An electromigration experimental device for sintered silver large-area interconnection joint

Abstract

The application discloses an electromigration experimental device for sintered silver large-area interconnection joints, which comprises a conductor plate, an insulating plate and a connecting piece; the number of the conductor plates is even, and the conductor plates are not less than two; two corresponding conductor plates form an experimental group; a gap for clamping a test sample is arranged between the two conductor plates in the same experimental group, and the two conductor plates are connected with the positive and negative poles of a power supply respectively; the insulating plate is installed on one side of the conductor plate, and the two conductor plates in the same experimental group are located between the two insulating plates; the connecting piece is arranged on the insulating plate; the connecting piece is used for connecting the two insulating plates in the same experimental group and forming a current loop between the two conductor plates. The application overcomes the problem that the sintered silver sandwich structure interconnection joint sample is difficult to clamp, can freely replace and disassemble the test sample, meets the experimental requirements of different specifications of the test sample, and realizes efficient completion of the electromigration experiment of the joint.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material connection, in particular to an electromigration experiment device for sintered silver large-area interconnection joint. BACKGROUND

[0002] In recent years, the development of new electronic applications stimulates the demand for smaller, faster and more efficient electronic packaging in power devices. WBG (wide bandgap semiconductor) is widely concerned because of its high breakdown voltage, large current density, high switching frequency and high temperature (> 250 DEG C) operation. However, traditional tin-based solder cannot meet the high temperature use requirement. Therefore, the development of advanced high temperature die bonding material is a key technical challenge for WBG device packaging. Silver nano-powder sintering shows excellent performance in high temperature application. The reliability problem of solder joint is attracting more and more attention and research of enterprises and scientific researchers. When the solder joint is subjected to certain load for a long time, including electrical load, thermal load, mechanical load or their combination, the service life of the solder joint will be shortened, and the electromigration reliability problem is a very extensive research field in recent years. According to the research theory of professor K.N.Tu, the current density is easy to reach the critical value of electromigration of the solder joint, so that the electromigration phenomenon occurs.

[0003] When the current density in the metal is large, the electrons move from the cathode to the anode and collide with the metal atoms, exchange momentum, and the force generated by the impact of the metal atoms by the electrons, that is, the electron wind force. When the formed electron wind force exceeds the electrostatic field force, the electron wind force will drive the metal atoms to diffuse from the cathode to the anode, and then the electromigration effect is generated. Electromigration can make metal atoms migrate from the cathode side to the anode side, and a large number of holes are generated near the cathode side, and a large number of atomic accumulations are generated on the anode side, causing the cathode to be subjected to tensile stress and the anode to be subjected to compressive stress. During the occurrence of electromigration, defects such as holes and cracks are caused, and the existence of these defects further aggravates the electromigration effect, and finally induces the failure of the interconnection solder joint.

[0004] At present, the electromigration devices used in related research and literature are usually designed by researchers according to their own needs, and there is no corresponding industry standard. For example, there is no corresponding electromigration device for large-area interconnection sintered silver joint, which greatly hinders the smooth progress of the electromigration experiment. SUMMARY

[0005] The purpose of the present application is to provide an electromigration experiment device for sintered silver large-area interconnection joint to solve the problems existing in the prior art.

[0006] To achieve the above purpose, the present application provides the following scheme: the present application provides an electromigration experiment device for sintered silver large-area interconnection joint, comprising:

[0007] a plurality of conductor plates, the number of the conductor plates being even and not less than two; two of the conductor plates correspondingly arranged as an experimental group, a gap for clamping a test sample being arranged between the two conductor plates in the same experimental group, and the two conductor plates being connected with a positive pole and a negative pole of a power supply, respectively;

[0008] an insulating plate, the insulating plate being mounted on one side of the conductor plate, and the two conductor plates in the same experimental group being located between the two insulating plates;

[0009] a connecting piece, the connecting piece being arranged on the insulating plate; the connecting piece being used for connecting the two insulating plates in the same experimental group and forming a current loop between the two conductor plates.

[0010] Preferably, the conductor plate is divided into a clamping section and a wiring section, the width of the wiring section being smaller than the width of the clamping section, and the conductor plate as a whole is in a convex structure; the clamping section of the conductor plate is connected with the insulating plate, and the clamping section coincides with the insulating plate, and the wiring section is provided with a wiring hole for connecting the power supply.

[0011] Preferably, the conductor plate is a copper plate.

[0012] Preferably, the conductor plate and the insulating plate are fixed by adhesive.

