Bone conduction speaker device

Abstract

The application discloses a bone conduction loudspeaker device, which comprises a core shell, a flexible circuit board, a key switch, an earphone core and an ear hook. The core shell comprises a peripheral side wall and a bottom end wall. The flexible circuit board is provided with a plurality of first pads and two second pads. The flexible circuit board comprises a main circuit board and a branch circuit board connected with the main circuit board. The key switch is attached to the main circuit board and connected to other first pads. The earphone core is connected to the two second pads through external wires. The ear hook is provided with a plurality of ear hook wires, which comprise two audio signal wires and at least two auxiliary signal wires. The two audio signal wires are respectively welded to the two first pads, and the at least two auxiliary signal wires are respectively welded to the other first pads. The plurality of first pads are closer to the ear hook than the two second pads. The two second pads are arranged at the end of the branch circuit board away from the main circuit board.

Description

[0001] This application is a divisional application of Chinese patent application No. 201910009904.3, filed on January 5, 2019, entitled "Bone Conduction Speaker Device". Technical Field

[0002] This application relates to the field of bone conduction technology, and in particular to a bone conduction speaker device. Background Technology

[0003] With the development of bone conduction technology, speaker devices based on this technology, such as headphones and MP3 players, have gradually entered the public eye. Bone conduction speakers are favored by consumers due to their open design and the fact that they do not damage the eardrum.

[0004] The internal housing of a bone conduction speaker contains the earphone drivers and other auxiliary functional modules, which need to be connected to the control circuit and battery via wiring to achieve the corresponding functions. However, as the functions of bone conduction speakers have become more complex, the number of wires that need to be accommodated inside the housing has increased significantly, thus occupying a considerable amount of internal space. Furthermore, the vibrations caused by multiple wires hanging inside the housing can lead to abnormal noises and affect the sound quality of the earphone drivers. Summary of the Invention

[0005] The main technical problem solved by this application is to provide a battery assembly and bone conduction speaker device that can optimize the wiring layout, save space in the core housing, and improve the sound quality of the headphone core to a certain extent.

[0006] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a bone conduction speaker device, comprising: a core housing; a flexible circuit board disposed inside the core housing, and having a plurality of first pads and two second pads spaced apart from the first pads, wherein the two second pads are connected to two corresponding first pads among the plurality of first pads via first flexible leads on the flexible circuit board, and external wires are further soldered onto the two second pads respectively; an auxiliary function module, mounted on the flexible circuit board, and connected to one of the plurality of first pads via second flexible leads on the flexible circuit board. The device has the following components: an earphone core, located inside the housing and connected to the two second pads via external wires; and an ear hook connected to the housing and provided with multiple ear hook wires. These multiple ear hook wires include two audio signal wires connected to the control circuit for transmitting audio signals to the earphone core, and at least two auxiliary signal wires connected to the control circuit for transmitting auxiliary signals to the control circuit. The two audio signal wires are respectively soldered to the two first pads connected to the second pads, and the at least two auxiliary signal wires are respectively soldered to other first pads among the multiple first pads.

[0007] The beneficial effects of this application are as follows: Unlike the prior art, this application provides a flexible circuit board inside the housing of the earphone, and further provides corresponding pads on the flexible circuit board. After the ear hook wires enter the housing, they are soldered to the corresponding pads, and further connected to the corresponding auxiliary function modules via the first and second flexible leads on the pads. This avoids the situation where multiple ear hook wires are directly connected to the auxiliary function modules, resulting in complex wiring inside the housing. This optimizes the wiring layout and saves space in the housing. Furthermore, when multiple ear hook wires are directly connected to the auxiliary function modules, the ear hook wires suspend inside the housing, which can easily cause vibrations and generate noise, affecting the sound quality of the earphone core. In this application, soldering the ear hook wires to the flexible circuit board and further connecting them to the corresponding auxiliary function modules reduces the impact of wire suspension on the sound quality of the earphone core, thereby improving the sound quality of the earphone core to a certain extent. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0009] Figure 1This is a schematic diagram of one embodiment of the bone conduction speaker device of this application;

[0010] Figure 2 This is a partial exploded view of one embodiment of the bone conduction speaker device of this application;

[0011] Figure 3 This is a partial exploded view of one embodiment of the bone conduction speaker device of this application;

[0012] Figure 4 This is a partial structural cross-sectional view of one embodiment of the bone conduction speaker device of this application;

[0013] Figure 5 This is a schematic diagram of the battery assembly in one embodiment of the bone conduction speaker device of this application;

[0014] Figure 6 This is a schematic diagram of the battery assembly in one embodiment of the bone conduction speaker device of this application;

[0015] Figure 7 This is a schematic diagram of the flexible circuit board wiring at the battery location in one embodiment of the bone conduction speaker device of this application.

[0016] Figure 8 This is a partial exploded view of one embodiment of the bone conduction speaker device of this application;

[0017] Figure 9 This is a partial structural cross-sectional view of one embodiment of the bone conduction speaker device of this application;

[0018] Figure 10 yes Figure 9 A magnified view of part A in the middle;

[0019] Figure 11 This is a first top view of the magnetic connector in one embodiment of the bone conduction speaker device of this application;

[0020] Figure 12 This is a second top view of the magnetic connector in one embodiment of the bone conduction speaker device of this application;

[0021] Figure 13 This is a third top view of the magnetic connector in one embodiment of the bone conduction speaker device of this application;

[0022] Figure 14 yes Figure 9 A magnified view of part B in the middle section;

[0023] Figure 15 This is a partial structural diagram of one embodiment of the bone conduction speaker device of this application;

[0024] Figure 16This is a partial exploded view of one embodiment of the bone conduction speaker device of this application;

[0025] Figure 17 This is a partial structural cross-sectional view of one embodiment of the bone conduction speaker device of this application;

[0026] Figure 18 yes Figure 17 A magnified view of part C in the middle;

[0027] Figure 19 This is a partial structural diagram of one embodiment of the bone conduction speaker device of this application;

[0028] Figure 20 This is a partial exploded view of one embodiment of the bone conduction speaker device of this application;

[0029] Figure 21 This is a partial structural cross-sectional view of one embodiment of the bone conduction speaker device of this application;

[0030] Figure 22 yes Figure 21 A magnified view of part D in the middle;

[0031] Figure 23 This is a partial structural cross-sectional view of one embodiment of the bone conduction speaker device of this application;

[0032] Figure 24 yes Figure 23 A magnified view of part E in the middle;

[0033] Figure 25 This is a schematic diagram of the speaker assembly of one embodiment of the bone conduction speaker device of this application;

[0034] Figure 26 This is another structural schematic diagram of the speaker assembly of one embodiment of the bone conduction speaker device of this application;

[0035] Figure 27 This is another structural schematic diagram of the speaker assembly of one embodiment of the bone conduction speaker device of this application;

[0036] Figure 28 This is a partial structural schematic diagram of the speaker assembly of one embodiment of the bone conduction speaker device of this application;

[0037] Figure 29 This is a partial cross-sectional view of the speaker assembly of one embodiment of the bone conduction speaker device of this application;

[0038] Figure 30 yes Figure 29 A magnified view of part F in the middle. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0040] Please see Figures 1 to 30 , Figures 1 to 30 The illustration depicts the bone conduction speaker device of this application. The bone conduction speaker device of this application can be a bone conduction-based headset, MP3 player, or other device with speaker functionality. Specifically, the bone conduction speaker device may include: a circuit housing 10, an ear hook 20, a rear hook 30, a speaker assembly 40, a control circuit 51, a battery 52, etc. The circuit housing 10 houses the control circuit 51 or the battery 52. ​​The speaker assembly 40 includes a mechanism housing 41 and an earphone core 42. The mechanism housing 41 is connected to the ear hook 20 and houses the earphone core 42. There can be two circuit housings 10, two speaker assemblies 40, and two ear hooks 20, corresponding to the user's left and right sides respectively. The mechanism housing 41 and the circuit housing 10 are respectively located at both ends of the ear hook 20, and the rear hook 30 is further located at the end of the circuit housing 10 furthest from the ear hook 20.

[0041] In one embodiment, a housing sleeve 21 is injection molded onto the ear hook 20. Specifically, the ear hook 20 includes a first elastic metal wire for supporting the shape of the ear hook 20, and an ear hook sleeve 22 is injection molded around the first elastic metal wire. The ear hook sleeve 22 further forms a housing sleeve 21 integrally formed with the ear hook sleeve 22 at the connection between the ear hook 20 and the circuit housing 10, that is, the housing sleeve 21 is located on the side of the ear hook sleeve 22 facing the circuit housing 10.

[0042] Similarly, the rear hanger 30 is injection molded with a housing sleeve 31. Specifically, the rear hanger 30 also includes a second elastic metal wire for supporting the shape of the rear hanger 30, and a rear hanger sleeve 32 injection molded around the second elastic metal wire. The rear hanger sleeve 32 further forms a housing sleeve 31 integrally formed with the rear hanger sleeve 32 at the connection between the rear hanger 30 and the circuit housing 10, that is, the housing sleeve 31 is located on the side of the rear hanger sleeve 32 facing the circuit housing 10.

[0043] It should be noted that the shell cover 21 and ear hook cover 22, as well as the shell cover 31 and back hook cover 32, can all be made of soft materials with a certain degree of elasticity, such as soft silicone or rubber, to provide users with a better tactile experience when wearing them.

[0044] Specifically, the circuit housing 10, housing sleeve 21, and housing sleeve 31 are respectively formed, such that the shape of the inner sidewall of the housing sleeve 21 matches the shape of at least a portion of the outer sidewall of the circuit housing 10 near the ear hook 20, and the shape of the inner sidewall of the housing sleeve 31 matches the shape of at least a portion of the outer sidewall of the circuit housing 10 near the rear hook 30. After the three are formed, the housing sleeve 21 is fitted onto the outer periphery of the circuit housing 10 near the ear hook 20 from the side of the circuit housing 10 facing the ear hook 20, and the housing sleeve 31 is fitted onto the outer periphery of the circuit housing 10 near the rear hook 30 from the side of the circuit housing 10 facing the rear hook 30, so that the circuit housing 10 can be covered by the housing sleeve 21 and the housing sleeve 31 together.

[0045] It should be noted that, since the ambient temperature during the molding of the housing sleeve 21 and housing sleeve 31 is relatively high, and the high temperature environment may cause certain damage to the control circuit 51 or battery 52 housed in the circuit housing 10, the circuit housing 10 and housing sleeve 21 and housing sleeve 31 are molded separately during the molding stage and then assembled together, instead of directly injection molding the housing sleeve 21 and housing sleeve 31 onto the periphery of the circuit housing 10. This avoids the damage to the control circuit 51 or battery 52 caused by the high temperature during one-piece injection molding, thereby reducing the adverse effects of the molding stage on the control circuit 51 or battery 52.

[0046] In one embodiment, the circuit housing 10 includes a main sidewall 11, an auxiliary sidewall 12, and an end wall 13 connected to each other. The circuit housing 10 can be a flat housing, and the flat circuit housing 10 includes a large main sidewall 11. When the user wears the bone conduction speaker, the two opposing main sidewalls 11 are respectively a sidewall that rests against the head and a sidewall opposite to the head that is located away from the head. The auxiliary sidewall 12 and the end wall 13 are both used to connect the two main sidewalls 11. The auxiliary sidewalls 12 are the two sidewalls facing the upper and lower sides of the user's head when the user wears the device; the end walls 13 are the opposing sidewalls of the circuit housing 10, respectively near one end of the ear hook 20 and one end of the back hook 30, facing the front and back sides of the user's head when the user wears the device. The main sidewalls 11, auxiliary sidewalls 12, and end walls 13 are connected to each other to jointly constitute the circuit housing 10.

[0047] Specifically, the housing sleeve 21 includes an open end 211, which extends from the circuit housing 10 toward the ear hook 20 and is fitted onto the circuit housing 10, covering the end wall 13 of the circuit housing 10 facing the ear hook 20, as well as the portions of the main sidewall 11 and auxiliary sidewall 12 near the ear hook 20. The housing sleeve 31 includes an open end 311, which extends from the circuit housing 10 toward the rear hook 30 and is fitted onto the circuit housing 10, covering the end wall 13 of the circuit housing 10 facing the rear hook 30, as well as the portions of the main sidewall 11 and auxiliary sidewall 12 near the rear hook 30. The open ends 211 and 311 then abut against each other on the main sidewall 11 and auxiliary sidewall 12 of the circuit housing 10 to cover the circuit housing 10.

[0048] In one application scenario, the housing sleeves 21 and 31 do not completely cover the entire circuit housing 10. For example, exposed holes can be opened at the positions corresponding to buttons or power interfaces to expose the corresponding structures for user convenience.

[0049] Among them, after the housing sleeve 21 and housing sleeve 31 are fitted around the circuit housing 10, they can be further fixed to the circuit housing 10 by certain means, thereby fixing the circuit housing 10 and the corresponding housing sleeve together.

[0050] Specifically, in one embodiment, positioning protrusions 212 and 312 are integrally formed on the inner surfaces of the housing sleeve 21 and the main sidewall 11, respectively, and positioning grooves 111 and 112 are respectively provided on the outer surface of the main sidewall 11.

[0051] The positioning protrusion 212 is disposed on the inner sidewall near the opening end 211. The positioning protrusion 212 can be an annular protrusion surrounding the inner sidewall of the housing sleeve 21, or it can be multiple protrusions spaced apart on the inner sidewall of the housing sleeve 21, depending on actual needs. In this embodiment, there are two positioning protrusions 212, respectively disposed on the inner sidewalls of the two main sidewalls 11 of the housing sleeve 21 corresponding to the circuit housing 10; similarly, there are also two positioning protrusions 312, respectively disposed on the inner sidewalls of the housing sleeve 31 corresponding to the two main sidewalls 11 of the circuit housing 10.

