A tin-filling tool and a tin-filling method for a chip

Abstract

The application discloses a kind of for chip soldering tool and soldering method, belong to soldering technical field.The soldering tool includes bottom plate and control component.Bottom plate has a plurality of first positioning groove and a plurality of second positioning groove, a plurality of first positioning groove and a plurality of second positioning groove are symmetrically arranged along the center line of bottom plate, and are symmetrically arranged along the center line of bottom plate, and the diameter of first positioning groove is greater than second positioning groove, to accommodate different sizes of chip, and the bottom of each first positioning groove and each second positioning groove has at least one suction hole for adsorbing chip.Control component includes motor, vacuumizing equipment and a plurality of cover plates, the output end of motor is drivingly connected with the center of bottom plate, the suction port of vacuumizing equipment is communicated with each suction hole, and the plurality of cover plates at least includes first cover plate and second cover plate.The soldering tool for chip provided in the embodiment of the application can not only ensure the consistency of soldering effect, but also greatly improve the soldering efficiency.

Description

Technical Field

[0001] This invention belongs to the field of tinning technology, specifically relating to a tinning fixture and tinning method for chips. Background Technology

[0002] With increasingly stringent quality requirements for electronic products, tinning to remove oxidation from components before soldering is a common process. Currently, the most common tinning methods are manual tinning using a soldering iron, manual tinning using a tin pot, and fully automated tinning equipment. Fully automated tinning equipment offers superior tinning results and controllable precision, but it is expensive, and most manufacturers do not equip themselves with this equipment, primarily relying on manual tinning methods.

[0003] In related technologies, chip pins need to be tinned during the manufacturing process. Existing manual tinning methods are based on fixtures, where the chip is manually clamped and then tinned onto the chip pins.

[0004] However, the above-mentioned method of manually controlling the fixture to pick up chips and spray them in sequence is inefficient, and manual picking cannot guarantee the consistency of the pin tilt angle on the chip during spraying (or coating) (each chip is arranged at a different tilt angle when manually picked up), resulting in inconsistent soldering effect (poor soldering consistency) and failure to meet factory requirements. Summary of the Invention

[0005] In view of the above-mentioned defects or improvement needs of the prior art, the present invention provides a soldering fixture and soldering method for chips, which aims to not only ensure the consistency of soldering effect, but also greatly improve soldering efficiency.

[0006] In a first aspect, the present invention provides a soldering fixture for a chip, the soldering fixture comprising a base plate and a control assembly; The base plate is horizontally arranged and has at least a plurality of first positioning grooves and a plurality of second positioning grooves. The plurality of first positioning grooves and the plurality of second positioning grooves are arranged at intervals along a first direction and symmetrically arranged along the center line of the base plate. The diameter of the first positioning groove is larger than that of the second positioning groove to accommodate chips of different sizes. The bottom of each first positioning groove and each second positioning groove has at least one adsorption hole for adsorbing the chip. The control component includes a motor, a vacuum pump, and multiple cover plates. The output end of the motor is connected to the center of the base plate to drive the base plate to rotate. The air extraction port of the vacuum pump is connected to each of the adsorption holes. The multiple cover plates include at least a first cover plate and a second cover plate. The first cover plate and the second cover plate are slidably arranged on the base plate along a first direction to cover multiple first positioning grooves and multiple second positioning grooves, respectively.

[0007] Optionally, the base plate has at least two spaced guide grooves, each guide groove extending along the first direction, and a plurality of first positioning grooves and a plurality of second positioning grooves are located below the corresponding guide grooves, and the first cover plate and the second cover plate can be slidably inserted into the corresponding guide grooves.

[0008] Optionally, both the first cover plate and the second cover plate have a stop block on one side, and each of the two ends of the guide groove has a first limiting block and a second limiting block respectively, so as to block and limit the movement with the stop block, and the stop block is located between the first limiting block and the second limiting block.

[0009] Optionally, the inner peripheral walls of the first positioning groove and the second positioning groove have multiple spaced notches, each notch corresponding to an edge of the chip.

[0010] Optionally, each of the notches is arc-shaped.

