Heat dissipation device and server heat dissipation system

Abstract

This invention provides a heat dissipation device and a server heat dissipation system, relating to the field of server heat dissipation technology. The heat dissipation device includes multiple sets of cooling components; multiple sets of heat exchange components, each installed on multiple servers; a liquid distribution and collection assembly connecting at least one set of cooling components; and coolant filling each set of heat exchange components, each set of cooling components, and the liquid distribution and collection assembly. The heat dissipation device and server heat dissipation system provided by this invention utilizes the liquid distribution and collection assembly to distribute the coolant from multiple sets of cooling components to different heat exchange components, and after heat exchange, distributes coolant with different temperatures to different cooling components. This not only avoids mixing of coolant with large temperature differences, reducing coolant consumption, but also improves heat dissipation efficiency, enabling precise heat dissipation for the different cooling requirements of different servers.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and in particular to a heat dissipation device and server heat dissipation system. Background Technology

[0002] In existing technologies, server racks utilize components such as distributors, heat exchange heads, coolant collectors, and radiator assemblies to dissipate heat from the servers. During operation, the coolant is evenly distributed to different servers via the distributor for heat exchange. After the coolant has heated up, it is collected together via the collector and finally flows to the radiator assembly for further cooling before returning to the distributor for the next cycle.

[0003] However, in practice, different servers generate different amounts of heat, so the temperature of the heat transfer fluid after heat exchange through the heat exchange head is also different. When these fluids are combined and then cooled by the radiator, the coolant with a relatively higher temperature is cooled directly, but the coolant with a relatively lower temperature is heated first and then cooled down. This not only reduces the heat dissipation efficiency but also wastes the cooling capacity of the coolant, making it impossible to achieve precise heat dissipation for different servers. Summary of the Invention

[0004] This invention provides a heat dissipation device and a server heat dissipation system to solve the problem that the existing technology has low heat dissipation efficiency for servers with different heat requirements and cannot achieve precise heat dissipation for different servers.

[0005] In a first aspect, the present invention provides a heat dissipation device, comprising:

[0006] Multiple cooling components;

[0007] Multiple heat exchange components are installed on multiple servers;

[0008] The liquid separation and collection assembly connects at least one set of the cooling components to at least one set of the cooling components;

[0009] Coolant is filled in each group of heat exchange components, each group of cooling components, and the liquid distribution and collection assembly; the liquid distribution and collection assembly is used to distribute the coolant of each group of cooling components to each heat exchange component, and after heat exchange, distribute coolant with different temperatures to different cooling components.

[0010] According to a heat dissipation device provided by the present invention, the liquid distribution and collection assembly includes a multi-component liquid distributor and a multi-component liquid collector;

[0011] Each set of liquid distributors connects the liquid outlet of the corresponding heat exchange component to the liquid inlet of the cooling component.

[0012] Each set of liquid collectors connects the liquid outlet of the corresponding cooling component to the liquid inlet of the heat exchange component.

[0013] According to a heat dissipation device provided by the present invention, the liquid distributors in each group are interconnected.

[0014] According to a heat dissipation device provided by the present invention, the plurality of cooling components include a first cooling component and a second cooling component; the liquid distribution and collection assembly includes a first liquid distributor, a second liquid distributor, a first liquid collector, and a second liquid collector;

[0015] The outlet of the first cooling component is connected to the inlet of a portion of the heat exchange components through the first distributor; the outlet of the second cooling component is connected to the inlet of another portion of the heat exchange components through the second distributor.

[0016] One portion of the heat exchange components has its liquid outlet connected to the liquid inlet of the first cooling component via the first liquid collector; the other portion of the heat exchange components has its liquid outlet connected to the liquid inlet of the second cooling component via the second liquid collector.

[0017] According to a heat dissipation device provided by the present invention, the plurality of cooling components include a first cooling component and a second cooling component; the liquid distribution and collection assembly includes a third liquid distributor, a third liquid collector and a fourth liquid collector;

[0018] The outlet of the first cooling component is simultaneously connected to the inlet of all the heat exchange components through the third distributor.

[0019] One portion of the heat exchange components' liquid outlets are connected to the second cooling component via the third liquid collector, while another portion of the heat exchange components' liquid outlets are connected to the first cooling component's liquid inlet via the fourth liquid collector. The second cooling component's liquid outlet is also connected to the first cooling component's liquid inlet via the fourth liquid collector.

