Fully automatic solder dispensing and testing machine

Abstract

This invention relates to a fully automatic soldering, dispensing, and testing integrated machine, comprising a skeleton misalignment feeding mechanism, a first wire feeding mechanism, a first desoldering and wire bonding mechanism, a second wire feeding mechanism, a second desoldering and wire bonding mechanism, a dispensing mechanism, a testing mechanism, a defective product recycling station, and a good product recycling station, all respectively arranged on the outer circumference of a turntable. This invention enables a series of operations on a single machine, including conveying, flipping, positioning, misalignment, active mounting onto the skeleton spindle, wire feeding, wire pressing, wire bonding, desoldering, dispensing, testing, defective product recycling, and good product unloading. It boasts advantages such as high production efficiency, high wire bonding accuracy, good desoldering effect, high dispensing accuracy, and high testing accuracy. Furthermore, it solves the problem of high purchase costs for enterprises caused by the lack of automatic desoldering functionality in existing skeleton welding equipment and the inability to integrate wire bonding, desoldering, dispensing, and testing functions on a single machine.

Description

Technical Field

[0001] This invention relates to the field of soldering machines, and more particularly to a fully automatic soldering dispensing and testing integrated machine. Background Technology

[0002] The processing of the drive frame (frame coil), including wire bonding, adhesive application, and testing, is all done manually. The specific operation method is as follows: First, the worker positions the solder wire at the desired soldering position on the frame. Then, the worker uses a soldering gun to bond the wire to the frame. Because solder residue adheres to the soldering gun during the soldering process, workers must manually clean this residue to ensure uniform solder joint size. After wire bonding, the worker applies adhesive to the frame. After adhesive application, the worker tests the frame by visually inspecting the product's appearance or using testing tools (such as multimeters and magnetoelectric instruments). This method not only suffers from low efficiency, poor wire bonding accuracy, poor bonding effect, poor adhesive application effect, high false positive rate in testing, and low product yield, but also results in high labor intensity for workers and high labor costs for the company, making it unsuitable for large-scale mass production and automated production. Later, some automated wire bonding equipment for skeletons appeared on the market to replace traditional manual wire bonding. Although such equipment can automatically bond wires to skeletons, it generally does not have an automatic desoldering function. In order to ensure that the solder joints of the skeleton are of uniform size, manual intervention is still required to desolder the soldering gun during the wire bonding process. Moreover, after the skeleton is welded, it needs to be manually moved to the dispensing machine and the testing machine for dispensing and testing. That is, it cannot integrate wire bonding, desoldering, dispensing and testing functions into one machine, thus increasing the purchase cost for enterprises to purchase multiple independent machines (such as welding machines, dispensing machines and testing machines). Summary of the Invention

[0003] The technical problem this invention aims to solve is to provide a fully automatic soldering, dispensing, and testing integrated machine. Its overall structural design enables a single machine to perform a series of operations on a single device, including conveying, flipping, positioning, misaligned material distribution, active mounting onto the main shaft of the skeleton, wire feeding, wire pressing, wire bonding, desoldering, dispensing, testing, defective product recycling, and good product unloading. It boasts advantages such as high production efficiency, high wire bonding accuracy, good wire bonding effect, good desoldering effect, high desoldering efficiency, high dispensing accuracy, good dispensing effect, high testing accuracy, and high product yield. Furthermore, it reduces the need for enterprises to purchase [equipment / manufacturing equipment]. This invention effectively solves the problems of low efficiency, poor soldering accuracy, poor soldering effect, poor adhesive application effect, high detection error rate, low product yield, high labor intensity for workers, and high labor costs associated with traditional manual operations such as wire bonding, desoldering, adhesive application, and testing of the skeleton. Furthermore, it addresses the issue of high purchase costs for enterprises due to the lack of automatic desoldering functionality and the inability to integrate wire bonding, desoldering, adhesive application, and testing functions into a single machine in current skeleton welding equipment. This invention is achieved through the following technical solution:

[0004] This fully automatic soldering, dispensing, and testing integrated machine includes a frame misalignment feeding mechanism, a first wire feeding mechanism, a first desoldering and soldering mechanism, a second wire feeding mechanism, a second desoldering and soldering mechanism, a dispensing mechanism, a testing mechanism, a defective product recycling station, and a good product recycling station. These mechanisms are located on the outer circumference of the turntable. Both the defective and good product recycling stations have unloading mechanisms. A defective product recycling unit is located on one side of the unloading mechanism in the defective product recycling station, while a finished product unloading line is located on one side of the unloading mechanism in the good product recycling station. The defective product recycling unit is a defective product recycling box, but this is not a limitation. The finished product unloading line refers to the conveyor line used to transport finished products. Conveyor lines are commonly used components, and their specific structure and working principle are common knowledge, so they will not be explained in detail here.

[0005] When using the above technical solution, skeleton spindles are evenly spaced at equal intervals on the circumference of the turntable. The skeletons are conveyed, flipped, conveyed again after flipping, and distributed in a staggered manner through a skeleton staggered feeding mechanism. The skeletons that have completed staggered distribution are actively fitted onto the skeleton spindles that rotate with the turntable. When the skeleton spindles are passively fitted onto the skeletons and then pass through the first and second desoldering wire bonding mechanisms with the rotation of the turntable, the first wire feeding mechanism is used to feed and supply wires to the first desoldering wire bonding mechanism, and the second wire feeding mechanism is used to feed and supply wires to the second desoldering wire bonding mechanism. Each desoldering wire bonding mechanism can press the wires into the space below it that rotates with the turntable. Within the wire grooves of the bobbin, wires are soldered onto the bobbin, and solder adhered during the soldering process is automatically removed. As the bobbin rotates with the turntable, it passes sequentially through the dispensing mechanism and the testing mechanism. The dispensing mechanism automatically dispenses adhesive onto the wires within the bobbin's wire grooves, while the testing mechanism automatically tests the dispensed bobbin. Bobbins that fail the test enter the defective product recycling station as the turntable rotates, where the unloading mechanism unloads the spindle bobbin from the turntable into the good product recycling box for recycling. Conversely, bobbins that pass the test enter the good product recycling station as the turntable rotates, where the unloading mechanism unloads the bobbin from the turntable onto the finished product unloading line, where it is then conveyed along with the finished product unloading line.

[0006] Preferably, the dispensing mechanism includes a dispensing gun and a dispensing drive device for driving the dispensing gun to move repeatedly in the up-down direction.

[0007] Preferably, the dispensing drive device includes a dispensing sliding assembly. The dispensing gun is mounted on the dispensing sliding assembly via a dispensing bracket. The dispensing bracket and the dispensing gun slide together along the dispensing sliding assembly to set the dispensing unit. Dispensing buffers are respectively provided on both sides of the dispensing bracket. A first material arrival detection unit is provided below the dispensing gun. The dispensing unit is a dispensing cylinder, but is not limited thereto. The first material arrival detection unit is a first material arrival detection optical fiber, but is not limited thereto.

