A unequal depth SUS processing technology

Abstract

The present invention relates to the technical field of stainless steel processing, and in particular to a unequal-depth SUS processing process. The present invention can control the depth of SUS etching in the same time by setting different proportions of reagents, thereby forming evenly distributed unequal-depth etching grooves on the stainless steel plate. Compared with the etching process of the prior art in which unequal depths are adopted in the middle and on both sides, the formation of the unequal-depth etching grooves can achieve a good bending effect and more superior surface support performance of the stainless steel plate when the stainless steel plate is bent, thereby effectively improving the processing quality of the stainless steel plate. The present invention is provided with a screen forming and printing operation process, thereby realizing efficient and accurate photoresist film coating operation on the stainless steel plate according to actual needs, and can conveniently display the shape to be etched through a development operation, thereby facilitating the unequal-depth etching processing operation of the stainless steel plate.

Description

Technical Field

[0001] The invention relates to a SUS processing technology, in particular to a unequal depth SUS processing technology. Background Art

[0002] According to GB / T20878-2007, stainless steel (SUS) is defined as steel with stainless steel and corrosion resistance as its primary characteristics, with a chromium content of at least 10.5% and a maximum carbon content of no more than 1.2%. The corrosion resistance of stainless steel decreases with increasing carbon content. Therefore, most stainless steels have a low carbon content, with a maximum of no more than 1.2%. Some steels even have a ωc (carbon content) below 0.03% (such as 00Cr12). The primary alloying element in stainless steel is chromium (Cr), and corrosion resistance is achieved only when the Cr content reaches a certain level. Therefore, stainless steel generally contains at least 10.5% Cr (Chromium). Stainless steel also contains elements such as Ni, Ti, Mn, N, Nb, Mo, Si, and Cu.

[0003] In the existing technology, the processing of stainless steel plates mostly uses the full-break etching process with equal thickness in the middle and the half-break etching process with equal thickness on both sides, that is, it can only achieve equal-depth etching processing operations on the stainless steel plates. In the later processing operations of the stainless steel plates, it is easy for the bending strength of the processing area of ​​the stainless steel plates to be slightly weak and the supporting performance to be relatively weak, thereby reducing the processing quality of the stainless steel plates and being not conducive to the use of the stainless steel plates.

[0004] Based on the above reasons, the present invention proposes a unequal depth SUS processing technology to solve the problems of the existing processing technology. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a unequal depth SUS processing technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A unequal depth SUS processing process includes the following steps:

[0008] S1: Design stainless steel processing drawings according to actual needs, and perform stainless steel cutting operations according to the stainless steel processing drawings;

[0009] S2: Cleaning the stainless steel sheet after cutting;

[0010] S3: Carry out screen printing operation according to the processing requirements of stainless steel drawings;

[0011] S4: Using chemical solvents of different concentrations to perform different depth etching operations on stainless steel plates;

[0012] S5: De-molding operation is performed on the etched stainless steel sheet to complete the processing of the stainless steel.

[0013] As a preferred technical solution of the present invention, the stainless steel cutting operation in step 1 includes the following steps:

[0014] S11: Fix the larger stainless steel sheet material and cut it with a hacksaw or shearing machine to obtain a stainless steel sheet with a size close to that of the drawing;

[0015] S12: The obtained stainless steel sheet is processed and cut with high precision according to the drawing size by manual or high-precision machine tools to obtain a stainless steel sheet that meets the size;

[0016] S13: Deburr and grind stainless steel sheets that meet the size requirements to improve the quality of the stainless steel sheets.

[0017] As a preferred technical solution of the present invention, in step 2, the stainless steel plate is cleaned with a mild solvent and water pressure to achieve a thorough removal of oil stains, impurities and particles on the stainless steel plate, ensuring that the surface of the stainless steel plate is smooth and clean.

[0018] As a preferred technical solution of the present invention, the screen printing operation on the surface of the stainless steel plate in step 3 includes the following steps:

[0019] S31: Uniformly coating and applying a photoresist film on the upper and lower surfaces of the stainless steel plate;

[0020] S32: Using CAD to draw the shape to be etched, and transferring the drawn image to the photoresist film of the stainless steel plate;

[0021] S33: Irradiating the photoresist film after the image is transferred with ultraviolet light. The ultraviolet light can pass through the locations where etching is not required, making the photoresist film hard and strong. On the contrary, the ultraviolet light is not affected by the locations where etching is required, and the photoresist film remains soft.

