Method of processing an integrated carrier, mold assembly, and wire

Abstract

The application relates to a processing method of an integrated carrier, a die assembly and a wire, the integrated carrier comprising a carrier main body configured as a frame-shaped structure and comprising a first frame and a second frame oppositely arranged along a first direction, the first frame being provided with a first wire slot, the second frame being provided with a second wire slot, the first wire slot and the second wire slot both extending along the first direction, and the carrier main body being detachably connected with a cavity of a plurality of the die assemblies. Thus, the positioning and installation of the wire can be facilitated, the external integrated carrier has a wide field of view and sufficient operation space during the installation of the wire, and the positioning is more accurate; on the other hand, the wire does not need to be detached from the two wire slots every time the die assembly is replaced, so as to prevent unnecessary damage of the wire and improve the yield of the wire. In addition, the first wire slot and the second wire slot with different sizes can be arranged according to different models of the wire, and the universal performance is good.

Description

Technical Field

[0001] This application relates to the field of wire processing technology, and in particular to an integrated carrier, mold assembly, and wire processing method. Background Technology

[0002] The forming of branched wires includes internal mold injection molding and external mold injection molding. Internal mold injection molding is used to isolate the two wires at the branching point with insulating material. The function of external mold injection molding is to inject a tube around the wires and insulating material, which can improve the reliability of the cable and make the product more aesthetically pleasing.

[0003] In existing technologies, to achieve secondary injection molding of branched wires, due to the relatively long pre-extensions at both ends of the wire, operators need to insert the wire into the cavity of the inner mold, position it, and then use the inner mold to injection mold an insulating sleeve. Afterward, the wire is removed from the cavity of the inner mold, positioned again in the outer mold, and then injection molded to form the sleeve. However, this setup results in limited operating space, inconvenient installation, complex operating procedures, and low processing efficiency. Summary of the Invention

[0004] This application provides a processing method that integrates a carrier, mold assembly, and wire to solve the technical problems of small operating space, inconvenient installation, complex operation steps, and low processing efficiency.

[0005] Firstly, this application provides an integrated vehicle.

[0006] Secondly, this application also provides a mold assembly, including the aforementioned integrated carrier.

[0007] Thirdly, this application also provides a method for processing wire, wherein the wire is made using the above-mentioned mold assembly.

[0008] An integrated carrier according to a first aspect of this application is used for processing wire and is suitable for installation in multiple mold assemblies. The integrated carrier includes a carrier body, which is configured as a frame structure and includes a first side frame and a second side frame disposed opposite to each other along a first direction. The first side frame has a first wire groove, and the second side frame has a second wire groove. Both the first wire groove and the second wire groove extend along the first direction. The carrier body is detachably connected to the cavities of the multiple mold assemblies.

[0009] The technical solutions provided in this application have the following advantages compared with the prior art:

[0010] The integrated carrier provided in this application embodiment facilitates the positioning and installation of wires. The external integrated carrier offers a wide field of vision and ample operating space during wire installation, resulting in more precise positioning. Furthermore, it eliminates the need to remove the wires from the two slots every time the mold components are changed, preventing unnecessary damage and improving wire yield. In addition, it allows for the design of different sizes of the first and second slots for different wire models, simplifying processing, reducing costs, and enhancing versatility.

[0011] In some embodiments, the device further includes: a first cover plate, one end of which is pivotally disposed on the first frame and switchable between a first open position and a first closed position; when the first cover plate is in the first open position, the first wire groove is open; when the first cover plate is in the first closed position, the first cover plate and the first wire groove together clamp the wire.

[0012] In some embodiments, the first cover plate is formed with a flow channel adapted to communicate with the cavity of the mold assembly.

[0013] In some embodiments, the flow channel includes a first sub-flow channel and a second sub-flow channel, the first sub-flow channel and the second sub-flow channel being located on opposite sides of the first groove; the first frame has a communicating groove communicating with the first sub-flow channel and / or the second sub-flow channel, the communicating groove being open on one side facing the second frame.

