A multi-temperature cooling thermosiphon device based on non-azeotropic mixed working medium

Abstract

The application discloses a multi-temperature cooling thermosiphon device based on non-azeotropic mixed working medium, wherein two-phase state non-azeotropic mixed working medium is condensed into two-phase state working medium in a first condenser, and the two-phase state working medium is separated into liquid-phase working medium and gas-phase working medium in a gas separator; the liquid-phase working medium enters a first evaporator through a first outlet to become two-phase state non-azeotropic mixed working medium by heat absorption; the gas-phase working medium enters a second condenser through a second outlet to become saturated liquid-phase working medium by heat release, and the saturated liquid-phase working medium enters a second evaporator to become two-phase state non-azeotropic mixed working medium by heat absorption; and the non-azeotropic mixed working medium in the first evaporator and the second evaporator reenters the first condenser. The application can provide different saturated temperatures to cool servers and has the characteristics of low energy consumption.

Description

Technical Field

[0001] This invention belongs to the field of heat pipe energy-saving technology, and particularly relates to a multi-temperature cooling thermosiphon device based on a non-azeotropic mixed working fluid. Background Technology

[0002] my country is currently in a stage of rapid industrialization and urbanization, with continuous growth in energy consumption for residential use and transportation. Energy consumption is expected to maintain a rigid growth trend, with the telecommunications industry consuming 20% ​​of the world's electricity. In mobile communication networks, base stations are major power consumers, accounting for approximately 80% of energy consumption. The denser the base station network, the higher the energy consumption. Therefore, addressing base station energy consumption is crucial. Traditional base station cooling primarily uses simple mechanical refrigeration to maintain a constant internal air temperature, resulting in extremely high energy consumption throughout the year.

[0003] Thermosiphons, as a type of heat pipe, have advantages such as no moving parts, compact arrangement, low leakage risk, and the ability to select appropriate evaporator and condenser heat exchanger types according to the application background, making them widely used in electronic equipment cooling. Compared to traditional vapor compression cooling, thermosiphons can utilize the low outdoor temperature as a natural cold source to cool indoor air when the outdoor temperature is lower than the indoor temperature in autumn and winter, effectively saving a significant amount of energy. However, with the increasing number of servers in base stations and the growing power difference between servers, traditional single-evaporator thermosiphons can no longer meet the demand. When using a single evaporator to dissipate heat from the air inside the base station, localized hot spots are prone to appear at high-power servers. Therefore, to ensure the safe operation of all servers, maximum cooling capacity must be provided to the base station, resulting in energy waste. In addition, the mixing of hot and cold air inside the base station also causes cooling loss. Summary of the Invention

[0004] To address the shortcomings and deficiencies of existing technologies, the present invention aims to provide a multi-temperature cooling thermosiphon device based on a non-azeotropic working fluid, which can provide multi-temperature cooling for servers with different heat loads, achieve independent temperature control, cool on demand, avoid the occurrence of local hot spots, and reduce cooling energy consumption.

[0005] This invention is implemented as follows: a multi-temperature cooling thermosiphon device based on a non-azeotropic working fluid, comprising a first condenser, a second condenser, a first evaporator, a second evaporator, and a gas separator; the outlet of the first condenser is connected to the inlet of the gas separator via a pipe; the first outlet of the gas separator is connected to the inlet of the first evaporator via a pipe; the second outlet of the gas separator is connected to the inlet of the second condenser via a pipe; the outlet of the second condenser is connected to the inlet of the second evaporator via a pipe; and the outlets of the first and second evaporators are connected to the inlet of the first condenser via pipes. The two-phase non-azeotropic mixture is condensed exothermically in the first condenser to become a two-phase working fluid. This two-phase working fluid enters the gas separator and is separated into a liquid phase and a gas phase. The liquid phase working fluid enters the first evaporator through the first outlet and absorbs heat to become a two-phase non-azeotropic mixture. The gas phase working fluid enters the second condenser through the second outlet and exothermically becomes a saturated liquid phase working fluid. This saturated liquid phase working fluid enters the second evaporator and absorbs heat to become a two-phase non-azeotropic mixture. The non-azeotropic mixture from the first evaporator and the second evaporator re-enters the first condenser.

