Wafer supply device and component transfer device

Abstract

In the wafer supply device (6), a device main body (91) has a first opening portion (911A) that opens toward the wafer table (10) side and a second opening portion (912A) that opens toward the opposite side of the wafer table (10). A moving mechanism (96) moves a tray housing body (95) between a first position that allows movement of a tray (8) between the tray housing body (95) and the wafer table (10) via the first opening portion (911A) and a second position that allows exchange of the tray (8) housed in the tray housing body (95) via the second opening portion (912A). An opening and closing plate (97) is movable in conjunction with movement of the tray housing body (95) based on the moving mechanism (96). The opening and closing plate (97) entirely opens the first opening portion (911A) in a state in which the tray housing body (95) is disposed at the first position, and entirely closes the first opening portion (911A) in a state in which the tray housing body (95) is disposed at the second position.

Description

Technical Field

[0001] The present invention relates to a wafer supply apparatus for supplying wafers divided into multiple components, and a component transfer apparatus having the wafer supply apparatus. Background Technology

[0002] As a component mounting apparatus for mounting components onto a substrate, there are known devices that include a component supply device that supplies components while they are held on a tray to a designated component removal position. For example, such a component supply device is disclosed in Patent Document 1.

[0003] Patent Document 1 discloses a component supply device comprising: a pallet housing (hopper) housing a pallet on which a tray containing multiple components is mounted; and an elevator mechanism for moving the pallet housing vertically. The elevator mechanism moves the pallet housing vertically between a first position and a second position, the first position being at the same height as the component removal position, and the second position being a position for exchanging used pallets. When the pallet housing is positioned in the first position, the pallet is supplied from the pallet housing to the component removal position. Conversely, when the pallet housing is positioned in the second position, the used pallet is removed from the pallet housing and exchanged for a new pallet.

[0004] In a component supply device, when the tray housing is positioned in the second position, it is necessary to restrict access to the component removal operation position via the tray housing. In the component supply device disclosed in Patent Document 1, multiple insertion prevention members are installed in the tray housing at specified intervals that allow the tray to pass through. Based on the multiple insertion prevention members installed in the tray housing, access to the component removal operation position via the tray housing can be restricted.

[0005] Furthermore, wafer supply devices exist as a type of component supply device. A wafer supply device is a device that supplies wafers, which have been divided into multiple components, either in this state or in a state held on a tray. In this wafer supply device, when supplying wafers in the state held on a tray, a thicker tray is typically used. When the insertion prevention member disclosed in Patent Document 1 is applied to the wafer supply device, the spacing between adjacent insertion prevention members increases with the increase in the thickness of the tray. In this case, when the tray housing (wafer housing) housing the wafer in the held-on-tray state is positioned in the second position, it may be impossible to properly restrict access to the component removal operation position via the wafer housing.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Publication No. 4322863 Summary of the Invention

[0009] The object of the present invention is to provide a wafer supply device capable of appropriately restricting access to the component removal operation position via a wafer housing, and a component transfer device having the wafer supply device.

[0010] One aspect of the present invention relates to a wafer supply apparatus for supplying wafers divided into multiple components to a designated component removal operation position. The wafer supply apparatus includes: an apparatus body comprising a first skeleton plate and a second skeleton plate, the first skeleton plate forming a first opening toward the component removal operation position, and the second skeleton plate forming a second opening toward the opposite side of the component removal operation position; the apparatus body defining an internal space between the first skeleton plate and the second skeleton plate communicating with the first and second openings; a wafer housing configured to accommodate the wafer and disposed within the internal space; and a moving mechanism that moves the wafer housing in a first moving direction from the first position to the second position between a first position and a second position, and moves the wafer housing in a direction from... The second position moves in a second direction toward the first position. The first position is a position that allows the wafer to move between the wafer housing and the component removal position via the first opening. The second position is a position that allows the wafer housed in the wafer housing to be exchanged via the second opening. An opening / closing plate is provided within the internal space in a manner that allows movement in conjunction with the movement of the wafer housing based on the moving mechanism. When the wafer housing is positioned in the first position, the first opening is completely opened, and when the wafer housing is positioned in the second position, the first opening is completely closed.

[0011] Another aspect of the present invention relates to a component transfer apparatus comprising: the aforementioned wafer supply apparatus, which supplies a wafer divided into a plurality of components to a designated component removal operation position; and a component transfer unit, which removes the components from the wafer supplied to the component removal operation position and transfers them to a designated component transfer section.

[0012] The objectives, features, and advantages of the present invention will become clearer from the following detailed description and accompanying drawings. Attached Figure Description

[0013] Figure 1 This is a top plan view showing the overall configuration of the component mounting device according to an embodiment of the present invention.

[0014] Figure 2 This is a schematic three-dimensional diagram showing the head unit and the push-up unit.

[0015] Figure 3 This is a 3D view of the wafer storage elevator of the wafer supply unit, as seen from the +Y side.

[0016] Figure 4 This is a three-dimensional view of the wafer storage elevator of the wafer supply unit, as seen from the -Y side.

[0017] Figure 5 This is a 3D view of the wafer storage elevator of the wafer supply unit, observed from the +Y side with the skeleton plate removed.

[0018] Figure 6 This is a 3D view of the wafer storage elevator of the wafer supply unit, observed from the -Y side with the skeleton plate removed.

[0019] Figure 7 It is a three-dimensional view of the tray housing and a diagram showing the locking bolt member in a position where its movement is restricted.

[0020] Figure 8 It is a three-dimensional view of the tray housing and a diagram showing the state in which the locking bolt member is in a movable posture.

[0021] Figure 9 This is a block diagram representing the control structure of a wafer supply device.

[0022] Figure 10 It is a diagram used to illustrate the tray supply and recycling process based on the wafer supply device and is a diagram showing the state in which the tray housing is configured in position 1.

[0023] Figure 11 This is a diagram used to illustrate the tray supply and recycling process based on a wafer supply device, and it shows the state in which the tray housing is configured in position 2.

[0024] Figure 12 This diagram illustrates the tray supply and recycling process based on a wafer supply device and shows the door in an open state.

[0025] Figure 13 It is a diagram used to illustrate the tray supply and recycling process based on the wafer supply device and is a diagram showing the state of the tray container moving to the first position.

[0026] Figure 14 This is a flowchart of the tray supply and recycling process based on the wafer supply device.

[0027] Figure 15 This is a diagram showing a first modified example of a wafer supply device.

[0028] Figure 16 This is a diagram showing a second variation of the wafer supply device. Detailed Implementation

[0029] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Hereinafter, the directional relationships will be explained using the XYZ orthogonal coordinate axes. The X and Y directions are mutually orthogonal directions on a horizontal plane, and the Z direction is a direction extending along a vertical line orthogonal to both the X and Y directions. Furthermore, the side opposite to the X direction is called the "+X side," and the side opposite to the X direction is called the "-X side." Similarly, the side opposite to the Y direction is called the "+Y side," and the side opposite to the Y direction is called the "-Y side." Furthermore, the side opposite to the Z direction, i.e., the upper side, is called the "+Z side," and the side opposite to the Z direction, i.e., the lower side, is called the "-Z side."

[0030] The component transfer apparatus equipped with the wafer supply device according to the present invention can be applied to various devices such as a tape and reel device for receiving, for example, bare dies diced from a wafer in a tape, a die bonding machine for connecting the bare dies to a substrate, or a component mounting apparatus for mounting the bare dies to a substrate. Here, an example of the component transfer apparatus of the present invention being applied to a component mounting apparatus will be described.

[0031] [Overall Structure of the Component Mounting Device]

[0032] like Figure 1 As shown, the component mounting apparatus 1 in this embodiment is an apparatus for mounting bare dies 7a (components) cut from wafer 7 onto substrate P (a designated component transfer section). Figure 1 and Figure 2 As shown, the component mounting device 1 includes a base 2, a conveyor 3, a head unit 4 (component transfer unit), a component supply unit 5, a wafer supply device 6, a camera unit 32U, and a push-up unit 40.