[0008] With the above technical solution, when the first material arrival detection fiber senses that the skeleton rotates to directly below the dispensing mechanism as the turntable rotates, the dispensing gun, along with the dispensing bracket and driven by the dispensing cylinder, moves down along the dispensing sliding assembly to the surface of the skeleton's wire groove and dispenses glue onto the wires on the skeleton. This fixes the wires within the skeleton's wire groove, preventing them from falling out of the skeleton and preparing the skeleton for subsequent inspection. The dispensing buffer limits and buffers the downward movement of the dispensing bracket to prevent the dispensing gun from moving too fast and colliding with the skeleton's main shaft, which is completing the passive assembly of the skeleton, thus damaging the skeleton.

[0009] Preferably, the testing mechanism includes a wire pulling test unit for testing the weld wires of the skeleton, a wire pulling lifting device for driving the wire pulling test unit to move repeatedly in the up-down direction, and a test drive device for driving the wire pulling lifting device to move repeatedly in the straight line direction to achieve the function of combing and straightening the wire. The wire pulling test unit is a wire pulling clamp cylinder, but is not limited to this.

[0010] Preferably, the wire lifting device includes a wire lifting sliding assembly, and the wire testing unit is mounted on the wire lifting sliding assembly via a wire clamping cylinder mounting component. The wire lifting unit is provided to push the wire testing unit and the wire clamping cylinder mounting component to move together along the wire lifting sliding assembly.

[0011] Preferably, the test drive device includes a wire sliding assembly, on which a wire slide block is mounted. A wire lifting unit is installed on the wire slide block, and a wire moving unit is slidably mounted on the wire sliding assembly to push the wire slide block. A wire limiting block is provided on the side of one end of the wire sliding assembly, and a wire buffer is provided on the side of the other end of the wire sliding assembly, with the wire limiting block and the wire buffer being on the same side. The wire lifting unit is a wire lifting cylinder, but is not limited thereto. The wire moving unit is a wire testing cylinder, but is not limited thereto.

[0012] With the above technical solution, when the skeleton rotates to directly below the testing mechanism along with the turntable, the wire clamping cylinder in the testing mechanism, driven by the wire lifting cylinder, rises along the wire lifting sliding assembly to the position of the skeleton and clamps the middle of the wire. Then, the wire testing cylinder pushes the wire slide to move along the wire sliding assembly, so that the wire clamping cylinder, through the wire clamping cylinder mounting piece, moves with the linear movement of the wire slide, can straighten the wire. The wire buffer can limit and buffer the movement of the wire slide, so that the wire clamping cylinder, driven by the wire testing cylinder, can finally clamp the metal wire at the end of the wire during the process of straightening the wire. At this time, when the wire clamping cylinder is energized, the skeleton with the metal wire at the end of the clamped wire can be tested, so as to automatically detect whether the skeleton is a qualified or unqualified product. The structural design of the testing mechanism realizes the automatic clamping of the wire metal end of the skeleton and the testing of qualified and unqualified products.

[0013] Preferably, the first and second wire desoldering mechanisms each include a wire desoldering transverse sliding assembly. A soldering mechanism is provided on the front side of the wire desoldering transverse sliding assembly. A wire desoldering transverse sliding unit is provided on the side of one end of the wire desoldering transverse sliding assembly for driving the soldering mechanism to move repeatedly in a straight line along the wire desoldering transverse sliding assembly. The soldering mechanism is connected and installed to the wire desoldering transverse sliding unit through a wire desoldering lead screw assembly. A desoldering mechanism and a frame fixing mechanism are respectively provided below the soldering mechanism. A wire insertion fixing mechanism is provided above the frame fixing mechanism. The desoldering mechanism is located on the left side of the frame fixing mechanism. The wire desoldering transverse sliding unit is a wire desoldering transverse sliding motor, but is not limited thereto.

[0014] Preferably, the soldering mechanism includes a solder removal transverse sliding plate disposed in front of the solder removal transverse sliding assembly. From top to bottom, a conductor sheet, a wire breakage detection fiber, an upper guide pin, and a lower guide pin are respectively disposed on the upper front side of the solder removal transverse sliding plate. A solder removal longitudinal sliding assembly is installed on the lower front side of the solder removal transverse sliding plate. A solder wire spool is disposed above the conductor sheet. Both the conductor sheet and the wire breakage detection fiber have internal holes for wires to pass through. A gap is formed between the upper guide pin and the lower guide pin, and a pressure point is disposed on one side of this gap. The solder wheel has a solder feeding drive wheel on the other side of the spacing, which is connected to a solder feeding drive unit. A solder wire clamping unit is located on the right side of the solder feeding drive wheel. A solder removal longitudinal sliding plate is located at the front of the solder removal longitudinal sliding assembly. A solder removal longitudinal unit is provided to push the solder removal longitudinal sliding plate repeatedly along the solder removal longitudinal sliding assembly. A soldering gun holder and a solder feeding guide pin bracket are respectively located at the front of the solder removal longitudinal sliding plate. A soldering gun is mounted on the soldering gun holder, and a solder feeding guide pin is mounted on the solder feeding guide pin bracket. The solder feeding drive unit is a solder feeding motor, but is not limited to this. The solder wire clamping unit is a solder wire clamping cylinder, but is not limited to this. The solder removal longitudinal unit is a solder removal longitudinal cylinder, but is not limited to this. A conductor sheet refers to a sheet-like structure used for conductors, but is not limited to this; it can also be a conductor block or conductor plate. Upper guide pin, lower guide pin, and solder feeding guide pin are all functional descriptions of the guide pins. A solder wire spool refers to a cylindrical structure used to store coils of solder wire. The solder pressure roller is a functional description of the pressure roller, and the solder feed drive roller is a functional description of the drive roller. The soldering gun clamp and the solder feed guide pin bracket are functional descriptions of the clamp and the bracket, respectively.

[0015] Preferably, the skeleton fixing mechanism includes a skeleton fixing fixture, a skeleton fixing unit for driving the skeleton fixing fixture to move repeatedly in the vertical direction, and a skeleton incoming material detection unit disposed on one side of the skeleton fixing fixture; the skeleton fixing unit is a skeleton fixing cylinder, but is not limited thereto. The skeleton incoming material detection unit is a skeleton incoming material detection optical fiber, but is not limited thereto.

[0016] Preferably, the wire insertion and fixing mechanism includes a wire fixing plate frame, a wire fixing sliding assembly on one side of the wire fixing plate frame, a wire fixing slide plate mounted on the wire fixing sliding assembly, a wire fixing unit configured to repeatedly move the wire fixing slide plate up and down along the wire fixing sliding assembly, a wire clamping fixture on one side of the wire fixing slide plate, and a wire clamping buffer on the other side of the wire fixing slide plate. The wire fixing unit is a wire fixing cylinder, but is not limited to this.

