Cleaning method

Abstract

The present disclosure relates to a cleaning method. The present disclosure aims to provide a cleaning method that has excellent cleaning properties for water-soluble flux and reduces metal influence. A cleaning method including: a step of cleaning a cleaning target to which a water-soluble flux is attached using a cleaning agent composition, the cleaning agent composition including: a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water, the first organic acid and the second organic acid being different organic acids, the first inorganic acid and the second inorganic acid being different inorganic acids, the water-soluble amine compound being a compound represented by Formula 1, the salt of the first organic acid and the salt of the first inorganic acid being salts other than ammonium salts.

Description

TECHNICAL FIELD

[0001] The present application relates to a cleaning method. BACKGROUND

[0002] Conventionally, a cleaning method including a step of cleaning a water-soluble flux-attached object with a cleaning agent composition has been used (Patent Document 1).

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENT

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-119782

[0006] In recent years, in the cleaning method, improvement in the cleaning property of flux residue is required. In particular, from the viewpoint of measures against environmental problems, improvement in the cleaning property of water-cleanable flux (in other words, water-soluble flux) is required. The residue of water-soluble flux has hygroscopicity and poor insulating properties, and thus removal of the residue is required. However, in the advancement of fluxes improved in accordance with the required properties, sometimes the cleaning property of water-soluble flux is insufficient. In addition, even in the case where the cleaning method is excellent in the cleaning property of water-soluble flux residue, sometimes corrosion of metal (for example, zinc (Zn)) contained in the cleaning target object (in other words, "metal influence") easily occurs. SUMMARY

[0007] The present disclosure was completed in view of the above-described circumstances, and an object thereof is to provide a cleaning method that has excellent cleaning property with respect to water-soluble flux and reduces metal influence.

[0008] The cleaning method of one aspect of the present disclosure includes a step of cleaning a water-soluble flux-attached object to be cleaned using a cleaning agent composition, the cleaning agent composition including: a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water, the first organic acid and the second organic acid being different organic acids, the first inorganic acid and the second inorganic acid being different inorganic acids, the water-soluble amine compound being a compound represented by Formula 1, the salt of the first organic acid and the salt of the first inorganic acid being salts other than ammonium salts, the content of the water-soluble amine compound in the cleaning agent composition being 0.1 mass% or more and 1.5 mass% or less, the total content of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid in the cleaning agent composition being 0.1 mass% or more and 2 mass% or less, the total content of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid in the cleaning agent composition being 0.1 mass% or more and 1.5 mass% or less, and the content of the water in the cleaning agent composition being 95 mass% or more and 99.7 mass% or less.

[0009]

[0010] (In Formula 1, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a hydrocarbon group, or a hydroxyalkyl group, at least one of R 1 , R 2 , and R 3 represents a hydroxyalkyl group, and the sum of the number of carbon atoms in R 1 , R 2 , and R 3 is 8 or less.)

[0011] Inventive Effects

[0012] According to the present disclosure, a cleaning method having excellent cleaning properties for water-soluble flux and reduced metal influence can be provided. DETAILED DESCRIPTION

[0013] [Explanation of Embodiments of the Present Disclosure]

[0014] First, embodiments of the present disclosure are listed and explained.

[0015] [1] The cleaning method of the present disclosure includes: a step of cleaning a water-soluble flux-attached object to be cleaned using a cleaning agent composition, the cleaning agent composition including: a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water, the first organic acid and the second organic acid being different organic acids, the first inorganic acid and the second inorganic acid being different inorganic acids, the water-soluble amine compound being a compound represented by Formula 1, the salt of the first organic acid and the salt of the first inorganic acid being salts other than ammonium salts, in the cleaning agent composition, the water-soluble amine compound having a content rate of 0.1 mass% or more and 1.5 mass% or less, in the cleaning agent composition, the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid having a total content rate of 0.1 mass% or more and 2 mass% or less, in the cleaning agent composition, the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid having a total content rate of 0.1 mass% or more and 1.5 mass% or less, in the cleaning agent composition, the water having a content rate of 95 mass% or more and 99.7 mass% or less.

[0016]

[0017] (In Formula 1, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a hydrocarbon group, or a hydroxyalkyl group, at least one of R 1 , R 2 , and R 3 represents a hydroxyalkyl group, and the total number of carbon atoms in R 1 , R 2 , and R 3 is 8 or less.)

