ceramic base

Abstract

The present invention relates to a ceramic base. The ceramic base of the present invention includes an insulating plate member configured with a high frequency electrode, a shaft body connected to one end of the insulating plate member and having an isolation plate at the other end, a connection base having an upper portion connected to the other end of the shaft body, first and second rod bodies connected to the high frequency electrode and extending through the isolation plate to the inside of the connection base, and a connection member connecting the first and second rod bodies to a lead-in rod body, the first and second rod bodies being disposed in the connection base and extending to the inside of the connection base. Also, the connection member includes an elastic member for absorbing a difference in deformation caused by heat between the first and second rod bodies and the lead-in rod body.

Description

Technical Field

[0001] The present invention relates to a ceramic susceptor, and more particularly to a ceramic susceptor having a structure for reducing heat generation in the high-frequency electrode portion. Background Technology

[0002] Semiconductor devices or display devices are typically fabricated by sequentially stacking multiple thin film layers, including dielectric and metal layers, on a glass substrate, flexible substrate, or semiconductor wafer substrate, and then patterning them. These thin film layers are sequentially deposited on the substrate using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. The CVD processes include low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and metal-organic chemical vapor deposition (MOCVD), among others. A ceramic substrate is disposed in such CVD and PVD apparatuses to support the glass substrate, flexible substrate, semiconductor wafer substrate, etc., and to generate specified heat or a high-frequency signal for plasma generation. For precision processes such as finer wiring in semiconductor devices, ceramic substrates are widely used in processes such as plasma deposition, based on the requirements of precise temperature control and heat treatment. They are also used for plasma formation or substrate heating in etching processes or photoresist firing processes for thin film layers formed on semiconductor wafer substrates.

[0003] like Figure 1 As shown, a conventional ceramic base includes an insulating plate 10 attached to a shaft 20. The insulating plate 10 includes a high-frequency (RF) electrode 12 disposed in a ceramic material. The RF electrode 12 is connected to an external power supply unit via parallel RF electrode rods 21 and 23 and a connecting member 41 connected to a rod 29 to reduce the load. Patent No. 10-2369346 (February 24, 2022) discloses the following prior art: In order to achieve refinement of semiconductor processes and improve productivity, RF power is constantly increasing. Therefore, the high-frequency electrodes in the shaft 20 are separated into two rods 21 and 23 to reduce the load.

[0004] However, in this conventional structure, since the degree of thermal expansion applied to the two high-frequency (RF) electrode rods 21 and 23 can be different, there is a problem in that any one or more of the two high-frequency (RF) electrode rods 21 and 23 can be cracked or short-circuited, thereby causing a failure in which power supply is not normally performed. SUMMARY

[0005] PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a ceramic base in which, when two or more high-frequency electrode rods in a shaft body are connected in a connection base, even if there is a difference in thermal expansion between the high-frequency electrode rods, an electrical characteristic can be maintained by applying a connection member that can absorb the difference in thermal expansion, so that cracking or short-circuiting of the high-frequency electrode rods does not occur.

[0007] MEANS FOR SOLVING THE PROBLEMS

[0008] First, the features of the present invention are summarized as follows: A ceramic base according to an aspect of the present invention for achieving the above object includes an insulating plate member configured with a high-frequency electrode, a shaft body having one end connected to the insulating plate member and the other end having an isolation plate, a connection base having an upper portion connected to the other end of the shaft body, a first rod and a second rod connected to the high-frequency electrode and extending to the inside of the connection base through the isolation plate, and a connection member connecting the first rod and the second rod to a lead-in rod, the first rod and the second rod being disposed in the connection base and extending to the inside of the connection base. Also, the connection member includes an elastic member for absorbing a difference in deformation caused by heat between the first rod, the second rod, and the lead-in rod.

[0009] The elastic member includes a first fastening portion for fastening the first rod, a second fastening portion for fastening the second rod and the lead-in rod, and a curved plate member between the first fastening portion and the second fastening portion.

