Component mounting machine

Abstract

A component mounting machine includes: a plurality of nozzle holders; a plurality of nozzles configured to be attached to and detached from the plurality of nozzle holders, respectively; an abnormality detection unit configured to detect an abnormality related to suction of a component by each of the nozzles attached to the plurality of nozzle holders; and a control unit. The control unit is configured to execute a first mounting process in which the nozzles are attached to the plurality of nozzle holders in a first combination and components are mounted to a board, acquire first abnormality information indicating a number of times of the abnormality detected by the abnormality detection unit for each of the nozzle holders in the first mounting process, execute a second mounting process in which the nozzles are attached to the plurality of nozzle holders in a second combination different from the first combination and components are mounted to the board, acquire second abnormality information indicating a number of times of the abnormality detected by the abnormality detection unit for each of the nozzle holders in the second mounting process, and determine a position where the abnormality occurs by comparing the first abnormality information and the second abnormality information.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a component mounting machine. Background Technology

[0002] Japanese Patent Application Publication No. 2010-118561 discloses a component assembly apparatus for mounting components on a substrate. In this apparatus, if an abnormality occurs when a first component is picked up using a first suction nozzle, a second suction nozzle (different from the first nozzle) is used to pick up the first component, and the abnormality is determined. If no abnormality occurs when using the second nozzle, it is determined that the abnormality originated from the first nozzle. Conversely, if an abnormality occurs when using the second nozzle, a second component (different from the first component) is picked up using the first nozzle, and the abnormality is determined again. If no abnormality occurs when picking up the second component, it is determined that the abnormality originated from the first component. This determines the cause of the abnormality related to component pickup. Summary of the Invention

[0003] The problem that the invention aims to solve

[0004] In Japanese Patent Application Publication No. 2010-118561, whenever an abnormality related to the adsorption of a component occurs, a process for determining the cause of the abnormality is performed. Therefore, there is a problem that the higher the frequency of the abnormality, the longer the cycle time. This specification provides a technique that can determine the cause of abnormalities related to the adsorption of a component while efficiently manufacturing the product.

[0005] Technical solutions for solving the problem

[0006] The component mounting machine disclosed in this specification is used to mount components onto a substrate. The component mounting machine includes: a head; a plurality of nozzle holders disposed on the head; a plurality of nozzles configured to be detachable from the plurality of nozzle holders and configured to adsorb the components; an anomaly detection unit that detects anomalies related to the adsorption of the components by each of the nozzles mounted on the plurality of nozzle holders; and a control unit. The control unit is configured to perform a first mounting process of mounting the nozzles onto the plurality of nozzle holders in a first combination and mounting the components onto the substrate. In the first mounting process, first anomaly information is obtained indicating the number of anomalies detected by the anomaly detection unit for each nozzle holder. Then, a second mounting process is performed of mounting the nozzles onto the plurality of nozzle holders in a second combination different from the first combination and mounting the components onto the substrate. In the second mounting process, second anomaly information is obtained indicating the number of anomalies detected by the anomaly detection unit for each nozzle holder. The location of the anomaly is determined by comparing the first anomaly information with the second anomaly information.

[0007] In the aforementioned component mounting machine, the control unit compares first abnormality information obtained in the first mounting process with second abnormality information obtained in the second mounting process to determine the location of the abnormality. For example, if a particular nozzle holder is detected abnormally more frequently in both the first and second mounting processes, it can be determined that an abnormality has occurred in that particular nozzle holder. Conversely, if a particular nozzle holder is detected abnormally more frequently in the first mounting process but less frequently in the second mounting process, it can be determined that the nozzle mounted on that particular nozzle holder was abnormal in the first mounting process. Thus, in the aforementioned component mounting machine, by performing the first and second mounting processes by replacing combinations of nozzles mounted on multiple nozzle holders, the location of the abnormality can be determined without stopping the operation of the component mounting machine. As a result, compared to a structure that determines the cause every time an abnormality occurs, products can be manufactured more efficiently. Attached Figure Description

[0008] Figure 1 This is a diagram showing the schematic structure of the component mounting machine involved in Embodiments 1 and 2.

