Antenna and electronic device

Abstract

The present disclosure provides an antenna and an electronic device, and belongs to the technical field of communication. The antenna of the present disclosure comprises an antenna substrate and a flexible circuit board. The antenna substrate comprises a first dielectric substrate, a first conductive layer arranged on the first dielectric substrate, the first conductive layer comprising at least one first feed line and at least one second feed line, and a second conductive layer arranged on the side of the first dielectric substrate away from the first conductive layer, the second conductive layer comprising at least one first opening. The flexible circuit board comprises oppositely arranged second and third dielectric substrates, a third conductive layer arranged between the second and third dielectric substrates, a first feed structure arranged on the side of the second dielectric substrate away from the third conductive layer, one second feed port of the first feed structure being electrically connected to one first feed line, and a second feed structure arranged on the side of the third dielectric substrate away from the third conductive layer, one fourth feed port of the second feed structure being electrically connected to one second feed line.

Description

Technical Field

[0001] This disclosure belongs to the field of communication technology, specifically relating to an antenna and electronic device. Background Technology

[0002] With the continuous development of mobile communication technology, antennas have become an indispensable part of mobile communication devices. Besides demanding higher electrical performance from antennas, people are also increasingly demanding aesthetically pleasing designs. Furthermore, in today's 5G era, the number of communication base stations will multiply. However, the influx of these base stations inevitably raises concerns about electromagnetic radiation, a concern that can be addressed by transparent base station antennas with excellent concealment. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide an antenna and electronic device.

[0004] In a first aspect, embodiments of this disclosure provide an antenna, which includes an antenna substrate and a flexible circuit board; wherein...

[0005] The antenna substrate includes:

[0006] First dielectric substrate;

[0007] A first conductive layer is disposed on the first dielectric substrate; the first conductive layer includes at least one first feed line and at least one second feed line;

[0008] The second conductive layer is disposed on the side of the first dielectric substrate opposite to the first conductive layer; the second conductive layer includes at least one first opening; the outline of the orthographic projection of the first opening on the first dielectric substrate intersects the orthographic projections of a first feed line and a second feed line on the first dielectric substrate, and the orthographic projections of the first feed line and the second feed line on the dielectric layer extend into the orthographic projection of the first opening on the dielectric layer, and the feeding directions of the first feed line and the second feed line are different.

[0009] The flexible circuit includes:

[0010] The second and third dielectric substrates are disposed opposite to each other;

[0011] A third conductive layer is disposed between the second dielectric substrate and the third dielectric substrate;

[0012] A first power supply structure is disposed on the side of the second dielectric substrate away from the third conductive layer, and a second power supply port of the first power supply structure is electrically connected to a first power supply line.

[0013] The second power supply structure is disposed on the side of the third dielectric substrate away from the third conductive layer, and a fourth power supply port of the second power supply structure is electrically connected to a second power supply line.

[0014] The flexible circuit board includes:

[0015] A fourth conductive layer is disposed on the side of the second dielectric substrate opposite to the third conductive layer; the fourth conductive layer includes a first feed structure, at least one first connection pad, at least one second connection pad, and at least one third connection pad; a second feed port of the first feed structure is electrically connected to one of the first connection pads, and a first feed line is bonded to one of the first connection pads; the third conductive layer is electrically connected to the third connection pad through a first connection via penetrating the second dielectric substrate; the second conductive layer is electrically connected to the third connection pad;

[0016] A fifth conductive layer is disposed on the side of the third dielectric substrate opposite to the third conductive layer. The fifth conductive layer includes a second power supply structure. A fourth power supply port of the second power supply structure is electrically connected to a second connection pad through a second connection via penetrating the second dielectric substrate and the third dielectric substrate. A second feed line is bonded to a second connection pad.

[0017] The antenna substrate includes at least one radiating element, the radiating element includes a first opening, a first feed line and a second feed line whose orthographic projection on the first dielectric substrate intersects with the orthographic projection outline of the first opening on the first dielectric substrate.

[0018] The radiating unit further includes a first isolation component located in the first conductive layer, and the first isolation component is located between the first feed line and the second feed line, and is bonded to the third connection pad;

[0019] In the radiation unit, the orthographic projection of the first isolation component on the first dielectric substrate intersects with the outline of the orthographic projection of the first opening on the first dielectric substrate and extends into the orthographic projection of the first opening on the first dielectric substrate.

[0020] The first dielectric substrate has at least one side trace on its side surface; a first isolation component is electrically connected to the second conductive layer through one of the side traces.

[0021] The length of the first isolation component is between 0.2λc and 0.25λc, where λc is the center frequency wavelength.

[0022] The number of the first openings is multiple, and the multiple first openings are arranged side by side along the first direction; the second conductive layer includes a first side and a second side arranged opposite to each other in the second direction; the flexible circuit board is closer to the first side than the second side;

[0023] The first conductive layer further includes a second opening penetrating the first side, and at least one second opening is provided between adjacent first openings, and the extension direction of the second opening intersects the first direction.

[0024] Wherein, the extension direction of the second opening is the second direction, and the length of the second opening is between 0.2λc and 0.25λc, where λc is the center frequency wavelength.

[0025] The first conductive layer further includes a third opening penetrating the second side, and at least one third opening is provided between adjacent first openings, and the extension direction of the third opening intersects the first direction; the second opening and the third opening are mirror-symmetrically arranged with the line connecting the centers of each first opening as the axis of symmetry.

[0026] The second conductive layer includes a metal mesh structure.

[0027] The antenna substrate further includes a first connecting strip to the second conductive layer, the first connecting strip shorting the edge of the metal mesh structure near the flexible circuit board.

[0028] The outline of the first opening includes a polygon.