[0010] The connection member includes a first coupling member for coupling the first rod, a second coupling member for coupling the second rod, a third coupling member for coupling the lead-in rod, and the elastic member having elasticity for coupling the first coupling member, the second coupling member, and the third coupling member as one.

[0011] The high-frequency electrode includes a first high-frequency electrode and a second high-frequency electrode. Also, the first rod and the first high-frequency electrode are electrically connected, and the second rod and the second high-frequency electrode are electrically connected.

[0012] The ceramic base can further include a temperature sensor for measuring the internal temperature of the connection base.

[0013] The ceramic base can further include a cooling structure for cooling the connection base.

[0014] The connection base is in a sealed form, includes an inlet and an outlet for circulation of a cooling medium, and the inlet rod body penetrates through the sealed connection base, thereby being exposed to the outside.

[0015] The ceramic base further includes a fixing plate fixing the inlet rod body, and the inlet rod body can penetrate through the fixing plate and the connection base, thereby being exposed to the outside.

[0016] Inventive Effects

[0017] In the case of the ceramic base according to the present application, when two or more high-frequency electrode rod bodies within a shaft body are connected within a connection base, even if there is a difference in thermal expansion between the high-frequency electrode rod bodies, the deformation thereof can be absorbed by an elastic member (an intermediate medium member having excellent elasticity) in the connection member, so that even if high-frequency power is increased, cracks in the high-frequency electrode rod bodies can be prevented, short circuits due to oxidation can be prevented from occurring, and arcing or local heating in the high-frequency electrode portion can be prevented, thereby maintaining constant electrical characteristics, so that abnormality in a thin film in a substrate process is not caused, and an increase in yield can be facilitated by a stable semiconductor process. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which are included as part of the detailed description, are used to help understand the present application and are incorporated in and constitute a part of this specification. They, together with the detailed description, serve to explain the principles of the present application.

[0019] Figure 1 is a cross-sectional view of a conventional ceramic base.

[0020] Figure 2 is a cross-sectional view of a ceramic base according to an embodiment of the present application.

[0021] Figure 3 is a perspective view of a connection member according to an embodiment of the present application, viewed from the right side.

[0022] Figure 4 is a perspective view of a connection member according to an embodiment of the present application, viewed from the left side.

[0023] Figure 5 is a perspective view of a connection member according to an embodiment of the present application, viewed from the right lower side.

[0024] Figure 6Fig. 10 is a perspective view of an elastic member according to an embodiment of the present application.

[0025] Reference numerals

[0026] 10: Insulating plate member

[0027] 12: High-frequency electrode

[0028] 21, 23: Rod for high-frequency electrode

[0029] 29: Rod

[0030] 41: Connecting member

[0031] 100: Ceramic base

[0032] 110: Insulating plate member

[0033] 112: High-frequency electrode

[0034] 114: Heat generating body

[0035] 120: Shaft

[0036] 121, 122: Connecting rod

[0037] 129: Lead-in rod

[0038] 130: Partition plate

[0039] 140: Connecting base

[0040] 144: Elastic member

[0041] 150: Fixing plate

[0042] 180: Temperature sensor

[0043] 181, 182: Groove

[0044] 190: Cooling structure

[0045] 191: Lead-in port

[0046] 192: Discharge port

[0047] 149: Connecting member

[0048] 141: First coupling member

[0049] 142: Second coupling member

[0050] 143: Third coupling member

[0051] 145: First fastening portion

[0052] 146: Second fastening portion

[0053] 147: curved plate member DETAILED DESCRIPTION

[0054] Hereinafter, the present application will be described in detail with reference to the accompanying drawings. In this case, the same components in each drawing are designated by the same reference numerals whenever possible. Also, the description of known functions and / or configurations will be omitted. The following disclosure mainly describes parts necessary for understanding the operation of various embodiments, and the description of elements that can obscure the gist of the description will be omitted. Also, some of the components in the drawings can be exaggerated, omitted, or schematically illustrated. The size of each component cannot fully reflect the actual size, and thus the contents described herein are not limited by the relative size or spacing of the components illustrated in each drawing.

