An apparatus and method for automatically identifying patterns and adjusting the orientation of PCB boards during outer layer preprocessing.

Abstract

This invention discloses an apparatus and method for automatically identifying patterns and adjusting the orientation of PCB boards during outer layer preprocessing. The method includes the following steps: When fabricating inner layer circuitry on the PCB board, a first target is fabricated at the center of both short sides of the inner layer, and a second target is fabricated on one side of one of the first targets. The second target and the first target together form an identification module. PCB boards with the identification module are conveyed one by one to an X-ray machine. The X-ray machine scans the identification module of the inner layer of the PCB board to identify the placement orientation of each PCB board and compares it with a preset placement orientation to determine if the PCB board orientation is incorrect. For PCB boards with incorrect orientation, the PCB boards are rotated and / or flipped to ensure that the placement orientation of each PCB board is consistent with the preset placement orientation before unloading. This invention eliminates the need for manual handling and adjustment of PCB board orientation, reducing employee fatigue and quality scrap losses, and improving work efficiency.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, specifically to a device and method for automatically identifying patterns and adjusting the orientation of a PCB board during outer layer preprocessing. Background Technology

[0002] The main process flow of circuit board manufacturing is as follows: inner layer → inner layer AOI → lamination → drilling → electroplating → outer layer → next process. Through multiple processes, production equipment automates loading, unloading, and transporting of PCBs. Each L-shaped rack typically carries multiple PCB models, leading to inconsistencies in orientation between different models and batches of PCBs during outer layer pre-processing. Even within the same model and batch, PCBs may have different orientations. Currently, to expedite PCB inventory management, reduce handling, and save labor costs, the industry generally uses an "outer layer pre-processing + film lamination + DI exposure line" method for outer layer production. However, the DI exposure machine only allows exposure if the orientation of the incoming PCB matches the graphic orientation. Inconsistent orientation results in rejection, requiring production line workers to remove the rejected PCBs, readjust their orientation, and re-expose them, severely impacting equipment utilization. Therefore, to resolve the issue of orientation consistency, during pre-processing, workers need to identify PCBs of the same model and batch, automatically adjust their orientation before transferring them to the automatic board loading machine.

[0003] The above-mentioned method of adjusting the orientation of the PCB board has the following drawbacks:

[0004] 1. Employees automatically move and adjust the direction of the boards, but the PCB boards are relatively heavy, which leads to high labor intensity for employees and is prone to causing the boards to fall and the risk of overturning, resulting in work-related injuries. Employee turnover and attrition rates are high.

[0005] 2. Manually moving boards can easily cause collisions and friction between them, resulting in scratches on the copper surface and rendering the boards unusable. Summary of the Invention

[0006] To address the aforementioned shortcomings of existing technologies, this invention provides an apparatus and method for automatically identifying patterns and adjusting the orientation of PCB boards during outer layer preprocessing. This method can automatically adjust the orientation of PCB boards, eliminating the need for manual handling and adjustment, reducing employee workload and minimizing quality scrap losses, while also improving work efficiency.

[0007] In a first aspect, to solve the above-mentioned technical problems, the present invention provides a method for automatically identifying patterns and adjusting the orientation of the PCB board during outer layer preprocessing, comprising the following steps:

[0008] S1. When making inner layer circuits in the PCB board, a first target is made at the center of the two short sides of the inner layer, and a second target is made on one side of one of the first targets. The second target and the two first targets together form the recognition module.

[0009] S2. Several PCB boards with the above-mentioned identification modules are transferred one by one to the bottom of the X-RAY machine. The X-RAY machine scans the identification modules on the inner layer of the PCB board to identify the placement direction of each PCB board and compares it with the preset placement direction to determine whether the PCB board direction is incorrect.

[0010] S3. For PCBs with incorrect orientation, rotate and / or flip the PCBs to ensure that the placement orientation of each PCB is consistent with the preset placement orientation before unloading.

[0011] Furthermore, in step S2, the preset board placement direction is the board placement direction required when the PCB board is fabricated for the outer layer pattern.

[0012] Furthermore, in step S2, for PCBs with the correct placement orientation, the PCBs are directly discharged backward without rotation and / or flipping.

