Display module

Abstract

The application provides a display module, which comprises a display panel, a bottom shell and a fixing structure. The display panel comprises a substrate and a plurality of light emitting devices. The fixing structure comprises a plurality of first connecting members and a plurality of second connecting members. The first connecting members are fixed on the surface of the substrate away from the light emitting devices. The second connecting members are arranged in the mounting holes of the bottom shell and are detachably connected with the corresponding first connecting members. In this way, the bottom shell is tightly connected with the substrate. The bottom shell and the substrate are fixedly combined without the adhesive mode, so that the problems of overflow pollution, adhesion of impurities and reduction of adhesive bonding force do not occur. When disassembling, the second connecting members are only needed to be disassembled, so that the bottom shell and the display panel can be separated. In this way, the substrate can be prevented from being damaged, so that the disassembly and maintenance difficulty can be reduced, and the service life of the display module can be prolonged.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module. Background Technology

[0002] Mini LED (Mini Light-Emitting Diode) direct-view technology is a new generation of display technology following Liquid Crystal Display (LCD), Organic Light-Emitting Diode (OLED), and Mini-LED backlighting, and is one of the hot topics in future display technology.

[0003] Currently, Mini LED direct-view active glass-based display modules typically use adhesives to fix the display panel substrate to the bottom shell. However, due to the poor temperature resistance of the adhesive, long-term use in high-temperature environments can easily lead to problems such as adhesive overflow, impurities adhering to the surface, and decreased adhesion, thus affecting the product's lifespan. Furthermore, in terms of maintenance, Mini LED direct-view active glass-based display modules are difficult to disassemble and maintain, and disassembly can easily cause substrate damage.

[0004] Therefore, it is necessary to provide a display module to improve this deficiency. Summary of the Invention

[0005] The embodiments of this application provide a display module that can avoid damage to the substrate during disassembly and assembly, reduce the difficulty of disassembly and maintenance, and improve the service life of the display module.

[0006] Embodiments of this application provide a display module, including:

[0007] The display panel includes a substrate and a plurality of light-emitting devices, the light-emitting devices being disposed on one side surface of the substrate;

[0008] A bottom shell is disposed on the side surface of the substrate opposite to the light-emitting device, and the bottom shell has multiple mounting holes;

[0009] A fixing structure for detachably mounting the display panel to the base shell, the fixing structure comprising:

[0010] Multiple first connectors are fixed on the surface of the substrate facing away from the light-emitting device;

[0011] Multiple second connectors are inserted through the mounting holes and detachably connected to the corresponding first connectors, the second connectors pressing the bottom shell against the substrate.

[0012] According to one embodiment of this application, the fixing structure further includes a bonding layer disposed between the substrate and the first connector, the bonding layer being used to bond the first connector to the substrate.

[0013] According to one embodiment of this application, the bonding layer has a plurality of spaced bonding patterns, and each bonding pattern is provided with at least one of the first connectors.

[0014] According to one embodiment of this application, an adhesive layer is provided between the first connector and the bonding layer, the adhesive layer being used to bond the first connector to the bonding layer.

[0015] According to one embodiment of this application, the adhesive layer is a non-conductive adhesive film.

[0016] According to one embodiment of this application, the material of the bonding layer is metal.

[0017] According to one embodiment of this application, the first connector is a nut, and the second connector is a screw;

[0018] Alternatively, the first connector may be a magnetic nut, and the second connector may be a magnetic post.

[0019] According to one embodiment of this application, the surface of the bottom shell near the substrate has a plurality of receiving grooves, and when the display panel is mounted on the bottom shell, the first connector is received in the receiving grooves.

[0020] According to one embodiment of this application, the display module further includes a buffer member sandwiched between the substrate and the bottom shell.

[0021] According to one embodiment of this application, the display module has a plurality of display panels, which are spliced ​​and mounted on the bottom shell.

