Visual inspection system and four-axis full-linear PCB drilling machine

Abstract

The application belongs to the technical field of circuit board processing equipment, and particularly relates to a visual detection system and a four-axis full-linear PCB drilling machine, which comprises a bed body, the top end of the bed body is provided with symmetrically designed beam pads, and the side, away from the bed body, of the beam pad is fixedly provided with a beam body; a motion control system; and a constant temperature control assembly, which is installed on a Y-axis table assembly and a Z-axis drilling assembly and used for controlling PCB constant temperature processing; the cooling mechanism and the constant temperature mechanism are used in combination, constant temperature air is sent from the periphery to the center during PCB drilling operation, constant temperature treatment is performed on the PCB, cooling air is sent from the drilling position to the periphery, the temperature of the PCB is relatively uniform, the shrinkage and expansion degrees of each part of the PCB are relatively uniform, and the negative influence of the expansion and shrinkage of the PCB on the processing precision is effectively reduced.

Description

Technical Field

[0001] This invention belongs to the technical field of circuit board processing equipment, specifically a vision inspection system and a four-axis fully linear PCB drilling machine. Background Technology

[0002] In the processing of PCBs, IC packaging substrates and other materials, drilling is one of the important steps in the processing technology. In the drilling process, holes are made in the material mainly by means of machinery or lasers. As the integration level of PCBs increases, the requirements for PCB drilling hole diameter and gap are getting smaller and smaller, which makes the precision of PCB drilling machines used for drilling increasingly higher and higher.

[0003] In mechanical drilling processes, PCB drilling often employs fully linear drilling machines. Through the rotation of the drill bit and the movement of the drilling machine along the X, Y, and Z axes, dense holes are drilled into the board material. Because mechanical drilling primarily relies on the rotation and cutting between the drill bit and the board, the high-speed friction between them generates a significant amount of frictional heat. This heat accumulates on both the drill bit and the board, causing the drill bit to break and wear easily. Furthermore, temperature changes cause both the board material and the drilling machine's coordinate system to expand or contract. Due to the different materials used, the board material experiences a higher degree of thermal deformation, and the varying locations of heat concentration result in uneven expansion and contraction. Currently, when using vision inspection systems to position boards in drilling machines, point positioning is typically employed. Before processing, positioning points on the board are picked up, and then, in conjunction with the XY motion control system, these positioning points are aligned with the origin of the processing program. Subsequently, the drilling machine drives the board and drill bit to move in the XYZ coordinate system under a pre-set program, thereby drilling holes in the board. Therefore, the shrinkage and unevenness of the board can lead to reduced drilling accuracy and changes in hole diameter, and in severe cases, even scrap the board. This is especially true in IC packaging substrates with densely packed holes, where the heat generated during the drilling of the front holes has a significant impact on the accuracy of the subsequent holes.

[0004] In related technologies, to reduce the impact of ambient temperature and board temperature on the accuracy of drilling processes, heat dissipation and cooling methods are usually adopted to accelerate the dissipation of heat generated during drilling, thereby reducing the degree of temperature change of the board. Alternatively, compensation methods are adopted, which measure the expansion and contraction of the board in real time during processing and select an appropriate compensation amount. For example, the drilling machine and its processing compensation method and device published in Chinese Patent Application No. 2021104129435 reduce the impact of temperature on the processing accuracy of the board through compensation and other methods. However, in practical applications, it has been found that conventional cooling and heat dissipation systems usually adopt a uniform heat dissipation method when dissipating heat from the board. During the heat dissipation process, not only can the heat dissipation efficiency not be adjusted according to the heat distribution, but the heat dissipation effect is not ideal due to the obstruction of the cover plate and the base plate. In view of this, the present invention proposes a vision inspection system and a four-axis fully linear PCB drilling machine to solve the above-mentioned technical problems.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the present invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] To overcome the shortcomings of existing technologies and solve the aforementioned technical problems, this invention proposes a vision inspection system and a four-axis fully linear PCB drilling machine.

[0007] The technical solution adopted by the present invention to solve its technical problem is: the four-axis fully linear PCB drilling machine of the present invention includes a bed, the top of the bed is equipped with a symmetrically designed crossbeam pad, and the crossbeam body is fixedly installed on the side of the crossbeam pad away from the bed;

[0008] A motion control system, comprising an X-axis assembly, a Y-axis assembly, and a Z-axis assembly;

[0009] The X-axis assembly is fixedly installed on one side of the crossbeam body, and an X-axis moving end plate is slidably installed on the X-axis assembly.