[0013] Furthermore, a roller conveyor line is provided below the X-RAY machine, and in step S2, the PCB boards are conveyed one by one to the roller conveyor line by an automatic board placement machine.

[0014] Furthermore, in step S3, a rotating device is used to drive the PCB board to rotate in the horizontal direction.

[0015] Furthermore, the rotating device includes a rotating platform located at the upper end of the roller conveyor line, a first driving member located below the roller conveyor line for driving the rotating platform to rotate, and a second driving member for driving the first driving member and the rotating platform to move up and down. The rotating platform has a cutout hole at the roller corresponding to the roller of the roller conveyor line for the roller to pass through, and the size of the cutout hole is larger than the size of the roller, so that the surface of the rotating platform is higher or lower than the top of the roller under the drive of the second driving member. In steps S2 and S3, after the roller conveyor line conveys the PCB board forward to above the rotating platform, the roller conveyor line stops working, and the X-RAY machine is used to scan the inner layers of the PCB board. The identification module determines whether the PCB board is oriented incorrectly. For PCB boards with the correct orientation, the roller conveyor continues to transport the PCB board backward. For PCB boards with the incorrect orientation, the rotating platform is first raised by the second drive unit, which also raises the PCB board above it, making the rotating platform and the PCB board higher than the roller conveyor. Then, driven by the first drive unit, the rotating platform and the PCB board above it rotate 90 degrees, 180 degrees, 270 degrees, or 360 degrees. After the rotation, the rotating platform and the PCB board are lowered, and the rotating platform is detached from the PCB board after being lower than the roller conveyor. Then, the roller conveyor is restarted to transport the PCB board backward.

[0016] Furthermore, the rotating device is located above the rear end of the roller conveyor line, and the rotating device is a vacuum adsorption robot that can rotate 360 ​​degrees. During the process of the PCB board being conveyed on the roller conveyor line, the identification module of the inner layer of the PCB board is first scanned by an X-ray machine to determine whether the PCB board orientation is incorrect. For PCB boards with the correct orientation, the rotating device does not work and the roller conveyor line directly conveys the PCB board to the rear for output. For PCB boards with the incorrect orientation, when they are conveyed to the bottom of the rotating device, the rotating device picks up the PCB board and then rotates the PCB board by 90 degrees, 180 degrees, 270 degrees or 360 degrees. After rotation, the PCB board is put down and output to the rear under the conveyor line.

[0017] Furthermore, for PCBs that need to be flipped, an automatic flipping machine connected to the end of the roller conveyor line is used to flip the board; while for PCBs that do not need to be flipped, the automatic flipping machine does not perform the flipping operation, but only performs the conveying work to the rear.

[0018] Furthermore, after step S3, the following steps are also included:

[0019] S4. Transport the output PCB board to the transfer vehicle or the automatic board placement machine in the outer layer circuit production line.

[0020] Secondly, the present invention also provides an apparatus for automatically identifying patterns and adjusting the orientation of a PCB board during outer layer preprocessing, comprising:

[0021] An X-RAY machine is used to scan the identification modules located on the inner layers of the PCB board below to identify the placement orientation of each PCB board.

[0022] A rotating device is used to drive the PCB board to rotate 90, 180, 270 or 360 degrees in the horizontal direction.

[0023] Automatic PCB flipping machine is used to flip PCB boards.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] In this invention, when fabricating the inner layer circuitry on the PCB board, an identification pattern consisting of a first target and a second target is created on the two short sides. The second target serves as a foolproof and identification tool. Then, an X-ray machine is used to penetrate and scan the inner layer identification pattern of the PCB board, thereby identifying and determining whether the PCB board is oriented incorrectly. Subsequently, the PCB board with incorrect orientation is automatically adjusted to the correct orientation through rotation and / or flipping operations, thus ensuring that all PCB boards are oriented in the same direction. The entire adjustment process does not require manual handling and adjustment of the PCB board orientation, reducing employee fatigue, minimizing quality scrap losses, and improving work efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of an apparatus for automatically recognizing patterns and adjusting the orientation of a PCB board during outer layer preprocessing, using a rotating platform, in one embodiment.

[0027] Figure 2 This is a schematic diagram of the roller conveyor line in the embodiment;

[0028] Figure 3 This is a schematic diagram of the rotating platform in the embodiment;

[0029] Figure 4 This is a schematic diagram illustrating the use of the rotating platform and the roller conveyor line in the embodiment.

