Flip-chip LED, preparation method and electronic device

Abstract

The application provides a flip-chip double-crystal LED, a preparation method and an electronic device. The flip-chip double-crystal LED comprises a support base and a support enclosure, the support base and the support enclosure are combined to form an encapsulation cavity, an insulating strip and an insulating plastic wall are arranged on the support base to divide the encapsulation cavity into a first positive electrode cavity, a second positive electrode cavity, a first negative electrode cavity and a second negative electrode cavity, a blue light chip and a green light chip are connected to the support base, opposite ends of the blue light chip are respectively arranged in the first positive electrode cavity and the first negative electrode cavity, and opposite ends of the green light chip are respectively arranged in the second positive electrode cavity and the second negative electrode cavity. A fluorescent glue layer made of KSF red fluorescent powder is arranged in the encapsulation cavity. The green light chip is used to replace the green fluorescent powder, so that the fluorescent glue layer only needs to use the KSF red fluorescent powder, the mixing ratio between different fluorescent powders does not need to be controlled in the preparation process, the consistency of LED output is effectively improved, the use amount of the fluorescent powder is reduced, and the cost is saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a flip double crystal LED, a preparation method and an electronic device. BACKGROUND

[0002] LED has the characteristics of small volume, long service life, good reliability, energy saving and environmental protection, and has been widely used in lighting and display fields. With the rapid development of LED, consumers' demand for high color gamut of LED is increasing. High color gamut refers to a large increase in color gamut range, richer color performance and better level.

[0003] In order to improve the color gamut, a blue chip is generally packaged into the inside of the support by a die bonder, and then a fluorescent glue mixed by green fluorescent powder and KSF red fluorescent powder is packaged to complete the production of LED.

[0004] However, this production method needs to mix different fluorescent powders, and the deviation of the mixing ratio will reduce the stability of the output of LED, and a large amount of fluorescent powder needs to be used, which will increase the production cost. SUMMARY

[0005] In view of the defects of the prior art, the present application provides a flip double crystal LED, a preparation method and an electronic device, which aims to solve the technical problems that in the prior art, when producing high color gamut LED, green fluorescent powder and KSF red fluorescent powder need to be mixed, the deviation of the mixing ratio will reduce the stability of the output of high color gamut LED, and a large amount of fluorescent powder needs to be used, which will increase the production cost.

[0006] In order to achieve the above purpose, on the one hand, the present application provides a flip double crystal LED, which comprises a support base and a support enclosure connected to one side of the support base, the support base and the support enclosure form an encapsulation cavity, an insulating strip is arranged on one side of the support base facing the support enclosure to separate the encapsulation cavity into a positive cavity and a negative cavity, an insulating plastic wall is connected to one side of the support base facing the support enclosure to separate the positive cavity into a first positive cavity and a second positive cavity, and separate the negative cavity into a first negative cavity and a second negative cavity, a blue light chip and a green light chip are connected to one side of the support base facing the support enclosure, one end of the blue light chip is arranged in the first positive cavity, the other end of the blue light chip is arranged in the first negative cavity, one end of the green light chip is arranged in the second positive cavity, and the other end of the green light chip is arranged in the second negative cavity, a fluorescent glue layer wrapping the blue light chip and the green light chip is arranged in the encapsulation cavity, and the fluorescent glue layer is made of KSF red fluorescent powder.

[0007] Compared with the prior art, the present application has the beneficial effects that: by separating the first positive electrode cavity, the first negative electrode cavity, the second positive electrode cavity and the second negative electrode cavity in the packaging cavity, the blue light chip and the green light chip can be simultaneously arranged in the packaging cavity, the green light chip replaces the green fluorescent powder, the fluorescent glue layer only needs to use KSF red fluorescent powder, the mixing ratio of different fluorescent powders does not need to be controlled in the preparation process, the consistency of LED output is effectively improved, the amount of fluorescent powder in the preparation process is reduced, the cost is saved, the LED formed by the green light chip, the blue light chip and the fluorescent glue layer can achieve a higher color gamut, the insulating plastic wall is arranged in the packaging cavity, the mutual light color influence between the blue light chip and the green light chip is reduced, and the phenomenon of tin connection during die bonding is avoided, thereby preventing the problem of short circuit.

