Method for manufacturing a bonded body and apparatus for manufacturing a bonded body

Abstract

The bonding step in the manufacturing method of the bonded body includes a supporting step of assembling the layered body in a supporting device. The supporting device is provided with a pressing member that presses the layered body, a base member that supports the pressing member, a supporting member that supports the layered body, and a fixing mechanism that fixes the supporting member to the base member. In the supporting step, the supporting member is fixed to the base member by the fixing mechanism.

Description

Technical Field

[0001] The present invention relates to a method and apparatus for manufacturing a bonded body by bonding substrates. Background Technology

[0002] As is well known, LED components and other electronic components are housed in hermetically sealed packages to prevent degradation. A hermetically sealed package is, for example, formed by bonding a first substrate, which serves as the base material, to a second substrate made of a glass substrate.

[0003] For example, Patent Document 1 discloses a method for manufacturing a bonded body by sandwiching a sealing material (bonding material) between a first substrate (a component to be bonded) and a second substrate made of a glass component and heating the sealing material.

[0004] In this manufacturing method, a laminate in which a sealing material is disposed between a first substrate and a second substrate is prepared, and the laminate is assembled into a jig and the internal air pressure of the jig is adjusted to press the laminate. Furthermore, while the laminate is pressed, the sealing material is irradiated with a laser, and a joint is formed by the sealing material, thereby manufacturing a joint (see paragraphs 0036 to 0046 of this document).

[0005] The fixture used in this manufacturing method has a fixture body that supports the laminate and a cover for pressing the laminate.

[0006] The fixture body also includes a force-applying part that applies force to the laminated body disposed within the recess of the fixture body towards the fixture body using a cover. The force-applying part includes a force-applying part main body that overcomes compressive force and a force-applying plate disposed between the force-applying part main body and the laminated body.

[0007] The force-applying body has multiple plungers and a base for mounting the plungers. The force-applying plate is supported by the plungers of the force-applying body, enabling it to uniformly transmit the force applied by the force-applying body to the laminate. The laminate is placed on the force-applying plate when it is received in the recess of the fixture body.

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: Japanese Patent Application Publication No. 2021-31306 Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] In the conventional manufacturing method of the aforementioned joint, the force-applying plate of the force-applying part is supported in a state of contact with the plunger of the force-applying part body. Therefore, positional displacement is prone to occur when the laminate is placed. When the position of the force-applying plate is displaced, the position of the laminate placed on the force-applying plate also changes. Therefore, it is necessary to adjust the laser irradiation position on the laminate, which may make the operation cumbersome.

[0013] The present invention was made in view of the above circumstances, and the technical problem is to prevent the positional displacement of the support member of the support joint.

[0014] Solution for solving the problem

[0015] This invention provides a method for manufacturing a bond to solve the aforementioned problems. The method manufactures a bond comprising a first substrate, a second substrate, and a sealing layer for bonding the first substrate and the second substrate. The method includes: a lamination step in which a sealing material is sandwiched between the first substrate and the second substrate, and the first substrate and the second substrate are overlapped to form a laminate; and a bonding step in which the sealing material in the laminate is irradiated with a laser to form the sealing layer. The bonding step includes: a support step in which the laminate is assembled on a support device; a pressing step in which the laminate is pressed; and a laser irradiation step in which the sealing material is irradiated with the laser to form the sealing layer. The support device includes: a pressing member that presses the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. In the support step, the fixing mechanism is used to fix the support member to the base member.

[0016] According to this structure, by using a fixing mechanism to fix the support member to the base member, it is possible to reliably prevent the positional displacement of the support member during the support process.

[0017] Alternatively, the fixing mechanism may include: a fixing member having a head and a shaft; and a hole formed in the support member and allowing the shaft to pass through. Thus, the support member can be suitably fixed to the base member.

[0018] Alternatively, the fixing mechanism may include: a fixing member having a head and a shaft; a hole formed in the support member and allowing the head and the shaft to pass through; a recess formed in the support member and locking the head; and a guide groove formed in the support member and allowing the shaft to move relative to the hole and the recess.

[0019] This structure allows for easy installation and removal of the support members relative to the base members.

[0020] Alternatively, the shaft portion of the fixing member may have an external thread, and the base member may have a threaded hole that engages with the external thread. According to this structure, the position of the support member can be adjusted by changing the position of the shaft portion of the fixing member that engages with the threaded hole of the base member.

[0021] Alternatively, the base member may include an elastic member that supports the support member, and during the supporting process, the fixing member fixes the support member to the base member while the elastic member is elastically deformed. This allows force to be applied to the support member under the elastic restoring force of the elastic member during pressing of the laminate.

[0022] Alternatively, the support member may have a receiving portion that accommodates the laminate. By accommodating the laminate in the receiving portion, it is possible to prevent the laminate from shifting position relative to the support member.

[0023] The present invention provides a manufacturing apparatus for a bond to solve the aforementioned problems. The apparatus manufactures a bond comprising a first substrate, a second substrate, and a sealing layer for bonding the first substrate and the second substrate. The manufacturing apparatus is characterized by comprising: a support device for supporting a laminate formed by sandwiching a sealing material between the first substrate and the second substrate and overlapping the first substrate and the second substrate; and a laser irradiation device for irradiating the sealing material in the laminate with a laser to form the sealing layer. The support device comprises: a pressing member for pressing the laminate; a base member for supporting the pressing member; a support member for supporting the laminate; and a fixing mechanism for fixing the support member to the base member. The manufacturing apparatus is configured to fix the support member to the base member using the fixing mechanism.