[0022] The beneficial effects of the embodiments of this application are as follows: The embodiments of this application provide a display module, which includes a display panel, a bottom shell, and a fixing structure. The display panel includes a substrate and multiple light-emitting devices. The light-emitting devices are disposed on one side surface of the substrate. The fixing structure includes multiple first connectors and multiple second connectors. By fixing the first connectors to the side surface of the substrate away from the light-emitting devices, and using the second connectors to pass through the mounting holes on the bottom shell and detachably connect with the corresponding first connectors, the bottom shell and the substrate are pressed together. There is no need to fix the bottom shell and the substrate together by adhesive, so there is no problem of glue overflow pollution, adhering impurities, and reduced adhesive bonding strength. During disassembly and assembly, only the second connectors need to be removed to separate the bottom shell from the display panel. This can avoid damage to the substrate, thereby reducing the difficulty of disassembly and maintenance and improving the service life of the display module. Attached Figure Description

[0023] Figure 1 A schematic diagram of the structure of a first display module provided for an embodiment of this application;

[0024] Figure 2 A schematic diagram of the structure of a second display module provided for an embodiment of this application;

[0025] Figure 3 A schematic diagram of the structure of a third display module provided for an embodiment of this application;

[0026] Figure 4a and Figure 4b This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of this application. Detailed Implementation

[0027] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative and understanding purposes and not for limiting the application. In the figures, structurally similar units are represented by the same reference numerals.

[0028] The present application will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] The embodiments of this application provide a display module that can avoid damage to the substrate during disassembly and assembly, reduce the difficulty of disassembly and maintenance, and improve the service life of the display module.

[0030] Please see Figure 1 , Figure 1 The first display module provided in the embodiments of this application is a structural schematic diagram. The display module includes a display panel 1, which includes a substrate 10 and a plurality of light-emitting devices 11. The light-emitting devices 11 are disposed on one side surface of the substrate 10.

[0031] It should be noted that the display panel 1 also includes a metal circuit layer 12 and an encapsulation layer 13. The statement that the light-emitting device 11 is disposed on one side surface of the substrate 10 means that the light-emitting device 11 is located on one side surface of the substrate 10, separated from the substrate 10 by the metal circuit layer 12, and electrically connected to the metal circuit in the metal circuit layer 12. The encapsulation layer 13 covers the metal circuit layer 12 and the light-emitting device 11. The film structure and circuit structure of the metal circuit layer 12 can refer to existing MiniLED direct-view active glass substrate display modules, and are not limited here.

[0032] In one embodiment, the light-emitting device 11 is a sub-millimeter light-emitting diode, i.e., a Mini LED. In other embodiments, the type of light-emitting device 11 is not limited to sub-millimeter light-emitting diodes, but may also be a light-emitting diode (LED) or a micro light-emitting diode (Micro LED).

[0033] The multiple light-emitting devices 11 are divided into a first light-emitting device 111, a second light-emitting device 112, and a third light-emitting device 113. The first light-emitting device 111 emits light of different colors from the second light-emitting device 112 and the third light-emitting device 113. For example, the first light-emitting device 111 emits red light, the second light-emitting device 112 emits green light, and the third light-emitting device 113 emits blue light.

[0034] like Figure 1 As shown, the display module also includes a bottom shell 4 and a fixing structure. The bottom shell 4 is disposed on the side surface of the substrate 10 away from the light-emitting device 11, and the fixing structure is used to detachably mount the display panel 1 onto the bottom shell 4.

[0035] The bottom shell 4 has multiple mounting holes 41. The fixing structure includes multiple first connectors 3 and multiple second connectors 5, with the number of mounting holes 41 being the same as the number of second connectors 5. The first connectors 3 are fixed to the surface of the substrate 10 facing away from the light-emitting device 11. The second connectors 5 pass through the mounting holes 41 and are detachably connected to the corresponding first connectors 3. When the second connectors 5 pass through the mounting holes 41 and are detachably connected to the corresponding first connectors 3, the second connectors 5 press the bottom shell 4 against the substrate 10, thereby achieving a fixed connection between the bottom shell 4 and the display panel 1.

[0036] It should be noted that the first connector 3 being fixed on the side of the substrate 10 away from the light-emitting device 11 can mean that the first connector 3 is located on the surface of the substrate 10 away from the light-emitting device 11, and the first connector 3 and the substrate 10 are separated by the bonding layer 2 or other adhesive layer with adhesive properties.

[0037] In some embodiments, combined with Figure 1 As shown, the fixing structure also includes a bonding layer 2, which is disposed between the substrate 10 and the first connector 3. The bonding layer 2 is used to bond the first connector 3 to the substrate 10.

