Housings for electrical components

Abstract

Provided is an electrical component housing for housing electrical components. The electrical component housing comprises: a resin base on which the electrical components are placed; a metal cover mounted on the base to cover the electrical components; and a metal plate abutting against the bottom surface of the base to cover the bottom surface of the base. In addition, the electrical component housing comprises a conductive component disposed in a through hole that penetrates the base in the thickness direction of the base, and the conductive component electrically connects a ground terminal of the electrical component to the metal plate.

Description

Technical Field

[0001] The present invention relates to a housing for an electrical component. Background Art

[0002] WO2019 / 175928 discloses a housing for electronic components that accommodates electronic components. In the housing for electronic components, a portion for placing the electronic components is made of a resin material that is easy to process and lightweight, and a portion for covering the electronic components is made of a metal material. Summary of the invention

[0003] However, in order to reduce the influence of electromagnetic noise from outside the housing and the influence of electromagnetic noise on the outside of the housing, the ground terminal of the electrical component in the housing needs to be grounded (electrically connected) to the metal part of the housing. However, in order to ground the electrical component, the housing needs to be assembled with the ground terminal of the electrical component connected to the inner wall of the metal part by a ground wire, which makes the assembly difficult.

[0004] In view of the above-mentioned problems, an object of the present invention is to provide a housing for an electric component having good assembling workability.

[0005] According to one embodiment of the present invention, there is provided an electrical component housing for housing an electrical component. The electrical component housing comprises: a resin base portion on which the electrical component is placed; a metal cover portion mounted on the base portion so as to cover the electrical component; and

[0006] The metal plate is in contact with the bottom surface of the base portion in a manner that covers the bottom surface of the base portion. In addition, the housing for the electrical component has a conductive component disposed in a through hole that penetrates the base portion in the thickness direction of the base portion, and the conductive component electrically connects the ground terminal of the electrical component and the metal plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a schematic cross-sectional view of the electric component case according to the first embodiment.

[0008] Figure 2 It is a schematic cross-sectional view of the electric component case according to the second embodiment.

[0009] Figure 3 It is a schematic cross-sectional view of an electric component case according to a third embodiment.

[0010] Figure 4 It is a bottom view of the electric component case according to the fourth embodiment.

[0011] Figure 5A It is along Figure 4 Cross-section diagram along line AA.

[0012] Figure 5B It is along Figure 4 Cross-sectional view of line BB.

[0013] Figure 6 It is a schematic cross-sectional view of the electric component case according to the fifth embodiment.

[0014] Figure 7 It is a bottom view of the electric component case according to the fifth embodiment.

[0015] Figure 8 This is a diagram for explaining the membrane vibration of the electric component case according to the comparative example.

[0016] Fig. 9 This is a diagram for explaining the membrane vibration of the electric component case according to the fifth embodiment. DETAILED DESCRIPTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like.

[0018] (First embodiment)

[0019] Reference Figure 1 An electric component housing 100 according to a first embodiment of the present invention will be described.

[0020] Figure 1 1 is a schematic cross-sectional view of the electric component case 100 according to the first embodiment, and is a cross-sectional view of the electric component case 100 as viewed from the side.

[0021] The housing 100 for electrical components is a housing for housing electrical components such as the inverter 1 and the smoothing capacitor 2. The housing 100 for electrical components includes: a resin base 3 on which the inverter 1 and the smoothing capacitor 2 are placed; a metal cover 4 mounted on the base 3 so as to cover the inverter 1 and the smoothing capacitor 2; and a metal plate 5 in contact with the bottom surface 34 of the base 3 so as to cover the bottom surface 34 of the base 3. In addition, the base 3 is formed with: a refrigerant flow path 31 passing below the position where the inverter 1 is placed; and a through hole 32 in which a conductive member 6 is provided.

[0022] The inverter 1 housed in the electrical component housing 100 includes a power module 11 having a built-in semiconductor element and a control substrate 12 having a control circuit, and has a function of converting electric power into direct current or alternating current. The inverter 1 is fixed to the base portion 3 of the electrical component housing 100 by bolts or the like. In addition, the inverter 1 has a ground terminal 13, and the ground terminal 13 is electrically connected to the conductive component 6 via a bus bar (conductor) 14.

[0023] The smoothing capacitor 2 accommodated in the electrical component case 100 is configured such that a capacitor element is accommodated in a capacitor case and is fixed to the base portion 3 by bolts (not shown) or the like.

[0024] The base 3 is formed of a plate-shaped member made of an electrically insulating resin material such as polyphenylene sulfide (PPS) or polyphthalamide (PPA), and the inverter 1 and the smoothing capacitor 2 are mounted on the mounting surface 33. By forming the base 3 of the resin material, the housing 100 for the electrical component is made lighter, less expensive, and more processable. A metal plate 5 made of iron or aluminum, etc., which is larger than the bottom surface 34, is in contact with the bottom surface 34 of the base 3. That is, the bottom surface 34 of the base 3 is covered by the metal plate 5.