[0030] Figure 5 This is a schematic diagram of an apparatus for automatically recognizing patterns and adjusting the orientation of a PCB board during outer layer pretreatment, as described in another embodiment, using a vacuum adsorption robot.

[0031] Figure 6 This is a top view of the automatic flip-board machine in the embodiment;

[0032] Figure 7 This is a side view of the automatic flipping machine in the embodiment;

[0033] Figure 8 for Figure 7 Enlarged diagram of A in the middle;

[0034] Figure 9 This is a schematic diagram of the identification module set in the inner layer of the PCB board in Example 2. Detailed Implementation

[0035] To better understand the technical content of the present invention, the present invention will be further introduced and described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the use of terms such as "first" and "second" in the text is for distinguishing different components, and does not represent the order of events, nor does it limit "first" and "second" to different types.

[0036] Example 1

[0037] like Figure 1 or Figure 5 As shown in this embodiment, an apparatus for automatically recognizing patterns and adjusting the orientation of a PCB board during outer layer preprocessing includes:

[0038] X-RAY machine 1 is used to scan the identification module of the inner layer of the PCB board located below it to identify the placement direction of each PCB board.

[0039] A rotating device is used to drive the PCB board to rotate 90, 180, 270 or 360 degrees in the horizontal direction.

[0040] Automatic flipping machine 2 is used to flip PCB boards.

[0041] Preferably, the device also includes a roller conveyor 3 located below the X-RAY machine 1 for conveying PCB boards.

[0042] In one embodiment, such as Figure 1-4 As shown, the rotating device includes a rotating platform 4 located at the upper end of the roller conveyor line 3 and below the X-RAY machine 1, a first driving member 5 located below the roller conveyor line 3 for driving the rotating platform 4 to rotate, and a second driving member 6 for driving the first driving member 5 and the rotating platform 4 to move up and down. The rotating platform 4 has a cutout hole 41 at the roller 31 of the roller conveyor line 3 for the roller 31 to pass through, and the size of the cutout hole 41 is larger than the size of the roller 31, so that the roller 31 and the rotating platform do not affect each other. Thus, under the drive of the second driving member 6, the surface of the rotating platform 4 can be higher or lower than the top of the roller, that is, the rotating platform 4 can switch between lifting and lowering at positions higher and lower than the top of the roller to achieve the purpose of lifting or lowering the PCB board. It can be understood that in order to ensure that the cutout holes on the rotating platform can still correspond one-to-one with the rollers below after rotation, the rollers 31 of the roller conveyor line 3 are arranged in a square array.

[0043] In the above, the first driving component 5 is preferably a motor, and the end of the motor's rotating shaft is fixedly connected to the center of the rotating platform 4; the second driving component is preferably a cylinder, and the piston rod of the cylinder is fixedly connected to the motor.

[0044] In the above-described operation, the roller conveyor 3 transports the PCB board forward to above the rotating platform 4. Then, the roller conveyor 3 stops operating. The X-ray machine 1 scans the identification module on the inner layer of the PCB board to determine if the PCB board's orientation is incorrect. For PCB boards with the correct orientation, the roller conveyor 3 continues to transport the PCB board backward. At this time, the rotating device does not operate. For PCB boards with the incorrect orientation, the rotating platform 4 first rises under the action of the second drive unit 6, causing the PCB board above it to rise as well, making the rotating platform 4 and the PCB board higher than the roller conveyor. Then, driven by the first drive unit 5, the rotating platform 4 and the PCB board above it rotate 90 degrees, 180 degrees, 270 degrees, or 360 degrees, thereby adjusting the orientation of the PCB board through rotation. After rotation, the rotating platform and the PCB board are lowered, so that the rotating platform is below the roller conveyor and detaches from the PCB board. Then, the roller conveyor is restarted to transport the PCB board backward.