[0020] According to a heat dissipation device provided by the present invention, the plurality of cooling components include a first cooling component and a second cooling component; the liquid distribution and collection assembly includes a fourth liquid distributor, a fifth liquid distributor, a fifth liquid collector, a sixth liquid collector, a first connecting pipe, and a second connecting pipe;

[0021] The liquid outlet of the first cooling component is connected to a portion of the heat exchange components through the fourth liquid distributor;

[0022] The outlet of the second cooling component is connected to another part of the heat exchange component through the fifth distributor;

[0023] The liquid outlet of a portion of the heat exchange component is connected to the liquid inlet of the first cooling component through the fifth liquid collector;

[0024] The outlet of another part of the heat exchange components is connected to the inlet of the second cooling component through the sixth liquid collector. The first connecting pipe is connected to the outlet of the other part of the heat exchange components and the inlet of a part of the heat exchange components. The second connecting pipe connects the fourth liquid distributor and the sixth liquid collector.

[0025] According to the present invention, a heat dissipation device further includes: a temperature sensor and a control switch;

[0026] The temperature sensor is used to detect the first coolant temperature at the outlet of a portion of the heat exchange components and the second coolant temperature at the inlet of another portion of the heat exchange components. The control switch is located in the first connecting pipe.

[0027] The temperature sensor is electrically connected to the control switch. The control switch is used to connect the first and second connecting pipes when the first cooling temperature is less than or equal to the second cooling temperature, and to disconnect the first and second connecting pipes when the first cooling temperature is greater than the second cooling temperature.

[0028] According to a heat dissipation device provided by the present invention, the heat exchange component is arranged in a ring shape in the corresponding server.

[0029] According to a heat dissipation device provided by the present invention, the liquid distribution and collection assembly is movably connected to at least one set of the heat exchange components and at least one set of the cooling components.

[0030] Secondly, the present invention also provides a server heat dissipation system, comprising: multiple servers and the aforementioned heat dissipation equipment, wherein each group of heat exchange components is respectively disposed on different servers.

[0031] The heat dissipation device and server heat dissipation system provided by the present invention utilize a liquid distribution and collection component to distribute the coolant of multiple cooling components to different heat exchange components, and after heat exchange, distribute coolant with different temperatures to different cooling components. This not only avoids mixing of coolant with large temperature differences and reduces the consumption of coolant, but also improves heat dissipation efficiency and enables precise heat dissipation for the cooling requirements of different servers. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device provided in the first embodiment of the present invention;

[0034] Figure 2 This is a top view of the heat dissipation device provided in the first embodiment of the present invention;

[0035] Figure 3 This is a three-dimensional structural schematic diagram of the heat dissipation device provided in the second embodiment of the present invention;

[0036] Figure 4 This is a top view of the heat dissipation device provided in the second embodiment of the present invention;

[0037] Figure 5 This is a three-dimensional structural diagram of the heat dissipation device provided in the third embodiment of the present invention;

[0038] Figure 6 This is a top view of the heat dissipation device provided in the third embodiment of the present invention;

[0039] Figure 7 This is a three-dimensional structural diagram of the heat dissipation device provided in the fourth embodiment of the present invention;

[0040] Figure 8 This is a top view of the heat dissipation device provided in the fourth embodiment of the present invention;

[0041] Figure 9 This is a partial structural schematic diagram of the heat dissipation device provided in the fourth embodiment of the present invention;

[0042] Figure 10 This is a schematic diagram of a server provided in the fourth embodiment of the present invention;

[0043] Figure label:

[0044] 10. Cooling component; 11. First cooling component; 12. Second cooling component; 20. Heat exchange component; 21. First heat exchange component; 22. Second heat exchange component; 23. Third heat exchange component; 30. Liquid distribution and collection assembly; 31. First liquid distributor; 32. Second liquid distributor; 33. First liquid collector; 34. Second liquid collector; 35. Third liquid distributor; 36. Third liquid collector; 37. Fourth liquid collector; 38. Fourth liquid distributor; 39. Fifth liquid distributor; 40. Server; 400. Housing; 4001. Receiving cavity; 41. Fifth liquid collector; 42. Sixth liquid collector; 43. First connecting pipe; 44. Second connecting pipe. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0046] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0047] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0048] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0049] The following is combined Figure 1 - Figure 10 The heat dissipation device of the present invention is described.