[0017] Preferably, the desoldering mechanism includes a desoldering sliding assembly, on which a desoldering slide plate is mounted, and on which a desoldering grinding wheel is mounted. A desoldering lifting unit is provided to drive the desoldering slide plate and the desoldering grinding wheel to move up and down along the desoldering sliding assembly. The desoldering grinding wheel is connected to a desoldering drive unit. The desoldering lifting unit is a desoldering lifting cylinder, but is not limited thereto. The desoldering drive unit is a desoldering motor, but is not limited thereto.

[0018] Preferably, both the first and second wire feeding mechanisms include a wire feeding sliding assembly. A wire feeding slide plate is located on the front side of the wire feeding sliding assembly. A wire feeding unit is mounted on one end of the wire feeding sliding assembly, and a wire feeding pulley assembly is connected to one side of the wire feeding unit. The wire feeding slide plate is connected to the wire feeding pulley assembly via a wire feeding screw assembly. A wire lifting sliding assembly is located on the front side of the wire feeding slide plate. A wire lifting slide plate is mounted on the wire lifting sliding assembly. A wire lifting unit is provided to push the wire lifting slide plate along the wire lifting sliding assembly. A wire flipping unit is provided on the wire lifting slide plate, and a wire clamping unit is provided on the wire flipping unit. The wire feeding unit, wire lifting unit, wire flipping unit, and wire clamping unit are respectively a wire feeding motor, a wire lifting cylinder, a wire flipping cylinder, and a wire clamping cylinder, but are not limited thereto. The term "wire feeding pulley assembly" is a functional description of a pulley assembly. The specific composition and working principle of the pulley assembly are common knowledge and will not be explained in detail here.

[0019] After adopting the above technical solution, when the wire feeding motor in each wire feeding mechanism rotates in both directions, it can drive the wire feeding screw assembly to rotate synchronously in both directions through the wire feeding pulley assembly. When the wire feeding screw assembly rotates in both directions, it can drive the wire feeding slide plate to move repeatedly in a straight line along the wire feeding sliding assembly. Meanwhile, the wire lifting slide plate can move up and down along the wire lifting sliding assembly under the drive of the wire lifting cylinder, so that the wire gripper cylinder can move up and down with the wire lifting slide plate. At the same time, the wire gripper cylinder can rotate under the drive of the wire tilting cylinder. That is, under the combined drive of the feeding motor, the wire lifting cylinder, and the wire tilting cylinder, the wire gripper cylinder can move left and right or forward and backward, as well as move up and down and tilt. Driven by the feeding motor, wire lifting cylinder, and wire tilting cylinder, the wire clamping cylinder is moved to one side of the soldering guide pin in the soldering mechanism located on its side. It clamps the wire conveyed from the soldering guide pin and places the wire, after being conveyed and rotated, into the wire groove of the skeleton located on the skeleton fixing fixture. Then, the wire pressing fixture in the wire groove fixing mechanism, driven by the wire fixing cylinder, can press the wire into the wire groove of the skeleton and press the wire to facilitate the wire bonding work on the skeleton. It provides a guarantee of precise positioning for subsequent welding operations between the wire and the skeleton.

[0020] Preferably, the skeleton misalignment feeding mechanism includes a first feeding track and a second feeding track arranged in a straight line. A flipping mechanism is provided connecting the first feeding track and the second feeding track. A second material arrival detection unit is provided at the end of the first feeding track near the flipping mechanism, and a skeleton misalignment material distribution and assembly mechanism is provided at the end of the second feeding track away from the flipping mechanism. The second material arrival detection unit is a second material arrival detection optical fiber, but it is not a limitation thereof.

[0021] Preferably, both the first and second feeding tracks are equipped with direct vibrators, which can feed the skeleton under the vibration of the direct vibrators located below them.

[0022] Preferably, the flipping mechanism includes a flipping bracket, a flipping clamping unit is provided on one side of the upper part of the flipping bracket, and a skeleton flipping unit is provided on the other side of the upper part of the flipping bracket. A flipping buffer is provided on both sides of the flipping clamping unit. The flipping clamping unit is a flipping clamping cylinder, but is not limited thereto. The skeleton flipping unit is a skeleton flipping motor, but is not limited thereto.

[0023] Preferably, the skeleton misalignment and material distribution assembly includes a skeleton sliding component, with a skeleton buffer at one end. A material trough slide is mounted on the skeleton sliding component, and a skeleton feeding unit is configured to repeatedly move the material trough slide along the skeleton sliding component in a straight line. A skeleton dividing plate is mounted on the material trough slide, and a skeleton misalignment and material distribution sliding component is mounted on the side of the dividing plate. A skeleton misalignment and material distribution fixture is mounted on the skeleton misalignment and material distribution sliding component, and a third material arrival detection unit is mounted on one side of the skeleton misalignment and material distribution fixture. A skeleton misalignment and material distribution unit is configured to repeatedly move the skeleton misalignment and material distribution fixture up and down along the skeleton misalignment and material distribution sliding component. The skeleton feeding unit is a skeleton feeding cylinder, but is not limited to this. The third material arrival detection unit is a third material arrival detection fiber optic cable, but is not limited to this. The skeleton misalignment and material distribution unit is a skeleton misalignment and material distribution cylinder, but is not limited to this.

[0024] Preferably, the feeding mechanism includes a feeding transverse sliding assembly, on which a feeding vertical plate is mounted. A feeding transverse moving unit is provided to slide the feeding vertical plate on the feeding transverse sliding assembly. A feeding longitudinal sliding assembly is provided on one side of the feeding vertical plate. A feeding longitudinal cylinder connector is provided on the feeding longitudinal cylinder connector. A skeleton feeding fixture is provided on the feeding longitudinal cylinder connector. A feeding longitudinal moving unit is provided to repeatedly move up and down along the feeding longitudinal sliding assembly, pushing the feeding longitudinal cylinder connector and the skeleton feeding fixture together. The feeding transverse moving unit is a feeding transverse cylinder, but is not limited to this. The feeding longitudinal moving unit is a feeding longitudinal cylinder, but is not limited to this.

[0025] As a preferred option, the first material arrival detection fiber, the second material arrival detection fiber, the third material arrival detection fiber, the wire breakage detection fiber, and the skeleton material arrival detection fiber are all functional descriptions of the fiber optic sensor. They can use the fiber optic sensor of model E3X-ZD11, but are not limited to this.