[0025] The base portion 3 has: a first component (base body) 36 having an opening portion 35 for forming a refrigerant flow path 31; and a second component (resin plate) 37. The opening portion 35 of the first component 36 opens downward, and the second component 37 is welded (joined) to the first component 36 in a manner covering the opening portion 35. In this way, the space formed by the second component 37 sealing the opening portion 35 becomes the refrigerant flow path 31. Around the refrigerant flow path 31, a joint portion 38 between the first component 36 and the second component 37 is formed along the refrigerant flow path 31. In addition, in Figure 1 In the embodiment, the upper portion of the first component 36 is also open, and the upper opening portion is covered by the inverter 1, but the present invention is not limited thereto, and the upper portion of the first component 36 may be closed.

[0026] The refrigerant flow path 31 passes below the position of the base 3 where the inverter 1 is placed, and cooling water for cooling the inverter 1 flows in the refrigerant flow path 31. The vanes 15 are provided at the lower part of the inverter 1, and the vanes 15 are in contact with the cooling water flowing in the refrigerant flow path 31. Thus, the inverter 1 is efficiently cooled. In addition, the inverter 1 may be fixed to the base 3 via a substrate having a plurality of holes through which the vanes 15 pass. In addition, the inverter 1 is preferably provided with the vanes 15 and in contact with the cooling water, but is not limited thereto, and the vanes 15 may not be provided.

[0027] The base 3 has a through hole 32 that penetrates the base 3 in the thickness direction of the base 3. A conductive member 6 electrically connected to the ground terminal 13 of the inverter 1 is provided in the through hole 32. The arrangement of the conductive member 6 will be described in detail later.

[0028] The cover 4 is formed of a metal material such as aluminum, and is mounted on the base 3 so as to cover the periphery of the inverter 1 and the smoothing capacitor 2. The cover 4 has a step portion 41 having an end face that abuts against the mounting surface 33 of the base 3 formed on the inner side of the side wall, and the front end face 42 of the side wall abuts against the outer peripheral edge of the metal plate 5, and the metal plate 5 abuts against the bottom surface 34 of the base 3. The cover 4, the base 3, and the metal plate 5 are fastened together by fastening with bolts or the like from the outside of the metal plate 5 at the portion where the step portion 41 of the cover 4 abuts against the mounting surface 33 of the base 3. Thus, the inverter 1 and the smoothing capacitor 2 are completely covered by the metal cover 4 and the metal plate 5, so that the electromagnetic shielding property of the housing 100 for electrical components can be improved.

[0029] The electrical component case 100 configured as described above achieves weight reduction, cost reduction, and improved processability by making the base 3 of resin, and improves electromagnetic shielding properties by covering the periphery with the metal cover 4 and the metal plate 5 .

[0030] However, regarding the housing that accommodates electrical (electronic) components inside, in order to reduce the influence of electromagnetic noise from outside the housing and the influence of electromagnetic noise on the outside of the housing, it is necessary to ground (electrically connect) the ground terminal of the electrical component in the housing to the metal part of the housing. However, regarding the housing composed of a resin material on which the base portion of the electrical component is placed, when the ground terminal of the electrical component is grounded to the metal part using a ground wire or the like, it is necessary to assemble the housing with the ground wire connected to the inner wall of the metal part, which makes the assembly operation difficult. For example, in the present embodiment, it is difficult to assemble the housing 100 for electrical components in a state where the ground terminal 13 of the inverter 1 and the metal cover 4 are connected using a ground wire or the like. In addition, in order to enable the assembly operation, it is necessary to extend the wire harness length of the ground wire, but if the wire harness length of the ground wire becomes longer, the inductance of the ground wire increases, which may lead to a decrease in the performance related to reducing electromagnetic noise (EMC performance).

[0031] Therefore, in the present embodiment, a through hole 32 penetrating in the thickness direction of the base portion 3 is provided in the base portion 3 of the housing 100 for electrical components, and a conductive component 6 electrically connecting the ground terminal 13 of the inverter (electrical component) 1 and the metal plate 5 is provided in the through hole 32. The conductive component 6 is provided in the through hole 32 of the base portion 3, so that when the housing 100 for electrical components is assembled, the ground terminal 13 of the inverter (electrical component) 1 can be grounded only by fastening (butting) the metal plate 5 and the conductive component 6 in a state where the ground terminal 13 and the conductive component 6 are connected. Therefore, it is not necessary to assemble the housing 100 for electrical components in a state where the ground wire and the like are connected to the inner wall of the metal part (cover portion 4) of the housing 100 for electrical components, and the assembly workability is improved. In addition, it is not necessary to extend the wire harness length of the ground wire for assembly work, so it is possible to suppress the degradation of EMC performance.

