Fully automatic heat sink detection equipment

Abstract

The present invention relates to a fully automatic heat sink detection device including a workbench, a loading device, a ejector demoulding device, a transfer device and a detection device. The adsorption column can move on the workbench so that the adsorption surface on the adsorption column abuts against the blue film on the loading plate. The adsorption column is provided with a plurality of functional holes passing through the adsorption surface and the lifting surface, and the center line of the functional hole is parallel to the center line of the adsorption column. The lifting disk is provided with a changing hole corresponding to the functional hole one by one, the first end of the ejector pin is fixed in the changing hole, the second end of the ejector pin is located in the functional hole, the lifting disk is fixed on the driving assembly, and the driving assembly can drive the second end of the ejector pin to move along the functional hole and extend out of the functional hole. The transfer device can absorb the chip on the blue film and transfer the chip to the detection device. By installing different numbers of ejector pins to the lifting disk, the number and relative position between the ejector pins can be adjusted according to the size and shape of the chip, thereby ensuring the demoulding effect.

Description

Technical Field

[0001] The present invention relates to the field of chip manufacturing, and in particular to fully automatic heat sink detection equipment. Background Art

[0002] During the chip production process, fully automatic heat sink inspection equipment is a machine that automatically inspects chips. The chip inspection process can be summarized as chip demolding, chip transfer, and chip inspection. Chip demolding is the process of separating the chip from the blue film. Chip transfer involves using a suction tool to pick up the chip and transfer it to the inspection station. Chip inspection uses a camera to inspect the chip for defects. When demolding the chip, existing technology often uses a single ejector pin to push the chip away from the blue film. The number and relative position of the ejector pins cannot be adjusted according to the size and shape of the chip, resulting in unsatisfactory demolding results and inconvenience in chip suction and transportation. Summary of the Invention

[0003] (1) Technical issues to be solved

[0004] The present invention provides a fully automatic heat sink detection device, which aims to solve the problem in the prior art that the number and position of ejector pins cannot be adjusted according to the size and shape of the chip, thereby causing inconvenience in chip suction and transportation.

[0005] (2) Technical solution

[0006] In order to solve the above problems, the present invention provides a fully automatic heat sink detection device, which includes: a workbench, a loading device, an ejector demoulding device, a transfer device and a detection device;

[0007] The loading device includes: a loading plate slidably mounted on the workbench, the loading plate being able to move along the X-axis on the workbench, and the loading plate being used to place the blue film;

[0008] The ejector demoulding device includes: an adsorption column, a driving assembly, a lifting plate and at least one ejector rod;

[0009] The end surfaces of the adsorption column at both ends are respectively an adsorption surface and a lifting surface. The adsorption column is arranged on a workbench, and the adsorption column can move along the Y-axis and the Z-axis on the workbench so that the adsorption surface on the adsorption column abuts against the blue film on the loading plate;

[0010] The adsorption column is provided with a plurality of functional holes that pass through the adsorption surface and the lifting surface, and the center lines of the functional holes are parallel to the center line of the adsorption column. The lifting disk is provided with replacement holes that correspond one-to-one with the functional holes. The first end of the push rod is fixed in the replacement hole, and the second end of the push rod is located in the functional hole. The lifting disk is fixed to the drive assembly, and the drive assembly can drive the second end of the push rod to move along the functional hole and extend out of the functional hole; the functional hole on the adsorption column that does not have the push rod inserted is used to connect to the negative pressure pump, which can generate negative pressure on the adsorption surface of the adsorption column through the functional hole;

[0011] The transfer device can absorb the chip on the blue film and transfer the chip to the detection device;

[0012] The detection device includes: a chip tooling component and a detection component;

[0013] The chip tooling assembly is slidably mounted on the workbench, and the chip tooling assembly is used to place the chip; the detection assembly includes a first detection camera and a second detection camera, both of which are located above the chip tooling assembly, the lenses of the first detection camera and the second detection camera are facing the chip tooling assembly, and the magnification of the first detection camera is smaller than that of the second detection camera.