[0033] The base 2 is a mounting platform for various devices included in the component mounting apparatus 1. The conveyor 3 is a transport line for the substrate P, extending along the X direction on the base 2. The conveyor 3 moves the substrate P from outside the machine to a designated mounting position, and after mounting, moves the substrate P out of the machine from the mounting position. The conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting position. Furthermore, Figure 1 The position of substrate P is indicated in the diagram as the mounting position. The component supply unit 5 supplies multiple bare dies 7a in a configuration state after being cut from wafer 7.

[0034] The head unit 4 picks up a bare die 7a from the wafer 7 at the component supply section 5, moves it to the aforementioned mounting position, and mounts the bare die 7a onto the substrate P. The head unit 4 has multiple heads 4H that hold the bare die 7a during pickup and release it during mounting. The heads 4H are capable of forward / backward (lifting / lowering) movement relative to the head unit 4 in the Z direction and rotational movement about an axis. A substrate recognition camera 31 is mounted in the head unit 4 to capture images of the substrate P. Reference marks affixed to the substrate P are identified based on the images captured by the substrate recognition camera 31. This allows for the identification of positional offsets on the substrate P, and correction of these offsets is performed during component mounting.

[0035] The component mounting device 1 includes a first drive mechanism D1 capable of moving the head unit 4 horizontally (in both the X and Y directions) in the space above the component supply section 5 and the substrate P held in the mounting position. The first drive mechanism D1 includes a pair of Y-axis fixed guide rails 13 on the +X and -X sides respectively, a first Y-axis servo motor 14, and a ball screw shaft 15, serving as the Y-direction movement mechanism for the head unit 4. The pair of Y-axis fixed guide rails 13 are fixed to the base 2 and extend parallel to each other in the Y direction at a specified interval in the X direction. The ball screw shaft 15 is arranged in a position close to the Y-axis fixed guide rails 13, extending in the Y direction. The first Y-axis servo motor 14 drives the ball screw shaft 15 to rotate. A support beam 16 supporting the head unit 4 is provided between the pair of Y-axis fixed guide rails 13. Nuts 17, screwed to each ball screw shaft 15, are assembled at the +X and -X sides of the support beam 16.

[0036] The first drive mechanism D1 includes a guide (not shown) mounted on the support beam 16, a first X-axis servo motor 18, and a ball screw shaft 19, serving as a movement mechanism for the head unit 4 in the X direction. The guide, which guides the movement of the head unit 4 in the X direction, is fixed on the +Y side of the support beam 16 in a manner extending along the X direction. The ball screw shaft 19 is positioned close to the guide and extends along the X direction. The first X-axis servo motor 18 drives the ball screw shaft 19 to rotate. A nut (not shown) is attached to the head unit 4 and screwed onto the ball screw shaft 19.

[0037] According to the first drive mechanism D1 with the above configuration, the ball screw shaft 15 is driven to rotate based on the operation of the first Y-axis servo motor 14, thereby moving the head unit 4 integrally with the support beam 16 in the Y direction. In addition, the ball screw shaft 19 is driven to rotate based on the operation of the first X-axis servo motor 18, thereby moving the head unit 4 relative to the support beam 16 in the X direction.

[0038] The component supply unit 5 includes a wafer supply device 6 that supplies wafers 7, which have been divided into multiple dies 7a, to a designated component removal position (wafer stage 10). In this embodiment, the wafer supply device 6 supplies wafers 7 to the wafer stage 10 while they are held on a tray 8. The wafer 7 is a disk-shaped semiconductor wafer with circuit patterns formed on it. The tray 8 holds a wafer board 8a. A collection of multiple dies 7a, 7a... formed by cutting the wafer 7 into a checkerboard pattern is attached to the wafer board 8a. In other words, the wafer supply device 6 supplies wafers 7 with multiple dies 7a attached to the wafer board 8a to the wafer stage 10 while they are held on the tray 8. Details about the wafer supply device 6 will be described later. In addition to the wafer supply device 6, the component supply unit 5 may also include a tape feeder that supplies components in the form of a component receiving tape containing electronic components.

[0039] The camera unit 32U is a unit capable of moving in both the X and Y directions, and includes a wafer camera 32. The wafer camera 32 captures images of a portion of the wafer 7 positioned on the wafer stage 10, specifically the die 7a within the camera's field of view. Based on this image, the position of the die 7a to be picked up is identified. The component mounting device 1 includes a second drive mechanism D2 capable of moving the camera unit 32U at least in the space above the component supply unit 5 and a designated standby position along the horizontal direction (X and Y directions). This second drive mechanism D2 is an independent drive system, distinct from the first drive mechanism D1 of the drive head unit 4. Furthermore, in this embodiment, the standby position is a position offset from the wafer stage 10 towards the +Y side by a distance.

[0040] The second drive mechanism D2 includes a pair of Y-axis fixed guide rails 33 on the +X and -X sides, a second Y-axis servo motor 34 disposed on the +X side, and a ball screw shaft 35, serving as a movement mechanism for the camera unit 32U in the Y direction. The pair of Y-axis fixed guide rails 33 are fixed to the base 2 and extend parallel to each other along the Y direction at specified intervals in the X direction. The ball screw shaft 35 is disposed at a position close to the Y-axis fixed guide rails 33 on the +X side, extending along the Y direction. The second Y-axis servo motor 34 drives the ball screw shaft 35 to rotate. A support beam 36 supporting the camera unit 32U is mounted between the pair of Y-axis fixed guide rails 33. A nut 37, screwed onto the ball screw shaft 35, is assembled at the +X side end of the support beam 36.

[0041] The second drive mechanism D2 includes a guide (not shown) mounted on the support beam 36, a second X-axis servo motor 38, and a ball screw shaft 39, serving as a movement mechanism for the camera unit 32U in the X direction. The guide, which guides the movement of the camera unit 32U in the X direction, is fixed on the -Y side of the support beam 36 in a manner extending along the X direction. The ball screw shaft 39 is positioned close to the guide and extends along the X direction. The second X-axis servo motor 38 drives the ball screw shaft 39 to rotate. A nut (not shown) is attached to the camera unit 32U and screwed onto the ball screw shaft 39.

[0042] According to the second drive mechanism D2 with the above configuration, the ball screw shaft 35 is driven to rotate based on the operation of the second Y-axis servo motor 34, thereby moving the camera unit 32U and the support beam 36 together in the Y direction. In addition, the ball screw shaft 39 is driven to rotate based on the operation of the second X-axis servo motor 38, thereby moving the camera unit 32U relative to the support beam 36 in the X direction.

[0043] The push-up unit 40 is positioned below the component supply section 5 and pushes the die 7a to be held by the head unit 4 from the underside of the wafer plate 8a. The push-up unit 40 is movably positioned on the base 2 in the XY direction to a degree corresponding to the wafer stage 10. The push-up unit 40 is movably supported in the X direction by a support beam 42, which is movable along a pair of guide rails 41 extending in the Y direction.

[0044] A ball screw shaft 43, screwed into a nut portion (not shown) located inside the support beam 42, is driven to rotate by a third Y-axis servo motor 44. Thus, the push-up unit 40 moves integrally with the support beam 42 in the Y direction. Furthermore, a ball screw shaft 45, screwed into a nut portion (not shown) located inside the push-up unit 40, is provided in the support beam 42. Driven to rotate by a third X-axis servo motor 46, the push-up unit 40 moves in the X-axis direction. The push-up unit 40 has an upper pusher 47 that pushes up the die 7a. When the die 7a is picked up at the head 4H, the upper pusher 47 rises and pushes the die 7a through the wafer plate 8a. The upper pusher 47 is driven to rise and fall by a pin lifting motor.

[0045] A component recognition camera 30 is mounted on the base 2. Before mounting the substrate P, the component recognition camera 30 takes a picture from below of the bare die 7a adsorbed by the head 4H of the head unit 4. Based on the image, it is determined whether the head 4H is adsorbing the bare die 7a abnormally or by mistake.