[0006] Preferably, the outlet of the first condenser is connected to the inlet of the gas separator via a first horizontal pipe, the first outlet of the gas separator is connected to the inlet of the first evaporator via a first downcomer, the second outlet of the gas separator is connected to the inlet of the second condenser via a second horizontal pipe, the outlet of the second condenser is connected to the inlet of the second evaporator via a second downcomer, the outlet of the first evaporator is connected to the inlet of the riser via a third horizontal pipe, the outlet of the second evaporator is connected to the inlet of the riser via a fourth horizontal pipe, and the outlet of the riser is connected to the inlet of the first condenser.

[0007] Preferably, the outlet of the first condenser is a two-phase mixed working fluid outlet; the outlet of the second condenser is a saturated or subcooled liquid working fluid outlet.

[0008] Preferably, the first condenser and the second condenser are tube-fin heat exchangers.

[0009] Preferably, the first evaporator and the second evaporator are microchannel heat exchangers.

[0010] Preferably, the dryness of the two-phase working fluid is controlled through the outlet of the first condenser.

[0011] Compared with the shortcomings and deficiencies of existing technologies, the present invention has the following beneficial effects:

[0012] (1) In this invention, a liquid working fluid rich in high-boiling-point components enters the first evaporator, while a gaseous working fluid rich in low-boiling-point components is cooled to a liquid state by a second condenser before entering the second evaporator. Under the same pressure, the working fluid rich in high-boiling-point components has a higher saturation temperature, while the working fluid rich in low-boiling-point components has a lower saturation temperature. Therefore, this invention can provide different saturation temperatures in the first and second evaporators to cool the server, achieving multi-temperature cooling.

[0013] (2) In traditional single-evaporator thermosiphon tubes, to avoid local hot spots, the maximum airflow and cooling capacity are usually used to cool the servers in the base station, resulting in energy waste. In this invention, the flow rate of the working fluid in the first and second evaporators is determined by the dryness of the two-phase working fluid at the outlet of the first condenser. By adjusting the dryness of the working fluid at the outlet of the first condenser, the cooling capacity of the first and second evaporators can be controlled, providing a large cooling capacity for the high-heat-load servers and effectively reducing cooling energy consumption.

[0014] (3) Traditional thermosiphons typically use evaporators to cool the air inside the base station. The cold air absorbs the heat from the server and then returns to the evaporator. The contact between hot and cold air inside the base station results in a loss of cooling capacity. In this invention, both the first and second evaporators use microchannel heat exchangers to directly contact the server, directly cooling it and avoiding cooling loss, thus effectively reducing cooling energy consumption. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the device of the present invention;

[0016] Figure 2 This is a top view of the structure of the first or second evaporator (i.e., microchannel heat exchanger) in the device of the present invention.

[0017] Figure 3 This is a schematic diagram of the gas-liquid separator in the device of the present invention.

[0018] In the diagram: First condenser-101, First horizontal pipe-102, Gas separator-103, Second horizontal pipe-104, Second condenser-105, Second downcomer-106, Second evaporator-107, Fourth horizontal pipe-108, First downcomer-109, First evaporator-110, Third horizontal pipe-111, Rising pipe-112. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0020] like Figures 1-3 As shown, where, Figure 1 This is a schematic diagram of the structure of the device of the present invention; Figure 2 This is a top view schematic diagram of the first evaporator and the second evaporator (i.e., microchannel heat exchanger) in the device of the present invention; Figure 3 This is a schematic diagram of the gas-liquid separator in the device of the present invention.

