Magnetic abrasive particle flow polishing system and method

By adjusting the number of abrasive particles using a magnetic suction device in the magnetic abrasive flow polishing system, the problems of abrasive fluid blockage and difficulty in controlling the polishing effect are solved, achieving flexible and varied polishing effects and high-efficiency production.

CN117381548BActive Publication Date: 2026-04-28SHENZHEN FOREACH TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN FOREACH TECH CO LTD
Filing Date
2023-11-14
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Abrasive fluids can easily clog channels and are difficult to control the polishing effect, especially in the polishing of tiny internal holes where precision machining is difficult to achieve.

Method used

The magnetic abrasive flow polishing system includes a storage tank, an inlet pipe, an outlet pipe, a pump body, a return pipe, and a magnetic suction device. The magnetic suction device attracts magnetic abrasive particles to the inner wall of the return pipe, and the number of abrasive particles in the inlet pipe is adjusted to control the polishing effect.

Benefits of technology

It reduces the possibility of abrasive fluid clogging the channels, achieves flexible and varied polishing effects, improves the stability and consistency of polishing processes, reduces manual maintenance time, and increases production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a magnetic abrasive flow polishing system and method, and belongs to the polishing technical field.The magnetic abrasive flow polishing system comprises a liquid storage pool, an inlet pipeline, an outlet pipeline, a pump body, a backflow pipeline and a magnetic attraction device.The inlet pipeline is connected with the liquid storage pool and the inlet end of a polishing channel.The outlet pipeline is connected with the liquid storage pool and the outlet end of the polishing channel.The backflow pipeline is connected with the inlet pipeline and the liquid storage pool.The magnetic attraction device is installed outside the backflow pipeline.The magnetic attraction device is used for adsorbing the magnetic abrasive particles in the abrasive particle fluid in the backflow pipeline on the inner wall surface of the backflow pipeline, so as to adjust the number of the magnetic abrasive particles in the abrasive particle fluid in the inlet pipeline.The magnetic abrasive flow polishing system and method can adsorb the magnetic abrasive particles on the backflow pipeline, adjust the number of the magnetic abrasive particles in the abrasive particle fluid in the inlet pipeline, reduce the possibility of blocking the whole system channel by the abrasive particle fluid, and change the polishing effect.
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Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to a magnetic abrasive flow polishing system and method. Background Technology

[0002] Abrasive flow machining is a cutting-edge machining method that uses an abrasive medium (a flowable mixture containing abrasive particles) under pressure to flow over the surface of a workpiece to be machined. This deburrs, remove flash, and round corners, reducing surface roughness and achieving a high-precision finish. Tiny internal holes in metal parts are typically smaller than 2mm, making them difficult to process using physical or chemical polishing methods. Therefore, abrasive flow polishing with magnetic microparticles is commonly used to polish these micro-holes. However, abrasive flow liquids contain impurities and can easily deposit in the pipes, causing blockages. Furthermore, different channel sizes require different polishing effects, making it difficult to flexibly control the polishing results using existing abrasive flow machining techniques. Summary of the Invention

[0003] Therefore, it is necessary to provide a magnetic abrasive flow polishing system and method to solve the technical problems of easy clogging of channels and difficulty in controlling polishing effect of abrasive fluid in the prior art.

[0004] Therefore, according to one aspect of this application, a magnetic abrasive flow polishing system is provided, the magnetic abrasive flow polishing system comprising:

[0005] The storage tank is used to store abrasive fluid, which contains magnetic abrasive particles.

[0006] The inlet pipe is connected at one end to the liquid storage tank and at the other end to the inlet end of the polishing channel of the part to be processed.

[0007] The outlet pipe is connected at one end to the liquid storage tank and at the other end to the outlet end of the channel to be polished.

[0008] Pump body, installed on the inlet pipe;

[0009] The return pipe is connected at both ends to the inlet pipe and the storage tank, respectively, with the connection point between the return pipe and the inlet pipe located on the side of the pump body furthest from the storage tank; and

[0010] The magnetic suction device is installed on the outside of the return pipe. It is used to attract magnetic abrasive particles in the abrasive fluid in the return pipe to the inner wall of the return pipe, so as to adjust the number of magnetic abrasive particles in the abrasive fluid in the inlet pipe.