[0009] Figure 2 yes Figure 1 A sectional view along line II-II.

[0010] Figure 3 A bottom view that represents the structure of the head in a stylized manner.

[0011] Figure 4 It is a block diagram showing the structure of the control system of the component mounting machine.

[0012] Figure 5 This is a diagram illustrating the process of identifying and handling abnormal locations in Example 1.

[0013] Figure 6 This is a diagram showing an example of the combination of each nozzle holder and each nozzle.

[0014] Figure 7 This is a graph representing an example of the number of anomalies in each nozzle holder as indicated by the first anomaly information.

[0015] Figure 8 This is a graph representing an example of the number of anomalies in each nozzle holder as indicated by the second anomaly information.

[0016] Figure 9 This is another example of a graph representing the number of anomalies for each nozzle holder as indicated by the second anomaly information.

[0017] Figure 10 This is a diagram illustrating the process of identifying and handling abnormal locations in Example 2.

[0018] Figure 11 This is a diagram showing an example of how many times a nozzle has been used relative to its respective nozzle holder. Detailed Implementation

[0019] In one embodiment of this technology, the control unit may be configured to perform a second installation process using the second combination instead of the first installation process if, during the first installation process using the first combination, the frequency of anomalies generated in the nozzles of any of the plurality of nozzle holders exceeds a first threshold.

[0020] If the frequency of certain anomalies increases, it is best to determine the cause of the anomaly. In the above structure, if the frequency of anomalies exceeds a first threshold, the process can be switched from the first installation process to the second installation process to determine the cause of the anomaly.

[0021] In one embodiment of this technology, the control unit may be configured to stop the operation of the component mounting machine if the frequency of anomalies generated in the nozzles of any of the plurality of nozzle holders exceeds a second threshold. The first threshold may also be smaller than the second threshold.

[0022] It is undesirable that the frequency of malfunctions would increase the more the component mounting machine should be stopped. Therefore, in the above structure, when the frequency of malfunctions exceeds a first threshold that is lower than a second threshold that should stop the component mounting machine, processing to determine the cause of the malfunction is performed. This structure allows for early intervention of malfunctions without stopping the component mounting machine.

[0023] In one embodiment of this technology, the control unit may be configured to execute a second installation process using the second combination after performing the first installation process using the first combination for a predetermined period.

[0024] In such a structure, it is possible to periodically determine whether an anomaly has occurred, and if an anomaly has occurred, to determine its cause.

[0025] In one embodiment of this technology, the control unit may be configured to determine the second combination in the first combination, in the case where there are multiple specific suction nozzles capable of adsorbing the same or similar elements among the suction nozzles respectively mounted on the plurality of suction nozzle holders, in a way that assigns the specific suction nozzles to the suction nozzle holders that were mounted with the specific suction nozzles in the first installation process in a combination different from the first combination.

[0026] In this structure, when multiple specific nozzles are present, the combination of specific nozzles is replaced among the nozzle holders equipped with those specific nozzles during the first installation process. Therefore, it is easy to determine whether the malfunction occurs in one of the multiple specific nozzles or in one of the multiple nozzle holders equipped with the multiple specific nozzles.

[0027] In one embodiment of this technology, the control unit may be configured to store the number of times each of the suction nozzles mounted on the plurality of suction nozzle holders is used, and to determine the second combination by allocating the suction nozzles with the fewest uses to the plurality of suction nozzle holders.

[0028] In this structure, the number of times the nozzles are used in each nozzle holder is averaged during the second installation process. Therefore, the accuracy in identifying locations where anomalies have occurred is improved.

[0029] In one embodiment of this technology, the plurality of nozzle holding structures may be arranged on the same circumference relative to the head. Alternatively, the control unit may be configured to determine the second combination in a manner that maintains the positional relationship of each nozzle respectively mounted on the plurality of nozzle holders in the first combination.

