Chip tape winding device and tape winding method

Abstract

The present invention relates to a chip tape winding device and a tape winding method, comprising: a workbench; a reel, arranged below the workbench, for reeling out the chip carrier tape; a reel, arranged below the workbench and located on one side of the reel, for reeling in the completed chip carrier tape; the adsorption component of the present invention adsorbs the chip in the loading slot, and when the adsorption component moves above the through hole, the driving component drives the adsorption component to move downward along the vertical slot in the track slot until the chip is pressed to the position where the chip carrier tape is placed, and conflicts with it, and under the push of the reaction force, the adsorption tube moves upward to squeeze the spring, and the adsorption tube is in a compressed state, so that a gap is generated between the adsorption tube and the suction tube, so that the external air in the fixed tube enters the adsorption tube through the gap, eliminating the negative pressure in the adsorption tube, and causing the chip adsorbed at the bottom of the adsorption tube to detach.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a chip tape winding device and a tape winding method. Background Art

[0002] Taping machines can be divided into two categories: semi-automatic and fully automatic. They place bulk component products into carrier tape after passing through inspection, reversing, testing and other stations.

[0003] In the existing technology, most of them use a driving part to drive a robot to place the chip in the storage grid of the chip carrier. The robot and the driving part each have a power drive device, resulting in poor linkage between the two, which will cause the chip to be unable to be accurately placed in the storage grid of the chip carrier, and the chip placement position deviation is prone to occur. Therefore, a chip tape winding device and a tape winding method are proposed to solve this problem. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a chip tape winding device and a tape winding method. The specific technical solutions are as follows:

[0005] A chip tape winding device comprises: a workbench;

[0006] An unwinding shaft is provided below the workbench and is used for unwinding the chip carrier tape;

[0007] A reel, disposed below the workbench and located on one side of the unreel, for reeling the completed chip carrier tape;

[0008] A laminating mechanism, disposed above the workbench, for connecting the carrier tape laminating film to the chip carrier tape;

[0009] The placing mechanism comprises a fixed plate arranged on the workbench, a driving assembly arranged on the fixed plate and an adsorption assembly connected to the driving assembly, wherein the fixed plate is provided with a track groove, the track groove is an inverted U-shaped groove body, and the adsorption assembly is driven by the driving assembly to move along the track groove to control the loading and unloading of the chip, the adsorption assembly comprises a fixed tube, an adsorption tube movably plugged into the bottom of the fixed tube and an air suction tube fixedly plugged into the top of the fixed tube, the bottom of the air suction tube extends into the adsorption tube, a spring is wound on the surface of the adsorption tube and located outside the fixed tube, the track groove comprises two groups of vertical grooves, a through hole for the chip carrier to move is provided on the fixed plate and directly below one group of vertical grooves, a loading groove is provided on the workbench and on the other group of vertical grooves, when loading, the adsorption tube conflicts with the chip carrier, so that external air enters from the gap between the adsorption tube and the suction tube, and the control chip is separated from the adsorption tube.

[0010] As an improvement to the above technical solution, a motor 1 is provided on the power end of the reeling shaft, and a transmission belt is provided between the unwinding shaft and the reeling shaft.

[0011] As an improvement of the above technical solution, the driving component includes a rotating shaft rotatably plugged into the fixed plate, a motor 2 is provided at one end of the rotating shaft, a rotating plate is provided at the other end of the rotating shaft, an annular groove is provided on the rotating plate, one end of the adsorption component is provided in the annular groove, and the motor 2 drives the rotating plate to swing back and forth along the width direction of the workbench through the rotating shaft, and the rotating plate drives the adsorption component to move back and forth and up and down along the track groove along the width direction of the workbench through the annular groove, thereby forming loading and unloading of chips.

[0012] As an improvement of the above technical solution, the adsorption assembly also includes a limiting rod arranged on the fixed tube, the end of the limiting rod passes through the annular groove and the track groove in sequence, and the fixed tube is provided with an air inlet hole connected to the external environment.