[0024] According to this structure, by using a fixing mechanism to fix the support member to the base member, it is possible to reliably prevent the positional displacement of the support member when the laminate is supported on the support member.

[0025] Invention Effects

[0026] According to the present invention, it is possible to prevent the positional displacement of the support member of the support joint. Attached Figure Description

[0027] Figure 1 This is a top view of the assembly.

[0028] Figure 2 yes Figure 1 A cross-sectional view along line II-II.

[0029] Figure 3 This is a bottom view of the second substrate.

[0030] Figure 4 This is a cross-sectional view showing the manufacturing apparatus for the joint.

[0031] Figure 5 This is a top view showing a portion of the support device.

[0032] Figure 6 yes Figure 5 A sectional view of the line of sight from VI to VI.

[0033] Figure 7 This is a top view of the supporting structure.

[0034] Figure 8 This is a top view of the pressing component.

[0035] Figure 9 This is a top view of the frame.

[0036] Figure 10 This is a cross-sectional view showing a method of mounting a support member onto a base member.

[0037] Figure 11 This is a top view showing the method of mounting the support member onto the base member.

[0038] Figure 12 yes Figure 11 A cross-sectional view along line XII-XII.

[0039] Figure 13 This is a flowchart illustrating the manufacturing method of the joint.

[0040] Figure 14 This is a cross-sectional view showing the lamination process.

[0041] Figure 15 This is a flowchart illustrating the joining process.

[0042] Figure 16 This is a cross-sectional view showing the support process.

[0043] Figure 17 This is a cross-sectional view showing the support process.

[0044] Figure 18 This is a top view showing the manufacturing apparatus for the joint of the second embodiment.

[0045] Figure 19 This is a top view of the supporting structure.

[0046] Figure 20 This is a cross-sectional view showing a method of mounting a support member onto a base member.

[0047] Figure 21 This is a cross-sectional view showing the support process.

[0048] Figure 22 This is a cross-sectional view showing the support process. Detailed Implementation

[0049] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figures 1 to 17 A first embodiment of the manufacturing method and manufacturing apparatus for the joint of the present invention is shown.

[0050] Figure 1 as well as Figure 2 An example of a hermetically sealed assembly is provided as a bonding body manufactured by the present invention. The bonding body 1 includes: a first substrate 2, which serves as a substrate; a second substrate 3, which overlaps with the first substrate 2; a plurality of sealing layers 4, which bond the first substrate 2 and the second substrate 3; and an element 5, which is housed between the first substrate 2 and the second substrate 3 and inside the sealing layers 4.

[0051] The first substrate 2 is configured in a rectangular shape, for example, but is not limited to that shape. The first substrate 2 has a first main surface 2a for mounting the element 5 and a second main surface 2b located on the opposite side of the first main surface 2a. The first main surface 2a may have a recess capable of accommodating the element 5.

[0052] The first substrate 2 is made of a high thermal conductivity substrate, such as a silicon substrate, but is not limited to these; it may also be made of other metal substrates, ceramic substrates, semiconductor substrates, or various other substrates. It should be noted that the thickness of the first substrate 2 is in the range of 0.1 to 5.0 mm, but is not limited to this range.

[0053] The thermal conductivity of the first substrate 2 can be higher than that of the second substrate 3. The thermal conductivity of the first substrate 2 at 20°C is preferably 10 to 500 W / m·K, more preferably 30 to 300 W / m·K, even more preferably 70 to 250 W / m·K, particularly preferably 100 to 200 W / m·K, but is not limited to this range.

[0054] The second substrate 3 is, for example, made of a rectangular transparent glass substrate, but is not limited to that shape. The second substrate 3 has a first main surface 3a and a second main surface 3b located on the opposite side of the first main surface 3a.

[0055] As the glass constituting the second substrate 3, for example, alkali-free glass, borosilicate glass, soda lime glass, quartz glass, or crystallized glass with a low coefficient of thermal expansion can be used. The thickness of the second substrate 3 is not particularly limited, but a thickness in the range of 0.01 to 2.0 mm is used, for example. The thermal conductivity of the second substrate 3 at 20°C is preferably 0.5 to 5 W / m·K, but is not limited to this range.

[0056] Multiple sealing layers 4 are formed on the bonding body 1 in a prescribed arrangement pattern. The sealing layers 4 are formed by sandwiching multiple sealing materials between the first substrate 2 and the second substrate 3, irradiating the sealing materials with a laser, and softening and flowing them by heating.

[0057] Figure 3 This is a bottom view showing the second substrate 3 before it is bonded to the first substrate 2. When a sealing material is sandwiched between the first substrate 2 and the second substrate 3, for example, the sealing material 6 can be pre-fixed to the first main surface 3a of the second substrate 3. It is not limited to this; the sealing material can be pre-fixed to the first substrate 2, or a sheet-like sealing material can be sandwiched between the first substrate 2 and the second substrate 3.

