A display panel packaging system and process

Abstract

This invention provides a display panel packaging system and process, belonging to the field of display panel packaging technology; it solves the problems of high cost and low efficiency in existing LED module packaging; it includes a feeding mechanism, a transmission platform, a unloading mechanism, and a curing rack arranged sequentially. The feeding mechanism includes a lower mold feeding position and a feeding robot. A lower mold waiting position is provided on the side of the transmission platform near the feeding mechanism. The transmission platform is arranged from front to back with a glue injection system, a board mounting mechanism, a demolding mechanism, and a mold transfer robot. A first transmission line and a second transmission line are respectively provided on both sides of the transmission platform. The first transmission line is used to sequentially transmit the product to be packaged to the glue injection system, the board mounting mechanism, and the demolding mechanism for corresponding operations. The second transmission line is used to return the demolded upper and lower molds to the corresponding workstations. The glue injection system is located between the feeding mechanism and the board mounting mechanism. This invention is applied to LED module packaging.

Description

Technical Field

[0001] This invention provides a display panel packaging system and process, belonging to the field of display panel packaging technology. Background Technology

[0002] LED screens are a new type of imaging electronic device made by arranging light-emitting diodes (LEDs) in sequence. Due to their high brightness, wide viewing angle, and long lifespan, they are widely used in products such as outdoor advertising screens. The display panel of an LED screen requires the encapsulation of multiple LED modules, and existing encapsulation production lines still have the following shortcomings:

[0003] 1. Existing production lines cannot achieve fully automated production and require manual processes such as film coating, loading and unloading, and curing, resulting in high labor costs;

[0004] 2. Existing release films are single-sided, and manual lamination can result in problems such as being laid backwards, making it impossible to demold the product and causing it to be scrapped;

[0005] 3. The existing process uses a point-damming method for encapsulating the adhesive, which poses a risk of adhesive leakage. Furthermore, the adhesive system for point-damming is different from that for encapsulation, which can easily cause adhesive poisoning, resulting in product defects. Point-damming is also prone to adhesive pulling, causing contamination on the product surface.

[0006] 4. The point-damming method requires a point-damming robot and an adhesive storage mechanism, which further increases equipment costs. The adhesive cannot be reused, resulting in increased material costs.

[0007] 5. The upper and lower molds cannot be used automatically in a continuous cycle;

[0008] 6. Existing process 1 uses a tunnel oven for curing, which has a long production line, occupies a large space, is inefficient, requires a large number of fixtures, can only achieve single-track curing, resulting in heat waste, high equipment power consumption, and further increasing costs.

[0009] 7. The existing process 2 uses room temperature curing, manual handling to the drying rack, and pressing the product with blocks. The product has problems with uneven stress and poor consistency of the thickness of the cured adhesive. The manual handling process is prone to cutting at an angle, causing the adhesive to flow out and resulting in product scrap. Summary of the Invention

[0010] To address the problems of high cost, low efficiency, and difficult process control in existing LED module packaging, this invention proposes a display panel packaging system and process.

[0011] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a display panel packaging system, including a feeding mechanism, a transmission platform, a unloading mechanism and a curing rack arranged in sequence. The feeding mechanism includes a lower mold feeding position and a feeding robot. A lower mold waiting position is arranged on the side of the transmission platform near the feeding mechanism. The lower mold feeding position includes position 1, position 2 and position 3, which are located on the same straight line. Position 1 is used to place the lower mold on the lower mold waiting position. Position 2 is used to stack the lower mold, lower mold fixture, release film and pressing fixture in sequence according to the upper and lower position relationship. Position 3 is used to transfer the stacked lower mold part to the transmission platform.

[0012] The transmission platform is arranged sequentially from front to back as a multi-head injection system, a plate-mounting mechanism, a mold-removing mechanism, and a mold transfer robot. A first transmission line and a second transmission line are respectively arranged on both sides of the transmission platform. The first transmission line is used to sequentially transmit the product to be packaged to the injection system, the plate-mounting mechanism, and the mold-removing mechanism for corresponding operations. The second transmission line is used to return the upper and lower molds after demolding to the corresponding workstations. The injection system is located between the loading mechanism and the plate-mounting mechanism.

