Earphone and earphone assembly

Abstract

The application discloses an earphone and an earphone assembly. The earphone comprises a shell, a loudspeaker, a main circuit board and a battery. The loudspeaker, the main circuit board and the battery are all installed in the shell. The main circuit board is located between the loudspeaker and the battery. The main circuit board is arranged obliquely relative to the loudspeaker. The loudspeaker of the earphone has a smaller risk of generating current noise. The sound quality of the earphone is better.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of audio technology, in particular to an earphone and an earphone assembly. BACKGROUND

[0002] Wireless earphones are favored by more and more consumers because they are more convenient to use without the traditional wired connection. At present, wireless earphones pursue miniaturization, resulting in compact arrangement of components such as a loudspeaker, a main board and a battery inside the earphones. The coil of the loudspeaker is easily interfered by the magnetic field of the main board (or the battery) to generate induced current, and then generates current noise, so that the sound quality of the wireless earphones is poor. SUMMARY

[0003] The present application provides an earphone and an earphone assembly comprising the same, the earphone has a smaller risk of generating current noise, and the sound quality of the earphone is better.

[0004] In a first aspect, an implementation manner of the present application provides an earphone. The earphone comprises a shell, a loudspeaker, a main circuit board and a battery, and the loudspeaker, the main circuit board and the battery are all installed in the shell. The main circuit board is located between the loudspeaker and the battery. At this time, the loudspeaker and the battery are respectively placed at both ends of the long side of the main circuit board, and the loudspeaker, the main circuit board and the battery are roughly like the shape of a dumbbell. The main circuit board is arranged obliquely relative to the loudspeaker. That is, the layout plane of the main circuit board is not parallel to the diaphragm plane of the loudspeaker. The layout plane of the main circuit board refers to the plane of the main circuit board for arranging devices. The diaphragm plane of the loudspeaker refers to the plane where the diaphragm of the loudspeaker is in a balanced position.

[0005] In the implementation manner, since the battery and the loudspeaker are respectively placed at both ends of the long side of the main circuit board, the distance between the battery and the loudspeaker is far, and the induced magnetic field generated by the battery has little effect on the coil of the loudspeaker, so that the risk of current noise brought by the battery can be eliminated. At the same time, the layout plane of the main circuit board is not parallel to the diaphragm plane of the loudspeaker, so that the effect of the induced magnetic field generated by the inductance or current loop on the loudspeaker is reduced, and the risk of current noise brought by the induced magnetic field of the main circuit board is reduced. Therefore, the implementation manner optimizes the positional relationship among the loudspeaker, the main circuit board and the battery, eliminates or weakens the adverse effect of the induced magnetic field of the main circuit board and the battery on the loudspeaker, reduces the risk of generating current noise, ensures the sound quality of the loudspeaker, and makes the earphone have better sound quality.

[0006] In some possible implementation manners, an angle between the layout plane of the main circuit board and the diaphragm plane of the speaker is in a range of 10 degrees to 60 degrees. At this time, the angle between the layout plane of the main circuit board and the diaphragm plane of the speaker is relatively large, and the influence of the induced magnetic field generated by the inductance or the current loop on the main circuit board on the speaker can be greatly reduced, so that the current sound risk caused by the induced magnetic field of the main circuit board is obviously reduced. In addition, the range of the angle between the layout plane of the main circuit board and the diaphragm plane of the speaker also helps to reduce the arrangement difficulty of the speaker, the main circuit board and the battery in the shell of the earphone, reduce the limitation on the appearance design of the shell of the earphone due to the position requirements of the speaker, the main circuit board and the battery, and make the flexibility of the form design of the shell of the earphone higher.

[0007] In some possible implementation manners, an angle between the layout plane of the main circuit board and the diaphragm plane of the speaker is in a range of 10 degrees to 60 degrees. At this time, the angle between the layout plane of the main circuit board and the diaphragm plane of the speaker is relatively large, and the influence of the induced magnetic field generated by the inductance or the current loop on the main circuit board on the speaker can be greatly reduced, so that the current sound risk caused by the induced magnetic field of the main circuit board is obviously reduced. In addition, the range of the angle between the layout plane of the main circuit board and the diaphragm plane of the speaker also helps to reduce the arrangement difficulty of the speaker, the main circuit board and the battery in the shell of the earphone, reduce the limitation on the appearance design of the shell of the earphone due to the position requirements of the speaker, the main circuit board and the battery, and make the flexibility of the form design of the shell of the earphone higher.

[0008] In some possible implementation manners, the battery is arranged to be inclined relative to the main circuit board. An axis of the battery is not perpendicular to the layout plane of the main circuit board. At this time, the influence of the induced magnetic field generated by the battery on the device (for example, the inductance) sensitive to the magnetic field on the main circuit board is small, so that the device on the main circuit board has a better working environment. For example, an angle between the axis of the battery and the layout plane of the main circuit board can be in a range of 30 degrees to 80 degrees.

[0009] In some possible implementation manners, the main circuit board can be in a strip shape, so as to have a relatively large layout plane. At this time, the distance between the speaker and the battery is relatively large, which helps to reduce the risk of the current noise of the speaker.

[0010] In some possible implementation manners, the battery is a button cell. The speaker is a moving coil speaker.

[0011] In some possible implementation manners, the earphone includes an ear cover and an ear stem, the ear stem can also be referred to as a handle, and a top of the ear stem is connected to a rear side of the ear cover. An outer surface of the earphone is a smooth transition geometric curved surface. In a direction from an end connected to the ear cover to an end away from the ear cover, an overall outer contour of the ear stem presents a shape of first contraction, then expansion, and then contraction again, and the ear stem is round and natural like a free-falling water droplet.

[0012] In some possible implementation manners, the shell includes a main shell and a front shell, the front shell is fixed to a front side of the main shell, an inner space of the front shell is in communication with an inner space of the main shell, and the front shell faces the ear of the user when the earphone is in a wearing state. The main shell includes a first end in contact with the front shell and a second end away from the front shell, and in a direction from the first end to the second end of the main shell, an outer contour of the main shell first contracts and then expands.

[0013] In the case that the outer contour of the main shell first narrows and then expands, there are two cases: in the first case, the outer contour of the main shell first narrows, then expands, and then narrows again; in the second case, the outer contour of the main shell first narrows and then expands.

[0014] For the first case, in the direction from the first end of the main shell to the second end of the main shell, the part of the main shell located at the ear pad is in a narrowing shape, the part of the main shell located at the ear stem is in a shape of first narrowing, then expanding, and then narrowing again, and the bottom of the main shell can be formed by an arc surface or an approximately arc surface to have a rounded shape. At this time, the shape design of the main shell enables the ear stem of the earphone to have a shape similar to a "freely falling water droplet".

[0015] For the second case, in the direction from the first end of the main shell to the second end of the main shell, the part of the main shell located at the ear pad is in a narrowing shape, and the part of the main shell located at the ear stem is in a shape of first narrowing and then expanding, that is, the bottom of the main shell can be formed by a flat surface or an approximately flat surface to form a bottom end surface. In the second case, the bottom of the main shell can have a small fillet transition area connected with the bottom end surface, and the shape of the transition area changes little and can be ignored.

[0016] In some possible implementation manners, the internal space of the main shell includes a top space, a middle space, and a bottom space, the top space of the main shell is close to the first end of the main shell, and the bottom space of the main shell is close to the second end of the main shell. The loudspeaker is installed in the internal space of the front shell and / or the top space of the main shell, the battery is installed in the bottom space of the main shell, the main circuit board is installed in the middle space of the main shell, and both ends of the main circuit board extend to the top space of the main shell and the bottom space of the main shell respectively.

[0017] In the implementation manner, the loudspeaker and the battery have a large volume and are substantially in a flat cylindrical shape, the main circuit board is a long and narrow plate-shaped structure, the internal space of the front shell, the top space of the main shell, and the bottom space of the main shell are large, and the middle space of the main shell is small. Therefore, the arrangement positions of the loudspeaker, the main circuit board, and the battery in the implementation manner not only can reduce the risk of current sound generated by the loudspeaker, but also can fully utilize the internal space of the shell, improve the space utilization rate of the shell, and facilitate the miniaturization of the earphone.

[0018] In some possible implementation manners, the main shell has a ridge line, and the ridge line extends from the first end of the main shell to the second end of the main shell. The ridge line is located on the back side of the main shell and on the central plane of the earphone. The ridge line is a smooth curve.

[0019] Exemplarily, the spine line extends first rearward and then forward when extending from the first end of the main shell to the second end of the main shell. In this case, the part of the main shell corresponding to the rearward extending segment of the spine line presents a shape of first contraction and then expansion, and the part of the main shell corresponding to the forward extending segment of the spine line presents a contracted shape. In this implementation, the shape of the spine line is set to make the back of the earphone present a shape of free sliding, and the overall shape of the earphone is natural and beautiful.

[0020] In some possible implementation, the spine line can include a plurality of arc segments connected smoothly, and the radii of the plurality of arc segments increase first and then decrease in the extending direction of the spine line. In this case, the arc segment with the largest radius can be arranged at the middle space of the main shell.

[0021] In some possible implementation, the included angle between the plane of the main circuit board and the plane of the diaphragm of the speaker is in the range of 20° to 50°. In this case, the relative positions of the speaker and the main circuit board can well match the relative position relationship between the top space of the main shell and the middle space of the main shell, and the installation difficulty is low and easy to implement.

[0022] In some possible implementation, the cross-sectional area of the top space of the main shell is greater than the cross-sectional area of the middle space of the main shell, and the cross-sectional area of the bottom space of the main shell is greater than the cross-sectional area of the middle space of the main shell. In this implementation, the main shell is a shell structure, and the shape change of the internal space of the main shell is the same as or similar to the shape change of the outer contour of the main shell.

[0023] In some possible implementation, the main shell includes a main shell piece and a cover piece, the main shell piece has a first opening and a second opening arranged at intervals, and the first opening and the second opening are both directed to the user's ear when the earphone is in the wearing state. The front shell is installed at the first opening, and the cover piece is installed at the second opening. The cover piece and part of the main shell piece jointly enclose the bottom space of the main shell.

[0024] In this implementation, the shell body is composed of the front shell, the main shell piece and the cover piece, which are three main shell pieces, and the number is small, the structure is simple, and the assembly is easy. In addition, the middle part of the main shell piece is a complete shell structure without openings, which is beneficial to improve the structural strength of the main shell piece, so that the overall structural strength of the main shell and the shell body is high.

[0025] In some possible implementation, the main shell further includes a main shell piece, a cover piece and a back cover piece. The main shell piece has a first opening, a second opening and a third opening arranged at intervals. The first opening and the second opening are both directed to the user's ear when the earphone is in the wearing state, and the third opening is directed away from the user's ear. The third opening is located between the first opening and the second opening. The front shell is installed at the first opening, the cover piece is installed at the second opening, the cover piece and part of the main shell piece jointly enclose the bottom space of the main shell, the back cover piece is installed at the third opening, and the back cover piece and part of the main shell piece jointly enclose the middle space of the main shell.

[0026] In the present implementation, the middle part of the main shell member forms an opening structure through the third opening, which facilitates smooth demolding of the main shell member, simplifies the demolding structure and process of the main shell member, and improves the production efficiency and yield of the main shell member.

[0027] In addition, the parting line between the cover member and the main shell member is hidden in the secondary appearance surface, and the back cover member is located in the primary appearance surface. Although the back cover member partially destroys the integrity of the primary appearance surface, the area of the back cover member is small, and therefore the primary appearance surface of the earphone can still have a good visual overall sense. In some implementations, the richness and diversity of the appearance can also be achieved through the differential design of the back cover member and the main shell member.

[0028] In some possible implementations, the main shell member is a one-piece structure. For example, the main shell member can be formed by an injection molding process. In the present implementation, the main shell member has high structural strength, which is conducive to improving the overall structural strength of the earphone.

[0029] In some implementations, the shell includes a front shell and a main shell, and the main shell includes a main shell member and a cover member. The main shell member has a first opening and a second opening arranged at intervals, and the first opening and the second opening are both arranged towards the front. The main shell member includes a top part, a middle part, and a bottom part connected in sequence, the first opening is formed in the top part of the main shell member, and the second opening extends from the bottom part of the main shell member, passes through the middle part of the main shell member, and extends to the top part of the main shell member.

[0030] In the present implementation, since the second opening is partially arranged in the middle part of the main shell member, the middle part of the main shell member has an opening structure, which facilitates smooth demolding of the main shell member, simplifies the demolding structure and process of the main shell member, and improves the production efficiency and yield of the main shell member.

[0031] In addition, the parting line between the cover member and the main shell member is mostly hidden in the secondary appearance surface and partially exposed in the primary appearance surface, and therefore the parting line has little damage to the primary appearance surface and basically maintains the integrity of the primary appearance surface, so that the earphone has a good visual overall sense. Moreover, the part of the parting line between the cover member and the main shell member that destroys the primary appearance surface is mainly located on the bottom side of the top part of the main shell member, which does not expose when the earphone is in the wearing state. Therefore, the visual overall sense of the earphone in the wearing state is not affected by the parting line between the cover member and the main shell member, and the user experience is better.

[0032] In some implementations, the shell includes a front shell and a main shell, the main shell includes a main shell piece and a back cover piece, the main shell piece has a first opening and a third opening arranged at intervals, the first opening is arranged towards the front, and the third opening is arranged towards the back. The main shell piece includes a top portion, a middle portion and a bottom portion connected in sequence, the first opening is formed in the top portion of the main shell piece, and the third opening is continuously formed in the top portion, the middle portion and the bottom portion of the main shell piece. The front shell is mounted in the first opening, and the back cover piece is mounted in the third opening.

[0033] In the implementation, the middle portion of the main shell piece forms an opening structure through the third opening, which helps to smoothly demold the main shell piece, simplifies the demolding structure and process of the main shell piece, and improves the production efficiency and yield of the main shell piece.

[0034] The parting line between the main shell piece and the back cover piece can be partially hidden in the secondary appearance surface and partially located in the primary appearance surface, so as to reduce the damage to the integrity of the primary appearance surface.

[0035] In some implementations, the shell includes a front shell and a main shell, the main shell includes a main shell piece and a bottom cover piece. The main shell piece has a first opening and a fourth opening arranged at intervals, the first opening is arranged towards the front, and the fourth opening is arranged downwards. The front shell is mounted in the first opening, and the bottom cover piece is mounted in the fourth opening. The back cover piece is arranged in a stack with the bottom cover piece. The fourth opening is located at a position where the cross-sectional area of the bottom portion of the main shell piece is the largest.

[0036] In some possible implementations, the main shell includes an abutting end surface, the abutting end surface is located in the main shell piece and surrounds the first opening, and the abutting end surface contacts the front shell. The main shell piece has a first projection on a plane where the abutting end surface is located, the cover piece has a second projection on the plane where the abutting end surface is located, and the first projection covers the second projection.

[0037] The surface of the earphone in the rear view angle is the primary appearance surface, that is, when viewed from the back to the front, the surface of the earphone exposed is the primary appearance surface. The surface of the earphone in the front view angle is the secondary appearance surface, that is, when viewed from the front to the back, the surface of the earphone exposed is the primary appearance surface. When the earphone is in the wearing state, the secondary appearance surface faces the user's ear and is hidden, and the primary appearance surface faces away from the user's ear and is exposed. The main shell piece projects from the back to the front to form a first projection, and the cover piece projects from the back to the front to form a second projection. Since the first projection covers the second projection, in the rear view angle of the earphone, the main shell piece blocks the cover piece, and the earphone hides the parting line between the cover piece and the main shell piece in the secondary appearance surface, so that the primary appearance surface of the earphone is complete, and a good visual overall sense is maintained. The parting line between the cover piece and the main shell piece is a line formed on the appearance surface of the earphone at the joint between the cover piece and the main shell piece.

[0038] In some possible implementation manners, the earphone further comprises a partition component, which is installed in the top space of the main shell and located between the loudspeaker and the main circuit board. The internal space of the shell comprises a front cavity, a rear cavity and a main board cavity, the front cavity is located between the front shell and the loudspeaker, the rear cavity is located between the loudspeaker and the partition component, and the main board cavity is located on the side of the partition component away from the loudspeaker. The main board cavity can be a sealed cavity, so that the reliability of the devices in the main board cavity is high, and the service life of the earphone is prolonged.

[0039] In some possible implementation manners, the partition component comprises one or more magnetic isolation members to reduce the risk of current sound of the loudspeaker.

[0040] In some possible implementation manners, the distance between the center point of the bottom surface of the loudspeaker and the center point of the battery in a first direction is in a range of 12 mm to 20 mm, and the distance between the center point of the bottom surface of the loudspeaker and the center point of the battery in a second direction is in a range of 6 mm to 15 mm, the first direction is parallel to the diaphragm plane of the loudspeaker, and the second direction is perpendicular to the first direction. Alternatively, the distance between the center point of the bottom surface of the loudspeaker and the center point of the battery is in a range of 10 mm to 30 mm.

[0041] In the implementation manners, the positional relationship between the loudspeaker and the battery is beneficial to the miniaturization of the earphone and the reduction of current sound.

[0042] In some possible implementation manners, the main circuit board comprises a first end adjacent to the loudspeaker and a second end adjacent to the battery; the earphone further comprises a first flexible circuit board and a second flexible circuit board, the first flexible circuit board and the loudspeaker are located on the same side of the main circuit board, the first flexible circuit board is electrically connected between the loudspeaker and the first end of the main circuit board, and the second flexible circuit board and the battery are located on the same side of the main circuit board, and the second flexible circuit board is electrically connected between the battery and the second end of the main circuit board.

[0043] In the embodiment, the main circuit board is a hard printed circuit board, which has sufficient structural strength, so that more devices can be arranged on the device plane, and double-sided devices can be implemented to improve the device integration. The first flexible circuit board and the second flexible circuit board can be bent, and the first flexible circuit board and the second flexible circuit board can be flexibly arranged according to the shape of the internal space of the earphone and the structure of other components, so that the circuit of the circuit assembly can be smoothly extended from the main circuit board to the outside and electrically connected with other components (such as the loudspeaker and the battery) of the earphone.

[0044] In some possible implementation manners, the main circuit board is fixedly connected with the first flexible circuit board through a BOF process, and the main circuit board is fixedly connected with the second flexible circuit board through a BOF process. In the implementation manner, the electrical connection between the main circuit board and the first flexible circuit board and the second flexible circuit board adopts a double-sided BOF process, which can effectively save the layout space of the main circuit board and the internal stacking space of the earphone, and is conducive to reducing the cost.

[0045] In a second aspect, the embodiments of the present application provide an earphone. The earphone comprises a housing, a first circuit board and an antenna, the first circuit board and the antenna are located in the housing and are arranged in a stack, the first circuit board and the antenna are independent structural members, and the first circuit board is located between the antenna and the housing. One side of the first circuit board facing the housing has a touch sensor, the touch sensor is used to detect a touch action acting on the housing, and the antenna is used to transmit and receive a radio frequency signal.

[0046] In the present application, one side of the touch sensor for detecting a user touch operation is a touch side, and the other side of the touch sensor is a non-touch side. That is, one side of the touch sensor facing the housing is the touch side, and the other side of the touch sensor facing away from the housing is the non-touch side. Since the antenna is located at the non-touch side of the touch sensor and the antenna is a conductor structure, the antenna can be used as a reference ground of the touch sensor to shield the clutter signal from the non-touch side of the touch sensor, thereby reducing or eliminating the signal interference of the clutter signal on the touch sensor and improving the accuracy of the touch detection of the touch sensor. In addition, since the antenna itself radiates high-frequency current and the touch sensor senses low-frequency current, the antenna has no effect on the touch detection of the touch sensor.

[0047] In the present application, the antenna is used to transmit and receive a radio frequency signal, and the antenna is also used to provide a reference ground for the touch sensor. At this time, based on the relative position relationship of the housing, the touch sensor and the antenna, the antenna has two functions through the same structure, that is, the antenna is used to realize wireless communication of the earphone and also serves as a reference ground of the touch sensor to shield the clutter signal and improve the accuracy of the touch detection.

[0048] In addition, the coexistence of the touch sensor and the antenna of the earphone in the same space region minimizes the occupied space, which is conducive to the miniaturization of the earphone. In addition, the radiation region of the antenna and the touch control region of the touch sensor can be realized through the same region of the housing. Under the condition that the volume of the housing is constant, the radiation region of the antenna and the touch control region of the touch sensor can both have a larger area, the earphone can obtain better antenna transmitting and receiving performance, and at the same time, more diversified touch operations can be detected.

[0049] In some possible implementation manners, the projection of the antenna on the first circuit board covers the touch sensor. In this case, the antenna can better provide a reference ground for the touch sensor, and improve the detection accuracy of the touch sensor. It can be understood that the case where the projection of the antenna on the first circuit board covers the touch sensor includes the case of "complete coverage" and the case of "substantial coverage", and the case of "substantial coverage" is considered to be met when the projection of the antenna covers more than 80% of the touch sensor. Specifically, the coverage of the antenna on the touch sensor mainly refers to the coverage of the radiation part of the antenna on the touch sensor. In the position where the touch sensor can be interfered by a relatively concentrated interference source, the coverage of the radiation part of the antenna on the touch sensor is as complete as possible.

[0050] In some possible implementation manners, the first circuit board includes a conductive layer, and the conductive layer includes the touch sensor. In this case, the first circuit board has a small thickness when the touch sensor is formed, so as to facilitate installation.

[0051] In some possible implementation manners, the touch sensor includes at least three touch blocks, and the at least three touch blocks are arranged in a strip-shaped touch area and are spaced from each other. The extension direction of the strip-shaped touch area corresponds to the extension direction of the antenna. In this case, the touch sensor is a slide bar sensing structure, and when the capacitances of the at least three touch blocks change in sequence, it can be determined that a user applies a sliding action. The touch sensor can also detect single-click, double-click, long-press and other actions of the user.

[0052] In some possible implementation manners, the distance between two adjacent touch blocks is in a range from 0.5 mm to 2 mm. In this case, the arrangement of the at least three touch blocks can avoid misjudgment of a sliding action caused by the user touching two touch blocks at the same time. Conversely, when the distance between two adjacent touch blocks is too small, false touch is prone to occur, and if the distance between two adjacent touch blocks is too large, the user can not touch the touch blocks, resulting in low touch efficiency.

[0053] In some possible implementation manners, the earphone further includes a main circuit board, a processor and a radio frequency circuit. The main circuit board is located on the side of the antenna away from the first circuit board, the processor and the radio frequency circuit are fixed to and electrically connected to the main circuit board, the radio frequency circuit is electrically connected to the antenna and the processor, and the processor is electrically connected to the plurality of touch blocks.

[0054] In the implementation manner, the main circuit board, the antenna and the first circuit board are stacked, the internal space of the earphone can be fully utilized, the space utilization rate of the earphone is provided, and the miniaturization of the earphone is facilitated.

[0055] In some possible implementation manners, the earphone further includes a high-frequency blocking circuit, which is connected in series between the plurality of touch blocks and the processor. For example, the high-frequency blocking circuit can be fixed and electrically connected to the second circuit board. The high-frequency blocking circuit is generally an inductor (choke) circuit, and each touch block is connected to the main circuit board through the high-frequency blocking circuit. In this way, the low-frequency signal formed by the touch sensor during touch detection can pass through the high-frequency blocking circuit and be transmitted to the processor. The antenna of the earphone generally works in a high-frequency Bluetooth frequency band, and therefore the high-frequency blocking circuit can block the formation of a path for the antenna signal on the plurality of touch blocks, thereby eliminating the coupling effect of the plurality of touch blocks on the antenna and ensuring that the receiving and transmitting performance of the antenna is not affected or is less affected.

[0056] In some possible implementation manners, the earphone further includes a second circuit board, one end of the second circuit board is connected to the first circuit board, and the other end of the second circuit board is connected to the main circuit board. The high-frequency blocking circuit is fixed and electrically connected to the second circuit board. In this way, the second circuit board and the first circuit board can be an integrally formed structure, for example, two parts of one flexible circuit board.

[0057] In some possible implementation manners, the antenna includes an antenna support and a first metal piece. The antenna support is located between the first circuit board and the main circuit board, and the first metal piece is fixed to the antenna support and electrically connected to the main circuit board. In this implementation manner, the antenna is simple in structure and easy to implement.

[0058] In some possible implementation manners, the antenna includes an antenna support, a first metal piece, and a second metal piece. The antenna support is located between the first circuit board and the main circuit board, the first metal piece is fixed to the antenna support and electrically connected to the main circuit board, and the second metal piece is fixed and electrically connected to the first metal piece.

[0059] In this implementation manner, the first metal piece and the second metal piece can jointly form a radiation part of the antenna. The radiation part of the antenna has a large size, which increases the radiation area of the antenna and improves the receiving and transmitting performance of the antenna, so that the wireless communication performance of the earphone is better.

[0060] In this implementation manner, the antenna support, the first metal piece, and the second metal piece can all be substantially strip-shaped, and the antenna as a whole is substantially strip-shaped. In this way, the antenna can better match the shape of the shell of the earphone and reduce the difficulty of installation while having a large radiation area.

[0061] In some possible implementation manners, the first metal piece is formed on the antenna support by a laser direct structuring process. In this case, the size and shape of the first metal piece are less constrained, and the pattern of the first metal piece is easy to adjust.

[0062] In some possible implementation manners, the antenna support includes a plate body and a plurality of legs fixed to the plate body, the plate body is arranged in a spaced manner with the main circuit board, and the plurality of legs are fixed to the main circuit board. A space is formed between the plate body of the antenna support and the main circuit board, and the device can be arranged on the main circuit board through the space. The first metal piece includes a main body part and a connecting part, the main body part is fixed to one side of the plate body away from the main circuit board, the connecting part is connected to the main body part and extends to at least one leg of the plurality of legs, and the connecting part is welded to the main circuit board. At this time, the connecting part of the first metal piece is fixed and electrically connected to the main circuit board through soldering, so that the main circuit board can realize feeding of the antenna.

[0063] In the implementation manner, the first metal piece forms a radiation part or a part of a radiation part of the antenna, the first metal piece and the main circuit board multiplex the legs of the antenna support, the legs of the antenna support are used for realizing structural connection and serving as feeding points of the antenna, so that the traditional spring structure serving as the feeding point is omitted, a large amount of board space is saved, and the antenna can be arranged in a small space. In addition, since signal transmission between the antenna and the main circuit board does not need to pass through the electrical connector, the antenna signal noise is reduced, and the wireless communication quality of the earphone is improved.

[0064] In the implementation manner, the antenna support can be an integrally formed structural member. At this time, the antenna support has high structural strength and low cost.

[0065] In some possible implementation manners, the number of the connecting parts is a plurality, the plurality of connecting parts are connected to different positions of the main body part and fixed to different legs. In the implementation manner, the earphone can realize an antenna scheme with multiple feeding points, so that a MIMO antenna scheme can be realized in some embodiments.

[0066] In some possible implementation manners, the antenna includes an extension circuit board, and the extension circuit board includes a second metal piece. In the implementation manner, the extension circuit board can form the second metal piece by using a conductive layer of the extension circuit board. The extension circuit board can be a flexible circuit board. In the implementation manner, the second metal piece is formed by the extension circuit board, the extension circuit board has a thin thickness, can be deformed by bending, has low requirements on installation space, and can be easily arranged in a narrow space, for example, an internal space of an ear stem, so that the radiation area of the antenna in the narrow space is expanded.

[0067] In other possible implementation manners, the second metal piece can also be a metal sheet, for example, a metal plate member such as a steel sheet or a structural member such as a metal support. Similarly, the antenna can also expand the radiation area of the antenna in the narrow space by using the thin thickness and the bending performance of the second metal piece.

[0068] In some possible implementation manners, the first circuit board comprises a conductive layer, an insulating layer and a second conductive layer arranged in a stack. The conductive layer is located on a side of the insulating layer facing the shell, and the conductive layer comprises the touch sensor. The second conductive layer is located on a side of the insulating layer facing away from the shell. A projection of the antenna on the first circuit board covers a part of the touch sensor, and the second conductive layer covers another part of the touch sensor.

[0069] In the implementation manner, the antenna and the second conductive layer provide reference grounds for the touch sensor at the same time, so as to ensure the coverage effect on the touch sensor and improve the detection accuracy of the touch sensor. The second conductive layer is arranged approximately staggered with the antenna. The second conductive layer has one layer, and the area of the second conductive layer is obviously smaller than the area of the insulating layer. The overall thickness of the first circuit board is still very thin, and the installation difficulty is small.

[0070] In some possible implementation manners, the shell comprises a main shell and a front shell. The front shell is fixed to the front side of the main shell, and the internal space of the front shell is in communication with the internal space of the main shell. When the earphone is in the wearing state, the front shell faces the ear of the user. The main shell comprises a first end connected to the front shell and a second end away from the front shell. In the direction from the first end to the second end of the main shell, the outer contour of the main shell first shrinks and then expands. The first circuit board is fixed to the inner wall of the main shell. When the earphone is in the wearing state, the first circuit board faces away from the ear of the user.

[0071] In the implementation manner, the touch sensor is a capacitive sensor (cap sensor). The first circuit board is arranged to abut against the inner wall of the main shell of the shell and is located close to the back side of the main shell. Therefore, when the earphone is in the wearing state, the first circuit board faces away from the ear of the user and is exposed relative to the ear of the user. When the user approaches or touches the back of the main shell, the touch sensor can detect the touch action of the user to realize human-computer interaction.

