A display panel and display device

Abstract

This invention relates to a display panel and a display device. The invention involves providing a through-hole in an inorganic layer of at least one sub-stacking structure within at least one protrusion in the transition region between the opening area and the display area, at a position corresponding to the metal layer in the sub-stacking structure. An organic layer is disposed within the through-hole. This organic layer serves as a stress buffer, reducing the risk of film peeling during laser cutting of the light-transmitting hole in the opening area. It also reduces the risk of localized film peeling occurring during cutting further expanding in subsequent processes.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and display device. Background Technology

[0002] With the development of electronic products, full-screen technology has received widespread attention and research. Current display devices generally require a front-facing camera, necessitating an opening in the display panel to allow light to enter the camera through the opening. This opening is known in the industry as the AA (Active Area) Hole. To prevent water and oxygen from intruding into the AA area of ​​the display panel from the AA Hole, a water and oxygen barrier structure is needed in the transition area between the AA Hole and the display area. One implementation involves creating multiple grooves on the substrate of the transition area; another implementation involves creating multiple hills (protrusions) on the substrate of the transition area. Experiments show that using inorganic materials for water and oxygen blocking is most effective, while using organic materials is generally less effective.

[0003] In current common manufacturing processes, the AA Hole is typically formed through laser cutting. This involves using a high-powered laser to perform rapid, circular cuts, generating high localized temperatures to complete the entire AA Hole cut. However, in actual product manufacturing, it has been observed that peeling occurs in the film layer near the AA Hole during laser cutting. When localized film peeling occurs during the cutting process, subsequent panel processing steps, such as film removal or glass lamination, may further exacerbate or expand the area of ​​film peeling. Therefore, the risk of peeling during the AA Hole cutting process should be strictly prevented.

[0004] To address the aforementioned film peeling issue, it's generally resolved by altering the film distribution at the AA Hole, or by positioning the AA Hole's cutting path closer to the first "Hill," ensuring that even if peeling occurs, it stops at the first "Hill" as quickly as possible. The former approach is affected by the film layer in the main display area of ​​the panel, making it generally more difficult to implement. The latter approach is merely a stopgap measure, as the initial peeling it generates can limit subsequent processes; that is, excessive force during later processes can further expand the peeling area. Summary of the Invention

[0005] The purpose of this invention is to provide a display panel and display device that can solve the problems in the prior art, such as the easy occurrence of film peeling during the cutting process of AAHole and the continued expansion of the peeling range in subsequent processes.

[0006] To address the aforementioned problems, the present invention provides a display panel comprising an opening area, a transition area surrounding the opening area, and a display area surrounding the transition area; the display panel located in the transition area has a plurality of protrusions disposed on a substrate, each of the protrusions comprising at least one sub-stacking structure; each sub-stacking structure comprising: a metal layer disposed on the substrate; and an inorganic layer disposed on the side of the metal layer away from the substrate and extending to cover the substrate; wherein, at least one of the protrusions comprises an inorganic layer in at least one of the sub-stacking structures comprising a through-hole at a position corresponding to the metal layer in the sub-stacking structure, and an organic layer is disposed within the through-hole.

[0007] Furthermore, the inorganic layer in at least one of the sub-stacking structures closest to the opening area has the through hole at a position corresponding to the metal layer in the sub-stacking structure.

[0008] Furthermore, the inorganic layer in the sub-stacking closest to the substrate has the through-hole at a position corresponding to the metal layer in that sub-stacking.

[0009] Furthermore, the inorganic layer in the sub-stacking structure furthest from the substrate has the through-hole at a position corresponding to the metal layer in that sub-stacking structure.

[0010] Furthermore, the total number of inorganic layers with through holes in any of the protruding structures is greater than or equal to the total number of inorganic layers with through holes in the protruding structures on the side adjacent to and far from the opening area.

[0011] Furthermore, the metal layer includes a flat portion and a transition portion connecting both sides of the flat portion; the projection of the through hole on the substrate falls within the projection of the flat portion on the substrate.

[0012] Furthermore, the distance between the outer edge of the projection of the through hole onto the substrate and the outer edge of the projection of the metal layer onto the substrate is greater than or equal to the thickness of the inorganic layer in which the through hole is located.

[0013] Furthermore, the width of the through hole on the side away from the substrate is greater than the width on the side closer to the substrate.

[0014] Furthermore, the organic layers are embedded one-to-one within the through holes, and the surface of the organic layer away from the substrate is flush with the surface of the corresponding through hole away from the substrate.

[0015] To address the aforementioned problems, the present invention provides a display device comprising the display panel described herein.

