Semiconductor cavity high-precision polishing machine

Abstract

The application relates to the technical field of semiconductor polishing processing, and discloses a high-precision semiconductor cavity polishing machine, which comprises a positioning base, a sliding base movably arranged on the positioning base, a polishing mounting base rotatably arranged at the end of a connecting arm, a track-type polishing assembly arranged on the outer side of the polishing mounting base, cleaning members and polishing liquid adding members arranged at the middle and the side of the inner side of the polishing mounting base respectively, and a tightening mechanism arranged on the polishing mounting base and used for adjusting the tightness and distribution state of the track-type polishing assembly and improving polishing precision. The high-precision semiconductor cavity polishing machine improves polishing processing efficiency, facilitates rapid processing of recessed areas such as curved surfaces, can effectively clean the polishing assembly and continuously and stably add polishing liquid to the polishing assembly, and improves polishing precision.

Description

Technical Field

[0001] This invention relates to the field of semiconductor polishing technology, specifically to a high-precision polishing machine for semiconductor cavities. Background Technology

[0002] Semiconductor cavities were developed to reduce the number of vacuum cavities in semiconductor applications while maintaining almost no change in wafer capacity. This structure utilizes a moving vacuum with pre-installed air bearings equipped with differential pressure vacuum grooves; the product features improved static and dynamic response of machine positioning, and reduced evacuation and settling times.

[0003] In the manufacturing of semiconductor cavities, in order to improve the accuracy of output and reduce the side effects of processing burrs and rough edges, the cavity components themselves need to be ground and polished. High-precision polishing components are used to perform comprehensive and detailed polishing of the semiconductor cavity, increasing the smoothness of the cavity itself. Due to the influence of the components and materials of the semiconductor cavity itself, the polishing process is different from conventional polishing. In addition to considering the polishing accuracy, semiconductor cavity polishing also needs to reduce the external force during polishing to prevent the semiconductor cavity from undergoing overall local deformation damage during polishing.

[0004] Existing grinding and polishing equipment uses a tracked polishing belt for reciprocating polishing operations. However, in actual processing, the equipment is prone to leaving dust and other impurities, resulting in a high level of dust residue in the working environment. This can easily damage the semiconductor cavity during polishing, affecting the polishing progress. Furthermore, it is inconvenient to add polishing slurry, and the unstable and continuous operation with added slurry can directly affect the polishing progress of the semiconductor cavity. In addition, polishing residue can easily remain on the curved and concave areas of the cavity, leading to incomplete polishing.

[0005] To address the aforementioned problems, a novel high-precision polishing machine for semiconductor cavities is provided, resolving the issues raised in the background section. Summary of the Invention

[0006] The purpose of this invention is to provide a high-precision polishing machine for semiconductor cavities, in order to solve the problems mentioned in the background art. Currently available polishing equipment on the market is prone to leaving dust and other impurities in actual processing operations, resulting in a lot of dust residue in the working environment. This can easily cause damage to the semiconductor cavity during polishing, affecting the polishing progress. At the same time, it is inconvenient to add polishing fluid to assist in the polishing process.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a high-precision polishing machine for semiconductor cavities, comprising:

[0008] A positioning base, on which a sliding base is movably mounted, and a robotic arm is provided above the sliding base, with a connecting arm connected to the end of the robotic arm;

[0009] It also includes: a grinding mounting base, which is rotatably mounted on the end of the connecting arm. A tracked polishing assembly is provided on the outer side of the grinding mounting base, and a cleaning component and a polishing liquid adding component for the tracked polishing assembly are respectively provided in the middle and on the side of the interior of the grinding mounting base, so as to perform surface cleaning and polishing treatment of the tracked polishing assembly and quantitative addition of polishing liquid.

[0010] The tightening mechanism, located on the grinding mounting base, is used to adjust the tightness and distribution of the track-type polishing assembly, thereby improving polishing accuracy.

[0011] Preferably, the tracked polishing assembly includes a guide roller and a steering wheel, wherein the guide roller and the steering wheel are rotatably mounted at the top and bottom corners of the polishing mounting base, respectively, and a soft polishing strip is movably mounted on the outer side of the guide roller and the steering wheel. A motor assembly is fixed in the middle of the back of the polishing mounting base, wherein the motor assembly drives the guide roller to rotate through a chain assembly.