[0008] Further, the inner wall of the bracket enclosure forms a first inclined surface, and an obtuse angle is formed between the first inclined surface and the bracket base.

[0009] Further, the insulating plastic wall and the insulating strip are perpendicular to each other.

[0010] Further, the opposite two side walls of the insulating plastic wall respectively form a second inclined surface and a third inclined surface, and an obtuse angle is formed between the second inclined surface and the third inclined surface and a surface of the insulating plastic wall away from the bracket base.

[0011] Further, the height of the insulating plastic wall is less than the depth of the packaging cavity, and the height of the insulating plastic wall is greater than the height of the blue light chip and the green light chip.

[0012] Further, a first placement cavity is formed between the first positive electrode cavity and the first negative electrode cavity, the blue light chip is located at the center of the first placement cavity, a second placement cavity is formed between the second positive electrode cavity and the second negative electrode cavity, and the green light chip is located at the center of the second placement cavity.

[0013] Further, the blue light chip and the green light chip are parallel to each other.

[0014] In another aspect, the present application provides a preparation method of the flip-chip double crystal LED, for preparing the flip-chip double crystal LED, the preparation method of the flip-chip double crystal LED comprises the following steps:

[0015] The insulating strip is arranged on the bracket base, and the bracket base is connected to the bracket enclosure to form the packaging cavity, and the insulating strip separates the packaging cavity into a positive electrode cavity and a negative electrode cavity;

[0016] Filling insulating plastic material in the packaging cavity, and forming the insulating plastic wall after solidification, the insulating plastic wall separates the positive electrode cavity into the first positive electrode cavity and the second positive electrode cavity, and separates the negative electrode cavity into the first negative electrode cavity and the second negative electrode cavity;

[0017] Pointing the first die bonding glue in the first positive electrode cavity and the first negative electrode cavity, placing the blue light chip on the first die bonding glue, so that the opposite ends of the blue light chip are respectively placed in the first positive electrode cavity and the first negative electrode cavity, pointing the second die bonding glue in the second positive electrode cavity and the second negative electrode cavity, placing the green light chip on the second die bonding glue, so that the opposite ends of the green light chip are respectively placed in the second positive electrode cavity and the second negative electrode cavity;

[0018] Drying the first die bonding glue and the second die bonding glue at a preset temperature;

[0019] Forming fluorescent glue by modulating the KSF red fluorescent powder, and dispensing the fluorescent glue into the packaging cavity to form the fluorescent glue layer wrapping the blue light chip and the green light chip.

[0020] In another aspect, the embodiment of the present application provides an electronic device, which comprises the flip-chip double crystal LED in the above technical solution. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a disassembled structure diagram of the flip-chip double crystal LED in the embodiment 1 of the present application;

[0022] Figure 2 It is a structure diagram of the flip-chip double crystal LED in the embodiment 1 of the present application; Figure 1 It is a structure diagram of the flip-chip double crystal LED in the embodiment 1 of the present application;

[0023] Figure 3 It is a structure diagram of the flip-chip double crystal LED in the embodiment 1 of the present application;

[0024] Figure 4 It is a flow chart of the preparation method of the flip-chip double crystal LED in the embodiment 2 of the present application;

[0025] Explanation of main element symbols:

[0026] 10, bracket base; 20, bracket fence; 210, first inclined surface; 30, insulating strip; 410, positive electrode cavity; 411, first positive electrode cavity; 412, second positive electrode cavity; 420, negative electrode cavity; 421, first negative electrode cavity; 422, second negative electrode cavity; 50, blue light chip; 60, green light chip; 70, insulating plastic wall; 710, second inclined surface; 720, third inclined surface; 80, fluorescent glue layer.

