A method, apparatus and equipment for bonding a metal plate to a carrier plate.

Abstract

This invention discloses a method, apparatus, and bonding device for bonding a metal plate onto a carrier plate. The method includes: after the carrier plate is positioned in an operating area, acquiring first position information of the carrier plate using an image acquisition device; determining second position information of a preset bonding area based on the first position information; controlling the image acquisition device to move to a first target area based on the second position information; ensuring the vertical projection of the first target area onto the carrier plate coincides with the preset bonding area; acquiring first image information of the metal plate using the image acquisition device; determining whether the vertical projection of the metal plate onto the carrier plate coincides with the preset bonding area based on the first image information; and if so, controlling the metal plate to be bonded to the preset bonding area. This eliminates the need for openings in the carrier plate, effectively reducing process costs. Furthermore, the carrier plate without openings allows for the division of different bonding areas, effectively improving the utilization rate of the carrier plate.

Description

Technical Field

[0001] This invention relates to the field of display module technology, and in particular to a method, apparatus and equipment for bonding a metal plate to a carrier plate. Background Technology

[0002] In the manufacturing of display modules, to ensure the robustness of the display module, a metal plate is usually bonded to the glass substrate of the display module. Typically, a carrier plate is used to hold the metal plate to be bonded to the glass substrate, and then the metal plate is transported to the glass substrate for alignment and bonding.

[0003] Typically, a carrier plate has multiple bonding areas, each corresponding to an area on the glass substrate where a metal plate is bonded. This ensures accurate alignment and bonding when the carrier plate bonds the metal plate to the glass substrate. The bonding areas on the carrier plate usually have openings as markers to facilitate accurate bonding of the metal plate to the carrier plate before it is transferred to the glass substrate.

[0004] Due to the rapid updates in display devices, the specifications of display modules have also diversified. Consequently, the specifications of metal plates are constantly being updated to match the specifications of display modules, making it impossible for the marked carrier boards to be used for a long time. In addition, it is necessary to re-set the opening positions of the carrier boards according to the specifications of the display modules, which is costly and results in a significant waste of resources. Summary of the Invention

[0005] This invention provides a method, apparatus, and equipment for bonding a metal plate to a carrier plate, in order to solve the problems that the carrier plate cannot be used for a long time and that setting openings on the carrier plate is costly.

[0006] According to one aspect of the present invention, a method for bonding a metal plate to a carrier plate is provided, the carrier plate including at least one predetermined bonding area for bonding the metal plate, comprising:

[0007] After the carrier plate is located in the operating area, the first position information of the carrier plate is acquired by the image acquisition device;

[0008] The second position information of the preset fitting area is determined based on the first position information;

[0009] The image acquisition device is controlled to move to the first target area according to the second position information; the vertical projection of the first target area on the carrier plate coincides with the preset bonding area.

[0010] The image acquisition device acquires the first image information of the metal plate.

[0011] Based on the first image information, determine whether the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area;

[0012] If so, the metal plate is controlled to adhere to the preset adhesion area.

[0013] According to another aspect of the present invention, an apparatus for bonding a metal plate to a carrier plate is provided, the carrier plate including at least one predetermined bonding area for bonding the metal plate, comprising:

[0014] The first position information acquisition module is used to acquire the first position information of the carrier plate through an image acquisition device after the carrier plate is located in the operation area.

[0015] The second position information determination module is used to determine the second position information of the preset fitting area based on the first position information;

[0016] A first motion control module is used to control the image acquisition device to move to a first target area according to the second position information; the vertical projection of the first target area on the carrier plate coincides with the preset bonding area.

[0017] The first image information acquisition module is used to acquire first image information of the metal plate through the image acquisition device;

[0018] The overlap determination module is used to determine whether the vertical projection of the metal plate on the carrier plate overlaps with the second preset bonding area based on the first image information.

[0019] The bonding control module is used to control the metal plate to bond to the preset bonding area after the overlap judgment module determines, based on the first image information, that the vertical projection of the metal plate on the carrier plate overlaps with the second preset bonding area.

[0020] According to another aspect of the present invention, an apparatus for bonding a metal plate to a carrier plate is provided, comprising: a support stage, an image acquisition device, an image acquisition driving device, a metal plate driving device, and a controller.

[0021] The support platform is used to place the carrier plate;

[0022] The image acquisition device, the image acquisition driving device, and the metal plate driving device are all electrically connected to the controller;

[0023] The image acquisition device acquires image information of the metal plate and / or carrier plate under the control of the controller;

[0024] The image acquisition drive device is driven to move under the control of the controller;

[0025] The metal plate driving device is used to adsorb the metal plate and drive the metal plate to move under the control of the controller;

[0026] The controller is used to perform the above-described method of attaching a metal plate to a carrier plate.