[0022] S34: The stainless steel sheet treated with ultraviolet light is transplanted into a developing device to implement screen forming and printing operations on the stainless steel sheet.

[0023] As a preferred technical solution of the present invention, step 32 needs to be performed in a room illuminated by yellow light to prevent exposure to ultraviolet rays.

[0024] As a preferred technical solution of the present invention, the operation of the transplantation and development equipment for the stainless steel plate in step 34 includes the following steps:

[0025] S341: First, the stainless steel metal plate is rinsed with an alkaline solution to remove the soft photoresist film and expose the portion to be etched;

[0026] S342: Then, the alkaline solution on the stainless steel plate after rinsing is cleaned to avoid solution residue;

[0027] S343: Finally, the rinsed stainless steel plate is dried.

[0028] As a preferred technical solution of the present invention, the formula of the chemical solvent used for etching in step 4 is: 65% ferric chloride with a degree Baume of 40-45, 10% hydrogen peroxide, and 25% hydrofluoric acid, or 210 g / L concentrated hydrochloric acid, 200 g / L concentrated nitric acid, 20 g / L glacial acetic acid, 200 g / L hydrofluoric acid, 12 g / L of disodium hydrogen phosphate, 12 g / L of crystal water, and 358 g / L of water.

[0029] As a preferred technical solution of the present invention, the unequal depth etching operation for the stainless steel plate in step 4 includes the following steps:

[0030] S41: performing a segmentation and sealing operation on one side of the stainless steel plate using an external mold in the shape of the developed photoresist film;

[0031] S42: Adding different concentrations of etching chemical solvents into the split mold, wherein the concentration of the etching chemical solvent is the highest at the center and decreases toward both sides;

[0032] S43: Maintain the temperature at 30-50 degrees Celsius and etch for a specified time to achieve sufficient etching of the stainless steel plate;

[0033] S44: Expelling the etching chemical solvent after etching is completed from the split mold, and removing the split mold from the stainless steel plate, thereby completing the uneven depth etching operation on one side of the stainless steel plate;

[0034] S45: Repeat the above steps to complete the unequal depth etching operation on the other side of the stainless steel plate, and clean the stainless steel plate after the processing to complete the overall unequal depth processing operation on the stainless steel plate.

[0035] As a preferred technical solution of the present invention, the removal of the photoresist film in step 5 is achieved by using a film remover. The photoresist film is completely removed by evenly applying the film remover to the two side walls of the stainless steel plate, and the stainless steel plate after the film is removed is cleaned.

[0036] The embodiment of the present invention provides a unequal depth SUS processing process, which has the following beneficial effects:

[0037] 1. The present invention can control the depth of SUS etching in the same time by setting different proportions of reagents, thereby forming evenly distributed etched grooves of unequal depths on the stainless steel plate. Compared with the prior art etching process in which the middle and both sides adopt unequal depths, the formation of etched grooves of unequal depths can achieve good bending effect and better surface support performance when bending the stainless steel plate, effectively improving the processing quality of the stainless steel plate.

[0038] 2. The present invention is provided with a screen forming and printing operation process, which can realize efficient and accurate photoresist film coating operation on the stainless steel plate according to actual needs. The shape to be etched can be conveniently displayed through the development operation, which is convenient for the unequal depth etching processing operation of the stainless steel plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0040] Figure 1 This is a flow chart of a unequal depth SUS processing process of the present invention;

[0041] Figure 2 This is a flow chart of the stainless steel cutting operation in the unequal depth SUS processing technology of the present invention;

[0042] Figure 3 This is a flow chart of the screen forming and printing operation on the surface of a stainless steel plate in a unequal depth SUS processing process of the present invention;

[0043] Figure 4 This is an operation flow chart of a transplantation and development device for a stainless steel plate in a unequal depth SUS processing process of the present invention;

[0044] Figure 5 The present invention provides a flowchart of the unequal depth etching operation of a stainless steel plate in a unequal depth SUS processing process. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0046] Example 1: Figure 1-5 As shown, a unequal depth SUS processing process includes the following steps:

[0047] S1: According to actual needs, design stainless steel processing drawings and perform stainless steel cutting operations according to the stainless steel processing drawings. The stainless steel cutting operations include the following steps:

[0048] S11: Fix the larger stainless steel sheet material and cut it with a hacksaw or shearing machine to obtain a stainless steel sheet with a size close to that of the drawing;

[0049] S12: The obtained stainless steel sheet is processed and cut with high precision according to the drawing size by manual or high-precision machine tools to obtain a stainless steel sheet that meets the size;

[0050] S13: Deburr and grind stainless steel sheets that meet the size requirements to improve the quality of the stainless steel sheets.