[0027] The following detailed description will further explain the present application with reference to the above mentioned drawings. DETAILED DESCRIPTION

[0028] For the purposes of promoting an understanding of the principles of the application, reference will now be made to the embodiments illustrated in the drawings. It is expressly understood that the drawings are graphic depictions of the present application and are not to be construed as limiting the present application. In the drawings:

[0029] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right", and the like are used for explanation purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0031] Referring to Figures 1 to 3 The flip-chip LED in Embodiment 1 of the present application comprises a support base 10 and a support enclosure 20 connected to one side of the support base 10. The support base 10 and the support enclosure 20 form an encapsulation cavity. Preferably, the inner wall of the support enclosure 20 forms a first inclined surface 210, and the first inclined surface 210 and the support base 10 form an obtuse angle. By setting the first inclined surface 210, the light emitting angle of the inner chip can be adjusted, and the light emitting efficiency can be effectively improved.

[0032] The bracket base 10 is provided with an insulation strip 30 on the side facing the bracket enclosure 20, so as to divide the packaging cavity into a positive electrode cavity 410 and a negative electrode cavity 420. The positive and negative electrodes are distinguished by the insulation strip 30, and the chip is realized to be conductive and light-emitting. The bracket base 10 is connected with an insulation plastic wall 70 on the side facing the bracket enclosure 20, so as to divide the positive electrode cavity 410 into a first positive electrode cavity 411 and a second positive electrode cavity 412, and divide the negative electrode cavity 420 into a first negative electrode cavity 421 and a second negative electrode cavity 422. Understandably, the first positive electrode cavity 411 and the first negative electrode cavity 421 form a first placement cavity, and the second positive electrode cavity 412 and the second negative electrode cavity 422 form a second placement cavity. The first placement cavity and the second placement cavity are both used for placing chips.

[0033] Further, the bracket base 10 is connected with a blue light chip 50 and a green light chip 60 on the side facing the bracket enclosure 20. One end of the blue light chip 50 is placed in the first positive electrode cavity 411, the other end of the blue light chip 50 is placed in the first negative electrode cavity 421, one end of the green light chip 60 is placed in the second positive electrode cavity 412, and the other end of the green light chip 60 is placed in the second negative electrode cavity 422. That is, the blue light chip 50 is located in the first placement cavity, and the green light chip 60 is located in the second placement cavity. Preferably, the blue light chip 50 is located at the center of the first placement cavity, the green light chip 60 is located at the center of the second placement cavity, and the blue light chip 50 is parallel to the green light chip 60. By arranging the insulation plastic wall 70 in the packaging cavity, the mutual light color influence between the blue light chip 50 and the green light chip 60 can be reduced, and the problem of short circuit caused by continuous tin phenomenon during die bonding can be avoided. The position arrangement of the blue light chip 50 and the green light chip 60 can better avoid the problem of light color influence. Understandably, the height of the insulation plastic wall 70 is greater than the height of the blue light chip 50 and the green light chip 60, so as to reduce the light color influence.

[0034] Preferably, the insulation plastic wall 70 and the insulation strip 30 are perpendicular to each other. By arranging them to be perpendicular to each other, the light uniformity of the flip-chip dual-chip LED can be effectively improved, and the light overlapping influence between the blue light chip 50 and the green light chip 60 can be reduced.

[0035] The second inclined surface 710 and the third inclined surface 720 are formed on the opposite two side walls of the insulating plastic wall 70, and form an obtuse angle with the surface of the insulating plastic wall 70 which is away from the support base 10. The second inclined surface 710 and the third inclined surface 720 are matched with the first inclined surface 210 respectively, so that the light emitting angle of the blue light chip 50 and the green light chip 60 is further improved, and the light efficiency of the flip-chip double crystal LED is improved.

