Laser etching method for high performance single-sided flip chip thin film with double conduction structure

By combining automatic feeding and cleaning mechanisms, the problems of contaminants affecting etching quality and inconvenient debris handling in existing laser etching methods are solved, achieving high-efficiency etching quality and precision.

CN117381173BActive Publication Date: 2026-01-02ZHEJIANG JINGYIN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202311320086.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-10-11
Publication Date
2026-01-02
Estimated Expiration
2043-10-11

AI Technical Summary

Technical Problem

Existing laser etching methods lack pretreatment processes, which leads to surface contaminants affecting etching quality. Furthermore, the debris generated during the etching process is difficult to handle effectively, increasing the complexity of the operation.

Method used

An automatic feeding system combined with a pressure adsorption system and a cleaning mechanism is adopted. Through air pump extraction and electric valve control, the pre-dust removal of workpieces and automatic cleaning of waste after etching are realized. Combined with the design of transmission rods and cams, etching accuracy is ensured.

Benefits of technology

It improves etching quality, reduces the complexity and economic cost of manual cleaning, enhances etching precision, and ensures the stability of the etching process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN117381173B_ABST
Patent Text Reader

Abstract

The application discloses a laser etching method for high-performance single-face chip-on-film with a double conduction structure, a mounting base is arranged on the top of the base, feeding mechanisms are symmetrically arranged on the left and right sides of the mounting base and are mounted in a conveying seat, the conveying seat is fixedly connected to the top of the base, and the feeding mechanisms are connected through cross rods. The laser etching method for high-performance single-face chip-on-film with a double conduction structure, the motor drives the first lead screw to rotate until the cover covers the workpiece and the rubber ring is in contact with the surface of the conveying belt, then the electric valve on the suction pipeline is closed and the electric valve on the conveying pipeline is opened, so that the air pump can extract the waste chips on the etched workpiece through the cover after limiting, and the motor drives the first lead screw to rotate at the same time, so that the second lead screw is driven to move up and down, thereby the position of the double-compression suction seat can be adjusted up and down, and the whole cleaning process does not need additional driving equipment.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film processing, in particular to a laser etching method for high-performance single-sided chip-on-film (COF) with double conduction structure. BACKGROUND

[0002] Chip-on-film (COF) is a kind of chip-on-film packaging technology that fixes driving IC on flexible circuit board. It is a technology that uses soft additional circuit board as a chip packaging carrier to connect chips and soft substrate circuit. COF is the mainstream packaging technology for all display panels, display screens, VR, notebook computers, wearable devices, touch screens, smart phones, etc., accounting for more than 60% of global COF demand. However, the domestic rate is less than 1%. The global demand for COF exceeds 8 billion pieces per year, and the domestic demand reaches 5 billion pieces. Double conduction single-sided COF is a kind of COF. In the production and processing process of COF, laser etching is used to etch a groove on the substrate to provide an interval for IC installation.

[0003] After searching, it is found that the existing laser etching method is typically disclosed in CN104475979A, a kind of transparent conductive film laser etching method, comprising the following steps: using a short wavelength infrared pulse laser to output a pulse laser with a wavelength of 1.4-3.0 microns, a pulse width of 0.1-800 ns, and collimating processing. The short wavelength infrared pulse laser is a fiber laser, the single pulse laser energy is 1-2000 microjoules, and the pulse frequency is 1 kHz to 1 MHz. Its main feature is that it can overcome the high laser focusing accuracy requirement and realize complex problems in the prior art.

[0004] In summary, the existing laser etching method is mostly directly etching the workpiece, i.e., it does not have a pretreatment process, so it is easy to be affected by the contamination on the surface of the workpiece, and the laser etching method cannot process the debris generated during etching, which is more troublesome for manual cleaning. In view of the above problems, the existing equipment needs to be improved. SUMMARY

[0005] The purpose of the present application is to provide a laser etching method for high-performance single-sided COF with double conduction structure to solve the problem that the existing laser etching method is mostly directly etching the workpiece, i.e., it does not have a pretreatment process, so it is easy to be affected by the contamination on the surface of the workpiece, and the laser etching method cannot process the debris generated during etching, which is more troublesome for manual cleaning.