[0050] This invention provides a heat dissipation device, which is mainly used for cooling servers in a server rack, such as... Figures 1 to 10 As shown, the heat dissipation device includes multiple sets of cooling components 10, multiple sets of heat exchange components 20, liquid distribution and collection assembly 30, and coolant.

[0051] Multiple heat exchange components 20 are respectively installed on multiple different servers 40, and are used to dissipate heat from the multiple different servers 40. Coolant is filled in each heat exchange component 20, each cooling component 10, and the liquid distribution and collection assembly 30. The multiple cooling components 10 can cool the coolant entering them. The liquid distribution and collection assembly 30 is used to distribute the coolant from each cooling component 10 to each heat exchange component 20, and after heat exchange, distribute coolant with different temperatures to different cooling components 10.

[0052] In this embodiment, different servers 40 have different operating temperatures and different heat exchange requirements. During operation, the liquid distribution and collection assembly 30 distributes the coolant from each group of cooling components 10 to each heat exchange component 20. Since multiple heat exchange components 20 are respectively installed on multiple different servers 40, and different servers 40 have different heat exchange requirements, the coolant at different locations has different temperatures after heat exchange on each heat exchange component 20. Therefore, the liquid distribution and collection assembly 30 can be used to distribute coolant of different temperatures to different cooling components 10 for cooling. The cooled coolant is then redistributed to each group of heat exchange components 20 through the liquid distribution and collection assembly 30, thereby avoiding mixing of coolants with excessive temperature differences, thus making full use of the cold energy in the coolant and improving heat dissipation efficiency.

[0053] The heat dissipation device provided by the present invention uses a liquid distribution and collection component 30 to distribute the coolant of multiple cooling components 10 to different heat exchange components 20, and after heat exchange, distributes coolant with different temperatures to different cooling components 10. This not only avoids mixing of coolant with large temperature differences and reduces the consumption of coolant, but also improves heat dissipation efficiency and enables precise heat dissipation for the cooling requirements of different servers 40.

[0054] It should be noted that, according to actual needs, the cooling component 10 can adjust the cooling temperature as required. Different cooling components 10 can not only cool coolants with different temperatures to the same temperature, but also cool coolants with the same cooling temperature after heat exchange to different temperatures, so as to adapt to the different operating temperatures of the server 40.

[0055] In a specific embodiment of the present invention, such as Figure 1 and Figure 2As shown, the liquid distribution and collection assembly 30 includes multiple liquid distributors and multiple liquid collectors. Each liquid distributor connects the outlet of the corresponding heat exchange component 20 to the inlet of the cooling component 10, that is, each liquid distributor corresponds to one set of heat exchange components 20 and one set of cooling components 10, and is used to guide the coolant in the corresponding cooling component 10 into the heat exchange component 20; each liquid collector connects the outlet of the corresponding cooling component 10 to the inlet of the heat exchange component 20, that is, each liquid collector corresponds to one set of heat exchange components 20 and one set of cooling components 10, and is used to guide the cooled coolant after heat dissipation into the cooling component 10 for re-cooling.

[0056] In this embodiment, during the operation of the heat dissipation device, multiple servers 40 use different heat exchange components 20 for heat dissipation. The corresponding heat exchange components 20 are each equipped with a separate distributor and a collector, which are connected to different groups of cooling components 10. Through the separately equipped distributor and collector, direct contact between coolants of different temperatures in the entire heat dissipation device can be avoided, thereby reducing the cooling capacity consumption of coolant and improving heat dissipation efficiency.

[0057] Understandably, the liquid distribution and collection assembly 30 can be assembled according to the actual number of servers in the server rack, the operating temperature, and the heat dissipation power requirements. This method of assembly based on needs reduces costs and improves heat dissipation efficiency.

[0058] In a specific embodiment, such as Figure 1 and Figure 2 As shown, the multiple cooling components 10 include a first cooling component 11 and a second cooling component 12. The liquid distribution and collection assembly 30 includes a first distributor 31, a second distributor 32, a first collector 33, and a second collector 34. The outlet of the first cooling component 11 is connected to the inlet of a portion of the heat exchange components 20 through the first distributor 31. The outlet of the second cooling component 12 is connected to the inlet of another portion of the heat exchange components 20 through the second distributor 32; the outlet of a portion of the heat exchange components 20 is connected to the inlet of the first cooling component 11 through the first collector 33; and the outlet of another portion of the heat exchange components 20 is connected to the inlet of the second cooling component 12 through the second collector 34.

