Microfluidic channel fabrication method

The microchannel fabrication method using mold casting and hydrophilic treatment solves the problems of high fabrication cost and structural instability, and realizes low-cost, high-stability and large-scale manufacturing of microchannels.

CN117563690BActive Publication Date: 2026-08-25XIAN RARE METAL MATERIALS RES INST CO LTD
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Patent Information

Application Number
CN202311579398.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-11-23
Publication Date
2026-08-25
Estimated Expiration
2043-11-23

AI Technical Summary

Technical Problem

Existing microchannel fabrication methods are costly, inefficient, and structurally unstable, making it difficult to achieve large-scale manufacturing and commercial applications.

Method used

Microchannels are fabricated using a mold casting method. Patterned grooves are engraved on a rigid substrate, and flexible liquid materials are used to fabricate punches and microchannel unit blocks. Hydrophilic treatment is then applied to improve structural stability.

Benefits of technology

It enables low-cost, high-stability, and large-scale manufacturing of microchannels, reduces material and preparation costs, improves fluid flow and structural stability, and avoids fluid leakage or blockage.

✦ Generated by Eureka AI based on patent content.

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Abstract

This disclosure provides a method for fabricating microchannels, relating to the field of microfluidics technology. The method includes: pouring a first liquid material into a mold, the mold including multiple patterned grooves, wherein the depth of the patterned grooves located at the ends of the multiple patterned grooves is greater than the depth of the remaining patterned grooves; after the first liquid material solidifies, peeling it off from the mold to obtain a punch, wherein the patterned protrusions in the punch correspond one-to-one with the patterned grooves in the mold; pouring a second liquid material into the punch, the second liquid material submerging all patterned protrusions except those located at the ends of the punch, but not submerging the patterned protrusions located at the ends of the punch; after the second liquid material solidifies, peeling it off from the punch to obtain a microchannel unit block; and fabricating a microchannel using the microchannel unit block and a substrate. This disclosure can reduce the fabrication cost of microchannels and improve fabrication efficiency.
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Description

Technical Field

[0001] This disclosure relates to the field of microfluidics, and more specifically, to a method for preparing microchannels. Background Technology

[0002] Microfluidics is a technology that uses micro-channels at the micrometer level to control and process minute amounts of fluids. It is a novel interdisciplinary field involving chemistry, fluid mechanics, medicine, life sciences, microelectronics, and microfabrication. Microfluidics plays a vital role in the development of electrical sensors.

[0003] As one of the core technologies of microfluidics, the fabrication methods of microchannels have attracted widespread attention. Currently, the fabrication methods of microchannels generally suffer from high cost and low efficiency.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to provide a method for preparing microchannels, thereby overcoming, at least to some extent, the problems of high cost and low efficiency in preparing microchannels.

[0006] According to a first aspect of this disclosure, a method for fabricating microchannels is provided, comprising: pouring a first liquid material into a concave mold, the concave mold including a plurality of patterned grooves, wherein the depth of the patterned groove located at the end of the plurality of patterned grooves is greater than the depth of the remaining patterned grooves; after the first liquid material has solidified, peeling it off from the concave mold to obtain a punch, wherein the patterned protrusions in the punch correspond one-to-one with the patterned grooves in the concave mold; pouring a second liquid material into the punch, wherein the second liquid material submerges the remaining patterned protrusions in the punch except for the patterned protrusions located at the end of the punch and does not submerge the patterned protrusions located at the end of the punch; after the second liquid material has solidified, peeling it off from the punch to obtain a microchannel unit block; and fabricating a microchannel using the microchannel unit block and a substrate.

[0007] Optionally, fabricating a microchannel using a microchannel unit block and a substrate includes: hydrophilizing the microchannel unit block to obtain a hydrophilized microchannel unit block; and fabricating a microchannel using the hydrophilized microchannel unit block and the substrate.

[0008] Optionally, the microchannel unit block is subjected to hydrophilic treatment to obtain a hydrophilic microchannel unit block, including: treating the inner wall of the groove included in the microchannel unit block with a hydrophilic coating, and obtaining the hydrophilic microchannel unit block after the hydrophilic coating on the inner wall dries.

