Regeneration chip, regeneration ink cartridge and chip repair process

Abstract

The present disclosure provides a regenerated chip, a regenerated ink cartridge and a chip repair process. The regenerated chip comprises a nozzle chip, a conductive adhesive layer and a regenerated circuit board. The nozzle chip comprises a pad. The conductive adhesive layer is electrically connected with the pad. The regenerated circuit board comprises a regenerated circuit electrically connected with the conductive adhesive layer. The regenerated circuit can replace a faulty circuit board to provide a regenerated circuit that can be normally used. The conductive adhesive layer can provide strong connection strength and good electrical connection effect.

Description

Technical Field

[0001] This disclosure relates to the field of printer consumables, and in particular to a regenerable chip, a regenerable ink cartridge, and a chip repair process. Background Technology

[0002] Ink cartridges are common consumables for printers and are crucial components of the entire printer. Currently, ink cartridges on the market can be broadly categorized into separate cartridges and integrated cartridges. Integrated cartridges, also known as printhead cartridges, generally consist of four components: the housing, the printhead, the printhead sponge, and the original circuit board. The basic functions of each component are summarized below:

[0003] 1. Housing: The main body with printhead and ink cartridge, used to store and install printhead, sponge and original circuit board;

[0004] 2. Printhead chip: including memory and ink outlet, used to control the ink ejection to achieve the final printing function;

[0005] 3. Sponge: Used to absorb the ink stored inside the casing and slowly release the ink, reducing the movement of ink inside the casing when the casing moves;

[0006] 4. Circuit board:

[0007] 4.1 One end of the circuit board is provided with a contact point, which is used for the ink cartridge to contact the printer's pins to realize communication between the ink cartridge and the printer.

[0008] 4.2 The other end of the circuit board is installed together with the printhead chip, and then assembled onto the cartridge housing.

[0009] The original circuit board and printhead chip form a complete chip assembly, which can then be tested. Defective products obtained during testing are due to various reasons, such as: improper installation of the printhead chip and circuit board, requiring reinstallation; a faulty printhead chip; or a faulty circuit board, requiring both the circuit board and printhead chip to be discarded or scrapped. Furthermore, used ink cartridges can also be recycled, and the recycled chip assemblies can be tested.

[0010] Because the cost of the printhead chip in the chip assembly is relatively high, it would be wasteful to simply scrap it along with the circuit board, and the scrapped chip assembly is also not environmentally friendly. Therefore, it is hoped that such pre-assembled printhead chips can be recycled. Summary of the Invention

[0011] In view of this, it is necessary to provide a regenerable chip to address the above problems and solve the problem of reusing the nozzle chip in the discarded chip assembly.

[0012] This disclosure provides a regenerated chip, including: a nozzle chip including pads; a conductive adhesive layer electrically connected to the pads; and a regenerated circuit board including regenerated circuitry electrically connected to the conductive adhesive layer.

[0013] This setup allows for the replacement of faulty circuit boards with regenerable circuit boards that can be used normally. Furthermore, the conductive adhesive layer provides strong connection strength and good electrical connection effect by electrically connecting the nozzle chip and the regenerable circuit board. The conductive adhesive layer also has low requirements for the processing of faulty chip components that need to be repaired, making the repair process simple.

[0014] In some implementations, the regenerated chip also includes a native circuit board, which includes native circuitry; the pads are electrically connected to the conductive adhesive layer via the native circuitry.

[0015] With this setup, the usable portion of the faulty circuit board of the faulty chip is retained as the original circuit board. During repair, the electrical connection between the printhead chip and the original circuit board will not be affected. Then, the original circuit board and the regenerated circuit board are electrically connected through a conductive adhesive layer. This reduces the possibility of damage to the chip portion of the printhead chip during repair and eliminates the need to treat the sealant at the printhead chip. As a result, the process of regenerating the chip is simple and the production cost is low.

[0016] In some implementations, the original circuitry and the regenerated circuitry are overlapped and bonded together by a conductive adhesive layer located between them.

[0017] This configuration increases the connection area between the original and regenerated lines, thereby enhancing their connection strength.

[0018] In some embodiments, the regenerated circuit board further includes a first protective film covering a portion of the regenerated circuit, the first protective film having a first gap space between it and the original circuit; the original circuit board further includes a second protective film covering a portion of the original circuit, the second protective film having a second gap space between it and the regenerated circuit; wherein, the regenerated chip further includes a third protective film and a fourth protective film, the third protective film covering and sealing the second gap space, and the fourth protective film covering and sealing the first gap space.