[0014] Preferably, the ejector demoulding device further comprises: a bottom plate and a floating plate;

[0015] The bottom plate is slidably mounted on the workbench, and the bottom plate can move along the Y-axis on the workbench;

[0016] The floating plate is slidably mounted on the bottom plate, and the floating plate can move along the direction of the Z axis on the bottom plate.

[0017] Preferably, the driving assembly comprises: a driving source, a rotating ring and a driving plate;

[0018] The driving source is fixedly mounted on the floating plate, the rotating ring is connected to the driving source, the driving source can drive the rotating ring to rotate, and the end surface of the rotating ring opposite to the adsorption column is an arc surface;

[0019] The driving plate is slidably mounted on the floating plate. The driving plate can slide on the floating plate along the direction of the Z axis. The direction of the Z axis is parallel to the direction indicated by the center line of the functional hole, and the first end of the driving plate abuts the arc surface. The lifting plate is fixedly provided at the second end of the driving plate. The first end and the second end of the driving plate are opposite ends. The rotation of the rotating ring can drive the driving plate to move in the direction of the Z axis.

[0020] Preferably, a roller is rotatably provided at the first end of the driving plate, and the circumferential surface of the roller abuts against the arc-shaped surface;

[0021] The driving assembly further includes a return spring, a first end of the return spring is connected to the driving plate, and a second end of the return spring is connected to the driving source.

[0022] Preferably, the detection assembly further comprises a height adjustment element;

[0023] The first detection camera and the second detection camera are both installed with independent height adjustment elements, and the height adjustment elements can drive the first detection camera and the second detection camera to move in the vertical direction.

[0024] Preferably, the chip fixture assembly includes a first sliding plate and a second sliding plate, wherein the second sliding plate is used for placing the chip;

[0025] A guide rail is provided on the workbench along the direction of the Y axis, the first sliding plate is slidably mounted on the guide rail, and the first sliding plate can move along the direction of the Y axis;

[0026] The second sliding plate is slidably mounted on the first sliding plate, and the second sliding plate is capable of moving along the X-axis on the first sliding plate;

[0027] Preferably, a rotating plate is rotatably provided on the second sliding plate, the rotating plate can rotate along the Z axis, and the rotating plate is used for placing chips.

[0028] Preferably, the detection assembly further includes a third detection camera and a fourth detection camera;

[0029] The height of the third inspection camera in the vertical direction is equal to the height of the chip on the chip fixture assembly in the vertical direction, and the lens of the third inspection camera faces the chip on the chip fixture assembly;

[0030] The fourth detection camera is arranged on the workbench, with the lens of the fourth detection camera facing upward, and the fourth detection camera is used to detect the bottom surface of the chip.

[0031] Preferably, the loading plate is provided with a loading hole that can be covered by a blue film; the loading plate is also provided with a fixing block for fixing the blue film, and the fixing block is arranged close to the loading hole.

[0032] Preferably, the fully automatic heat sink detection equipment further includes a material receiving device;

[0033] The material receiving device includes a material receiving rack and a material receiving plate. The material receiving rack is slidably mounted on the workbench and can be moved to the transfer device. The material receiving plate is placed on the material receiving rack and is used to place chips.

[0034] (3) Beneficial effects

[0035] The present invention can adjust the number of ejector pins according to the size and shape of the chip by installing different numbers of ejector pins on the lifting plate. In addition, by installing the ejector pins in different replacement holes, the relative positions between the multiple ejector pins can be adjusted so that when the chip and the blue film are separated, the chip is in a horizontal position, which is convenient for the suction cup to absorb the chip in the subsequent process. In addition, two first detection cameras and second detection cameras with different magnifications are used to detect the chip with different accuracies. The first detection camera is used to detect the overall appearance of the chip, and then according to the detection results of the first detection camera, the second detection camera performs higher-precision defect detection on the defects of the chip. Under the premise of ensuring the detection range, the high-magnification detection camera can perform higher-precision detection on the defects of the chip, thereby improving the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a schematic diagram of the overall structure of the fully automatic heat sink detection equipment of the present invention;