[0016] The advantages of this invention are: In this invention, at least one inorganic layer in at least one sub-staple of at least one protrusion structure in the transition area between the opening area and the display area has a through hole at the position corresponding to the metal layer in the sub-staple, and an organic layer is provided in the through hole. The organic layer is used to buffer stress, thereby reducing the risk of film peeling during the laser cutting of the light-transmitting hole in the opening area. It can also reduce the risk that the local film peeling that occurs during the cutting process will further expand the film peeling range in subsequent processes. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a plan view of the display panel of this application;

[0019] Figure 2 This is a cross-sectional schematic diagram of the transition region in Embodiment 1 of this application;

[0020] Figure 3 This is a schematic diagram of a sub-stack structure with through holes according to this application;

[0021] Figure 4 This is a cross-sectional schematic diagram of the transition region in Embodiment 2 of this application;

[0022] Figure 5 This is a cross-sectional schematic diagram of the transition region in Embodiment 3 of this application;

[0023] Figure 6 It is an equivalent stress contour plot of the existing protruding structure;

[0024] Figure 7 This is the equivalent stress cloud diagram of the protruding structure in Example 3;

[0025] Figure 8 It is a normal stress cloud diagram of the interface between the array substrate and the light-emitting layer of an existing display panel;

[0026] Figure 9This is a normal stress cloud diagram of the interface between the array substrate and the light-emitting layer of the display panel in Embodiment 3.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100. Display panel; 101. Opening area;

[0029] 102. Transition area; 103. Display area;

[0030] 1. Base; 2. Protruding structure;

[0031] 21. Sub-structure;

[0032] 211. Metallic layer; 212. Inorganic layer;

[0033] 213. Through-hole; 214. Organic layer;

[0034] 2111, Flat section; 2112, Transition section. Detailed Implementation

[0035] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings to fully introduce the technical content of the present invention to those skilled in the art, and to demonstrate that the present invention can be implemented, making the disclosed technical content of the present invention clearer and enabling those skilled in the art to more easily understand how to implement the present invention. However, the present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein. The following description of the embodiments is not intended to limit the scope of the present invention.

[0036] The directional terms used in this invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", and "side", are only for the directions shown in the accompanying drawings. The directional terms used herein are for the purpose of explaining and illustrating this invention, and not for limiting the scope of protection of this invention.

[0037] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. Furthermore, for ease of understanding and description, the dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component.

[0038] Example 1

[0039] This application provides a display device. The display device includes a display panel 100. The display device includes devices such as mobile phones, computers, MP3 players, MP4 players, tablet computers, televisions, or digital cameras.

[0040] like Figure 1As shown, the display panel 100 includes: an opening area 101, a transition area 102, and a display area 103.

[0041] The aperture area 101 has a light-transmitting hole that penetrates at least a portion of the film layer within the aperture area 101. This allows an optical sensor to be positioned within the aperture area 101, and light enters the optical sensor through the light-transmitting hole. The optical sensor can be a camera.

[0042] The transition zone 102 surrounds the opening zone 101. The transition zone 102 is mainly used to prevent water and oxygen from entering the display area 103 of the display panel 100 through the opening zone 101.

[0043] The display area 103 surrounds the transition area 102. The display area 103 includes film layer structures such as a thin-film transistor layer, a light-emitting layer, and a packaging layer, which will not be described in detail here. In this embodiment, the thin-film transistor layer is a low-temperature polycrystalline oxide (LTPO) structure.

[0044] like Figure 2 As shown, the display panel 100 located in the transition area 102 has a plurality of protruding structures 2 disposed on the substrate 1. In this embodiment, the left side of the transition area 102 is the opening area 101, and the right side of the transition area 102 is the display area 103.

[0045] like Figure 2 As shown, each of the protrusion structures 2 has at least one sub-staple 21. Each of the sub-staples 21 includes a metal layer 211 and an inorganic layer 212.

[0046] The metal layer 211 is disposed on the substrate 1. The material of the metal layer 211 may be Mo or a combination of Mo and Al, a combination of Mo and Cu, a combination of Mo, Cu and IZO, a combination of IZO, Cu and IZO, a combination of Mo, Cu and ITO, a combination of Ni, Cu and Ni, a combination of MoTiNi, Cu and MoTiNi, a combination of NiCr, Cu and NiCr, or CuNb, etc.

[0047] The inorganic layer 212 is disposed on the side of the metal layer 211 away from the substrate 1 and extends to cover the substrate 1. The inorganic layer 212 may be made of SiOx, SiNx, SiNOx, or a combination of SiNx and SiOx, etc.