[0010] The Y-axis assembly is fixedly installed on the top of the bed, and a Y-axis table assembly is installed on the Y-axis assembly;

[0011] The Z-axis assembly is fixedly mounted on the X-axis moving end plate, and a Z-axis drilling assembly is mounted on the Z-axis assembly;

[0012] It also includes a temperature control component, which is installed on the Y-axis table assembly and the Z-axis drilling assembly. The temperature control component is used to control the constant temperature processing of PCB.

[0013] The constant temperature control component includes a temperature control frame, which is mounted on the Y-axis table assembly. During processing, the temperature control frame surrounds the PCB board. A flow channel is provided on the temperature control frame to guide airflow onto the PCB board.

[0014] A cooling mechanism is connected to the Z-axis drilling assembly and moves synchronously with the Z-axis drilling assembly. The cooling mechanism cools the PCB board by outputting low-temperature airflow.

[0015] A temperature control mechanism is installed on a temperature control frame. The temperature control mechanism preheats the PCB board by outputting a constant temperature airflow, and the output temperature of the temperature control mechanism is constant.

[0016] Preferably, the cooling mechanism and the constant temperature mechanism include at least an air pump, an air duct, and a temperature controller. The air pump is used to deliver air, the air duct is connected to the output end of the air pump, and the temperature controller is installed on the air duct to control the airflow temperature inside the air duct.

[0017] The air pump and air duct of the cooling mechanism are both installed on the Z-axis drilling assembly, and the air duct outputs airflow vertically to the PCB board.

[0018] The air pump and air guide pipe corresponding to the constant temperature mechanism are installed on the Y-axis platform assembly, and the air guide pipe extends into the drainage groove.

[0019] Preferably, a support plate is installed on the Y-axis platform assembly. The support plate is a multi-layer structure and includes at least a perforated plate layer and a ventilation layer.

[0020] The perforated plate layer is made of a plate with uniformly distributed micropores on its surface, and the perforated plate layer is located on the uppermost side;

[0021] The ventilation layer is composed of multiple top blocks, and the multiple top blocks form a flow channel, which is used to guide the airflow. The ventilation layer is fixedly installed below the perforated plate layer.

[0022] The number of drainage channels is at least two, and they correspond to the ventilation layer and the upper surface of the PCB board, respectively.

[0023] Preferably, the cooling mechanism further includes an extension rod and a diverter pipe. The extension rod is fixedly installed on the Z-axis drilling assembly, and a diverter pipe is also fixedly installed on the air guide pipe of the cooling mechanism. The diverter pipe extends to the bottom of the PCB board under the guidance of the extension rod.

[0024] The pallet also includes a frame layer, which is fixedly installed below the top block. A movable groove is provided on the frame layer, and the movable groove is connected to the flow channel. The extension rod and the diversion pipe extend into the movable groove, and one end of the diversion pipe is located in the movable groove with its opening vertically upward.

[0025] Preferably, a reinforcing rib is also installed in the movable groove. The reinforcing rib is fixedly connected to the top block and is used to cooperate with the frame layer to provide support for the top block.

[0026] Preferably, the constant temperature mechanism further includes a reflux ring and a negative pressure pipe. There are two reflux rings, which are respectively fixedly installed on the Z-axis drilling assembly and the extension rod. The reflux ring is a cavity structure. The reflux ring has evenly distributed reflux holes on the side near the PCB board. A negative pressure pipe is installed at the air pump input end of the constant temperature mechanism. The negative pressure pipe is electrically connected to the inner cavity of the reflux ring. The negative pressure pipe is made of heat-insulating pipe material.

[0027] Preferably, the top blocks are all frustum-shaped, and the cross-section of the top block facing the perforated plate layer is small.

[0028] Preferably, a cover plate is elastically connected to the Z-axis assembly via a spring telescopic rod. The cover plate is made of transparent material and is fixedly installed above the return ring. A through groove is provided on the cover plate, and the Z-axis drilling assembly is designed to be non-contact with the through groove.

[0029] Preferably, the constant temperature control component further includes a preheating mechanism, which is installed on the bed. The preheating mechanism includes a preheating box and a preheating pipe. The preheating box has evenly distributed partitions fixedly installed inside. The preheating box is used to store PCB boards. A preheating pipe is installed on the air guide pipe corresponding to the constant temperature mechanism, and the preheating pipe extends into the preheating box.

[0030] A visual inspection system, which further includes an image acquisition system, a temperature detection system, and a processing algorithm;

[0031] The image acquisition system is used to acquire image or video data from cameras, sensors or other devices. This data is used to acquire and store images in real time during the operation of the four-axis full-linear PCB drilling machine.

[0032] The temperature detection system collects temperature distribution data on the Y-axis platform assembly in real time using an infrared sensor.