[0006] To achieve the above purpose, the present application provides the following technical scheme: a laser etching method for high-performance single-sided COF with double conduction structure, comprising the following steps:

[0007] S1: automatic feeding: the second motor drives the first drive roller to rotate through the cross bar under the cooperation of the belt transmission structure, the first drive roller rotates and pushes the workpiece in the positioning groove to move, realizing automatic feeding, and the base supports the whole device;

[0008] S2: processing position locking: the transmission rod rotates synchronously with the cross bar under the cooperation of the belt transmission structure, and when the workpiece moves to the processing area, the second motor stops driving the cross bar to rotate, at which time the transmission rod stops synchronously, and the cam on the transmission rod rotates to the top plate, locking the position of the top plate and the dust removal position;

[0009] S3: workpiece limiting: then the first lead screw drives the second lead screw to rotate through the belt transmission structure under the driving action of the motor in the cleaning mechanism, so that the second sliding block drives the complex compression adsorption seat to move upward along the second lead screw and penetrate the through hole to contact the side of the workpiece in the positioning groove that does not need to be etched;

[0010] S4: pre-dust removal: then under the extraction action of the air pump, the suction cup at the top of the complex compression adsorption seat will adsorb and position the workpiece, after adsorption, the electric valve is opened, and then the air pump will extract and remove the dust from the workpiece below through the dust removal pipeline, and the extracted pollutants will be stored in the dust collection box;

[0011] S5: processing procedure switching: after pre-dust removal, the second motor drives the first drive roller to move the workpiece position, and the first motor drives the installation base to rotate, so that the dust removal pipeline can be rotated above another set of feeding mechanism, and the above operations are repeated to limit and pre-dust the workpiece, at this time the laser etching assembly is rotated above the workpiece after dust removal, and the cam on the transmission rod is rotated into the top plate to lock the position of the rotated top plate;

[0012] S6: laser etching: then the laser etching assembly etches the workpiece in the positioning groove under the cooperation of the hydraulic cylinder, after etching, the second motor drives the first drive roller to move the workpiece position, and when the workpiece moves downward below the dust removal pipeline, the etched workpiece is located below the cover;

[0013] S7: cleaning and discharging: when the dust removal pipeline adsorbs and limits the workpiece before dust removal, the first sliding block on the first lead screw drives the cover to move downward along the first lead screw under the driving of the motor until the cover covers the workpiece, and when the air pump extracts the gas in the complex compression adsorption seat for adsorption and limiting, the gas in the cover is extracted synchronously, so that the waste residues remaining on the workpiece during the etching process can be cleaned, and after cleaning, the workpiece can be discharged with the movement of the conveyor belt.

[0014] Preferably, the top of the base is provided with a mounting base, and the top of the mounting base is connected with the top plate through a first motor, the left and right sides of the mounting base are symmetrically provided with feeding mechanisms, the feeding mechanisms are installed in a conveying seat, the conveying seat is fixedly connected to the top of the base, the feeding mechanisms are connected through a cross bar, the cross bar is connected with a second motor through a belt transmission structure, the feeding mechanism comprises a first drive roller, a conveying belt, a positioning groove and a through hole, the outer side of the first drive roller is wrapped with the conveying belt, the conveying belt is provided with the positioning groove, and the positioning groove is provided with the through hole.

[0015] The cleaning mechanism is connected with the conveying seat and connected with the second lead screw through a belt transmission structure, the second lead screw is connected with a second sliding block, one side of the second sliding block is connected with a double compression adsorption seat, the suction disc at the top of the double compression adsorption seat is correspondingly arranged with the through hole, the double compression adsorption seat and the dust removal pipeline are connected with one end of the adsorption pipeline through a branch pipe, the other end of the adsorption pipeline is connected with the conveying pipeline through a pipeline connector and connected with the air inlet of the air pump, at the same time, the adsorption pipeline and the conveying pipeline are provided with electric valves, the air outlet of the air pump is connected with the dust collection box, the dust collection box and the air pump are installed in the interior of the rack, the rack is fixedly connected to the bottom of one side of the top plate, and the bottom of the other side of the top plate is connected with the laser etching assembly through a hydraulic cylinder.

[0016] Preferably, the mounting base is provided with a transmission rod, and the transmission rod is connected with a cam, and the transmission rod is connected with the cross bar through a belt transmission structure.

[0017] Preferably, the cam is rotatably connected with the top plate, the bottom of the top plate is in contact with the ball, and the ball is installed on the top of the mounting base.