[0027] The method for bonding a metal plate to a carrier plate provided in this embodiment of the invention first places the carrier plate in the operation area when bonding the metal plate to the carrier plate. After the carrier plate is in the operation area, the first position information of the carrier plate is acquired by an image acquisition device. Combined with the position of the preset bonding area on the carrier plate, the second position information of the preset bonding area can be determined based on the first position information. Then, the image acquisition device is moved to a first target area that coincides with the preset bonding area in the vertical direction according to the second position information. At this time, the first image information of the metal plate is acquired by the image acquisition device. After determining that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area based on the first image information, the metal plate is controlled to be bonded to the preset bonding area. It is not necessary to achieve the alignment and bonding of the metal plate and the preset bonding area on the carrier plate according to the opening mark on the carrier plate, so that there is no need to set the opening on the carrier plate, which can effectively reduce the process cost. Furthermore, the carrier plate without openings can be divided into different bonding areas, which can effectively improve the utilization rate of the carrier plate.

[0028] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0031] Figure 2 This is a flowchart of a method for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0032] Figure 3 This is a flowchart of another method for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0033] Figure 4 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0034] Figure 5 This is a flowchart of another method for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram of the structure of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the structure of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0037] Figure 8 This is a schematic diagram of a device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0039] Figure 10 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention;

[0040] Explanation of reference numerals in the attached figures:

[0041] 10-Lamination equipment;

[0042] 11-Image acquisition device;

[0043] 12-Image acquisition drive device;

[0044] 13-Metal plate drive device;

[0045] 14 - Support platform;

[0046] 111-Coaxial camera module;

[0047] C1 - Upper camera;

[0048] C2 - Lower-level camera;

[0049] L0 - Connecting shaft;

[0050] A1 - Operating area;

[0051] A2 - The bonding area of ​​carrier plate 20;

[0052] A21 - Preset bonding area of ​​carrier plate 20;

[0053] 20-Carrier plate;

[0054] 30-Metal sheet;

[0055] a-The first vertex a of carrier plate 20;

[0056] b - Preset fitting area A21, first region vertex b;

[0057] c - the second vertex c of metal plate 30;

[0058] 100 - First location information acquisition module;

[0059] 200 - Second location information determination module;

[0060] 300 - First Motion Control Module;

[0061] 400 - First Image Information Acquisition Module;

[0062] 500 - Overlap Detection Module;

[0063] 600-Adhesion Control Module;

[0064] 700 - Position Adjustment Module;

[0065] 800 - Second Motion Control Module;

[0066] 900 - Third Motion Control Module;

[0067] 1000 - Third Image Information Acquisition Module;

[0068] 1100 - Offset Detection Module;

[0069] 110 - First mobile control unit;

[0070] 120 - Second image information acquisition unit;

[0071] 130 - First Judgment Unit;

[0072] 140 - First position coordinate determination unit;

[0073] 310 - Second Motion Control Unit 3;

[0074] 410 - First image information acquisition unit;

[0075] 510 - Second Judgment Unit;

[0076] 520 - Coincident determination unit. Detailed Implementation

[0077] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0078] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0079] This invention provides a device for bonding a metal plate to a carrier plate. Figure 1 This is a schematic diagram of a device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 1 As shown, the device 10 for bonding a metal plate to a carrier plate includes: a support platform 14, an image acquisition device 11, an image acquisition driving device 12, a metal plate driving device 13, and a controller (not shown in the figure). The support platform 14 is used to place the carrier plate 20; the image acquisition device 11, the image acquisition driving device 12, and the metal plate driving device 13 are all electrically connected to the controller; the image acquisition device 11 acquires image information of the metal plate 30 and / or the carrier plate 20 under the control of the controller; the image acquisition driving device 12 drives the image acquisition device 11 to move under the control of the controller; the metal plate driving device 13 is used to adsorb the metal plate 30 and drives the metal plate 30 to move under the control of the controller. The controller is used for the method of bonding a metal plate to a carrier plate provided in any embodiment of the present invention. Therefore, the device for bonding a metal plate to a carrier plate provided in the embodiments of the present invention includes the technical features of the method of bonding a metal plate to a carrier plate provided in any embodiment of the present invention, and can achieve the beneficial effects of the method of bonding a metal plate to a carrier plate provided in any embodiment of the present invention. The specific technical features and technical effects are described in the following embodiments of the method of bonding a metal plate to a carrier plate.

[0080] Specifically, the support platform 14 can be fixed in a certain position, such as in the operating area A1, or it can move horizontally (i.e., within the XOY plane). The image acquisition device 11 can move under the drive of the image acquisition drive device 12, and preferably, the image acquisition device 11 can only move horizontally. It is understood that when the carrier plate 20 is placed on the support platform 14, the image acquisition device 11 should be located on the side of the carrier plate 20 away from the support platform 14, so as to facilitate the image acquisition device 11 to acquire image information of the carrier plate 20. The metal plate drive device 13 can be located on the side of the image acquisition device 11 away from the support platform 14, and can adsorb the metal plate 30, and when adsorbing the metal plate 30, the metal plate 30 faces the support platform 14. Based on this, the metal plate drive device 13 can drive the metal plate 30 to move horizontally or vertically (i.e., along the ZO or OZ direction) under the control of the controller.