[0013] As an improvement of the above technical solution, a suction nozzle is provided at the bottom of the adsorption tube, and the diameter of the suction nozzle is larger than the diameter of the adsorption tube. A connecting tube is provided at the top of the adsorption tube, and the diameter of the connecting tube is smaller than the diameter of the adsorption tube. A movable disk adapted to the fixed tube is provided at the top of the connecting tube, and the spring is provided between the fixed tube and the suction nozzle.

[0014] As an improvement of the above technical solution, the bottom of the intake pipe is connected to an enlarged end that is compatible with the connecting pipe. The diameter of the enlarged end is larger than the diameter of the intake pipe. A seal is provided on the surface of the enlarged end and located inside the adsorption tube. The diameter of the seal is larger than the diameter of the connecting pipe.

[0015] A chip tape winding method, using the chip tape winding device described above, comprises the following steps:

[0016] S1: Place the chip carrier tape on the workbench through the through hole from the unwinding shaft;

[0017] S2: Starting the driving assembly, the adsorption assembly is driven by the driving assembly to move along the track groove, and is used to control the loading and unloading of the chip from the loading trough to the chip carrier;

[0018] S3: The chip carrier loaded with chips moves to the bottom of the laminating mechanism, and the laminating mechanism fixes the carrier film on the chip carrier;

[0019] S4: The laminated chip carrier tape is wound up through a winding shaft.

[0020] Beneficial effects of the present invention:

[0021] The chip in the loading trough is adsorbed by the adsorption component. When the adsorption component moves to above the through hole, the driving component drives the adsorption component to move downward along the vertical groove in the track groove until the chip is pressed to the position where the chip carrier is placed, and conflicts with it. Driven by the reaction force, the adsorption tube moves upward to squeeze the spring. The adsorption tube is in a compressed state, so that a gap is generated between the adsorption tube and the suction tube, so that the external air in the fixed tube enters the adsorption tube through the gap, eliminating the negative pressure in the adsorption tube, and causing the chip adsorbed at the bottom of the adsorption tube to detach. The chip can be placed in the specified position and then detached quickly to avoid the problem of inaccurate chip placement caused by untimely detachment of the chip, thereby ensuring smooth chip taping. The adsorption component and the driving component in the device have strong linkage. The chip will not detach until the driving component drives the adsorption component to reach the specified position. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view of the overall structure of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the placement mechanism in the present invention;

[0024] Figure 3 Schematic diagram of the driving mechanism of the present invention;

[0025] Figure 4 Schematic diagram of the structure of the limit block in the present invention;

[0026] Figure 5 Schematic diagram of the structure of the adsorption component in the present invention;

[0027] Figure 6 It is a structural schematic diagram of the adsorption component in the present invention when it is in a compressed state.

[0028] Figure numerals: 10, workbench; 11, loading trough; 20, unwinding shaft; 21, reeling shaft; 22, transmission belt; 30, laminating mechanism; 40, fixed plate; 401, through hole; 41, track groove; 42, limit groove; 43, limit block; 44, fixed tube; 441, air inlet; 442, spring; 443, adsorption tube; 4431, suction nozzle; 4432, connecting tube; 45, rotating plate; 451, annular groove; 46, limit rod; 47, rotating shaft; 48, suction pipe; 481, expanded end; 4811, sealing. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] Example 1

[0031] The chip tape winding device includes: a workbench 10; a reel 20, which is arranged below the workbench 10 and is used to reel the chip carrier tape; a reel 21, which is arranged below the workbench 10 and is located on one side of the reel, and is used to reel in the completed chip carrier tape; a coating mechanism 30, which is arranged above the workbench and is used to connect the carrier tape coating to the chip carrier tape; a placing mechanism, which includes a fixed plate 40 arranged on the workbench, a driving component arranged on the fixed plate 40, and an adsorption component connected to the driving component, wherein a track groove 41 is provided on the fixed plate 40, and the track groove 41 is an inverted U-shaped groove body, and the adsorption component is driven by the driving component to move along the track groove 41 to control the loading and unloading of the chip. The adsorption assembly includes a fixed tube 44, an adsorption tube 443 movably plugged into the bottom of the fixed tube 44, and an air suction tube 48 fixedly plugged into the top of the fixed tube 44. The bottom of the air suction tube 48 extends into the adsorption tube 443. A spring 442 is wound around the surface of the adsorption tube 443 and located outside the fixed tube 44. The track groove 41 includes two groups of vertical grooves. A through hole 401 for the chip carrier to move is provided on the fixed plate 40 and directly below one group of vertical grooves. A loading groove 11 is provided on the workbench 10 and located on the other group of vertical grooves. When loading, the adsorption tube 443 contacts the chip carrier, allowing external air to enter from the gap between the adsorption tube 443 and the air suction tube 48, and the control chip is separated from the adsorption tube 443.