[0029] The polygon includes a first side, a second side, a third side, a fourth side, a fifth side, a sixth side, a seventh side, and an eighth side connected in sequence; the extension direction of the first side is the same as the extension direction of the fifth side and is perpendicular to the extension direction of the third side; the first feed line and the second feed line intersect with the orthographic projections of the second side and the fifth side on the first dielectric substrate, respectively.

[0030] The number of the first openings is 2. n The first feeding structure includes n-level third feeders, and the second feeding structure includes n-level fourth feeders;

[0031] A third feeder located at level 1 connects two adjacent first feeders, and different third feeders located at level 1 connect to different first feeders; a third feeder located at level m connects two adjacent third feeders located at level m-1, and different third feeders located at level m connect to different third feeders located at level m-1.

[0032] A fourth feeder located at level 1 connects to two adjacent second feeders, and different fourth feeders at level 1 connect to different second feeders; a fourth feeder located at level m connects to two adjacent fourth feeders at level (m-1), and different fourth feeders at level m connect to different fourth feeders at level (m-1); where n≥2, 2≤m≤n, and m and n are both integers;

[0033] At least one of the third feed line and the fourth feed line is a microstrip line.

[0034] The third feeder and the fourth feeder each have two feed terminals; the feed terminal of the third feeder located in the first stage serves as the second feed port of the first feeder structure; the feed port of the fourth feeder located in the first stage serves as the fourth feed port of the first feeder structure; the first feed port of the first feeder structure is connected to the third feeder located in the nth stage; the third feed port of the second feeder structure is connected to the fourth feeder located in the nth stage.

[0035] The antenna further includes a first connector and a second connector; the first connector is electrically connected to a first feed port of the first feed structure; and the second connector is electrically connected to a third feed port of the second feed structure.

[0036] The fourth conductive layer further includes first patch electrodes located on both sides of the first feed port extension direction of the first feed structure; the first patch electrodes are electrically connected to the third conductive layer through a third connection via penetrating the second dielectric substrate.

[0037] The fifth conductive layer further includes second patch electrodes located on both sides of the extension direction of the third feed port of the first feed structure; the second patch electrodes are electrically connected to the third conductive layer through a fourth connection via penetrating the third dielectric substrate.

[0038] The first dielectric substrate includes a first sub-dielectric layer, a first adhesive layer, a support layer, a second adhesive layer, and a second sub-dielectric layer stacked together; the first conductive layer is disposed on the side of the first sub-dielectric layer opposite to the first adhesive layer; and the second electrode layer is disposed on the side of the second sub-dielectric layer opposite to the first adhesive layer.

[0039] The material of the support layer includes any one of polycarbonate plastic, cyclic olefin polymer plastic, and acrylic / plexiglass.

[0040] The material of the first sub-dielectric layer and / or the second sub-dielectric layer includes polyimide or polyethylene terephthalate.

[0041] Secondly, embodiments of this disclosure provide an electronic device that includes any of the antennas described above. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the antenna structure according to an embodiment of the present disclosure.

[0043] Figure 2 This is a cross-sectional view of the antenna substrate according to an embodiment of the present disclosure.

[0044] Figure 3 This is a top view of the first conductive layer according to an embodiment of this disclosure.

[0045] Figure 4 This is a top view of the second conductive layer according to an embodiment of this disclosure.

[0046] Figure 5 This is a top view of the antenna substrate according to an embodiment of the present disclosure.

[0047] Figure 6 This is a cross-sectional view of a flexible circuit board according to an embodiment of this disclosure.

[0048] Figure 7 This is a top view of a flexible circuit board according to an embodiment of the present disclosure.

[0049] Figure 8 for Figure 7 Cross-sectional view at position A.

[0050] Figure 9 for Figure 7 Cross-sectional view at position B.

[0051] Figure 10 This is a schematic diagram of the structure of the metal mesh according to an embodiment of the present disclosure.

[0052] Figure 11 This is a schematic diagram of the first power supply structure according to an embodiment of the present disclosure.

[0053] Figure 12 This is a structural plan view of the first dielectric substrate according to an embodiment of the present disclosure.

[0054] Figure 13 This is a schematic diagram of the S-parameters of an antenna according to an embodiment of this disclosure.

[0055] Figure 14 This is a schematic diagram showing the change in isolation before and after the introduction of the first isolation component into the antenna according to an embodiment of this disclosure.

[0056] Figure 15 This diagram illustrates the change in isolation before and after the introduction of the second and third openings in the antenna according to an embodiment of this disclosure.

[0057] Figure 16 This is a schematic diagram showing the peak gain of the antenna as a function of frequency according to an embodiment of this disclosure.

[0058] Figure 17 This is the radiation pattern of the antenna at the center frequency according to an embodiment of this disclosure. Detailed Implementation

[0059] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0061] Firstly, Figure 1 This is a schematic diagram of the antenna structure according to an embodiment of the present disclosure; as shown Figure 1 As shown, this embodiment of the present disclosure provides an antenna, which includes an antenna substrate 10 and a flexible circuit board 20. The flexible circuit board 20 is electrically connected to the antenna substrate 10 and is used to provide microwave signals to the antenna substrate 10.

[0062] Specifically, Figure 2 This is a cross-sectional view of the antenna substrate 10 according to an embodiment of the present disclosure; Figure 3 This is a top view of the first conductive layer 11 according to an embodiment of the present disclosure; Figure 4 This is a top view of the second conductive layer 12 according to an embodiment of the present disclosure; Figure 5 This is a top view of the antenna substrate 10 according to an embodiment of this disclosure. Figure 2-5 As shown, the antenna substrate 10 includes a first dielectric substrate 13, a first conductive layer 11, and a second conductive layer 12. The first conductive layer 11 and the second conductive layer 12 are respectively disposed on two surfaces of the first dielectric substrate 13 in its thickness direction. The first conductive layer 11 includes at least one first feed line 111 and at least one second feed line 112. The second conductive layer 12 includes at least one first opening 121.

