Display panel and manufacturing method thereof

Abstract

The present invention provides a display panel and a method for manufacturing the same. By aligning the boundaries of a first sealing layer with those of a first encapsulation layer, the problem of insufficient attachment precision of the first encapsulation layer, which results in the area of ​​the display panel not covered by the first encapsulation layer, being susceptible to moisture, is addressed. After preparing the first sealing layer and the first encapsulation layer on a substrate, portions of the first encapsulation layer and the first sealing layer are removed to align the boundaries of the first sealing layer and the first encapsulation layer, thereby omitting the step of attaching the first encapsulation layer and improving the technical problem of display quality being affected by insufficient attachment precision of the first encapsulation layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] To achieve waterproof encapsulation of display panels, an additional encapsulation layer is often applied to the substrate surface after the surface mount process. This not only increases the manufacturing process, but the accuracy of the encapsulation layer can also affect the quality of the display panel. If the encapsulation layer is not applied accurately enough, areas of the display panel that are not covered by the encapsulation layer will be susceptible to moisture. Summary of the Invention

[0003] Embodiments of the present invention provide a display panel and a method for manufacturing the same, which can improve the problem that the area of ​​the display panel not covered by the encapsulation layer is easily affected by water vapor due to insufficient attachment precision of the encapsulation layer.

[0004] An embodiment of the present invention provides a display panel comprising a substrate, a first sealing layer, and a first encapsulation layer. The substrate comprises a plurality of light-emitting devices, the first sealing layer is positioned on the plurality of light-emitting devices, and the first encapsulation layer is positioned on the first sealing layer. The boundary of the first sealing layer is flush with the boundary of the first encapsulation layer.

[0005] Optionally, in some embodiments of the present invention, the display panel includes a display area and a binding area adjacent to the display area, and further includes a second sealing layer and a second encapsulation layer. The second sealing layer is located in the binding area and is adjacent to the first sealing layer and the first encapsulation layer, and the second encapsulation layer is located on the first encapsulation layer and the second sealing layer.

[0006] An embodiment of the present invention further provides a method for manufacturing a display panel, comprising: forming a first sealant layer and a first encapsulation layer on a substrate; wherein the substrate includes a plurality of light-emitting devices, and the first sealant layer is positioned between the first encapsulation layer and the substrate; and removing portions of the first encapsulation layer and the first sealant layer so that the boundary between the first sealant layer and the first encapsulation layer is flush.

[0007] Optionally, in some embodiments of the present invention, the step of preparing the first sealing layer and the first encapsulation layer on the substrate includes: placing the substrate on the first mold side of a molding device; placing the carrier, the first encapsulation layer and the first sealing layer on the second mold side of the molding device; wherein the first mold and the second mold are opposite to each other, the first encapsulation layer is located between the carrier and the first sealing layer, and the first sealing layer is located on the side of the first encapsulation layer close to the substrate; vacuum pressing the substrate, the first encapsulation layer and the first sealing layer; and demolding to remove the carrier.

[0008] Optionally, in some embodiments of the present invention, before the step of vacuum pressing the substrate, the first packaging layer and the first sealing layer, the boundary of the first sealing layer is located within the boundary of the first packaging layer, and the boundary of the first packaging layer is located within the boundary of the carrier.

[0009] Optionally, in some embodiments of the present invention, the first packaging layer includes silicon nitride, and the first sealing glue layer includes liquid silicone and liquid epoxy resin.

[0010] Optionally, in some embodiments of the present invention, the step of cutting off part of the first encapsulation layer and the first sealing layer includes: cutting off parts of the first encapsulation layer and the first sealing layer that extend beyond the edge of the substrate.

[0011] Optionally, in some embodiments of the present invention, the substrate includes a display area and a binding area adjacent to the display area. The step of removing portions of the first encapsulation layer and the first sealing layer that extend beyond the edge of the substrate further includes removing portions of the first encapsulation layer and the first sealing layer that extend beyond the edge of the substrate, and removing portions of the first encapsulation layer and the first sealing layer that correspond to the binding area.