[0036] The packaging cavity is provided with a fluorescent glue layer 80 which wraps the blue light chip 50 and the green light chip 60, and the fluorescent glue layer 80 is made of KSF red fluorescent powder. The first positive cavity 411, the first negative cavity 421, the second positive cavity 412 and the second negative cavity 422 are separated in the packaging cavity, so that the blue light chip 50 and the green light chip 60 can be arranged in the packaging cavity at the same time. The green light chip 60 replaces the green fluorescent powder, so that the fluorescent glue layer 80 only needs to use KSF red fluorescent powder, and the mixing ratio of different fluorescent powders does not need to be controlled in the preparation process, the consistency of LED output is effectively improved, the amount of fluorescent powder in the preparation process is reduced, and the cost is saved. The LED formed by the green light chip 60, the blue light chip 50 and the fluorescent glue layer 80 can achieve higher color gamut. Preferably, the height of the insulating plastic wall 70 is less than the depth of the packaging cavity. By controlling the height of the insulating plastic wall 70, the fluorescent glue layer 80 can be formed at one time, and the production efficiency of the flip-chip double crystal LED is effectively improved.

[0037] Please refer to Figure 4 The embodiment 2 of the present application provides a preparation method of a flip-chip double crystal LED, which is used for preparing the flip-chip double crystal LED in the above technical solutions, and the method comprises the following steps:

[0038] S10: arranging the insulating strip on the support base, and connecting the support base with the support enclosure to form the packaging cavity, wherein the insulating strip separates the packaging cavity into positive cavities and negative cavities;

[0039] Preferably, the insulating strip 30 is arranged at the center line of the support base 10.

[0040] S20: filling the packaging cavity with insulating plastic material, and forming the insulating plastic wall after solidification, wherein the insulating plastic wall separates the positive cavities into the first positive cavity and the second positive cavity, and separates the negative cavities into the first negative cavity and the second negative cavity;

[0041] S30: point the first die bonding glue in the first positive cavity and the first negative cavity, place the blue light chip on the first die bonding glue, so that the opposite two ends of the blue light chip are placed in the first positive cavity and the first negative cavity respectively, point the second die bonding glue in the second positive cavity and the second negative cavity, and place the green light chip on the second die bonding glue, so that the opposite two ends of the green light chip are placed in the second positive cavity and the second negative cavity respectively;

[0042] Understandably, the first die bonding glue is located in the first placement cavity, the second die bonding glue is located in the second placement cavity, and the first die bonding glue extends from the first positive cavity 411 to the first negative cavity 421, and the second die bonding glue extends from the second positive cavity 412 to the second negative cavity 422.

[0043] S40: dry the first die bonding glue and the second die bonding glue at a preset temperature;

[0044] Preferably, the preset temperature is 170-200°C, in this embodiment, the preset temperature is 180°C, and the drying time of the first die bonding glue and the second die bonding glue is 1-3h, in this embodiment, the drying time of the first die bonding glue and the second die bonding glue is 2h.

[0045] Understandably, after the fixing of the blue light chip 50 and the green light chip 60 is completed, wire bonding needs to be performed, and the pads of the blue light chip 50 and the green light chip 60 are connected to the conductive area on the support base 10 through soldering metal wires.

[0046] S50: form a fluorescent glue by modulating the KSF red fluorescent powder, and glue the fluorescent glue into the packaging cavity to form the fluorescent glue layer wrapping the blue light chip and the green light chip.

[0047] Mix and stir the KSF red fluorescent powder and glue to form the fluorescent glue, during the glue dispensing process, the fluorescent glue gradually rises from the bottom of the packaging cavity to the top of the packaging cavity until it is flush with the side of the support enclosure 20 away from the support base 10, during the rising process, the fluorescent glue gradually wraps the blue light chip and the green light chip 60, and then wraps the insulating plastic wall 70. After the glue dispensing of the fluorescent glue is completed, the fluorescent glue is cured into the fluorescent glue layer 80 by baking, the temperature of the baking and curing is 120-140°C, and the time of the baking and curing is 4-6h, in this embodiment, the temperature of the baking and curing is 130°C, and the time of the baking and curing is 5h.