[0063] In some examples, the number of first openings 121, first feed lines 111, and second feed lines 112 can be equal, and these three elements are correspondingly arranged. For the orthographic projections of the corresponding first openings 121, first feed lines 111, and second feed lines 112 onto the first dielectric substrate 13, the orthographic projections of the first feed lines 111 and 112 onto the first dielectric substrate 13 intersect with the orthographic projection of the first opening 121 onto the first dielectric substrate 13. Furthermore, the feeding directions of the first feed lines 111 and 112 are different; that is, the intersection point of the orthographic projection of the first feed line 111 onto the first dielectric substrate 13 and the orthographic projection of the first opening 121 onto the first dielectric substrate 13, and the intersection point of the first opening 121 onto the first dielectric substrate 13, are also different. The line connecting the centers of the orthographic projections on the first dielectric substrate 13 is the first line segment. The line connecting the intersection of the orthographic projection of the second feed line 112 on the first dielectric substrate 13 and the orthographic projection of the first opening 121 on the first dielectric substrate 13, and the center of the orthographic projection of the first opening 121 on the first dielectric substrate 13, is the second line segment. The extension directions of the first line segment and the second line segment intersect. For example, the extension directions of the first line segment and the second line segment are perpendicular to each other. In this case, feeding through the first feed line 111 and the second feed line 112 can achieve the polarization direction of the antenna of ±45° or 0° / 90°. Figure 1 Taking the antenna's ability to achieve a polarization direction of ±45° as an example.

[0064] Figure 6 This is a cross-sectional view of the flexible circuit board 20 according to an embodiment of the present disclosure; Figure 7 This is a top view of the flexible circuit board 20 according to an embodiment of this disclosure. Figure 6 and 7As shown, the flexible circuit board 20 includes a second dielectric substrate 26 and a third dielectric substrate 27 disposed opposite to each other, as well as a third conductive layer 25, a fourth conductive layer 210, and a fifth conductive layer. The third conductive layer 25 is disposed between the second dielectric substrate 26 and the third dielectric substrate 27. The fourth conductive layer 210 is disposed on the side of the second dielectric substrate 26 opposite to the third conductive layer 25, and the fifth conductive layer is disposed on the side of the third dielectric substrate 27 opposite to the third conductive layer 25. The fourth conductive layer 210 includes at least a first feed structure 21, which has a first feed port and at least one second feed port. The fifth conductive layer includes at least a second feed structure 22, which has a third feed port and at least one fourth feed port. One of the second feed ports in the first feed structure 21 is electrically connected to a first feed line 111 for transmitting microwave signals with the first feed line 111; one of the fourth feed ports in the second feed structure 22 is electrically connected to a second feed line 112 for outputting microwave signals with the second feed line 112. In some examples, the number of second feed ports in the first feed structure 21 is equal to the number of first feed lines 111, and they are configured in a one-to-one correspondence. The number of fourth feed ports in the second feed structure 22 is equal to the number of second feed lines 112, and they are configured in a one-to-one correspondence.

[0065] It should be noted that, Figure 1 The number of the first opening 121, the first feeder 111, the second feeder 112, the second feeder port, and the fourth feeder port are all 2. n For example, there are n ≥ 2, where n is an integer. In the following description, the number of the first opening 121, the first feeder 111, the second feeder 112, the second feeder port, and the fourth feeder port are all 2. n This is just one example, but it should be understood that this does not constitute a limitation on the scope of protection of the embodiments of this disclosure. The number of the first opening 121, the first feed line 111, the second feed line 112, the second feed port, and the fourth feed port can also be one or any odd number. In the embodiments of this disclosure, the second conductive layer 12 and the third conductive layer 25 can both be ground layers. The reason for this arrangement is that a current loop is formed between the first conductive layer 11 and the second conductive layer 12; and the third conductive layer 25 forms a current loop with the fourth conductive layer 210 and the fifth conductive layer, respectively.

[0066] In the antenna of this embodiment, the first feeding structure 21 and the second feeding structure 22 are both integrated on the flexible circuit board 20 and are arranged in layers on the flexible circuit board 20. In this case, the first feeding structure 21 and the second feeding structure 22 can be electrically connected to the antenna substrate 10 from one side of the antenna substrate 10, for example, by bonding, so as to realize microwave communication between the flexible circuit board and the antenna substrate 10. Moreover, in this case, the size of the antenna can be effectively reduced, and the miniaturization design of the antenna can be realized.

[0067] In some examples, Figure 8 for Figure 7 The cross-sectional view at position A is shown in the reference diagram. Figure 7 and 8 As shown, the fourth conductive layer 210 includes not only the first feed structure 21, but also the first connection pad 212, the second connection pad 214, and the third connection pad 213. Specifically, the second feed port of the first feed junction on the fourth conductive layer 210 is connected to the first connection pad 212 in a one-to-one correspondence. The fourth feed port of the second feed structure 22 on the fifth conductive layer is connected to the second connection pad 214 in a one-to-one correspondence through a second connection via penetrating the second dielectric substrate 26 and the third dielectric substrate 27. The third conductive layer 25 is electrically connected to the third connection pad 213 through a first connection via penetrating the second dielectric substrate 26, and the second conductive layer 12 is electrically connected to the third connection pad 213. In this embodiment, the first feed line 111 on the antenna substrate 10 corresponds one-to-one with the first connecting pad 212, and the corresponding first feed line 111 and the first connecting pad 212 are bonded together; the second feed line 112 corresponds one-to-one with the second connecting pad 214, and the corresponding second feed line 112 and the second connecting pad 214 are bonded together. For example, the first feed line 111 and the first connecting pad 212 are bonded together using ACF adhesive (transparent optical conductive adhesive), and the second feed line 112 and the second connecting pad 214 are bonded together using ACF adhesive. It should be noted that during the bonding connection, the first conductive layer 11 is provided with an alignment mark 114, and the fourth conductive layer 210 is provided with an alignment mark 215. By precisely aligning the alignment marks 114 and 215, the bonding of the feed line connecting pads is achieved.