[0032] Next, the arrangement of the conductive member 6 and the assembly method of the electrical component case 100 will be described in detail.

[0033] like Figure 1 As shown, a through hole 32 is formed on the base portion 3 of the housing 100 for electrical components, which penetrates the base portion 3 in the thickness direction of the base portion 3, and a conductive component 6 made of a metal such as aluminum is provided in the through hole 32. The conductive component 6 and the inner peripheral surface of the through hole 32 are sealed by a sealing component not shown. On the upper surface 61 of the conductive component 6, the bus bar 14 connected to the ground terminal 13 of the inverter 1 is fixed by bolts or the like. On the other hand, the bottom surface 62 of the conductive component 6 abuts against the upper surface of the metal plate 5 covering the bottom surface 34 of the base portion 3, and the metal plate 5 is fixed to the bottom surface 62 of the conductive component 6 from the metal plate 5 side by bolts or the like. As a result, the ground terminal 13 of the inverter 1 and the metal plate 5 are electrically connected via the conductive component 6.

[0034] Furthermore, it is preferable that the through hole 32 is formed at a position as close as possible to the inverter 1. Thus, the distance between the ground terminal 13 of the inverter 1 and the conductive member 6 can be shortened, and the length of the bus bar 14 can be shortened.

[0035] When assembling the housing 100 for electric components, first, the bus bar 14 connected to the ground terminal 13 of the inverter 1 is connected (fixed) to the conductive component 6 by bolts or the like. Next, the cover 4, the base 3, and the metal plate 5 are fastened, and the metal plate 5 and the conductive component 6 are fastened by bolts or the like from the side of the metal plate 5 in such a manner that the metal plate 5 abuts against the bottom surface 62 of the conductive component 6. In this way, the metal plate 5 is fastened to the conductive component 6 to ground the inverter 1, so it is not necessary to assemble the housing 100 for electric components in a state where the ground wire is connected to the inner wall of the cover 4 and the metal plate 5. Therefore, the assemblability of the housing 100 for electric components is improved.

[0036] According to the electrical component case 100 of the first embodiment described above, the following effects can be obtained.

[0037] The housing 100 for electric components includes: a base portion 3 made of resin on which an inverter 1 and a smoothing capacitor 2 (electrical components) are placed; and a metal cover portion 4 mounted on the base portion 3 in a manner covering the inverter 1 and the smoothing capacitor 2 (electrical components). In addition, the housing 100 for electric components includes: a metal plate 5 in contact with the bottom surface 34 of the base portion 3 in a manner covering the bottom surface 34 of the base portion 3; and a conductive member 6 provided in a through hole 32 penetrating the base portion 3 in the thickness direction of the base portion 3. The conductive member 6 electrically connects the ground terminal 13 of the inverter 1 (electrical component) to the metal plate 5. In this way, since the conductive member 6 electrically connected to the ground terminal 13 is provided on the base portion 3, when the housing 100 for electric components is assembled, the ground terminal 13 of the inverter 1 (electrical component) can be grounded simply by bringing the metal plate 5 and the conductive member 6 into contact. That is, it is not necessary to assemble the electrical component case 100 in a state where the ground wire and the like are connected to the inner wall of the cover portion 4 (metal portion) of the electrical component case 100 , and thus the assembling workability is improved.

[0038] Furthermore, when assembling the housing 100 for electrical components, the ground terminal 13 of the inverter 1 (electrical component) can be grounded simply by bringing the metal plate 5 and the conductive component 6 into contact, so there is no need to extend the length of the ground wire harness for assembly work. Therefore, it is possible to suppress degradation of EMC performance.

[0039] Regarding the housing 100 for electrical components, the base portion 3 has a refrigerant flow path 31 for circulating cooling water (refrigerant) for cooling the inverter 1 (electrical component), and the refrigerant flow path 31 passes below the position where the inverter 1 (electrical component) is placed. Thus, the inverter 1 (electrical component) is efficiently cooled.

[0040] Although it is preferable to provide the coolant flow path 31 for cooling the inverter 1 in the base portion 3 as in the present embodiment, the coolant flow path 31 is not an indispensable structure. That is, even if the coolant flow path 31 is not provided, the effect of improving the assembly workability can be obtained.

[0041] In the present embodiment, the coolant flow path 31 is configured to pass below the position where the inverter 1 is placed, but the coolant flow path 31 may also pass below the position where the smoothing capacitor 2 is placed.

[0042] In the present embodiment, the second member 37 is welded to the first member 36 so as to cover the opening 35 to form the refrigerant flow path 31, but the method of joining the second member 37 and the first member 36 is not limited to welding, and any known method may be used. For example, the joining may be performed by gasket sealing.