[0011] Optionally, two magnetic suction devices are provided, which are symmetrically distributed on opposite sides of the return pipe.

[0012] Optionally, the magnetic attraction device includes:

[0013] The permanent magnet is located outside the return pipe; and

[0014] The linear motion mechanism, connected to the permanent magnet, is used to move the permanent magnet closer to or away from the return pipe, thereby changing the attraction of the permanent magnet to the magnetic abrasive particles in the return pipe.

[0015] Optionally, the magnetic attraction device includes an electromagnet whose magnetic force is adjustable when energized.

[0016] Optionally, the return pipe at the magnetic attraction device protrudes outward to form an annular protrusion. After the magnetic attraction device is activated, the magnetic abrasive particles are attracted into the annular protrusion.

[0017] Optionally, the return conduit includes a thin tube section connected to the annular protrusion, wherein one end of the annular protrusion for the abrasive fluid to flow out is smoothly connected to the thin tube section.

[0018] Optionally, the storage tank is equipped with a stirrer for agitating the abrasive fluid.

[0019] Optionally, a pressure sensor for detecting the pressure inside the inlet pipe is installed on the inlet pipe.

[0020] Optionally, a valve for controlling the opening and closing of the return pipe is provided on the return pipe.

[0021] Optionally, the inlet pipe is a flexible hose, and a flow control device is installed on the inlet pipe. The flow control device controls the flow rate of the inlet pipe by squeezing the inlet pipe.

[0022] The beneficial effects of the magnetic abrasive flow polishing system provided in this application are as follows: Compared with the prior art, the magnetic abrasive flow polishing system of this application includes a storage tank, an inlet pipe, an outlet pipe, a pump body, a return pipe, and a magnetic suction device. The inlet pipe connects the storage tank and the inlet end of the channel to be polished, the outlet pipe connects the storage tank and the outlet end of the channel to be polished, the return pipe connects the inlet pipe and the storage tank, and the magnetic suction device is installed outside the return pipe. In this way, the magnetic suction device can adsorb the magnetic abrasive particles in the abrasive fluid in the return pipe onto the inner wall surface of the return pipe, thereby adjusting the number of magnetic abrasive particles in the abrasive fluid in the inlet pipe and reducing the possibility of the abrasive fluid clogging the entire system channel. Furthermore, changing the number of magnetic abrasive particles in the abrasive fluid in the inlet pipe can also change the polishing effect, making the polishing process of the magnetic abrasive flow polishing system more flexible and versatile.

[0023] According to another aspect of this application, a magnetic abrasive flow polishing method is provided, applied to the magnetic abrasive flow polishing system as described above, the magnetic abrasive flow polishing method comprising the following steps:

[0024] Prepare the magnetic abrasive flow polishing system as described above;

[0025] Before the magnetic abrasive flow polishing system is started, magnetic abrasive particles are adsorbed onto the inner wall of the return pipe. After the magnetic abrasive flow polishing system is started, the passage of the magnetic abrasive flow polishing system is first flushed with a liquid that does not contain magnetic abrasive particles.

[0026] Magnetic abrasive particles are mixed into a liquid to polish the channel to be polished. The amount of magnetic abrasive particles mixed into the liquid is adjusted according to the size of the channel to be polished.

[0027] After the polishing channel is polished, magnetic abrasive particles are adsorbed onto the inner wall surface of the return pipe.

[0028] The passage of the magnetic abrasive flow polishing system is flushed again with a liquid that does not contain magnetic abrasive particles.

[0029] The beneficial effects of the magnetic abrasive flow polishing method provided in this application are as follows: Compared with the prior art, the magnetic abrasive flow polishing method of this application first flushes the passage of the magnetic abrasive flow polishing system with a liquid that does not contain magnetic abrasive particles before polishing, ensuring that the passage is unobstructed and reducing the possibility of abrasive fluid clogging the entire system passage. When polishing the channel, the number of magnetic abrasive particles mixed into the liquid can also be adjusted according to the size of the channel to achieve the best polishing effect. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of the magnetic abrasive flow polishing system provided in the embodiments of this application;

[0032] Figure 2 A schematic diagram of the structure of the magnetic abrasive flow polishing system provided in this application, in which magnetic abrasive particles are adsorbed onto the annular protrusion.