[0013] The upper plate mechanism is placed on the transmission platform near the lower mold waiting position on one side of the second transmission line. A plasma cleaning station is set on the other side of the upper plate mechanism, which is located below the transmission platform. An upper mold loading robot is also set above the transmission platform in the X direction of the upper plate mechanism. A vacuum pressing system is set on one side of the upper mold loading robot. The vacuum pressing system presses the upper mold, module and the lower mold part of the transmission.

[0014] The upper plate mechanism includes a multi-layer transfer box. The bottom of the transfer box is a platform with a lifting mechanism at the bottom. Guide columns are set around the platform to fix the direction of platform movement. Sensors are also set on the platform to detect whether there are any abnormalities in the loading process. The inside of the transfer box is lined with soft pads. The module is placed in the transfer box with the light side facing down, and the mold is placed on top of the module.

[0015] A track is provided above the upper plate mechanism, which is used for transporting the upper mold and loading the module.

[0016] The unloading mechanism includes a lifting platform, with a feeding port on one side and a discharging port on the other side. The feeding port is located on one side of the transmission platform. The lifting platform surface is provided with an X-direction transmission line, and the bottom is provided with a lifting mechanism and a Y-direction drive shaft.

[0017] The curing rack includes a multi-layer conveyor system using belt conveyors. Each layer of the conveyor system has a release film device at both ends. The release film device includes a pneumatic shaft and a release film mounted on the pneumatic shaft. The pneumatic shaft is driven by a motor and an encoder. The release film devices at both ends form a release film above the conveyor system to protect the airbags and prevent adhesive adhesion. One of the pneumatic shafts for the two release films is a film feeding device, and the other is a film collecting device. The collecting device cleans residual adhesive from the release film using compressed gas and a scraper. The release film is recyclable. An airbag is located above the release film. A heating platform is located at the bottom of the conveyor system.

[0018] A sensor for detecting the lower mold's position is installed at the bottom of position 1, a sensor for fixing the lower mold in the Y direction is installed at the bottom of position 2, and a sensor for positioning is installed at the bottom of position 3. The loading robot is located above positions 1-3 and is a vacuum suction cup robot used for loading the lower mold fixture, release film, and pressing fixture.

[0019] A display panel packaging process, employing a display panel packaging system, includes the following steps:

[0020] S1. Film Laying and Fixture Loading: The lower mold arrives at position 1 of the lower mold loading station via the second transmission line. At this time, the sensor at position 1 detects whether the lower mold is in place. After it is in place, the loading robot picks up the lower mold and transports it to position 2. After the lower mold is in place, the loading robot stops moving. The loading robot puts the lower mold fixture, release film, and pressing fixture into the lower mold in sequence by vacuum suction. After placement, it is transported to position 3. After placement, the loading robot descends and places the placed lower mold part on the first transmission line and transports it to the back-end station.

[0021] S2. Adhesive injection: Adhesive is injected into the release film by a multi-head adhesive injection system according to the designed adhesive injection path;

[0022] S3, Plate-up: Place the module light face down in the corresponding model transfer box, and transport it to the plate-up station by the transfer vehicle. The multi-layer transfer box is placed in the loading position by the operator. The upper mold loading robot grabs the upper mold to the plate-up position. The upper mold automatically picks up the module and then goes to the plasma cleaning station for cleaning. The plate-up mechanism uses the lifting mechanism at the bottom to make the platform rise and fall according to the set value. When the platform rises to the set position, the upper mold is transported by the track to the top of the platform to pick up the module.

[0023] S4, Plasma Cleaning: After the upper mold picks up the module, it is transported to the cleaning position by the upper mold loading robot. When the cleaning position senses the upper mold and the module, the plasma machine performs the cleaning.

[0024] S5. Pressing: The cleaned module is transported to the top of the mold closing position by the upper mold loading robot. After the sensor detects that the lower mold part has arrived at the mold closing position, the upper mold loading robot moves downward to complete the alignment and locking of the upper and lower molds. Then, the aligned upper and lower molds are placed into the vacuum pressing system for pressing. The vacuum chamber is closed and vacuumed to quickly break the air bubbles in the encapsulating glue and level it. The bottom of the vacuum chamber is equipped with a real-time detection CCD lens. After the degassing is completed, the upper mold base moves downward to press the mold, so that the glue wraps the module. After pressing and checking that there are no abnormalities, the vacuum chamber is opened and the mold is transported to the rear end.

