A power component and a liquid-cooled converter

Abstract

This invention discloses a power assembly and a liquid-cooled converter. The power assembly includes a capacitor module comprising interconnected DC capacitor banks and capacitor busbars; an input busbar, an output busbar, and three single-phase switching transistor groups, each of which includes several switching modules connected to the input busbar and the output busbar; the input busbar is connected to a connection portion; the output busbar is used to output electrical energy; and at least one heat sink has a mounting surface for mounting each of the single-phase switching transistor groups, the mounting surface being parallel to the connection portion. This power assembly can improve the problem of the large size of existing power assemblies.

Description

Technical Field

[0001] This invention relates to the field of power equipment, and more specifically to a power component and a liquid-cooled converter. Background Technology

[0002] Converters are widely used in power systems, rail transportation, military industry, petroleum machinery, new energy vehicles, wind power generation, solar photovoltaic and other fields. They connect the battery system to the power grid to realize bidirectional conversion of electrical energy, control the charging and discharging process of the battery, and perform AC-DC conversion. In the absence of a power grid, they can directly supply power to AC loads. At the same time, NPC (Neutral Point Clamp) or ANPC (Active Neutral Point Clamp) three-level topologies can use IGBT devices with low blocking voltage to increase the DC bus voltage, thereby increasing the AC output voltage and expanding the system power level. Therefore, they are widely used in converters.

[0003] like Figure 1 As shown, it illustrates the structure of the power components in a conventional three-level topology converter, which mainly includes a capacitor busbar 01, a DC capacitor bank 02, an input busbar 03, a switching transistor 04, an output busbar 05, a heat sink 06, and a connection busbar 07.

[0004] The capacitor busbar 01 and the DC capacitor bank 02 work together to form a capacitor module. The capacitor busbar 01 includes a positive plate, a neutral plate, and a negative plate. According to the three-level topology circuit structure, each capacitor in the DC capacitor bank 02 is connected to the plates of different polarities on the capacitor busbar 01.

[0005] Since the power component outputs three-phase AC power, it comprises three sets of single-phase switching transistors. Each set of single-phase switching transistors includes multiple switching modules, a heat sink 06, an input bus 03, a connection bus 07, and an output bus 05. The heat sink 06 is an air-cooled heat sink, with a mounting surface for mounting the switching transistors 04 on one side and heat dissipation fins arranged on the other side away from the mounting surface.

[0006] Continue to refer to Figure 2Each switching module includes three switching transistors 04. The two upper transistors 04a are input transistors 04a, and the lower transistor 04b is the output transistor 04b. The two input transistors 04a and the input transistors 04a and output transistors 04b are connected via connecting blocks 07. The switching modules are connected in parallel. This parallel connection improves the output current capability of the bridge arm of a single three-level topology. This power component uses a structure of four switching modules connected in parallel. One set of input blocks 03 corresponds to a capacitor busbar 01 and is equipped with a positive plate, a neutral plate, and a negative plate, which are respectively connected to the corresponding plates on the capacitor busbar 01. The output blocks 05 are connected to the output terminals of the four switching modules to provide single-phase AC output. The output blocks 05 of the three sets of switching modules together provide three-phase AC output.

[0007] Continue to refer to Figure 3a and Figure 3b Let's take a set of switch modules as an example for explanation. Figure 3a This is a circuit diagram of the three-level topology. Figure 3b This is a schematic diagram of the actual connection of the switching transistor 04. In one switching module, there are two input transistors 04a and one output transistor 04b. The terminals connecting the two input transistors 04a to the input bus 03 include a positive terminal 041, a first neutral terminal 042, a second neutral terminal 043, and a negative terminal 044. The positive terminal 041 is connected to the positive plate of the input bus 03, the first neutral terminal 042 and the second neutral terminal 043 are connected to the neutral plate of the input bus 03, and the negative terminal 044 is connected to the negative plate of the input bus 03. After the lower terminals of the two input transistors 04a are connected, they are then connected to the output transistor 04b below them via a connecting bus 07. The lower end of the output transistor 04b has a first output terminal 045 and a second output terminal 046, both of which are connected to the output bus 05. The input transistors 04a may include... Figure 3a T1, D1, T2, D2; input tube 04b may include Figure 3a T3, D3, T4, and D4; the output transistors may include Figure 3a T5, D5, T6, and D6 in the text.

[0008] In a switching module, the corresponding terminal of input transistor 04a forms the input terminal of the switching module, and the corresponding terminal of output transistor 04b forms the output terminal of the switching module. In a single-phase switching module, the input terminals of each switching module form the input terminal of the single-phase switching module, and the output terminals of each switching module form the output terminal of the single-phase switching module.

[0009] It is obvious that this type of power component has the following problems: the power component is large in size, making the corresponding converter unsuitable for small or special-needs electrical cabinets; and the power component reduces stray inductance generated during commutation by using a large number of copper busbars to reduce stray inductance, resulting in excessively high manufacturing costs. Summary of the Invention

[0010] The purpose of this invention is to overcome at least one defect or problem existing in the prior art and to provide a power component and converter.

[0011] The present invention and its related embodiments adopt the following technical solutions, but are not limited to the following solutions:

[0012] The first technical solution and its related embodiments relate to a power component, comprising: a capacitor module including interconnected DC capacitor banks and capacitor busbars; the capacitor busbars having a connection portion; a power module including an input busbar, an output busbar, and three single-phase switching transistor groups; the input busbar being connected to the connection portion and to each of the single-phase switching transistor groups; each of the single-phase switching transistor groups being connected to an output busbar; and further comprising: at least one heat sink, the heat sink having a mounting surface for mounting each of the single-phase switching transistor groups, the mounting surface being parallel to the connection portion.

[0013] The second technical solution is based on the first technical solution and is a preferred embodiment of the first technical solution, wherein the mounting surface is formed on the side of the heat sink facing away from the capacitor busbar; the single-phase switch tube group is mounted on the mounting surface.

[0014] The third technical solution is based on the first technical solution and is a preferred embodiment of the first technical solution, wherein the mounting surface is formed on the side of the heat sink facing the capacitor busbar; the single-phase switch tube group is mounted on the mounting surface.

[0015] The fourth technical solution is based on the first technical solution and is a preferred embodiment of the first technical solution, wherein the mounting surfaces are formed on both sides of the heat sink facing and away from the capacitor busbar; all single-phase switch tube groups are divided into two parts and respectively mounted on the two mounting surfaces.

[0016] The fifth technical solution is based on the first to fourth technical solutions and is a preferred embodiment of the first to fourth technical solutions. In this solution, each of the single-phase switch tube groups is arranged in parallel on the heat sink. Furthermore, in each of the single-phase switch tube groups, the arrangement direction of each switch module is consistent with the arrangement direction of each single-phase switch tube group.

[0017] The sixth technical solution is based on the fifth technical solution and is a preferred embodiment of the fifth technical solution, wherein the number of heat sinks is one.

[0018] The seventh technical solution is based on the fourth technical solution and is a preferred embodiment of the fourth technical solution. In this solution, each single-phase switch tube group includes several switch modules, and each switch module includes several switch tubes. The switch tubes are divided into input tubes and output tubes according to their type. In each single-phase switch tube group, the input tubes and output tubes of each switch module are arranged side by side in the left-right direction.

[0019] The eighth technical solution is based on the seventh technical solution and is a preferred embodiment of the seventh technical solution. In each of the single-phase switch tube groups, the input tube of each switch module is located on a different mounting surface from the output tube of the switch module.

[0020] The ninth technical solution is based on the seventh technical solution and is a preferred embodiment of the seventh technical solution. In this solution, each of the switch modules includes two input tubes and one output tube. The two input tubes are located on different mounting surfaces, and the output tube is located on the same mounting surface as one of the input tubes.

[0021] The tenth technical solution and its related embodiments relate to a converter that includes power components as described in any one of the first to ninth technical solutions.

[0022] As can be seen from the above description of the present invention and its specific embodiments, compared with the prior art, the technical solution of the present invention and its related embodiments have the following beneficial effects due to the adoption of the following technical means:

[0023] Through continuous observation, experimentation and research, the inventors discovered that the reason for the technical problem of "large power component size" in the existing technical solution is that the three heat sinks are installed vertically on the capacitor busbar, resulting in the heat sinks occupying too much space.

[0024] In response, in the first technical solution and related embodiments, the heat sink is mounted on the capacitor busbar in a parallel manner, forming a stacked arrangement between the heat sink and the capacitor busbar. The heat sink has a smaller thickness dimension, which can reduce the size of the power component in the thickness direction, thereby reducing the overall volume of the power component. Furthermore, the parallel arrangement allows the size of the power component in each direction to be within an appropriate range, which is more conducive to practical implementation. In addition, when the power component or converter composed of this arrangement is installed in the electrical cabinet, the power component can be installed flat in the electrical cabinet, which facilitates the design of air ducts and wiring in the electrical cabinet and can avoid interference between air ducts and wiring.

[0025] In the second technical solution and related embodiments, the single-phase switching transistor group is installed on the mounting surface on the back side of the heat sink. At this time, the distance between each switching transistor and the capacitor busbar is relatively close, which can effectively shorten the length of the commutation circuit and reduce stray inductance.

[0026] In the third technical solution and related embodiments, the single-phase switching transistor group is installed on the mounting surface in front of the heat sink. Since there is no capacitor busbar blocking the front of the heat sink, it is more convenient to maintain the switching transistor.

[0027] In the fourth technical solution and related embodiments, the single-phase switching transistor group is installed on the mounting surfaces on the front and back sides of the heat sink, which can improve the surface space utilization of the heat sink, while reducing the overall volume of the power module. The size of the power module is more balanced, which is convenient for practical implementation.

[0028] In the fifth technical solution and related embodiments, three single-phase switching transistor groups are arranged in parallel, and the arrangement direction of each single-phase switching transistor group is parallel to the connection part of the capacitor busbar. At the same time, the arrangement direction of each switching module in each single-phase switching module is also consistent with the arrangement direction of each single-phase switching transistor group. Thus, the input points of the three single-phase switching transistor groups are consistent and can be connected to the same input busbar, thereby improving current balance. At the same time, since they can be connected to the same input busbar, the number of input busbars can be reduced, the total length of the input busbars can be reduced, and the manufacturing cost can be reduced. Furthermore, since the input busbars are connected in the same position, the maintenance points are consistent, which facilitates later maintenance. In addition, since the switching modules in each single-phase switching module are also arranged in parallel, the commutation circuits of each switching module in the single-phase switching module are consistent, which can reduce the stray inductance of the power components.

[0029] In the sixth technical solution and related embodiments, the three single-phase switching transistors are assembled on the same heat sink. Compared with the prior art, there is no need to set gaps between the heat sinks, which reduces the overall space occupied by the heat sink. Furthermore, the three single-phase switching transistors are arranged more closely together, further reducing the volume of the power module.

[0030] In the seventh technical solution and related embodiments, the input tubes of the switching module are arranged in parallel, and the output tubes are also arranged in parallel. This facilitates the connection of the input tubes in the same single-phase switching tube group to the same input bus and the connection of the output tubes to the same output bus. It also facilitates the wiring of the input bus and the output bus and improves the balance between the various switching modules.

[0031] In the eighth technical solution and related embodiments, the input tube and output tube of the same switching module are located on different mounting surfaces, which can improve the surface space utilization of the heat sink. Furthermore, when wiring each single-phase switching tube group, the input and output bars will not be intertwined, which facilitates the wiring of the switching module and the installation of the input and output bars. At the same time, the consistent maintenance points also facilitate future maintenance.

[0032] In the ninth technical solution and related embodiments, the two input tubes of the same switching module are installed on different mounting surfaces, and the output tube is installed on one of the mounting surfaces. At this time, the connection between the input bus and the input tube is smoother, and the output bus is not affected by the input bus and the capacitor bus. The overall wiring is more convenient and simpler. In addition, the distance between the connection part of the input tube and the capacitor bus is shortened, which shortens the length of the entire commutation circuit and reduces stray inductance.