[0009] Optionally, the microchannel is prepared using the hydrophilized microchannel unit block and the substrate, which includes: placing the hydrophilized microchannel unit block on the substrate to obtain the microchannel.

[0010] Optionally, the hydrophilicated microchannel unit blocks are disposed on the substrate to obtain microchannels, including: connecting the hydrophilicated microchannel unit blocks to the substrate using an adhesive to obtain microchannels.

[0011] Optionally, the microchannel fabrication method further includes forming multiple patterned grooves on the upper surface of a rigid substrate to obtain a concave mold.

[0012] Optionally, multiple patterned grooves are formed on the upper surface of the rigid substrate to obtain a cavity mold, including: adhering double-sided adhesive to the lower surface of the rigid substrate and adhering oil paper to the other side of the double-sided adhesive; engraving multiple patterned grooves on the upper surface of the rigid substrate by laser engraving; peeling off the oil paper and adhering the lower surface of the rigid substrate to the bottom of the open container with double-sided adhesive to obtain a cavity mold.

[0013] Alternatively, the rigid substrate may be made of acrylic, polyethylene, polystyrene, polyvinyl chloride, glass, carbon steel, or aluminum.

[0014] Optionally, the first liquid material is silicone, polyurethane, or hydrogel. After curing, the first liquid material is flexible and easy to peel off. Furthermore, the punch obtained based on this first liquid material can be reused.

[0015] Optionally, the second liquid material is resin, acrylic, or a mixture, wherein the mixture is a mixture of sodium silicate water glass and condensed aluminum phosphate.

[0016] According to a second aspect of this disclosure, a microchannel is provided, which is prepared using any of the microchannel preparation methods described above.

[0017] In some embodiments of the present disclosure, microchannels are prepared by mold casting. The mold preparation process is simple, the mold processing accuracy is high and the cost is low. Moreover, a single preparation can be used multiple times. Mold casting is conducive to large-scale manufacturing and has high preparation efficiency.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 A flowchart illustrating a microchannel fabrication method according to an embodiment of the present disclosure is shown.

[0021] Figure 2 A cross-sectional schematic diagram of the process of constructing a die according to an embodiment of the present disclosure is shown.

[0022] Figure 3 A cross-sectional schematic diagram of the process of obtaining a punch using a die according to an embodiment of the present disclosure is shown.

[0023] Figure 4 A cross-sectional schematic diagram of the process of obtaining microchannel unit blocks according to an embodiment of the present disclosure is shown.

[0024] Figure 5 A cross-sectional schematic diagram of the process of hydrophilicating microchannel unit blocks according to an embodiment of the present disclosure is shown.

[0025] Figure 6 A cross-sectional schematic diagram of the process of configuring microchannel unit blocks on a substrate according to an embodiment of the present disclosure is shown.

[0026] Figure 7 A schematic diagram of the entire process of the microchannel fabrication method according to an embodiment of the present disclosure is shown.

[0027] Figure 8 A photograph of a microchannel prepared using the microchannel preparation method according to an embodiment of the present disclosure is shown after being filled with fluid. Detailed Implementation

[0028] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced with one or more of these specific details omitted, or other methods, processes, steps, etc., can be employed. In other instances, well-known technical solutions are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0029] Furthermore, the accompanying drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. The flowcharts shown in the drawings are merely exemplary illustrations and do not necessarily include all steps. For example, some steps may be broken down, while others may be combined or partially combined; therefore, the actual order of execution may change depending on the actual situation. Additionally, all the terms "first" and "second" below are for distinction purposes only and should not be construed as limiting the content of this disclosure.

[0030] Currently, fabricating low-cost, highly stable microchannels is a major challenge in microfluidic technology. The problems include: First, the high cost of manufacturing technologies and materials. Microchannel fabrication typically requires advanced micro-nano fabrication techniques, such as photolithography and etching, which limit large-scale manufacturing and commercial applications. Second, poor structural stability. The tiny structures within microchannels are easily affected by external environmental factors, such as temperature and fluid pressure changes, which can lead to structural instability, fluid leakage, or channel blockage, posing challenges to the fabrication process. Third, the complex fabrication process. The design and fabrication of microchannels are relatively complex and require precise processing and assembly, demanding high technical expertise.

[0031] To address or at least alleviate the aforementioned problems to some extent, this disclosure provides a novel microchannel fabrication method.