[0019] This design reduces the workload of repairing the second protective film during restoration and helps maintain the integrity of the original circuitry. Furthermore, the portion of the original circuitry exposed to the second protective film can be electrically connected to the regenerated circuitry via a conductive adhesive layer, facilitating good performance of the regenerated chip. The third and fourth protective films protect the conductive adhesive layer and strengthen the bond at the joints, minimizing the risk of the regenerated chip becoming unusable due to broken electrical connections during subsequent use. Moreover, due to the inclusion of the first and second protective films, the third and fourth protective films can be smaller in size, and their formation process is faster.

[0020] In some implementations, the length m of the regenerated circuit board (300) and the length n of the regenerated chip satisfy the following condition: 20% ≤ m / n ≤ 60%.

[0021] This setup helps ensure the functionality of the regenerated chip and also helps maintain the connection strength between the regenerated circuit board and the original circuit board.

[0022] In some embodiments, the conductive adhesive layer is an anisotropic conductive adhesive film.

[0023] Anisotropic conductive adhesive films can achieve unidirectional conductivity while maintaining good cross-sectional insulation. Therefore, multiple conductive lines on the recycled circuit board can be sequentially covered by a single conductive adhesive layer, achieving insulation between the multiple conductive lines. Subsequently, the multiple conductive lines on the recycled circuit board can be uniformly and simultaneously matched with multiple pads on the nozzle chip or multiple conductive lines on the original circuit board, and can be finely adjusted, for example, under a microscope.

[0024] This disclosure also provides a regenerated ink cartridge, including the regenerated chip described herein.

[0025] This regenerated ink cartridge performs well, is low in cost, and its manufacturing process reduces waste and is environmentally friendly.

[0026] This disclosure also provides a chip repair process, including: forming a conductive adhesive layer electrically connected to the pads of a printhead chip, wherein the printhead chip is taken from a faulty chip; and attaching the conductive adhesive layer to a regenerated circuit board so that the conductive adhesive layer and the regenerated circuit are electrically connected.

[0027] This chip repair process can utilize faulty chips that were originally intended to be scrapped, reducing waste. The chip repair process is relatively simple, easy to implement, and fast. The pads of the nozzle chip and the regeneration circuit of the regeneration circuit board can achieve a stable and reliable mechanical and electrical connection, and the resulting regeneration chip can work well.

[0028] In some embodiments, the chip repair process further includes removing at least a portion of the faulty circuit board of the faulty chip, wherein the faulty circuit board is electrically connected to the pads of the nozzle chip.

[0029] This configuration ensures the proper functioning of the nozzle chip and allows for the removal of faulty components from faulty circuit boards.

[0030] In some embodiments, the step of removing at least a portion of the faulty circuit board from the faulty chip includes: removing a portion of the faulty circuit board to form a native circuit board including native circuitry; and the step of forming a conductive adhesive layer includes: attaching the conductive adhesive layer to the native circuitry to make the conductive adhesive layer electrically connected to the native circuitry.

[0031] This setup preserves the original circuit board, which still functions well, and eliminates the need to repair the connection between the printhead chip and the original circuit board, ensuring a secure connection between them.

[0032] In some implementations, the chip repair process further includes: bridging the original circuitry and the regenerated circuitry, with a conductive adhesive layer placed between them.

[0033] This setup enhances the connection strength between the native and regenerated lines, thereby ensuring an effective electrical connection between them.

[0034] In some embodiments, the step of removing at least a portion of the faulty circuit board from the faulty chip includes: removing a portion of the protective layer of the faulty circuit board to form a second protective film covering a portion of the original circuit; the regenerated circuit board further includes a first protective film 321 covering a portion of the regenerated circuit 310; the chip repair process further includes: forming a third protective film and a fourth protective film, wherein the third protective film covers and seals a second gap space between the second protective film and the regenerated circuit, and the fourth protective film covers and seals a first gap space between the first protective film and the original circuit.

[0035] With this configuration, the third and fourth protective films formed in this step can be used to protect the conductive adhesive layer and prevent it from coming into contact with air through the first or second space. The third and fourth protective films can also work in conjunction with the first and second protective films to protect the conductive wires.

[0036] In some implementations, the step of removing at least a portion of the faulty circuit board includes removing 20% ​​to 60% of the length of the faulty circuit board.

[0037] Removing 20% ​​to 60% of the faulty circuit board basically ensures that the faulty part is removed. The original circuit board remaining on the faulty circuit board can work effectively. Then, the complete circuit of the regenerated chip is completed by the regenerated circuit board, and the regenerated chip can realize the predetermined function.

[0038] In some embodiments, the conductive adhesive layer is an anisotropic conductive adhesive film, and the step of attaching the conductive adhesive layer includes: hot-pressing the conductive adhesive layer.

[0039] The anisotropic conductive adhesive film can be firmly bonded to the recycled circuit board through hot pressing without causing any damage to the printhead chip.