[0048] The application further provides an electronic device comprising the flip-chip twin LED, wherein the flip-chip twin LED is the flip-chip twin LED described in the above embodiments.

[0049] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as the limitation of the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An inverted flip-chip LED, comprising a support base and a support enclosure connected to one side of the support base, the support base and the support enclosure enclosing a packaging cavity, characterized in that, The bracket base is provided with an insulation strip on the side facing the bracket enclosure to divide the packaging cavity into a positive electrode cavity and a negative electrode cavity, the bracket base is connected with an insulation plastic wall on the side facing the bracket enclosure to divide the positive electrode cavity into a first positive electrode cavity and a second positive electrode cavity and divide the negative electrode cavity into a first negative electrode cavity and a second negative electrode cavity, the bracket base is connected with a blue light chip and a green light chip on the side facing the bracket enclosure, one end of the blue light chip is arranged in the first positive electrode cavity, the other end of the blue light chip is arranged in the first negative electrode cavity, one end of the green light chip is arranged in the second positive electrode cavity, and the other end of the green light chip is arranged in the second negative electrode cavity, the packaging cavity is provided with a fluorescent glue layer wrapping the blue light chip and the green light chip, the fluorescent glue layer is made of KSF red fluorescent powder, the height of the insulation plastic wall is less than the depth of the packaging cavity, and the height of the insulation plastic wall is greater than the height of the blue light chip and the green light chip, a first placement cavity is formed between the first positive electrode cavity and the first negative electrode cavity, the blue light chip is located at the center of the first placement cavity, a second placement cavity is formed between the second positive electrode cavity and the second negative electrode cavity, and the green light chip is located at the center of the second placement cavity.

2. The flip-chip LED of claim 1, wherein, The inner wall of the bracket enclosure forms a first inclined surface, and an obtuse angle is formed between the first inclined surface and the bracket base.

3. The flip-chip LED of claim 1, wherein, The insulation plastic wall and the insulation strip are perpendicular to each other.

4. The flip-chip LED of claim 1, wherein, The opposite two side walls of the insulation plastic wall form a second inclined surface and a third inclined surface, respectively, and an obtuse angle is formed between the second inclined surface and the third inclined surface and the side of the insulation plastic wall facing away from the bracket base.

5. The flip-chip LED of claim 1, wherein, The blue light chip and the green light chip are parallel to each other.

6. A method for manufacturing a flip-chip LED, for manufacturing the flip-chip LED according to any one of claims 1 to 5, characterized in that, The preparation method of the flip-chip double crystal LED comprises the following steps: The insulation strip is arranged on the bracket base, and the bracket base is connected with the bracket enclosure to form the packaging cavity, and the insulation strip divides the packaging cavity into a positive electrode cavity and a negative electrode cavity; The insulation plastic wall is formed by filling the insulation plastic material in the packaging cavity and allowing it to solidify, the insulation plastic wall divides the positive electrode cavity into the first positive electrode cavity and the second positive electrode cavity and divides the negative electrode cavity into the first negative electrode cavity and the second negative electrode cavity; The first solid crystal glue is dotted in the first positive electrode cavity and the first negative electrode cavity, the blue light chip is arranged on the first solid crystal glue so that the opposite two ends of the blue light chip are arranged in the first positive electrode cavity and the first negative electrode cavity, respectively, the second solid crystal glue is dotted in the second positive electrode cavity and the second negative electrode cavity, and the green light chip is arranged on the second solid crystal glue so that the opposite two ends of the green light chip are arranged in the second positive electrode cavity and the second negative electrode cavity, respectively; The first solid crystal glue and the second solid crystal glue are dried at a preset temperature; The fluorescent glue is formed by modulating the KSF red fluorescent powder, and the fluorescent glue is dotted into the packaging cavity to form the fluorescent glue layer wrapping the blue light chip and the green light chip.

7. An electronic device, comprising: The flip-chip double crystal LED comprises any one of claims 1-5.

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