[0058] Various materials can be used as sealing materials. Among them, from the viewpoint of improving sealing strength, composite materials (glass frits) containing bismuth-based glass powder and refractory filler powder are preferred. Not only bismuth-based glass, but also glass powders such as silver phosphate glass and tellurium glass can be used as sealing materials.

[0059] As a refractory filler powder, various materials can be used, among which, preferably, it is composed of one or more materials selected from cordierite, zircon, tin oxide, niobium oxide, zirconium phosphate ceramics, zinc siliceous ore, β-lithium nepheline, and β-quartz solid solution.

[0060] like Figure 1 As shown, the sealing layer 4 is configured as a closed curve in a way that spatially joins the housing element 5. In this invention, the term "closed curve" is used not only for shapes composed solely of curves, but also for shapes composed of a combination of curves and straight lines, and shapes composed solely of straight lines (e.g., quadrilateral shapes, other polygonal shapes).

[0061] The thickness of the sealing layer 4 is preferably 1 μm to 20 μm, more preferably 3 to 8 μm. The width W of the sealing layer 4 is preferably 50 to 2000 μm, more preferably 100 to 1000 μm.

[0062] Component 5 is mounted on the first main surface 2a of the first substrate 2. Furthermore, component 5 is disposed within the space (cavity) defined by the first main surface 2a of the first substrate 2, the first main surface 3a of the second substrate 3, and the sealing layer 4. Various components, such as deep ultraviolet LEDs (Light Emitting Diodes), MEMS (Micro Electro Mechanical Systems) components, and CCD (Charge Coupled Device) components, can be used as component 5.

[0063] Figures 4 to 12 The manufacturing apparatus 7 for the joint 1 is shown. (As shown) Figure 4 As shown, the manufacturing apparatus 7 includes: a support device 8 that supports a laminate LM, which is formed by laminating a first substrate 2 and a second substrate 3 with a sealing material 6 in between; and a laser irradiation device 9 that forms a sealing layer 4 by irradiating the sealing material 6 of the laminate LM with a laser L.

[0064] like Figures 4 to 9 As shown, the support device 8 includes: a support member 10 that supports the laminate LM; a pressing member 11 that presses the laminate LM; a base member 12 that supports the pressing member 11; a fixing mechanism 13 that fixes the support member 10 to the base member 12; a frame 14 that fixes the pressing member 11 to the base member 12; a sealing member 15 disposed between the pressing member 11 and the base member 12; a receiving space 16 for the laminate LM that is formed between the pressing member 11 and the base member 12; and a pressure adjusting device 17 that adjusts the pressure of the receiving space 16.

[0065] The support member 10 is disposed together with the laminate LM in the receiving space 16. The support member 10 is, for example, made of metal (stainless steel, etc.) and is constructed of a circular plate member (see reference). Figure 7 The material and shape of the support member 10 are not limited to this embodiment. The support member 10 has a first surface 10a and a second surface 10b located on the opposite side of the first surface 10a. The first surface 10a has a receiving portion 18 for receiving the laminated body LM. In this embodiment, the receiving portion 18 is composed of a recess capable of receiving the laminated body LM, but the structure of the receiving portion 18 is not particularly limited as long as it can position the laminated body LM. For example, multiple positioning protrusions can be provided on the first surface 10a of the support member 10, and the space inside it can be used as the receiving portion 18.

[0066] like Figure 8 As shown, the pressing member 11 is, for example, a circular transparent glass plate. The thickness of the pressing member 11 is preferably 3 to 10 mm. The Young's modulus of the pressing member 11 is preferably 50 to 80 GPa, more preferably 60 to 70 GPa. The pressing member 11 has a first surface 11a that contacts the sealing member 15 and the laminate LM, and a second surface 11b that contacts the frame 14.

[0067] The base member 12 is made of metal (e.g., stainless steel), but may also be made of other materials. The base member 12 has walls 19 for forming the receiving space 16 and a bottom 20.

[0068] Figure 5A top view of a base member 12 to which a support member 10 is fixed by a fixing mechanism 13 is shown. The wall portion 19 of the base member 12 is cylindrical, but is not limited to this shape. A support portion 21 for mounting a sealing member 15 is formed at the midpoint of the inner side of the wall portion 19. The support portion 21 is the surface opposite to the pressing member 11 mounted on the base member 12. A top-view annular groove 21a for mounting the sealing member 15 is formed in the support portion 21.

[0069] like Figure 4 as well as Figure 5 As shown, the wall portion 19 has an end face 19a (upper surface), inner peripheral faces 19b and 19c, and an outer peripheral face 19d.

[0070] The frame 14 is fixed to the end face 19a of the wall portion 19 by means of a fixing member 22. The fixing member 22 is composed of, for example, a bolt or screw member, and has a head 22a and a shaft portion 22b. A plurality of threaded holes 23 are formed on the end face 19a for engaging with the shaft portion 22b of the fixing member 22.

[0071] The inner peripheral surfaces 19b and 19c of the wall portion 19 include: a first inner peripheral surface 19b, which functions as a guide surface for guiding the pressing member 11 toward the support portion 21; and a second inner peripheral surface 19c, through which the support member 10 can pass. The diameter of the first inner peripheral surface 19b is larger than the diameter of the pressing member 11. The diameter of the second inner peripheral surface 19c is larger than the diameter of the support member 10.