[0052] Specifically, after the housing sleeve 21 and housing sleeve 31 are respectively fitted onto the two sides of the circuit housing 10, the positioning protrusion 212 is further embedded into the positioning groove 111, and the positioning protrusion 312 is embedded into the positioning groove 112, so that the open end 211 of the housing sleeve 21 and the open end 311 of the housing sleeve 31 elastically abut together, thereby covering the circuit housing 10.

[0053] Furthermore, in one embodiment, the outer wall 313 of the housing cover 31 covering the end wall 13 of the circuit housing 10 is inclined relative to the auxiliary side wall 12. Specifically, when worn by the user, the outer wall 313 of the housing cover 31 is inclined in a direction gradually away from the back hanger 30 from the side near the upper side of the user's head to the side near the lower side of the user's head.

[0054] The positioning protrusions 212 and 312 can be arranged in strips along the opening ends 211 and 311 respectively, and can be inclined relative to the auxiliary sidewall 12. Furthermore, the joint seam of the housing sleeve 21 and housing sleeve 31 on the main sidewall 11 of the circuit housing 10 can also be inclined relative to the auxiliary sidewall 12. The inclination direction of the positioning protrusions 212 and 312, as well as the joint seam of the housing sleeve 21 and housing sleeve 31 on the main sidewall 11 of the circuit housing 10, can all be consistent with the inclination direction of the outer wall 313 of the area of ​​the housing sleeve 31 covering the end wall 13 of the circuit housing 10, thereby making the bone conduction speaker device more consistent in appearance.

[0055] In one application scenario, the coverage area of ​​either housing sleeve 21 or housing sleeve 31 on the circuit housing 10 is not less than half of the coverage area of ​​the other on the circuit housing 10. For example, the coverage area of ​​housing sleeve 21 on the circuit housing 10 is not less than half of the coverage area of ​​housing sleeve 31 on the circuit housing 10, or the coverage area of ​​housing sleeve 31 on the circuit housing 10 is not less than half of the coverage area of ​​housing sleeve 21 on the circuit housing 10. The coverage areas of housing sleeve 21 and housing sleeve 31 on the circuit housing 10, and the ratio between them, can be set to other values ​​as needed, such as each occupying half; no specific limitation is made here.

[0056] The circuit housing 10 and the rear mount 30 can be integrally formed, or they can be connected together by plugging, snapping or other methods.

[0057] In one embodiment, the rear hanger 30 further includes a connector 33 disposed toward the circuit housing 10, and a housing sleeve 31 is fitted over at least a portion of the connector 33. Specifically, the connector 33 may be injection molded onto the end of the second elastic metal wire, and the rear hanger sleeve 32 may be further injection molded onto the second elastic metal wire and the exterior of the portion of the connector 33, with the housing sleeve 31 integrally formed at the connector 33, thereby allowing the housing sleeve 31 to further cover the periphery of the area of ​​the connector 33 not covered by the rear hanger sleeve 32.

[0058] Furthermore, the circuit housing 10 is provided with a connector hole 14 facing the rear hanger 30. The connector hole 14 can be provided on the end wall 13 of the circuit housing 10 near the rear hanger 30 and extends towards the rear hanger 30 on the side of the end wall 13 near an auxiliary side wall 12.

[0059] The connector 33 is at least partially inserted into the connector hole 14. Slots 331 are respectively provided on opposite sides of the connector 33, perpendicular to the insertion direction of the connector 33 relative to the connector hole 14. The two slots 331 are spaced apart and symmetrically arranged on both sides of the connector 33. Furthermore, both slots 331 can communicate with the corresponding sidewall of the connector 33 in a direction perpendicular to the insertion direction.

[0060] Accordingly, the side wall 15 of the connector 14 is provided with through holes 151 corresponding to the positions of the two slots 331. The side wall 15 of the connector 14 is located around the connector 14 and faces the lower side of the user's head when worn.

[0061] The bone conduction speaker further includes a fixing member 53, which includes two parallel pins 531 and a connecting portion 532 for connecting the pins 531. In this embodiment, the two pins 531 are arranged in parallel, and the connecting portion 532 can be vertically connected to the same side of the two pins 531, thereby forming a U-shaped fixing member 53.

[0062] Furthermore, the pin 531 can be inserted into the slot 331 through the through hole from the outer side wall 15 of the plug hole 14, thereby blocking the connection part 532 outside the plug hole 14, thus realizing the connection and fixation between the circuit housing 10 and the rear hanger 30.

[0063] Furthermore, in one embodiment, a through hole 161 opposite to the through hole 151 is further provided on the side wall 16 that defines the insertion hole 14, and the pin 531 is further inserted into the through hole 161 through the slot 331. The side wall 16 can be an auxiliary side wall 12 of the circuit housing 10 near the insertion hole 14, and when the bone conduction speaker is in the wearing state, the auxiliary side wall 12 faces the upper side of the user's head.

[0064] In this embodiment, the pin 531 is inserted into the slot 331 through the through hole 151, and further inserted into the through hole 161 through the slot 331. That is to say, the pin 531 can completely penetrate and connect the opposite side walls of the connector 33 of the rear hanger 30 and the connector 33 together, thereby making the connection between the circuit housing 10 and the rear hanger 30 more stable.

[0065] Furthermore, in one embodiment, the connector 33 is further divided into a first connector segment 332 and a second connector segment 333 along the insertion direction of the connector 33 relative to the connector hole 14. In the cross-sectional direction perpendicular to the insertion direction of the connector 33 relative to the connector hole 14, the cross-section of the first connector segment 332 is larger than the cross-section of the second connector segment 333.

[0066] Specifically, the rear-mounted protective sleeve 32 can be injection molded onto the first connector segment 332 of the connector end, and the housing sleeve 31 can be integrally injection molded at the connection between the first connector segment 332 and the second connector segment 333. Further, a slot 331 is provided on the second connector segment 333, and the second connector segment 333 is inserted into the connector hole 14, while the connector end 33 is exposed outside the connector hole 14.

[0067] Further, in one embodiment, the first connector segment 332 is provided with a first wiring groove 3321 disposed along the insertion direction of the connector end 33 relative to the connector hole 14, and the second connector segment 333 is provided with a second wiring groove 3331 extending perpendicular to the insertion direction and penetrating at least one outer side surface on its outer end surface away from the first connector segment 332. Specifically, the first wiring groove 3321 is disposed on the side of the first connector segment 332 near the auxiliary sidewall 12 used to define the connector hole 14, and penetrates both end surfaces of the first connector segment 332 along the insertion direction of the connector end 33 relative to the connector hole 14. The second wiring groove 3331 can penetrate the two outer sides of the second connector segment 333 perpendicular to the extension direction of the second wiring groove 3331.

[0068] In addition, a wiring groove 162 is provided on the inner side wall of the connector 14, which is connected to the first wiring groove 3321 at one end and to the second wiring groove 3331 at the other end. The wiring groove 162 is specifically formed by the recess of the inner wall surface of the side wall 16.

[0069] Furthermore, the circuit housing 10 includes an inner partition wall 17 disposed inside the housing to form a receiving cavity 18 spaced apart from the connector hole 14. Specifically, the main sidewall 11, auxiliary sidewall 12, and end wall 13 of the circuit housing 10 together constitute a receiving space, and the inner partition wall 17 divides the receiving space into two parts: the receiving cavity 18 and the connector hole 14. A wiring hole 171 is further provided on the inner partition wall 17 to connect the connector hole 14 and the receiving cavity 18.

[0070] The bone conduction speaker is further provided with a rear-mounted wire 34, which passes through the rear mount 30 and is connected at both ends to the control circuit 51 and the battery 52, respectively. Specifically, the rear-mounted wire 34 passes sequentially from the rear mount 30 through the first wiring groove 3321, the wiring groove 162 and the second wiring groove 3331, and passes through the wiring hole 171 to enter the receiving cavity 18, so as to connect to the control circuit 51 or the battery 52.

[0071] In one embodiment, the circuit housing 10 includes a first circuit housing 10a and a second circuit housing 10b. The bone conduction speaker also includes a flexible circuit board 54, which can be housed together with the battery 52 within the receiving cavity 18 of the first circuit housing 10a. The flexible circuit board 54 can be a flexible printed circuit (FPC). The battery 52 has a positive terminal and a negative terminal.

[0072] Specifically, the flexible circuit board 54 includes a first board body 541 and a second board body 542. One end of the first board body 541 is fixed to the battery 52, and the other end is connected to the second board body 542. The flexible circuit board 54 can be a single unit, with the first board body 541 and the second board body 542 being two regions of the unit. The second board body 542 may have pads and flexible traces connecting the pads, while the first board body 541 may only have flexible traces to connect the corresponding pads on the second board body 542 to the battery 52. ​​Because the first board body 541 only has flexible traces, it can be bent, such as... Figure 6 As shown, the position of the flexible circuit board 54 can be adjusted according to requirements.

[0073] The second board 542 has multiple pads spaced apart, including two pads 543 and multiple pads 544. Furthermore, the first board 541 and the second board 542 share two continuous flexible leads 545, and the two pads 543 are electrically connected to the positive and negative terminals of the battery 52 via these two flexible leads 545, respectively.

[0074] In addition, the multiple pads 544 can be divided into at least two groups. The number of pads 544 in each group can be set according to the requirements. For example, the number of pads 544 in each group can be two, and the two pads 544 are electrically connected to each other by flexible leads 546 provided on the second board body 542. The two pads 544 in each group can be connected to functional components through wires, and then the two corresponding functional components can be connected together through flexible leads 546.

[0075] In the above method, on the one hand, the pads used for circuit connection are all set on the second board 542 of the flexible circuit board 54, and connected to the battery 52 through the first board 541 of the flexible circuit board 54. Thus, the first board 541 can be bent according to space requirements to place the second board 542, thereby optimizing the space utilization of the accommodating cavity 18 of the first circuit housing 10a and improving space utilization. On the other hand, the two pads 543 can be directly connected to the positive and negative terminals of the battery 52 through the flexible leads 545 on the flexible circuit board 54, without the need to set additional pads to lead out the positive and negative terminals of the battery 52, thereby reducing the number of pads and simplifying the structure and process.

[0076] In one embodiment, the first plate 541 is further folded so that the second plate 542 is attached to the side surface of the battery 52, so that the first plate 541 and the battery 52 are stacked, thereby greatly reducing the space occupied by the battery 52 and the flexible circuit board 54.

[0077] Specifically, the battery 52 may include a cell 521, which includes a body region 5211 and a sealing region 5212. The body region 5211 and the sealing region 5212 are laid flat, and the thickness of the body region 5211 is greater than the thickness of the sealing region 5212, so that the side surface of the sealing region 5212 and the side surface of the body region 5211 are stepped.

[0078] Specifically, the sealing area 5212 and the body area 5211 are arranged in a stepped manner on the side surface in the thickness direction of the battery cell 521, so that the second plate 542 can utilize the space formed by the body area 5211 and the sealing area 5212 of the battery cell 521 without having to set up a separate space to place the flexible circuit board 54, thereby further improving the space utilization rate.

[0079] In one embodiment, the battery 52 further includes a rigid circuit board 522, which is disposed on the side surface of the sealing area 5212 of the cell 521. Specifically, the positive and negative terminals are disposed on the rigid circuit board 522, and the rigid circuit board 522 is further provided with a protection circuit (not shown) to provide overload protection for the battery 52.

[0080] In this embodiment, the end of the first plate 541 away from the second plate 542 is attached and fixed to the rigid circuit board 522, thereby connecting the two flexible leads on the first plate 541 to the positive and negative terminals on the rigid circuit board 522. Specifically, the first plate 541 and the rigid circuit board 522 can be directly pressed together during the manufacturing stage.

[0081] Furthermore, the shapes of the first plate 541 and the second plate 542 can be configured according to actual conditions. In this embodiment, the shape of the first plate 541 matches the shape of the sealing area 5212 of the battery cell 521, both being elongated rectangles. The shape of the second plate 542 can also be rectangular, and it is disposed at one end of the length direction of the first plate 541, perpendicular to the first plate 541 along its length direction. Furthermore, the first plate 541 can be connected to the middle region of the second plate 542 along its length direction, thereby making the first plate 541 and the second plate 542 T-shaped.

[0082] Furthermore, on the second board 542, the pads 543 and 544 can be arranged in various ways. For example, all pads can be arranged at intervals along a straight line, or they can be arranged at intervals in other shapes.

[0083] In this embodiment, two pads 543 are spaced apart along the length of the second plate 542 in the middle region of the second plate 542, and multiple pads 544 are further distributed on both sides of the two pads 543 along the length of the second plate 542, and the pads 544 in each group are arranged adjacent to each other.

[0084] In this embodiment, the pads 544 in each group are arranged at intervals along the width direction of the second board 542 and staggered from each other along the length direction of the second board 542, so that the pads 544 in each group can be arranged in a stepped interval. In this way, on the one hand, it can avoid the formation of a flush interval area between two adjacent groups of pads 544, thereby making the strength distribution on the second board 542 more uniform, reducing the occurrence of bending between two adjacent groups of pads 544, reducing the probability of the second board 542 breaking due to bending, and thus protecting the second board 542; on the other hand, it can increase the distance between the pads, which facilitates soldering and reduces the occurrence of short circuits between different pads.

[0085] This application also provides a battery assembly. In one embodiment, the battery assembly includes the battery 52 and the flexible circuit board 54 described in the above embodiments. The battery assembly in this embodiment can be applied to devices such as headphones and MP3 players that require circuit switching at the battery 52, for example, it can be used in the bone conduction speaker device described in this application.

[0086] Furthermore, in the embodiment of the bone conduction speaker device of this application, the rear hook 30 is inserted into one end of the first circuit housing 10a and is provided with a plurality of rear hook wires 34; the ear hook 20 is inserted into the other end of the first circuit housing 10a and is provided with a plurality of ear hook wires 23.