[0043] (Second embodiment)

[0044] Reference Figure 2 The electric component housing 100 according to the second embodiment will be described. Note that the same elements as those of the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0045] Figure 2 2 is a schematic cross-sectional view of an electrical component housing 100 according to a second embodiment. Figure 2 As shown in FIG. 1 , in the present embodiment, the shape of the refrigerant flow path 31 is different from that in the first embodiment.

[0046] like Figure 2 As shown, in this embodiment, the refrigerant flow path 31 is also formed in the base portion 3, but a protrusion 39 protruding from the inner peripheral surface of the opening portion 35 toward the center in the width direction of the refrigerant flow path 31 is formed in the refrigerant flow path 31 below the inverter 1. That is, the first component (base body) 36 of the base portion 3 has a portion extending below the position where the inverter 1 is placed so as to form the protrusion 39. In addition, a joint portion 38 is formed on the lower surface of the protrusion 39 so that the first component 36 and the second component (resin plate) 37 are welded (joined).

[0047] In addition, if Figure 2 As shown, the conductive component 6 provided in the through hole 32 of the base portion 3 is provided near the protrusion 39 and directly below the inverter 1, and the upper surface 61 is in contact with the bottom surface of the inverter 1. Above the position where the conductive component 6 and the inverter 1 are in contact, the bus bar 14 connected to the ground terminal 13 of the inverter 1 is in contact with the inverter 1, and at this position, the bus bar 14, the power module 11 of the inverter 1, and the conductive component 6 are fastened together from the bus bar 14 side by bolts or the like. On the other hand, the bottom surface 62 of the conductive component 6 is fastened to the metal plate 5 covering the bottom surface 34 of the base portion 3 by bolts or the like. Thus, the ground terminal 13 and the metal plate 5 are electrically connected via the conductive component 6.

[0048] Here, if the conductive member 6 (through hole 32) is provided at the position where the joint portion 38 is located, the sealing property of the refrigerant flow path 31 will be reduced, so it is necessary to provide the conductive member 6 avoiding the joint portion 38. Therefore, when the refrigerant flow path 31 does not have the protruding portion 39, the conductive member 6 must be provided at a position separated from the refrigerant flow path 31 avoiding the joint portion 38 around the refrigerant flow path 31. In contrast, in the present embodiment, the protruding portion 39 protruding from the inner peripheral surface of the opening portion 35 toward the center in the width direction of the refrigerant flow path 31 is formed in the refrigerant flow path 31 below the inverter 1, and the joint portion 38 is formed on the lower surface of the protruding portion 39. In this way, the joint portion 38 is formed on the lower surface of the protruding portion 39, so that the conductive member 6 can be provided near the protruding portion 39, that is, near the refrigerant flow path 31 below the inverter 1. Therefore, the distance between the inverter 1 and the conductive member 6 can be shortened. As a result, the bus bar 14 connecting the ground terminal 13 of the inverter 1 and the conductive member 6 can be shortened, so that the inductance of the bus bar 14 is reduced and the EMC performance is improved.

[0049] In addition, the conductive member 6 can be disposed near the refrigerant flow path 31 below the inverter 1, so that Figure 2 As shown, the conductive component 6 can also be arranged directly below the inverter 1. As described above, in this embodiment, the conductive component 6 is arranged directly below the inverter 1, and the ground terminal 13 (the bus bar 14 connected thereto), the power module 11 of the inverter 1, and the conductive component 6 are integrally fastened by bolts or the like. That is, a fixing component (bolts, etc.) for fixing the inverter 1 to the base 3 and a fixing component (bolts, etc.) for fixing the bus bar 14 (conductor) connected to the ground terminal 13 to the conductive component 6 are not separately provided. Therefore, the number of components can be reduced, and the grounding of the inverter 1 (electrical component) can be realized compactly and inexpensively.

[0050] According to the electrical component case 100 according to the second embodiment described above, the following effects can be obtained.

[0051] The housing 100 for electrical components has a protrusion 39 protruding from the inner peripheral surface of the opening 35 toward the center in the width direction of the refrigerant flow path 31 at the lower part of the inverter 1 (electrical component), and a joint portion 38 is formed on the lower surface of the protrusion 39. In addition, the conductive component 6 is provided near the protrusion 39. In this way, the joint portion 38 is formed on the lower surface of the protrusion 39, and the conductive component 6 is provided near the protrusion 39, that is, near the refrigerant flow path 31 at the lower part of the inverter 1. As a result, the bus bar (conductor) 14 connecting the inverter 1 and the conductive component 6 can be shortened, the inductance of the bus bar (conductor) 14 is reduced, and the EMC performance is improved.

