A method and apparatus for testing the bond strength of semiconductor products

Abstract

A method and device for testing the bonding strength of semiconductor products, wherein the device comprises a mounting plate, a substrate bearing mechanism, a high-speed moving device and a driving assembly, the substrate bearing mechanism and the high-speed moving device are arranged on the mounting plate, a buffer spring is arranged between the bottom of the substrate bearing mechanism and the mounting plate, and the high-speed moving device drives the substrate bearing mechanism to move downward along the Z-axis direction at high speed; a clamp assembly of the substrate bearing mechanism is used to fix a substrate with a measured object; a pulling force clamp of a testing tool is used to clamp the measured object; and the pulling force clamp and the measured object are kept stationary; the high-speed moving device drives the clamp assembly and the substrate to move downward at high speed, so as to pull the measured object off the substrate. Since only the measured object of the measured sample and the substrate of the substrate need to move during the test, and the measured object is fixed, the present application is easier to realize a repeatable and stable test in technology, and the test reliability is higher.

Description

Technical Field

[0001] This invention relates to methods and apparatus for testing the electrical bonding of semiconductors, and more particularly to methods and apparatus suitable for high-speed tensile testing. Background Technology

[0002] Semiconductor electrically bonded circuits typically consist of a series of solder balls or gold balls on a substrate having circuitry. These balls are used to connect individual wires to pathways, or to pathways on another substrate when the substrates are aligned and contacted.

[0003] Testing equipment is needed to confirm that the ball has sufficient mechanical adhesion to the substrate, thereby confirming the durability of the manufacturing technique. Shear tests are known to be performed by driving a tool along the side of the ball, and tensile tests are performed by clamping and stretching the ball orthogonally to the substrate.

[0004] Individual spheres are typically arranged in a row and are very small. Solder spheres are typically 1000-75µm in diameter, while gold spheres are 100-20µm in diameter. When these "spheres" are attached to a substrate, they have a slightly hemispherical appearance. The very small size of some solder spheres and gold spheres means that their fracture force is very small, requiring special measuring equipment and methods to measure it.

[0005] For example, the high-speed tensile testing apparatus and method disclosed in Chinese patent document CN1950689A involves clamping a ball (solder ball or gold ball) and rapidly moving it in a direction substantially orthogonal to the adhesion plane. The substrate is abruptly stopped by a stop portion to apply a sudden load to the interface between the ball and the substrate, thereby measuring the breaking force between the ball and the substrate.

[0006] The problem with the above method is that it is difficult to ensure that the force-generating device (such as a cylinder or similar device with a tensile function) and the clamping tool move synchronously, which leads to low accuracy of test results, difficulty in determining the effective test time, and the sample itself is likely to be stretched or compressed prematurely when the required pull-out test speed is reached; thus, it is impossible to achieve repeatable and stable testing from a technical point of view; and the test reliability is low. Summary of the Invention

[0007] To address the aforementioned problems, this invention provides a method and apparatus for testing the bonding strength of semiconductor products that is technically easier to achieve with repeatable and stable testing and has high testing reliability.

[0008] The technical solution of this invention is: to provide a method for testing the bonding strength of semiconductor products, comprising the following steps:

[0009] S1. Fix the substrate with the test object to the fixture assembly;

[0010] S2. Use a testing tool to cooperate with the object under test, so that the testing tool and the object under test are fixedly connected, and keep the testing tool and the object under test stationary;

[0011] S3. A high-speed moving device is used to drive the clamp assembly and the substrate to move downwards at an instantaneous acceleration, thereby pulling the object to be tested off the substrate.

[0012] S4. Measure the bonding force at the interface between the test object and the substrate.

[0013] As an improvement to the present invention, the high-speed moving device drives the clamping assembly and the base plate to move downward at high speed by rapidly squeezing the inclined surface of the wedge block.

[0014] As an improvement to the present invention, the high-speed moving device drives the clamping assembly and the substrate to move downward at high speed by rapidly impacting the first striking block.

[0015] This invention also provides an apparatus for testing the bonding strength of semiconductor products, including a mounting plate, a substrate support mechanism, a high-speed moving device, and a driving assembly. The substrate support mechanism and the high-speed moving device are mounted on the mounting plate. The high-speed moving device drives the substrate support mechanism to move rapidly downward along the Z-axis direction via the driving assembly. In use, a substrate with the test object is fixed to the clamping assembly of the substrate support mechanism; the tensile clamp of the testing tool clamps the test object; and the tensile clamp and the test object remain stationary; the high-speed moving device drives the clamping assembly and the substrate to move downward at an instantaneous acceleration, thereby pulling the test object off the substrate.