[0033] The processing algorithm is used to process and enhance the acquired images or videos, including noise reduction, filtering, and contrast enhancement. It is also used to process and enhance the acquired temperature distribution data, and to adjust the temperature parameters of the temperature controllers in the constant temperature mechanism and the cooling mechanism in real time according to the set threshold.

[0034] The beneficial effects of this invention are as follows:

[0035] 1. The vision inspection system and four-axis fully linear PCB drilling machine described in this invention, by setting up a cooling mechanism and a constant temperature mechanism in combination, delivers a constant temperature airflow from all sides to the center during the PCB drilling operation to perform constant temperature treatment on the PCB board. At the same time, a cooling airflow is delivered from the drilling position to all sides, thereby making the temperature of the PCB board more uniform. At this time, the degree of expansion and contraction of various parts of the PCB board is more uniform, thus effectively reducing the negative impact of PCB board expansion and contraction on processing accuracy.

[0036] 2. The vision inspection system and four-axis fully linear PCB drilling machine described in this invention draw in outside air through a return hole, and then collect the constant-temperature airflow, so that the constant-temperature airflow re-enters the constant-temperature mechanism, and after being processed by the temperature controller, it is used again to control the temperature of the PCB board. Since the standard temperature of the airflow output by the constant-temperature mechanism is between the ambient temperature and the temperature of the drilling part of the PCB board, the energy consumed in heating the airflow can be effectively reduced by recycling and reusing the airflow output by the constant-temperature mechanism. Attached Figure Description

[0037] The invention will now be further described with reference to the accompanying drawings.

[0038] Figure 1 This is a perspective view of the present invention;

[0039] Figure 2 This is a perspective view of the invention from another angle;

[0040] Figure 3 This is a three-dimensional view of part of the structure of the present invention;

[0041] Figure 4 This is a split diagram of the temperature control component and the Z-axis component;

[0042] Figure 5 This is a partial 3D view of the temperature control component;

[0043] Figure 6 This is a breakdown diagram of the Y-axis assembly and the temperature control assembly;

[0044] Figure 7 This is a breakdown diagram of the tray;

[0045] Figure 8 yes Figure 7 A magnified view of a section at point A in the middle;

[0046] Figure 9 This is a partial sectional view of the pallet;

[0047] In the diagram: 100, Bed; 101, Crossbeam Pad; 102, Crossbeam Body; 200, X-axis Assembly; 201, Y-axis Assembly; 202, Z-axis Assembly; 203, X-axis Moving End Plate; 204, Y-axis Table Assembly; 205, Z-axis Drilling Assembly; 300, Temperature Control Frame; 301, Drainage Channel; 302, Air Pump; 303, Air Guide Pipe; 304, Temperature Controller; 30 5. Extension rod; 306. Diverter pipe; 307. Return ring; 308. Negative pressure pipe; 309. Return hole; 30A. Cover plate; 30B. Through groove; 400. Support plate; 401. Orifice plate layer; 402. Ventilation layer; 403. Top block; 404. Flow channel; 405. Frame layer; 406. Moving groove; 407. Reinforcing rib; 500. Preheating box; 501. Preheating pipe. Detailed Implementation

[0048] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0049] like Figures 1 to 9 As shown, the four-axis fully linear PCB drilling machine of the present invention includes a bed 100, a symmetrically designed crossbeam pad 101 is installed on the top of the bed 100, and a crossbeam body 102 is fixedly installed on the side of the crossbeam pad 101 away from the bed 100.

[0050] A motion control system, comprising an X-axis assembly 200, a Y-axis assembly 201, and a Z-axis assembly 202;

[0051] The X-axis assembly 200 is fixedly installed on one side of the crossbeam body 102, and an X-axis moving end plate 203 is slidably installed on the X-axis assembly 200.

[0052] The Y-axis assembly 201 is fixedly installed on the top of the bed 100, and the Y-axis table assembly 204 is installed on the Y-axis assembly 201.

[0053] The Z-axis assembly 202 is fixedly mounted on the X-axis moving end plate 203, and the Z-axis drilling assembly 205 is mounted on the Z-axis assembly 202;

[0054] It also includes a temperature control component, which is installed on the Y-axis table assembly 204 and the Z-axis drilling assembly 205. The temperature control component is used to control the constant temperature processing of PCB.

[0055] The constant temperature control component includes a temperature control frame 300, which is mounted on the Y-axis table assembly 204. During processing, the temperature control frame 300 surrounds the PCB board. A flow channel 301 is provided on the temperature control frame 300, which is used to guide airflow onto the PCB board.