[0046] [Detailed Composition of Wafer Supply Equipment]

[0047] Apart from Figure 1In addition, refer to Figures 3 to 8 The configuration of the wafer supply apparatus 6 will be described in detail below. The wafer supply apparatus 6 includes a wafer receiving elevator 9, a wafer stage 10, and a wafer conveyor 11. The wafer receiving elevator 9 stores wafer boards 8a with multiple dies 7a attached to them in multiple layers in the Z direction, holding them on a tray 8. The wafer stage 10 is positioned on the base 2 at the -Y side of the wafer receiving elevator 9. The wafer stage 10 is arranged side-by-side on the +Y side relative to the mounting operation position, which is the stopping position of the substrate P. In this embodiment, the wafer stage 10, which is the area on the base 2 where wafers 7 cut into multiple dies 7a are disposed, becomes the component removal operation position for the tray 8 supplied by the wafer supply apparatus 6. The wafer conveyor 11 leads the tray 8 from the wafer receiving elevator 9 to the wafer stage 10, or returns the tray 8 on the wafer stage 10 to the wafer receiving elevator 9.

[0048] The wafer storage elevator 9 is configured to supply a tray 8 holding a wafer board 8a with a wafer 7 attached to it to a wafer stage 10 and is configured to be able to retrieve the used tray 8 from the wafer stage 10. The wafer storage elevator 9 includes a device body 91, a tray receiving body 95 (wafer receiving body), a moving mechanism 96, and an opening and closing plate 97.

[0049] The main body 91 of the device has a frame structure defining an internal space 917, in which a tray receiving body 95, a moving mechanism 96, and an opening / closing plate 97 are arranged. The main body 91 includes: a first frame plate 911 and a second frame plate 912 arranged facing each other in the Y direction; a pair of third frame plates 913 arranged facing each other in the X direction; and a fourth frame plate 914 and a fifth frame plate 915 arranged facing each other in the Z direction. The main body 91 defines the internal space 917 as the space surrounded by the aforementioned frame plates.

[0050] The first skeleton plate 911 forms the wall surface of the -Y side of the device body 91. A first opening 911A is formed on the first skeleton plate 911, opening towards the wafer stage 10, i.e., the -Y side. For example... Figure 4 As shown, the first opening 911A has a shape that allows a tray 8 holding a wafer 7 to pass through. Specifically, the length of the first opening 911A in the X direction is set to be slightly larger than the length of the tray 8 in the X direction, and the length of the first opening 911A in the Z direction is set to be slightly larger than the length of the tray 8 in the Z direction. The first opening 911A is formed at the same height position as the wafer stage 10 in the Z direction.

[0051] The second skeleton plate 912 forms the wall surface of the +Y side of the device body 91. A second opening 912A is formed on the second skeleton plate 912, opening onto the opposite side (i.e., the +Y side) towards the wafer stage 10. For example... Figure 3 As shown, the second opening 912A has a shape that allows the tray housing 95, described later, to be fully exposed within the internal space 917. Specifically, the length of the second opening 912A in the X direction is set to be greater than the length of the tray housing 95 in the X direction, and the length of the second opening 912A in the Z direction is set to be greater than the length of the tray housing 95 in the Z direction. The opening area of ​​the second opening 912A is greater than the opening area of ​​the first opening 911A.

[0052] In the main body 91 of the device, an internal space 917 defined between the first frame plate 911 and the second frame plate 912 communicates with the first opening 911A and the second opening 912A. Furthermore, the first opening 911A and the second opening 912A are formed such that they do not overlap when viewed from a Y direction orthogonal to the Z direction, which is the movement direction of the tray housing 95 within the internal space 917. The first opening 911A is formed on the -Z side relative to the second opening 912A in the Z direction.

[0053] A pair of third frame plates 913 respectively form the walls on the +X and -X sides of the main body 91 of the device. A fourth frame plate 914 forms the wall on the +Z side of the main body 91 of the device. A fifth frame plate 915 forms the wall on the -Z side of the main body 91 of the device.

[0054] In addition, such as Figure 3 As shown, the main body 91 of the device also includes a door 916 for opening and closing the second opening 912A. The door 916 opens and closes the second opening 912A by swinging about a swing axis extending in the Z direction at the end of the second frame plate 912 on the -X side.

[0055] In addition, such as Figure 5 and Figure 6 As shown, a housing support structure 92 is provided at the end region of the fifth frame plate 915 on the +X side of the device body 91. The housing support structure 92 is a structure for supporting the tray housing 95 in a manner that allows it to move in the Z direction within the internal space 917. The housing support structure 92 has a pair of guide rail members 921 that are spaced apart from each other in the Y direction and extend in the Z direction. The pair of guide rail members 921 movably supports the tray housing 95. The tray housing 95 can move in the Z direction by moving along the pair of guide rail members 921 while being supported by them.

[0056] In addition, such as Figure 3As shown, a door switch 94A is provided in the region on the +Y side of the fourth frame plate 914. Furthermore, a door locking mechanism 93 and a door detection mechanism 94B are provided on the end face of the +Y side of the third frame plate 913 on the +X side of the pair of third frame plates 913.

[0057] Door switch 94A is a switch that receives requests to open or close door 916. Upon receiving a request to open door 916, door switch 94A outputs a door opening request signal SA1 (described later). Figure 11 On the other hand, when door 916 is closed, a door closing signal SA2 (described later) is output. Figure 13 ).

[0058] The door locking mechanism 93 is used to maintain the door body 916 in a closed state at the second opening 912A. The door detection mechanism 94B is used to detect when the door body 916 is opened due to the release of the closed state maintained by the door locking mechanism 93. When the door detection mechanism 94B detects that the door body 916 has been opened, it outputs a door opening detection signal SC (described later). Figure 12 ).

[0059] The tray housing 95 is a wafer housing that houses multiple wafers 7 held on the tray 8 arranged in the Z direction. In other words, the tray housing 95 houses the tray 8 holding the wafers 7. The tray housing 95 is movably supported in the Z direction within the internal space 917 of the device body 91 based on a pair of guide rail members 921 of the housing support structure 92 (see reference). Figure 5 and Figure 6 ).like Figure 7 and Figure 8 As shown, the pallet housing 95 includes a hopper frame 951, a locking member 952, and a locking opening and closing mechanism 953.

[0060] The hopper rack 951 is a box-shaped structure with openings at both ends in the Y direction, forming a housing body for accommodating trays 8 holding wafers 7. Multiple support portions 9511 arranged in the Z direction are provided on both sides of the hopper rack 951 in the X direction, supporting the trays 8 movable in the Y direction. Furthermore, the wafers 7 held by each tray 8 supported by the multiple support portions 9511 are of the same type. That is, the multiple trays 8 housed in the hopper rack 951 each hold wafers 7 having the same type of bare die 7a. In this embodiment, the hopper rack 951 is configured within the internal space 917 of the device body 91 and forms a designated gap GP between itself and the first frame plate 911. Figure 6 ).

[0061] The locking member 952 is a rod-shaped member that protrudes towards the first skeleton plate 911 side relative to the hopper rack 951 within the gap GP and extends along the Z direction. The locking member 952 is an example of a wafer movement control member. The locking member 952 is respectively provided at its ends on the first skeleton plate 911 side (-Y side) and the +X and -X sides in the X direction of the hopper rack 951. The locking member 952 is capable of oscillating about a locking swing axis 9521 extending along the Z direction. The locking swing axis 9521 is respectively provided at its ends on the -Y and +X sides and the -Y and -X sides of the hopper rack 951. Based on oscillation about the locking swing axis 9521, the locking member 952 is capable of performing movement restriction postures (…). Figure 7 (posture) and movement-allowed posture ( Figure 8 The movement restriction posture restricts the movement of the pallet 8, which holds the wafer 7 in a certain state, from the hopper rack 951 toward the first skeleton plate to the 911 side (-Y side), and the movement permission posture allows the movement.

[0062] The bolt opening and closing mechanism 953 is disposed on the upper side of the +Z side in the hopper frame 951. The bolt opening and closing mechanism 953 is a mechanism based on swinging the bolt member 952 about the bolt swing axis 9521, thereby changing the posture of the bolt member 952 between the movement restriction posture and the movement permission posture.