[0033] In the tenth technical solution and related embodiments, a liquid-cooled converter is provided, which uses a liquid-cooled heat sink and has the above-mentioned technical effects based on the power components it uses. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of the existing converter power components mentioned in the background art. Figure 1 ;

[0036] Figure 2 This is a schematic diagram of the structure of the existing converter power components mentioned in the background art. Figure 2 ;

[0037] Figure 3a This is a schematic diagram of the circuit topology of the existing converter power components mentioned in the background art;

[0038] Figure 3b 3 is a schematic diagram of the structure of the existing converter power assembly mentioned in the background art;

[0039] Figure 4a This is a schematic diagram of the structure of Embodiment 1 of the present invention. Figure 1 ;

[0040] Figure 4b This is a schematic diagram of the structure of Embodiment 1 of the present invention. Figure 2 ;

[0041] Figure 5a This is a schematic diagram of the structure of Embodiment 2 of the present invention. Figure 1 ;

[0042] Figure 5b This is a schematic diagram of the structure of Embodiment 2 of the present invention. Figure 2 ;

[0043] Figure 6aThis is a schematic diagram of the structure of Embodiment 3 of the present invention. Figure 1 ;

[0044] Figure 6b This is a schematic diagram of the structure of Embodiment 3 of the present invention. Figure 2 ;

[0045] Figure 7a This is a structural schematic diagram of Embodiment 4 of the present invention. Figure 1 ;

[0046] Figure 7b This is a structural schematic diagram of Embodiment 4 of the present invention. Figure 2 ;

[0047] Figure 8a This is a structural schematic diagram of Embodiment 5 of the present invention. Figure 1 ;

[0048] Figure 8b This is a schematic diagram of the structure of Embodiment 5 of the present invention. Figure 2 ;

[0049] Figure 9a This is a schematic diagram of the structure of Embodiment 6 of the present invention. Figure 1 ;

[0050] Figure 9b This is a schematic diagram of the structure of Embodiment 6 of the present invention. Figure 2 ;

[0051] Figure 10a This is a schematic diagram of the structure of Embodiment 7 of the present invention. Figure 1 ;

[0052] Figure 10b This is a schematic diagram of the structure of Embodiment 7 of the present invention. Figure 2 ;

[0053] Figure 11a This is a schematic diagram of the structure of Embodiment 8 of the present invention. Figure 1 ;

[0054] Figure 11b This is a schematic diagram of the structure of Embodiment 8 of the present invention. Figure 2 ;

[0055] Figure 12a This is a schematic diagram of the structure of Embodiment 9 of the present invention. Figure 1 ;

[0056] Figure 12b This is a schematic diagram of the structure of Embodiment 9 of the present invention. Figure 2 ;

[0057] Figure 13a This is a schematic diagram of the structure of Embodiment 10 of the present invention. Figure 1 ;

[0058] Figure 13bThis is a schematic diagram of the structure of Embodiment 10 of the present invention. Figure 2 ;

[0059] Figure 14 This is a schematic diagram of the structure of Embodiment 11 of the present invention. Figure 1 ;

[0060] Figure 15 This is a schematic diagram of the structure of Embodiment 11 of the present invention. Figure 2 ;

[0061] Figure 16 This is a schematic diagram of the structure of Embodiment 11 of the present invention;

[0062] Figure 17 for Figure 15 Schematic diagram of section AA;

[0063] Figure 18a This is a schematic diagram of the structure of Embodiment 12 of the present invention. Figure 1 ;

[0064] Figure 18b This is a schematic diagram of the structure of Embodiment 12 of the present invention. Figure 2 ;

[0065] Figure 19 This is a schematic diagram of the structure of Embodiment 13 of the present invention. Explanation of main reference numerals:

[0066] Appendix Figure 1 Up to 3:

[0067] 01 Capacitor busbar; 02 DC capacitor bank; 03 Input busbar; 04 Switching transistor; 05 Output busbar; 06 Heat sink; 07 Connector busbar;

[0068] Input transistor 04a; Output transistor 04b;

[0069] Positive terminal 041; First neutral terminal 042; Second neutral terminal 043; Negative terminal 044; First output terminal 045; Second output terminal 046.

[0070] In Figures 4 to 19 of the instruction manual:

[0071] Heat sink 10; Switching transistor 20; Input transistor 21; Output transistor 22; Input bus 31; Output bus 32; Connector bus 33; Single-phase switching transistor group 40; First phase 41; Second phase 42; Third phase 43; Capacitor busbar 50;

[0072] First sub-radiator 10a; Second sub-radiator 10b; Third sub-radiator 10c;

[0073] Input the first part of the sorted row 31a; input the second part of the sorted row 31b; input the third part of the sorted row 31c;

[0074] Output row first part 32a; Output row second part 32b; Output row third part 32c;

[0075] First phase, first part 41a; First phase, second part 41b;

[0076] Second phase, first part 42a; Second phase, second part 42b;

[0077] Third phase, first part 43a; Third phase, second part 43b;

[0078] Input row positive plate 311; Input row neutral plate 312; Input row terminal 313;

[0079] Connecting section 1, part 331; Connecting section 2, part 332;

[0080] 51. Positive plate of capacitor busbar; 52. Neutral plate of capacitor busbar; 53. Negative plate of capacitor busbar. Detailed Implementation

[0081] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0082] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0083] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0084] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0085] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0086] Regarding the structure of the power component in the prior art described in the background section, the inventors have found that the reason why the power component with this structure is too large is that the three sets of single-phase switching transistors are respectively set on three heat sinks 10, and the size of the power component is increased due to the influence of the heat sinks 10.

[0087] In addition, the inventors also discovered that the power component with this structure also has the problem of excessive stray inductance. The reason is that the input bus 03 is set vertically relative to the capacitor bus 01, which results in the switch module located on the outside of the capacitor bus 01 being too far away from the capacitor bus 01, thus causing the commutation circuit to be too long and the stray inductance to increase.

[0088] To address these technical problems, the present invention provides the following embodiments.

[0089] Example 1

[0090] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0091] The capacitor module includes interconnected capacitor busbar 50 and DC capacitor banks. The capacitor busbar 50 has a connection portion for connecting a power module. Referring to the prior art, the capacitor busbar 50 has a positive plate, a neutral plate, and a negative plate, stacked together, each with three input terminals. The power module draws power from the capacitor busbar 50 by connecting to it; the point of connection is called the aforementioned connection portion. Therefore, the position of the connection portion on the capacitor busbar 50 is determined by the location where the power module is connected. The portion of the capacitor busbar 50 that connects to the power module and its vicinity can be considered as the aforementioned connection portion. It should be noted that the connection portion should be flat to facilitate connection to the power module. Typically, the capacitor busbar 50 is also flat, and the connection portion is formed on the capacitor busbar 50.

[0092] The power module includes an input bus 31, an output bus 32, and three single-phase switching transistor groups 40. The input bus 31 is connected to the capacitor bus 50 and to each single-phase switching transistor group 40. Each single-phase switching transistor group 40 is connected to an output bus 32 to output single-phase AC power. Each single-phase switching transistor group 40 includes several switching modules composed of switching transistors 20. The switching transistors 20 are IGBT devices. Three switching transistors 20 work together to form a switching module, and multiple switching modules are connected in parallel to form a single-phase switching transistor group 40. Each single-phase switching transistor group 40 is used to output single-phase AC power. This power module has three single-phase switching transistor groups 40, which work together to output three-phase AC power. In this embodiment, each single-phase switching transistor group 40 includes four switching modules, for a total of twelve switching transistors 20.

[0093] Each switching module contains two input transistors 21 and one output transistor 22. The input terminal of the input transistor 21 forms the input terminal of its corresponding switching module, and the output terminal of the output transistor 22 forms the output terminal of its corresponding switching module.

[0094] Referring to the background art, the input tube 21 and the output tube 22 are connected by a connecting busbar 33, which can be a copper busbar. The input terminals of the two input tubes 21 are connected to the capacitor busbar 50 through the input busbar 31, and the output terminals of the two input tubes 21 are connected to the input terminals of the output tube 22 through the connecting busbar 33. The output terminals of the output tube 22 are connected to the output busbar 32. Each output tube 22 in each single-phase switch group 40 is connected to the same output busbar 32.

[0095] Input bus 31 and output bus 32 are used to transmit current in a hard-wired manner, and can be copper busbars or terminals. For example, when some input tubes 21 in a single-phase switch group are close to the connection points of the capacitor busbar 50, they can be directly connected using terminals instead of copper busbars.

[0096] The heat sink 10 is used to mount the switching transistor 20. After the switching transistor 20 is mounted on the heat sink 10, excess heat can be dissipated through the heat sink 10, preventing the switching transistor 20 from overheating during operation. Conventionally, the heat sink 10 can be an air-cooled heat sink as shown in the background art. In this embodiment, it can also be an air-cooled heat sink. In this case, the side of the air-cooled heat sink 10 opposite to the heat dissipation fins forms a mounting surface for mounting the switching transistor 20.

[0097] However, as a preferred embodiment, a liquid-cooled heat sink is used in this embodiment. Liquid-cooled heat sinks offer higher heat dissipation efficiency, and more switching transistors 20 can be accommodated within a single liquid-cooled heat sink. Liquid-cooled heat sinks are generally plate-shaped components, with mounting surfaces formed on both sides.

[0098] The layout of the switching transistor 20 in the power component described above will be explained below.

[0099] As an optional implementation, all three single-phase switching transistor groups 40 are mounted on a single heat sink 10. This effectively reduces the overall size of the power assembly, as multiple heat sinks 10 are not required as described in the background section. Understandably, in order to mount all three single-phase switching transistor groups 40 on a single heat sink 10, the heat sink 10 needs to have good heat dissipation performance; in this case, the liquid-cooled heat sink used in this embodiment may be a preferred choice.

[0100] Furthermore, in each single-phase switch group 40, the arrangement direction of each switch module is parallel to the connection part of the capacitor busbar 50. In this way, it can be ensured that the distance from each switch module to the capacitor busbar 50 is equal in each single-phase switch group 40, avoiding the problem of inconsistent commutation circuit lengths of switch modules at different positions in each single-phase switch group 40.

[0101] Furthermore, the three single-phase switching transistor groups 40 are all mounted on a mounting surface of the heat sink 10, and this mounting surface is parallel to the connecting portion. The parallelism between the mounting surface and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. When this mounting surface is located on the front side of the heat sink 10, it facilitates maintenance of the three unidirectional switching modules. Furthermore, when another mounting surface is formed on the other side of the heat sink 10, this other mounting surface can be used for rapid heat dissipation, improving heat dissipation efficiency. In this embodiment, the three single-phase switching transistor groups 40 are mounted on the front mounting surface of the heat sink 10. However, in other embodiments, the three single-phase switching transistor groups 40 can also be mounted on the rear mounting surface of the heat sink 10. When mounted on the rear mounting surface, the individual switching transistors 20, the input busbar 31, and the output busbar 32 can be arranged according to the layout described in this embodiment.

[0102] Furthermore, each switch module in all single-phase switch tube groups 40 is divided into two parts, one above and one below the mounting surface. Each switch module in each part is arranged side by side in the left-right direction, and the input terminals of the switch modules in the two parts are opposite to each other.

[0103] Furthermore, the three single-phase switch groups 40 are designated as first phase 41, second phase 42, and third phase 43. The first phase 41 and second phase 42 are respectively arranged on the upper and lower parts of the mounting surface, with their output terminals facing each other and located in the middle of the mounting surface. Each of their output terminals is connected to an output bar 32. The third phase 43 is divided into a first part 43a and a second part 43b according to the number of switch modules it includes. These two parts are respectively arranged on the upper and lower parts of the mounting surface, with their output terminals located in the middle of the mounting surface and connected to the same output bar 32. It should be noted that the term "parallel arrangement" in this specification means that the positions of the input tubes 21 of each switch module correspond to each other in the left-right direction, and the positions of the output tubes 22 also correspond to each other in the left-right direction.