[0032] Figure 1 A flowchart illustrating an exemplary embodiment of the microchannel fabrication method of this disclosure is shown schematically. (Reference) Figure 1 The microchannel fabrication method may include the following steps:

[0033] S10. The first liquid material is poured into a cavity mold, the cavity mold including a plurality of patterned grooves, wherein the depth of the patterned groove located at the end of the plurality of patterned grooves is greater than the depth of the other patterned grooves.

[0034] In an exemplary embodiment of this disclosure, the die is a pre-manufactured rigid mold that can be reused. The die may include multiple patterned grooves; this disclosure does not limit the number of patterned grooves. The depth of the patterned groove at the end of the die is greater than the depth of the remaining patterned grooves. The greater depth of the end patterned grooves compared to the intermediate patterned grooves is to allow for the formation of microchannel injection ports and vents in the corresponding portions of the end patterned grooves during subsequent processes.

[0035] refer to Figure 2 The process of obtaining the die cavity is described. For example... Figure 2 As shown, firstly, double-sided adhesive tape 21 can be adhered to the lower surface of the rigid substrate 20, and the other side of the double-sided adhesive tape can be adhered to parchment paper (not shown). Next, multiple patterned grooves 201 can be engraved on the upper surface of the rigid substrate using, for example, laser engraving. Among these patterned grooves 201, the depth of the patterned grooves 201 located at the ends is greater than the depth of the remaining patterned grooves 201. For example, the depth of the patterned grooves 201 located at the ends ranges from 20 μm to 3000 μm, and the depth of the patterned grooves 201 in the middle ranges from 10 μm to 2000 μm. Subsequently, the parchment paper can be peeled off, and the engraved lower surface of the rigid substrate can be adhered to the bottom of the open container 22 using double-sided adhesive tape 21 to obtain a concave mold.

[0036] It should be noted that in the embodiments employing laser engraving, the laser is used only when constructing the mold cavity; no laser processing occurs in subsequent processes. Furthermore, it should be understood that, in addition to laser engraving, the aforementioned mold cavity can also be constructed using methods such as etching, and this disclosure does not limit this approach.

[0037] The rigid substrate used in the embodiments of this disclosure can be acrylic (PMMA), polyethylene (PE), polystyrene (PS), polyvinyl chloride (PVC), glass, carbon steel, or aluminum, and this disclosure does not limit it.

[0038] With a pre-constructed cavity mold, the first liquid material can be poured into the cavity mold, eliminating air bubbles that may be generated during pouring.

[0039] In some embodiments of this disclosure, the first liquid material may be liquid silicone obtained by mixing the main agent and curing agent of silicone in a certain proportion. The liquid silicone has good fluidity within 1 hour after mixing and can be poured into a concave mold.

[0040] Besides silicone, the first liquid material can also be polyurethane (PU) or hydrogel. It should be noted that the first liquid material is flexible after curing to facilitate subsequent peeling.

[0041] S12. After the first liquid material has solidified, it is peeled off from the die to obtain the punch, wherein the patterned protrusions in the punch correspond one-to-one with the patterned grooves in the die.

[0042] The curing temperature and curing time may vary depending on the first liquid material. Specifically, this step focuses on the curing of the first liquid material, with a curing temperature ranging from 10°C to 90°C and a curing time ranging from 0.1 hours to 72 hours. Taking liquid silicone as an example, the curing method can be 12 hours at 25°C.

[0043] After the first liquid material solidifies, it is peeled off from the die to obtain a punch corresponding to the die. It can be understood that the patterned protrusions in the punch correspond one-to-one with the patterned grooves in the die.

[0044] refer to Figure 3 The first liquid material 30 is poured into the cavity mold. During the solidification process of the first liquid material, it is peeled off from the cavity mold to obtain the punch mold. It is understood that most of the process diagrams shown in this disclosure are schematic cross-sectional views of the process. Figure 3 A three-dimensional view of the punch is also shown as an example.

[0045] It should be noted that the punch is flexible and easy to peel off. In addition, the obtained punch can be reused, that is, in some other embodiments of the microchannel preparation disclosed herein, steps S10 and S12 can be skipped, and the process can start directly from step S14.