[0012] Optionally, in some embodiments of the present invention, after the steps of cutting off the portions of the first packaging layer and the first sealing layer that extend beyond the edge of the substrate, and cutting off the portions of the first packaging layer and the first sealing layer corresponding to the binding area, the steps further include: binding a chip-on-chip film in the binding area, and bending the chip-on-chip film to a side of the substrate away from the first packaging layer; and preparing a second packaging layer on the chip-on-chip film and the first packaging layer.

[0013] Optionally, in some embodiments of the present invention, before the step of preparing the second encapsulation layer on the COF and the first encapsulation layer, the method further includes: preparing a second sealing layer corresponding to the binding area.

[0014] The present invention provides a display panel and a method for manufacturing the same. By aligning the boundaries of a first sealing layer with those of a first encapsulation layer, the problem of insufficient attachment precision of the first encapsulation layer, which results in the area of ​​the display panel not covered by the first encapsulation layer, being susceptible to moisture, is addressed. After preparing the first sealing layer and the first encapsulation layer on a substrate, portions of the first encapsulation layer and the first sealing layer are removed to align the boundaries of the first sealing layer and the first encapsulation layer, thereby omitting the step of attaching the first encapsulation layer and improving the technical problem of display quality being affected by insufficient attachment precision of the first encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1A-1B It is a structural diagram of a display panel in the prior art;

[0017] Figure 1C This is a flow chart of a method for preparing a display panel in the prior art;

[0018] Figure 2A-2B is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0019] Figure 3A to Figure 3C is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0020] Figures 4A to 4G It is a schematic diagram of a display panel manufacturing process provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0022] Specifically, Figure 1A-1B It is a structural diagram of a display panel in the prior art. Figure 1CIt is a flow chart of the method for preparing a display panel in the prior art. In the existing display panel, after the process of preparing the light-emitting device Pi on the substrate 100 is completed, the surface of the light-emitting device Pi is molded and sealed with glue; thereafter, the processes of cutting glue, removing glue, cutting, grinding edges, binding, bending the binding device, assembling the pallet and thin film packaging are carried out. In order to improve the waterproof performance of the display panel, another encapsulation layer 102 is attached to the thin film encapsulation layer 101. Before the step of attaching the encapsulation layer 102 to the thin film encapsulation layer 101, the size of the encapsulation layer 102 needs to be cut to the same size as the substrate 1001 of the substrate 100. However, when the encapsulation layer 102 is attached to the thin film encapsulation layer 101, there are situations where part of the display panel is not covered by the encapsulation layer 102 due to the attachment accuracy (such as Figure 1A A in the Figure 1B If the area of ​​the display panel not covered by the encapsulation layer 102 is affected by water vapor, the area of ​​the display panel not covered by the encapsulation layer 102 may be easily affected by water vapor, and the water vapor may even penetrate along the edge of the encapsulation layer 102 into the display panel covered by the encapsulation layer 102. Whether the area of ​​the display panel not covered by the encapsulation layer 102 is affected by water vapor or the area of ​​the display panel covered by the encapsulation layer 102 is penetrated along the edge of the encapsulation layer 102 into the display panel covered by the encapsulation layer 102, both may easily cause display quality problems.

[0023] In particular, the portion of the display panel corresponding to the display area 100a that is not covered by the encapsulation layer 102 is closer to the display area, while the portion of the display panel corresponding to the binding area 100b that is not covered by the encapsulation layer 102 is farther from the display area; therefore, the path for water vapor to penetrate into the display area through the portion of the display area 100a that is not covered by the encapsulation layer 102 is shorter, while the path for water vapor to penetrate into the display area through the portion of the binding area 100b that is not covered by the encapsulation layer 102 is farther. Therefore, except for the side where the binding area is located, the other three sides of the display panel (such as Figure 1B Accordingly, the attachment deviation of the encapsulation layer 102 in the portion corresponding to the display area 100a has a greater impact on the display panel than the attachment deviation of the encapsulation layer 102 in the portion corresponding to the binding area 100b.