[0072] In some possible implementation manners, the internal space of the main shell comprises a top space, a neck space and a bottom space. The cross-sectional area of the top space of the main shell is greater than the cross-sectional area of the neck space of the main shell. The cross-sectional area of the bottom space of the main shell is greater than the cross-sectional area of the neck space of the main shell. The first circuit board extends from the top space of the main shell to the bottom space of the main shell. At this time, the first circuit board has a large area, so that the touch sensor has a large arrangement area, thereby being capable of detecting more diversified touch actions.

[0073] In some possible implementation manners, the earphone further comprises a third circuit board. The third circuit board is located in the top space of the main shell. One end of the third circuit board is connected to the first circuit board or the second circuit board. The other end of the third circuit board is bent to a side of the antenna facing away from the first circuit board and is fixed to the main shell. The side of the third circuit board facing the main shell is provided with a wearing detection sensor.

[0074] In the present implementation, the wearing detection sensor is a capacitive sensor (cap sensor), when the user wears the earphone, the intertragic notch of the ear corresponds to the position where the wearing detection sensor is located, and the wearing detection sensor can detect whether the user's skin contacts the earphone, thereby cooperating with the detection of whether the earphone is in a wearing state, and the detection accuracy of the wearing detection sensor is high.

[0075] The earphone cooperates with the detection of the proximity sensor and the wearing detection sensor to determine whether the earphone is in a wearing state. For example, when the proximity sensor and the wearing detection sensor of the earphone both detect that the earphone is close to or in contact with the user, the earphone determines that it is in a wearing state, and if one of them detects that the user is not close to or in contact with the user, the earphone determines that it is not in a wearing state. The wearing detection of the earphone can be a prerequisite for the touch sensor to detect the user's touch operation, and when the earphone determines that it is in a wearing state, the touch sensor senses the user's touch operation.

[0076] In some possible implementations, the first circuit board of the detection circuit board can be fixedly connected to the inner wall of the main shell by a hot melt adhesive film, the third circuit board can be fixedly connected to the inner wall of the main shell by a double-sided adhesive, and other parts of the detection circuit board can also be fixedly connected to the inner wall of the main shell by a double-sided adhesive. The area of the main shell for the third circuit board is located close to the first opening, and the opening area of the first opening is large, which is easy to bond, so that the third circuit board can be closely attached to the main shell by the double-sided adhesive at one time and easily. The first circuit board is long, and needs to be inserted from the top space of the main shell to the bottom space of the main shell during assembly. By using the hot melt adhesive film fixing method, the first circuit board can be inserted into the main shell first during the assembly process, and no false bonding will occur during this process. When the first circuit board is in place, the hot melt adhesive film is heated (for example, to 80-90 degrees), so that the first circuit board is bonded to the main shell, and the semi-melted state of the hot melt adhesive film can better absorb the gap between the first circuit board and the main shell, and the attachment state of the two is better. During the assembly process of the earphone, the detection circuit board can be installed in the main shell first, and then the main circuit board is installed, and then the detection circuit board is buckled to the main circuit board to realize electrical connection.

[0077] In some possible implementations, the third circuit board and the first circuit board are an integrally formed structural member, so as to reduce the cost and assembly difficulty of the earphone.

[0078] In a third aspect, the embodiments of the present application provide an earphone. The earphone comprises a shell, a speaker, a support and a microphone. The shell has a first through hole and a second through hole arranged at intervals. The speaker is fixed in the shell. The support is fixed in the shell, and a rear cavity is formed between the support and the speaker. The support is provided with a bass tube channel, a pickup channel and a pickup cavity. One end of the bass tube channel is communicated with the rear cavity, and the other end is communicated with the first through hole. The pickup channel is arranged separately from the bass tube channel. One end of the pickup channel is communicated with the pickup cavity, and the other end is communicated with the second through hole. The microphone is installed in the pickup cavity.

[0079] In the embodiments of the present application, the earphone integrates the bass tube channel and the pickup channel into the support, has high integration and high utilization rate of the internal space of the earphone, and is beneficial to the miniaturization of the earphone. By adopting the design scheme of the integrated support, the earphone can also reduce the assembly difficulty, improve the production yield, bring cost advantages, and further improve the competitiveness of the product.

[0080] In some possible implementation manners, the support has a front side and a rear side arranged oppositely, and has a circumferential side located between the front side and the rear side. The front side of the support is arranged towards the speaker, and the rear cavity is formed between the support and the speaker. The front side of the support is arranged towards the rear cavity. The rear side of the support is arranged away from the speaker, that is, towards the mainboard cavity. The circumferential side of the support is arranged towards the shell.

[0081] The bass tube channel forms a first opening on the front side of the support, and forms a second opening on the circumferential side of the support. The second opening is communicated with the first through hole. At this time, the air in the rear cavity of the earphone can be propagated to the external space of the earphone through the bass tube channel and the first through hole.

[0082] In some possible implementation manners, the bass tube channel forms a strip-shaped groove on the front side of the support. The earphone further comprises a first cover plate fixed on the front side of the support and covering part of the opening of the strip-shaped groove. The other part of the opening of the strip-shaped groove forms the first opening. At this time, the bass tube channel is formed by being jointly surrounded by the support and the first cover plate. The first cover plate can be positioned with the support through positioning structures (such as positioning columns, protrusions, etc.) on the support first, and then fixed with the support by ultrasonic welding to ensure the reliability of the sealing of the bass tube. In other embodiments, the first cover plate can be fixedly connected with the support by using adhesive, double-sided adhesive and the like.

[0083] Wherein, in the embodiments of the present application, when the speaker of the earphone is working, the air in the bass tube channel forms a resonance, which drives the resonance of the air in the rear cavity, thereby affecting the vibration of the diaphragm of the speaker, so as to improve the bass performance of the earphone. The size of the bass tube channel of the earphone affects the frequency response result, and the low-frequency sensitivity can be improved based on sound quality / noise reduction considerations by adjusting the length and / or cross-sectional area of the bass tube channel. In addition, the cross-sectional area of the bass tube channel is limited and cannot be too large or too small; if the cross-sectional area of the bass tube channel is too small, it will cause the acoustic viscous damping to increase, affecting the resonance effect; if the cross-sectional area of the bass tube channel is too large, it will cause the size of the earphone to be too large.

[0084] For example, the cross-sectional area of the bass tube channel can be in the range of 0.8mm 2 to 1.7mm 2 , such as in the range of 0.94mm 2 to 1.54mm 2 , such as 1.126mm 2 , 1.20mm 2 , 1.24mm 2 , 1.28mm 2 , etc.; the length of the bass tube channel can be in the range of 7mm to 16mm, such as in the range of 9.8mm to 13.8mm, such as 9.8mm, 10.4mm, 11.2mm, etc., to obtain better low-frequency sensitivity.

[0085] In some embodiments, the first cover plate can be made of plastic material, at this time, the first cover plate is lighter in weight, which is beneficial to the weight reduction of the earphone. In addition, when the support is also made of plastic material, the first cover plate and the support can be fixed to each other by ultrasonic welding technology, which can meet the needs of fixation and sealing, and at the same time, it will not occupy additional space due to the need for connection, which is beneficial to miniaturization. Of course, the first cover plate can also be fixed and connected to the support by using glue materials such as dispensing, double-sided adhesive, etc.

[0086] In other embodiments, the first cover plate can also be made of metal material, at this time, the first cover plate and the main body still maintain a sealed connection relationship, such as being fixed by glue materials such as dispensing, double-sided adhesive, etc. At the same time, since the first cover plate is located between the speaker and the main circuit board, when the first cover plate is made of metal material, the first cover plate can be used as a magnetic shielding member, which can isolate the magnetic field, so as to reduce the adverse effects of the induced magnetic field generated by the devices on the main circuit board on the speaker, further reducing the risk of current noise.

[0087] In some other embodiments, the first cover plate can also include a plurality of plate bodies arranged in a stack, at least one of the plurality of plate bodies being made of a metal material. At this time, the first cover plate can be reused as a magnetic isolation member. Among the plurality of plate bodies, at least one plate body can also be made of a plastic material, and at this time, the first cover plate is a composite cover plate. For example, the first cover plate can include a plastic plate and a metal plate arranged in a stack, the plastic plate being arranged on the side close to the support, and the first cover plate being capable of being ultrasonically welded to the support through the plastic plate. In addition, the first cover plate can also achieve magnetic isolation through the metal plate to reduce the risk of current noise of the loudspeaker.

[0088] In some possible implementations, the area of the support located around the second opening is sealingly connected with the inner wall of the shell. For example, the gap between the area of the support located around the second opening and the inner wall of the shell can be sealingly connected by a glue layer to improve the sealing performance of the bass tube channel.

[0089] In some possible implementations, the sound pickup channel forms a third opening on the circumferential side of the support, the third opening is arranged in a spaced manner with the second opening, and the third opening is in communication with the second through hole. The third opening and the second opening can be located on different sides of the support to correspond to the positions of the first through hole and the second through hole of the shell, thereby matching the appearance of the earphone.

[0090] In some possible implementations, the earphone further includes a fifth mesh cloth fixed to the circumferential side of the support and covering the third opening. The fifth mesh cloth allows sound to pass through and prevents external dust from entering the sound pickup channel through the third opening, so that the sound pickup accuracy of the second microphone is higher. The fifth mesh cloth can be fixed to the support by a glue layer, which can be a glue material such as a glue dispensing layer, a double-sided adhesive tape, or the like. The fifth mesh cloth can also be fixed to the support by other means.

[0091] In some possible implementations, the area of the support located around the third opening is sealingly connected with the inner wall of the shell. For example, the area of the support located around the third opening and the inner wall of the shell can be sealingly connected by a glue layer to improve the sealing performance of the sound pickup channel.

[0092] In some possible implementations, the sound pickup cavity is formed on the front side of the support, and the earphone further includes a second cover plate fixed to the front side of the support and covering the sound pickup cavity. The second cover plate can be fixed to the support by a glue layer, which can be a glue material such as a glue dispensing layer, a double-sided adhesive tape, or the like. In some other embodiments, the second cover plate can also be fixed to the support by ultrasonic welding or other means.

[0093] The second cover plate is sealingly connected with the support to close the sound pickup cavity, and isolate the rear cavity from the sound pickup cavity, so as to avoid the second microphone in the sound pickup cavity from picking up the sound of the loudspeaker, causing self-excitation and howling. The isolation degree of the second cover plate is higher than 30 dB to meet the isolation degree requirement of the second microphone and the loudspeaker. In some examples, the thickness of the second cover plate can be in the range of 0.15 mm to 0.45 mm, such as 0.23 mm, 0.3 mm, 0.35 mm, etc.

[0094] In some possible implementations, the second cover plate is made of plastic material or metal material; or the second cover plate includes a plurality of plate bodies arranged in layers, at least one of which is made of metal material. Specifically:

[0095] In some examples, the second cover plate can be made of plastic material, which is lighter in weight and is conducive to weight reduction of the earphone. In addition, when the support is also made of plastic material, the second cover plate and the support can be fixed to each other by ultrasonic welding technology, which can meet the requirements of fixation and sealing, and at the same time, does not occupy additional space due to connection, which is conducive to miniaturization. Of course, the second cover plate can also be fixed and connected to the support by using glue, double-sided tape, etc.

[0096] In other examples, the second cover plate can also be made of metal material, which is still sealingly connected with the main body, for example, the two can be fixed by using glue, double-sided tape, etc. At the same time, since the second cover plate is located between the loudspeaker and the main circuit board, when the second cover plate is made of metal material, the second cover plate can be used as a magnetic shield, which can isolate the magnetic field to reduce the adverse effects of the induced magnetic field generated by the devices on the main circuit board on the loudspeaker, further reducing the risk of current noise. For example, the second cover plate can be made of SPCC material.

[0097] In other examples, the second cover plate can also include a plurality of plate bodies arranged in layers, at least one of which is made of metal material. At this time, the second cover plate can be used as a magnetic shield. Among them, at least one of the plurality of plate bodies can also be made of plastic material, at this time, the second cover plate is a composite cover plate. For example, the second cover plate can include a plastic plate and a metal plate arranged in layers, the plastic plate is located on the side close to the support, and the second cover plate can be ultrasonically welded with the support through the plastic plate. In addition, the second cover plate can also realize magnetic shielding through the metal plate to reduce the risk of current noise of the loudspeaker.

[0098] In some possible implementations, the earphone further includes a sixth mesh cloth fixed to the bottom wall of the sound pickup cavity and covering the opening of the sound pickup passage on the bottom wall of the sound pickup cavity. The sixth mesh cloth can be fixed to the bottom wall of the sound pickup cavity by using glue 83 or other means, and the glue layer can be glue, double-sided tape, etc.

[0099] In some possible implementation manners, the earphone further includes a first flexible circuit board, a portion of the first flexible circuit board extends into the sound pickup cavity from the front side of the support, and the microphone is fixed to and electrically connected to the first flexible circuit board. The second microphone is fixed to the first portion of the first flexible circuit board. The first flexible circuit board can extend from the rear side of the support to the front side of the support, the first portion of the first flexible circuit board can be located in the sound pickup cavity, and the second microphone is located in the sound pickup cavity to collect sound entering the sound pickup cavity. The first portion of the first flexible circuit board can be fixed to one side of the sixth mesh cloth away from the sound pickup channel through the adhesive layer. The first flexible circuit board can also have a portion of the structure fixed to the front side of the support to stabilize and reliably position the first flexible circuit board relative to the support.

[0100] In some possible implementation manners, the sound pickup direction of the microphone is away from the loudspeaker. In this case, the isolation effect of the second microphone from the loudspeaker is better, which is conducive to improving the sound pickup signal-to-noise ratio of the second microphone. For example, the first portion of the first flexible circuit board is provided with a through hole, and the sound pickup hole of the second microphone is connected to the sound pickup channel through the through hole, so that sound can enter the second microphone through the sound pickup channel, the through hole of the first portion, and the sound pickup hole of the second microphone, and the second microphone can realize sound pickup.

[0101] In some possible implementation manners, the sound pickup channel forms a connecting groove at the rear side of the support, the rear side of the support is away from the loudspeaker, one end of the connecting groove is connected to the sound pickup cavity, and the other end of the connecting groove is connected to the third opening. The earphone further includes a third cover plate fixed to the rear side of the support and covering the connecting groove.

[0102] In the implementation manner, the sound pickup channel forms a curved portion at each end of the connecting groove. The sound pickup channel extends from the sound pickup cavity to the third opening, first extends from the front side of the support to the rear side of the support, extends a distance on the rear side of the support, and then extends from the rear side of the support to the circumferential side of the support to form a curved channel.

[0103] The third cover plate can be fixedly connected to the support through an adhesive layer, and the adhesive layer can be a glue dispensing material, a double-sided adhesive, or the like. In other embodiments, the third cover plate can be fixedly connected to the support through ultrasonic welding to ensure the reliability of the sealing of the sound pickup channel. The third cover plate can be made of a plastic material or a metal material, or a composite plate structure.

[0104] In some possible implementation manners, the sound pickup channel includes at least one curved portion. In this case, the sound pickup channel is a curved channel to avoid direct entry of external sound (for example, wind noise) into the sound pickup cavity, to improve the windproof effect, reduce wind noise, and thus improve the sound pickup accuracy of the second microphone.

[0105] In some possible implementation manners, the support further has a rear leakage passage, which is arranged separately from the bass tube passage and the sound pickup passage. The rear leakage passage forms a fourth opening on the front side of the support and forms a fifth opening on the circumferential side of the support, and the fifth opening is communicated with the first through hole. Air in the rear cavity of the earphone can be transmitted to the external space of the earphone through the rear leakage passage and the first through hole.

[0106] In the implementation manner, the bass tube passage, the sound pickup passage and the rear leakage passage are integrated into the support, which has high integration and high utilization of the internal space of the earphone, and is conducive to miniaturization of the earphone. The design scheme of the integrated support can also reduce the assembly difficulty, improve the production yield, bring cost advantages, and further improve the competitiveness of the product.

[0107] The fifth opening is arranged adjacent to the second opening, that is, the openings of the bass tube passage and the rear leakage passage on the circumferential side of the support are arranged adjacent to each other, so that the opening area of the first through hole is reduced in the case that the fifth opening and the second opening are both communicated with the first through hole, to avoid forming a large-area hole on the appearance of the shell, and to improve the overall visual integrity of the appearance of the earphone. In other embodiments, the fifth opening and the second opening can also be communicated and merged into one opening.

[0108] The region of the support around the fifth opening is sealingly connected with the inner wall of the shell. For example, the region of the support around the fifth opening can be sealingly connected with the inner wall of the shell by a glue layer, to improve the sealing performance of the sound pickup passage. The glue layer can surround the fifth opening and the second opening at the same time, so that the region of the support around the fifth opening and the second opening is sealingly connected with the region of the inner wall of the shell around the first through hole.

[0109] The seventh mesh cloth is fixed to the front side of the support and covers the fourth opening. The seventh mesh cloth can be fixed to the support by a glue layer, or can be fixed to the support by other means.

[0110] In some possible implementation manners, the distance between the fifth opening and the third opening on the circumferential side of the support is greater than or equal to 10 mm. At this time, there is a certain distance between the fifth opening and the third opening to meet the isolation requirement between the sound pickup passage and the rear leakage passage, for example, the isolation can be greater than or equal to 30 dB to improve the sound pickup accuracy of the second microphone. The first through hole of the shell is arranged corresponding to the fifth opening, and the second through hole is arranged corresponding to the third opening. The distance between the first through hole and the second through hole also needs to meet certain requirements, for example, the distance on the outer surface of the shell is greater than or equal to 10 mm.

[0111] In some possible implementation manners, the earphone further includes a third appearance net fixed to the inner wall of the shell and covering the second through hole. The third appearance net can be fixed to the inner wall of the shell through a glue layer. The third appearance net can include a main body and a flange connected to the periphery of the main body in a surrounding manner, the flange is fixed to the inner wall of the shell, and the main body is embedded in the second through hole.

[0112] The third appearance net is made of a conductive material and is grounded. In this case, the third appearance net can prevent electric shock. The third appearance net can further include an extension connected to the flange, and the extension is used to electrically connect the first flexible circuit board to achieve grounding of the third appearance net. In this implementation manner, the third appearance net is a conductive member, and the extension thereof is fixed to and electrically connected to the first flexible circuit board by welding. The welding connection is reliable, simple in process, and low in cost.

[0113] In some possible implementation manners, the support is a one-piece structural member. In this case, the support has high structural strength, so that the overall structure formed by the support and the related cover plate has good stability. In other embodiments, the support can also be formed by assembling a plurality of structures into an integrated structure to meet the needs of modular assembly.

[0114] In some embodiments, the support can be made of plastic material to achieve light weight. In other embodiments, the support itself can be made of a magnetic conductive material (such as metal) or at least partially covered with a magnetic shielding sheet to achieve magnetic shielding and reduce the risk of current sound of the loudspeaker.

[0115] In some possible implementation manners, the shell includes a main shell and a front shell fixed to the front side of the main shell, the internal space of the front shell communicates with the internal space of the main shell, and the front shell faces the user's ear when the earphone is in a wearing state. The main shell includes a first end connected to the front shell and a second end away from the front shell, and the outer contour of the main shell first shrinks and then expands in the direction from the first end to the second end of the main shell. The internal space of the main shell includes a top space, a middle space, and a bottom space, the cross-sectional area of the top space of the main shell is greater than that of the middle space of the main shell, and the cross-sectional area of the bottom space of the main shell is greater than that of the middle space of the main shell.

[0116] The loudspeaker is located in the internal space of the front shell and the top space of the main shell, and is fixedly connected to the front shell. The earphone further includes a magnetic attraction member, the magnetic attraction member and the support are both located in the top space of the main shell and are fixedly connected to the main shell, and the magnetic attraction member is located on the bottom side of the support. In this case, the volume and position of the magnetic attraction member can meet the requirement of the magnetic attraction force of the earphone into the box.

[0117] The magnetic attraction piece and the support form a mainboard cavity in the direction away from the side of the loudspeaker. The mainboard cavity can be a sealed cavity. For example, the support and the related cover plate and the magnetic attraction piece form a separation assembly, the support and the magnetic attraction piece are in sealed connection, the periphery of the separation assembly is in sealed connection with the inner wall of the shell, so that the sealing of the mainboard cavity is reliable.

[0118] The separation assembly can include a magnetic isolation piece to reduce the risk of current sound of the loudspeaker. For example, the magnetic isolation piece can be realized by the support, the first cover plate, the second cover plate and / or the third cover plate. In addition, the magnetic attraction piece can be a soft magnet (such as a metal block, etc.), at this time, the magnetic attraction piece can also be used as a magnetic isolation piece.

[0119] In some possible implementations, the front shell has a first communication hole and a second communication hole arranged at intervals. The front shell can have a generally cover shape, and can include a front side shell part and a peripheral side shell part. The front side shell part is arranged towards the front, and the peripheral side shell part is connected to the front side shell part and arranged around the front side shell part. The first communication hole can be arranged on the front side shell part of the front shell, and the second communication hole can be arranged on the peripheral side shell part of the front shell.

[0120] The first component and the second component of the audio auxiliary assembly are both mounted in the internal space of the front shell and can be located in the front cavity of the earphone. The first component is arranged corresponding to the first communication hole and covers the first communication hole, and the second component is arranged corresponding to the second communication hole and covers the second communication hole.

[0121] In some embodiments, the first component includes a first seat body, a first appearance net, a first grounding piece, a first mesh cloth, a fixing plate and a plurality of glue layers. The first seat body is provided with a front leakage hole and a light transmission area. The front leakage hole is a through hole structure allowing sound to pass through. The light transmission area allows light to pass through. The light transmission area is arranged at intervals with the front leakage hole, and can be located on one side of the front leakage hole or arranged around the front leakage hole, which is not strictly limited here.

[0122] For example, the first seat body can include a main body and a flange connected to the periphery of the main body. The front leakage hole and the light transmission area can be formed in the main body. The first seat body can be an integrally formed structure, and the first seat body is a light transmission structure so that the corresponding structure of the light transmission area allows light to pass through. The first seat body can have a black or nearly black appearance, but allow light to pass through. For example, the first seat body can include a transparent substrate and a black film layer, and the black film layer is fixed to the transparent substrate. The black film layer is provided with a hollow structure or a thin thickness corresponding to the position of the light transmission area.

[0123] The first seat body can be fixed to the front shell by a glue layer. When the first seat body is mounted to the front shell, the main body of the first seat body can be embedded in the first communication hole of the front shell, and the flange is connected to the inner wall of the front shell by the glue layer. The glue layer can be a continuous glue ring to achieve the connection between the first seat body and the front shell and also achieve the sealing therebetween. The glue layer can be double-sided tape, glue, or other adhesive materials. The main body of the first seat body forms part of the appearance of the earphone.

[0124] The first appearance net can include a main body and a flange that is circumferentially connected to the periphery of the main body. The first appearance net is fixed to the rear side of the first seat body and covers the front vent hole. The main body of the first appearance net is embedded in the front vent hole, and the flange of the first appearance net is fixed to the inner wall of the first seat body. The first appearance net forms part of the appearance of the earphone. The first appearance net can be a metal mesh to increase the fashion and mechanical reliability of the earphone, reduce the risk of damage to components located at the rear side of the first appearance net by external forces, for example, to prevent sharp objects from the outside from penetrating, thereby improving the service life of the earphone. The first appearance net can be an integrally formed structural member, for example, the first appearance net can be formed by stamping a metal mesh member.

[0125] The first ground member includes a fixed part and a connecting part, and one end of the connecting part is connected to the fixed part. The fixed part can be annular. The first ground member is fixed to the side of the first appearance net away from the first seat body, and the fixed part of the first ground member can be circumferentially fixed to the first appearance net, for example, to the flange of the first appearance net, and the fixed part of the first ground member can also be partially located on the inner side of the main body of the first appearance net. At this time, the first ground member is arranged around the front vent hole. The first ground member is made of conductive material, for example, metal material. The first ground member can be an integrally formed structural member, for example, the first ground member can be formed by stamping a metal plate member. The first ground member is grounded to prevent electric shock of the first assembly.

[0126] The first mesh cloth is fixed to the side of the first ground member away from the first appearance net by a glue layer. The first mesh cloth is used to prevent external dust from entering the earphone and adversely affecting the sound effect and sound quality of the earphone. The first mesh cloth is a breathable structure.

[0127] In the present implementation, air can pass through the first appearance net, the first ground member, the first mesh cloth, and the plurality of glue layers, so that the front cavity of the earphone is in communication with the outside of the earphone to balance the air pressure between the front cavity of the earphone and the outside of the earphone, and the first assembly provides a front vent channel for the loudspeaker of the earphone.

[0128] The second part of the first flexible circuit board is fixed to the rear side of the first seat body by a glue layer, and the proximity sensor is arranged corresponding to the light transmission area of the first seat body. The proximity sensor transmits and receives light signals through the light transmission area to detect the wearing of the earphone. The fixing plate can be fixed to the side of the second part of the first flexible circuit board away from the proximity sensor by a glue layer, and the fixing plate is used to increase the structural strength of the second part of the first flexible circuit board. The fixing plate can also be fixedly connected with the first seat body, so that the second part of the first flexible circuit board is fixedly connected with the first seat body, thereby improving the assembly stability of the first assembly.

[0129] The connecting part of the first grounding member can be fixed and electrically connected with the second part of the first flexible circuit board to realize grounding. For example, the connecting part of the first grounding member can be welded with the second part of the first flexible circuit board. In other embodiments, the first assembly can also not be provided with the first grounding member, and the first appearance net is made of conductive material and is electrically connected with the first flexible circuit board to realize grounding.

[0130] In some embodiments, the second assembly includes a second seat body, a second mesh cloth, a second appearance net, a second grounding member, a third mesh cloth, and a plurality of glue layers.

[0131] The second seat body has a first face and a second face. The first face is located on one side of the second seat body, and the second face is connected to the periphery of the first face and is arranged obliquely opposite to the first face. The second seat body is provided with a first hole, a sound pickup channel, and a second hole. The first hole penetrates through the first face to the other side of the second seat body. One end of the sound pickup channel is open on the first face, and the other end of the sound pickup channel extends to the surface of the other side of the second seat body. The sound pickup channel is arranged separately from the first hole. The sound pickup channel can be a curved channel. The second hole penetrates through the first face or the second face to the other side of the second seat body. The second hole is arranged separately from the sound pickup channel and the first hole.

[0132] The second seat body is fixed to the inner side of the front shell, and the second seat body is located in the front cavity. The first face of the second seat body faces the second communication hole, and the second face faces the inner wall of the front shell.

[0133] The second mesh cloth is fixed to the first face of the second seat body by a glue layer. The second mesh cloth is used to prevent external dust from entering the earphone and causing adverse effects on the sound effect and sound quality of the earphone. The second mesh cloth covers the first hole and the opening of the sound pickup channel on the first face of the second seat body. In some embodiments, the second mesh cloth can cover the first face of the second seat body, and the shape of the glue layer can be adapted to the shape of the first face.

[0134] Exemplarily, the second grounding member includes a fixed part and a connecting part, one end of the connecting part being connected to the fixed part. The fixed part can be annular. The second grounding member is fixed to the side of the second mesh away from the second seat body, and the fixed part of the second grounding member can be fixedly connected to the periphery of the second mesh, for example, by a glue layer. The connecting part of the second grounding member can extend to the other side of the second seat body through the second hole of the second seat body. The second grounding member is made of a conductive material, for example, a metal material. The second grounding member can be an integrally formed structural member, for example, the second grounding member can be formed by stamping a metal plate. The second grounding member is grounded to prevent the second assembly from being electrically shocked.

[0135] Exemplarily, the second appearance mesh includes a middle part and a peripheral part, the peripheral part being annularly connected to the periphery of the middle part. The middle part can be convex relative to the peripheral part to form a bulging structure, or the middle part can also be a flat structure, and the second appearance mesh is a planar mesh structure. The peripheral part of the second appearance mesh can be fixed to the side of the second grounding member away from the second mesh by a glue layer, and the middle part of the second appearance mesh can be convex away from the second seat body.

[0136] The second appearance mesh can be a metal mesh to increase the fashion and mechanical reliability of the earphone, reduce the risk of damage to components located on the back side of the second appearance mesh by external force, for example, prevent sharp objects from the outside from penetrating, and improve the service life of the earphone. The second appearance mesh can be an integrally formed structural member, for example, the second appearance mesh can be formed by stamping a metal mesh. In other embodiments, the second appearance mesh can also be made of plastic or other materials.

[0137] Exemplarily, the second appearance mesh, the second grounding member, and the second mesh are located between the second communication hole of the front shell and the second seat body, the peripheral part of the second appearance mesh is connected to the inner wall of the front shell by a glue layer, and the second appearance mesh and the second mesh cover the second communication hole. When the loudspeaker 31 is working, the air in the front cavity is pushed to vibrate to form sound, the sound passes through the first hole of the second seat body, the second mesh, the second appearance mesh, and the second communication hole of the front shell in turn, and is transmitted to the outside of the earphone, thereby realizing sound emission. The second assembly forms a sound emission channel of the loudspeaker 31.

[0138] The opening area of the first hole of the second seat body needs to meet the sound emission requirement of the loudspeaker. When the number of the first holes is multiple, the multiple first holes are arranged at intervals, the area of a single first hole is small, and the total area of the multiple first holes meets the sound emission requirement, and at this time, the structural strength of the second seat body is high.