[0033] Figure 3 A schematic diagram of the flow control device of the magnetic abrasive flow polishing system provided in this application embodiment when it squeezes the inlet pipe;

[0034] Figure 4 A flowchart of a magnetic abrasive flow polishing method provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Storage tank; 2. Inlet pipe; 3. Outlet pipe; 4. Pump body; 5. Return pipe; 510. Annular protrusion; 520. Thin tube section; 6. Magnetic attraction device; 610. Permanent magnet; 620. Linear motion mechanism; 7. Stirrer; 8. Pressure sensor; 9. Valve; 10. Controller; 11. Display; 12. Flow control device; 1210. Electromagnetic coil; 1220. Bag body; 1230. Magnetic bead;

[0037] 100. Parts to be processed; 101. Channel to be polished;

[0038] 200. Magnetic abrasive particles. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] According to one aspect of this application, please refer to the following: Figures 1 to 3This application provides a magnetic abrasive flow polishing system, which includes a storage tank 1, an inlet pipe 2, an outlet pipe 3, a pump body 4, a return pipe 5, and a magnetic suction device 6. The storage tank 1 stores abrasive fluid containing magnetic abrasive particles 200, which mix with the liquid to form the abrasive fluid. One end of the inlet pipe 2 is connected to the storage tank 1, and the other end is connected to the inlet end of the polishing channel 101 of the workpiece 100. One end of the outlet pipe 3 is connected to the storage tank. 1. The other end of the outlet pipe 3 is connected to the outlet end of the polishing channel 101; the pump body 4 is installed on the inlet pipe 2; the two ends of the return pipe 5 are respectively connected to the inlet pipe 2 and the storage tank 1, and the connection between the return pipe 5 and the inlet pipe 2 is located on the side of the pump body 4 away from the storage tank 1; the magnetic suction device 6 is installed outside the return pipe 5, and the magnetic suction device 6 is used to attract the magnetic abrasive particles 200 in the abrasive fluid in the return pipe 5 to the inner wall surface of the return pipe 5, so as to adjust the number of magnetic abrasive particles 200 in the abrasive fluid in the inlet pipe 2.

[0046] In this embodiment, the magnetic abrasive flow polishing system includes a storage tank 1, an inlet pipe 2, an outlet pipe 3, a pump body 4, a return pipe 5, and a magnetic suction device 6. The inlet pipe 2 connects the storage tank 1 and the inlet end of the polishing channel 101, the outlet pipe 3 connects the storage tank 1 and the outlet end of the polishing channel 101, and the return pipe 5 connects the inlet pipe 2 and the storage tank 1. The magnetic suction device 6 is installed outside the return pipe 5. In this way, the magnetic suction device 6 can attract the magnetic abrasive particles 200 in the abrasive fluid in the return pipe 5 to the inner wall surface of the return pipe 5, thereby adjusting the number of magnetic abrasive particles 200 in the abrasive fluid in the inlet pipe 2 and reducing the possibility of the abrasive fluid clogging the entire system channel. Changing the number of magnetic abrasive particles 200 in the abrasive fluid in the inlet pipe 2 can also change the polishing effect, making the polishing process of the magnetic abrasive flow polishing system more flexible and versatile.

[0047] In one embodiment, please refer to [the relevant documentation / reference]. Figure 1 and Figure 2 There are two magnetic attraction devices 6, which are symmetrically distributed on opposite sides of the return pipe 5.

[0048] In this way, the two magnetic attraction devices 6 can more forcefully attract the magnetic abrasive particles 200 in the circuit pipe, and the symmetrical distribution of the two magnetic attraction devices 6 can make the magnetic force evenly distributed, attracting as many magnetic abrasive particles 200 as possible.

[0049] In other embodiments, the number of magnetic attraction devices 6 may be three, four, or more, with multiple magnetic attraction devices 6 evenly distributed along the circumference of the return pipe 5. The specific number of magnetic attraction devices 6 is selected according to actual needs and is not limited here.

[0050] In one specific embodiment, please refer to the following: Figure 1 and Figure 2 The magnetic attraction device 6 includes a permanent magnet 610 and a linear motion mechanism 620. The permanent magnet 610 is located outside the return pipe 5. The linear motion mechanism 620 is connected to the permanent magnet 610 and is used to drive the permanent magnet 610 closer to or further away from the return pipe 5 to change the attraction force of the permanent magnet 610 on the magnetic abrasive particles 200 inside the return pipe 5.