[0026] As preferred options, the following are functional descriptions of sliding components: dispensing sliding assembly, wire pulling lifting sliding assembly, wire pulling sliding assembly, wire feeding sliding assembly, wire lifting sliding assembly, desoldering wire lateral sliding assembly, desoldering wire lateral sliding assembly, desoldering wire longitudinal sliding assembly, wire fixing sliding assembly, desoldering sliding assembly, skeleton sliding assembly, skeleton misalignment material distribution sliding assembly, unloading lateral sliding assembly, and unloading longitudinal sliding assembly. They all include a slide rail, and a slider is provided on the slide rail. The slide rail is fixedly connected to other components through the slider, but this is not a limitation.

[0027] As preferred options, the following are functional descriptions of cylinders: dispensing cylinder, wire pulling lifting cylinder, wire pulling testing cylinder, wire lifting cylinder, wire flipping cylinder, solder wire clamping cylinder, solder removal and soldering longitudinal cylinder, skeleton fixing cylinder, wire fixing cylinder, solder removal lifting cylinder, skeleton feeding cylinder, skeleton misalignment and material distribution cylinder, unloading lateral cylinder, and unloading longitudinal cylinder. The following are functional descriptions of clamping cylinders: wire clamping cylinder, wire pulling clamping cylinder, and flipping clamping cylinder. The following are functional descriptions of motors: wire feeding motor, solder removal and soldering lateral sliding motor, solder feeding motor, solder removal motor, and skeleton flipping motor. The following are functional descriptions of buffers: dispensing buffer, wire pulling buffer, wire clamping buffer, flipping buffer, and skeleton sleeve buffer. The following are functional descriptions of fixtures: skeleton fixing fixture, wire clamping fixture, skeleton misalignment and material distribution fixture, and skeleton unloading fixture. The following are functional descriptions of slides: material tray slide and wire pulling slide. Both the frame support plate and the unloading support plate are functional descriptions of the support plate. The wire feeding slide plate, wire lifting slide plate, desoldering / soldering transverse slide plate, desoldering / soldering longitudinal slide plate, wire fixing slide plate, and desoldering slide plate are functional descriptions of the slide plates. The wire pull clamp cylinder mounting component, wire pull limit stop, wire fixing plate frame, desoldering grinding wheel, flipping bracket, and unloading longitudinal cylinder connector are functional descriptions of the mounting component, stop, plate frame, grinding wheel, bracket, and connector, respectively. The wire feeding screw assembly and desoldering / soldering screw assembly are functional descriptions of the screw assembly; the specific composition and working principle of the screw assembly are common knowledge and will not be explained in detail here.

[0028] Preferably, the components such as the skeleton misalignment feeding mechanism, the first wire feeding mechanism, the first desoldering and soldering mechanism, the second wire feeding mechanism, the second desoldering and soldering mechanism, the dispensing mechanism, the testing mechanism, the unloading mechanism, and the finished product unloading line are equipped with controllers or control systems for signal control. The controllers are PLC programmable logic controllers. The PLC programmable logic controller can be a programmable logic controller manufactured in Shenzhen and model XDS-40T-D, but this is not a limitation.

[0029] Compared with existing technologies, the beneficial effects of the present invention are as follows: 1. By designing the structure of the skeleton misalignment feeding mechanism, it enables the skeleton to automatically convey, flip, convey after flipping, position, misalign material distribution, and actively mount the skeleton after misalignment material distribution onto the skeleton main shaft; 2. By designing the structure of the first wire feeding mechanism and the second wire feeding mechanism, each wire feeding mechanism can automatically pick up the solder wire conveyed from the solder feeding guide pin in the soldering mechanism and move the solder wire to the wire groove of the skeleton, thereby achieving precise wire feeding to the wire groove of the skeleton and precise positioning of the solder wire to the wire groove of the skeleton, ensuring high precision and good soldering effect in subsequent wire bonding of the skeleton.

[0030] 2. By designing the structure of the first and second desoldering wire bonding mechanisms, the skeleton fixing mechanism in each desoldering wire bonding mechanism, when used in conjunction with the wire insertion fixing mechanism, can fix and limit the bottom and sides of the skeleton and press the wire on the skeleton into the wire groove of the skeleton; each desoldering wire bonding mechanism can perform wire bonding on the skeleton positioned by the skeleton fixing mechanism through the soldering mechanism; and each desoldering wire bonding mechanism can also automatically desolder the soldering gun through the desoldering mechanism, thus solving the problem that the automatic soldering equipment on the market generally does not have the function of automatic desoldering.

[0031] 3. By designing the dispensing mechanism, testing mechanism, and unloading mechanism separately, and integrating them with the skeleton misalignment feeding mechanism, the first wire feeding mechanism, the first desoldering and wire bonding mechanism, the second wire feeding mechanism, and the second desoldering and wire bonding mechanism, a new fully automatic soldering, dispensing, and testing integrated machine can be assembled. This machine can perform a series of operations on a single device, including skeleton conveying, flipping conveying, positioning, misalignment material distribution, active mounting onto the skeleton spindle, wire feeding, wire pressing, wire bonding, desoldering, dispensing, testing, defective product recycling, and good product unloading. It has the advantages of high production efficiency, high wire bonding accuracy, good wire bonding effect, good desoldering effect, high desoldering efficiency, high dispensing accuracy, good dispensing effect, high testing accuracy, and high product yield. This solves the problem of high purchase costs for enterprises caused by the lack of automatic desoldering function and the inability to integrate wire bonding, desoldering, dispensing, and testing functions on a single device in the current skeleton welding equipment market. Attached Figure Description

[0032] For ease of explanation, the present invention will be described in detail below with reference to the preferred embodiments and accompanying drawings.

[0033] Figure 1 This is a perspective view of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0034] Figure 2 This is a perspective view of the dispensing mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0035] Figure 3 This is a perspective view of the testing mechanism of the fully automatic solder dispensing tester of the present invention.

[0036] Figure 4 This is a perspective view of the first wire feeding mechanism or the second wire feeding mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0037] Figure 5 This is a perspective view of the first or second desoldering wire bonding mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0038] Figure 6 This is a perspective view of the soldering mechanism of the fully automatic soldering dispensing and testing integrated machine of the present invention.

[0039] Figure 7 This is an assembly perspective view of the skeleton fixing mechanism and the wire insertion slot fixing mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0040] Figure 8 This is a perspective view of the desoldering mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0041] Figure 9 This is a perspective view of the skeleton misalignment feeding mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0042] Figure 10 This is a perspective view of the flipping mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0043] Figure 11 This is a perspective view of the skeleton misalignment and material distribution assembly mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention.

[0044] Figure 12 This is a perspective view of the unloading mechanism of the fully automatic solder dispensing and testing integrated machine of the present invention. Implementation

[0045] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0047] In this embodiment, refer to Figures 1 to 12 As shown, the fully automatic soldering and dispensing testing integrated machine of the present invention includes a turntable 2, and a skeleton misaligned feeding mechanism 1, a first wire feeding mechanism 21, a first desoldering and soldering mechanism 31, a second wire feeding mechanism 22, a second desoldering and soldering mechanism 32, a dispensing mechanism 4, a testing mechanism 5, a defective product recycling station 6, and a good product recycling station 7, which are respectively arranged on the outer circumference of the turntable 2. Both the defective product recycling station 6 and the good product recycling station 7 are provided with a feeding mechanism 8. A defective product recycling box 9 is provided on one side of the feeding mechanism 8 in the defective product recycling station 6, and a finished product feeding line 3 is provided on one side of the feeding mechanism 8 in the good product recycling station 7.