[0018] Preferably, the inner side of the conveying belt is symmetrically provided with two groups of first drive rollers, and the first drive rollers are arranged on the two sides of the positioning groove.

[0019] Preferably, the cleaning mechanism comprises a motor, a first lead screw, a limiting seat, a first sliding block, a support rod, a cover and a rubber ring, the output end of the motor is connected with the first lead screw, the first lead screw is connected with the first sliding block, the first sliding block is connected with the cover through the support rod, and the cover is connected with the conveying pipeline.

[0020] Preferably, the motor is installed in the interior of the conveying seat, the top of the conveying seat is fixedly connected with the limiting seat, and the limiting seat is slidably connected with the first sliding block.

[0021] Preferably, the first lead screw is connected with the second lead screw through a belt transmission structure, and the second lead screw is connected with the interior of the conveying seat through a supporting plate.

[0022] Preferably, the bottom of the cover is connected with a rubber ring, and the cover is arranged above the positioning groove.

[0023] Preferably, one side of the second screw rod is provided with a traction rod, and the traction rod is in sliding connection with the second sliding block, and the second screw rods are connected through a belt transmission structure.

[0024] Compared with the prior art, the laser etching method of the high-performance single-sided COF with a double-conduction structure has the beneficial effects that,

[0025] (1) The present application can effectively solve the problem that the existing laser etching method is directly etched on the workpiece, i.e., it does not have a pretreatment process, thereby easily affecting the etching quality due to the contamination on the surface of the workpiece. The gas pump extracts the airflow in the suction cup at the top of the complex pressure adsorption seat through the branch pipe, thereby adsorbing and positioning the workpiece by the complex pressure adsorption seat. At the same time of adsorption, the gas pump extracts dust from the workpiece to be etched through the dust removal pipeline, thereby achieving the purpose of pre-cleaning the workpiece and ensuring the etching quality of the completed device. Compared with the existing etching method, the present application can simultaneously adsorb and position the workpiece and pre-clean the surface of the workpiece through the linkage of the dust removal pipeline, thereby improving the etching quality.

[0026] (2) The present application can effectively solve the problem that the existing laser etching method cannot handle the debris generated during etching, and manual cleaning is troublesome. The motor drives the first screw rod to rotate until the workpiece is covered by the cover and the rubber ring is in contact with the surface of the conveying belt. Then the electric valve on the adsorption pipeline is closed and the electric valve on the conveying pipeline is opened, thereby driving the gas pump to extract and clean the debris on the workpiece after etching through the conveying pipeline and the cover after the limiting and pre-dust removal are completed. At the same time, the motor drives the first screw rod to rotate, which drives the second screw rod to move up and down through the belt transmission structure, thereby adjusting the position of the complex pressure adsorption seat up and down. The entire cleaning process does not require additional driving equipment, thereby reducing economic costs and improving the linkage between structures and functional areas.

[0027] (3) The present application can effectively solve the problem that the existing laser etching method alternately etches and processes, which easily causes the etching assembly to move during etching of the workpiece, thereby affecting the etching effect. The second motor drives the horizontal rod to drive the first drive roller to rotate for automatic feeding through the cooperation of the belt transmission structure, and simultaneously drives the transmission rod and the cam above it to rotate. When the second motor stops driving the first drive roller to rotate for automatic feeding, i.e., the workpiece needs to be etched, the cam is inside the top plate, thereby limiting the position of the laser etching assembly at the bottom of the top plate from moving during etching of the workpiece, and thereby improving the etching precision. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic view of the main view of the structure of the present application;

[0029] Figure 2 is a schematic view of the side view of the structure of the present application;

[0030] Figure 3 is a schematic view of the top view of the loading mechanism of the present application;

[0031] Figure 4 is a schematic view of the enlarged structure at A of the present application Figure 1

[0032] Figure 5 is a schematic view of the enlarged structure at B of the present application Figure 1

[0033] Figure 6 is a schematic view of the main view of the connection relationship of the cleaning mechanism, the second lead screw, the traction rod and the complex compression adsorption seat of the present application;

[0034] Figure 7 is a schematic view of the method of the present application;

[0035] Figure 8 is a schematic view of the main view of the finished product of the present application.