[0081] Based on this, embodiments of the present invention provide a method for bonding a metal plate to a carrier plate, which is executed by the controller in the aforementioned device for bonding a metal plate to a carrier plate. This method can solve the problems of the carrier plate not being able to be used for a long time and the high cost of setting openings on the carrier plate. Alternatively, the method for bonding a metal plate to a carrier plate is executed by the device for bonding a metal plate to a carrier plate provided in the embodiments of the present invention, which can be integrated into the controller of the device for bonding a metal plate to a carrier plate provided in the embodiments of the present invention.

[0082] This invention provides a method for bonding a metal plate to a carrier plate. Figure 2 This is a flowchart of a method for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 2 As shown, the method for bonding a metal plate to a carrier plate includes:

[0083] S110. After the carrier plate is located in the operating area, the first position information of the carrier plate is obtained through the image acquisition device.

[0084] Specifically, after the carrier plate 20 is located in the operation area A1, the image acquisition device 11 can be driven to move into the operation area A1, and then the image acquisition device 11 can be controlled to acquire the image information of the carrier plate 20, so as to determine the position information (i.e., the first position information) of the carrier plate based on the image information of the carrier plate 20.

[0085] S120. Determine the second position information of the preset fitting area based on the first position information.

[0086] Specifically, the carrier plate 20 may have multiple areas for bonding the metal plate 30, and the metal plate 30 can be sequentially bonded to areas of the same shape and size. That is, each time the operation of bonding the metal plate 30 to the carrier plate 20 is performed, the metal plate 30 has a corresponding preset bonding area A2. It can be understood that the positions of each preset bonding area A2 on the carrier plate 20 are preset according to the layout information of different production lines. Therefore, after obtaining the first position information of the carrier plate 20, combined with the position information of the preset bonding area A2 (e.g., preset bonding area A21) corresponding to the metal plate 30 on the carrier plate 20, the position information of the preset bonding area A21 (i.e., the second position information) can be determined based on the first position information of the carrier plate 20.

[0087] S130. Control the image acquisition device to move to the first target area according to the second position information.

[0088] The vertical projection of the first target area on the carrier plate 20 coincides with the preset bonding area A21.

[0089] Specifically, for ease of positioning and operation, the image acquisition device 11 can be configured to move horizontally. Within its reachable range, it can include a first target area, which is located directly above the preset bonding area A21, meaning its vertical projection on the carrier plate 20 coincides with the preset bonding area A21. Thus, the position information of the first target area can be determined based on the second position information, and the image acquisition device can be controlled to move to the first target area based on the second position information, thereby positioning the image acquisition device 11 directly above the preset bonding area A21.

[0090] S140. Acquire the first image information of the metal plate through the image acquisition device.

[0091] Specifically, the metal plate driving device 13 can move the metal plate 30 to a position approximately directly above the first target area, that is, to a position approximately directly above the preset bonding area A21, and the image acquisition device 11 can acquire the image information (i.e., the first image information) of the metal plate 30. The image acquisition device 11 can be configured to acquire image information bidirectionally, that is, it can acquire the image information of the carrier plate 20 located below it, and it can also acquire the image information of the metal plate 30 located above it.

[0092] S150. Determine whether the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area based on the first image information; if so, proceed to step S160.

[0093] S160, Control the metal plate to adhere to the preset adhesion area.

[0094] Specifically, after acquiring the first image information, the image features of the metal plate 30 can be analyzed based on the first image information, and it can be determined whether the vertical projection of the metal plate 30 on the carrier plate 20 coincides with the preset bonding area A21. After determining that the vertical projection of the metal plate 30 on the carrier plate 20 coincides with the preset bonding area A21, the metal plate driving device 13 can be controlled to move vertically downward, that is, move along the ZO direction, so that the metal plate 30 can be accurately bonded to the preset bonding area A21. Before controlling the metal plate driving device 13 to move vertically downward, the image acquisition device can first be moved to a position that will not obstruct the progress of the metal plate driving device 13.

[0095] For example, if it is determined from the first image information that the vertical projection of the metal plate 30 on the carrier plate 20 does not coincide with the preset bonding area A21, the position of the metal plate 30 can be adjusted, that is, the metal plate driving device 13 is controlled to move, thereby adjusting the position of the metal plate 30. After adjusting the position, the first image information of the metal plate 30 is re-acquired through the image acquisition device 11, and the vertical projection of the metal plate 30 on the carrier plate 20 is again checked against the preset bonding area A21 based on the current first image information, until it is determined whether the vertical projection of the metal plate 30 on the carrier plate 20 coincides with the preset bonding area A21. Then, the adjustment of the position of the metal plate 30 is stopped, and the metal plate 30 is controlled to be bonded to the preset bonding area A21.