[0051] Specifically, the closer the permanent magnet 610 is to the outer surface of the return pipe 5, the stronger the attraction of the permanent magnet 610 to the magnetic abrasive particles 200 of the return pipe 5, and the more magnetic abrasive particles 200 can be adsorbed onto the inner wall surface of the return pipe 5; the closer the permanent magnet 610 is to the outer surface of the return pipe 5, the weaker the attraction of the permanent magnet 610 to the magnetic abrasive particles 200 of the return pipe 5, and the fewer magnetic abrasive particles 200 can be adsorbed onto the inner wall surface of the return pipe 5.

[0052] For example, when the linear motion mechanism 620 drives the permanent magnet 610 away from the outer surface of the return pipe 5 by at least 10 cm, the permanent magnet 610 no longer attracts the magnetic abrasive particles 200 of the return pipe 5, and the magnetic abrasive particles 200 can move freely with the liquid.

[0053] In another specific embodiment, the magnetic attraction device 6 includes an electromagnet with adjustable magnetic force when energized, which can more easily change the electromagnet's ability to attract the magnetic abrasive particles 200 of the return pipe 5.

[0054] Furthermore, the electromagnet is configured as a ring, with the axis of the ring electromagnet coinciding with the axis of the return pipe 5, resulting in a more uniform adsorption capacity for the magnetic abrasive particles 200, and enabling the adsorption of as many magnetic abrasive particles 200 as possible.

[0055] In another embodiment, please refer to Figure 2 The return pipe 5 at the magnetic attraction device 6 protrudes outward to form an annular protrusion 510. After the magnetic attraction device 6 is activated, the magnetic abrasive particles 200 are attracted into the annular protrusion 510.

[0056] Specifically, the annular protrusion 510 forms an expanded receiving space compared to the other parts of the return pipe 5. The magnetic abrasive particles 200 are adsorbed in the receiving space of the annular protrusion 510, leaving space for the normal flow of liquid without the inclusion of magnetic abrasive particles 200.

[0057] In one specific embodiment, please refer to Figure 2 The return pipe 5 includes a thin tube section 520 connected to the annular protrusion 510, and the end of the annular protrusion 510 from which the abrasive fluid flows out is smoothly connected to the thin tube section 520.

[0058] Thus, the end of the annular protrusion 510 from which the abrasive fluid flows out is smoothly connected to the thin tube 520. After the magnetic suction device 6 no longer attracts the magnetic abrasive particles 200, the magnetic abrasive particles 200 can easily detach from the annular protrusion 510 along the smooth transition joint with the fluid, thus preventing the magnetic abrasive particles 200 from accumulating in the annular protrusion 510.

[0059] In another embodiment, please refer to Figure 1 The storage tank 1 is equipped with a stirrer 7 for stirring the abrasive fluid. After the stirrer 7 is started, it can fully mix the magnetic abrasive particles 200 and the liquid to obtain high-quality abrasive fluid.

[0060] In another embodiment, please refer to Figure 1 A pressure sensor 8 is installed on the inlet pipe 2 to detect the pressure inside the inlet pipe 2.

[0061] Specifically, based on the detection data of the pressure sensor 8, the pressure value inside the inlet pipe 2 can be obtained, and the content of magnetic abrasive particles 200 in the abrasive fluid can be roughly calculated. If the content does not meet the preset amount, it can be combined with the magnetic attraction device 6 to appropriately increase or decrease the magnetic abrasive particles 200 attracted by the magnetic attraction device 6, so that the abrasive fluid in the inlet pipe 2 can reach the preset content of magnetic abrasive particles 200.

[0062] In another embodiment, please refer to Figure 1 The return pipe 5 is equipped with a valve 9 for controlling the opening and closing of the return pipe 5. Before the magnetic abrasive flow polishing system officially starts polishing, the valve 9 is closed so that the abrasive fluid flows only in the inlet pipe 2, reducing unnecessary flow paths and improving polishing efficiency.

[0063] Furthermore, the valve body is a solenoid valve.