[0139] For example, the third mesh fabric can be fixed to the side of the second seat body away from the first surface by an adhesive layer, and cover the opening of the sound pickup channel. The third portion of the first flexible circuit board can be fixed to the side of the third mesh fabric away from the second seat body by an adhesive layer. The third portion of the first flexible circuit board is provided with a through hole, and the first microphone fixed to the third portion of the first flexible circuit board can receive sound through the through hole. The third mesh fabric covers the through hole.

[0140] In the implementation, the sound outside the earphone can enter the first microphone through the second appearance mesh, the second mesh fabric, the sound pickup channel, the third mesh fabric, and the through hole of the third portion of the first flexible circuit board in sequence, and the earphone can collect the external sound through the first microphone to realize sound pickup.

[0141] The connecting portion of the second grounding member can be fixed and electrically connected to the third portion of the first flexible circuit board to realize grounding. For example, the connecting portion of the second grounding member can be welded to the third portion of the first flexible circuit board. In some other embodiments, the second assembly can also not be provided with the second grounding member, the second appearance mesh is made of a conductive material, and the second appearance mesh is electrically connected to the first flexible circuit board to realize grounding.

[0142] In some possible implementations, the loudspeaker includes a basket, a magnetic circuit assembly, and a diaphragm, the magnetic circuit assembly and the diaphragm are fixedly connected to the basket, a second space is formed between the diaphragm and the magnetic circuit assembly, and a third space is formed on the side of the magnetic circuit assembly away from the diaphragm. The basket is provided with a first through hole or a second through hole, and the first through hole or the second through hole of the basket communicates the second space and the third space. The magnetic circuit assembly is provided with a third through hole, and the third through hole communicates the second space and the third space.

[0143] In the implementation, the side of the diaphragm away from the magnetic circuit assembly forms a first space, a second space is formed between the diaphragm and the magnetic circuit assembly, and a third space is formed on the side of the magnetic circuit assembly away from the diaphragm. When the loudspeaker is installed in the earphone, the first space corresponds to the front cavity, and the third space corresponds to the rear cavity. The first through hole, the second through hole, and the third through hole all communicate the second space and the third space, and the first through hole, the second through hole, and the third through hole form a rear vent hole of the loudspeaker. In the embodiments of the present application, the third through hole is additionally provided in the loudspeaker, so that the opening area of the rear vent hole of the loudspeaker is greatly increased, which is beneficial to reduce the overall acoustic impedance of the earphone, so that the resonance effect of the loudspeaker and the bass tube channel is better, and the low-frequency performance of the earphone is better.

[0144] The total acoustic impedance of the earphone includes the mechanical acoustic impedance of the diaphragm of the speaker, the acoustic impedance of the back vent of the speaker, the acoustic impedance of the bass tube channel, and the acoustic impedance of the sound outlet. The mechanical acoustic impedance of the diaphragm is the resistance that the diaphragm receives when vibrating. The acoustic impedance of the back vent of the speaker refers to the acoustic impedance of the mesh cloth covering the back vent of the speaker, which in this implementation is the acoustic impedance of the first mesh cloth, the second mesh cloth, and the third mesh cloth. The acoustic impedance of the bass tube channel is the acoustic impedance of the mesh cloth at the opening of the bass tube channel, which in this implementation is the acoustic impedance of the mesh cloth at the position where the bass tube channel is in communication with the outside world. The acoustic impedance of the sound outlet is the acoustic impedance of the mesh cloth at the position where the front cavity of the earphone is in communication with the outside world, that is, the acoustic impedance of the second mesh cloth covering the second communication hole.

[0145] For example, the total acoustic impedance of the earphone is less than or equal to 10 7 Pa*s / mm 3 to ensure that the resonance effect of the speaker and the bass tube channel is good.

[0146] In some possible implementations, the opening area of the third through hole is less than or equal to 3.14 mm 2 to ensure that the magnetic field strength of the magnetic circuit assembly of the speaker is sufficient while reducing the total acoustic impedance. The third through hole can be a circular hole, a square hole, or a hole of another shape. When the third through hole is a circular hole, the diameter of the third through hole is less than or equal to 2 mm.

[0147] In a fourth aspect, the embodiments of the present application also provide an earphone assembly, which includes a charging box and the earphone of any one of the above-mentioned first aspect. The charging box is used to accommodate the earphone.

[0148] In a fifth aspect, the embodiments of the present application also provide an earphone assembly, which includes a charging box, a first earphone, and a second earphone. The charging box has a first earphone slot and a second earphone slot arranged at intervals. The charging box includes a first electrode, a second electrode, a third electrode, and a fourth electrode. The first electrode and the second electrode are at least partially located in the first earphone slot, and the third electrode and the fourth electrode are at least partially located in the second earphone slot. The second electrode and the third electrode are located between the first electrode and the fourth electrode. The first electrode and the third electrode have the same polarity, and the second electrode and the fourth electrode have the same polarity.

[0149] The first earphone includes a first contact and a second contact arranged at intervals, and the second earphone includes a first contact and a second contact arranged at intervals. The first contact of the second earphone and the first contact of the first earphone have the same polarity, and the second contact of the second earphone and the second contact of the first earphone have the same polarity.

[0150] The first earphone is detachably accommodated in the first earphone slot, the first contact of the first earphone contacts the first electrode, and the second contact of the first earphone contacts the second electrode; the second earphone is detachably accommodated in the second earphone slot, the first contact of the second earphone contacts the third electrode, and the second contact of the second earphone contacts the fourth electrode.

[0151] In the present application, when the first earphone and the second earphone are correctly placed in the charging box, the contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, and the first earphone and the second earphone can normally communicate and charge with the charging box. When the first earphone is placed in the second earphone slot and the second earphone is placed in the first earphone slot, the first earphone and the second earphone are incorrectly placed in the charging box in the form of double-ear reverse, the first contact of the second earphone contacts the first electrode, the second contact of the second earphone contacts the second electrode, the first contact of the first earphone contacts the third electrode, and the second contact of the first earphone contacts the fourth electrode. The contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, so as to effectively avoid damaging the later-stage circuit of the first earphone and the second earphone, and prolong the service life of the earphone and the earphone assembly.

[0152] In the present application, when the first earphone and the second earphone are correctly placed in the charging box, the contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, and the first earphone and the second earphone can normally communicate and charge with the charging box. When the first earphone is placed in the second earphone slot and the second earphone is placed in the first earphone slot, the first earphone and the second earphone are incorrectly placed in the charging box in the form of double-ear reverse, the first contact of the second earphone contacts the first electrode, the second contact of the second earphone contacts the second electrode, the first contact of the first earphone contacts the third electrode, and the second contact of the first earphone contacts the fourth electrode. The contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, so as to effectively avoid damaging the later-stage circuit of the first earphone and the second earphone, and prolong the service life of the earphone and the earphone assembly.

[0153] In some possible implementation manners, the first contact of the first earphone and the second contact of the first earphone are both fixed to the shell of the first earphone and exposed relative to the shell of the first earphone; and the first contact of the second earphone and the second contact of the second earphone are both fixed to the shell of the second earphone and exposed relative to the shell of the second earphone. The shell of the first earphone and the shell of the second earphone are mutually symmetrical structures, the first contact of the first earphone and the second contact of the second earphone are symmetrically arranged, and the second contact of the first earphone and the first contact of the second earphone are symmetrically arranged.

[0154] In the present application, when the first earphone and the second earphone are correctly placed in the charging box, the contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, and the first earphone and the second earphone can normally communicate and charge with the charging box. When the first earphone is placed in the second earphone slot and the second earphone is placed in the first earphone slot, the first earphone and the second earphone are incorrectly placed in the charging box in the form of double-ear reverse, the first contact of the second earphone contacts the first electrode, the second contact of the second earphone contacts the second electrode, the first contact of the first earphone contacts the third electrode, and the second contact of the first earphone contacts the fourth electrode. The contact polarity of the first earphone and the second earphone corresponds to the polarity of the plurality of electrodes of the charging box, which is positive connection, so as to effectively avoid damaging the later-stage circuit of the first earphone and the second earphone, and prolong the service life of the earphone and the earphone assembly.

[0155] In the above two reverse connection cases, the earphone assembly can be provided with an anti-reverse connection circuit in the first earphone and the second earphone, the anti-reverse connection circuit being connected in series between the first contact or the second contact and the charging circuit, the anti-reverse connection circuit being used to be turned on when the first earphone or the second earphone is connected to the charging box in a normal manner and to be turned off when the first earphone or the second earphone is connected to the charging box in a reverse manner, so as to effectively avoid damage to the rear circuit of the first earphone and the second earphone when the first earphone or the second earphone is incorrectly placed in the charging box. The anti-reverse connection circuit can include one or more of a MOS tube, a resistor, a capacitor, a diode, a magnetic bead, etc.

[0156] In some possible implementation manners, in the first earphone, the first earphone includes an anti-reverse connection circuit and a charging circuit, the anti-reverse connection circuit being connected in series between the first contact or the second contact and the charging circuit, the anti-reverse connection circuit being used to be turned on when the first contact contacts the first electrode and the second contact contacts the second electrode, and to be turned off when the first contact contacts the second electrode and the second contact contacts the first electrode.

[0157] In the present implementation manner, the anti-reverse connection circuit is turned on when the first earphone is connected to the charging box in a normal manner, and is turned off when the first earphone is connected to the charging box in a reverse manner, so as to effectively avoid damage to the rear circuit when the first earphone is incorrectly placed in the charging box.

[0158] The anti-reverse connection circuit can also be turned on or turned off when the first contact contacts the third electrode and the second contact contacts the fourth electrode, and the anti-reverse connection circuit is turned off when the first contact contacts the fourth electrode and the second contact contacts the third electrode.

[0159] For example, the processor of the first earphone is electrically connected to the anti-reverse connection circuit, and the processor is used to control the working state of the anti-reverse connection circuit. The processor can send an enable signal to the anti-reverse connection circuit, and the enable signal is used to instruct the anti-reverse connection circuit to work.

[0160] In some possible implementation manners, the anti-reverse connection circuit includes an NMOS tube, a drain of the NMOS tube being electrically connected to the first contact or the second contact, and a source of the NMOS tube being electrically connected to the charging circuit. In the present implementation manner, the anti-reverse connection circuit realizes the functions of being turned on in a normal manner and being turned off in a reverse manner through the NMOS tube.

[0161] In some possible implementation manners, the first earphone further includes a processor, the processor being electrically connected to a gate of the NMOS tube, and the processor being used to control the working state of the anti-reverse connection circuit.

[0162] For example, the drain of the NMOS tube is electrically connected to the second contact, the source of the NMOS tube is electrically connected to the second port of the charging circuit, and the gate of the NMOS tube can be electrically connected to the processor. Alternatively, the drain of the NMOS tube is electrically connected to the first contact, the source of the NMOS tube is electrically connected to the first port of the charging circuit, and the gate of the NMOS tube can be electrically connected to the processor. When the first earphone is connected to the charging box in the positive direction, the Vgs of the NMOS tube is greater than Vth, and the NMOS tube is turned on. When the first earphone is connected to the charging box in the reverse direction, the Vgs of the NMOS tube is less than Vth, and the NMOS tube is turned off.

[0163] The equivalent circuit of the NMOS tube can include a MOS tube part, a parasitic capacitor, and a body diode in parallel.

[0164] In some possible implementations, the first earphone further includes a first resistor and a second resistor, and the first resistor and the second resistor form a voltage dividing circuit. The first resistor and the second resistor are connected in series between the first contact and the second contact, and the gate of the NMOS tube is electrically connected between the first resistor and the second resistor. When the first earphone is connected to the charging box in the positive direction, a first voltage exists between the first contact and the second contact, and the first resistor and the second resistor divide the voltage, so that a voltage exists at the gate of the NMOS tube, and the NMOS tube is turned on.

[0165] In some use scenarios, the first earphone is correctly placed in the first earphone slot of the charging box, and when the in-box detection is performed through the first contact and the second contact, a detection voltage exists between the first contact and the second contact, the first resistor and the second resistor divide the voltage, so that a voltage exists at the gate of the NMOS tube, and the NMOS tube is turned on; when the first earphone communicates with the charging box, if the charging box outputs a 1 signal (high level), the first resistor and the second resistor divide the voltage, so that a voltage exists at the gate of the NMOS tube, and the NMOS tube is turned on, and if the charging box outputs a 0 signal (low level), the processor outputs an enable signal, so that a voltage exists at the gate of the NMOS tube, and the NMOS tube is turned on; when the charging box charges the first earphone, a charging voltage exists between the first contact and the second contact, the first resistor and the second resistor divide the voltage, so that a voltage exists at the gate of the NMOS tube, and the NMOS tube is turned on.

[0166] In some possible implementations, the first earphone further includes a first transient diode, and the first transient diode has two ends electrically connected to the first contact and the second contact, respectively; and / or the first earphone further includes a second transient diode, and the second transient diode has two ends electrically connected to the drain and the source of the NMOS tube, respectively.

[0167] In the present implementation, the transient diode is a high-efficiency protection device in the form of a diode, and the first transient diode and the second transient diode are configured to prevent static electricity from being generated in the first earphone, thereby improving reliability and user experience.

[0168] In some possible implementation manners, the first earphone further includes a diode, a positive electrode of the diode is connected to the processor, and a negative electrode of the diode is connected to the gate of the NMOS tube, so as to prevent the voltage from flowing back into the processor and reduce the risk of damage to the processor.

[0169] In some possible implementation manners, the reverse connection prevention circuit includes one NMOS tube. At this time, the reverse connection prevention circuit has few components, simple logic, is easy to control, and has low cost.

[0170] In some possible implementation manners, the reverse connection prevention circuit includes a plurality of NMOS tubes, which are connected in series or in parallel. When the NMOS tubes are connected in parallel, the reverse connection prevention circuit can reduce impedance, increase current flow, and thus improve charging efficiency. In addition, the risk of damage to the NMOS tubes can also be reduced. When the NMOS tubes are connected in series, the reverse connection prevention circuit has high reliability and can effectively prevent the risk of damage to the rear-stage circuit of the first earphone when the first earphone is reversely connected to the charging box.

[0171] In some possible implementation manners, the first earphone further includes a third resistor, two ends of the third resistor are respectively connected to the two ports of the charging circuit. The third resistor is configured to achieve impedance matching.

[0172] In some possible implementation manners, the reverse connection prevention circuit can cooperate with the software of the earphone to ensure that, when the first earphone and the second earphone are normally connected to the charging box, the first earphone and the second earphone can normally communicate and charge, and when the first earphone and the second earphone are reversely connected to the charging box, the charging circuit and other devices of the charging box and the charging circuit and other rear-stage circuits of the earphone are protected, so as to improve the reliability of the earphone assembly.

[0173] In some possible implementation manners, the software of the first earphone and the second earphone enables the reverse connection prevention function by default, that is, the processor sends an enable signal to the reverse connection prevention circuit by default, so that the reverse connection prevention circuit is in a working state. At this time, when the first earphone and the second earphone are normally connected to the charging box, the first earphone and the second earphone can charge and communicate; and when the first earphone and the second earphone are reversely connected to the charging box, the rear-stage circuit of the first earphone and the second earphone is normal.

[0174] In other possible implementation manners, the software of the first earphone and the second earphone does not enable the reverse connection prevention function by default, but enables the reverse connection prevention function in some scenarios. For example, the first earphone and the second earphone can determine whether to enable the reverse connection prevention function according to an in-box detection state. For example, the first earphone includes an in-box detection assembly (for example, a Hall sensor), the in-box detection assembly is electrically connected to the processor, and the in-box detection assembly is configured to detect whether the first earphone is accommodated in a first earphone slot of the charging box. The processor is configured to control the reverse connection prevention circuit to work when the first earphone is accommodated in the first earphone slot. In addition, the first earphone and the second earphone can also determine whether to enable the reverse connection prevention function according to other state changes of the earphone, including but not limited to changes of state registers such as sensors and charging circuits.

[0175] In some possible implementation manners, in the first earphone, the first earphone comprises a processor, a charging circuit and an in-box detection component, the processor is electrically connected to the charging circuit and the in-box detection component, the charging circuit is electrically connected to the first contact and the second contact, the in-box detection component is configured to detect whether the first earphone is accommodated in the first earphone slot, and the processor is configured to control the charging circuit to work when the first earphone is accommodated in the first earphone slot.

[0176] In some possible implementation manners, in the first earphone, the first earphone comprises a processor, a charging circuit and an in-box detection component, the processor is electrically connected to the charging circuit and the in-box detection component, the charging circuit is electrically connected to the first contact and the second contact, the in-box detection component is configured to detect whether the first earphone is accommodated in the first earphone slot, and the processor is configured to control the charging circuit to work when the first earphone is accommodated in the first earphone slot.

[0177] In some possible implementation manners, in the charging case, the charging case further comprises a processor and a charging circuit, the charging circuit is electrically connected to the processor, the first electrode and the second electrode, the processor is configured to acquire the power of the first earphone through the charging circuit, the first electrode and the second electrode when the first earphone is accommodated in the first earphone slot, and control the charging circuit to charge the first earphone when the power of the first earphone is less than or equal to a threshold value.

[0178] In some possible implementation manners, in the charging case, the charging circuit is in the communication mode after the charging case is opened, and the processor constantly rounds the detection through the charging circuit to detect whether the first earphone is accommodated in the charging case. After detecting that the first earphone is accommodated in the charging case, the processor acquires the power of the first earphone through the charging circuit, and determines whether the first earphone needs to be charged. When the power of the first earphone is less than or equal to a threshold value, the processor determines that the first earphone needs to be charged, controls the charging circuit to switch to the charging mode, and charges the first earphone. After charging for a certain period of time, the processor controls the charging circuit to switch to the communication mode, reads the power of the first earphone again, and determines whether the first earphone needs to be continuously charged. The above process is repeated one or more times. When the processor determines that the power of the first earphone is full, the charging is stopped. When the processor determines that the power of the first earphone is sufficient (for example, higher than 90%), or the voltage of the first earphone is sufficient, the charging current of the charging circuit can be reduced.

[0179] In the implementation manners, the first earphone adopts the double-contact scheme, and the charging case correspondingly adopts the double-electrode scheme. Therefore, in the working process of the first earphone assembly, the double contacts of the first earphone and the double electrodes of the charging case switch between the communication mode and the charging mode.

[0180] In some possible implementation manners, the shell of the first earphone is of an asymmetric structure, the first earphone slot is of an asymmetric structure, and the shape of the first earphone slot is the same as that of the shell of the first earphone. Similarly, the shell of the second earphone is of an asymmetric structure, the second earphone slot is of an asymmetric structure, and the shape of the second earphone slot is the same as that of the shell of the second earphone. When the first earphone and the second earphone are not placed in the charging box in a correct posture, the first earphone and the second earphone cannot be placed in place, which can remind the user to reposition, thereby facilitating the user experience.

[0181] In some possible implementation manners, in the first earphone, the shell includes a main shell and a front shell, the front shell is fixed to the front side of the main shell, and the internal space of the front shell is in communication with the internal space of the main shell. When the earphone is in a wearing state, the front shell faces the user's ear. The main shell includes a first end in contact with the front shell and a second end away from the front shell. In the direction from the first end to the second end of the main shell, the outer contour of the main shell first shrinks and then expands. The first contact point and the second contact point are both fixed to the main shell and exposed relative to the main shell.

[0182] In the implementation manner, the shape of the main shell is designed such that the ear stem of the earphone can have a shape similar to that of a "freely falling water droplet", and the appearance is delicate.

[0183] In some possible implementation manners, in the first earphone, the main shell includes a main shell piece, the main shell piece includes a top portion, a middle portion and a bottom portion connected in sequence, the top portion of the main shell piece is connected to the front shell, and the first contact point and the second contact point are both fixed to the bottom portion of the main shell piece. The first earphone slot includes a first bottom slot and a first top slot in the box body of the charging box. When the first earphone is placed in the first earphone slot, the bottom portion of the main shell piece is located in the first bottom slot, the front shell and the top portion of the main shell piece are both partially located in the first top slot and partially located outside the box body, and the middle portion of the main shell piece is located outside the box body.

[0184] In the implementation manner, when the first earphone is placed in the first earphone slot, the first earphone has more exposed parts relative to the charging box, which is beneficial to the user to take the earphone and improves the user experience.

[0185] In a sixth aspect, an embodiment of the present application provides a charging box, the charging box has two earphone slots arranged at intervals, the earphone slot is used for accommodating an earphone, the charging box includes a box body and a box cover, and the box cover is rotationally connected to the box body. The earphone slot includes a top slot and a bottom slot in the box body, the top slot is used for placing an ear cap of the earphone, and the bottom slot is used for accommodating an ear stem of the earphone. The box body includes a top surface facing the box cover, the opening of the top slot and the opening of the bottom slot are both located on the top surface of the box body, and the opening of the bottom slot is lower than the opening of the top slot.

[0186] In the embodiments of the present application, the display surface of the charging box is an inclined surface. When the earphone is placed in the earphone slot, the earphone is exposed more relative to the charging box, so that the user can easily take the earphone, the user experience of taking the earphone from the charging box is improved, and the appearance of the product is also ensured to be delicate.

[0187] In some possible implementation manners, the opening of the bottom groove is arranged in a spaced manner with the opening of the top groove. At this time, the opening of the bottom groove is close to one end of the opening of the top groove and is lower than the end of the opening of the top groove close to the opening of the bottom groove. In the present implementation manner, the opening of the bottom groove can be significantly lower than the opening of the top groove, so that when the earphone is placed in the earphone slot, the earphone is exposed more relative to the charging box.

[0188] In some possible implementation manners, the lowest part of the bottom wall of the top groove is not lower than the lowest edge of the opening of the bottom groove. In the present implementation manner, when the earphone is placed in the earphone slot, the earphone is exposed more relative to the charging box.

[0189] In some possible implementation manners, the box body has oppositely arranged first and second ends, and the box cover has oppositely arranged first and second ends. The first end of the box cover is rotationally connected to the first end of the box body, and the second end of the box cover is away from the second end of the box body to open relative to the box body, or the second end of the box cover is close to the second end of the box body to close relative to the box body. The top groove is close to the first end of the box body relative to the bottom groove.

[0190] In some possible implementation manners, the first end of the box body is higher than the second end of the box body.

[0191] In some possible implementation manners, the box body includes a box body shell and a box body lining. The box body lining is fixed to the inner side of the box body shell, and the box body lining has the top groove and the bottom groove. The top of the box body lining is protruded relative to the box body shell. At this time, the top surface of the box body shell is protruded relative to the top surface of the box body lining, so that the user can more conveniently take the earphone placed in the charging box, and the user experience is improved.

[0192] In some possible implementation manners, the top surface of the box body shell is a plane, so as to reduce the processing difficulty of the box body shell and the box cover shell, and make the box body shell and the box cover shell easy to close. The parting surface of the charging box is a plane, and the appearance of the charging box is delicate and simple. In other embodiments, the parting surface of the charging box can also be a curved surface, which is not strictly limited in the embodiments of the present application.

[0193] The top surface of the box body lining is a curved surface, so as to better match and support the earphone in shape between the opening of the top groove and the opening of the bottom groove. At this time, the earphone is stably and reliably placed in the charging box, and it is also convenient for the user to take the earphone. In addition, the display surface of the charging box is also beautiful and delicate. In other embodiments, the top surface of the box body shell can also be a plane, which is not strictly limited in the embodiments of the present application.

[0194] In some possible implementation manners, the charging box has a width direction, a thickness direction and a height direction perpendicular to each other, the two earphone slots are arranged in the width direction of the charging box, the size of the charging box in the height direction is greater than the size of the charging box in the thickness direction, and the top surface of the box body shell is inclined relative to the thickness direction of the charging box and relative to the height direction of the charging box.

[0195] In some possible implementation manners, the charging box includes a magnet, the magnet is fixed to the box body lining and located between the top slot and the bottom slot. In this implementation manner, there is a larger space between the top slot and the bottom slot, so that a larger magnet can be placed to increase the magnetic attraction force for attracting the earphone. When the earphone is placed in the earphone slot, the magnetic attraction member of the earphone is arranged opposite the magnet of the charging box, and the two are close to each other and have a small spacing, so that sufficient magnetic attraction force is generated to stably place the first earphone in the charging box.

[0196] In some possible implementation manners, the charging box further includes a battery and a circuit board, the battery and the circuit board are both fixed to the inner side of the box body shell and located below the box body lining, the circuit board is located below the bottom slot, and the battery is located below the top slot. At this time, the battery and the circuit board can be arranged in the space of the box body, and the space utilization rate of the charging box is high.

[0197] In some possible implementation manners, the charging box further includes a rotating shaft assembly, the rotating shaft assembly includes a rotating shaft and a rotating shaft support, the rotating shaft support is fixed to the box body, and the box cover is rotationally connected to the rotating shaft support through the rotating shaft to rotationally connect the box body.

[0198] In some possible implementation manners, the charging box further includes a wireless charging coil, the wireless charging coil is fixed to the box body; the rotating shaft support includes a metal part and a plastic part, the plastic part is located between the metal part and the wireless charging coil, and the rotating shaft is inserted into the metal part.

[0199] In this implementation manner, the rotating shaft support can reduce the adverse effects of the metal part on the wireless charging process of the charging box while ensuring the strength of the connection structure, to ensure the wireless charging performance of the earphone assembly.

[0200] The rotating shaft support can be an integrally formed structural member to have high structural strength. For example, the rotating shaft support can be formed through a metal injection molding (MIM) process, a metal insert injection molding process, or the like.

[0201] In some possible implementation manners, the box cover includes an adapter block, the adapter block is rotationally connected to the rotating shaft support through the rotating shaft. The box body is provided with a notch, and the adapter block covers the notch when the box cover is closed relative to the box body. At this time, the appearance of the charging box is complete.

[0202] In some possible implementation manners, the rotating shaft assembly further includes a decoration piece, the decoration piece is fixed to the outer side of the adapter block and covers the outer side surface of the adapter block.

[0203] In the implementation manner, the decoration piece covers the outer side surface of the adapter block, and covers the notch of the box body when the charging box is closed, and cooperates with the box body to form the appearance of the charging box.

[0204] In some possible implementation manners, the decoration piece is made of an aluminum alloy material. In this case, the decoration piece is beautiful and has high structural strength, and can also reduce the influence on the wireless charging process of the charging box. The decoration piece can be formed by bending a plate piece, has high structural strength, is easy to process and has low cost.

[0205] In some possible implementation manners, the decoration piece includes a first plate piece, a second plate piece and a third plate piece, the second plate piece and the third plate piece are respectively connected to two ends of the first plate piece and are bent relative to the first plate piece, the first plate piece covers the outer side surface of the adapter block, and the rotating shaft is inserted into the second plate piece and the third plate piece.

[0206] In the implementation manner, the decoration piece is designed to have a structure in which the rotating shaft penetrates through two ends, thereby solving the problem of non-uniform gap between the traditional rear decoration piece and the box body, improving the appearance, and also increasing the support for the rotating shaft, so that the rotating shaft assembly has high structural strength and high reliability.

[0207] In some possible implementation manners, the rotating shaft assembly further includes a torsion spring, one end of the torsion spring is connected to the rotating shaft support, and the other end of the torsion spring is connected to the adapter block. In the implementation manner, the torsion spring is arranged to make the charging box have a switching cover feel.

[0208] In some possible implementation manners, the charging box includes a first electrode, a second electrode, a third electrode and a fourth electrode, the first electrode and the second electrode are located at least partially in one of the earphone slots, the third electrode and the fourth electrode are located at least partially in the other earphone slot, the second electrode and the third electrode are located between the first electrode and the fourth electrode, the first electrode and the third electrode have the same polarity, and the second electrode and the fourth electrode have the same polarity.

[0209] In the implementation manner, when the earphone is correctly placed in the charging box, the polarity of the contact point of the earphone corresponds to the polarity of the plurality of electrodes of the charging box, that is, the earphone is positively connected, and the earphone can normally communicate and charge with the charging box. When the earphone is incorrectly placed in the charging box in a double-ear reverse manner, the polarity of the contact point of the earphone still corresponds to the polarity of the plurality of electrodes of the charging box, that is, the earphone is positively connected, so that the rear-stage circuit of the earphone can be effectively prevented from being damaged, and the service life of the earphone and the earphone assembly is long.