[0096] The method for bonding a metal plate to a carrier plate provided in this embodiment of the invention first places the carrier plate in the operation area when bonding the metal plate to the carrier plate. After the carrier plate is in the operation area, the first position information of the carrier plate is acquired by an image acquisition device. Combined with the position of the preset bonding area on the carrier plate, the second position information of the preset bonding area can be determined based on the first position information. Then, the image acquisition device is moved to a first target area that coincides with the preset bonding area in the vertical direction according to the second position information. At this time, the first image information of the metal plate is acquired by the image acquisition device. After determining that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area based on the first image information, the metal plate is controlled to be bonded to the preset bonding area. It is not necessary to achieve the alignment and bonding of the metal plate and the preset bonding area on the carrier plate according to the opening mark on the carrier plate, so that there is no need to set the opening on the carrier plate, which can effectively reduce the process cost. Furthermore, the carrier plate without openings can be divided into different bonding areas, which can effectively improve the utilization rate of the carrier plate.

[0097] Optional, see reference Figure 1 The image acquisition device 11 includes at least two coaxial camera modules 111, each coaxial camera module 111 including a higher camera C1 and a lower camera C2 set coaxially; the carrier plate 20 includes at least two first vertices a, and the first position information includes the first position coordinates of each first vertex a.

[0098] Specifically, the display module is generally rectangular in shape, meaning the mother plate, carrier plate, and metal plate are mostly rectangular. It is understood that the method for attaching a metal plate to a carrier plate provided in this embodiment of the invention is also applicable to other carrier plate shapes with at least two vertices or corners. The image acquisition device 11 may include at least two coaxial camera modules 111, specifically two, three, or four; this embodiment of the invention does not specifically limit this. For example, for a rectangular carrier plate 20, metal plate 30, and preset bonding area A21, only two coaxial camera modules are needed to achieve the technical solution of this invention. However, to improve the accuracy of alignment between the metal plate and the preset bonding area, the image acquisition device 11 may include three or four coaxial camera modules 111. Alternatively, for a carrier plate 20, metal plate 30, or preset bonding area A21 with more vertices, the image acquisition device 11 may include more coaxial camera modules 111 to achieve the technical solution of this invention; this embodiment of the invention does not specifically limit this. For ease of understanding, unless otherwise specified, the embodiments of the present invention are illustrated by taking the shape of the carrier plate 20, the metal plate 30 and the preset bonding area A21 as rectangles, and the image acquisition device 11 including two coaxial camera modules 111.

[0099] Specifically, the upper camera C1 and the lower camera C2 in the same coaxial camera module 111 are fixedly mounted at both ends of the connecting shaft L0. Along the extension direction of the connecting shaft L0, the upper camera C1 is located above the lower camera C2. The upper camera C1 is used to acquire image information from above (i.e., image information on one side of the connecting shaft L0 along the OZ direction), and the lower camera C2 is used to acquire image information from below (i.e., image information on one side of the connecting shaft L0 along the ZO direction).

[0100] Based on this Figure 3 This is a flowchart of another method for bonding a metal plate to a carrier plate according to an embodiment of the present invention, such as... Figure 3 As shown, the method for bonding a metal plate to a carrier plate includes:

[0101] S211. After the carrier plate is located in the operating area, control each coaxial camera module to move above different first vertices.

[0102] For details, please refer to Figure 1After the carrier plate 20 is positioned in the operating area A1, one of the coaxial camera modules 111 can be controlled to be positioned above one of the first vertices a of the carrier plate 20, and the other coaxial camera module 111 can be controlled to move above the other first vertices a. The two first vertices a can be two vertices located diagonally opposite each other, or vertices located at both ends of a long side of a rectangle, or vertices located at both ends of a short side of a rectangle; this embodiment of the invention does not specifically limit this. It is understood that if the image acquisition device 11 includes three coaxial camera modules 111, then the three coaxial camera modules 111 are respectively located above the three first vertices a; based on the same principle, if the image acquisition device 11 includes four coaxial camera modules 111, then the four coaxial camera modules 111 are respectively located above the four first vertices a.

[0103] S212, Control each lower-level camera to acquire the second image information of the carrier board.

[0104] Specifically, after moving each coaxial camera module 111 above a different first vertex a, the lower camera C2 in each coaxial camera module 11 is controlled to acquire image information (i.e., second image information) of the carrier plate 20.

[0105] S213. Determine whether each of the second image information includes the first vertex; if so, proceed to step S214.

[0106] S214. The horizontal coordinates of each coaxial camera module are determined as the first position coordinates of each first vertex.