[0025] S6. Mold Separation: Multiple telescopic cylinders are installed on both sides of the mold separation mechanism's transmission line. After the product at the front end is transported to the position, the cylinders drive the mechanical clamps to move in opposite directions to tighten the mold. The pressure sensor detects whether it is tightened. After tightening, the upper and lower mold transfer robot grabs the upper mold and transports it to the second transmission line. The upper mold is transported to the second transmission line by the upper and lower mold transfer robot. The lower mold fixture and the same module are lifted by the bottom cylinder of the first transmission line and pushed to the first transmission line by the upper and lower mold transfer robot, flowing into the unloading mechanism. The lower mold is transported to the second transmission line by the upper and lower mold transfer robot, forming a return flow. The platform inlet of the unloading mechanism is aligned with the first transmission line. The lower mold fixture and the same product are automatically upgraded and displaced by the unloading mechanism to reach the designated curing rack level and are sent into the curing rack belt line.

[0026] S7. Curing: After one layer of the curing rack is filled, curing is carried out. The temperature of the heating platform is adjusted according to the production process requirements and the actual temperature is displayed in real time. The temperature is set according to the curing status of the adhesive. After one layer is filled, the airbag is inflated. When the set pressure is reached, inflation stops and timing begins. After the set time is reached, the airbag is automatically deflated and the module is transported to the next station.

[0027] S8. Inspection: The robotic arm picks up the sealed display panel and takes it to the product appearance inspection station. The CCD camera is used to inspect the sealed display panel for missing or overflowing glue, and then sorts and cuts the panels.

[0028] The advantages of this invention compared to existing technologies are as follows: The feeding mechanism of this invention is equipped with a feeding robot, which can automatically lay the mold, load and unload the mold fixtures and the pressing fixture. The fixtures are recyclable. Replacing the existing point dam with the pressing fixture further reduces costs, and the product reliability and packaging yield are further improved. The curing station adopts a belt conveyor, which can realize the automatic curing of multi-layer products. The curing mechanism is equipped with an airbag to press the product, ensuring the flatness of the product and the consistency of the adhesive thickness during the curing process. A release film mechanism is provided to protect the back of the product and the airbag from adhesive sticking. A release film cleaning station is also provided to ensure that the release film can be recycled. The entire production line of this invention is a fully automated production method, with automatic film laying, loading and unloading, automatic reflow of upper and lower molds, and automatic curing, which simplifies the process, reduces costs, and improves product quality. Attached Figure Description

[0029] The present invention will be further described below with reference to the accompanying drawings:

[0030] Figure 1 This is a schematic diagram of the overall structure of the system of the present invention;

[0031] Figure 2 This is a schematic diagram of the feeding mechanism of the present invention;

[0032] Figure 3 This is a schematic diagram of the upper plate mechanism of the present invention;

[0033] Figure 4 This is a schematic diagram of the transfer box of the present invention;

[0034] Figure 5 This is a schematic diagram of the feeding mechanism of the present invention;

[0035] Figure 6 This is a schematic diagram of the curing rack of the present invention;

[0036] In the diagram: 1 is the transmission platform, 2 is the loading mechanism, 3 is the unloading mechanism, 4 is the curing rack, 101 is the plate-on mechanism, 102 is the glue injection system, 103 is the demolding mechanism, 104 is the upper and lower mold transfer robot, 105 is the lower mold waiting position, 106 is the upper mold waiting position, 107 is the plasma cleaning station, 108 is the vacuum pressing system, 109 is the upper mold loading robot, 110 is the first transmission line, 111 is the second transmission line, 201 is the lower mold loading position, 202 is the loading robot, 203 is the lower mold fixture, 204 is the release film, 205 is the pressing fixture, 206 is... 1011 is the first drive shaft, 202 is the second drive shaft, 208 is the lower mold, 209 is the guide rail, 301 is the lifting platform, 302 is the feed port, 303 is the discharge port, 304 is the X-direction drive shaft, 305 is the lifting mechanism, 306 is the Y-direction drive shaft, 401 is the release film device, 402 is the transport device, 403 is the pneumatic shaft, 404 is the airbag, 405 is the heating platform, 1011 is the upper mold, 1012 is the transfer box, 1013 is the guide pillar, 1014 is the platform, 1015 is the transfer box, 1016 is the soft pad, 1017 is the module, and 1018 is the track. Detailed Implementation