[0051] S2: Clean the stainless steel sheets after cutting. Use mild solvent and water pressure to clean the stainless steel sheets to thoroughly remove the oil, impurities and particles on the stainless steel sheets, ensuring that the surface of the stainless steel sheets is smooth and clean.

[0052] S3: Perform screen printing operations according to the processing requirements of the stainless steel drawings. The screen printing operations on the surface of stainless steel plates include the following steps:

[0053] S31: Uniformly coating and applying a photoresist film on the upper and lower surfaces of the stainless steel plate;

[0054] S32: Use CAD to draw the shape to be etched and transfer the drawn image to the photoresist film of the stainless steel plate. This needs to be done in a room illuminated by yellow light to prevent exposure to ultraviolet rays.

[0055] S33: Irradiating the photoresist film after the image is transferred with ultraviolet light. The ultraviolet light can pass through the locations where etching is not required, making the photoresist film hard and strong. On the contrary, the ultraviolet light is not affected by the ultraviolet light at the locations where etching is required, and the photoresist film remains soft.

[0056] S34: The stainless steel sheet treated with UV light is transplanted into a developing device to implement screen printing of the stainless steel sheet. The operation of the transplanting and developing device for the stainless steel sheet includes the following steps:

[0057] S341: First, the stainless steel metal plate is rinsed with an alkaline solution to remove the soft photoresist film and expose the portion to be etched;

[0058] S342: Then, the alkaline solution on the stainless steel plate after rinsing is cleaned to avoid solution residue;

[0059] S343: Finally, the rinsed stainless steel plate is dried.

[0060] S4: Using chemical solvents of different concentrations to perform unequal depth etching on the stainless steel sheet. The chemical solvent formula for etching is: 65% ferric chloride with a Baume degree of 40-45, 10% hydrogen peroxide, and 25% hydrofluoric acid. The unequal depth etching operation of the stainless steel sheet includes the following steps:

[0061] S41: performing a segmentation and sealing operation on one side of the stainless steel plate using an external mold in the shape of the developed photoresist film;

[0062] S42: Adding different concentrations of etching chemical solvents into the split mold, wherein the concentration of the etching chemical solvent is the highest in the center and decreases toward the sides. The etching chemical solvent in the center is 45 degrees Baume of ferric chloride with a content of 65%, 10% hydrogen peroxide, and 25% hydrofluoric acid. The degrees Baume of ferric chloride in the etching chemical solvents toward the sides are 44, 43, 42, ..., 40, respectively, and the content of ferric chloride is always 65%. The remaining hydrogen peroxide content is 10% and the hydrofluoric acid content is 25% and the same setting is maintained.

[0063] S43: maintaining the temperature at 30-50 degrees Celsius and etching time for 45 minutes to achieve full etching operation on the stainless steel plate;

[0064] S44: Expelling the etching chemical solvent after etching is completed from the split mold, and removing the split mold from the stainless steel plate, thereby completing the uneven depth etching operation on one side of the stainless steel plate;

[0065] S45: Repeat the above steps to complete the unequal depth etching operation on the other side of the stainless steel plate, and clean the stainless steel plate after the processing to complete the overall unequal depth processing operation on the stainless steel plate.

[0066] S5: The etched stainless steel sheet is stripped to complete the processing of the stainless steel. The photoresist film is removed by using a film remover. The photoresist film is completely removed by evenly applying the film remover to the two side walls of the stainless steel sheet. The stainless steel sheet is then cleaned after the film is removed.