[0107] Specifically, if each coaxial camera module 111 is located above a first vertex a, then after the lower camera C2 acquires the second image information of the carrier plate 20, each image information should include the corresponding first vertex a. Therefore, after acquiring the second image information of the carrier plate 20, it is determined whether each second image information includes the first vertex a. If it is determined that each second image information includes the first vertex a, then the current horizontal coordinates (XOY plane coordinates) of each coaxial camera module 111 can be correspondingly determined as the first position coordinates of each first vertex a. That is, after moving and aligning each coaxial camera module 111 directly above each first vertex a of the carrier plate 20, the actual placement position of the carrier plate 20 (the first position coordinates of each first vertex a) can be determined by the position coordinates of each coaxial camera module 111. In a preferred embodiment, when the center position of the second image information generated by the coaxial camera module 111 includes the first vertex a, the current horizontal coordinate (XOY plane coordinate) of each coaxial camera module 111 is determined as the first position coordinate of each first vertex a.

[0108] For example, if at least one of the second image information does not include the first vertex a, the position of the corresponding coaxial camera module 111 is adjusted until the second image information acquired by the coaxial camera module 111 includes the corresponding first vertex a, and the horizontal coordinate of the coaxial camera module 111 is determined as the first position coordinate of the first vertex a.

[0109] S215. Determine the second position information of the preset fitting area based on the first position information.

[0110] The preset fitting area A21 includes at least two first region vertices b, and the second position information includes the second position coordinates of each first region vertex b.

[0111] Specifically, taking a rectangle as an example of a preset fitting area A21, if the preset fitting area A21 includes at least two first region vertices b, then the two first region vertices b can be the vertices at both ends of the rectangle's diagonal, the vertices at both ends of one long side of the rectangle, or the vertices at both ends of one short side of the rectangle. Alternatively, the at least two first region vertices b can also be the four vertices of the rectangle.

[0112] S216. Based on the coordinates of each second position, control each coaxial camera module to move to different vertices of the second region of the first target area.

[0113] The first target region includes at least two second region vertices (not shown in the figure); the vertical projection of each second region vertex on the carrier plate 20 coincides with the corresponding first region vertex b.

[0114] Specifically, since the first target area coincides with the preset fitting area A21, it can be known that the shape and size of the first target area are the same as those of the preset fitting area A21, including the vertices at the same positions as those of the preset fitting area A21 (i.e., the vertices of the second area), and each of the vertices of the second area is located directly above the corresponding vertex b of the first area, that is, the vertical projection of each vertex of the second area on the carrier plate 20 coincides with the corresponding vertex b of the first area.

[0115] S217. Acquire the first image information of the metal plate through each upper-level camera.

[0116] Before the metal plate 30 is attached to the preset attachment area A21 of the carrier plate 20, the metal plate 30 is located on the side of the image acquisition device 11 away from the carrier plate 20.

[0117] Specifically, based on the setting of the coaxial camera module 111, before the metal plate 30 is attached to the preset attachment area A21 of the carrier plate 20, the metal plate 30 and the carrier plate 20 can be set to be located on the upper and lower sides of the image acquisition device 11, respectively. In this way, the coaxial camera module 111 can acquire the image information (i.e., the second image information) of the carrier plate 20 through the lower camera C2, and acquire the image information (first image information) of the metal plate 30 through the upper camera C1.

[0118] S218. Determine whether each of the first image information includes the second vertex of the metal plate; if yes, proceed to step S219; if no, proceed to step S221.

[0119] S219. Determine that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area.

[0120] S220, Control the metal plate to adhere to the preset adhesion area.

[0121] S221. Adjust the position of the metal plate; return to step S217.

[0122] Specifically, the metal plate 30 should be compatible with the preset bonding area A21, that is, they should have the same shape and size. Therefore, the metal plate 30 also includes at least two second vertices c corresponding to the preset bonding area A21. The first image information of the metal plate 30 can be obtained through each upper camera C1. Since each coaxial camera module 111 is located above different vertices of the preset bonding area A21, if the position of the metal plate 30 coincides with the preset bonding area A21 in the vertical direction, then each first image information should include the second vertex c at the corresponding position of the metal plate 30. Figure 4 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 4As shown, the metal plate 30 is located directly above the preset bonding area A21, meaning that the position of the metal plate 30 coincides with the preset bonding area A21 in the vertical direction. Therefore, when it is determined that each first image information should include the second vertex c at the corresponding position of the metal plate 30, it can be determined that the metal plate 30 is directly above the preset bonding area A21. At this time, the metal plate driving device 13 can be controlled to move vertically downward to bond the metal plate 30 to the preset bonding area A21 on the carrier plate 20. However, if at least one first image information does not include the second vertex c of the metal plate 30, it can be determined that the position of the metal plate 30 is offset relative to the preset bonding area A21. At this time, the position of the metal plate 30 is adjusted until it is determined that each first image information includes the second vertex c of the metal plate 30, and the position of the metal plate 30 is determined to be no offset relative to the preset bonding area A21. Then, the metal plate 30 can be controlled to bond to the preset bonding area A21. In a preferred embodiment, the coaxial camera module 111 is fixed, and the position of the metal plate 30 is adjusted so that the upper camera C1 can acquire different first image information. When it is determined that the center position of each first image information includes the second vertex c corresponding to the metal plate 30, it can be determined that the metal plate 30 is located directly above the preset bonding area A21.