[0024] In addition, since the second sealing layer 104 provided for the binding area 100b is prepared after the first sealing layer 103 for the display area 100a is prepared, in order to ensure that the second sealing layer 104 has a similar packaging performance to the first sealing layer 103, the thickness of the second sealing layer 104 is generally greater than the thickness of the first sealing layer 103. However, the thickness of the second sealing layer 104 is greater than the thickness of the first sealing layer 103, which may cause the thin film encapsulation layer 101 and the encapsulation layer 102 prepared on the second sealing layer 104 and the first sealing layer 103 to have unevenness problems (such as Figure 1A B in the figure).

[0025] If the size of the encapsulation layer 102 is larger than the substrate 1001 of the substrate 100 before the encapsulation layer 102 is attached to the thin film encapsulation layer 101, then when the encapsulation layer 102 is removed, it is very easy to cut into the thin film encapsulation layer 101, affecting the encapsulation effect. Moreover, if a release film is provided on the surface of the encapsulation layer 102, removing the release film can cause the edge of the encapsulation layer 102 to warp, which in turn can cause display problems on the display panel at the corresponding warped areas. To this end, the present application provides a display panel and its preparation method, which can improve the display quality and the complex preparation process caused by insufficient encapsulation layer attachment precision.

[0026] Figure 2A-2B 2 is a schematic structural diagram of a display panel provided by an embodiment of the present invention; an embodiment of the present invention provides a display panel, and the display panel includes a substrate 200.

[0027] Optionally, the substrate 200 includes a plurality of light-emitting devices Pi.

[0028] Optionally, the light emitting device Pi includes at least one of an organic light emitting diode, a sub-millimeter light emitting diode and a micro light emitting diode.

[0029] Optionally, the substrate 200 further includes a substrate 2001 and a driving circuit layer 2002. The substrate 2001 includes a flexible substrate (such as polyimide), a rigid substrate (such as glass, ceramic, etc.), etc. The driving circuit layer 2002 includes multiple signal lines and multiple pixel driving circuits. The multiple signal lines may include at least one of a scan signal line, a data signal line, a light-emitting control signal line, a read signal line, a write signal line, and a sense signal line. The multiple signal lines can be used to transmit at least one of a scan signal, a data signal, a light-emitting control signal, a read signal, a write signal, and a sense signal. The multiple pixel driving circuits are electrically connected to the multiple signal lines and the multiple light-emitting devices Pi, so that the multiple signals transmitted by the multiple signal lines control the multiple light-emitting devices Pi to achieve the display function of the display panel. Optionally, the pixel driving circuit can be implemented using a circuit structure such as 2T1C, 3T1C, 3T2C, 7T1C, 7T2C, or 8T2C. Wherein, T represents a transistor, C represents a capacitor, and xTyC indicates that the pixel driving circuit includes x transistors and y capacitors.

[0030] Optionally, the driving circuit layer 2002 includes film layers such as a light shielding layer 21, a buffer layer 22, an active layer 23, a gate insulating layer 24, a gate layer 25, an interlayer dielectric layer 26, a source-drain electrode layer 27, a protective layer 28, and a planarization layer 29. The light shielding layer 21 is located on the substrate 2001, the buffer layer 22 is located on the light shielding layer 21, the active layer 23 is located on the buffer layer 22, the gate insulating layer 24 is located on the active layer 23, the gate layer 25 is located on the gate insulating layer 24, the interlayer dielectric layer 26 is located on the gate layer 25, the source-drain electrode layer 27 is located on the interlayer dielectric layer 26, the source-drain electrode layer 27 includes a first electrode electrically connected to the active layer 23 and a second electrode electrically connected to the light-emitting device Pi, the protective layer 28 is located on the source-drain electrode layer 27, and the planarization layer 29 is located on the protective layer 28. Optionally, the driving circuit layer 2002 further includes a first connecting portion 30 and a second connecting portion 31, wherein the first connecting portion 30 and the second connecting portion 31 are electrically connected between the first electrode and the light-emitting device Pi, and electrically connected between the second electrode and the light-emitting device Pi. Optionally, the driving circuit layer 2002 further includes an insulating layer 32 located on the planar layer 29.