[0210] In a seventh aspect, the embodiments of the present application also provide an earphone assembly, which includes two earphones and the charging box of any one of the above. BRIEF DESCRIPTION OF DRAWINGS

[0211] FIG. 1A is a rear view of the earphone provided in the present application in some embodiments;

[0212] FIG. 1B is a left view of the earphone shown in the present application; FIG. 1A

[0213] FIG. 2 is a structural schematic view of the earphone shown in the present application in some use scenarios; FIG. 1A

[0214] FIG. 3 is a partially exploded structural schematic view of the earphone shown in the present application; FIG. 1A

[0215] FIG. 4 is a cross-sectional structural schematic view of the earphone shown in the present application along A-A; FIG. 1A

[0216] FIG. 5 is a schematic block diagram of a part of the circuit of the earphone shown in the present application; FIG. 1A

[0217] FIG. 6 is an exploded structural schematic view of the shell shown in the present application; FIG. 3

[0218] FIG. 7 is an internal structural schematic view of the shell shown in the present application; FIG. 3

[0219] FIG. 8A is a demolding process schematic view of the middle shell shown in the present application; FIG. 6

[0220] FIG. 8B is a demolding process schematic view of the middle shell shown in the present application; FIG. 6 FIG. 2

[0221] FIG. 9A is a rear view of the shell of the earphone provided in the present application in some other embodiments;

[0222] FIG. 9B is a left view of the shell shown in the present application; FIG. 9A

[0223] is a rear view of the shell of the earphone provided in the present application in some other embodiments; FIG. 10A

[0224] is a left view of the shell shown in the present application; FIG. 10B FIG. 10A

[0225] FIG. 11A ​​​​​​​​​​​​is a structural schematic diagram of the shell of the earphone provided in the application in another embodiment;

[0226] FIG. 11B is a structural schematic diagram of the shell of the earphone provided in the application in another embodiment;

[0227] FIG. 11C is a structural schematic diagram of the shell of the earphone provided in the application in another embodiment;

[0228] FIG. 11D is a structural schematic diagram of the shell of the earphone provided in the application in another embodiment;

[0229] FIG. 12A is a partial structural schematic diagram of a conventional earphone;

[0230] FIG. 12B is a partial structural schematic diagram of another conventional earphone;

[0231] FIG. 13 is a partial structural schematic diagram of the earphone shown in FIG. 1A

[0232] FIG. 14 is a partial structural schematic diagram of the earphone shown in FIG. 4

[0233] FIG. 15 is a partial structural schematic diagram of the earphone shown in FIG. 1A

[0234] FIG. 16 is a structural schematic diagram of the first flexible circuit board and part of the device shown in FIG. 15

[0235] FIG. 17 is a structural schematic diagram of the second flexible circuit board and part of the device shown in FIG. 15

[0236] FIG. 18 is a partial structural schematic diagram of the earphone shown in another angle; FIG. 1A

[0237] FIG. 19 is an exploded structural schematic diagram of the first assembly shown in FIG. 3

[0238] FIG. 20 is a partial cross-sectional structural schematic diagram of the earphone shown at B-B; FIG. 18

[0239] FIG. 21 is an exploded structural schematic diagram of the second assembly shown in FIG. 3

[0240] FIG. 22 ​​​​​​​​​is FIG. 21 Fig. 6 is a schematic view of another part of the earphone shown in Fig. 1, in accordance with some embodiments;

[0241] FIG. 23 is FIG. 18 Fig. 7 is a schematic view of another part of the earphone shown in Fig. 1, in accordance with some embodiments;

[0242] FIG. 24 is FIG. 1A Fig. 8 is a schematic view of a part of the earphone shown in Fig. 1, in accordance with some embodiments;

[0243] FIG. 25 is FIG. 3 Fig. 9 is a schematic view of a fifth component of the audio accessory shown in Fig. 1, in accordance with some embodiments;

[0244] FIG. 26 is FIG. 25 Fig. 10 is a schematic view of a partially exploded view of the fifth component shown in Fig. 9, in accordance with some embodiments;

[0245] FIG. 27 is FIG. 25 Fig. 11 is a schematic view of the fifth component shown in Fig. 9, in accordance with some embodiments;

[0246] FIG. 28 is FIG. 27 Fig. 12 is a schematic view of a partially exploded view of the fifth component shown in Fig. 9, in accordance with some embodiments;

[0247] FIG. 29A is FIG. 25 Fig. 13 is a schematic view of a simulation of the relationship between the length of the bass tube channel of the fifth component shown in Fig. 9 and the frequency response of the earphone, in accordance with some embodiments;

[0248] FIG. 29B is FIG. 25 Fig. 14 is a schematic view of a simulation of the relationship between the cross-sectional area of the bass tube channel of the fifth component shown in Fig. 9 and the frequency response of the earphone, in accordance with some embodiments;

[0249] FIG. 30A is FIG. 1A Fig. 15 is a schematic view of a part of the internal structure of the earphone shown in Fig. 1, in accordance with some embodiments;

[0250] FIG. 30B is FIG. 30A Fig. 16 is a schematic view of a cross-sectional view of the part of the structure shown in Fig. 15, in accordance with some embodiments;

[0251] FIG. 31A is FIG. 3 Fig. 17 is a schematic view of a structure of a loudspeaker, in accordance with some embodiments;

[0252] FIG. 31B is FIG. 31A Fig. 18 is a schematic view of a cross-sectional view of the loudspeaker shown in Fig. 17, in accordance with some embodiments;

[0253] FIG. 31C is FIG. 31A Fig. 19 is a schematic view of an exploded view of the loudspeaker shown in Fig. 17, in accordance with some embodiments;

[0254] FIG. 31D is FIG. 1A a schematic diagram of the whole frequency response curve of the earphone in some possible implementation manners;

[0255] FIG. 32A is FIG. 3 a structural schematic diagram of the antenna of the earphone;

[0256] FIG. 32B is FIG. 32A a structural schematic diagram of the antenna in another angle;

[0257] FIG. 33A is FIG. 3 a structural schematic diagram of the antenna and the main circuit board assembly;

[0258] FIG. 33B is FIG. 33A a structural schematic diagram of the structure in another angle;

[0259] FIG. 34A is FIG. 3 a structural schematic diagram of the assembly structure of the main circuit board, the antenna and the detection circuit board;

[0260] FIG. 34B is FIG. 34A a structural schematic diagram of the structure in another angle;

[0261] FIG. 35 is FIG. 4 a partial structural schematic diagram of the earphone;

[0262] FIG. 36 is FIG. 34A a partial structural schematic diagram of the first circuit board;

[0263] FIG. 37 is FIG. 34A a structural schematic diagram of the first circuit board and the antenna in some other embodiments;

[0264] FIG. 38 is FIG. 35 a structural schematic diagram of the detection circuit board and the related adhesive layer;

[0265] FIG. 39 is FIG. 6 a partial structural schematic diagram of the main shell;

[0266] FIG. 40 is FIG. 6 another partial structural schematic diagram of the main shell;

[0267] FIG. 41 is FIG. 3 a structural schematic diagram of the first contact of the earphone;

[0268] FIG. 42 is a partial structure diagram of the earphone shown in FIG. 1; FIG. 3

[0269] FIG. 43 is an internal structure diagram of the partial structure of the earphone shown in FIG. 1; FIG. 1A

[0270] FIG. 44 is an enlarged view of the structure at A shown in FIG. 1; FIG. 43

[0271] FIG. 45 is an enlarged view of the structure at B shown in FIG. 1; FIG. 43

[0272] FIG. 46 is a structure diagram of an earphone assembly in some embodiments provided by the present application;

[0273] FIG. 47 is a structure diagram of the earphone assembly shown in FIG. 1 in another use state; FIG. 46

[0274] FIG. 48A is a structure diagram of the charging box of the earphone assembly shown in FIG. 1 in another use state; FIG. 47

[0275] FIG. 48B is a structure diagram of the charging box shown in FIG. 1 from another angle; FIG. 48A

[0276] FIG. 49 is a partial exploded structure diagram of the charging box shown in FIG. 1; FIG. 47

[0277] FIG. 50 is a cross-sectional structure diagram at C-C; FIG. 48A

[0278] FIG. 51 is a cross-sectional structure diagram at D-D; FIG. 48A

[0279] FIG. 52 is a structure diagram of the earphone assembly shown in FIG. 1 from another angle; FIG. 46

[0280] FIG. 53 is a partial structure diagram of the charging box shown in FIG. 1; FIG. 49

[0281] FIG. 54 is an assembly structure diagram one of the partial structure in FIG. 1; FIG. 53

[0282] ​​​​​​​​​​​​​FIG. 55 is FIG. 53 an assembled structure of a partial structure shown in FIG. 2 ;

[0283] FIG. 56 is FIG. 51 a partial structure of the charging case shown in

[0284] FIG. 57 is FIG. 49 an exploded structure of a partial structure shown in

[0285] FIG. 58 is FIG. 46 a partial structure of the earphone assembly shown in

[0286] FIG. 59A is FIG. 46 a structure of the earphone assembly shown in another use state

[0287] FIG. 59B is FIG. 59A a partial structure of the earphone assembly shown in

[0288] FIG. 60A is FIG. 46 a structure of the earphone assembly shown in another use state

[0289] FIG. 60B is FIG. 60A a partial structure of the earphone assembly shown in

[0290] FIG. 61A is FIG. 46 a structure of the earphone assembly shown in another use state

[0291] FIG. 61B is FIG. 61A a partial structure of the earphone assembly shown in

[0292] FIG. 62 is FIG. 46 a partial circuit of the earphone assembly in some embodiments

[0293] FIG. 63 is FIG. 62 a partial circuit of the first earphone in some embodiments

[0294] FIG. 64 is FIG. 62 a partial circuit of the first earphone in some embodiments

[0295] FIG. 65 is FIG. 62 a partial circuit of the first earphone in some embodiments Detailed Implementation

[0296] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more than two.

[0297] In the following text, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0298] The directional terms mentioned in the embodiments of this application, such as "front", "rear", "left", "right", "inner", "outer", "side", "top", "bottom", "upper", "lower", etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0299] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set on" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. "Electrical connection" refers to a connection that allows electrical signals to be conducted between the two connections.

[0300] Regarding the overall design and types of headphones:

[0301] Please refer to the following: FIG. 1A , FIG. 1B as well as FIG. 2 , FIG. 1A This is a rear view of the earphone 10 provided in this application in some embodiments. FIG. 1B yes FIG. 1A The left view of the earphone 10 shown. FIG. 2 yes FIG. 1A The diagram shows the structure of the earphone 10 in some usage scenarios.

[0302] The earphone 10 is a wireless earphone, for example, a TWS (True Wireless Stereo) earphone. For the convenience of the following description, the earphone 10 is defined to have opposite orientations of "top" and "bottom" corresponding to the height direction of the earphone 10, opposite orientations of "left" and "right" corresponding to the width direction of the earphone 10, and opposite orientations of "front" and "back" corresponding to the thickness direction of the earphone 10. In the description of some embodiments, the orientation "up" corresponds to the orientation "top", and the orientation "down" corresponds to the orientation "bottom".

[0303] The earphone 10 includes an ear cover 10a and an ear stem 10b, which can also be referred to as a handle. The top of the ear stem 10b is connected to the back side of the ear cover 10a. The outer surface of the earphone 10 is a smooth transition geometric curved surface. The outer contour of the ear stem 10b as a whole presents a shape of first contraction, then expansion, and then contraction in the direction from the end connected to the ear cover 10a to the end away from the ear cover 10a, and the ear stem 10b is like a free-falling water droplet that is round and natural. For example, the earphone 10 can have a central plane 10c, and the central axis 10d of the ear cover 10a can be inclined relative to the central plane 10c. When the earphone 10 is used as a left earphone, the bottom end of the central axis 10d of the ear cover 10a can be deflected to the left relative to the central plane 10c, and the top end of the central axis 10d of the ear cover 10a can be deflected to the right relative to the central plane 10c. When the earphone 10 is used as a right earphone, the bottom end of the central axis 10d of the ear cover 10a can be deflected to the right relative to the central plane 10c, and the top end of the central axis 10d of the ear cover 10a can be deflected to the left relative to the central plane 10c. For example, the outer contour of the ear stem 10b can be symmetrically arranged relative to the central plane 10c.

[0304] When the earphone 10 is worn on the ear of a consumer, the front side of the earphone 10 faces the ear, and the back side of the earphone 10 faces away from the ear. The front side of the earphone 10 is mostly an invisible area, and the back side of the earphone 10 is mostly a visible area. The ear cover 10a of the earphone 10 is inserted into the concha cavity of the ear, the top of the ear stem 10b is located in the concha cavity, and the bottom of the ear stem 10b is located outside the concha cavity. Among them, the tragus, the intertragic notch, and the antitragus of the ear can just surround the contraction part of the ear stem 10b, so as to improve the wearing stability of the earphone 10 by clamping the contraction part of the ear stem 10b, and also take into account the wearing comfort, so as to improve the user experience.

[0305] Please refer to FIG. 3 and FIG. 4 , FIG. 3 is FIG. 1A a partially exploded structural schematic view of the earphone 10, FIG. 4 is FIG. 1AA cross-sectional structure of the earphone 10 is shown along the section A-A. The section A-A corresponds to the center plane 10c of the earphone 10.

[0306] In some embodiments, the earphone 10 includes a housing 1 and a plurality of components mounted in the housing 1, which include but are not limited to a circuit component 2, an audio component 3, an audio auxiliary component 4, a detection component 5, an antenna 6, a first contact 71, a second contact 72, a battery 73, and a magnetic attraction member 81.

[0307] For example, the circuit component 2 can include a main circuit board 21, a first flexible circuit board 22, and a second flexible circuit board 23. A plurality of devices can be fixed on each circuit board. For example, a main control chip 211 can be arranged on the main circuit board 21, and the main control chip 211 can be a System on Chip (SOC). The main control chip 211 can integrate a plurality of circuits. One end of the first flexible circuit board 22 is electrically connected to the main circuit board 21, and one end of the second flexible circuit board 23 is electrically connected to the main circuit board 21 to realize electrical connection between the devices on each circuit board. The circuit component 2 is electrically connected to other functional devices, modules, etc. of the earphone 10.

[0308] For example, the audio component 3 can include a speaker 31 and a plurality of microphones for realizing sound playing and sound picking up. The speaker 31 can also be referred to as a "loudspeaker" for converting audio electrical signals into sound signals. The microphone is used to convert sound signals into electrical signals, mainly used to collect the sound outside the earphone 10 and convert it into an electrical signal to be transmitted to the main control chip 211 for processing, so as to realize the functions of active noise reduction, voice call, call noise reduction, ambient sound mode, voice assistant wake-up, etc. of the earphone 10.

[0309] The plurality of microphones can include a first microphone 32, a second microphone 33, and a third microphone 34. In this application, the first microphone 32 and the second microphone 33 of the audio component 3 of the earphone 10 are applied to an active noise cancelling (ANC) design system, which is a method of identifying an unwanted sound source as noise and eliminating the original noise by generating an "anti-noise" signal to eliminate noise in real time. The second microphone 33 can be an FF (Feed Forward topology) microphone, which is a reference microphone facing outside the user's ear and is used to perceive the noise main signal, and can be used as a reference signal for a forward active noise cancelling filter. The first microphone 32 can be an FB (Feed Back Topology) microphone, which is an error microphone used to collect signals entering the user's ear as a reference signal for a feedback active noise cancelling filter. The third microphone 34 can be a call microphone.

[0310] For example, the audio auxiliary assembly 4 is configured to provide multiple channels to assist the audio assembly 3 to play sound, pick up sound, etc. The audio auxiliary assembly 4 can include a first assembly 41, a second assembly 42, a third assembly 43, a fourth assembly 44, a fifth assembly 45, and a sixth assembly 46, which are installed at different positions of the housing 1 to provide corresponding channels for multiple components of the audio assembly 3.

[0311] For example, the detection assembly 5 includes multiple sensors, which can include a proximity sensor 51, a wearing detection sensor 52, a hall sensor (not shown), a touch sensor 54, a g-sensor (not shown), etc. The proximity sensor 51 and the wearing detection sensor 52 are configured to detect whether the earphone 10 is worn; the hall sensor is configured to detect whether the earphone 10 is put into the charging box; the touch sensor 54 is configured to detect a touch action of a user; the g-sensor is configured to detect a posture change of the earphone 10; the touch sensor 54 and the g-sensor are configured to improve the human-computer interaction experience of the earphone 10. The wearing detection sensor 52 and the touch sensor 54 can be a capacitive sensor (Cap-sensor). The detection assembly 5 can include a detection circuit board 56, which forms the wearing detection sensor 52 and the touch sensor 54.

[0312] In some use scenarios, the earphone 10 can determine whether the earphone 10 is worn or taken off by the user through the wearing detection function, to automatically play / pause music. In other use scenarios, if the user takes off the earphone 10 for a long time without wearing it again and putting it back into the charging box, the earphone 10 will automatically hibernate / shut down to save power. In other use scenarios, to improve the experience of single-ear or double-ear use of the earphone 10, both earphones 10 play music when both earphones 10 are worn, the earphone 10 in the non-wearing state stops playing music, and the earphone 10 in the wearing state continues playing music when one earphone 10 is taken off and the other earphone 10 is worn, to realize seamless switching.

[0313] In some use scenarios, the earphone 10 can detect different touch actions or operation actions of the user through the human-computer interaction function, to realize the functions of playing / pausing music, switching up / down songs, adjusting the volume, and smart voice wake-up, etc. Thus, the earphone 10 can be used to a certain extent without being connected to a terminal (a mobile phone, a tablet, etc.), which is convenient and fast for operation, and is conducive to improving the user experience.

[0314] The antenna 6 is configured to implement wireless communication between the earphone 10 and other terminals (e.g., mobile phones, tablets, etc.). The battery 73 is configured to supply power to the earphone 10. The first contact 71 and the second contact 72 are configured to implement communication between the earphone 10 and the charging case and charging of the earphone 10 by the charging case when the earphone 10 is received in the charging case. The magnetic attraction member 81 is configured to form a magnetic attraction force between the earphone 10 and the charging case when the earphone 10 is received in the charging case, so that the earphone 10 is stably placed in the charging case.

[0315] In some other embodiments of the present application, the earphone 10 can include more or fewer components than those described above, or combine some components, or split some components, or different arrangement of components. The components of the earphone 10 can be implemented in hardware, software, or a combination of software and hardware.

[0316] Referring to FIG. 5 , FIG. 5 is FIG. 1A a schematic block diagram of part of the circuit of the earphone 10.

[0317] In some embodiments, the earphone 10 can include a processor 2a, a memory 2b, an audio processing circuit 2c, a radio frequency circuit 2d, a radio frequency front end 2e, a power management circuit 2f, a charging circuit 2g, etc. The processor 2a is electrically connected to the memory 2b.

[0318] The loudspeaker 31, the first microphone 32, the second microphone 33, and the third microphone 34 are electrically connected to the audio processing circuit 2c, and the audio processing circuit 2c is electrically connected to the processor 2a. The audio processing circuit 2c is configured to convert digital audio information into an analog audio signal output, and is also configured to convert an analog audio input into a digital audio signal. The audio processing circuit 2c can also be configured to encode and decode audio signals. In some embodiments, the audio processing circuit 2c can also be arranged in the processor 2a, or some functional modules of the audio processing circuit 2c can be arranged in the processor 2a.

[0319] The antenna 6 is connected to the radio frequency front end 2e, the radio frequency front end 2e is connected to the radio frequency circuit 2d, and the radio frequency circuit 2d is connected to the processor 2a. The radio frequency circuit 2d is configured to modulate or demodulate a radio frequency signal, and the radio frequency front end 2e is configured to filter and amplify the radio frequency signal. The radio frequency front end 2e can include one or more of a power amplifier (PA), a filter, a switch, and a low noise amplifier (LNA). The filter can be a surface acoustic wave (SAW) filter.

[0320] The first contact 71 and the second contact 72 are electrically connected to a charging circuit 2g, which is electrically connected to the processor 2a, a power management circuit 2f, and a battery 73. The charging circuit 2g is configured to receive a charging input through the first contact 71 and the second contact 72. The power management circuit 2f is electrically connected to the processor 2a. The power management circuit 2f receives input from the battery 73 and / or the charging circuit 2g to power the processor 2a, the memory 2b, and other components. In some other embodiments, the power management circuit 2f can also be disposed in the processor 2a. In some other embodiments, the power management circuit 2f and the charging circuit 2g can also be disposed in the same device.

[0321] The proximity sensor 51, the wearing detection sensor 52, the Hall sensor 53, the touch sensor 54, and the gravity sensor 55 are electrically connected to the processor 2a.

[0322] The processor 2a, the memory 2b, the audio processing circuit 2c, the radio frequency circuit 2d, and the power management circuit 2f can be integrated into the master control chip 211. The radio frequency front end 2e and the charging circuit 2g can be formed in other chips, respectively. In some other embodiments, the above-mentioned circuits can also have other implementation structures. For example, the master control chip 211 can integrate more or fewer circuits. For example, the radio frequency circuit 2d can be implemented by a radio frequency chip independent of the master control chip 211. The embodiments of the present application do not make strict limitations in this regard.

[0323] The components / assemblies of the earphone 10 are described below.

[0324] Regarding the shell 1 of the earphone 10:

[0325] Please refer to FIG. 1A , FIG. 1B , FIG. 6 and FIG. 7 , FIG. 6 is an exploded structural schematic view of the shell 1 shown in FIG. 3 , FIG. 7 is an internal structural schematic view of the shell 1 shown in FIG. 3 .

[0326] In some embodiments, the shell 1 includes a main shell 11 and a front shell 12, the front shell 12 is fixed to the front side of the main shell 11, and the internal space 121 of the front shell 12 is in communication with the internal space 111 of the main shell 11. When the earphone 10 is in a wearing state, the front shell 12 faces the user's ear, specifically, the front shell 12 can be located in the concha cavity, contact the concha cavity, and face the ear canal of the user's ear. The part of the front shell 12 and the main shell 11 connected to the front shell 12 forms the shell of the ear cover 10a of the earphone 10, and the other part of the main shell 11 forms the shell of the ear stem 10b of the earphone 10.

[0327] The main shell 11 includes a first end 11a and a second end 11b. The first end 11a of the main shell 11 is close to the front shell 12 and contacts the front shell 12. The second end 11b of the main shell 11 is away from the front shell 12. The main shell 11 has a spine line 112 extending from the first end 11a to the second end 11b of the main shell 11. The spine line 112 is located on the rear side of the main shell 11 and on the central plane 10c of the earphone 10. The spine line 112 is a smooth curve. As shown in FIG. 1B When the earphone 10 is in the left view, the profile line of the rear side of the main shell 11 (i.e., the side facing away from the front shell 12) corresponds to the spine line 112. The spine line 112 can be a solid line or a non-solid line, and the embodiments of the present application do not make strict limitations thereon.

[0328] For example, in the direction from the first end 11a to the second end 11b of the main shell 11, the outer profile of the main shell 11 first shrinks and then expands. The outer profile of the main shell 11 first shrinks and then expands includes a first case where the outer profile of the main shell 11 first shrinks, then expands, and then shrinks again, and a second case where the outer profile of the main shell 11 first shrinks and then expands.

[0329] For the first case, in the direction from the first end 11a to the second end 11b of the main shell 11, the part of the main shell 11 located in the ear cover 10a is in a shrinking state, the part of the main shell 11 located in the ear stem 10b is in a state of first shrinking, then expanding, and then shrinking again, and the bottom of the main shell 11 can be formed by an arc surface or an approximately arc surface to have a rounded shape. At this time, the shape design of the main shell 11 enables the ear stem 10b of the earphone 10 to have a shape similar to a “freely falling water droplet”.

[0330] For the second case, in the direction from the first end 11a to the second end 11b of the main shell 11, the part of the main shell 11 located in the ear cover 10a is in a shrinking state, and the part of the main shell 11 located in the ear stem 10b is in a state of first shrinking and then expanding, i.e., the bottom of the main shell 11 can be formed by a flat surface or an approximately flat surface. In the second case, the bottom of the main shell 11 can have a small circular corner transition area connected to the bottom end surface. The shape of this transition area changes little and can be ignored.

[0331] For example, as shown in FIG. 7As shown, the internal space 111 of the main shell 11 includes a top space 111a, a middle space 111b and a bottom space 111c in sequence, the top space 111a of the main shell 11 is close to the first end 11a of the main shell 11, and the bottom space 111c of the main shell 11 is close to the second end 11b of the main shell 11. The top space 111a of the main shell 11 is connected to the internal space 121 of the front shell 12. In the direction from the first end 11a of the main shell 11 to the second end 11b of the main shell 11, the internal space 111 of the main shell 11 first narrows and then widens. The cross-sectional area of the top space 111a of the main shell 11 is substantially larger than the cross-sectional area of the middle space 111b of the main shell 11, and the cross-sectional area of the bottom space 111c of the main shell 11 is substantially larger than the cross-sectional area of the middle space 111b of the main shell 11. That is, the narrowest position in the internal space 111 of the main shell 11 is in the middle space 111b of the main shell 11. In this embodiment, the main shell 11 is a shell structure, and the shape change of the internal space 111 of the main shell 11 is the same as or similar to the shape change of the outer contour of the main shell 11.

[0332] It can be understood that the division positions of the top space 111a, the middle space 111b and the bottom space 111c of the main shell 11 in the drawings of the embodiments of the present application are exemplary positions, and are not strict or unique position division. The earphone 10 meets the requirement that the internal space 111 of the main shell 11 narrows to the narrowest in the middle space 111b in overall design, and the division positions of the top space 111a, the middle space 111b and the bottom space 111c of the main shell 11 can be adaptively changed according to actual conditions.

[0333] For example, when the spine line 112 extends from the first end 11a of the main shell 11 to the second end 11b of the main shell 11, the spine line 112 first extends backward and then extends forward. Among them, the part of the main shell 11 corresponding to the backward extending segment of the spine line 112 presents a shape of first narrowing and then widening, and the part of the main shell 11 corresponding to the forward extending segment of the spine line 112 presents a narrowing shape. In this embodiment, by setting the shape of the spine line 112, the back of the earphone 10 presents a shape of freely sliding, and the overall shape of the earphone 10 is natural and beautiful.

[0334] Among them, the spine line 112 can include a plurality of arc segments connected smoothly, and in the extension direction of the spine line 112, the radii of the plurality of arc segments first increase and then decrease. Among them, the arc segment with the largest radius can be provided in the middle space 111b of the main shell 11.

[0335] In some embodiments, as FIG. 1B , FIG. 6 and FIG. 7As shown, the main shell 11 comprises a main shell piece 113 and a cover piece 114. The main shell piece 113 has a first opening 1131 and a second opening 1132 which are spaced apart and both face forward. That is, when the earphone 10 is in the wearing state, the first opening 1131 and the second opening 1132 both face the user's ear. The main shell piece 113 comprises a top portion 113a, a middle portion 113b and a bottom portion 113c which are connected in sequence, the first opening 1131 is formed in the top portion 113a of the main shell piece 113, and the second opening 1132 is formed in the bottom portion 113c of the main shell piece 113. The front shell 12 is mounted to the first opening 1131, and the cover piece 114 is mounted to the second opening 1132 and located in front of the bottom portion 113c of the main shell piece 113. Among them, as shown in FIG. 7 As shown, the inner space of the top portion 113a of the main shell piece 113 forms a top space 111a of the main shell 11, the inner space of the middle portion 113b of the main shell piece 113 forms a middle space 111b of the main shell 11, and the cover piece 114 and part of the main shell piece 113 (i.e. the bottom portion 113c of the main shell piece 113) together enclose a bottom space 111c of the main shell 11. Among them, the main shell piece 113 can be an integrally formed structural piece, for example, the main shell piece 113 can be formed by injection molding process.

[0336] In this embodiment, the shell 1 is composed of three main shell pieces, i.e. the front shell 12, the main shell piece 113 and the cover piece 114, which are less in number, simple in structure and easy to assemble. In addition, the middle portion 113b of the main shell piece 113 is a complete shell piece structure without openings, which is beneficial to improve the structural strength of the main shell piece 113, so that the overall structural strength of the main shell 11 and the shell 1 is higher.

[0337] For example, in combination with the above FIG. 1A , FIG. 6 and FIG. 7 , the main shell 11 comprises an abutting end face 113d which is located on the main shell piece 113 and surrounds the first opening 1131, and the abutting end face 113d contacts the front shell 12. The plane where the abutting end face 113d is located is perpendicular to the central plane 10c of the earphone 10. The main shell piece 113 has a first projection on the plane where the abutting end face 113d is located, the cover piece 114 has a second projection on the plane where the abutting end face 113d is located, and the first projection covers the second projection.

[0338] The surface of the earphone 10 in the rear view angle is the main appearance surface, that is, when viewed from rear to front, the surface exposed by the earphone 10 is the main appearance surface; the surface of the earphone 10 in the front view angle is the secondary appearance surface, that is, when viewed from front to rear, the surface exposed by the earphone 10 is the main appearance surface; when the earphone 10 is in the wearing state, the secondary appearance surface faces the ear of the user and is hidden, and the main appearance surface faces away from the ear of the user and is exposed. The main shell member 113 is projected from rear to front to form a first projection, and the cover member 114 is projected from rear to front to form a second projection. Since the first projection covers the second projection, in the rear view angle of the earphone 10, the main shell member 113 blocks the cover member 114, and the earphone 10 hides the parting line between the cover member 114 and the main shell member 113 on the secondary appearance surface, so that the main appearance surface of the earphone 10 is complete, and a good visual overall sense is maintained. The parting line between the cover member 114 and the main shell member 113 is a line formed on the appearance surface of the earphone 10 at the joint between the cover member 114 and the main shell member 113. The maximum profile line of the main shell member 113 in the left-right direction is shown by the dashed line in FIG. 12, and the parting line between the cover member 114 and the main shell member 113 is located in front of the maximum profile line. FIG. 1B

[0339] ​In some embodiments, the overall height of the earphone 10 can be in the range of 35mm to 45mm, such as 38mm, 39.56mm, 41.5mm, 43.21mm, etc.; the overall width of the earphone 10 can be in the range of 19mm to 26mm, such as 21mm, 22.83mm, 24.5mm, etc. The overall height of the main shell piece 113 can be in the range of 35mm to 45mm, such as 37mm, 39.38mm, 41.2mm, 42.8mm, etc. The thickness of the thickest part of the bottom 113c of the main shell piece 113 can be in the range of 8mm to 12mm, such as 8.2mm, 9mm, 9.74mm, 10.11mm, 10.53mm, etc.; the width of the widest part of the bottom 113c of the main shell piece 113 can be in the range of 11mm to 16mm, such as 12mm, 12.8mm, 13.53mm, 14.2mm, etc. The thickness of the main shell piece 113 at the narrowest position in the front-rear direction can be in the range of 6mm to 8.5mm, such as 6.5mm, 7.2mm, 7.4mm, etc.; the width of the main shell piece 113 at the narrowest position in the left-right direction can be in the range of 5mm to 8.5mm, such as 6.47mm. The front-rear distance between the cover piece 114 and the front shell 12 can be in the range of 5mm to 8mm, such as 5.7mm, 6mm, 6.54mm, 7.12mm, etc. The angle between the central axis 10d of the ear cover 10a and the central plane 10c can be in the range of 50° to 70°, such as 55°, 60°, 67°, etc. The angle between the dividing line of the ear cover 10a and the ear stem 10b and the abutting end face 113d of the main shell piece 113 can be in the range of 7° to 10°, such as 7.6°, 8.4°, 9.2°, etc. In other embodiments, one or more of the above-mentioned dimensions of the earphone 10 can also be adjusted as needed.