[0064] In other embodiments, the magnetic abrasive flow polishing system further includes a controller 10, which is electrically connected to the pump body 4 to control the start and stop of the pump body 4, electrically connected to the linear motion mechanism 620 to control the adsorption capacity of the permanent magnet 610 on the magnetic abrasive particles 200 in the return pipe 5, electrically connected to the stirrer 7 to control the start and stop of the stirrer 7, electrically connected to the pressure sensor 8 to receive the detection data of the pressure sensor 8, and electrically connected to the valve 9 to control the opening and closing of the valve 9.

[0065] In other embodiments, the magnetic abrasive flow polishing system also includes a display 11 electrically connected to the controller 10, which displays various data from the controller 10 to allow operators to understand the operating status of the magnetic abrasive flow polishing system.

[0066] In another embodiment, please refer to [the document / reference]. Figure 1and Figure 3 The inlet pipe 2 is a flexible hose, and a flow control device 12 is installed on the inlet pipe 2. The flow control device 12 controls the flow of the inlet pipe 2 by squeezing the inlet pipe 2.

[0067] In the embodiments of this application, please refer to Figure 3 The flow control device 12 is mainly used to control the flow rate of liquid in the inlet pipe 2 that does not contain magnetic abrasive particles 200. The flow control device 12 includes an electromagnetic coil 1210, a bag body 1220, and magnetic beads 1230. The electromagnetic coil 1210 is fixedly installed on the outer side of the inlet pipe 2; the bag body 1220 is fixedly installed between the inlet pipe 2 and the electromagnetic coil 1210. The side of the bag body 1220 near the electromagnetic coil 1210 is made of a rigid material that will not deform, while the side of the bag body 1220 near the inlet pipe 2 is made of a flexible material that can deform; the magnetic beads 1230 are placed inside the bag body 1220. When the electromagnetic coil 1210 is energized, it generates a magnetic field. The magnetic beads 1230 are subjected to the force of the magnetic field and will quickly converge towards the electromagnetic coil 1210. Since the side of the bag body 1220 near the inlet pipe 2 is made of a flexible material, the large number of converged magnetic beads 1230 will squeeze the flexible inlet pipe 2, thereby reducing the flow rate of liquid in the inlet pipe and achieving the function of throttling or intercepting flow.

[0068] Understandably, both the electromagnetic coil 1210 and the bag body 1220 are annular structures to facilitate better compression of the flexible inlet pipe 2.

[0069] Furthermore, the bag body 1220 extends vertically, and the electromagnetic coil 1210 is positioned at the higher end of the bag body 1220. This allows the magnetic beads 1230 to fall downwards under their own weight when the current to the electromagnetic coil 1210 is cut off. Compared to positioning the electromagnetic coil 1210 at the lower end of the bag body 1220, positioning it at a higher level helps to prevent the magnetic beads 1230 from clumping together after the power to the electromagnetic coil 1210 is cut off.

[0070] Furthermore, the electromagnetic coil 1210 is also electrically connected to the controller 10. The current of the electromagnetic coil 1210 can be adjusted by the controller 10. Under different current magnitudes, the strength of the electromagnetic field generated by the electromagnetic coil 1210 will also change, and it can be approximately regarded as a linear proportional relationship. The current can be adjusted and controlled according to the actual throttling situation.

[0071] Furthermore, the controller 10 can also automatically adjust the current value based on the pressure changes of the pressure sensor 8. Alternatively, a flow sensor electrically connected to the controller 10 can be installed in the inlet pipe 2 to determine whether the current flow rate meets the usage requirements, thereby forming a closed-loop automatic electromagnetic field adjustment process to achieve precise adjustment.

[0072] In other embodiments, the flow control device 12 can also be an annular airbag fitted outside the flexible inlet pipe 2. Inflating the annular airbag can cause it to expand, thereby compressing the inlet pipe 2. The degree of compression on the inlet pipe 2 can be controlled by controlling the annular airbag. It is understood that the specific structural design of the flow control device 12 can be selected according to actual needs and is not limited to a single design here.

[0073] According to another aspect of this application, please refer to Figure 4 The embodiments of this application also provide a magnetic abrasive flow polishing method, applied to the magnetic abrasive flow polishing system as described above, the magnetic abrasive flow polishing method comprising the following steps:

[0074] Step S1: Prepare the magnetic abrasive flow polishing system as described above.