[0048] In one embodiment, the dispensing mechanism 4 includes a dispensing gun 41 and a dispensing drive device for driving the dispensing gun 41 to move repeatedly in the up-down direction.

[0049] In one embodiment, the dispensing drive device includes a dispensing sliding assembly 42, a dispensing gun 41 is mounted on the dispensing sliding assembly 42 via a dispensing bracket 43, and a dispensing cylinder 44 is set up by pushing the dispensing bracket 43 and the dispensing gun 41 together to slide along the dispensing sliding assembly 42. Dispensing buffers 45 are respectively provided on both sides of the dispensing bracket 43. A first material arrival detection optical fiber 46 is provided below the dispensing gun 41.

[0050] In one embodiment, the testing mechanism 5 includes a wire-pulling finger cylinder 51 for testing the welding wire of the skeleton 16, a wire-pulling lifting device for driving the wire-pulling finger cylinder 51 to move repeatedly in the up-down direction, and a testing drive device for driving the wire-pulling lifting device to move repeatedly in the straight line direction to achieve the function of combing and straightening the wire.

[0051] In one embodiment, the pull-wire lifting device includes a pull-wire lifting sliding assembly 52, a pull-wire clamping cylinder 51 is mounted on the pull-wire lifting sliding assembly 52 via a pull-wire clamping cylinder mounting part 53, and a pull-wire lifting cylinder 54 is provided to push the pull-wire clamping cylinder 51 and the pull-wire clamping cylinder mounting part 53 to move together along the pull-wire lifting sliding assembly 52.

[0052] In one embodiment, the test drive device includes a wire sliding assembly 55, a wire sliding seat 56 is provided on the wire sliding assembly 55, a wire lifting cylinder 54 is installed on the wire sliding seat 56, and a wire test cylinder 57 is provided to push the wire sliding seat 56 to slide on the wire sliding assembly 55; a wire limiting block 58 is provided on the side of one end of the wire sliding assembly 55, and a wire buffer 59 is provided on the side of the other end of the wire sliding assembly 55.

[0053] In one embodiment, both the first wire feeding mechanism 21 and the second wire feeding mechanism 22 include a wire feeding sliding assembly 210. A wire feeding slide plate 211 is provided on the front side of the wire feeding sliding assembly 210. A wire feeding motor 212 is installed on the top of one end of the wire feeding sliding assembly 210. A wire feeding pulley assembly 213 is connected to one side of the wire feeding motor 212. The wire feeding slide plate 211 is connected to the wire feeding pulley assembly 213 through a wire feeding screw assembly 214. A wire lifting sliding assembly 215 is provided on the front side of the wire feeding slide plate 211. A wire lifting slide plate 216 is provided on the wire lifting sliding assembly 215. A wire lifting cylinder 217 is provided to push the wire lifting slide plate 216 to move along the wire lifting sliding assembly 215. A wire tilting cylinder 218 is provided on the wire lifting slide plate 216. A wire gripping cylinder 219 is provided on the wire tilting cylinder 218.

[0054] In one embodiment, the first desoldering wire bonding mechanism 31 and the second desoldering wire bonding mechanism 32 each include a desoldering wire bonding lateral sliding assembly 310. A soldering mechanism 30 is provided on the front side of the desoldering wire bonding lateral sliding assembly 310. A desoldering wire bonding lateral sliding motor 311 is provided on the side of one end of the desoldering wire bonding lateral sliding assembly 310 for driving the soldering mechanism 30 to move repeatedly in a straight line along the desoldering wire bonding lateral sliding assembly 310. The soldering mechanism 30 is connected and installed to the desoldering wire bonding lateral sliding motor 311 through a desoldering wire bonding lead screw assembly 312. A desoldering mechanism 313 and a frame fixing mechanism 314 are respectively provided below the soldering mechanism 30. A wire insertion fixing mechanism 315 is provided above the frame fixing mechanism 314.

[0055] In one embodiment, the soldering mechanism 30 includes a desoldering wire transverse sliding plate 300 disposed in front of the desoldering wire transverse sliding assembly 310. From top to bottom, a wire guide plate 301, a wire breakage detection optical fiber 302, an upper guide pin 303, and a lower guide pin 304 are respectively disposed on the upper front side of the desoldering wire transverse sliding plate 300. A desoldering wire longitudinal sliding assembly 305 is installed on the lower front side of the desoldering wire transverse sliding plate 300. A solder wire spool 306 is disposed above the wire guide plate 301. Both the wire guide plate 301 and the wire breakage detection optical fiber 302 have internal holes for wires to pass through. A gap is formed between the upper guide pin 303 and the lower guide pin 304, and a solder pressure roller 307 is disposed on one side of this gap. On the other side of the spacing, a solder feeding drive wheel 308 is provided, and a solder feeding motor 309 is connected to the solder feeding drive wheel 308; a solder wire clamping cylinder 3091 is provided on the right side of the solder feeding drive wheel 308; a solder wire removing longitudinal sliding plate 3092 is provided on the front side of the solder wire removing longitudinal sliding assembly 305, and a solder wire removing longitudinal cylinder 3093 is provided to push the solder wire removing longitudinal sliding plate 3092 to move repeatedly along the solder wire removing longitudinal sliding assembly 305; a soldering gun clamp 3094 and a solder feeding guide pin bracket 3095 are respectively provided on the front side of the solder wire removing longitudinal sliding plate 3092, a soldering gun 3096 is installed on the soldering gun clamp 3094, and a solder feeding guide pin 3097 is installed on the solder feeding guide pin bracket 3095.

[0056] In one embodiment, the skeleton fixing mechanism 314 includes a skeleton fixing fixture 3141, a skeleton fixing cylinder 3142 for driving the skeleton fixing fixture 3141 to move repeatedly in the vertical direction, and a skeleton material detection optical fiber 3143 disposed on one side of the skeleton fixing fixture 3141.

[0057] In one embodiment, the wire insertion and fixing mechanism 315 includes a wire fixing plate frame 3151, a wire fixing sliding assembly 3152 is provided on one side of the wire fixing plate frame 3151, a wire fixing slide plate 3153 is installed on the wire fixing sliding assembly 3152, a wire fixing cylinder 3154 is provided to push the wire fixing slide plate 3153 to move up and down repeatedly along the wire fixing sliding assembly 3152, a wire clamping fixture 3155 is provided on one side of the wire fixing slide plate 3153, and a wire clamping buffer 3156 is provided on the other side of the wire fixing slide plate 3153.