[0087] Each set of pads 544 includes two pads 544, and the ear-hook wire 23 and its corresponding rear-hook wire 34 are electrically connected to the two pads 544 in the same set of pads 544 respectively. Then, the functional components connected to the rear-hook wire 34 and the functional components connected to the ear-hook wire 23 are connected together by the flexible lead 546 connecting the two pads 544 in each set.

[0088] In one embodiment, the mechanism housing 41 further accommodates auxiliary function modules (not shown) such as push-button switch 431. In addition, the control circuit 51 is accommodated in the second circuit housing 10b, and the second board 542 has four sets of solder pads 544.

[0089] The ear hook cable 23 includes two audio signal cables 231, namely a first ear hook cable 2311 and a second ear hook cable 2312 connected to the earphone core 42. The rear cable cable 34 includes a first rear cable cable 341 and a second rear cable cable 342 connected to the control circuit 51 and used to transmit audio signals to the earphone core 42. Further, the first ear hook cable 2311 and the first rear cable cable 341, the second ear hook cable 2312 and the second rear cable cable 342 are respectively connected to different pads in different groups of two sets of pads 544. Specifically, the first ear hook cable 2311 and the first rear cable cable 341 are respectively connected to two pads 544 in the same set of pads 544, and the second ear hook cable 2312 and the second rear cable cable 342 are respectively connected to two pads 544 in another set of pads 544, thereby electrically connecting the earphone core 42 and the control circuit 51 to achieve audio signal transmission.

[0090] In addition, the ear hook wire 23 also includes at least two auxiliary signal wires 232, such as a third ear hook wire 2321 and a fourth ear hook wire 2322 connected to the push-button switch 431. Correspondingly, the rear ear hook wire 34 also includes a third rear ear hook wire 343 and a fourth rear ear hook wire 344 connected to the control circuit 51 for transmitting button signals to the push-button switch 431. Further, the third ear hook wire 2321 and the third rear ear hook wire 343, and the fourth ear hook wire 2322 and the fourth rear ear hook wire 344 are respectively connected to different pads 544 in different groups of the two sets of pads 544. These two sets of pads 544 are different from the two sets of pads 544 mentioned above that transmit audio signals to the earphone core 42. Furthermore, the third ear hook wire 2321 and the third rear hook wire 343 are respectively connected to two pads 544 in the same set of pads 544, and the fourth ear hook wire 2322 and the fourth rear hook wire 344 are respectively connected to two pads 544 in another set of pads 544, thereby electrically connecting the push button switch 431 and the control circuit 51 together to realize the transmission of push button signals.

[0091] Furthermore, the rear-mounted wire 34 also includes a fifth rear-mounted wire 345 and a sixth rear-mounted wire 346 connected to the control circuit 51 and used to supply power to the control circuit 51. The fifth rear-mounted wire 345 and the sixth rear-mounted wire 346 are respectively connected to two pads 543, thereby connecting the battery 52 to the control circuit 51.

[0092] In one embodiment, the bone conduction speaker further includes a magnetic connector 55, which can be used as a power interface to charge the bone conduction speaker in conjunction with the power interface of a charger. Specifically, when charging the bone conduction speaker, the magnetic connector 55 and the corresponding connector of the charger form a system, and the two are structurally matched so that they can be attracted together, thereby establishing an electrical connection to charge the bone conduction speaker. In this embodiment, the magnetic connector 55 includes: a magnetic attraction ring 551, an insulating base 552, and a first terminal 553 and a second terminal 554.

[0093] The magnetic adsorption ring 551 can be a magnet, with different magnetic polarities at its two opposite ends. Correspondingly, the charger's corresponding connector has a magnetic adsorption structure corresponding to the magnetic adsorption ring 551. This magnetic adsorption structure can be made of a magnetic material, such as iron, and the two can be attracted together regardless of the magnetic polarity of the outer end face of the magnetic adsorption ring 551. Alternatively, the magnetic adsorption structure can also be a magnet; in this case, they can only be attracted when the magnetic polarity of the outer end face of the magnetic adsorption structure is opposite to that of the outer end face of the magnetic adsorption ring 551. Furthermore, the magnetic connector 55 and the corresponding connector can be attracted to each other in a preset relative position through magnetic adsorption, thereby connecting their corresponding terminals and establishing an electrical connection.

[0094] Specifically, the outer end face of the magnetic adsorption ring 551 can be annular, and it can be adsorbed together with the magnetic adsorption structure of the corresponding connector through the annular end face. It should be noted that, since the annular ring is "hollow" in design, when the magnetic adsorption ring 551 is adsorbed and constrained by the annular magnetic adsorption structure of the corresponding connector, the magnetic adsorption ring 551 can be accurately combined with the corresponding magnetic adsorption structure.

[0095] The insulating base 552 is at least partially inserted into the magnetic adsorption ring 551 to fix the magnetic adsorption ring 551. The insulating base 552 has at least two receiving holes 5521, the extension direction of which is consistent with the height direction of the insulating base 552, and at least penetrates the outer end face of the insulating base 552. The insulating base 552 may be made of insulating materials such as PC or PVC.

[0096] Furthermore, the first terminal 553 and the second terminal 554 are respectively arranged in a columnar shape, with the number matching the number of receiving holes 5521 on the insulating base 552, so as to be inserted into their respective receiving holes 5521, and with the corresponding end face exposed through the receiving hole 5521 at one end of the top surface of the insulating base 552, thus visible from the top surface of the insulating base 552 and flush with the top surface of the insulating base 552, to form the first contact surface 5531 and the second contact surface 5541. The first terminal 553 and the second terminal 554 correspond to the positive and negative terminals of the power supply, respectively, and are used to supply power to the electronic device by connecting the positive and negative terminals of the power supply. Correspondingly, the first contact surface 5531 and the second contact surface 5541 can achieve electrical connection with the corresponding connector through contact.

[0097] In the above method, when the magnetic connector 55 is used in conjunction with the corresponding connector, it can be attracted and constrained from different directions along the direction of the "hollow" annular surface of the magnetic adsorption ring 551. This reduces the possibility of misalignment or deviation when the "solid" surfaces are adsorbed, thus preventing accurate positioning. By aligning the magnetic adsorption ring 551, the first contact surface 5531 and the second contact surface 5541 are accurately positioned to achieve matching connection with the corresponding connector, thereby improving the accuracy of docking with the corresponding connector.

[0098] In one embodiment, the insulating base 552 includes a support portion 5522 and an insertion portion 5523. Specifically, the support portion 5522 and the insertion portion 5523 are arranged along the extending direction of the receiving hole 5521. The cross-section of the support portion 5522 is larger than the cross-section of the insertion portion 5523, thereby forming a support platform 55221 at the connection between the two.

[0099] The shape of the outer wall near the end of the insertion portion 5523 matches the shape of the inner wall of the magnetic adsorption ring 551, allowing the insertion portion 5523 to be inserted into the magnetic adsorption ring 551 and to fix the magnetic adsorption ring 551 in place. The two ends of the receiving hole 5521 of the insulating base 552 penetrate the end faces of the insertion portion 5523 and the support portion 5522 away from each other, respectively, so that the first terminal 553 and the second terminal 554 penetrate the entire insulating base 552, exposing the first contact surface 5531 and the second contact surface 5541 on the outer end face of the insertion portion 5523 away from the support portion 5522. Furthermore, the first terminal 553 and the second terminal 554 can also extend out from the outer end face of the support portion 5522 away from the insertion portion 5523 for further connection to the internal circuitry.

[0100] Specifically, the insertion part 5523 can be inserted into the ring of the magnetic adsorption ring 551 from the end away from the support part 5522, so that the magnetic adsorption ring 551 and its outer end face opposite to each other are supported on the support platform 55221. The size of the outer side of the magnetic adsorption ring 551 can be consistent with the size of the outer side of the support part 5522, so that the structure of the magnetic connector is more uniform.

[0101] Furthermore, in one embodiment, the magnetic connector 55 further includes a housing 555, which can be sleeved on the outer periphery of the insulating base 552 and the magnetic adsorption ring 551, so that the entire magnetic connector 55 becomes a whole, thereby facilitating the further assembly of the magnetic connector 55 onto the power interface of the bone conduction speaker.

[0102] The shell 555 can be made of a metal material that is not attracted by a magnetic field, such as copper, aluminum, or aluminum alloy, or plastic material; no specific limitation is made here.

[0103] In this embodiment, metal is used as the housing 555 of the magnetic connector 55, so that it can be made thin while meeting the strength requirements, thereby reducing the space occupied.

[0104] Specifically, the housing 555 includes a cylindrical body 5551 and a flange 5552 disposed at one end of the cylindrical body 5551 and protruding into the interior of the cylindrical body 5551, such that one end of the housing 555 with the flange 5552 is partially open and the other end is completely open. The inner surface of the cylinder 5551 is shaped to match the outer surface of the magnetic adsorption ring 551 and the support portion 5522 of the insulating base 552. The flange 5552 at the partially open end can cover the magnetic adsorption ring 551, exposing the first contact surface 5531 and the second contact surface 5541 of the first terminal 553 and the second terminal 554. This allows the housing 555 to be fitted around the insulating base 552, the first terminal 553, the second terminal 554 and the magnetic adsorption ring 551 through the fully open end. The flange 5552 covers the periphery of the end of the magnetic adsorption ring 551 away from the support portion 5522, and the first contact surface 5531 and the second contact surface 5541 are exposed through the partially open end for further electrical connection with the corresponding connector.

[0105] In one application scenario, the outer end face of the insertion portion 5523 of the insulating base 552, away from the support portion 5522, protrudes relative to the end of the magnetic adsorption ring 551 away from the support portion 5522. In this case, the shape of the partial opening formed by the flange 5552 can match the shape of the periphery of the insertion portion 5523, so that the end of the insertion portion 5523 away from the support portion 5522 can pass through the partial opening of the housing 555 and extend to the outside of the housing 555.

[0106] In another application scenario, the outer end face of the insertion portion 5523 of the insulating base 552, away from the support portion 5522, is recessed relative to the top surface of the flange 5552.

[0107] It should be noted that the magnetic connector 55 in this embodiment can be applied to the power interface of an electronic device or the power interface of a charger, thereby cooperating with the power interface of the corresponding charger or the power interface of the electronic device to supply power to the electronic device. In the above method, by setting the top surface of the insulating base 552 to protrude or be recessed relative to the top surface of the flange 5552, the magnetic connector 55 can protrude into the corresponding connector, thereby forming a certain plug-in relationship between the two, so as to make the connection between the two more stable.

[0108] Furthermore, in one embodiment, the outer peripheral wall of the support 5522 and the inner peripheral wall of the cylinder 5551 may be provided with mutually cooperating snap-fit ​​structures. Through the snap-fit ​​structure, the housing 555 is more securely fitted onto the insulating base 552 and the magnetic adsorption ring 551, thereby making the structure of the magnetic connector 55 more stable.

[0109] Specifically, in one application scenario, a through groove 55511 is provided on each of the two opposite outer surfaces of the outer peripheral wall of the cylinder 5551. Correspondingly, a buckle 55222 is provided on the support part 5522 at the corresponding position of the two through grooves 55511. When assembling the magnetic connector 55, the housing 555 can be sleeved on the periphery of the insulating base 552, and the buckle on the support part 5522 can be engaged on the side wall of the corresponding through groove 55511, thereby fixing the housing 555 to the periphery of the outer peripheral wall of the support part 5522.

[0110] It should be noted that the specific shape of the magnetic adsorption ring 551 in the above embodiments can be set according to different needs.

[0111] In one embodiment, the outer end face of the magnetic adsorption ring 551 may be rotationally symmetrical with respect to a preset point of symmetry. When the magnetic adsorption ring 551 rotates symmetrically, the first contact surface 5531 and the second contact surface 5541 rotate with the magnetic adsorption ring 551, and the first contact surface 5531 and the second contact surface 5541 before rotation at least partially overlap with the first contact surface 5531 and the second contact surface 5541 after rotation. That is, the surface formed by the first contact surface 5531 and the second contact surface 5541 may also be rotationally symmetrical with respect to a preset point of symmetry, or nearly rotationally symmetrical. The shape of the outer end face of the magnetic adsorption ring 551 and the angle of rotational symmetry may be determined according to the arrangement of the first contact surface 5531 and the second contact surface 5541.

[0112] Specifically, the outer end face of the magnetic adsorption ring 551 can be set as a circular ring, an elliptical ring, or a rectangular ring, as long as it can be consistent with the arrangement of the first contact surface 5531 and the second contact surface 5541 so that the first contact surface 5531 and the second contact surface 5541 before symmetrical rotation can partially overlap with the second contact surface 5541 after symmetrical rotation.

[0113] In the above manner, since the outer end face of the magnetic adsorption ring 551 is rotationally symmetrical with respect to the preset symmetry point, the magnetic adsorption ring 551 can return to its position before the symmetrical rotation after symmetrical rotation. On the one hand, when assembling the magnetic connector 55, the magnetic adsorption ring 551 can have at least two relative assembly positions with respect to the first contact surface 5531 and the second contact surface 5541, which facilitates assembly. On the other hand, when the magnetic connector 55 is used in a power interface, the magnetic connector 55 can be connected to the corresponding interface at multiple rotation angles to achieve normal power supply to the electronic device, which is convenient to use.

[0114] Specifically, such as Figure 10 In one embodiment, the magnetic adsorption ring 551 can be a ring-shaped design centered on a point of symmetry, and the first contact surface 5531 and the second contact surface 5541 are respectively circular or ring-shaped designs that are concentrically arranged with the magnetic adsorption ring 551 and nested with each other.