[0036] In the figure: 1, base; 2, mounting base; 3, first motor; 4, top plate; 5, transmission rod; 6, cam; 7, cross rod; 8, second motor; 9, loading mechanism; 901, first drive roller; 902, conveying belt; 903, positioning groove; 904, through hole; 10, belt transmission structure; 11, conveying seat; 12, cleaning mechanism; 1201, motor; 1202, first lead screw; 1203, limiting seat; 1204, first sliding block; 1205, support rod; 1206, cover; 1207, rubber ring; 13, second lead screw; 14, supporting plate; 15, traction rod; 16, second sliding block; 17, complex compression adsorption seat; 18, branch pipe; 19, adsorption pipeline; 20, conveying pipeline; 21, electric valve; 22, air pump; 23, dust collecting box; 24, rack; 25, dust removal pipeline; 26, hydraulic cylinder; 27, laser etching assembly. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0038] Please refer to​​Figures 1-8 The application provides a technical scheme: a laser etching method for a high-performance single-sided chip-on-film with a double-conduction structure, comprising the following steps:

[0039] S1: automatic feeding: the second motor 8 drives the first driving roller 901 to rotate through the horizontal rod 7 under the cooperation of the belt transmission structure 10, and the first driving roller 901 drives the conveying belt 902 to move the workpiece in the positioning groove 903 during rotation, thereby realizing automatic feeding;

[0040] S2: processing position locking: the transmission rod 5 rotates synchronously with the horizontal rod 7 under the cooperation of the belt transmission structure 10, and when the workpiece moves to the processing area, the second motor 8 stops driving the horizontal rod 7 to rotate, at which time the transmission rod 5 synchronously stops, and the cam 6 on the transmission rod 5 rotates to the top plate 4 to lock the position of the top plate 4 and the dust removal position;

[0041] S3: workpiece limiting: then the first lead screw 1202 drives the second lead screw 13 to rotate through the belt transmission structure 10 under the driving action of the motor 1201 in the cleaning mechanism 12, so that the second sliding block 16 drives the double-pressing adsorption seat 17 to move upwards along the second lead screw 13 and penetrate the through hole 904 to contact the side of the workpiece in the positioning groove 903 that does not need to be etched;

[0042] S4: pre-dust removal: then the suction cup at the top of the double-pressing adsorption seat 17 adsorbs and positions the workpiece under the extraction action of the air pump 22, after adsorption is completed, the electric valve 21 is opened, and then the air pump 22 pre-extracts and removes dust from the workpiece below through the dust removal pipeline 25, and the extracted pollutants are discharged into the dust collection box 23 for storage;

[0043] S5: processing procedure switching: after the pre-dust removal is completed, the second motor 8 drives the first driving roller 901 to move the workpiece position, and at the same time, the first motor 3 drives the mounting base 2 to rotate, so that the dust removal pipeline 25 can be rotated above another set of feeding mechanism 9, and the above operations are repeated to limit and pre-dust the workpiece, at this time, the laser etching assembly 27 is rotated above the workpiece after dust removal, and at the same time, the cam 6 on the transmission rod 5 is rotated into the top plate 4 to lock the position of the rotated top plate 4;

[0044] S6: laser etching: then the laser etching assembly 27 etches the workpiece in the positioning groove 903 under the cooperation of the hydraulic cylinder 26, and after etching is completed, the second motor 8 drives the first driving roller 901 to move the workpiece position, and when the workpiece moves downwards to below the dust removal pipeline 25, the etched workpiece is located below the cover 1206;

[0045] S7: cleaning and discharging: that is, when the dust removal pipeline 25 is dusted, the first slider 1204 on the first lead screw 1202 drives the cover shell 1206 to move downward along the first lead screw 1202 until the cover shell 1206 covers the workpiece, and the gas pump 22 extracts the gas in the complex pressure adsorption seat 17 to adsorb the limit, which will simultaneously extract the gas in the cover shell 1206, so as to clean the waste residues remaining on the workpiece during etching, and after cleaning, the waste residues will be discharged with the movement of the conveying belt 902.

[0046] The top of the base 1 is provided with a mounting base 2, and the top of the mounting base 2 is connected with the top plate 4 through the first motor 3. The left and right sides of the mounting base 2 are symmetrically provided with a feeding mechanism 9, and the feeding mechanism 9 is installed in the conveying seat 11, and the conveying seat 11 is fixedly connected to the top of the base 1. The feeding mechanisms 9 are connected through the cross bar 7, and the cross bar 7 is connected with the second motor 8 through the belt transmission structure 10. The feeding mechanism 9 comprises a first drive roller 901, a conveying belt 902, a positioning groove 903 and a through hole 904, and the outer side of the first drive roller 901 is wrapped with the conveying belt 902. The conveying belt 902 is provided with a positioning groove 903, and the positioning groove 903 is provided with a through hole 904.