[0021] This invention discloses a multi-temperature cooling thermosiphon device based on a non-azeotropic working fluid. The device includes a first condenser 101, a second condenser 105, a first evaporator 110, a second evaporator 107, and a gas separator 103. The outlet of the first condenser 101 is connected to the inlet of the gas separator 103 via a pipe. The first outlet of the gas separator 103 is connected to the inlet of the first evaporator 110 via a pipe. The second outlet of the gas separator 103 is connected to the inlet of the second condenser 105 via a pipe. The outlet of the second condenser 105 is connected to the inlet of the second evaporator 107 via a pipe. The outlets of the first evaporator 110 and the second evaporator 107 are connected to the gas separator 103 via pipes. The inlet of the first condenser 101 is described; wherein, the two-phase non-azeotropic working fluid is exothermically condensed in the first condenser 101 into a two-phase working fluid, which enters the gas separator 103 and is separated into a liquid working fluid and a gas working fluid; the liquid working fluid enters the first evaporator 110 through the first outlet and absorbs heat to become a two-phase non-azeotropic working fluid; the gas working fluid enters the second condenser 105 through the second outlet and exothermically becomes a saturated liquid working fluid, which enters the second evaporator 107 and absorbs heat to become a two-phase non-azeotropic working fluid; the non-azeotropic working fluid of the first evaporator 110 and the second evaporator 107 re-enters the first condenser 101.

[0022] In this embodiment of the invention, valves may be installed on each pipeline as needed (views omitted in the figure).

[0023] In this embodiment of the invention, the gas separator 103 is a gas-liquid separator that perfectly separates the two-phase working fluid entering the gas-liquid separator into a gas phase working fluid and a liquid phase working fluid.

[0024] In this embodiment of the invention, existing heat-dissipating devices that can realize the technical concept of the invention can be used to explain the first condenser 101 and the second condenser 105 of the invention. Preferably, the first condenser 101 and the second condenser 105 are tube-fin heat exchangers.

[0025] In this embodiment of the invention, existing heat-absorbing devices that can realize the technical concept of the invention can be used to explain the first evaporator 110 and the second evaporator 107 of the invention. In this embodiment of the invention, preferably, the first evaporator 110 and the second evaporator 107 are microchannel heat exchangers.

[0026] In this embodiment of the invention, preferably, the outlet of the first condenser 101 is connected to the inlet of the gas separator 103 via a first horizontal pipe 102; the first outlet of the gas separator 103 is connected to the inlet of the first evaporator 110 via a first downcomer 109; the second outlet of the gas separator 103 is connected to the inlet of the second condenser 105 via a second horizontal pipe 104; the outlet of the second condenser 105 is connected to the inlet of the second evaporator 107 via a second downcomer 106; the outlet of the first evaporator 110 is connected to the inlet of the riser pipe 112 via a third horizontal pipe 111; the outlet of the second evaporator 107 is connected to the inlet of the riser pipe via a fourth horizontal pipe 108; and the outlet of the riser pipe is connected to the inlet of the first condenser 101. In this embodiment of the invention, the horizontal pipes are placed horizontally after the actual device is assembled, and the riser pipes and downcomers are placed vertically after the actual device is assembled. The placement of these pipes also indicates the spatial relationship between the first condenser 101, the second condenser 105, the first evaporator 110, the second evaporator 107, and the gas separator 103.

[0027] In a further implementation, to achieve multi-temperature cooling, in this embodiment of the invention, preferably, the outlet of the first condenser 101 is a two-phase mixed working fluid outlet, and the outlet of the second condenser 105 is a saturated or subcooled liquid working fluid outlet. In this embodiment, the liquid working fluid rich in high-boiling-point components enters the first evaporator 110, and the gaseous working fluid rich in low-boiling-point components is cooled to a liquid state by the second condenser 105 before entering the second evaporator 107. Under the same pressure, the working fluid rich in high-boiling-point components has a higher saturation temperature, and the working fluid rich in low-boiling-point components has a lower saturation temperature. Therefore, this invention can provide different saturation temperatures in the first evaporator 110 and the second evaporator 107 to cool the server, achieving multi-temperature cooling.