[0012] Preferably, there are two guide rollers and two steering rollers symmetrically arranged about the vertical central axis of the grinding mounting base, and the guide rollers and steering rollers are distributed parallel to each other, and the soft grinding strip below the steering roller is horizontally arranged.

[0013] Preferably, the cleaning component includes a cleaning chamber located in the middle of the grinding mounting base, and two symmetrically distributed positioning rollers are arranged inside the cleaning chamber. The positioning rollers realize the rotation and positioning of the soft grinding strip. A reciprocating screw is arranged directly above the middle position of the two positioning rollers. The reciprocating screw is fixed to the end of the motor shaft of the motor assembly. A guide bracket is sleeved on the outer wall of the reciprocating screw. Meanwhile, a fixing seat is fixed on the inner wall of the grinding mounting base directly below the middle position of the two positioning rollers. A cleaning brush is sleeved on the outer side of the fixing seat. Permanent magnets are embedded in the middle of the top of the cleaning brush and the middle of the bottom of the guide bracket.

[0014] Preferably, the guide bracket is hollowed out as a whole, and the guide bracket is threadedly connected to the reciprocating lead screw. The guide bracket, the fixed seat, and the cleaning brush are all vertically coaxially distributed. The middle part of the cleaning brush and the fixed seat form a through-fitting sliding installation structure. The top surface of the middle part of the cleaning brush is in contact with the bottom surface of the guide bracket and the outer wall of the soft abrasive strip between the positioning roller.

[0015] Preferably, a drain pipe and a liquid inlet pipe are fixedly connected through the upper and lower parts of the cleaning chamber, respectively, and the drain pipe is located above the soft grinding strip between the positioning rollers. The drain pipe and the liquid inlet pipe are connected to the external cleaning liquid circulation assembly.

[0016] Preferably, the polishing fluid addition component includes a fluid addition chamber on the left and right sides inside the grinding mounting base, and a fluid injection chamber is fixed above the fluid addition chamber. The fluid injection chamber is connected to the external polishing fluid pressurization component through a pipe, and a U-shaped tube is fixed between the fluid addition chamber and the cleaning chamber. The top of the U-shaped tube and the bottom of the fluid injection chamber are both located above the positioning horizontal height of the drain pipe.

[0017] Preferably, a vertical rod is slidably installed through the bottom of the injection chamber inside the filling chamber. A float plate is fixed to the lower end of the vertical rod, and a liquid seal plug is fixed to the middle section of the vertical rod inside the injection chamber. An elastic element is fixed to the top of the liquid seal plug and the inner wall of the injection chamber. An injection hole is opened on the injection chamber directly below the liquid seal plug, and the liquid seal plug realizes the sealing control of the injection hole.

[0018] Preferably, the tightening mechanism is provided in two parts. The first part is located inside the grinding mounting base directly above the liquid filling chamber. The first part of the tightening mechanism includes an adjusting frame hinged to the inner wall of the grinding mounting base. An elastic element is provided at the hinge between the adjusting frame and the grinding mounting base. An adjusting roller is rotatably installed at the end of the adjusting frame. The adjusting roller realizes the tightness adjustment of the soft grinding strip. The outer wall of the adjusting roller is in contact with the bottom of the soft grinding strip.

[0019] Preferably, the second part of the tightening mechanism is located at the bottom center of the grinding mounting base. The second part of the tightening mechanism includes a spacer cavity at the bottom center of the grinding mounting base. Lifting frames are evenly spaced in the spacer cavity. A rotating rod is rotatably installed at the bottom of the lifting frame. The lifting frame and the spacer cavity form a through-type telescopic structure. An elastic element is provided at the through-connection. A magnet is provided at the top of the lifting frame. At the same time, electromagnets are distributed one-to-one on the inner wall of the top of the spacer cavity directly above the lifting frame.