[0075] Step S2: Before the magnetic abrasive flow polishing system is started, the magnetic abrasive particles 200 are adsorbed on the inner wall of the return pipe 5. After the magnetic abrasive flow polishing system is started, the passage of the magnetic abrasive flow polishing system is first flushed with fluid that does not contain magnetic abrasive particles 200.

[0076] It is understandable that both completely free of magnetic abrasive particles 200 and containing trace amounts of magnetic abrasive particles 200 (whose impact on the system is negligible) can be considered as not containing magnetic abrasive particles 200.

[0077] Specifically, when the machine is first turned on, the liquid without magnetic abrasive particles 200 can flow smoothly throughout the entire passage, cleaning all parts of the passage, removing obstacles to the inflow of abrasive fluid, and preventing accumulation caused by the failure of a certain component.

[0078] The following explains the specific process by which magnetic abrasive particles 200 are adsorbed onto the inner wall of the return pipe 5:

[0079] The controller 10 sends a start action command to the pump body 4, a stop action command to the agitator 7, and an open state command to the valve 9. The abrasive fluid flows in the inlet pipe 2 and is diverted into the return pipe 5. The fluid in the inlet pipe 2 is normally delivered to the polishing channel 101 of the workpiece 100 to be processed, and then flows back to the storage tank 1 from the outlet pipe 3.

[0080] Simultaneously, the control chip controls the linear motion mechanism 620 to move the permanent magnet 610 closer to the return pipe 5. Under the influence of the magnetic field, the magnetic abrasive particles 200 in the return pipe 5 at the permanent magnet 610 adhere tightly to the inner wall surface of the annular protrusion 510 of the return pipe 5 (e.g., ...). Figure 2 (As shown).

[0081] The magnetic abrasive flow polishing system operates in this state for 5 minutes. The magnetic abrasive particles 200 have been adsorbed into the return pipe 5 in the entire system. Only liquid without magnetic abrasive particles 200 runs in the system pipe. At this time, the magnetic abrasive flow polishing system can be started and stopped at any state without worrying about the deposition of magnetic abrasive particles 200 in the pipe, thus avoiding pipe blockage.

[0082] Step S3: Mix magnetic abrasive particles 200 into the fluid to polish the channel 101 to be polished. Adjust the amount of magnetic abrasive particles 200 mixed into the fluid according to the size of the channel 101 to be polished.

[0083] The following explains the specific process by which the magnetic abrasive particles 200 enter the entire system pathway:

[0084] The controller 10 controls the linear motion mechanism 620 to move the permanent magnet 610 at least 10cm away from the return pipe. At this point, the permanent magnet 610 loses its attraction to the magnetic abrasive particles 200 in the return pipe 5, and the magnetic abrasive particles 200 re-enter the storage tank 1 with the liquid. The controller 10 then closes the valve 9, allowing the fluid in the pipe to flow only into the inlet pipe 2. The stirrer 7 is then started, and the liquid in the storage tank 1 and the magnetic abrasive particles 200 are thoroughly mixed to form an abrasive fluid. This abrasive fluid then continuously runs in the system pipes, typically for 1 to 2 hours, to achieve the desired polishing effect.

[0085] Step S4: After the polishing channel 101 is polished, the magnetic abrasive particles 200 are adsorbed onto the inner wall surface of the return pipe 5.

[0086] Step S5: Rinse the passage of the magnetic abrasive flow polishing system again with fluid that does not contain magnetic abrasive particles 200.

[0087] It is understandable that when polishing a new part after polishing the previous part, steps S1 to S5 above can be repeated.

[0088] Specifically, in steps S2 and S5, the passage of the magnetic abrasive flow polishing system is flushed with a fluid that does not contain magnetic abrasive particles 200, and the flow rate of the fluid in the passage is reasonably controlled by the cooperation of the pressure sensor 8 and the flow control device 12.

[0089] In this embodiment of the application, the magnetic abrasive flow polishing method first flushes the passage of the magnetic abrasive flow polishing system with a fluid that does not contain magnetic abrasive particles 200 before polishing to ensure that the passage is unobstructed and reduce the possibility of the abrasive fluid clogging the entire system passage. When polishing the passage, the number of magnetic abrasive particles 200 mixed into the fluid can also be adjusted according to the size of the passage to achieve the best polishing effect.

