Cell assembly

Abstract

The present disclosure provides a cell aligning device, belonging to the field of display technology, which can solve the problem of light leakage of display mother boards in the cell aligning process. The cell aligning device is used for supporting a display mother board, the display mother board comprises a plurality of arrayed display panels, each display panel comprises a first substrate, a second substrate and a frame glue, the display mother board is matched with the cell aligning device, and the cell aligning device comprises a plurality of arrayed supporting pins and a machine table. The supporting pin comprises a first supporting pin and a second supporting pin, the first supporting pin is closer to the frame glue than the second supporting pin, the distance between the end of the first supporting pin away from the machine table and the machine table is a first height, the distance between the end of the second supporting pin away from the machine table and the machine table is a second height, and the first height is smaller than the second height.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, and specifically relates to a matching device. Background Technology

[0002] We have now entered the video era, and thin-film transistor liquid crystal displays (TFT-LCDs) offer advantages such as small size, low power consumption, and no radiation, better meeting people's requirements for displays. The display primarily consists of two substrates filled directly with liquid crystal, sealed with a layer of adhesive. The rotation of the liquid crystal is controlled by an electric field, combined with the optical properties of the liquid crystal, to control light and thus display a perfect image. Therefore, the uniformity of liquid crystal deflection affects the overall image quality of the display. Especially around the perimeter of the display, the presence of the adhesive makes it susceptible to compression during production due to contact with support rods or pillars of the equipment. Residual stress after curing affects the deformation of this area, leading to abnormal liquid crystal alignment and localized light leakage. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a box-fitting device that improves the peripheral light leakage caused by uneven support of the product and greatly enhances the picture quality of the product.

[0004] Firstly, the technical solution adopted to solve the technical problem of the present invention is a cell alignment device for supporting a display motherboard. The display motherboard includes multiple arrayed display panels, each display panel including a first substrate and a second substrate arranged opposite to each other, and the multiple first substrates corresponding to the multiple display panels form an integral structure, and the multiple second substrates form an integral structure; each display panel is divided into a display area and a peripheral area surrounding the display area, and a sealing adhesive is provided in the peripheral area; the first substrate, the second substrate, and the sealing adhesive form a receiving space, and liquid crystal is placed in the receiving space; the display motherboard is matched with the cell alignment device, and the cell alignment device includes:

[0005] The system comprises multiple arrayed support pins and a machine base, wherein the machine base has pin holes through which the support pins pass.

[0006] The support pin includes a first support pin and a second support pin, wherein the first support pin is closer to the sealing adhesive than the second support pin;

[0007] The distance between the end of the first support pin away from the machine table and the machine table is a first height, and the distance between the end of the second support pin away from the machine table and the machine table is a second height. The first height is less than the second height, and the second support pin is any other support pin besides the first support pin.

[0008] In some embodiments, the minimum value of the first height is equal to the distance between the side of the first substrate away from the second substrate and the machine when the display motherboard is deformed on the machine.

[0009] In some embodiments, the difference between the first height and the second height is determined by the distance between the support pins.

[0010] In some embodiments, the difference between the first height and the second height ranges from 1.0 mm to 1.2 mm.

[0011] In some embodiments, the support pin includes a main structure and a support structure, wherein the support structure is arranged perpendicularly to the main structure and the main structure is arranged parallel to the machine tool.

[0012] In some embodiments, the material of the support pin is Peek or Teflon.

[0013] Secondly, embodiments of this disclosure provide a cell alignment device for supporting a display motherboard. The display motherboard includes a plurality of display panels arranged in an array. Each display panel includes a first substrate and a second substrate arranged opposite to each other. The plurality of first substrates corresponding to the plurality of display panels form an integral structure, and the plurality of second substrates form an integral structure. Each display panel is divided into a display area and a peripheral area surrounding the display area, and a sealing adhesive is disposed in the peripheral area. The first substrate, the second substrate, and the sealing adhesive form a receiving space, and liquid crystal is placed in the receiving space. The display motherboard is matched with the cell alignment device. The cell alignment device includes:

[0014] Multiple arrays of support pins and a machine base are provided, the machine base having pin holes through which the support pins pass.