[0059] Specifically, in this embodiment, the multiple heat exchange components 20 include a first heat exchange component 21 and a second heat exchange component 22. The first heat exchange component 21 and the second heat exchange component 22 are disposed on different servers 40 and are used to dissipate heat from servers 40 with different heat dissipation requirements.

[0060] During operation, the first heat exchange component 21 dissipates heat from server A (operating temperature 50 degrees Celsius), and the second heat exchange component 22 dissipates heat from server B (operating temperature 70 degrees Celsius). The coolant that has completed its cooling process in the first heat exchange component 21 enters the first cooling component 11 through the first collector 33 for further cooling. The cooled coolant is then distributed back into the first heat exchange component 21 through the first distributor 31. Similarly, the coolant that has completed its cooling process in the second heat exchange component 22 enters the second cooling component 12 through the second collector 34 for further cooling. The cooled coolant is then distributed back into the second heat exchange component 22 through the second distributor 32. Since servers A and B have different cooling requirements, the flow rate and temperature of the coolant in the two different lines can be controlled independently using the first cooling component 11 and the second cooling component 12, allowing for separate cooling of servers A and B. This not only avoids mixing of coolants with large temperature differences, reducing coolant consumption, but also improves cooling efficiency, enabling precise cooling for the different cooling requirements of each server.

[0061] It should be noted that in this embodiment, the first liquid separator 31, the second liquid separator 32, the first liquid collector 33, and the second liquid collector 34 are independently set liquid separation or liquid collection pipes.

[0062] In another embodiment, such as Figure 3 and Figure 4 As shown, in this embodiment, the cooling component 10 can cool coolants with different temperatures to the same temperature. The various distributors are interconnected, so the coolants in the distributors are mixed and then distributed to different heat exchange components 20. Because the distributors mix all the cooled coolants, the flow rate of coolant entering different heat exchange components 20 can be adjusted according to the situation during subsequent distribution, enabling precise heat dissipation for the cooling requirements of different servers.

[0063] In one example, multiple sets of servers 40 are divided into server A and server B, multiple sets of heat exchange components 20 include a first heat exchange component 21 and a second heat exchange component 22, and multiple sets of cooling components 10 include a first cooling component 11 and a second cooling component 12. The liquid distribution and collection assembly 30 includes a first liquid distributor 31, a second liquid distributor 32, a first liquid collector 33, and a second liquid collector 34.

[0064] In this embodiment, the first heat exchange component 21 is installed on server A, the second heat exchange component 22 is installed on server B, the first distributor 31 is connected to the second distributor 32, the outlet of the first cooling component 11 is connected to the first heat exchange component 21 and the second heat exchange component 22 through the first distributor 31, the outlet of the second cooling component 12 is connected to the first distributor 31 through the second distributor 32, the outlet of the first heat exchange component 21 is connected to the inlet of the first cooling component 11 through the first collector 33, and the outlet of the second heat exchange component 22 is connected to the inlet of the second cooling component 12 through the second collector 34.

[0065] During the operation of the heat dissipation equipment, the coolant that dissipates heat from server A in the first heat exchange component 21 enters the first cooling component 11 through the first collector 33 for further cooling. The cooled coolant is then distributed back into the first heat exchange component 21 through the first distributor 31. Similarly, the coolant that dissipates heat from server B in the second heat exchange component 22 enters the second cooling component 12 through the second collector 34 for further cooling. The cooled coolant is then distributed back into the second heat exchange component 22 through the first distributor 31 and the second distributor 32. Since the temperatures of the heat transfer fluids in servers A and B are different after heat exchange, but the temperatures before heat exchange are the same, the power of the first cooling component 11 and the second cooling component 12 can be adjusted according to the temperature of the heat transfer fluids after heat exchange.

[0066] In addition, when the cooling temperatures of the first cooling component 11 and the second cooling component 12 are the same, mixing the coolant during the liquid separation process can not only avoid mixing coolants with large temperature differences and reduce the cooling capacity consumption of the coolant, but also improve the heat dissipation efficiency and enable precise heat dissipation by adjusting the flow rate according to the cooling capacity required by different servers.

[0067] It should be noted that, as Figures 3 to 4 As shown, in this embodiment, the first liquid distributor 31, the second liquid distributor 32, the first liquid collector 33 and the second liquid collector 34 can all adopt liquid distribution pipes or other connecting structures. The components can be assembled as needed, as long as the connection between the first liquid distributor 31 and the second liquid distributor 32 is ensured.