[0090] In summary, the magnetic abrasive flow polishing system of this application can effectively separate magnetic abrasive particles 200 from liquid, avoiding pipe blockage. Its core function is to ensure the stability of batch polishing, the consistency of polishing effect, and to reduce manual maintenance time and improve production efficiency.

[0091] Meanwhile, when the channel size to be polished changes, or when a different polishing effect is required, feedback can be provided through the pressure sensor 8, and the controller 10 controls the linear motion mechanism 620 to move the permanent magnet 610. The moving distance of the permanent magnet 610 is different, the permanent magnetic field strength is also different, and the number of magnetic abrasive particles 200 that can be adsorbed also changes accordingly. Adjustment can be made according to actual needs to achieve an adjustable abrasive particle density effect.

[0092] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A magnetic abrasive flow polishing system, characterized in that, include: A storage tank for storing abrasive fluid, wherein the abrasive fluid contains magnetic abrasive particles; An inlet pipe is connected at one end to the liquid storage tank and at the other end to the inlet end of the polishing channel of the part to be processed. An outlet pipe is connected at one end to the liquid storage tank and at the other end to the outlet end of the channel to be polished. The pump body is installed on the inlet pipe; The return pipe is connected at both ends to the inlet pipe and the storage tank, respectively, and the connection between the return pipe and the inlet pipe is located on the side of the pump body away from the storage tank. as well as A magnetic suction device is installed outside the return pipe. The magnetic suction device is used to attract the magnetic abrasive particles in the abrasive fluid in the return pipe to the inner wall surface of the return pipe, so as to adjust the number of magnetic abrasive particles in the abrasive fluid in the inlet pipe.

2. The magnetic abrasive flow polishing system according to claim 1, characterized in that, Two magnetic suction devices are provided, and the two magnetic suction devices are symmetrically distributed on opposite sides of the return pipe.

3. The magnetic abrasive flow polishing system according to claim 2, characterized in that, The magnetic attraction device includes: A permanent magnet is located outside the return pipe; and A linear motion mechanism is connected to the permanent magnet. The linear motion mechanism is used to move the permanent magnet closer to or away from the return pipe, so as to change the attraction of the permanent magnet to the magnetic abrasive particles in the return pipe.

4. The magnetic abrasive flow polishing system according to claim 2, characterized in that, The magnetic attraction device includes an electromagnet whose magnetic force is adjustable when energized.

5. The magnetic abrasive flow polishing system according to claim 1, characterized in that, The return pipe at the magnetic attraction device protrudes outward to form an annular protrusion. After the magnetic attraction device is activated, the magnetic abrasive particles are attracted into the annular protrusion.

6. The magnetic abrasive flow polishing system according to claim 5, characterized in that, The return pipe includes a thin tube section connected to the annular protrusion, and the end of the annular protrusion from which the abrasive fluid flows out is smoothly connected to the thin tube section.

7. The magnetic abrasive flow polishing system according to claim 1, characterized in that, The storage tank is equipped with a stirrer for stirring the abrasive fluid.

8. The magnetic abrasive flow polishing system according to claim 1, characterized in that, A pressure sensor for detecting the pressure inside the inlet pipe is installed on the inlet pipe.

9. The magnetic abrasive flow polishing system according to claim 1, characterized in that, The inlet pipe is a flexible tube, and a flow control device is installed on the inlet pipe. The flow control device controls the flow rate of the inlet pipe by squeezing the inlet pipe.

10. A magnetic abrasive flow polishing method, applied to the magnetic abrasive flow polishing system as described in claim 1, characterized in that, The magnetic abrasive flow polishing method includes the following steps: Prepare the aforementioned magnetic abrasive flow polishing system; Before the magnetic abrasive flow polishing system is started, magnetic abrasive particles are adsorbed onto the inner wall of the return pipe. After the magnetic abrasive flow polishing system is started, the passage of the magnetic abrasive flow polishing system is first flushed with a liquid that does not contain magnetic abrasive particles. Magnetic abrasive particles are mixed into a liquid to polish the channel to be polished. The amount of magnetic abrasive particles mixed into the liquid is adjusted according to the size of the channel to be polished. After the polishing channel is polished, magnetic abrasive particles are adsorbed onto the inner wall surface of the return pipe. The passage of the magnetic abrasive flow polishing system is flushed again with a liquid that does not contain magnetic abrasive particles.

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