[0011] Optionally, the distance between the first positioning groove and the second positioning groove in the second direction is not less than 50 mm, and the distance between any two adjacent first positioning grooves or second positioning grooves is not less than 30 mm.

[0012] In a second aspect, the present invention provides a method for soldering a chip, the soldering method being based on the soldering fixture described in the first aspect, the soldering method comprising: According to the size of the chip, a plurality of the chips are placed sequentially in a plurality of the first positioning slots or a plurality of the second positioning slots; Move the second cover plate or the first cover plate to cover a plurality of second positioning slots or a plurality of first positioning slots; The vacuum device is used to evacuate each of the adsorption holes; Based on the position of the chip, the base plate is driven to rotate by the motor, and tin-coating is applied to two symmetrical chips in sequence along the first direction.

[0013] Optionally, after placing the plurality of chips sequentially into the plurality of first positioning slots or the plurality of second positioning slots, the tinning method further includes: A gap-filling material is inserted into the gap between the inner wall of each of the first or second positioning slots and the corresponding chip.

[0014] Optionally, the gap-filling material is a rubber sheet or a silicone sheet.

[0015] Optionally, before placing the plurality of chips sequentially into the plurality of first positioning slots or the plurality of second positioning slots, the tinning method further includes: An air blowing device is provided, wherein the air outlet of the air blowing device is connected to each of the adsorption holes, so as to blow air onto each of the first positioning slots or the second positioning slots. The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0016] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art are as follows: In the soldering fixture for chips provided in this embodiment of the invention, when soldering multiple chips of the same type, firstly, according to the chip size, the chips are sequentially placed in multiple first positioning slots or multiple second positioning slots. Because the base plate is horizontally arranged, the chips can be horizontally positioned when inserted into the positioning slots, ensuring that the tilt angles of the pins on each chip are consistent, thus guaranteeing consistent soldering results. Furthermore, the availability of positioning slots of various sizes increases the applicability of this fixture. Moreover, the positioning of the chips via the positioning slots eliminates the need for clamps, improving soldering efficiency and effectively preventing chip damage. Next, the second cover plate or the first cover plate is moved to cover the multiple second positioning slots or multiple first positioning slots, thus sealing and protecting the other positioning slots and preventing molten solder splashes or dust deposits from affecting subsequent use.

[0017] Then, a vacuum is applied to each adsorption hole using a vacuum pump. This ensures that the bottom surface of each chip is tightly attached to the bottom of the positioning groove, preventing the chips from moving within the groove during spraying and further ensuring the chips are horizontally arranged and that the pin angles on each chip are consistent. Finally, based on the chip positions, a motor drives the base plate to rotate, and tin-coating is applied to two symmetrical chips sequentially along the first direction. During the spraying of two symmetrical chips, the spraying position does not need to be changed; after spraying, the spraying position is changed along the first direction to continue spraying other symmetrical chips, greatly improving tin-coating efficiency.

[0018] In other words, the soldering fixture for chips provided in this embodiment of the invention can not only ensure the consistency of soldering effect, but also greatly improve soldering efficiency. Attached Figure Description

[0019] Figure 1 This is a top view of a soldering fixture for chips provided in an embodiment of the present invention; Figure 2 This is a side view of a soldering fixture for a chip provided in an embodiment of the present invention; Figure 3 This is a flowchart of a tinning method for chips provided in an embodiment of the present invention.

[0020] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Base plate; 11. First positioning groove; 12. Second positioning groove; 13. Adsorption hole; 14. Guide groove; 15. First limiting block; 16. Second limiting block; 17. Notch; 2. Motor; 3. First cover plate; 4. Second cover plate; 5. Stop block. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] Example: Figure 1 This is a top view of a soldering fixture for chips provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the tinning fixture includes a base plate 1 and a control assembly.

[0027] The base plate 1 is arranged horizontally and has at least a plurality of first positioning grooves 11 and a plurality of second positioning grooves 12. The plurality of first positioning grooves 11 and the plurality of second positioning grooves 12 are arranged at intervals along a first direction and symmetrically arranged along the center line a of the base plate 1. The diameter of the first positioning groove 11 is larger than that of the second positioning groove 12 to accommodate chips of different sizes. The bottom of each first positioning groove 11 and each second positioning groove 12 has at least one adsorption hole 13 for adsorbing the chip.