[0032] The chip carrier is passed through the through hole 401 from the unwinding shaft 20 and placed on the workbench 10 and then wound onto the surface of the reeling shaft 21. When the chip needs to be loaded into the chip carrier, the driving component is started, and the driving component drives the adsorption component to move along the track groove 41. Since the track groove 41 is an inverted U-shaped groove, the adsorption component can move up and down and left and right along the track groove 41. When the adsorption component is located at the position of the loading groove 11, the adsorption component is in a free extension state, so the bottom of the adsorption tube 443 is in a negative pressure state, which can adsorb the chip in the loading groove 11. When the adsorption component moves to above the through hole 401, the driving component drives the adsorption component to move downward along the vertical groove in the track groove 41 until it is The chip is pressed to the position where the chip carrier is placed, and it conflicts with it. Under the push of the reaction force, the adsorption tube 443 moves upward to squeeze the spring 442, and the adsorption tube 443 is in a compressed state, so that a gap is generated between the adsorption tube 443 and the suction tube 48, so that the external air in the fixed tube 44 enters the adsorption tube 443 through the gap, eliminating the negative pressure in the adsorption tube 443, so that the chip adsorbed on the bottom of the adsorption tube 443 is detached, and the chip can be placed in the specified position and then detached quickly to avoid the problem of untimely detachment of the chip, resulting in inaccurate chip position placement, ensuring smooth chip taping, and effectively avoiding the problem of the chip not being detached at the specified position. The suction tube is connected to the vacuum generator.

[0033] In one embodiment, reference Figure 1 A motor 1 is provided on the power end of the reel 21, and a transmission belt 22 is provided between the unwinding shaft 20 and the reel 21. The reel 21 can reel and move the chip carrier under the action of the motor 1. Under the action of the transmission belt 22, the unwinding shaft 20 can rotate synchronously, so that the chip carrier on the unwinding shaft 20 releases the chip carrier of the same length, so that the chip carrier maintains the tension, effectively avoiding the problem of chip misplacement due to loose chip carrier.

[0034] In one embodiment, reference Figure 2 、 Figure 3 as well as Figure 4The driving component includes a rotating shaft 47 rotatably plugged into the fixed plate 40, and a motor 2 is provided at one end of the rotating shaft 47, and a rotating plate 45 is provided at the other end of the rotating shaft 47. An annular groove 451 is provided on the rotating plate 45, and one end of the adsorption component is provided in the annular groove 451. The motor 2 drives the rotating plate 45 to swing back and forth along the width direction of the workbench 10 through the rotating shaft 47, and the rotating plate 45 drives the adsorption component to move back and forth and up and down along the track groove 41 along the width direction of the workbench 10 through the annular groove 451, thereby forming the loading and unloading of chips. Specifically, the motor 2 drives the rotating plate 45 to rotate back and forth through the rotating shaft 47, and the rotating plate 45 can drive the adsorption component to move back and forth along the track groove 41 through the annular groove 451 to load and unload chips.

[0035] In one embodiment, reference Figure 3 The adsorption assembly also includes a limit rod 46 fixedly arranged on the fixed tube 44, the end of the limit rod 46 passes through the annular groove 451 and the track groove 41 in sequence, and the fixed tube 44 is provided with an air inlet 441 that is connected to the external environment. Specifically, the fixed tube 44 maintains the same air pressure as the external environment through the air inlet 441, and the rotating plate 45 drives the limit rod 46 to move along the track groove 41, so that the limit rod 46 drives the fixed tube 44 to move along the track groove 41. In order to prevent the fixed tube 44 from deflecting during the movement, a limit groove 42 is provided on the fixed plate 40 and below the track groove 41 along the width direction of the fixed plate 40, and a limit block 43 is movably connected in the limit groove 42. The bottom of the fixed tube 44 passes through the limit block 43 and extends to the bottom of the limit block 43. The fixed tube 44 is movably plugged into the limit block 43, and the fixed tube 44 can move up and down in the limit block 43, so that the fixed tube 44 can move in a vertical state.