[0018] Thus, a cleaning method having excellent cleaning properties for water-soluble flux and reduced metal influence can be provided.

[0019] [2] In the above-mentioned [1], it can also be that, in the cleaning agent composition, a glycol ether compound has a content rate of 0 mass% or more and 1 mass% or less. Thus, a cleaning method having more excellent cleaning properties for water-soluble flux and further reduced drainage load in the case where water is used in a rinsing agent can be provided.

[0020] [3] In the above [1] or [2], the water-soluble amine compound can be at least one compound selected from the group consisting of diethanolamine, N-butyl diethanolamine, N-methyl ethanolamine, and N-methyl diethanolamine. Thus, a cleaning method having more excellent cleaning properties for water-soluble fluxes and further reduced metal influence can be provided.

[0021] [4] In any one of the above [1] to [3], the first organic acid can be at least one compound selected from the group consisting of citric acid, gluconic acid, and nitrilo tris (methylene phosphonic acid), and the first inorganic acid can be pyrophosphoric acid and / or polyphosphoric acid. Thus, a cleaning method having more excellent cleaning properties for water-soluble fluxes and further reduced metal influence can be provided.

[0022] [5] In any one of the above [1] to [4], the ammonium salt of the second organic acid can be ammonium formate and / or ammonium acetate, and the ammonium salt of the second inorganic acid can be ammonium carbonate. Thus, a cleaning method having more excellent cleaning properties for water-soluble fluxes and further reduced metal influence can be provided.

[0023] [Details of the embodiments of the present disclosure]

[0024] One embodiment of the present disclosure (hereinafter, also referred to as "the present embodiment") will be described. However, the present embodiment is not limited thereto. In the present specification, the expression in the form of "A to Z" means the upper limit and the lower limit of the range (i.e., A or more and Z or less). In the case where the unit is not described at A but is described only at Z, the unit of A is the same as that of Z.

[0025] [Embodiment 1: Cleaning method]

[0026] A cleaning agent composition of one embodiment of the present disclosure will be described.

[0027] The cleaning method of one embodiment of the present disclosure (hereinafter, also referred to as "this embodiment") is a cleaning method including a step of cleaning a cleaning target to which a water-soluble flux is attached using a cleaning agent composition, the cleaning agent composition including: a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water, the first organic acid and the second organic acid being different organic acids, the first inorganic acid and the second inorganic acid being different inorganic acids, the water-soluble amine compound being a compound represented by Formula 1, the salt of the first organic acid and the salt of the first inorganic acid being salts other than ammonium salts, in the cleaning agent composition, the content rate of the water-soluble amine compound is greater than or equal to 0.1 mass % and less than or equal to 1.5 mass %, in the cleaning agent composition, the content rate of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid is greater than or equal to 0.1 mass % and less than or equal to 2 mass %, in the cleaning agent composition, the content rate of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid is greater than or equal to 0.1 mass % and less than or equal to 1.5 mass %, and in the cleaning agent composition, the content rate of the water is greater than or equal to 95 mass % and less than or equal to 99.7 mass %.

[0028]

[0029] (In Formula 1, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a hydrocarbon group, or a hydroxyalkyl group, at least one of R 1 , R 2 , and R 3 represents a hydroxyalkyl group, and the total number of carbon atoms in R 1 , R 2 , and R 3 is less than or equal to 8.)

[0030] According to the present disclosure, a cleaning method with excellent cleaning properties for a water-soluble flux and reduced metal influence can be provided. The reason is presumably as described below.

[0031] (a) In the cleaning agent composition, the content rate of the water-soluble amine compound is greater than or equal to 0.1 mass % and less than or equal to 1.5 mass %. Thus, decomposition of the flux component can be promoted without affecting the metal, and thus the cleaning properties for the water-soluble flux can be improved.

[0032] (b) The content of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid in the cleaning agent composition is 0.1 mass% or more and 2 mass% or less. Thus, the metal salt in the flux component is solubilized in the cleaning agent composition, and thus the cleaning property for the water-soluble flux can be improved.

[0033] (c) The content of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid in the cleaning agent composition is 0.1 mass% or more and 1.5 mass% or less. Thus, the metal influence that can be generated in the presence of the water-soluble amine compound can be suppressed, and thus the metal influence can be reduced.