[0045] In another embodiment, such as Figure 5 As shown, the rotating device is a 360-degree rotatable vacuum suction robot 7, which is located above the rear end of the roller conveyor line 3, while the X-RAY machine 1 is located above the front end of the roller conveyor line 3. During operation, as the PCB board is conveyed on the roller conveyor line 3, the X-RAY machine 1 above scans the identification module of the inner layer of the PCB board to determine whether the PCB board is in the correct orientation. For PCB boards with the correct orientation, the rotating device does not work and the roller conveyor line directly conveys the PCB board to the rear for output. For PCB boards with the incorrect orientation, when they are conveyed to the vacuum suction robot 7, the vacuum suction robot 7 picks up the PCB board and then rotates the PCB board by 90 degrees, 180 degrees, 270 degrees, or 360 degrees to adjust the orientation of the PCB board. After rotation, the PCB board is placed down and output to the rear by the roller conveyor line.

[0046] In the above description, the vacuum adsorption robot 7 is a conventional robot structure, which will not be described in detail here. It can be understood that in order to achieve the purpose of picking up and putting down PCB boards, the vacuum adsorption robot can move up and down. This can be achieved by a multi-axis connected robot, such as a three-axis or five-axis robot, or by a Z-axis drive mechanism. The Z-axis drive mechanism is preferably a conventional ball screw transmission mechanism.

[0047] As a preferred option, such as Figure 1 or Figure 5As shown, the automatic flipping machine 2 is connected to the tail end of the roller conveyor line 3, so that for PCB boards that need to be flipped, the automatic flipping machine 2 flips the PCB boards; while for PCB boards that do not need to be flipped, the automatic flipping machine 2 does not perform the flipping operation, but only performs the conveying work to the rear.

[0048] In one embodiment, such as Figure 1 or Figure 5 As shown, the device also includes an automatic board placement machine 9 located at the head of the roller conveyor line and docked therewith, used to transfer PCB boards one by one to the roller conveyor line; preferably, the automatic board placement machine is preferably an existing vacuum adsorption type conveyor device.

[0049] In other embodiments, such as Figures 6 to 8 As shown, the automatic flipping machine includes a flipping mechanism and a third drive unit 21 that drives the flipping mechanism to rotate around a vertical plane. The flipping mechanism includes a fixed frame 22 and two rows of roller conveyor lines 3 arranged vertically on the fixed frame 22. The third drive unit is a motor, and the rotation shaft of the motor is connected to the middle of one side of the fixed frame. A conveying channel 23 is formed between the two rows of roller conveyor lines for the PCB board to pass through. After the PCB board enters the channel, for PCB boards that need to be flipped, the third drive unit 9 works to drive the flipping mechanism to flip 180 degrees to complete the flipping operation of the PCB board, and then outputs it outward. It can be understood that in order to realize the forward conveying of the PCB board, the fixed frame will be equipped with a drive device (not shown in the figure) for driving the rotation of the two rows of roller conveyor lines. This drive device adopts the conventional chain drive device.

[0050] Example 2

[0051] This embodiment illustrates a method for automatically identifying patterns and adjusting the orientation of a PCB board during outer layer preprocessing. The method uses the apparatus described in Embodiment 1 to adjust the PCB board orientation and specifically includes the following steps:

[0052] When fabricating inner layer circuitry on a PCB, a first target 10 is fabricated at the center of each of the two short sides of the inner layer, and a second target 20 is fabricated on one side of one of the first targets 10 (e.g., ...). Figure 9 As shown in the figure, a second target 20 and two first targets 10 together form the identification module.

[0053] In the above, both the first target and the second target are circular PADs with a diameter of 5mm, and the distance between the second target and its adjacent first target is 100mm.

[0054] Several PCBs equipped with the aforementioned identification modules are conveyed one by one to the roller conveyor line below the X-RAY machine 1 via an automatic board placement machine. The X-RAY machine 1 scans the identification modules on the inner layer of the PCBs to identify the placement direction of each PCB, that is, to identify the orientation and position of the identification modules on the inner layer of the PCBs. This is compared with the preset placement direction (i.e., the orientation and position of the identification modules) to determine whether the PCB orientation is incorrect. For PCBs with the correct orientation, the rotating device does not operate, and the roller conveyor line directly conveys the PCBs to the rear for output. The automatic flipping machine behind does not perform a flipping operation, but only performs the rearward conveying operation.