[0036] In one embodiment, reference Figure 5 as well as Figure 6The bottom of the adsorption tube 443 is connected to a suction nozzle 4431, and the diameter of the suction nozzle 4431 is larger than the diameter of the adsorption tube 443. The top of the adsorption tube 443 is connected to a connecting tube 4432, and the diameter of the connecting tube 4432 is smaller than the diameter of the adsorption tube 443. The top of the connecting tube 4432 is provided with a movable disk adapted to the fixed tube 44, and the spring 442 is arranged between the fixed tube 44 and the suction nozzle 4431. Specifically, when the adsorption component moves to the top of the through hole 401 under the action of the driving component, the driving component drives the adsorption component to move downward along the vertical groove in the track groove 41 until the suction nozzle 4431 presses the chip to the position where the chip is placed on the chip carrier. , and at the same time, it conflicts with it. Under the push of the reaction force, the suction nozzle 4431 pushes the suction tube 443 to move upward, squeezing the spring 442. The suction tube 443 drives the connecting tube 4432 to move upward, so that the end of the suction tube 48 completely enters the suction tube 443, so that a gap is generated between the connecting tube 4432 and the end of the suction tube 48, and the air inside the fixed tube 44 enters the suction nozzle 4431 through the gap between the connecting tube 4432 and the end of the suction tube 48, releasing the negative pressure state, so that the chip adsorbed by the suction nozzle is detached. After the chip is detached, when the suction tube 443 moves upward along the vertical slot under the action of the driving component, the suction nozzle 4431 will be pushed downward by the restorative elastic force of the spring 442 to return to its initial state. Figure 5 The gap between the connecting pipe 4432 and the end of the suction pipe 48 is gradually eliminated. Therefore, under the action of the suction pipe 48, the suction nozzle 4431 returns to a negative pressure state and returns to the position of the loading trough 11 for loading.

[0037] In one embodiment, reference Figure 5 as well as Figure 6The bottom of the suction pipe 48 is connected to an enlarged end 481 adapted to the connecting pipe 4432. The diameter of the enlarged end 481 is larger than the diameter of the suction pipe 48. A sealing member 4811 is provided on the surface of the enlarged end 481 and is located inside the adsorption tube 443. The diameter of the sealing member 4811 is larger than the diameter of the connecting pipe 4432. Specifically, when the spring 442 is in a free extension state, the enlarged end 481 is located at the connection between the connecting pipe 4432 and the adsorption tube 443, and under the action of the sealing member 4811, the connecting pipe 4432 can be blocked. In order to effectively prevent the air inside the fixed tube 44 from entering the suction nozzle 4431, the suction nozzle 4431 is in a negative pressure state under the action of the suction pipe 48. When the spring 442 is in a compressed state, the adsorption tube 443 moves upward, so that the expanded end 481 is completely located in the adsorption tube 443. Since the diameter of the adsorption tube 443 is larger than the diameter of the expanded end 481, a gap will be generated between the expanded end 481 and the adsorption tube 443, so that the air inside the fixed tube 44 enters the adsorption tube 443 through the connecting tube 4432, thereby relieving the suction nozzle 4431 from being in a negative pressure state.

[0038] Example 2

[0039] A chip tape winding method, using the chip tape winding device described in Example 1, includes the following steps:

[0040] S1: Place the chip carrier tape on the workbench 10 through the through hole from the unwinding shaft 20;

[0041] S2: Start the driving assembly, and the adsorption assembly is driven by the driving assembly to move along the track groove 41 to control the loading and unloading of chips from the loading groove 11 to the chip carrier;

[0042] S3: The chip carrier loaded with chips moves to the bottom of the laminating mechanism 30, and the laminating mechanism 30 fixes the carrier film on the chip carrier;

[0043] S4: The laminated chip carrier tape is wound up by the winding shaft 21 .