[0037] Figure 2 for Figure 1 Enlarged view at point A;

[0038] Figure 3 for Figure 1 Enlarged view at point B;

[0039] Figure 4 A top view of the fully automatic heat sink detection device of the present invention;

[0040] Figure 5 Schematic diagram of the structure of the ejector demoulding device of the present invention;

[0041] Figure 6 for Figure 5 Enlarged view at point C;

[0042] Figure 7 It is a front view of the ejector demoulding device of the present invention;

[0043] Figure 8 It is a three-dimensional diagram of the detection device in the present invention.

[0044] [Description of Reference Numerals]

[0045] 1: workbench;

[0046] 2: feeding device; 21: feeding plate; 22: feeding hole; 23: fixing block;

[0047] 3: Ejector demoulding device; 31: Adsorption column; 311: Adsorption surface; 312: Lifting surface; 313: Functional hole; 32: Drive assembly; 321: Drive source; 322: Rotating ring; 3221: Arc surface; 323: Drive plate; 324: Roller; 325: Return spring; 33: Lifting plate; 34: Ejector rod; 35: Bottom plate; 36: Floating plate;

[0048] 4: Transfer device;

[0049] 5: Detection device; 51: Chip fixture assembly; 511: First sliding plate; 512: Second sliding plate; 513: Third sliding plate; 52: Detection assembly; 521: First detection camera; 522: Second detection camera; 523: Height adjustment element; 524: Third detection camera; 525: Fourth detection camera;

[0050] 6: Material receiving device; 61: Material receiving rack; 62: Material receiving plate. DETAILED DESCRIPTION

[0051] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation methods in conjunction with the accompanying drawings.

[0052] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0053] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0054] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0055] The present invention provides a fully automatic heat sink detection device, which includes: a workbench 1, a loading device 2, an ejector demoulding device 3, a transfer device 4 and a detection device 5;

[0056] The loading device 2 includes a loading plate 21 slidably mounted on the workbench 1. The loading plate 21 can move along the X-axis on the workbench 1 and is used to place the blue film. In the actual production process, chips are arranged on the blue film and attached to the blue film. This application requires that the chips be separated from the blue film and transported to the detection device 5 for detection.

[0057] The ejector pin demoulding device 3 includes: an adsorption column 31, a drive assembly 32, a lifting plate 33, and at least one ejector rod 34. The end faces of the adsorption column 31 are respectively an adsorption surface 311 and a lifting surface 312. The adsorption column 31 is set on the workbench 1. The adsorption column 31 can move along the Y-axis and the Z-axis on the workbench 1 so that the adsorption surface 311 on the adsorption column 31 abuts against the blue film on the loading plate 21. In this application, the X-axis, Y-axis, and Z-axis are perpendicular to each other, and when the fully automatic heat sink detection equipment of this application is in use, the direction of the Z-axis is the vertical direction.

[0058] The adsorption column 31 is provided with a plurality of functional holes 313 penetrating the adsorption surface 311 and the lifting surface 312 . The center lines of the functional holes 313 are parallel to the center line of the adsorption column 31 . The lifting plate 33 is provided with changing holes corresponding to the functional holes 313 one by one. The first end of the lifting rod 34 is fixed in the changing hole, and the second end of the lifting rod 34 is located in the functional hole 313. The lifting plate 33 is fixed on the driving assembly 32, and the driving assembly 32 can drive the second end of the lifting rod 34 to move along the functional hole 313 and extend out of the functional hole 313; the functional hole 313 on the adsorption column 31 where the lifting rod 34 is not inserted is used to connect with the negative pressure pump, and the negative pressure pump can generate negative pressure on the adsorption surface 311 of the adsorption column 31 through the functional hole 313; in an actual implementation scheme, a hose can be used to connect the negative pressure pump and the functional hole 313 where the lifting rod 34 is not inserted on the lifting surface 312 of the lifting rod 34, so that the functional hole 313 can generate negative pressure on the adsorption surface 311 on the adsorption column 31, and the blue film is adsorbed by the negative pressure to separate the chip on the blue film from the blue film.