[0067] Example 2: Figure 1-5 As shown, a unequal depth SUS processing process includes the following steps:

[0068] S1: According to actual needs, design stainless steel processing drawings and perform stainless steel cutting operations according to the stainless steel processing drawings. The stainless steel cutting operations include the following steps:

[0069] S11: Fix the larger stainless steel sheet material and cut it with a hacksaw or shearing machine to obtain a stainless steel sheet with a size close to that of the drawing;

[0070] S12: The obtained stainless steel sheet is processed and cut with high precision according to the drawing size by manual or high-precision machine tools to obtain a stainless steel sheet that meets the size;

[0071] S13: Deburr and grind stainless steel sheets that meet the size requirements to improve the quality of the stainless steel sheets.

[0072] S2: Clean the stainless steel sheets after cutting. Use mild solvent and water pressure to clean the stainless steel sheets to thoroughly remove the oil, impurities and particles on the stainless steel sheets, ensuring that the surface of the stainless steel sheets is smooth and clean.

[0073] S3: Perform screen printing operations according to the processing requirements of the stainless steel drawings. The screen printing operations on the surface of stainless steel plates include the following steps:

[0074] S31: Uniformly coating and applying a photoresist film on the upper and lower surfaces of the stainless steel plate;

[0075] S32: Use CAD to draw the shape to be etched and transfer the drawn image to the photoresist film of the stainless steel plate. This needs to be done in a room illuminated by yellow light to prevent exposure to ultraviolet rays.

[0076] S33: Irradiating the photoresist film after the image is transferred with ultraviolet light. The ultraviolet light can pass through the locations where etching is not required, making the photoresist film hard and strong. On the contrary, the ultraviolet light is not affected by the ultraviolet light at the locations where etching is required, and the photoresist film remains soft.

[0077] S34: The stainless steel sheet treated with UV light is transplanted into a developing device to implement screen printing of the stainless steel sheet. The operation of the transplanting and developing device for the stainless steel sheet includes the following steps:

[0078] S341: First, the stainless steel metal plate is rinsed with an alkaline solution to remove the soft photoresist film and expose the portion to be etched;

[0079] S342: Then, the alkaline solution on the stainless steel plate after rinsing is cleaned to avoid solution residue;

[0080] S343: Finally, the rinsed stainless steel plate is dried.

[0081] S4: Using chemical solvents of different concentrations to perform unequal depth etching on the stainless steel sheet, the chemical solvent formula for etching is: concentrated hydrochloric acid 210 g / L, concentrated nitric acid 200 g / L, glacial acetic acid 200 g / L, hydrofluoric acid 200 g / L, disodium hydrogen phosphate 12, crystal water 12 g / L, and water 358 g / L. The unequal depth etching operation of the stainless steel sheet includes the following steps:

[0082] S41: performing a segmentation and sealing operation on one side of the stainless steel plate using an external mold in the shape of the developed photoresist film;

[0083] S42: Adding different concentrations of etching chemical solvents into the split mold, wherein the concentration of the etching chemical solvent is the highest at the center and decreases toward the sides. The etching chemical solvent in the center is 210 g / L concentrated hydrochloric acid, 200 g / L concentrated nitric acid, 20 g / L glacial acetic acid, 200 g / L hydrofluoric acid, 12 g / L of hydrated water of 12 sodium hydrogen phosphate, and 358 g / L water. The water content in the etching chemical solvents increases by 100 g / L from the center toward the sides, thereby continuously decreasing the concentrations of the etching chemical solvents on both sides. The remaining 210 g / L concentrated hydrochloric acid, 200 g / L concentrated nitric acid, 20 g / L glacial acetic acid, 200 g / L hydrofluoric acid, and 12 g / L of hydrated water of 12 sodium hydrogen phosphate remain unchanged.

[0084] S43: maintaining the temperature at 24-60 degrees Celsius and etching time for 45 minutes to achieve full etching operation on the stainless steel plate;

[0085] S44: Expelling the etching chemical solvent after etching is completed from the split mold, and removing the split mold from the stainless steel plate, thereby completing the uneven depth etching operation on one side of the stainless steel plate;

[0086] S45: Repeat the above steps to complete the unequal depth etching operation on the other side of the stainless steel plate, and clean the stainless steel plate after the processing to complete the overall unequal depth processing operation on the stainless steel plate.

[0087] S5: The etched stainless steel sheet is stripped to complete the processing of the stainless steel. The photoresist film is removed by using a film remover. The photoresist film is completely removed by evenly applying the film remover to the two side walls of the stainless steel sheet. The stainless steel sheet is then cleaned after the film is removed.