[0030] In this structure, the positional relationship between the multiple nozzles remains unchanged during the first and second installation processes. Therefore, the loading and unloading time of the nozzles relative to the nozzle holder can be shortened when transferring from the first installation process to the second installation process.

[0031] (Example 1)

[0032] Hereinafter, the component mounting machine 10 of an embodiment will be described with reference to the accompanying drawings. The component mounting machine 10 is an apparatus for mounting components 4 onto a substrate 2. The component mounting machine 10 is also referred to as a component assembly apparatus or a chip mounting machine. Typically, the component mounting machine 10 is arranged side by side with other substrate processing machines such as solder printing machines and substrate inspection machines to form a series of mounting lines.

[0033] like Figure 1 as well as Figure 2 As shown, the component mounting machine 10 includes multiple component feeders 12, a feeder holding section 14, a head 16, a moving device 18, a substrate conveyor 20, a nozzle receiving section 30, a camera 34, a control device 40, and a touch panel 42. Each component feeder 12 contains multiple components 4. The component feeder 12 is detachably mounted to the feeder holding section 14 and supplies components 4 to the head 16. The specific structure of the component feeder 12 is not particularly limited. Each component feeder 12 can be, for example, a belt feeder that contains multiple components 4 on a tape, a tray feeder that contains multiple components 4 on a tray, or a bulk feeder that randomly contains multiple components 4 in a container.

[0034] The feeder holding part 14 has multiple slots, in which the component feeder 12 can be detachably mounted. The feeder holding part 14 can be fixed to the component mounting machine 10, or it can be detached from the component mounting machine 10.

[0035] like Figure 1 as well as Figure 3 As shown, the head 16 includes a base 22, a rotating part 24, and a plurality of nozzle holders 26. The base 22 is mounted on the moving device 18 described later. The rotating part 24 is rotatably mounted on the base 22. The rotating part 24 protrudes downward from the lower surface of the base 22. The rotating part 24 rotates relative to the base 22 about an axis R by an actuator (not shown).

[0036] Each nozzle retainer 26 is mounted on the rotating part 24. More specifically, as... Figure 3As shown, a plurality of nozzle holders 26 are arranged at equal intervals along the circumference C on the lower surface of the rotating part 24, centered on the axis R. In this embodiment, eight nozzle holders 26 are mounted relative to the rotating part 24. As described above, since the rotating part 24 can rotate relative to the base 22 about the axis R, each nozzle holder 26 moves along the circumference C while maintaining the interval between adjacent nozzle holders 26 when the rotating part 24 rotates about the axis R. In addition, each nozzle holder 26 is configured to be movable in the Z direction (vertical direction) by an actuator (not shown) housed in the head 16. Each nozzle holder 26 detachably holds a nozzle 6 capable of adsorbing the element 4. Since the nozzle holder 26 can move along the circumference C, the nozzle 6 can also move along the circumference C as the nozzle holder 26 moves.

[0037] like Figure 1 As shown, the moving device 18 moves the head 16 between the component feeder 12 and the substrate 2. Although this is an example, the moving device 18 in this embodiment is an XY robot that moves the base 22 in the X and Y directions. Furthermore, the head 16 is not limited to being fixed to the base 22, but can also be detachably mounted on the moving base 18a.

[0038] As described above, since the base 22 moves along the XY direction, the nozzle 6 held in the nozzle holder 26 moves along the XY direction. Since the rotating part 24 rotates relative to the base 22 about the axis R, the nozzle 6 moves in the circumference C. Furthermore, since the nozzle holder 26 moves along the Z direction, the nozzle 6 also moves along the Z direction. Therefore, by moving the nozzle 6 in various directions, the nozzle 6 can adsorb the element 4, and the element 4 adsorbed on the nozzle 6 can be mounted onto the substrate 2. Specifically, first, the nozzle 6 is positioned in the XY direction relative to the element 4 supplied from the element feeder 12, and the nozzle 6 is moved downward until the adsorption surface (lower surface) of the nozzle 6 abuts against the element 4. When the adsorption surface of the nozzle 6 abuts against the element 4, the element 4 is adsorbed by the nozzle 6. After moving the nozzle 6 with the adsorbed element 4 upward, the element 4 adsorbed on the nozzle 6 is positioned relative to the substrate 2 in the XY direction by the moving device 18. Next, the element 4 is installed on the substrate 2 by moving the nozzle 6 downward until the element 4 comes into contact with the substrate 2.