[0056] A cooling mechanism is connected to the Z-axis drilling assembly 205 and moves synchronously with the Z-axis drilling assembly 205. The cooling mechanism cools the PCB board by outputting low-temperature airflow.

[0057] A constant temperature mechanism is installed on the temperature control frame 300. The constant temperature mechanism preheats the PCB board by outputting a constant temperature airflow, and the output temperature of the constant temperature mechanism is constant.

[0058] In PCB board drilling operations, the PCB board usually has different degrees of thermal expansion and contraction under different temperature environments. During drilling, a large amount of heat is generated under friction. In addition, the temperature of the processing environment will also change over time, causing the PCB board to undergo different degrees of expansion and contraction, which has a significant impact on the processing of high-precision PCB boards.

[0059] In related technologies, to reduce the impact of temperature on the expansion and contraction of PCB boards, PCB boards are usually processed in a temperature-controlled workshop and equipped with an air cooling system to cool the PCB boards during drilling. However, the temperature control of the workshop usually fluctuates within a certain temperature range, and there is a certain time delay in heat dissipation during air cooling. Therefore, it is easy to cause poor temperature uniformity of the PCB board during processing. There is usually a temperature difference between the processed and unprocessed areas, resulting in different expansion and contraction of different parts of the PCB board. In order to reduce the temperature difference between different parts of the PCB board, this invention sets up a temperature control component to control the temperature of the PCB board. During processing, the processing area is cooled, and the parts far from the processing area are heated at a constant temperature. This makes the temperature difference between different parts of the PCB board smaller, thereby enhancing the temperature during PCB drilling.

[0060] Specifically, during drilling, the PCB board is mounted on the Y-axis table assembly 204. Under the control of a pre-set program, the X-axis assembly 200, Y-axis assembly 201, and Z-axis assembly 202 move in the X, Y, and Z axes, respectively, cooperating with the Y-axis table assembly 204 and the Z-axis drilling assembly 205 to drill holes in the PCB board. During this process, a temperature control component maintains a constant temperature for the PCB board. When the Z-axis drilling assembly 205 drills the PCB board, the heat generated by friction accumulates at the drilling location. At this time, a cooling mechanism connected to the Z-axis drilling assembly 205 delivers cooling airflow around the PCB drilling hole. The cooling airflow exchanges heat with the PCB board, causing the temperature at the drilling location to drop rapidly. After the airflow comes into contact with the PCB board, it changes its flow direction, thereby diffusing the heat to the surrounding areas of the drilling location. Simultaneously, the temperature control mechanism maintains a constant temperature. An airflow at ambient temperature is delivered into the temperature control frame 300 and guided by the flow channel 301 on the temperature control frame 300, causing the constant temperature airflow to flow from the edge of the PCB board to the center. During the flow, the constant temperature airflow heats the PCB board, and together with the cooling airflow diffused from the drilling position, the temperature of the PCB board is adjusted. After being heated by the constant temperature mechanism, the temperature of the PCB board in the non-drilled position increases. After being cooled by the cooling mechanism, the temperature of the PCB board in the drilled position decreases, thereby reducing the temperature difference between the two and reducing the temperature difference between various parts of the PCB board during processing, thereby enhancing the drilling accuracy of the PCB board. It should be noted that the PCB drilling process and the adjustment and determination of drilling parameters in this invention are all carried out at the temperature corresponding to the constant temperature mechanism. Therefore, when the temperature of the PCB board tends to the temperature of the constant temperature mechanism, the processing technology and the temperature of the PCB board are more compatible.

[0061] In this invention, a cooling mechanism and a temperature-regulating mechanism are used together. During the PCB drilling process, a constant-temperature airflow is delivered from the periphery to the center to maintain the temperature of the PCB board. At the same time, a cooling airflow is delivered from the drilling position to the periphery, which makes the temperature of the PCB board more uniform. At this time, the expansion and contraction of various parts of the PCB board are more uniform, thus effectively reducing the negative impact of the expansion and contraction of the PCB board on the processing accuracy.

[0062] In a preferred embodiment of the present invention, the cooling mechanism and the constant temperature mechanism include at least an air pump 302, an air duct 303 and a temperature controller 304. The air pump 302 is used to transport air, the air duct 303 is connected to the output end of the air pump 302, and the temperature controller 304 is installed on the air duct 303 to control the airflow temperature in the air duct 303.

[0063] The air pump 302 and air guide pipe 303 corresponding to the cooling mechanism are both installed on the Z-axis drilling assembly 205, and the air guide pipe 303 outputs airflow vertically to the PCB board.

[0064] The air pump 302 and air guide pipe 303 corresponding to the constant temperature mechanism are installed on the Y-axis table assembly 204, and the air guide pipe 303 extends into the drainage groove 301.

