Antenna assembly and electronic device

Abstract

The application relates to an antenna assembly and an electronic device, the antenna assembly comprising: an antenna coil, a region where the antenna coil is located being a wiring region, a region outside the wiring region being a peripheral region; a conductive member being arranged at a distance from the antenna coil, the conductive member comprising a first sub-conductive part and a second sub-conductive part, a first projection of the first sub-conductive part towards the antenna coil at least partially falling into the wiring region, a second projection of the second sub-conductive part towards the antenna coil at least partially falling into the peripheral region, the peripheral region where the second projection falls into being in an extension direction of the wiring region where the first projection falls into; and a magnetic member arranged on one side of the antenna coil, a third projection of the magnetic member towards the antenna coil at least partially falling into the wiring region, wherein the first projection and the third projection at least partially do not overlap, so that the magnetic member can be avoided from being arranged in the whole wiring region of the antenna assembly, the use of the magnetic member is reduced, the cost is saved, and the radiation effect of the antenna device is improved.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and in particular to an antenna assembly and electronic device. Background Technology

[0002] With the rapid development of the communications industry and the continuous improvement of wireless communication technology, near-field communication (NFC) technology has ushered in a period of rapid development. As the uplink and downlink data transmission rates of wireless communication continue to increase rapidly, the applications of electronic devices (such as mobile phones) are also evolving daily. Relying on the rapid development of mobile payment, NFC technology is increasingly appearing in our lives, with wide applications in mobile payment, electronic ticketing, access control, mobile identity verification and anti-counterfeiting, and wireless charging.

[0003] In related technologies, NFC antennas are generally used to support near-field communication. However, NFC antennas in these technologies often incorporate magnetic components, such as ferrite, that cover the entire antenna coil to increase the radiation performance of the NFC antenna. This results in higher costs for NFC antennas. Summary of the Invention

[0004] This application provides an antenna assembly and an electronic device that avoids having magnetic components installed in the entire wiring area of ​​the antenna assembly. This reduces the amount of material used in the magnetic components, saves costs, and improves the radiation effect of the antenna device.

[0005] In a first aspect, embodiments of this application provide an antenna assembly, including:

[0006] An antenna coil, wherein the area where the antenna coil is located is the wiring area, and the area outside the wiring area is the peripheral area;

[0007] A conductive element is provided at a distance from the antenna coil. The conductive element includes a first sub-conductive portion and a second sub-conductive portion. A first projection of the first sub-conductive portion toward the antenna coil at least partially falls into the wiring area. A second projection of the second sub-conductive portion toward the antenna coil at least partially falls into the peripheral area. The peripheral area into which the second projection falls is in the extending direction of the wiring area into which the first projection falls. The extending direction is the direction from the geometric center of the antenna coil to the wiring area into which the first projection falls.

[0008] A magnetic element is disposed on one side of the antenna coil, and a third projection portion of the magnetic element toward the antenna coil at least falls into the wiring area, wherein the first projection and the third projection at least partially do not overlap.

[0009] Secondly, embodiments of this application provide an electronic device including the aforementioned antenna assembly.

[0010] The aforementioned antenna assembly and electronic device include an antenna coil, a conductive element, and a magnetic element. The conductive element comprises a first sub-conductive portion and a second sub-conductive portion. A first projection of the first sub-conductive portion toward the antenna coil at least partially falls into the wiring area. A second projection of the second sub-conductive portion toward the antenna coil at least partially falls into the peripheral area, with the peripheral area into which the second projection falls extending along the direction of the wiring area into which the first projection falls. A third projection of the magnetic element toward the antenna coil at least falls into the wiring area. Thus, a magnetic element is correspondingly provided in a portion of the wiring area of ​​the antenna coil. Because the magnetic element has a good magnetic field enhancement effect, it can significantly improve the magnetic field radiation effect of the antenna coil (e.g., the first local area). Simultaneously, the absence of a corresponding magnetic element in a portion of the wiring area of ​​the antenna coil significantly reduces the ohmic loss of the antenna coil in that area caused by the magnetic material, and also reduces the magnetic field density within the area covered by the corresponding conductive structure inside the electronic device, reducing eddy current losses caused by the conductive structure inside the electronic device. Furthermore, the presence of a conductive element in a portion of the wiring area of ​​the antenna coil can cancel or weaken the external magnetic field in the peripheral area of ​​the antenna assembly, further enhancing the communication capability of the antenna assembly. The antenna assembly provided in this embodiment can avoid setting magnetic components in all wiring areas of the antenna assembly, thereby reducing the amount of material used for magnetic components, saving costs, and improving the radiation effect of the antenna device. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is one of the schematic diagrams of the antenna assembly in the XY plane in one embodiment;

[0013] Figure 2 for Figure 1 The image shows a cross-sectional view of the antenna assembly along line AA.

[0014] Figure 3 This is a second schematic diagram of the antenna assembly in the XY plane in one embodiment;

[0015] Figure 4 This is a schematic diagram of the antenna coil in the antenna assembly in the XY plane in one embodiment;

[0016] Figure 5This is one of the structural schematic diagrams of the conductive and magnetic components in the antenna assembly in the XY plane in one embodiment;

[0017] Figure 6 This is a second schematic diagram of the conductive and magnetic components in the antenna assembly in the XY plane in one embodiment;

[0018] Figure 7 This is the third schematic diagram of the conductive and magnetic components in the antenna assembly in the XY plane in one embodiment;

[0019] Figure 8 This is a fourth schematic diagram of the conductive and magnetic components in the antenna assembly in the XY plane in one embodiment;

[0020] Figure 9 One of the cross-sectional views of the antenna assembly along the X direction in one embodiment;

[0021] Figure 10 This is a second cross-sectional view of the antenna assembly in the X direction in one embodiment;

[0022] Figure 11a for Figure 1 Simulation diagram of the magnetic field of the antenna assembly;

[0023] Figure 11b The magnetic field simulation diagram of the antenna assembly in the first related technical solution is shown.

[0024] Figure 11c The magnetic field simulation diagram of the antenna assembly in the second related technical solution is shown.

[0025] Figure 11d The magnetic field simulation diagram of the antenna assembly in the third related technical solution is shown.

[0026] Figure 12 This is a schematic diagram of the antenna assembly in the first related technical solution;

[0027] Figure 13 This is a schematic diagram of the antenna assembly in the second related technical solution;

[0028] Figure 14 This is a schematic diagram of the antenna assembly in the third related technical solution;

[0029] Figure 15 The figures show the coupling curves between the antenna components and the target electronic device in the embodiments of this application, related technical solutions one, two, and three.

[0030] Figures 16-20 These are cross-sectional views of the antenna assembly in the X direction in different embodiments;

[0031] Figure 21This is the third schematic diagram of the antenna assembly in the XY plane in one embodiment;

[0032] Figure 22 for Figure 21 The image shows a cross-sectional view of the antenna assembly along line AA.