[0115] In this way, when the magnetic adsorption ring 551 rotates symmetrically at any angle around its center, the first contact surface 5531 and the second contact surface 5541 before rotation can overlap with the first contact surface 5531 and the second contact surface 5541 after rotation. Therefore, during assembly, the magnetic adsorption ring 551 only needs to be concentrically fitted around the insertion portion 5523 of the insulating base 552, without needing to check other positions. Similarly, when aligning the magnetic connector 55 with the corresponding connector, simply aligning the magnetic adsorption ring 551 with the magnetic adsorption structure of the corresponding connector allows the first contact surface 5531 and the second contact surface 5541 to be connected to the positive and negative terminals of the corresponding interface, without further calibration, thus facilitating user operation.

[0116] In one implementation, such as Figure 11 The magnetic adsorption ring 551 is 180 degrees rotationally symmetrical with respect to the symmetry point. That is, when the magnetic adsorption ring 551 is rotated 180 degrees with respect to the symmetry point, the first contact surface 5531 and the second contact surface 5541 before rotation and the first contact surface 5531 and the second contact surface 5541 after rotation at least partially overlap.

[0117] The magnetic adsorption ring 551 has different dimensions in the first and second directions, which pass through the symmetrical point and are perpendicular to each other. For example, the outer end face of the magnetic adsorption ring 551 can be elliptical or rectangular, etc., without specific limitation here.

[0118] In one application scenario, the dimension in the first direction is larger than the dimension in the second direction. There can be one first contact surface 5531, which is set at the symmetrical point of the magnetic adsorption ring 551. There can be two second contact surfaces 5541, so that when the magnetic adsorption ring 551 rotates relative to the symmetrical point, the two second contact surfaces 5541 rotate relative to the first contact surface 5531, and when the magnetic adsorption ring 551 rotates 180 degrees, the two second contact surfaces 5541 exchange positions.

[0119] Furthermore, the two second contact surfaces 5541 can be arranged on both sides of the symmetrical point along the first direction, and when the magnetic adsorption ring 551 rotates 180 degrees, either of the two second contact surfaces 5541 before rotation will at least partially overlap with the other second contact surface 5541 after rotation. Since both contact surfaces are arranged along the first direction, before and after rotation, the two second contact surfaces 5541 are located on the same straight line and their positions are interchanged, that is, one of the second contact surfaces 5541 is located on the other second contact surface 5541 before rotation after rotation. Therefore, when either of the two second contact surfaces 5541 before rotation at least partially overlaps with the other second contact surface 5541 after rotation, the two second contact surfaces 5541 at least partially overlap before and after rotation.

[0120] Specifically, the first contact surface 5531 and the two second contact surfaces 5541 can be rotated symmetrically with respect to a symmetrical point by 180 degrees. That is, the first contact surface 5531 and the second contact surface 5541 are rotated symmetrically with respect to the center point of the first contact surface 5531 by 180 degrees. This allows the first contact surface 5531 and the second contact surface 5541 before and after the symmetrical rotation to completely overlap, while they cannot completely overlap when rotated by other degrees.

[0121] The shape of the first contact surface 5531 and the shape of the second contact surface 5541 can be the same or different, but the shapes of the two second contact surfaces 5541 must correspond to each other. For example, the first contact surface 5531 and the second contact surface 5541 can both be circular surfaces, or other surfaces that can completely overlap after rotating 180 degrees around the center point of the first contact surface 5531.

[0122] In this manner, as the magnetic adsorption ring 551 rotates 180° relative to the symmetrical point, it faces two opposite directions. Simultaneously, the first contact surface 5531 and the second contact surface 5541 before the 180° rotation at least partially overlap with the first contact surface 5531 and the second contact surface 5541 after the rotation. Therefore, when assembling the magnetic connector 55, the magnetic adsorption ring 551 can be fitted onto the periphery of the insertion portion 5523 of the insulating base 552, which is provided with the first terminal 553 and the second terminal 554, in both opposite directions, facilitating assembly. Furthermore, when using the magnetic connector 55 to mate with the corresponding connector, mating can also be achieved in both opposite directions, thus providing convenience for the user.

[0123] In one embodiment, the magnetic adsorption ring 551 is divided into at least two ring segments 5511 along the circumference, wherein the outer end faces of adjacent ring segments 5511 have different magnetic polarities.

[0124] The division of the ring segment 5511 can be carried out according to certain rules. For example, when the outer end face of the magnetic adsorption ring 551 is circular, the magnetic adsorption ring 551 can be divided equally along the radial direction of the circular shape. For example, it can be divided into four equal parts to obtain four quarter-circular ring segments 5511 with the same shape and symmetrical distribution; or multiple ring segments 5511 of different shapes can be randomly divided irregularly, without specific limitations.

[0125] Specifically, in actual use, the first contact surface 5531 and the second contact surface 5541 need to contact the exposed surfaces of the corresponding terminals of the corresponding connector to establish an electrical connection between the magnetic connector 55 and the corresponding connector, thereby supplying power to the bone conduction speaker. However, if the first contact surface 5531 and the second contact surface 5541 are incorrectly connected to the exposed surfaces of the terminals in the corresponding connector, a correct electrical connection cannot be established between the magnetic connector 55 and the corresponding connector, and therefore power cannot be supplied to the bone conduction speaker.

[0126] In this embodiment, the magnetic polarity of the outer end face of each ring segment 5511 can be set according to the connection method between the first contact surface 5531 and the second contact surface 5541 and the terminal in the corresponding connector. This ensures that when the first contact surface 5531 and the second contact surface 5541 are correctly mated with the terminal in the corresponding connector, the magnetic polarity of the outer end face of the magnetic structure of the corresponding connector is the same as or opposite to the magnetic polarity of the outer end face of the corresponding ring segment 5511 of the magnetic connector 55. This allows the two connectors to mat together due to the attraction of opposite polarities, thus establishing a correct connection between them. Conversely, when the first contact surface 5531 and the second contact surface 5541 are incorrectly mated with the terminal in the corresponding connector, the magnetic polarity of the outer end face of the magnetic structure of the corresponding connector is the same as the magnetic polarity of the outer end face of the corresponding ring segment 5511 of the magnetic connector 55. This prevents them from mating due to the repulsion of like polarities, thus avoiding the establishment of an incorrect connection that would prevent the magnetic connector 55 from functioning properly. This improves the accuracy and efficiency of the mating process and provides convenience for the user.

[0127] In one embodiment, the magnetic adsorption ring 551 can be divided into two ring segments 5511 along the circumference.

[0128] Specifically, the shape of the outer end face of the magnetic adsorption ring 551 can be a regular symmetrical ring such as an elliptical ring, a circular ring, or a rectangular ring as described in the above embodiments, so that it can be divided into two ring segments 5511 along the axis of symmetry of the regular ring; or it can be an irregular ring, and correspondingly divided into two asymmetrical ring segments 5511. The specific shape can be set according to the requirements, and no specific limitation is made here.

[0129] In an application scenario, such as Figure 12 The magnetic connector 55 has one first contact surface 5531 and one second contact surface 5541, which are arranged side-by-side and spaced apart, corresponding to the positive and negative terminals of the electronic device, respectively. The magnetic adsorption ring 551 is 180 degrees rotationally symmetrical with respect to a point of symmetry, and its dimensions differ in the first and second directions, which pass through the point of symmetry and are perpendicular to each other. Specifically, the magnetic adsorption ring 551 has a larger dimension in the first direction than in the second direction, and its outer end face can be elliptical. Further, the elliptical ring can be divided into two parallel segments 5511 along its axis of symmetry in the first or second direction. The outer end face of one segment 5511 has a N pole magnetic polarity, and the outer end face of the other segment 5511 has a S pole magnetic polarity. Further still, the first contact surface 5531 and the second contact surface 5541 of the magnetic connector 55 are also arranged side-by-side and are 180 degrees rotationally symmetrical about the point of symmetry of the magnetic adsorption ring 551.

[0130] Correspondingly, the shape and number of the magnetic adsorption structure of the corresponding connector are consistent with the magnetic adsorption ring 551 of the magnetic connector 55, while the magnetic polarity of the outer end face is opposite.

[0131] At this time, when the first contact surface 5531 and the second contact surface 5541 are correctly aligned with the corresponding terminals in the corresponding connectors, and the two ring segments 5511 of the magnetic adsorption ring 551 are aligned with the magnetic adsorption structure in the corresponding connectors by attraction of opposite poles, and when the first contact surface 5531 and the second contact surface 5541 are incorrectly aligned with the corresponding terminals in the corresponding connectors, the ring segment 5511 with the N pole magnetic polarity on the outer end face of the magnetic connector 55 corresponds to the N pole in the magnetic adsorption structure, and the ring segment 5511 with the S pole magnetic polarity on the outer end face corresponds to the S pole in the magnetic adsorption structure, thus generating like poles repulsion and preventing them from being aligned together, thereby avoiding incorrect connection and facilitating user use.

[0132] This application also provides a magnetic connector 55, which includes the specific structure of the magnetic connector 55 in the bone conduction speaker device described above. The magnetic connector 55 can be used for the power interface of electronic devices, including the bone conduction speaker device of this application, or the power interface of a charger. It is used to position and electrically connect the power interface of the electronic device and the power interface of the charger together through magnetic attraction, thereby supplying power to the electronic device. The relevant structure and the resulting technical effects are described in the above embodiments and will not be repeated here.

[0133] This application also provides a magnetic connector 55 assembly, which includes two magnetic connectors 55 as described in the above-described embodiments. The number and shape of the ring segments 5511 on the two magnetic connectors 55 correspond to each other, and the magnetic polarities of the outer end faces of the corresponding ring segments 5511 are opposite to each other, so that when the corresponding ring segments 5511 attract each other, the first contact surface 5531 and the second contact surface 5541 of the two magnetic connectors 55 respectively contact each other. Other related details can be found in the above embodiments and will not be repeated here.

[0134] It should be noted that, by setting the magnetic polarity of the outer end faces of each ring segment 5511 of the two magnetic connectors 55, when the first contact surface 5531 and the second contact surface 5541 of the two magnetic connectors 55 are in contact with each other, the magnetic polarities of the outer end faces of the corresponding ring segments 5511 are consistent but opposite, so that the two magnetic connectors 55 are joined together due to the attraction of opposite polarities, thus establishing a correct connection between them; however, when the first contact surface 5531 and the second contact surface 5541 of one magnetic connector 55 correspond to the second contact surface 5541 and the first contact surface 5531 of the other magnetic connector 55, the magnetic polarities of the outer end faces of the corresponding ring segments 5511 are the same, so they cannot be joined together due to the repulsion of like polarities, thereby reducing the probability of establishing an incorrect connection between the two magnetic connectors 55, and thus improving the accuracy and efficiency of the connection.

[0135] Furthermore, in the bone conduction speaker embodiment of this application, the magnetic connector 55 may be disposed within a circuit housing 10, specifically within a circuit housing 10 used to accommodate the control circuit 51.

[0136] In one application scenario, the two main sidewalls 11 of the circuit housing 10 are spaced apart from each other, and at least one main sidewall 11 has two spaced-apart baffles 19 formed on its inner surface. These two baffles 19 can be arranged parallel to the end wall 13 of the circuit housing 10. The two main sidewalls 11 and the two baffles 19 enclose a receiving space, which can be located near an auxiliary sidewall 12. The magnetic connector 55 is disposed within this receiving space.

[0137] The two main sidewalls 11 are further provided with mounting holes 113, and the bone conduction speaker further includes two fasteners 56. The two fasteners 56 can be inserted into the mounting holes 113 of the two main sidewalls 11 respectively, and abut against the magnetic connectors 55 from opposite sides.

[0138] The number of mounting holes 113 can be the same as the number of fasteners 56. Specifically, the fastener 56 can be a screw, which passes through the mounting hole 113 from the outside of the main sidewall 11, such that one end of the screw abuts against the outer sidewall of the magnetic connector 55, and the other end is fixed in the mounting hole 113.

[0139] Furthermore, the central axes of the two fasteners 56 are parallel to each other and spaced apart, so that the central axes of the two fasteners 56 do not coincide, thereby enabling the magnetic connector 55 to be more securely fixed in the circuit housing 10.

[0140] In one application scenario, each of the two main sidewalls 11 is provided with an assembly hole 113, and the magnetic connector 55 is rotated 180 degrees symmetrical about the insertion direction of the magnetic connector 55 relative to the accommodating space enclosed by the two main sidewalls 11 and the two baffles 19. Each of the opposite sides of the magnetic connector 55 is provided with two assembly holes 55512 that can receive the fastener 56. After the magnetic connector 55 is symmetrically rotated and inserted into the accommodating space, one of the two assembly holes 55512 on each side of the magnetic connector 55 is aligned with the assembly hole 113.

[0141] Specifically, the mounting hole 113 is used to receive the outer end of the fastener 56, and the mounting hole 55512 is used to receive the inner end of the fastener 56. By having the fastener 56 pass through the mounting hole 113 and the mounting hole 55512 at both ends, the magnetic connector 55 is fixed in the accommodating space enclosed by the two main side walls 11 and the two baffle walls 19.

[0142] It should be noted that the magnetic connector 55 is 180 degrees of rotational symmetry, so that there are two corresponding mounting holes 55512 and mounting holes 113 before and after the 180-degree rotation. Thus, the magnetic connector 55 can be fixed in both relative positional relationships, which facilitates assembly.

[0143] Furthermore, the housing sleeve 21 or housing sleeve 31 covers the mounting hole 113 provided on the main side wall 11, and the corresponding housing sleeve 21 and / or housing sleeve 31 are provided with exposed holes 57 that allow the magnetic connector 55 to be exposed for convenient use.

[0144] In one embodiment, the bone conduction speaker further includes a button module 58 disposed on the circuit housing 10. Specifically, a recessed area 10c is provided on the outer surface of the circuit housing 10, and a button hole 10d is further provided in the recessed area 10c for connecting the inner surface and the outer surface of the circuit housing 10.