[0104] The following provides further explanation of the above content.

[0105] In this embodiment, the side of the liquid-cooled heat sink that faces away from the capacitor busbar 50 forms a mounting surface, and the power module is mounted on this mounting surface. Therefore, the power module is also positioned away from the connection part of the capacitor busbar 50.

[0106] Reference Figure 4a It shows the layout of the three single-phase switch groups 40 on the heat sink 10, and shows the corresponding orientation. Meanwhile, referring to... Figure 4b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 4a The direction shown is the direction when viewed from the front of the radiator 10, towards the front mounting surface of the radiator 10.

[0107] In this embodiment, a single-phase switch tube group 40 is composed of four switch modules. The three single-phase switch tube groups 40 are the first phase 41, the second phase 42 and the third phase 43, respectively. The first phase 41 and the second phase 42 include four switch modules arranged in parallel. The third phase 43 is divided into a first part 43a and a second part 43b of the third phase, each part including two switch modules arranged in parallel.

[0108] In the first phase 41 and the second phase 42, four switch modules are arranged side by side in the left-right direction. Therefore, the output and input terminals of each switch module are also arranged side by side. At this time, the input terminals of the four switch modules together form the input terminal of the single-phase switch tube group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch tube group 40.

[0109] In the third phase 43, the four switch modules are divided into two parts. The two switch modules in each part are arranged side by side in the left-right direction. Therefore, the output and input terminals of each switch module in each part are also arranged side by side. At this time, the input terminals of the two switch modules in each part together form the input terminal of that part, and the output terminals of the two switch modules in each part together form the output terminal of that part.

[0110] Furthermore, the switching modules in the first phase 41 and the first part 43a of the third phase are arranged in parallel; the switching modules in the second phase 42 and the second part 43b of the third phase are also arranged in parallel.

[0111] Reference Figure 4a The single-phase switching transistor groups 40 of the first phase 41 and the second phase 42 are arranged symmetrically vertically. That is, the input and output terminals of the first phase 41 are located at the top and bottom, respectively, and the input and output terminals of the second phase 42 are located at the bottom and top, respectively. Their output terminals are opposite to each other, while their input terminals are opposite to each other. When installed on the heat sink 10, the input terminal of the first phase 41 corresponds to the upper edge of the heat sink 10, and the output terminal corresponds to the middle of the heat sink 10; the input terminal of the second phase 42 corresponds to the lower edge of the heat sink 10, and the output terminal corresponds to the middle of the heat sink 10. The first part 43a and the second part 43b of the third phase 43 are also arranged symmetrically vertically. That is, the input and output terminals of the first part 43a are located at the top and bottom, respectively, and the input and output terminals of the second part 43b are located at the bottom and top, respectively. Their output terminals are opposite to each other, while their input terminals are opposite to each other. When installed on the radiator 10, the input terminal of the first part 43a of the third phase corresponds to the upper edge of the radiator 10 and the output terminal corresponds to the middle part of the radiator 10, and the input terminal of the second part 43b of the third phase corresponds to the lower edge of the radiator 10 and the output terminal corresponds to the middle part of the radiator 10.

[0112] Reference Figure 4a Each single-phase switch group 40 is connected to the capacitor busbar 50 via an input busbar 31 and each is connected to an output busbar 32. The input terminals of the single-phase switch groups 40 of the first phase 41 and the first part 43a of the third phase are located at the upper edge of the heat sink 10, therefore an input busbar first part 31a can be provided along the upper edge of the heat sink 10. The input terminals of the single-phase switch groups 40 of the second phase 42 and the second part 43b of the third phase are located at the lower edge of the heat sink 10, therefore an input busbar second part 31b can be provided along the lower edge of the heat sink 10. The output terminals of the first phase 41 are correspondingly provided with an output busbar first part 32a, the output terminals of the second phase 42 are correspondingly provided with an output busbar second part 32b, and the output terminals of the first part 43a and the second part 43b of the third phase are opposite to each other, therefore a shared output busbar third part 32c can be provided.

[0113] Reference Figure 4b The capacitor busbar 50 is located on the rear side of the heat sink 10, and three single-phase switch tube groups 40 are mounted on the front mounting surface of the heat sink 10, with the extension direction of the input busbar 31 parallel to the plate surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, so the commutation circuit length of each switch module is equal, and compared with the prior art solution, this distance is also shorter, stray inductance is reduced, and switching losses are reduced accordingly.

[0114] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. The second part 31b of the input busbar also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are located at the upper and lower edges of the heat sink 10, the first part 31a and the second part 31b of the input busbar do not need to pass through the front mounting surface of the heat sink 10 to the capacitor busbar 50. Furthermore, the distances between the first part 31a and the second part 31b of the input busbar and the capacitor busbar 50 are equal, resulting in better balance of the DC-side current loop.

[0115] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located in the middle of the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0116] The power component provided in this embodiment reduces the volume of the heat sink 10, thereby reducing the overall volume of the power component, and also reduces the generation of stray inductance.

[0117] Example 2

[0118] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0119] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0120] The layout of the switching transistor 20 in the power component described above will be explained below.

[0121] As an optional implementation, the three single-phase switching transistor groups 40 are divided into two parts and respectively mounted on the two mounting surfaces of the heat sink 10. In this embodiment, the liquid-cooled heat sink has mounting surfaces on both sides, and the power module is mounted on these two mounting surfaces. This reduces the volume of the heat sink 10, further improves the space utilization of the heat sink 10, and reduces the overall volume of the power components. Furthermore, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner.

[0122] Furthermore, in each single-phase switch group 40, the individual switch modules are arranged side-by-side in the left-right direction. One complete single-phase switch group 40 is located on the front mounting surface of the heat sink 10, another complete single-phase switch group 40 is located on the rear mounting surface of the heat sink 10, and in the last single-phase switch group 40, the output transistor 22 of the switch module is located on the front mounting surface of the heat sink 10, and the input transistor 21 of the switch module is located on the rear mounting surface of the heat sink 10. It should be noted that in the last single-phase switch group 40, the output transistors 22 are arranged side-by-side in the left-right direction, and the input transistors 21 are also arranged side-by-side in the left-right direction.

[0123] The following provides further explanation of the above content.

[0124] Reference Figure 5a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 5b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 5a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 5a The directions shown are for indication only. Figure 5a The direction of the front view in the image.

[0125] Reference Figure 5a In this embodiment, four switching modules form a single-phase switching transistor group 40, and the three single-phase switching transistor groups 40 are respectively a first phase 41, a second phase 42, and a third phase 43. The first phase 41 and the second phase 42 include four switching modules arranged in parallel. The third phase 43 is divided into a first part 43a and a second part 43b. The first part 43a includes all the output transistors 22 of each switching module in the single-phase switching transistor group 40, and the second part 43b includes all the input transistors 21 of each switching module in the single-phase switching transistor group 40.

[0126] Reference Figure 5aThe single-phase switch tube group 40 of the first phase 41 is located on the front mounting surface of the radiator 10, the single-phase switch tube group 40 of the second phase 42 is located on the rear mounting surface of the radiator 10, the first part 43a of the third phase is located on the front mounting surface of the radiator 10, and the second part 43b of the third phase is located on the rear mounting surface of the radiator 10.

[0127] In the first phase 41 and the second phase 42, four switch modules are arranged side-by-side in the left-right direction. Therefore, the output and input terminals of each switch module are also arranged side-by-side. In this case, the input terminals of the four switch modules together form the input terminal of the single-phase switch group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch group 40. Furthermore, the input and output terminals of the single-phase switch group 40 in the first phase 41 and the second phase 42 are located at the top and bottom, respectively. When installed on the heat sink 10, the input terminals of the first phase 41 and the second phase 42 correspond to the upper edge of the heat sink 10, the only difference being that one is on the front side of the heat sink 10 and the other is on the rear side; simultaneously, the output terminals of the first phase 41 and the second phase 42 correspond to the middle of the heat sink 10.

[0128] The first part 43a of the third phase corresponds to the output tubes 22 of each switch module in the single-phase switch tube group 40 of the third phase 43. These four output tubes 22 are arranged side by side in the left-right direction, and their output terminals are also arranged side by side. At this time, the output terminals of these four output tubes 22 together form the output terminal of the single-phase switch tube group 40. The second part 43b of the third phase corresponds to the input tubes 21 of each switch module in the single-phase switch tube group 40 of the third phase 43. These eight input tubes 21 are arranged side by side in the left-right direction, with two input tubes 21 in the same switch module being close to each other. The input terminals of these eight input tubes 21 are also arranged side by side. At this time, the input terminals of these eight input tubes 21 together form the input terminal of the single-phase switch tube group 40. In the third phase 43, the output and input terminals of the single-phase switching transistor group 40 are both located at the bottom. When installed on the heat sink 10, even though the output and input terminals of the single-phase switching transistor group 40 are both located at the upper edge of the heat sink 10, the difference is that its output terminal is located at the front side of the heat sink 10 and its output terminal is located at the rear side of the heat sink 10.

[0129] Reference Figure 5aEach single-phase switch group 40 is connected to the capacitor bus 50 via an input bus 31, and each is connected to an output bus 32. The input terminals of the single-phase switch groups 40 of the first phase 41 and the second phase 42 are located at the upper edge of the heat sink 10. Therefore, a first input bus 31a and a second input bus 31b can be provided at the upper edge of the heat sink 10. The first input bus 31a and the second input bus 31b can be connected in parallel before being connected to the capacitor bus 50. The input terminal of the second part 43b of the third phase is located at the lower edge of the heat sink 10. Therefore, a third input bus 31c can be provided at the lower edge of the heat sink 10.

[0130] Reference Figure 5b The output terminals of the single-phase switching transistor group 40 of the first phase 41 and the second phase 42 are both located in the middle of the heat sink 10. Therefore, the first part 32a and the second part of the output bus can be set in the middle of the heat sink 10. It should be noted that the first part 32a of the output bus is located on the front side of the heat sink 10 and can be directly output to the outside. However, the second part 32b of the output bus is located on the rear side of the heat sink 10. If it is to be output to the outside, there must be enough space between the mounting surface on the rear side of the heat sink 10 and the capacitor bus 50. This is not conducive to the length of the overall converter circuit of the power module. Therefore, an opening can be set in the middle of the heat sink 10 to lead the second part 32b of the output bus from the rear side of the heat sink 10 to the front side of the heat sink 10, which facilitates the output wiring of the second part 32b of the output bus.

[0131] The output terminal of the first part 43a of the third phase is located at the lower edge of the heat sink 10. The third part 32c of the output bus can be located at the lower edge of the heat sink 10. In the third phase 43, the two input tubes 21 and the output tube 22 of each switching module are located on both sides of the heat sink 10. Therefore, openings can be provided at corresponding positions on the heat sink 10, and the input tubes 21 and output tubes 22 of each switching module can be connected via the connecting bus 33. For ease of fabrication, since the position of the connecting bus 33 in the third phase 43 also corresponds to the middle of the heat sink 10, only one opening can be provided in the middle of the heat sink 10. This opening can be used to simultaneously allow the connecting bus 33 to pass through and to allow the second part 32b of the output bus to pass through.

[0132] Reference Figure 5b The capacitor busbar 50 is located behind the heat sink 10, and the extension direction of the input busbar 31 is parallel to the surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. Stray inductance is reduced, and switching losses are reduced accordingly.

[0133] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Similarly, the input busbar 31 also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are located at the upper and lower edges of the heat sink 10, the first, second, and third parts of the input busbar do not need to pass through the front mounting surface of the heat sink 10 to reach the capacitor busbar 50. The second part 31b and the third part 31c of the input busbar are equidistant from the capacitor busbar 50, resulting in better DC-side current loop balance. Although the current loop distance between the single-phase switching transistor group 40 corresponding to the first phase 41 and the capacitor busbar 50 is slightly longer, the stacked arrangement of the input busbars 31 reduces stray inductance, thus meeting the usage requirements.