[0123] Optional, Figure 5 This is a flowchart of another method for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 5 As shown, the method for bonding a metal plate to a carrier plate includes:

[0124] S311. After the carrier plate is located in the operating area, the first position information of the carrier plate is obtained through the image acquisition device.

[0125] S312. Determine the second position information of the preset fitting area based on the first position information.

[0126] S313. Control the image acquisition device to move to the first target area according to the second position information.

[0127] The vertical projection of the first target area onto the carrier plate coincides with the preset bonding area.

[0128] S314. Acquire the first image information of the metal plate through the image acquisition device.

[0129] S315. Determine whether the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area based on the first image information; if yes, proceed to step S317; if no, proceed to step S316.

[0130] S316. Adjust the position of the metal plate; return to step S314.

[0131] S317. Control the image acquisition device to move to the outside of the first target area.

[0132] S318, Control the metal plate to adhere to the preset adhesion area.

[0133] Specifically, after determining that the vertical projection of the metal plate 30 on the carrier plate 20 coincides with the preset bonding area A21, the image acquisition device 11 can be moved out of the first target area to avoid obstructing the process in the path of the metal plate 30 when controlling the metal plate 30 to be vertically and downwardly bonded to the preset bonding area A21 of the carrier plate 20. For example, Figure 6 This is a schematic diagram of another device for attaching a metal plate to a carrier plate provided by an embodiment of the present invention. As shown in Figure 6, each coaxial camera module 111 in the image acquisition device 11 can be controlled to move along the XO direction to the periphery of the carrier plate 20, so as to avoid obstruction when the coaxial camera module 111 is attached to the carrier plate 20.

[0134] S319. Control the image acquisition device to move back to the first target area.

[0135] S320: Obtain third image information of the preset bonding area through the image acquisition device.

[0136] S321. Detect the offset of the metal plate in the preset bonding area based on the third image information.

[0137] Specifically, after the metal plate 30 is attached to the preset attachment area A21 of the carrier plate 20, the image acquisition device can be controlled to return to the first target area. Figure 7 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 7 As shown, each coaxial camera module 111 can be controlled to return to directly above different vertices of the preset bonding area A21. Then, the lower camera C2 of each coaxial camera module 111 acquires image information (i.e., third image information) of the preset bonding area A21 on the carrier plate 20 again, so as to detect whether the bonding of the metal plate in the preset bonding area is offset according to the third image information.

[0138] For example, when detecting whether there is a misalignment in the bonding of the metal plate within the preset bonding area based on the third image information, it can be determined whether each third image information acquired by each lower camera C21 includes the second vertex c corresponding to the position of the metal plate 20. If it is determined that each third image information includes the second vertex c corresponding to the position of the metal plate 20, it can be determined that there is no misalignment in the bonding of the metal plate 20 on the carrier plate 20, and the same metal plate bonding method can be used to bond the metal plate in another bonding area A2 of the carrier plate 20. If at least one third image information does not include the second vertex c of the metal plate 20, it can be determined that there is a misalignment in the bonding of the metal plate 20 on the carrier plate 20, and the metal plate 20 can be removed and rebonded using the above method.

[0139] Based on the same inventive concept, embodiments of the present invention also provide an apparatus for bonding a metal plate to a carrier plate. The carrier plate includes at least one preset bonding area for bonding the metal plate. The apparatus for bonding the metal plate to the carrier plate is used to execute the method for bonding a metal plate to a carrier plate provided in any embodiment of the present invention. The apparatus for bonding the metal plate to the carrier plate can be implemented by software and / or hardware. Therefore, the apparatus for bonding a metal plate to a carrier plate provided in the embodiments of the present invention includes the technical features of the method for bonding a metal plate to a carrier plate provided in any embodiment of the present invention, and can achieve the beneficial effects of the method for bonding a metal plate to a carrier plate provided in any embodiment of the present invention. Similarities can be referred to the above description of the method for bonding a metal plate to a carrier plate provided in the embodiments of the present invention, and will not be repeated here.

[0140] Optional, Figure 8 This is a schematic diagram of a device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 8 As shown, the device for bonding a metal plate to a carrier plate includes a first position information acquisition module 100, used to acquire first position information of the carrier plate through an image acquisition device after the carrier plate is located in the operation area; a second position information determination module 200, used to determine second position information of a preset bonding area based on the first position information; a first movement control module 300, used to control the image acquisition device to move to a first target area based on the second position information; the vertical projection of the first target area on the carrier plate coincides with the preset bonding area; a first image information acquisition module 400, used to acquire first image information of the metal plate through an image acquisition device; an overlap judgment module 500, used to determine whether the vertical projection of the metal plate on the carrier plate coincides with the second preset bonding area based on the first image information; and a bonding control module 600, used to control the metal plate to bond to the preset bonding area after the overlap judgment module determines that the vertical projection of the metal plate on the carrier plate coincides with the second preset bonding area based on the first image information.