[0040] Another aspect of this disclosure provides a regenerated chip, comprising: a nozzle chip including pads; a native circuit board including native lines electrically connected to the pads; and a regenerated circuit board including regenerated lines electrically connected to the native lines. Exemplarily, one end of the native lines is bonded to a bonding wire, and the other end of the regenerated lines is bonded to the bonding wire.

[0041] By setting up regeneration circuitry to complete the original circuitry, it can be ensured that the regenerated chip resolves the fault of the original faulty chip, and the regenerated chip can regain its usability.

[0042] Another aspect of this disclosure provides a chip repair process, which includes: removing a portion of the faulty circuit board of a faulty chip to form a native circuit board including native circuitry, wherein the native circuit board is electrically connected to a nozzle chip; electrically connecting conductive components to the native circuit board; and regenerated circuitry electrically connecting the conductive components to the regenerated circuit board. Exemplarily, the conductive components are bonding wires or conductive adhesive. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the faulty chip in the comparative example of this disclosure;

[0044] Figure 2 This is a schematic diagram of the structure of the regenerated chip in an embodiment of this disclosure;

[0045] Figure 3 for Figure 2 A schematic top view of the regenerated chip;

[0046] Figure 4 This is a schematic diagram of the structure of another regenerable chip in an embodiment of this disclosure;

[0047] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0048] Figure 6 for Figure 4 A schematic top view of the regenerated chip;

[0049] Figure 7 This is a partial enlarged view of another regenerated chip in an embodiment of this disclosure;

[0050] Figure 8 This is a schematic diagram of the structure of the regenerated ink cartridge in an embodiment of this disclosure;

[0051] Figure 9 This is a flowchart of the chip repair process in an embodiment of this disclosure.

[0052] Reference numerals: 1. Regenerated ink cartridge; 10. Regenerated chip; 11. Faulty chip; 100. Printhead chip; 101. Pad; 102. Crystal; 103. First gap space; 104. Second gap space; 20. Faulty circuit board; 21. Conductive line of the faulty circuit board; 22. Protection structure of the faulty circuit board; 23. Contact of the faulty circuit board; 200. Original circuit board; 201. Original cutout space; 210. Original circuit; 220. Second protection Structure; 221, Second protective film; 222, Sixth protective film; 300, Recycled circuit board; 301, Recycled hollow space; 310, Recycled circuit; 311, Recycled conductive line; 312, Recycled contact; 320, First protective structure; 321, First protective film; 322, Fifth protective film; 400, Conductive adhesive layer; 510, Third protective film; 520, Fourth protective film; 600, Binding line; 610, Protective adhesive; 7, Housing; 71, Sponge. Detailed Implementation

[0053] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0054] It should be noted that when a component is referred to as "connected to", "set to", "fixed to", or "mounted to" another component, it can be directly on the other component or it can exist in the middle of the component.

[0055] The structural dimensions shown in the accompanying drawings do not represent actual dimensions and may be adjusted as needed during actual production. The directional terms "up," "down," "left," and "right" used in this document refer to the orientation shown in the drawings and should not be considered as limitations on the actual use of the product unless explicitly stated otherwise. The terms "above," "on top of," and "above" used to describe the first feature in this document as being "above" or "above" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature.

[0056] In this document, the terms "first," "second," "third," etc., are used only to distinguish identical features. Understandably, the "first protective film" in this document can also be referred to as the "second protective film," and vice versa. The product dimensions in the accompanying drawings are not actual dimensions, and the proportions between dimensions may be adjusted. For example, the thickness and length ratio of the original circuit board are not actual ratios.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0058] like Figure 1 As shown, this disclosure provides a fault chip 11 as a comparative example. The fault chip 11 includes a nozzle chip 100 and a fault circuit board 20. The fault circuit board 20 includes a native cutout space 201 to avoid the nozzle chip 100.

[0059] The faulty circuit board 20 is electrically connected to the printhead chip 100. The faulty circuit board 20 can be, for example, a printed circuit board, specifically a flexible circuit board. The wiring of the faulty circuit board 20 can be housed within a protective structure 22, and the wiring of the faulty circuit board 20 can include multiple conductive lines. For example, the two ends of the conductive lines 21 of the faulty circuit board are electrically connected to the contacts 23 of the faulty circuit board and the printhead chip 100, respectively. However, due to the breakage of some conductive lines 21 of the faulty circuit board, the contacts 23 of the faulty circuit board cannot be electrically connected to the printhead chip 100. In some cases, the contacts 23 of the faulty circuit board may also be detached or damaged.

[0060] In other cases, the failure of chip 11 may be due to damage to the contacts of the faulty circuit board 20 used to connect to the nozzle chip 100, resulting in poor contact between the faulty circuit board 20 and the nozzle chip 100. The nozzle chip 100 can be removed, and the pads 101 of the nozzle chip 100 can be cleaned. Figure 2 ( ) Nearby glue, solder, and other debris. In some embodiments, the printhead chip 100 taken from the faulty chip 11 can be considered to be substantially the same as a brand-new printhead chip.