[0145] The number of recessed areas 10c can be one or more, and each recessed area 10c can be provided with one or more button holes 10d, which is not limited here.

[0146] Furthermore, the button module 58 further includes: a flexible support 581, a button 582, and a second button switch 583.

[0147] The elastic support 581 includes an integrally formed support body 5811, a contact head 5812, and a support column 5813. The support body 5811 is disposed in the recessed area 10c and fixed to the bottom of the recessed area 10c. The support column 5813 is disposed on the side of the support body 5811 facing the outside of the circuit housing 10. The contact head 5812 is disposed on the other side of the support body 5811 facing the inside of the circuit housing 10 and extends along the key hole 10d.

[0148] The elastic support 581 can be made of a soft material, such as soft rubber or silicone, and can be made of the same material as the housing sleeve 21 and housing sleeve 31.

[0149] Furthermore, to improve the tactile feel of pressing, button 582 can be made of rigid plastic and is located at the end of support post 5813 facing the outside of circuit housing 10. Specifically, button 582 and support post 5813 can be fixed together by means of bonding, injection molding, or elastic contact.

[0150] The push button switch 583 is located inside the circuit housing 10 and is positioned corresponding to the button hole 10d. When the pressing surface of the button 582 is pressed, it drives the support column 5813 and further drives the contact head 5812 through the button hole 10d and triggers the push button switch 583, so that the bone conduction speaker can perform the corresponding function.

[0151] In the above method, the elastic support 581 is disposed in the recessed area 10c and fixed to the bottom of the recessed area 10c. On the one hand, the support body 5811 covers the button hole 10d disposed in the recessed area 10c, thereby making it difficult for liquid outside the circuit housing 10 to enter the interior of the circuit housing 10 through the button hole 10d, thus providing waterproofing and protection for the internal components of the circuit housing 10. On the other hand, since the elastic support 581 is elastic, the contact head 5812 triggers the button switch 583, which makes the contact pressure between the contact head 5812 and the button switch 583 have a certain elasticity, so that the triggering of the button switch 583 is not too abrupt, thus providing a good tactile feel when the user presses the button 582.

[0152] In one embodiment, the elastic bearing 581 can be fixed to the bottom of the recessed area 10c by means of adhesive or injection molding through the bearing body 5811.

[0153] In one application scenario, the surface of the bearing body 5811 facing the inside of the circuit housing 10 and the surface of the bottom of the recessed area 10c of the circuit housing 10 facing the outside of the circuit housing 10 are integrally formed by injection molding, specifically by overmolding.

[0154] In this application scenario, the elastic support 581 and the bottom of the recessed area 10c of the circuit housing 10 are integrally formed by injection molding, which makes the connection between the two more solid, increases the connection strength between the two and improves the sealing performance of the circuit housing 10. This makes the entire button module 58 more stable and reliable, and further improves the waterproof effect of the circuit housing 10.

[0155] In one embodiment, the support body 5811 specifically includes an annular fixing part 58111 and an elastic support part 58112.

[0156] The annular fixing part 58111 is arranged around the key hole 10d and is attached to the bottom of the recessed area 10c, thereby fixing the elastic support 581 to the circuit housing 10.

[0157] The elastic support portion 58112 is connected to the inner annular surface of the annular fixing portion 58111 and protrudes in a dome shape towards the outside of the circuit housing 10, so that its top to bottom has a certain height in the pressing direction of the button 582, and its top dimension perpendicular to the pressing direction is smaller than that of the bottom. The support column 5813 and the contact head 5812 are respectively disposed on both sides of the top of the elastic support portion 58112. When the button 582 is pressed, the top of the elastic support portion 58112 is pressed and moves towards its bottom, thereby driving the button 582 to move towards the button hole 10d until the button switch 583 is triggered.

[0158] It should be noted that, due to the relatively small overall structure of the bone conduction speaker and the tight connections between its components, the pressing stroke between the button 582 and the button switch 583 is small, thus reducing the tactile feedback of the button 582. In this embodiment, since the elastic support portion 58112 is dome-shaped and protrudes outward from the circuit housing 10, the distance between the button 582 and the button switch 583, which are located on the elastic support portion 58112 facing outward from the circuit housing 10, can be increased, thereby increasing the pressing stroke of the button 582 and improving the tactile feedback of the user pressing the button 582.

[0159] In one embodiment, the button 582 includes a button body 5821 and an annular flange 5822 and an annular flange 5823 disposed on one side of the button body 5821. Specifically, the annular flange 5822 and the annular flange 5823 may be disposed on the side opposite to the pressing surface of the button body 5821.

[0160] Specifically, the annular flange 5822 is located in the middle region of the button body 5821, and the annular flange 5823 is located on the outer edge of the button body 5821. Both the annular flanges 5822 and 5823 protrude in a direction away from the pressing surface of the button body 5821, thereby forming an accommodating space surrounded by the annular flange 5822 and an accommodating space jointly surrounded by the annular flanges 5822 and 5823. The protrusion heights of the annular flanges 5822 and 5823 relative to the button body 5821 can be equal or unequal. In this embodiment, the protrusion height of the annular flange 5822 relative to the button body 5821 is greater than the protrusion height of the annular flange 5823 relative to the button body 5821.

[0161] The support column 5813 is inserted into the accommodating space inside the annular flange 5822. Specifically, the support column 5813 can be fixed to the annular flange 5822 by means of bonding, injection molding or elastic contact.

[0162] Furthermore, the end face of the annular flange 5823 away from the button body 5821 is recessed in the recessed area 10c, and is spaced a certain distance from the bottom of the recessed area 10c when the elastic support 581 is in its natural state.

[0163] The bottom of the recessed area 10c refers to the inner wall surface of the recessed area 10c facing the inside of the circuit housing 10. Specifically, when the elastic support 581 is in its natural state, pressing the pressing surface of the button 582 causes the top of the elastic support portion 58112 of the elastic support 581 to move in the direction towards the inside of the circuit housing 10, and triggers the button switch 583 before the end face of the annular flange 5823 away from the button body 5821 contacts the bottom of the recessed area 10c.

[0164] Furthermore, button 582 also includes a columnar extension arm 5824 disposed on one side of button body 5821 and protruding towards button hole 10d inside annular flange 5822. A receiving hole 58131 is provided on support column 58133, extending towards button hole 10d through support column 5813 and reaching contact head 5812. The columnar extension arm 5824 is further accommodated within the receiving hole 58131 to support elastic support 581. Thus, when button 582 is pressed, causing contact head 5812 to trigger button switch 583, the columnar extension arm 5824 provides support for contact head 5812, preventing the contact between contact head 5812 and button switch 583 from being too weak, thereby further improving the pressing feel.

[0165] In one embodiment, the button hole 10d is disposed on the auxiliary side wall 12 of the circuit housing 10, and the pressing direction of the button switch 583 is perpendicular to the auxiliary side wall 12 and parallel to the main side wall 11 of the circuit housing 10.

[0166] In this embodiment, the button module 58 and the control circuit 51 correspond to the same circuit housing 10. The control circuit 51 includes a control circuit board, which is disposed inside the circuit housing 10 and spaced apart from the main sidewall 11. Specifically, the main surface of the control circuit board is parallel to the main sidewall 11.

[0167] The push button switch 583 is disposed on the main surface of the control circuit board, specifically at one end of the main surface near the auxiliary sidewall 12 of the circuit housing 10, so that the push button switch 583 corresponds to the button hole 10d. When the button 582 is pressed, the contact head 5812 is driven to activate the push button switch 583 in a direction parallel to the main sidewall 11 and thus parallel to the main surface of the control circuit board.

[0168] In this way, the space on the auxiliary sidewall 12 of the circuit housing 10 can be fully utilized. Secondly, the push-button switch 583 is set on the end of the main surface of the main control circuit board facing the button hole 10d, so that even if it is set on the main surface of the main control circuit board, the push-button switch 583 can still be triggered normally. Therefore, there is no need to specially set a first button circuit board parallel to the auxiliary sidewall 12 of the circuit housing 10. This reduces the space occupied inside the circuit housing 10 and saves costs.

[0169] In one embodiment, the circuit housing 10 near the location of the button 582 may be covered by one of the housing sleeve 21 and the housing sleeve 31, or by both.

[0170] The corresponding housing cover is further provided with an exposed hole 59 that allows the button 582 to be exposed, so that when the housing cover 21 and / or housing cover 31 are fitted around the circuit housing 10, the button 582 is exposed through the exposed hole 59.

[0171] In one embodiment, an annular baffle 60 is integrally formed on the inner surface of the housing sheath along the edge of the exposed hole. The annular baffle 60 extends along the side wall of the recessed area 10c to the interior of the recessed area 10c. Specifically, it can abut against the side wall surface of the circuit housing 10 located in the recessed area 10c, and can further abut against the bottom wall surface of the recessed area 10c.

[0172] Furthermore, a sealant can be provided between the outer peripheral surface of the annular baffle 60 and the side wall of the recessed area 10c to bond the outer peripheral surface of the annular baffle 60 to the side wall of the recessed area 10c, thereby further fixing the housing sleeve 21 and / or housing sleeve 31 to the circuit housing 10.

[0173] In one embodiment, the end of the first elastic metal wire of the ear hook 20 facing the circuit housing 10 is injection molded with a connector 24. The ear hook sleeve 22 can be further injection molded onto the outside of a portion of the connector 24 of the first elastic metal wire, and a housing sleeve 21 is integrally formed at the connector 24. The connector 24 is inserted and fixed to the end of the first circuit housing 10a facing the ear hook 20. Furthermore, the housing sleeve 21 covers the periphery of the first circuit housing 10a from one end of the first circuit housing 10a in a sleeve manner, thereby realizing the connection between the ear hook 20 and the first circuit housing 10a.

[0174] The connection method between the connector 24 and the first circuit housing 10a can be the same as or different from the connection method between the connector 33 of the rear hanger 30 and the first circuit housing 10a, and no specific limitation is made here.

[0175] In one embodiment, a flexible circuit board 44 may also be provided inside the housing 41 of the bone conduction speaker.

[0176] Specifically, the flexible circuit board 44 is provided with multiple pads 45 and two pads 46. The two pads 46 and the multiple pads 45 are located on the same side of the flexible circuit board 44 and are spaced apart. The two pads 46 are connected to two corresponding pads 45 of the multiple pads 45 through flexible leads 47 on the flexible circuit board 44. Furthermore, the housing 41 of the mechanism also accommodates two external wires 48. One end of each external wire 48 is soldered to the corresponding pad 46, and the other end is connected to the earphone core 42, so that the earphone core 42 is connected to the pads 46 through the external wires 48.

[0177] The auxiliary function module can be mounted on the flexible circuit board 44 and connected to other pads among the multiple pads 45 via flexible leads 49 on the flexible circuit board 44. The auxiliary function module can be a module that receives auxiliary signals and performs auxiliary functions, distinct from the earphone core 42. For example, the auxiliary function module can be a microphone, a push-button switch, etc., and can be specifically configured according to actual needs.

[0178] Furthermore, one end of each of the multiple ear hook wires 23 is soldered to a flexible circuit board 44 disposed inside the circuit housing 10, or to a control circuit board, while the other end enters the interior of the mechanism housing 41 and is soldered to a pad 45 on the flexible circuit board 44.

[0179] Among them, one end of two audio signal wires 231 of the multiple ear hook wires 23 located inside the core housing 41 is soldered to two pads 45 soldered by two flexible leads 47, and the other end can be directly or indirectly connected to the control circuit board. The two pads 45 are further connected to the earphone core 42 by soldering flexible leads 49 to two pads 46 and by soldering two external wires 48 to pads 46, thereby transmitting audio signals to the earphone core 42.

[0180] At least two auxiliary signal wires 232 are located inside the mechanism housing 41, with one end soldered to the pad 45 where the flexible lead 49 is soldered, and the other end can be directly or indirectly connected to the control circuit board, thereby transmitting the auxiliary signal received and converted by the auxiliary function module to the control circuit 51.

[0181] In the above method, a flexible circuit board 44 is provided inside the mechanism housing 41, and corresponding pads are further provided on the flexible circuit board 44. After the ear hook wire 23 enters the mechanism housing 41, it is soldered to the corresponding pads, and further connected to the corresponding auxiliary function modules through the flexible leads 47 and 49 on the pads. This avoids the situation where multiple ear hook wires 23 are directly connected to the auxiliary function modules, which would make the wiring inside the mechanism housing 41 complicated. This optimizes the wiring layout and saves space in the mechanism housing 41. Moreover, when multiple ear hook wires 23 are directly connected to the auxiliary function modules, the middle part of the ear hook wire 23 is suspended inside the mechanism housing 41, which can easily cause vibration and bring abnormal noise, affecting the sound quality of the earphone core 42. However, by soldering the ear hook wire 23 to the flexible circuit board 44 and further connecting to the corresponding auxiliary function modules in the above method, the situation where the wire is suspended and affects the sound quality of the earphone core 42 can be reduced, thereby improving the sound quality of the earphone core 42 to a certain extent.

[0182] In one embodiment, the auxiliary function module may include two microphones 432, namely a first microphone 432a and a second microphone 432b. Both the first microphone 432a and the second microphone 432b can be MEMS (Micro-Electro-Mechanical Systems) microphones 432, which have low operating current, relatively stable performance, and produce high-quality voice. The two microphones 432 can be positioned at different locations on the flexible circuit board 44 according to actual needs.

[0183] The flexible circuit board 44 includes a main circuit board 441 and branch circuit boards 442 and 443 connected to the main circuit board 441. The branch circuit board 442 extends in the same direction as the main circuit board 441. A first microphone 432a is attached to the end of the branch circuit board 442 away from the main circuit board 441. The branch circuit board 443 extends perpendicularly to the main circuit board 441. A second microphone 432b is attached to the end of the branch circuit board 443 away from the main circuit board 441. Multiple pads 45 are disposed on the end of the main circuit board 441 away from the branch circuit boards 442 and 443.