[0016] As an improvement to the present invention, the substrate carrying mechanism includes a clamping assembly, a connecting plate is provided on the lower bottom surface of the clamping assembly, the connecting plate is disposed on a Z-guide rail and moves up and down along the Z-guide rail; a buffer spring is provided between the bottom of the substrate carrying mechanism and the mounting plate.

[0017] As an improvement to the present invention, the drive assembly includes a drive assembly body, a drive wheel, and a wedge block. The drive wheel is horizontally disposed on the drive assembly body, and the wedge block is disposed at the lower part of the connecting plate. The drive assembly body is located on the linear guide rail of the mounting plate. The wedge block and the drive wheel are configured such that when the drive wheel moves horizontally, the drive wheel presses against the inclined surface of the wedge block, causing the connecting plate to move downward at high speed.

[0018] As an improvement to the present invention, the high-speed moving device includes a motor and a synchronous pulley assembly, the motor drives the synchronous pulley assembly to move, and the main body of the driving assembly is connected to the belt of the synchronous pulley assembly.

[0019] As an improvement to the present invention, the driving component includes a driving component body, an active striking block and a passive striking block. The active striking block is slidably disposed on the driving component body via a Z-axis slider, and the passive striking block is disposed at the lower part of the connecting plate. The active striking block and the passive striking block are configured such that when the active striking block moves vertically downward, the active striking block strikes the passive striking block, causing the connecting plate to move downward at high speed.

[0020] As an improvement to the present invention, the high-speed moving device includes a motor and a synchronous pulley assembly, the motor driving the synchronous pulley assembly to move, and the Z-axis slider being connected to the belt of the synchronous pulley assembly.

[0021] As an improvement to the present invention, the present invention further includes a pressure holding cylinder, which is adjacent to the substrate support mechanism.

[0022] Because this invention employs a method where only the test sample and the substrate in the substrate need to move during the testing process, while the test sample remains fixed, it is technically easier to achieve repeatable and stable testing, resulting in higher test reliability.

[0023] In addition, since the present invention only needs to realize the movement of a single part of the substrate support mechanism, the control system and algorithm logic of the present invention are simpler and more reliable. Attached Figure Description

[0024] Figure 1 This is a block diagram of the method of the present invention.

[0025] Figure 2 This is a three-dimensional structural schematic diagram of the first embodiment of the device of the present invention.

[0026] Figure 3 yes Figure 2 A three-dimensional structural diagram from another perspective.

[0027] Figure 4 yes Figure 2 The illustrated embodiment is a schematic diagram of its usage state.

[0028] Figure 5 This is a schematic diagram of the planar structure of the second embodiment of the device of the present invention. Detailed Implementation

[0029] The present invention will be illustrated below using the example of tearing a conductive ball off a substrate. Of course, in addition to tearing a conductive ball off a substrate, the present invention can also be used to test the bonding performance of two different types of materials. The test object in the present invention includes, but is not limited to, a conductive ball. The tool used to fix the test object is, but is not limited to, a tension clamp, or any structure that can fix the test object.

[0030] Please see Figure 1 , Figure 1 This discloses a method for testing the bonding strength of semiconductor products, comprising the following steps:

[0031] S1. Fix the substrate with conductive balls to the clamp assembly; the clamp assembly includes a fixed clamp plate and a movable clamp plate. The movable clamp plate can reciprocate relative to the fixed clamp plate under the control of the adjusting handle, so as to fix the substrate to the clamp assembly and thus achieve relative fixation of the substrate.

[0032] S2. Using a testing tool, cooperate with the conductive ball to clamp the conductive ball with the tension clamp of the testing tool; and keep the tension clamp and the conductive ball stationary; the testing tool and its tension clamp are existing technologies, wherein the tension clamp is a component of the testing tool, and will not be described in detail here;

[0033] S3. A high-speed moving device is used to drive the clamp assembly and the substrate to move downwards at an instantaneous acceleration, thereby pulling the conductive ball off the substrate.

[0034] S4. Measure the bonding force at the interface between the conductive ball and the substrate; the method for testing the bonding force is existing technology and will not be described in detail here.

[0035] This invention, by employing a method where only the conductive ball of the tested sample and the substrate within the substrate need to move during the testing process, while the conductive ball remains stationary, technically facilitates more repeated and stable testing, resulting in higher test reliability. Furthermore, since this invention only requires the movement of a single part of the substrate-supporting mechanism, its control system and algorithm logic are simpler and more reliable.

[0036] Preferably, the high-speed moving device drives the clamp assembly and the base plate to move downward at high speed by rapidly squeezing the inclined surface of the wedge block.