[0031] Please continue reading Figure 2A-2B , the display panel also includes a first encapsulation layer 402 and a first sealing layer 403. The first sealing layer 403 is located on the plurality of light-emitting devices Pi, and the first encapsulation layer 402 is located on the first sealing layer 403. The boundary of the first sealing layer 403 is flush with the boundary of the first encapsulation layer 402, so that the area of ​​the display panel covered by the first encapsulation layer 402 is the same as the area of ​​the display panel covered by the first sealing layer 403, so as to improve the problem that the area of ​​the display panel not covered by the first encapsulation layer 402 is susceptible to water vapor due to insufficient attachment accuracy of the first encapsulation layer 402. In particular, the remaining three sides of the display panel (such as the side where the binding area 200b is located) except for the side where the binding area 200b is located can be fixed. Figure 2B 10a, 10b and 10c) in the package to achieve better packaging performance in the weaker areas, and improve the display problem of water vapor penetrating from the display area.

[0032] Optionally, the display panel further includes a display area 200a, and the display area 200a is adjacent to the binding area 200b. The display panel further includes a second sealing layer 405 and a second encapsulation layer 404. The second sealing layer 405 is located in the binding area 200b and is adjacent to the first sealing layer 403 and the first encapsulation layer 402. The second encapsulation layer 404 is located on the first encapsulation layer 402 and the second sealing layer 405 to further improve the encapsulation performance. In addition, since the first sealing layer 403 is no longer provided in the binding area 200b, compared to Figure 1A The prior art shown can also reduce the unevenness of the display panel corresponding to the binding area 200 b.

[0033] like Figure 3A to Figure 3C is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention, Figures 4A to 4G It is a schematic diagram of a display panel manufacturing process provided by an embodiment of the present invention.

[0034] An embodiment of the present invention further provides a method for manufacturing a display panel, comprising:

[0035] A first sealing layer 403 and a first encapsulation layer 402 are prepared on the substrate 200. The substrate 200 includes a plurality of light-emitting devices Pi, and the first sealing layer 403 is located between the first encapsulation layer 402 and the substrate 200;

[0036] Part of the first encapsulation layer 402 and the first sealing layer 403 is cut off so that the boundary of the first sealing layer 403 is flush with the boundary of the first encapsulation layer 402. Figure 4D shown.

[0037] The method for manufacturing a display panel provided in the present application improves the technical problem of display quality being affected by insufficient attachment precision by aligning the boundary of the first encapsulation layer 402 with the boundary of the first sealing glue layer 403 .

[0038] Optionally, in the step of preparing the first sealing layer 403 and the first encapsulation layer 402 on the substrate 200, an attachment process can be used to prepare the first encapsulation layer 402 having a size larger than the first sealing layer 403 on the first sealing layer 403, or a molding device can be used to prepare the first sealing layer 403 and the first encapsulation layer 402 on the substrate 200.

[0039] Optionally, see Figure 3B The step of preparing the first sealing layer 403 and the first encapsulation layer 402 on the substrate 200 includes:

[0040] The substrate 200 is placed on the first mold 301 side of the molding equipment;

[0041] The carrier board 401, the first packaging layer 402 and the first sealing glue layer 403 are placed on the second mold 302 side of the molding equipment, as shown in FIG. Figure 4A As shown; wherein, the first mold 301 and the second mold 302 are opposite to each other, the first encapsulation layer 402 is located between the carrier 401 and the first sealing layer 403, and the first sealing layer 403 is located on the side of the first encapsulation layer 402 close to the substrate 200;

[0042] The substrate 200, the first packaging layer 402 and the first sealing layer 403 are vacuum pressed together. Figure 4B As shown;

[0043] Demolding to remove the carrier plate 401, such as Figure 4C shown.