[0055] In describing the embodiments of the present application, if it is determined that a detailed description of the known technology related to the present application unnecessarily obscures the gist of the present application, the detailed description thereof will be omitted. Also, the terms described later are terms defined in consideration of the functions of the present application, and can vary according to the intention of the user or the operator or precedents. Therefore, the definition thereof should be interpreted based on the contents of the entire specification. The terms used in the specification are used only to describe the embodiments of the present application, and are not used to limit. Unless otherwise specified, the expression in the singular form should include the expression in the plural form. The expression "include" or "have" or the like in the specification is used to mean that any feature, number, step, action, component or a combination thereof is included, and should not be understood as excluding the existence or possibility of addition of one or more other features, numbers, steps, actions, components or combinations thereof.

[0056] Also, the terms "first", "second", and the like, although can be used to describe various components, are not limited to the components. The terms are used only to distinguish one component from another component.

[0057] Figure 2 is a cross-sectional view schematically illustrating a ceramic base 100 according to an embodiment of the present application.

[0058] Referring to Figure 2 , the ceramic base 100 according to an embodiment of the present application includes an insulating plate member 110, a shaft 120, and a connection mount 140. The insulating plate member 110, the shaft 120, and the connection mount 140 are sequentially connected, and the shaft 120 and the connection mount 140 include a partition plate 130 formed at an end portion in a length direction of the shaft 120 to partition the internal spaces from each other.

[0059] The ceramic susceptor 100 according to an embodiment of the present application can be a semiconductor device that supports a process target substrate (e.g., a semiconductor wafer, a glass substrate, a flexible substrate, etc.) for various purposes and heats the process target substrate at a prescribed temperature. In addition, the ceramic susceptor 100 can include a chuck electrode for supporting an electrostatic chuck function, and the ceramic susceptor 100 can further include a high frequency electrode for supporting a process such as a plasma enhanced chemical vapor deposition, etc., or a heating element for supporting a heating function.

[0060] The insulating plate member 110 is configured in a structure in which the high frequency electrode 112 is disposed (buried) between ceramic materials, and in some cases, can also be a structure in which a heating element is disposed (buried) in a manner spaced apart from the high frequency electrode 112 by a prescribed interval. The insulating plate member 110 can stably support a process target substrate while being capable of heating using the heating element 114 and / or being capable of performing various semiconductor processes such as a plasma enhanced chemical vapor deposition using the high frequency electrode 112. Also, the ceramic susceptor 100 according to an embodiment of the present application can be used as an electrostatic chuck that chucks and dechucks a process target substrate using a chuck electrode. The insulating plate member 110 can be formed in a plate-like structure having a prescribed shape. As an example, the insulating plate member 110 can be formed in a circular plate-like structure, but is not necessarily limited thereto. Among them, the ceramic material can be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, Autoclaved lightweight concrete (AlC), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BN, SiO2, SiC, Yttrium Aluminum Garnet (YAG), Mullite, AlF3, and the like, and preferably, can be aluminum nitride (AlN). Further, a powder of the ceramic material can be molded together with the electrode, sintered to form the insulating plate member 110, and each ceramic powder used for this purpose can selectively contain yttria powder of about 0.1% to about 10%, and preferably, about 1% to about 5%. x C y , BN, SiO2, SiC, Yttrium Aluminum Garnet (YAG), Mullite, AlF3, and the like, and preferably, can be aluminum nitride (AlN). Further, a powder of the ceramic material can be molded together with the electrode, sintered to form the insulating plate member 110, and each ceramic powder used for this purpose can selectively contain yttria powder of about 0.1% to about 10%, and preferably, about 1% to about 5%.