[0047] The mounting base 2 is provided with a transmission rod 5, and the transmission rod 5 is connected with a cam 6, and the transmission rod 5 is connected with the cross bar 7 through the belt transmission structure 10.

[0048] The cam 6 is rotatably connected with the top plate 4, and the bottom of the top plate 4 is in contact with the ball, and the ball is installed on the top of the mounting base 2.

[0049] The inner side of the conveying belt 902 is symmetrically provided with two groups of first drive rollers 901, and the first drive rollers 901 are arranged on the two sides of the positioning groove 903.

[0050] The cleaning mechanism 12 is connected with the conveying seat 11, and the cleaning mechanism 12 is connected with the second lead screw 13 through the belt transmission structure 10, and the second lead screw 13 is connected with the second slider 16. One side of the second slider 16 is connected with the complex pressure adsorption seat 17, and the suction cup on the top of the complex pressure adsorption seat 17 corresponds to the through hole 904. The complex pressure adsorption seat 17 and the dust removal pipeline 25 are connected with one end of the adsorption pipeline 19 through the branch pipe 18, and the other end of the adsorption pipeline 19 and the conveying pipeline 20 are connected with the gas inlet of the gas pump 22 through the pipeline connector. The adsorption pipeline 19 and the conveying pipeline 20 are both provided with an electric valve 21. The gas outlet of the gas pump 22 is connected with the dust collection box 23, and the dust collection box 23 and the gas pump 22 are both installed in the inside of the rack 24. The rack 24 is fixedly connected to the bottom of one side of the top plate 4, and the other side of the bottom of the top plate 4 is connected with the laser etching assembly 27 through the hydraulic cylinder 26.

[0051] The cleaning mechanism 12 comprises a motor 1201, a first lead screw 1202, a limiting seat 1203, a first sliding block 1204, a supporting rod 1205, a cover 1206 and a rubber ring 1207, and the output end of the motor 1201 is connected with the first lead screw 1202, and the first lead screw 1202 is connected with the first sliding block 1204, and the first sliding block 1204 is connected with the cover 1206 through the supporting rod 1205, and the cover 1206 is connected with the conveying pipeline 20.

[0052] The motor 1201 is installed in the interior of the conveying seat 11, and the top of the conveying seat 11 is fixedly connected with the limiting seat 1203, and the limiting seat 1203 is slidably connected with the first sliding block 1204.

[0053] The first lead screw 1202 is connected with the second lead screw 13 through the belt transmission structure 10, and the second lead screw 13 is connected with the interior of the conveying seat 11 through the supporting plate 14.

[0054] The bottom of the cover 1206 is connected with the rubber ring 1207, and the cover 1206 is arranged above the positioning groove 903.

[0055] One side of the second lead screw 13 is provided with a traction rod 15, and the traction rod 15 is slidably connected with the second sliding block 16, and the second lead screws 13 are connected through the belt transmission structure 10.

[0056] The working principle and use process of the present application are as follows: the second motor 8 drives the first driving roller 901 to rotate through the cross rod 7 under the cooperation of the belt transmission structure 10, the first driving roller 901 drives the workpiece in the positioning groove 903 to move in the process of rotating, automatic feeding is realized, the transmission rod 5 rotates synchronously with the cross rod 7 under the cooperation of the belt transmission structure 10, when the workpiece moves to the machining area, the second motor 8 stops driving the cross rod 7 to rotate, at this time, the transmission rod 5 synchronously stops, and the cam 6 on the transmission rod 5 rotates to the top plate 4, and the position of the top plate 4 is locked immediately;

[0057] Then the first lead screw 1202 drives the second lead screw 13 to rotate through the belt transmission structure 10 under the driving action of the motor 1201, so that the second sliding block 16 drives the complex pressure adsorption seat 17 to move upwards along the second lead screw 13 and penetrate the through hole 904 to contact the side of the workpiece in the positioning groove 903 which does not need to be etched, and the workpiece is adsorbed and positioned by the suction cup on the top of the complex pressure adsorption seat 17 under the extraction action of the air pump 22, after the adsorption is completed, the electric valve 21 is opened, and then the air pump 22 extracts and removes dust from the workpiece below through the dust removal pipeline 25, and the extracted pollutants are discharged into the dust collecting box 23 for storage.