[0028] The control components include a motor 2, a vacuum pump, and multiple cover plates. The output of the motor 2 is connected to the center of the base plate 1 to drive the base plate 1 to rotate (see...). Figure 2 The vacuum pump's air extraction port is connected to each adsorption hole 13. The multiple cover plates include at least a first cover plate 3 and a second cover plate 4. The first cover plate 3 and the second cover plate 4 are slidably arranged on the base plate 1 along the first direction to cover multiple first positioning grooves 11 and multiple second positioning grooves 12 respectively.

[0029] For the soldering fixture for chips provided in this embodiment of the invention, when soldering multiple chips of the same type, firstly, according to the size of the chips, the multiple chips are sequentially placed in multiple first positioning slots 11 or multiple second positioning slots 12. Since the base plate 1 is arranged horizontally, the chips can be arranged horizontally when inserted and positioned into the positioning slots. At this time, the tilt angle of the pins on each chip is consistent, which can ensure the consistency of the soldering effect. In addition, the positioning slots of various sizes can increase the applicability of this fixture. Moreover, the positioning and placement of chips by the positioning slots eliminates the need for clamping and positioning, which not only improves the soldering efficiency, but also effectively avoids damage to the chip clamping. Next, the second cover plate 4 or the first cover plate 3 is moved to cover the multiple second positioning slots 12 or multiple first positioning slots 11. At this time, the other positioning slots are sealed and protected to prevent solder splashing or dust accumulation in the other positioning slots, which would affect subsequent use.

[0030] Then, a vacuum is applied to each adsorption hole 13 using a vacuum pump. This ensures that the bottom surface of each chip is tightly attached to the bottom of the positioning groove, preventing the chip from moving within the positioning groove during spraying and further ensuring the chips are horizontally arranged and that the pin angles on each chip are consistent. Finally, based on the chip positions, the base plate 1 is driven to rotate by the motor 2, and tin-coating is applied to two symmetrical chips sequentially along the first direction. During the spraying of two symmetrical chips, the spraying position does not need to be changed; after spraying, the spraying position can be changed along the first direction to spray other symmetrical chips, greatly improving tin-coating efficiency.

[0031] In other words, the soldering fixture for chips provided in this embodiment of the invention can not only ensure the consistency of soldering effect, but also greatly improve soldering efficiency.

[0032] For example, when multiple chips are of type A (size: 20mm*20mm), the chips are placed sequentially in each of the first positioning slots 11. In this case, by sliding the second cover plate 4, the multiple second positioning slots 12 can be sealed and protected. Similarly, when multiple chips are of type B (size: 10mm*10mm), the chips are placed sequentially in each of the second positioning slots 12. In this case, by sliding the first cover plate 3, the multiple first positioning slots 11 can be sealed and protected.

[0033] Exemplarily, the base plate 1 may also have a third positioning groove, etc., and the present invention is not limited thereto. The first direction can be the X-axis direction. The dimensions of the base plate 1 can be 200mm*160mm.

[0034] See also Figure 1The base plate 1 has at least two spaced guide grooves 14, each guide groove 14 extending along a first direction. Multiple first positioning grooves 11 and multiple second positioning grooves 12 are located below the corresponding guide grooves 14. The first cover plate 3 and the second cover plate 4 can be slidably inserted into the corresponding guide grooves 14.

[0035] In the above embodiments, the guide groove 14 can conveniently guide the sliding of the first cover plate 3 or the second cover plate 4.

[0036] Furthermore, each of the first cover plate 3 and the second cover plate 4 has a stop block 5 on one side, and each of the inner walls at both ends of the guide groove 14 has a first limiting block 15 and a second limiting block 16 respectively, with the stop block 5 blocking and limiting the movement. The stop block 5 is located between the first limiting block 15 and the second limiting block 16.