[0014] In some embodiments, the other end of the first cover plate is connected to the first frame via a snap-fit ​​mechanism; and / or, the other end of the first cover plate is connected to the first frame via an insertion mechanism.

[0015] In some embodiments, the other end of the first cover plate is connected to the first frame via the snap-fit ​​mechanism, the snap-fit ​​mechanism including a slot and a buckle, the buckle having a vertically connected handle section and a mounting section, the mounting section being pivotally disposed on the first frame to switch the buckle between a locked position and an unlocked position, the handle section having a snap-fit ​​portion extending obliquely toward the slot at one end facing the slot, and the sidewall of the slot extending obliquely toward the buckle at one end extending obliquely toward the handle section; when the buckle is in the locked position, the snap-fit ​​portion engages with the sidewall of the slot at one end facing the buckle, and when the buckle is in the unlocked position, the snap-fit ​​portion separates from the sidewall of the slot at one end facing the buckle.

[0016] In some embodiments, the vehicle body further includes a third sidewall and a fourth sidewall disposed opposite to each other along a second direction, the first sidewall, the third sidewall, the second sidewall and the fourth sidewall being sequentially connected, at least one of the third sidewall and the fourth sidewall being provided with a handhold, the housing of the mold assembly having an opening, and the handhold being adapted to extend out of the housing from the opening.

[0017] In some embodiments, the device further includes: a second cover plate, which is pivotally disposed on the second frame and switches between a second open position and a second closed position; when the second cover plate is in the second open position, the second wire groove is open; when the second cover plate is in the second closed position, the second cover plate and the second wire groove together clamp the wire.

[0018] In some embodiments, the system further includes: an auxiliary cable management platform, which is detachably connected to the main body of the vehicle, and a third cable groove is formed in the middle of the auxiliary cable management platform, which extends along the first direction and is located between the first cable groove and the second cable groove.

[0019] A mold assembly according to a second aspect of this application includes the aforementioned integrated carrier. The mold assembly provided by this application facilitates the positioning and installation of wires. The external integrated carrier offers a wide field of vision and ample operating space during wire installation, resulting in more precise positioning. Furthermore, it eliminates the need to remove the wires from the two slots every time the mold assembly is replaced, preventing unnecessary damage and improving wire yield. In addition, it allows for the design of different sizes of the first and second slots for different wire models, simplifying processing, reducing costs, and improving versatility.

[0020] A method for processing wire according to a third aspect of this application, wherein the wire is made using a mold assembly according to the claim, the mold assembly comprising multiple molds including a first mold and a second mold, characterized in that the processing method includes the following steps: installing the carrier body onto an auxiliary wire-arranging platform of the integrated carrier; opening a first cover plate and a second cover plate of the carrier body; placing the wire to be formed into a first wire groove, a third wire groove of the auxiliary wire-arranging platform, and a second wire groove, and closing the first cover plate and the second cover plate to confine the wire to be formed within the first wire groove and the second wire groove; separating the carrier body from the auxiliary wire-arranging platform and placing it into the first mold for processing; separating the carrier body from the first mold and placing it into the second mold for processing. The wire processing method provided by this application provides accurate wire positioning, simplifies operation steps, and improves processing efficiency. Furthermore, it reduces the need to handle the wire to be formed, preventing damage to the wire and improving the yield rate. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0024] Figure 1 This is a perspective view of a vehicle body provided in an embodiment of this application.

[0025] Figure 2 for Figure 1 A magnified view of point A.

[0026] Figure 3 This is a perspective view of an integrated vehicle provided in an embodiment of this application.

[0027] Figure 4 This is a perspective view of a first mold provided in an embodiment of this application.