[0072] The bottom 20 of the base member 12 is formed on the inner side of the cylindrical wall 19. The bottom 20 is composed of a circular surface when viewed from above.

[0073] like Figures 4 to 6 As shown, the fixing mechanism 13 includes: an elastic member 24 that supports the support member 10; a fixing member 25 that fixes the support member 10 to the base member 12; an insertion hole 26 formed in the support member 10 and allowing a portion of the fixing member 25 to pass through; a locking recess 27 formed in the support member 10 and locking a portion of the fixing member 25; and a guide groove 28 formed in the support member 10 and allowing the fixing member 25 to move relative to each other between the insertion hole 26 and the locking recess 27.

[0074] An elastic member 24 is mounted on the bottom 20 of the base member 12. Multiple elastic members 24 are disposed on the bottom 20. The elastic member 24 is, for example, a compression coil spring, but is not limited thereto; it may also be made of other springs, rubber, or other materials. Multiple mounting recesses 29 are formed on the bottom 20 to accommodate a portion of the elastic member 24. One end of the elastic member 24 is inserted into the mounting recess 29, and the other end of the elastic member 24 protrudes from the bottom 20. The elastic member 24 has the function of applying force to the support member 10 under the action of its elastic restoring force.

[0075] The fixing member 25 is composed of, for example, bolts or screws, and has a head 25a and a shaft portion 25b. The head 25a has a larger diameter than the shaft portion 25b. The shaft portion 25b has an external thread 30. The shaft portion 25b is fixed to the bottom 20 of the base member 12. A threaded hole 31 is formed in the bottom 20 of the base member 12 for the shaft portion 25b to be inserted.

[0076] like Figure 7 As shown, the through hole 26 is circular in top view, but is not limited to this shape. The through hole 26 has a diameter larger than that of the head 25a, so that the head 25a and the shaft portion 25b of the fixing member 25 can pass through.

[0077] The locking recess 27 has a sidewall surface 27a into which the head 25a of the fixing member 25 can be inserted, and a bottom surface 27b into which the head 25a is locked. The sidewall surface 27a is circular in plan view, but is not limited to this shape. The sidewall surface 27a has a diameter larger than that of the head 25a to avoid contact with the head 25a of the fixing member 25. The bottom surface 27b is configured to contact the head 25a.

[0078] The guide groove 28 extends through the support member 10 along its thickness direction so that the shaft portion 25b of the fixing member 25 passes through it. The guide groove 28 is connected to the bottom surface 27b of the insertion hole 26 and the locking recess 27 of the fixing member 25 such that the shaft portion 25b of the fixing member 25 can move relative to it between the insertion hole 26 and the locking recess 27. Specifically, one end of the guide groove 28 communicates with the inner circumferential surface of the insertion hole 26. The other end of the guide groove 28 is located at the center of the bottom surface 27b of the locking recess 27.

[0079] The guide groove 28 is configured as an arc or a straight line when viewed from above. By rotating the support member 10 about its center, the guide groove 28 allows the shaft portion 25b of the fixing member 25 to move relative to each other between the through hole 26 and the locking recess 27.

[0080] like Figure 9As shown, the frame 14 is a plate-shaped member configured as a ring when viewed from above. The frame 14 is fixed to the end face 19a of the wall portion 19 of the base member 12 by the fixing member 22. The frame 14 includes: a through hole 32 through which the shaft portion 22b of the fixing member 22 passes; a locking recess 33 that receives the head 22a of the fixing member 22; a cylindrical portion 34; and an opening 35.

[0081] like Figure 4 as well as Figure 9 As shown, the insertion holes 32 and locking recesses 33 are concentric in plan view. Multiple insertion holes 32 and locking recesses 33 are formed in the frame 14. The cylindrical portion 34 is cylindrical in shape, corresponding to the shape of the wall portion 19 of the base member 12. The diameter of the inner circumferential surface of the cylindrical portion 34 is larger than the diameter of the outer circumferential surface 19d of the wall portion 19 of the base member 12. The opening portion 35 is circular in plan view. The diameter of the opening portion 35 is smaller than the diameter of the pressing member 11.

[0082] The sealing member 15 is made of an elastic component such as rubber (e.g., an O-ring). Figure 4 as well as Figure 5 As shown, the sealing member 15 is disposed in the annular groove 21a formed in the support portion 21 of the base member 12. The sealing member 15 seals the receiving space 16 by being in close contact with the pressing member 11.

[0083] like Figure 8 As shown, the sealing member 15 is configured to form a circular surrounding laminate LM between the pressing member 11 and the base member 12. The diameter of the circular shape of the sealing member 15 is smaller than the diameter of the pressing member 11 and larger than the diameter of the support member 10.

[0084] The receiving space 16 of the laminate LM is a space formed by the pressing member 11, the base member 12, and the sealing member 15. The receiving space 16 is airtight by tightly pressing the pressing member 11 against the sealing member 15 mounted on the support portion 21 of the base member 12. The receiving space 16 can accommodate the laminate LM, the support member 10, and the fixing mechanism 13.