[0065] In practical applications, both the cooling mechanism and the constant temperature mechanism include an air pump 302, an air guide pipe 303, and a temperature controller 304. During actual drilling operations, the cooling mechanism is connected to the Z-axis drilling assembly 205. The air pump 302 and the air guide pipe 303 are mounted on the Z-axis drilling assembly 205. When the air pump 302 is working, it draws in the surrounding air, pressurizes the air, and pumps it into the air guide pipe 303. The air flows along the air guide pipe 303, and during this flow, the gas enters the temperature controller 304. The temperature controller 304 used in this invention is a temperature control instrument with heating and cooling functions. After setting the parameters before processing, it can heat or cool the airflow according to the preset values, so that the temperature of the output airflow is close to the preset value. Therefore, the airflow in the air guide pipe 303 of the cooling mechanism passes through the temperature controller. 304 performs cooling treatment, and finally, low-temperature airflow is output from the end of the air guide pipe 303. The low-temperature airflow is vertically sprayed around the drilled part of the PCB board to cool the drilled part of the PCB board. The cooling mechanism is installed on the Z-axis drilling assembly 205 and moves synchronously with the Z-axis drilling assembly 205, so as to continuously cool the drilled part. Similarly, after the air pump 302 in the constant temperature mechanism draws airflow, it is delivered to the guide groove 301 on the temperature control frame 300 through the air guide pipe 303 and the temperature controller 304. Under the guidance of the guide groove 301, it is sprayed onto the PCB board, thereby performing constant temperature treatment on the PAB board and the unprocessed parts of the PCB board, effectively reducing the temperature difference between different parts of the PCB board.

[0066] In a preferred embodiment of the present invention, a support plate 400 is installed on the Y-axis platform assembly 204. The support plate 400 is a multi-layer structure and includes at least a perforated plate layer 401 and a ventilation layer 402.

[0067] The perforated plate layer 401 is made of a plate with uniformly distributed micropores on its surface, and the perforated plate layer 401 is located on the uppermost side;

[0068] The ventilation layer 402 is composed of multiple top blocks 403, and the multiple top blocks 403 form a flow channel 404, which is used to guide the airflow. The ventilation layer 402 is fixedly installed below the perforated plate layer 401.

[0069] The number of drainage channels 301 is at least two, and they correspond to the ventilation layer 402 and the upper surface of the PCB board, respectively.

[0070] In actual processing, simply blowing a constant-temperature airflow onto one side of the PCB board results in weak temperature control. Therefore, by setting up a perforated plate layer 401 and a ventilation layer 402, along with double airflow channels 301, when the air guide pipe 303 delivers the constant-temperature airflow into the airflow channels 301, the airflow splits under the action of the airflow channels 301, flowing towards the upper and lower sides of the PCB board. The upward-flowing airflow blows onto the surface of the PCB board, while the downward-flowing constant-temperature airflow enters the ventilation layer 402. Because the ventilation layer 402... 02 consists of multiple uniformly arranged top blocks 403, and the top blocks 403 form a flow channel 404. Therefore, the airflow is uniformly dispersed under the guidance of the flow channel 404, and then contacts the PCB board through the micro-holes on the perforated plate layer to achieve constant temperature control on both sides of the PCB board. It should be noted that during the processing of the PCB board, its top surface is covered with a cover plate and its bottom is covered with a pad. Therefore, the airflow does not directly contact the PCB board, but exchanges heat with the PCB board through the heat conduction of the cover plate and the pad, thereby achieving constant temperature control of the PCB board.

[0071] As a preferred embodiment of the present invention, the cooling mechanism further includes an extension rod 305 and a diversion pipe 306. The extension rod 305 is fixedly installed on the Z-axis drilling assembly 205, and the diversion pipe 306 is also fixedly installed on the air guide pipe 303 of the cooling mechanism. The diversion pipe 306 extends to the bottom of the PCB board under the guidance of the extension rod 305.

[0072] The pallet 400 also includes a frame layer 405, which is fixedly installed below the top block 403. A movable groove 406 is provided on the frame layer 405, and the movable groove 406 is conductively connected to the flow channel 404. The extension rod 305 and the diversion pipe 306 extend into the movable groove 406, and one end of the diversion pipe 306 is vertically upward inside the movable groove 406.