[0037] like Figure 1-6As shown, the present invention provides a display panel packaging system, including a loading mechanism 2, a glue injection mechanism 102, a vacuum pressing system 108, a demolding mechanism 103, a unloading mechanism 3, and a curing rack 4 arranged sequentially. The loading mechanism 2 is used to place the lower mold, lower mold fixture, release film, and pressing fixture sequentially on the waiting station of the loading mechanism 2 to form a whole to be processed. Then, the lower mold, lower mold fixture, release film, and pressing fixture are placed on the first transmission line 110 and transported to the glue injection system 102 for glue injection. After glue injection, it is transported to the pressing waiting station. At the same time, the upper mold loading robot 109 picks up the upper mold 1011 and moves it directly above the upper plate mechanism 101. The upper mold loading robot 109 picks up the module downward and transports it to the plasma cleaning station 107 for plasma cleaning. After cleaning, it is transported to the pressing waiting station to be pressed with the lower mold. Then, the aligned upper and lower molds are placed into the vacuum pressing system 108 for vacuum pressing. The vacuum chamber is closed and a vacuum is drawn to quickly break the air bubbles in the encapsulating glue and allow it to flow smoothly. A real-time detection CCD lens is installed at the bottom of the vacuum chamber. After degassing is completed, the platform 1014 moves downward to press the mold, allowing the glue to wrap the module. After pressing and checking for any abnormalities, the vacuum chamber is opened, and the mold is transported to the rear end. After pressing, the upper and lower molds are removed by the mold removal mechanism 103. The upper and lower molds are transferred to the second transmission line 111 by the upper and lower mold transfer robot 104 and returned to their respective workstations. The pressed lower mold fixture is transferred together with the module to the unloading mechanism 3, and finally transferred to the curing rack 4 for curing.

[0038] The feeding mechanism 2 of the present invention includes a lower mold feeding position 201, a feeding robot 202, a first transmission shaft 206, and a second transmission shaft 207. The first transmission shaft 206 and the second transmission shaft 207 serve as two motion axes of the feeding robot 202. A lower mold waiting position 105 is provided on the side of the transmission platform 1 near the feeding mechanism 2. Multiple lower molds are transported back from the second transmission line 111 on the lower mold waiting position 105. The lower molds on the waiting position 105 are sequentially transported to the lower mold feeding position 201. The lower mold feeding position 201 includes positions 1, 2, and 3, all located on the same straight line. Position 1 is used to place the lower molds on the waiting position 105. Position 2 is used to stack the lower molds, lower mold fixture 203, release film 204, and pressing fixture 205 sequentially according to their hierarchical relationship. Position 3 is used for… The stacked lower mold parts are placed on the first transmission line 110. A fiber optic sensor is set at the bottom of position 1 to detect whether it is in position. A fiber optic sensor is set at the bottom of position 2 to fix the lower mold in the Y direction. A fiber optic sensor is set at the bottom of position 3 for positioning. The loading robot 202 can realize the movement of the X-axis and Y-axis respectively through the first transmission shaft 206 and the second transmission shaft 207. The loading robot 202 transports the lower mold at position 1 to position 2. The loading robot 202 is equipped with a vacuum nozzle. The lower mold fixture 203, release film 204 and pressing film fixture 205 are placed in the lower mold in sequence by vacuum adsorption. The lower mold has 4 guide pillars, 9 magnets and 4 positioning holes. The positioning holes are equipped with push-type buckles, which are composed of positioning holes, buckles, upper mold guide pillars and springs. There are guide grooves in the positioning holes. The buckles cooperate with the guide pillars to lock and pop out. The guide post is used to calibrate the lower mold fixture 203 to ensure that the lower mold fixture 203 is fully in place. The magnet is used to increase the adsorption force between the pressing fixture 205 and the lower mold to ensure no glue leakage and the flatness of the release film 204.

[0039] The transmission platform 1 of the present invention is provided with, from front to back, a glue injection system 102, a platen mechanism 101, a mold disassembly mechanism 103, and an upper and lower mold transfer robot 104. The glue injection system 102 is located between the feeding mechanism 2 and the platen mechanism 101. The lower mold part transmitted by the feeding mechanism 2 to the first transmission line 110 is first injected with glue by the glue injection system 102. The glue injection system 102 can be a mature glue injection machine already available in the LED industry. The present invention will not explain it in detail.