[0058] In one embodiment, the desoldering mechanism 313 includes a desoldering sliding assembly 3130, a desoldering slide plate 3131 is provided on the desoldering sliding assembly 3130, a desoldering grinding wheel 3132 is provided on the desoldering slide plate 3131, and a desoldering lifting cylinder 3133 is provided to push the desoldering slide plate 3131 and the desoldering grinding wheel 3132 to move up and down along the desoldering sliding assembly 3130. The desoldering grinding wheel 3132 is connected to a desoldering motor 3134, and there are one or more desoldering grinding wheels 3132.

[0059] In one embodiment, the skeleton misalignment feeding mechanism 1 includes a first feeding track 11 and a second feeding track 12 that are linearly distributed. The first feeding track 11 is connected to the second feeding track 12 through a flipping mechanism 13. A second material arrival detection optical fiber 14 is provided at the end of the first feeding track 11 near the flipping mechanism 13, and a skeleton misalignment material distribution assembly mechanism 15 is provided at the end of the second feeding track 12 away from the flipping mechanism 13.

[0060] In one embodiment, the flipping mechanism 13 includes a flipping bracket 131, a flipping clamping cylinder 132 is provided on one side of the upper part of the flipping bracket 131, a skeleton flipping motor 133 is provided on the other side of the upper part of the flipping bracket 131, and flipping buffers 134 are respectively provided on both sides of the flipping clamping cylinder 132.

[0061] In one embodiment, the skeleton misalignment and material distribution assembly 15 includes a skeleton sliding assembly 150, a skeleton buffer 151 at the end of the skeleton sliding assembly 150, a material trough slide 152 on the skeleton sliding assembly 150, a skeleton feeding cylinder 153 for pushing the material trough slide 152 to move repeatedly in a straight line along the skeleton sliding assembly 150; a skeleton dividing plate 154 on the material trough slide 152, a skeleton misalignment and material distribution sliding assembly 155 on the side of the skeleton dividing plate 154, a skeleton misalignment and material distribution fixture 156 on the skeleton misalignment and material distribution sliding assembly 155, a third material arrival detection optical fiber 157 on one side of the skeleton misalignment and material distribution fixture 156, and a skeleton misalignment and material distribution cylinder 158 for pushing the skeleton misalignment and material distribution fixture 156 to move repeatedly up and down along the skeleton misalignment and material distribution sliding assembly 155.

[0062] In one embodiment, the feeding mechanism 8 includes a feeding transverse sliding assembly 80, a feeding vertical plate 81 is provided on the feeding transverse sliding assembly 80, a feeding transverse cylinder 82 is provided to push the feeding vertical plate 81 to slide on the feeding transverse sliding assembly 80, a feeding longitudinal sliding assembly 83 is provided on one side of the feeding vertical plate 81, a feeding longitudinal cylinder connector 84 is provided on the feeding longitudinal sliding assembly 83, a skeleton feeding fixture 85 is provided on the feeding longitudinal cylinder connector 84, a feeding longitudinal cylinder 86 is provided to push the feeding longitudinal cylinder connector 84 and the skeleton feeding fixture 85 to move up and down repeatedly along the feeding longitudinal sliding assembly 83.

[0063] In one embodiment, the process flow of the fully automatic soldering and dispensing testing integrated machine is as follows: the skeleton spindle 10 is first placed on the circumferential edge of the turntable 2. When the turntable 2 rotates under the drive of the servo motor connected to it, it can drive the skeleton spindle 10 to rotate and pass through the skeleton misalignment feeding mechanism 1. The skeleton 16 is conveyed and fed through the first feeding track 11 in the skeleton misalignment feeding mechanism 1. When the first feeding track 11 conveys the skeleton 16 to one end near the flipping mechanism 13, the flipping mechanism 13 can automatically clamp the skeleton 16 from the top of the first feeding track 11, flip the skeleton 16 and place it on the second feeding track 12. When the skeleton 16 passes through the second feeding track 12, the skeleton 16 is conveyed and fed through the second feeding track 12. When the material track 12 is conveyed to the skeleton misalignment and material distribution fixture 156, the skeleton misalignment and material distribution fixture 156 is raised under the drive of the skeleton misalignment and material distribution cylinder 158 to misalign and distribute the skeleton 16. Then, the skeleton 16 located on the skeleton misalignment and material distribution fixture 156 moves along the material trough slide 152 and under the drive of the skeleton loading cylinder 153 in the direction of the skeleton main shaft 10 that rotates with the turntable 2. This allows the skeleton 16 to be actively fitted onto the skeleton main shaft 10, so that the skeleton misalignment and material distribution mechanism 1 can realize the feeding, flipping, and continued feeding, positioning, misalignment and material distribution of the skeleton 16 and the fitting of the skeleton 16 onto the skeleton main shaft 10. After the skeleton 16 is fitted onto the skeleton spindle 10, the skeleton 16 passes over the skeleton fixing mechanism 314 in the first desoldering and wire bonding mechanism 31 and the second desoldering and wire bonding mechanism 32 as the turntable 2 rotates. When the skeleton fixing fixture 3141 in the skeleton fixing mechanism 314 of each desoldering and wire bonding mechanism is raised under the drive of the skeleton fixing cylinder 3142, it can support the bottom of the skeleton 16. When used in conjunction with the wire insertion groove fixing mechanism 315, it can limit and fix the bottom and sides of the skeleton 16, providing a guarantee for precise positioning of the skeleton 16 in subsequent wire bonding operations.

[0064] The first wire feeding mechanism 21 can automatically pick up the wire conveyed by the solder feeding guide pin 3097 in the first desoldering and soldering mechanism 31, and guide the wire to the wire slot position of the skeleton 16 in the first desoldering and soldering mechanism 31 as the turntable 2 rotates. Similarly, the second wire feeding mechanism 22 can automatically pick up the wire conveyed by the solder feeding guide pin 3097 in the second desoldering and soldering mechanism 32, and guide the wire to the wire slot position of the skeleton 16 in the second desoldering and soldering mechanism 32 as the turntable 2 rotates. Then, the wire slot fixing mechanism 315 in each desoldering and soldering mechanism can press the wire into and press it into the skeleton wire slot through the wire pressing fixture 3155 and driven by the wire fixing cylinder 3154. This provides a guarantee for precise positioning of the subsequent wire bonding operation between the wire and the skeleton 16, thereby ensuring high bonding accuracy and good bonding effect of the skeleton 16.