[0073] During PCB board drilling, friction occurs between the drill bit and the board, generating frictional heat. This heat is conducted or dissipated in all directions. At this time, the cooling mechanism's air duct 303 delivers a low-temperature airflow, which is then split during delivery. A portion of the low-temperature airflow is sprayed onto the PCB board from the air duct 303, while the other portion enters the diversion pipe 306 installed on the extension rod 305. This diversion pipe then flows into the moving groove 406, passing through the moving groove 406, the ventilation layer 402, and the perforated plate layer 401, before contacting the underside of the PCB board. The contact allows for simultaneous cooling of both the upper and lower sides of the PCB board processing area, effectively enhancing the cooling effect on the drilling area of ​​the PCB board. The frame layer 405 and the moving slot 406 ensure that the extension rod 305 moves synchronously when the Z-axis drilling assembly 205 moves. The presence of the moving slot 406 prevents movement conflicts between the extension rod 305 and the frame layer 405, allowing the air duct 303 and the diverter 306 to always be positioned on the upper and lower sides of the drilling area of ​​the PCB board, maintaining the heat dissipation effect on the PCB board.

[0074] In a preferred embodiment of the present invention, a reinforcing rib 407 is also installed in the movable groove 406. The reinforcing rib 407 is fixedly connected to the top block 403 and is used to cooperate with the frame layer 405 to provide support for the top block 403.

[0075] The reinforcing rib 407 provides support for the top block 403. During actual installation, the frame layer 405 is fixedly installed on the Y-axis platform assembly 204, the reinforcing rib 407 is fixedly installed at the opening of the moving slot 406, and the top block 403 is fixed at one end to the edge of the reinforcing rib 407 and the frame layer 405, and at the other end to the lower surface of the perforated plate layer 401. The PCB board is fixed above the perforated plate layer 401 during installation, which can provide stable support for it.

[0076] In a preferred embodiment of the present invention, the constant temperature mechanism further includes a return ring 307 and a negative pressure tube 308. There are two return rings 307, which are respectively fixedly installed on the Z-axis drilling assembly 205 and the extension rod 305. The return ring 307 is a cavity structure. The return ring 307 has uniformly distributed return holes 309 on the side near the PCB board. A negative pressure tube 308 is installed at the input end of the air pump 302 of the constant temperature mechanism. The negative pressure tube 308 is electrically connected to the inner cavity of the return ring 307. The negative pressure tube 308 is made of heat-insulating tubing.

[0077] In actual constant temperature control, the airflow output by the constant temperature mechanism diffuses on both the top and bottom sides of the PCB board. To enhance the energy efficiency of the PCB board temperature control, a negative pressure pipe 308 and a return ring 307 are set up, and the return ring 307 is fixedly installed on the Z-axis drilling assembly 205 and the extension rod 305. Therefore, the airflow output by the constant temperature mechanism diffuses from the outside of the return ring 307 towards the center of the return ring 307. Since the negative pressure pipe 308 is installed on the input end of the air pump 302, when the air pump 302 draws airflow, it causes the negative pressure pipe 308 to generate negative pressure. The negative pressure acts on the return ring 307 and draws in outside air through the return hole 309, thereby collecting the constant temperature airflow, so that the constant temperature airflow re-enters the constant temperature mechanism and passes through the temperature controller 30. 4. After processing, it is used again for constant temperature control of PCB board. Since the standard temperature of the airflow output by the constant temperature mechanism is between the ambient temperature and the temperature of the drilled part of the PCB board, the energy consumed by heating the airflow can be effectively reduced by recycling and reusing the airflow output by the constant temperature mechanism. It should be noted that although the low temperature airflow output by the cooling mechanism also flows towards the return hole 309 on the return ring 307 during the airflow recycling process, on the one hand, the temperature of the cooling airflow has increased after heat exchange treatment, and on the other hand, the flow rate of the cooling airflow is less than the flow rate of the airflow output by the constant temperature mechanism. Therefore, the energy consumption required for heating is lower when recycling the airflow compared to directly drawing outside air for heating.

[0078] In a preferred embodiment of the present invention, the top blocks 403 are all frustum-shaped, and the cross section of the top block 403 facing the perforated plate layer 401 is small;

[0079] By designing the top block 403 as a frustum shape and making the cross-section of the top block 403 facing the perforated plate layer 401 small, the diameter of the cross-section of the flow channel 404 formed by the top block 403 changes from top to bottom. Combined with the shielding of the reinforcing rib 407, the flow channel 404 has a large conducting area with the perforated plate layer 401 and a small conducting area with the moving groove 406 below, thereby effectively reducing the efficiency of the downward diffusion of the airflow delivered by the constant temperature mechanism.

[0080] In a preferred embodiment of the present invention, a cover plate 30A is elastically connected to the Z-axis assembly 202 via a spring telescopic rod. The cover plate 30A is made of transparent material and is fixedly installed above the return ring 307. A through groove 30B is provided on the cover plate 30A. The Z-axis drilling assembly 205 is designed to be non-contact with the through groove 30B.