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Chip tape winding device, characterized in that, include: Workbench (10); An unwinding shaft (20), arranged below the workbench (10), for unwinding the chip carrier tape; A reel (21) is disposed below the workbench (10) and located on one side of the unreeling shaft, and is used for reeling the completed chip carrier tape; A laminating mechanism (30) is arranged above the workbench and is used to connect the carrier tape laminating film to the chip carrier tape; A placement mechanism, the placement mechanism includes a fixed plate (40) arranged on the workbench, a driving component arranged on the fixed plate (40) and an adsorption component connected to the driving component, the fixed plate (40) is provided with a track groove (41), the track groove (41) is an inverted U-shaped groove body, the adsorption component is driven by the driving component to move along the track groove (41), and is used to control the loading and unloading of the chip, the adsorption component includes a fixed tube (44), an adsorption tube (443) movably plugged into the bottom of the fixed tube (44) and an air suction tube (48) fixedly plugged into the top of the fixed tube (44), the bottom of the air suction tube (48) extends into the adsorption tube (443), the adsorption The surface of the tube (443) is wound with a spring (442) located outside the fixed tube (44), the track groove (41) includes two groups of vertical grooves, and a through hole (401) for the chip carrier to move is provided on the fixed plate (40) and directly below one group of vertical grooves. A loading groove (11) is provided on the workbench (10) and located on the other group of vertical grooves. When loading, the adsorption tube (443) contacts the chip carrier, so that external air enters from the gap between the adsorption tube (443) and the suction tube (48), and the control chip is separated from the adsorption tube (443); the driving component includes a rotating shaft (47) rotatably plugged into the fixed plate (40), and the rotating shaft (4 7) is provided with a second motor at one end, and a rotating plate (45) is provided at the other end of the rotating shaft (47), and an annular groove (451) is provided on the rotating plate (45), and one end of the adsorption component is provided in the annular groove (451), and the second motor drives the rotating plate (45) to swing back and forth along the width direction of the workbench (10) through the rotating shaft (47), and the rotating plate (45) drives the adsorption component to move back and forth and up and down along the width direction of the workbench (10) along the track groove (41) through the annular groove (451), thereby forming a loading and unloading of the chip; the adsorption component also includes a limiting rod (46) provided on the fixed tube (44), and the end of the limiting rod (46) The fixed tube (44) passes through the annular groove (451) and the track groove (41) in sequence, and an air inlet (441) communicating with the external environment is provided on the fixed tube (44); a suction nozzle (4431) is provided at the bottom of the adsorption tube (443), and the diameter of the suction nozzle (4431) is larger than the diameter of the adsorption tube (443); a connecting tube (4432) is provided at the top of the adsorption tube (443), and the diameter of the connecting tube (4432) is smaller than the diameter of the adsorption tube (443); a movable disk adapted to the fixed tube (44) is provided at the top of the connecting tube (4432), and the spring (442) is provided between the fixed tube (44) and the suction nozzle (4431);The bottom of the suction pipe (48) is connected to an expanded end (481) adapted to the connecting pipe (4432), the diameter of the expanded end (481) being larger than the diameter of the suction pipe (48), and a sealing member (4811) being provided on the surface of the expanded end (481) and located inside the adsorption pipe (443), the diameter of the sealing member (4811) being larger than the diameter of the connecting pipe (4432).

2. The chip tape winding device according to claim 1, characterized in that: A motor 1 is provided on the power end of the reeling shaft (21), and a transmission belt (22) is provided between the unwinding shaft (20) and the reeling shaft (21).

3. A chip tape winding method, characterized in that: The chip tape winding device according to any one of claims 1 to 2 comprises the following steps: S1: placing the chip carrier tape on the workbench (10) through the through hole from the unwinding shaft (20); S2: starting the driving component, the adsorption component is driven by the driving component to move along the track groove (41), and is used to control the loading and unloading of the chip from the loading groove (11) to the chip carrier; S3: The chip carrier loaded with chips is moved to the bottom of the laminating mechanism (30), and the laminating mechanism (30) fixes the carrier film on the chip carrier; S4: The chip carrier tape after lamination is rolled up through a roll-up shaft (21).

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