[0088] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0089] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0090] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A unequal depth SUS processing process, comprising the following steps, characterized in that: S1: Design stainless steel processing drawings according to actual needs, and perform stainless steel cutting operations according to the stainless steel processing drawings; S2: Cleaning the stainless steel sheet after cutting; S3: Carry out screen printing operation according to the processing requirements of stainless steel drawings; S4: Using chemical solvents of different concentrations to perform different depth etching operations on stainless steel plates; S5: Demolding the etched stainless steel sheet to complete the processing of the stainless steel; The chemical solvent for etching in step 4 is formulated as follows: 65% ferric chloride with a Baume degree of 40-45, 10% hydrogen peroxide, and 25% hydrofluoric acid, or 210 g / L concentrated hydrochloric acid, 200 g / L concentrated nitric acid, 20 g / L glacial acetic acid, 200 g / L hydrofluoric acid, 12 g / L of disodium hydrogen phosphate, 12 g / L of crystal water, and 358 g / L of water. The unequal depth etching operation for the stainless steel plate in step 4 includes the following steps: S41: performing a segmentation and sealing operation on one side of the stainless steel plate using an external mold in the shape of the developed photoresist film; S42: Adding different concentrations of etching chemical solvents into the split mold, wherein the concentration of the etching chemical solvent is the highest at the center and decreases toward both sides; S43: Maintain the temperature at 30-50 degrees Celsius and etch for a specified time to achieve sufficient etching of the stainless steel plate; S44: Expelling the etching chemical solvent after etching is completed from the split mold, and removing the split mold from the stainless steel plate, thereby completing the uneven depth etching operation on one side of the stainless steel plate; S45: Repeat the above steps to complete the unequal depth etching operation on the other side of the stainless steel plate, and clean the stainless steel plate after the processing to complete the overall unequal depth processing operation on the stainless steel plate.

2. The unequal depth SUS processing technology according to claim 1 is characterized in that: The stainless steel cutting operation in step 1 includes the following steps: S11: Fix the larger stainless steel sheet material and cut it with a hacksaw or shearing machine to obtain a stainless steel sheet with a size close to that of the drawing; S12: The obtained stainless steel sheet is processed and cut with high precision according to the drawing size by manual or high-precision machine tools to obtain a stainless steel sheet that meets the size; S13: Deburr and grind stainless steel sheets that meet the size requirements to improve the quality of the stainless steel sheets.

3. The unequal depth SUS processing technology according to claim 1 is characterized in that: In step 2, the stainless steel plate is cleaned with a mild solvent and water pressure to thoroughly remove oil stains, impurities and particles on the stainless steel plate, ensuring that the surface of the stainless steel plate is smooth and clean.

4. The unequal depth SUS processing technology according to claim 1 is characterized in that: The screen printing operation on the surface of the stainless steel plate in step 3 includes the following steps: S31: Uniformly coating and applying a photoresist film on the upper and lower surfaces of the stainless steel plate; S32: Using CAD to draw the shape to be etched, and transferring the drawn image to the photoresist film of the stainless steel plate; S33: Irradiating the photoresist film after the image is transferred with ultraviolet light. The ultraviolet light can pass through the locations where etching is not required, making the photoresist film hard and strong. On the contrary, the ultraviolet light is not affected by the ultraviolet light at the locations where etching is required, and the photoresist film remains soft. S34: The stainless steel sheet treated with ultraviolet light is transplanted into a developing device to implement screen forming and printing operations on the stainless steel sheet.

5. The unequal depth SUS processing technology according to claim 4 is characterized in that: The step 32 needs to be performed in a room illuminated by yellow light to prevent exposure to ultraviolet rays.

6. The unequal depth SUS processing technology according to claim 4 is characterized in that: The operation of the transplantation and development equipment for the stainless steel plate in step 34 includes the following steps: S341: First, the stainless steel metal plate is rinsed with an alkaline solution to remove the soft photoresist film and expose the portion to be etched; S342: Then, the alkaline solution on the stainless steel plate after rinsing is cleaned to avoid solution residue; S343: Finally, the rinsed stainless steel plate is dried.

7. The unequal depth SUS processing technology according to claim 1 is characterized in that: In step 5, the photoresist film is removed by using a film remover. The photoresist film is completely removed by evenly applying the film remover to the two side walls of the stainless steel plate, and the stainless steel plate after the film is removed is cleaned.

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