[0028] Figure 5 This is a perspective view of a partial structure of a first mold provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Integrated carrier; 100. First mold; 101. Opening; 102. Cavity; 200. Wire;

[0031] 10. Vehicle body; 11. First frame; 111. First groove; 112. Connecting groove;

[0032] 12. Second border; 121. Second groove; 13. Third border; 14. Fourth border;

[0033] 20. First cover plate; 21. Flow channel; 211. First sub-flow channel; 212. Second sub-flow channel;

[0034] 30. Second cover plate;

[0035] 40. Buckle; 41. Hand buckle section; 411. Snap-fit ​​part; 42. Mounting section; 50. Slot;

[0036] 60. Auxiliary cable management platform; 61. Third cable tray; 70. Handheld part. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0039] For ease of description, spatial relative terms may be used in this document to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "center," "horizontal," "vertical," "upper," "lower," "front," "rear," "length," "width," "thickness," "inner," and "outer." Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or movement change, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used herein will be interpreted accordingly. In the description of this application, "a plurality of" means two or more.

[0040] In order to solve the technical problems of small operating space, inconvenient installation, complicated operation steps and low processing efficiency in the prior art, this application provides an integrated carrier 1.

[0041] The integrated carrier 1 of this application embodiment is described below with reference to the accompanying drawings.

[0042] Specifically, such as Figures 1-5 As shown, the integrated carrier 1 is used to process wire 200, which can be a wire to be formed or a wire that has already been formed but still needs further processing. The integrated carrier 1 is suitable for installation in multiple mold assemblies. The integrated carrier includes: a carrier body 10, which is constructed into a frame structure and includes a first side frame 11 and a second side frame 12 arranged opposite to each other along a first direction. The first side frame 11 has a first wire groove 111, and the second side frame 12 has a second wire groove 121. Both the first wire groove 111 and the second wire groove 121 extend along the first direction. The carrier body 10 is detachably connected to the cavities 102 of the multiple mold assemblies.

[0043] By setting the first groove 111 and the second groove 121, the two grooves can position and limit the wire 200 on both sides of the length direction of the wire 200. Since the wire needs to be processed multiple times in multiple mold components, the integrated carrier 1 can be detachably connected to the cavities of multiple mold components. When installing the wire 200, the integrated carrier 1 can be placed externally, for example, on a workbench, and then the wire 200 can be placed into the first groove 111 and the second groove 121. Then, according to the processing steps, the integrated carrier 1 and the wire 200 can be placed as a whole inside different mold components.

[0044] Therefore, compared to a fixed installation structure within each mold assembly, this approach offers several advantages. First, it facilitates the positioning and installation of the wire 200. The external integrated carrier 1 provides a wide field of vision and ample operating space during wire 200 installation, resulting in more precise positioning. Second, it eliminates the need to remove the wire 200 from the two slots every time a mold assembly is replaced, preventing unnecessary damage to the wire 200 and improving its yield. Furthermore, it allows for the creation of different sizes of the first slot 111 and second slot 121 for different wire 200 models, simplifying processing, reducing costs, and enhancing versatility.

[0045] In some embodiments, such as Figure 1 As shown, the integrated carrier may further include: a first cover plate 20, one end of which is pivotally disposed on the first frame 11 and switchable between a first open position and a first closed position. When the first cover plate 20 is in the first open position, the first wire groove 111 is open; when the first cover plate 20 is in the first closed position, the first cover plate 20 and the first wire groove 111 together clamp the wire 200.

[0046] In existing technologies, because wires are prone to bending and shifting, each processing mold assembly has a cover plate for limiting the wire movement. The opening and closing of the cover plate in each mold assembly can damage the wire, and the operation is complex, resulting in long processing times. Furthermore, when processing multiple times using multiple mold assemblies, the cover plate needs to be opened and closed multiple times. By setting a first cover plate 20 on the integrated carrier 1, the wire 200 can be limited, preventing it from shifting during transport by the integrated carrier 1 and preventing it from shifting during processing. Moreover, during multiple processing operations, there is no need to repeatedly open and close the first cover plate 20, preventing wear on the wire 200 and improving the yield rate of the wire 200.