[0033] Figure 23 This is the fourth schematic diagram of the antenna assembly in the XY plane in one embodiment;

[0034] Figure 24 This is the fifth schematic diagram of the antenna assembly in the XY plane in one embodiment;

[0035] Figure 25 This is the sixth schematic diagram of the antenna assembly in the XY plane in one embodiment;

[0036] Figure 26 This is a cross-sectional view of the antenna assembly along the X direction in one embodiment;

[0037] Figure 27 This is a schematic diagram of the structure of an electronic device in one embodiment;

[0038] Figure 28 This is a schematic diagram of the electronic device in another embodiment;

[0039] Figure 29 This is a schematic diagram of the internal structure of an electronic device in one embodiment. Detailed Implementation

[0040] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0046] The antenna components described in this application can be applied to electronic devices with wireless communication capabilities. These electronic devices can be handheld devices, in-vehicle devices, wearable devices, computing devices, or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE) (e.g., mobile phones), mobile stations (MS), etc. For ease of description, the devices mentioned above are collectively referred to as electronic devices.

[0047] like Figure 1 and Figure 2 As shown, this application embodiment provides an antenna assembly. The antenna assembly includes: an antenna coil 110, a conductive element 120, and a magnetic element 130. The antenna coil 110 includes, but is not limited to, Near Field Communication (NFC) antennas (hereinafter referred to as NFC antennas), wireless charging antennas, and other antennas that transmit energy through magnetic coupling. For ease of explanation, the antenna coil 110 in this application embodiment is described using an NFC antenna as an example. Near Field Communication is a short-range wireless communication technology developed based on RFID technology. NFC operating modes are divided into passive mode and active mode. In passive mode, the NFC initiating device (also called the master device) uses the energy of the power supply device to provide a radio frequency field and sends data to the NFC target device (also called the slave device). The slave device uses the radio frequency field generated by the master device to convert it into electrical energy, powering the slave device's circuitry, receiving the data sent by the master device, and using load modulation technology to transmit the slave device's data back to the master device at the same speed. In active mode, both the initiating device and the target device actively generate radio frequency fields when sending data to each other. This communication mode is the standard mode for peer-to-peer network communication to achieve very fast connection speeds.

[0048] The area where the antenna coil 110 is located is the wiring area 11, and the area outside the wiring area 11 is the outer perimeter area 13. Optionally, when the antenna coil 110 has a coil hole, the area corresponding to the coil hole is the inner area. It can be understood that the area inside the wiring area is the inner area 12.

[0049] For ease of explanation, the plane containing the antenna coil 110 is defined as the XY plane, and the thickness direction of the antenna coil 110 is defined as the Z-axis direction. Optionally, the winding shape of the antenna coil 110 can be a loop, a spiral, etc. The loop shape can include, but is not limited to, circular loops, elliptical loops, rectangular loops, rounded rectangular loops, etc. It should be noted that, in this embodiment, no further limitations are made on the number of coils, the winding shape, or the size of the coil hole 111 of the antenna coil 110.

[0050] For ease of explanation, the winding shape of the antenna coil is assumed to be a ring structure. In the XY plane, from the geometric center of the antenna coil 110 outwards, the regions are sequentially designated as the inner region 12, the wiring region 11, and the outer region 13. The coil hole 111 formed by the winding of the antenna coil 110 corresponds to the inner region 12, and the side of the wiring region 11 facing away from the coil hole 111 is the outer region 13. It should be noted that the inner region 12, wiring region 11, and outer region 13 not only define the plane containing the antenna coil 110 but can also correspond to the division of the three-dimensional space containing the antenna assembly.

[0051] For a typical host device with an NFC antenna, the magnetic field directions of the inner region 12 and the outer region 13 of the antenna coil 110 are opposite. It can be understood that the Z-direction magnetic field directions of the inner region 12 and the outer region 13 of the antenna coil 110 are opposite to each other. For example, the direction of the magnetic field lines in the inner region of the antenna assembly is as follows: Figure 2 As shown, the magnetic field lines point vertically upwards, while the magnetic field lines in the outer region of the antenna assembly are oriented as follows: Figure 2 As shown, it points vertically downwards. The inner region 12 of a typical antenna assembly can be understood as the NFC communication region. If the magnetic field of the inner region 12 is an effective magnetic field for achieving NFC communication, then the magnetic field of the outer region 13 is an external magnetic field that inhibits NFC communication.

[0052] The conductive element 120 includes a first sub-conductive portion 121 and a second sub-conductive portion 122. The first sub-conductive portion 121 has a first projection toward the antenna coil 110 that at least partially falls into the wiring region 11, and the second sub-conductive portion has a second projection toward the antenna coil 110 that at least partially falls into the peripheral region 13. The peripheral region 13 into which the second projection falls extends in the extending direction of the wiring region 11 into which the first projection falls, the extending direction being from the geometric center of the antenna coil toward the wiring region 11 into which the first projection falls. It is understood that the first sub-conductive portion 121 is disposed corresponding to a first region of the wiring region 11, and the second sub-conductive portion 122 is disposed corresponding to the peripheral region 13. The peripheral region 13 corresponding to the second sub-conductive portion 122 extends in the extending direction of the first region, which can also be understood as extending from the inner region 12 toward the first region. It is understood that the second projection of the second sub-conductive portion 122 toward the antenna coil 110 at least partially falls into the peripheral region 13 extending from the inner region 12 toward the first region.

[0053] The first sub-conductive part 121 and the second sub-conductive part 122 are arranged sequentially along the positive X-axis. The orthographic projection of the first sub-conductive part 121 in the Z-axis direction and the orthographic projection of the second sub-conductive part 122 in the Z-axis direction can be spaced apart, connected, or partially overlap. The first conductive part can shield and weaken the external magnetic field of the first region, and the second sub-conductive part 122 can shield and weaken the external magnetic field of the peripheral region 13, increasing the shielding area against external magnetic fields. This can further improve the radiation performance of the antenna coil 110 and also avoid the need to place the magnetic component 130 at the corresponding position in the first region, thereby reducing the amount of magnetic material used and lowering costs.

[0054] The conductive element 120 can be disposed on the same layer as the antenna coil 110 or on a different layer from the antenna coil 110.

[0055] The conductive element 120 is spaced apart from the antenna coil 110. The conductive element 120 has good conductivity and can couple with the adjacent antenna coil 110. Optionally, the material of the conductive element 120 can be a high-conductivity material, such as, but not limited to, metals, stainless steel, alloys, graphite, conductive oxides, graphene, etc. The conductive element 120 can be formed into a regular sheet or an irregularly shaped sheet, or it can be a thin film. For example, the shape of the conductive element 120 can be a rectangular sheet. The larger the area of ​​the conductive element 120, the higher its coupling coefficient with the antenna coil 110. In this embodiment, the size of the conductive element 120 can be designed to be as large as possible while reducing the space occupied by the antenna assembly. In this embodiment, the shape, size, material, thickness, etc. of the conductive element 120 are not further limited.