[0061] In some comparative embodiments, the entire faulty circuit board 20 can be removed from the faulty chip 11. This can be achieved by electrically connecting the regenerated circuit board to the pads 101 of the nozzle chip 100, or by electrically connecting the regenerated circuit board to the residual conductive lines at the pads 101. However, both methods require using conductive lines to electrically connect the regenerated circuit board to the pads 101 or the residual conductive lines, which is technically challenging. Furthermore, since the regenerated circuit board includes multiple regenerated conductive lines, and the nozzle chip 100 has multiple pads 101, and each residual conductive line corresponds to a pad 101, the process of matching multiple regenerated conductive lines of the regenerated circuit board to the pads 101 or the residual conductive lines is also quite difficult. When using a regenerated chip with residual conductive lines, the housing cannot support the residual conductive lines, so a reinforcing plate is needed to support them and prevent the regenerated chip from breaking at this point, making the solution more complex and the connection strength difficult to guarantee.

[0062] like Figure 2 As shown, this embodiment of the present disclosure provides a regeneration chip 10. The regeneration chip 10 includes a nozzle chip 100, a regeneration circuit board 300, and at least one conductive adhesive layer 400.

[0063] The nozzle chip 100 may be taken from a faulty chip 11. Exemplarily, the nozzle chip 100 includes pads 101, a crystal 102, and a water outlet (not shown). The pads 101 are electrically connected to the crystal 102 of the nozzle chip 100 and can be used to transmit electrical signals controlling the water outlet. The nozzle chip 100 may include at least one pad 101. The pads 101 may protrude from the crystal 102.

[0064] like Figure 2 and Figure 3 As shown, the regenerated circuit board 300 includes a regenerated circuit 310. Exemplarily, the regenerated circuit 310 may include at least one regenerated conductive line 311 and a regenerated contact 312 electrically connected to the regenerated conductive line 311. The structure of the regenerated circuit board 300 is the same as that of a normally used circuit board. Specifically, the routing of the regenerated circuit 310 enables normal electrical signal transmission, and the position of the regenerated contact 312 relative to the printhead chip 100 is suitable for normal assembly into an ink cartridge. The regenerated circuit board 300 may be a flexible circuit board, which can be bent but still needs to ensure a certain length.

[0065] The conductive adhesive layer 400 is electrically connected to the pad 101 and the regenerated line 310 on both sides, respectively. For example, Figure 2 The upper side of the conductive adhesive layer 400 is bonded to the pad 101, and the lower side of the conductive adhesive layer 400 is bonded to the regenerated circuit 310.

[0066] The regenerated chip disclosed herein avoids wasting printhead chips and reduces environmental impact. The regenerated chip can perform the functions of a normal chip. The process of applying the conductive adhesive layer is relatively easy to operate, and the conductive adhesive layer adapts well to the pads of the printhead chip taken from the faulty chip. Furthermore, the conductive adhesive layer provides stable electrical connection and helps to strengthen the fixed connection.

[0067] like Figure 3 As shown, the multiple regenerated conductive lines 311 of the regenerated circuit 310 correspond one-to-one with the multiple pads 101 of the nozzle chip 100 and are arranged in the same position. When the nozzle chip 100 is fixedly connected to the regenerated circuit board 300, they can be aligned as a whole in one go. Specifically, the alignment can be finely adjusted under a microscope, for example, and then electrically connected using the conductive adhesive layer 400.

[0068] Exemplarily, the recycled circuit board 300 includes a first protective structure 320 for protecting the recycled circuit 310. The first protective structure 320 includes a first protective film 321 adhered to one side of the recycled circuit 310 and a fifth protective film 322 adhered to the other side of the recycled circuit 310. The first protective film 321 covers a portion of the recycled circuit 310, leaving another portion of the recycled circuit 310 exposed and subsequently electrically connected to the conductive adhesive layer 400. As explained above, the terms first, second, third, etc., are used herein to distinguish the same features by name; therefore, the fifth protective film 322 may also be referred to as, for example, the second protective film. The first protective film 321 and the fifth protective film 322 may be directly attached to the outside of the recycled circuit 310.

[0069] For example, the conductive adhesive layer 400 is an anisotropic conductive film (ACF). Figure 2 and Figure 3 As shown, taking the surface where the pad 101 is located as the XY plane, and the Z direction is perpendicular to the XY plane, according to the characteristics of the conductive adhesive film, the conductive direction of the conductive adhesive layer 400 can be approximately parallel to the Z direction, and the conductive adhesive layer 400 is insulated in the XY plane, for example, at least in the Y direction.