[0044] In which, in the step of demolding to remove the carrier 401, the bonding force between the first sealing layer 403 and the substrate 200 and the bonding force between the first packaging layer 402 and the first sealing layer 403 are both greater than the bonding force between the first packaging layer 402 and the carrier 401, so that the carrier 401 can be demolded and removed.

[0045] The preparation method of the display panel provided in the present application is by placing the substrate 200 including a plurality of the light-emitting devices Pi on the first mold 301 side of the molding equipment, placing the carrier 401, the first encapsulation layer 402 and the first sealing layer 403 on the second mold 302 side of the molding equipment, and making the first mold 301 and the second mold 302 opposite to each other, the first encapsulation layer 402 is located between the carrier 401 and the first sealing layer 403, and the first sealing layer 403 is located on the side of the first encapsulation layer 402 close to the substrate 200, so as to vacuum press the substrate 200, the first encapsulation layer 402 and the first sealing layer 403, and then demolding to remove the carrier 401 and cut off part of the first encapsulation layer 402 and the first sealing layer 403 so that the edges of the first encapsulation layer 402 and the first sealing layer 403 are flush, thereby omitting the process of attaching the encapsulation layer and improving the technical problem of affecting the display quality due to insufficient attachment accuracy.

[0046] Optionally, the method for preparing the display panel further includes, before the step of placing the substrate 200 on the first mold 301 side of the molding device:

[0047] A driving circuit layer 2002 and a plurality of light-emitting devices Pi are formed on the substrate 2001; the driving circuit layer 2002 is located between the substrate 2001 and the plurality of light-emitting devices Pi. Optionally, the driving circuit layer 2002 includes a light-shielding layer 21, a buffer layer 22, an active layer 23, a gate insulating layer 24, a gate layer 25, an interlayer dielectric layer 26, a source and drain electrode layer 27, a protective layer 28, a planarization layer 29, and other film layers.

[0048] Optionally, the light-emitting device Pi includes a micro light-emitting diode or a sub-millimeter light-emitting diode; the step of preparing the driving circuit layer 2002 and multiple light-emitting devices Pi on the substrate 2001 also includes: preparing the driving circuit layer 2002 on the substrate 2001 and preparing the light-emitting device Pi on the driving circuit layer 2002 using surface mounting technology.

[0049] Optionally, the first encapsulation layer 402 includes silicon nitride to provide a waterproof effect. Optionally, the first encapsulation layer 402 may also include other materials to improve the waterproof oxygen performance of the display panel. Optionally, the first encapsulation layer 402 may be a single layer or multi-layer structure.

[0050] Optionally, the first sealing glue layer 403 includes liquid silicone and liquid epoxy resin.

[0051] Optionally, see Figures 4A to 4C The second mold 302 of the molding equipment has a constant temperature pre-bake cavity, and the carrier 401, the first packaging layer 402 and the first sealing layer 403 are located in the constant temperature pre-bake cavity.

[0052] Optionally, the temperature of the constant temperature pre-bake chamber is less than or equal to 150 degrees Celsius to prevent the first encapsulation layer 402 from being liquefied due to the temperature being too high.

[0053] Optionally, when the substrate 200, the first packaging layer 402 and the first sealing glue layer 403 are vacuum pressed, the pressure used is 3 kPa to 5 kPa, and the pre-baking temperature can be 70 degrees Celsius to 80 degrees Celsius to avoid the problem of deformation of the first packaging layer 402 caused by excessive pressure and high temperature.

[0054] Optionally, the pressure is 3 kPa, 3.2 kPa, 3.5 kPa, 4 kPa, 4.5 kPa, 4.8 kPa or 5 kPa, and the pre-bake temperature may be 70 degrees Celsius, 71 degrees Celsius, 72 degrees Celsius, 73 degrees Celsius, 74 degrees Celsius, 75 degrees Celsius, 76 degrees Celsius, 77 degrees Celsius, 78 degrees Celsius, 79 degrees Celsius or 80 degrees Celsius.