[0015] A support rod is disposed at one end of the support pin near the first substrate, wherein the support pin includes a first support pin and a second support pin, the first support pin being closer to the sealing adhesive than the second support pin; the support rod is disposed at least corresponding to the first support pin.

[0016] In some embodiments, the support rod is arranged parallel to the sealing adhesive, and the support rod has multiple openings located perpendicular to the sealing adhesive.

[0017] In some embodiments, the orthographic projection of the support rod onto the machine tool coincides with the display area.

[0018] In some embodiments, the distance between the orthographic projection of the support rod on the machine and the nearest sealant to the support rod is greater than 5 mm. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of light leakage in existing products.

[0020] Figure 2 This is a schematic diagram illustrating the deformation of a display panel supported by a pin in the prior art.

[0021] Figure 3 A schematic diagram of a display motherboard provided in an embodiment of this disclosure;

[0022] Figure 4 A side view of a display motherboard supported by a matching device, provided in an embodiment of this disclosure;

[0023] Figure 5 This is a schematic diagram of another type of box-matching device provided in an embodiment of the present disclosure;

[0024] Figure 6 An enlarged schematic diagram of the support rod;

[0025] Figure 7 This is a schematic diagram showing the verification results after removing part of the support pins. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0028] Figure 1 This is a schematic diagram of light leakage in existing products. Figure 2 This is a schematic diagram illustrating the deformation of the motherboard under supported ejector pins in existing technology. For example... Figures 1-2As shown. Investigation revealed that the light leakage in the product was primarily related to the support pin 4 in the cell assembly process during production. This cell assembly process involves vacuum assembling the first substrate 1 and the second substrate 2, which are coated with liquid crystal and sealant. After assembly, the equipment activates the vacuum, and the first and second substrates 1 and 2 are lifted from the machine base 6. Initially, due to the downward pressure during vacuum assembly, the first and second substrates 1 and 2 adhere tightly to the machine base 6, resulting in greater stress during the first half of the lifting process by the support pin 4. In the latter half, because there is a certain space between the first and second substrates 1 and 2 and the machine base 6, and the pressure is at atmospheric pressure both above and below, the pressure decreases, and the stress also diminishes. For example... Figure 2 As shown, when the entire display motherboard is lifted to the next process, the sealant is not yet cured and is relatively soft, making it susceptible to deformation under stress, especially when the stress is uneven. This deformation will be cured and left behind during the subsequent curing process, causing the liquid crystal in that area to align differently from other areas, resulting in light leakage.

[0029] To address the aforementioned problems in the prior art, this disclosure provides a matching device for improving light leakage around the display motherboard, which can be used to support the display motherboard. Figure 3 This is a schematic diagram of a display motherboard provided in an embodiment of the present disclosure. Figure 4 This is a side view of a display motherboard supported by a matching device, as provided in an embodiment of this disclosure. This embodiment uses an example of a display motherboard comprising eight display panels for illustration. Figures 3-4 As shown, the display motherboard includes multiple arrayed display panels 10. Each display panel 10 includes a first substrate 1 and a second substrate 2 disposed opposite to each other. The multiple first substrates 1 corresponding to the multiple display panels 10 form an integral structure, and the multiple second substrates 2 form an integral structure. Each display panel 10 is divided into a display area and a peripheral area surrounding the display area. A sealing adhesive 3 is provided in the peripheral area. The first substrate 1, the second substrate 2, and the sealing adhesive 3 form a receiving space. The liquid crystal is placed in the receiving space. The display motherboard is matched with a cell alignment device, which includes: Multiple arrays of support pins 4 and a machine base 6 are arranged. The machine base 6 has pin holes, through which the support pins 4 pass. The support pins 4 include a first support pin and a second support pin. The first support pin is closer to the sealing glue 3 than the second support pin. The distance between the end of the first support pin away from the machine base 6 and the machine base 6 is a first height d1, and the distance between the end of the second support pin away from the machine base 6 and the machine base 6 is a second height d2. The first height d1 is less than the second height d2. The second support pin is any support pin other than the first support pin.