[0020] Compared with the prior art, the beneficial effects of the present invention are: this high-precision polishing machine for semiconductor cavities improves polishing efficiency, facilitates rapid processing of concave areas such as curved surfaces, and can effectively clean polishing components and continuously and stably add polishing fluid during continuous polishing, thereby improving polishing precision. The specific details are as follows:

[0021] 1. Firstly, a tracked polishing component is used to achieve stable and effective polishing of the semiconductor cavity. Simultaneously, a cleaning mechanism and a polishing fluid addition mechanism are respectively installed in the middle and on the sides of the polishing mounting base. These mechanisms continuously clean the tracked polishing component and add polishing fluid during the processing. The cleaning component utilizes a motor assembly and a chain drive assembly. Through the threaded connection between the reciprocating screw and the guide bracket, the guide bracket is driven to move reciprocally. During the movement of the guide bracket, the magnetism between permanent magnets achieves a synchronous driving effect on the cleaning brush. The moving action of the cleaning brush and the reciprocating circulation of the cleaning fluid in the inlet pipe and the filling chamber achieve the cleaning effect of dust and impurities on the soft polishing strip. The polishing fluid addition mechanism, through the action of the floating plate installed on the filling chamber, uses the buoyancy of the liquid to drive the floating plate to rise and fall as the liquid in the filling chamber continues to increase in height, thus introducing the external polishing fluid into the filling chamber. Through the U-shaped tube and the siphon principle, the mixture of polishing fluid and cleaning fluid is introduced into the cleaning chamber. Under the action of thorough mixing of the liquid, the cleaning effect of dust and impurities on the soft polishing strip and the addition of polishing fluid are achieved simultaneously, thereby improving the polishing efficiency of the semiconductor cavity.

[0022] 2. This technical solution also includes a tightening mechanism for the soft polishing strip. The tightening roller is positioned directly above the liquid filling chamber. During continuous conveying of the soft polishing strip, the relative squeezing force between the strip and the roller directs excess solution from the strip into the filling chamber, ensuring continuous addition of solution and supporting the siphoning of liquid within the chamber. The tightening roller can also be used in conjunction with the spacer cavity and its internal components. When polishing a flat semiconductor cavity, the presence of curved surfaces and depressions makes adjusting the polishing precision difficult. In this case, the repulsive force between the electromagnet and the magnet at the top of the lifting frame drives the lifting frame and rotating rod to selectively lift and lower, pushing the soft polishing strip to better conform to the curved surfaces and depressions of the semiconductor cavity. This facilitates rapid and stable polishing operations and improves the polishing precision of the cavity. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the front structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the installation structure of the grinding mounting base of the present invention;

[0025] Figure 3 This is a schematic diagram of the external structure of the grinding mounting base of the present invention;

[0026] Figure 4 This is a schematic diagram of the internal structure of the grinding mounting base of the present invention;

[0027] Figure 5 This is a schematic diagram of the guide bracket installation structure of the present invention;

[0028] Figure 6 This is a schematic diagram of the cleaning brush installation structure of the present invention;

[0029] Figure 7 This is a schematic diagram of the installation and distribution structure of the tightening roller and the liquid injection cavity of the present invention;

[0030] Figure 8 This is a schematic diagram of the internal structure of the injection chamber of the present invention;

[0031] Figure 9 This is a schematic diagram of the internal structure of the spacer cavity of the present invention.

[0032] In the diagram: 1. Positioning base; 2. Sliding base; 3. Robotic arm; 4. Connecting arm; 5. Grinding mounting base; 6. Guide roller; 7. Steering wheel; 8. Soft grinding strip; 9. Motor assembly; 10. Cleaning chamber; 11. Positioning roller; 12. Reciprocating screw; 13. Guide bracket; 14. Fixed seat; 15. Cleaning brush; 16. Permanent magnet; 17. Drain pipe; 18. Inlet pipe; 19. Liquid filling chamber; 20. Injection chamber; 21. Vertical rod; 22. Float plate; 23. Liquid seal plug; 24. U-tube; 25. Adjusting frame; 26. Tensioning roller; 27. Interval chamber; 28. Lifting frame; 29. ​​Rotating rod; 30. Electromagnet. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1

[0035] Please see Figures 1-4 This invention provides a technical solution: a high-precision polishing machine for semiconductor cavities, comprising:

[0036] A positioning base 1 is provided, on which a sliding base 2 is movably mounted, and a robotic arm 3 is provided above the sliding base 2, and a connecting arm 4 is connected to the end of the robotic arm 3.