[0047] In some embodiments, such as Figure 1 As shown, the first cover plate 20 has a flow channel 21, which is adapted to communicate with the cavity 102 of the mold assembly. In the prior art, wire is generally injection molded using a component with an integrated flow channel. During processing, if injection molding is required, the component is installed in the cavity of the mold assembly, processed, and then disassembled, making the processing steps complex. The operator needs to insert the wire into the inner mold cavity, align it, and then tighten the front and rear pressure plates to fix the wire before covering it with the flow channel baffle to form the inner mold. After the inner mold is formed, the flow channel baffle is removed, the product is taken out, and then it is placed in the outer mold for secondary positioning before the flow channel baffle is covered to continue forming the outer mold. In the embodiment of this application, the first cover plate 20 and the flow channel baffle used to press the wire 200 can be integrated into one piece. If an injection molding process is required, the injection molding liquid can be directly poured into the flow channel 21 without repeatedly removing and placing the flow channel 21. This makes the operation convenient, improves processing accuracy and the yield of the wire 200, and reduces processing costs.

[0048] In some embodiments, such as Figure 1 As shown, the flow channel 21 includes a first sub-flow channel 211 and a second sub-flow channel 212. The first sub-flow channel 211 and the second sub-flow channel 212 are respectively located on opposite sides of the first groove 111 to facilitate the flow of injection molding liquid to the outer periphery of the wire 200 and improve the processing accuracy of the wire 200. The first frame 11 has a connecting groove 112 that communicates with the first sub-flow channel 211 and / or the second sub-flow channel 212, and the connecting groove 112 is open on the side facing the second frame 12. For example, the connecting groove 112 can be connected to both the first sub-channel 211 and the second sub-channel 212. The connecting groove 112 can extend vertically to allow the injection molding liquid to be diverted from the connecting groove 112 to the first sub-channel 211 and the second sub-channel 212. The height of the cross-section of the first sub-channel 211 and the second sub-channel 212 in the vertical direction can be greater than the width of the cross-section of the first sub-channel 211 and the second sub-channel 212 in the vertical direction, so that the injection molding liquid can continue to flow downward into the cavity 102, thereby improving processing efficiency and accuracy.

[0049] In some embodiments, the other end of the first cover plate 20 is connected to the first frame 11 via a snap-fit ​​mechanism; and / or, the other end of the first cover plate 20 is connected to the first frame 11 via a plug-in mechanism. For example, the snap-fit ​​mechanism can be a snap-fit ​​engagement of a hook and a hole or a slot and a buckle, and the plug-in mechanism can include a plug-in post, a slot, or a plug-in post and a hole, which is not limited here. Thus, one end of the first cover plate 20 is pivotally mounted on the first frame 11, and the other end of the first cover plate 20 is detachably connected to the first frame 11 to facilitate the installation and removal of the wire 200.

[0050] Furthermore, such as Figure 2 As shown, the other end of the first cover plate 20 is connected to the first frame 11 via a snap-fit ​​mechanism. The snap-fit ​​mechanism includes a slot 50 and a buckle 40. The buckle 40 has a vertically connected handle section 41 and a mounting section 42. The mounting section 42 is pivotally mounted on the first frame 11 to allow the buckle 40 to switch between a locked position and an unlocked position. The end of the handle section 41 facing the slot 50 has a snap-fit ​​portion 411 that extends obliquely toward the slot 50. The sidewall of the slot 50 facing the buckle 40 extends obliquely toward the handle section 41. When the buckle 40 is in the locked position, the snap-fit ​​portion 411 snaps into the sidewall of the slot 50 facing the buckle 40. When the buckle 40 is in the unlocked position, the snap-fit ​​portion 411 separates from the sidewall of the slot 50 facing the buckle 40.