[0030] Specifically, see Figure 3A display motherboard includes eight display panels 10, i.e., each frame and multiple arrayed points within the frame constitute a display panel. The multiple arrayed points within the frame are the support pins 4 arranged in multiple arrays, and each frame is a sealing adhesive 3 surrounding the display panel 10. Due to interference from the fixing holes of the machine tool 6, the support pins 4 are difficult to arrange uniformly and periodically, resulting in uneven stress on the sealing adhesive 3 and light leakage. Therefore, in this embodiment, the first height d1 of at least one column / row of support pins 4 closer to the sealing adhesive 3 is set relatively low, with the aim of allowing the sealing adhesive 3 to descend naturally, receiving little or no support from the support pins 4. Thus, during the first half of the display motherboard's rise, when atmospheric pressure is high, it receives no stress; during the second half, when less force is needed and the stress is more uniform, it provides support again, resulting in even stress distribution.

[0031] It should be noted that the first support pin can be the row / column support pin 4 closest to the sealing adhesive 3, or it can be multiple rows / columns support pins 4 closest to the sealing adhesive 3. This disclosure does not limit this, and the specific arrangement of the support pins 4 can be determined according to the actual scenario.

[0032] It should also be noted that the first support pin can be set in at least one row / column around all the sealing adhesive 3 in the display motherboard, or it can be set in at least one row / column around some of the sealing adhesive 3 in the display motherboard. This disclosure does not limit this, and the specific arrangement of the support pins 4 can be determined according to the actual scenario.

[0033] For example, Figure 3 The products in the picture include the short side along the X direction and the long side along the Y direction, which are compatible with the layout of the support pin 4 of the box-type equipment. Figure 3 The explanation only considers the shorter side of the product as being heavier. Due to interference from the fixing holes of the machine base 6, the arrangement of the support pins 4 is difficult to achieve uniformity and periodicity, resulting in some unevenly arranged support pins, for example... Figure 3 The abnormal arrangement of support pins 43 was observed. The distance between the support pins 4 varied in the short side region, resulting in uneven stress on the sealing adhesive 3 along the entire short side, causing light leakage. Verification by removing the two middle rows of support pins 4 showed that the light leakage on the short side of the motherboard was completely eliminated, further proving that the product's light leakage was related to these support pins 4. Figure 7 This is a schematic diagram showing the verification results after partially removing the support pins. However, as... Figure 7 As shown, temporary dismantling verification also revealed that, despite improvements on the short side, the light leakage on the long side tended to worsen. This indicates a change in the overall stress on the motherboard. Due to the removal of the short side, the stress on the long side increased, exacerbating the light leakage. Therefore, simple dismantling alone cannot provide sufficient improvement. Of course, in actual products, the long side may be heavier, or some long sides and / or short sides may be heavier. This disclosure does not impose any limitations on this; specific products should be analyzed on a case-by-case basis.

[0034] In this embodiment of the cassette assembly equipment, without changing the existing arrangement of the support pins 4, the problem of poor light leakage around the display screen caused by poor uniformity of the equipment support corresponding to the surrounding sealant 3 is improved by optimizing the height of the support pins 4 during the vacuum assembly process when the product sealant 3 is not cured. Specifically, the distance between the end of the first support pin away from the machine 6 and the machine 6 is defined as a first height d1, and the distance between the end of the second support pin away from the machine 6 and the machine 6 is defined as a second height d2. The first height d1 is smaller than the second height d2. The first support pin is closer to the sealant 3 than the second support pin to optimize the uniformity of the equipment support for the cassette assembly equipment corresponding to the product sealant 3, thereby improving the poor light leakage around the display motherboard.