[0039] The substrate conveyor 20 is a device for loading, positioning, and unloading the substrate 2. As an example, the substrate conveyor 20 in this embodiment has a pair of belt conveyors and a support device for supporting the substrate 2 from below (not shown).

[0040] like Figure 2As shown, the nozzle receiving section 30 is disposed between the component feeder 12 and the substrate conveyor 20 (more specifically, the belt conveyor disposed on the side of the component feeder 12 in a pair of belt conveyors). The nozzle receiving section 30 can receive a plurality of nozzles 6 and exchange nozzles 6 with the head 16. The plurality of nozzles 6 are respectively received in a plurality of nozzle receiving holes 32 formed in the nozzle receiving section 30. The nozzle receiving holes 32 are configured to receive a variety of nozzles 6.

[0041] A camera 34 is positioned between the component feeder 12 and the substrate conveyor 20 (specifically, the belt conveyor located on the side of the component feeder 12 in a pair of belt conveyors). The camera 34 is positioned with its shooting direction upwards to capture images from below of the nozzle 6 with the component 4 attached to it. That is, the camera 34 captures images of the lower surface of the component 4 attached to the nozzle 6. The camera 34 is, for example, a CCD camera. The image data captured by the camera 34 is sent to the control device 40.

[0042] The control device 40 is equipped with a computer containing a CPU, ROM, and RAM. For example... Figure 4 As shown, the control device 40 is communicatively connected to the component feeder 12, the head 16, the moving device 18, the substrate conveyor 20, the camera 34, and the touch panel 42. The control device 40 performs the mounting process of the component 4 onto the substrate 2 by controlling the above-mentioned components.

[0043] like Figure 4 As shown, the control device 40 includes an anomaly detection unit 52, an anomaly information storage unit 54, and a combination decision unit 56. The anomaly detection unit 52 detects anomalies related to the adsorption of the component 4. Examples of anomalies related to the adsorption of the component 4 include failure of the nozzle 6 to adsorb the component 4, and anomalies in the image processing of the image by the camera 34 of the component 4 adsorbed on the nozzle 6 (i.e., anomalies in the adsorption posture of the component 4). In addition, anomalies in the adsorption posture of the component 4 can also be detected by taking a side view of the component 4 adsorbed on the nozzle 6 using another camera mounted on the base 22.

[0044] The anomaly information storage unit 54 stores the anomaly information detected by the anomaly detection unit 52. As described above, in this embodiment, eight nozzle holders 26 are provided, and the anomaly information storage unit 54 accumulates and stores the number of anomalies detected by the anomaly detection unit 52 for each nozzle holder 26.

[0045] The assembly determination unit 56 determines the suction nozzles 6 assigned to each suction nozzle holder 26 (i.e., the suction nozzles 6 assembled to each suction nozzle holder 26). As will be described later, in this embodiment, there are multiple suction nozzles 6 used depending on the type of element 4 that is being adsorbed. Specifically, in this embodiment, there are three types of suction nozzles 6 with diameters of φ3, φ4, and φ7 (see reference). Figure 6 The same type of suction nozzle 6 (i.e., the same diameter) is configured to adsorb the same or similar components 4. The combination determining unit 56 determines the combination of the suction nozzle 6 and the suction nozzle holder 26, depending on which type of suction nozzle 6 is fitted onto the suction nozzle holder 26. The method for determining this combination will be described later. Furthermore, the term "similar components" as used in this specification refers to components that are substantially equal in size, substantially equal in shape, substantially equal in resistance, etc.

[0046] The touch panel 42 is a display device that provides various information to the operator and is a user interface that receives instructions and information from the operator. For example, the touch panel 42 can display to the operator the location of any abnormality related to the adsorption of component 4.