[0081] By installing a cover plate 30A on the Z-axis assembly 202 and using a spring telescopic rod for elastic installation, the cover plate 30A moves synchronously with the Z-axis assembly 202 when the Z-axis assembly 202 moves. When the Z-axis drilling assembly 205 drills downwards, it moves through the through slot 30B on the cover plate 30A. During the constant temperature control process, the airflow delivered by the constant temperature mechanism flows above the PCB board and gradually moves towards the return ring 307. The presence of the cover plate 30A can reduce the probability of the airflow delivered by the constant temperature mechanism flowing outward when the return ring 307 recovers the airflow. The flow path of the airflow delivered by the cooling mechanism is more consistent with the through slot 30B. Therefore, when the flow direction of the airflow delivered by the cooling mechanism changes, it can contact the Z-axis drilling assembly 205 corresponding to the through slot 30B. On the one hand, it can cool the Z-axis drilling assembly 205, and on the other hand, it can reduce the proportion of low-temperature airflow in the airflow extracted by the return ring 307.

[0082] In a preferred embodiment of the present invention, the constant temperature control component further includes a preheating mechanism, which is installed on the bed 100. The preheating mechanism includes a preheating box 500 and a preheating pipe 501. The preheating box 500 is fixedly installed with evenly distributed partitions. The preheating box 500 is used to store PCB boards. The preheating pipe 501 is installed on the air guide pipe 303 corresponding to the constant temperature mechanism. The preheating pipe 501 extends into the preheating box 500.

[0083] The preheating mechanism can pre-treat the unprocessed PCB board, thus ensuring that the board is in a constant temperature state before processing. Specifically, the airflow delivered by the constant temperature mechanism flows along the air guide pipe 303 and is diverted by the preheating pipe 501, flowing into the preheating box 500 to preheat the PCB board placed on the partition, thereby enhancing the constant temperature state during PCB board processing.

[0084] A visual inspection system, which further includes an image acquisition system, a temperature detection system, and a processing algorithm;

[0085] The image acquisition system is used to acquire image or video data from cameras, sensors or other devices. This data is used to acquire and store images in real time during the operation of the four-axis full-linear PCB drilling machine.

[0086] The temperature detection system collects temperature distribution data on the Y-axis platform assembly 204 in real time using an infrared sensor.

[0087] The processing algorithm is used to process and enhance the acquired images or videos, including noise reduction, filtering, and contrast enhancement. It is also used to process and enhance the acquired temperature distribution data, and adjust the temperature parameters of the temperature controller 304 in the constant temperature mechanism and cooling mechanism in real time according to the set threshold.

[0088] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A four-axis fully linear PCB drilling machine, including a bed (100), wherein a symmetrically designed crossbeam pad (101) is installed on the top of the bed (100), and a crossbeam body (102) is fixedly installed on the side of the crossbeam pad (101) away from the bed (100). A motion control system, comprising an X-axis assembly (200), a Y-axis assembly (201), and a Z-axis assembly (202). The X-axis assembly (200) is fixedly installed on one side of the crossbeam body (102), and an X-axis moving end plate (203) is slidably installed on the X-axis assembly (200). The Y-axis assembly (201) is fixedly installed on the top of the bed (100), and a Y-axis table assembly (204) is installed on the Y-axis assembly (201). The Z-axis assembly (202) is fixedly mounted on the X-axis moving end plate (203), and a Z-axis drilling assembly (205) is mounted on the Z-axis assembly (202). Its features are: It also includes a temperature control component, which is installed on the Y-axis table assembly (204) and the Z-axis drilling assembly (205). The temperature control component is used to control the constant temperature processing of the PCB. The constant temperature control component includes a temperature control frame (300), which is mounted on the Y-axis table assembly (204). During processing, the temperature control frame (300) surrounds the PCB board. A flow channel (301) is provided on the temperature control frame (300), which is used to guide the airflow to flow onto the PCB board. The cooling mechanism is connected to the Z-axis drilling assembly (205) and moves synchronously with the Z-axis drilling assembly (205). The cooling mechanism cools the PCB board by outputting low-temperature airflow. A constant temperature mechanism is installed on a temperature control frame (300). The constant temperature mechanism preheats the PCB board by outputting a constant temperature airflow. The output temperature of the constant temperature mechanism is constant. The cooling mechanism and the constant temperature mechanism include at least an air pump (302), an air duct (303), and a temperature controller (304). The air pump (302) is used to transport air. The air duct (303) is connected to the output end of the air pump (302). The temperature controller (304) is installed on the air duct (303) and is used to control the airflow temperature in the air duct (303). The air pump (302) and air guide pipe (303) corresponding to the cooling mechanism are both installed on the Z-axis drilling assembly (205), and the air guide pipe (303) outputs airflow vertically to the PCB board. The air pump (302) and air guide pipe (303) corresponding to the constant temperature mechanism are installed on the Y-axis table assembly (204), and the air guide pipe (303) extends into the drainage groove (301); The Y-axis platform assembly (204) is equipped with a tray (400), which is a multi-layer structure and includes at least a perforated plate layer (401) and a ventilation layer (402). The perforated plate layer (401) is made of a plate with uniformly distributed micropores on its surface, and the perforated plate layer (401) is located on the uppermost side; The ventilation layer (402) is composed of multiple top blocks (403), and the multiple top blocks (403) form a flow channel (404) between them. The flow channel (404) is used to guide the airflow. The ventilation layer (402) is fixedly installed below the perforated plate layer (401). The number of drainage channels (301) is at least two, and they correspond to the ventilation layer (402) and the upper surface of the PCB board, respectively.