[0046] S14. The second liquid material is poured into the punch, and the second liquid material submerges the remaining patterned protrusions except for the patterned protrusions located at the ends of the punch, but does not submerge the patterned protrusions located at the ends of the punch.

[0047] After obtaining the punch, a second liquid material can be poured into the punch. The second liquid material can be a liquid resin obtained by mixing the main component and the curing agent in a certain proportion. This liquid resin has good fluidity within 2 hours after mixing and can be poured into the punch.

[0048] In addition to resin, the second liquid material can also be acrylic or a mixture, which is a mixture of sodium silicate water glass and condensed aluminum phosphate.

[0049] For this casting process, the second liquid material needs to submerge all the patterned protrusions except for the patterned protrusions located at the ends of the punch, while not submerging the patterned protrusions located at the ends of the punch.

[0050] refer to Figure 4 The second liquid material 40 is poured into the punch. The second liquid material 40 needs to submerge the patterned protrusions in the middle without submerging the patterned protrusions at the ends, so that subsequent processes can be carried out.

[0051] S16. After the second liquid material has solidified, it is peeled off from the punch to obtain a microchannel unit block.

[0052] The curing temperature and curing time may vary depending on the second liquid material. Specifically, this step focuses on curing the second liquid material, with a curing temperature ranging from 10°C to 50°C and a curing time ranging from 1 hour to 30 hours. Taking a liquid resin as an example, the curing method can be 24 hours at 25°C.

[0053] The second liquid material used in this embodiment, after solidification, is easily peeled off from the solidified first liquid material, resulting in the microchannel unit block and the punch not adhering to each other, and neither the mold nor the microchannel unit block being damaged. (Continue to refer to...) Figure 4 The diagram shows the microchannel unit block obtained after the second liquid material 40 is cured and peeled off from the punch.

[0054] S18. Microchannels are fabricated using microchannel unit blocks and substrates.

[0055] In exemplary embodiments of this disclosure, the substrate is a functional substrate, and the resulting microchannels enable the detection of liquids within the microchannels. For example, the microchannels prepared in embodiments of this disclosure can be used in the detection of biological fluids.

[0056] This disclosure does not limit the material of the substrate, such as including but not limited to indium tin oxide (ITO), circuit boards, polyvinyl chloride, glass plates, etc.

[0057] According to some embodiments of this disclosure, microchannel unit blocks and substrates can be connected using adhesives to form microchannels. The adhesive may include, but is not limited to, liquid resin or acrylic, and the amount of adhesive used may range from, for example, 1 μL to 1000 μL.

[0058] According to other embodiments of this disclosure, in order to further address the problem of leakage or blockage that may occur in the microchannels, the microchannel unit blocks may be hydrophilized before being connected to the substrate.

[0059] First, the microchannel unit blocks can be hydrophilized to obtain hydrophilized microchannel unit blocks. Specifically, the inner walls of the tanks included in the microchannel unit block are treated with a hydrophilic coating. After the hydrophilic coating on the inner walls dries, the hydrophilized microchannel unit block is obtained. (Reference) Figure 5 A hydrophilic coating is dripped onto the tank contained in the microchannel unit. The coating automatically spreads on the inner wall of the tank, eventually covering the entire inner wall. After the water in the hydrophilic coating evaporates, a layer of hydrophilic functional groups is formed on the surface of the inner wall. The hydrophilic coating can be, for example, an agarose fluid, which can be generated by mixing agarose powder with ultrapure water and then heating and boiling it. This disclosure does not impose any limitations on this method.

[0060] Next, the hydrophilicized microchannel unit blocks are placed on the substrate to obtain microchannels.

[0061] Figure 6 This schematically illustrates the process of configuring microchannel unit blocks on a substrate. (Reference) Figure 6 Adhesive 601 is applied between the microchannel unit block and the substrate 60 via capillary action. After curing, the microchannel unit block and the substrate are firmly bonded together. The through holes corresponding to the patterned grooves at the end of the aforementioned die form injection ports and vent ports, respectively. The cross-sectional area of ​​the injection ports and vent ports is, for example, 20 μm. 2 Up to 20mm 2 .in addition, Figure 6 A schematic diagram of the microchannels obtained through the above process is shown in three dimensions.