[0056] The direction of the magnetic field induced by the conductive element 120 under the influence of the antenna coil 110 is opposite to the direction of the magnetic field induced in the peripheral region 13 when the antenna coil 110 is coupled with the external device, thereby canceling or weakening the external magnetic field in the peripheral region 13 of the antenna assembly.

[0057] A magnetic component 130 is disposed on one side of the antenna coil 110. The magnetic component 130 and the antenna coil 110 are disposed on different layers, that is, the magnetic component 130 and the antenna coil 110 are not coplanar and are disposed on different layers.

[0058] The third projection portion of the magnetic element 130 toward the antenna coil 110 falls at least within the wiring region 11. It is understood that the third projection portion of the magnetic element 130 toward the antenna coil 110 falls at least within the second region of the wiring region 11. Specifically, a conductive element 120 is disposed in the first region of the wiring region 11, and this conductive element 120 extends to the peripheral region 13; the magnetic element 130 is disposed in the second region of the wiring region 11.

[0059] In this embodiment, the first projection and the third projection do not overlap at least partially, that is, the first region and the second region of the wiring region 11 do not overlap at least partially.

[0060] Optional, such as Figure 1As shown, the first projection and the third projection do not overlap at all. That is, it can be understood that the first projection of the first sub-conductive part 121 toward the antenna coil 110, which at least partially falls into the first region of the wiring region 11, and the first projection of the magnetic element 130 toward the antenna coil 110, which at least partially falls into the second region of the wiring region, do not coincide at all. For example, the first region of the wiring region 11 where the antenna coil 110 is located is provided with a conductive element 120, and the second sub-conductive part 122 of the conductive element 120 extends to the peripheral region 13, while the wiring region 11 (i.e., the second region) where the conductive element 120 is not provided is provided with a magnetic element 130.

[0061] Optional, such as Figure 3 As shown, the first projection and the third projection at least partially overlap. That is, it can be understood that the first projection of the first sub-conductive part 121 toward the antenna coil 110 at least partially falls into the first region of the wiring region 11 and the first projection of the magnetic element 130 toward the antenna coil 110 at least partially falls into the second region of the wiring region 11 at least partially overlap. For example, the first region of the wiring region 11 where the antenna coil 110 is located is provided with a conductive element 120, and the conductive element 120 extends to the peripheral region 13. At the same time, at least a portion of the first region and the wiring region 11 where the conductive element 120 is not provided (i.e., the second region) are also provided with magnetic elements 130.

[0062] The magnetic element 130 can be in the shape of a regular sheet, an irregular sheet, or a thin film. For example, the magnetic element 130 can be C-shaped, U-shaped, I-shaped, L-shaped, etc. Optionally, the magnetic element 130 can also extend to the inner region 12 corresponding to the coil hole 111. In this embodiment, the shape of the magnetic element 130 is not limited to the examples described above and can also be other shapes.

[0063] The magnetic component 130 has good magnetic permeability. Optionally, the magnetic component 130 is a magnetic component with high magnetic permeability, such as including but not limited to ferrite sheets, ferrite ceramic sheets, resin-type alloy powder filled sheets, etc.

[0064] In this embodiment, the antenna assembly includes an antenna coil 110, a conductive element 120, and a magnetic element 130. The conductive element 120 includes a first sub-conductive portion 121 and a second sub-conductive portion 122. The first projection of the first sub-conductive portion 121 toward the antenna coil 110 at least partially falls into the wiring region 11, and the second projection of the second sub-conductive portion 122 toward the antenna coil 110 at least partially falls into the peripheral region 13. The third projection of the magnetic element 130 toward the antenna coil 110 at least falls into the wiring region 11. The magnetic element 130 is provided in a portion of the wiring region of the antenna coil 110 because it has a good magnetic field enhancement effect, significantly improving the magnetic field radiation effect of the antenna coil 110. Conversely, the absence of the magnetic element 130 in a portion of the wiring region of the antenna coil 110 significantly reduces the ohmic loss caused by the magnetic material in that region and reduces the magnetic field density within the area covered by the conductive structure inside the electronic device, thus reducing eddy current losses caused by the conductive structure within the electronic device. Meanwhile, conductive elements 120 are provided in a portion of the wiring area of ​​the antenna coil 110, which can cancel or weaken the external magnetic field in the outer area 13 of the antenna coil 110, thereby further improving the communication capability of the antenna assembly. In this embodiment, the antenna assembly avoids the need to provide magnetic elements 130 in all wiring areas 11 of the antenna assembly, thus reducing the material used for magnetic elements 130, saving costs, and improving the radiation effect of the antenna device.

[0065] In one embodiment, a first projection falling on a first region of wiring region 11 and a second projection falling on a third region of wiring region 11 are adjacent to each other to form wiring region 11. The adjacent first and second regions can form a complete wiring region 11. It is understood that a conductive element 120 is correspondingly provided in the first region of wiring region 11, while a magnetic element 130 is correspondingly provided in the wiring region 11 other than the first region (i.e., the second region).

[0066] Antenna coil 110 may include four sub-coils connected sequentially, wherein the four sub-coils may include a first sub-coil, a second sub-coil, a third sub-coil, and a fourth sub-coil. The first, second, third, and fourth sub-coils form a ring structure, with the center of the ring structure corresponding to coil hole 111. The inner edge line of each sub-coil may be an arc or a straight line. Adjacent sub-coils may have a transition connection such as a right angle, a rounded chamfer, an arc, or a beveled chamfer. In this embodiment, the connection method between adjacent sub-coils is not limited to the examples described above. It should be noted that the division method of the first, second, third, and fourth sub-coils is not limited to the above division method. Correspondingly, the area where each sub-coil is located is a sub-region. Figure 4As shown, the wiring area 11 includes four sub-areas connected in sequence, wherein the four sub-areas may include a first sub-area 11a, a second sub-area 11b, a third sub-area 11c, and a fourth sub-area 11d. In this embodiment, it should be noted that the division method of the first sub-area 11a, the second sub-area 11b, the third sub-area 11c, and the fourth sub-area 11d is not limited to the following. Figure 4 The division method shown.

[0067] The first projection of the conductive element 120 toward the antenna coil 110 is at least partially located within at least one of the four sub-regions. For example, at least part of the first projection falls within at least one of the first sub-region 11a, the second sub-region 11b, the third sub-region 11c, and the fourth sub-region 11d of the wiring region 11. The third projection of the magnetic element 130 toward the antenna coil 110 is at least partially located within the remaining region of the wiring region 11. The remaining region is the area of ​​the wiring region 11 excluding the sub-regions into which the first projection falls.