[0051] Therefore, when the operator moves the lever section 41 away from the slot 50, the mounting section 42 pivots, causing the end of the lever section 41 away from the slot 50 to press down, allowing the locking part 411 to disengage from the slot 50. This allows the other end of the first cover plate 20 to separate from the first frame 11, facilitating the installation or removal of the wire 200. This locking structure avoids direct force in the vertical direction, reducing the pressure on the wire 200 when opening and closing the first cover plate 20, and improving processing accuracy and the yield of the wire 200.

[0052] In some embodiments, refer to Figure 1 and combined Figure 4 and Figure 5 The vehicle body 10 also includes a third side frame 13 and a fourth side frame 14 disposed opposite to each other along a second direction. The first side frame 11, the third side frame 13, the second side frame 12 and the fourth side frame 14 are connected in sequence. At least one of the third side frame 13 and the fourth side frame 14 is provided with a handhold 70. The housing of the mold assembly has an opening 101, and the handhold 70 is adapted to extend out of the housing from the opening 101.

[0053] Therefore, the handheld part 70 not only facilitates the transfer and installation of the integrated carrier 1, but also utilizes the opening 101 of the mold assembly. The opening 101 can be an existing clearance structure of the mold assembly in the prior art, or a clearance structure for avoiding components with integrated flow channels or other components. In this application, when the integrated carrier 1 is installed inside the mold assembly, the operator can also use the handheld part 70, which can extend to the outside of the mold assembly, to perform hand holding, installation, disassembly or other operations, thereby improving operability and usability.

[0054] In some embodiments, such as Figure 1 As shown, the integrated carrier 1 further includes a second cover plate 30, which is pivotally mounted on the second frame 12 and switches between a second open position and a second closed position. When the second cover plate 30 is in the second open position, the second wire groove 121 is open; when the second cover plate 30 is in the second closed position, the second cover plate 30 and the second wire groove 121 jointly clamp the wire 200. In this way, the first cover plate 20 and the second cover plate 30 can clamp the wire 200 together with the first wire groove 111 and the second wire groove 121 on both sides of the wire 200 along its length, thereby improving the stability and processing accuracy of the wire 200 during processing.

[0055] For example, one end of the second cover plate 30 can be pivotally mounted on the second frame 12, and the other end of the second cover plate 30 can be connected to the second frame 12 by a snap fastener to facilitate the installation or removal of the wire 200. This snap-fit ​​structure can avoid direct forces in the vertical direction, reduce the pressure on the wire 200 when opening and closing, and improve processing accuracy and the yield of the wire 200.

[0056] In some embodiments, such as Figure 1 and Figure 3 As shown, the system also includes an auxiliary wire management platform 60, which is detachably connected to the carrier body 10. A third wire groove 61 is formed in the middle of the auxiliary wire management platform 60, extending along a first direction and located between the first wire groove 111 and the second wire groove 121. By providing the auxiliary wire management platform 60, the wire 200 can be assisted in being installed on the carrier body 10, thereby further improving the processing accuracy of the wire 200 and increasing its yield. Simultaneously, the auxiliary wire management platform 60 is detachably connected to the carrier body 10. After the wire 200 is installed on the carrier body 10, the auxiliary wire management platform 60 can be separated from the carrier body 10, and the auxiliary wire management platform 60 will not occupy the internal space of the mold assembly.

[0057] For example, one of the auxiliary cable management platform 60 and the carrier body 10 has a plug-in block, and the other of the auxiliary cable management platform 60 and the carrier body 10 has a plug-in slot or plug-in hole, so that the auxiliary cable management platform 60 and the carrier body 10 can be plugged in to facilitate positioning and detachable connection, and prevent the two from shifting when installing the cable 200. The plug-in block may include a plurality of blocks spaced apart along a first direction and a plurality of blocks spaced apart along a second direction to further improve the limiting effect.