[0070] For example, the regenerated chip 10 includes a third protective film 510. The third protective film 510 protects the upper and lower sides of the conductive adhesive layer 400 from environmental factors such as oxidation, moisture, and dust, ensuring the stability of the electrical connection at the conductive adhesive layer 400. The third protective film 510 may partially overlap with the first protective film 321.

[0071] The recycled circuit board 300 also includes a recycled cutout space 301, which is used to avoid the printhead chip 100, specifically, to avoid the inkjet nozzle of the printhead chip 100. Figure 4As shown, this embodiment of the present disclosure provides another regenerated chip 10, which includes a nozzle chip 100, a native circuit board 200, a regenerated circuit board 300, and a conductive adhesive layer 400.

[0072] The nozzle chip 100 is electrically connected to the native circuit board 200, and both can be removed as a whole from the faulty chip 11. The native circuit board 200 is... Figure 4 The length of the transverse direction is less than that of the faulty circuit board 20. The native circuit 210 of the native circuit board 200 is electrically connected to the pad 101 and fixedly connected, for example, by soldering. The nozzle chip 100 and the native circuit board 200 can be packaged.

[0073] A conductive adhesive layer 400 is disposed between the native circuit board 200 and the recycled circuit board 300. Understandably, the pad 101 is electrically connected to the conductive adhesive layer 400 through the native circuit 210, and further electrically connected to the recycled circuit 310 of the recycled circuit board 300.

[0074] When the regenerated chip 10 is manufactured, processing of the nozzle chip 100 can be avoided, thus better ensuring the integrity of the crystal 102, pad 101, and the left end of the original circuit 210. Simultaneously, the cooperation between the original circuit 210 and the regenerated circuit 310 achieves the normal circuit function of the circuit board. For example, the distance between the contacts (not shown) of the regenerated circuit 310 and the nozzle chip 100 meets the installation requirements of the regenerated chip 10.

[0075] The multiple conductive lines of the original circuit 210 can correspond one-to-one with the multiple conductive lines of the regenerated circuit 310 and are arranged in the same position. When the original circuit board 200 and the regenerated circuit board 300 are fixedly connected, they can all be matched at once, and then electrically connected using the conductive adhesive layer 400.

[0076] For example, the conductive adhesive layer 400 is an anisotropic conductive adhesive film. For instance... Figure 5 As shown, taking the natural extension surface of the original circuit board 200 as the XY plane, and with the Z direction along the thickness direction, based on the characteristics of the conductive adhesive film, the conductive direction of the conductive adhesive layer 400 can be approximately parallel to the XY plane. Figure 5 The Z-direction. (Reference) Figure 6 The conductive adhesive layer 400 can provide insulation in the XY plane, for example, in a direction substantially parallel to the Y direction, and it can also provide insulation in a direction substantially parallel to the X direction (perpendicular to the Y direction). Multiple pairs of conductive wires can be electrically connected using a single conductive adhesive layer 400. It is understood that the embodiments disclosed herein are not limited to providing only one conductive adhesive layer 400.

[0077] like Figure 4 and Figure 5As shown, the recycled circuit board 300 includes a first protective structure 320, which includes a first protective film 321 covering a portion of the recycled circuit 310. The native circuit board 200 also includes a second protective structure 220, which includes a second protective film 221 covering a portion of the native circuit 210. The portion of the recycled circuit 310 exposed to the first protective film 321 is bonded to the conductive adhesive layer 400, and the portion of the native circuit 210 exposed to the second protective film 221 is bonded to the conductive adhesive layer 400.

[0078] For example, such as Figure 4 As shown, the native circuit board 200 also includes a sixth protective film 222 located below the native circuit 210. The regenerated circuit board 300 also includes a fifth protective film 322 located above the regenerated circuit 310. These protective films of the regenerated chip 10 can be used to prevent or slow down the oxidation and breakage of the conductive lines and help the conductive lines maintain their shape and arrangement.

[0079] like Figure 5 As shown, the original circuit 210 and the regenerated circuit 310 overlap, and a conductive adhesive layer 400 is disposed between them. Alternatively, the original circuit 210 can be positioned on top and the regenerated circuit 310 on the bottom. Figure 5 In the first protective film 321, there is a first gap space 103 between the original circuit 210 and the second protective film 221, and a second gap space 104 between the regenerated circuit 310.

[0080] It should be understood that, for example, the first protective film 321 can be pressed against the original circuit 210 so that the first gap space 103 is along... Figure 5 The lateral dimension is zero, but this contact generally cannot achieve a sealing effect, leaving tiny gaps and air passages. The exposed circuit lengths in the original circuit board 200 and the recycled circuit board 300 may not be the same. Therefore, when overlapping the original circuit board 200 and the recycled circuit board 300, it is possible that only the first protective film 321 abuts against the original circuit 210, or only the second protective film 221 abuts against the recycled circuit 310. In other cases, for example, the first protective film 321 abuts against the original circuit 210, while the end of the recycled circuit 310 may overlap the second protective film 221.