[0058] After the pre-dust removal, the second motor 8 drives the first driving roller 901 to move the workpiece position, while the first motor 3 drives the mounting base 2 to rotate, so that the dust removal pipeline 25 can be rotated to the upper side of the other set of feeding mechanism 9, and the above operation is repeated to position the workpiece and pre-dust removal, at this time the laser etching assembly 27 is rotated to the upper side of the workpiece after dust removal, while the cam 6 on the transmission rod 5 is rotated to the top plate 4, the position of the top plate 4 after rotation is locked, and then the laser etching assembly 27 cooperates with the hydraulic cylinder 26 to etch the workpiece in the positioning groove 903, after etching, the second motor 8 drives the first driving roller 901 to move the workpiece position, while the workpiece after etching is located below the cover 1206 when the workpiece moves downward to the lower side of the dust removal pipeline 25.

[0059] When the dust removal pipeline 25 is adsorbed and positioned before dust removal, the first sliding block 1204 on the first lead screw 1202 drives the cover 1206 to move downward along the first lead screw 1202 under the drive of the motor 1201 until the cover 1206 covers the workpiece, and when the air pump 22 extracts the gas in the complex pressure adsorption seat 17 for adsorption and positioning, the gas in the cover 1206 is extracted synchronously, so that the waste residues remaining on the workpiece during the etching process can be cleaned, and after cleaning, the workpiece can be discharged with the movement of the conveying belt 902.

[0060] Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify the technical solutions described in the foregoing embodiments, or make equivalent replacements to part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method of laser etching a high performance single-sided flip chip thin film with a double passivation structure, characterized in that, The method comprises the following steps: S1: automatic feeding: the second motor (8) drives the first drive roller (901) to rotate through the cross rod (7) under the cooperation of the belt transmission structure (10), and the first drive roller (901) drives the workpiece in the positioning groove (903) to move in the process of rotation, so that automatic feeding is realized, and the base (1) supports the whole device; S2: processing position locking: the transmission rod (5) rotates synchronously with the cross rod (7) under the cooperation of the belt transmission structure (10), and when the workpiece moves to the processing area, the second motor (8) stops driving the cross rod (7) to rotate, at this time the transmission rod (5) synchronously stops, and the cam (6) on the transmission rod (5) rotates into the top plate (4), so that the position of the top plate (4) is locked and the dust removal position is locked; S3: workpiece limiting: then the first lead screw (1202) drives the second lead screw (13) to rotate through the belt transmission structure (10) under the driving action of the motor (1201) in the cleaning mechanism (12), so that the second sliding block (16) drives the negative pressure adsorption seat (17) to move upwards along the second lead screw (13) and penetrate the through hole (904) and the side of the workpiece in the positioning groove (903) which does not need to be etched; S4: pre-dust removal: then under the extraction action of the air pump (22), the suction cup at the top of the negative pressure adsorption seat (17) adsorbs and positions the workpiece, after adsorption, the electric valve (21) is opened, then the air pump (22) extracts and removes the dust from the workpiece below through the dust removal pipeline (25), and the extracted pollutants are discharged into the dust collection box (23) for storage; S5: processing procedure switching: after pre-dust removal, the second motor (8) drives the first drive roller (901) to move the workpiece position, and the first motor (3) drives the installation base (2) to rotate, so that the dust removal pipeline (25) can be rotated above another set of feeding mechanism (9), and the above operation is repeated to limit and pre-dust the workpiece, at this time the laser etching assembly (27) is rotated above the workpiece after dust removal, and the cam (6) on the transmission rod (5) is rotated into the top plate (4), so that the position of the rotated top plate (4) is locked; S6: laser etching: then the laser etching assembly (27) etches the workpiece in the positioning groove (903) under the cooperation of the hydraulic cylinder (26), and after etching, the second motor (8) drives the first drive roller (901) to move the workpiece position, and when the workpiece moves downwards below the dust removal pipeline (25), the etched workpiece is below the cover (1206); S7: cleaning and discharging: that is, when the dust removal pipeline (25) is dusted, the first slider (1204) on the first lead screw (1202) drives the cover (1206) to move downward along the first lead screw (1202) under the drive of the motor (1201) until the cover (1206) covers the workpiece, and the gas pump (22) extracts the gas in the adsorption seat (17) to adsorb the limit, which will simultaneously extract the gas in the cover (1206), so as to clean the waste residues remaining on the workpiece during etching, and after cleaning, the workpiece will be discharged along with the movement of the conveying belt (902); The top of the base (1) is provided with a mounting base (2), and the top of the mounting base (2) is connected with the top plate (4) through the first motor (3). The mounting base (2) is symmetrically provided with a feeding mechanism (9) on the left and right sides, and the feeding mechanism (9) is installed in the conveying seat (11), and the conveying seat (11) is fixedly connected to the top of the base (1). The feeding mechanism (9) is connected by a cross bar (7), and the cross bar (7) is connected with the second motor (8) through a belt transmission structure (10). The feeding mechanism (9) comprises a first drive roller (901), a conveying belt (902), a positioning groove (903) and a through hole (904), and the outer side of the first drive roller (901) is wrapped with the conveying belt (902). The conveying belt (902) is provided with a positioning groove (903), and the positioning groove (903) is provided with a through hole (904). The cleaning mechanism (12) is connected with the conveying seat (11), and the cleaning mechanism (12) is connected with the second lead screw (13) through the belt transmission structure (10), and the second lead screw (13) is connected with the second slider (16). One side of the second slider (16) is connected with a negative pressure adsorption seat (17), and the suction disc on the top of the negative pressure adsorption seat (17) is correspondingly arranged with the through hole (904). The negative pressure adsorption seat (17) and the dust removal pipeline (25) are connected with one end of the adsorption pipeline (19) through the branch pipe (18). The other end of the adsorption pipeline (19) and the conveying pipeline (20) are connected with the air inlet of the air pump (22) through the pipeline connector. The adsorption pipeline (19) and the conveying pipeline (20) are provided with electric valves (21). The air outlet of the air pump (22) is connected with the dust collection box (23), and the dust collection box (23) and the air pump (22) are installed in the inside of the rack (24). The rack (24) is fixedly connected to the bottom of one side of the top plate (4), and the other side of the bottom of the top plate (4) is connected with the laser etching assembly (27) through the hydraulic cylinder (26).