[0085] like Figure 4 As shown, the air pressure regulating device 17 mainly comprises: a flow path 36 formed in the base member 12, which allows gas to flow out of the receiving space 16; a pipe 37 connected to the flow path 36; a regulating valve 38 disposed in the middle of the pipe 37; and a pump 39. The flow path 36 includes a suction port 36a formed in the bottom 20 of the base member 12 and an exhaust port 36b formed on the outer surface of the base member 12. The air pressure regulating device 17 uses the pump 39 to draw air from the receiving space 16, thereby reducing the air pressure in the receiving space 16 and making the receiving space 16 a negative pressure relative to the atmosphere.

[0086] As the laser irradiation device 9, it is suitable to use a laser irradiation device that irradiates semiconductor lasers, but it is not limited to this. It can also use devices that irradiate various lasers such as YAG lasers, green lasers, and ultrashort pulse lasers.

[0087] The following describes the method of fixing the support member 10 to the base member 12 using the fixing mechanism 13. First, as Figure 10 As shown, with the shaft portion 25b of the fixing member 25 installed into the threaded hole 31 of the base member 12, the support member 10 is brought closer to the base member 12 from above. Then, while lowering the support member 10, as... Figure 11 as well as Figure 12 As shown, the through hole 26 passes through the head 25a and shaft 25b of the fixing member 25. In this case, the upper end of the elastic member 24 mounted on the base member 12 contacts the second surface 10b of the support member 10.

[0088] Then, the head 25a of the fixed component 25 is as follows Figure 12 As shown, the support member 10 protrudes from its first surface 10a and is pressed against the elastic member 24. The elastic member 24 contracts while elastically deforming. As a result, the elastic member 24 generates an elastic restoring force that overcomes the force pressing on the support member 10.

[0089] Next, while maintaining the head's 25a protrusion, as in Figure 11 As indicated by the arrow, the support member 10 is rotated counterclockwise when viewed from above. This causes the shaft portion 25b, passing through the through hole 26, to move relative to the locking recess 27 via the guide groove 28. Figure 12 As shown by the double-dotted line, the head 25a of the fixing member 25, which moves relative to the locking recess 27 via the guide groove 28, is located above the locking recess 27.

[0090] Subsequently, when the force pressing the support member 10 against the elastic member 24 is released, the support member 10 is pushed up under the force of the elastic member 24. As a result, the head 25a of the fixing member 25 enters the locking recess 27. The locking recess 27 contacts the head 25a through its bottom surface 27b, thereby locking it against the fixing member 25. It is desirable that in this state, the elastic member 24 does not return to its free length, but continues to exert force on the support member 10 under the action of its elastic restoring force.

[0091] The force exerted by the elastic member 24 on the support member 10 causes the fixing member 25 to rotate about its axis and change the position of the head 25a in the axial direction, thereby enabling adjustment. In order to enable this position adjustment, the end of the shaft portion 25b of the fixing member 25 is preferably not located at the bottom of the threaded hole 31 formed in the base member 12, but at the middle of the threaded hole 31.

[0092] When the support member 10 is removed from the base member 12, the support member 10 is pressed against the elastic member 24, causing the elastic member 24 to contract, and the support member 10 is moved downwards such that the head 25a of the fixing member 25 protrudes from the locking recess 27. Then, the support member 10 is rotated clockwise in plan view. As a result, the shaft portion 25b of the fixing member 25 engages with the guide groove 28. Then, through the relative movement of the support member 10 and the fixing member 25, the shaft portion 25b is positioned in the through hole 26.

[0093] Next, the support member 10 is lifted by means of the head 25a of the fixing member 25 from the first surface 10a side toward the second surface 10b side through the through hole 26. As a result, the support member 10 is removed from the base member 12.

[0094] As described above, the support member 10 can be easily installed or removed from the base member 12 using the fixing mechanism 13. Furthermore, by adjusting the position of the fixing member 25 relative to the threaded hole 31, the fixing position of the support member 10 can be adjusted according to the thickness of the laminate LM.

[0095] The following is for reference Figures 13 to 17 The method for manufacturing the assembly 1 using the manufacturing apparatus 7 with the above-described structure will be described. For example... Figure 13 As shown, this method includes a lamination process S1 and a bonding process S2.

[0096] like Figure 14 As shown, in the lamination process S1, firstly, the first substrate 2 and the second substrate 3 are overlapped with their first main surface 2a facing each other. It should be noted that an element 5 is pre-installed on the first main surface 2a of the first substrate 2. The first substrate 2 and the second substrate 3 are then laminated with the element 5 located inside the sealing material 6 to form a laminate LM.

[0097] like Figure 15 As shown, the joining process S2 includes a supporting process S21, a pressing process S22, and a laser irradiation process S23.

[0098] In the supporting process S21, the laminated body LM formed by the lamination process S1 is assembled onto the supporting device 8. That is, as shown in the figure. Figure 16As shown, firstly, the laminate LM is housed in the receiving portion 18 of the base member 12 supporting the member 10, which is mounted by the fixing mechanism 13.

[0099] like Figure 17 As shown, the thickness dimension TLM of the laminate LM is preferably larger than the depth dimension D of the receiving portion 18. The laminate LM is received in the receiving portion 18 such that a portion of the thickness direction of the second substrate 3 extends from the receiving portion 18 toward the pressing member 11. The dimension PD1 of the portion of the thickness direction of the second substrate 3 extending from the recess is preferably 0.05 to 0.95 times the thickness dimension T of the second substrate 3 (0.05T≤PD1≤0.95T).