[0035] In some embodiments, the maximum value of the first height d1 is equal to the distance between the side of the first substrate 1 away from the second substrate 2 and the machine 6 when the display motherboard is deformed on the machine 6.

[0036] Specifically, Figure 4 This is a schematic diagram illustrating the deformation of a display motherboard placed on a machine, as provided in an embodiment of this disclosure. This embodiment reduces the height of the first support pin of the box-fitting device at the corresponding positions of the four-sided sealing glue on the product, without altering the existing box-fitting equipment. For example... Figure 4 As shown, the first height d1 is the distance between the end of the first support pin of the box-setting device away from the machine base 6 and the machine base 6 at the corresponding position of the sealing frame adhesive on the four sides of the product, where the motherboard is lowered to the lowest point of the deformation and concavity. The height of the support pins 4 on both sides of the sealing frame adhesive 3 needs to be lowered to this lowest point so that the motherboard is not under pressure during the first half of its rise, when subjected to greater atmospheric pressure, and only provides support when the force is less and more uniform during the second half, thus ensuring even force distribution.

[0037] In some embodiments, the difference between the first height d1 and the second height d2 is determined by the distance between the support pins 4.

[0038] Specifically, the light leakage of the product is due to interference from the fixing holes of the machine base 6 on the support pins 4. The arrangement of the support pins 4 is difficult to achieve uniform and periodic distribution, resulting in uneven stress on the sealing adhesive 3. This disclosure adjusts the stress on the sealing adhesive 3 by adjusting the first height. Furthermore, it ensures that the display motherboard experiences less stress during the first half of its rise when subjected to greater atmospheric pressure, and then provides support again during the second half when the stress is less and more uniform, thus achieving even stress distribution. Therefore, the value of the first height d1 is specifically determined by the arrangement of the support pins 4, that is, by the distance between the support pins 4. Furthermore, the difference between the first height d1 and the second height d2 is determined by the distance between the support pins 4.

[0039] In some embodiments, the difference between the first height d1 and the second height d2 ranges from 1.0 mm to 1.2 mm.

[0040] Specifically, the long and short sides of the product are displayed. Due to the different weight distribution of the product, the sag values ​​are slightly different. The typical value for the long side is 1.2mm and for the short side is 1.0mm. Therefore, the first height d1 of the first support pins on both sides of the sealing frame adhesive 3 needs to be lowered to this value so that they are not under pressure when subjected to greater force under atmospheric pressure in the first half of the rise, and then play a supporting role when the force is smaller and more uniform in the second half, so that the force is evenly distributed.

[0041] In some embodiments, the support pin 4 includes a main structure 42 and a support structure 41, wherein the support structure 41 is arranged perpendicularly to the main structure 42, and the main structure 42 is arranged parallel to the machine base 6.

[0042] In some embodiments, the material of the support pin 4 is Peek or Teflon.

[0043] Specifically, the material of the support pin 4 is usually Peek or Teflon, mainly considering static electricity and wear resistance, so that the support pin 4 will not scratch the display motherboard. Of course, the support pin 4 can also be made of other materials with a certain degree of hardness, mainly serving a supporting function.

[0044] In some embodiments, the material of the display panel is generally glass.

[0045] In this embodiment of the present disclosure, in order to solve the problem of uneven force distribution when the sealing adhesive 3 is not cured during vacuum assembly of the product, this embodiment of the present disclosure modifies the existing assembly equipment by lowering the height of the first support pins at the corresponding positions of the sealing adhesive 3 on the four sides of the product, lowering them to the lowest point of the deformation and concavity when the display motherboard is placed on the machine 6. This allows the display motherboard to be unloaded when subjected to greater pressure under atmospheric pressure in the first half of the lifting process, and to provide support when the force required in the second half is smaller and more uniform, thus ensuring even force distribution.