[0037] Preferably, the high-speed moving device drives the clamp assembly and the substrate to move downward at high speed by rapidly impacting the first striking block.

[0038] Please see Figures 2-4 , Figures 2-4This invention discloses a first embodiment of an apparatus for testing the bonding strength of semiconductor products, comprising a mounting plate 1, a substrate support mechanism 2, a high-speed moving device 3, and a driving assembly 4. The substrate support mechanism 2 and the high-speed moving device 3 are mounted on the mounting plate 1. A buffer spring 5 is provided between the bottom of the substrate support mechanism 2 and the mounting plate 1. In this embodiment, the buffer spring 5 includes a first buffer spring 51 and a second buffer spring 52, which are spaced apart by a predetermined distance. The high-speed moving device 3 drives the substrate support mechanism 2 to move rapidly downward along the Z-axis direction via the driving assembly 4. In use, a substrate 6 with conductive balls 61 is fixed to the clamp assembly 21 of the substrate support mechanism 2; the testing tool 7 (see...) Figure 4 The tension clamp 71 clamps the conductive ball 61; and keeps the tension clamp 71 and the conductive ball 61 stationary; the high-speed moving device 3 drives the clamp assembly 21 and the substrate 6 to move downwards at an instantaneous acceleration, thereby pulling the conductive ball 61 off the substrate 6.

[0039] In this embodiment, the clamping assembly 21 includes a fixed clamping plate 211 and a movable clamping plate 212. The movable clamping plate 212 can reciprocate relative to the fixed clamping plate 211 under the control of the adjusting handle 213, thereby fixing the substrate 6 to the clamping assembly 21 and thus achieving relative fixation of the substrate 6.

[0040] Preferably, the substrate carrying mechanism 2 includes a clamping assembly 21, and a connecting plate 22 is provided on the lower bottom surface of the clamping assembly 21. The connecting plate 22 is disposed on the Z-guide rail 23 and moves up and down along the Z-guide rail 23. The buffer spring 5 is disposed at the lower part of the connecting plate 22. The function of the buffer spring 5 is to buffer the substrate carrying mechanism 2 when it moves downward, and appropriately reduce the downward speed of the substrate carrying mechanism 2.

[0041] Preferably, the drive assembly 4 includes a drive assembly body 41, a drive wheel 42, and a wedge block 43. The drive wheel 42 is horizontally disposed on the drive assembly body 41, and the wedge block 43 is disposed on the lower part of the connecting plate 22. The drive assembly body 41 is disposed on a linear guide rail 44 and can reciprocate along the linear guide rail 44. The linear guide rail 44 is disposed on the mounting plate 1. The wedge block 43 and the drive wheel 42 are configured such that when the drive wheel 42 moves horizontally, the drive wheel 42 presses against the inclined surface 431 of the wedge block 43, causing the connecting plate 22 to move downward at high speed.

[0042] Preferably, the high-speed moving device 3 includes a motor 31 and a synchronous pulley assembly 32. The motor 31 drives the synchronous pulley assembly 32 to move, and the main body 41 of the driving assembly is connected to the belt 321 of the synchronous pulley assembly 32. In this embodiment, the motor 31 can be a servo motor to facilitate system control.

[0043] As needed, the synchronous belt pulley assembly 32 in this invention can be replaced by a lead screw and nut structure; the high-speed moving device 3 in this invention can be replaced by a cylinder. When the high-speed moving device 3 is a cylinder, the cylinder can directly act on the drive assembly body 41; the high-speed moving device 3 in this invention can be replaced by a linear motor, which can achieve the same function.

[0044] Preferably, the present invention further includes a pressure holding cylinder 8, which is adjacent to the substrate support mechanism 2; the pressure holding cylinder 8 is configured to hold the substrate support mechanism 2 when the test is not being performed, and to release the substrate support mechanism 2 at the moment the test begins so that the test can proceed.

[0045] In practical use, a series of conductive balls 61 may appear on the substrate 6. In this case, the present invention can index the tension clamp 71 or the entire device to place the required conductive balls 61 under the testing tool. Figure 4 As shown, this invention uses the X-axis 9 and Y-axis 91 to index the entire device. The X-axis 9 and Y-axis 91 described in this invention are existing technologies and will not be elaborated upon here.

[0046] Please see Figure 5 , Figure 5 This is a schematic diagram of the planar structure of the second embodiment of the device of the present invention.