[0038] It should be noted that the bonding layer 2 being disposed between the substrate 10 and the first connector 3 means that the bonding layer 2 is located on the surface of the substrate 10 away from the light-emitting device 11 and is in direct contact with the surface of the substrate 10, and the first connector 3 is located on the surface of the bonding layer 2 away from the substrate 10. The first connector 3 is in direct contact with the surface of the bonding layer 2 away from the substrate 10, and can also be separated by other adhesive film layers.

[0039] In one embodiment, the substrate 10 is a glass substrate. In practical applications, the material of the substrate 10 is not limited to glass; the substrate 10 can also be made of rigid or flexible materials.

[0040] It should be noted that since the bottom shell 4 is not fixed to the substrate 10 of the display panel 1 using adhesive, there will be no issues of excess adhesive, adhering impurities, or reduced adhesive strength. Because the connection between the second connector 5 and the first connector 3 is detachable, only the second connector needs to be removed during assembly and disassembly to separate the bottom shell from the display panel. This avoids damage to the substrate during assembly and disassembly, thereby reducing the difficulty of assembly and maintenance and extending the lifespan of the display module.

[0041] In some embodiments, the bonding layer 2 has a plurality of spaced bonding patterns 21, and each bonding pattern 21 is provided with at least one first connector 3.

[0042] In one embodiment, such as Figure 1 As shown, the bonding layer 2 has multiple bonding patterns 21, which are spaced apart from each other, and each bonding pattern 21 has a first connector 3.

[0043] In some other embodiments, the number of first connectors 3 provided on each bonding pattern 21 is not limited to one as in the above embodiments. Two or three or more first connectors 3 may be fixed on each bonding pattern 21 at the same time. This is not a unique limitation.

[0044] In one embodiment, such as Figure 2 As shown, Figure 2 A schematic diagram of the structure of a second display module provided in the embodiments of this application is shown, and its structure is similar to... Figure 1 The structures of the display modules shown are roughly the same, the difference being that the bonding layer 2 is set on the entire surface and is not divided into multiple spaced bonding patterns. That is, the bonding layer 2 covers the entire surface of the substrate 10 away from the light-emitting device 11, and multiple first connectors 3 can be arrayed on the surface of the bonding layer 2 away from the substrate 10.

[0045] exist Figure 2In the embodiment shown, by setting the bonding layer 2 over the entire surface, the process of etching to form multiple bonding patterns 21 can be eliminated, thereby reducing production steps and lowering production costs.

[0046] In some embodiments, an adhesive layer 6 is provided between the first connector 3 and the bonding layer 2, and the adhesive layer 6 is used to bond the first connector 3 to the bonding layer 2.

[0047] In one embodiment, such as Figure 1 As shown, the bonding layer 2 has multiple bonding patterns 21, and each bonding pattern 21 is provided with an adhesive layer 6. The first connector 3 is bonded to the bonding pattern 21 through the adhesive layer 6, which is a non-conductive adhesive film (NCF). The adhesive layer 6 is only coated on the bonding pattern 21, without the need for full-surface coating. This not only reduces the amount of adhesive layer 6 used and lowers production costs, but also reduces the risk of adhesive overflow contamination and impurity adhesion by reducing the coating area of ​​the adhesive.

[0048] In some other embodiments, when the bonding layer 2 is provided on the entire surface, the adhesive layer 6 can be provided only at the position corresponding to the first connector 3. This can also reduce the amount of adhesive layer 6 used, reduce production costs, and at the same time reduce the risk of adhesive overflow and contamination by reducing the coating range of the adhesive, thus reducing the adhesion of impurities.

[0049] In some other embodiments, the type of adhesive layer 6 is not limited to the non-conductive adhesive film in the above embodiments, but can also be an anisotropic conductive film (ACF).

[0050] In one embodiment, the bonding layer 2 is made of metal. The bonding layer 2 can be prepared using the same processes and equipment as the metal layer in the metal circuit layer 12, either before or after the metal circuit layer 12 is formed, thus eliminating the need for additional equipment and avoiding increased production costs.

[0051] When the material of the bonding layer 2 is metal, the first connector 3 can be welded to the bonding layer 2 by welding. The welding material can be, but is not limited to, tin.

[0052] In some other embodiments, the material of the bonding layer 2 is not limited to metal, but can also be other inorganic non-metallic materials, such as silicon nitride, silicon oxide, or silicon oxynitride.