[0061] The high frequency electrode 112 can be made of tungsten (W), molybdenum (Mo), silver (Ag), gold (Au), niobium (Nb), titanium (Ti), aluminum nitride (AIN), or an alloy thereof, and preferably, can be made of molybdenum (Mo). The high frequency electrode 112 can be connected to a power source (e.g., ground) through a lead-in rod body 129 connected to a connection member for connecting (short-circuiting) the connection rod bodies 121 and 122. The connection rod bodies 121 and 122 are configured to pass through the inside of the shaft body 120 and the isolation plate 130. Hereinafter, a case in which the connection rod bodies 121 and 122 are two is exemplified, but in some cases, there can be three or more.

[0062] The connection base 140 is connected to the end portion of the length direction of the shaft body 120, and the connection rod bodies 121 and 122 passing through the isolation plate 130 formed at the end portion of the length direction of the shaft body 120 are connected by the connection member 149 disposed inside the connection base 140 in a sealed form, and the lead-in rod body 129 connected to the connection member 149 passes through the lower portion of the connection base 140 and extends to be exposed to the outside. The high frequency electrode 112 has a mesh structure of a wire type or a sheet type. Here, the mesh structure is a mesh-shaped structure in which a plurality of metals arranged in a first direction and a plurality of metals arranged in a second direction are interlaced with each other.

[0063] The heating element 114 can be formed in a form of a plate-shaped coil based on a heating wire (or a resistance wire) or a flat plate. Also, in order to accurately control the temperature, the heating element 114 can be formed in a multi-layer structure. Such a heating element 114 is connected to a heating element power source through a heating element connection rod body (not shown), and in a semiconductor manufacturing process, performs a function of heating a process target substrate on the insulation plate 110 at a predetermined temperature to perform heating of the substrate or a deposition process, an etching process, etc. Although Figure 2 Although not shown in FIG. 1, the heating element connection rod body can be configured to pass through the inside of the shaft body 120 and the isolation plate 130. The heating element connection rod body passing through the isolation plate 130 can pass through the lower portion of the connection base 140 in a sealed form and extend to be exposed to the outside.

[0064] The shaft body 120 is a pipe shape having a through-hole, which is combined to the lower surface of the insulating plate member 110. The shaft body 120 can be formed of the same ceramic material as the insulating plate member 110 and combined. Among them, the ceramic material can be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, Autoclaved lightweight concrete (AlC), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BN, SiO2, SiC, yttrium aluminum garnet (YAG), Mullite, AlF3, and preferably, can be aluminum nitride (AlN). Further, the powder of the ceramic material can form the shaft body 120 by molding, sintering, and each ceramic powder for this purpose can selectively contain yttria powder of about 0.1% to 10%, preferably about 1% to 5%. x C y

[0065] As described below, the shaft body 120 can be combined with the insulating plate member 110 by a bonding material 125 such as a ceramic paste or the like. In some cases, the shaft body 120 can be mechanically combined with the insulating plate member 110 using a bolt, nut, or the like. The through-hole of the shaft body 120 accommodates each rod body (121, 122, or the like) that provides power to the high-frequency electrode 112 and / or the heating body 114, which is extended to be exposed to the outside through a connection base 140 of a sealing form.

[0066] ​In the ceramic base 100 according to an embodiment of the present application, in particular, two or more connection rod bodies 121, 122 inside the shaft body connected with the high frequency electrode 112 are connected in the connection base 140 having a sealing form of a cooling structure (including a guide inlet 191 and a discharge outlet 192 for circulating a cooling medium), thereby even if the high frequency (RF) power is increased, the current is branched in the plurality of connection rod bodies 121, 122, so that no crack occurs in the high frequency electrode 112 and the connection rod bodies 121, 122 connected with the high frequency electrode 112, and no arcing occurs, the uniformity of the film forming characteristics on the substrate based on the heat generation is achieved, and the electrical characteristics are maintained without the short circuit due to the oxidation of the connection rod bodies 121, 122 connected with the high frequency electrode 112. In particular, even if there is a difference in thermal expansion between the high frequency electrode rod bodies, since the deformation thereof can be absorbed by the elastic member 144 (an intermediate medium member having excellent elasticity) in the connection member 149, even if the high frequency power is increased, the crack of the high frequency electrode rod bodies (121, 122) can be prevented, the short circuit due to the oxidation can be prevented, and the arcing or the local heat generation of the high frequency electrode portion (including the high frequency electrode 112, the connection rod bodies 121, 122, etc.) can be prevented, thereby maintaining the constant electrical characteristics, so that the film in the substrate process does not become abnormal, and the yield can be improved by the stable semiconductor process.