[0034] <Process>

[0035] The cleaning method of the present embodiment includes a process of cleaning the object to be cleaned on which the water-soluble flux is attached using the cleaning agent composition (hereinafter, also referred to as "cleaning process"). "Including the cleaning process" means the concept including the case where the cleaning method is composed only of the cleaning process and the case where the cleaning method can include a process other than the cleaning process. As the process other than the cleaning process, for example, a pre-rinse process of rinsing the object to be cleaned with water, water-containing alcohol, or water-containing glycol ether to remove the cleaning agent composition from the object to be cleaned, a post-rinse process of rinsing the object to be cleaned with the same clean rinsing agent as used in the pre-rinse process after the pre-rinse process, and a drying process of drying the object to be cleaned by volatilizing the rinsing agent attached to the object to be cleaned can be exemplified.

[0036] <Process>

[0037] The cleaning method of the present embodiment is performed by cleaning the object to be cleaned on which the water-soluble flux is attached using the cleaning agent composition. The cleaning method can include bringing the cleaning agent composition described later into contact with the surface or gap of the object to be cleaned.

[0038] The method of bringing the cleaning agent composition into contact with the surface or gap of the object to be cleaned is not particularly limited. The method can be exemplified by, for example, contact in the atmosphere, under reduced pressure, or under increased pressure at ordinary temperature or under heating by dipping, coating, and spraying based on spraying or showering. In the case of bringing the cleaning agent composition into contact with the surface or gap of the object to be cleaned by dipping, stirring treatment, ultrasonic treatment, bubbling treatment, swinging, or the like can be performed as needed. The method is preferably dipping the object to be cleaned in a cleaning agent tank into which the cleaning agent composition warmed is poured, and performing cleaning. The time of dipping is preferably 1 minute or more and 30 minutes or less.

[0039] In one aspect of the present embodiment, in the case of cleaning the gap of the object to be cleaned, it is preferable to irradiate ultrasonic waves while the cleaning agent composition is in contact with the object to be cleaned. Thereby, the cleaning property for the gap can be improved. The frequency of the ultrasonic waves is preferably 26 Hz or more and 1500 Hz or less, and more preferably 40 Hz or more and 1000 Hz or less.

[0040] Cleaning agent composition

[0041] Water-soluble amine compound

[0042] The cleaning agent composition contains a water-soluble amine compound. The water-soluble amine compound is a compound represented by Formula 1.

[0043]

[0044] (In Formula 1, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a hydrocarbon group, or a hydroxyalkyl group, at least one of R 1 , R 2 , and R 3 represents a hydroxyalkyl group, and the total number of carbon atoms in R 1 , R 2 , and R 3 is 8 or less.) In the cleaning agent composition, the content rate of the water-soluble amine compound is 0.1 mass% or more and 1.5 mass% or less. Thereby, the cleaning property for the water-soluble flux can be improved. In the cleaning agent composition, the lower limit of the content rate of the water-soluble amine compound can be 0.15 mass% or more, can be 0.2 mass% or more, or can be 0.25 mass% or more. In the cleaning agent composition, the upper limit of the content rate of the water-soluble amine compound can be 1.4 mass% or less, can be 1.3 mass% or less, or can be 1.2 mass% or less. In the cleaning agent composition, the content rate of the water-soluble amine compound can be 0.15 mass% or more and 1.4 mass% or less, can be 0.2 mass% or more and 1.3 mass% or less, or can be 0.25 mass% or more and 1.2 mass% or less. Note that, in the present disclosure, “water-soluble” means a property in which the solubility in water at an environment of 20°C exceeds 50 mass%. On the other hand, in the present disclosure, “hydrophobic” means a property in which the solubility in water at an environment of 20°C is 50 mass% or less.

[0045] The water-soluble amine compound can also be at least one compound selected from the group consisting of diethanolamine, N-butyl diethanolamine, N-methyl ethanolamine, and N-methyl diethanolamine. Thereby, the cleaning property for the water-soluble flux can be further improved.