[0055] Optionally, when the substrate 200 , the first encapsulation layer 402 and the first sealing layer 403 are vacuum pressed together, the first sealing layer 403 may also provide a buffer for the first encapsulation layer 402 to avoid deformation of the first encapsulation layer 402 and thus affect display quality.

[0056] Optionally, see Figure 4D to Figure 4E The step of removing part of the first packaging layer 402 and the first sealing layer 403 includes: removing part of the first packaging layer 402 and the first sealing layer 403 by laser.

[0057] Optionally, the laser is ultraviolet light. Optionally, the wavelength of the laser can be 315 nanometers.

[0058] Since the present application prepares the first sealing layer 403 and the first encapsulation layer 402 simultaneously in the sealing process, and cuts the first encapsulation layer 402 and the first sealing layer 403 simultaneously in the cutting process, after cutting off part of the first encapsulation layer 402 and the first sealing layer 403, the distance between the boundary of the first encapsulation layer 402 and the boundary of the first sealing layer 403 is less than or equal to 10 microns. Figures 1A to 1C The prior art shown prepares a first sealing layer 103 during the sealing process, and only removes the first sealing layer 103 during the cutting stage. Then, after the thin film encapsulation process, the encapsulation layer 102 is attached to the thin film encapsulation layer 101 using an attachment process. The distance between the boundary of the encapsulation layer 102 and the boundary of the first sealing layer 103 is greater than 50 microns due to the influence of the attachment accuracy. The present application can save process steps and reduce the distance between the boundary of the first encapsulation layer 402 and the boundary of the first sealing layer 403, ensuring that the surface of the display panel can be covered by the first encapsulation layer 402.

[0059] It is understandable that after the step of removing part of the first encapsulation layer 402 and the first sealing layer 403 (i.e., the corresponding glue cutting step), a glue stripping step of removing the first encapsulation layer 402 and the first sealing layer 403 is further included. After the glue stripping step of removing the first encapsulation layer 402 and the first sealing layer 403, a cutting step of cutting the substrate 2001 and an edge grinding step may also be included, such as Figure 3C shown.

[0060] Optionally, the carrier plate 401 may be made of the same material as the release film.

[0061] Optionally, the step of removing a portion of the first encapsulation layer 402 and the first sealing layer 403 includes: removing a portion of the first encapsulation layer 402 and the first sealing layer 403 that extends beyond the edge of the substrate 200, such as Figure 4Dshown.

[0062] Because in Figure 1A-1B In the prior art shown, a release film is attached to the surface of the encapsulation layer 102. In order to reduce the impact of the release film on the display quality of the display panel, the release film will be torn off after the encapsulation layer 102 is attached to the display panel. However, tearing off the release film will cause the edge of the encapsulation layer 102 to warp, which in turn affects the quality of the display panel. In the present application, after demoulding to remove the carrier 401, the portion of the first encapsulation layer 402 and the first sealing layer 403 that exceeds the edge of the substrate 200 is cut off so that the position where the edge warping occurs can be cut off, thereby reducing the impact of the edge warping on the display quality of the display panel. Therefore, compared with the edge warping caused by tearing off the release film in the prior art, the warping caused by demoulding to remove the carrier 401 in the present application has less impact on the quality of the display panel.

[0063] Optionally, before the step of vacuum pressing the substrate 200, the first encapsulation layer 402 and the first sealing layer 403, the boundary of the first sealing layer 403 is located within the boundary of the first encapsulation layer 402, and the boundary of the first encapsulation layer 402 is located within the boundary of the carrier 401, so that the first encapsulation layer 402 provides a larger extension area for the first sealing layer 403, so that in the step of vacuum pressing the substrate 200, the first encapsulation layer 402 and the first sealing layer 403, the first sealing layer 403 is compressed and the distribution area is expanded, so that a portion of the first sealing layer 403 may extend beyond the substrate 200.