[0055] In the above, the preset board placement direction is the board placement direction required when the PCB board is made in the outer layer pattern. Therefore, the device for adjusting the PCB board direction can be directly connected to the outer layer circuit production line. After the PCB board is adjusted, it can be directly transferred to the outer layer circuit production line for production, thereby improving the efficiency of the wiring production.

[0056] c. For PCBs with incorrect orientation, the PCBs are rotated and / or flipped according to the specific orientation and position of the identification module. That is, the PCBs can be rotated only, flipped only, or rotated and flipped in sequence to ensure that the placement orientation of each PCB is consistent with the preset placement orientation before unloading.

[0057] In the above, a rotating device is used to drive the PCB board to rotate in the horizontal direction.

[0058] In one embodiment, when the rotating device shown in the figure is used, the specific working process is as follows: After the roller conveyor 3 conveys the PCB board forward to the top of the rotating platform 4, the roller conveyor 3 stops working. The X-RAY machine 1 scans the identification module of the inner layer of the PCB board to determine whether the orientation of the PCB board is incorrect. For the PCB board with the correct orientation, the roller conveyor 3 continues to work to convey the PCB board backward. For the PCB board with the incorrect orientation, the rotating platform 4 is first raised under the action of the second driving member 6, and drives the PCB board above it to rise, so that the rotating platform 4 and the PCB board are higher than the roller conveyor. Then, under the drive of the first driving member 5, the rotating platform 4 and the PCB board above it are rotated by 90 degrees, 180 degrees, 270 degrees or 360 degrees (the specific rotation angle is obtained according to the comparison result of the previous identification module). After the rotation is completed, the rotating platform and the PCB board are lowered so that the rotating platform is lower than the roller conveyor 3 and detached from the PCB board. Then the roller conveyor 3 is restarted to convey the PCB board backward.

[0059] In another embodiment, when the rotating device uses a 360-degree rotatable vacuum suction robot as shown in the figure, the specific working process is as follows: During the process of the PCB board being conveyed on the roller conveyor line, the X-ray machine first scans the identification module of the inner layer of the PCB board to determine whether the PCB board orientation is incorrect. For PCB boards with the correct orientation, the rotating device does not work and the roller conveyor line directly conveys the PCB board to the rear for output. For PCB boards with the incorrect orientation, when they are conveyed to the vacuum suction robot, the vacuum suction robot picks up the PCB board and then rotates the PCB board by 90 degrees, 180 degrees, 270 degrees or 360 degrees (the specific rotation angle is obtained according to the comparison results of the identification module). After rotation, the PCB board is put down and output to the rear under the conveyor line.

[0060] In one embodiment, for PCBs that need to be flipped, an automatic flipping machine 2 connected to the tail of the roller conveyor line 3 is used to flip the board; while for PCBs that do not need to be flipped, the automatic flipping machine 2 does not perform the flipping operation, but only performs the rearward conveying operation.

[0061] Furthermore, after step S3, the following steps are also included:

[0062] S4. Transport the output PCB board to the transfer vehicle or the automatic board placement machine in the outer layer circuit production line.

[0063] In one embodiment, the PCB board is manufactured through the following process before the outer layer circuitry is fabricated:

[0064] (1) Cutting: Cut the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the copper layer thickness on both surfaces of the core board is 0.5oz.

[0065] (2) Inner layer circuit fabrication (negative film process): Inner layer pattern transfer, photosensitive film is coated using a vertical coating machine, and the film thickness is controlled at 8μm. A fully automatic exposure machine is used, and the inner layer circuit is exposed using 5-6 exposure scales (21 exposure scales). After development, the inner layer circuit pattern is formed, and the identification module pattern is formed on the two short sides of the core board. The identification module pattern includes two first targets 10 located at the center of the two short sides and a second target 20 located on one side of one of the first targets (e.g., ...). Figure 9 (As shown); Inner layer etching: the inner layer circuitry and identification module are etched out of the core board after exposure and development. The inner layer line width is measured to be 3mil; Inner layer AOI: then check for defects such as open and short circuits, line gaps, and line pinholes in the inner layer circuitry. Defective products are scrapped, and defect-free products are sent to the next process.

[0066] (3) Lamination: The browning speed is based on the thickness of the bottom copper. The core board, prepreg, and outer copper foil are stacked in sequence as required. Then, according to the Tg of the board material, appropriate lamination conditions are selected to laminate the stacked board to form the production board (i.e., PCB board).