[0046] <First organic acid, salt of the first organic acid, first inorganic acid, and salt of the first inorganic acid>

[0047] The cleaning agent composition contains at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid. The first organic acid is different from a second organic acid described later. The first inorganic acid is different from a second inorganic acid described later. The salt of the first organic acid and the salt of the first inorganic acid are salts other than ammonium salts. In the cleaning agent composition, the content ratio of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid is 0.1% by mass or more and 2% by mass or less. Thereby, the cleaning property for the water-soluble flux can be improved. In the cleaning agent composition, the lower limit of the content ratio of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid can be 0.15% by mass or more, can be 0.2% by mass or more, or can be 0.25% by mass or more. In the cleaning agent composition, the upper limit of the content ratio of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid can be 1.8% by mass or less, can be 1.6% by mass or less, or can be 1.4% by mass or less. In the cleaning agent composition, the content ratio of the total amount of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid can be 0.15% by mass or more and 1.8% by mass or less, can be 0.2% by mass or more and 1.6% by mass or less, or can be 0.25% by mass or more and 1.4% by mass or less.

[0048] The first organic acid can also be at least one compound selected from the group consisting of citric acid, gluconic acid, and nitrilotris(methylene phosphonic acid). The first inorganic acid can also be pyrophosphoric acid and / or polyphosphoric acid. Thereby, the cleaning property for the water-soluble flux can be further improved.

[0049] <Ammonium salt of a second organic acid, and ammonium salt of a second inorganic acid>

[0050] The cleaning agent composition contains an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid. In the cleaning agent composition, the content of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid is 0.1 mass% or more and 1.5 mass% or less. Thereby, metal influence can be reduced. In the cleaning agent composition, the lower limit of the content of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid can be 0.15 mass% or more, can be 0.2 mass% or more, or can be 0.25 mass% or more. In the cleaning agent composition, the upper limit of the content of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid can be 1.4 mass% or less, can be 1.3 mass% or less, or can be 1.2 mass% or less. In the cleaning agent composition, the content of the total amount of the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid can be 0.15 mass% or more and 1.4 mass% or less, can be 0.2 mass% or more and 1.3 mass% or less, or can be 0.25 mass% or more and 1.2 mass% or less.

[0051] The ammonium salt of the second organic acid can also be ammonium formate and / or ammonium acetate. The ammonium salt of the second inorganic acid can also be ammonium carbonate. Thereby, metal influence can be further reduced.

[0052] <Water>

[0053] The cleaning agent composition contains water. In the cleaning agent composition, the content of water is 95 mass% or more and 99.7 mass% or less. Thereby, environmental load caused by cleaning can be reduced. In the cleaning agent composition, the lower limit of the content of water can be 95.5 mass% or more, can be 96 mass% or more, or can be 96.5 mass% or more. In the cleaning agent composition, the upper limit of the content of water can be 99.5 mass% or less, can be 99.3 mass% or less, or can be 99 mass% or less. In the cleaning agent composition, the content of water can be 95.5 mass% or more and 99.5 mass% or less, can be 96 mass% or more and 99.3 mass% or less, or can be 96.5 mass% or more and 99 mass% or less. Note that water is not particularly limited as long as it is water used as a raw material for various industrial products, tap water, or the like. Water can be distilled water or ion-exchange water. In one aspect of the present embodiment, the electrical conductivity of water can be 1 to 300 μS / cm, or can be 1 to 100 μS / cm.

[0054] The content of water can be found by analysis using a Karl Fischer moisture meter. The conditions of analysis using a Karl Fischer moisture meter are described below.

[0055] (Analysis conditions of Karl Fischer moisture meter)

[0056] Apparatus: Karl Fischer moisture meter MKS-500 (manufactured by Kyoto Electronics Manufacturing Co., Ltd.).

[0057] Measurement method: volumetric titration method.

[0058] Measurement temperature: 20°C.

[0059] <DIOL ETHER COMPOUND>

[0060] The content rate of the diol ether compound in the cleaner composition can also be 0 mass% or more and 1 mass% or less. Thereby, the cleanability to the water-soluble flux can be further improved, and the drainage load in the case where water is used in the rinsing agent can be further reduced.

[0061] The content rate of the diol ether compound in the cleaner composition can be found by analysis using a gas chromatography method. The conditions of the analysis using the gas chromatography method are described below.

[0062] (Conditions of analysis)

[0063] Apparatus: gas chromatography GC-14B (manufactured by Shimadzu Corporation).

[0064] Detector: thermal conductivity detector (TCD: Thermal Conductivity Detector).

[0065] Column: Thermon-3000 (manufactured by Signal Chemical Industry Co., Ltd.).

[0066] Gasification chamber temperature: 160°C.

[0067] Detector temperature: 160°C.