[0064] Optionally, the display panel is electrically connected to the control system by binding a flexible circuit board, a chip-on-film (COF), etc. Optionally, the substrate 200 includes a display area 200a and a binding area 200b adjacent to the display area 200a, and the flexible circuit board, the chip-on-film (COF), etc. are bound to the binding area 200b.

[0065] In order to realize the electrical connection between the display panel and the control system, the method for preparing the display panel further includes, in the step of removing the portion of the first encapsulation layer 402 and the first sealing layer 403 that exceeds the edge of the substrate 200, removing the portion of the first encapsulation layer 402 and the first sealing layer 403 that exceeds the edge of the substrate 200, and removing the portion of the first encapsulation layer 402 and the first sealing layer 403 that corresponds to the binding area 200b, such as Figure 4E shown.

[0066] Optionally, see Figure 3CAfter the steps of removing the portions of the first encapsulation layer 402 and the first sealing layer 403 that extend beyond the edge of the substrate 200, and removing the portions of the first encapsulation layer 402 and the first sealing layer 403 that correspond to the binding area 200 b, the method further includes: binding a chip-on-film (COF) or a flexible printed circuit board (FPC) to the binding area 200 b, and bending the chip-on-film (COF) or the FPC to a side of the substrate 200 away from the first encapsulation layer 402; and preparing a second encapsulation layer 404 on the chip-on-film (COF) or the FPC and the first encapsulation layer 402, as shown in FIG. Figure 4F shown.

[0067] Optionally, the second encapsulation layer 404 may be a thin film encapsulation layer. Figure 1A-1B In the conventional design shown, the encapsulation layer 102 is located on the thin film encapsulation layer 101. The thin film encapsulation layer of the present invention is disposed on the first encapsulation layer 402, which helps to save process steps and improve display quality problems caused by insufficient attachment precision.

[0068] Optionally, the second encapsulation layer 404 may include a stacked structure of an inorganic film layer and an organic film layer. Optionally, the second encapsulation layer 404 may include parylene or the like.

[0069] Optionally, in order to achieve electrical connection between the display panel and the control system, the first encapsulation layer 402 and the first sealing layer 403 corresponding to the binding area 200b are removed before the step of binding the binding area 200b to the chip-on-film or the flexible circuit board. Therefore, after the chip-on-film or the flexible circuit board is bound to the binding area 200b, the height and sealing performance of the binding area 200b are different from those of the display area 200a, which is not conducive to ensuring the quality of the display panel. Therefore, a second sealing layer 405 is also prepared in the binding area 200b to make the height and sealing performance of the binding area 200b similar to those of the display area 200a. Figure 4F shown.

[0070] Correspondingly, before the step of preparing the second encapsulation layer on the COF and the first encapsulation layer 402 , the method further includes: preparing a second sealing layer 405 corresponding to the binding area 200 b .

[0071] Optionally, the second sealing layer 405 includes liquid silicone and liquid epoxy resin.

[0072] Optionally, when the light emitting device Pi includes a micro light emitting diode or a sub-millimeter light emitting diode, the display panel may include a plurality of sub-display modules (eg Figure 4G500 represents the sub-display module), and a plurality of the sub-display modules 500 are arranged in an array to form the display panel. Figure 3A to Figure 3C The manufacturing method shown is as follows (ie, the structure of each sub-display module 500 is as shown in FIG. Figure 4F As shown, a plurality of the sub-display modules may share the second encapsulation layer 404).

[0073] Accordingly, before the step of preparing the second encapsulation layer 404 on the COF and the first encapsulation layer 402 , the method further includes: providing a support plate 501 , and attaching the side of the substrate 200 away from the first encapsulation layer 402 to the support plate 501 .

[0074] Optionally, a side of the substrate 200 away from the first packaging layer 402 is adhered to the support plate 501 by glue.