[0100] Next, the pressing member 11 is placed on the sealing member 15 mounted on the support portion 21 of the base member 12. Thus, the first surface 11a of the pressing member 11 contacts the sealing member 15. In this case, it is preferable that the pressing member 11, the sealing member 15, and the laminate LM are arranged concentrically. Alternatively, in this state, the first surface 11a of the pressing member 11 may also contact the second main surface 3b of the second substrate 3 in the laminate LM.

[0101] Next, the frame 14 is placed on the end face 19a of the wall portion 19 in the base member 12, and the frame 14 is fixed to the wall portion 19 using the fixing member 22. That is, the through hole 32 of the frame 14 is aligned with the threaded hole 23 of the wall portion 19 of the base member 12, and after the shaft portion 22b of the fixing member 22 is passed through the through hole 32, the shaft portion 22b is engaged with the threaded hole 23, and the fixing member 22 is tightened. In this state, the frame 14 and the sealing member 15 together hold the pressing member 11. In addition, the opening 35 of the frame 14 exposes a portion of the second surface 11b of the pressing member 11 toward the laser irradiation device 9. Thus, the assembly of the laminate LM to the support device 8 is completed. Thus, the laminate LM is housed together with the support member 10 in the receiving space 16.

[0102] It should be noted that, in the support process S21, dry air may be filled into the receiving space 16, for example. This allows the interior of the manufactured laminate LM to be in a low-moisture state, preventing performance degradation of the component 5 within the hermetically sealed package. Here, dry air refers to a gas whose moisture has been removed through a drying process, meaning a gas that does not produce water even with pressure fluctuations. Examples of dry air include, for instance, a gas obtained by drying the gas in the environment where the manufacturing apparatus 7 is located, or high-purity nitrogen gas.

[0103] For example, preferably, the support device 8 is arranged in a working space filled with dry air, and the above-described support process S21 is performed in the working space, thereby filling the receiving space 16 with dry air. As a result, not only the receiving space 16, but also the space between the first substrate 2 and the second substrate 3 in the laminate LM and inside the sealing material 6 (the receiving space of the element 5) is filled with dry air.

[0104] In the subsequent pressing step S22, the pump 39 draws the gas in the receiving space 16 through the flow path 36 of the pressure adjusting device 17 and discharges it to the outside. This reduces the air pressure in the receiving space 16, creating a negative pressure relative to the atmosphere. Under this negative pressure, the first surface 11a of the pressing member 11 is pressed tightly against the sealing member 15, pressing the second substrate 3 of the laminate LM. It should be noted that in the pressing step S22, the pressure within the receiving space 16 can be adjusted by operating the adjusting valve 38. The air pressure in the receiving space 16 is preferably 100–95000 Pa, more preferably 1000–85000 Pa.

[0105] Preferably, in the pressing process S22, the pressing member 11 flexes in a manner that presses the laminate LM due to the negative pressure of the receiving space 16.

[0106] like Figure 4 As shown, in the laser irradiation step S23, the sealing material 6 of the laminate LM is irradiated with laser L from the laser irradiation device 9, thereby heating the sealing material 6 (heating step). Laser L irradiates the sealing material 6 through the pressing member 11 and the second substrate 3. In the bonding step S2, the sealing material 6 is heated to a temperature above its softening point or at its softening flow temperature under the irradiation of laser L. Laser L irradiates in a manner that surrounds the closed curve of the sealing material 6.

[0107] The wavelength of laser L is preferably 600–1600 nm. Semiconductor lasers are suitable for use, but are not limited to this; various lasers such as YAG lasers, green lasers, and ultrashort pulse lasers can also be used.

[0108] Heating is performed using laser L, which softens and flows the sealing material 6, followed by curing. This forms a sealing layer 4 that hermetically bonds the first substrate 2 and the second substrate 3. Through the above process, a bonded body 1 comprising the first substrate 2, the second substrate 3, and the sealing layer 4 is manufactured. The bonded body 1 is removed from the support member 10 after the frame 14 and the pressing member 11 are removed from the base member 12.

[0109] According to the manufacturing method and manufacturing apparatus 7 of the assembly 1 of this embodiment described above, by using the fixing mechanism 13 to fix the support member 10 to the base member 12, it is possible to reliably prevent the positional displacement of the support member 10 when the laminate LM is housed in the housing portion 18 of the support member 10 in the support process S21.

[0110] Figures 18 to 22 The second embodiment of the present invention is shown. In this embodiment, the structure of the laminate LM and the structure of the support device 8 of the manufacturing apparatus 7 are different from those of the first embodiment.

[0111] like Figure 18 As shown, the pressing member 11 of the support device 8 has a protrusion 40 that is inserted into the receiving portion 18 of the support member 10. The protrusion 40 is formed on the first surface 11a of the pressing member 11. The protrusion 40 is cylindrical, but is not limited to this shape. The protrusion dimension PD2 of the protrusion 40 is smaller than the depth dimension D of the receiving portion 18 (see reference). Figure 21 The protrusion 40 has a pressing surface 41 that contacts the second main surface 3b of the second substrate 3 of the laminate LM.

[0112] like Figure 19 As shown, the support member 10 of the support device 8 has a receiving portion 18 that is circular in top view. The laminate LM is configured to be circular in top view (not shown) to engage with the receiving portion 18. That is, the first substrate 2 and the second substrate 3 of the laminate LM are configured as circular plates.