[0068] If more servers need to be set up, see another example, such as Figure 3 and Figure 4As shown, the multiple servers 40 are divided into server A, server B, and server C, with server B and server C operating at the same temperature. The multiple heat exchange components 20 include a first heat exchange component 21, a second heat exchange component 22, and a third heat exchange component 23, and the multiple cooling components 10 include a first cooling component 11 and a second cooling component 12. The cooling components 10 can be further added as needed. The liquid distribution and collection assembly 30 includes a first liquid distributor 31, a second liquid distributor 32, a first liquid collector 33, and a second liquid collector 34.

[0069] In this embodiment, the first heat exchange component 21 is installed on server A, the second heat exchange component 22 is installed on server B, and the third heat exchange component 23 is installed on server C. The first distributor 31 is connected to the second distributor 32. The outlet of the first cooling component 11 is connected to the first heat exchange component 21, the second heat exchange component 22, and the third heat exchange component 23 through the first distributor 31. The outlet of the second cooling component 12 is connected to the first distributor 31 through the second distributor 32. The outlet of the first heat exchange component 21 is connected to the inlet of the first cooling component 11 through the first collector 33. The outlets of the second heat exchange component 22 and the third heat exchange component 23 are connected to the inlet of the second cooling component 12 through the second collector 34.

[0070] During the operation of the heat dissipation equipment, the coolant that dissipates heat from server A in the first heat exchange component 21 enters the first cooling component 11 through the first collector 33 for further cooling. The cooled coolant is then distributed back to the first heat exchange component 21 through the first distributor 31. Similarly, the coolant that dissipates heat from servers B and C in the second heat exchange component 22 and the third heat exchange component 23 enters the second cooling component 12 through the second collector 34 for further cooling. The cooled coolant is then distributed back to the second heat exchange component 22 and the third heat exchange component 23 through the first distributor 31 and the second distributor 32. When the cooling temperatures of the first cooling component 11 and the second cooling component 12 are the same, mixing the coolant during the distribution process not only avoids mixing coolants with large temperature differences, reducing coolant consumption, but also improves heat dissipation efficiency. It allows for precise heat dissipation by adjusting the flow rate according to the cooling requirements of different servers. Furthermore, this combination method allows for adjustment of the coolant flow rate and the assembly of the distribution and collection components 30 can be customized according to different server sizes.

[0071] In some embodiments, such as Figure 5 and Figure 6As shown, the multiple cooling components 10 include a first cooling component 11 and a second cooling component 12. The liquid distribution and collection assembly 30 includes a third liquid distributor 35, a third liquid collector 36, and a fourth liquid collector 37. The outlet of the first cooling component 11 is simultaneously connected to the inlet of all heat exchange components 20 through the third liquid distributor 35; the outlets of some heat exchange components 20 are connected to the second cooling component 12 through the third liquid collector 36, and the outlets of other heat exchange components 20 are connected to the inlet of the first cooling component 11 through the fourth liquid collector 37; the outlet of the second cooling component 12 is connected to the inlet of the first cooling component 11 through the fourth liquid collector 37.

[0072] In this embodiment, the multiple heat exchange components 20 include a first heat exchange component 21, a second heat exchange component 22, and a third heat exchange component 23. The multiple servers 40 are divided into server A, server B, and server C. The first heat exchange component 21 is installed on server A, the second heat exchange component 22 is installed on server B, and the third heat exchange component 23 is installed on server C. The outlet of the first cooling component 11 is simultaneously connected to the inlets of the first heat exchange component 21, the second heat exchange component 22, and the third heat exchange component 23 via a third distributor 35. The outlet of the first heat exchange component 21 is connected to the second cooling component 12 via a third collector 36. The outlets of the second heat exchange component 22 and the third heat exchange component 23 are connected to the inlet of the first cooling component 11 via a fourth collector 37. The outlet of the second cooling component 12 is connected to the inlet of the first cooling component 11 via a branch pipe on the fourth collector 37.