[0068] <OTHER COMPONENTS>

[0069] The cleaner composition can also contain other components. As the other components, for example, a surfactant, a rust preventive, a pH adjustor, a chelating agent, an evaporation inhibitor, an antifoaming agent, an antioxidant, a perfume, and a preservative can be exemplified.

[0070]

[0071] The pH of the cleaner composition can also be 6 or more and 11 or less. Thereby, the cleaner composition can have more excellent cleanability to the water-soluble flux, and the metal influence can be further reduced. The lower limit of the pH of the cleaner composition can be 6.5 or more, 7 or more, or 7.5 or more. The upper limit of the pH of the cleaner composition can be 10.5 or less, 10 or less, or 9.5 or less. The pH of the cleaner composition can be 6.5 or more and 10.5 or less, or 7 or more and 10 or less.

[0072] The pH of the cleaning agent composition can be determined by the following method. For the cleaning agent composition, the determination can be performed at a determination temperature of 25°C using "Docu-PH" (trademark) manufactured by Sato K.K. as a pH meter.

[0073] <TEMPERATURE>

[0074] The temperature of the cleaning agent composition can also be 20°C or higher and 80°C or lower. Thereby, the water-soluble flux can be cleaned more excellently, the metal influence can be further reduced, and the evaporation of water can be suppressed. The lower limit of the temperature of the cleaning agent composition can be 25°C or higher, 30°C or higher, or 40°C or higher. The upper limit of the temperature of the cleaning agent composition can be 75°C or lower, 70°C or lower, or 60°C or lower. The temperature of the cleaning agent composition can be 25°C or higher and 75°C or lower, 30°C or higher and 70°C or lower, or 40°C or higher and 60°C or lower.

[0075] The temperature of the cleaning agent composition can be determined, for example, by using "Anti-drip digital thermometer CT-450WR" (trademark) manufactured by CUSTOM Co., Ltd. as a thermometer.

[0076] <USE>

[0077] The cleaning method of the present embodiment can be preferably used for removing a water-soluble flux. That is, the cleaning method can also be for water-soluble flux cleaning.

[0078] [Embodiment 2: Method for producing cleaning agent composition]

[0079] The manufacturing method of the cleaning agent composition of the present embodiment includes: a step of preparing a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water; and a step of adding the water-soluble amine compound; at least one compound selected from the group consisting of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid; the ammonium salt of the second organic acid and / or the ammonium salt of the second inorganic acid; and water to the water. In the preparation step, each of the water-soluble amine compound; at least one compound selected from the group consisting of the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid; the ammonium salt of the second organic acid and / or the ammonium salt of the second inorganic acid; and water can be prepared, for example, by purchasing a commercially available product. The addition step can use any method. As the addition step, for example, the following can be listed: "adding a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water to a flask" and "adding a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water in an industrial scale in a chemical plant or the like" and the like.

[0080] [Example]

[0081] Hereinafter, the present application will be described in detail by citing examples, but the present application is not limited thereto.

[0082] [Example 1]

[0083] Preparation of cleaning agent composition

[0084] The cleaning agent compositions of Test Samples 1 to 19 and Test Samples 101 to 108 were prepared as described below.

[0085] <Preparation step>

[0086] As raw materials for preparing the cleaning agent composition of each test sample, a water-soluble amine compound, a first organic acid, a salt of the first organic acid, a first inorganic acid, a salt of the first inorganic acid, an ammonium salt of a second organic acid, an ammonium salt of a second inorganic acid, and water were prepared as described below.

[0087] (Water-soluble amine compound)

[0088] Diethanolamine (compound shown in Formula 1): manufactured by Tokyo Chemical Industry Co., Ltd.

[0089] N-Butyl diethanolamine (compound shown in Formula 1): manufactured by Tokyo Chemical Industry Co., Ltd.

[0090] N-Methyl ethanolamine (compound shown in Formula 1): manufactured by Tokyo Chemical Industry Co., Ltd.

[0091] N-Methyl diethanolamine (compound shown in Formula 1): manufactured by Tokyo Chemical Industry Co., Ltd.

[0092] Triisopropanolamine (compound in which the total number of carbon atoms is 9 or more): manufactured by Tokyo Chemical Industry Co., Ltd.

[0093] (Hydrophobic amine compound)

[0094] Ethylhexylamine: manufactured by Tokyo Chemical Industry Co., Ltd.

[0095] Tricaprylylamine: manufactured by Tokyo Chemical Industry Co., Ltd.