[0340] In conventional earphones, the shell of the ear stem is usually designed in a regular geometric shape, such as a cuboid or a cylinder, to facilitate mold demolding during shell injection molding. However, the shell 1 of the earphone 10 of the present application adopts an irregular geometric shape, and therefore the present application designs a mold scheme of rear mold inclined core pulling and rear mold inclined inner slide block collision glue sealing to smoothly demold, as follows:

[0341] Please refer to FIG. 8A and FIG. 8B , FIG. 8A is FIG. 6 the demolding process schematic diagram of the middle shell, FIG. 8B is FIG. 6 the demolding process schematic FIG. 2 . FIG. 8B The demolding process shown in FIG. 8A follows.

[0342] In some embodiments, the mold 13 includes a front mold slider 131, a back mold core 132, a back mold inclined core 133, a back mold inclined inner slider 134, and a back mold slider shovel base 135. Before demolding, the front mold slider 131 and the back mold core 132 clamp the main shell piece 113 from top to bottom, and part of the structure of the back mold core 132 extends into the inside of the main shell piece 113 through the first opening 1131 of the main shell piece 113. The back mold inclined inner slider 134 and the back mold slider shovel base 135 are inserted into the back mold core 132 and the front mold slider 131, and extend into the inside of the main shell piece 113 through the second opening 1132 of the main shell piece 113, and abut against the inner wall of the main shell piece 113; the back mold core 132 has a directional groove 1321, and one end of the back mold inclined inner slider 134 is installed in the directional groove 1321. After the back mold inclined core 133 is inserted into the back mold core 132 and extends into the inside of the main shell piece 113 through the second opening 1132 of the main shell piece 113, it abuts against the back mold inclined inner slider 134 and the inner wall of the main shell piece 113. During the demolding process, first, the front mold slider 131 is slid left and right to separate from the main shell piece 113; then, the back mold inclined core 133 is pulled out, and the back mold inclined core 133 separates from the back mold inclined inner slider 134 and the inner wall of the main shell piece 113, and avoids the undercut position of the main shell piece 113; after that, the back mold slider shovel base 135 is pulled out, and the back mold slider shovel base 135 separates from the main shell piece 113, and the back mold inclined inner slider 134 slides to the lower left under the driving of the back mold slider shovel base 135 and the constraint of the directional groove 1321, separates from the inner wall of the main shell piece 113, and avoids the undercut position of the main shell piece 113; finally, the main shell piece 113 is pushed upward to complete the demolding. The implementation of the demolding scheme in this embodiment helps to realize the mass production of the main shell piece 113.

[0343] It can be understood that the above-mentioned mold 13 structure and demolding process are only an example of illustration, and in some other embodiments, the mold 13 structure and demolding process can also have other implementation manners, and the embodiments of the present application do not make strict limitations on this.

[0344] In the present application, the shell 1 of the earphone 10 can also have other structures, which are illustrated below.

[0345] Please refer to FIG. 9A and FIG. 9B , FIG. 9A is a rear view of the shell 1 of the earphone 10 in some other embodiments provided by the present application, FIG. 9B is FIG. 9A a left view of the shell 1 shown in FIG. 8. FIG. 9A and FIG. 9B The shell 1 shown in FIGS. 9 and 10 can include most of the features of the shell 1 in the previous embodiments, and the differences between them are mainly described below, and the same parts are not described again.

[0346] In some embodiments, the shell 1 comprises a front shell 12 and a main shell 11, the main shell 11 comprising a main shell piece 113, a cover piece 114 and a back cover piece 115, the main shell piece 113 having a first opening 1131, a second opening 1132 and a third opening 1133 arranged in sequence, the first opening 1131 and the second opening 1132 being arranged towards the front, and the third opening 1133 being arranged towards the back. That is, when the earphone 10 is in a wearing state, the first opening 1131 and the second opening 1132 are both arranged towards the user's ear, and the third opening 1133 is arranged away from the user's ear. The third opening 1133 is located between the first opening 1131 and the second opening 1132. The main shell piece 113 comprises a top portion 113a, a middle portion 113b and a bottom portion 113c connected in sequence, the first opening 1131 is formed in the top portion 113a of the main shell piece 113, the second opening 1132 is formed in the bottom portion 113c of the main shell piece 113, and the third opening 1133 is formed in the middle portion 113b of the main shell piece 113. In other embodiments, the third opening 1133 can also extend to the top portion 113a of the main shell piece 113 and / or the bottom portion 113c of the main shell piece 113.

[0347] The front shell 12 is mounted on the first opening 1131, the cover piece 114 is mounted on the second opening 1132, and the back cover piece 115 is mounted on the third opening 1133. The inner space of the top portion 113a of the main shell piece 113 forms a top space of the main shell 11, the cover piece 114 and part of the main shell piece 113 (i.e., the bottom portion 113c of the main shell piece 113) jointly form a bottom space of the main shell 11, and the back cover piece 115 and part of the main shell piece 113 (i.e., the middle portion 113b of the main shell piece 113) jointly form a middle space of the main shell 11.

[0348] In the present embodiment, since the middle portion 113b of the main shell piece 113 forms an opening structure through the third opening 1133, it is helpful to realize smooth demolding of the main shell piece 113, simplify the demolding structure and process of the main shell piece 113, and improve the production efficiency and yield of the main shell piece 113.

[0349] In addition, the parting line between the cover piece 114 and the main shell piece 113 is hidden in the secondary appearance surface, and the back cover piece 115 is located in the primary appearance surface. Although the back cover piece 115 to some extent destroys the integrity of the primary appearance surface, the area of the back cover piece 115 is small, so the primary appearance surface of the earphone 10 can still have a good visual overall sense. In some embodiments, the difference between the back cover piece 115 and the main shell piece 113 can also be used to realize the richness and diversity of the appearance.

[0350] Please refer to FIG. 10A and FIG. 10B , FIG. 10A is a rear view of the shell 1 of the earphone 10 provided by the present application in other embodiments, FIG. 10B is FIG. 10AA left view of the shell 1. FIG. 10A and FIG. 10B The shell 1 shown can include most features of the shell 1 of the foregoing embodiment, and the following mainly describes the differences between the two, and the same parts of the two are not described again.

[0351] In some embodiments, the shell 1 includes a front shell 12 and a main shell 11, and the main shell 11 includes a main shell piece 113 and a cover piece 114. The main shell piece 113 has a first opening 1131 and a second opening 1132 arranged at intervals, and both the first opening 1131 and the second opening 1132 are arranged towards the front. The main shell piece 113 includes a top portion 113a, a middle portion 113b and a bottom portion 113c connected in sequence, the first opening 1131 is formed in the top portion 113a of the main shell piece 113, and the second opening 1132 extends from the bottom portion 113c of the main shell piece 113, through the middle portion 113b of the main shell piece 113, to the top portion 113a of the main shell piece 113.

[0352] In the present embodiment, since the second opening 1132 is partially arranged in the middle portion 113b of the main shell piece 113, the middle portion 113b of the main shell piece 113 has an opening structure, which helps to achieve smooth demolding of the main shell piece 113, simplify the demolding structure and process of the main shell piece 113, and improve the production efficiency and yield of the main shell piece 113.

[0353] In addition, the parting line between the cover piece 114 and the main shell piece 113 is mostly hidden in the secondary appearance surface and only a small part is exposed to the primary appearance surface, so the parting line has less damage to the primary appearance surface, basically maintains the integrity of the primary appearance surface, and makes the earphone 10 have better visual overall sense. Moreover, the part of the parting line between the cover piece 114 and the main shell piece 113 that damages the primary appearance surface is mainly located at the bottom side of the top portion 113a of the main shell piece 113, and when the earphone 10 is in the wearing state, the bottom side of the top portion 113a of the main shell piece 113 abuts against the user's ear, and is not exposed, so the visual overall sense of the earphone 10 in the wearing state is not damaged by the parting line between the cover piece 114 and the main shell piece 113, and the user experience is better.

[0354] Please refer to FIG. 11A , FIG. 11A is a structural schematic view of the shell 1 of the earphone 10 provided by the present application in another embodiment. FIG. 11A The shell 1 shown can include most features of the shell 1 of the foregoing embodiment, and the following mainly describes the differences between the two, and the same parts of the two are not described again.

[0355] In some embodiments, the shell 1 comprises a front shell 12 and a main shell 11, the main shell 11 comprises a main shell piece 113 and a back cover piece 115, the main shell piece 113 has a first opening 1131 and a third opening 1133 arranged at intervals, the first opening 1131 is arranged towards the front, and the third opening 1133 is arranged towards the back. The main shell piece 113 comprises a top portion 113a, a middle portion 113b and a bottom portion 113c connected in sequence, the first opening 1131 is formed in the top portion 113a of the main shell piece 113, and the third opening 1133 is continuously formed in the top portion, the middle portion 113b and the bottom portion 113c of the main shell piece 113. The front shell 12 is mounted on the first opening 1131, and the back cover piece 115 is mounted on the third opening 1133.

[0356] In the present embodiment, since the middle portion 113b of the main shell piece 113 forms an opening structure through the third opening 1133, it is helpful to realize smooth demolding of the main shell piece 113, simplify the demolding structure and process of the main shell piece 113, and improve the production efficiency and yield of the main shell piece 113.

[0357] In the present embodiment, the parting line of the main shell piece 113 and the back cover piece 115 can be partially hidden in the secondary appearance surface and partially located in the main appearance surface, so as to reduce the damage to the integrity of the main appearance surface.

[0358] Please refer to FIG. 11B , FIG. 11B is a structural schematic diagram of the shell 1 of the earphone 10 in another embodiment provided by the present application. FIG. 11B The schematic shell 1 is different from FIG. 11A The difference between the schematic shell 1 and the shell 1 is that the opening area of the third opening 1133 of the main shell piece 113 is smaller, the area of the back cover piece 115 is smaller, and the parting line of the main shell piece 113 and the back cover piece 115 can be partially located in the maximum contour line.

[0359] Please refer to FIG. 11C , FIG. 11C is a structural schematic diagram of the shell 1 of the earphone 10 in another embodiment provided by the present application. FIG. 11C The schematic shell 1 can comprise most of the features of the shell 1 of the previous embodiment, and the differences between the two will be mainly described below, and the same parts of the two will not be described again. FIG. 11A The difference between the schematic shell 1 and the shell 1 is that the top portion of the back cover piece 115 extends to connect the front shell 12, the area of the back cover piece 115 is larger, and the main shell piece 113 and the back cover piece 115 are in a front-back stacking structure.

[0360] Please refer to FIG. 11D , FIG. 11D is a structural schematic diagram of the shell 1 of the earphone 10 in another embodiment provided by the present application. FIG. 11D The schematic shell 1 can comprise most of the features of the shell 1 of the previous embodiment, and the differences between the two will be mainly described below, and the same parts of the two will not be described again.

[0361] In some embodiments, the shell 1 comprises a front shell 12 and a main shell 11, the main shell 11 comprising a main shell piece 113 and a bottom cover piece 116. The main shell piece 113 has a first opening 1131 and a fourth opening 1134 arranged at intervals, the first opening 1131 being arranged towards the front, and the fourth opening 1134 being arranged towards the bottom. The front shell 12 is mounted to the first opening 1131, and the bottom cover piece 116 is mounted to the fourth opening 1134. The back cover piece 115 is arranged in a stack with the bottom cover piece 116. The fourth opening 1134 is arranged at a position where the cross-sectional area of the bottom of the main shell piece 113 is the largest.

[0362] It can be understood that the foregoing description of the structure of the shell 1 is only an exemplary description, and in other embodiments, the shell 1 can also have other structures, which are not strictly limited by the present application.

[0363] Regarding the speaker 31, the main circuit board 21, and the battery 73 of the earphone 10:

[0364] Please refer to FIG. 12A , FIG. 12A is a partial structure diagram of a conventional earphone 40.

[0365] In a conventional earphone 40 with an ear stem, the speaker 401 and the main board 402 are located at the ear cup position, and the battery 403 is located at the ear stem position. Due to the space limitation of the ear cup, the main board 402 is generally arranged close to the speaker 401 and substantially parallel to the speaker 401. Among them, the on-board current on the main board 402 can be equivalent to a coil after vector summation. According to Ampere's law, the coil generates a magnetic field when energized. Similarly, the inductance of the main board 402 will also generate a magnetic field when energized. When the main board 402 is arranged close to the speaker 401, according to Faraday's law, the magnetic field generated by the on-board current and / or inductance of the main board 402 will pass through the inside of the voice coil of the speaker 401, causing the magnetic flux inside the voice coil to change, thereby generating a potential, causing the speaker 401 to generate a current sound.

[0366] Please refer to FIG. 12B , FIG. 12B is a partial structure diagram of another conventional earphone 50.

[0367] In the conventional bean-shaped earphone 50, the loudspeaker 501 and the battery 503 are located at the ear cover position, and the main board 502 is located behind the battery 503. Due to the limitation of the ear cover space, the battery 503 is generally arranged close to the loudspeaker 501 and substantially parallel to the loudspeaker 501. For the battery 503, for example, a button cell, due to the winding of the electrode of the battery 503, the length of the positive electrode and the negative electrode of the battery 503 is different, resulting in that when the battery 503 performs the power output, the positive and negative magnetic fields are not completely offset, and the battery 503 generates an induced magnetic field, the direction of the induced magnetic field is parallel to the direction of the central axis of the battery 503; when the battery 503 is arranged close to the loudspeaker 501, according to Faraday's law, the magnetic induction lines of the magnetic field generated by the battery 503 will pass through the inside of the voice coil of the loudspeaker 501, resulting in the change of the magnetic flux in the voice coil, and then generating an electric potential, resulting in the generation of current sound of the loudspeaker 501.

[0368] Therefore, in the conventional earphone, the coil of the loudspeaker is easily interfered by the magnetic field of the main board or the battery to generate induced current, and then generate current noise, resulting in poor sound quality of the earphone.

[0369] Please refer to FIG. 13 , FIG. 13 is FIG. 1A the partial structure diagram of the earphone 10.

[0370] In some embodiments, the main circuit board 21 is located between the loudspeaker 31 and the battery 73. At this time, the loudspeaker 31 and the battery 73 are respectively placed at both ends of the long side of the main circuit board 21, and the loudspeaker 31, the main circuit board 21 and the battery 73 are substantially like the shape of a dumbbell. Among them, the main circuit board 21 is arranged inclined to the loudspeaker 31, that is, the layout plane 212 of the main circuit board 21 is not parallel to the diaphragm plane 311 of the loudspeaker 31. The layout plane 212 of the main circuit board 21 refers to the board surface of the main circuit board 21 for arranging devices. The diaphragm plane 311 of the loudspeaker 31 refers to the plane where the diaphragm of the loudspeaker 31 is in the balanced position.

[0371] In the embodiment, since the battery 73 and the speaker 31 are arranged at two ends of the long side of the main circuit board 21, the distance between the battery 73 and the speaker 31 is far, the induced magnetic field generated by the battery 73 has little effect on the voice coil of the speaker 31, thereby eliminating the current sound risk caused by the battery 73. At the same time, the layout plane 212 of the main circuit board 21 is not parallel to the diaphragm plane 311 of the speaker 31, so that the effect of the induced magnetic field generated by the inductor or current loop on the speaker 31 is reduced, and the current sound risk caused by the induced magnetic field of the main circuit board 21 is reduced. Therefore, by optimizing the positional relationship among the speaker 31, the main circuit board 21 and the battery 73, the embodiment eliminates or weakens the adverse effect of the induced magnetic field of the main circuit board 21 and the battery 73 on the speaker 31, reduces the risk of generating current sound, and ensures the sound quality of the speaker 31, so that the earphone 10 has better sound quality.

[0372] For example, the angle a between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is in the range of 10° to 60°, such as 20.2°, 28.5°, 30°, 35.21°, 45°, 48.5°, 50°, 55°, etc. At this time, the angle between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is larger, which can greatly reduce the effect of the induced magnetic field generated by the inductor or current loop on the speaker 31, so that the current sound risk caused by the induced magnetic field of the main circuit board 21 is significantly reduced. In addition, the range of the angle between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 also helps to reduce the arrangement difficulty of the speaker 31, the main circuit board 21 and the battery 73 in the shell 1 of the earphone 10, reduce the limitation on the appearance design of the shell 1 of the earphone 10 due to the position requirements of the speaker 31, the main circuit board 21 and the battery 73, and make the form design of the shell 1 of the earphone 10 more flexible.

[0373] For example, the angle a between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is in the range of 10° to 60°, such as 20.2°, 28.5°, 30°, 35.21°, 45°, 48.5°, 50°, 55°, etc. At this time, the angle between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 is larger, which can greatly reduce the effect of the induced magnetic field generated by the inductor or current loop on the speaker 31, so that the current sound risk caused by the induced magnetic field of the main circuit board 21 is significantly reduced. In addition, the range of the angle between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the speaker 31 also helps to reduce the arrangement difficulty of the speaker 31, the main circuit board 21 and the battery 73 in the shell 1 of the earphone 10, reduce the limitation on the appearance design of the shell 1 of the earphone 10 due to the position requirements of the speaker 31, the main circuit board 21 and the battery 73, and make the form design of the shell 1 of the earphone 10 more flexible.

[0374] For example, the battery 73 is arranged obliquely relative to the main circuit board 21. The center axis 731 of the battery 73 is not perpendicular to the layout plane 212 of the main circuit board 21. At this time, the effect of the induced magnetic field generated by the battery 73 on the devices (such as inductors, etc.) sensitive to magnetic field on the main circuit board 21 is smaller, so that the devices on the main circuit board 21 have a better working environment.

[0375] Exemplarily, the included angle between the central axis 731 of the battery 73 and the layout plane 212 of the main circuit board 21 can be in the range of 30° to 80°, for example, 32°, 35.21°, 45°, 48.5°, 50°, 55°, 57.5°, 63.4°, 69.5°, etc.

[0376] Exemplarily, the end surface 732 of the battery 73 can be parallel to the diaphragm plane 311 of the loudspeaker 31. The end surface 732 of the battery 73 is perpendicular to the central axis 731 of the battery 73. At this time, the central axis 731 of the battery 73 is perpendicular to the diaphragm plane 311 of the loudspeaker 31.

[0377] In some embodiments, the main circuit board 21 can be in the shape of a long strip plate to have a larger area of the layout plane 212. At this time, the distance between the loudspeaker 31 and the battery 73 is also larger, which is beneficial to reduce the risk of current noise of the loudspeaker 31.

[0378] Exemplarily, the loudspeaker 31 is a moving coil loudspeaker. In the present embodiment, the loudspeaker 31 drives the diaphragm to vibrate by the vibration of the voice coil in the permanent magnetic field to realize sound emission. In other embodiments, the loudspeaker 31 can also adopt other types of loudspeakers with a voice coil structure, for example, a moving iron loudspeaker or a moving coil loudspeaker, etc., which are not strictly limited in the present embodiment.

[0379] Exemplarily, the battery 73 is a button battery. The meaning of the button battery is a cylindrical battery with a diameter greater than a height. In other embodiments, the battery 73 can also adopt other types of batteries with electrodes repeatedly bent, stacked, or wound, which are not strictly limited in the present embodiment.

[0380] Exemplarily, the distance between the bottom center point 312 of the loudspeaker 31 and the center point 733 of the battery 73 in the first direction is in the range of 12 mm to 20 mm, for example, 13.2 mm, 14 mm, 16.2 mm, 18.8 mm, etc.; the distance between the bottom center point 312 of the loudspeaker 31 and the center point 733 of the battery 73 in the second direction is in the range of 6 mm to 15 mm, for example, 8.4 mm, 9.2 mm, 10.5 mm, 12.3 mm, 13.8 mm, etc. The center point 733 of the battery 73 is located on the central axis 731 of the battery 73. The first direction is parallel to the diaphragm plane 311 of the loudspeaker 31, and the second direction is perpendicular to the first direction. The first direction can be parallel to the height direction of the earphone 10, and the second direction can be parallel to the thickness direction of the earphone 10.

[0381] Exemplarily, the distance between the center point 312 of the bottom surface of the loudspeaker 31 and the center point 733 of the battery 73 is in the range of 10mm to 30mm, such as 15mm, 18.2mm, 19.2mm, 22.2mm, 26.8mm, etc. The above-mentioned position relationship between the loudspeaker 31 and the battery 73 is beneficial to the miniaturization requirement of the earphone 10 and the low-current sound requirement.

[0382] In the embodiments of the present application, the earphone 10 can reasonably arrange the loudspeaker 31, the main circuit board 21 and the battery 73 according to the relative position relationship of the loudspeaker 31, the main circuit board 21 and the battery 73, the shape of the shell 1, and the shape of the internal space 11 of the shell 1. For example:

[0383] Please refer to FIG. 14 , FIG. 14 is FIG. 4 a schematic diagram of part of the structure of the earphone 10.

[0384] In some embodiments, the loudspeaker 31, the main circuit board 21 and the battery 73 are all installed in the shell 1. For example, the loudspeaker 31 can be installed in the internal space 121 of the front shell 12 and / or the top space 111a of the main shell 11; the battery 73 can be installed in the bottom space 111c of the main shell 11; and the main circuit board 21 is installed in the middle space 111b of the main shell 11, and the two ends of the main circuit board 21 extend to the top space 111a of the main shell 11 and the bottom space 111c of the main shell 11, respectively.

[0385] In the embodiments, the loudspeaker 31 and the battery 73 have a large volume and are substantially in the shape of a flat cylinder, and the main circuit board 21 is a long and narrow plate structure. Meanwhile, the internal space 121 of the front shell 12, the top space 111a of the main shell 11 and the bottom space 111c of the main shell 11 are large, and the middle space 111b of the main shell 11 is small. Therefore, the arrangement position of the loudspeaker 31, the main circuit board 21 and the battery 73 in the embodiments not only can reduce the risk of current sound generated by the loudspeaker 31, but also can fully utilize the internal space of the shell 1, improve the space utilization rate of the shell 1, and is beneficial to the miniaturization of the earphone 10.

[0386] Exemplarily, the included angle between the layout plane 212 of the main circuit board 21 and the diaphragm plane 311 of the loudspeaker 31 is in the range of 20° to 50°. At this time, the relative position of the loudspeaker 31 and the main circuit board 21 can well match the relative position relationship of the top space 111a of the main shell 11 and the middle space 111b of the main shell 11, and the installation difficulty is low and easy to implement.

[0387] It can be understood that in other embodiments, the earphone 10 can also be designed or matched with other shapes of the shell to obtain more diversified appearance styles under the condition of meeting the relative position relationship of the loudspeaker 31, the main circuit board 21 and the battery 73, and the application embodiments do not make strict limitations on this.

[0388] Regarding the circuit assembly 2 of the earphone 10:

[0389] Please refer to FIG. 3 and FIG. 15 , FIG. 15 is FIG. 1A the partial structure diagram of the earphone 10.

[0390] In some embodiments, the main circuit board 21 includes opposite first and second ends 21a and 21b, the first end 21a of the main circuit board 21 is adjacent to the loudspeaker 31, and the second end 21b of the main circuit board 21 is adjacent to the battery 73. The first flexible circuit board 22 and the loudspeaker 31 are located on the same side of the main circuit board 21, and the first flexible circuit board 22 is electrically connected to the loudspeaker 31 and the first end 21a of the main circuit board 21. The second flexible circuit board 23 and the battery 73 are located on the same side of the main circuit board 21, and the second flexible circuit board 23 is electrically connected to the battery 73 and the second end 21b of the main circuit board 21.

[0391] In the embodiment, the main circuit board 21 is a hard printed circuit board, which has sufficient structural strength to arrange more devices on the plane of the device, and can also realize double-sided device to improve the device integration. The first and second flexible circuit boards 22 and 23 can be bent, and the first and second flexible circuit boards 22 and 23 can be flexibly arranged according to the shape of the internal space of the earphone 10 and the structure of other components, so that the circuit of the circuit assembly 2 can smoothly extend from the main circuit board 21 to the outside and be electrically connected to other components (such as the loudspeaker 31 and the battery 73) of the earphone 10.

[0392] Among them, the first flexible circuit board 22 can be wound from the back side of the loudspeaker 31 to the front side of the loudspeaker 31, and multiple parts of the first flexible circuit board 22 at different positions can be connected to different devices to improve the device integration of the earphone 10. The second flexible circuit board 23 partially surrounds the battery 73, and multiple parts of the second flexible circuit board 23 at different positions can be connected to different devices to improve the device integration of the earphone 10.

[0393] Exemplarily, the main circuit board 21 is fixedly connected with the first flexible circuit board 22 through a BOF (Board on FPC) process, and the main circuit board 21 is fixedly connected with the second flexible circuit board 23 through a BOF process. The BOF process means a process of "directly mounting the main circuit board 21 on the FPC". In the embodiment, the electrical connection between the main circuit board 21 and the first flexible circuit board 22 and the second flexible circuit board 23 adopts a double-sided BOF process, which can effectively save the layout space of the main circuit board 21 and the internal stacking space of the earphone 10, and is conducive to reducing the cost.

[0394] In other embodiments, the electrical connection between the first flexible circuit board 22, the second flexible circuit board 23 and the main circuit board 21 can also have other implementation manners, for example, the electrical connection can be realized through a BTB (Board-to-board) connector or a ZIF (Zero Insertion Force) connector, or the electrical connection can also be realized through a combination of hard and soft boards.

[0395] As shown in FIG. 15 , exemplarily, both of the two opposite surfaces of the main circuit board 21 are layout surfaces 212, and the main circuit board 21 is double-sided layout to fully utilize the surface space and improve the internal space utilization rate of the earphone 10. In the embodiment, the main circuit board 21 is a single board structure, and in other embodiments, the main circuit board 21 can also be a multi-board structure, for example, a sandwich structure (i.e., a circuit board-device-circuit board structure), and the embodiment of the application does not make strict limitation on this.

[0396] Exemplarily, in addition to the main control chip 211, the main circuit board 21 can also arrange other devices of the earphone 10, such as a gravity sensor, a Hall sensor, a radio frequency front end, etc., and the application does not make strict limitation on the specific devices arranged on the main circuit board 21.

[0397] Please refer to FIG. 16 , FIG. 16 is FIG. 15 the structural schematic diagram of the first flexible circuit board 22 and part of the devices.

[0398] In some embodiments, the first flexible circuit board 22 comprises an interface portion 221 and a plurality of connecting portions, which can have various arrangements and connecting structures, and are electrically connected to the interface portion 221, which is used to electrically connect the main circuit board 21. The plurality of connecting portions can comprise a first portion 222, a second portion 223, a third portion 224 and a fourth portion 225. For example, the second microphone 33 is fixedly and electrically connected to the first portion 222, which can also be used to fix and electrically connect the mating components of the second microphone 33; the proximity sensor 51 is electrically connected to the second portion 223, which can also be used to fix and electrically connect the mating components of the proximity sensor 51; the first microphone 32 is fixedly and electrically connected to the third portion 224, which can also be used to fix and electrically connect the mating components of the first microphone 32; and the fourth portion 225 is used to electrically connect the speaker 31. In some embodiments, some portion(s) of the first flexible circuit board 22 can also be used to fix other components to stabilize and secure the installation position of the first flexible circuit board 22 in the earphone 10. In some embodiments, some portion(s) of the first flexible circuit board 22 can also be used to arrange other circuit components. In some embodiments, the portion(s) of the first flexible circuit board 22 used to fix components can be provided with reinforcing plates to increase the support strength and improve the reliability.

[0399] Please refer to FIG. 17 , FIG. 17 is FIG. 15 the structural schematic diagram of the second flexible circuit board 23 and some components.

[0400] In some embodiments, the second flexible circuit board 23 comprises an interface portion 231 and a plurality of connecting portions, which can have various arrangements and connection structures, and are electrically connected to the interface portion 231, which is used to electrically connect the main circuit board 21. The plurality of connecting portions can comprise a first portion 232, a second portion 233, a third portion 234, and a fourth portion 235. For example, the first portion 232 is used to electrically connect the battery 73, and a charging circuit 2g and its matching devices can be fixed on the first portion 232; the third microphone 34 is electrically connected to the second portion 233, and the second portion 233 can also be fixed and electrically connected to the matching devices of the third microphone 34; the third portion 234 and the fourth portion 235 can be used to connect the first contact 71 and the second contact 72, respectively, which will be described later. In addition, some portion(s) of the second flexible circuit board 23 can also be used to fix other components to stabilize and reliably fix the installation position of the second flexible circuit board 23 in the earphone 10. In addition, some portion(s) of the second flexible circuit board 23 can also be used to arrange other circuit devices. In addition, the portion of the second flexible circuit board 23 used to fix the devices can be provided with a reinforcing plate to increase the support strength and improve the reliability.