[0073] During the operation of the heat dissipation equipment, the coolant used to dissipate heat from server B in the second heat exchange component 22 and the coolant used to dissipate heat from server C in the third heat exchange component 23 enter the second cooling component 12 through the third collector 36 for initial cooling (e.g., from 70 degrees Celsius to 50 degrees Celsius). The initially cooled coolant then mixes with the coolant used to dissipate heat from server A in the first heat exchange component 21 (at 50 degrees Celsius) through the fourth collector 37. The mixed coolant is then introduced into the first cooling component 11 through the fourth collector 37 for secondary cooling. Finally, after cooling to the specified temperature, the next cycle begins, and the secondary cooled coolant is distributed to the first heat exchange component 21, the second heat exchange component 22, and the third heat exchange component 23 through the third distributor 35. By mixing the coolant during the cooling process, not only can the mixing of coolants with large temperature differences be avoided, reducing the cooling capacity consumption of the coolant, but the heat dissipation efficiency can also be improved, allowing for precise heat dissipation by adjusting the flow rate according to the cooling capacity required by different servers.

[0074] In some embodiments, such as Figure 7 , Figure 8 and Figure 9As shown, the multiple cooling components 10 include a first cooling component 11 and a second cooling component 12. The liquid distribution and collection assembly 30 includes a fourth liquid distributor 38, a fifth liquid distributor 39, a fifth liquid collector 41, a sixth liquid collector 42, a first connecting pipe 43, and a second connecting pipe 44.

[0075] The outlet of the first cooling component 11 is connected to a portion of the heat exchange components 20 via the fourth distributor 38; the outlet of the second cooling component 12 is connected to another portion of the heat exchange components 20 via the fifth distributor 39. The outlet of one portion of the heat exchange components 20 is connected to the inlet of the first cooling component 11 via the fifth collector 41; the outlet of another portion of the heat exchange components 20 is connected to the inlet of the second cooling component 12 via the sixth collector 42; the first connecting pipe 43 is connected to the outlet of the other portion of the heat exchange components 20 and the inlet of one portion of the heat exchange components 20 respectively; the second connecting pipe 44 connects the fourth distributor 38 and the sixth collector 42.

[0076] Specifically, such as Figure 7 and Figure 8 As shown, the multiple heat exchange components 20 include a first heat exchange component 21 and a second heat exchange component 22. The multiple servers 40 are divided into server A and server B. The first heat exchange component 21 is installed on server A, and the second heat exchange component 22 is installed on server B. The outlet of the first cooling component 11 is connected to the first heat exchange component 21 via a fourth distributor 38. The outlet of the second cooling component 12 is connected to the second heat exchange component 22 via a fifth distributor 39. The outlet of the first heat exchange component 21 is connected to the inlet of the first cooling component 11 via a fifth collector 41; the outlet of the second heat exchange component 22 is connected to the inlet of the second cooling component 12 via a sixth collector 42. A first connecting pipe 43 connects the outlet of the second heat exchange component 22 and the inlet of the first heat exchange component 21. A second connecting pipe 44 connects the fourth distributor 38 and the sixth collector 42.

[0077] During the operation of the heat dissipation equipment, the coolant that dissipates heat from server B in the second heat exchange component 22 can enter the second cooling component 12 through the sixth collector 42 for further cooling. Simultaneously, this coolant can also enter the first heat exchange component 21 through the first connecting pipe 43, where it mixes with the coolant distributed by the fourth distributor 38 to dissipate heat from server A. Afterwards, the mixed coolant that dissipates heat from server A in the first heat exchange component 21 can enter the first cooling component 11 through the fifth collector 41 for further cooling. Finally, once the designated temperature is reached, the fourth distributor 38 distributes the coolant from the first cooling component 11 to the first heat exchange component 21, and the fifth distributor 39 distributes the coolant from the second cooling component 12 to the second heat exchange component 22. Throughout the process, because the second connecting pipe 44 connects the fourth distributor 38 and the sixth collector 42, coolant can flow into the corresponding circuit of the first cooling component 11. Part of the coolant in the fourth distributor 38 can flow back to the sixth collector 42 through the second connecting pipe 44, and then be cooled again in the second cooling component 12, thus ensuring that the flow rate in both circuits remains within a certain range. By mixing the coolant during the heat dissipation process, not only can the mixing of coolants with excessive temperature differences be avoided, reducing coolant consumption, but also the heat dissipation efficiency can be improved, allowing for precise heat dissipation by adjusting the flow rate according to the cooling requirements of different servers.