[0047] Next, the process for identifying the location of the abnormality related to the adsorption of element 4 (hereinafter referred to as the abnormality location identification process) will be described. Hereinafter, to distinguish between the eight nozzle holders 26, each nozzle holder 26 will be referred to as holders A to H, and the description will continue. Furthermore, to distinguish between the nozzles 6 assembled in each nozzle holder 26, each nozzle 6 will be referred to as nozzles a to h, and the description will continue. Figure 6 As shown, the diameter of nozzles a to d is φ3, the diameter of nozzles e to g is φ4, and the diameter of nozzle h is φ7. Figure 5 This is a flowchart illustrating the process of identifying and handling abnormal locations. First, the control device 40 determines the first combination of the cages A-H and the nozzles a-h (S10). For example, the control device 40... Figure 6 The first combination is determined as shown in area M (a combination of nozzle a relative to cage A, nozzle b relative to cage B, etc.). Alternatively, the first combination can also be determined by the operator inputting the combination of cages A to H and nozzles a to h into the touch panel 42.

[0048] Next, the control device 40 assembles the nozzles a to h onto each of the retainers A to H in the first combination, and performs the first installation process (S12). The first installation process is performed, for example, according to the operation pre-input into the control device 40.

[0049] Next, the control device 40 acquires first anomaly information (S14) indicating the number of anomalies detected during the first installation process. For example, Figure 7As shown, the control device 40 acquires first abnormality information corresponding to each nozzle holder, indicating the number of abnormalities related to the adsorption of element 4. Furthermore, in Figure 7 In the diagram, the letters in parentheses indicate the reference numerals for the nozzles assembled with the cage. (This will be discussed later.) Figure 8 as well as Figure 9 The same applies to China.

[0050] Next, the control device 40 determines whether the frequency of anomalies occurring in the nozzle of one of the holders assembled in the holders A to H exceeds a first threshold (S16). For example, if the number of anomalies in the number of trial adsorptions relative to the element 4 exceeds the first threshold, the control device 40 determines "yes" in S16. Figure 7 The example shown illustrates a situation where the frequency of anomalies occurring in the nozzle a, mounted on the retainer A, exceeds a first threshold. Furthermore, the first frequency is set to a value lower than the second threshold, which is the frequency of anomalies at which the operation of the component mounting machine 10 should be stopped. The first frequency is not particularly limited; for example, it can be set to 0.1%. It is not preferable for the frequency of anomalies to be higher the more the operation of the component mounting machine 10 should be stopped. Therefore, in this embodiment, when the frequency of anomalies exceeds the first threshold, which is lower than the second threshold at which the operation of the component mounting machine 10 should be stopped, the process of determining the location of the anomaly, as described later, is performed. By configuring it in this way, anomalies can be addressed as early as possible without stopping the operation of the component mounting machine.

[0051] Next, the control device 40 determines the second combination of the cages A-H and the nozzles a-h (S18). The process for determining the second combination will be explained. In this embodiment, there are multiple nozzles of the same type (i.e., the same diameter) among the nozzles a-h assembled to each cage A-H. For example, in the first combination, nozzles a-d with a diameter of φ3 are respectively installed relative to the cages A-D. The control device 40 determines the second combination by allocating nozzles a-d with a diameter of φ3 to the cages A-D in a combination different from the first combination. For example, as... Figure 6 As shown in region N, control device 40 determines the combination of nozzle b relative to cage A, nozzle c relative to cage B, nozzle d relative to cage C, and nozzle a relative to cage D. Control device 40 similarly determines a second combination for cages E to G. Control device 40 assigns φ7 nozzles to cage H in the same manner as the first combination. As described above, control device 40 determines the second combination.

[0052] return Figure 5 The flowchart is explained below. When the control device 40 determines the second combination in S18, it assembles the nozzles a to h onto each of the cages A to H with the second combination and performs the second installation process (S20). The second installation process is performed in the same manner as the first installation process.