[0081] The regenerated chip 10 also includes a third protective film 510 and a fourth protective film 520. The third protective film 510 covers and seals the second gap space 104 to prevent the original circuit 210, conductive adhesive layer 400, and regenerated circuit 310 from being affected by the external space through the second gap space 104. The third protective film 510 may overlap with a portion of the second protective film 221 and also with a portion of the fifth protective film 322. The fourth protective film 520 covers and seals the first gap space 103 to prevent the original circuit 210, conductive adhesive layer 400, and regenerated circuit 310 from being affected by the external space through the first gap space 103. Furthermore, the third and fourth protective films 510 and 520 also help improve the connection strength between the original circuit board 200 and the regenerated circuit board 300. The fourth protective film 520 may partially overlap with the first protective film 321 and also with a portion of the sixth protective film 222.

[0082] Exemplarily, the length m of the regenerated circuit board 300 and the length n of the regenerated chip 10 satisfy: 20% ≤ m / n ≤ 60%. The original circuit board 200 can retain a length of 40% to 80% of the length of the faulty circuit board 20. Exemplarily, one of the original circuit board 200 and the regenerated circuit board 300 may also include an extension section for overlapping, for example, the extension section of the regenerated circuit board 300 is 21% of its original length, and the length n of the original circuit board 200 is 80% of its original length. The connection between the original circuit board 210 and the regenerated circuit board 310 can avoid the bending points of the regenerated chip 10 during use. The length of the original circuit board 200 in this embodiment of the disclosure ensures that at least the faulty part of the faulty circuit board 20 is cut off. The circuit board of the regenerated chip 10 can be flexible. The length of the regenerated circuit board 300 ensures that the regenerated chip 10 has sufficient strength when bent, thereby ensuring the performance and lifespan of the regenerated chip 10.

[0083] like Figure 7 As shown, this embodiment of the disclosure provides another regeneration chip, which includes a native circuit board 200, a regeneration circuit board 300, a nozzle chip (not shown) connected to the native circuit board 200, and a bonding wire 600. The bonding wire 600 may be a metal conductive wire.

[0084] The original circuit board 200, the recycled circuit board 300 and the nozzle chip can be referred to the above content. The original circuit board 200 and the recycled circuit board 300 can be connected. For example, a gap can also be left between the original circuit board 200 and the recycled circuit board 300.

[0085] One end of the bonding wire 600 is bonded to the original circuit 210 of the original circuit board 200, and the other end is bonded to the regenerated circuit 310 of the regenerated circuit board 300. After bonding, the bonding wire 600 can be wrapped with insulating protective adhesive 610, which can also improve the fixed connection strength between the original circuit board 200 and the regenerated circuit board 300.

[0086] The regenerated chip provided in this embodiment can perform the functions of a normal chip, and no reinforcing plate is needed when performing bonding process on the bonding line. The manufacturing cost of the regenerated chip is low and the manufacturing process is simple, avoiding the nozzle chip in the scrap faulty chip.

[0087] like Figure 8 As shown, this disclosure also provides a regenerated ink cartridge 1. The regenerated ink cartridge 1 includes the aforementioned regenerated chip 10. The contacts of the regenerated chip 10 are used for electrical connection with the printer's controller, accepting electrical signals and controlling the ink outlet of the printhead chip 100. The regenerated ink cartridge 1 provided by this disclosure has low production cost and good performance.

[0088] Specifically, the regenerated ink cartridge 1 may also include a housing 7 and a sponge 71. The housing 7 is used to hold ink, and the sponge 71 is disposed in the housing 7 to absorb and slowly release ink. The regenerated chip 10 is flexibly disposed in the housing 7; specifically, the original circuit board 200 or the regenerated circuit board 300 is flexibly disposed in the housing 7. The ink outlet of the printhead chip 100 can communicate with the housing 7. Since the original circuit board 200 or the regenerated circuit board 300 is relatively thin and can be a flexible circuit board, the original circuit board 200 can fit as close as possible to the housing 7 in the working area near the ink outlet.

[0089] like Figure 9 As shown, this disclosure provides a chip repair process 1000, which may include the steps described below.

[0090] For example, in step S101, at least a portion of the faulty circuit of the faulty chip is removed.

[0091] Step S102: A conductive adhesive layer is formed, and the conductive adhesive layer is electrically connected to the pads of the nozzle chip.

[0092] Step S103: Apply the conductive adhesive layer to the recycled circuitry of the recycled circuit board. Exemplarily, the electrical connections in steps S102 and S103 can be implemented simultaneously.

[0093] refer to Figure 1 In step S101, the faulty circuit of the faulty chip 11 can be removed along with the entire faulty circuit board 20, which can also be regarded as the nozzle chip 100 being taken from the faulty chip 11. For example, the pads 101 of the nozzle chip 100 can be further cleaned.