[0134] Compared to Embodiment 1, the power component provided in this embodiment further reduces the volume of the heat sink 10 by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, thereby improving the surface space utilization of the heat sink 10, reducing the overall volume of the power component, and reducing the generation of stray inductance.

[0135] Example 3

[0136] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0137] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0138] The layout of the switching transistor 20 in the power component described above will be explained below.

[0139] This embodiment employs a liquid-cooled heat sink. Liquid-cooled heat sinks offer higher heat dissipation efficiency, allowing for the packing of more switching transistors 20 within a single unit. Liquid-cooled heat sinks are typically plate-shaped components, with mounting surfaces formed on both sides.

[0140] As an optional implementation, the three single-phase switch groups 40 are arranged in parallel along the vertical direction.

[0141] In each single-phase switch group 40, the output tube 22 of the switch module is located on the front mounting surface of the heat sink 10, and the input tube 21 of the switch module is located on the rear mounting surface of the heat sink 10. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner.

[0142] Corresponding to this layout, the "parallel arrangement" in a single-phase switch tube group 40 means that in each single-phase switch tube group 40, each output tube 22 is arranged side by side in the left-right direction, and each input tube 21 is also arranged side by side in the left-right direction. The "parallel arrangement" mentioned above means that each single-phase switch tube group 40 is treated as a whole, and the arrangement direction of each switch module in each single-phase switch tube group 40 is the overall extension direction of the single-phase switch tube group 40. That is, each single-phase switch tube group 40 extends in the left-right direction. Under this premise, the three single-phase switch tube groups 40 are arranged in parallel from top to bottom on the heat sink 10.

[0143] Furthermore, in each single-phase switch group 40, both its output and input terminals are located below it relative to the single-phase switch group 40.

[0144] The following provides further explanation of the above content.

[0145] Reference Figure 6a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 6b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 6a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 6a The directions shown are for indication only. Figure 6a The direction of the front view in the image.

[0146] Reference Figure 6a In this embodiment, four switching modules form a single-phase switching transistor group 40, and the three single-phase switching transistor groups 40 are designated as a first phase 41, a second phase 42, and a third phase 43. Each of the first, second, and third phases 43 is divided into two parts: a first part 41a and a second part 41b of the first phase; a first part 42a and a second part 42b of the second phase; and a first part 43a and a second part 43b of the third phase. The first part of each phase corresponds to each input transistor 21 in the single-phase switching transistor group 40, and the second part of each phase corresponds to each output transistor 22 in the single-phase switching transistor group 40.

[0147] Reference Figure 6a In each single-phase switch tube group 40, the input terminals of the four switch modules together form the input terminal of the single-phase switch tube group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch tube group 40.

[0148] In this configuration, the first phase 41 is located at the upper part of the radiator 10, the second phase 42 is located at the middle part of the radiator 10, and the second phase 43 is located at the lower part of the radiator 10. Correspondingly, the first part 41a of the first phase is located on the rear mounting surface of the upper part of the radiator 10, and the second part 41b of the first phase is located on the front mounting surface of the upper part of the radiator 10. The first part 41a and the second part 41b of the first phase are connected by a connecting strip 33, which bypasses the upper edge of the radiator 10. The first part 42a of the second phase is located on the rear mounting surface of the middle part of the radiator 10, and the second part 42b of the second phase is located on the front mounting surface of the middle part of the radiator 10. The first part 42a and the second part 42b of the second phase are connected by the connecting strip 33. Referring to Embodiment 2, an opening is provided at the corresponding position of the radiator 10, through which the connecting strip 33 can pass to connect the first part 42a and the second part 42b of the second phase. The first part of the third phase 43a is located on the rear mounting surface of the lower part of the radiator 10, and the second part of the third phase 43b is located on the front mounting surface of the lower part of the radiator 10. The first part of the third phase 43a and the second part of the third phase 43b are connected by a connecting strip 33. Similarly, an opening can be provided at the corresponding position of the radiator 10, and the connecting strip 33 can pass through the opening to connect the first part of the third phase 43a and the second part of the third phase 43b.

[0149] Reference Figure 6a Each single-phase switch group 40 is connected to the capacitor busbar 50 via an input busbar 31 and each is connected to an output busbar 32. Specifically, the input terminal of the first phase 41 is connected to the first part 31a of the input busbar, which is located below the first part 41a of the first phase; the output terminal of the first phase 41 is connected to the first part 32a of the output busbar, which is located below the second part 41b of the first phase. The input terminal of the second phase 42 is connected to the second part 31b of the input busbar, which is located below the first part 42a of the second phase; the output terminal of the second phase 42 is connected to the second part 32b of the output busbar, which is located below the second part 42b of the second phase. The input terminal of the third phase 43 is connected to the third part 31c of the input busbar, which is located below the first part 43a of the third phase; the output terminal of the third phase 43 is connected to the third part 32c of the output busbar, which is located below the second part 43b of the third phase.

[0150] refer to Figure 6bThe capacitor busbar 50 is located behind the heat sink 10, and the extension direction of the input busbar 31 is parallel to the surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. Stray inductance is reduced, and switching losses are reduced accordingly.

[0151] Specifically, the first part 31a, the second part 31b, and the third part 31c of the input busbar each include a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located behind the heat sink 10, the first, second, and third parts of the input busbar can all be directly connected to the capacitor busbar 50. Furthermore, the distance between the input terminal of each single-phase switching transistor group 40 and the capacitor busbar 50 is equal, which improves the balance of the DC-side current loop. Simultaneously, the output terminals of each single-phase switching transistor group 40 are located in front of the heat sink 10, making it easy to connect the first, second, and third parts of the output busbar for external output wiring.

[0152] Compared to Embodiment 1, the power component provided in this embodiment further reduces the volume of the heat sink 10 by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, thereby improving the surface space utilization of the heat sink 10, reducing the overall volume of the power component, and reducing the generation of stray inductance.

[0153] Furthermore, in this embodiment, the number of heat sinks 10 is one. However, in other embodiments, the number of heat sinks 10 can be set to three, with the three heat sinks 10 arranged vertically. Each heat sink 10 is equipped with a complete single-phase switch tube group 40. The wiring method of the single-phase switch tube group 40 can refer to the wiring method of each single-phase switch tube group 40 in this embodiment. However, when using three heat sinks 10, the connecting bar 33 in each single-phase switch tube group 40 can directly bypass the upper or lower edge of the heat sink 10 it is located on. Using three heat sinks 10 reduces the heat dissipation capacity requirement of a single heat sink 10, which can reduce the cost of the heat sink 10. It also facilitates the wiring and maintenance of the single-phase switch tube group on each heat sink 10.

[0154] Example 4

[0155] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0156] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0157] The layout of the switching transistor 20 in the power component described above will be explained below.

[0158] This embodiment employs a liquid-cooled heat sink. Liquid-cooled heat sinks offer higher heat dissipation efficiency, allowing for the packing of more switching transistors 20 within a single unit. Liquid-cooled heat sinks are typically plate-shaped components, with mounting surfaces formed on both sides.

[0159] In this embodiment, in each single-phase switch group 40, the output tube 22 of the switch module is located on the front mounting surface of the heat sink 10, and the input tube 21 of the switch module is located on the rear mounting surface of the heat sink 10. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be considered as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner.

[0160] Corresponding to this layout, the aforementioned "parallel arrangement" means that in each single-phase switch tube group 40, each output tube 22 is arranged side by side in the left-right direction, and each input tube 21 is also arranged side by side in the left-right direction. The aforementioned "parallel arrangement" means that each single-phase switch tube group 40 is treated as a whole, and the arrangement direction of each switch module in each single-phase switch tube group 40 is taken as the overall extension direction of the single-phase switch tube group 40. That is, each single-phase switch tube group 40 extends in the left-right direction. Under this premise, the three single-phase switch tube groups 40 are arranged in parallel from top to bottom on the heat sink 10.

[0161] Furthermore, in the two upper single-phase switch groups 40, the output terminal and the input terminal are both located below their respective single-phase switch groups 40; in the two lower single-phase switch groups 40, the output terminal and the input terminal are both located above their respective single-phase switch groups 40.

[0162] Reference Figure 7a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 7b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 7a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 7a The directions shown are for indication only. Figure 7a The direction of the front view in the image.

[0163] Reference Figure 7aIn this embodiment, four switching modules form a single-phase switching transistor group 40, and the three single-phase switching transistor groups 40 are designated as a first phase 41, a second phase 42, and a third phase 43. Each of the first, second, and third phases 43 is divided into two parts: a first part 41a and a second part 41b of the first phase; a first part 42a and a second part 42b of the second phase; and a first part 43a and a second part 43b of the third phase. The first part of each phase corresponds to each input transistor 21 in the single-phase switching transistor group 40, and the second part of each phase corresponds to each output transistor 22 in the single-phase switching transistor group 40.

[0164] Reference Figure 7a In each single-phase switch tube group 40, the input terminals of the four switch modules together form the input terminal of the single-phase switch tube group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch tube group 40.

[0165] In this configuration, the first phase 41 is located at the upper part of the radiator 10, the second phase 42 is located at the middle part of the radiator 10, and the second phase 43 is located at the lower part of the radiator 10. Correspondingly, the first part 41a of the first phase is located on the rear mounting surface of the upper part of the radiator 10, and the second part 41b of the first phase is located on the front mounting surface of the upper part of the radiator 10. The first part 41a and the second part 41b of the first phase are connected by a connecting strip 33, which bypasses the upper edge of the radiator 10. The first part 42a of the second phase is located on the rear mounting surface of the middle part of the radiator 10, and the second part 42b of the second phase is located on the front mounting surface of the middle part of the radiator 10. The first part 42a and the second part 42b of the second phase are connected by the connecting strip 33. Referring to Embodiment 2, an opening is provided at the corresponding position of the radiator 10, through which the connecting strip 33 can pass to connect the first part 42a and the second part 42b of the second phase. The first part of the third phase 43a is located on the rear mounting surface of the lower part of the radiator 10, and the second part of the third phase 43b is located on the front mounting surface of the lower part of the radiator 10. The first part of the third phase 43a and the second part of the third phase 43b are connected by a connecting strip 33. Similarly, the first part of the third phase 43a and the second part of the third phase 43b are connected by a connecting strip 33, which bypasses the lower edge of the radiator 10.

[0166] Reference Figure 7aEach single-phase switch group 40 is connected to the capacitor busbar 50 via an input busbar 31 and each is connected to an output busbar 32. Specifically, the input terminal of the first phase 41 is connected to the first part 31a of the input busbar, which is located below the first part 41a of the first phase; the output terminal of the first phase 41 is connected to the first part 32a of the output busbar, which is located below the second part 41b of the first phase. The input terminal of the second phase 42 is connected to the second part 31b of the input busbar, which is located below the first part 42a of the second phase; the output terminal of the second phase 42 is connected to the second part 32b of the output busbar, which is located below the second part 42b of the second phase. The input terminal of the third phase 43 is connected to the third part 31c of the input busbar, which is located above the first part 43a of the third phase; the output terminal of the third phase 43 is connected to the third part 32c of the output busbar, which is located above the second part 43b of the third phase.

[0167] refer to Figure 7b The capacitor busbar 50 is located behind the heat sink 10, and the extension direction of the input busbar 31 is parallel to the surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. Stray inductance is reduced, and switching losses are reduced accordingly.

[0168] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Similarly, the input busbar 31 includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located behind the heat sink 10, the first, second, and third parts of the input busbar can be directly connected to the capacitor busbar 50. Furthermore, the distance between the input terminal of each single-phase switching transistor group 40 and the capacitor busbar 50 is equal, which improves the balance of the DC-side current loop. At the same time, the output terminals of each single-phase switching transistor group 40 are located in front of the heat sink 10, making it easy to connect the first, second, and third parts of the output busbar to external wiring.