[0063] like Figure 6 As shown, a pallet detection mechanism 94C is mounted on the main body 91 of the device. The pallet detection mechanism 94C is an example of a wafer inspection mechanism used to detect the movement of a pallet 8, which holds a wafer 7, from the hopper rack 951 towards the first stencil plate 911 (-Y side). The pallet detection mechanism 94C includes a light-emitting part 94C2 and a light-receiving part 94C3. The light-emitting part 94C2 and the light-receiving part 94C3 are arranged facing each other along a light path 94C1 extending in the Z direction (the moving direction of the pallet housing 95) within the gap GP formed between the hopper rack 951 and the first stencil plate 911. The pallet detection mechanism 94C detects the movement of the pallet 8 from the hopper rack 951 towards the first stencil plate 911 based on the light received in the light-receiving part 94C3 by the light emitted from the light-emitting part 94C2 and traveling along the light path 94C1.

[0064] The moving mechanism 96 is a mechanism for moving a tray housing 95, supported by a pair of guide rail members 921 of a housing support structure 92 within the internal space 917 of the device body 91, in the Z direction. For example... Figure 5 and Figure 6As shown, the moving mechanism 96 includes a ball screw shaft 961 and a drive motor 962. The ball screw shaft 961 is arranged close to a pair of guide rail members 921 and extends in the Z direction. The drive motor 962 is a servo motor that generates a driving force for moving the pallet housing 95, and drives the ball screw shaft 961 to rotate. A nut (not shown) is attached to the pallet housing 95 and is screwed onto the ball screw shaft 961. According to the moving mechanism 96 with this configuration, the ball screw shaft 961 is driven to rotate by the operation of the drive motor 962, thereby moving the pallet housing 95 along the pair of guide rail members 921 in the Z direction.

[0065] The moving mechanism 96 moves the tray housing 95 within the internal space 917 of the device body 91 along the Z direction between a first position facing the first opening 911A and a second position facing the second opening 912A. The first position allows the tray 8 to move between the tray housing 95 and the wafer stage 10 via the first opening 911A. The second position allows the tray 8 housed in the tray housing 95 to be exchanged via the second opening 912A. Furthermore, as described above, since the first opening 911A is formed on the -Z side of the Z direction relative to the second opening 912A, in this case, the first position is located on the -Z side of the Z direction relative to the second position. The moving mechanism 96 moves the tray housing 95 along a first moving direction Z1 from the first position to the second position, and moves the tray housing 95 along a second moving direction Z2 from the second position to the first position.

[0066] In addition, such as Figure 5 As shown, a housing detection mechanism 94D is provided within the internal space 917 of the device body 91. The housing detection mechanism 94D is used to detect when the tray housing 95 is positioned in the second position. The housing detection mechanism 94D includes a light-emitting part 94D1 and a light-receiving part 94D2 (see below). Figures 10 to 13 The light-emitting part 94D1 is installed at the end of the first frame plate 911 side in the tray housing 95, and the light-receiving part 94D2 is installed in the area of ​​the first frame plate 911 facing the second opening 912A. Furthermore, the light-emitting part 94D1 can be installed on the first frame plate 911, and the light-receiving part 94D2 can be installed on the tray housing 95. The housing detection mechanism 94D detects whether the tray housing 95 is positioned in the second position based on the light received by the light emitted from the light-emitting part 94D1 in the light-receiving part 94D2. When the housing detection mechanism 94D detects that the tray housing 95 is positioned in the second position, it outputs a housing detection signal SB (described later). Figure 11Furthermore, the containment detection mechanism 94D is not limited to the light-utilizing structure described above, as long as it can detect that the tray containment 95 is located at the second position.

[0067] The opening / closing plate 97 is a plate-shaped member installed in the internal space 917 of the device body 91 in such a way that it can move in conjunction with the movement of the tray receiving body 95 based on the moving mechanism 96. The opening / closing plate 97 opens and closes the first opening 911A formed in the first frame plate 911 by moving in conjunction with the movement of the tray receiving body 95.

[0068] Specifically, when the tray housing 95 is positioned in the first position, the opening / closing plate 97 opens the first opening 911A entirely. This allows for the supply of the tray 8 from the tray housing 95 to the wafer stage 10 via the first opening 911A when the tray housing 95 is in the first position. Furthermore, it allows for the retrieval of the tray 8 from the wafer stage 10 to the tray housing 95 via the first opening 911A. Conversely, when the tray housing 95 is positioned in the second position, the opening / closing plate 97 closes the first opening 911A entirely. This allows for the complete disconnection of the connection from the tray housing 95 to the wafer stage 10 via the first opening 911A when the tray housing 95 is in the second position. Therefore, with the tray housing 95 positioned in the second position, access to the wafer stage 10 via the tray housing 95 can be appropriately restricted.

[0069] like Figures 6 to 8 As shown, the opening / closing plate 97 is installed at the end of the pallet housing 95 on the upstream side (-Z side) and the side of the first frame plate 911 (-Y side) in the first movement direction Z1. With this simple configuration of installing the opening / closing plate 97 into the pallet housing 95, it is possible to realize an opening / closing plate 97 that can move in conjunction with the movement of the pallet housing 95 based on the movement mechanism 96. Furthermore, the position in the pallet housing 95 where the opening / closing plate 97 is installed is on the upstream side of the first movement direction Z1 from the first position to the second position, and is at the end of the first frame plate 911 side where the first opening 911A is formed. Therefore, when the tray housing 95 is positioned in the second position, which is downstream of the first moving direction Z1 relative to the first position, the first opening 911A formed in the first frame plate 911 can be reliably closed by the opening / closing plate 97 installed on the end of the tray housing 95 upstream of the first moving direction Z1 and on the side of the first frame plate 911. Thus, with the tray housing 95 positioned in the second position, access to the wafer stage 10 via the tray housing 95 can be more appropriately restricted.

[0070] As described above, the first opening 911A and the second opening 912A are formed so that they do not overlap when viewed from a Y direction orthogonal to the Z direction of movement of the tray receiver 95 within the internal space 917 of the device body 91. In this case, with the tray receiver 95 positioned in the second position corresponding to the second opening 912A, the opening / closing plate 97 can reliably cut off communication from the tray receiver 95 to the wafer stage 10 via the first opening 911A over the entire area of ​​the first opening 911A. Therefore, with the tray receiver 95 positioned in the second position, access to the wafer stage 10 via the tray receiver 95 can be more appropriately restricted.

[0071] Furthermore, as described above, the pallet receiving body 95 is configured to include a locking member 952, which protrudes relative to the hopper frame 951 toward the first frame plate 911 within the range of the gap GP formed between the hopper frame 951 and the first frame plate 911. When the locking member 952 swings about the locking pivot axis 9521 based on the locking opening / closing mechanism 953, thus achieving the movement-allowing posture, movement of the pallet 8 from the hopper frame 951 toward the first frame plate 911 is permitted. In this case, supply of the pallet 8 from the hopper frame 951 to the wafer stage 10 via the first opening 911A is possible. On the other hand, when the locking member 952 is in the movement-restricting posture, movement of the pallet 8 from the hopper frame 951 toward the first frame plate 911 is restricted. In this case, for example, when the pallet housing 95 based on the moving mechanism 96 is moving or when the pallet housing 95 is configured in the second position, it is possible to restrict the pallet 8 from moving from the hopper rack 951 toward the first frame plate 911.

[0072] When the pallet receiver 95 is configured to include a locking member 952, a gap GP is formed between the hopper rack 951 and the first frame plate 911, as described above. Since this gap GP is formed between the hopper rack 951 and the first frame plate 911, the first opening 911A formed on the first frame plate 911 communicates with the gap GP. Therefore, when the pallet receiver 95 is positioned in the second position, the hopper rack 951 and the wafer stage 10 are connected via the gap GP and the first opening 911A. In this case, to restrict access to the wafer stage 10 via the hopper rack 951, it is necessary to cut off the communication from the hopper rack 951 to the wafer stage 10 via the gap GP and the first opening 911A.