[0053] In one embodiment, such as Figure 1As shown, the first connector 3 is a nut with threads on its inner ring, and the second connector 5 is a screw. When the second connector 5 passes through the mounting hole 41 and is detachably connected to the corresponding first connector 3, the head of the screw presses against the bottom shell 4, and the shank of the screw passes through the mounting hole 41 and is threadedly connected to the corresponding nut.

[0054] In one embodiment, the first connector 3 is a magnetic nut, and the second connector 5 is a magnetic post. The second connector 5 is magnetic, while the first connector 3 is made of metal and is non-magnetic. When the display panel 1 is mounted on the bottom shell 4, the first connector 3 and the second connector 5 can attract each other under the action of magnetic force, thereby achieving a fixed connection between the display panel 1 and the bottom shell 4. In other embodiments, the second connector 5 is non-magnetic, while the first connector 3 is magnetic; or, both the first connector 3 and the second connector 5 are magnetic, which also achieves a fixed connection between the display panel 1 and the bottom shell 4.

[0055] In one embodiment, such as Figure 1 As shown, the bottom shell 4 has multiple receiving grooves 42 on the surface near the substrate 10. The number of receiving grooves 42 is the same as the number of first connectors 3 and they correspond one-to-one. When the display panel 1 is installed on the bottom shell 4, the first connectors 3 are received in the receiving grooves 42. This can avoid interference between the bottom shell 4 and the first connectors 3, and also avoid increasing the overall thickness of the display module due to the addition of the bonding layer 2, adhesive layer 6 and the first connectors 3.

[0056] In some embodiments, the display module further includes a buffer 7, which is sandwiched between the substrate 10 and the bottom shell 4. In this structure, the buffer 7 can fill the gap between the substrate 10 and the bottom shell 4, preventing the substrate 10 from being suspended and subjected to force, thus affecting its service life. At the same time, it can also prevent the shell 4 from directly contacting the substrate 10 and causing wear to the substrate 10.

[0057] In one embodiment, such as Figure 1 As shown, the buffer 7 is an integral structure and covers the entire surface of the substrate 10 near the bottom shell 4. The buffer 7 can be provided with multiple clearance holes, and the second connector 5 can pass through the clearance holes.

[0058] In some other embodiments, the buffer 7 may have multiple sub-buffers, which are spaced apart from each other at various main stress points of the substrate 10 and the bottom shell 4.

[0059] In one embodiment, the thickness of the buffer 7 is 1 mm. In other embodiments, the thickness of the buffer 7 is not limited to 1 mm as in the above embodiments, but can also be 0.5 mm, 0.7 mm, 1.5 mm, 1.8 mm or 2 mm, etc. As long as it is between 0.5 mm and 2 mm, the substrate 10 can be prevented from being suspended under force, and the cost of excessively thick buffer 7 can also be avoided.

[0060] In one embodiment, the buffer 7 can be adhesively bonded to the substrate 10, thus avoiding the increased risk of substrate damage due to misalignment of the buffer 7 during installation. In other embodiments, the buffer 7 can also be fixed between the substrate 10 and the bottom shell 4 by the clamping force between the substrate 10 and the bottom shell 4.

[0061] In some embodiments, the display module is a splicing display module, which includes multiple display panels 1, which are spliced ​​and mounted on the bottom shell 4.

[0062] In one embodiment, such as Figure 3 As shown, Figure 3 This is a schematic diagram of a third type of display module provided in an embodiment of this application. The display module includes two display panels 1, which have identical structures and are spliced ​​and fixedly installed on the base shell 4 in the same manner as in any of the above embodiments. In practical applications, the number of display panels in the display module is not limited to the two in the above embodiments, but can also be three, four or more.

[0063] Based on the display module provided in the above embodiments of this application, embodiments of this application also provide a method for manufacturing the display module, combined with... Figure 1 as well as Figure 4a and Figure 4b As shown, Figure 4a and Figure 4b This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of this application. The method includes:

[0064] Step S1: Form a metal circuit layer 12 on one side surface of the substrate 10;

[0065] Step S2: Form a bonding layer 2 on the other side surface of the substrate 10;

[0066] Step S3: Fix the first connector 3 onto the bonding layer 2;

[0067] Step S4: Install the bottom shell 4 onto the base plate 10;

[0068] Step S5: Insert the second connector 5 through the mounting hole on the bottom shell 4 and detachably connect it with the corresponding first connector 3. The second connector 5 presses the bottom shell 4 against the substrate 10.