[0169] Furthermore, compared to Embodiment 3, the input terminals of the first part 42a of the second phase and the first part 43a of the third phase can be connected in parallel before being connected to the capacitor busbar 50. This reduces the total length of the second part 31b and the third part 31c of the input busbar, which helps to reduce stray inductance and lower costs.

[0170] Compared to Embodiment 1, the power component provided in this embodiment further reduces the volume of the heat sink 10 by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, thereby improving the surface space utilization of the heat sink 10, reducing the overall volume of the power component, and reducing the generation of stray inductance.

[0171] Example 5

[0172] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0173] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0174] The layout of the switching transistor 20 in the power component described above will be explained below.

[0175] Conventionally, the heat sink 10 can be an air-cooled heat sink as shown in the background art, and it can also be an air-cooled heat sink in this embodiment. In this case, the side of the air-cooled heat sink 10 opposite to the heat dissipation fins forms a mounting surface for mounting the switching transistor 20. However, as a preferred embodiment, a liquid-cooled heat sink is used in this embodiment. Liquid-cooled heat sinks can provide higher heat dissipation efficiency, and more switching transistors 20 can be stacked in a single liquid-cooled heat sink. Liquid-cooled heat sinks are generally plate-shaped components, and mounting surfaces can be formed on both sides.

[0176] As an optional implementation, in the power module, each single-phase switching transistor group is arranged in parallel on the heat sink 10, and the arrangement direction of each single-phase switching transistor group is parallel to the connection part; in each single-phase switching transistor group, the arrangement direction of each switching module is consistent with the arrangement direction of each single-phase switching transistor group. In each single-phase switching transistor group 40, the arrangement direction of each switching module is parallel to the connection part of the capacitor busbar 50. In this way, it can be ensured that the distance from each switching module to the capacitor busbar 50 is equal in each single-phase switching transistor group 40, avoiding the problem of inconsistent commutation circuit lengths of switching modules at different positions in each single-phase switching transistor group 40.

[0177] Furthermore, the three single-phase switching transistor groups 40 are all mounted on a mounting surface of the heat sink 10. In this embodiment, the mounting surface is parallel to the connecting portion. The parallelism between the mounting surface and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. When the mounting surface is located on the front side of the heat sink 10, it facilitates maintenance of the three unidirectional switching modules. Furthermore, when another mounting surface is formed on the other side of the heat sink 10, this other mounting surface can be used for rapid heat dissipation, improving heat dissipation efficiency. In this embodiment, the three single-phase switching transistor groups 40 are mounted on the front mounting surface of the heat sink 10. However, in other embodiments, the three single-phase switching transistor groups 40 can also be mounted on the rear mounting surface of the heat sink 10. When mounted on the rear mounting surface, the individual switching transistors 20, the input busbar 31, and the output busbar 32 can be arranged according to the layout described in this embodiment.

[0178] The following provides further explanation of the above content.

[0179] Specifically, refer to Figure 8a It shows the layout of the three single-phase switch groups 40 on the heat sink 10, and shows the corresponding orientation. Meanwhile, referring to... Figure 8b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 8a The direction shown is the direction when viewed from the front of the radiator 10, towards the front surface of the radiator 10.

[0180] In this embodiment, four switch modules form a single-phase switch group 40. The three single-phase switch groups 40 are designated as a first phase 41, a second phase 42, and a third phase 43. Each of the first phase 41, second phase 42, and third phase 43 includes four switch modules arranged side-by-side in a left-right direction. In each switch module, the output and input terminals of each switch module are also arranged side-by-side. In this case, the input terminals of the four switch modules together form the input terminal of the single-phase switch group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch group 40.

[0181] Reference Figure 8a Each single-phase switching transistor group 40 is connected to the capacitor busbar 50 via an input busbar 31, and each is connected to an output busbar 32. The input and output terminals of each phase of the three single-phase switching transistor groups 40 are located at the top and bottom, respectively. Therefore, an input busbar 31 can be set along the upper edge of the heat sink 10, which connects to all three single-phase switching transistor groups 40. At the same time, three output busbars 32 can be set along the lower edge of the heat sink 10, corresponding to the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 32a, the second part 32b, and the third part 32c of the output busbar.

[0182] Reference Figure 8b The capacitor busbar 50 is located on the rear side of the heat sink 10, and the three single-phase switch tube groups 40 are mounted on the front mounting surface of the heat sink 10, with the extension direction of the input busbar 31 parallel to the plate surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal, thereby reducing stray inductance and switching losses.

[0183] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. The input busbar 31 also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of the heat sink 10, only one input busbar 31 is needed to connect to the capacitor busbar 50. Therefore, the distance between each single-phase switching transistor group 40 and the capacitor busbar 50 is equal, and the current loop distance between the three single-phase switching transistor groups 40 and the capacitor busbar 50 is consistent. Regardless of the current direction of the capacitor busbar 50, the arrival time of each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance.

[0184] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located below the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0185] The power component provided in this embodiment, compared with embodiments 1 to 4, arranges each single-phase switch group 40 in parallel, so that the current loop distance between the three single-phase switch groups 40 and the capacitor bus 50 is consistent. Therefore, the current loop balance from the capacitor bus 50 to each single-phase switch group 40 is improved, and stray inductance is reduced.

[0186] Example 6

[0187] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0188] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0189] The layout of the switching transistor 20 in the power component described above will be explained below.

[0190] This embodiment employs a liquid-cooled heat sink. Liquid-cooled heat sinks offer higher heat dissipation efficiency, allowing for the packing of more switching transistors 20 within a single unit. Liquid-cooled heat sinks are typically plate-shaped components, with mounting surfaces formed on both sides.

[0191] As an optional implementation, the three single-phase switch modules 40 are divided into two parts and respectively mounted on two mounting surfaces of the heat sink 10, with the switch modules arranged side-by-side in the left-right direction on each mounting surface. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. This reduces the volume of the heat sink 10, further improving its space utilization and reducing the overall size of the power components.

[0192] The following provides further explanation of the above content.

[0193] Among them, a complete single-phase switch tube group 40 is located on the front mounting surface of the heat sink 10, another complete single-phase switch tube group 40 is located on the rear mounting surface of the heat sink 10, and in the last single-phase switch tube group 40, each switch module is divided into two parts, and the switch modules in each part are arranged side by side. These two parts are located on the front mounting surface and the rear mounting surface of the heat sink 10, respectively.

[0194] Reference Figure 9a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 9b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 9a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 9a The directions shown are for indication only. Figure 9a The direction of the front view in the image.

[0195] Reference Figure 9a In this embodiment, four switch modules form a single-phase switch group 40, and the three single-phase switch groups 40 are respectively a first phase 41, a second phase 42, and a third phase 43. The first phase 41 and the second phase 42 each include four switch modules arranged in parallel. The third phase 43 is divided into a first part 43a and a second part 43b, each part including two switch modules arranged in parallel. The first phase 41 and the first part 43a are located on the front mounting surface of the heat sink 10, and the second phase 42 and the second part 43b are located on the rear mounting surface of the heat sink 10. On the front mounting surface of the heat sink 10, the first phase 41 and the first part 43a are arranged in parallel along the left-right direction; on the rear mounting surface of the heat sink 10, the second phase 42 and the second part 43b are arranged in parallel along the left-right direction.

[0196] In the first phase 41 and the second phase 42, four switch modules are arranged side by side in the left-right direction. Therefore, the output and input terminals of each switch module are also arranged side by side. At this time, the input terminals of the four switch modules together form the input terminal of the single-phase switch tube group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch tube group 40.

[0197] In the third phase 43, the four switch modules are divided into two parts. The two switch modules in each part are arranged side by side in the left-right direction. Therefore, the output and input terminals of each switch module in each part are also arranged side by side. At this time, the input terminals of the two switch modules in each part together form the input terminal of that part, and the output terminals of the two switch modules in each part together form the output terminal of that part.

[0198] Reference Figure 9a The input terminals of the first phase 41, the second phase 42, and the third phase 43 are all located at the top. When installed on the heat sink 10, the input terminals of the first phase 41, the second phase 42, and the third phase 43 correspond to the upper edge of the heat sink 10, and the output terminals correspond to the lower edge of the heat sink 10. Simultaneously, each single-phase switch group 40 is connected to the capacitor busbar 50 via an input busbar 31, and each is connected to an output busbar 32. Therefore, an input busbar 31 can be provided along the upper edge of the heat sink 10, which simultaneously connects to the input terminals of the first phase 41, the second phase 42, and the third phase 43; and three output busbars 32 can be provided along the lower edge of the heat sink 10, namely, the first part 32a, the second part 32b, and the third part 32c, which are respectively connected to the output terminals of the first phase 41, the second phase 42, and the third phase 43.

[0199] Specifically, for the third part 32c of the output bus, since the third phase 43 is divided into the first part 43a and the second part 43b of the third phase, and the two are located on the front and rear mounting surfaces of the heat sink 10 respectively, and the third part 32c of the output bus needs to connect to the output terminals of the first part 43a and the second part 43b of the third phase at the same time, the third part 32c of the output bus can be bypassed around the right edge of the heat sink 10. At this time, the third part 32c of the output bus can connect to the output terminals of the first part 43a and the second part 43b of the third phase at the same time.

[0200] Reference Figure 9b The capacitor busbar 50 is located on the rear side of the heat sink 10. Three single-phase switch tube groups 40 are mounted on the front and rear mounting surfaces of the heat sink 10, and the extension direction of the input busbar 31 is parallel to the plate surface of the capacitor busbar 50. In this way, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. The stray inductance is reduced, and the switching loss is reduced accordingly.

[0201] Reference Figure 9b Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of the heat sink 10, only one input bus 31 is needed to connect to the capacitor bus 50. Therefore, the distance between each single-phase switching transistor group 40 and the capacitor bus 50 is equal, and the current loop distance between the three single-phase switching transistor groups 40 and the capacitor bus 50 is consistent. Regardless of the current direction of the capacitor bus 50, the arrival time of the current in each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance. Meanwhile, referring to... Figure 9b The input terminal of the second phase 42 can be connected in parallel with the input bus 31 connected to the input terminal of the first phase 41 and then connected to the capacitor bus 50, thereby reducing the total length of the input bus 31, reducing manufacturing costs, and also reducing stray inductance.

[0202] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located at the lower edge of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0203] The power component provided in this embodiment, compared to embodiments 1 to 4, arranges the individual single-phase switching transistor groups 40 in parallel, ensuring that the current loop distance between the three single-phase switching modules and the capacitor busbar 50 is consistent. This improves the current loop balance from the capacitor busbar 50 to each individual single-phase switching transistor group 40 and reduces stray inductance. Furthermore, compared to embodiment 5, by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, the volume of the heat sink 10 is further reduced, improving the surface space utilization of the heat sink 10 and also reducing the overall volume of the power component.

[0204] Example 7

[0205] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0206] For an introduction to capacitor modules and power modules, please refer to Example 1. The following only explains the differences between the two.

[0207] The layout of the switching transistor 20 in the power component described above will be explained below.

[0208] As an alternative implementation, the three single-phase switching transistor groups 40 are respectively mounted on three heat sinks 10. In this way, the heat dissipation capacity requirement of each heat sink 10 is reduced, thereby reducing the cost of the heat sink 10.

[0209] Furthermore, in the power module, each single-phase switching transistor group is arranged in parallel on the heat sink 10, and the arrangement direction of each single-phase switching transistor group is parallel to the connection part; in each single-phase switching transistor group, the arrangement direction of each switching module is consistent with the arrangement direction of each single-phase switching transistor group. In each single-phase switching transistor group 40, the arrangement direction of each switching module is parallel to the connection part of the capacitor busbar 50. In this way, it can be ensured that the distance from each switching module to the capacitor busbar 50 is equal in each single-phase switching transistor group 40, avoiding the problem of inconsistent commutation circuit lengths of switching modules at different positions in each single-phase switching transistor group 40.