[0078] Further, based on the above embodiments, such as Figure 7 , Figure 8 and Figure 9 As shown, the heat dissipation device also includes a temperature sensor and a control switch. The temperature sensor is used to detect the first coolant temperature at the outlet of a portion of the heat exchange component 20 and the second coolant temperature at the inlet of another portion of the heat exchange component 20. That is, the temperature sensor is used to detect the outlet temperature of the first heat exchange component 21 and the inlet temperature of the second heat exchange component 22.

[0079] The control switch is located on the first connecting pipe 43. The temperature sensor is electrically connected to the control switch. Since cooling can continue when the first cooling temperature is less than or equal to the second cooling temperature, the control switch, when the first cooling temperature is less than or equal to the second cooling temperature, controls the first connecting pipe 43 and the second connecting pipe 44 to be open. This allows the coolant in the second heat exchange component 22 to enter the first heat exchange component 21 through the first connecting pipe 43. The coolant in the fourth distributor 38 can flow back to the sixth collector 42 through the second connecting pipe 44, where it can mix with the coolant distributed by other distributors. However, when the first cooling temperature is greater than the second cooling temperature, directly mixing the coolant would affect heat dissipation efficiency. Therefore, the control switch cuts off the first connecting pipe 43 and the second connecting pipe 44 based on the temperature signal transmitted by the temperature sensor, allowing the first heat exchange component 21 and the second heat exchange component 22 to independently dissipate heat for their respective servers.

[0080] Based on the above embodiments, in one embodiment, such as Figure 10 As shown, server 40 includes a housing 400 and a chip. A receiving cavity 4001 is formed in the housing 400, and the chip is disposed in the receiving cavity.

[0081] To improve heat exchange efficiency, the heat exchange component 20 is arranged in a ring shape in the receiving cavity 4001 of the corresponding server 40. Thus, the heat exchange component 20 can first dissipate heat from the receiving cavity 4001 and then dissipate heat from the chip in the receiving cavity 4001, so that the overall temperature of the server 40 can be maintained within a certain range.

[0082] Based on the above embodiments, in one embodiment, such as Figures 1 to 10 As shown, depending on the actual use and installation needs, the liquid separating and collecting assembly 30 is fixedly or movably connected to at least one set of heat exchange components 20 and at least one set of cooling components 10. In other words, each liquid separator and liquid collector in the liquid separating and collecting assembly 30 can be connected to each set of heat exchange components 20 and cooling components 10 by means of fixed connection or movable connection as needed, and the specific form of fixed connection or movable connection can be freely adjusted.

[0083] For example, when the server 40 frequently needs to adjust its heat dissipation or position, the liquid distribution and collection assembly 30 can be connected in a movable manner to facilitate disassembly and adjustment of the components. However, when the server 40 does not need to adjust its heat dissipation, a fixed connection can be used to connect the components to make the entire heat dissipation device more robust.

[0084] In addition, embodiments of the present invention also provide a server heat dissipation system, such as... Figures 1 to 10As shown, it includes: multiple servers 40 and a heat dissipation device, which includes multiple sets of cooling components 10, multiple sets of heat exchange components 20, a liquid distribution and collection assembly 30, and coolant. The multiple sets of heat exchange components 20 are respectively installed on multiple different servers 40 and are used to dissipate heat from the multiple different servers 40. Coolant fills each set of heat exchange components 20, each set of cooling components 10, and the liquid distribution and collection assembly 30, and the multiple sets of cooling components 10 can cool the coolant entering them. The liquid distribution and collection assembly 30 is used to distribute the coolant from each set of cooling components 10 to each heat exchange component 20, and after heat exchange, distributes coolant at different temperatures to different cooling components 10. Each set of heat exchange components 20 is respectively installed on different servers 40.