[0069] In one embodiment, in step S2, the material of the bonding layer 2 is metal. The bonding layer 2 can be prepared using the same process and equipment as the metal layer in the metal circuit layer 12 before or after the metal circuit layer 12 is formed. Therefore, there is no need to add new equipment, thus avoiding increased production costs.

[0070] In one embodiment, before performing step S3, a protective layer 14 needs to be formed on the metal circuit layer 12. The protective layer 14 covers the metal circuit layer 12 to prevent subsequent processes from damaging the metal circuit layer 12.

[0071] In one embodiment, such as Figure 4b As shown, in step S3, before fixing the first connector 3 to the bonding layer 2, an adhesive layer 6 needs to be provided between the bonding layer 2 and the first connector 3. A hot-pressing buffer material 9 needs to be provided between the hot-pressing head 8 and the first connector 3 to prevent the hot-pressing head 8 from damaging the first connector 3. The front side of the substrate 10 is supported by the support member 20. The hot-pressing head 8 is pressed over the first connector 3, and the hot-pressing head 8 heats and applies pressure to the first connector 3 in the direction shown by the arrow in the figure, so that the adhesive layer 6 melts and bonds the first connector 3 to the bonding layer 2.

[0072] The beneficial effects of the embodiments of this application are as follows: The embodiments of this application provide a display module, which includes a display panel, a bottom shell, and a fixing structure. The display panel includes a substrate and multiple light-emitting devices. The light-emitting devices are disposed on one side surface of the substrate. The fixing structure includes multiple first connectors and multiple second connectors. By fixing the first connectors to the side surface of the substrate away from the light-emitting devices, and using the second connectors to pass through the mounting holes on the bottom shell and detachably connect with the corresponding first connectors, the bottom shell and the substrate are pressed together. There is no need to fix the bottom shell and the substrate together by adhesive, so there is no problem of glue overflow pollution, adhering impurities, and reduced adhesive bonding strength. During disassembly and assembly, only the second connectors need to be removed to separate the bottom shell from the display panel. This can avoid damage to the substrate, thereby reducing the difficulty of disassembly and maintenance and improving the service life of the display module.

[0073] In summary, although the present application discloses the preferred embodiments as described above, the above preferred embodiments are not intended to limit the present application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display module, characterized in that, include: The display panel includes a substrate and a plurality of light-emitting devices, the light-emitting devices being disposed on one side surface of the substrate; A bottom shell is disposed on the side surface of the substrate opposite to the light-emitting device, and the bottom shell has multiple mounting holes; A fixing structure for detachably mounting the display panel to the base shell, the fixing structure comprising: Multiple first connectors are fixed on the surface of the substrate facing away from the light-emitting device; Multiple second connectors are inserted through the mounting holes and detachably connected to the corresponding first connectors, the second connectors pressing the bottom shell against the substrate; The substrate is a glass substrate, and the fixing structure further includes a bonding layer. The bonding layer is disposed between the substrate and the first connector. An adhesive layer is disposed between the first connector and the bonding layer. The adhesive layer is used to bond the first connector to the bonding layer.

2. The display module as described in claim 1, characterized in that, The bonding layer has multiple spaced bonding patterns, and each bonding pattern is provided with at least one of the first connectors.

3. The display module as described in claim 1, characterized in that, The adhesive layer is a non-conductive adhesive film.

4. The display module as described in claim 1, characterized in that, The bonding layer is made of metal.

5. The display module as described in claim 1, characterized in that, The first connector is a nut, and the second connector is a screw; Alternatively, the first connector may be a magnetic nut, and the second connector may be a magnetic post.

6. The display module as described in claim 1, characterized in that, The bottom shell has multiple receiving grooves on its surface near the substrate. When the display panel is mounted on the bottom shell, the first connector is received in the receiving grooves.

7. The display module as described in claim 1, characterized in that, The display module also includes a buffer component, which is sandwiched between the substrate and the bottom shell.

8. The display module as described in claim 1, characterized in that, The display module has multiple display panels, which are spliced ​​and installed on the bottom shell.

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