[0046] This disclosure also provides another type of matching device for supporting a display motherboard. Figure 5 This is a schematic diagram of yet another type of box-connecting device provided in an embodiment of this disclosure. See also... Figure 3 and Figure 5The display motherboard includes multiple arrayed display panels 10. Each display panel 10 includes a first substrate 1 and a second substrate 2 arranged opposite to each other. The multiple first substrates 1 corresponding to the multiple display panels 10 form an integral structure, and the multiple second substrates 2 form an integral structure. Each display panel 10 is divided into a display area and a peripheral area surrounding the display area. A sealing adhesive 3 is provided in the peripheral area. The first substrate 1, the second substrate 2, and the sealing adhesive 3 form a receiving space. The liquid crystal is placed in the receiving space. The display motherboard is matched with a cell assembly device. The cell assembly device includes multiple arrayed support pins 4, a machine base 6, and support rods 5. The machine base 6 has pin holes, and the support pins 4 are arranged through the pin holes to pass through the machine base 6. The support rods 5 are located at the end of the support pins 4 near the first substrate 1. The support pins 4 include a first support pin and a second support pin. The first support pin is closer to the sealing adhesive 3 than the second support pin. The support rods 5 are at least corresponding to the first support pins.

[0047] Specifically, see Figure 3 A display motherboard includes eight display panels 10, meaning each frame and multiple arrayed points within the frame constitute a display panel. The multiple arrayed points within the frame are the support pins 4 arranged in multiple arrays. Each frame is a sealing adhesive 3 surrounding the display panel 10. Due to interference from the fixing holes of the machine tool 6, the support pins 4 are difficult to arrange uniformly and periodically, resulting in uneven stress on the sealing adhesive 3 and light leakage. In other words, the uneven stress in the display motherboard is around the sealing adhesive 3. Therefore, in this embodiment, support rods 5 are added at the corresponding positions of the first support pins around the sealing adhesive, so that the support on both sides of the sealing adhesive 3 is strongest and the deformation is minimal.

[0048] It should be noted that the first support pin can be the row / column support pin 4 closest to the sealing adhesive 3, or it can be multiple rows / columns support pins 4 closest to the sealing adhesive 3. This disclosure does not limit this, and the specific arrangement of the support pins 4 can be determined according to the actual scenario.

[0049] It should also be noted that the first support pin can be set in at least one row / column around all the sealing adhesive 3 in the display motherboard, or it can be set in at least one row / column around some of the sealing adhesive 3 in the display motherboard. This disclosure does not limit this, and the specific arrangement of the support pins 4 can be determined according to the actual scenario.

[0050] Still using the previous Figure 3 Let's take an example to illustrate. Figure 3 The products in the picture include the short side along the X direction and the long side along the Y direction, which are compatible with the layout of the support pin 4 of the box-type equipment. Figure 3The explanation only considers the shorter side of the product as being heavier. Due to interference from the fixing holes of the machine base 6, the arrangement of the support pins 4 is difficult to achieve uniformity and periodicity, resulting in some unevenly arranged support pins, for example... Figure 3 The abnormal arrangement of support pins 43 in the product causes uneven stress on the sealing adhesive 3 along the short side, resulting in light leakage. Therefore, this disclosure improves the light leakage problem by adding support rods 5 at the corresponding positions of the support pins 4 on the short side of the sealing adhesive, thus maximizing the support and minimizing deformation on both sides of the sealing adhesive 3.

[0051] In some embodiments, the support rod 5 is arranged parallel to the sealing adhesive 3, and the support rod 5 has a plurality of openings, which are located perpendicular to the sealing adhesive 3.