[0059] The transfer device 4 can absorb the chip on the blue film and transfer the chip to the detection device 5. The transfer device 4 can include a transfer frame and a suction cup tool, wherein the transfer frame is fixed on the workbench 1, and the suction cup tool is slidably set on the transfer frame. The suction cup tool is located above the adsorption column 31, and the loading plate 21 can be moved to the bottom of the suction cup. The suction cup tool can move along the Y-axis and the Z-axis on the transfer frame, so that the suction cup tool can transfer the chip to the corresponding station after sucking it.

[0060] The detection device 5 includes: a chip tooling component 51 and a detection component 52;

[0061] The chip tooling assembly 51 is slidably installed on the workbench 1, and the chip tooling assembly 51 is used to place the chip; the detection assembly 52 includes a first detection camera 521 and a second detection camera 522, both of which are located above the chip tooling assembly 51. The lenses of the first detection camera 521 and the second detection camera 522 are facing the chip tooling assembly 51, and the magnification of the first detection camera 521 is smaller than that of the second detection camera 522.

[0062] In the present application, a plurality of functional holes 313 are provided on the adsorption column 31, and then at least one ejector rod 34 is fixed on the lifting disk 33, and the driving assembly 32 drives the ejector rod 34 to move. When the chip is demolded, the functional hole 313 without the ejector rod 34 inserted generates negative pressure on the adsorption surface 311 on the adsorption column 31, thereby sucking the blue film. The chip on the blue film is lifted by the ejector rod 34, and the chip is separated from the blue film, which facilitates the transfer device 4 to suck the chip and transfer the chip to the chip tooling assembly 51. The above scheme can adjust the number according to the size and shape of the chip by installing different numbers of ejector rods 34 to the lifting disk 33. In addition, by installing the ejector rods 34 in different replacement holes, the relative positions between the multiple ejector rods 34 can be adjusted. The ejector rod 34 lifts the chip so that when the chip and the blue film are separated, the chip is in a horizontal posture, which facilitates the suction cup to suck the chip in the subsequent process. In addition, a first detection camera 521 and a second detection camera 522 with two different magnifications are used to inspect the chip with different accuracies. The first detection camera 521 is used to inspect the overall appearance of the chip, and then according to the detection results of the first detection camera 521, the second detection camera 522 performs higher-precision defect detection on the defects of the chip. Under the premise of ensuring the detection range, the high-magnification detection camera can perform higher-precision detection on the defects of the chip, thereby improving the accuracy of the detection results.

[0063] In summary, the present application uses multiple ejector pins 34 to push the chip so that the chip and the blue film are separated, ensuring that the chip and the blue film are separated in an ideal manner, and ensuring that the chip is in a horizontal position when the chip and the blue film are separated so that the transfer device 4 can transfer the chip. In addition, two first detection cameras 521 and second detection cameras 522 with different magnifications are used to detect the chip at different accuracies. Under the premise of ensuring the detection range, the high-magnification detection camera can perform higher-precision detection on the defects of the chip, thereby improving the accuracy of the detection results. This makes the present application have a good demolding effect, accurate detection results, and high efficiency when detecting the chip.

[0064] Furthermore, the ejector pin demolding device 3 includes a base plate 35 and a floating plate 36. The base plate 35 is slidably mounted on the workbench 1 and is movable along the Y-axis. The floating plate 36 is slidably mounted on the base plate 35 and is movable along the Z-axis.