[0067] Also, in the present application, since the connection base 140 is maintained in a cooling state, it is not exposed to a high temperature as in the inside of the conventional shaft body, and since the connection rod bodies 121, 122 are located in the connection base 140, they are not easily oxidized, and the electrical characteristics can be maintained without the oxidation and the short circuit based on the cooling inside the connection base 140. Also, in the prior art, the operation of connecting the plurality of high frequency electrode rod bodies in the hole having a small diameter of the shaft body is not easy, but in the present application, the connection member 149 is disposed in the connection base 140 without being located in the shaft body 120, so that the operation of connecting the plurality of connection rod bodies 121, 122 by the connection member 149 becomes easier than the existing structure.

[0068] As Figure 2As shown, in the present application, although it is described that the plurality of connection rods 121, 122 connected to one high frequency electrode 112 are connected by the connection member 149 in the connection base 140, it is not limited thereto, and in some cases, the high frequency electrode 112 can be configured in the form of two or more separated electrodes (for example, two separated electrodes including a first high frequency electrode and a second high frequency electrode). At this time, the plurality of connection rods can be electrically connected to the plurality of separated electrodes, respectively. Among them, in the former case in which the plurality of connection rods are connected to one high frequency electrode 112, the size of the through hole formed in the insulating plate 110 for connecting the connection rods 121, 122 and the terminal of the high frequency electrode 112 will be minimized, thereby making it possible to become a structure that is advantageous in preventing cracks that occur due to the difference in the thermal expansion coefficient of the connection rods 121, 122 and the insulating plate 110.

[0069] As shown, Figure 2 The connection base 140 is connected to the end portion in the length direction of the shaft 120. The connection base 140 can be mechanically combined with the shaft 120, and the isolation plate 130 formed at the end portion in the length direction of the shaft 120 is located therein. The connection of the shaft 120 and the isolation plate 130 can be mechanical combination by using a bolt, a nut, or the like. Also, the connection of the isolation plate 130 combined with the shaft 120 and the upper portion of the connection base 140 can be mechanical combination by using a bolt, a nut, or the like. The periphery of the plurality of through holes for the connection rods (121, 122, etc.) passing through the isolation plate 130 is sealed by using the paste of the ceramic material as described above or the like, so that there is no gap therein, and the connection base 140 is fastened in a manner of wrapping the periphery of the isolation plate 130. The upper portion of the connection base 140 and the isolation plate 130 can also be sealed by using the paste of the ceramic material as described above or the like, so that there is no gap therein.

[0070] The lower surface of the connection base 140 is also sealed by using the paste of the ceramic material as described above or the like, so that there is no gap in the periphery of the plurality of through holes for the connection rods (121, 122, etc.) passing through the introduction rod 129 and the temperature sensor 180. As shown, Figure 2 The lower surface of the connection base 140 can be made in an integrated manner with the body wall surface of the connection base 140, but is not limited thereto, and a separate plate of the lower surface can be mechanically combined with the body wall surface of the connection base 140 by using a bolt, a nut, or the like, and the connection base 140 can be made in a sealed state.

[0071] As shown, Figure 2As shown, the connecting rod bodies 121, 122 connected to the high-frequency electrode 112 pass through the lengthwise end of the shaft body 120 and extend toward the connecting base 140. In other words, the connecting rod bodies 121, 122 are configured to pass through the isolation plate 130 formed in the lengthwise end of the shaft body 120. The connecting rod bodies 121, 122 passing through the isolation plate 130 are separated into two and connected (short-circuited) by the connecting member 149 having an elastic member 144, which is configured inside the connecting base 140 in a sealed form, and the lead-in rod body 129 connected to the connecting member 149 passes through the lower portion of the connecting base 140 and extends to be exposed to the outside. The lead-in rod body 129 can be connected to a power source (for example, a ground) so that the high-frequency electrode 112 forms one side electrode of a high-frequency power source.