[0067] (4) Drilling: Drilling is performed on the production board according to the design requirements based on existing drilling technology;

[0068] (5) Copper plating: A thin layer of copper is deposited on the board surface and hole walls using chemical copper plating. The backlight test is level 10, and the copper plating thickness in the hole is 0.5μm.

[0069] (6) Full-board electroplating: According to the design requirements, the production board is electroplated to thicken the copper in the holes and the copper layer on the board surface.

[0070] In the above, the production board after full-board electroplating is transferred to the outer layer circuit production board line by a transfer vehicle. However, during the transfer process, the orientation of the production boards on the transfer vehicle needs to be adjusted to be consistent before they can be placed on the outer layer circuit production board line. Therefore, the method described in Example 2 is used to adjust the orientation of the boards.

[0071] The technical solutions provided by the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of the present invention. The descriptions of the embodiments above are only for helping to understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for automatically identifying patterns and adjusting the orientation of a PCB board during outer layer preprocessing, characterized in that, Includes the following steps: S1. When making inner layer circuits in the PCB board, a first target is made at the center of the two short sides of the inner layer, and a second target is made on one side of one of the first targets. The second target and the two first targets together form the recognition module. S2. Several PCB boards equipped with the above-mentioned identification modules are transferred one by one to the roller conveyor line below the X-RAY machine by an automatic board placement machine. The X-RAY machine scans the identification modules on the inner layer of the PCB board to identify the placement direction of each PCB board and compares it with the preset placement direction to determine whether the PCB board direction is incorrect. S3. For PCBs with incorrect orientation, a rotating device is used to drive the PCB to rotate horizontally. The rotating device includes a rotating platform located at the upper end of the roller conveyor line, a first driving component located below the roller conveyor line for driving the rotating platform to rotate, and a second driving component for driving the first driving component and the rotating platform to move up and down. The rotating platform has a cutout hole at the roller corresponding to the roller of the roller conveyor line for the roller to pass through, and the size of the cutout hole is larger than the size of the roller, so that the surface of the rotating platform is higher or lower than the top of the roller under the drive of the second driving component. In steps S2 and S3, after the roller conveyor line conveys the PCB forward to above the rotating platform, the roller conveyor line stops working, and an X-ray machine is used to scan the interior of the PCB. The layer identification module determines whether the PCB board orientation is incorrect. For PCB boards with the correct orientation, the roller conveyor continues to work, conveying the PCB board backward for output. For PCB boards with the incorrect orientation, the rotating platform is first raised by the second drive unit, which also raises the PCB board above it, making the rotating platform and the PCB board higher than the roller conveyor. Then, driven by the first drive unit, the rotating platform and the PCB board above it rotate 90 degrees, 180 degrees, 270 degrees, or 360 degrees. After the rotation, the rotating platform and the PCB board are lowered, so that the rotating platform is lower than the roller conveyor and detaches from the PCB board. Then, the roller conveyor is restarted to convey the PCB board backward, so that the placement orientation of each PCB board is consistent with the preset placement orientation before it is discharged.

2. The method for automatically identifying patterns and adjusting PCB board orientation in the outer layer preprocessing according to claim 1, characterized in that, In step S2, the preset board placement direction is the board placement direction required when the PCB board is made up of the outer layer pattern.

3. The method for automatically identifying patterns and adjusting PCB board orientation in the outer layer preprocessing according to claim 1 or 2, characterized in that, In step S2, PCBs with the correct placement orientation are directly discharged backward without rotation and / or flipping.

4. The method for automatically identifying patterns and adjusting PCB board orientation in the outer layer preprocessing according to claim 1, characterized in that, For PCBs that need to be flipped, an automatic flipping machine connected to the end of the roller conveyor line is used to flip the board; for PCBs that do not need to be flipped, the automatic flipping machine does not perform the flipping operation, but only transports them to the rear.

5. The method for automatically identifying patterns and adjusting PCB board orientation in the outer layer preprocessing according to claim 1, characterized in that, Step S3 is followed by the following steps: S4. Transport the output PCB board to the transfer vehicle or the automatic board placement machine in the outer layer circuit production line.

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