[0040] The upper plate mechanism 101 is placed on the transmission platform 1, located on one side of the second transmission line 111 near the lower mold waiting position 105. On the other side of the upper plate mechanism 101, a plasma cleaning station 107 is provided, on which a plasma cleaning machine is installed. The plasma cleaning station 107 is located directly below the intersection of the second transmission line 111 and the track 1018. Above the transmission platform 1 in the X direction of the upper plate mechanism 101, an upper mold loading robot 109 is also provided. On one side of the upper mold loading robot 109, a vacuum pressing system 108 is provided to vacuum press the upper mold, module and the lower mold part being transported. Then, the upper and lower molds are separated by the mold disassembly mechanism 103, and the lower mold fixture together with the module is transported to the unloading mechanism 3.

[0041] The upper plate mechanism 101 includes a multi-layer transfer box 1012, which is made of plastic. The bottom of the transfer box 1012 is a platform 1014, and a lifting mechanism is provided at the bottom of the platform 1014. The lifting mechanism can be a gear and rack lift. Guide posts 1013 are provided around the platform 1014 to fix the movement direction of the platform 1014. The platform 1014 is also equipped with an optical fiber sensor to detect whether there is any abnormality in the feeding process. The transfer box 1015 is equipped with a soft pad 1016 inside to prevent the module 1017 from being scratched or bumped and causing failure. When the module 1017 is placed, the light side faces down and contacts the soft pad 1016. The upper mold 1011 is finally placed on the module 1017. The upper mold 1011 is equipped with guide posts, and the lower mold is equipped with positioning holes. The lower mold is also equipped with a self-locking mechanism. During pressing, the upper mold 1011 and the lower mold are locked together by the self-locking mechanism.

[0042] The unloading mechanism 3 includes a lifting platform 301. One side of the lifting platform 301 is a feed inlet 302, and the other side is a discharge outlet 303. The feed inlet 302 is located on one side of the transmission platform 1. The bottom of the lifting platform 301 is provided with an X-direction drive shaft 304, a lifting mechanism 305, and a Y-direction drive shaft 306. The lifting platform 301 is lifted and lowered by the lifting mechanism 305, moved forward and backward by the X-direction drive shaft 304, and moved left and right by the Y-direction drive shaft 306.

[0043] The curing rack 4 adopts a belt conveyor method, which can realize the automatic curing of multi-layer products. Each layer includes a transport device 402 and release film devices 401 set at both ends of the transport device 402. The release film device 401 includes a pneumatic shaft 403, which is driven by a motor and an encoder. The motor and encoder can control the length and tension of the release film. A heating platform 405 is set at the bottom of the transport device 402. The temperature of the heating platform 405 can be adjusted according to the production process requirements and the actual temperature is displayed in real time. The temperature can be set according to the curing status of the adhesive. An air bladder 404 is set above the release film to press the module, ensuring the flatness of the module and the consistency of the adhesive thickness during the curing process. After the transport device 402 is full of modules, the air bladder 404 is inflated. When the set pressure is reached, the inflation stops and the timing starts. The air bladder automatically deflates after the set time is reached. A release film cleaning station is also set on one side of the curing rack 4. The residual adhesive on the release film is cleaned by a scraper and vacuum adsorption.

[0044] A top-film device is installed on the first transmission line 110 located at the demolding mechanism 103. This device can lift the lower mold fixture 203 and the pressed module, and then the upper and lower mold transfer robot 109 places the lower mold on the second transmission line 111 and returns it to the lower mold waiting position 105. The top-film device adopts the existing top-film device in the LED industry. At the same time, the vacuum pressing system 108 used in this invention adopts the existing fully automatic vacuum pressing system in the LED industry. Therefore, this invention does not improve the above equipment, and its structure will not be described in detail.

[0045] The process of implementing display panel packaging using the display panel packaging system proposed in this invention is as follows, specifically including:

[0046] S1. Film Laying and Fixture Loading: The lower mold 208 reaches position 1 of the lower mold loading position 201 via the second transmission line 111. At this time, the sensor at position 1 detects whether the lower mold is in position. After it is in position, the loading robot 202 picks up the lower mold 208 and transports it to position 2. Position 2 has guide rails 209 on both sides to fix the X-axis coordinate of the lower mold. A sensor is located at the bottom of position 2 to fix the Y-axis coordinate of the lower mold. After the lower mold is in position, the loading robot 202 stops moving. The loading robot 202 is equipped with a vacuum suction cup, and the Y-axis movement is achieved by forward and reverse rotation of the second transmission shaft 207. The loading robot 202 is equipped with a cylinder, which achieves the up and down Z-axis movement. The lower mold fixture 203, release film 204, and pressing fixture 205 are sequentially placed into the lower mold using an air adsorption method. The lower mold is equipped with 4 guide pillars and 9 magnets. The guide pillars are used to calibrate the lower mold fixture 203 to ensure that the lower mold fixture 203 is fully in place. The magnets are used to increase the adsorption force between the pressing fixture 205 and the lower mold to ensure no glue leakage and the flatness of the release film 204. A CCD lens is installed at position 2 for real-time monitoring to ensure that the placement order and position are correct. After placement, the parts are transported to position 3, which is equipped with a sensor for positioning. After the parts are in place, the loading robot 202 descends and places the lower mold part that has been placed on the first transmission line 110 for transmission to the back-end station.

[0047] S2. Glue Injection: Using a VALAE composite glue-specific dispensing valve for dynamic mixing, the multi-head glue injection robot of the glue injection system 102 evenly injects the pre-mixed glue onto the release film 204. The X, Y, and Z axes of the multi-head glue injection robot are controlled by ball screws, linear guides, and servo motors. The dispensing path and glue volume can be set according to the product model. The glue injection head has an automatic back suction function to prevent glue leakage. The glue is packaged in 40L anti-static packaging bottles, which are directly placed into the equipment. After being mixed evenly by the stirring function, the glue is degassed and then sent to the dispensing valve by a precision quantitative plunger pump. After mixing, the glue is injected into the lower mold release film 204. Multiple lower mold waiting positions 105 are provided behind the glue injection system 102.

[0048] S3, Loading: Place the module light face down in the corresponding model transfer box 1015. The transfer box 1015 has a soft pad 1016 at the bottom to protect the product. The bottom has support and positioning grooves, allowing for multiple stacks. It is transported to the loading station by a transfer cart. The multi-layer transfer box 1015 is manually placed at the loading position. The upper mold loading robot 109 grabs the upper mold 1011 and moves it to the loading position. The upper mold 1011 automatically picks up the module and moves it to the plasma cleaning station 107 for cleaning. The loading mechanism 101 passes through the bottom... The lifting mechanism allows the platform 1014 to rise and fall according to the set value. The guide column 1013 is used to fix the movement direction of the platform 1014. The upper mold 1011 is specifically a flat plate with guide columns at the four corners. When the platform 1014 rises to the set position, the upper mold 1011 is transported to the suction module 1017 directly above the platform 1014 via the track 1018. The platform 1014 is equipped with a fiber optic sensor to detect whether there is any abnormality in the loading process. The upper mold loading robot 109 is composed of a lead screw, a lifting cylinder, and a clamping cylinder.

[0049] S4, Plasma Cleaning: The upper mold loading robot 109 is driven by a servo motor and lead screw to move along the Y-axis to the loading position. The robot moves up and down with the help of a telescopic cylinder. The upper mold 1011 is clamped by a clamping cylinder. After clamping, the upper mold 1011 is transported to the loading position. After the upper mold 1011 picks up the module, it is transported to the cleaning position by the upper mold loading robot 109. When the cleaning position senses the upper mold 1011 and the module, the plasma machine performs the cleaning.

[0050] S5. Pressing: The cleaned module is placed in the mold closing position by the upper mold loading robot 109. After the sensor detects that the lower mold part has reached the mold closing position, the upper mold loading robot 109 moves downward to complete the alignment and locking of the upper and lower molds. The upper mold 1011 is equipped with 4 guide pillars and the lower mold is equipped with positioning holes to automatically correct the alignment and ensure that there is no deviation in the mold closing of the upper and lower molds. Then, the aligned upper and lower molds are put into the vacuum pressing system 108 for pressing.

[0051] S6. Mold Separation: The mold after pressing is separated by the mold disassembly mechanism 103. The lower mold fixture 203 and the mold assembly are lifted by the bottom cylinder of the first transmission line 110 and pushed to the second transmission line 111 by the upper and lower mold transfer robot 104. The unloading mechanism 3 sends them into the curing rack 4 for curing. The upper and lower molds are returned to their respective loading stations. The unloading mechanism 3 is equipped with a lifting platform 301 that can move in three axes (XYZ) and can transfer the mold assembly with the curing transport device 402 on the multi-layer curing rack 4.