[0053] Next, the control device 40 acquires second anomaly information (S22) indicating the number of anomalies detected during the second installation process. The control device 40, for example, as follows: Figure 8 As shown, second anomaly information is obtained to represent the number of anomalies related to the adsorption of element 4 for each nozzle holder.

[0054] Next, the control device 40 determines whether the frequency of the abnormality generated in the nozzle of one of the cages A to H exceeds the first threshold (S24). The determination method in S24 is the same as that in S16. Figure 8 The example shown illustrates a situation where the frequency of anomalies generated in the nozzle b assembled in cage A exceeds a first threshold.

[0055] Next, the control device 40 compares the first abnormality information and the second abnormality information to determine the location where the abnormality occurred (S26). Figure 7 as well as Figure 8 In the example shown, the frequency of anomalies generated in cage A (nozzle a) exceeded the first threshold in the first installation process, and the frequency of anomalies generated in cage A (nozzle b) exceeded the first threshold in the second installation process. In other words, cage B equipped with nozzle b in the first installation process and cage D equipped with nozzle a in the second installation process did not generate many anomalies. Therefore, in Figure 7 as well as Figure 8 In the example shown, the control device 40 can determine that due to an abnormality in the cage A, there are more abnormalities related to the adsorption of element 4 in the nozzle assembled with the cage A. In addition, examples of abnormalities in the cage A include, for example, a driving abnormality of the actuator that drives the cage A in the Z direction, or the clamping of foreign objects into the actuator.

[0056] Next, the control device 40 displays the location identified in S26 as the location where the abnormality occurred on the touch panel 42 (S28). That is, the control device 40 displays on the touch panel 42 that an abnormality has occurred in the cage A. After executing S28, the control device 40 ends the series of processes.

[0057] Furthermore, in S22, there is an acquisition Figure 9 The example shown illustrates a second type of abnormal information. That is, in... Figure 9 In the example shown, the frequency of anomalies generated in the nozzle a, which is assembled with the cage D, exceeds the first threshold. When comparing... Figure 7 as well as Figure 9The abnormal information shown indicates that, in the first installation process, the frequency of abnormalities occurring in cage A (nozzle a) exceeded a first threshold, and in the second installation process, the frequency of abnormalities occurring in cage D (nozzle a) exceeded the first threshold. In other words, abnormalities were not significantly observed in cage D (with nozzle d) in the first installation process and in cage A (with nozzle b) in the second installation process. Therefore, in Figure 7 as well as Figure 9 In the example shown, in S26, the control device 40 can determine that an abnormality related to the adsorption of element 4 has increased because an abnormality has occurred at the nozzle a. Other examples of abnormalities at the nozzle a include gaps in the adsorption surface of the nozzle a and dirt.

[0058] In the component mounting machine 10 of this embodiment, the control device 40 compares the first abnormality information obtained in the first mounting process with the second abnormality information obtained in the second mounting process to determine the location where the abnormality occurred. For example, the control device 40 compares... Figure 7 as well as Figure 8 The abnormal information shown indicates that, in both the first and second installation processes, if the frequency of abnormalities in a specific nozzle holder (i.e., holder A) is high, it can be determined that an abnormality has occurred in holder A. Furthermore, if the frequency of abnormalities in a specific nozzle holder (holder A) is high in the first installation process, but low in the second installation process, it can be determined that an abnormality has occurred in the nozzle a mounted on holder A in the first installation process. Thus, in the component mounting machine 10 of this embodiment, by performing the first and second installation processes instead of combinations of nozzles 6 respectively mounted on multiple nozzle holders 26, the location of the abnormality can be determined without stopping the operation of the component mounting machine 10. As a result, compared to a structure that determines the cause every time an abnormality occurs, products can be manufactured more efficiently.

[0059] Furthermore, in the above embodiments, there are multiple suction nozzles 6 of the same type (i.e., suction nozzles a to d, suction nozzles e to g). In the first installation process, the second installation process is performed by replacing the combination of suction nozzles 6 assembled with suction nozzle holders of the same type. Therefore, it is easy to determine whether the abnormality is caused by the suction nozzle 6 or by the suction nozzle holder 26.