[0037] It is easy to understand that when the first cover plate 3 or the second cover plate 4 slides to the left end of the guide groove 14, the stop block 5 abuts against the first limiting block 15 (the first limiting block 15 is located to the left of the stop block 5), thereby preventing the first cover plate 3 or the second cover plate 4 from disengaging from the left end of the guide groove 14. Similarly, when the first cover plate 3 or the second cover plate 4 slides to the right end of the guide groove 14, the stop block 5 abuts against the second limiting block 16 (the second limiting block 16 is located to the right of the stop block 5), thereby preventing the first cover plate 3 or the second cover plate 4 from disengaging from the right end of the guide groove 14.

[0038] For example, there are two blocks 5 on the first cover plate 3 or the second cover plate 4, and each block 5 corresponds to a first limiting block 15 and a second limiting block 16.

[0039] In this embodiment, the inner peripheral walls of the first positioning groove 11 and the second positioning groove 12 have a plurality of spaced notches 17, each notch 17 corresponding to the edge of the chip.

[0040] In the above embodiment, on the one hand, the notch 17 can prevent the chip's edges from being worn by the base plate 1; on the other hand, the notch 17 facilitates the clamping of the chip's edge, thereby enabling convenient removal of the chip.

[0041] For example, each notch 17 is arc-shaped, allowing for a larger clamping angle. Furthermore, the number of notches 17 can be 4-6, etc., and this invention does not limit this.

[0042] In one implementation of the present invention, the distance between the first positioning groove 11 and the second positioning groove 12 in the second direction is not less than 50 mm, and the distance between any two adjacent first positioning grooves 11 or second positioning grooves 12 is not less than 30 mm.

[0043] In the above embodiment, the distance between the first positioning groove 11 and the second positioning groove 12 in the second direction is not less than 50mm, which can effectively avoid interference from adjacent cover plates during the nozzle spraying process. Furthermore, the distance between any two adjacent first positioning grooves 11 or second positioning grooves 12 is not less than 30mm, which can avoid affecting adjacent chips during the spraying process and prevent molten solder from splashing onto other chips.

[0044] For example, the second direction can be the Y-axis direction.

[0045] Figure 3 This is a flowchart of a tinning method for chips provided in an embodiment of the present invention, such as... Figure 3 As shown, the tinning method is based on the aforementioned tinning fixture, and the tinning method includes: S1. According to the size of the chip, place multiple chips in multiple first positioning slots 11 or multiple second positioning slots 12 in sequence.

[0046] S2. Move the second cover plate 4 or the first cover plate 3 to cover multiple second positioning grooves 12 or multiple first positioning grooves 11.

[0047] S3. Vacuum each adsorption hole 13 using a vacuum pump.

[0048] S4. Based on the position of the chip, the base plate 1 is driven to rotate by the motor 2, and the two symmetrical chips are sprayed with tin in sequence along the first direction.

[0049] The present invention provides a method for tinning chips that not only ensures the consistency of tinning effect but also greatly improves tinning efficiency.

[0050] In this embodiment, after placing multiple chips sequentially into multiple first positioning slots 11 or multiple second positioning slots 12, the soldering method further includes: Filler material is inserted into the gap between the inner wall of each first positioning groove 11 or second positioning groove 12 and the corresponding chip.

[0051] In the above implementation, the gap between the inner wall of the first positioning groove 11 or the second positioning groove 12 and the corresponding chip can be filled by the gap filling material, thereby compensating for the design error between the chip and the positioning groove, realizing further positioning of the chip, and avoiding the chip shaking in the positioning groove during the spraying process, which would affect the consistency of the spraying.

[0052] For example, the gap-filling material is a rubber sheet or a silicone sheet, which has good elasticity and will not damage the chip during the filling process.

[0053] Furthermore, before placing the multiple chips sequentially into the multiple first positioning slots 11 or the multiple second positioning slots 12, the tinning method further includes: An air blowing device is provided, wherein the air outlet of the air blowing device is connected to each adsorption hole 13 to blow air onto each first positioning groove 11 or second positioning groove 12.

[0054] In the above embodiments, the air extraction device can blow air into each adsorption hole 13, thereby removing impurities in each positioning groove before placing the chip, ensuring that each chip can be tightly attached to the positioning groove during subsequent adsorption.