[0068] like Figure 5 As shown, optionally, the first projection of the conductive element 120 toward the antenna coil 110 falls into the first sub-region 11a of the wiring region 11. The third projection of the magnetic element 130 toward the antenna coil 110 falls into the second sub-region 11b, the third sub-region 11c, and the fourth sub-region 11d of the wiring region 11.

[0069] like Figure 6 As shown, optionally, the first projection of the conductive element 120 toward the antenna coil 110 falls into the first sub-region 11a and the second sub-region 11b of the wiring region 11, and the third projection of the magnetic element 130 toward the antenna coil 110 is located in the third sub-region 11c and the fourth sub-region 11d of the wiring region 11.

[0070] Optionally, the first projection of the conductive element 120 toward the antenna coil 110 falls into the first sub-region 11a, the second sub-region 11b and the third sub-region 11c of the wiring region 11, and the third projection of the magnetic element 130 toward the antenna coil 110 is located in the fourth sub-region 11d of the wiring region 11.

[0071] like Figure 7 As shown, optionally, the first projection of the conductive element 120 toward the antenna coil 110 is located in the first sub-region 11a and the third sub-region 11c of the wiring region 11, and the third projection of the magnetic element 130 toward the antenna coil 110 is located in the second sub-region 11b and the fourth sub-region 11d of the wiring region 11.

[0072] Optionally, the first projection of the conductive element 120 toward the antenna coil 110 and the third projection of the magnetic element 130 toward the antenna coil 110 may also be located in the same sub-region. For example, the first projection of the conductive element 120 toward the antenna coil 110 is located in a portion of the first sub-region 11a, and the third projection of the magnetic element 130 toward the antenna coil 110 is located in the remaining portion of the first sub-region 11a, wherein the remaining portion is the area of ​​the first sub-region 11a excluding the area where the first projection is located.

[0073] It should be noted that, in this embodiment of the application, the division of the first region and the second region in the wiring region 11 is not limited to the example described above, and may also be other implementable division methods.

[0074] In this embodiment, the magnetic element 130 is provided only in the local wiring area 11 where the antenna coil 110 is located, which can greatly improve the magnetic field radiation effect of the remaining antenna coil 110. The conductive element 120 is provided in the remaining wiring area 11 where the magnetic element 130 is not provided, avoiding the provision of the magnetic element 130 in the entire wiring area 11 of the antenna assembly. This can reduce the material used for the magnetic element 130, save costs, and at the same time, it can also cancel or weaken the external magnetic field of the peripheral area 13, and reduce the magnetic field density in the area covered by the conductive structure inside the electronic device. The reduction of eddy current loss caused by the conductive structure inside the electronic device can further improve the communication capability of the antenna assembly.

[0075] In one embodiment, the first projection falling on a first region of the wiring region 11 and the third projection falling on a second region of the wiring region 11 are spaced apart. It is understood that the wiring region 11 may include a first region, a second region, and a third region. The first, second, and third regions are adjacent to each other to form the wiring region 11. The third region corresponding to the antenna coil 110 does not have a conductive element 120 or a magnetic element 130.

[0076] like Figure 8 As shown, optionally, the first projection of the conductive element 120 toward the antenna coil 110 is located in the first sub-region 11a of the wiring region 11. The third projection of the magnetic element 130 toward the antenna coil 110 is located in the third sub-region 11c and the fourth sub-region 11d of the wiring region 11.

[0077] Please continue to refer to this. Figure 2In one embodiment, the conductive element 120 and the magnetic element 130 are disposed on the same layer. In the thickness direction of the antenna assembly, for example, along the Z-axis, the antenna assembly includes a magnetic element 130 and an antenna coil 110 from bottom to top, wherein the conductive element 120 and the magnetic element 130 may be located on the same layer and may both be disposed below the antenna coil 110. The conductive element 120 and the magnetic element 130 may be in contact or spaced apart. Optionally, the conductive element 120 and the magnetic element 130 may also be fixed together by adhesive. It should be noted that the positive direction of the Z-axis can be understood as the communication direction of the antenna coil 110.

[0078] In this embodiment, by setting the conductive element 120 and the magnetic element 130 in the same layer, the antenna assembly can be made relatively small in the thickness direction, which is beneficial to the miniaturization of the antenna assembly, such as thin-film design.

[0079] like Figure 9 As shown, in one embodiment, the conductive element 120 and the magnetic element 130 are disposed in different layers. The conductive element 120 may be disposed on the side of the magnetic element 130 opposite to the antenna coil 110, that is, the conductive element 120 is disposed below the antenna coil 110. Figure 10 As shown, optionally, the conductive element 120 can also be disposed on the side of the antenna coil 110 away from the magnetic element 130, that is, the conductive element 120 is disposed above the antenna coil 110. Optionally, part of the conductive element 120 can be disposed on the same layer as the magnetic element 130, and the other part of the conductive element 120 can be located on a different layer than the magnetic element 130. In this way, the conductive element 120 and the magnetic element 130 can be flexibly designed to form diverse antenna assemblies suitable for different application scenarios.

[0080] Please see Figures 11a-11d , Figure 11a-Figure 1 Figures 1 and 2 show the Z-axis distribution of the magnetic field of the antenna components in the embodiments of this application, related technical solutions one, related technical solutions two, and related technical solutions three, respectively. The embodiments of this application are illustrated using an example where the first region includes a first sub-region 11a, the second region includes a second sub-region 11b, a third sub-region 11c, and a fourth sub-region 11d. The antenna components in related technical solution one, such as... Figure 12 As shown, each of the four sub-regions of the antenna assembly is provided with a magnetic element 130, and one of the outer regions 13 is provided with a conductive element 120. In the antenna assembly of related technical solution two, as... Figure 13 As shown, each of the three sub-regions of the antenna assembly is provided with a magnetic element 130, but no conductive element 120 is provided in the antenna assembly. In the antenna assembly of related technical solution three, as... Figure 14As shown, a sub-region of the antenna assembly and the connected peripheral region 13 are respectively provided with conductive components 120, but no magnetic components 130 are provided in the antenna assembly.