[0072] Figure 3 FIG. 7 is a perspective view of the connecting member 149 according to an embodiment of the present application, viewed from the right side.

[0073] Figure 4 FIG. 8 is a perspective view of the connecting member 149 according to an embodiment of the present application, viewed from the left side.

[0074] Figure 5 FIG. 9 is a perspective view of the connecting member 149 according to an embodiment of the present application, viewed from the lower right side.

[0075] Figure 6 FIG. 10 is a perspective view of the elastic member 144 according to an embodiment of the present application.

[0076] Referring to Figures 3 to 6 , the connecting member 149 includes a first coupling member 141 for coupling the (first) connecting rod body 121, a second coupling member 142 for coupling the (second) connecting rod body 122, a third coupling member 143 for coupling the lead-in rod body 129, and an elastic member 144 having elasticity for coupling the first coupling member 141, the second coupling member 142, and the third coupling member 143 together (integrally coupled).

[0077] As shown in Figure 6 , the elastic member 144 includes a first fastening portion 145 for fastening the (first) connecting rod body 121, a second fastening portion 146 for fastening the (second) connecting rod body 122 and the lead-in rod body 129, and a curved plate 147 between the first fastening portion 145 and the second fastening portion 146.

[0078] The elastic member 144 is used to absorb the difference in deformation caused by the heat between the (first) connection rod 121, the (second) connection rod 122, and the lead-in rod 129. In other words, together with the first coupling member 141, the second coupling member 142, and the third coupling member 143, the (first) connection rod 121, the (second) connection rod 122, and the lead-in rod 129 are coupled (integrated) together, and even if there is a temperature difference between the (first) connection rod 121, the (second) connection rod 122, and the lead-in rod 129, and there is a difference in the degree of deformation of each, the flexible curved plate 147 can flexibly absorb the difference in deformation in various semiconductor processes such as the plasma enhanced chemical vapor deposition process described above.

[0079] To this end, each of the constituent elements of the connection member 149 described above can be made of a metal material having excellent electrical conductivity, such as Cu, beryllium copper (BeCu), a metal coated with Au (Cu, beryllium copper), Au, or Ag, or the like. The elastic member 144 can be formed in an integrated manner by the first fastening portion 145, the second fastening portion 146, and the curved plate 147, and the thickness of the curved plate 147 can be less than the thickness of the first fastening portion 145 and the second fastening portion 146 for flexibility purposes.

[0080] In the first fastening portion 145 and the second fastening portion 146 of the elastic member 144, one or more screw holes can be provided. Based on a screw (Screw) fastened to the screw hole of the first fastening portion 145 and the screw hole of the first coupling member 141 corresponding thereto, and using the threads of the screw hole or the nut on the opposite side, the mutually spaced and opposite plates of the first coupling member 141 can be fastened, thereby fixing the (first) connection rod 121 inserted into the insertion hole on the side of the first coupling member 141.

[0081] Also, the second coupling member 142 has an insertion hole for coupling the (second) connection rod 122 and one or more screw holes on one side of the "L" shaped body, and one or more screw holes for coupling the third coupling member 143 and the lead-in rod 129 and the second fastening portion 146 on the other side. In other words, the end of the (second) connection rod 122 is inserted into the insertion hole on one side of the second coupling member 142, and based on a screw fastened to the screw hole, and using the threads of the screw hole or the nut on the opposite side, the mutually spaced and opposite plates of the second coupling member 142 can be fastened, thereby fixing the (second) connection rod 122.