[0065] Furthermore, the driving assembly 32 includes: a driving source 321, a rotating ring 322 and a driving plate 323. The driving source 321 is fixedly mounted on the floating plate 36, and the rotating ring 322 is connected to the driving source 321. The driving source 321 can drive the rotating ring 322 to rotate, and the end surface of the rotating ring 322 opposite to the adsorption column 31 is an arcuate surface 3221. The driving plate 323 is slidably mounted on the floating plate 36. The driving plate 323 can slide on the floating plate 36 along the direction of the Z axis. The direction of the Z axis is parallel to the direction indicated by the center line of the functional hole 313, and the first end of the driving plate 323 abuts against the arcuate surface 3221. The lifting disk 33 is fixedly provided at the second end of the driving plate 323. The first and second ends of the driving plate 323 are opposite ends. The rotation of the rotating ring 322 can drive the driving plate 323 to move in the direction of the Z axis. In the above embodiment, the Z-axis is oriented vertically, meaning the end surface of rotating ring 322 that contacts drive plate 323 is not horizontal (i.e., the end surface is a curved surface 3221 with undulations in the vertical direction). Therefore, when rotating ring 322 rotates, it can drive drive plate 323 to reciprocate in the vertical direction. In this application, a curved surface is provided on the rotating ring to drive the drive plate up and down, rather than a screw-nut drive. This makes the drive method simpler and more reliable than the prior art.

[0066] In a preferred embodiment, a roller 324 is rotatably provided at the first end of the driving plate 323, and the circumferential surface of the roller 324 abuts against the arc surface 3221; the circumferential surface of the roller 324 abuts against the arc surface 3221. By providing the roller 324, the sliding friction between the driving plate 323 and the rotating ring 322 can be converted into rolling friction, thereby reducing the friction force. An internal thread is provided in the changing hole, and an external thread is provided at one end of the ejector rod 34. The ejector rod 34 is installed in the changing hole by means of a threaded connection, which enables the ejector rod 34 to be quickly disassembled and installed. Four ejector rods 34 are fixedly provided on the lifting plate 33. The four ejector rods 34 can be formed into a rectangle according to the shape of the chip, so that the posture of the chip can be kept horizontal when the chip is demolded.

[0067] The drive assembly 32 also includes a return spring 325. The first end of the return spring 325 is connected to the drive plate 323, and the second end of the return spring 325 is connected to the drive source 321 (the second end of the return spring 325 may also be fixedly connected to the floating plate 36). The cooperation between the return spring 325 and the rotating ring 322 can conveniently drive the drive plate 323 to reciprocate in the vertical direction.

[0068] In addition, the inspection assembly 52 also includes a height adjustment element 523. Independent height adjustment elements 523 are installed on each of the first inspection camera 521 and the second inspection camera 522. The height adjustment elements 523 can drive the first inspection camera 521 and the second inspection camera 522 to move vertically. The first inspection camera 521 and the second inspection camera 522 can each independently adjust their height using the height adjustment elements 523, allowing them to focus on the chip.

[0069] The chip fixture assembly 51 includes a first sliding plate 511 and a second sliding plate 512, and the second sliding plate 512 is used to place the chip. A guide rail is provided on the workbench 1 along the Y-axis direction, and the first sliding plate 511 is slidably mounted on the guide rail and can move along the Y-axis direction. The second sliding plate 512 is slidably mounted on the first sliding plate 511 and can move along the X-axis direction on the first sliding plate 511. The chip fixture assembly 51 is configured as the first sliding plate 511 and the second sliding plate 512. The chip on the second sliding plate 512 can move in the X-axis direction and the Y-axis direction relative to the first detection camera 521 and the second detection camera 522, so that the first detection camera 52131 and the second detection camera 52232 can fully detect the chip.

[0070] A rotating plate 513 is rotatably provided on the second sliding plate 512 . The rotating plate 513 can rotate along the Z axis and is used for placing chips.