[0062] The following is for reference. Figure 7 The entire process of the microchannel fabrication method according to the first embodiment of this disclosure will be described.

[0063] First, a reusable die is prepared. Specifically, an acrylic double-sided adhesive is adhered to the bottom surface of an acrylic substrate, and a piece of parchment paper is adhered to the other side of the adhesive. The upper surface of the acrylic substrate is engraved using a laser engraving method to obtain an acrylic substrate with multiple patterned grooves on the upper surface. The depth of the patterned grooves at both ends of the pattern is greater than the depth of the patterned grooves in the middle of the pattern lines. For example, the depth of the patterned grooves at both ends is 500 μm, and the depth of the patterned grooves in the middle is 200 μm. Alternatively, the depths of the multiple patterned grooves in the middle may not be exactly the same; this disclosure does not limit this. After peeling off the parchment paper, the lower surface of the acrylic substrate can be adhered to the bottom of an open container. Thus, a reusable rigid die is obtained.

[0064] Next, a punch is prepared. In some embodiments of this disclosure, the punch can also be reused. Specifically, the silicone base and curing agent are mixed in a certain proportion to obtain liquid silicone. The liquid silicone is poured into a cavity mold, and air bubbles are removed. It is cured at 25°C for 12 hours, and after curing, it is peeled off from the cavity mold to obtain a punch, which can also be called a silicone punch. The cross-sectional width of the line is, for example, 300 μm, and the height is, for example, 200 μm.

[0065] Subsequently, microchannel unit blocks are prepared. Specifically, the resin main agent and curing agent are mixed in a certain proportion to obtain liquid resin. This liquid resin is poured into a punch, wherein the liquid resin needs to submerge all patterned protrusions except for the end patterned protrusions, but not completely submerge the end patterned protrusions, so that the patterned protrusions can subsequently correspond to injection ports and vents. After curing at 25°C for 24 hours, the cured microchannel is peeled off from the die to obtain a resin-based microchannel with patterned grooves. The two ends of the patterned grooves are through holes, corresponding to the injection port and vent, respectively, with a cross-sectional area of ​​0.2 mm². 2 .

[0066] Next, the microchannel unit blocks are hydrophilized. Specifically, 50 μL of hydrophilic coating is slowly dripped into the center of the patterned groove, ensuring it does not overflow. The coating automatically spreads on the inner wall of the groove, eventually covering the entire inner wall. After the water in the coating evaporates, a layer of hydrophilic functional groups forms on the inner wall surface.

[0067] Finally, a complete microchannel is fabricated. Specifically, the aforementioned microchannel unit blocks (i.e., resin-based microchannels) are mounted on an ITO glass substrate. Patterned grooves and the glass together form a cavity. For the gaps at the interface, for example, 100 μL of liquid resin can be dripped onto the edge of the gap. The liquid resin automatically fills the gap through capillary action, thus acting as an adhesive. After the adhesive cures, the microchannel unit blocks are firmly bonded to the ITO glass, thereby obtaining a complete microchannel with a cross-sectional dimension of, for example, 0.06 mm. 2 .

[0068] When in use, the liquid (usually the object to be tested) can be dripped into the injection port. The liquid can automatically fill the entire microchannel, and the internal air is expelled through the vent. Figure 8 A photograph of a microchannel fabricated using the microchannel fabrication method of the present disclosure is shown schematically.

[0069] The entire process of the microchannel fabrication method according to the second embodiment of this disclosure will now be described.

[0070] First, patterned grooves can be engraved on an aluminum plate using laser engraving to create a reusable aluminum-based rigid mold.

[0071] Next, hot melt adhesive can be poured onto the rigid aluminum mold. After curing, the adhesive block can be removed to obtain the adhesive block punch. Specifically, the adhesive block is a flexible adhesive block, and the adhesive block punch is a flexible adhesive block punch.

[0072] Subsequently, a mixture of sodium silicate water glass and condensed aluminum phosphate is poured onto the punch. As required by the second liquid material described above, the mixture must submerge the patterned protrusions in the middle but not the patterned protrusions at the upper end of the punch. After curing, the punch is peeled off to obtain microchannel unit blocks.

[0073] Then, the microchannel unit blocks are treated with hydrophilic coatings, and the process is the same as described above, so it will not be repeated here.