[0065] When the soldering gun 3096 in each soldering mechanism 30 moves downward to the position of the wire in the skeleton wire groove under the drive of the desoldering wire longitudinal cylinder 3093, it can perform wire bonding operation to weld the wire to the skeleton 16; when the tip of the soldering gun 3096 is covered with solder balls generated during the soldering process, each soldering mechanism 30 can be moved to the desoldering mechanism 313 after lateral and downward movement under the joint drive of the desoldering wire transverse sliding motor 311 and the desoldering wire longitudinal cylinder 3093. The side of the desoldering wheel 3132 can automatically desolder the soldering gun 3096 when the desoldering motor 3134 in each desoldering mechanism 313 drives the desoldering wheel 3132 to rotate. After the soldering gun 3096 in each soldering mechanism 30 has finished desoldering, each soldering mechanism 30 is moved back to the frame fixing mechanism 314 after being moved horizontally and downward under the joint drive of the desoldering wire horizontal sliding motor 311 and the desoldering wire vertical cylinder 3093 to continue the wire bonding operation on the frame 16.

[0066] After the wire bonding of the skeleton 16 is completed, the skeleton fixing cylinder 3142 in the skeleton fixing mechanism 314 drives the skeleton fixing fixture 3141 to reset and descend. The skeleton 16 rotates with the rotation of the turntable 2 to be directly below the dispensing mechanism 4. When the first material arrival detection fiber 46 in the dispensing mechanism 4 detects that the skeleton 16 has been delivered to the correct position, it sends a detected signal to the controller. After receiving the signal transmitted by the first material arrival detection fiber 46, the controller controls the dispensing cylinder 44 to start working. The dispensing cylinder 44 drives the dispensing gun 41 to move down to the surface of the skeleton wire groove and perform a dispensing operation on the wire, so that the wire can be firmly attached to the wire groove of the skeleton 16 to prevent the wire from falling out of the skeleton 16. This prepares the skeleton 16 for subsequent inspection operations.

[0067] When the dispensing completed skeleton 16 rotates to the top of the testing mechanism 5 along with the rotation of the turntable 2, the wire clamping cylinder 51 in the testing mechanism 5, driven by the wire lifting cylinder 54, rises along the wire lifting sliding assembly 52 to the position of the skeleton 16 and clamps the middle of the wire. Then, the wire testing cylinder 57 pushes the wire sliding block 56 to move along the wire sliding assembly 55. The wire buffer 59 can limit and buffer the movement of the wire sliding block 56. The wire clamping cylinder 51 moves along the wire sliding block 56 via the wire clamping cylinder mounting part 53. When the device moves, it can straighten and comb the clamped wire. During the process of straightening and combing the wire, the wire clamping cylinder 51 can change from clamping the middle of the wire to clamping the metal wire at the end of the wire. At this time, when the wire clamping cylinder 51 is energized, it can test the skeleton 16 of the metal wire at the end of the wire it clamps, so as to automatically test whether the skeleton 16 is a qualified or unqualified product. The structural design of the testing mechanism 5 enables automatic operation of straightening and combing the wire in the skeleton 16, clamping the metal end of the wire, and testing.

[0068] When the testing mechanism 5 detects that the skeleton 16 is a defective product, the skeleton 16 enters the defective product recycling station 6 as the turntable 2 rotates. When the skeleton unloading fixture 85 in the unloading mechanism 8 of the defective product recycling station 6 is raised under the drive of the unloading longitudinal cylinder 86, it can hold the skeleton spindle 10 in the skeleton 16. Then, since the skeleton unloading fixture 85 is connected to the unloading vertical plate 81 through the unloading longitudinal cylinder connector 84, when the unloading transverse cylinder 82 pushes the unloading vertical plate 81 to move along the unloading transverse sliding assembly 80 towards the defective product recycling box 9, it can drive the skeleton unloading fixture 85 to move synchronously, so that the defective product can be moved to the position of the defective product recycling box 9 for recycling.

[0069] When the testing mechanism 5 detects that the skeleton 16 is a qualified product, the skeleton can be conveyed into the good product recycling station 7 as the turntable 2 rotates. The unloading mechanism 8 in the good product recycling station 7 works on the same principle as the unloading mechanism 8 in the defective product recycling station 6. The unloading mechanism 8 in the good product recycling station 7 is provided with a finished product unloading line 3 on one side, so that the unloading mechanism 8 in the good product recycling station 7 can move the qualified skeleton 16 to the finished product unloading line 3, and the finished product unloading line 3 will convey the material out. Its overall structural design enables a single machine to perform a series of operations on the skeleton, including conveying, flipping conveying, positioning, misaligned material distribution, active assembly onto the skeleton spindle, wire feeding, wire slot pressing, wire bonding, desoldering, dispensing, testing, defective product recycling, and good product unloading. It not only boasts advantages such as high production efficiency, high wire bonding accuracy, good wire bonding effect, good desoldering effect, high desoldering efficiency, high dispensing accuracy, good dispensing effect, high testing accuracy, and high product yield, but also reduces the cost for enterprises to purchase multiple machines with different functions and processing procedures, and lowers labor costs. It reduces labor intensity and lowers labor costs for enterprises, effectively solving the problems of low efficiency, poor wire bonding accuracy, poor wire bonding effect, poor adhesive dispensing effect, high detection error rate, low product yield, high labor intensity for workers, and high labor costs associated with traditional manual wire bonding, desoldering, adhesive dispensing, and testing of the skeleton. It also solves the problem of high purchase costs for enterprises caused by the lack of automatic desoldering function in the current skeleton welding equipment on the market and the inability to integrate wire bonding, desoldering, adhesive dispensing, and testing functions into one machine.