[0071] In a preferred embodiment, the detection assembly 52 also includes a third detection camera 524 and a fourth detection camera 525. The height of the third detection camera 524 in the vertical direction is equal to the height of the chip on the chip fixture assembly 51 in the vertical direction, and the lens of the third detection camera 524 is facing the chip on the chip fixture assembly 51. The third detection camera 524 is used to detect the side of the chip. The fourth detection camera 525 is set on the workbench 1, and the lens of the fourth detection camera 525 is facing upward, and the fourth detection camera 525 is used to detect the bottom surface of the chip. The suction cup tool on the transfer device 4 can move to the top of the fourth detection camera 525, so that the fourth detection camera 525 can detect the bottom surface of the chip.

[0072] In a specific embodiment, the loading plate 21 is provided with a loading hole 22 that can be covered by the blue film. The loading plate 21 is also provided with a fixing block 23 for fixing the blue film, which is located near the loading hole 22. The edge of the blue film is fixed to the loading plate 21 by the fixing block 23. The loading plate 21 can be moved along the X-axis to below the adsorption column 31. At this time, the adsorption column 31 can move along the Z-axis, that is, upward, passing through the loading hole 22 and abutting the blue film.

[0073] Finally, the fully automatic heat sink inspection equipment also includes a material collection device 6. This device comprises a material collection rack 61 and a material collection plate 62. The material collection rack 61 is slidably mounted on the workbench 1 and can be moved to the transfer device 4. The material collection plate 62 is placed on the material collection rack 61 and is used to hold the chips. The provision of this material collection device 6 enables automatic chip recovery.

[0074] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A fully automatic heat sink detection device, characterized in that: The fully automatic heat sink detection equipment comprises: a workbench (1), a loading device (2), an ejector demoulding device (3), a transfer device (4) and a detection device (5); The loading device (2) comprises: a loading plate (21) slidably mounted on the workbench (1), the loading plate (21) being capable of moving along the direction of the X-axis on the workbench (1), and the loading plate (21) being used for placing the blue film; The ejector demoulding device (3) comprises: an adsorption column (31), a driving assembly (32), a lifting plate (33) and at least one ejector rod (34); The end surfaces of the adsorption column (31) are respectively an adsorption surface (311) and a lifting surface (312); the adsorption column (31) is arranged on the workbench (1); the adsorption column (31) can move on the workbench (1) along the Y-axis direction and the Z-axis direction, so that the adsorption surface (311) on the adsorption column (31) abuts against the blue film on the loading plate (21); The adsorption column (31) is provided with a plurality of functional holes (313) penetrating the adsorption surface (311) and the lifting surface (312), and the center lines of the functional holes (313) are parallel to the center line of the adsorption column (31); the lifting plate (33) is provided with replacement holes corresponding to the functional holes (313), the first end of the push rod (34) is fixed in the replacement hole, and the second end of the push rod (34) is located in the functional hole (313); the lifting plate (33) is fixed on the driving assembly (32), and the driving assembly (32) can drive the second end of the push rod (34) to move along the functional hole (313) and extend out of the functional hole (313); the functional hole (313) on the adsorption column (31) where the push rod (34) is not inserted is used to connect with a negative pressure pump, and the negative pressure pump can generate negative pressure on the adsorption surface (311) of the adsorption column (31) through the functional hole (313); The transfer device (4) is capable of sucking the chip on the blue film and transferring the chip to the detection device (5); The detection device (5) comprises: a chip tooling component (51) and a detection component (52); The chip fixture assembly (51) is slidably mounted on the workbench (1), and the chip fixture assembly (51) is used to place a chip; the detection assembly (52) comprises a first detection camera (521) and a second detection camera (522), both of which are located above the chip fixture assembly (51), the lenses of the first detection camera (521) and the second detection camera (522) are oriented toward the chip fixture assembly (51), and the magnification of the first detection camera (521) is smaller than that of the second detection camera (522); The loading plate (21) is provided with a loading hole (22) that can be covered by a blue film; the loading plate (21) is also provided with a fixing block (23) for fixing the blue film, and the fixing block (23) is arranged close to the loading hole (22); The fully automatic heat sink detection equipment further includes a material receiving device (6); The material receiving device (6) includes a material receiving rack (61) and a material receiving plate (62). The material receiving rack (61) is slidably mounted on the workbench (1). The material receiving rack (61) can be moved to the transfer device (4). The material receiving plate (62) is placed on the material receiving rack (61) and is used to place chips.