[0401] Regarding the division of the cavity of the earphone 10:

[0402] Please refer again to FIG. 3 and FIG. 4 , the magnetic attraction member 81 of the earphone 10 is located below the fifth component 45 of the audio auxiliary assembly 4, and the fifth component 45 and the magnetic attraction member 81 together form the partition component 8. The partition component 8 is installed in the top space 111a of the main shell 11 and is located between the loudspeaker 31 and the main circuit board 21. The internal space 14 of the shell 1 comprises a front cavity 14a, a rear cavity 14b, and a main board cavity 14c. The front cavity 14a is located between the front shell 12 and the loudspeaker 31, the rear cavity 14b is located between the loudspeaker 31 and the partition component 8, and the main board cavity 14c is located on the side of the partition component 8 away from the loudspeaker 31.

[0403] In addition, the main circuit board 21, the second flexible circuit board 23, the antenna 6, the battery 73, and the like can be located in the main board cavity 14c; the first flexible circuit board 22 can extend from the main board cavity 14c to the rear cavity 14b and the front cavity 14a; some components of the audio auxiliary assembly 4 are located in the main board cavity 14c, and some components are located in the front cavity 14a.

[0404] For example, the periphery of the loudspeaker 31 is sealingly connected to the inner wall of the front shell 12, at this time, the front cavity 14a and the rear cavity 14b are separated from each other and not connected. The front shell 12 is sealingly connected to the main shell 11, the fifth component 45 is sealingly connected to the magnetic attraction member 81, and the periphery of the partition component 8 is sealingly connected to the inner wall of the main shell 11. In addition, the main board cavity 14c can be designed as a sealed cavity.

[0405] Regarding the front shell 12 of the earphone 10, the first component 41 and proximity sensor 51 of the audio auxiliary component 4, the second component 42 of the audio auxiliary component 4, and the first microphone 32:

[0406] Please refer to the following: FIG. 1A and FIG. 6 As shown, the front shell 12 has a first connecting hole 122 and a second connecting hole 123 spaced apart. The front shell 12 is generally shaped like a cover and may include a front shell portion and a peripheral shell portion. The front shell portion faces forward, and the peripheral shell portion connects to and surrounds the front shell portion. The first connecting hole 122 may be located on the front shell portion of the front shell 12, and the second connecting hole 123 may be located on the peripheral shell portion of the front shell 12. The second connecting hole 123 can also be referred to as a sound outlet. The front shell 12 may have a center surface 124, which corresponds to the central axis 10d of the earpiece 10a of the earphone 10. The outer contour of the front shell 12 may be symmetrically arranged relative to the center surface 124, and the first connecting hole 122 and the second connecting hole 123 may intersect with the center surface 124 of the front shell 12.

[0407] Please refer to the following: FIG. 4 and FIG. 18 , FIG. 18 yes FIG. 1A The diagram shows a partial structural view of the earphone 10 from another angle.

[0408] In some embodiments, the first component 41 and the second component 42 of the audio auxiliary component 4 are both installed in the internal space 121 of the front shell 12, and can be located in the front cavity 14a of the earphone 10. The first component 41 is disposed corresponding to and covers the first connecting hole 122, and the second component 42 is disposed corresponding to and covers the second connecting hole 123.

[0409] Please refer to the following: FIG. 19 and FIG. 20 , FIG. 19 yes FIG. 3 The diagram shows the exploded structure of the first component 41. FIG. 20 yes FIG. 18 The diagram shows a partial cross-sectional view of the earphone 10 at point BB. For ease of illustration, [the diagram is missing here]. FIG. 20 Relative perspective FIG. 18 The viewpoint shown has been rotated.

[0410] In some embodiments, the first component 41 includes a first seat body 411, a first appearance net 412, a first grounding member 413, a first mesh cloth 414, a fixing plate 415, and a plurality of adhesive layers. The first seat body 411 is provided with a front vent hole 4111 and a light transmission area 4112. The front vent hole 4111 is a through-hole structure allowing sound to pass through. The light transmission area 4112 allows light to pass through. The light transmission area 4112 is arranged apart from the front vent hole 4111, and can be arranged on one side of the front vent hole 4111 or surround the front vent hole 4111, which is not strictly limited here.

[0411] For example, the first seat body 411 can include a main body 4113 and a flange 4114 connected to the periphery of the main body 4113. The main body 4113 can be protruded forward relative to the flange 4114, and the rear side of the main body 4113 forms a plurality of grooves for accommodating other components. The front vent hole 4111 and the light transmission area 4112 can be formed in the main body 4113. The first seat body 411 can be an integrally formed structure, and the first seat body 411 is a light transmission structure to allow light to pass through the corresponding structure of the light transmission area 4112. The first seat body 411 can have a black or nearly black appearance, but allow light to pass through. For example, the first seat body 411 can include a transparent substrate and a black film layer fixed to the transparent substrate, and the black film layer is hollowed out or has a small thickness at the position corresponding to the light transmission area 4112. In some other embodiments, the first seat body 411 can include a first part and a second part, the first part is a light transmission structure to form the light transmission area 4112, and the second part is a non-light transmission structure, and the first part is embedded in the through hole of the second part. It can be understood that the first seat body 411 can also have other implementation structures, which are not strictly limited by the embodiments of the present application.

[0412] The first seat body 411 can be fixed to the front shell 12 by the adhesive layer 4161. When the first seat body 411 is mounted on the front shell 12, the main body 4113 of the first seat body 411 can be embedded in the first communication hole 122 of the front shell 12, and the flange 4114 is connected to the inner wall of the front shell 12 by the adhesive layer 4161. The adhesive layer 4161 can be a continuous adhesive ring to achieve the connection between the first seat body 411 and the front shell 12, and also achieve the sealing therebetween. The adhesive layer 4161 can be double-sided adhesive tape, glue or other adhesive materials. The main body 4113 of the first seat body 411 forms part of the appearance of the earphone 10.

[0413] The first appearance net 412 can include a main body 4121 and a flange 4122 connected to the periphery of the main body 4121 in a surrounding manner. The first appearance net 412 is fixed to the rear side of the first seat body 411 and covers the front vent hole 4111. The main body 4121 of the first appearance net 412 is embedded in the front vent hole 4111, and the flange 4122 of the first appearance net 412 is fixed to the inner wall of the first seat body 411. The first appearance net 412 forms part of the appearance of the earphone 10. The first appearance net 412 can be a metal mesh to increase the fashion and mechanical reliability of the earphone 10, reduce the risk of damage to components located at the rear side of the first appearance net 412 by external force, for example, to prevent sharp objects from the outside from penetrating, thereby improving the service life of the earphone 10. The first appearance net 412 can be an integrally formed structure, for example, the first appearance net 412 can be formed by stamping a metal mesh. In other embodiments, the first appearance net 412 can also be made of plastic or other materials.

[0414] The first ground 413 includes a fixed part 4131 and a connecting part 4132 connected to one end of the fixed part 4131. The fixed part 4131 can be annular. The first ground 413 is fixed to the side of the first appearance net 412 away from the first seat body 411, and the fixed part 4131 of the first ground 413 can be fixedly connected to the first appearance net 412 in a surrounding manner, for example, fixedly connected to the flange of the first appearance net 412, and the fixed part 4131 of the first ground 413 can also be partially located on the inner side of the main body of the first appearance net 412. At this time, the first ground 413 is arranged around the front vent hole 4111. The first ground 413 is made of conductive material, for example, metal material. The first ground 413 can be an integrally formed structure, for example, the first ground 413 can be formed by stamping a metal plate. The first ground 413 is grounded to prevent the first assembly 41 from being electrically shocked.

[0415] The first mesh cloth 414 is fixed to the side of the first ground 413 away from the first appearance net 412 through the adhesive layer 4162. The first mesh cloth 414 is used to prevent external dust from entering the earphone 10 and adversely affecting the sound effect and sound quality of the earphone 10. The first mesh cloth 414 is a breathable structure. In the embodiments of the present application, the mesh cloth can have a mesh structure, and the mesh cloth can be made of nylon, metal, etc., which is not strictly limited in the embodiments of the present application.

[0416] In the embodiments, air can pass through the first appearance net 412, the first ground 413, the first mesh cloth 414, and the plurality of adhesive layers, so that the front cavity 14a of the earphone 10 is in communication with the outside of the earphone 10 to balance the air pressure between the front cavity 14a of the earphone 10 and the outside of the earphone 10, and the first assembly 41 provides a front vent channel for the loudspeaker 31 of the earphone 10.

[0417] Exemplarily, the second portion 223 of the first flexible circuit board 22 is fixed to the rear side of the first housing 411 by the adhesive layer 4163, and the proximity sensor 51 is arranged corresponding to the light-transmissive region 4112 of the first housing 411. The proximity sensor 51 emits and receives light signals through the light-transmissive region 4112 to detect the wearing of the earphone 10. The fixing plate 415 can be fixed to the side of the second portion 223 of the first flexible circuit board 22 away from the proximity sensor 51 by the adhesive layer 4164, and the fixing plate 415 is used to increase the structural strength of the second portion 223 of the first flexible circuit board 22. The fixing plate 415 can also be fixedly connected with the first housing 411, so that the second portion 223 of the first flexible circuit board 22 is fixedly connected with the first housing 411, thereby improving the assembly stability of the first assembly 41.

[0418] The connecting portion 4132 of the first grounding member 413 can be fixed and electrically connected with the second portion 223 of the first flexible circuit board 22 to realize grounding. For example, the connecting portion 4132 of the first grounding member 413 can be welded with the second portion 223 of the first flexible circuit board 22. In some other embodiments, the first assembly 41 can also not be provided with the first grounding member 413, and the first appearance net 412 is made of conductive material and is electrically connected with the first flexible circuit board 22 to realize grounding.

[0419] Please refer to FIGS. 21-23 , FIG. 21 is FIG. 3 the exploded structural schematic view of the second assembly 42, FIG. 22 is FIG. 21 the structural schematic view of the second housing of the second assembly 42 from another angle, FIG. 23 is FIG. 18 the another partial cross-sectional structural schematic view of the earphone 10 at B-B. In order to facilitate the illustration, FIG. 23 is FIG. 18 the view angle is rotated relative to

[0420] In some embodiments, the second assembly 42 includes a second housing 421, a second mesh 422, a second appearance net 423, a second grounding member 424, a third mesh 425, and a plurality of adhesive layers.

[0421] Exemplarily, the second seat 421 has a first face 4211 and a second face 4212. The first face 4211 is located at one side of the second seat 421. The second face 4212 is connected to the periphery of the first face 4211 and is arranged obliquely opposite to the first face 4211. The second seat 421 is provided with a first hole 4213, a sound pickup channel 4214, and a second hole 4215. The first hole 4213 penetrates through the first face 4211 to the other side of the second seat 421. The number of the first holes 4213 can be one or more. The sound pickup channel 4214 has one end opening on the first face 4211 and the other end opening extending to the surface of the other side of the second seat 421. The sound pickup channel 4214 is arranged separately from the first hole 4213. The sound pickup channel 4214 can be a curved channel. The second hole 4215 penetrates through the first face 4211 or the second face 4212 to the other side of the second seat 421. The second hole 4215 is arranged separately from the sound pickup channel 4214 and the first hole 4213.

[0422] In some embodiments, the second seat 421 is fixed to the inner side of the front shell 12, the second seat 421 is located in the front cavity 14a, the first face 4211 of the second seat 421 faces the second communication hole 123, and the second face 4212 of the second seat 421 faces the inner wall of the front shell 12.

[0423] Exemplarily, the second mesh 422 is fixed to the first face 4211 of the second seat 421 by a glue layer 4261. The second mesh 422 is used to prevent external dust from entering the earphone 10 to adversely affect the sound effect and sound quality of the earphone 10. The second mesh 422 covers the first hole 4213 and the opening of the sound pickup channel 4214 on the first face 4211 of the second seat 421. In some embodiments, the second mesh 422 can cover the first face 4211 of the second seat 421, and the shape of the glue layer 4261 can be adapted to the shape of the first face 4211.

[0424] Exemplarily, the second grounding member 424 includes a fixed part 4241 and a connecting part 4242. One end of the connecting part 4242 is connected to the fixed part 4241. The fixed part 4241 can be annular. The second grounding member 424 is fixed to the side of the second mesh 422 away from the second seat 421. The fixed part 4241 of the second grounding member 424 can be annularly fixed to the second mesh 422, for example, by a glue layer 4262 fixedly connected to the periphery of the second mesh 422. The connecting part 4242 of the second grounding member 424 can extend to the other side of the second seat 421 through the second hole 4215 of the second seat 421. The second grounding member 424 is made of conductive material, for example, metal material. The second grounding member 424 can be an integrally formed structural member, for example, the second grounding member 424 can be formed by punching a metal plate. The second grounding member 424 is grounded and is used to prevent the second assembly 42 from being electrified.

[0425] Exemplarily, the second appearance net 423 includes a middle portion 4231 and a peripheral portion 4232, the peripheral portion 4232 is connected to the periphery of the middle portion 4231 in a surrounding manner. The middle portion 4231 can be convex relative to the peripheral portion 4232 to form a bulging structure, or the middle portion 4231 can be a flat structure, and the second appearance net 423 is a planar net structure. The peripheral portion 4232 of the second appearance net 423 can be fixed to the side of the second grounding member 424 away from the second mesh cloth 422 through the adhesive layer 4263, and the middle portion 4231 of the second appearance net 423 can be convex away from the second seat body 421.

[0426] The second appearance net 423 can be a metal net to increase the fashion sense and mechanical reliability of the earphone 10, reduce the risk of damage to the components located at the back side of the second appearance net 423 by external force, for example, prevent sharp objects from the outside from penetrating, and improve the service life of the earphone 10. The second appearance net 423 can be an integrally formed structure, for example, the second appearance net 423 can be formed by stamping a metal net. In other embodiments, the second appearance net 423 can also be made of plastic or other materials.

[0427] Exemplarily, the second appearance net 423, the second grounding member 424 and the second mesh cloth 422 are located between the second communication hole 123 of the front shell 12 and the second seat body 421, the peripheral portion 4232 of the second appearance net 423 is connected to the inner wall of the front shell 12 through the adhesive layer 4264, and the second appearance net 423 and the second mesh cloth 422 cover the second communication hole 123. When the loudspeaker 31 works, the air in the front cavity 14a is vibrated to form sound, and the sound passes through the first hole 4213 of the second seat body 421, the second mesh cloth 422, the second appearance net 423 and the second communication hole 123 of the front shell 12 in sequence, and is transmitted to the outside of the earphone 10, thereby realizing sound emission. The second assembly 42 forms a sound emission channel of the loudspeaker 31.

[0428] The opening area of the first hole 4213 of the second seat body 421 needs to meet the sound emission requirement of the loudspeaker 31. When the number of the first hole 4213 is multiple, the multiple first holes 4213 are arranged at intervals, the area of a single first hole 4213 is small, and the total area of the multiple first holes 4213 meets the sound emission requirement, and at this time, the structural strength of the second seat body 421 is high.

[0429] For example, the third mesh fabric 425 can be fixed to the second seat body 421 by the adhesive layer 4265, and cover the opening of the sound pickup channel 4214. The third portion 224 of the first flexible circuit board 22 can be fixed to the side of the third mesh fabric 425 away from the second seat body 421 by the adhesive layer 4266. The third portion 224 of the first flexible circuit board 22 is provided with a through hole 2241, and the first microphone 32 fixed to the third portion 224 of the first flexible circuit board 22 can receive sound through the through hole 2241. The third mesh fabric 425 covers the through hole 2241.

[0430] In this embodiment, the sound outside the earphone 10 can enter the first microphone 32 through the second appearance mesh 423, the second mesh fabric 422, the sound pickup channel 4214, the third mesh fabric 425, and the through hole 2241 of the third portion 224 of the first flexible circuit board 22 in sequence. The earphone 10 collects external sound through the first microphone 32 to realize sound pickup.

[0431] The connecting portion 4242 of the second grounding member 424 can be fixed and electrically connected to the third portion 224 of the first flexible circuit board 22 to realize grounding. For example, the connecting portion 4242 of the second grounding member 424 can be welded to the third portion 224 of the first flexible circuit board 22. In some other embodiments, the second assembly 42 can also not be provided with the second grounding member 424, the second appearance mesh 423 is made of conductive material, and the second appearance mesh 423 is electrically connected to the first flexible circuit board 22 to realize grounding.

[0432] Regarding the main shell member 113 of the earphone 10, the third assembly 43 and the fourth assembly 44 of the audio auxiliary assembly 4:

[0433] Please refer to FIG. 1A and FIG. 6 again. In some embodiments, the main shell member 113 of the shell 1 is provided with a first through hole 1135 and a second through hole 1136 arranged at intervals. The first through hole 1135 and the second through hole 1136 are located on the back side of the main shell member 113, that is, on the side of the main shell 11 away from the front shell 12. The first through hole 1135 and the second through hole 1136 are respectively located on the two sides of the spine line 112. The first through hole 1135 and the second through hole 1136 can be located at the intersection position of the ear cover 10a and the ear rod 10b. When the user wears the earphone 10, the first through hole 1135 and the second through hole 1136 are away from the user's ear and exposed.

[0434] In this embodiment, the positions of the first through hole 1135 and the second through hole 1136 are approximately symmetrical, which is beneficial to improve the appearance delicacy of the earphone 10.

[0435] Please refer to FIG. 1A and FIG. 24 again.FIG. 24 is FIG. 1A a partial structure diagram of the earphone 10.

[0436] In some embodiments, the third component 43 of the audio auxiliary component 4 includes a fourth mesh cloth 431 and a glue layer 432. The fourth mesh cloth 431 can be fixed to the inner wall of the main shell 113 through the glue layer 432, and the fourth mesh cloth 431 covers the first through hole 1135. The fourth mesh cloth 431 is used to prevent external dust from entering the earphone 10 through the first through hole 1135. The fourth mesh cloth 431 can also prevent the structure inside the earphone 10 from being directly seen from the outside of the earphone 10, and plays a certain decorative role. In other embodiments, the third component 43 can also not include the glue layer, and the fourth mesh cloth 431 is fixed to the inner wall of the main shell 113 by other means, and the embodiments of the present application do not make strict limitations thereto.

[0437] In some embodiments, the fourth component 44 of the audio auxiliary component 4 includes a third appearance mesh 441 and a glue layer 442. The third appearance mesh 441 can be fixed to the inner wall of the main shell 113 through the glue layer 442, and the third appearance mesh 441 covers the second through hole 1136. The third appearance mesh 441 can include a main body 4411 and a flange 4412, the flange 4412 is connected to the periphery of the main body 4411 in a surrounding manner, the flange 4412 is fixed to the inner wall of the main shell 113, and the main body 4411 is embedded in the second through hole 1136.

[0438] For example, the third appearance mesh 441 is made of conductive material and is grounded. At this time, the third appearance mesh 441 can prevent electric shock. The third appearance mesh 441 can also include an extension piece 4413 connected to the flange 4412, and the extension piece 4413 is used to electrically connect the first flexible circuit board 22 to realize the grounding of the third appearance mesh 441. In this embodiment, the third appearance mesh 441 is a conductive piece, and the extension piece 4413 thereof is fixed and electrically connected to the first flexible circuit board 22 by welding. The welding connection is reliable, simple in process and low in cost.

[0439] The third appearance mesh 441 forms part of the appearance of the earphone 10. The third appearance mesh 441 can be a metal mesh to increase the fashion sense and mechanical reliability of the earphone 10, reduce the risk of damage to components located at the back side of the third appearance mesh 441 by external force, for example, prevent sharp objects from the outside from penetrating, and improve the service life of the earphone 10. The third appearance mesh 441 can be an integrally formed structural member, for example, the third appearance mesh 441 can be formed by stamping a metal mesh.

[0440] In other embodiments, the fourth component 44 can also include a grounding piece, and the fourth component 44 is grounded through the grounding piece to prevent electric shock. At this time, the third appearance mesh 441 can be made of metal material, or can be made of plastic or other materials.

[0441] The fifth component 45 of the audio auxiliary assembly 4 of the earphone 10:

[0442] Please refer to FIGS. 25-28 , FIG. 25 is FIG. 3 the structural schematic diagram of the fifth component 45 of the audio auxiliary assembly 4, FIG. 26 is FIG. 25 the partially exploded structural schematic diagram of the fifth component 45, FIG. 27 is FIG. 25 the structural schematic diagram of the fifth component 45 from another angle, FIG. 28 is FIG. 27 the partially exploded structural schematic diagram of the fifth component 45. FIG. 27 The view angle is relatively FIG. 25 The view angle is reversed.

[0443] In some embodiments, the fifth component 45 of the audio auxiliary assembly 4 includes a bracket 451, a first cover plate 452, a second cover plate 453, a third cover plate 454, a fifth mesh cloth 455, a sixth mesh cloth 456, a seventh mesh cloth 457, and a plurality of adhesive layers.

[0444] For example, the bracket 451 has a front side 451a and a back side 451b arranged oppositely, and has a circumferential side 451c arranged around the front side 451a and the back side 451b. Please refer to FIG. 4 The front side 451a of the bracket 451 is arranged towards the speaker 31, and a back cavity 14b is formed between the bracket 451 and the speaker 31, and the front side 451a of the bracket 451 is arranged towards the back cavity 14b; the back side 451b of the bracket 451 is arranged away from the speaker 31, and is arranged towards the main circuit board 21, i.e. towards the main board cavity 14c; the circumferential side of the bracket 451 is arranged towards the shell 1. The fifth component 45 can be fixedly connected to the inner wall of the main shell piece 113 through the circumferential side 451c of the bracket 451, so as to be fixed in the shell 1.

[0445] In some embodiments, as FIG. 25 and FIG. 26As shown, the support 451 is provided with a bass tube passage 4511, which is formed with two openings on the support 451 to communicate different spaces at different positions of the support 451. When the fifth assembly 45 is installed in the shell 1, one end of the bass tube passage 4511 communicates with the rear cavity 14b, and the other end communicates with the first through hole 1135 of the main shell piece 113, so that the air in the rear cavity 14b of the earphone 10 can be transmitted to the external space of the earphone 10 through the bass tube passage 4511 and the first through hole 1135. For example, the bass tube passage 4511 is formed with a first opening 4511a on the front side 451a of the support 451, and a second opening 4511b on the circumferential side 451c of the support 451, and the second opening 4511b communicates with the first through hole 1135. At this time, the bass tube passage 4511 can communicate the rear cavity 14b with the external space of the earphone 10.

[0446] The region of the support 451 around the second opening 4511b is sealingly connected with the inner wall of the shell 1. For example, the gap between the region of the support 451 around the second opening 4511b and the inner wall of the main shell piece 113 can be sealingly connected by a glue layer to improve the sealing performance of the bass tube passage 4511.

[0447] The bass tube passage 4511 can have various implementation structures. For example, the bass tube passage 4511 can be formed with a strip-shaped groove 4511c on the front side 451a of the support 451, and the first cover plate 452 is fixed on the front side 451a of the support 451 and covers part of the opening of the strip-shaped groove 4511c, and the other part of the opening of the strip-shaped groove 4511c forms the first opening 4511a. At this time, the bass tube passage 4511 is formed by the support 451 and the first cover plate 452. The first cover plate 452 can be positioned on the support 451 by positioning structures (such as positioning columns, protrusions, etc.) on the support 451, and then fixed on the support 451 by ultrasonic welding to ensure the reliability of the sealing of the bass tube.

[0448] In the embodiment, when the loudspeaker 31 of the earphone 10 is working, the air in the bass tube passage 4511 resonates to drive the air in the rear cavity 14b to resonate, thereby affecting the vibration of the diaphragm of the loudspeaker 31 to improve the bass performance of the earphone 10.

[0449] The simplified calculation formula of the resonance frequency of the acoustic system is: Wherein, C ms is the mechanical compliance coefficient of the loudspeaker, S Dis the area of the diaphragm of the loudspeaker, p is the density of air, L is the length of the bass tube channel, R is the equivalent radius of the cross-sectional area of the bass tube channel, and S is the cross-sectional area of the bass tube channel.

[0450] It can be seen that the size of the bass tube channel 4511 of the earphone 10 affects the frequency response result, and the length and / or the cross-sectional area of the bass tube channel 4511 can be adjusted to improve the low-frequency sensitivity based on sound quality / noise reduction considerations. Among them, FIG. 25 The dotted line shows the extension direction of the bass tube channel 4511, the size of the bass tube channel 4511 in the extension direction is the length, the cross section of the bass tube channel 4511 is perpendicular to the extension direction, and the cross-sectional area of the bass tube channel 4511 is the area of the cross section of the bass tube channel 4511.

[0451] In addition, the cross-sectional area of the bass tube channel 4511 is limited and cannot be too large or too small; if the cross-sectional area of the bass tube channel 4511 is too small, the acoustic viscous damping will increase, affecting the resonance effect; if the cross-sectional area of the bass tube channel 4511 is too large, the volume of the earphone 10 will be too large.

[0452] Please refer to FIG. 29A and FIG. 29B , FIG. 29A is FIG. 25 the relationship between the length of the bass tube channel 4511 of the fifth component 45 of the earphone 10 and the frequency response in a possible implementation, FIG. 29B is FIG. 25 the relationship between the cross-sectional area of the bass tube channel 4511 of the fifth component 45 of the earphone 10 and the frequency response in a possible implementation. FIG. 29A and FIG. 29B The abscissa is the frequency, in hertz (Hz), and the ordinate is the sound pressure level, in decibels (dB).

[0453] FIG. 29A The multiple curves of FIG. 11 correspond to the frequency response curves when the length of the bass tube channel 4511 is 9.8 mm, 10.8 mm, 11.8 mm, 12.8 mm, and 13.8 mm, respectively. The arrow in the figure corresponds to the trend of the frequency response of the earphone 10 when the length of the bass tube channel 4511 increases. FIG. 29B The multiple curves of FIG. 12 correspond to the frequency response curves when the cross-sectional area of the bass tube channel 4511 is 1.54 mm 2 , 1.44 mm 2 , 1.34 mm 2 , 1.24 mm 2 , 1.14 mm 2 , 1.04 mm 2 , 0.94 mm 2The frequency response curves are shown in the figure. The arrows in the figure correspond to the changes in the frequency response of the headphone 10 as the cross-sectional area of ​​the bass tube channel 4511 decreases. FIG. 29A and FIG. 29B As shown, when the length of the bass tube channel 4511 increases or the cross-sectional area decreases, the resonant peak frequency near 100Hz will shift forward, the resonant valley depth near 1.5kHz will decrease, and the sensitivity in the 100-1kHz frequency band will decrease.

[0454] In this embodiment of the application, for example, the cross-sectional area of ​​the bass tube channel 4511 can be 0.8 mm. 2 Up to 1.7mm 2 Within a range, for example, it can be within 0.94mm. 2 Up to 1.54mm 2 Within the range, for example, 1.126mm 2 1.20mm 2 1.24mm 2 1.28mm 2 The length of the bass tube channel 4511 can be in the range of 7mm to 16mm, for example, in the range of 9.8mm to 13.8mm, such as 9.8mm, 10.4mm, 11.2mm, etc., to obtain better low frequency sensitivity.

[0455] In this application embodiment, for example, the cross-section of the bass tube channel 4511 can be rectangular, circular or other shapes; the bass tube channel 4511 may include a straight extension portion and / or a curved extension portion to meet the length requirements and spatial arrangement requirements of the bass tube channel 4511. This application embodiment does not strictly limit the specific structural shape of the bass tube channel 4511.

[0456] In some embodiments, the first cover plate 452 can be made of plastic, which makes it lighter and helps reduce the weight of the earphone 10. Furthermore, when the bracket 451 is also made of plastic, the first cover plate 452 and the bracket 451 can be fixed together using ultrasonic welding technology, which satisfies the requirements for fixation and sealing without taking up extra space due to the connection, thus promoting miniaturization. Of course, the first cover plate 452 can also be fixed to the bracket 451 using adhesive materials such as glue or double-sided tape.

[0457] In some other embodiments, the first cover plate 452 may also be made of metal. In this case, the first cover plate 452 and the main body still maintain a sealed connection, for example, they can be fixed together by adhesives such as glue or double-sided tape. Meanwhile, since the fifth component 45 is located between the speaker 31 and the main circuit board 21, when the first cover plate 452 is made of metal, it can also serve as a magnetic shield, isolating magnetic fields to reduce the adverse effects of the induced magnetic field generated by the devices on the main circuit board 21 on the speaker 31, further reducing the risk of current noise. For example, the first cover plate 452 may be made of SPCC material, which is generally cold-rolled carbon steel sheet and strip, where S-steel, P-plate, C-cold-rolled, and C-common.

[0458] In some other embodiments, the first cover plate 452 may also include multiple plates stacked together, at least one of which is made of metal. In this case, the first cover plate 452 can be reused as a magnetic shielding component. Alternatively, at least one of the multiple plates may be made of plastic, in which case the first cover plate 452 is a composite cover plate. For example, the first cover plate 452 may include stacked plastic plates and metal plates, with the plastic plate located near the support 451. The first cover plate 452 can be ultrasonically welded to the support 451 via the plastic plate. Furthermore, the first cover plate 452 can also achieve magnetic shielding via the metal plate, thereby reducing the risk of current noise in the speaker 31.

[0459] In some other embodiments, the bass tube channel 4511 may also have other implementation structures. Correspondingly, the audio auxiliary component 4 may not include the first cover plate 452, or may include other structures.