[0141] The device for bonding a metal plate to a carrier plate provided in this embodiment of the invention does not require the metal plate to be aligned and bonded to the preset bonding area on the carrier plate according to the opening mark on the carrier plate. Therefore, it is not necessary to set openings on the carrier plate, which can effectively reduce the process cost. Furthermore, the carrier plate without openings can be divided into different bonding areas, which can effectively improve the utilization rate of the carrier plate.

[0142] Optional, Figure 9 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 9 As shown, the image acquisition device includes at least two coaxial camera modules, each including a coaxially mounted upper camera and a lower camera; the carrier plate includes at least two first vertices, and the first position information includes the first position coordinates of each first vertices; the first position information acquisition module 100 includes a first movement control unit 110, used to control each coaxial camera module to move above different first vertices after the carrier plate is located in the operation area; a second image information acquisition unit 120, used to control each lower camera to acquire second image information of the carrier plate; a first judgment unit 130, used to determine whether each second image information includes the first vertices; and a first position coordinate determination unit 140, used to determine the horizontal coordinates of each coaxial camera module as the first position coordinates of each first vertices when the first judgment unit determines that each second image information includes the first vertices.

[0143] Optional, see reference Figure 9 The preset fitting area includes at least two first region vertices, and the second position information includes the second position coordinates of each first region vertices; the first target area includes at least two second region vertices; the vertical projection of each second region vertices on the carrier plate coincides with the corresponding first region vertices; the first movement control module 300 includes a second movement control unit 310, which is used to control each coaxial camera module to move to different second region vertices of the first target area according to each second position coordinate.

[0144] Optional, continue to refer to Figure 9 Before the metal plate is attached to the preset bonding area of ​​the carrier plate, the metal plate is located on the side of the image acquisition device away from the carrier plate; the first image information acquisition module 400 includes a first image information acquisition unit 410, which is used to acquire the first image information of the metal plate through each upper camera.

[0145] Optional, continue to refer to Figure 9The metal plate includes at least two second vertices; the overlap judgment module 500 includes a second judgment unit 510, used to judge whether each first image information includes the second vertices of the metal plate; and an overlap determination unit 520, used to determine that when the second judgment unit 510 determines that each first image information includes the second vertices of the metal plate, the vertical projection of the metal plate on the carrier plate overlaps with the preset bonding area.

[0146] Optional, continue to refer to Figure 9 The device for attaching a metal plate to a carrier plate also includes a position adjustment module 700, which is used to adjust the position of the metal plate when the overlap judgment module 500 determines, based on the first image information, that the vertical projection of the metal plate on the carrier plate does not overlap with the preset attachment area; and after adjusting the position of the metal plate, returns to the first image information acquisition module 400 to perform the step of acquiring the first image information of the metal plate through the image acquisition device.

[0147] Optional, Figure 10 This is a schematic diagram of another device for bonding a metal plate to a carrier plate according to an embodiment of the present invention, as shown below. Figure 10 As shown, the device for bonding a metal plate to a carrier plate also includes a second movement control module 800, which is used to control the image acquisition device to move to the outside of the first target area after the overlap judgment module 500 determines that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding area based on the first image information, and before the bonding control module 600 controls the metal plate to be bonded to the preset bonding area.

[0148] Optional, see reference Figure 10 The device for bonding a metal plate to a carrier plate also includes a third movement control module 900, which controls the image acquisition device to move back to the first target area after the bonding control module controls the metal plate to be bonded to the preset bonding area; a third image information acquisition module 1000, which acquires third image information of the preset bonding area through the image acquisition device; and an offset detection module 1100, which detects the offset of the metal plate in the preset bonding area based on the third image information.

[0149] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0150] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method of attaching a metal plate to a carrier plate, the carrier plate including at least one predetermined attachment area for attaching a metal plate, characterized in that, The method comprises the following steps: After the carrier plate is located in the operation area, first position information of the carrier plate is acquired by an image acquisition device; Second position information of the preset fitting area is determined according to the first position information; The image acquisition device is controlled to move to a first target area according to the second position information; The vertical projection of the first target area on the carrier plate coincides with the preset fitting area; First image information of the metal plate is acquired by the image acquisition device; It is judged whether the vertical projection of the metal plate on the carrier plate coincides with the preset fitting area according to the first image information; If yes, the metal plate is controlled to be fitted to the preset fitting area; The image acquisition device comprises at least two coaxial camera modules, the coaxial camera module comprises an upper camera and a lower camera arranged coaxially, and the carrier plate comprises at least two first vertices, and the first position information comprises first position coordinates of the first vertices; After the carrier plate is located in the operation area, first position information of the carrier plate is acquired by an image acquisition device, which comprises the following steps: After the carrier plate is located in the operation area, each coaxial camera module is controlled to move above the different first vertices respectively; Second image information of the carrier plate is acquired by each lower camera; It is judged whether the first vertices are included in each second image information; If yes, the horizontal coordinates of each coaxial camera module are determined as the first position coordinates of the first vertices.