[0052] Regarding the housing 100 for electrical components, the conductive component 6 is integrally fastened to the inverter 1 (electrical component) and the bus bar 14 (conductor) connected to the ground terminal 13 of the inverter 1 (electrical component) just below the inverter 1 (electrical component). That is, a fixing component (bolt, etc.) for fixing the inverter 1 (electrical component) to the base 3 and a fixing component (bolt, etc.) for fixing the bus bar 14 (conductor) connected to the ground terminal 13 to the conductive component 6 are not separately provided. Therefore, the number of components can be reduced, and the grounding of the inverter 1 (electrical component) can be realized compactly and inexpensively.

[0053] In addition, it is preferred that the conductive component 6 is disposed directly below the inverter 1 as in the present embodiment, but the location of the conductive component 6 is not limited thereto, and the conductive component 6 may be disposed at any location as long as it is near the protrusion 39. If the conductive component 6 is disposed near the protrusion 39, the distance between the inverter 1 and the conductive component 6 can be shortened, and the ECM performance is improved.

[0054] (Third embodiment)

[0055] Reference Figure 3 The electrical component housing 100 according to the third embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals and their description will be omitted.

[0056] Figure 3 FIG. 1 is a schematic cross-sectional view of a housing 100 for an electrical component according to a third embodiment. Figure 3 As shown, in this embodiment, the shape of the conductive member 6 is different from that of other embodiments.

[0057] like Figure 3 As shown, in this embodiment, the refrigerant flow path 31 is also formed in the base portion 3. In addition, around the refrigerant flow path 31, a joint portion 38 between the first member 36 and the second member 37 is formed along the refrigerant flow path 31.

[0058] Here, as described above, if the conductive component 6 is set at the position where the joint 38 is located, the sealing of the refrigerant flow path 31 will decrease, so it is necessary to avoid the joint 38 and set the conductive component 6. On the other hand, if the conductive component 6 is set at a position separated from the refrigerant flow path 31 below the inverter 1 in order to avoid the joint 38, the distance of the bus bar 14 connecting the inverter 1 and the conductive component 6 becomes longer, and the EMC performance may decrease. Therefore, in this embodiment, the conductive component 6 is bent and set in a crank shape in a manner avoiding the joint 38. As a result, the conductive component 6 can be set near the refrigerant flow path 31 below the inverter 1, and the distance between the inverter 1 and the conductive component 6 can be shortened. Therefore, the bus bar 14 connecting the inverter 1 and the conductive component 6 can be shortened, the inductance of the bus bar 14 is reduced, and the EMC performance is improved.

[0059] Next, the shape of the conductive member 6 of the electrical component case 100 according to the present embodiment will be described in detail.

[0060] like Figure 3 As shown, the conductive component 6 is provided near the refrigerant flow path 31 below the inverter 1. The upper surface 61 of the conductive component 6 is located directly below the inverter 1 and abuts against the bottom surface of the inverter 1. Above the position where the conductive component 6 abuts against the inverter 1, the bus bar 14 connected to the ground terminal 13 of the inverter 1 contacts the inverter 1, and at this position, the bus bar 14, the power module 11 of the inverter 1, and the conductive component 6 are fastened together from the bus bar 14 side by bolts 63 or the like. The through hole 32 of the base portion 3 and the conductive component 6 in the through hole 32 are bent in the direction of separation from the refrigerant flow path 31 at the upper part, and are bent downward at a position further outward than the position where the joint 38 is located. That is, the conductive component 6 is bent and provided in a crank shape in the vicinity of the refrigerant flow path 31 below the inverter 1 in a manner avoiding the joint 38. The bottom surface 62 of the conductive member 6 abuts against the upper surface of the metal plate 5 and is fixed to the metal plate 5 by bolts 64 or the like. The bolts 63 and 64 overlap in the height (vertical) direction of the electrical component case 100 .

[0061] In this way, the conductive component 6 is formed into a shape avoiding the joint portion 38 and is arranged near the refrigerant flow path 31 below the inverter 1, so that the distance between the inverter 1 and the conductive component 6 can be shortened. In addition, the conductive component 6 is bent into a crank shape, so that the bolts 63 that fix the bus bar 14 and the upper surface 61 of the conductive component 6 and the bolts 64 that fix the bottom surface 62 of the conductive component 6 and the metal plate 5 can be arranged to overlap in the height (up and down) direction of the electrical component housing 100. As a result, the height of the conductive component 6 and the base portion 3 can be reduced, and space saving and cost reduction can be further achieved. In addition, the conductive component 6 is arranged directly below the inverter 1, and the ground terminal 13 (the bus bar 14 connected thereto), the inverter 1 and the conductive component 6 are integrally fastened. Therefore, it is not necessary to separately provide a fixing member (bolt, etc.) for fixing the inverter 1 (electrical component) to the base portion 3 and a fixing member (bolt, etc.) for fixing the bus bar 14 (conductor) connected to the ground terminal 13 to the conductive member 6, thereby reducing the number of components. Therefore, the grounding of the inverter 1 (electrical component) can be achieved in a more compact and inexpensive manner.