[0096] (Salt of first organic acid)

[0097] Sodium gluconate: manufactured by FUJIFILM Wako Pure Chemical Corporation.

[0098] Sodium citrate: manufactured by FUJIFILM Wako Pure Chemical Corporation.

[0099] (Salt of first inorganic acid)

[0100] Sodium pyrophosphate: manufactured by Yoneyama Chemical Industry Co., Ltd.

[0101] Sodium tripolyphosphate: manufactured by Yoneyama Chemical Industry Co., Ltd.

[0102] Potassium tripolyphosphate: manufactured by Nacalai Tesque, Inc.

[0103] (First organic acid)

[0104] Nitrilotris(methylene phosphonic acid): manufactured by Tokyo Chemical Industry Co., Ltd.

[0105] Citric acid: manufactured by FUJIFILM Wako Pure Chemical Corporation.

[0106] (Ammonium salt of second organic acid)

[0107] Ammonium formate: manufactured by Nacalai Tesque, Inc.

[0108] Ammonium acetate: manufactured by Nacalai Tesque, Inc.

[0109] (Ammonium salt of second inorganic acid)

[0110] Ammonium carbonate: manufactured by Nacalai Tesque, Inc.

[0111] (Glycol ether compound)

[0112] Diethylene glycol monobutyl ether: manufactured by Nacalai Tesque Inc.

[0113] (Water)

[0114] Distilled water.

[0115] (Other components)

[0116] Tetraethylammonium hydroxide: manufactured by Tokyo Chemical Industry Co., Ltd.

[0117] <Adding step>

[0118] Next, the raw materials other than distilled water (water) among the above raw materials were added to the distilled water (water) in accordance with the compositions described in Tables 1 to 7. Note that in the column of "blending composition [mass%]" in Tables 1 to 7, the components indicated by "-" mean that they are not included in the sample.

[0119] [Table 1]

[0120]

[0121] [Table 2]

[0122]

[0123] [Table 3]

[0124]

[0125] [Table 4]

[0126]

[0127] [Table 5]

[0128]

[0129] [Table 6]

[0130]

[0131] [Table 7]

[0132]

[0133] By performing the above procedures, the cleaning agent compositions of Samples 1 to 19 and Samples 101 to 108 having the compositions shown in Tables 1 to 7 were produced.

[0134] <Property evaluation of cleaning method>

[0135] <Cleaning property for water-soluble flux>

[0136] For each of the cleaning methods of the samples, the water-soluble flux cleaning properties were evaluated in the following order.

[0137] (Adjustment of the evaluation sample)

[0138] The evaluation sample for evaluating the water-soluble flux cleaning properties was prepared in the following order. First, a copper plate (20 mm x 40 mm) and "Sparkle Flux WF-6400" (trademark) manufactured by Chiyoda Metal Industry Co., Ltd. as a flux were prepared. Next, the flux was printed on the copper plate. Next, reflow soldering was performed by leaving the copper plate on a hot plate at 250°C for 3 minutes. The evaluation sample was prepared as described above. The sample corresponds to "a water-soluble flux-attached object to be cleaned".

[0139] (Cleaning of the evaluation sample)

[0140] The above-described evaluation sample was immersed in each of the cleaning agent compositions under stirring at 60°C for 10 minutes at 500 rpm. Next, the time until the flux was completely removed from the copper plate (i.e., the cleaning time) was measured by visual observation. Here, the burned portion of the flux was not the target. Next, the cleaning properties of each of the cleaning methods of the samples were evaluated in accordance with the cleaning time and the following criteria. The results obtained are shown in the column of "cleaning properties (60°C)" in Tables 1 to 7. Note that the evaluation results of "A" or "B" mean that the cleaning properties are extremely excellent.

[0141] (Evaluation criteria)

[0142] A: The cleaning time was less than 1 minute.

[0143] B: The cleaning time was 1 minute or more and less than 2 minutes.

[0144] C: The cleaning time was 2 minutes or more and less than 5 minutes.

[0145] D: The cleaning time was 5 minutes or more.

[0146] The cleaning methods of Samples 1 to 19 correspond to the examples. The cleaning methods of Samples 101 to 108 correspond to the comparative examples. It is understood that the cleaning methods of Samples 1 to 19 have extremely excellent "water-soluble flux cleaning properties" as compared with the cleaning methods of Samples 101 to 106 and 108.