[0082] And, to make the third coupling member 143 coupled with the lead-in rod body 129 and the second fastening part 146 on the other side of the "L" shaped body of the second coupling member 142, the screw hole of the second fastening part 146 on one side and the screw hole of the third coupling member 143 on the other side are formed to correspond to the screw hole of the second coupling member 142, and based on the screw rod fastened to the corresponding screw holes of the three members, and using the screw thread of the screw hole or the nut of the opposite side, the following fixing structure can be achieved: the third coupling member 143 and the second fastening part 146 are tightly coupled in a way that the body of the second coupling member 142 is located therebetween, at the same time, the lead-in rod body 129 is inserted between the groove 181 formed on the end side of the second coupling member 142 and the groove 182 formed on the end side of the third coupling member 143 to be able to achieve the fixation of the lead-in rod body 129.

[0083] On the other hand, in the ceramic susceptor 100 according to the present application, the connection rod bodies 121, 122 connected to the high frequency electrode 112 through the through-isolation plate 130 are separated into two, and connected (short-circuited) by the connection member 149 disposed inside the connection base 140, and the lead-in rod body 129 connected to the connection member 149 penetrates the lower surface of the connection base 140 in a sealed state and extends to be exposed to the outside.

[0084] On the other hand, in the ceramic susceptor 100 according to the present application, the connection rod bodies 121, 122 connected to the high frequency electrode 112 through the through-isolation plate 130 are separated into two, and connected (short-circuited) by the connection member 149 disposed inside the connection base 140, and the lead-in rod body 129 connected to the connection member 149 penetrates the lower surface of the connection base 140 in a sealed state and extends to be exposed to the outside. Figure 2

[0085] The cooling structure 190 includes an inlet 191 and an outlet 192 for circulating a cooling medium such as air, water, gas, or cooling oil. The cooling structure 190 can include a prescribed motor pump (not shown) to inject the cooling medium into the connection base 140 through the inlet 191 and discharge the cooling medium from the connection base 140 through the outlet 192.

[0086] And, the temperature sensor 180 can be connected to a control device (not shown) such as a computer, and the temperature inside the connection base 140 can be monitored through the display interface of the control device (not shown).

[0087] ​Further, a control device (not shown) can control the operation of a pump (not shown) according to the temperature value measured by the temperature sensor 180. For example, when the temperature value measured by the temperature sensor 180 is above a threshold value (for example, 80°C), the control device (not shown) cools the connection base 140 by operating the pump (not shown) connected to the inlet port 191 and the outlet port 192, and when the temperature value measured by the temperature sensor 180 is less than the threshold value (for example, 80°C), the pump (not shown) can be controlled to stop operating.

[0088] Also, as shown in the connection base 140 of the ceramic base 100 according to the present application, a fixing plate 150 for fixing the lead-in rod body 129 or other connection rod bodies can also be included. Figure 2

[0089] In other words, the lead-in rod body 129 and one or more rod bodies that pass through the inside of the shaft body 120 and penetrate the isolation plate 130 in a manner connected to the heat generating body 114 are fixed again by the fixing plate 150, so that short circuits caused by shaking or the like can be prevented, thereby maintaining safety. The lead-in rod body 129 and one or more rod bodies that pass through the inside of the shaft body 120 and penetrate the isolation plate 130 in a manner connected to the heat generating body 114 penetrate the fixing plate 150 and penetrate the lower surface of the connection base 140 to be exposed to the outside.

[0090] The above-described connection base 140, isolation plate 130, fixing plate 150, etc. can be a metal material such as aluminum (Al), or can also be made of a ceramic material as described above. In other words, the ceramic material can be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, Autoclaved lightweight concrete (AlC), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BN, SiO2, SiC, yttrium aluminum garnet (YAG), Mullite, AlF3, and preferably can be aluminum nitride (AlN). Further, the powder of the ceramic material can be formed into the shaft body 120 by molding, sintering, and each ceramic powder for this purpose can selectively contain yttria powder of about 0.1% to about 10%, preferably about 1% to about 5%. x C y