[0013] Preferably, the insulating plate is an insulating hard plastic plate.

[0014] Preferably, the connecting piece includes a bolt and a nut, both ends of the insulating plate are provided with connecting holes, the conductor plate is arranged between the two connecting holes, the connecting holes are matched with the bolt, and the two insulating plates in the same experimental group are connected and fixed by the bolt and the nut.

[0015] Preferably, the end face of the conductor plate away from the insulating plate is a smooth surface.

[0016] The present application discloses the following technical effects:

[0017] The electromigration experiment device for sintered silver large-area interconnection joints provided by the present application overcomes the problem of difficult sample clamping of large-area sintered silver sandwich structure interconnection joint, can freely replace and disassemble the test sample, thereby meeting the experimental requirements of test samples of different specifications, and realizing efficient completion of the electromigration experiment of the joint; the copper plate is selected as the conductor plate, which can ensure good conductive contact between the conductor plate and the test sample, and the copper conductor can effectively prevent deformation; the insulating plates are fixed on the upper and lower sides of the conductive device by bolts, thereby playing a heat insulation and insulation role. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Figure 1 The structure schematic diagram of the double-layer structure composite board in Example 1 of the present application;

[0020] Figure 2 The structure schematic diagram of the electromigration experiment device in Example 1 of the present application;

[0021] Figure 3 The structure schematic diagram of the double-layer structure composite board in Example 2 of the present application;

[0022] Among them, the conductor plate-1, the clamping section-1.1, the wiring section-1.2, the wiring hole-1.3, the insulating plate-2, the clamping block-2.1, the stop block-2.2, the connecting hole-2.3, the bolt-3, and the nut-4. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0025] Example 1

[0026] The present application provides an electromigration experiment device for sintering silver large-area interconnection, comprising:

[0027] The conductor plate 1, the number of the conductor plate 1 is even, and the conductor plate 1 is not less than two pieces; two pieces of the corresponding conductor plate 1 constitute an experimental group, and the gap for clamping the test sample is arranged between the two pieces of the conductor plate 1 in the same experimental group, and the two pieces of the conductor plate 1 are connected with the positive and negative poles of the power supply respectively;

[0028] The insulating plate 2 is installed on one side of the conductor plate 1, and the two pieces of the conductor plate 1 in the same experimental group are located between the two pieces of the insulating plate 2;

[0029] A connecting piece is arranged on the insulating plate 2; the connecting piece is used for connecting two insulating plates 2 in the same experiment group, and forms a current loop between the two conductor plates 1.

[0030] In a further optimization scheme, the conductor plate 1 is divided into a clamping section 1.1 and a wiring section 1.2, the width of the wiring section 1.2 is smaller than the width of the clamping section 1.1, and the conductor plate 1 has a convex structure as a whole; the clamping section 1.1 of the conductor plate 1 is connected with the insulating plate 2, and the clamping section 1.1 is coincident with the insulating plate 2; and the wiring section 1.2 is provided with a wiring hole 1.3 for connecting a power supply.

[0031] In a further optimization scheme, the conductor plate 1 is a copper plate.

[0032] In a further optimization scheme, the conductor plate 1 and the insulating plate 2 are fixed by adhesive.

[0033] In a further optimization scheme, the insulating plate 2 is an insulating hard plastic plate.

[0034] In a further optimization scheme, the connecting piece comprises a bolt 3 and a nut 4; the two ends of the insulating plate 2 are provided with connecting holes 2.3, the conductor plate 1 is arranged between the two connecting holes 2.3, the connecting holes 2.3 are matched with the bolt 3, and the two insulating plates 2 in the same experiment group are connected and fixed by the bolt 3 and the nut 4.

[0035] In a further optimization scheme, the end surface of the conductor plate 1 away from the insulating plate 2 is a smooth surface.

[0036] The application is used for building an electromigration experiment device for sintered silver large-area interconnection.