2. The four-axis fully linear PCB drilling machine according to claim 1, characterized in that: The cooling mechanism also includes an extension rod (305) and a diversion pipe (306). The extension rod (305) is fixedly installed on the Z-axis drilling assembly (205). A diversion pipe (306) is also fixedly installed on the air guide pipe (303) of the cooling mechanism. The diversion pipe (306) extends to the bottom of the PCB board under the guidance of the extension rod (305). The pallet (400) also includes a frame layer (405), which is fixedly installed below the top block (403). A movable groove (406) is provided on the frame layer (405), and the movable groove (406) is connected to the flow channel (404). The extension rod (305) and the diversion pipe (306) extend into the movable groove (406), and one end of the diversion pipe (306) is vertically upward inside the movable groove (406).

3. The four-axis fully linear PCB drilling machine according to claim 2, characterized in that: The movable slot (406) is also equipped with a reinforcing rib (407), which is fixedly connected to the top block (403) and is used to cooperate with the frame layer (405) to provide support for the top block (403).

4. The four-axis fully linear PCB drilling machine according to claim 3, characterized in that: The constant temperature mechanism also includes a return ring (307) and a negative pressure tube (308). There are two return rings (307), which are fixedly installed on the Z-axis drilling assembly (205) and the extension rod (305) respectively. The return ring (307) is a cavity structure. The return ring (307) has uniformly distributed return holes (309) on the side near the PCB board. A negative pressure tube (308) is installed at the input end of the air pump (302) of the constant temperature mechanism. The negative pressure tube (308) is connected to the inner cavity of the return ring (307). The negative pressure tube (308) is made of heat-insulating pipe material.

5. The four-axis fully linear PCB drilling machine according to claim 4, characterized in that: All the top blocks (403) are designed in a frustum shape, and the cross section of the top block (403) facing the perforated plate layer (401) is small.

6. The four-axis fully linear PCB drilling machine according to claim 5, characterized in that: The Z-axis assembly (202) is elastically connected to a cover plate (30A) via a spring telescopic rod. The cover plate (30A) is made of transparent material and is fixedly installed above the return ring (307). A through groove (30B) is provided on the cover plate (30A). The Z-axis drilling assembly (205) and the through groove (30B) are designed to be non-contact.

7. The four-axis fully linear PCB drilling machine according to claim 6, characterized in that: The constant temperature control component also includes a preheating mechanism, which is installed on the bed (100). The preheating mechanism includes a preheating box (500) and a preheating pipe (501). The preheating box (500) is fixedly installed with evenly distributed partitions. The preheating box (500) is used to store PCB boards. The preheating pipe (501) is installed on the air guide pipe (303) corresponding to the constant temperature mechanism. The preheating pipe (501) extends into the preheating box (500).

8. A visual inspection system, characterized in that: The vision inspection system includes the four-axis fully linear PCB drilling machine according to any one of claims 1-7, and the vision inspection system further includes an image acquisition system, a temperature detection system, and a processing algorithm; The image acquisition system is used to acquire image or video data from cameras, sensors or other devices. This data is used to acquire and store images in real time during the operation of the four-axis full-linear PCB drilling machine. The temperature detection system collects temperature distribution data on the Y-axis platform assembly (204) in real time using an infrared sensor; The processing algorithm is used to process and enhance the acquired images or videos, including noise reduction, filtering, and contrast enhancement. It is also used to process and enhance the acquired temperature distribution data, and adjust the temperature parameters of the temperature controller (304) in the constant temperature mechanism and cooling mechanism in real time according to the set threshold.

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