[0068] Further, continue to refer to Figure 5 The antenna substrate 10 includes at least one radiating element 100 (shown as including 2 in the figure). n(Taking a radiating unit 100 as an example), the radiating unit 100 includes a first opening 121, a first feed line 111 and a second feed line 112 whose orthographic projections on the first dielectric substrate 13 intersect with the orthographic projection outline of the first opening 121 on the first dielectric substrate 13. In particular, the radiating unit 100 in this embodiment further includes a first isolation component 113 located in the first conductive layer 11, and the first isolation component 113 is located between the first feed line 111 and the second feed line 112, and is bonded to a third connection pad 213. The orthographic projection of the first isolation component 113 on the first dielectric substrate 13 intersects with the outline of the orthographic projection of the first opening 121 on the first dielectric substrate 13, and extends into the orthographic projection of the first opening 121 on the first dielectric substrate 13. By setting a first isolation component 113 between the first feed line 111 and the second feed line 112 of the radiating element 100, and binding the first isolation component 113 to the third connecting pad 213 (i.e., grounding the first isolation component), the coupling between the feed ports of the first feed line 111 and the second feed line 112 can be effectively reduced, thereby improving antenna performance. The length of the first isolation component 113 is between 0.2λc and 0.25λc, where λc is the center frequency wavelength; for example, the length of the first isolation component 113 is 0.25λc. By reasonably setting the length of the first isolation component 113, the best decoupling effect between the feed ports of the first feed line 111 and the second feed line 112 can be achieved.

[0069] Furthermore, a side trace 30 is formed on the side of the first dielectric substrate 13 near the flexible circuit. An isolation component is connected to the second conductive layer 12 through a side trace 30, thereby realizing the electrical connection between the second conductive layer 12 and the third connection pad 213. That is, the second conductive layer 12, the third conductive layer 25 and the first isolation component 113 are all grounded through the third connection pad 213.

[0070] In some examples, there are multiple first openings 121, i.e., multiple radiating units 100, and the multiple first openings 121 are arranged side by side along the first direction X; the second conductive layer 12 includes a first side and a second side disposed opposite to each other in the second direction Y; the flexible circuit board 20 is closer to the first side than the second side; the first conductive layer 11 also includes a second opening 122 penetrating the first side, and at least one second opening 122 is disposed between adjacent first openings 121, and the extension direction of the second opening 122 intersects the first direction X. In the embodiments of this disclosure, by distributing second openings 122 located in the first conductive layer 11 between the first openings 121 of adjacent radiating units 100, the coupling of microwave signals between radiating units 100 is reduced. In some examples, the length of the second opening 122 is between 0.2λc and 0.25λc, where λc is the center frequency wavelength, for example, the length of the second opening 122 is 0.25λc. By reasonably setting the length of the second opening 122, the best decoupling effect between adjacent radiating units 100 is achieved. In some examples, the number of second openings 122 between adjacent first openings 121 can be one or more. Figure 5 Taking the example of setting three second openings 122 between adjacent first openings 121, this embodiment of the present disclosure changes the current path between radiating units 100 by designing the number of second openings 122 and the spacing between the second openings 122, so that the currents between the radiating units 100 are orthogonally distributed, thereby reducing the coupling between the radiating units 100.

[0071] Furthermore, the first conductive layer 11 also includes a third opening 123 penetrating the second side, and at least one third opening 123 is provided between adjacent first openings 121, with the extension direction of the third opening 123 intersecting the first direction X; the second opening 122 and the third opening 123 are arranged in a mirror-symmetrical manner with the line connecting the centers of each first opening 121 as the axis of symmetry. This arrangement is to ensure the uniformity of the light transmittance of the antenna substrate 10.

[0072] In some examples, continue to refer to Figure 4 The outline shape of the first opening 121 on the second conductive layer 12 in this embodiment includes, but is not limited to, triangles, quadrilaterals, octagons, crosses, circular ellipsoids, etc. In this embodiment, by providing a polygonal first opening 121 on the second conductive layer 12, the impedance distribution on the surface of the radiating slit of the second conductive layer 12 and the current path thereon are changed, thereby expanding the bandwidth and achieving impedance matching.

[0073] For example, in this embodiment of the present disclosure, taking the outline of the first opening 121 as a polygon, such as an octagon, the outline of the first opening 121 specifically includes a first side, a second side, a third side, a fourth side, a fifth side, a sixth side, a seventh side, and an eighth side connected in sequence; the extension direction of the first side and the extension direction of the fifth side are the same, and perpendicular to the extension direction of the third side; the first feed line 111 and the second feed line 112 intersect the orthographic projections of the second side and the fifth side on the first dielectric substrate 13, respectively. In this case, the antenna of this embodiment of the present disclosure can achieve a polarization direction of ±45°.