[0047] Figure 5 The illustrated embodiments and Figure 2 Compared to the illustrated embodiment, the general structure is the same, except that the driving component 4 includes a driving component body 41, an active striking block 44, and a passive striking block 45. The active striking block 44 is slidably mounted on the driving component body 41 via a Z-axis slider 441, and the passive striking block 45 is located at the lower part of the connecting plate 22. The active striking block 44 and the passive striking block 45 are configured such that when the active striking block 44 moves vertically downward, the active striking block 44 strikes the passive striking block 45, causing the connecting plate 22 to move downward at high speed. Preferably, the high-speed moving device 3 includes a motor 31 and a synchronous pulley assembly 32. The motor 31 drives the synchronous pulley assembly 32 to move, and the Z-axis slider 441 is connected to the belt 321 of the synchronous pulley assembly 32.

[0048] Obviously, the synchronous belt pulley assembly 32 in this invention can be replaced by a lead screw and nut structure; the high-speed moving device 3 in this invention can be replaced by a cylinder. When the high-speed moving device 3 is a cylinder, the cylinder can directly act on the drive assembly body 41; the high-speed moving device 3 in this invention can be replaced by a linear motor, which can achieve the same function.

[0049] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An apparatus for testing the bond strength of a semiconductor product, characterized by: The device comprises a mounting plate (1), a substrate bearing mechanism (2), a high-speed moving device (3) and a driving assembly (4), the substrate bearing mechanism (2) and the high-speed moving device (3) are arranged on the mounting plate (1), the high-speed moving device (3) drives the substrate bearing mechanism (2) to move downward along the Z-axis direction at high speed through the driving assembly (4); the substrate bearing mechanism (2) comprises a clamp assembly (21), a connecting plate (22) is arranged on the lower bottom surface of the clamp assembly (21), the connecting plate (22) is arranged on a Z-direction guide rail (23) and moves up and down along the Z-direction guide rail (23); a buffer spring (5) is arranged between the bottom of the substrate bearing mechanism (2) and the mounting plate (1); in use, a substrate (6) with a measured object (61) is fixed to the clamp assembly (21) of the substrate bearing mechanism (2); a tension clamp (71) of a testing tool (7) clamps the measured object (61); and the tension clamp (71) and the measured object (61) are kept stationary; the high-speed moving device (3) drives the clamp assembly (21) and the substrate (6) to move downward at high speed, so as to pull the measured object (61) off the substrate (6); the driving assembly (4) comprises a driving assembly body (41), a driving wheel (42) and a wedge block (43), the driving wheel (42) is horizontally arranged on the driving assembly body (41), the wedge block (43) is arranged at the lower part of the connecting plate (22), and the driving assembly body (41) is located on a linear guide rail of the mounting plate (1); the wedge block (43) and the driving wheel (42) are configured such that when the driving wheel (42) moves horizontally, the driving wheel (42) presses the inclined surface (431) of the wedge block (43), so as to make the connecting plate (22) move downward at high speed; the high-speed moving device (3) comprises a motor (31) and a synchronous pulley assembly (32), the motor (31) drives the synchronous pulley assembly (32) to move, the driving assembly body (41) is connected with a belt (321) of the synchronous pulley assembly (32), or the driving assembly (4) comprises a driving assembly body (41), a driving striking block and a driven striking block (45), the driving striking block is slidably arranged on the driving assembly body (41) through a Z-axis sliding block (441), the driven striking block (45) is arranged at the lower part of the connecting plate (22), and a buffer spring (5) is arranged below the driven striking block (45); the driving striking block and the driven striking block (45) are configured such that when the driving striking block moves downward vertically, the driving striking block strikes the driven striking block (45), so as to make the connecting plate (22) move downward at high speed; the high-speed moving device (3) comprises a motor (31) and a synchronous pulley assembly (32), the motor (31) drives the synchronous pulley assembly (32) to move, and the Z-axis sliding block (441) is connected with a belt (321) of the synchronous pulley assembly (32).

2. The apparatus for testing the bonding strength of a semiconductor product according to claim 1, wherein: Further comprising a down-press holding cylinder (8) which is adjacent to the substrate carrying mechanism (2).

3. A method of testing the bonding strength of a semiconductor product using the apparatus according to any one of claims 1 to 2, characterized by: The method comprises the following steps: S1, fixing a substrate with a measured object to a clamp assembly; S2, using a test tool, cooperating with the measured object, fixing the test tool and the measured object, and keeping the test tool and the measured object still; S3, driving the clamp assembly and the substrate to move downward at a high speed by a high-speed moving device, so as to pull the measured object off the substrate, wherein the high-speed moving device is to drive the clamp assembly and the substrate to move downward at a high speed by quickly pressing the inclined surface of a wedge-shaped block, or the high-speed moving device is to drive the clamp assembly and the substrate to move downward at a high speed by quickly hitting a passive hitting block; S4, measuring the bonding force at the interface between the measured object and the substrate.

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