[0052] S7. Curing: After one layer is filled, curing is carried out. The curing station adopts a belt conveyor method, which can realize the automatic curing of multi-layer products. Each layer of the curing rack 4 is equipped with an airbag 404 on the transport device 402 to press the product, ensuring the flatness of the module and the consistency of the adhesive thickness during the curing process. A release film device 401 is provided, which uses the cooperation of a motor and a pneumatic shaft 403 to realize the release film winding and unwinding function. The length and tension of the film can be set at any time through the motor and encoder, which is used to protect the back of the module and the airbag 404 from adhesive. A release film cleaning station is also provided, which cleans the residual adhesive on the release film by scraper and vacuum adsorption, ensuring that the release film can be recycled. The transport device 402 is equipped with a heating platform 405, the temperature of which can be adjusted according to the production process requirements and the actual temperature is displayed in real time. The temperature can be set according to the adhesive curing status. After one layer is filled, the airbag 404 is inflated. When the set pressure is reached, inflation stops and timing begins. After the set time is reached, the airbag is automatically deflated and the module is transported to the next station.

[0053] S8. Inspection: The robotic arm picks up the sealed display panel and takes it to the product appearance inspection station. The CCD camera is used to inspect the sealed display panel for missing or overflowing glue, and the panels are sorted and cut into smaller units. The images taken can be saved locally.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel packaging system, comprising, in sequence, a feeding mechanism, a conveying platform, a discharging mechanism and a curing rack, characterized in that: The upper feeding mechanism comprises a lower mold feeding position and a feeding manipulator, and a lower mold waiting position is arranged on one side of the transmission platform close to the upper feeding mechanism; the lower mold feeding position comprises position 1, position 2 and position 3, which are arranged on the same straight line; position 1 is used for placing the lower mold in the lower mold waiting position; position 2 is used for stacking the lower mold, the lower mold fixture, the release film and the film pressing fixture in sequence according to the up-down relationship; and position 3 is used for transmitting the stacked lower mold to the transmission platform. A plurality of head glue injection systems, a plate feeding mechanism, a mold dismounting mechanism and an upper and lower mold transfer manipulator are arranged in sequence on the transmission platform from front to back, and first and second transmission lines are arranged on the two sides of the transmission platform respectively; the first transmission line is used for transmitting the products to be packaged to the glue injection system, the plate feeding mechanism and the mold dismounting mechanism in sequence for corresponding operation; the second transmission line is used for returning the upper mold and the lower mold after mold dismounting to the corresponding position; and the glue injection system is arranged between the upper feeding mechanism and the plate feeding mechanism. The plate feeding mechanism is arranged on the transmission platform on the side of the second transmission line close to the lower mold waiting position, and a plasma cleaning position is arranged on the other side of the plate feeding mechanism; the plasma cleaning position is arranged below the transmission platform; an upper mold feeding manipulator is further arranged above the transmission platform in the X direction of the plate feeding mechanism; a vacuum pressing system is arranged on one side of the upper mold feeding manipulator; and the vacuum pressing system is used for pressing the upper mold, the mold group and the lower mold part. The plate feeding mechanism comprises a plurality of transfer boxes, the bottom of the transfer box is a platform, the bottom of the platform is provided with a lifting mechanism, the periphery of the platform is provided with guide columns for fixing the movement direction of the platform, and sensors for detecting whether there is an abnormality in the feeding process are further arranged on the platform; soft pads are arranged in the transfer box; the mold group is placed in the transfer box with the lamp surface facing downward; and the upper mold is placed above the mold group. A track is arranged above the plate feeding mechanism, and the track is used for upper mold handling and mold group feeding. The discharging mechanism comprises a lifting platform, one side of the lifting platform is an inlet, and the other side is an outlet; the inlet is arranged on one side of the transmission platform; the lifting platform is provided with an X direction transmission line on the surface and a lifting mechanism and a Y direction transmission shaft on the bottom; The curing frame comprises a plurality of transport devices using belt transmission, and each layer of transport device is provided with release film devices at both ends; the release film device comprises a pneumatic shaft and a release film arranged on the pneumatic shaft; the pneumatic shaft is driven by a motor and an encoder; the release film devices at both ends form a layer of release film above the transport device, which is used for protecting the air bag to prevent glue sticking; the pneumatic shafts of the two release film devices are a film placing device and a film collecting device; the film collecting device cleans the release film residue by compressed gas and a scraper; the release film can be recycled; and an air bag is arranged above the release film.