[0460] In some embodiments, such as FIGS. 25-28 As shown, the bracket 451 also includes a pickup channel 4512 and a pickup cavity 4513. The pickup channel 4512 is separated from the bass tube channel 4511. One end of the pickup channel 4512 connects to the pickup cavity 4513, and the other end has an opening on the bracket 451 to connect the pickup cavity 4513 with the space outside the bracket 451. When the fifth component 45 is installed in the housing 1, the end of the pickup channel 4512 away from the pickup cavity 4513 connects to the second through hole 1136 of the main housing 113, allowing external sound from the earphone 10 to enter the pickup cavity 4513 through the second through hole 1136 and the pickup channel 4512. The pickup cavity 4513 is used to house the second microphone 33; the second microphone 33 of the audio component 3 is installed in the pickup cavity 4513, and the second microphone 33 can collect external sound entering the pickup cavity 4513.

[0461] The sound pickup channel 4512 forms a third opening 4512a on the circumferential side 451c of the support 451, the third opening 4512a is arranged at intervals with the second opening 4511b, and the third opening 4512a communicates with the second through hole 1136. The third opening 4512a and the second opening 4511b are located on different sides of the support 451 to correspond to the positions of the first through hole 1135 and the second through hole 1136 of the main shell 113, thereby matching the appearance of the earphone 10.

[0462] The fifth mesh cloth 455 can be fixed to the circumferential side 451c of the support 451 and cover the third opening 4512a. The fifth mesh cloth 455 allows sound to pass through, which is used to prevent external dust from entering the sound pickup channel 4512 through the third opening 4512a, so that the sound pickup accuracy of the second microphone 33 is higher. The fifth mesh cloth 455 can be fixed to the support 451 by the adhesive layer 4581, which can be a glue, double-sided tape, or other adhesive materials. The fifth mesh cloth 455 can also be fixed to the support 451 by other means, which is not strictly limited in the embodiments of the present application.

[0463] The area of the support 451 around the third opening 4512a is sealingly connected with the inner wall of the shell 1. For example, the area of the support 451 around the third opening 4512a can be sealingly connected with the inner wall of the main shell 113 by an adhesive layer, so as to improve the sealing performance of the sound pickup channel 4512.

[0464] For example, the sound pickup cavity 4513 is formed on the front side 451a of the support 451, and the second cover plate 453 is fixed to the front side 451a of the support 451 and covers the sound pickup cavity 4513. The second cover plate 453 can be fixed to the support 451 by the adhesive layer 4582, which can be a glue, double-sided tape, or other adhesive materials. In other embodiments, the second cover plate 453 can also be fixed to the support 451 by ultrasonic welding or other means.

[0465] The second cover plate 453 sealingly connects the support 451 to close the sound pickup cavity 4513, isolates the rear cavity 14b from the sound pickup cavity 4513, and avoids the second microphone 33 in the sound pickup cavity 4513 from picking up the sound of the loudspeaker 31, thereby causing self-excitation and howling. The isolation degree of the second cover plate 453 is higher than 30 dB to meet the isolation degree requirement of the second microphone 33 and the loudspeaker 31. In some examples, the thickness of the second cover plate 453 can be in the range of 0.15 mm to 0.45 mm, such as 0.23 mm, 0.3 mm, 0.35 mm, etc.

[0466] In some embodiments, the second cover plate 453 can be made of plastic material, so that the second cover plate 453 is light in weight, which is conducive to the weight reduction of the earphone 10. In addition, when the support 451 is also made of plastic material, the second cover plate 453 and the support 451 can be fixed to each other by ultrasonic welding technology, which can meet the requirements of fixation and sealing, and at the same time, the space is not occupied due to the connection, which is conducive to miniaturization. Of course, the second cover plate 453 can also be fixed and connected to the support 451 by using glue such as point glue and double-sided adhesive tape.

[0467] In other embodiments, the second cover plate 453 can also be made of metal material, so that the second cover plate 453 and the main body are still in a sealed connection relationship, for example, the two can be fixed by using glue such as point glue and double-sided adhesive tape. At the same time, since the fifth assembly 45 is located between the loudspeaker 31 and the main circuit board 21, when the second cover plate 453 is made of metal material, the second cover plate 453 can be used as a magnetic shielding member, which can isolate the magnetic field to reduce the adverse effects of the induced magnetic field generated by the devices on the main circuit board 21 on the loudspeaker 31, and further reduce the risk of current noise. For example, the second cover plate 453 can be made of SPCC material, that is, a cold-rolled carbon steel sheet and a steel strip, wherein S-steel (Steel), P-plate (Plate), C-cold (cold), and the fourth C-common (common).

[0468] In other embodiments, the second cover plate 453 can also include a plurality of plate bodies arranged in layers, at least one of the plurality of plate bodies being made of metal material. At this time, the second cover plate 453 can be reused as a magnetic shielding member. Among them, at least one of the plurality of plate bodies can also be made of plastic material, at this time, the second cover plate 453 is a composite cover plate. For example, the second cover plate 453 can include a plastic plate and a metal plate arranged in layers, the plastic plate being arranged on the side close to the support 451, and the second cover plate 453 can be ultrasonically welded with the support 451 through the plastic plate. In addition, the second cover plate 453 can also realize magnetic shielding through the metal plate to reduce the risk of current noise of the loudspeaker 31.

[0469] Among them, the sound pickup channel 4512 can form an opening 4512b on the bottom wall of the sound pickup cavity 4513 to communicate with the sound pickup cavity 4513. The sixth mesh cloth 456 is located in the sound pickup cavity 4513 and is fixed to the bottom wall of the sound pickup cavity 4513 and covers the opening 4512b of the sound pickup channel 4512 on the bottom wall of the sound pickup cavity 4513. Among them, the sixth mesh cloth 456 can be fixed to the bottom wall of the sound pickup cavity 4513 by using a glue layer 4583 or other means, and the glue layer 4583 can be glue such as point glue and double-sided adhesive tape.

[0470] For example, the sound pickup passage 4512 can be provided with a connecting groove 4512c formed on the rear side 451b of the support 451, one end of the connecting groove 4512c being communicated with the sound pickup cavity 4513, and the other end of the connecting groove 4512c being communicated with the third opening 4512a. The third cover plate 454 is fixed to the rear side 451b of the support 451 and covers the connecting groove 4512c. In this case, the sound pickup passage 4512 is provided with a curved portion at each end of the connecting groove 4512c. The sound pickup passage 4512 extends from the sound pickup cavity 4513 to the third opening 4512a, extends from the front side 451a of the support 451 to the rear side 451b of the support 451, extends from the rear side 451b of the support 451 to the circumferential side 451c of the support 451, and forms a curved passage. In other embodiments, the sound pickup passage 4512 can have other implementation structures, which are not strictly limited in the embodiments of the present application.

[0471] The third cover plate 454 can be fixedly connected to the support 451 by means of the adhesive layer 4584, which can be a point adhesive, double-sided adhesive or other adhesive. In other embodiments, the third cover plate 454 can be fixedly connected to the support 451 by ultrasonic welding to ensure the reliability of the sealing of the sound pickup passage 4512. The third cover plate 454 can be made of plastic or metal, or a composite plate structure.

[0472] In some embodiments, as shown in FIG. 25 and FIG. 26 The support 451 can further be provided with a rear discharge passage 4514, which is arranged separately from the bass tube passage 4511 and the sound pickup passage 4512. The rear discharge passage 4514 is provided with two openings on the support 451 to communicate different spaces at different positions of the support 451. When the fifth assembly 45 is installed in the housing 1, one end of the rear discharge passage 4514 is communicated with the rear cavity 14b, and the other end of the rear discharge passage 4514 is communicated with the first through hole 1135 of the main housing 113, so that the air in the rear cavity 14b of the earphone 10 can be transmitted to the external space of the earphone 10 through the rear discharge passage 4514 and the first through hole 1135. For example, the rear discharge passage 4514 is provided with a fourth opening 4514a on the front side 451a of the support 451 and a fifth opening 4514b on the circumferential side 451c of the support 451, and the fifth opening 4514b is communicated with the first through hole 1135. In this case, the rear discharge passage 4514 can communicate the rear cavity 14b with the external space of the earphone 10.

[0473] The fifth opening 4514b is adjacent to the second opening 4511b, that is, the openings of the bass tube channel 4511 and the back leakage channel 4514 at the circumferential side 451c of the support 451 are adjacent, so that in the case where the fifth opening 4514b and the second opening 4511b are both in communication with the first through hole 1135, the opening area of the first through hole 1135 is reduced, so as to avoid forming a large area of holes on the appearance of the shell 1, and to improve the overall visual integrity of the appearance of the earphone 10. In some other embodiments, the fifth opening 4514b and the second opening 4511b can be in communication and merged into one opening, and the embodiments of the present application do not make strict limitations thereto.

[0474] The area of the support 451 around the fifth opening 4514b is sealingly connected with the inner wall of the shell 1. For example, the area of the support 451 around the fifth opening 4514b can be sealingly connected with the inner wall of the main shell piece 113 through a glue layer, so as to improve the sealing performance of the sound pickup channel 4512. The glue layer can surround both the fifth opening 4514b and the second opening 4511b, so that the area of the support 451 around the fifth opening 4514b and the second opening 4511b is sealingly connected with the area of the inner wall of the main shell piece 113 around the first through hole 1135.

[0475] The seventh mesh cloth 457 is fixed to the front side 451a of the support 451 and covers the fourth opening 4514a. The seventh mesh cloth 457 can be fixed to the support 451 through a glue layer 4585, or can be fixed to the support 451 through other means.

[0476] For example, the fifth opening 4514b and the third opening 4512a are a certain distance apart, for example, the distance between the two on the circumferential side 451c of the support 451 is greater than or equal to 10 mm, so as to meet the isolation requirement between the sound pickup channel 4512 and the back leakage channel 4514, for example, the isolation can be greater than or equal to 30 dB, so as to improve the sound pickup accuracy of the second microphone 33. The first through hole 1135 of the main shell piece 113 is correspondingly arranged with the fifth opening 4514b, and the second through hole 1136 is correspondingly arranged with the third opening 4512a. The distance between the first through hole 1135 and the second through hole 1136 also needs to meet certain requirements, for example, the distance on the outer surface of the main shell piece 113 is greater than or equal to 10 mm.

[0477] In the embodiment, the bass tube passage 4511, the pickup passage 4512, and the back leakage passage 4514 are integrated into the support 451, the fifth assembly 45 has high integration and high utilization of the internal space of the earphone 10, and is conducive to the miniaturization of the earphone 10. The fifth assembly 45 adopts the design scheme of the integrated support, can also reduce the assembly difficulty, improve the production yield, bring the cost advantage, and further improve the competitiveness of the product. In addition, part or all of the cover plates in the fifth assembly 45 can be used as magnetic shielding members, so that the fifth assembly 45 can reduce the risk of current noise of the loudspeaker 31 and improve the sound quality of the earphone 10.

[0478] In some embodiments, the support 451 can be an integrally formed structural member. At this time, the support 451 has high structural strength, and the overall structural stability of the fifth assembly 45 is better. In other embodiments, the support 451 can also be formed into an integrated structure by a plurality of structural assemblies to meet the modular assembly requirements of the fifth assembly 45.

[0479] In some embodiments, the support 451 can be made of plastic material to achieve light weight. In other embodiments, the support 451 itself can be made of a magnetic conductive material (such as metal) or at least partially covered with a magnetic shielding sheet to achieve magnetic shielding and reduce the risk of current noise of the loudspeaker 31.

[0480] In other embodiments, the back leakage passage 4514 can also be implemented by other structural members, which are not strictly limited by the application.

[0481] Regarding the installation of the partition assembly 8 of the earphone 10:

[0482] In some embodiments, as shown in FIG. 4 , the partition assembly 8 is located at the top space 111a of the main shell 11 and is fixedly connected to the main shell 11; the magnetic attraction member 81 is located at the bottom side of the support 451 of the fifth assembly 45, and the volume and position of the magnetic attraction member 81 can meet the requirement of the in-box magnetic attraction force of the earphone 10. In the assembly process of the earphone 10, the third assembly 43 and the fourth assembly 44 are first installed into the main shell 113, then the fifth assembly 45 with the second microphone 33 is installed into the main shell 113, then the magnetic attraction member 81 is installed, and finally the fixing and sealing between the partition assembly 8 and the main shell 113 are realized by gluing.

[0483] The partition assembly 8 can include a magnetic shielding member to reduce the risk of current noise of the loudspeaker 31. As described above, the magnetic shielding member can be implemented by the support 451, the first cover plate 452, the second cover plate 453, and / or the third cover plate 454 of the fifth assembly 45. In addition, the magnetic attraction member 81 can be a soft magnet (such as a metal block), at this time, the magnetic attraction member 81 can also be used as a magnetic shielding member.

[0484] Exemplarily, as shown in FIG. 6 and FIG. 24 , the inner side of the main shell 113 is provided with at least two glue storage ribs, for example, including a first glue storage rib 11310 and a second glue storage rib 11320. The first glue storage rib 11310 is arranged near and half-encircles the first through hole 1135, and the second glue storage rib 11320 is arranged near and half-encircles the second through hole 1136. After the third assembly 43 is assembled to the main shell 113, the first glue storage rib 11310 half-encircles the third assembly 43. After the fourth assembly 44 is assembled to the main shell 113, the second glue storage rib 11320 half-encircles the fourth assembly 44.

[0485] Please refer to FIG. 26 , FIG. 30A and FIG. 30B , FIG. 30A is a partial internal structure diagram of the earphone 10 shown in FIG. 1A , FIG. 30B is a cross-sectional structure diagram of the partial structure along F-F shown in FIG. 30A . Among them, FIG. 30A the viewing angle is reversed relative to FIG. 1A the viewing angle.

[0486] In some embodiments, a part of the first flexible circuit board 22 extends into the sound pickup cavity 4513 from the front side 451a of the support 451, and the second microphone 33 is fixed and electrically connected to the first flexible circuit board 22. As shown in FIG. 16 , the second microphone 33 is fixed to the first part 222 of the first flexible circuit board 22. In FIG. 30A , the first flexible circuit board 22 can be wrapped from the back side 451b of the support 451 to the front side 451a of the support 451, the first part 222 of the first flexible circuit board 22 can be located in the sound pickup cavity 4513, and the second microphone 33 is located in the sound pickup cavity 4513 to collect sound entering the sound pickup cavity 4513. Among them, as shown in FIG. 30B , the first part 222 of the first flexible circuit board 22 can be fixed to the side of the sixth mesh cloth 456 away from the sound pickup channel 4512 through the adhesive layer 4586. Among them, the first flexible circuit board 22 can also have a part of the structure fixed to the front side 451a of the support 451, so that the relative position of the first flexible circuit board 22 and the support 451 is stable and reliable.

[0487] Exemplarily, the sound pickup direction of the second microphone 33 can be arranged away from the loudspeaker 31. As shown in FIG. 30B , the first part 222 of the first flexible circuit board 22 is provided with a through hole, and the sound pickup hole of the second microphone 33 communicates with the sound pickup channel 4512 through the through hole, so that sound can enter the second microphone 33 through the sound pickup channel 4512, the through hole of the first part 222, and the sound pickup hole of the second microphone 33, and the second microphone 33 realizes sound pickup. AsFIG. 30A and FIG. 30B As shown, the pickup direction of the second microphone 33 is away from the second cover plate 453, that is, away from the rear cavity 14b of the earphone 10. (See also...) FIG. 4 Since the rear cavity 14b of the earphone 10 is located between the speaker 31 and the fifth component 45, the pickup direction of the second microphone 33 is opposite to that of the speaker 31. At this time, the isolation effect between the second microphone 33 and the speaker 31 is better, which is beneficial to improving the pickup signal-to-noise ratio of the second microphone 33.

[0488] For example, during the assembly of the fifth component 45 into the main housing 113, adhesive can be applied first at the first adhesive retaining rib 11310 and the second adhesive retaining rib 11320 (e.g., FIG. 24 (As shown by the bold dashed line in the middle) Then, the fifth component 45 is installed into the main housing 113. Next, adhesive is applied again around the positions surrounding the third component 43 and the fourth component 44, so that the two adhesives formed by the two applications surround the third component 43 and the fourth component 44 respectively, and seal the bracket 451 of the fifth component 45 to the inner wall of the main housing 113, ensuring that the channel provided by the fifth component 45 is reliably sealed. At this time, one of the two adhesives can seal the area of ​​the bracket 451 around the second opening 4511b and the fifth opening 4514b to the inner wall of the main housing 113, and the other adhesive can seal the area of ​​the bracket 451 around the third opening 4512a to the inner wall of the main housing 113.

[0489] After installing the fifth component 45 into the main housing 113, the magnetic chuck 81 is inserted into the main housing 113, positioning the magnetic chuck 81 with the main housing 113 and the bracket 451. Finally, adhesive is applied to seal the mating positions of the bracket 451 and the main housing 113, the bracket 451 and the magnetic chuck 81, the magnetic chuck 81 and the main housing 113, and the second cover plate 453 and the main housing 113 (e.g., ...). FIG. 30A (As shown by the bold dashed line in the middle), thus realizing the assembly of the partition component 8 and the main housing 113. At this time, the sealing connection between the partition component 8 and the main housing 11 is reliable, and the partition component 8 can effectively separate the rear cavity 14b and the main board cavity 14c, so that the main board cavity 14c is reliably sealed.

[0490] The inner wall of the main housing 113 may be provided with multiple limiting structures or guiding structures, so that when the fifth component 45 is installed into the main housing 113, it can be directly installed to the accurate position under the guidance of the limiting structures or guiding structures, thereby reducing the assembly difficulty of the earphone 10 and improving the assembly accuracy and product yield of the earphone 10.

[0491] Regarding the speaker 31 of the headphone 10:

[0492] Please refer to the following:FIG. 31A to FIG. 31C , FIG. 31A yes FIG. 3 The diagram shows the structure of the loudspeaker 31. FIG. 31B yes FIG. 31A The diagram shows a cross-sectional view of the loudspeaker 31 at EE. FIG. 31C yes FIG. 31A The exploded view of the loudspeaker 31 is shown.

[0493] In some embodiments, the loudspeaker 31 includes a frame 313, a magnetic circuit assembly 314, a diaphragm 315, a connecting ring 316, and a voice coil 317.

[0494] The basin frame 313 can be roughly annular. The basin frame 313 can be provided with a first through hole 3131 and a second through hole 3132, which are spaced apart from each other. For example, the first through hole 3131 and the second through hole 3132 can be formed on both sides of the basin frame 313 respectively.

[0495] The magnetic circuit assembly 314 is fixedly connected to the yoke 313. The magnetic circuit assembly 314 covers the inner space of the yoke 313, and the magnetic circuit assembly 314 can be partially located in the inner space of the yoke 313. The middle part of the magnetic circuit assembly 314 is provided with a third through hole 3141, and the third through hole 3141 communicates the spaces on both sides of the magnetic circuit assembly 314. For example, the magnetic circuit assembly 314 can include a first magnetic conducting sheet 3142, a first magnet 3143, a second magnetic conducting sheet 3144, a second magnet 3145, and a third magnetic conducting sheet 3146. The first magnetic conducting sheet 3142 can be substantially annular, and the first magnetic conducting sheet 3142 is fixed to the yoke 313 and at least partially exposed to the inner space of the yoke 313. For example, the first magnetic conducting sheet 3142 can be embedded in the yoke 313, and the first magnetic conducting sheet 3142 and the yoke 313 can be integrally formed by, for example, in-mold injection. The first magnet 3143 can be substantially annular, and the first magnet 3143 is fixed to one side of the first magnetic conducting sheet 3142. The second magnetic conducting sheet 3144 is fixed to the side of the first magnet 3143 away from the first magnetic conducting sheet 3142, and the middle part of the second magnetic conducting sheet 3144 is provided with a first hole 3147. The second magnet 3145 is fixed to the side of the second magnetic conducting sheet 3144 facing the first magnet 3143, and the second magnet 3145 is located on the inner side of the first magnet 3143 and forms a first gap with the first magnet 3143. The second magnet 3145 is also provided with a second hole 3148, and the second hole 3148 communicates the first hole 3147. The third magnetic conducting sheet 3146 is fixed to the side of the second magnet 3145 away from the second magnetic conducting sheet 3144, and the third magnetic conducting sheet 3146 is located on the inner side of the first magnetic conducting sheet 3142 and forms a second gap with the first magnetic conducting sheet 3142. The second gap communicates the first gap. The third magnetic conducting sheet 3146 is provided with a third hole 3149, and the third hole 3149 communicates the second hole 3148. The third hole 3149, the second hole 3148, and the first hole 3147 jointly form the third through hole 3141. The magnetic circuit assembly 314 can be fixedly connected to the yoke 313 by the adhesive 319. The number of the adhesive 319 can be one or more.

[0496] The diaphragm 315 is fixedly connected to the yoke 313. The diaphragm 315 covers the inner space of the yoke 313. For example, the periphery of the diaphragm 315 can be fixedly connected to the yoke 313 by the connecting ring 316. The voice coil 317 is located in the inner space of the yoke 313, one end of the voice coil 317 is fixedly connected to the diaphragm 315, and the other end of the voice coil 317 is located in the second gap and the first gap.

[0497] The loudspeaker 31 can further include a mesh assembly 318. The mesh assembly 318 includes a first mesh 3181, a first adhesive layer 3182, a second mesh 3183, a second adhesive layer 3184, a third mesh 3185, and a third adhesive layer 3186. The first mesh 3181 is fixed to the back of the frame 313 opposite the diaphragm 315 by the first adhesive layer 3182, and covers the first through hole 3131. The second mesh 3183 is fixed to the back of the frame 313 opposite the diaphragm 315 by the second adhesive layer 3184, and covers the second through hole 3132. The third mesh 3185 is fixed to the back of the second magnetic conductive sheet 3144 opposite the diaphragm 315 by the third adhesive layer 3186, and covers the third through hole 3141. In other embodiments, the first mesh 3181, the second mesh 3183, and / or the third mesh 3185 can be fixed in other ways, which are not strictly limited in the embodiments of the present application.

[0498] In the embodiment, the side of the diaphragm 315 opposite the magnetic circuit assembly 314 forms a first space, the second space is formed between the diaphragm 315 and the magnetic circuit assembly 314, and the side of the magnetic circuit assembly 314 opposite the diaphragm 315 forms a third space. When the loudspeaker 31 is installed in the earphone 10, the first space corresponds to the front cavity 14a, and the third space corresponds to the rear cavity 14b. The first through hole 3131, the second through hole 3132, and the third through hole 3141 all communicate the second space and the third space, and form the rear leak hole of the loudspeaker. In the embodiments of the present application, the third through hole 3141 is added to the loudspeaker 31, so that the opening area of the rear leak hole of the loudspeaker 31 is greatly increased, which is conducive to reducing the overall acoustic impedance of the earphone 10, so that the resonance effect of the loudspeaker 31 and the bass tube channel 4511 is better, and the low frequency performance of the earphone 10 is better.

[0499] In the embodiment, the side of the diaphragm 315 opposite the magnetic circuit assembly 314 forms a first space, the second space is formed between the diaphragm 315 and the magnetic circuit assembly 314, and the side of the magnetic circuit assembly 314 opposite the diaphragm 315 forms a third space. When the loudspeaker 31 is installed in the earphone 10, the first space corresponds to the front cavity 14a, and the third space corresponds to the rear cavity 14b. The first through hole 3131, the second through hole 3132, and the third through hole 3141 all communicate the second space and the third space, and form the rear leak hole of the loudspeaker. In the embodiments of the present application, the third through hole 3141 is added to the loudspeaker 31, so that the opening area of the rear leak hole of the loudspeaker 31 is greatly increased, which is conducive to reducing the overall acoustic impedance of the earphone 10, so that the resonance effect of the loudspeaker 31 and the bass tube channel 4511 is better, and the low frequency performance of the earphone 10 is better. FIG. 24 FIG. 23 In the embodiment, the side of the diaphragm 315 opposite the magnetic circuit assembly 314 forms a first space, the second space is formed between the diaphragm 315 and the magnetic circuit assembly 314, and the side of the magnetic circuit assembly 314 opposite the diaphragm 315 forms a third space. When the loudspeaker 31 is installed in the earphone 10, the first space corresponds to the front cavity 14a, and the third space corresponds to the rear cavity 14b. The first through hole 3131, the second through hole 3132, and the third through hole 3141 all communicate the second space and the third space, and form the rear leak hole of the loudspeaker. In the embodiments of the present application, the third through hole 3141 is added to the loudspeaker 31, so that the opening area of the rear leak hole of the loudspeaker 31 is greatly increased, which is conducive to reducing the overall acoustic impedance of the earphone 10, so that the resonance effect of the loudspeaker 31 and the bass tube channel 4511 is better, and the low frequency performance of the earphone 10 is better.​

[0500] When the third through hole 3141 is not provided, only the first through hole 3131 and the second through hole 3132 are provided as the back vent hole, due to the structure size limitation of the yoke 313, the opening area of the first through hole 3131 and the second through hole 3132 is limited, and it is difficult to expand the opening area. The overall acoustic impedance of the earphone 10 is high. By providing the third through hole 3141 in the magnetic circuit assembly 314, the opening size of the third through hole 3141 can be controlled to effectively increase the opening area of the back vent hole of the loudspeaker 31 while considering the magnetic field strength of the magnetic circuit assembly 314, thereby reducing the overall acoustic impedance of the earphone 10.

[0501] Please refer to FIG. 31D , FIG. 31D is FIG. 1A the schematic diagram of the overall frequency response curve of the earphone 10 in some possible implementations. Among them, FIG. 31D the abscissa is the frequency, unit: hertz (Hz), the ordinate is the sound pressure level, unit: decibel (dB). FIG. 31D The solid line of the figure corresponds to the frequency response curve of the loudspeaker 31 of the earphone 10 provided with the first through hole 3131, the second through hole 3132 and the third through hole 3141, and the dotted line corresponds to the frequency response curve of the loudspeaker 31 of the earphone 10 provided with the first through hole 3131 and the second through hole 3132, without the third through hole 3141. In some possible implementations, the overall acoustic impedance of the loudspeaker 31 without the third through hole 3141 is 2.5*10 7 pa*s / mm 3 , the overall acoustic impedance of the loudspeaker 31 with the third through hole 3141, which is a circular hole with an opening diameter of 2mm, is 9*10 6 pa*s / mm 3 The overall acoustic impedance of the loudspeaker 31 is significantly reduced, and the overall frequency response curve shows the characteristics of the resonance peak in the frequency band of 20Hz to 200Hz, thereby enhancing the low-frequency resonance near 100Hz, so that the low-frequency performance of the earphone 10 is better.

[0502] For example, the overall acoustic impedance of the earphone 10 is less than or equal to 10 7 pa*s / mm 3 to ensure that the loudspeaker 31 and the bass tube channel 4511 have better resonance effect.

[0503] For example, the opening area of the third through hole 3141 is less than or equal to 3.14mm 2This is to ensure sufficient magnetic field strength in the magnetic circuit assembly 314 of the speaker 31 while reducing the overall acoustic impedance. The third through-hole 3141 can be a round hole, a square hole, or a hole of other shapes. When the third through-hole 3141 is a round hole, its diameter is less than or equal to 2 mm.

[0504] It is understood that the loudspeaker 31 may also adopt other structures different from those described above. For example, the structure of the frame 313 may be different, the structure of the magnetic circuit assembly 314 may be different, the connection structure between the magnetic circuit assembly 314 and the frame 313 may be different, and the connection structure between the frame 313 and the diaphragm 315 may be different. The embodiments of this application do not strictly limit the specific structure of the loudspeaker 31.

[0505] In some other embodiments, the speaker 31's frame 313 may have only one through hole, for example, without the first through hole 3131 or the second through hole 3132. Alternatively, the frame 313 may have three or more through holes, and this application does not strictly limit this. In some other embodiments, when the opening area of ​​the first through hole 3131 and the second through hole 3132 is large enough to make the rear vent area of ​​the speaker 31 sufficient, the speaker 31 may not have a third through hole 3141.

[0506] Regarding antenna 6 of headphone 10:

[0507] Please refer to the following: FIG. 32A and FIG. 32B , FIG. 32A yes FIG. 3 The diagram shows the structure of the antenna 6 of the earphone 10. FIG. 32B yes FIG. 32A The diagram shows the structure of antenna 6 at another angle.

[0508] In some embodiments, the antenna 6 includes an antenna support 61, a first metal part 62, and a second metal part 63.

[0509] The antenna support 61 includes a plate 611 and legs 612 and protrusions 613 fixed to the plate 611. The legs 612 and protrusions 613 are located on the same side of the plate 611 and are spaced apart from each other. There can be multiple legs 612, which are spaced apart and can be fixed around the plate 611. There can be one or more protrusions 613, which can be fixed to one end of the plate 611. The antenna support 61 can be a one-piece molded structure.

[0510] The first metal piece 62 is a patterned metal layer, which can be formed on the antenna support 61 by a laser direct structuring (LDS) process to be fixed on the antenna support 61. In this case, the size and shape of the first metal piece 62 are less restricted, and the pattern of the first metal piece 62 is easy to adjust. The first metal piece 62 includes a main body portion 621, a connecting portion 622, and an extending portion 623. The main body portion 621 is fixed on the top side of the plate body 611 of the antenna support 61. The connecting portion 622 is connected to the main body portion 621 and extends to at least one of the plurality of legs 612 of the antenna support 61. For example, the number of the connecting portions 622 can be multiple, and the multiple connecting portions 622 are connected to different positions of the main body portion 621 and fixed on different legs 612 of the antenna support 61. Alternatively, the number of the connecting portions 622 is one, and the connecting portion 622 is fixed on one of the plurality of legs 612. The number of the connecting portions 622 can be the same as or different from the number of the legs 612 of the antenna support 61, which is not strictly limited in the embodiments of the present application. The connecting portion 622 can partially or entirely wrap the corresponding leg 612 of the antenna support 61. The extending portion 623 is connected to the main body portion 621 and extends to the protrusion 613 of the antenna support 61. The extending portion 623 can partially or entirely wrap the protrusion 613 of the antenna support 61.