[0055] In other words, before placing the chip, air is blown upward through the adsorption hole 13 to remove impurities; after placing the chip, the chip is drawn downward through the adsorption hole 13 to adsorb it.

[0056] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A soldering fixture for chips, characterized in that, The tinning fixture includes a base plate (1) and a control assembly; The base plate (1) is arranged horizontally and has at least a plurality of first positioning grooves (11) and a plurality of second positioning grooves (12). The plurality of first positioning grooves (11) and the plurality of second positioning grooves (12) are arranged at intervals along a first direction and symmetrically arranged along the center line of the base plate (1). The diameter of the first positioning groove (11) is larger than that of the second positioning groove (12) to accommodate chips of different sizes. The bottom of each first positioning groove (11) and each second positioning groove (12) has at least one adsorption hole (13) for adsorbing the chip. The control component includes a motor (2), a vacuum pump and multiple cover plates. The output end of the motor (2) is connected to the center of the base plate (1) to drive the base plate (1) to rotate. The air extraction port of the vacuum pump is connected to each of the adsorption holes (13). The multiple cover plates include at least a first cover plate (3) and a second cover plate (4). The first cover plate (3) and the second cover plate (4) are slidably arranged on the base plate (1) along a first direction to cover multiple first positioning grooves (11) and multiple second positioning grooves (12) respectively.

2. The soldering fixture for chips according to claim 1, characterized in that, The base plate (1) has at least two spaced guide grooves (14), each guide groove (14) extending along the first direction, and a plurality of first positioning grooves (11) and a plurality of second positioning grooves (12) are located below the corresponding guide grooves (14), and the first cover plate (3) and the second cover plate (4) can be slidably inserted into the corresponding guide grooves (14).

3. The soldering fixture for chips according to claim 2, characterized in that, The first cover plate (3) and the second cover plate (4) each have a stop block (5) on one side. Each guide groove (14) has a first limiting block (15) and a second limiting block (16) on the inner wall of each end to block and limit the stop block (5). The stop block (5) is located between the first limiting block (15) and the second limiting block (16).

4. The soldering fixture for chips according to claim 1, characterized in that, The inner peripheral walls of the first positioning groove (11) and the second positioning groove (12) have a plurality of spaced notches (17), each notch (17) corresponding to the corner of the chip.

5. A soldering fixture for chips according to claim 4, characterized in that, All the notches (17) are arc-shaped.

6. A soldering fixture for chips according to any one of claims 1-5, characterized in that, The first positioning groove (11) and the second positioning groove (12) are spaced apart in the second direction by not less than 50 mm, and the distance between any two adjacent first positioning grooves (11) or the second positioning grooves (12) is not less than 30 mm.

7. A method for tinning chips, characterized in that, The tinning method is based on the tinning fixture according to any one of claims 1-6, and the tinning method includes: According to the size of the chip, a plurality of the chips are placed sequentially in a plurality of the first positioning slots (11) or a plurality of the second positioning slots (12); Move the second cover plate (4) or the first cover plate (3) to cover a plurality of second positioning grooves (12) or a plurality of first positioning grooves (11); The vacuum device is used to evacuate each of the adsorption holes (13); According to the position of the chip, the base plate (1) is driven to rotate by the motor (2), and the two symmetrical chips are sprayed with tin in sequence along the first direction.

8. A method for tinning a chip according to claim 7, characterized in that, After placing the plurality of chips sequentially into the plurality of first positioning slots (11) or the plurality of second positioning slots (12), the tinning method further includes: A gap-filling material is inserted into the gap between the inner wall of each of the first positioning grooves (11) or the second positioning grooves (12) and the corresponding chip.

9. A method for tinning a chip according to claim 8, characterized in that, The gap-filling material is a rubber sheet or a silicone sheet.

10. A method for tinning a chip according to any one of claims 7-9, characterized in that, Before placing the plurality of chips sequentially into the plurality of first positioning slots (11) or the plurality of second positioning slots (12), the tinning method further includes: An air blowing device is provided such that the air outlet of the air blowing device is connected to each of the adsorption holes (13) to blow air onto each of the first positioning slots (11) or the second positioning slots (12).

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