[0037] 1. Two 5*5cm square copper plates are prepared, and the two copper plates are processed into a convex structure with one side wide and one side narrow by wire cutting, as shown in the drawing Figure 1 ; the wide side is 3cm long, and the narrow side is 2cm long; the copper plate is polished before use to avoid the influence of surface oxides on the conductivity of the copper plate;

[0038] 2. A hole with a diameter of 2-3mm is drilled at the narrow side edge of the convex copper plate by using a radial drilling machine, as a wiring hole 1.3;

[0039] 3. Two insulating hard rectangular plastic plates with a size of 3*10cm are prepared, the wide side of the convex copper plate is bonded to the plastic plate by using plastic metal adhesive, to form two double-structure composite plates with the wide side of the copper plate coincident with the plastic plate and the narrow side of the copper plate exposed;

[0040] 4. Holes with a diameter of 6mm are drilled at the same positions on both sides of each composite plate without copper plate;

[0041] 5. The two composite plates are fastened by bolts 3 and nuts 4 to form a multilayer structure of plastic plate-copper plate-gap-copper plate-plastic plate;

[0042] 6. The positive and negative leads of the power supply device are connected to the exposed copper plate narrow side wire hole 1.3 of the composite plate respectively;

[0043] 7. The test sample is clamped at the gap of the multilayer structure conductive device, and the device is connected to the power supply using the connecting wire to complete the construction of the electromigration experiment device.

[0044] Example Two

[0045] The difference between this embodiment and Example One is the connection method of the conductor plate 1 and the insulating plate 2. In order to facilitate the replacement of the conductor plate 1, a clamping groove is formed on the two side walls of the wide side of the conductor plate 1, two clamping blocks 2.1 are fixedly connected on one side of the insulating plate 2, the clamping blocks 2.1 are matched with the clamping grooves, and a blocking block 2.2 is fixedly connected at the same end of the two clamping blocks 2.1; the detachable connection of the conductor plate 1 and the insulating plate 2 is realized by using the clamping blocks 2.1 and the blocking block 2.2, so as to facilitate the polishing of the conductor plate 1 after multiple electromigration experiments, and avoid the influence of surface oxides on the conductivity of the conductor plate 1.

[0046] In the description of the present application, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application.

[0047] The above-described embodiments are only preferred modes of the present application, and do not limit the scope of the present application. Without departing from the design spirit of the present application, various modifications and improvements to the technical solutions of the present application made by those skilled in the art shall fall within the protection scope determined by the claims of the present application.

Claims

1. An electromigration experimental apparatus for sintered silver large-area interconnect joints, characterized in that, include: Conductor plate (1), the number of conductor plates (1) is even, and there are no less than two conductor plates (1); two conductor plates (1) arranged in correspondence form an experimental group, and a gap for clamping the test sample is provided between the two conductor plates (1) in the same experimental group, and the two conductor plates (1) are respectively connected to the positive and negative terminals of the power supply; An insulating plate (2) is installed on one side of the conductor plate (1), and two conductor plates (1) in the same experimental group are located between two insulating plates (2); A connector is disposed on the insulating plate (2); the connector is used to connect two insulating plates (2) in the same experimental group and to form a current loop between the two conductor plates (1); The conductor plate (1) has snap-fit ​​grooves on both sides of its wide side. Two snap-fit ​​blocks (2.1) are fixedly connected to one side of the insulating plate (2). The snap-fit ​​blocks (2.1) are adapted to the snap-fit ​​grooves, and a stop block (2.2) is fixedly connected to the same end of the two snap-fit ​​blocks (2.1). The snap-fit ​​blocks (2.1) and the stop block (2.2) are used to realize the detachable connection between the conductor plate (1) and the insulating plate (2).

2. The electromigration experimental apparatus for sintered silver large-area interconnect joints according to claim 1, characterized in that, The conductor plate (1) is divided into a clamping section (1.1) and a wiring section (1.2). The width of the wiring section (1.2) is smaller than the width of the clamping section (1.1). The conductor plate (1) is generally convex in shape. The clamping section (1.1) of the conductor plate (1) is connected to the insulating plate (2), and the clamping section (1.1) overlaps with the insulating plate (2). The wiring section (1.2) has a wiring hole (1.3) for connecting the power supply.

3. The electromigration experimental apparatus for sintered silver large-area interconnect joints according to claim 2, characterized in that, The conductor plate (1) is a copper plate.

4. The electromigration experimental apparatus for sintered silver large-area interconnect joints according to claim 1, characterized in that, The insulating board (2) is an insulating rigid plastic board.

5. The electromigration experimental apparatus for sintered silver large-area interconnect joints according to claim 1, characterized in that, The connector includes a bolt (3) and a nut (4). Both ends of the insulating plate (2) are provided with connection holes (2.3). The conductor plate (1) is disposed between the two connection holes (2.3). The connection holes (2.3) are adapted to the bolt (3). The two insulating plates (2) in the same experimental group are connected and fixed by the bolt (3) and the nut (4).

6. The electromigration experimental apparatus for sintered silver large-area interconnect joints according to claim 1, characterized in that, The end face of the conductor plate (1) away from the insulating plate (2) is smooth.

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