[0074] In some examples, Figure 10 This is a schematic diagram of the structure of the metal mesh according to an embodiment of the present disclosure; as shown Figure 10 As shown, the second conductive layer 12 includes a metal mesh structure. The metal mesh structure may include multiple intersecting first metal lines 201 and multiple second metal lines 202. For example, the extending directions of the first metal lines 201 and the second metal lines 202 may be perpendicular to each other, forming a directional or rectangular cutout. Alternatively, the extending directions of the first metal lines 201 and the second metal lines 202 may not be perpendicular; for example, the angle between the extending directions of the first metal lines 201 and the second metal lines 202 may be 45°, forming a rhomboid cutout. In some examples, the line width, line thickness, and line spacing of the first metal lines 201 and the second metal lines 202 in the metal mesh structure are preferably the same, but they may also be different. For example, the line width W1 of the first metal lines 201 and the second metal lines 202 are both approximately 1-30 μm, the line spacing W2 is approximately 50-250 μm, and the line thickness is approximately 0.5-10 μm. In the embodiments of this disclosure, the metal mesh structure may be formed on the first dielectric substrate 13 by processes including but not limited to imprinting or etching.

[0075] In some examples, when the second conductive layer 12 adopts a metal mesh structure, the first metal line 201 and the second metal line 202 of the metal mesh structure of the second conductive layer 12 can be connected together near the flexible line end. For example: continue to refer to Figure 4 The antenna substrate 10 also includes a first connecting strip 40 disposed on the same layer as the second conductive layer 12. This first connecting strip 40 short-circuits the edge of the metal mesh structure near the flexible circuit board 20. The first connecting strip 40 can be made of copper, specifically bendable copper. This is to prevent the metal wires of the metal mesh structure from breaking when the flexible circuit board 20 is folded after bonding it to the antenna substrate 10. The first connecting strip 40 ensures the electrical stability of the metal mesh structure. Of course, in actual products, the ends of the first metal wire 201 and the second metal wire 202 of the metal mesh structure can also be unconnected, meaning the periphery of the metal mesh structure radiates outwards.

[0076] Furthermore, the first conductive layer 11 in this embodiment can also adopt a metal mesh structure, that is, the first feed line 111, the second feed line 112, and the first isolation component 113 can all adopt a metal mesh structure. When both the first conductive layer 11 and the second conductive layer 12 adopt a metal mesh structure, the projections of the cutouts of the two metal mesh structures on the first dielectric substrate 13 completely overlap or substantially overlap. It should be noted that, in this embodiment, "substantially overlap" means that the width of the intersecting area of ​​the orthographic projections of the cutouts of the two metal mesh structures is not greater than 1 line width. This arrangement can effectively improve the optical transmittance of the antenna. In this embodiment, the light transmittance of each metal mesh structure is approximately 70%-88%.

[0077] In some examples, Figure 11 This is a schematic diagram of the first power supply structure 21 according to an embodiment of the present disclosure; as shown Figure 11 As shown, when the number of first openings 121 on the second conductive layer 12 in this embodiment of the present disclosure is 2 n In this case, the first feed structure 21 includes n-level third feed lines 211, and the second feed structure 22 includes n-level fourth feed lines 221. At least one of the third feed lines 211 and the fourth feed lines 221 is a microstrip line; in this embodiment, it is taken that both the third feed line 211 and the fourth feed line 221 are microstrip lines. A third feeder 211 located at level 1 connects to two adjacent first feeders 111, and different third feeders 211 at level 1 connect to different first feeders 111; a third feeder 211 located at level m connects to two adjacent third feeders 211 at level (m-1), and different third feeders 211 at level m connect to different third feeders 211 at level (m-1); a fourth feeder 221 located at level 1 connects to two adjacent second feeders 112, and different fourth feeders 221 at level 1 connect to different second feeders 112; a fourth feeder 221 located at level m connects to two adjacent fourth feeders 221 at level (m-1), and different fourth feeders 221 at level m connect to different fourth feeders 221 at level (m-1); where n≥2, 2≤m≤n, and m and n are both integers.

[0078] It should be noted that both the third feeder 211 and the fourth feeder 221 have two feed terminals; the feed terminal of the third feeder 211 located in the first stage serves as the second feed port of the first feeder structure 21; the feed port of the fourth feeder 221 located in the first stage serves as the fourth feed port of the first feeder structure 21; the first feed port of the first feeder structure 21 is connected to the third feeder 211 located in the nth stage; the third feed port of the second feeder structure 22 is connected to the fourth feeder 221 located in the nth stage.

[0079] For example: Figure 1 The second conductive layer 12 of the antenna includes four first openings 121, i.e., n=2. The first feed structure 21 adopts a two-stage (three-line) third feed line 211 with a split-to-two and two-to-four configuration. The second feed structure 22 is a two-stage (three-line) fourth feed line 221 with a split-to-two and two-to-four configuration. Among them, one third feed line 211 located in the first stage connects to the feed ends of the first and second first feed lines 111 from left to right, and another third feed line 211 connects to the feed ends of the third and fourth first feed lines 111 from left to right. The third feed line 211 located in the second stage connects to the feed ends of the two third feed lines 211 in the first stage. Similarly, one fourth feeder 221 in the first stage connects to the feed terminals of the first and second second feeders 112 from left to right, and another fourth feeder 221 connects to the feed terminals of the third and fourth second feeders 112 from left to right; the fourth feeder 221 in the second stage connects to the feed terminals of the two fourth feeders 221 in the first stage.

[0080] In some examples, the antenna may include not only the structures described above, but also a first connector and a second connector; the first connector is electrically connected to a first feed port of the first feed structure 21; and the second connector is electrically connected to a third feed port of the second feed structure 22. In one example, the first connector and the second connector may include, but are not limited to, an SMA (Small A Type) connector.