[0081] From such Figures 11a-11d As can be seen from the Z-axis magnetic field distribution diagram, in the first related technical solution, since magnetic components 130 are provided in all four sub-regions of the wiring area 11, the conductive component 120 in the outer region 13 cannot shield the external magnetic field. In the second related technical solution, the conductive component 120 is not provided, and it cannot shield the external magnetic field of the outer region 13. This external magnetic field is opposite in direction to the magnetic field of the inner region 12 in the Z-axis direction. In the third related technical solution, the magnetic component 130 is not provided, and it is impossible to reduce the influence of eddy currents generated by the metal component below the antenna coil 110 on the radiated magnetic field of the antenna coil 110. Obviously, the antenna assembly of the present application embodiment can effectively shield the external magnetic field of the outer region 13. It should be noted that white and black in the simulation diagram can represent the magnetic field direction along the Z-axis direction, where white is perpendicular to the paper and outwards, and black is perpendicular to the paper and inwards.

[0082] The following describes the simulation results of the antenna components of the embodiments of this application, related technical solutions one, two, and three. Figure 15 As shown in Table 1, the following simulation frequency band is 13.56MHz.

[0083] Table 1 compares the simulation results of the coupling coefficients between the four antenna components and the test coil.

[0084] plan Coupling coefficient Examples of this application 0.030 Related technical solution 1 0.0216 Related technical solution two 0.0183 Related technical solution three 0.0269

[0085] By comparing the four schemes and the simulation results of the coupling coefficient with the test antenna coil 110 in the target device, the antenna assembly improved in this application embodiment can effectively improve the coupling coefficient between the NFC antenna in the electronic device and the test antenna coil 110 in the target device, thereby enhancing antenna performance and increasing communication distance.

[0086] For ease of explanation, the structure of the conductive element 120 and its relative positional relationship with the antenna coil 110 and the magnetic element 130 are illustrated below from the perspective of the ZX plane.

[0087] Please continue to refer to this. Figure 2 In one embodiment, the first sub-conductive part 121 and the second sub-conductive part 122 are disposed in the same layer, which reduces the thickness of the conductive part 120 in the Z-axis direction and is beneficial to the thin-film design of the antenna assembly.

[0088] Optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in the same layer and interconnected as a whole; that is, the first sub-conductive portion 121 and the second sub-conductive portion 122 can be integrally formed to form a single conductive sheet. Optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in the same layer but can be spaced apart. Optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in the same layer but can be spaced apart and electrically connected by a connector. The connector may include, but is not limited to, electrical connecting wires, conductive adhesive, conductive posts, flexible FPC, welded metal, etc.

[0089] like Figure 16 and Figure 17 As shown, optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in different layers. For example, taking the plane containing the antenna coil 110 as a reference plane, the first sub-conductive portion 121 can be located on the side of the reference plane containing the antenna coil 110 facing the positive Z-axis, and the second sub-conductive portion 122 can be disposed in the same layer as the antenna coil 110. Alternatively, the first sub-conductive portion 121 can be located on the side of the reference plane containing the antenna coil 110 facing the negative Z-axis, and the second sub-conductive portion 122 can be disposed in the same layer as the antenna coil 110. Alternatively, the first sub-conductive portion 121 can be located on the side of the reference plane containing the antenna coil 110 facing the negative Z-axis, and the second sub-conductive portion 122 can be located on the side of the reference plane containing the antenna coil 110 facing the positive Z-axis. In this way, the conductive component 120 can be flexibly configured to facilitate the molding of diverse antenna assemblies suitable for different application scenarios.

[0090] Optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in different layers and interconnected into a whole. That is, the first sub-conductive portion 121 and the second sub-conductive portion 122 can be integrally formed to form a whole conductive sheet, which has two 90° bends.

[0091] Optionally, the first sub-conductive portion 121 and the second sub-conductive portion 122 are disposed in different layers and spaced apart. The spaced-apart first sub-conductive portion 121 and second sub-conductive portion 122 can be electrically connected by multiple connectors. The connectors may include, but are not limited to, electrical connecting wires, conductive adhesives, conductive posts, flexible FPCs, and welded metals.

[0092] When the first sub-conductive portion 121 and the second sub-conductive portion 122 in the conductive component 120 are spaced apart and not electrically connected, two separate sub-conductive portions can be formed. In this way, the size of the first sub-conductive portion 121 can be designed to correspond to the size of the first region in the wiring region 11, and the size of the second sub-conductive portion 122 can be designed to correspond to the size of the outer region 13 extending from the inner region 12 to the first region. This can achieve shielding or weakening of the magnetic field outside the antenna coil 110 by the first sub-conductive portion 121 and the second sub-conductive portion 122, and can also relatively reduce the space occupied by the conductive component 120, which is beneficial to the miniaturization design of the antenna assembly.

[0093] The first sub-conductive portion 121 and the second sub-conductive portion 122 in the conductive member 120 are integrally formed, or the first sub-conductive portion 121 and the second sub-conductive portion 122 are spaced apart and electrically connected, so that a conductive circuit can be formed between the first sub-conductive portion 121 and the second sub-conductive portion 122. In this way, an induced current can be generated in the first sub-conductive portion 121, thereby shielding or weakening the magnetic field outside the antenna coil 110.

[0094] It should be noted that, in the embodiments of this application, the connection method and relative positional relationship of the first sub-conductive part 121 and the second conductive part are not limited to the examples described above, and may be in other ways. In the embodiments of this application, the connection method and relative positional relationship of the first sub-conductive part 121 and the second sub-conductive part 122 are not limited.

[0095] like Figure 18-20 As shown, in one embodiment, the conductive element 120 further includes a third sub-conductive portion 123, wherein the projection of the third sub-conductive portion 123 toward the antenna coil 110 at least partially falls into one of the first region and the peripheral region 13.

[0096] The third sub-conductive part 123 may be disposed in the same layer as the first sub-conductive part 121 or in a different layer.

[0097] Please continue to refer to this. Figure 19 Optionally, the third sub-conductive part 123 is disposed on the same layer as the first sub-conductive part 121, wherein the projection of the third sub-conductive part 123 toward the antenna coil 110 at least partially falls into the peripheral region 13.

[0098] In this embodiment, the conductive element 120 includes a first sub-conductive portion 121, a second sub-conductive portion 122, and a third sub-conductive portion 123, forming at least two separate sub-conductive portions. This allows the first sub-conductive portion 121 to be designed to correspond in size to the first region in the wiring region 11, and the second sub-conductive portion 122 to be designed to correspond in size to the peripheral region 13 extending from the inner region 12 to the first region. The third sub-conductive portion 123 is designed to correspond in size to the first region in the wiring region 11 and / or the peripheral region 13. This enables the first sub-conductive portion 121, the second sub-conductive portion 122, and the third sub-conductive portion 123 to shield or weaken the magnetic field outside the antenna coil 110, and also reduces the space occupied by the conductive element 120. In addition, the third sub-conductive portion 123 is arranged in the same layer as the first sub-conductive portion 121, which can reduce the thickness of the conductive element 120 in the Z-axis direction, which is beneficial for the miniaturization design of the antenna assembly.