[0058] A fourth groove and a fifth groove may be respectively provided at the corresponding positions of the first cover plate 20 and the first groove 111, and at the corresponding positions of the second cover plate 30 and the second groove 121. The fourth groove and the first groove 111 cooperate to clamp the wire 200 in the vertical direction, and the fifth groove and the second groove 121 cooperate to clamp the wire 200 in the vertical direction. At least one of the fourth groove and the fifth groove may be provided with a flexible component such as a silicone element to further reduce the pressure on the wire 200 and improve the yield of the wire 200.

[0059] This application also proposes a mold assembly, including the aforementioned integrated carrier 1. Multiple mold carriers can be used, and the integrated carrier 1 is detachably disposed within multiple mold assemblies. The mold assembly facilitates the positioning and installation of the wire 200, providing a wide field of vision and ample operating space during wire assembly, resulting in more precise positioning. Furthermore, it eliminates the need to remove the wire 200 from the two wire slots every time the mold assembly is changed, preventing unnecessary damage to the wire 200 and improving the yield rate of the wire 200. In addition, it is easy to process, has low cost, and good versatility.

[0060] This application also proposes a method for processing wire, wherein the wire is made using the aforementioned mold assembly. The mold assembly comprises multiple molds, including a first mold 100 and a second mold. For example, the first mold 100 can be an inner mold, and the second mold can be an outer mold. The wire processing method includes the following steps:

[0061] The carrier body 10 is installed on the auxiliary cable management platform 60 of the integrated carrier 1 so that the third cable groove 61, the first cable groove 111, and the second cable groove 121 can jointly restrict the wire 200 to be formed.

[0062] Open the first cover plate 20 and the second cover plate 30 of the carrier body 10 so as to open the first wire groove 111 and the second wire groove 121 to place the wire to be formed 200.

[0063] The wire 200 to be formed is placed into the first wire groove 111, the third wire groove 61 of the auxiliary wire management platform 60 and the second wire groove 121, and the first cover plate 20 and the second cover plate 30 are closed to confine the wire 200 to be formed within the first wire groove 111 and the second wire groove 121.

[0064] The carrier body 10 is separated from the auxiliary cable management platform 60 and placed into the first mold 100 for processing. When the carrier body 10 is separated from the auxiliary cable management platform 60, the wire to be formed 200 is separated from the third cable groove 61 and then placed into the first mold for processing. When the first mold 100 is needed for injection molding, since the first cover plate 20 of this embodiment integrates the flow channel 21, it is not necessary to place the component with the flow channel 21 separately, which simplifies the processing steps and improves the processing efficiency.

[0065] The carrier body 10 is separated from the first mold 100 and placed into the second mold for processing. When the wire 200 to be processed requires a second processing step, the carrier body 10, along with the wire 200, only needs to be removed from the first mold and placed into the second mold. Compared to the prior art where the cover plate of the first mold is integrated into the first mold and the cover plate of the second mold is integrated into the second mold, requiring repeated opening and closing of the cover plate to remove the wire 200, this design further simplifies the operation steps, improves processing efficiency, and reduces the need to handle the wire 200, preventing damage to the wire 200 and improving the yield of the wire 200.

[0066] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0067] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0068] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An integrated carrier (1) for processing wire (200) and adapted to be installed within a plurality of mold assemblies, characterized in that, include: The vehicle body (10) is constructed as a frame structure and includes a first side frame (11) and a second side frame (12) arranged opposite to each other along a first direction. The first side frame (11) has a first groove (111), and the second side frame (12) has a second groove (121). The first groove (111) and the second groove (121) both extend along the first direction. The vehicle body (10) is detachably connected to the cavities (102) of the plurality of mold assemblies. A first cover plate (20) is pivotally mounted at one end on the first frame (11) and switchable between a first open position and a first closed position. When the first cover plate (20) is in the first open position, the first wire groove (111) is open. When the first cover plate (20) is in the first closed position, the first cover plate (20) and the first wire groove (111) together clamp the wire (200). The first cover plate (20) has a flow channel (21) which is suitable for... The flow channel (21) is connected to the cavity (102) of the mold assembly. The flow channel (21) includes a first sub-flow channel (211) and a second sub-flow channel (212), which are respectively located on opposite sides of the first groove (111). The first frame (11) has a connecting groove (112) that is connected to the first sub-flow channel (211) and / or the second sub-flow channel (212). The connecting groove (112) is open on the side facing the second frame (12).