[0210] Furthermore, the three single-phase switching transistor groups 40 are all mounted on a mounting surface of the heat sink 10. In this embodiment, the mounting surface is parallel to the connecting portion. The parallelism between the mounting surface and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. When the mounting surface is located on the front side of the heat sink 10, it facilitates maintenance of the three unidirectional switching modules. Furthermore, when another mounting surface is formed on the other side of the heat sink 10, this other mounting surface can be used for rapid heat dissipation, improving heat dissipation efficiency. In this embodiment, the three single-phase switching transistor groups 40 are mounted on the front mounting surface of the heat sink 10. However, in other embodiments, the three single-phase switching transistor groups 40 can also be mounted on the rear mounting surface of the heat sink 10. When mounted on the rear mounting surface, the individual switching transistors 20, the input busbar 31, and the output busbar 32 can be arranged according to the layout described in this embodiment.

[0211] The following provides further explanation of the above content.

[0212] Specifically, refer to Figure 10a It shows the layout of the three single-phase switch groups 40 on the heat sink 10, and shows the corresponding orientation. Meanwhile, referring to... Figure 10b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 10a The direction shown is the direction when viewed from the front of the radiator 10, towards the front mounting surface of the radiator 10.

[0213] Reference Figure 10a In this embodiment, the radiator 10 includes a first sub-radiator 10a, a second sub-radiator 10b, and a third sub-radiator 10c, which are arranged side by side along the left-right direction. In this embodiment, the radiator 10 is a liquid-cooled radiator.

[0214] In this embodiment, four switch modules form a single-phase switch group 40. The three single-phase switch groups 40 are designated as a first phase 41, a second phase 42, and a third phase 43. Each of the first phase 41, second phase 42, and third phase 43 includes four switch modules arranged side-by-side in a left-right direction. In each switch module, the output and input terminals of each switch module are also arranged side-by-side. In this case, the input terminals of the four switch modules together form the input terminal of the single-phase switch group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch group 40.

[0215] Reference Figure 10a In each single-phase switch group 40, the arrangement direction of the four switch modules corresponds to the extension direction of the single-phase switch group 40, and also corresponds to the extension direction of the heat sink 10. In this embodiment, it can be considered that the single-phase switch group 40 extends in the left-right direction, and each heat sink 10 also extends in the left-right direction. The above-mentioned three switch modules arranged side by side in the left-right direction can be understood as the three single-phase switch groups 40 being arranged in a line along their extension direction, that is, the three heat sinks 10 being arranged in a line along their extension direction.

[0216] Reference Figure 10a Each single-phase switching transistor group 40 is connected to the capacitor busbar 50 via an input busbar 31 and is also connected to an output busbar 32. The input and output terminals of each phase of the three single-phase switching transistor groups 40 are located at the top and bottom, respectively. Therefore, an input busbar 31 can be set along the upper edge of each heat sink 10, corresponding to the single-phase switching transistor groups 40 of the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 31a, the second part 31b, and the third part 31c of the input busbar. At the same time, three output busbars 32 can be set along the lower edge of each heat sink 10, corresponding to the single-phase switching transistor groups 40 of the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 32a, the second part 32b, and the third part 32c of the output busbar.

[0217] Reference Figure 10b The capacitor busbar 50 is located on the rear side of the heat sink 10, and the three single-phase switch tube groups 40 are mounted on the front mounting surface of the heat sink 10, with the extension direction of the input busbar 31 parallel to the plate surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal, thereby reducing stray inductance and switching losses.

[0218] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. The input busbar 31 also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of their respective heat sinks 10, three input busbars 31 are needed to connect to the capacitor busbar 50. However, since the three single-phase switching transistor groups 40 are arranged side by side in the left-right direction, the distance between each single-phase switching transistor group 40 and the capacitor busbar 50 is equal. The current loop distance between the three single-phase switching transistor groups 40 and the capacitor busbar 50 is consistent, and regardless of the current direction of the capacitor busbar 50, the arrival time of each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance.

[0219] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located below the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0220] The power component provided in this embodiment, compared with embodiments 1 to 4, arranges each single-phase switch group 40 in parallel, so that the current loop distance between the three single-phase switch groups 40 and the capacitor bus 50 is consistent. Therefore, the current loop balance from the capacitor bus 50 to each single-phase switch group 40 is improved, and stray inductance is reduced.

[0221] Example 8

[0222] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0223] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0224] The layout of the switching transistor 20 in the power component described above will be explained below.

[0225] As an optional implementation, the three single-phase switch modules 40 are divided into two parts and respectively mounted on two mounting surfaces of each heat sink 10. The switch modules on each mounting surface are arranged side-by-side in the left-right direction. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. This reduces the volume of the heat sink 10, further improving the space utilization of the heat sink 10 and reducing the overall volume of the power components.

[0226] The following provides further explanation of the above content.

[0227] Each single-phase switch tube group 40 is divided into two parts, and the switch modules in each part are arranged side by side. The two parts are located on the front mounting surface and the rear mounting surface of the heat sink 10, respectively.

[0228] Reference Figure 11a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 11b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 11a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In the illustration corresponding to each single-phase switch tube group 40, the part on the left is the front side, and the part on the right is the rear side.

[0229] Reference Figure 10a In this embodiment, the radiator 10 includes a first sub-radiator 10a, a second sub-radiator 10b, and a third sub-radiator 10c, which are arranged side by side along the left-right direction. In this embodiment, the radiator 10 is a liquid-cooled radiator.

[0230] Reference Figure 11a In this embodiment, four switch modules form a single-phase switch group 40, and the three single-phase switch groups 40 are the first phase 41, the second phase 42, and the third phase 43, respectively. In each phase of the first phase 41, the second phase 42, and the third phase 43, the four switch modules are divided into two parts. The two switch modules in each part are arranged side by side in the left-right direction. Therefore, the output terminal and the input terminal of each switch module in each part are also arranged side by side. At this time, the input terminals of the two switch modules in each part together form the input terminal of that part, and the output terminals of the two switch modules in each part together form the output terminal of that part.

[0231] In this embodiment, the first phase 41 is divided into a first phase first part 41a and a first phase second part 41b, the second phase 42 is divided into a second phase first part 42a and a second phase second part 42b, and the third phase 43 is divided into a third phase first part 43a and a third phase second part 43b. The first parts of the first phase 41, second phase 42, and third phase 43 are all located on the front mounting surface of their respective heat sinks 10, and the second parts of the first phase 41, second phase 42, and third phase 43 are all located on the rear mounting surface of their respective heat sinks 10. The input terminals of the first and second parts of each phase are located at the top, and the output terminals are located at the bottom. When installed on the heat sink 10, the input terminals of the first phase 41, second phase 42, and third phase 43 correspond to the upper edge of their respective heat sinks 10, and the output terminals correspond to the lower edge of their respective heat sinks 10.

[0232] Meanwhile, each single-phase switching transistor group 40 is connected to the capacitor busbar 50 via an input busbar 31, and each is connected to an output busbar 32. The input and output terminals of each phase of the three single-phase switching transistor groups 40 are located at the top and bottom, respectively. Therefore, an input busbar 31 can be set along the upper edge of each heat sink 10, corresponding to the single-phase switching transistor groups 40 of the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 31a, the second part 31b, and the third part 31c of the input busbar. At the same time, three output busbars 32 can be set along the lower edge of each heat sink 10, corresponding to the single-phase switching transistor groups 40 of the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 32a, the second part 32b, and the third part 32c of the output busbar.

[0233] Since each phase is divided into two parts located on the front mounting surface and the rear mounting surface of the heat sink 10, and the input row 31 and output row 32 of each phase need to be connected to each switch module in that phase at the same time, the input row 31 can be made to bypass the upper edge of the heat sink 10 to connect to the switch modules on the front and rear sides of the heat sink 10, and the output row 32 can be made to bypass the lower edge of the heat sink 10 to connect to the switch modules on the front and rear sides of the heat sink 10.

[0234] Reference Figure 11b The capacitor busbar 50 is located on the rear side of the heat sink 10. The three single-phase switch tube groups 40 are mounted on the front and rear mounting surfaces of their respective heat sinks 10, and the extension direction of the input busbar 31 is parallel to the plate surface of the capacitor busbar 50. In this way, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. The stray inductance is reduced, and the switching loss is reduced accordingly.

[0235] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. The input busbar 31 also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of their respective heat sinks 10, three input busbars 31 are needed to connect to the capacitor busbar 50. However, since the three single-phase switching transistor groups 40 are arranged side by side in the left-right direction, the distance between each single-phase switching transistor group 40 and the capacitor busbar 50 is equal. The current loop distance between the three single-phase switching transistor groups 40 and the capacitor busbar 50 is consistent, and regardless of the current direction of the capacitor busbar 50, the arrival time of each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance.

[0236] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located below the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0237] The power component provided in this embodiment, compared to embodiments 1 to 4, arranges the single-phase switching transistor groups 40 in parallel, ensuring a consistent current loop distance between the three single-phase switching transistor groups 40 and the capacitor bus 50. This improves the current loop balance from the capacitor bus 50 to each single-phase switching transistor group 40 and reduces stray inductance. Furthermore, compared to embodiment 7, by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, the volume of the heat sink 10 is further reduced, improving the surface space utilization of the heat sink 10 and also reducing the overall volume of the power component.

[0238] Example 9

[0239] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0240] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0241] The layout of the switching transistor 20 in the power component described above will be explained below.

[0242] As an alternative implementation, all three single-phase switching transistor groups 40 are mounted on a single heat sink 10. This effectively reduces the overall size of the power components by eliminating the need for multiple heat sinks 10 as described in the background section.

[0243] Furthermore, in the power module, each single-phase switching transistor group is arranged in parallel on the heat sink 10, and the arrangement direction of each single-phase switching transistor group is parallel to the connection part; in each single-phase switching transistor group, the arrangement direction of each switching module is consistent with the arrangement direction of each single-phase switching transistor group. In each single-phase switching transistor group 40, the arrangement direction of each switching module is parallel to the connection part of the capacitor busbar 50. In this way, it can be ensured that the distance from each switching module to the capacitor busbar 50 is equal in each single-phase switching transistor group 40, avoiding the problem of inconsistent commutation circuit lengths of switching modules at different positions in each single-phase switching transistor group 40.

[0244] Furthermore, the three single-phase switch modules 40 are divided into two parts and respectively mounted on two mounting surfaces of the heat sink 10. The switch modules on each mounting surface are arranged side-by-side in the left-right direction. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism between the mounting surfaces and the connecting portion can be interpreted as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner. This reduces the volume of the heat sink 10, further improving its space utilization and reducing the overall volume of the power components.

[0245] The following provides further explanation of the above content.

[0246] In each single-phase switch tube group 40, the output tube 22 of the switch module is located on the front mounting surface of the heat sink 10, and the input tube 21 of the switch module is located on the rear mounting surface of the heat sink 10. Corresponding to this layout, the above-mentioned "parallel arrangement" means that in each single-phase switch tube group 40, each output tube 22 is arranged in parallel along the left-right direction, and each input tube 21 is also arranged in parallel along the left-right direction.

[0247] Reference Figure 12a It shows the layout of the three single-phase switch groups 40 on the heat sink 10 in this embodiment, and shows the corresponding orientation. Meanwhile, referring to... Figure 12b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 12a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 12a The directions shown are for indication only. Figure 12a The direction of the front view in the image.

[0248] Reference Figure 12a In this embodiment, four switching modules form a single-phase switching transistor group 40, and the three single-phase switching transistor groups 40 are designated as a first phase 41, a second phase 42, and a third phase 43. Each of the first, second, and third phases 43 is divided into two parts: a first part 41a and a second part 41b of the first phase; a first part 42a and a second part 42b of the second phase; and a first part 43a and a second part 43b of the third phase. The first part of each phase corresponds to each input transistor 21 in the single-phase switching transistor group 40, and the second part of each phase corresponds to each output transistor 22 in the single-phase switching transistor group 40.