[0184] In one embodiment, the housing 41 includes a peripheral sidewall 411 surrounding the earpiece and a bottom wall 412 connected to one end face of the peripheral sidewall 411, thereby forming an accommodating space with an open end. The earphone housing 42 is placed within the accommodating space through the open end, a first microphone 432a is fixed to the bottom wall 412, and a second microphone 432b is fixed to the peripheral sidewall 411.

[0185] In this embodiment, the branch circuit boards 442 and / or 443 can be appropriately bent to accommodate the position of the sound inlet corresponding to the microphone 432 on the mechanism housing 41. Specifically, the flexible circuit board 44 can be disposed inside the mechanism housing 41 with the main circuit board 441 parallel to the bottom wall 412, so that the first microphone 432a corresponds to the bottom wall 412 without bending the main circuit board 441. However, since the second microphone 432b is fixed to the peripheral wall 411 of the mechanism housing 41, the second main circuit board 441 needs to be bent. Specifically, the branch circuit board 443 can be bent at the end away from the main circuit board 441, so that the surface of the branch circuit board 443 is perpendicular to the surfaces of the main circuit board 441 and the branch circuit board 442, and thus the second microphone 432b is fixed to the peripheral wall 411 of the mechanism housing 41 in a direction away from the main circuit board 441 and the branch circuit board 442.

[0186] In one embodiment, pads 45 and 46, the first microphone 432a and the second microphone 432b can all be disposed on the same side of the flexible circuit board 44, with pad 46 and the second microphone 432b disposed adjacent to each other.

[0187] Specifically, the pad 46 can be located at the end of the branch circuit board 443 away from the main circuit board 441, and is positioned with the same orientation as and at intervals from the second microphone 432b, so that it is perpendicular to the orientation of the pad 45 as the branch circuit board 443 bends. It should be noted that the surface of the branch circuit board 443 may not be perpendicular to the surface of the main circuit board 441 after bending, depending on the arrangement between the peripheral side wall 411 and the bottom end wall 412.

[0188] Furthermore, on the other side of the flexible circuit board 44, there is a rigid support plate 4a for supporting the pad 45 and a microphone rigid support plate 4b. The microphone rigid support plate 4b includes a rigid support plate 4b1 for supporting the first microphone 432a and a rigid support plate 4b2 for jointly supporting the pad 46 and the second microphone 432b.

[0189] Among them, rigid support plates 4a, 4b1, and 4b2 are mainly used to support the corresponding pads and microphones 432, and therefore need to have a certain strength. The materials of the three can be the same or different, specifically polyimide film (PI), or other materials that can provide strength support, such as polycarbonate, polyvinyl chloride, etc. In addition, the thickness of the three rigid support plates can be set according to the strength of the rigid support plates themselves and the actual strength requirements of pads 45, pads 46, and the first microphone 432a and the second microphone 432b, and no specific limitation is made here.

[0190] Among them, rigid support plate 4a, rigid support plate 4b1 and rigid support plate 4b2 can be three different regions of a rigid support plate as a whole, or they can be three independent wholes set apart from each other, without specific limitations here.

[0191] In one embodiment, the first microphone 432a and the second microphone 432b correspond to two microphone assemblies 4c, respectively. In one embodiment, the two microphone assemblies 4c have the same structure, and the core housing 41 is provided with an inlet hole 413. Furthermore, the bone conduction speaker is also provided with an annular baffle 414 integrally formed on the inner surface of the core housing 41 and disposed around the inlet hole 413, thereby defining an accommodating space 415 communicating with the inlet hole 413.

[0192] Furthermore, the microphone assembly 4c also includes: a waterproof membrane assembly 4c1.

[0193] The waterproof membrane assembly 4c1 is disposed within the accommodating space 415 and covers the sound inlet 413. The microphone rigid support plate 4b is disposed within the accommodating space 415 and located on the side of the waterproof membrane assembly 4c1 away from the sound inlet 413, thereby pressing the waterproof membrane assembly 4c1 onto the inner surface of the mechanism housing 41. Furthermore, the microphone rigid support plate 4b is provided with a sound inlet 4b3 corresponding to the sound inlet 413. Furthermore, the microphone 432 is disposed on the side of the microphone rigid support plate 4b away from the waterproof membrane assembly 4c1 and covers the sound inlet 4b3.

[0194] The waterproof membrane assembly 4c1 has the function of waterproofing and sound transmission, and is tightly attached to the inner surface of the core housing 41 to prevent liquid outside the core housing 41 from entering the core housing 41 through the sound inlet 413 and affecting the performance of the microphone 432.

[0195] The axial directions of the sound inlet 4b3 and the sound inlet 413 can coincide, or they can intersect at a certain angle according to the actual needs of the microphone 432, etc.

[0196] The microphone rigid support plate 4b is disposed between the waterproof membrane assembly 4c1 and the microphone 432. On the one hand, it presses the waterproof membrane assembly 4c1 so that the waterproof membrane assembly 4c1 is tightly attached to the inner surface of the core housing 41; on the other hand, the microphone rigid support plate 4b has a certain strength, thereby playing the role of supporting the microphone 432.

[0197] Specifically, the microphone rigid support plate 4b can be made of polyimide (PI) or other materials that can provide strength support, such as polycarbonate or polyvinyl chloride. Furthermore, the thickness of the microphone rigid support plate 4b can be set according to the strength of the microphone rigid support plate 4b and the actual strength required by the microphone 432; no specific limitation is made here.

[0198] In one embodiment, the waterproof membrane assembly 4c1 includes a waterproof membrane body 4c11 and an annular adhesive pad 4c12. The annular adhesive pad 4c12 is disposed on the side of the waterproof membrane body 4c11 facing the microphone rigid support plate 4b, and further disposed around the sound inlet 413 and the sound inlet 4b3.

[0199] The microphone rigid support plate 4b is pressed against the annular rubber pad 4c12, thereby bonding and fixing the waterproof membrane assembly 4c1 and the microphone rigid support plate 4b together.

[0200] In one application scenario, the annular rubber pad 4c12 is configured to form a sealed cavity between the waterproof membrane body 4c11 and the rigid support plate, which is connected to the microphone 432 only through the sound inlet 4b3. This means that there is no gap in the connection between the waterproof membrane assembly 4c1 and the microphone rigid support plate 4b, thereby isolating the space around the annular rubber pad 4c12 between the waterproof membrane body 4c11 and the microphone rigid support plate 4b from the sound inlet 4b3.

[0201] Specifically, the waterproof membrane body 4c11 can be a waterproof and sound-permeable membrane, equivalent to the eardrum of the human ear. When external sound enters through the sound inlet 413, the waterproof membrane body 4c11 vibrates, causing a change in the air pressure in the sealed cavity, which in turn causes sound to be emitted from the microphone 432.

[0202] Furthermore, since the air pressure in the sealed cavity changes when the waterproof membrane body 4c11 vibrates, and this air pressure needs to be controlled within an appropriate range, both excessive and insufficient pressure will affect the sound quality. In this embodiment, the distance between the waterproof membrane body 4c11 and the rigid support plate can be 0.1-0.2 mm, specifically 0.1 mm, 0.15 mm, 0.2 mm, etc., so that the air pressure change in the sealed cavity caused by the vibration of the waterproof membrane body 4c11 is within an appropriate range, thereby improving the sound quality.

[0203] In one embodiment, the waterproof membrane assembly 4c1 further includes an annular rubber pad 4c13 disposed on the inner surface of the waterproof membrane body 4c11 facing the movement housing 41 and overlapping with the annular rubber pad 4c12.

[0204] In this way, the waterproof membrane assembly 4c1 can be tightly fitted to the inner surface of the core housing 41 surrounding the sound inlet 413, thereby reducing the loss of sound entering through the sound inlet 413 and improving the conversion rate of sound into vibration of the waterproof membrane body 4c11.

[0205] Among them, the ring-shaped rubber gasket 4C12 and the ring-shaped rubber gasket 4C13 can be double-sided adhesive or sealant, respectively.

[0206] In one application scenario, sealant can be further applied to the annular baffle 414 and the outer periphery of the microphone 432 to further improve the sealing performance, thereby improving the sound conversion rate and thus improving the sound quality.

[0207] In one embodiment, a flexible circuit board 44 may be disposed between a rigid support plate and a microphone 432, and an inlet hole 444 is provided at a position corresponding to the inlet hole 4b3 of the rigid support plate 4b of the microphone, so that the vibration of the waterproof membrane body 4c11 caused by external sound passes through the inlet hole 444 and further affects the microphone 432.

[0208] Furthermore, the flexible circuit board 44 extends further away from the microphone 432 to connect with other functional components or wires to achieve corresponding functions. Correspondingly, the microphone rigid support plate 4b also extends a distance away from the microphone 432 along with the flexible circuit board.

[0209] Correspondingly, the annular baffle 414 is provided with a notch that matches the shape of the flexible circuit board, allowing the flexible circuit board to extend out from the receiving space 415. In addition, sealant can be further filled at the notch to further improve the sealing performance.

[0210] Furthermore, in one embodiment, the speaker assembly 40 also includes a button module 4d. The auxiliary function module mounted on the flexible circuit board 44 includes a push-button switch 431, which is disposed in a different circuit housing 10 from the microphone 432. Of course, in other embodiments, they may also be disposed in the same circuit housing 10, which is not specifically limited here.

[0211] Correspondingly, the flexible circuit board 44 may include a main circuit board 445 and a branch circuit board 446, wherein the branch circuit board 446 may extend along an extension direction perpendicular to the main circuit board 445. A plurality of pads 45 are disposed at the end of the main circuit board 445 away from the branch circuit board 446, the push-button switch is mounted on the main circuit board 445, and the pads 46 are disposed at the end of the branch circuit board 446 away from the main circuit board 445.

[0212] In this embodiment, the surface of the flexible circuit board 44 is parallel to and spaced apart from the bottom wall 412, so that the push-button switch can be positioned toward the bottom wall 412 of the mechanism housing 41.

[0213] Correspondingly, the push-button switch is located on the side of the flexible circuit board 44 facing the bottom wall 412. For ease of assembly, the pads 45 and 46 can be located on the side of the flexible circuit board 44 away from the bottom wall 412, so that the pads 45 and 46 and the push-button switch are respectively located on both sides of the flexible circuit board 44. It should be noted that the arrangement of the pads 45 and 46 with the flexible leads 47 and 49 in this embodiment is the same as the arrangement of the microphone 432 in the above embodiment, and will not be repeated here.

[0214] The main circuit board 445 has a rigid support plate 4d3 on the side away from the push button switch to support the push button switch and keep the pad 45 exposed, and a rigid support plate 4e on the side away from the pad 45 to support the pad 45 and keep the push button switch exposed. The branch circuit board 446 has a rigid support plate 4f on the side away from the pad 46 to support the pad 46.

[0215] The rigid support plates 4d3, 4e, and 4f can be made of the same material, specifically the same material and function as the rigid support plates 4a, 4b1, and 4b2 in the above embodiments. For details, please refer to the above embodiments; they will not be repeated here. Furthermore, the thickness of the rigid support plates 4d3, 4e, and 4f can be determined based on their inherent strength and the required support strength for the corresponding push-button switches, solder pads 45 and 46.

[0216] The push-button switch 431 and the pad 45 are respectively disposed on both sides of the main circuit board 445, and are spaced apart from each other on both sides of the main circuit board 445. Correspondingly, the rigid support plate 4d3 corresponding to the push-button switch 431 and the rigid support plate 4e corresponding to the pad 45 are also respectively disposed on both sides of the main circuit board 445, and further bypass the push-button switch 431 and the pad 45, so that the two have adjacent edges disposed adjacent to each other.

[0217] Since the adjacent edges of the rigid support plate 4d3 and the rigid support plate 4e are spaced apart on the flexible circuit board 44, only the flexible circuit board 44 is provided in the gap between the adjacent edges. Since the strength of the flexible circuit board 44 is small and the strength of the rigid support plate is large, the flexible circuit board 44 is easily broken when the flexible circuit board 44 in the gap area is repeatedly bent.

[0218] In this embodiment, the projections of the adjacent edges of the rigid support plate 4d3 and the rigid support plate 4e onto the flexible circuit board 44 overlap each other, so that no gap is set between the adjacent edges of the two, or only a partial gap is set, thereby reducing the occurrence of the above situation and protecting the flexible circuit board 44.

[0219] Among them, a rigid support plate 4d4 can be further provided on the side of the rigid support plate 4d3 away from the flexible circuit board 44, and the rigidity of the rigid support plate 4d4 is greater than that of the rigid support plate 4d3.

[0220] The rigid support plate 4d3 corresponds to the push-button switch 431, which is subjected to repeated pressing by the user during use and therefore requires higher strength support. In this embodiment, the rigid support plate 4d4 can be made of stainless steel or other materials with higher strength than the rigid support plate 4d3. Specifically, the rigid support plate 4d3 and the rigid support plate 4d4 can be formed together by hot pressing.

[0221] In one embodiment, a recessed area 4121 is provided on the inner surface of the movement housing 41, specifically on the inner surface of the bottom end wall 412, and a button hole 4122 is further provided in the recessed area 4121 for communicating between the inner and outer surfaces of the movement housing 41. The recessed area 4121 is formed by the inner surface of the movement housing 41 recessed towards the outside of the movement housing 41. The button hole 4122 may be further provided in the middle of the recessed area 4121, or in other locations as needed.

[0222] Furthermore, the button module 4d also includes a flexible support 4d1 and a button 4d2.