[0062] According to the electrical component case 100 according to the third embodiment described above, the following effects can be obtained.

[0063] Regarding the housing 100 for electrical components, the conductive component 6 is bent and arranged in a crank shape in the vicinity of the refrigerant flow path 31 below the inverter 1 (electrical component) in a manner avoiding the joint portion 38. In this way, the conductive component 6 is formed in a shape avoiding the joint portion 38 and is arranged in the vicinity of the refrigerant flow path 31 below the inverter 1, so that the distance between the inverter 1 (electrical component) and the conductive component 6 can be shortened. Therefore, the bus bar 14 (conductor) connecting the inverter 1 (electrical component) and the conductive component 6 can be shortened, the inductance is reduced, and the EMC performance is improved.

[0064] In addition, the conductive component 6 is bent into a crank shape, so that the bolts 63 (fixing components) that fix the bus bar 14 and the upper surface 61 of the conductive component 6 and the bolts 64 (fixing components) that fix the bottom surface 62 of the conductive component 6 and the metal plate 5 can be arranged to overlap in the height (up and down) direction of the electrical component housing 100. As a result, the height of the conductive component 6 and the base portion 3 can be reduced, further achieving space saving and cost reduction.

[0065] Regarding the housing 100 for electrical components, the conductive component 6 is integrally fastened to the inverter 1 (electrical component) and the bus bar 14 (conductor) connected to the ground terminal 13 of the inverter 1 (electrical component) just below the inverter 1 (electrical component). That is, a fixing component (bolt, etc.) for fixing the inverter 1 (electrical component) to the base 3 and a fixing component (bolt, etc.) for fixing the bus bar 14 (conductor) connected to the ground terminal 13 to the conductive component 6 are not separately provided. Therefore, the number of components can be reduced, and the grounding of the inverter 1 (electrical component) can be realized more compactly and inexpensively.

[0066] In addition, it is preferable to place the conductive member 6 directly below the inverter 1 as in the present embodiment, but the location of the conductive member 6 is not limited thereto, and the conductive member 6 may be placed at any location as long as it is near the refrigerant flow path 31 below the inverter 1. If the conductive member 6 is placed near the refrigerant flow path 31 below the inverter 1, the distance between the inverter 1 and the conductive member 6 can be shortened, and the ECM performance is improved.

[0067] (Fourth embodiment)

[0068] Reference Figure 4 5 , an electric component housing 100 according to a fourth embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0069] Figure 4 is a bottom view of an electrical component housing 100 according to a fourth embodiment. Figure 5A It is along Figure 4 The cross-section diagram of line AA, Figure 5B It is along Figure 4 The present embodiment is different from other embodiments in that a reinforcing member 7 is provided in the refrigerant flow path 31 .

[0070] like Figure 4 As shown, the refrigerant flow path 31 has: a flow path inlet 311, which allows cooling water to flow into the housing 100 for the electrical component; and a flow path outlet 312, which allows the cooling water after cooling the inverter 1 to flow out to the outside of the housing 100 for the electrical component. In addition, the refrigerant flow path 31 has a rectangular portion 313 between the flow path inlet 311 and the flow path outlet 312, and the flow path width of the rectangular portion 313 is larger than that of other parts and is formed in an approximately rectangular shape when viewed from above (from above). Above the rectangular portion 313, the inverter 1 is mounted on the base portion 3. A joint portion 38 is formed around the refrigerant flow path 31 along the refrigerant flow path 31.

[0071] The corners of the four corners of the rectangular portion 313 that are closest to the center of the housing 100 for the electrical components enter toward the inside of the refrigerant flow path 31. A conductive component 6 is provided in the portion that enters. As a result, the conductive component 6 can be arranged directly below the inverter 1 above the rectangular portion 313, and the distance between the conductive component 6 and the inverter 1 can be shortened. Therefore, the distance between the bus bar 14 that connects the inverter 1 and the conductive component 6 can be shortened, the inductance of the bus bar 14 is reduced, and the EMC performance is improved. In addition, the conductive component 6 is arranged on the inside of the inverter 1 (directly below the inverter 1) when viewed from above, so that space saving is further achieved.

[0072] In addition, in the rectangular portion 313, a reinforcement member 7 for ensuring the rigidity of the base portion 3 is provided across the refrigerant flow path 31 on a diagonal connecting a corner closest to the center of the housing 100 for electrical components and a corner opposite thereto. On the other hand, a rectangular portion inlet 314 for allowing cooling water to flow into the rectangular portion 313 and a rectangular portion outlet 315 for allowing cooling water to flow out of the rectangular portion 313 are formed at two corners on a diagonal orthogonal to the diagonal on which the reinforcement member 7 is provided. Figure 4 As shown, the flow path width of the refrigerant flow path 31 is formed smaller in the rectangular portion inlet 314 and the rectangular portion outlet 315 than in the rectangular portion 313 .