2. The method of claim 1, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. The mounting base (2) is provided with a transmission rod (5), and the transmission rod (5) is connected with a cam (6). The transmission rod (5) is connected with the cross bar (7) through the belt transmission structure (10).

3. The method of claim 2, wherein the high performance single-sided COF with a dual conduction structure is laser-etched by using a laser beam having a wavelength of 1064 nm. The cam (6) is rotatably connected with the top plate (4), and the bottom of the top plate (4) is in contact with a ball, and the ball is installed on the top of the mounting base (2).

4. The method of claim 1, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. The inner side of the conveying belt (902) is symmetrically provided with two groups of first driving rollers (901), and the first driving rollers (901) are arranged on both sides of the positioning groove (903).

5. The method of claim 1, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. The cleaning mechanism (12) comprises a motor (1201), a first lead screw (1202), a limiting seat (1203), a first sliding block (1204), a supporting rod (1205), a cover (1206) and a rubber ring (1207), the output end of the motor (1201) is connected with the first lead screw (1202), the first lead screw (1202) is connected with the first sliding block (1204), the first sliding block (1204) is connected with the cover (1206) through the supporting rod (1205), and the cover (1206) is connected with the conveying pipeline (20). 6.The method of claim 5, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. The motor (1201) is installed in the conveying seat (11), the top of the conveying seat (11) is fixedly connected with the limiting seat (1203), and the limiting seat (1203) is slidably connected with the first sliding block (1204).

7. The method of claim 6, wherein the high performance single-sided COF with a dual conduction structure is laser-etched by using a laser beam having a wavelength of 1064 nm. The first lead screw (1202) is connected with the second lead screw (13) through the belt transmission structure (10), and the second lead screw (13) is connected with the inside of the conveying seat (11) through the supporting plate (14). 8.The method of claim 7, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. The bottom of the cover (1206) is connected with the rubber ring (1207), and the cover (1206) is arranged above the positioning groove (903). 9.The method of claim 1, wherein the high performance single-sided COF with a dual conduction structure is laser-etched. One side of the second lead screw (13) is provided with a traction rod (15), the traction rod (15) is slidably connected with the second sliding block (16), and the second lead screws (13) are connected through the belt transmission structure (10).

Citation Information

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