[0081] Furthermore, Figure 9 for Figure 7 The cross-sectional view at position B is shown in the reference diagram. Figure 7 and 9 As shown, the fourth conductive layer 210 further includes first patch electrodes 23 located on both sides of the first feed port extending in the first feed structure 21; the first patch electrodes 23 are electrically connected to the third conductive layer 25 through a third connection via penetrating the second dielectric substrate 26; the fifth conductive layer further includes second patch electrodes 24 located on both sides of the third feed port extending in the first feed structure 21; the second patch electrodes 24 are electrically connected to the third conductive layer 25 through a fourth connection via penetrating the third dielectric substrate 27. The first patch electrodes 23 and the second patch electrodes 24 are provided so that the first feed port can be connected to the first connector, and the third feed port can be connected to the second connector.

[0082] In some examples, Figure 12 This is a structural plan view of the first dielectric substrate 13 according to an embodiment of this disclosure. Figure 12As shown, in this embodiment of the present disclosure, the first dielectric substrate 13 includes a first sub-dielectric layer 131, a first adhesive layer 132, a support layer 133, a second adhesive layer 134, and a second sub-dielectric layer 135 stacked together. A first conductive layer 11 is disposed on the surface of the first sub-dielectric layer 131 facing away from the first adhesive layer 132. A second conductive layer 12 is disposed on the surface of the second sub-dielectric layer 135 facing away from the second adhesive layer 134. In some examples, the materials of the first sub-dielectric layer 131 and the second sub-dielectric layer 135 include, but are not limited to, polyimide (PI) or polyethylene terephthalate (PET). The materials of the first adhesive layer 132 and the second adhesive layer 134 may be optically transparent (OCA) adhesive. The materials of the support layer 133 include, but are not limited to, polycarbonate (PC), polymers of cycloolefin (COP), or polymethyl methacrylate (PMMA).

[0083] In some examples, both the second dielectric substrate 26 and the third dielectric substrate 27 are made of flexible substrates, the materials of which include, but are not limited to, polyimide (PI) or polyethylene terephthalate (PET).

[0084] To better understand the transparent antenna structure and effects of the embodiments of this disclosure, the following is combined with... Figure 1 The diagram shown illustrates the effect of simulating the antenna structure.

[0085] Reference Figure 1 The antenna includes an antenna substrate 10 and a flexible circuit board 20. The antenna substrate 10 includes four radiating elements 100. The antenna measures 301mm × 76mm × 2.2mm (2.207λc × 0.557λc × 0.016λc, where λc is the center frequency wavelength). The spacing between the radiating elements 100 is 75mm (0.55λc).

[0086] Specifically, the antenna substrate 10 includes a first dielectric substrate 13, with a first conductive layer 11 and a second conductive layer 12 respectively disposed on both sides of the first dielectric substrate 13 in the thickness direction. Each radiating structure includes a first feed line 111, a second feed line 112, and a first isolation component 113 located in the first conductive layer 11, and a first opening 121 located in the second conductive layer 12. The second conductive layer 12 also includes a second opening 122 and a third opening 123 located between adjacent first openings 121. The flexible circuit board 20 includes a second dielectric substrate 26 and a third dielectric substrate 27 disposed opposite to each other, and a third conductive layer 25, a fourth conductive layer 210, and a fifth conductive layer. The third conductive layer 25 is disposed between the second dielectric substrate 26 and the third dielectric substrate 27, the fourth conductive layer 210 is disposed on the side of the second dielectric substrate 26 away from the third conductive layer 25, and the fifth conductive layer is disposed on the side of the third dielectric substrate 27 away from the third conductive layer 25. The fourth conductive layer 210 includes at least a first feed structure 21, a first connection pad 212, a second connection pad 214, and a third connection pad 213. The first feed structure 21 has a first feed port and at least one second feed port. The fifth conductive layer includes at least a second feed structure 22, which has a third feed port and at least one fourth feed port. The second feed ports of the first feed junctions on the fourth conductive layer 210 are connected to the first connection pads 212 in a one-to-one correspondence. The fourth feed ports of the second feed structures 22 on the fifth conductive layer are connected to the second connection pads 214 in a one-to-one correspondence through second connection vias penetrating the second dielectric substrate 26 and the third dielectric substrate 27. The third conductive layer 25 is electrically connected to the third connection pads 213 through first connection vias penetrating the second dielectric substrate 26, and the first isolation component 113 is electrically connected to the third connection pads 213. The first isolation component 113 is electrically connected to the second conductive layer 12 through side traces 30. In this embodiment of the disclosure, the first feed line 111 on the antenna substrate 10 corresponds one-to-one with the first connection pad 212, and the corresponding first feed line 111 and the first connection pad 212 are bonded together; the second feed line 112 corresponds one-to-one with the second connection pad 214, and the corresponding second feed line 112 and the second connection pad 214 are bonded together.

[0087] Figure 13 This is a schematic diagram of the S-parameters of the antenna according to an embodiment of this disclosure, as shown below. Figure 13 The diagram illustrates the return loss S11 and port isolation S21 of the antenna according to an embodiment of this disclosure. The antenna of this embodiment can cover the 2515MHz-2675MHz frequency band with a return loss of less than -15dB. Simultaneously, the port isolation within this frequency band is better than -20.6dB.

[0088] Figure 14This diagram illustrates the change in isolation before and after the introduction of the first isolation component into the antenna according to an embodiment of this disclosure. Figure 14 Before the antenna of this embodiment is introduced into the first isolation component 113, as shown in S21(1) in the figure, the isolation between the polarization ports of the radiating element 100±45° in the frequency band is better than -10.9dB. After the antenna of this embodiment is introduced into the first isolation component 113, as shown in S21(2) in the figure, the isolation between the polarization ports of the radiating element 100±45° in the frequency band is better than -16.4dB, which is an improvement of more than 5dB, and the low-frequency isolation reaches -19dB.