[0073] Therefore, such as Figure 6As shown, the opening / closing plate 97 is configured to include a protrusion 971 and an extension 972. The protrusion 971 is a plate-shaped portion that protrudes from the end of the hopper frame 951 on the upstream side (-Z side) and the side of the first frame plate 911 (-Y side) in the first movement direction Z1 towards the side of the first frame plate 911 within the range of the gap GP. The length of the protrusion 971 in the X direction is set to be approximately the same as the length of the hopper frame 951 in the X direction. Furthermore, the protrusion length of the protrusion 971 from the hopper frame 951 is set to be slightly smaller than the size of the gap GP. The extension 972 is a plate-shaped portion that extends from the protrusion 971 towards the side of the second movement direction Z2 (-Z side) in such a way that the first opening 911A can be opened or closed entirely. The length of the extension 972 in the X direction is set to be the same as the length of the protrusion 971 in the X direction and greater than the length of the first opening 911A in the X direction. Furthermore, the length of the extension 972 along the Z direction is set to be greater than the length of the first opening 911A along the Z direction.

[0074] In this embodiment, the opening / closing plate 97 is formed by an L-shaped component with a protrusion 971 and an extension 972 integrated into one piece. By using an L-shaped component, the opening / closing plate 97 with the protrusion 971 and the extension 972 integrated into one piece can be easily constructed.

[0075] The protrusion 971 of the opening / closing plate 97 protrudes from the upstream side of the hopper rack 951 in the first movement direction Z1 and from the end of the first frame plate 911 within the range of the gap GP toward the first frame plate 911 side. Therefore, when the pallet receiver 95 is positioned in the second position, which is downstream of the first movement direction Z1 relative to the first position, the protrusion 971 can cut off the communication between the gap GP and the first opening 911A. Furthermore, the extension 972 of the opening / closing plate 97 extends from the protrusion 971 in such a way that the first opening 911A can be opened or closed entirely. Therefore, when the pallet receiver 95 is positioned in the second position, the extension 972 can close the first opening 911A. In other words, with the pallet housing 95 positioned in the second position, the protrusion 971 severs the communication between the gap GP between the hopper rack 951 and the first frame plate 911 and the first opening 911A, and the extension 972 closes the first opening 911A. Thus, with the pallet housing 95 positioned in the second position, access to the wafer stage 10 via the hopper rack 951 can be appropriately restricted.

[0076] Furthermore, as described above, within the gap GP formed between the hopper frame 951 and the first frame plate 911, a pallet detection mechanism 94C is provided, comprising a light-emitting portion 94C2 and a light-receiving portion 94C3 arranged facing each other along an optical path 94C1 extending in the Z direction within the gap GP. Based on the detection result of the pallet detection mechanism 94C, it is possible to detect conditions such as the pallet 8 moving from the hopper frame 951 towards the first frame plate 911. In this case, the protrusion 971 of the opening / closing plate 97, which protrudes from the hopper frame 951 towards the first frame plate 911 within the gap GP, has a light-passing hole 9711. This light-passing hole 9711 allows light from the light-emitting portion 94C2 to the light-receiving portion 94C3 to pass through by opening the optical path 94C1 of the pallet detection mechanism 94C. Therefore, it is possible to prevent the opening / closing plate 97 from obstructing the pallet detection mechanism 94C's detection of the pallet 8.

[0077] [Control structure of wafer supply device]

[0078] Secondly, refer to Figure 9 The control structure of the wafer supply device 6 is illustrated using a block diagram. The wafer supply device 6 includes a control unit 6C that controls the operation of the wafer conveyor 11 and the wafer receiving elevator 9. The control unit 6C has a microcomputer with a built-in storage device such as a ROM (Read Only Memory) for storing, for example, a control program, and flash memory for temporarily storing data. The control unit 6C controls the operation of the wafer conveyor 11 and the wafer receiving elevator 9 by reading the control program. The control unit 6C is mounted on, for example, the fifth frame plate 915 in the device body 91 (see reference 5). Figure 5 The control unit 6C includes, as a functional component, a transmitter control unit 11C and an elevator control unit 9C.

[0079] The transporter control unit 11C controls the wafer transporter 11. When supplying the tray 8 to the wafer stage 10, the transporter control unit 11C controls the wafer transporter 11 to pull the tray 8 from the tray housing 95 onto the wafer stage 10 via the first opening 911A. On the other hand, when retrieving a used tray 8 disposed on the wafer stage 10, the transporter control unit 11C controls the wafer transporter 11 to return the tray 8 on the wafer stage 10 to the tray housing 95 via the first opening 911A.

[0080] The elevator control unit 9C controls the wafer storage elevator 9. The elevator control unit 9C receives the output signal from the input door switch 94A and the detection signals from the door detection mechanism 94B, the tray detection mechanism 94C, and the housing detection mechanism 94D. The elevator control unit 9C functionally includes a locking control unit 9C1, a bolt control unit 9C2, and a movement control unit 9C3.

[0081] The locking control unit 9C1 controls the door locking mechanism 93 based on the detection signal from the housing detection mechanism 94D. The housing detection signal SB (described later) indicates that the tray housing 95 is positioned at the second location. Figure 11 When the receiving body detection mechanism 94D outputs a signal, the locking control unit 9C1 controls the door locking mechanism 93 to release the door locking mechanism 93 from maintaining the closed state of the door 916. Therefore, as long as the tray receiving body 95 is positioned in the second position, the closed state of the door 916 is released. In other words, the closed state of the door 916 is released when the opening / closing plate 97 is positioned in the second position corresponding to the tray receiving body 95 and the first opening 911A is completely closed. Therefore, the door 916 can be opened as long as the tray receiving body 95 is in the second position and the first opening 911A is closed by the opening / closing plate 97. On the other hand, when no receiving body detection signal SB is output from the receiving body detection mechanism 94D, the locking control unit 9C1 controls the door locking mechanism 93 to maintain the closed state of the door 916.

[0082] The latch control unit 9C2 controls the latch opening and closing mechanism 953 based on the position of the tray receiver 95 within the internal space 917 of the device body 91. When the tray receiver 95 is positioned in the first position, the latch control unit 9C2 controls the latch opening and closing mechanism 953 in a manner that allows the latch member 952 to move. With the latch member 952 in the movement-allowing posture, the tray 8 is allowed to move from the hopper rack 951 toward the first frame plate 911. This enables the supply of the tray 8 from the hopper rack 951 to the wafer stage 10 via the first opening 911A. On the other hand, when the tray receiver 95 moves based on the moving mechanism 96 or when the tray receiver 95 is positioned in the second position, the latch control unit 9C2 controls the latch opening and closing mechanism 953 in a manner that restricts the movement of the latch member 952. With the locking member 952 in the position of the movement restriction, the pallet 8 is restricted from moving from the hopper frame 951 toward the first frame plate 911. This restricts the pallet 8 from moving from the hopper frame 951 toward the first frame plate 911.

[0083] The movement control unit 9C3 controls the movement mechanism 96 based on the output signal of the door switch 94A. When an operation to open the door 916 is accepted, a door opening request signal SA1 (described later) is generated. Figure 11When the door switch 94A is activated, the movement control unit 9C3 controls the movement mechanism 96 to position the tray housing 95 in the second position corresponding to the second opening 912A where the door 916 is located. Thus, after the operation of the door switch 94A, when the door 916 is opened, the tray housing 95 is positioned in the second position. With the tray housing 95 in the second position, opening the door 916 allows for the exchange of the tray 8 housed in the tray housing 95 via the second opening 912A. In this case, the opening / closing plate 97 appropriately restricts access to the wafer stage 10 via the tray housing 95.

[0084] On the other hand, the door closing signal SA2 (described later) when door body 916 is closed. Figure 13 When the door switch 94A is activated, the movement control unit 9C3 controls the movement mechanism 96 to position the tray receiver 95 in the first position corresponding to the first opening 911A that opens towards the wafer stage 10. Thus, when the door 916 is closed, the tray receiver 95 is positioned in the first position. With the tray receiver 95 in the first position, the first opening 911A is opened by the opening / closing plate 97. Therefore, it is possible to supply the tray 8 from the tray receiver 95 to the wafer stage 10 via the first opening 911A.