[0223] The elastic support 4d1 includes an integrally formed support body 4d11 and a support column 4d12. The support body 4d11 is disposed within a recessed area 4121 and fixed to the bottom of the recessed area 4121. Specifically, the bottom of the recessed area 4121 refers to the inner wall surface of the recessed area 4121 away from the interior of the movement housing 41. The support column 4d12 is disposed on the side of the support body 4d11 facing the exterior of the movement housing 41 and is exposed through the button hole 4122.

[0224] The elastic support 4d1 can be made of a soft material, such as soft rubber or silicone, and can be made of the same material as the housing sleeve 21 and housing sleeve 31. To improve the pressing feel, the button 4d2 can be made of hard plastic and is located on the part of the support post 4d12 exposed outside the button hole 4122. Specifically, the button 4d2 and the support post 4d12 can be fixed together by means of bonding, injection molding, or elastic abutment.

[0225] In the above method, the elastic support 4d1 is disposed in the recessed area 4121 and fixed to the bottom of the recessed area 4121. The support body 4d11 covers the button hole 4122 from the inside side of the mechanism housing 41, so as to separate the inside of the mechanism housing 41 from the outside. This makes it difficult for liquid outside the mechanism housing 41 to enter the inside of the mechanism housing 41 through the button hole 4122, thereby providing waterproof and protective functions for the internal components of the mechanism housing 41.

[0226] In one application scenario, the elastic support 4d1 can be fixed to the bottom of the recessed area 4121 by adhesive through the support body 4d11. Specifically, adhesive, double-sided tape or the like can be applied between the surface of the support body 4d11 facing the outside of the movement housing 41 and the bottom of the recessed area 4121 to stick the two together.

[0227] In one application scenario, the support body 4d11 can be fixed to the bottom of the recessed area 4121 by injection molding. The surface of the support body 4d11 facing the outside of the mechanism housing 41 is integrally formed with the bottom of the recessed area 4121 of the mechanism housing 41 by injection molding, specifically by overmolding. In this application scenario, the elastic support 4d1 and the bottom of the recessed area of ​​the mechanism housing 41 are integrally formed by injection molding, which makes the connection between the two more solid, increases the bonding strength, and improves the sealing performance of the mechanism housing 41. This makes the entire button module 4d more stable and reliable, and further improves the waterproof effect of the mechanism housing 41.

[0228] In one embodiment, the support body 4d11 includes an annular fixing part 4d111 and an elastic support part 4d112. The annular fixing part 4d111 is disposed around the button hole 4122 and is fitted and fixed to the bottom of the recessed area 4121, thereby fixing the elastic support 4d1 to the movement housing 41.

[0229] The elastic support portion 4d112 is connected to the inner annular surface of the annular fixing portion 4d111 and protrudes in a dome shape towards the outside of the mechanism housing 41, so that its top to bottom has a certain height in the pressing direction of the button 4d2, and its top dimension perpendicular to the pressing direction is smaller than that of the bottom. The support column 4d12 is disposed at the top of the elastic support portion 4d112. When the button 4d2 is pressed, the top of the elastic support portion 4d112 is pressed and moves towards its bottom, thereby driving the button 4d2 towards the button hole 4122 until the button switch 431 is triggered.

[0230] It should be noted that, due to the relatively small overall structure of the bone conduction speaker and the tight connections between its components, the pressing stroke between button 4d2 and button switch 431 is short, thus reducing the tactile feedback of button 4d2. In this embodiment, since the elastic support portion 4d112 protrudes in a dome shape towards the outside of the mechanism housing 41, the distance between button 4d2 and button switch 431 inside the mechanism housing 41 can be increased, thereby appropriately increasing the pressing stroke of button 4d2 to trigger button switch 431, and thus improving the tactile feedback of the user pressing button 4d2.

[0231] Specifically, the bottom of the elastic support 4d112 is fixed to the side wall of the key hole 4122, so that the top of the elastic support 4d112 is exposed from the key hole 4122, and the support column 4d12 located at the end of the elastic support 4d112 facing the outside of the mechanism housing 41 is completely exposed outside the mechanism housing 41, and is then fixed together with the key 4d2 outside the mechanism housing 41.

[0232] In one embodiment, a recessed area 4123 is provided on the outer surface of the mechanism housing 41, wherein the button hole 4122 is further located within the recessed area 4123. That is, the recessed areas 4121 and 4123 are located at opposite ends of the button hole 4122 and are connected by the button hole 4122. The shape and size of the recessed areas 4121 and 4123 can be the same or different according to actual needs. In addition, the number of recessed areas 4121 and 4123 can be the same, and their number can be determined according to the number of buttons 4d2, which can be one or more. Each recessed area 4121 and recessed area 4123 can be provided with one or more button holes 4122, which is not specifically limited here. In this embodiment, the mechanism housing 41 corresponds to one button 4d2, and corresponds to one recessed area 4121 and one recessed area 4123.

[0233] The support column 4d12 is supported by the elastic support part 4d112 to the side of the button hole 4122 facing the outside of the mechanism housing 41 and located in the recessed area 4123. Furthermore, the button 4d2 is disposed on one side of the elastic support part 4d112 of the support column 4d12. In this embodiment, by setting the height of the elastic support part 4d112 and the support column 4d12 along the pressing direction of the button 4d2, the button 4d2 is at least partially sunk in the recessed area 4123, so as to improve the space utilization and reduce the space occupied by the button module 4d.

[0234] In one embodiment, the button 4d2 includes a button body 4d21 and an annular flange 4d22 and an annular flange 4d23 disposed on one side of the button body 4d21. Specifically, the annular flange 4d22 and annular flange 4d23 may be disposed on the opposite side of the pressing surface of the button body 4d21.

[0235] Specifically, the annular flange 4d22 is located in the middle region of the button body 4d21, and the annular flange 4d23 is located on the outer edge of the button body 4d21. Both the annular flanges 4d22 and 4d23 protrude in a direction away from the pressing surface of the button body 4d21, thereby forming a columnar accommodating space 4d24 surrounded by the annular flange 4d22, and a ring-column accommodating space 4d25 formed by the annular flanges 4d22 and 4d23. The protrusion heights of the annular flanges 4d22 and 4d23 relative to the button body 4d21 can be equal or unequal. In this embodiment, the protrusion height of the annular flange 4d22 relative to the button body 4d21 is greater than the protrusion height of the annular flange 4d23 relative to the button body 4d21.

[0236] The support column 4d12 is inserted inside the annular flange 4d22, that is, it is housed in the accommodating space 4d24. Specifically, the support column 4d12 can be fixed to the annular flange 4d22 by means of bonding, injection molding or elastic contact.

[0237] Furthermore, the end face of the annular flange 4d23 away from the button body 4d21 is recessed in the recessed area 4123, and is spaced a certain distance from the bottom of the recessed area 4123 when the elastic support 4d1 is in its natural state.

[0238] The bottom of the recessed area 4123 refers to the inner wall surface of the recessed area 4123 facing the interior of the mechanism housing 41. Specifically, when the elastic support 4d1 is in its natural state, pressing the pressing surface of the button 4d2 causes the top of the elastic support portion 4d112 of the elastic support 4d1 to move in the direction toward the interior of the mechanism housing 41, and triggers the button switch 431 before the end face of the annular flange 4d23 away from the button body 4d21 contacts the bottom of the recessed area 4123.

[0239] In one embodiment, the elastic support 4d1 further includes a contact head 4d13 for contacting the push button switch 431. The contact head 4d13 may be disposed on the side of the support body 4d11 near the inside of the mechanism housing 41. Specifically, it may be disposed in the middle region of the inner wall surface of the top of the elastic support portion 4d112 facing the inside of the mechanism housing 41, and protrude from the inner wall surface toward the inside of the mechanism housing 41.

[0240] When button 4d2 is pressed, the top of the elastic support portion 4d112 of the elastic bearing 4d1 moves towards the inside of the mechanism housing 41, thereby driving the contact head 4d13 to move towards the push-button switch 431 inside the mechanism housing 41. This contact head 4d13 then triggers the push-button switch 431, thus achieving the corresponding function. In this way, the pressing stroke of button 4d2 can be reduced according to actual needs.

[0241] In one embodiment, the speaker assembly 40 is connected to the ear hook 20 via a mechanism housing 41, and the button module 4d is centrally located relative to the speaker assembly 40 or located at the proximal end 4g of the speaker assembly 40 near the top 25 of the ear hook.

[0242] The ear hook tip 25 refers to the top part of the ear hook 20 when the user is wearing the bone conduction speaker device, which corresponds to the top of the user's ear.

[0243] When a user wears the bone conduction speaker device, the ear hook tip 25 fits snugly against the head. The vibration of the speaker assembly 40 can be considered as the reciprocating swing of the ear hook 20 between the ear hook tip 25 and the speaker assembly 40, with the ear hook tip 25 as a fixed point. The amplitude of the speaker assembly 40's swing (i.e., vibration acceleration) is positively correlated with the volume it produces. The mass distribution of the speaker assembly 40 significantly affects the amplitude of its reciprocating swing, thus influencing the volume produced by the speaker assembly 40.

[0244] In this embodiment, the placement of the button module 4d on the speaker assembly 40 affects the mass distribution of the speaker assembly 40, and consequently, the volume it produces. Specifically, based on the principles of dynamics, when the button 4d2 is positioned 4h away from the ear hook tip 25, the vibration acceleration of the speaker assembly 40 will be less than the vibration acceleration when the button module 4d is positioned 4g away from the ear hook tip 25, resulting in a decrease in volume.

[0245] Accordingly, in this embodiment, by centering the button module 4d relative to the speaker assembly 40 or placing it near the ear hook tip 25 of the speaker assembly 40, the vibration acceleration of the speaker assembly 40 is increased, thereby increasing the volume of the speaker assembly 40.

[0246] The projection of the open end of the mechanism housing 41 onto the plane α where the outer side 4d26 of the button 4d2 is located includes the proximal edge p near the top 25 of the ear hook and the distal edge q away from the top 25 of the ear hook, wherein the shortest distance h1 between the button 4d2 and the proximal edge p is not greater than the shortest distance h2 between the button 4d2 and the distal edge q.

[0247] Here, the outer surface 4d26 of button 4d2 refers to the plane containing the surface of button 4d2 on the side away from button hole 4122. Furthermore, the projection of the opening end onto the plane containing the outer surface 4d26 of button 4d2 covers button 4d2.

[0248] The shortest distance h1 between button 4d2 and the proximal edge p is the shortest distance between the side of button 4d2 near the top 25 of the ear hook and the side of the proximal edge p near the top 25 of the ear hook; correspondingly, the shortest distance h2 between button 4d2 and the distal edge q is the shortest distance between the side of button 4d2 away from the top 25 of the ear hook and the side of the distal edge q away from the top 25 of the ear hook.

[0249] The relationship between the shortest distance h1 between button 4d2 and the proximal edge p and the shortest distance h2 between button 4d2 and the distal edge q corresponds to the setting of button 4d2 being located near the proximal end 4g of the ear hook top 25, or in the center, or near the distal end 4h.

[0250] Specifically, when the shortest distance h1 between button 4d2 and the proximal edge p is less than the shortest distance h2 between button 4d2 and the distal edge q, button 4d2 is located at the proximal end 4g of the ear hook top 25. As the difference between the shortest distance h1 between button 4d2 and the proximal edge p and the shortest distance h2 between button 4d2 and the distal edge q increases, button 4d2 is closer to the ear hook top 25. When the two are equal, button 4d2 is centered.

[0251] In one embodiment, the button 4d2 is axially symmetrical with respect to two perpendicularly intersecting symmetrical directions, wherein the dimension s1 of the button 4d2 in the major axis direction of the two symmetrical directions is greater than the dimension s2 of the button 4d2 in the minor axis direction of the two symmetrical directions.

[0252] Specifically, the shape of button 4d2 can be elliptical, rectangular, etc. In this embodiment, the direction of the major and minor axes of button 4d2 is not specifically limited. For example, the major axis can be located in the connection direction between ear hook 20 and mechanism housing 41, or in a direction perpendicular to the connection direction between ear hook 20 and mechanism housing 41, or in other directions.

[0253] In one embodiment, the angle θ between the projection of the extension line r of the central axis of the connection portion between the ear hook 20 and the speaker assembly 40 onto the plane where the outer surface 4d26 of the button 4d2 is located and the major axis direction is less than 10°, and can specifically be 9°, 7°, 5°, 3°, 1°, etc., without specific limitation here.

[0254] The extension line r of the central axis of the connection between the ear hook 20 and the speaker assembly 40 can be parallel to the connection direction between the ear hook 20 and the speaker assembly 40.

[0255] When the angle θ between the projection of the extension line r onto the plane containing the outer surface 4d26 of the button 4d2 and the major axis direction is less than 10°, the major axis direction of the button 4d2 will not deviate too much from the extension direction of the extension line r, thereby making the direction of the extension line r of the central axis consistent or nearly consistent with the direction of the major axis direction of the button 4d2.

[0256] In one embodiment, the shortest distance d between the projection of the extension line r of the central axis of the ear hook 20 onto the plane containing the outer surface 4d26 of the button 4d2 and the intersection of the major and minor axis directions is less than the dimension s2 of the button 4d2 along the minor axis of the two symmetrical directions, thereby making the button 4d2 close to the extension line r of the central axis of the ear hook 20. In one application scenario, the projection of the extension line r of the central axis of the ear hook 20 onto the plane containing the outer surface 4d26 of the button 4d2 can coincide with the major axis direction to further improve the sound quality of the speaker assembly 40.

[0257] In one embodiment, the centroid m1 or centroid of the button module 4d is at a first distance L1 with respect to the ear hook tip 25, and the centroid m2 or centroid of the remaining portion of the speaker assembly 40 excluding the button module 4d is at a second distance L2 with respect to the ear hook tip 25. In this embodiment, the mass distribution of the button module 4d and the speaker assembly 40 is relatively uniform; therefore, it can be considered that the centroid m1 of the button module 4d coincides with the centroid, and the centroid m2 of the speaker assembly 40 also coincides with the centroid.