[0094] Then refer to Figure 2 In step S102, a conductive adhesive layer 400 is applied to the pads 101 of the printhead chip 100. Then, in step S103, the recycled circuit board 300 is assembled with the printhead chip 100, and the recycled circuit 310 is attached to the conductive adhesive layer 400 at the pads 101. In some embodiments, the conductive adhesive layer 400 may be applied to the recycled circuit 310 of the recycled circuit board 300 first, and then the recycled circuit board 300 and the printhead chip 100 are assembled. In other embodiments, conductive adhesive may be applied to both the recycled circuit 310 and the pads 101, thereby forming a conductive adhesive layer 400 between the recycled circuit 310 and the pads 101 after the recycled circuit board 300 and the printhead chip 100 are assembled, and it is considered that the formed conductive adhesive layer 400 is attached to the recycled circuit 310.

[0095] For example, the conductive adhesive layer 400 is an anisotropic conductive film, and the step of attaching the conductive adhesive layer 400 includes: hot-pressing the conductive adhesive layer 400. Different materials of the conductive adhesive layer 400 can result in different connection methods. For example, after the conductive adhesive layer 400 is applied to the pad 101 or the regenerated circuit 310, a virtual connection may be achieved. By using the hot-pressing process, the conductive adhesive layer 400 can be firmly attached to the pad 101 and the regenerated circuit 310 simultaneously, and electrical connections between the conductive adhesive layer 400 and the pad 101 and between the conductive adhesive layer 400 and the regenerated circuit 310 are also achieved.

[0096] Specifically, the conductive adhesive layer 400 can be heated to 130-150°C, and the nozzle chip 100 and the recycled circuit board 300 can be extruded. The crystal 102 of the nozzle chip 100 can withstand temperatures up to 200°C, so its performance will not be significantly affected by the hot pressing process.

[0097] In an exemplary implementation, reference Figure 4 A portion of the faulty circuitry of the faulty chip 11 can be removed to form a native circuit board 200 including native circuitry 210. The remaining portion of the faulty circuitry is the native circuitry 210. For example, the cutouts of the native circuit board 200 are kept flat to facilitate subsequent connections and alignment of the native circuitry 210.

[0098] The edge of the native circuit board 200 may extend more than 2 mm relative to the sealant at the pad 101. Exemplarily, the edge of the native circuit board 200 is located outside the edge of the nozzle chip 100. Exemplarily, step S101 includes removing 20% ​​to 60% of the length of the faulty circuit board 20.

[0099] For example, prior to step S103, the chip repair process 1000 further includes the step of forming a regenerated circuit board 300. The circuit structure of the regenerated circuit board 300 is designed as part of the normal circuit board. Specifically, the regenerated circuit 310 of the regenerated circuit board 300 can cooperate with the original circuit 210 to realize the function of the normal circuit board.

[0100] Step S102 may include attaching a conductive adhesive layer 400 to the native circuit 210, thereby enabling the conductive adhesive layer 400 to be electrically connected to the pad 101 through the native circuit 210.

[0101] For example, the chip repair process 1000 further includes: overlapping the original circuit 210 and the regenerated circuit 310, with a conductive adhesive layer 400 disposed between them. The conductive adhesive layer 400 can be applied to the original circuit 210 first, and then in step S103, the regenerated circuit board 300 is assembled with the original circuit board 200, so that the regenerated circuit 310 is attached to the conductive adhesive layer 400 at the original circuit 210. In other embodiments, the conductive adhesive layer 400 can be applied to the regenerated circuit 310 of the regenerated circuit board 300 first, and then the regenerated circuit board 300 is assembled with the original circuit board 200. In other embodiments, conductive adhesive can be applied to both the regenerated circuit 310 and the original circuit 210 respectively, so that after the regenerated circuit board 300 and the original circuit board 200 are assembled, a conductive adhesive layer 400 is formed between the regenerated circuit 310 and the original circuit 210.

[0102] For example, the conductive adhesive layer 400 is an anisotropic conductive adhesive film, and the step of attaching the conductive adhesive layer 400 includes: hot-pressing the conductive adhesive layer 400. The recycled circuit board 300 and the original circuit board 200 can be fixedly connected through the conductive adhesive layer 400, and the recycled circuit 310 and the original circuit 210 can be electrically connected through the conductive adhesive layer 400.

[0103] In an exemplary embodiment, step S101 includes: removing a portion of the protective layer of the faulty circuit board 20 to form a second protective film 221 covering a portion of the original circuitry 210. Furthermore, the formed regenerated circuit board 300 also includes a first protective film 321 covering a portion of the regenerated circuitry 310. This configuration allows the portion of the original circuitry 210 exposed to the second protective film 221 to be electrically connected to the conductive adhesive layer 400, and the portion of the regenerated circuitry 310 exposed to the first protective film 321 to be electrically connected to the conductive adhesive layer 400.