[0028] In further implementation, to facilitate control of the cooling capacity of the first evaporator 110 and the second evaporator 107, in this embodiment of the invention, preferably, the device controls the dryness of the two-phase working fluid through the outlet of the first condenser 101. In this embodiment of the invention, the flow rate of the working fluid in the first evaporator 110 and the second evaporator 107 is determined by the dryness of the two-phase working fluid at the outlet of the first condenser. By adjusting the dryness of the working fluid at the outlet of the first condenser 101, the cooling capacity of the first evaporator 110 and the second evaporator 107 can be controlled, providing a large cooling capacity for the high heat load server and effectively reducing cooling energy consumption.

[0029] In practical application of this invention, the first evaporator 110 and the second evaporator 107 are installed on the server in the computer room in direct contact. The first condenser 101 and the second condenser 105 are placed outdoors in the computer room. The liquid working fluid rich in high-boiling-point components enters the first evaporator 110, and the gaseous working fluid rich in low-boiling-point components is cooled into a liquid working fluid by the second condenser 105 before entering the second evaporator 107. Under the same pressure, the working fluid rich in high-boiling-point components has a higher saturation temperature, and the working fluid rich in low-boiling-point components has a lower saturation temperature. By providing different saturation temperatures in the first evaporator 110 and the second evaporator 107, the server is cooled, achieving multi-temperature cooling. Furthermore, the flow rate of the working fluid in the first evaporator 110 and the second evaporator 107 is determined by the dryness of the two-phase working fluid at the outlet of the first condenser. By adjusting the dryness of the working fluid at the outlet of the first condenser 101, the cooling capacity of the first evaporator 110 and the second evaporator 107 can be controlled, providing a large cooling capacity for the high-heat-load server and effectively reducing cooling energy consumption. In addition, both the first evaporator 110 and the second evaporator 107 of the present invention adopt microchannel heat exchangers, which directly cool the server, avoiding cold loss and effectively reducing cooling energy consumption.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-temperature cooling thermosiphon device based on a non-azeotropic working fluid, characterized in that, The device includes a first condenser, a second condenser, a first evaporator, a second evaporator, and a gas separator. The outlet of the first condenser is connected to the inlet of the gas separator via a pipe. The first outlet of the gas separator is connected to the inlet of the first evaporator via a pipe. The second outlet of the gas separator is connected to the inlet of the second condenser via a pipe. The outlet of the second condenser is connected to the inlet of the second evaporator via a pipe. The outlets of the first evaporator and the second evaporator are connected to the inlet of the first condenser via pipes. A two-phase non-azeotropic working fluid is exothermically condensed in the first condenser to become a two-phase working fluid. This two-phase working fluid enters the gas separator and is separated into a liquid phase and a gas phase. The liquid phase working fluid enters the first evaporator from the first outlet and absorbs heat to become a two-phase non-azeotropic working fluid. The gas phase working fluid enters the second condenser from the second outlet and exothermically becomes a saturated or subcooled liquid phase working fluid. This saturated or subcooled liquid phase working fluid enters the second evaporator and absorbs heat to become a two-phase non-azeotropic working fluid. The non-azeotropic working fluid from the first and second evaporators re-enters the first condenser.

2. The apparatus as claimed in claim 1, characterized in that, The first condenser outlet is connected to the gas separator inlet via a first horizontal pipe. The first outlet of the gas separator is connected to the first evaporator inlet via a first downcomer. The second outlet of the gas separator is connected to the second condenser inlet via a second horizontal pipe. The second condenser outlet is connected to the second evaporator inlet via a second downcomer. The first evaporator outlet is connected to the riser inlet via a third horizontal pipe. The second evaporator outlet is connected to the riser inlet via a fourth horizontal pipe. The riser outlet is connected to the first condenser inlet.

3. The apparatus as described in claim 1, characterized in that, The first and second condensers are tube-fin heat exchangers.

4. The apparatus as claimed in claim 1, characterized in that, The first evaporator and the second evaporator are microchannel heat exchangers.

5. The apparatus as claimed in claim 1, characterized in that, The cooling capacity of the first evaporator and the second evaporator is controlled by the dryness of the two-phase working fluid at the outlet of the first condenser.

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