2. The method of claim 1, wherein The preset fitting area comprises at least two first area vertices, and the second position information comprises second position coordinates of the first area vertices; The first target area comprises at least two second area vertices, and the vertical projections of the second area vertices on the carrier plate respectively coincide with the corresponding first area vertices; The image acquisition device is controlled to move to a first target area according to the second position information, which comprises the following steps: Each coaxial camera module is controlled to move to the different second area vertices of the first target area according to the second position coordinates.

3. The method of claim 1, wherein Before the metal plate is fitted to the preset fitting area of the carrier plate, the metal plate is located on the side of the image acquisition device away from the carrier plate; First image information of the metal plate is acquired by the image acquisition device, which comprises the following steps: First image information of the metal plate is acquired by each upper camera.

4. The method of claim 3, wherein The metal plate comprises at least two second vertices; It is judged whether the vertical projection of the metal plate on the carrier plate coincides with the preset fitting area according to the first image information, which comprises the following steps: It is judged whether the second vertices of the metal plate are included in each first image information; If yes, it is determined that the vertical projection of the metal plate on the carrier plate coincides with the preset fitting area.

5. The method of claim 1, wherein The method further comprises the following steps: If it is determined according to the first image information that the vertical projection of the metal plate on the carrier plate does not coincide with the preset fitting area, the position of the metal plate is adjusted; After the position of the metal plate is adjusted, the step of acquiring first image information of the metal plate by the image acquisition device is executed again.

6. The method of claim 1, wherein After determining, according to the first image information, that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding region, and before controlling the metal plate to be bonded to the preset bonding region, the method further comprises: Controlling the image acquisition device to move to the outside of the first target region.

7. The method of claim 6, wherein the metal sheet is attached to the carrier sheet by a method selected from the group consisting of welding, brazing, soldering, and adhesive bonding. After controlling the metal plate to be bonded to the preset bonding region, the method further comprises: Controlling the image acquisition device to move to the first target region again; Obtaining third image information of the preset bonding region by the image acquisition device; Detecting, according to the third image information, the offset of the metal plate in the preset bonding region.

8. An apparatus for attaching a metal plate to a carrier plate, the carrier plate including at least one predetermined attachment area for attaching the metal plate, the apparatus comprising: a first attachment device for attaching the metal plate to the carrier plate at the predetermined attachment area; and a second attachment device for attaching the metal plate to the carrier plate at the predetermined attachment area. The method comprises: A first position information acquisition module, configured to acquire first position information of the carrier plate by an image acquisition device after the carrier plate is located in an operation region; A second position information determination module, configured to determine second position information of the preset bonding region according to the first position information; A first movement control module, configured to control the image acquisition device to move to a first target region according to the second position information; The vertical projection of the first target region on the carrier plate coincides with the preset bonding region; A first image information acquisition module, configured to acquire first image information of the metal plate by the image acquisition device; A coincidence judgment module, configured to judge whether the vertical projection of the metal plate on the carrier plate coincides with the preset bonding region according to the first image information; A bonding control module, configured to control the metal plate to be bonded to the preset bonding region after the coincidence judgment module determines, according to the first image information, that the vertical projection of the metal plate on the carrier plate coincides with the preset bonding region; The image acquisition device comprises at least two coaxial camera modules, and each coaxial camera module comprises an upper camera and a lower camera arranged coaxially; the carrier plate comprises at least two first vertices, and the first position information comprises first position coordinates of the first vertices; The first position information acquisition module comprises: A first movement control unit, configured to control each coaxial camera module to move above a different first vertex after the carrier plate is located in an operation region; A second image information acquisition unit, configured to control each lower camera to acquire second image information of the carrier plate; A first judgment unit, configured to judge whether each second image information comprises a first vertex; A first position coordinate determination unit, configured to determine, when the first judgment unit determines that each second image information comprises the first vertex, a horizontal coordinate of each coaxial camera module as a first position coordinate of the first vertex.

9. An apparatus for bonding a metal plate to a carrier plate, characterized by The method comprises: A carrier table, an image acquisition device, an image acquisition driving device, a metal plate driving device and a controller; The carrier table is configured to place the carrier plate; The image acquisition device, the image acquisition driving device and the metal plate driving device are electrically connected with the controller; The image acquisition device acquires image information of the metal plate and / or the carrier plate under the control of the controller; The image acquisition driving device drives the image acquisition device to move under the control of the controller; The metal plate driving device is used for adsorbing the metal plate and driving the metal plate to move under the control of the controller. The controller is used for executing the method for adhering the metal plate on the carrier plate according to any one of claims 1-7.

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