[0099] Optionally, the third sub-conductive portion 123 is disposed in a different layer from the first sub-conductive portion 121, wherein the projection of the third sub-conductive portion 123 toward the antenna coil 110 falls into the peripheral region 13. The third sub-conductive portion 123 is disposed in a different layer from the first sub-conductive portion 121, and the antenna coil 110 is disposed between the first sub-conductive portion 121 and the third sub-conductive portion 123.

[0100] Optional, please continue to refer to Figure 20 The third sub-conductive portion 123 is disposed in a different layer from the first sub-conductive portion 121, wherein the projection of the third sub-conductive portion 123 toward the antenna coil 110 falls into the first region. Optionally, please refer to... Figure 21 The third sub-conductive portion 123 is disposed on a different layer from the first sub-conductive portion 121, wherein the projection of the third sub-conductive portion 123 toward the antenna coil 110 is located in the first region and the peripheral region 13. Exemplarily, one of the first sub-conductive portion 121 and the third sub-conductive portion 123 may be disposed on the same layer as the magnetic element 130, and the other of the first sub-conductive portion 121 and the third sub-conductive portion 123 may be disposed on the side of the antenna coil 110 opposite to the magnetic element 130. The projection of the third sub-conductive portion 123 toward the antenna coil 110 is located in at least one of the first region and the peripheral region 13.

[0101] In this embodiment, the conductive component 120 includes three sub-conductive parts, and the relative positions of each sub-conductive part can be flexibly set to facilitate the formation of diverse antenna assemblies suitable for different application scenarios.

[0102] like Figure 21 and Figure 22As shown, in one embodiment, the conductive element 120 is disposed between the magnetic element 130 and the antenna coil 110. The first projection of the conductive element 120 toward the antenna coil 110 and the third projection of the magnetic element 130 toward the antenna coil 110 respectively fall into regions that at least partially overlap in the wiring region 11. It is understood that the first region and the second region at least partially overlap. Exemplarily, the first region and the second region may partially overlap or may completely overlap.

[0103] In this embodiment, the first projection of the conductive element 120 toward the antenna coil 110 and the third projection of the magnetic element 130 toward the antenna coil 110 at least partially overlap in the wiring area 11. This can relatively increase the area of ​​the magnetic element 130 and the conductive element 120, which can significantly improve the magnetic field radiation effect of the antenna coil 110 in the area corresponding to the magnetic element 130. At the same time, the conductive element 120 can generate an induced magnetic field under the influence of the antenna coil 110 in the corresponding area. This induced magnetic field can cancel or weaken the external magnetic field of the outer area 13 of the antenna assembly. In the area where the antenna coil 110 is not corresponding to the magnetic element 130, the ohmic loss of the antenna coil 110 caused by the magnetic material in the area can be significantly reduced, and the magnetic field density in the area covered by the corresponding conductive structure inside the electronic device can be reduced. This reduces the eddy current loss caused by the conductive structure inside the electronic device, which can further improve the communication performance of the antenna assembly.

[0104] In one embodiment, the conductive element 120 is located between the magnetic element 130 and the antenna coil 110. The first projection of the conductive element 120 toward the antenna coil 110 at least partially falls into the first region of the wiring region 11, and the third projection of the magnetic element 130 toward the antenna coil 110 at least partially falls into the second region of the wiring region 11. The wiring region 11 may include four sub-regions connected in sequence, which may be referred to as the first sub-region 11a, the second sub-region 11b, the third sub-region 11c, and the fourth sub-region 11d, respectively.

[0105] Wherein, at least a portion of the first projection falls within at least one sub-region; that is, at least a portion of the first projection may fall within at least one of the first sub-region 11a, the second sub-region 11b, the third sub-region 11c, and the fourth sub-region 11d. Wherein, at least a portion of the third projection falls within at least one sub-region; that is, at least a portion of the third projection may fall within at least one of the first sub-region 11a, the second sub-region 11b, the third sub-region 11c, and the fourth sub-region 11d. Wherein, the first projection and the third projection each fall within at least one identical sub-region; that is, the sub-regions included in the first region and the sub-regions included in the second region are identical, and at least one overlapping region exists. Wherein, the overlapping region may include at least one sub-region.

[0106] Optionally, the first region may include a first sub-region 11a, a second sub-region 11b, and a third sub-region 11c, and the second region may include a third sub-region 11c and a fourth sub-region 11d.

[0107] Optionally, the overlapping area of ​​the first region and the second region is not limited to a complete sub-region, but can also be a part of a sub-region, etc. It should be noted that in the embodiments of this application, the relative positional relationship between the conductive element 120 and the magnetic element 130 is not further limited, nor is it limited to the examples described above.

[0108] In one embodiment, the antenna assembly includes a plurality of conductive elements 120, wherein adjacent conductive elements 120 are spaced apart. The gap between two spaced conductive elements 120 communicates with the coil hole 111 of the antenna coil 110. The gap between two conductive elements 120 can be used to break eddy currents on the conductive elements 120, so as to induce current at the edge of the conductive element 120 near the coil hole 111, thereby shielding or weakening the external magnetic field of the peripheral region 13 of the antenna assembly.

[0109] Optionally, in the multiple conductive elements 120 of the antenna assembly, adjacent conductive elements 120 are interconnected as a single unit, and a gap is provided between adjacent conductive elements 120, which connects to the coil hole 111 of the antenna coil 110. It should be noted that there can be multiple gaps, which can be provided between adjacent conductive elements 120 or formed on the conductive elements 120. The gaps are used to break the eddy currents on the conductive elements 120, so as to form an induced current at the edge of the conductive element 120 near the coil hole 111, thereby shielding or weakening the external magnetic field of the outer region 13 of the antenna assembly.

[0110] Optionally, each conductive component 120 can be installed on the same layer or on different layers.

[0111] like Figure 23 As shown, optionally, the antenna assembly may include a first conductive element 120a and a second conductive element 120b. The projections of the first conductive element 120a and the second conductive element 120b toward the antenna coil 110 may fall into two adjacent sub-regions in the wiring area, and a peripheral region 13 connected to each sub-region. Optionally, the first conductive element 120a and the second conductive element 120b may be located in two oppositely arranged sub-regions and the peripheral region 13 connected to each sub-region. For example, the first conductive element 120a and the second conductive element 120b may be generally L-shaped, II-shaped, etc.

[0112] like Figure 24As shown, optionally, the antenna assembly may include a first conductive element 120a, a second conductive element 120b, and a third conductive element 120c. The projections of the first conductive element 120a, the second conductive element 120b, and the third conductive element 120c toward the antenna coil 110 may fall into three adjacent sub-regions in the wiring area, as well as the peripheral area 13 connected to each sub-region. For example, the first conductive element 120a, the second conductive element 120b, and the third conductive element 120c may be generally C-shaped, U-shaped, etc.