[0091] ​​Also, all the conductors of the connecting rod bodies (121, 122, etc.) and the inner core of the lead-in rod body 129 as described above can be in a form coated with the ceramic material as described above. In other words, preferably, the connecting rod bodies (121, 122, etc.) inside the shaft body 120 are coated with a tube of the ceramic material. Also, the connecting rod bodies that pass through the isolation plate 130, then pass through the fixing plate 150 and the exposed portion of the lower surface of the connecting base 140, and the connecting rod bodies 121, 122 that pass through the isolation plate 130 and then pass through the connecting member 149 can be in a form coated with a tube of the ceramic material as described above. Further, the lead-in rod body 129 that extends from the connecting member 149 to pass through the fixing plate 150 and the exposed portion of the lower surface of the connecting base 140 can be in a form coated with a tube of the ceramic material as described above.

[0092] As described above, according to the ceramic pedestal 100 of the present application, when two or more high-frequency electrode rod bodies (121, 122) inside the shaft body are connected within the connecting base 140, even if there is a difference in thermal expansion between the high-frequency electrode rod bodies (121, 122), the deformation thereof can be absorbed by the elastic member 144 (intermediate medium member having excellent elasticity) in the connecting member 149, so even if the high-frequency electric power increases, it is possible to prevent cracks in the high-frequency electrode rod bodies (121, 122), prevent short circuits due to oxidation, and prevent the generation of arcs or local heating in the high-frequency electrode portion, thereby maintaining constant electrical characteristics, so that the thin film in the substrate process does not become abnormal, and also the yield can be improved by stable semiconductor processes.

[0093] As described above, in the present application, specific matters such as specific components and limited examples and drawings have been described, but this is only provided to help understand the overall of the present application, and the present application is not limited to the described examples, and a person having ordinary skill in the art to which the present application pertains can make various modifications and changes within the scope of the essential characteristics of the present application. Therefore, the gist of the present application should not be determined only by the described examples, and all technical ideas of equivalent or equivalent changes to the appended claims should be interpreted as included in the scope of the present application.

Claims

1. A ceramic base, wherein, include: An insulating plate equipped with high-frequency electrodes; A shaft, one end of which is connected to the insulating plate, and the other end of which has an isolation plate; A connecting base, the upper part of which is connected to the other end of the shaft; The first rod and the second rod are connected to the high-frequency electrode and extend through the isolation plate and into the interior of the connecting base; as well as A connecting member connects the first rod and the second rod to the guide rod, wherein the first rod and the second rod are disposed within the connecting base and extend into the interior of the connecting base. Furthermore, the connecting member includes: The first connecting member is used to connect the first rod body; The second connecting member is used to connect the second rod; A third connecting member is used to connect the guide rod; and Elastic component, In the first connecting member, the second connecting member, and the third connecting member formed separately from each other, the first connecting member is connected to the elastic member, one side of the second connecting member is connected to the second rod, and the other side of the second connecting member is connected to the third connecting member, the elastic member, and the guide rod.

2. The ceramic base according to claim 1, wherein, The elastic member includes: The first fastening part is used to fasten the first rod body; A second fastening part is used to fasten the second rod and the guide rod; and A bent plate is located between the first fastener and the second fastener.

3. The ceramic base according to claim 1, wherein, The high-frequency electrode includes a first high-frequency electrode and a second high-frequency electrode. Furthermore, the first rod is electrically connected to the first high-frequency electrode, and the second rod is electrically connected to the second high-frequency electrode.

4. The ceramic base according to claim 1, wherein, The ceramic base also includes a temperature sensor for measuring the internal temperature of the connecting base.

5. The ceramic base according to claim 1, wherein, The ceramic base also includes a cooling structure for cooling the connecting base.

6. The ceramic base according to claim 1, wherein, The connecting base is in a sealed form. Furthermore, the connecting base includes an inlet and an outlet for circulating the cooling medium. Furthermore, the guide rod penetrates the sealed connecting base and is exposed to the outside.

7. The ceramic base according to claim 1, wherein, The ceramic base also includes a fixing plate for fixing the guide rod. Furthermore, the guide rod penetrates the fixing plate and the connecting base, thus being exposed to the outside.

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