[0085] Furthermore, the movement control unit 9C3 controls the movement mechanism 96 based on the detection signal from the door detection mechanism 94B. The door opening detection signal SC (described later) indicates that the door 916 has been opened. Figure 12 When the door detection mechanism 94B outputs an output, the movement control unit 9C3 stops the drive of the drive motor 962 of the movement mechanism 96. This restricts the movement of the tray housing 95 when the door 916 is open. Furthermore, even when the movement control unit 9C3 stops the drive of the drive motor 962, the drives of the servo motors 14 and 18 for moving the head unit 4 in the component mounting device 1, the servo motors 34 and 38 for moving the camera unit 32U, and the servo motors 44 and 46 for moving the push unit 40 are not stopped. Therefore, even when the drive of the drive motor 962 of the wafer supply device 6 is stopped, the mounting operation of the bare wafer 7a of the wafer 7 using the tray 8 of the wafer stage 10, performed by the component mounting device 1, continues.

[0086] [Basic Operations of Wafer Supply Equipment]

[0087] Secondly, refer to Figures 10 to 13 ,as well as Figure 14The flowchart illustrates the supply and recycling process of the tray 8 by the wafer supply device 6.

[0088] like Figure 10 As shown, with the pallet housing 95 positioned in the first position within the internal space 917 of the device body 91, the first opening 911A is opened based on the opening / closing plate 97 (step S1). In this case, the bolt control unit 9C2 controls the bolt opening / closing mechanism 953 to bring the bolt member 952 into the movement-allowing posture. With the bolt member 952 in the movement-allowing posture, the pallet 8 is allowed to move from the hopper rack 951 toward the first frame plate 911. In this state, the conveyor control unit 11C controls the wafer conveyor 11 to return the used pallet 8E disposed on the wafer stage 10 to the pallet housing 95 via the first opening 911A (step S2). Thus, the used pallet 8E disposed on the wafer stage 10 is recovered into the pallet housing 95.

[0089] After the used tray 8E is recycled, the conveyor control unit 11C controls the wafer conveyor 11 to pull a new tray 8 from the tray housing 95 through the first opening 911A onto the wafer stage 10 (step S3). Thus, the new tray 8 replaces the used tray 8E and is supplied to the wafer stage 10. The head unit 4 removes the bare die 7a from the wafer 7 held by the new tray 8 supplied to the wafer stage 10.

[0090] With the tray housing 95 positioned in the first position, the elevator control unit 9C monitors for a door opening request signal SA1 (step S4) output from the door switch 94A. Figure 11 As shown, when a door opening request signal SA1 is output from the door switch 94A ("Yes" in step S4), the bolt control unit 9C2 controls the bolt opening and closing mechanism 953 to bring the bolt member 952 into the movement-restricting posture. With the bolt member 952 in the movement-restricting posture, the movement of the pallet 8 from the hopper frame 951 towards the first frame plate 911 is restricted. In this state, the movement control unit 9C3 controls the movement mechanism 96 (step S5) to position the pallet receiving body 95 in the second position corresponding to the second opening 912A where the door body 916 is located.

[0091] The elevator control unit 9C monitors for the presence of a containment detection signal SB output from the containment detection mechanism 94D (step S6). For example... Figure 11As shown, when the housing detection signal SB is output from the housing detection mechanism 94D ("Yes" in step S6), the tray housing 95 is positioned in the second position and the opening / closing plate 97 completely closes the first opening 911A. In this state, the locking control unit 9C1 controls the door locking mechanism 93 to release the door locking mechanism 93 from maintaining the closed state of the door 916 (step S7).

[0092] After the door locking mechanism 93 releases the closed state of the door body 916, the door body 916 can be opened. The elevator control unit 9C monitors whether there is a door opening detection signal SC output from the door detection mechanism 94B (step S8). Figure 12 As shown, when a door opening detection signal SC is output from the door detection mechanism 94B ("Yes" in step S8), the movement control unit 9C3 stops the drive of the drive motor 962 of the movement mechanism 96 (step S9). Thus, with the door 916 in the open state, the movement of the tray housing 95 can be restricted. With the door 916 in the open state, the used tray 8E returned to the tray housing 95 can be exchanged with a new tray 8 via the second opening 912A. In this case, access to the wafer stage 10 via the tray housing 95 is appropriately restricted by the opening / closing plate 97. Furthermore, in this state, the head unit 4 continues the operation of removing the die 7a from the wafer 7 held by the tray 8 supplied to the wafer stage 10.

[0093] The elevator control unit 9C monitors for a door closing signal SA2 output from the door switch 94A (step S10). For example... Figure 13 As shown, when a door closing signal SA2 is output from the door switch 94A ("Yes" in step S10), the movement control unit 9C3 controls the movement mechanism 96 (step S11) to position the tray receiver 95 in the first position corresponding to the first opening 911A that opens towards the wafer stage 10. Thus, when the door 916 is closed, the tray receiver 95 is positioned in the first position. With the tray receiver 95 positioned in the first position, the first opening 911A is opened based on the opening / closing plate 97. Therefore, it is possible to supply the tray 8 from the tray receiver 95 to the wafer stage 10 via the first opening 911A.

[0094] [Regarding modified embodiments of the wafer supply device]

[0095] The above describes the wafer supply device 6 included in the component mounting device 1 according to the embodiments of the present invention. However, the present invention is not limited to this and can be implemented in modified embodiments such as those described below.

[0096] In the above embodiment, a configuration was described in which the first opening 911A is formed on the -Z side in the Z direction relative to the second opening 912A in the device body 91 of the wafer storage elevator 9, but it is not limited to this. Figure 15 As shown, the first opening 911A may also be formed on the +Z side in the Z direction relative to the second opening 912B. In this case, regarding the moving direction of the moving mechanism 96 moving the pallet housing 95, the first moving direction Z1 from the first position corresponding to the first opening 911A to the second position corresponding to the second opening 912A is the direction from the +Z side to the -Z side. On the other hand, the second moving direction Z2 from the second position corresponding to the second opening 912A to the first position corresponding to the first opening 911A is the direction from the -Z side to the +Z side.

[0097] In this configuration, the opening / closing plate 97 is installed at the end of the tray housing 95 on the upstream side (+Z side) and the side of the first frame plate 911 (-Y side) in the first movement direction Z1. In this configuration, when the tray housing 95 is positioned in a second position relative to the first position but downstream on the first movement direction Z1 (-Z side), the opening / closing plate 97 installed at the end of the tray housing 95 on the upstream side (+Z side) and the side of the first frame plate 911 (-Y side) in the first movement direction Z1 can reliably close the first opening 911A formed in the first frame plate 911. Therefore, when the tray housing 95 is positioned in the second position, access to the wafer stage 10 via the tray housing 95 can be appropriately restricted.

[0098] Furthermore, the above-described embodiment illustrates an example where only the hopper rack 951 constitutes the receiving body for receiving the pallet 8 in the pallet receiving body 95, but it is not limited to this. Figure 16 As shown, the main body of the pallet receiving body 95 can also be constructed from a hopper rack 951 and a housing 951A. The housing 951A is a box-shaped frame with openings at both ends in the Y direction. The housing 951A is mounted on the ball screw shaft 961 of the moving mechanism 96 and houses the hopper rack 951 in a manner that allows it to move towards the +Y side in the Y direction. In this case, with the pallet receiving body 95 in the second position, the hopper rack 951 can move in and out of the housing 951A via the second opening 912A. Therefore, it is possible to exchange hopper racks 951 that house multiple pallets 8.

[0099] In this configuration, the opening / closing plate 97 is installed on the upstream side of the first movement direction Z1 and on the end side of the first frame plate 911 in the housing 951A. In this configuration, with the tray housing 95 in the second position, the first opening 911A formed in the first frame plate 911 can be reliably closed based on the opening / closing plate 97 installed on the upstream side of the first movement direction Z1 and on the end side of the first frame plate 911 in the housing 951A. Therefore, with the tray housing 95 in the second position, access to the wafer stage 10 via the tray housing 95 can be appropriately restricted.