2. The fully automatic heat sink detection equipment according to claim 1, characterized in that: The ejector demoulding device (3) further comprises: a bottom plate (35) and a floating plate (36); The bottom plate (35) is slidably mounted on the workbench (1), and the bottom plate (35) is capable of moving along the direction of the Y axis on the workbench (1); The floating plate (36) is slidably mounted on the base plate (35), and the floating plate (36) is capable of moving on the base plate (35) along the direction of the Z axis.

3. The fully automatic heat sink detection equipment according to claim 2, characterized in that: The driving assembly (32) includes: a driving source (321), a rotating ring (322), and a driving plate (323); The driving source (321) is fixedly mounted on the floating plate (36), the rotating ring (322) is connected to the driving source (321), the driving source (321) is capable of driving the rotating ring (322) to rotate, and the end surface of the rotating ring (322) opposite to the adsorption column (31) is an arc-shaped surface (3221); The driving plate (323) is slidably mounted on the floating plate (36), and the driving plate (323) can slide on the floating plate (36) along the direction of the Z axis, the direction of the Z axis being parallel to the direction indicated by the center line of the functional hole (313), and the first end of the driving plate (323) is in contact with the arc surface (3221), and the lifting plate (33) is fixedly provided at the second end of the driving plate (323), and the first end and the second end of the driving plate (323) are opposite ends, and the rotation of the rotating ring (322) can drive the driving plate (323) to move in the direction of the Z axis.

4. The fully automatic heat sink detection device according to claim 3, characterized in that: A roller (324) is rotatably provided at the first end of the driving plate (323), and the circumferential surface of the roller (324) abuts against the arc-shaped surface (3221); The driving assembly (32) further includes a return spring (325), wherein a first end of the return spring (325) is connected to the driving plate (323), and a second end of the return spring (325) is connected to the driving source (321).

5. The fully automatic heat sink detection device according to any one of claims 1 to 4, characterized in that: The detection assembly (52) further includes a height adjustment element (523); The first detection camera (521) and the second detection camera (522) are both equipped with mutually independent height adjustment elements (523), and the height adjustment elements (523) are capable of driving the first detection camera (521) and the second detection camera (522) to move in a vertical direction.

6. The fully automatic heat sink detection device according to claim 5, characterized in that: The chip fixture assembly (51) comprises a first sliding plate (511) and a second sliding plate (512), wherein the second sliding plate (512) is used for placing the chip; A guide rail is provided on the workbench (1) along the direction of the Y axis, the first sliding plate (511) is slidably mounted on the guide rail, and the first sliding plate (511) is capable of moving along the direction of the Y axis; The second sliding plate (512) is slidably mounted on the first sliding plate (511), and the second sliding plate (512) is capable of moving along the direction of the X-axis on the first sliding plate (511).

7. The fully automatic heat sink detection device according to claim 6, characterized in that: A rotating plate (513) is rotatably provided on the second sliding plate (512), the rotating plate (513) being capable of rotating along the Z axis, and the rotating plate (513) is used for placing chips.

8. The fully automatic heat sink detection device according to claim 7, characterized in that: The detection assembly (52) further includes a third detection camera (524) and a fourth detection camera (525); The height of the third inspection camera (524) in the vertical direction is equal to the height of the chip on the chip fixture assembly (51) in the vertical direction, and the lens of the third inspection camera (524) faces the chip on the chip fixture assembly (51); The fourth detection camera (525) is arranged on the workbench (1), and the lens of the fourth detection camera (525) faces upward. The fourth detection camera (525) is used to detect the bottom surface of the chip.

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