[0085] The specific structure of the heat dissipation equipment is detailed above and will not be repeated here. Since the server heat dissipation system uses this heat dissipation equipment, the liquid distribution and collection assembly 30 distributes the coolant from multiple cooling components 10 to different heat exchange components 20, and after heat exchange, distributes coolant with different temperatures to different cooling components 10. This not only avoids mixing of coolant with large temperature differences and reduces the cooling capacity consumption of coolant, but also improves heat dissipation efficiency and enables precise heat dissipation for the cooling capacity required by different servers 40.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: Multiple sets of cooling components (10), including a first cooling component (11) and a second cooling component (12); Multiple sets of heat exchange components (20) are respectively installed on multiple servers (40); The liquid separation and collection assembly (30) connects at least one set of the cooling components (10) to at least one set of the cooling components (10); Coolant is filled in each group of heat exchange components (20), each group of cooling components (10), and the liquid distribution and collection assembly (30); the liquid distribution and collection assembly (30) is used to distribute the coolant of each group of cooling components (10) to each heat exchange component (20), and after heat exchange, distribute coolant with different temperatures to different cooling components (10); The liquid separation and collection assembly (30) can be one of the following three types: In one embodiment, the liquid distribution and collection assembly (30) includes a first liquid distributor (31), a second liquid distributor (32), a first liquid collector (33), and a second liquid collector (34); the outlet of the first cooling component (11) is connected to the inlet of a portion of the heat exchange component (20) through the first liquid distributor (31); the outlet of the second cooling component (12) is connected to the inlet of another portion of the heat exchange component (20) through the second liquid distributor (32); the outlet of a portion of the heat exchange component (20) is connected to the inlet of the first cooling component (11) through the first liquid collector (33); and the outlet of another portion of the heat exchange component (20) is connected to the inlet of the second cooling component (12) through the second liquid collector (34). Alternatively, in the second method, the liquid distribution and collection assembly (30) includes a third liquid distributor (35), a third liquid collector (36), and a fourth liquid collector (37); the outlet of the first cooling component (11) is connected to the inlet of all the heat exchange components (20) through the third liquid distributor (35); the outlet of a portion of the heat exchange components (20) is connected to the second cooling component (12) through the third liquid collector (36), the outlet of another portion of the heat exchange components (20) is connected to the inlet of the first cooling component (11) through the fourth liquid collector (37), and the outlet of the second cooling component (12) is connected to the inlet of the first cooling component (11) through the fourth liquid collector (37); Alternatively, in method three, the liquid distribution and collection assembly (30) includes a fourth liquid distributor (38), a fifth liquid distributor (39), a fifth liquid collector (41), a sixth liquid collector (42), a first connecting pipe (43), and a second connecting pipe (44); the outlet of the first cooling component (11) is connected to a portion of the heat exchange component (20) through the fourth liquid distributor (38); the outlet of the second cooling component (12) is connected to another portion of the heat exchange component (20) through the fifth liquid distributor (39); a portion of the heat exchange component ( The outlet of heat exchange component (20) is connected to the inlet of the first cooling component (11) through the fifth liquid collector (41); the outlet of another part of the heat exchange component (20) is connected to the inlet of the second cooling component (12) through the sixth liquid collector (42); the first connecting pipe (43) is connected to the outlet of another part of the heat exchange component (20) and the inlet of a part of the heat exchange component (20); the second connecting pipe (44) connects the fourth liquid distributor (38) and the sixth liquid collector (42).

2. The heat dissipation device according to claim 1, characterized in that, The liquid separation and collection assembly (30) includes a multi-component liquid separator and a multi-component liquid collector; Each group of liquid distributors connects the liquid outlet of the corresponding heat exchange component (20) and the liquid inlet of the cooling component (10); Each set of liquid collectors connects the liquid outlet of the corresponding cooling component (10) and the liquid inlet of the heat exchange component (20).

3. The heat dissipation device according to claim 2, characterized in that, The dispensers in each group are interconnected.

4. The heat dissipation device according to claim 1, characterized in that, When the liquid separation and collection assembly (30) is in mode three, the heat dissipation device further includes: a temperature sensor and a control switch; The temperature sensor is used to detect the first coolant temperature at the outlet of a portion of the heat exchange component (20) and the second coolant temperature at the inlet of another portion of the heat exchange component (20). The control switch is located in the first connecting pipe (43). The temperature sensor is electrically connected to the control switch. The control switch is used to connect the first connecting pipe (43) and the second connecting pipe (44) when the first cooling temperature is less than or equal to the second cooling temperature, and to disconnect the first connecting pipe (43) and the second connecting pipe (44) when the first cooling temperature is greater than the second cooling temperature.

5. The heat dissipation device according to any one of claims 1-4, characterized in that, The heat exchange component (20) is arranged in a ring shape in the corresponding server (40).

6. The heat dissipation device according to any one of claims 1-4, characterized in that, The liquid separation and collection assembly (30) is movably connected to at least one set of the heat exchange components (20) and at least one set of the cooling components (10).

7. A server cooling system, characterized in that, include: Multiple servers (40) and a heat dissipation device as described in any one of claims 1-6, wherein each group of heat exchange components (20) is respectively disposed on different servers (40).

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