[0073] like Figure 5A and Figure 5B As shown, the blades 15 of the inverter 1 are in contact with the cooling water in the rectangular portion 313. The reinforcement 7 in the rectangular portion 313 constitutes a part of the first component (base body) 36, and is erected upward from the bottom surface of the refrigerant flow path 31 (that is, the upper surface of the second component (resin plate)). Preferably, the bottom surface of the reinforcement 7 abuts against the upper surface of the second component (resin plate) 37, and the reinforcement 7 and the second component are joined by welding or the like at the joint 38 where the bottom surface of the reinforcement 7 and the second component 37 abut. In this way, the reinforcement 7 is joined to the second component 37 to further enhance the rigidity of the base portion 3. In addition, the reinforcement 7 is configured to be lower than the refrigerant flow path 31. As a result, the cooling water in the refrigerant flow path 31 flows through the front end 71 of the reinforcement 7. That is, as Figure 5A As shown by the arrows, the cooling water in the refrigerant flow path 31 first flows from the rectangular portion inlet 314 toward the front end 71 of the reinforcement 7 (above the refrigerant flow path 31), and then flows from the front end 71 of the reinforcement 7 toward the rectangular portion outlet 315. As a result, the cooling water in the refrigerant flow path 31 (rectangular portion 313) can be prevented from deflecting downward, and the cooling water flows throughout the blades 15 of the inverter 1 without omission. Therefore, the cooling efficiency of the inverter 1 is improved.

[0074] Furthermore, the rectangular portion inlet 314 and the rectangular portion outlet 315 are formed so that the flow path width of the refrigerant flow path 31 is smaller than that in the rectangular portion 313 . Therefore, the flow velocity of the cooling water in the rectangular portion 313 is increased, and the cooling efficiency of the inverter 1 is further improved.

[0075] Furthermore, in the present embodiment, the reinforcement member 7 is configured as a part of the first member (base body) 36 , but the present invention is not limited thereto. For example, the reinforcement member 7 may be provided as a different member from the first member 36 .

[0076] According to the electrical component case 100 according to the fourth embodiment described above, the following effects can be obtained.

[0077] Regarding the housing 100 for electrical components, the inverter 1 (electrical component) has blades 15 that are in contact with the cooling water in the refrigerant flow path 31. In addition, in the refrigerant flow path 31 below the inverter 1 (electrical component), a reinforcement member 7 that crosses the refrigerant flow path 31 is erected from the second member (resin plate) 37, and the reinforcement member 7 is configured to be lower than the refrigerant flow path 31 in such a manner that the cooling water passes through the front end 71 of the reinforcement member 7. As a result, the cooling water in the refrigerant flow path 31 can be suppressed from deflecting downward, and the cooling water flows through the blades 15 of the inverter 1 without omission. Therefore, the cooling efficiency of the inverter 1 is improved.

[0078] In addition, as in the present embodiment, it is preferred to provide a rectangular portion 313 having a larger flow path width than other portions in the refrigerant flow path 31 to increase the flow velocity in the rectangular portion 313, but it is also possible not to provide the rectangular portion 313. If a reinforcing member 7 is provided in the refrigerant flow path 31 below the inverter 1 to cross the refrigerant flow path 31, the biased flow of the cooling water is suppressed, and the cooling efficiency of the inverter 1 is improved.

[0079] (Fifth embodiment)

[0080] Reference Figure 6 to Figure 9 The electric component housing 100 according to the fifth embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals and their description will be omitted.

[0081] Figure 6 FIG. 1 is a schematic cross-sectional view of an electrical component housing 100 according to a fifth embodiment. Figure 7 It is a bottom view of the electric component case 100. In the present embodiment, the conductive member 6 is provided near the center of the electric component case 100.

[0082] like Figure 6As shown, in this embodiment, as in other embodiments, the ground terminal 13 of the inverter 1 and the metal plate 5 are electrically connected via the conductive component 6 in the through hole 32 of the base portion 3. The bottom surface 62 of the conductive component 6 abuts against the upper surface of the metal plate 5, and the metal plate 5 is fixed to the bottom surface 62 of the conductive component 6 by bolts 64 or the like.

[0083] In addition, the conductive component 6 is disposed near the center of the electrical component housing 100. Figure 7 As shown, near the center of the electrical component housing 100, the conductive component 6 and the metal plate 5 are fastened from the metal plate 5 side by bolts 64 or the like. In addition, the peripheral edge of the metal plate 5 is fastened to the base portion 3 and the cover portion 4 ( Figure 6 , Figure 7 ).