[0258] The mass distribution of the button module 4d can be represented by the ratio between the first distance L1 and the second distance L2, and the mass ratio k of the button module 4d to the mass of the rest of the speaker assembly 40 excluding the button module 4d. Specifically, with a fixed mass of the button module 4d, as the ratio between the first distance L1 and the second distance L2 increases, the vibration acceleration of the speaker assembly 40 decreases, leading to a decrease in volume; conversely, with a fixed ratio between the first distance L1 and the second distance L2, as the mass of the button module 4d increases, the vibration acceleration of the bone conduction speaker decreases, leading to a decrease in volume. Therefore, by adjusting the ratio between the first distance L1 and the second distance L2 and the mass ratio k of the button module 4d to the mass of the rest of the speaker assembly 40 excluding the button module 4d, the volume reduction caused by the setting of the button module 4d can be controlled within a range perceptible to the human ear.

[0259] In one application scenario, the ratio between the first distance L1 and the second distance L2 may not be greater than 1.

[0260] Specifically, when the ratio between the first distance L1 and the second distance L2 is equal to 1, the centroid m1 and centroid of the button module 4d coincide with the centroid m2 and centroid of the speaker assembly 40, thus making the button module 4d centrally located relative to the speaker assembly 40. When the ratio between the first distance L1 and the second distance L2 is less than 1, the centroid m1 and centroid of the button module 4d are closer to the ear hook top 25 relative to the centroid m2 and centroid of the speaker assembly 40, thus being located at the proximal end 4g of the speaker assembly 40 near the ear hook top 25. Moreover, the smaller the ratio between the first distance L1 and the second distance L2, the closer the centroid m1 and centroid of the button module 4d are to the ear hook top 25 relative to the centroid m2 and centroid of the speaker assembly 40.

[0261] Furthermore, the ratio between the first distance L1 and the second distance L2 can be no greater than 0.95, thereby making the button module 4d closer to the top 25 of the ear hook. The ratio between the first distance L1 and the second distance L2 can also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., and can be set according to requirements; no limitation is made here.

[0262] Furthermore, when the ratio between the first distance L1 and the second distance L2 satisfies the above-mentioned range, the mass ratio of the button module 4d to the mass of the rest of the speaker assembly 40 excluding the button module 4d may not be greater than 0.3, and may specifically not be greater than 0.29, 0.23, 0.17, 0.1, 0.06, 0.04, etc., which are not limited here.

[0263] In this application, the button module 4d can be disposed on only one speaker assembly 40. In one embodiment, there are two button modules 4d, which are disposed on two speaker assemblies 40 respectively. In this case, the volume of both speaker assemblies 40 decreases, making it easier for the human ear to perceive. In this case, the mass ratio of the button module 4d to the mass of the rest of the speaker assembly 40 excluding the button module 4d can be no greater than 0.1, such as 0.1, 0.6, 0.4, etc.

[0264] In one embodiment of the bone conduction speaker device of this application, the earphone core 42 of the bone conduction speaker device is a bone conduction earphone core 42. Specifically, the bone conduction earphone core 42 includes a bracket 421, a coil 422 and an external wire 48.

[0265] The bracket 421, which is the housing of the earphone core 42, serves to support and protect the entire earphone core 42 structure. In this embodiment, the bracket 421 is provided with a wire groove 4211, which can be used to accommodate the wiring of the earphone core 42.

[0266] The coil 422 may be mounted on the bracket 421 and has at least one internal lead 423 connected to the main circuit in the coil 422 to lead out the main circuit and transmit audio current to the coil 422 through the internal lead 423.

[0267] The external wire 48 is used to connect to the internal lead 423. Furthermore, the external wire 48 can be connected to the control circuit 51 to transmit audio current to the coil 422 via the internal lead 423 through the control circuit 51.

[0268] Specifically, during the assembly stage, the external wire 48 and the internal lead 423 need to be connected together by welding or other methods. Due to structural limitations, the length of the wire cannot be exactly the same as the length of the channel after welding, and there will usually be excess wire. If the excess wire is not properly placed, it will vibrate with the coil 422, thus producing abnormal noise and affecting the sound quality emitted by the earphone core 42.

[0269] Furthermore, at least one of the external conductor 48 and the internal lead 423 can be wound and disposed within the wire trough 4211. In one application scenario, the welding position between the internal lead 423 and the external conductor 48 can be located within the wire trough 4211, thereby winding the portions of the external conductor 48 and the internal lead 423 near the welding position within the wire trough 4211. Additionally, to maintain stability, sealant can be further filled into the wire trough 4211 to fix the wiring within it.

[0270] In the above method, a wire groove 4211 is provided on the bracket 421, so that at least one of the external wire 48 and the internal lead wire 423 is wound and disposed in the wire groove 4211 to accommodate the excess length of the wire, thereby reducing the vibration generated in the channel and reducing the impact on the sound quality emitted by the earphone core 42 due to abnormal noise caused by vibration.

[0271] In one embodiment, the bracket 421 includes an annular body 4212, a supporting flange 4213, and an outer baffle 4214. The annular body 4212, the supporting flange 4213, and the outer baffle 4214 can be integrally formed.

[0272] The annular body 4212 is disposed on the inner side of the entire support 421 and is used to support the coil 422. Specifically, the cross-section of the annular body 4212 in the direction perpendicular to the annular radial direction is consistent with that of the coil 422. The coil 422 is disposed at the end of the annular body 4212 facing the inside of the mechanism housing 41. The inner and outer walls of the annular body 4212 can be flush with the inner and outer walls of the coil 422, respectively, so that the inner wall of the coil 422 is coplanar with the inner wall of the annular body 4212, and the outer wall of the coil 422 is coplanar with the outer wall of the annular body 4212.

[0273] Furthermore, the support flange 4213 protrudes from the outer wall of the annular body 4212 and extends outward from the annular body 4212, specifically extending outward in a direction perpendicular to the outer wall of the annular body 4212. The support flange 4213 may be located between the two ends of the annular body 4212. In this embodiment, the support flange 4213 may protrude around the outer wall of the annular body 4212 to form an annular support flange 4213. In other embodiments, it may protrude only at a portion of the outer wall of the annular body 4212, depending on requirements.

[0274] The outer baffle 4214 is connected to the supporting flange 4213 and is spaced apart from the annular body 4212 along its side. The outer baffle 4214 can be spaced around the annular body 4212 and / or the coil 422, specifically partially spaced around the annular body 4212 and the coil 422, and partially spaced around the annular body 4212, depending on actual needs. It should be noted that in this embodiment, the portion of the outer baffle 4214 near the wire-embedded groove 4211 is spaced around a portion of the annular body 4212. Specifically, the outer baffle 4214 is located on the side of the supporting flange 4213 away from the mechanism housing 41. The outer wall of the annular body 4212, the side wall of the supporting flange 4213 away from the mechanism housing 41, and the inner wall of the outer baffle 4214 together define the wire-embedded groove 4211.

[0275] In one embodiment, a wiring channel 424 is provided on the annular body 4212 and the supporting flange 4213, and the internal lead wire 423 extends through the wiring channel 424 into the buried wire groove 4211.

[0276] The wiring channel 424 includes a sub-wiring channel 4241 located on the annular body 4212 and a sub-wiring channel 4242 located on the supporting flange 4213. The sub-wiring channel 4241 is disposed through the inner and outer walls of the annular body 4212. A wiring port 42411 connecting one end of the sub-wiring channel 4241 is provided on the side of the annular body 4212 near the coil 422, and a wiring port 42412 connecting the other end of the sub-wiring channel 4241 is provided on the side of the annular body 4212 facing inwards from the support flange 4213 towards the interior of the mechanism housing 41. The sub-wiring channel 4242 passes through the support flange 4213 in the direction towards the exterior of the mechanism housing 41. A wiring port 42421 connecting one end of the sub-wiring channel 4242 is provided on the side of the support flange 4213 facing inwards from the mechanism housing 41, and a wiring port 42422 connecting the other end of the sub-wiring channel 4242 is provided on the side of the support flange 4213 away from the interior of the mechanism housing 41. The wiring ports 42412 and 42421 are connected by the space between the support flange 4213 and the annular body 4212.

[0277] Furthermore, the internal lead wire 423 can enter the wiring port 42411, extend along the sub-wiring channel 4241, and pass out from the wiring port 42412 into the area between the annular body 4212 and the support flange 4213. It can then enter the sub-wiring channel 4242 from the wiring port 42421, and after passing out from the wiring port 42422, extend into the buried wire groove 4211.

[0278] In one embodiment, the top of the outer baffle 4214 is provided with a slot 42141, through which the external wire 48 can extend into the buried wire groove 4211.

[0279] One end of the external wire 48 is disposed on the flexible circuit board 44, which is specifically disposed on the side of the earphone core 42 facing the inside of the core housing 41.

[0280] In this embodiment, the support flange 4213 extends further to the side of the outer baffle 4214 away from the annular body 4212 to form an outer edge. Further, this outer edge surrounds and abuts against the inner sidewall of the mechanism housing 41. Specifically, the outer edge of the support flange 4213 is provided with a slot 42131, allowing the external wire 48 of the earphone core 42 facing inwards from the support flange 4213 to extend through the slot 42131 to the slot 42141, and then into the wire groove 4211.

[0281] Furthermore, a guide groove 416 is provided on the inner wall of the mechanism housing 41, with one end located on one side of the flexible circuit board 44 and the other end connected to the slot 42131, extending in the direction toward the outside of the mechanism housing 41, so that the external wire 48 can be extended from the flexible circuit board to the second wiring groove 3331 through the guide groove 416.

[0282] In one embodiment, the bracket 421 further includes two side walls 4215 that are circumferentially spaced along the annular body 4212 and connect the annular body 4212, the support flange 4213 and the outer wall 4214, thereby defining a wire groove 4211 between the two side walls 4215.

[0283] Specifically, two side walls 4215 are disposed opposite to each other on the support flange 4213, protruding along the support flange 4213 toward the outside of the movement housing 41. The side of the two side walls 4215 facing the annular body 4212 is connected to the outer wall of the annular body 4212, and the side away from the annular body 4212 terminates at the outer wall of the outer wall 4214, defining the wiring port 42422 and the slot 42141 between the two side walls 4215, so that the internal lead wire 423 passing through the wiring port 42422 and the external lead wire 48 entering through the slot 42141 extend into the buried wire groove 4211 defined by the two side walls 4215.

[0284] This application also provides a bone conduction headphone core. In one embodiment, the bone conduction headphone core may have the same structure and function as the bone conduction headphone core described above. This bone conduction headphone core can be applied to bone conduction speaker devices or other electronic devices that can transmit sound via bone conduction technology. For related details, please refer to the above embodiments, which will not be repeated here.

[0285] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bone conduction sound amplifier, characterized in that, include: The movement housing includes a peripheral sidewall and a bottom wall connected to one end face of the peripheral sidewall, thereby forming an accommodating space with an open end. A flexible circuit board is disposed inside the housing of the mechanism and has a plurality of first pads and two second pads spaced apart from the first pads. The two second pads are connected to two corresponding first pads among the plurality of first pads through first flexible leads on the flexible circuit board. The flexible circuit board includes a main circuit board and a branch circuit board connected to the main circuit board. A push-button switch is mounted on the main circuit board and connected to other first pads among the plurality of first pads via a second flexible lead on the flexible circuit board. The earphone core is located inside the core housing and is connected to the two second solder pads via external wires; The ear hook is connected to the housing of the core and is provided with multiple ear hook wires. The multiple ear hook wires include two audio signal wires connected to the control circuit and used to transmit audio signals to the earphone core, and at least two auxiliary signal wires connected to the control circuit and used to transmit auxiliary signals to the control circuit. The two audio signal wires are respectively soldered to the two first pads connected to the second pad, and the at least two auxiliary signal wires are respectively soldered to other first pads among the multiple first pads. The plurality of first pads are located at the end of the main circuit board away from the branch circuit board, and are closer to the ear hook than the two second pads located at the end of the branch circuit board away from the main circuit board.

2. The bone conduction speaker device according to claim 1, characterized in that, The push-button switch is located in the area between the plurality of first pads and the two second pads.

3. The bone conduction speaker device according to claim 1, characterized in that, The two second pads are closer to the peripheral sidewall than the connection position between the main circuit board and the branch circuit board.

4. The bone conduction speaker according to any one of claims 1-3, characterized in that, The push-button switch is located on the side of the flexible circuit board facing the bottom wall, and the second pad is located on the side of the flexible circuit board away from the bottom wall.

5. The bone conduction speaker device according to claim 4, characterized in that, The first pad is located on the side of the flexible circuit board away from the bottom end wall.

6. The bone conduction speaker device according to claim 5, characterized in that, The main circuit board has a first rigid support plate on the side away from the push button switch to support the push button switch and keep the first pad exposed, and a second rigid support plate on the side away from the first pad to support the first pad and keep the push button switch exposed. The branch circuit board has a third rigid support plate on the side away from the second pad to support the second pad.

7. The bone conduction speaker device according to claim 1, characterized in that, The external conductor extends along the peripheral sidewall toward the opening end.

8. The bone conduction speaker device according to claim 7, characterized in that, The earphone core is placed in the accommodating space through the open end. The earphone core also includes a bracket and a coil. The coil has an internal lead. The external lead extends to the bracket on the side facing the open end and is connected to the internal lead. The bracket is provided with a wire-buried groove. The external lead extends into the wire-buried groove. The welding position between the internal lead and the external lead is located in the wire-buried groove. The wire-buried groove is filled with sealant.

9. The bone conduction speaker device according to claim 8, characterized in that, At least one of the external conductor and the internal lead is wound and disposed within the buried wire groove.

10. The bone conduction speaker according to claim 1, characterized in that, The branch circuit board extends perpendicular to the extension direction of the main circuit board.

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