[0104] The chip repair process 1000 further includes forming a third protective film 510 and a fourth protective film 520. The third protective film 510 covers and seals a second gap space 104 between the second protective film 221 and the regenerated circuit 310, and the fourth protective film 520 covers and seals a first gap space 103 between the first protective film 321 and the original circuit 210. Exemplarily, a portion of the third protective film 510 fills the second gap space 104. Exemplarily, a portion of the fourth protective film 520 fills the first gap space 103.

[0105] like Figure 5 As shown, exemplarily, the third protective film 510 partially overlaps with the second protective film 221 and also partially overlaps with the fifth protective film 322; the fourth protective film 520 partially overlaps with the first protective film 321 and also partially overlaps with the sixth protective film 222. The third protective film 510 and the fourth protective film 520 also help to improve the connection strength between the recycled circuit board 300 and the original circuit board 200.

[0106] This disclosure provides a chip repair process, which may include the following steps: Step S101, removing a portion of the faulty circuit of the faulty chip to form a native circuit board including the native circuit; Step S102, forming a conductive portion, wherein the conductive portion is electrically connected to the native circuit and electrically connected to the regenerated circuit of the regenerated circuit board.

[0107] For example, the conductive portion is a conductive adhesive layer or a bonding wire. For example, one end of the bonding wire can be bonded to the original circuit and the other end can be bonded to the regenerated circuit.

[0108] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A regenerable chip, characterized in that, include: The nozzle chip, including the solder pads; A native circuit board includes native circuitry, a first protective film covering a portion of the native circuitry on one side, and a second protective film on the other side. The conductive adhesive layer is electrically connected to the pads via the native circuitry. A recycled circuit board includes recycled circuitry electrically connected to the conductive adhesive layer, a third protective film covering a portion of the recycled circuitry on one side, and a fourth protective film on the other side; the original circuitry and the recycled circuitry overlap and are bonded together by the conductive adhesive layer located between them; a first gap space exists between the third protective film and the original circuitry; wherein, a second gap space exists between the first protective film and the recycled circuitry. A fifth protective film covers and seals the first gap space. The fifth protective film partially overlaps with the third protective film and also partially overlaps with the second protective film. as well as A sixth protective film covers and seals the second spacer space, the sixth protective film overlapping a portion of the first protective film and also a portion of the fourth protective film.

2. The regenerated chip according to claim 1, wherein, The length m of the regenerated circuit board and the length n of the regenerated chip satisfy the following condition: 20% ≤ m / n ≤ 60%.

3. The regenerated chip according to claim 1, wherein, The conductive adhesive layer is an anisotropic conductive adhesive film.

4. A regenerated ink cartridge, characterized in that, Includes the regenerated chip as described in any one of claims 1 to 3.

5. A chip repair process, characterized in that, include: Removing at least a portion of a faulty circuit board from a faulty chip, including removing a portion of the protective layer of the faulty circuit board; forming a native circuit board including native circuitry, a first protective film covering a portion of the native circuitry on one side, and a second protective film on the other side; A conductive adhesive layer is formed that is electrically connected to the pads of the nozzle chip through the native circuitry, wherein the nozzle chip is taken from the faulty chip; The original circuit and the regenerated circuit are connected, with the conductive adhesive layer disposed between them. The conductive adhesive layer is attached to the regenerated circuit of the regenerated circuit board to make the conductive adhesive layer electrically connected to the regenerated circuit. The regenerated circuit board further includes a third protective film covering a portion of the regenerated circuit on one side and a fourth protective film on the other side. The fifth and sixth protective films are formed. The fifth protective film covers and seals the first gap space between the third protective film and the original circuit. The fifth protective film partially overlaps with the third protective film and also partially overlaps with the second protective film. The sixth protective film covers and seals the second gap between the first protective film and the regeneration line. The sixth protective film overlaps with a portion of the first protective film and also with a portion of the fourth protective film.

6. The chip repair process according to claim 5, wherein, The step of removing at least a portion of the faulty circuit board of the faulty chip includes: removing a portion of the faulty circuit board, wherein the faulty circuit board is electrically connected to the nozzle chip; and The step of forming the conductive adhesive layer includes: attaching the conductive adhesive layer to the original circuit to make the conductive adhesive layer electrically connected to the original circuit.

7. The chip repair process according to claim 5, wherein, The step of removing at least a portion of the faulty circuit board from the faulty chip includes removing 20% ​​to 60% of the length of the faulty circuit board.

8. The chip repair process according to claim 5, wherein, The conductive adhesive layer is an anisotropic conductive adhesive film. The step of attaching the conductive adhesive layer includes: hot-pressing the conductive adhesive layer.

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