[0060] (Example 2)

[0061] Next, Example 2 will be described. The component mounting machine of Example 2 has the same structure as that of Example 1. In Example 2, the method of identifying and handling abnormal parts is different from that of Example 1. Figure 10 This is a flowchart illustrating the process of identifying abnormal locations in Example 2. Figure 10S30 and S32 are respectively related to Example 1 Figure 5 S10 and S12 are the same.

[0062] In S34, the control device 40 determines whether a predetermined period has elapsed since the start of the first installation process. The predetermined period is not specifically limited; for example, it can be set to 24 hours. Furthermore, the predetermined period can be the actual operating time of the component mounting machine 10 after the start of the first installation process, or it can be a period including the time the component mounting machine 10 stops operating after the start of the first installation process. When the control device 40 determines that the predetermined period has elapsed since the start of the first installation process (S34: Yes), it proceeds to S36. S36, S38, and S40 are respectively related to… Figure 5 S14, S18 and S20 are the same.

[0063] In S42, the control device 40 determines whether a predetermined period has elapsed since the start of the second installation process (S40). The predetermined period in S40 may be the same as or different from the predetermined period in S34. When the control device 40 determines that a predetermined period has elapsed since the start of the second installation process (S42: Yes), it proceeds to S44. S44 and S46 are respectively related to... Figure 5 S22 and S26 are the same. When the control device 40 executes S46, in S48, the location identified as the location where the abnormality occurred is displayed on the touch panel 42, and the series of processes ends.

[0064] As described above, in Example 2, unlike Example 1, instead of determining whether the frequency of anomalies exceeds a threshold (…), the… Figure 5 Instead of performing the first installation process (S16), if a predetermined period has elapsed since the start of the first installation process (S34: Yes), the second installation process is performed instead of the first installation process. Therefore, in Embodiment 2, it is possible to periodically determine whether an abnormality related to the adsorption of element 4 has occurred, and if an abnormality has occurred, the cause can be determined.

[0065] Furthermore, the method of determining the second combination is not limited to the methods of Embodiments 1 and 2. The second combination can be different from the first combination, and the control device 40 can also randomly determine the second combination. In addition, the determination of the second combination can also be carried out in other ways described below.

[0066] For example, Figure 11 As shown, the control device 40 can also accumulate and store the number of times each nozzle is used in each of the retainers A to H. Then, when determining the second combination, the control device 40 can also determine the second combination by allocating the nozzles with the fewest uses to each of the retainers A to H. Specifically, as... Figure 11As shown, the control device 40 can also determine the second combination by allocating a nozzle b (used 12 times) to cage A, a nozzle d (used 31 times) to cage B, a nozzle a (used 21 times) to cage C, and a nozzle d (used 75 times) to cage D. In this configuration, the number of times the nozzles assembled to each cage A through H are used is averaged during the second installation process. Therefore, the accuracy in identifying locations where abnormalities have occurred is improved.

[0067] Furthermore, in the above embodiment, the nozzle holders 26 are arranged on the same circumference. Therefore, the control device 40 can, for example, determine the second combination in a manner that the positional relationship between the nozzles a to h assembled on each holder A to H remains unchanged. That is, the control device 40 can also determine the second combination by shifting the combination of holders A to H and nozzles a to h clockwise or counterclockwise by one or more times during the first installation process. In such a structure, the positional relationship between each nozzle a to h remains unchanged during the first and second installation processes, thus shortening the loading and unloading time of nozzles a to h relative to holders A to H when transferring from the first installation process to the second installation process.

[0068] In addition, the processing of comparing the frequency of anomalies with the threshold in Example 1 can also be performed simultaneously. Figure 5 S16 and S24) and the process of determining whether the predetermined period in Example 2 has been completed ( Figure 10 (S34 and S42). For example, it can also be in Figure 5 After determining "no" in S16, proceed... Figure 10 S34.