[0147] < Metal influence >

[0148] For each of the cleaning methods of the samples, the metal influence on zinc (Zn) was evaluated in the following order.

[0149] A pure zinc plate was immersed in each of the cleaning agent compositions at 60°C for 30 minutes. Subsequently, the pure zinc plate was taken out of the cleaning agent composition and rinsed with water (distilled water). Subsequently, the appearance of the pure zinc plate was observed with a stereoscopic microscope (magnification: 40 times) and the metal influence of the cleaning method of each of the test samples was evaluated according to the following evaluation criteria. The results obtained are shown in the column of "metal influence (Zn, 60°C, 30 minutes)" in Tables 1 to 7. Note that an evaluation result of "A" means that the metal influence was extremely reduced.

[0150] (Evaluation Criteria)

[0151] A: No appearance change was confirmed for 30 minutes.

[0152] B: An appearance change was confirmed for 20 minutes or more and less than 30 minutes.

[0153] C: An appearance change was confirmed for 10 minutes or more and less than 20 minutes.

[0154] D: An appearance change was confirmed for less than 10 minutes.

[0155] It was found that the cleaning method of Test Samples 1 to 19 extremely reduced the metal influence compared to the cleaning method of Test Samples 101 and 107.

[0156] It was found from the above that the cleaning method of Test Samples 1 to 19 had extremely excellent cleaning properties for water-soluble fluxes and extremely reduced the metal influence.

[0157] As described above, the embodiments and examples of the present application were explained, and it was intended from the beginning to appropriately combine the configurations of each of the above-described embodiments and examples.

[0158] It should be considered that the embodiments and examples disclosed herein are illustrative in all respects, rather than restrictive. The scope of the present application is not represented by the above-described embodiments and examples but by the claims, and it is intended to include all modifications within the meaning and range equivalent to the claims.

Claims

1. A cleaning method comprising: a process of cleaning a water-soluble flux-attached object to be cleaned using a cleaning agent composition, the cleaning agent composition contains a water-soluble amine compound; at least one compound selected from the group consisting of a first organic acid, a salt of the first organic acid, a first inorganic acid, and a salt of the first inorganic acid; an ammonium salt of a second organic acid and / or an ammonium salt of a second inorganic acid; and water, the first organic acid and the second organic acid are different organic acids, the first inorganic acid and the second inorganic acid are different inorganic acids, the water-soluble amine compound is a compound represented by Formula 1, the salt of the first organic acid and the salt of the first inorganic acid are salts other than ammonium salts, in the cleaning agent composition, the water-soluble amine compound is contained in an amount of 0.1 mass% or more and 1.5 mass% or less, in the cleaning agent composition, the first organic acid, the salt of the first organic acid, the first inorganic acid, and the salt of the first inorganic acid are contained in a total amount of 0.1 mass% or more and 2 mass% or less, in the cleaning agent composition, the ammonium salt of the second organic acid and the ammonium salt of the second inorganic acid are contained in a total amount of 0.1 mass% or more and 1.5 mass% or less, in the cleaning agent composition, water is contained in an amount of 95 mass% or more and 99.7 mass% or less, In Formula 1, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a hydrocarbon group, or a hydroxyalkyl group, at least one of R 1 , R 2 , and R 3 represents a hydroxyalkyl group, and the total number of carbon atoms in R 1 , R 2 , and R 3 is 8 or less, the cleaning agent composition has a pH of 6 or more and 10 or less at a measurement temperature of 25°C.

2. The cleaning method according to claim 1, wherein in the cleaning agent composition, a glycol ether compound is contained in an amount of 0 mass% or more and 1 mass% or less.

3. The cleaning method according to claim 1 or 2, wherein the water-soluble amine compound is at least one compound selected from the group consisting of diethanolamine, N-butyl diethanolamine, N-methyl ethanolamine, and N-methyl diethanolamine.

4. The cleaning method according to claim 1 or 2, wherein the first organic acid is at least one compound selected from the group consisting of citric acid, gluconic acid, and nitrilo tris (methylene phosphonic acid), the first inorganic acid is pyrophosphoric acid and / or polyphosphoric acid.

5. The cleaning method according to claim 1 or 2, wherein the ammonium salt of the second organic acid is ammonium formate and / or ammonium acetate, the ammonium salt of the second inorganic acid is ammonium carbonate.

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