[0113] like Figure 25 As shown, optionally, the antenna assembly may include a first conductive element 120a, a second conductive element 120b, a third conductive element 120c, and a fourth conductive element 120d, with the four conductive elements 120 disposed between the magnetic element 130 and the antenna coil 110. For example, the first conductive element 120a, the second conductive element 120b, the third conductive element 120c, and the fourth conductive element 120d may be generally O-shaped, D-shaped, or "U"-shaped, etc.

[0114] It should be noted that the relative positions of the multiple conductive elements 120 are not limited to the examples described above.

[0115] In this embodiment, by setting multiple conductive elements 120, with at least two adjacent conductive elements 120 spaced apart, the area of ​​the conductive elements 120 can be increased. This increases the suppression effect on a larger area of ​​external magnetic fields, which is beneficial to the effective communication of the inner region 12 of the antenna assembly, thereby improving the communication distance and communication quality of the antenna assembly.

[0116] like Figure 26 As shown, in one embodiment, the antenna assembly further includes a dielectric substrate 140, wherein a magnetic element 130 and an antenna coil 110 are stacked sequentially on the dielectric substrate 140, and a conductive element 120 is disposed on the dielectric substrate 140 on the side opposite to the magnetic element 130. Optionally, the conductive element 120 and the magnetic element 130 are disposed on the same layer or different layers, and are disposed on the same side of the dielectric substrate 140.

[0117] Optionally, the dielectric substrate 140 can be made of a flexible and insulating material. In this embodiment, the material of the dielectric substrate 140 is not further limited.

[0118] Optionally, the magnetic component 130 is bonded to the dielectric substrate 140.

[0119] Optionally, the antenna coil 110 and the dielectric substrate 140, and the antenna coil 110 and the magnetic component 130 can be connected by adhesive, or the antenna coil 110, the magnetic component 130, the conductive component 120, and the dielectric substrate 140 can be directly fixed in the electronic device by different structures.

[0120] In this embodiment, the antenna coil 110 and the conductive element 120 are respectively disposed on the dielectric substrate 140, which facilitates the placement of conductive elements 120 of different shapes, such as I-shaped, L-shaped, U-shaped, II-shaped, C-shaped, etc., and also facilitates the reuse of other metal structures in electronic devices by the conductive element 120.

[0121] This application also provides an electronic device including the antenna assembly from any of the foregoing embodiments. In this application, the placement of the antenna assembly within the electronic device is not further limited. (See reference...) Figure 27 and Figure 28 In one embodiment, a mobile phone is used as an example for illustration.

[0122] For example, when the antenna assembly is used in an electronic device, the electronic device can be used as a master device. Optionally, when the antenna assembly is used in an electronic device, the electronic device can also be used as a slave device. For NFC communication between the master and slave devices, the transmitting antenna of the master device is the antenna assembly in any of the foregoing embodiments, and the receiving antenna of the slave device is also the antenna assembly in any of the foregoing embodiments. The antenna assemblies of the master and slave devices communicate by mutual coupling via an alternating magnetic field.

[0123] For example, electronic device 100 may include display assembly 101, bezel 102, and cover assembly 103. Display assembly 101 includes a display screen, which may be an OLED (Organic Light-Emitting Diode) screen or an LCD (Liquid Crystal Display) screen. Display assembly 101 can be used to display information and provide an interactive interface for the user. The shape of the display screen can be rectangular or rounded rectangle. A rounded rectangle is sometimes also called a rounded rectangle, meaning that the four corners of the rectangle are rounded, and the four sides of the rectangle are approximately straight lines.

[0124] The bezel 102 can be made of a metal material such as aluminum alloy, magnesium alloy, or stainless steel. The bezel 102 is located on the outer periphery of the display assembly 101 to support and protect the display assembly 101. The bezel 102 can further extend into the electronic device 100 to form a middle plate. The integrally formed middle plate and bezel 102 are sometimes referred to as a mid-frame. The display assembly 101 can be fixedly connected to the bezel 102 or the middle plate using processes such as dispensing.

[0125] The cover plate assembly 103 is located on the side facing away from the display area and connected to the frame 102. Further, the display assembly 101 and the cover plate assembly 103 are located on opposite sides of the middle plate. An installation space can be formed between the cover plate assembly 103 and the display screen for mounting electronic components such as the battery, motherboard, and camera module of the electronic device 100. The motherboard can integrate electronic components such as the processor, storage unit, power management module, and baseband chip of the electronic device 100. The motherboard is located on the side facing away from the display area and can be fixedly connected to the middle frame using screws or other structural components. The motherboard can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit). Radio frequency (RF) circuitry for processing RF signals can be integrated on this substrate, as can a controller for controlling the operation of the electronic device 100. The RF circuitry includes, but is not limited to, antenna components, at least one amplifier, transceiver, coupler, low-noise amplifier (LNA), duplexer, etc. Furthermore, the RF circuitry can communicate wirelessly with networks and other devices. The aforementioned wireless communications may use any communication standard or protocol, including but not limited to Global System for Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0126] Optionally, the antenna assembly may be located between the display screen and the middle plate, or between the middle plate and the cover plate assembly 103.

[0127] The following description, in conjunction with the accompanying drawings, illustrates the specific location of the antenna assembly within the electronic device 100. Of course, the specific location of the antenna assembly within the electronic device 100 includes, but is not limited to, the following embodiments.

[0128] The cover assembly 103 includes a back cover 1031. This back cover can be a non-conductive back cover. An antenna assembly 132 is disposed on the inner side of the back cover 1031. The inner side can be understood as the side of the cover assembly 103 facing the display area of ​​the screen. The back cover 1031 forms the external outline of the electronic device 100 and can serve as the rear shell of the electronic device 100. The back cover 1031 can be integrally molded. During the molding process of the back cover 1031, structures such as a rear camera hole, a fingerprint recognition module, and mounting holes can be formed on the back cover 1031. The coil hole of the antenna coil 110 corresponds to the non-conductive back cover. The antenna coil 110 of the antenna assembly is positioned closer to the non-conductive back cover than the magnetic component 130, and the main communication direction of the antenna coil 110 points towards the non-conductive back cover.

[0129] In this embodiment, the coil hole of the antenna coil 110 is positioned to correspond to the non-conductive back cover, meaning the effective communication area of ​​the antenna coil 110 corresponds to the aforementioned non-conductive area. This allows the effective magnetic induction lines of the inner region 12 of the antenna coil 110 to communicate with the antenna coils 110 in other electronic devices 100 (e.g., master or slave devices) via the non-conductive area. Furthermore, by designing the position of the antenna coil 110 to reuse the space above the non-conductive back cover, this embodiment increases the communication distance and improves the communication quality of the antenna coil 110 without requiring an additional non-conductive area.