[0052] Specifically, to avoid affecting the vertical sealing adhesive 3, the support rod 5 needs to be disconnected at the vertical sealing adhesive 3. (Still using...) Figure 3 For example, the horizontal support rod 5 is parallel to the short side adhesive and needs to be disconnected at the long side adhesive. Figure 6 An enlarged schematic diagram of the support rod setup. (See attached diagram.) Figure 6 As shown, with the corner magnified, the direction of the support rod 5 remains parallel to the sealing frame adhesive 3, and it breaks off at a point perpendicular to the sealing frame adhesive 3. When the spacing of the corner support pins 4 varies, the distance d10 between the support rods 5 remains constant, but the connection points with the support pins 4 change to ensure uniform stress on the display motherboard. For example, Figure 6 The first connection point 81 and the second connection point 82 are located at different positions on the support rod 5. Compared with the second connection point 82, the first connection point 81 is closer to the left side of its corresponding support rod 5. The connection point between the support rod 5 and the support pin 4 is mainly related to the position of the support pin 4.

[0053] In some embodiments, the orthographic projection of the support rod 5 onto the machine base 6 coincides with the display area.

[0054] In some embodiments, the distance between the orthographic projection of the support rod 5 on the machine base 6 and the nearest sealing adhesive 3 to the support rod 5 is greater than 5 mm.

[0055] Specifically, the distance between the support rod 5 and the sealing adhesive 3 should not be too close, otherwise it will affect the stress on the sealing adhesive 3. However, it should also not be too far away from the sealing adhesive 3, otherwise the support rod 5 will not achieve the expected effect. Generally, considering process fluctuations, the distance between the support rod 5 and the sealing adhesive 3 should be more than 5mm.

[0056] In this embodiment, based on existing box-fitting equipment, support rods 5 are added to the support pins 4 at corresponding positions on both sides of the sealing adhesive 3 on the four sides of the product. The support rods 5 are parallel to the sealing adhesive 3, making the support on both sides of the sealing adhesive 3 strongest and the deformation smallest. Furthermore, to avoid affecting the vertical sealing adhesive 3, the added support rods 5 need to be disconnected at the vertical sealing adhesive 3. For example, the horizontal support rod 5 is parallel to the short side adhesive and needs to be disconnected at the long side adhesive. In this embodiment, the support rods 5 make the support around the product more uniform, thereby improving the problem of uneven support caused by the sealing adhesive 3, which further causes light leakage in the product, and greatly improving the product image quality.

[0057] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A cell alignment device for supporting a display motherboard, the display motherboard comprising a plurality of arrayed display panels, each display panel comprising a first substrate and a second substrate disposed opposite to each other, wherein the plurality of first substrates corresponding to the plurality of display panels constitute an integral structure, and the plurality of second substrates constitute an integral structure; each display panel is divided into a display area and a peripheral area surrounding the display area, wherein a sealing adhesive is disposed in the peripheral area; the first substrate, the second substrate, and the sealing adhesive constitute a receiving space, wherein a liquid crystal is placed in the receiving space, and the display motherboard is matched with the cell alignment device, the cell alignment device comprising: The system comprises multiple arrayed support pins and a machine base, wherein the machine base has pin holes through which the support pins pass. The support pin includes a first support pin and a second support pin, wherein the first support pin is closer to the sealing adhesive than the second support pin; The distance between the end of the first support pin away from the machine table and the machine table is a first height, and the distance between the end of the second support pin away from the machine table and the machine table is a second height. The first height is less than the second height, and the second support pin is any other support pin besides the first support pin.

2. The box-matching device according to claim 1, wherein, The maximum value of the first height is equal to the distance between the side of the first substrate away from the second substrate and the machine platform when the display motherboard is deformed on the machine platform.

3. The box-matching device according to claim 1, wherein, The difference between the first height and the second height is determined by the distance between the support pins.

4. The box-matching device according to claim 3, wherein, The difference between the first height and the second height is in the range of 1.0mm to 1.2mm.

5. The box-matching device according to claim 1, wherein, The support pin includes a main structure and a support structure. The support structure is arranged perpendicularly to the main structure, and the main structure is arranged parallel to the machine platform.

6. The box-matching device according to claim 1, wherein, The material of the support pin is Peek or Teflon.

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