2. The integrated vehicle according to claim 1, characterized in that, The other end of the first cover plate (20) is connected to the first frame (11) by a snap-fit ​​mechanism; and / or, the other end of the first cover plate (20) is connected to the first frame (11) by a plug-in mechanism.

3. The integrated vehicle according to claim 2, characterized in that, The other end of the first cover plate (20) is connected to the first frame (11) via the snap-fit ​​mechanism, which includes a slot (50) and a buckle (40). The buckle (40) has a vertically connected hand buckle section (41) and a mounting section (42). The mounting section (42) is pivotally disposed on the first frame (11) so that the buckle (40) can switch between a locked position and an unlocked position. The end of the hand buckle section (41) facing the slot (50) has a snap-fit ​​portion (411) that extends obliquely toward the slot (50). The sidewall of the end of the slot (50) facing the buckle (40) extends obliquely toward the hand buckle section (41). When the buckle (40) is in the locked position, the latching part (411) is latched and connected to the side wall of the slot (50) facing the buckle (40). When the buckle (40) is in the unlocked position, the latching part (411) is separated from the side wall of the slot (50) facing the buckle (40).

4. The integrated vehicle according to claim 1, characterized in that, The vehicle body (10) further includes a third side frame (13) and a fourth side frame (14) arranged opposite to each other along a second direction. The first side frame (11), the third side frame (13), the second side frame (12) and the fourth side frame (14) are connected in sequence. At least one of the third side frame (13) and the fourth side frame (14) is provided with a handhold (70). The housing of the mold assembly has an opening (101), and the handhold (70) is adapted to extend out of the housing from the opening (101).

5. The integrated vehicle according to claim 1, characterized in that, Also includes: The second cover plate (30) is pivotally disposed on the second frame (12) and switches between a second open position and a second closed position. When the second cover plate (30) is in the second open position, the second wire groove (121) is open. When the second cover plate (30) is in the second closed position, the second cover plate (30) and the second wire groove (121) together clamp the wire (200).

6. The integrated vehicle according to claim 1, characterized in that, Also includes: An auxiliary cable management platform (60) is detachably connected to the main body of the vehicle (10). A third cable groove (61) is formed in the middle of the auxiliary cable management platform (60). The third cable groove (61) extends along the first direction and is located between the first cable groove (111) and the second cable groove (121).

7. A mold assembly, characterized in that, Includes the integrated vehicle (1) according to any one of claims 1-6.

8. A method for processing wire, said wire being manufactured using a mold assembly according to claim 7, said mold assembly comprising a plurality of molds including a first mold (100) and a second mold, characterized in that, The processing method includes the following steps: The main body of the vehicle (10) is installed on the auxiliary cable management platform (60) of the integrated vehicle (1). Open the first cover plate (20) and the second cover plate (30) of the vehicle body (10). The wire (200) to be formed is placed into the first wire groove (111), the third wire groove (61) of the auxiliary wire management platform (60) and the second wire groove (121), and the first cover plate (20) and the second cover plate (30) are closed to confine the wire (200) to be formed within the first wire groove (111) and the second wire groove (121); The vehicle body (10) is separated from the auxiliary cable management platform (60) and placed into the first mold (100) for processing; The vehicle body (10) is separated from the first mold (100) and placed into the second mold for processing.

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