[0048] In at least one of the sub-stacking structures 21 of the protruding structure 2, the inorganic layer 212 has a through-hole 213 at a position corresponding to the metal layer 211 in the sub-stacking structure 21, and an organic layer 214 is provided within the through-hole 213. The organic layer 214 is used for stress buffering to reduce the risk of film peeling during the laser cutting of the light-transmitting hole in the opening area 101, and also to reduce the risk that local film peeling that occurs during the cutting process will further expand the film peeling range in subsequent processes.

[0049] In this configuration, the total number of inorganic layers 212 with through holes 213 in any one of the protruding structures 2 is greater than or equal to the total number of inorganic layers 212 with through holes 213 in the protruding structures 2 adjacent to it and farthest from the opening area 101. In other words, the total number of inorganic layers 212 with through holes 213 in the protruding structure 2 closest to the opening area 101 is not less than the total number of inorganic layers 212 with through holes 213 in any other protruding structure 2. By providing through holes 213 in the protruding structure 2 closest to the opening area 101 and then setting an organic layer 214 within the through holes 213, the risk of film peeling during laser cutting of the light-transmitting holes in the opening area 101 is reduced, and the risk of localized film peeling occurring during cutting further expanding the peeling range in subsequent processes is also reduced.

[0050] like Figure 2 As shown, the width of the via 213 on the side away from the substrate 1 is greater than the width on the side closer to the substrate 1. Currently, vias 213 are generally formed on the inorganic layer 212 using a mask exposure and development process. Because the surface of the inorganic layer 212 away from the substrate 1 is exposed first, the resulting via 213 has a shape similar to an inverted trapezoid, wider at the top and narrower at the bottom. It is worth noting that when the inorganic layer 212 in a sub-staple 21 is formed by multiple layers, the via 213 penetrates the entire inorganic layer 212 from top to bottom.

[0051] The organic layers 214 are embedded in the through holes 213 one by one, and the surface of the organic layer 214 away from the substrate 1 is flush with the surface of the corresponding through hole 213 away from the substrate 1. In other words, the organic layer 214 does not protrude from the upper surface of the through hole 213.

[0052] like Figure 3As shown, the metal layer 211 includes a flat portion 2111 and a transition portion 2112 connecting both sides of the flat portion 2111. The projection of the through hole 213 on the substrate 1 falls within the projection of the flat portion 2111 on the substrate 1. In other words, by placing the through hole 213 (i.e., the break point of the inorganic layer 212) on the flat portion 2111 of the metal layer 211, stress concentration is avoided by placing the through hole 213 (i.e., the break point of the inorganic layer 212) on the transition portion 2112 of the metal layer 211, thereby preventing the formation of "voids" or microcracks.

[0053] like Figure 3 As shown, the distance L between the outer edge of the projection of the through hole 213 onto the substrate 1 and the outer edge of the projection of the metal layer 211 onto the substrate 1 is greater than or equal to the thickness H of the inorganic layer 212 where the through hole 213 is located. This avoids stress concentration caused by placing the through hole 213 (i.e., the break point of the inorganic layer 212) at the transition portion 2112 of the metal layer 211, thereby preventing the formation of "voids" or microcracks.

[0054] The display panel 100 located in the transition zone 102 also has a retaining wall 3 located between the protruding structures 2.

[0055] In this embodiment, each of the protruding structures 2 includes two sub-staples 21. In each of the two sub-staples 21 of the protruding structure 2 located between the retaining wall 3 and the opening area 101, the inorganic layer 212 is provided with a through-hole 213, and an organic layer 214 is disposed within the through-hole 213. The organic layer 214 is used for stress buffering to reduce the risk of film peeling during laser cutting of the light-transmitting holes in the opening area 101, and also to reduce the risk that localized film peeling occurring during cutting may further expand in subsequent processes.

[0056] Example 2

[0057] like Figure 4 As shown, this embodiment includes most of the technical features of embodiment 1. The difference between this embodiment and embodiment 1 is that in this embodiment, at least one of the inorganic layers 212 in the sub-staple 21 of the protrusion structure 2 closest to the opening area 101 has the through hole 213 at the position corresponding to the metal layer 211 in the sub-staple 21.

[0058] Specifically, in the sub-staple 21 of the protrusion 2 closest to the opening area 101 and furthest from the substrate 1, the inorganic layer 212 has the through-hole 213 at a position corresponding to the metal layer 211 in that sub-staple 21. This embodiment utilizes the organic layer 214 for stress buffering to reduce the risk of film peeling during laser cutting of the light-transmitting hole in the opening area 101. It also reduces the risk of localized film peeling during cutting further expanding in subsequent processes. Compared to Embodiment 1, this reduces the number of through-holes 213, the number of photomasks, and production costs.