[0084] Here, in the housing for electrical components, the metal plate covering the bottom surface of the base portion is generally low in rigidity, so if only the peripheral edge of the metal plate is fixed to the base portion, the central portion of the metal plate will generate membrane vibration. Figure 8 In the electrical component housing 100' shown, the metal plate 5' is fixed to the base 3' and the cover 4' only at the periphery of the metal plate 5', so that the central part of the metal plate 5' generates membrane vibration. As a result, resonance occurs at low frequencies, and the acoustic vibration performance of the electrical component housing 100' deteriorates.

[0085] In contrast, in this embodiment, the metal plate 5 covering the bottom surface 34 of the base 3 is fixed to the base 3 and the cover 4 at the peripheral portion by bolts or the like, and is fixed to the conductive member 6 by bolts 64 or the like near the center of the electrical component housing 100. Fig. 9 As shown, even if the metal plate 5 vibrates, resonance can be suppressed, and deterioration of acoustic vibration performance can be suppressed.

[0086] Furthermore, even when the conductive component 6 is provided at a position other than near the center of the electrical component housing 100, the deterioration of the acoustic vibration performance can be suppressed to some extent if the metal plate 5 is fixed to the conductive component 6 by bolts, etc. However, by arranging the conductive component 6 near the center of the electrical component housing 100 and fixing the metal plate 5 to the conductive component 6, the deterioration of the acoustic vibration performance can be suppressed more effectively.

[0087] According to the electrical component case 100 according to the fifth embodiment described above, the following effects can be obtained.

[0088] Regarding the electrical component housing 100, the conductive component 6 is provided near the center of the electrical component housing 100, and the metal plate 5 covering the bottom surface 34 of the base portion 3 is fixed to the conductive component 6. Thus, the metal plate 5 is fixed to the conductive component 6 near the center of the electrical component housing 100, so that even if the metal plate 5 vibrates, resonance can be suppressed, and deterioration of acoustic vibration performance is suppressed.

[0089] In any embodiment, the inverter 1 and the smoothing capacitor 2 are housed in the electrical component housing 100, but the electrical components housed in the electrical component housing 100 are not limited thereto. In addition, the number of electrical components housed in the electrical component housing 100 is also arbitrary, for example, one electrical component may be housed, or a plurality of electrical components may be housed.

[0090] In any embodiment, the ground terminal 13 of the inverter 1 and the conductive member 6 are electrically connected by the bus bar 14, but the present invention is not limited thereto. For example, a wire harness or the like may be used as a conductor connecting the ground terminal 13 and the conductive member 6.

[0091] In addition, in any embodiment, the refrigerant flowing in the refrigerant flow path 31 is cooling water, but the refrigerant is not limited to this, and may be, for example, refrigerant gas.

[0092] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate a part of application examples of the present invention, and the technical scope of the present invention is not limited to the specific structures of the above embodiments.

[0093] Although the above-mentioned respective embodiments have been described as separate embodiments, they may be appropriately combined.

Claims

1. A housing for an electrical component, which accommodates the electrical component, wherein: The housing for the electrical component has: a base portion made of resin on which the electrical components are placed; a metal cover portion mounted on the base portion so as to cover the electrical component; a metal plate abutting against the bottom surface of the base portion so as to cover the bottom surface of the base portion; and a conductive member provided in a through hole penetrating the base portion in a thickness direction of the base portion, The conductive component electrically connects the ground terminal of the electrical component and the metal plate. The base portion has a refrigerant flow path through which a refrigerant for cooling the electrical components flows. The refrigerant flow path passes below a position where the electrical components are placed. The conductive component is integrally fastened to the electrical component and the conductor connected to the ground terminal of the electrical component directly below the electrical component, and The conductive component is disposed near the center of the housing for the electrical component. The metal plate is fixed to the conductive member.

2. The housing for an electrical component according to claim 1, wherein: The base portion is composed of a base body having an opening portion opening downward, and a resin plate joined to the base body in a manner covering the opening portion. The refrigerant flow path is formed by sealing the opening with the resin plate, A joining portion between the base body and the resin plate is formed along the refrigerant flow path.

3. The housing for an electrical component according to claim 2, wherein: A protrusion is formed on the refrigerant flow path below the electrical component, the protrusion protruding from the inner peripheral surface of the opening toward the center in the width direction of the refrigerant flow path. The engaging portion is formed on the lower surface of the protruding portion, The conductive component is disposed near the protruding portion.

4. The housing for an electrical component according to claim 2, wherein: The conductive member is bent in a crank shape in the vicinity of the refrigerant flow path below the electrical component so as to avoid the joining portion.

5. The housing for an electrical component according to any one of claims 2 to 4, wherein: The electrical component has a blade that contacts the refrigerant in the refrigerant flow path. In the refrigerant flow path below the electrical component, a reinforcing member that crosses the refrigerant flow path is erected upward from the bottom surface of the refrigerant flow path. The reinforcement is configured to be lower than the refrigerant flow path so that the refrigerant passes through the front end of the reinforcement.

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