[0089] Figure 15 This diagram illustrates the change in isolation before and after the introduction of the second and third openings in the antenna according to an embodiment of this disclosure. Figure 15 As shown in Figure S32(1), before the antenna of this embodiment introduces the second opening 122 and the third opening 123, the isolation between adjacent radiating elements 100±45° polarization ports in the frequency band is better than -11.9dB. After the antenna of this embodiment introduces the second opening 122 and the third opening 123, as shown in Figure S32(2), the isolation between adjacent radiating elements 100±45° polarization ports in the frequency band is better than -19dB, an improvement of more than 7dB, and the low-frequency isolation reaches -21.6dB.

[0090] Figure 16 This is a schematic diagram showing the peak gain of the antenna as a function of frequency according to an embodiment of this disclosure. Figure 16 As shown, its peak gain is greater than 7.2 dBi in the operating frequency band of 2515MHz-2675MHz, which allows it to radiate a large communication range.

[0091] Figure 17 This is the radiation pattern of the antenna at the center frequency according to an embodiment of this disclosure. Figure 10 As shown, the V-plane radiation pattern has a narrow half-power beamwidth due to the formation of a quaternary linear array in this direction. The H-plane has a wider half-power beamwidth, and the introduction of the power divider expands the equivalent ground plane of the antenna H-plane, resulting in larger sidelobes on the H-plane.

[0092] Secondly, this disclosure provides an electronic device that may include the aforementioned antenna, which may be fixed to the inside of a glass window.

[0093] The glass window system in this disclosure can be used in glass window systems of automobiles, trains (including high-speed trains), airplanes, buildings, etc. The antenna can be fixed to the inside of the glass window (the side closer to the interior). Because the antenna has high optical transmittance, it does not significantly affect the transmittance of the glass window while achieving communication functions, and this type of antenna is also becoming a trend in aesthetically pleasing antenna designs. The glass window in this disclosure includes, but is not limited to, double-glazed windows; the type of glass window can also be single-glazed, laminated, thin, or thick glass.

[0094] In some examples, the electronic device provided in this disclosure further includes a transceiver unit, a radio frequency transceiver, a signal amplifier, a power amplifier, and a filtering unit. The antenna in the electronic device can function as either a transmitting antenna or a receiving antenna. The transceiver unit may include a baseband and a receiving end. The baseband provides signals in at least one frequency band, such as 2G, 3G, 4G, and 5G signals, and transmits these signals to the radio frequency transceiver. After receiving the signal, the transparent antenna in the communication system can process it through the filtering unit, power amplifier, signal amplifier, and radio frequency transceiver (not shown) before transmitting it to the receiving end in the transceiver unit. The receiving end may be, for example, a smart gateway.

[0095] Furthermore, the RF transceiver is connected to the transceiver unit and is used to modulate the signals transmitted by the transceiver unit, or to demodulate the signals received by the transparent antenna before transmitting them to the transceiver unit. Specifically, the RF transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate the various types of signals provided by the baseband before transmitting them to the antenna. The transparent antenna receives the signals and transmits them to the receiving circuit of the RF transceiver. The receiving circuit then transmits the signals to the demodulation circuit, which demodulates the signals before transmitting them to the receiving end.

[0096] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit. The filtering unit is connected to at least one antenna. During signal transmission in the communication system, the signal amplifier improves the signal-to-noise ratio (SNR) of the RF transceiver's output signal before transmitting it to the filtering unit; the power amplifier amplifies the power of the RF transceiver's output signal before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output from the signal amplifier and power amplifier, filters out clutter, and transmits them to the transparent antenna, which radiates the signal. During signal reception in the communication system, the antenna receives the signal and transmits it to the filtering unit. The filtering unit filters out clutter from the received signal and transmits it to the signal amplifier and power amplifier. The signal amplifier increases the gain of the received signal, improving the SNR; the power amplifier amplifies the power of the received signal. The signal received by the antenna, after processing by the power amplifier and signal amplifier, is transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0097] In some examples, the signal amplifier may include various types of signal amplifiers, such as low-noise amplifiers, without limitation.

[0098] In some examples, the electronic device provided in this disclosure also includes a power management unit connected to a power amplifier and providing the power amplifier with a voltage for amplifying signals.

[0099] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An antenna comprising an antenna substrate and a flexible circuit board; wherein, The antenna substrate includes: First dielectric substrate; A first conductive layer is disposed on the first dielectric substrate; the first conductive layer includes at least one first feed line and at least one second feed line; A second conductive layer is disposed on the side of the first dielectric substrate opposite to the first conductive layer; the second conductive layer includes at least one first opening; the outline of the orthographic projection of the first opening on the first dielectric substrate intersects the orthographic projections of a first feed line and a second feed line on the first dielectric substrate, and the orthographic projections of the first feed line and the second feed line on the first dielectric substrate extend into the orthographic projection of the first opening on the first dielectric substrate, and the feeding directions of the first feed line and the second feed line are different; The flexible circuit includes: The second and third dielectric substrates are disposed opposite to each other; A third conductive layer is disposed between the second dielectric substrate and the third dielectric substrate; A first power supply structure is disposed on the side of the second dielectric substrate away from the third conductive layer, and a second power supply port of the first power supply structure is electrically connected to a first power supply line. The second power supply structure is disposed on the side of the third dielectric substrate away from the third conductive layer, and a fourth power supply port of the second power supply structure is electrically connected to a second power supply line. A fourth conductive layer is disposed on the side of the second dielectric substrate opposite to the third conductive layer; the fourth conductive layer includes at least one third connection pad; the third conductive layer is electrically connected to the third connection pad through a first connection via penetrating the second dielectric substrate; the second conductive layer is electrically connected to the third connection pad. The antenna substrate includes at least one radiating element, the radiating element includes a first opening, a first feed line and a second feed line whose orthogonal projection on the first dielectric substrate intersects the orthogonal projection contour of the first opening on the first dielectric substrate; The radiating unit further includes a first isolation component located in the first conductive layer, and the first isolation component is located between the first feed line and the second feed line, and is bonded to the third connection pad; In the radiation unit, the orthographic projection of the first isolation component on the first dielectric substrate intersects with the outline of the orthographic projection of the first opening on the first dielectric substrate, and extends into the orthographic projection of the first opening on the first dielectric substrate. The number of the first openings is multiple, and the multiple first openings are arranged side by side along the first direction; the second conductive layer includes a first side and a second side arranged opposite to each other in the second direction; the flexible circuit board is closer to the first side than the second side; The second conductive layer further includes a second opening penetrating the first side, and at least one second opening is provided between adjacent first openings, and the extending direction of the second opening intersects the first direction; The second conductive layer further includes a third opening penetrating the second side, and at least one third opening is provided between adjacent first openings, and the extension direction of the third opening intersects the first direction; the second opening and the third opening are mirror-symmetrically arranged with the line connecting the centers of each first opening as the axis of symmetry.