[0100] The specific embodiments described above mainly include inventions having the following configuration.

[0101] One aspect of the present invention relates to a wafer supply apparatus for supplying wafers divided into multiple components to a designated component removal operation position. The wafer supply apparatus includes: an apparatus body comprising a first skeleton plate and a second skeleton plate, the first skeleton plate forming a first opening toward the component removal operation position, and the second skeleton plate forming a second opening toward the opposite side of the component removal operation position; the apparatus body defining an internal space between the first skeleton plate and the second skeleton plate communicating with the first and second openings; a wafer housing configured to accommodate the wafer and disposed within the internal space; and a moving mechanism that moves the wafer housing in a first moving direction from the first position to the second position between a first position and a second position, and moves the wafer housing in a direction from... The second position moves in a second direction toward the first position. The first position is a position that allows the wafer to move between the wafer housing and the component removal position via the first opening. The second position is a position that allows the wafer housed in the wafer housing to be exchanged via the second opening. An opening / closing plate is provided within the internal space in a manner that allows movement in conjunction with the movement of the wafer housing based on the moving mechanism. When the wafer housing is positioned in the first position, the first opening is completely opened, and when the wafer housing is positioned in the second position, the first opening is completely closed.

[0102] According to this wafer supply apparatus, the main body of the apparatus has a first opening facing the component removal operation position and a second opening facing the opposite side of the component removal operation position. A moving mechanism moves a wafer housing between a first position and a second position. The first position allows the wafer to move between the wafer housing and the component removal operation position via the first opening, and the second position allows the wafer housed in the wafer housing to be exchanged via the second opening. An opening / closing plate is capable of moving in conjunction with the movement of the wafer housing based on the moving mechanism.

[0103] When the wafer housing is positioned in the first position, the opening / closing plate completely opens the first opening. This allows for the supply of wafers from the wafer housing to the device removal position via the first opening when the wafer housing is in the first position. Conversely, when the wafer housing is positioned in the second position, the opening / closing plate completely closes the first opening. This cuts off communication from the wafer housing to the device removal position via the first opening across the entire area of ​​the first opening when the wafer housing is in the second position. Therefore, when the wafer housing is positioned in the second position, access to the device removal position via the wafer housing can be appropriately restricted.

[0104] In the wafer supply apparatus described above, the opening and closing plate can be configured such that it is installed on the upstream side of the first moving direction of the wafer housing and at the end of the first skeleton plate side.

[0105] In this configuration, by simply mounting an opening / closing plate onto the wafer housing, an opening / closing plate capable of moving in conjunction with the movement of the wafer housing based on a moving mechanism can be achieved. Furthermore, the opening / closing plate is mounted on the end of the first frame plate side, upstream of the first position in the first moving direction from the first position to the second position, and the first opening is formed thereon. Therefore, when the wafer housing is positioned in the second position, downstream of the first position in the first moving direction, the first opening formed on the first frame plate can be reliably closed based on the opening / closing plate mounted on the upstream end of the wafer housing in the first moving direction and on the first frame plate side. Thus, when the wafer housing is positioned in the second position, access to the component removal operation position via the wafer housing can be more appropriately restricted.

[0106] In the wafer supply apparatus described above, the first opening and the second opening may be configured such that they do not overlap when viewed from a direction orthogonal to the first moving direction and the second moving direction.

[0107] In this configuration, with the wafer housing positioned in the second position corresponding to the second opening, the opening / closing plate can more reliably cut off communication from the wafer housing through the first opening to the device removal position across the entire area of ​​the first opening. Therefore, with the wafer housing positioned in the second position, access to the device removal position via the wafer housing can be more appropriately restricted.

[0108] In the aforementioned wafer supply apparatus, the wafer housing may be configured such that: the wafer housing comprises: a housing body disposed within the internal space with a specified gap between it and the first scaffold plate for housing the wafer; and a wafer movement control member protruding toward the first scaffold plate relative to the housing body within the gap, and capable of changing its posture between a movement-limiting posture that restricts movement of the wafer from the housing body toward the first scaffold plate and a movement-allowing posture that allows such movement. In this configuration, the opening / closing plate comprises: a protrusion protruding from an end of the housing body on the first movement direction and on the first scaffold plate side within the gap toward the first scaffold plate side; and an extension extending from the protrusion such that the first opening can be opened or closed entirely.

[0109] In this configuration, a wafer movement control member is provided using the gap formed between the housing body and the first scaffold plate of the wafer housing. When the wafer movement control member is in a movement-allowing posture, the wafer is allowed to move from the housing body towards the first scaffold plate. In this case, the wafer can be supplied from the housing body to the component removal position via the first opening. On the other hand, when the wafer movement control member is in a movement-restricting posture, the movement of the wafer from the housing body towards the first scaffold plate is restricted. In this case, for example, when the wafer housing is moved based on a movement mechanism or when the wafer housing is positioned in the second position, the wafer's movement from the housing body towards the first scaffold plate can be restricted.

[0110] When the wafer housing is configured to include a wafer movement control component, a gap is formed between the housing body and the first scaffold plate, as described above. Since this gap is formed between the housing body and the first scaffold plate, a first opening in the first scaffold plate communicates with the gap. Therefore, when the wafer housing is positioned in the second position, the housing body and the component removal operation position are connected via the gap and the first opening. In this case, to restrict access to the component removal operation position via the housing body, it is necessary to cut off the communication between the housing body and the component removal operation position via the gap and the first opening.

[0111] Therefore, the opening / closing plate is configured to include a protrusion and an extension. The protrusion of the opening / closing plate protrudes from the end of the housing body on the upstream side and the first skeleton plate side in the first moving direction, within the gap, toward the first skeleton plate side. Thus, when the wafer housing is positioned in a second position downstream of the first moving direction relative to the first position, the connection between the gap and the first opening can be severed based on the protrusion protruding from the end of the housing body on the upstream side and the first skeleton plate side in the first moving direction, within the gap, to the first skeleton plate side. Furthermore, the extension of the opening / closing plate extends from the protrusion in a manner that allows the first opening to be opened or closed entirely. Thus, when the wafer housing is positioned in the second position, the first opening can be closed based on the extension. In other words, when the wafer housing is positioned in the second position, the connection between the gap between the housing body and the first skeleton plate and the first opening is severed based on the protrusion, and the first opening is closed based on the extension. Therefore, with the wafer housing in the second position, access to the device removal operation position via the housing can be appropriately restricted.

[0112] In the aforementioned wafer supply device, the opening / closing plate is composed of a component in which the protrusion and the extension are integrally formed and have an L-shaped cross-section.

[0113] In this configuration, by using a component with an L-shaped cross-section, it is possible to easily construct an opening and closing plate that integrates the protrusion and the extension.

[0114] The aforementioned wafer supply apparatus can be configured such that it further includes a wafer inspection mechanism for detecting the movement of the wafer from the housing body towards the first scaffold plate, and has a light-emitting portion and a light-receiving portion arranged facing each other within the gap and along an optical path extending along the first and second movement directions. In this configuration, the protrusion of the opening / closing plate has a light-passing hole that allows light from the light-emitting portion to pass through the light-receiving portion by opening the optical path.

[0115] In this configuration, the wafer inspection mechanism can detect the wafer's movement from the housing body to the first scaffold plate based on the inspection results. In this case, a light-passing hole is formed in a protrusion protruding from the opening / closing plate within the gap between the housing body and the first scaffold plate, opening the light path of the wafer inspection mechanism. This prevents the opening / closing plate from obstructing the wafer inspection mechanism's inspection of the wafer.

[0116] In the aforementioned wafer supply apparatus, the main body of the apparatus may include a door for opening and closing the second opening. In this configuration, the wafer supply apparatus further includes: a door switch that outputs a door opening request signal upon receiving an operation requesting to open the door; and a movement control unit that controls the movement mechanism based on the signal output from the door switch. Furthermore, when the door opening request signal is output from the door switch, the movement control unit controls the movement mechanism in such a way that it moves the wafer housing toward and positions it at the second position.