[0130] In one embodiment, the electronic device 100 further includes a conductive functional device (not shown in the figure). Exemplary examples include, but are not limited to, at least one of a display screen steel plate, a flexible circuit board steel plate, a voltage-conducting plate, a conductive shield, an aluminum alloy film for a battery, and an aluminum alloy middle plate. At least a portion of the conductive functional device is a conductive element 120.

[0131] The conductive device generates an induced current under the action of the antenna coil 110, and the magnetic field generated by the induced current cancels the external magnetic field in the peripheral area of ​​the antenna coil 110, thereby shielding part of the external magnetic field and "moving" the magnetic induction lines of the external magnetic field outside the area where the conductive device is located, thereby reducing the impact of the external magnetic field on the effective communication area and improving the NFC communication distance and NFC communication quality.

[0132] like Figure 29 As shown, further explanation will be given using a mobile phone as an example for electronic device 100. Specifically, as follows... Figure 29 As shown, the mobile phone may include a memory 21 (which optionally includes one or more computer-readable storage media), processing circuitry 22, control circuitry 23, and an input / output (I / O) subsystem 24. These components optionally communicate via one or more communication buses or signal lines 29. Those skilled in the art will understand that... Figure 29 The mobile phone shown does not constitute a limitation on the mobile phone and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Figure 29 The various components shown are implemented in hardware, software, or a combination of both, including one or more signal processing and / or application-specific integrated circuits.

[0133] Memory 21 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Exemplary examples include software components stored in memory 21 such as an operating system 211, a communication module (or instruction set) 212, a global positioning system (GPS) module (or instruction set) 213, etc.

[0134] The processing circuit 22 and other control circuits 23 can be used to control the operation of the mobile phone. The processing circuit 22 can be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application-specific integrated circuits, etc.

[0135] The I / O subsystem 24 couples input / output peripherals on the phone, such as the keypad and other input control devices, to the peripheral interface. Optionally, the I / O subsystem 24 includes a touchscreen, buttons, a tone generator, an accelerometer (motion sensor), an ambient light sensor and other sensors, LEDs and other status indicators, data ports, etc. For example, a user can control the operation of the phone by supplying commands via the I / O subsystem 24, and can use the output resources of the I / O subsystem 24 to receive status information and other outputs from the phone. For instance, a user can press button 241 to turn the phone on or off.

[0136] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An antenna assembly, characterized in that, include: An antenna coil, wherein the area where the antenna coil is located is the wiring area, and the area outside the wiring area is the peripheral area; A conductive element, spaced apart from the antenna coil, includes a first sub-conductive portion and a second sub-conductive portion. A first projection of the first sub-conductive portion toward the antenna coil at least partially falls into the wiring area. A second projection of the second sub-conductive portion toward the antenna coil at least partially falls into the peripheral area. The peripheral area into which the second projection falls extends along the extension direction of the wiring area into which the first projection falls, the extension direction being the direction from the geometric center of the antenna coil to the wiring area into which the first projection falls. The magnetic induction direction of the induced magnetic field generated by the conductive element under the influence of the antenna coil is opposite to the magnetic induction direction of the external magnetic field generated in the peripheral area when the antenna coil is coupled to an external device. A magnetic element is disposed on one side of the antenna coil, and a third projection portion of the magnetic element toward the antenna coil at least falls into the wiring area, wherein the first projection and the third projection at least partially do not overlap.

2. The antenna assembly according to claim 1, characterized in that, The first projection and the third projection do not overlap at all in the areas of the wiring region.

3. The antenna assembly according to claim 2, characterized in that, The first projection falls into a first area of ​​the wiring area and the third projection falls into a second area of ​​the wiring area, which are adjacent to each other, or the first projection falls into a first area of ​​the wiring area and the third projection falls into a second area of ​​the wiring area are spaced apart.

4. The antenna assembly according to claim 2, characterized in that, The conductive component and the magnetic component are disposed in the same layer or in different layers.

5. The antenna assembly according to claim 2, characterized in that, The conductive portion further includes a third sub-conductive portion, wherein the fourth projection of the third sub-conductive portion toward the antenna coil at least partially coincides with at least one of the first projection and the second projection.

6. The antenna assembly according to claim 5, characterized in that, The antenna coil is disposed between the first sub-conductive part and the third sub-conductive part.

7. The antenna assembly according to any one of claims 1-6, characterized in that, The wiring area includes four sub-areas connected in sequence; At least a portion of the first projection falls within at least one of the sub-regions, and at least a portion of the third projection falls within at least one of the sub-regions.

8. The antenna assembly according to claim 7, characterized in that, The first projection and the third projection fall into different sub-regions.

9. The antenna assembly according to claim 8, characterized in that, The wiring area includes a first sub-area, a second sub-area, a third sub-area, and a fourth sub-area connected in sequence; wherein, the first projection falls into the first sub-area, and the third projection falls into the second sub-area, the third sub-area, and the fourth sub-area.

10. The antenna assembly according to claim 1, characterized in that, The conductive element is disposed between the magnetic element and the antenna coil, and the first projection and the third projection fall into the area of ​​the wiring region, which at least partially overlaps.

11. The antenna assembly according to claim 10, characterized in that, The wiring area comprises four sub-areas connected in sequence; wherein... At least a portion of the first projection falls into at least one of the sub-regions, at least a portion of the third projection falls into at least one of the sub-regions, and the first projection and the third projection each fall into at least one of the same sub-regions.

12. The antenna assembly according to claim 1, characterized in that, The antenna assembly includes multiple conductive elements, wherein a gap is provided between two adjacent conductive elements, and the gap communicates with the coil hole of the antenna coil.

13. The antenna assembly according to claim 1, characterized in that, The antenna assembly includes multiple conductive elements, wherein two adjacent conductive elements are interconnected as a single unit, and at least one gap is formed between two adjacent conductive elements, the gap being connected to the coil hole of the antenna coil.

14. The antenna assembly according to claim 1, characterized in that, The antenna assembly further includes a dielectric substrate, wherein the magnetic element and the antenna coil are stacked sequentially on the dielectric substrate, and the conductive element is disposed on the dielectric substrate on the side away from the magnetic element, or the conductive element and the magnetic element are disposed on the same layer or different layers and on the same side of the dielectric substrate.

15. An electronic device, characterized in that, include: The antenna assembly as described in any one of claims 1-14.

16. The electronic device according to claim 15, characterized in that, The electronic device includes a non-conductive back cover, the antenna coil of the antenna assembly is disposed closer to the non-conductive back cover than the magnetic component, and the communication direction of the antenna coil is directed towards the non-conductive back cover.

17. The electronic device according to claim 16, characterized in that, The electronic device further includes a conductive functional device, at least a portion of which is the conductive element.

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