2. The display panel packaging system of claim 1, wherein: The bottom of position 1 is provided with a sensor for detecting the position of the lower mold; the bottom of position 2 is provided with a sensor for fixing the Y direction of the lower mold; the bottom of position 3 is provided with a sensor for positioning; the feeding manipulator is arranged above positions 1-3 and adopts a vacuum suction cup manipulator, which is used for feeding the lower mold fixture, the release film and the film pressing fixture.

3. A display panel packaging process using the display panel packaging system of claim 2, characterized in that: Comprising the following steps: S1, film and jig loading: the lower mold reaches position 1 at the lower mold loading position through the second transmission line at this time, the sensor at position 1 detects whether the lower mold is in place, after being in place, the loading manipulator adsorbs the lower mold and then transports it to position 2, when the lower mold is in place, the loading manipulator stops moving, the loading manipulator puts the lower mold jig, release film and pressing film jig into the lower mold in turn by vacuum adsorption, after the placement is completed, it is transported to position 3, after being in place, the loading manipulator descends, the part of the lower mold that has completed the placement is placed on the first transmission line and is transported to the rear end station; S2, glue injection: a multi-head glue injection system injects glue into the release film according to the designed glue injection path; S3, plate loading: the module lamp is placed downward in the corresponding transfer box, and is transported to the plate loading station by the transfer car, the multi-layer transfer box is placed on the loading position by hand, the upper mold loading manipulator grabs the upper mold to the plate loading position, the upper mold automatically adsorbs the module and then goes to the plasma cleaning station for cleaning, the plate mechanism rises and falls according to the set value by the lifting mechanism at the bottom, when the platform rises to the set position, the upper mold is transported to the platform directly above by the track to adsorb the module; S4, plasma cleaning: after the upper mold adsorbs the module, it is transported to the cleaning position by the upper mold loading manipulator, when the cleaning position senses the upper mold and the module, it is cleaned by the plasma machine; S5, pressing: the cleaned module is transported to the mold closing position directly above by the upper mold loading manipulator and waits, after the sensor senses the lower mold part to the mold closing position, the upper mold loading manipulator moves downward, the upper and lower molds are aligned and locked, then the aligned upper and lower molds are put into the vacuum pressing system for pressing, the vacuum cavity is closed and vacuumized, the bubbles in the packaging glue are quickly broken and flattened, the bottom of the vacuum cavity is provided with a real-time detection CCD lens, when the defoaming is completed, the upper mold moves downward, the mold is pressed tightly, the glue wraps the module, after the pressing, if there is no abnormality, the vacuum cavity is opened, and the mold is transported to the rear end; S6, mold splitting: a plurality of telescopic cylinders are arranged on both sides of the mold splitting mechanism transmission line, after the front end product is transported to position, the cylinder drives the mechanical clamp to move towards each other, the mold is clamped, whether the mold is pressed tightly is sensed by the pressure sensor, after being pressed tightly, the upper mold is grabbed and transported to the second transmission line by the upper and lower mold transfer manipulator, the upper mold is transported to the second transmission line by the upper and lower mold transfer manipulator, the lower mold jig and the module are lifted by the bottom cylinder of the first transmission line and then pushed to the first transmission line by the upper and lower mold transfer manipulator to flow into the unloading mechanism, the lower mold is transported to the second transmission line by the upper and lower mold transfer manipulator, forming a backflow, the inlet of the unloading mechanism platform is aligned with the first transmission line, the lower mold jig and the product are automatically lifted and displaced by the unloading mechanism to reach the specified curing rack level and are sent to the curing rack belt line; S7, curing: after a layer of the curing rack is filled, curing is performed, the temperature of the heating platform is adjusted according to the production process requirement, the actual temperature is displayed in real time, the temperature is set according to the glue curing condition, after a layer is filled, the air bag is inflated, stops when the set pressure is reached, starts timing, automatically exhausts when the set time is reached, the module is transported to the next station; S8, inspection: the robot picks up the sealed display panel to the product appearance detection station, detects whether the sealed display panel has the phenomenon of glue shortage and glue overflow by CCD shooting method and sorts and discharges.

Images