[0113] like Figures 18 to 22 As shown, the fixing mechanism 13, in addition to the elastic member 24 and fixing member 25 identical to those in the first embodiment, also has an insertion hole 26 and a locking recess 27 formed in the support member 10. It should be noted that the support member 10 in this embodiment does not have the guide groove 28 found in the first embodiment.

[0114] The diameter of the through hole 26 is larger than the diameter of the shaft portion 25b of the fixing member 25, but smaller than the diameter of the head 25a. Therefore, the through hole 26 allows the shaft portion 25b of the fixing member 25 to pass through, but the head 25a cannot pass through.

[0115] The locking recess 27, like in the first embodiment, has a side wall surface 27a that is circular when viewed from above and a bottom surface 27b that locks the head 25a of the fixing member 25. The locking recess 27 and the through hole 26 are concentric when viewed from above.

[0116] In this embodiment, the support member 10 is installed on the base member 12 as follows. First, as... Figure 20As shown, with the fixing member 25 of the fixing mechanism 13 removed from the threaded hole 31 of the base member 12, the support member 10 is placed on the elastic member 24 installed on the base member 12.

[0117] Next, from a top view, align the through hole 26 of the support member 10 with the threaded hole 31 of the base member 12, and pass the shaft portion 25b of the fixing member 25 through the through hole 26. Then, engage the shaft portion 25b with the threaded hole 31. This brings the head 25a of the fixing member 25 into contact with the bottom surface 27b of the locking recess 27, thus locking the support member 10. Through these steps, the support member 10 is fixed to the base member 12 by the fixing mechanism 13.

[0118] like Figure 18 , Figure 21 as well as Figure 22 As shown, the support device 8 includes an adjustment plate 42 that engages with the receiving portion 18. In this embodiment, one adjustment plate 42 is shown, but multiple adjustment plates 42 may also be used. The adjustment plate 42 is made of, for example, a circular glass plate or a metal plate. The adjustment plate 42 is placed on the bottom of the receiving portion 18 to adjust the depth of the receiving portion 18. Not limited to this usage, the adjustment plate 42 may also be made of transparent glass and used to overlap with the second main surface 3b of the second substrate 3 in the laminate LM received in the receiving portion 18.

[0119] The fixing mechanism 13 and the adjusting plate 42 of this embodiment can also be used in the support device 8 of the first embodiment.

[0120] The following describes the differences between the manufacturing method of the joint in this embodiment and that in the first embodiment. For example... Figure 21 As shown, in the manufacturing method of the joint in this embodiment, in the support process S21, the adjustment plate 42 is housed in the housing portion 18 of the support member 10, and then the laminate LM is housed in the housing portion 18.

[0121] like Figure 22 As shown, the depth dimension D of the receiving portion 18 in this embodiment is larger than the thickness dimension TLM of the laminate LM. Therefore, the laminate LM is not a part of the second substrate 3 that extends out from the receiving portion 18, but is entirely received within the receiving portion 18.

[0122] Next, the pressing member 11 is placed on the sealing member 15 mounted on the base member 12. At this time, the protrusion 40 of the pressing member 11 is inserted into the receiving portion 18 of the support member 10. The pressing surface 41 of the protrusion 40 contacts the second main surface 3b of the second substrate 3 housed in the laminate LM housed in the receiving portion 18.

[0123] In the pressing process S22, the pressing surface 41 presses the second substrate 3 of the laminate LM. In the subsequent laser irradiation process S23, the laser L passes through the protrusion 40 of the pressing member 11 and the second substrate 3 of the laminate LM to irradiate the sealing material 6.

[0124] The other structures in this embodiment are the same as in the first embodiment. Common reference numerals are used to label the components that are the same in this embodiment as in the first embodiment.

[0125] It should be noted that the present invention is not limited to the structure of the above-described embodiments, nor is it limited to the effects described above. Various modifications can be made to the present invention without departing from its spirit.

[0126] Explanation of reference numerals in the attached figures

[0127] 1. Connector

[0128] 2 First substrate

[0129] 3 Second substrate

[0130] 4 sealing layers

[0131] 6 Sealing materials

[0132] 8 Support devices

[0133] 10 Supporting Components

[0134] 11 Pressing Components

[0135] 12 base components

[0136] 13 Fixed mechanisms

[0137] 18 Containment Department

[0138] 24 elastic components

[0139] 25 Fixing components of the fixing mechanism

[0140] 26 through holes

[0141] 27Latching recess

[0142] 28 guide slots

[0143] 30 External Thread Section

[0144] 31 threaded hole

[0145] L-laser

[0146] LM stack

[0147] S1 Lamination Process

[0148] S2 Joining Process

[0149] S21 Support Process

[0150] S22 Pressing Process

[0151] S23 laser irradiation process.