[0059] Example 3

[0060] like Figure 5 As shown, this embodiment includes most of the technical features of embodiment 1. The difference between this embodiment and embodiment 1 is that in this embodiment, at least one of the inorganic layers 212 in the sub-staple 21 of the protrusion structure 2 closest to the opening area 101 has the through hole 213 at the position corresponding to the metal layer 211 in the sub-staple 21.

[0061] Specifically, in the sub-staple 21 of the protrusion 2 closest to the aperture region 101, the inorganic layer 212 is provided with the through-hole 213 at a position corresponding to the metal layer 211 in the sub-staple 21. This embodiment utilizes the organic layer 214 for stress buffering to reduce the risk of film peeling during laser cutting of the light-transmitting holes in the aperture region 101. It also reduces the risk of localized film peeling during cutting further expanding in subsequent processes. Compared to Embodiment 1, this reduces the number of through-holes 213, the number of photomasks, and production costs.

[0062] like Figure 6 and Figure 7 As shown, the maximum equivalent stress (Mises) of the protrusion structure 2 in this embodiment is 3.860e+01, while the maximum equivalent stress of the existing protrusion structure (i.e., without through holes in the inorganic layer and without an organic layer in the through holes) is 4.566e+01. The equivalent stress of this application is reduced by about 15% compared with the equivalent stress of the protrusion structure in the prior art. This proves that by providing through holes 213 on the inorganic layer 212 in the sub-stack 21 and providing an organic layer 214 in the through holes 213, the Mises stress of the protrusion structure 2 can be reduced.

[0063] like Figure 8 and Figure 9As shown, the maximum normal stress (S22) at the interface between the array substrate and the light-emitting layer of the display panel in this embodiment is 1.217e+00. The maximum normal stress of the existing protruding structure (i.e., without a through hole in the inorganic layer and without an organic layer in the through hole) is 1.488+00. The normal stress S22 of this application is reduced by about 18%. This proves that the structure of this application can not only reduce the risk of film peeling during the laser cutting of the light-transmitting hole in the opening area 101, but also reduce the risk that the local film peeling that occurs during the cutting process will further expand the film peeling range in subsequent processes.

[0064] Furthermore, the display panel and display device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized by, The display panel comprises an aperture region, a transition region surrounding the aperture region, and a display region surrounding the transition region. The display panel in the transition region comprises a plurality of protruding structures disposed on a substrate, each protruding structure comprising at least one sub-stack. Each sub-stack comprises: a metal layer disposed on the substrate; and an inorganic layer disposed on a side of the metal layer away from the substrate and extending to cover the substrate. At least one sub-stack in at least one protruding structure is provided with a through hole in the inorganic layer at a position corresponding to the metal layer in the sub-stack, and the through hole is provided with an organic layer.

2. The display panel of claim 1, wherein, The inorganic layer in at least one sub-stack in a protruding structure closest to the aperture region is provided with the through hole at a position corresponding to the metal layer in the sub-stack.

3. The display panel of claim 2, wherein, The inorganic layer in a sub-stack closest to the substrate is provided with the through hole at a position corresponding to the metal layer in the sub-stack.

4. The display panel of claim 2, wherein, The inorganic layer in a sub-stack farthest from the substrate is provided with the through hole at a position corresponding to the metal layer in the sub-stack.

5. The display panel of claim 1, wherein, The total number of layers of the inorganic layer provided with the through hole in any protruding structure is greater than or equal to the total number of layers of the inorganic layer provided with the through hole in a protruding structure adjacent to it and away from the aperture region.

6. The display panel of claim 1, wherein, The metal layer comprises a flat portion and a transition portion connected to both sides of the flat portion. The projection of the through hole on the substrate falls within the projection of the flat portion on the substrate.

7. The display panel of claim 6, wherein, The distance between the outer edge of the projection of the through hole on the substrate and the outer edge of the projection of the metal layer on the substrate is greater than or equal to the thickness of the inorganic layer in which the through hole is located.

8. The display panel of claim 7, wherein, The width of the through hole away from the substrate is greater than the width of the through hole close to the substrate.

9. The display panel of claim 1, wherein, The organic layer is embedded one-to-one in the through hole, and the surface of the organic layer away from the substrate is flush with the surface of the through hole away from the substrate.

10. A display device, characterized by comprising: The display panel of any one of claims 1-9.

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