[0075] Optionally, the support plate 501 includes a support plate body and a magnetic member, and the display panel further includes a magnetic box 502 . A plurality of support plates 501 are mounted on the magnetic box 502 , so that the plurality of sub-display modules 500 together form the display panel.

[0076] Optionally, the magnetic member cooperates with the magnetic box 502 to facilitate installation and removal of the magnetic box 502 and the plurality of support plates 501 , and is also beneficial to improving equipment utilization.

[0077] exist Figure 1A-1B In the prior art shown, the surface reflectivity of encapsulation layer 102 is weak and the light transmittance is low. In a design where thin film encapsulation layer 101 is provided on the surface of first sealant layer 103, and encapsulation layer 102 is attached to the surface of thin film encapsulation layer 101, if the surface reflectivity of first sealant layer 103 is strong and the light transmittance is high, then optical delamination will be visible, resulting in poor display quality of the display panel. If the surface reflectivity of first sealant layer 103 is weak and the light transmittance is low, then light loss through first sealant layer 103 and encapsulation layer 102 is large, affecting the display brightness of the display panel. In the present application, however, the first sealant layer 403 and the first encapsulation layer 402 are vacuum pressed together to form a composite structure, which can reduce penetration, lower optical loss, and help improve display brightness.

[0078] The present invention also provides a display device comprising a display panel produced by any of the above-described production methods. It is understood that the display device includes a mobile display device (such as a laptop computer, a mobile phone, etc.), a fixed terminal (such as a desktop computer, a television, etc.), a measuring device (such as a sports bracelet, a thermometer, etc.), etc.

[0079] Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a binding area adjacent to the display area, and the display panel includes: a substrate comprising a plurality of light-emitting devices; a first sealing layer, located on the plurality of light-emitting devices; a first encapsulation layer, located on the first sealing layer, wherein a boundary of the first sealing layer is flush with a boundary of the first encapsulation layer; a second sealing layer, located in the binding area and adjacent to the first sealing layer and the first encapsulation layer; The second packaging layer is located on the first packaging layer and the second sealing layer.

2. A method for preparing a display panel, characterized in that: The display panel includes a display area and a binding area adjacent to the display area; The method for preparing the display panel includes: Preparing a first sealing layer and a first encapsulation layer on a substrate; wherein the substrate includes a plurality of light-emitting devices, and the first sealing layer is located between the first encapsulation layer and the substrate; Cutting off portions of the first encapsulation layer and the first sealing glue layer that extend beyond the edge of the substrate, and cutting off portions of the first encapsulation layer and the first sealing glue layer that correspond to the binding area, so that a boundary of the first sealing glue layer is flush with a boundary of the first encapsulation layer; Binding a chip-on-film (CFF) in the binding area, and bending the CFF to a side of the substrate away from the first packaging layer; Prepare a second sealing layer corresponding to the binding area; A second encapsulation layer is prepared on the second sealing glue layer and the first encapsulation layer.

3. The preparation method according to claim 2, characterized in that The step of preparing the first sealing layer and the first encapsulation layer on the substrate includes: placing the substrate on a first mold side of a molding apparatus; Placing the carrier, the first encapsulation layer, and the first sealing layer on the second mold side of the molding device; wherein the first mold and the second mold are opposite to each other, the first encapsulation layer is located between the carrier and the first sealing layer, and the first sealing layer is located on the side of the first encapsulation layer close to the substrate; vacuum pressing the substrate, the first packaging layer and the first sealing glue layer; De-molding is performed to remove the carrier plate.

4. The preparation method according to claim 3, characterized in that Before the step of vacuum pressing the substrate, the first packaging layer and the first sealing glue layer, the boundary of the first sealing glue layer is located within the boundary of the first packaging layer, and the boundary of the first packaging layer is located within the boundary of the carrier.

5. The preparation method according to claim 2, characterized in that The first packaging layer includes silicon nitride, and the first sealing glue layer includes liquid silicone and liquid epoxy resin.

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