Claims

1. A method for manufacturing a bond, comprising manufacturing a bond having a first substrate, a second substrate, and a sealing layer for bonding the first substrate and the second substrate, The method for manufacturing the joint is characterized in that... The method for manufacturing the joint includes: In the lamination process, a sealing material is sandwiched between the first substrate and the second substrate, and the first substrate and the second substrate are overlapped to form a laminate. The bonding process involves irradiating the sealing material in the laminate with a laser to form the sealing layer. The bonding process includes: a supporting process, assembling the laminate on a supporting device; a pressing process, pressing the laminate; and a laser irradiation process, irradiating the sealing material with laser light to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. In the supporting process, the supporting member is fixed to the base member using the fixing mechanism. The fixing mechanism includes: a fixing member having a head and a shaft; a hole formed in the support member and allowing the head and the shaft to pass through; a recess formed in the support member and locking the head; and a guide groove formed in the support member and allowing the shaft to move relative to the hole and the recess.

2. A method for manufacturing a bond, comprising manufacturing a bond having a first substrate, a second substrate, and a sealing layer for bonding the first substrate and the second substrate. The method for manufacturing the joint is characterized in that... The method for manufacturing the joint includes: In the lamination process, a sealing material is sandwiched between the first substrate and the second substrate, and the first substrate and the second substrate are overlapped to form a laminate. The bonding process involves irradiating the sealing material in the laminate with a laser to form the sealing layer. The bonding process includes: a supporting process, assembling the laminate on a supporting device; a pressing process, pressing the laminate; and a laser irradiation process, irradiating the sealing material with laser light to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. In the supporting process, the supporting member is fixed to the base member using the fixing mechanism. The fixing mechanism includes: a fixing member having a head and a shaft; and a hole formed in the supporting member and allowing the shaft to pass through. The shaft portion of the fixing member has an external thread. The base component has a threaded hole that engages with the external threaded portion.

3. A method for manufacturing a bond, comprising manufacturing a bond having a first substrate, a second substrate, and a sealing layer for bonding the first substrate and the second substrate. The method for manufacturing the joint is characterized in that... The method for manufacturing the joint includes: In the lamination process, a sealing material is sandwiched between the first substrate and the second substrate, and the first substrate and the second substrate are overlapped to form a laminate. The bonding process involves irradiating the sealing material in the laminate with a laser to form the sealing layer. The bonding process includes: a supporting process, assembling the laminate on a supporting device; a pressing process, pressing the laminate; and a laser irradiation process, irradiating the sealing material with laser light to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. In the supporting process, the supporting member is fixed to the base member using the fixing mechanism. The fixing mechanism includes: a fixing member having a head and a shaft; and a hole formed in the supporting member and allowing the shaft to pass through. The base component has an elastic member that supports the support component. One end of the elastic member is mounted on the base member, and the other end of the elastic member is in contact with the support member. In the supporting process, the fixing member fixes the supporting member to the base member while the elastic member is elastically deformed.

4. The method for manufacturing the joint according to any one of claims 1 to 3, wherein, The support member has a receiving portion for receiving the laminate.

5. An apparatus for manufacturing a bond, comprising a first substrate, a second substrate, and an sealing layer for bonding the first substrate and the second substrate. The manufacturing apparatus for the assembly is characterized in that... The apparatus for manufacturing the bond comprises: a support device that supports a laminate, the laminate being formed by sandwiching a sealing material between a first substrate and a second substrate and overlapping the first substrate and the second substrate; and a laser irradiation device that irradiates the sealing material in the laminate with a laser to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. The manufacturing apparatus for the joint is configured to fix the support member to the base member using the fixing mechanism. The fixing mechanism includes: A fixing component, which has a head and a shaft; A hole is formed in the support member and allows the head and the shaft to pass through; A recess formed in the support member and engaging the head; and a guide groove formed in the support member and allowing the shaft to move relative to the hole and the recess.

6. An apparatus for manufacturing a bond, comprising a first substrate, a second substrate, and an sealing layer for bonding the first substrate and the second substrate. The manufacturing apparatus for the assembly is characterized in that... The apparatus for manufacturing the bond comprises: a support device that supports a laminate, the laminate being formed by sandwiching a sealing material between a first substrate and a second substrate and overlapping the first substrate and the second substrate; and a laser irradiation device that irradiates the sealing material in the laminate with a laser to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. The manufacturing apparatus for the joint is configured to fix the support member to the base member using the fixing mechanism. The fixing mechanism includes: A fixing member having a head and a shaft; and a hole formed in the supporting member allowing the shaft to pass through. The shaft portion of the fixing member has an external thread. The base component has a threaded hole that engages with the external threaded portion.

7. An apparatus for manufacturing a bond, comprising a first substrate, a second substrate, and an sealing layer for bonding the first substrate and the second substrate. The manufacturing apparatus for the assembly is characterized in that... The apparatus for manufacturing the bond comprises: a support device that supports a laminate, the laminate being formed by sandwiching a sealing material between a first substrate and a second substrate and overlapping the first substrate and the second substrate; and a laser irradiation device that irradiates the sealing material in the laminate with a laser to form the sealing layer. The support device includes: a pressing member that presses against the laminate; a base member that supports the pressing member; a support member that supports the laminate; and a fixing mechanism that fixes the support member to the base member. The manufacturing apparatus for the joint is configured to fix the support member to the base member using the fixing mechanism. The fixing mechanism includes: A fixing member having a head and a shaft; and a hole formed in the supporting member allowing the shaft to pass through. The base component has an elastic member that supports the support component. One end of the elastic member is mounted on the base member, and the other end of the elastic member is in contact with the support member. The fixing member fixes the supporting member to the base member in a state where the elastic member is elastically deformed.

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