[0249] Reference Figure 12aIn each single-phase switch group 40, the input terminals of the four switch modules together form the input terminal of the single-phase switch group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch group 40. In each phase, the first part is located on the rear mounting surface of the heat sink 10, and the second part is located on the front mounting surface of the heat sink 10. The first part and the second part are connected by a connecting strip 33, which can be configured to bypass the lower edge of the heat sink 10.

[0250] Reference Figure 12a Each single-phase switching transistor group 40 is connected to the capacitor busbar 50 via an input busbar 31, and each is connected to an output busbar 32. The input and output terminals of each phase of the three single-phase switching transistor groups 40 are located at the top, so an input busbar 31 can be set along the upper edge of the heat sink 10. This input busbar 31 connects to all three single-phase switching transistor groups 40. At the same time, three output busbars 32 can be set along the upper edge of the heat sink 10, corresponding to the first phase 41, the second phase 42, and the third phase 43, respectively, which are the first part 32a, the second part 32b, and the third part 32c of the output busbar.

[0251] Reference Figure 12b The capacitor busbar 50 is located on the rear side of the heat sink 10. Three single-phase switch tube groups 40 are mounted on the front and rear mounting surfaces of the heat sink 10, and the extension direction of the input busbar 31 is parallel to the plate surface of the capacitor busbar 50. In this way, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. The stray inductance is reduced, and the switching loss is reduced accordingly.

[0252] Specifically, the first part 31a of the input busbar includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. The input busbar 31 also includes a positive plate, a neutral plate, and a negative plate, which are stacked and connected to the corresponding plates of the capacitor busbar 50. Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of the heat sink 10, only one input busbar 31 is needed to connect to the capacitor busbar 50. Therefore, the distance between each single-phase switching transistor group 40 and the capacitor busbar 50 is equal, and the current loop distance between the three single-phase switching transistor groups 40 and the capacitor busbar 50 is consistent. Regardless of the current direction of the capacitor busbar 50, the arrival time of each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance.

[0253] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located above the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0254] The power component provided in this embodiment, compared to embodiments 1 to 4, arranges the single-phase switching transistor groups 40 in parallel, ensuring a consistent current loop distance between the three single-phase switching transistor groups 40 and the capacitor bus 50. This improves the current loop balance from the capacitor bus 50 to each single-phase switching transistor group 40 and reduces stray inductance. Furthermore, compared to embodiment 7, by arranging the switching transistors 20 on the front and rear sides of the heat sink 10, the volume of the heat sink 10 is further reduced, improving the surface space utilization of the heat sink 10 and also reducing the overall volume of the power component.

[0255] Furthermore, in Embodiment 3, since the three single-phase switching transistor groups 40 are arranged parallel to each other in the vertical direction, one single-phase switching transistor group 40 must be located in the middle position. This causes the input and output pins of the single-phase switching transistor group 40 to occupy the surface space of the mounting surface of the heat sink 10, resulting in low surface space utilization of the heat sink 10 and the overall volume of the power component cannot be compressed to its limit. In this embodiment, the three single-phase switching transistor groups 40 are arranged side by side in the horizontal direction. Although this increases the length of the power component in the horizontal direction, the input and output pins do not occupy the surface space of the mounting surface of the heat sink 10. Therefore, the surface space utilization of the heat sink 10 is higher, and the overall volume of the heat sink 10 can be further reduced.

[0256] Furthermore, in this embodiment, the number of heat sinks 10 is one. However, in other embodiments, the number of heat sinks 10 can be set to three, arranged in a left-right direction. Each heat sink 10 is equipped with a complete single-phase switch tube group 40. The wiring method of the single-phase switch tube group 40 can refer to the wiring method of each single-phase switch tube group 40 in this embodiment. However, when using three heat sinks 10, the connecting bar 33 in each single-phase switch tube group 40 can directly bypass the upper or lower edge of the heat sink 10 it is located on. Using three heat sinks 10 reduces the heat dissipation capacity requirement of a single heat sink 10, which can reduce the cost of the heat sink 10. It also facilitates the wiring and maintenance of the single-phase switch tube group on each heat sink 10.

[0257] Example 10

[0258] This embodiment provides a power component, which mainly includes a heat sink 10, a capacitor module and a power module.

[0259] For an introduction to the heat sink 10, capacitor module and power module, please refer to Example 1.

[0260] The layout of the switching transistor 20 in the power component described above will be explained below.

[0261] As an optional implementation, the surface of the heat sink 10 forms two mounting surfaces parallel to the connecting portion for mounting each single-phase switch tube group. One mounting surface faces the connecting portion, and the other mounting surface faces away from the connecting portion. One input tube and one output tube in each switching module are mounted on the same mounting surface, and the other input tube is mounted on the other mounting surface. Thus, since multiple heat sinks 10 are not required as in the prior art, the overall size of the power component can be effectively reduced. In this embodiment, both mounting surfaces are parallel to the connecting portion. The parallelism of the mounting surfaces to the connecting portion can be considered as the flat heat sink 10 and the flat capacitor busbar 50 being arranged in a stacked manner.

[0262] Furthermore, in each single-phase switch group 40, the arrangement direction of each switch module is parallel to the connection part of the capacitor busbar 50. In this way, it can be ensured that the distance from each switch module to the capacitor busbar 50 is equal in each single-phase switch group 40, avoiding the problem of inconsistent commutation circuit lengths of switch modules at different positions in each single-phase switch group 40.

[0263] Furthermore, in each single-phase switch tube group, the input tubes or output tubes located on the same mounting surface are arranged side by side in the left-right direction, and the two input tubes and the output tubes in each switch module are connected by a connecting strip 33; the connecting strip 33 passes through the heat sink 10 to connect the input tubes and the output tubes located on their respective mounting surfaces.

[0264] Furthermore, each single-phase switch tube group is arranged side-by-side on the heat sink 10 in a left-right direction. In each switch module, the input and output tubes mounted on the same mounting surface are arranged vertically, and the two input tubes are corresponding in position. In each switch module, the input ends of the two input tubes point in the same direction and are connected to the same input bar. In each switch module, the input ends of the input tubes mounted on the same mounting surface and the output ends of the output tubes are opposite to each other.

[0265] The following provides further explanation of the above content.

[0266] Specifically, refer to Figure 13a It shows the layout of the three single-phase switch groups 40 on the heat sink 10, and shows the corresponding orientation. Meanwhile, referring to... Figure 13b It shows the layout in a side view and indicates the corresponding orientation. It should be noted that... Figure 13a The direction shown is the direction when viewed from the front of the heat sink 10, towards the front mounting surface of the heat sink 10. In other words, Figure 13a The directions shown are for indication only. Figure 13a The direction of the front view in the image.

[0267] Reference Figure 13aIn this embodiment, four switching modules form a single-phase switching transistor group 40, and the three single-phase switching transistor groups 40 are designated as first phase 41, second phase 42, and third phase 43. Each of the first, second, and third phases 43 is divided into two parts: first phase first part 41a and second phase 41b, second phase first part 42a and second phase second part 42b, and third phase first part 43a and second phase second part 43b. The first part of each phase corresponds to one input transistor 21 and one output transistor 22 of the single-phase switching transistor group 40, and the second part of each phase corresponds to the other input transistor 21 of the single-phase switching transistor group 40.

[0268] Reference Figure 13a In each single-phase switch tube group 40, the input terminals of the two input tubes 21 of the four switch modules together form the input terminal of the single-phase switch tube group 40, and the output terminals of the four switch modules together form the output terminal of the single-phase switch tube group.

[0269] Phase 41, Phase 42, and Phase 43 are arranged in a row along the left-right direction on the radiator 10. The first portion 41a of Phase 41 is located on the front mounting surface of the radiator 10, and the second portion 41b of Phase 41 is located on the rear mounting surface of the radiator 10. Similarly, the first portion 42a of Phase 42 is located on the front mounting surface of the radiator 10, and the second portion 42b of Phase 42a is located on the rear mounting surface of the radiator 10. Likewise, the first portion 43a of Phase 43a is located on the front mounting surface of the radiator 10, and the second portion 43b of Phase 43a is located on the rear mounting surface of the radiator 10. This arrangement leaves space below the rear mounting surface of the radiator 10 for mounting without the switching transistor 20, thus improving the heat dissipation efficiency of the radiator 10.

[0270] The input pipe 21 of the first phase first part 41a is located at the upper part of the front mounting surface of the radiator 10, and the output pipe 22 of the first phase first part 41a is located at the lower part of the front mounting surface of the radiator 10, and is located directly below its corresponding input pipe 21; the input pipe 21 of the first phase second part 41b is located at the upper part of the rear mounting surface of the radiator 10, and its position corresponds to the position of the input pipe 21 of the first phase first part 41a. The input tube 21 and output tube 22 of the first phase first part 41a are connected by a connecting bus 33; at the same time, the output tube 22 of the first phase first part 41a and the input tube 21 of the first phase second part 41b are also connected by a connecting bus 33. Since the output tube 22 of the first phase first part 41a and the input tube 21 of the first phase second part 41b are located on different mounting surfaces of the radiator 10, openings can be provided at corresponding positions on the radiator 10, and the connecting bus 33 can be passed through the openings to connect the output tube 22 of the first phase first part 41a and the input tube 21 of the first phase second part 41b.

[0271] Reference Figure 13a Each single-phase switch group 40 is connected to the capacitor busbar 50 via an input busbar 31, and each is connected to an output busbar 32. Since the input terminals of the first phase 41, the second phase 42, and the third phase 43 are all located at the top, corresponding to the upper edge of the heat sink 10, only one input busbar 31 is needed. (See also...) Figure 13b Since the two input tubes 21 in each phase are located on the front and rear mounting surfaces of the heat sink 10 respectively, the structure of the input row 31 in this embodiment is different from that in embodiments 1 to 9.

[0272] refer to Figure 13b The capacitor busbar 50 is located behind the heat sink 10, and the extension direction of the input busbar 31 is parallel to the surface of the capacitor busbar 50. Thus, in each single-phase switch tube group 40, the distance between each switch module and the capacitor busbar 50 connected through the input busbar 31 is equal, and the commutation circuit length of each switch module is also equal. Stray inductance is reduced, and switching losses are reduced accordingly. For input bus 31, it includes a positive plate, a neutral plate, and a negative plate. Taking the first phase 41 as an example, in this embodiment, the input tube 21 of the first part 41a of the first phase is connected to the positive plate and the neutral plate of input bus 31, and the input tube 21 of the second part 41b of the first phase is connected to the negative plate and the neutral plate of input bus 31. At this time, the positive plate and the neutral plate of input bus 31 need to be routed to the front of the heat sink 10 to connect with the input tube 21 of the first part 41a of the first phase. The positive plate and the neutral plate of input bus 31 can be stacked. The input tube 21 of the second part 41b of the first phase can be directly connected to the negative plate and the neutral plate of capacitor bus 50. Here, the input tube 21 of the second part 41b of the first phase can be connected to the negative plate and neutral plate of the capacitor busbar 50 through terminals or terminal blocks. These terminals and terminal blocks still belong to the input busbar 31, but they do not need to be stacked with the positive plate and neutral plate of the input busbar 31, thus reducing the manufacturing cost of the input busbar 31. At the same time, in this layout configuration, the commutation loop of the power module is shortened, and the overall stray inductance is lower. Even without stacking the three plates of the input busbar 31, the usage requirements can still be met.

[0273] Similarly, the input busbars 31 of the second phase 42 and the third phase 43 also adopt the above wiring method. At the same time, the first phase 41, the second phase 42, and the third phase 43 share the same input busbar 31. Since the input terminals of the three single-phase switching transistor groups 40 are all located on the upper edge of the heat sink 10, only one input busbar 31 is needed to connect to the capacitor busbar 50. Therefore, the distance between each single-phase switching transistor group 40 and the capacitor busbar 50 is equal, and the current loop distance between the three single-phase switching transistor groups 40 and the capacitor busbar 50 is consistent. Regardless of the current direction of the capacitor busbar 50, the arrival time of each single-phase switching transistor group 40 is also equal, thus achieving the best current loop balance.