[0069] Alternatively, in the above embodiments, this step may not be performed. Figure 5 S16, S24 and Figure 10 S34 and S42. For example, in Figure 5 In S16, if the number of adsorption trials of element 4 exceeds a predetermined number, first abnormal information can be obtained (S14), and a second combination can be determined (S18). Additionally, in Figure 5 In S24, if the number of adsorption trials of element 4 exceeds a predetermined number, second abnormal information can be obtained (S22), and processing to determine the abnormal part can be performed (S26).

[0070] Furthermore, in the above embodiments, all of the anomaly detection unit 52, anomaly information storage unit 54, and combination decision unit 56 may not be provided in the control device 40 of the component mounting machine 10. For example, at least one of the anomaly detection unit 52, anomaly information storage unit 54, and combination decision unit 56 may be provided in a computer that is external to the component mounting machine 10 and can communicate with the component mounting machine 10.

[0071] The above provides detailed examples of the specific technologies disclosed in this specification; however, these are merely examples and do not limit the scope of the claims. The technologies described in the claims include various modifications and alterations to the specific examples described above. Furthermore, the technical elements illustrated in this specification or the accompanying drawings, whether individually or in various combinations, are technically useful and are not limited to the combinations described in the claims at the time of application.

Claims

1. A component mounting machine for mounting components onto a substrate, wherein, The component mounting machine includes: head; Multiple nozzle holders are provided on the head; Multiple suction nozzles are configured to be attached to and detached from the multiple suction nozzle holders respectively, and are configured to adsorb the element; An anomaly detection unit detects anomalies related to the adsorption of the element by each of the nozzles assembled on the plurality of nozzle holders; as well as Control Department Each of the nozzle holders detachably holds one of the nozzles. The control unit is configured such that, A first mounting process is performed, in which the plurality of nozzle holders are respectively assembled with the nozzles in a first combination with the plurality of nozzles, and the components are mounted on the substrate. In the first installation process, first abnormality information is obtained, which is information representing the number of abnormalities detected by the abnormality detection unit for each nozzle holder. A second mounting process is performed, in which the plurality of nozzle holders are respectively assembled with the nozzles in a second combination different from the first combination, and the components are mounted on the substrate. In the second installation process, second abnormality information is obtained, which is information representing the number of abnormalities detected by the abnormality detection unit for each nozzle holder. By comparing the first abnormal information with the second abnormal information, it is determined whether the abnormality occurred in the nozzle holder or the nozzle itself.

2. The component mounting machine according to claim 1, wherein, The control unit is configured to, during the first installation process using the first combination, if the frequency of anomalies generated in the nozzles of any of the plurality of nozzle holders exceeds a first threshold, replace the first installation process with the second installation process using the second combination.

3. The component mounting machine according to claim 2, wherein, The control unit is configured to stop the operation of the component mounting machine if the frequency of anomalies occurring in the nozzles of any of the plurality of nozzle holders exceeds a second threshold. The first threshold is smaller than the second threshold.

4. The component mounting machine according to any one of claims 1 to 3, wherein, The control unit is configured to perform a second installation process using the second combination after performing the first installation process using the first combination for a predetermined period.

5. The component mounting machine according to any one of claims 1 to 3, wherein, The control unit is configured such that, in the first combination, when there are multiple specific suction nozzles among the suction nozzles respectively mounted on the plurality of suction nozzle holders that are capable of adsorbing the same or similar elements, the second combination is determined by distributing the specific suction nozzles to the suction nozzle holders that were mounted with the specific suction nozzles in the first installation process in a combination different from the first combination.

6. The component mounting machine according to any one of claims 1 to 3, wherein, The control unit is configured such that, The number of uses of each of the aforementioned nozzles, which are respectively mounted on the plurality of nozzle holders, is stored for each nozzle. The second combination is determined by assigning the least used nozzle to each of the plurality of nozzle holders.

7. The component mounting machine according to any one of claims 1 to 3, wherein, The plurality of suction nozzles are arranged on the same circumference relative to the head. The control unit is configured to determine the second combination in such a way that the positional relationship of each of the suction nozzles respectively mounted on the plurality of suction nozzle holders in the first combination remains unchanged.

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