[0074] Finally, the microchannel unit block is placed on the circuit board, and liquid glass-specific adhesive is filled into the gap between the microchannel unit block and the circuit board through capillary action, so that the two are connected together, thus obtaining the microchannel.

[0075] The entire process of the microchannel fabrication method according to the third embodiment of this disclosure will now be described.

[0076] First, patterned grooves can be engraved on an acrylic substrate using laser engraving to create a reusable rigid mold.

[0077] Next, liquid silicone can be poured into the rigid mold, and after curing, the silicone punch can be removed.

[0078] Subsequently, liquid resin is poured onto the punch. As required by the second liquid material described above, the liquid resin should submerge the patterned protrusions in the center but not the patterned protrusions at the upper end of the punch. After curing, the punch is peeled off to obtain microchannel unit blocks.

[0079] Then, glue is applied to a flat circuit board, and the microchannel unit block is placed on the circuit board to connect the two together, thus obtaining the microchannel.

[0080] Based on the exemplary microchannel fabrication method described above, the molds are low-cost, highly accurate, and easy to manufacture, and can be reused. Therefore, the microchannels of this disclosure can achieve low cost, high stability, and large-scale manufacturing. Furthermore, some embodiments of this disclosure employ inexpensive and efficient hydrophilic coatings to hydrophilize the inner walls of the channels, which facilitates the flow of aqueous fluids within the channels, reduces flow resistance, decreases liquid pressure on the structure, effectively prevents fluid leakage or blockage, and improves structural stability. In addition, this disclosure primarily uses various inexpensive liquid polymer materials to fabricate the molds and microchannels, significantly reducing material costs. Therefore, this disclosure provides a low-cost, easily mass-producible, and highly stable microchannel fabrication solution with broad application value.

[0081] Furthermore, this disclosure also provides a microchannel, which is prepared by the microchannel preparation method described above.

[0082] It should be noted that although the steps of the method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple steps.

[0083] Furthermore, the above figures are merely illustrative of the processes included in the method according to exemplary embodiments of this disclosure and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0084] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0085] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A method for preparing microchannels, characterized in that, include: A first liquid material is poured into a cavity mold, the cavity mold including a plurality of patterned grooves, wherein the depth of the patterned groove located at the end of the plurality of patterned grooves is greater than the depth of the other patterned grooves; After the first liquid material solidifies, it is peeled off from the concave mold to obtain the convex mold, wherein the patterned protrusions in the convex mold correspond one-to-one with the patterned grooves in the concave mold; A second liquid material is poured into the punch, the second liquid material submerging all patterned protrusions except for the patterned protrusions located at the ends of the punch and not submerging the patterned protrusions located at the ends of the punch; After the second liquid material solidifies, it is peeled off from the punch to obtain a microchannel unit block; The microchannel is fabricated using the microchannel unit block and the substrate, comprising: treating the inner wall of the groove included in the microchannel unit block with a hydrophilic coating; after the hydrophilic coating on the inner wall dries, a hydrophilized microchannel unit block is obtained; and the hydrophilized microchannel unit block is connected to the substrate with an adhesive to obtain the microchannel. The microchannel fabrication method further includes: The plurality of patterned grooves are formed on the upper surface of a rigid substrate to obtain the cavity. The step of forming the plurality of patterned grooves on the upper surface of the rigid substrate to obtain the concave mold includes: adhering double-sided adhesive to the lower surface of the rigid substrate and adhering oil paper to the other side of the double-sided adhesive; engraving the plurality of patterned grooves on the upper surface of the rigid substrate by laser engraving; peeling off the oil paper and adhering the lower surface of the rigid substrate to the bottom of the open container with the double-sided adhesive to obtain the concave mold.

2. The microchannel fabrication method according to claim 1, characterized in that, The rigid substrate is made of acrylic, polystyrene, glass, carbon steel, or aluminum.

3. The microchannel fabrication method according to claim 1, characterized in that, The first liquid material is silicone, polyurethane, or hydrogel.

4. The microchannel fabrication method according to claim 1, characterized in that, The second liquid material is resin, acrylic, or a mixture, wherein the mixture is a mixture of sodium silicate water glass and condensed aluminum phosphate.

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