[0274] The first part 32a, the second part 32b, and the third part 32c of the output bar are all located below the front mounting surface of the heat sink 10. Their concentrated distribution facilitates external output wiring.

[0275] The power component provided in this embodiment shortens the overall commutation loop of the three-level topology and reduces the generation of stray inductance by arranging the two input transistors 21 in the switching module on the front and rear sides of the heat sink 10 respectively; and arranges each single-phase switching transistor group 40 in parallel so that the current loop distance between the three single-phase switching transistor groups 40 and the capacitor bus 50 is consistent, thereby improving the current loop balance from the capacitor bus 50 to each single-phase switching transistor group 40.

[0276] Furthermore, compared to Embodiment 9, the power component provided in this embodiment also has the following advantages:

[0277] In Example 9, the switching modules are arranged side-by-side in the left-right direction, resulting in an excessively long power module in this direction. This not only poses challenges in practical implementation but also affects the heat sink 10. Since the heat sink 10 uses liquid cooling, it requires internal coolant flow. If coolant is introduced at the left or right end of the heat sink 10, the other end will be too far from the coolant inlet, leading to a decrease in temperature uniformity at different locations. Conversely, if coolant is introduced at the top or bottom of the heat sink 10, the coolant piping will interfere with the input port 31 or output port 32 of the power module.

[0278] In this embodiment, in each switching module, an input tube and an output tube are arranged vertically on the mounting surface, and the switching modules are arranged side by side in the left-right direction. This shortens the size of the power module in the left-right direction and increases the size of the power module in the up-down direction. This makes the size of the power module more balanced in the left-right and up-down directions. In addition to the advantage of being easy to implement, the heat sink 10 can also be supplied with coolant at the left or right end. Since the size in the left-right direction is shortened, the coolant can be better released at all positions of the heat sink 10, and the overall temperature uniformity of the heat sink 10 is better.

[0279] Furthermore, in the case that there are three switching transistors 20 in the switching module, in this embodiment, a spare part is left at the lower position of the mounting surface on the rear side. When actually designing the coolant flow channel, the upper part of the radiator 10 can be designed as the coolant inlet channel, while the lower part can be designed as the coolant return channel. The coolant temperature in the coolant inlet channel is lower, which can improve the cooling efficiency of the input pipe 21 with higher temperature release. The coolant temperature in the coolant return channel is higher, which will not affect the cooling effect of the output pipe 22 with lower temperature release.

[0280] Example 11

[0281] This embodiment is a further refinement of embodiment 10. In this embodiment, the same layout as the single-phase switch tube group 40 in embodiment 10 is adopted. The only difference is that each single-phase switch tube group 40 in this embodiment consists of three switch modules.

[0282] The power component provided in this embodiment will be further described below.

[0283] Reference Figure 14 It shows the structure of the heat sink 10, switching transistor 20, input bus 31, output bus 32, capacitor bus 50 and connection bus 33 in the power component provided in this embodiment.

[0284] Reference Figure 15 and Figure 16 In the power component provided in this embodiment, a single-phase switch tube group 40 is composed of three switch modules, and there are a total of nine switch modules forming three single-phase switch tube groups 40. Each single-phase switch tube group 40 outputs single-phase AC power through a corresponding output bus 32, and the three work together to output three-phase AC power. Among the three switch modules in each single-phase switch tube group 40, two input tubes 21 are located on the front and rear mounting surfaces of the heat sink 10, respectively, and are located at the upper part of the heat sink 10. Its output tube 22 is located on the front mounting surface of the heat sink 10 and is located at the lower part of the heat sink 10. The input tube 21 and the output tube 22 located on the front mounting surface of the heat sink 10 are connected by a connecting bus 33. The input tube 21 located on the rear mounting surface of the heat sink 10 and the output tube 22 located on the front mounting surface of the heat sink 10 are connected by another connecting bus 33. The connecting bus 33 passes through an opening provided on the heat sink 10 to connect the front and rear sides of the heat sink 10.

[0285] Reference Figure 17 In the power component provided in this embodiment, the capacitor busbar 50 includes three plates: a positive plate 51, a neutral plate 52, and a negative plate 53. Figure 17As shown, the three plates, from back to front, are capacitor busbar positive plate 51, capacitor busbar center plate 52, and capacitor busbar negative plate 53, which are stacked together, with the capacitor busbar negative plate 53 being the closest to the heat sink 10.

[0286] The input busbar 31 also comprises three parts: the input busbar positive plate 311, the input busbar neutral plate 312, and the input busbar terminal block 313. In this embodiment, the terminals of the input tube 21 located on the front mounting surface of the heat sink 10 are adapted to connect with the capacitor busbar positive plate 51 and the capacitor busbar neutral plate 52. Therefore, one end of the input busbar positive plate 311 and the input busbar neutral plate 312 are connected to the capacitor busbar positive plate 51 and the capacitor busbar neutral plate 52, and the other end extends to the front of the heat sink 10 and connects to the input tube 21 in each switching module. Meanwhile, the terminals of the input tube 21 located on the rear mounting surface of the heat sink 10 are suitable for connection to the capacitor busbar neutral plate 52 and the capacitor busbar negative plate 53. Since there is no heat sink 10 between the capacitor busbar 50 and the input tube 21, the negative terminal of the input tube 21 can be directly connected to the capacitor busbar negative plate 53 using the input busbar terminal 313, and the neutral terminal of the input tube 21 can be connected to the capacitor busbar neutral plate 52.

[0287] The connecting bar 33 includes two parts: a first part 331 and a second part 332. The first part 331 connects the input pipe 21 and the output pipe 22 located on the front mounting surface of the radiator 10, and the second part 332 connects the input pipe 21 located on the rear mounting surface of the radiator 10 and the output pipe 22 located on the front mounting surface of the radiator 10.

[0288] In this embodiment, the heat sink 10 is a liquid-cooled heat sink, which can effectively meet the heat dissipation requirements of the switching transistor 20.

[0289] Compared with embodiments 1-9, the power component provided in this embodiment can not only reduce the overall volume of the heat sink 10, but also keep the length and width of the heat sink 10 within an appropriate range, which is conducive to the practical application of the power component. Furthermore, the positions of the input and output terminals of each switching transistor 20 are reasonably arranged, stray inductance is effectively reduced, and it also has better current loop balance.

[0290] Example 12

[0291] Example 12 is based on Example 10, the difference being that in Example 12:

[0292] In each switch module, the input and output tubes mounted on the same mounting surface are arranged vertically, and the two input tubes are staggered in position. In each switch module, the input ends of the two input tubes are opposite to each other. In each switch module, the input ends of the input tubes mounted on the same mounting surface and the output ends of the output tubes are opposite to each other.

[0293] Reference Figure 18a and Figure 18b One input pipe 21 is installed on the upper part of the front mounting surface of the heat sink 10, with its input end located on the upper side; the other input pipe 21 is installed on the lower part of the rear mounting surface of the heat sink 10, with its input end located on the lower side. The connection between the input pipe 21 on the front mounting surface and the input bus 31 can be referred to in Embodiment 10. The input pipe 21 on the rear mounting surface can be directly connected to the connection part of the capacitor bus 50 through a terminal block, as can be referred to in Embodiment 11.

[0294] Example 13

[0295] Reference Figure 19 This embodiment is based on embodiment 10. The difference between the two is that in embodiment 13, the mounting surface and the connecting part formed by the heat sink 10 have a certain angle, and of the two mounting surfaces formed, one mounting surface faces upward relative to the capacitor busbar 50, and the other mounting surface faces downward relative to the capacitor busbar 50.

[0296] Specifically, the mounting surface formed by the heat sink 10 is perpendicular to the connection portion of the capacitor bus 50, with one mounting surface facing upwards and the other facing downwards. Compared to Embodiment 10, with reference to the description in Embodiment 11, the input tube 21 can be directly connected to the capacitor bus via a terminal block, eliminating the need for copper busbars, etc., resulting in simpler wiring. Furthermore, in the same switching module, the distances of the two input tubes 21 from the capacitor bus 50 are consistent, and the distance is shorter under the same conditions compared to Embodiment 10, which also better reduces stray inductance.

[0297] It should be understood that this layout is also applicable to embodiments 1-9 above, and only adaptive modifications are needed for each embodiment. However, in order to improve the actual use effect of this layout, it is preferable to use a technical solution where the input bus 31 is located at the edge of the heat sink 10 and the three single-phase switching transistor groups 40 are connected to the same input bus 31 as the basis for improvement. Since the input bus 31 is located at the edge, it can be directly connected to the capacitor bus 50, reducing the length of the commutation circuit and thus reducing stray inductance.

[0298] Example 14

[0299] This embodiment provides a converter, which includes a converter housing, and the power component of any one of Embodiments 1 to 13 is installed inside the converter housing.

[0300] The heat sink 10 of the liquid-cooled converter is a liquid-cooled heat sink.

[0301] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this invention, but does not constitute a limitation on the scope of protection of this invention. Modifications, equivalent substitutions, or other improvements to the embodiments of this invention or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this invention or the foregoing embodiments, in conjunction with common knowledge, general technical knowledge, and / or existing technology, should all be included within the scope of protection of this invention.

Claims

1. A power assembly comprising: a capacitor module comprising DC capacitor banks and a capacitor busbar (50) connected to each other; the capacitor busbar (50) having a connection part; a power module comprising an input busbar (31), an output busbar (32) and three single-phase switching tube groups (40); each of the single-phase switching tube groups (40) comprises a plurality of switching modules and is connected to the input busbar (31) and the output busbar (32); the input busbar (31) is connected to the connection part; the output busbar (32) is used for outputting electric energy; characterized in that it further comprises: at least one heat sink (10) formed with mounting surfaces for mounting the single-phase switching tube groups (40), the mounting surfaces being parallel to the connection part; each of the switching modules comprises a plurality of switching tubes (20) which are classified into input tubes (21) and output tubes (22) according to types; in each of the single-phase switching tube groups (40), the input tubes (21) and the output tubes (22) of the switching modules are respectively arranged side by side in left-right direction. each of the switching modules comprises two input tubes (21) and one output tube (22), the two input tubes (21) being located on different mounting surfaces, and the output tube (22) being located on the same mounting surface as one of the input tubes (21).

2. A power pack as claimed in claim 1, characterised in that, the mounting surfaces are formed on the side surfaces of the heat sink (10) facing away from the capacitor busbar (50); and the single-phase switching tube groups (40) are mounted on the mounting surfaces.

3. A power pack as claimed in claim 1, characterised in that, the mounting surfaces are formed on the side surfaces of the heat sink (10) facing the capacitor busbar (50); and the single-phase switching tube groups (40) are mounted on the mounting surfaces.

4. A power pack as claimed in claim 1, characterized in that the mounting surfaces are formed on both side surfaces of the heat sink (10) facing and facing away from the capacitor busbar (50); and all the single-phase switching tube groups (40) are divided into two parts and are mounted on the two mounting surfaces respectively.

5. A power pack as claimed in any one of claims 1 to 4, wherein each of the power sources is a battery. the single-phase switching tube groups (40) are arranged side by side on the heat sink (10); and in each of the single-phase switching tube groups (40), the arrangement direction of the switching modules is consistent with the arrangement direction of the single-phase switching tube groups (40).

6. A power pack as claimed in claim 5, characterised in that the number of the heat sink (10) is one.

7. A power pack as claimed in claim 4, wherein each of the power supplies is a battery. in each of the single-phase switching tube groups (40), the input tubes (21) of the switching modules are located on different mounting surfaces from the output tubes (22) of the switching modules.

8. A liquid-cooled current transformer characterized by, the power assembly according to any one of claims 1-7, wherein the heat sink (10) is a liquid cooling heat sink.

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