[0511] The second metal piece 63 is fixed and electrically connected to the first metal piece 62. For example, one end of the second metal piece 63 is fixed and electrically connected to one end of the first metal piece 62, and the other end of the second metal piece 63 extends away from the first metal piece 62. For example, the second metal piece 63 can be provided with a through hole 631, and the second metal piece 63 is positioned through the through hole 631 and the protrusion 613 of the antenna support 61. The second metal piece 63 can be fixed and electrically connected to the extending portion 623 of the first metal piece 62 by soldering.

[0512] In the embodiments, the first metal piece 62 and the second metal piece 63 can jointly form the radiating portion of the antenna 6. The size of the radiating portion of the antenna 6 is large, which increases the radiating area of the antenna 6 and improves the transmitting and receiving performance of the antenna 6, so that the wireless communication performance of the earphone 10 is better. For example, the antenna support 61, the first metal piece 62, and the second metal piece 63 can all be substantially strip-shaped, and the antenna 6 is substantially strip-shaped as a whole, so as to better match the shape of the shell 1 of the earphone 10 and reduce the installation difficulty in the case of a large radiating area.

[0513] In some examples, the antenna 6 can include an extended circuit board connecting the antenna support 61 and the first metal piece 62, and the extended circuit board includes the second metal piece 63, wherein the second metal piece 63 can be formed by a conductive layer of the extended circuit board. The extended circuit board can be a flexible circuit board. In the embodiment, the second metal piece 63 is formed by the extended circuit board, the extended circuit board has a thin thickness and can be deformed by bending, has a low requirement on the installation space, and can be easily arranged in a narrow space, such as the internal space of the ear stem 10b, so as to achieve the purpose of expanding the radiation area of the antenna 6 in the narrow space.

[0514] In other examples, the second metal piece 63 can also be a metal sheet, such as a metal plate piece or a metal support 451. Similarly, the antenna 6 can also achieve the purpose of expanding the radiation area of the antenna 6 in the narrow space by the thin thickness and the easy bending performance of the second metal piece 63.

[0515] In other embodiments, the antenna support 61 can also not be provided with the protrusion 613, the extension portion 623 of the first metal piece 62 is adaptively changed, and the second metal piece 63 can adopt other structures to be fixed and electrically connected with the first metal piece 62, which is not strictly limited in the embodiment.

[0516] In other embodiments, the antenna 6 can also not be provided with the second metal piece 63, the antenna 6 includes the antenna support 61 and the first metal piece 62, and the first metal piece 62 forms the radiation part of the antenna 6.

[0517] In other embodiments, the antenna 6 can also have other implementation structures, for example, the antenna 6 can include a circuit board, and a conductive layer in the circuit board forms the radiation part of the antenna 6. The circuit board can be a flexible circuit board, or a soft and hard combined board, or a hard board, which is not strictly limited in the embodiment.

[0518] Please refer to FIG. 33A and FIG. 33B , FIG. 33A is FIG. 3 the structure schematic view of the antenna 6 and the main circuit board 21 assembled, FIG. 33B is FIG. 33A the structure schematic view of the structure from another angle.

[0519] In some embodiments, the antenna 6 is fixedly connected with the main circuit board 21. The antenna 6 is located on one side of the main circuit board 21, the plate body 611 of the antenna support 61 is arranged in a spaced manner with the main circuit board 21, and the plurality of legs 612 of the antenna support 61 are fixed to the main circuit board 21, so that the antenna 6 is fixed relative to the main circuit board 21. The plate body 611 of the antenna support 61 and the main circuit board 21 form a space, and devices can be arranged in the main circuit board 21 through the space.

[0520] The main body part 621 of the first metal piece 62 is located on the side of the plate body 611 of the antenna support 61 which is away from the main circuit board 21, and the connecting part 622 of the first metal piece 62 is soldered to the main circuit board 21. At this time, the connecting part 622 of the first metal piece 62 is fixed and electrically connected to the main circuit board 21 by soldering, so that the main circuit board 21 can realize the feeding of the antenna 6. The main circuit board 21 is provided with a radio frequency circuit, the radio frequency circuit is electrically connected to the antenna 6, and the radio frequency circuit is also electrically connected to the processor.

[0521] In this embodiment, the first metal piece 62 forms the radiation part or part of the radiation part of the antenna 6, the first metal piece 62 and the leg 612 of the antenna support 61 are multiplexed with the main circuit board 21, the leg 612 of the antenna support 61 is used not only for structural connection but also as a feeding point of the antenna 6, thereby eliminating the traditional spring structure used as a feeding point and saving a large amount of board space, which is conducive to arranging the antenna 6 in a small space. In addition, since the signal transmission between the antenna 6 and the main circuit board 21 does not need to pass through an electrical connector, it is also conducive to reducing the signal noise of the antenna 6 and improving the wireless communication quality of the earphone 10.

[0522] The leg 612 of the antenna support 61 and the connecting part 622 of the first metal piece 62 can be multiple, so as to realize an antenna scheme with multiple feeding points, thereby realizing a MIMO (Multiple-Input Multiple-Out-put) antenna scheme in some embodiments.

[0523] In other embodiments, the electrical connection relationship between the first metal piece 62 and the main circuit board 21 can also be realized by other structures, that is, the main circuit board 21 can also use other feeding structures to feed the antenna 6, for example, a conductive spring can be attached to the main circuit board 21, and the first metal piece 62 and / or the second metal piece 63 are pressed by the conductive spring; or the first metal piece 62 and / or the second metal piece 63 press the main circuit board 21 through the conductive spring; or the second metal piece 63 is soldered to the main circuit board 21, and the present embodiment does not strictly limit the feeding structure of the antenna 6.

[0524] Regarding the touch sensor 54 of the earphone 10:

[0525] Please refer to FIG. 34A and FIG. 34B , FIG. 34A is FIG. 3 the assembly structure diagram of the main circuit board 21, the antenna 6 and the detection circuit board 56, FIG. 34B is FIG. 34A the structure diagram of the structure shown in another angle.

[0526] In some embodiments, the detection circuit board 56 includes a first circuit board 561, a second circuit board 562, and a third circuit board 563, the first circuit board 561 and the third circuit board 563 are electrically connected to the second circuit board 562. The first circuit board 561, the second circuit board 562, and the third circuit board 563 can be integrally formed structural members, each being a part of the detection circuit board 56. The detection circuit board 56 can be a flexible circuit board, so that the first circuit board 561, the second circuit board 562, and the third circuit board 563 can be deformed, such as bending, to meet the assembly and connection requirements. The detection circuit board 56 and the antenna 6 are independent structural members.

[0527] The first circuit board 561 can have the touch sensor 54, which can be electrically connected to other structures through the second circuit board 562; the third circuit board 563 can form the wearing detection sensor 52, which can be electrically connected to other structures through the second circuit board 562.

[0528] For example, the first circuit board 561 and the antenna 6 are independent structural members. The first circuit board 561 can be disposed on the side of the antenna 6 away from the main circuit board 21, and stacked with the antenna 6, and there is an overlapping area between the first circuit board 561 and the antenna 6. For example, the first circuit board 561 and the first metal member 62 and / or the second metal member 63 (see FIG. 32A ) of the antenna 6 are stacked, and there is an overlapping area. At this time, the antenna 6 is located between the first circuit board 561 and the main circuit board 21. One end of the third circuit board 563 can be connected to the first circuit board 561 or the second circuit board 562, and the other end of the third circuit board 563 is bent to the side of the main circuit board 21 away from the first circuit board 561. At this time, the third circuit board 563 is also located on the side of the antenna 6 away from the first circuit board 561.

[0529] In other embodiments, the third circuit board 563 and the first circuit board 561 can also be independent circuit boards, that is, different circuit boards, and the wearing detection sensor 52 on the third circuit board 563 can also be electrically connected to the main circuit board 21 by other means, which is not strictly limited by the embodiments of the present application.

[0530] Please refer to FIG. 35 , FIG. 35 is FIG. 4 a partial structural schematic diagram of the earphone 10.

[0531] In some embodiments, the main circuit board 21, the antenna 6 and the detection circuit board 56 are all located in the shell 1. The first circuit board 561 of the detection circuit board 56 is located between the antenna 6 and the shell 1. The side of the first circuit board 561 facing the shell 1 is provided with a touch sensor 54 for detecting a touch action applied to the shell 1.

[0532] In this embodiment, the touch sensor 54 is a capacitive sensor (cap sensor). The first circuit board 561 is arranged to abut against the inner wall of the main shell 11 of the shell 1 and is located close to the spine line 112 of the main shell 11, so that the first circuit board 561 faces away from the user's ear and is exposed to the user's ear when the earphone is in the wearing state. When the user approaches or touches the back of the main shell 11, the touch sensor 54 can detect the touch action of the user to realize human-computer interaction.

[0533] In this embodiment, the touch sensor 54 is a capacitive sensor (cap sensor). The first circuit board 561 is arranged to abut against the inner wall of the main shell 11 of the shell 1 and is located close to the spine line 112 of the main shell 11, so that the first circuit board 561 faces away from the user's ear and is exposed to the user's ear when the earphone is in the wearing state. When the user approaches or touches the back of the main shell 11, the touch sensor 54 can detect the touch action of the user to realize human-computer interaction.

[0534] In this embodiment, the touch sensor 54 is a capacitive sensor (cap sensor). The first circuit board 561 is arranged to abut against the inner wall of the main shell 11 of the shell 1 and is located close to the spine line 112 of the main shell 11, so that the first circuit board 561 faces away from the user's ear and is exposed to the user's ear when the earphone is in the wearing state. When the user approaches or touches the back of the main shell 11, the touch sensor 54 can detect the touch action of the user to realize human-computer interaction.

[0535] In this embodiment, the touch sensor 54 is a capacitive sensor (cap sensor). The first circuit board 561 is arranged to abut against the inner wall of the main shell 11 of the shell 1 and is located close to the spine line 112 of the main shell 11, so that the first circuit board 561 faces away from the user's ear and is exposed to the user's ear when the earphone is in the wearing state. When the user approaches or touches the back of the main shell 11, the touch sensor 54 can detect the touch action of the user to realize human-computer interaction.

[0536] Please refer to FIG. 34A to FIG. 35The side of the touch sensor 54 for detecting the user touch operation is a touch side, and the other side of the touch sensor 54 is a non-touch side. In this embodiment, the side of the touch sensor 54 facing the main shell 11 is the touch side, and the side of the touch sensor 54 facing away from the main shell 11 is the non-touch side. Since the antenna 6 is located at the non-touch side of the touch sensor 54, the antenna 6 is a conductor structure, and thus the antenna 6 can be used as the reference ground of the touch sensor 54 to shield the clutter signals (e.g., signals generated by the devices on the main circuit board 21) from the non-touch side of the touch sensor 54, thereby reducing or eliminating the signal interference of the clutter signals on the touch sensor 54 and improving the accuracy of the touch detection of the touch sensor 54. In addition, since the antenna 6 itself radiates high-frequency current and the touch sensor 54 senses low-frequency current, the antenna 6 has no effect on the touch detection of the touch sensor 54.

[0537] For example, the projection of the antenna 6 on the first circuit board 561 covers the touch sensor 54 to better provide the reference ground for the touch sensor 54 and improve the detection accuracy of the touch sensor 54. It can be understood that the case that the projection of the antenna 6 on the first circuit board 561 covers the touch sensor 54 includes the cases of “complete coverage” and “substantial coverage”, and the case that the projection of the antenna 6 covers more than 80% of the touch sensor 54 is considered to meet the case of “substantial coverage”. Specifically, the coverage of the antenna 6 on the touch sensor 54 mainly refers to the coverage of the radiation part of the antenna 6 on the touch sensor 54. Among them, at the positions where the touch sensor 54 can be interfered by relatively concentrated interference sources, the coverage of the radiation part of the antenna 6 on the touch sensor 54 is as complete as possible.

[0538] In this embodiment, the antenna 6 is used for transmitting and receiving radio frequency signals, and the antenna 6 is also used for providing the reference ground for the touch sensor 54. At this time, based on the relative position relationship among the main shell 11, the touch sensor 54, and the antenna 6, the antenna 6 in this embodiment of the application is compatible with the two functions through the same structure, which is used for realizing the wireless communication of the earphone 10 and also serves as the reference ground of the touch sensor 54 to shield the clutter signals and improve the accuracy of the touch detection.

[0539] In this embodiment, the coexistence of the touch sensor 54 and the antenna 6 of the earphone 10 in the same space region minimizes the occupied space and is conducive to the miniaturization of the earphone 10. In addition, the radiation region of the antenna 6 and the touch operation region of the touch sensor 54 can be realized through the same region of the main shell 11, and in the case that the volume of the main shell 11 is constant, the radiation region of the antenna 6 and the touch operation region of the touch sensor 54 can both have a relatively large area, and the earphone 10 can obtain better antenna 6 transmission and reception performance and can detect more diversified touch operations.

[0540] The touch sensor 54 includes at least three touch blocks 541 arranged in a strip-shaped touch area and spaced apart from each other. The extension direction of the strip-shaped touch area corresponds to the extension direction of the antenna 6. In this case, the touch sensor 54 is a slide bar sensing structure, and when the capacitances of the at least three touch blocks 541 change in sequence, it can be determined that the user applies a sliding action. The touch sensor 54 can also detect the single click, double click, long press and other actions of the user.

[0541] The at least three touch blocks 541 can avoid the misjudgment of the sliding action caused by the user touching two touch blocks 541 at the same time. For example, the distance between the adjacent two touch blocks 541 can be in the range of 0.5mm to 2mm. Conversely, when the distance between the adjacent two touch blocks 541 is too small, it is easy to appear false touch, and if the distance between the adjacent two touch blocks 541 is too large, the user may not be able to touch the touch block 541, resulting in low touch efficiency.

[0542] When the touch sensor 54 includes a plurality of touch blocks 541, the projection of the antenna 6 on the first circuit board 561 "substantially covers" the touch sensor 54, which should cover more than 80% of the area of each touch block 541.

[0543] Please refer to FIG. 36 , FIG. 36 is FIG. 34A the partial structural schematic diagram of the first circuit board 561.

[0544] In some embodiments, the first circuit board 561 includes a layer of insulating layer 5611 and a layer of conductive layer 5612 arranged in a stack, and the conductive layer 5612 is located on the side of the insulating layer 5611 facing the shell 1 (see FIG. 35 ), that is, the side facing away from the antenna 6, and the conductive layer 5612 includes the touch sensor 54, and the conductive layer 5612 can include at least three touch blocks 541. The insulating layer 5611 can be a polyimide (PI) layer, and the conductive layer 5612 can be a copper foil layer.

[0545] The first circuit board 561 can be a single-layer board structure, that is, the number of conductive layers of the first circuit board 561 is one, so as to have a smaller thickness while forming the touch sensor 54. In other embodiments, the positions of the insulating layer 5611 and the conductive layer 5612 of the first circuit board 561 can be interchanged; in other embodiments, the number of insulating layers of the first circuit board 561 can also be two, and located on both sides of the conductive layer 5612.

[0546] For example, as FIG. 34AAs shown, the main circuit board 21 is located on the side of the antenna 6 opposite to the first circuit board 561, and a processor (which can be integrated in the main control chip 211) on the main circuit board 21 is electrically connected to the plurality of touch blocks 541 of the touch sensor 54. The second circuit board 562 has one end connected to the first circuit board 561 and the other end connected to the main circuit board 21, and the plurality of touch blocks 541 can be electrically connected to the main circuit board 21 through the second circuit board 562. The processor can determine the touch operation of the user by the change of the corresponding capacitance value of the plurality of touch blocks 541. In some other embodiments, a detection circuit can also be arranged on the main circuit board 21, and the detection circuit is connected in series between the plurality of touch blocks 541 and the processor. The detection circuit is used to preliminarily process the electrical signals of the plurality of touch blocks 541 to reduce the operation amount of the processor.

[0547] The earphone 10 further includes a high-frequency blocking circuit 5621 connected in series between the plurality of touch blocks 541 and the processor. For example, the high-frequency blocking circuit 5621 can be fixedly and electrically connected to the second circuit board 562. The high-frequency blocking circuit 5621 generally adopts an inductor (choke) circuit, and each touch block 541 is connected to the main circuit board 21 through the high-frequency blocking circuit 5621. The low-frequency signal formed by the touch sensor 54 during the touch detection process can pass through the high-frequency blocking circuit 5621 and be transmitted to the processor. The antenna 6 of the earphone 10 generally works in the Bluetooth frequency band of high frequency, and therefore the high-frequency blocking circuit 5621 can block the signal of the antenna 6 from forming a path on the plurality of touch blocks 541, thereby eliminating the coupling effect of the plurality of touch blocks 541 on the antenna 6 and ensuring that the receiving and transmitting performance of the antenna 6 is not affected or is less affected.

[0548] Please refer to FIG. 37 , FIG. 37 is FIG. 34A the structural schematic diagram of the first circuit board 561 and the antenna 6 in some other embodiments.

[0549] In some embodiments, when the antenna 6 does not include the second metal piece 63 or when the radiation part of the antenna 6 is not large enough, the projection of the antenna 6 on the first circuit board 561 can not cover some touch blocks 541 of the touch sensor 54. In this case, a second conductive layer 5613 serving as a reference ground corresponding to the some touch blocks 541 can be arranged on the first circuit board 561. In this case, the second conductive layer 5613 is arranged approximately staggered with the antenna 6.

[0550] Exemplarily, the first circuit board 561 comprises a conductive layer 5612, an insulating layer 5611 and a second conductive layer 5613 arranged in a stack, the conductive layer 5612 is located on the side of the insulating layer 5611 facing the shell 1, the conductive layer 5612 comprises the touch sensor 54, and the second conductive layer 5613 is located on the side of the insulating layer 5611 away from the shell 1. The projection of the antenna 6 on the first circuit board 561 covers a part of the touch sensor 54, and the second conductive layer 5613 covers another part of the touch sensor 54. At this time, the second conductive layer 5613 can provide a reference ground for the touch sensor 54. In this embodiment, the number of layers of the second conductive layer 5613 is one layer, and the area of the second conductive layer 5613 is obviously smaller than the area of the insulating layer 5611. The overall thickness of the first circuit board 561 is still very thin, and the installation difficulty is small.

[0551] Please refer to FIG. 35 and FIG. 38 , FIG. 38 is FIG. 35 the structure diagram of the detection circuit board 56 and the related adhesive layer shown in FIG.

[0552] In some embodiments, the first circuit board 561 of the detection circuit board 56 can be fixedly connected to the inner wall of the main shell 11 through the hot melt adhesive film 564, the third circuit board 563 can be fixedly connected to the inner wall of the main shell 11 through the double-sided adhesive 565, and other parts of the detection circuit board 56 can also be fixedly connected to the inner wall of the main shell 11 through the double-sided adhesive. Among them, the area of the main shell 11 used for the third circuit board 563 is located near the first opening 1131, and the opening area of the first opening 1131 is large, which is easy to bond, so that the third circuit board 563 can be closely attached to the main shell 11 through the double-sided adhesive 565 at one time and easily. The first circuit board 561 is long, and needs to be inserted from the top space 111a of the main shell 11 to the bottom space 111c of the main shell 11 during assembly. By using the fixed mode of the hot melt adhesive film 564, the first circuit board 561 can be inserted into the main shell 11 during the assembly process, and no false bonding will occur during this process. When the first circuit board 561 is in place, the hot melt adhesive film 564 is heated (for example, heated to 80-90 degrees), so that the first circuit board 561 is bonded to the main shell 11, and the semi-melted state of the hot melt adhesive film 564 can better absorb the gap between the first circuit board 561 and the main shell 11, and the attachment state of the two is better. During the assembly process of the earphone 10, the detection circuit board 56 can be installed in the main shell 11 first, and then the main circuit board 21 is installed, and then the detection circuit board 56 is buckled to the main circuit board 21 to realize electrical connection.

[0553] Regarding the main shell 113 of the earphone 10, the first contact 71, the second contact 72, the sixth assembly 46 of the audio auxiliary assembly 4 and the third microphone 34:

[0554] Please refer toFIG. 6 、 FIG. 39 and FIG. 40 , FIG. 39 is FIG. 6 a partial structural schematic diagram of the main shell piece 113, FIG. 40 is FIG. 6 another partial structural schematic diagram of the main shell piece 113.

[0555] In some embodiments, the main shell piece 113 of the main shell 11 further has a first mounting slot 1137, a second mounting slot 1138, and a third mounting slot 1139. The third mounting slot 1139 is located at the bottom 113c of the main shell piece 113, and can be located at a middle position or a position close to the middle. The first mounting slot 1137 and the second mounting slot 1138 are located at the bottom 113c of the main shell piece 113, and are respectively located on both sides of the third mounting slot 1139. Among them, the first mounting slot 1137 and the second mounting slot 1138 can be symmetrically arranged relative to the center plane 10c of the earphone 10.

[0556] As shown in FIG. 39 , for example, the first mounting slot 1137 can include a recessed part 1137a and a communication part 1137b. The opening of the recessed part 1137a is located on the outer surface of the main shell piece 113, and the communication part 1137b communicates the recessed part 1137a with the inner space of the main shell piece 113. Among them, the shape of the recessed part 1137a can be generally round (also known as track-shaped). The bottom wall of the recessed part 1137a can be provided with a first protrusion 1137c and a second protrusion 1137d; the first protrusion 1137c is arranged around the communication part 1137b; the second protrusion 1137d is arranged in a spaced manner with the first protrusion 1137c. The number of second protrusions 1137d can be two, and the two second protrusions 1137d are respectively located on both sides of the first protrusion 1137c. Among them, the shape of the second mounting slot 1138 can be the same as that of the first mounting slot 1137, which will not be described here.

[0557] As shown in FIG. 40 , the third mounting slot 1139 can be provided with a first recessed part 1139a, a second recessed part 1139b, and a communication part 1139c which are sequentially communicated. The shape of the first recessed part 1139a can be generally round (also known as track-shaped). Among them, the third mounting slot 1139 can further be provided with two third recessed parts 1139d, both of which are communicated with the first recessed part 1139a and are respectively located on both sides of the first recessed part 1139a.

[0558] Please refer to FIG. 41 , FIG. 41 is FIG. 3 a structural schematic diagram of the first contact 71 of the earphone 10.

[0559] In some embodiments, the first contact 71 comprises a main body portion 711 and a stylus portion 712, the stylus portion 712 protruding from one side of the main body portion 711. The main body portion 711 can be substantially in the shape of a waist circle (also referred to as a racetrack shape). The side of the main body portion 711 facing the stylus portion 712 can be provided with a groove 713, the groove 713 being located close to and surrounding the stylus portion 712.

[0560] The first contact 71 can be made of an electrically conductive material. The first contact 71 can be a one-piece structure.

[0561] Please refer to FIG. 3 and FIG. 42 , FIG. 42 Figure 6 is a schematic diagram of a partial structure of the sixth assembly 46 of the earphone 10 shown in FIG. 3

[0562] In some embodiments, the sixth assembly 46 comprises a fourth appearance net 461. The fourth appearance net 461 can comprise a main body 4611 and two protrusions 4612. The main body 4611 is provided with a plurality of through holes 4613 to form a net structure. The main body 4611 can be substantially in the shape of a waist circle (also referred to as a racetrack shape). The two protrusions 4612 are fixed to the same side of the main body 4611 and are located at the two ends of the main body 4611, respectively.

[0563] The fourth appearance net 461 can be a metal net to increase the fashion sense and mechanical reliability of the earphone 10, reduce the risk of damage to the components located at the back side of the fourth appearance net 461 by external force, for example, prevent sharp objects from the outside from penetrating, and improve the service life of the earphone 10. The fourth appearance ...

Claims

1. An earphone, characterized by comprising: The earphone comprises a shell, a speaker, a main circuit board and a battery, the speaker, the main circuit board and the battery are all installed in the shell, the main circuit board is located between the speaker and the battery, and the main circuit board is arranged obliquely relative to the speaker. The shell comprises a main shell and a front shell, the front shell is fixed to the front side of the main shell, the internal space of the front shell is communicated with the internal space of the main shell, the front shell faces the ear of a user when the earphone is in a wearing state, the main shell comprises a first end contacting the front shell and a second end away from the front shell, and the outer contour of the main shell is first contracted and then expanded in the direction from the first end to the second end of the main shell. The internal space of the main shell comprises a top space, a middle space and a bottom space, the top space of the main shell is close to the first end of the main shell, the bottom space of the main shell is close to the second end of the main shell, the cross-sectional area of the top space of the main shell is greater than that of the middle space of the main shell, and the cross-sectional area of the bottom space of the main shell is greater than that of the middle space of the main shell. The speaker is installed in the internal space of the front shell and / or the top space of the main shell, the battery is installed in the bottom space of the main shell, the main circuit board is installed in the middle space of the main shell, and the two ends of the main circuit board respectively extend to the top space of the main shell and the bottom space of the main shell.

2. The earphone of claim 1, wherein The angle between the plane of the main circuit board and the plane of the diaphragm of the speaker is in the range of 10° to 60°.

3. The earphone of claim 1, wherein, The battery is arranged obliquely relative to the main circuit board.

4. The earphone according to any one of claims 1 to 3, characterized in that, The battery is a button battery.

5. The earphone of claim 1, wherein The angle between the plane of the main circuit board and the plane of the diaphragm of the speaker is in the range of 20° to 50°.

6. The earphone according to any one of claims 1 to 3, 5, wherein, The main shell comprises a main shell member and a cover member, the main shell member has a first opening and a second opening arranged at intervals, and the first opening and the second opening both face the ear of a user when the earphone is in a wearing state. The front shell is installed in the first opening, the cover member is installed in the second opening, and the cover member and part of the main shell member jointly enclose the bottom space of the main shell.

7. The earphone according to any one of claims 1 to 3, 5, wherein, The main shell further comprises a main shell member, a cover member and a back cover member, the main shell member has a first opening, a second opening and a third opening arranged at intervals, the first opening and the second opening both face the ear of a user when the earphone is in a wearing state, and the third opening faces away from the ear of a user, and the third opening is located between the first opening and the second opening. The front shell is installed in the first opening, the cover member is installed in the second opening, the cover member and part of the main shell member jointly enclose the bottom space of the main shell, the back cover member is installed in the third opening, and the back cover member and part of the main shell member jointly enclose the middle space of the main shell.

8. The earphone of claim 6, wherein, The main shell member is an integrally formed structural member.

9. The earphone of claim 7, wherein, The main shell member is an integrally formed structural member.

10. The earphone of claim 6, wherein, The main shell comprises an abutting end face, the abutting end face is located on the main shell member and surrounds the first opening, and the abutting end face contacts the front shell. The main shell has a first projection on the plane of the abutting end face, and the cover has a second projection on the plane of the abutting end face, and the first projection covers the second projection.

11. The earphone of claim 7, wherein, The main shell includes an abutting end face, which is arranged on the main shell and surrounds the first opening, and the abutting end face contacts the front shell. The main shell has a first projection on the plane of the abutting end face, and the cover has a second projection on the plane of the abutting end face, and the first projection covers the second projection.

12. The earphone according to any one of claims 1 to 3, 5, 8 to 11, wherein, The earphone further includes a partition assembly, which is arranged in the top space of the main shell and between the loudspeaker and the main circuit board. The internal space of the shell includes a front cavity, a rear cavity, and a main board cavity, the front cavity is between the front shell and the loudspeaker, the rear cavity is between the loudspeaker and the partition assembly, and the main board cavity is on the side of the partition assembly away from the loudspeaker.

13. The earphone of claim 12, wherein, The partition assembly includes one or more magnetic separators.

14. The earphone according to any one of claims 1 to 3, 5, 8 to 11, 13, wherein, The distance between the center point of the bottom surface of the loudspeaker and the center point of the battery in a first direction is in the range of 12 mm to 20 mm, and the distance in a second direction is in the range of 6 mm to 15 mm, the first direction is parallel to the diaphragm plane of the loudspeaker, and the second direction is perpendicular to the first direction. Alternatively, the distance between the center point of the bottom surface of the loudspeaker and the center point of the battery is in the range of 10 mm to 30 mm.

15. The earphone according to any one of claims 1 to 3, 5, 8 to 11, 13, wherein, The main circuit board includes a first end adjacent to the loudspeaker and a second end adjacent to the battery. The earphone further includes a first flexible circuit board and a second flexible circuit board, the first flexible circuit board and the loudspeaker are on the same side of the main circuit board, the first flexible circuit board electrically connects the loudspeaker and the first end of the main circuit board, and the second flexible circuit board and the battery are on the same side of the main circuit board, and the second flexible circuit board electrically connects the battery and the second end of the main circuit board.

16. The earphone of claim 15, wherein, The main circuit board and the first flexible circuit board are fixedly connected by a BOF process, and the main circuit board and the second flexible circuit board are fixedly connected by a BOF process.

17. An earphone assembly, characterized by The earphone includes a charging box and the earphone of any one of claims 1 to 16, and the charging box is used to accommodate the earphone.

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