2. The antenna according to claim 1, wherein, The fourth conductive layer further includes the first power feeding structure, at least one first connection pad, and at least one second connection pad; a second power feeding port of the first power feeding structure is electrically connected to a first connection pad, and a first feed line is bonded to a first connection pad. The flexible circuit board also includes: A fifth conductive layer is disposed on the side of the third dielectric substrate opposite to the third conductive layer. The fifth conductive layer includes a second power supply structure. A fourth power supply port of the second power supply structure is electrically connected to a second connection pad through a second connection via penetrating the second dielectric substrate and the third dielectric substrate. A second feed line is bonded to a second connection pad.

3. The antenna according to claim 1, wherein, At least one side trace is provided on the side of the first dielectric substrate; a first isolation component is electrically connected to the second conductive layer through one of the side traces.

4. The antenna according to claim 1 or 2, wherein, The length of the first isolation component is between 0.2λc and 0.25λc, where λc is the center frequency wavelength.

5. The antenna according to claim 1, wherein, The second opening extends in the second direction, and the length of the second opening is between 0.2λc and 0.25λc, where λc is the center frequency wavelength.

6. The antenna according to claim 1, wherein, The second conductive layer includes a metal mesh structure.

7. The antenna according to claim 6, wherein, The antenna substrate also includes a first connecting strip disposed on the same layer as the second conductive layer, the first connecting strip shorting the edge of the metal mesh structure near the flexible circuit board.

8. The antenna according to claim 1, wherein, The outline of the first opening comprises a polygon.

9. The antenna according to claim 8, wherein, The polygon includes a first side, a second side, a third side, a fourth side, a fifth side, a sixth side, a seventh side, and an eighth side connected in sequence; the extension direction of the first side is the same as the extension direction of the fifth side and is perpendicular to the extension direction of the third side; the first feed line and the second feed line intersect with the orthographic projections of the second side and the fifth side on the first dielectric substrate, respectively.

10. The antenna according to claim 2, wherein, The number of the first openings is 2 n The first feeding structure includes n-level third feeders, and the second feeding structure includes n-level fourth feeders; A third feeder located at level 1 connects two adjacent first feeders, and different third feeders located at level 1 connect to different first feeders; a third feeder located at level m connects two adjacent third feeders located at level m-1, and different third feeders located at level m connect to different third feeders located at level m-1. A fourth feeder located at level 1 connects to two adjacent second feeders, and different fourth feeders at level 1 connect to different second feeders; a fourth feeder located at level m connects to two adjacent fourth feeders at level (m-1), and different fourth feeders at level m connect to different fourth feeders at level (m-1); where n≥2, 2≤m≤n, and m and n are both integers; At least one of the third feed line and the fourth feed line is a microstrip line.

11. The antenna according to claim 10, wherein, Both the third feeder and the fourth feeder have two feed terminals; the feed terminal of the third feeder located in the first stage serves as the second feed port of the first feeder structure; the feed port of the fourth feeder located in the first stage serves as the fourth feed port of the first feeder structure; the first feed port of the first feeder structure is connected to the third feeder located in the nth stage; the third feed port of the second feeder structure is connected to the fourth feeder located in the nth stage. The antenna further includes a first connector and a second connector; the first connector is electrically connected to the first feed port of the first feed structure. The second connector is electrically connected to the third power supply port of the second power supply structure.

12. The antenna according to claim 11, wherein, The fourth conductive layer further includes first patch electrodes located on both sides of the first feed port extension direction of the first feed structure; the first patch electrodes are electrically connected to the third conductive layer through a third connection via penetrating the second dielectric substrate. The fifth conductive layer further includes second patch electrodes located on both sides of the extension direction of the third feed port of the first feed structure; the second patch electrodes are electrically connected to the third conductive layer through a fourth connection via penetrating the third dielectric substrate.

13. The antenna according to claim 1, wherein, The first dielectric substrate includes a first sub-dielectric layer, a first adhesive layer, a support layer, a second adhesive layer, and a second sub-dielectric layer stacked together; the first conductive layer is disposed on the side of the first sub-dielectric layer opposite to the first adhesive layer; and the second conductive layer is disposed on the side of the second sub-dielectric layer opposite to the second adhesive layer.

14. The antenna according to claim 13, wherein, The material of the support layer includes any one of polycarbonate plastic, cyclic olefin polymer plastic, and acrylic / plexiglass.

15. The antenna according to claim 13, wherein, The material of the first sub-dielectric layer and / or the second sub-dielectric layer includes polyimide or polyethylene terephthalate.

16. An electronic device comprising the antenna according to any one of claims 1-15.

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