[0117] In this configuration, the movement control unit controls the movement mechanism based on the output signal of the door switch regarding the opening and closing of the second opening in the door of the main body of the device. When a door opening request signal is output from the door switch when an operation to open the door is received, the movement control unit controls the movement mechanism to position the wafer housing in a second position corresponding to the second opening of the door. Thus, after the door switch is operated and the door is opened, the wafer housing is positioned in the second position. In this state, with the wafer housing positioned in the second position, the wafer housed in the wafer housing can be exchanged via the second opening by opening the door. In this case, the opening and closing plate can appropriately restrict access to the component removal operation position via the wafer housing.

[0118] In the aforementioned wafer supply apparatus, the main body of the apparatus may include a door for opening and closing the second opening. In this configuration, the wafer supply apparatus further includes: a door switch that outputs a door closing signal when the door is closed; and a movement control unit that controls the movement mechanism based on the signal output from the door switch. Furthermore, when the door closing signal is output from the door switch, the movement control unit controls the movement mechanism in such a way that it moves the wafer housing toward and positions it at the first position.

[0119] In this configuration, when a door closing signal is output from the door switch when the door is closed, the movement control unit controls the movement mechanism to position the wafer housing in a first position corresponding to the first opening leading to the device take-out position. Thus, when the door is closed, the wafer housing is positioned in the first position. With the wafer housing in the first position, the first opening is opened by the opening / closing plate. Therefore, it is possible to supply wafers from the wafer housing to the device take-out position via the first opening.

[0120] The wafer supply device described above can be configured such that it further includes: a housing detection mechanism that outputs a housing detection signal when the wafer housing is detected to be positioned at the second position; a door locking mechanism that maintains the door closed at the second opening; and a locking control unit that controls the door locking mechanism to release the door locking mechanism from maintaining the closed state of the door when the housing detection signal is output from the housing detection mechanism.

[0121] In this configuration, when a housing detection signal indicating that the wafer housing is positioned in the second position is output from the housing detection mechanism, the locking control unit controls the locking mechanism to release the locking state that maintains the locking mechanism's closure of the door. Therefore, as long as the wafer housing is positioned in the second position, the maintenance of the closed state of the door is released. In other words, the maintenance of the closed state of the door is released when the opening / closing plate is completely closed corresponding to the wafer housing being positioned in the second position. Therefore, as long as the wafer housing is positioned in the second position and the first opening is closed based on the opening / closing plate, the door can be opened.

[0122] The aforementioned wafer supply device can be configured such that it further includes a door detection mechanism that outputs a door opening detection signal when the door is detected to be open. Furthermore, the moving mechanism includes a drive motor that generates a driving force to move the wafer housing; when the door opening detection signal is output from the door detection mechanism, the moving control unit stops the drive motor.

[0123] In this configuration, when a door opening detection signal indicating that the door has been opened is output from the door detection mechanism, the movement control unit stops the drive motor of the movement mechanism. Thus, when the door is open, the movement of the wafer housing can be restricted.

[0124] Another aspect of the present invention relates to a component transfer apparatus comprising: the aforementioned wafer supply apparatus, which supplies a wafer divided into a plurality of components to a designated component removal operation position; and a component transfer unit, which removes the components from the wafer supplied to the component removal operation position and transfers them to a designated component transfer section.

[0125] As described above, according to the present invention, it is possible to provide a wafer supply device that can appropriately restrict access to the component removal operation position via a wafer housing, and a component transfer device having the wafer supply device.

Claims

1. A wafer supply apparatus for supplying wafers to be divided into multiple components to a designated component removal operation position, characterized in that... include: The device body includes a first frame plate and a second frame plate. The first frame plate has a first opening that opens toward the component removal operation position. The second frame plate has a second opening that opens toward the opposite side of the component removal operation position. The device body defines an internal space between the first frame plate and the second frame plate that communicates with the first opening and the second opening. A wafer housing is configured to house the wafer and is disposed within the internal space; A moving mechanism, between a first position and a second position, moves the wafer housing in a first moving direction from the first position to the second position, and moves the wafer housing in a second moving direction from the second position to the first position. The first position is a position allowing the wafer to move between the wafer housing and the component removal position via the first opening, and the second position is a position allowing the wafer housed in the wafer housing to be exchanged via the second opening. An opening and closing plate is disposed within the internal space in such a way that it can move in conjunction with the movement of the wafer housing based on the moving mechanism. When the wafer housing is positioned in the first position, the first opening is opened entirely, and when the wafer housing is positioned in the second position, the first opening is closed entirely.

2. The wafer supply apparatus according to claim 1, characterized in that, The opening and closing plate is installed on the upstream side of the first moving direction of the wafer housing and at the end of the first skeleton plate side.

3. The wafer supply apparatus according to claim 2, characterized in that, The first opening and the second opening are formed so that they do not overlap when viewed from a direction orthogonal to the first and second moving directions.

4. The wafer supply apparatus according to any one of claims 1 to 3, characterized in that, The wafer housing includes: A housing body, configured within the internal space with a designated gap formed between it and the first skeleton plate, is used to house the wafer; and... A wafer movement control component is provided protruding toward the first scaffold plate side relative to the housing body within the gap, and is capable of changing its posture between a movement-limiting posture that restricts the movement of the wafer from the housing body toward the first scaffold plate side and a movement-allowing posture that allows the movement. The opening / closing plate includes: The protrusion extends from the end of the receiving body on the upstream side of the first moving direction and on the side of the first skeleton plate within the range of the gap toward the side of the first skeleton plate; as well as, An extension extends from the protrusion in a manner that allows the first opening to be opened or closed entirely.

5. The wafer supply apparatus according to claim 4, characterized in that, The opening and closing plate is composed of a component in which the protrusion and the extension are integrally formed and have an L-shaped cross-section.

6. The wafer supply apparatus according to claim 4, characterized in that... Also includes: The wafer inspection mechanism is a mechanism for detecting the movement of the wafer from the housing body towards the first scaffold plate side, and has a light-emitting part and a light-receiving part arranged facing each other within the range of the gap and along an optical path extending along the first movement direction and the second movement direction; wherein, The protrusion of the opening / closing plate has a light-passing hole that allows light from the light-emitting part to pass through the light-receiving part by opening the light path.

7. The wafer supply apparatus according to any one of claims 1 to 3, characterized in that, The main body of the device includes a door for opening and closing the second opening. The wafer supply device also includes: The door switch, upon receiving a request to open the door, outputs a door opening request signal; and... The movement control unit controls the movement mechanism based on the signal output from the door switch; wherein, When the door opening request signal is output from the door switch, the movement control unit controls the movement mechanism in such a way that the wafer housing is moved toward and positioned at the second position.

8. The wafer supply apparatus according to any one of claims 1 to 3, characterized in that, The main body of the device includes a door for opening and closing the second opening. The wafer supply device also includes: The door switch outputs a door-closed signal when the door is closed; and, The movement control unit controls the movement mechanism based on the signal output from the door switch, wherein... When the door close signal is output from the door switch, the movement control unit controls the movement mechanism in such a way that the wafer housing is moved toward and positioned at the first position.

9. The wafer supply apparatus according to claim 7, characterized in that... Also includes: The housing detection mechanism outputs a housing detection signal when it detects that the wafer housing is positioned at the second position. A door locking mechanism maintains the door closed at the second opening; and, The locking control unit controls the door locking mechanism in such a way that the door locking mechanism releases the maintenance of the closed state of the door when the receiving body detection mechanism outputs the receiving body detection signal.

10. The wafer supply apparatus according to claim 7, characterized in that... Also includes: The door detection mechanism outputs a door opening detection signal when it detects that the door has been opened; wherein, The moving mechanism includes a drive motor that generates a driving force for moving the wafer housing. When the door opening detection signal is output from the door detection mechanism, the movement control unit stops the drive motor.

11. A component transfer device, characterized in that... include: The wafer supply apparatus according to any one of claims 1 to 10 supplies wafers divided into multiple components to a designated component removal operation position; as well as, The component transfer unit removes the component from the wafer supplied to the component removal operation position and transfers it to the designated component transfer section.

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