[0070] The above embodiments are merely examples of the present invention and are not intended to limit the implementation and scope of the present invention. All technical solutions that are the same as or equivalent to the contents described in the claims of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic solder dispensing and testing integrated machine, characterized in that: It includes a skeleton misalignment feeding mechanism, a first wire feeding mechanism, a first desoldering and wire bonding mechanism, a second wire feeding mechanism, a second desoldering and wire bonding mechanism, a dispensing mechanism, a testing mechanism, a defective product recycling station and a good product recycling station, which are respectively set on the outer circumference of the turntable. Both the defective product recycling station and the good product recycling station are equipped with a feeding mechanism. The good product recycling station has a finished product feeding line on one side of the feeding mechanism. The dispensing mechanism includes a dispensing gun and a dispensing drive device for driving the dispensing gun to move repeatedly in the up and down direction. The testing mechanism includes a wire pulling test unit for testing the welding wires of the skeleton, a wire pulling lifting device for driving the wire pulling test unit to move repeatedly in the up and down direction, and a test drive device for driving the wire pulling lifting device to move repeatedly in the straight line direction so as to straighten and comb the wires. The first and second wire desoldering mechanisms each include a wire desoldering transverse sliding assembly. A soldering mechanism is provided on the front side of the wire desoldering transverse sliding assembly. A wire desoldering transverse sliding unit is provided on the side of one end of the wire desoldering transverse sliding assembly for driving the soldering mechanism to move repeatedly in a straight line along the wire desoldering transverse sliding assembly. The soldering mechanism is connected and installed to the wire desoldering transverse sliding unit through a wire desoldering lead screw assembly. A desoldering mechanism and a frame fixing mechanism are respectively provided below the soldering mechanism. A wire insertion groove fixing mechanism is provided above the frame fixing mechanism. The soldering mechanism includes a lateral sliding plate for removing solder wire, located in front of the lateral sliding assembly. From top to bottom, the upper front side of the lateral sliding plate is equipped with a conductor plate, a fiber optic cable for detecting wire breakage, an upper guide pin, and a lower guide pin. A longitudinal sliding assembly for removing solder wire is installed on the lower front side of the lateral sliding plate. A solder wire spool is located above the conductor plate. Both the conductor plate and the fiber optic cable for detecting wire breakage have internal holes for wire to pass through. A gap is formed between the upper and lower guide pins, and a solder pressure roller is located on one side of this gap. On the other side of the spacing, there is a solder feeding drive wheel, which is connected to a solder feeding drive unit; a solder wire clamping unit is provided on the right side of the solder feeding drive wheel; a solder removal soldering longitudinal sliding plate is provided on the front side of the solder removal soldering longitudinal sliding assembly, and a solder removal soldering longitudinal unit is provided to push the solder removal soldering longitudinal sliding plate to move repeatedly along the solder removal soldering longitudinal sliding assembly; a soldering gun clamp and a solder feeding guide pin bracket are respectively provided on the front side of the solder removal soldering longitudinal sliding plate, a soldering gun is installed on the soldering gun clamp, and a solder feeding guide pin is installed on the solder feeding guide pin bracket; The skeleton misaligned feeding mechanism includes a first feeding track and a second feeding track that are linearly distributed. A flipping mechanism is provided between the first feeding track and the second feeding track. A second material arrival detection unit is provided at the end of the first feeding track near the flipping mechanism. A skeleton misaligned material distribution and assembly mechanism is provided at the end of the second feeding track away from the flipping mechanism. The flipping mechanism includes a flipping bracket, a flipping clamping unit is provided on one side of the upper part of the flipping bracket, a skeleton flipping unit is provided on the other side of the upper part of the flipping bracket, and flipping buffers are provided on both sides of the flipping clamping unit. The skeleton misalignment and material distribution assembly includes a skeleton sliding component, a skeleton buffer at the end of the skeleton sliding component, a material trough slide on the skeleton sliding component, and a skeleton feeding unit that pushes the material trough slide to move repeatedly in a straight line along the skeleton sliding component; a skeleton dividing plate on the material trough slide, a skeleton misalignment and material distribution sliding component on the side of the skeleton dividing plate, a skeleton misalignment and material distribution fixture on the skeleton misalignment and material distribution sliding component, a third material arrival detection unit on one side of the skeleton misalignment and material distribution fixture, and a skeleton misalignment and material distribution unit that pushes the skeleton misalignment and material distribution fixture to move repeatedly up and down along the skeleton misalignment and material distribution sliding component.

2. The fully automatic solder dispensing and testing integrated machine according to claim 1, characterized in that: The dispensing drive device includes a dispensing sliding assembly. The dispensing gun is mounted on the dispensing sliding assembly via a dispensing bracket. The dispensing bracket and the dispensing gun are pushed to slide together along the dispensing sliding assembly to set the dispensing unit. Dispensing buffers are respectively set on both sides of the dispensing bracket. A first material arrival detection unit is set below the dispensing gun. The wire lifting device includes a wire lifting sliding assembly. The wire test unit is mounted on the wire lifting sliding assembly via a wire clamping cylinder mounting component. The wire lifting unit is provided to push the wire test unit and the wire clamping cylinder mounting component to move together along the wire lifting sliding assembly. The test drive device includes a wire sliding assembly, on which a wire slide block is provided, and a wire moving unit is provided to push the wire slide block to slide on the wire sliding assembly; a wire limiting block is provided on the side of one end of the wire sliding assembly, and a wire buffer is provided on the side of the other end of the wire sliding assembly.

3. The fully automatic solder dispensing and testing integrated machine according to claim 1, characterized in that: Both the first and second wire feeding mechanisms include a wire feeding sliding assembly. A wire feeding slide plate is provided on the front side of the wire feeding sliding assembly. A wire feeding unit is installed on the top of one end of the wire feeding sliding assembly. A wire feeding pulley assembly is connected to one side of the wire feeding unit. The wire feeding slide plate is connected to the wire feeding pulley assembly through a wire feeding screw assembly. A wire lifting sliding assembly is provided on the front side of the wire feeding slide plate. A wire lifting slide plate is provided on the wire lifting sliding assembly. A wire lifting unit is provided to push the wire lifting slide plate to move along the wire lifting sliding assembly. A wire flipping unit is provided on the wire lifting slide plate. A wire clamping unit is provided on the wire flipping unit.

4. The fully automatic solder dispensing and testing integrated machine according to claim 1, characterized in that: The skeleton fixing mechanism includes a skeleton fixing fixture, a skeleton fixing unit for driving the skeleton fixing fixture to move repeatedly in the vertical direction, and a skeleton material inspection unit disposed on one side of the skeleton fixing fixture. The wire insertion and fixing mechanism includes a wire fixing plate frame, a wire fixing sliding assembly is provided on one side of the wire fixing plate frame, a wire fixing slide plate is installed on the wire fixing sliding assembly, a wire fixing unit is provided by pushing the wire fixing slide plate up and down repeatedly along the wire fixing sliding assembly, a wire clamping fixture is provided on one side of the wire fixing slide plate, and a wire clamping buffer is provided on the other side of the wire fixing slide plate.

5. The fully automatic solder dispensing and testing integrated machine according to claim 1, characterized in that: The desoldering mechanism includes a desoldering sliding assembly, a desoldering slide plate, and a desoldering grinding wheel. A desoldering lifting unit is provided to drive the desoldering slide plate and the desoldering grinding wheel to move up and down along the desoldering sliding assembly. The desoldering grinding wheel is connected to a desoldering drive unit.

6. The fully automatic solder dispensing and testing integrated machine according to claim 1, characterized in that: A defective product recycling unit is provided on one side of the unloading mechanism in the defective product recycling station. The unloading mechanism includes an unloading lateral sliding assembly, an unloading vertical plate is provided on the unloading lateral sliding assembly, and an unloading lateral moving unit is provided to push the unloading vertical plate to slide on the unloading lateral sliding assembly. An unloading longitudinal sliding assembly is provided on one side of the unloading vertical plate, an unloading longitudinal cylinder connector is provided on the unloading longitudinal cylinder connector, and a skeleton unloading fixture is provided on the unloading longitudinal cylinder connector. An unloading longitudinal moving unit is provided to push the unloading longitudinal cylinder connector and the skeleton unloading fixture to move up and down repeatedly along the unloading longitudinal sliding assembly.

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