[0037] It also includes: a grinding mounting base 5, which is rotatably mounted on the end of the connecting arm 4. A tracked polishing assembly is provided on the outside of the grinding mounting base 5, and a cleaning component and a polishing liquid adding component for the tracked polishing assembly are respectively provided in the middle and on the side of the interior of the grinding mounting base 5, so as to perform surface cleaning and polishing treatment of the tracked polishing assembly and quantitative addition of polishing liquid.

[0038] The tracked polishing assembly includes guide rollers 6 and steering wheels 7, which are rotatably mounted on the top and bottom corners of the polishing mounting base 5, respectively. Soft polishing strips 8 are movably mounted on the outer sides of the guide rollers 6 and steering wheels 7. A motor assembly 9 is fixed in the center of the back of the polishing mounting base 5. The motor assembly 9 drives the guide rollers 6 to rotate via a chain assembly. Two guide rollers 6 and two steering wheels 7 are symmetrically arranged about the vertical central axis of the polishing mounting base 5, and the guide rollers 6 and the steering wheels 7 are parallel to each other. The soft polishing strips 8 below the steering wheels 7 are horizontally arranged.

[0039] like Figure 2-4 As shown, by simply starting the rotation of the motor assembly 9, the guide roller 6 can be directly driven to rotate under the action of the chain belt assembly. Utilizing the meshing connection and friction, the soft polishing strip 8 is driven to reciprocate as the guide roller 6 rotates. Through the continuous movement of the soft polishing strip 8, its polishing surface is made to adhere to the outer wall of the semiconductor cavity for operation, thereby achieving the polishing effect of cavity processing.

[0040] Example 2

[0041] Based on Embodiment 1, the present invention also discloses a cleaning component inside a high-precision polishing machine for semiconductor cavities, which enables surface cleaning of the track-type polishing assembly, as detailed below:

[0042] The cleaning component includes a cleaning chamber 10 located in the center of the grinding mounting base 5. Two symmetrically distributed positioning rollers 11 are arranged inside the cleaning chamber 10. The positioning rollers 11 position the soft grinding strip 8 for rotational positioning. A reciprocating lead screw 12 is positioned directly above the center of the two positioning rollers 11 and is fixed to the end of the motor shaft of the motor assembly 9. A guide bracket 13 is fitted onto the outer wall of the reciprocating lead screw 12. A fixing seat 14 is fixed to the inner wall of the grinding mounting base 5 directly below the center of the two positioning rollers 11. A cleaning brush 15 is fitted onto the outer side of the fixing seat 14. Permanent magnets 1 are embedded in the center of the top of the cleaning brush 15 and the center of the bottom of the guide bracket 13. 6; The guide bracket 13 is hollowed out and threadedly connected to the reciprocating screw 12. The guide bracket 13, the fixed seat 14, and the cleaning brush 15 are all vertically coaxially distributed. The middle part of the cleaning brush 15 and the fixed seat 14 form a through sliding installation structure. The top surface of the middle part of the cleaning brush 15 is in contact with the bottom surface of the guide bracket 13 and the outer wall of the soft abrasive strip 8 between the positioning roller 11. The upper and lower parts of the cleaning chamber 10 are respectively fixedly connected to the drain pipe 17 and the inlet pipe 18. The drain pipe 17 is located above the soft abrasive strip 8 between the positioning rollers 11. The drain pipe 17 and the inlet pipe 18 are connected to the external cleaning fluid circulation assembly.

[0043] like Figure 4 As shown, the drain pipe 17 and the inlet pipe 18 are interconnected with the external cleaning fluid circulation assembly. The cleaning fluid circulation assembly enables the circulation of cleaning fluid within the cleaning chamber 10. Simultaneously, the drain pipe 17 directly controls the highest water level inside the cleaning chamber 10. Meanwhile, the soft abrasive strip 8, positioned by the positioning roller 11, penetrates the cleaning chamber 10, and moves within the cleaning fluid inside the cleaning chamber 10. Figure 5-6 As shown, the motor assembly 9 drives the guide bracket 13 to move via the reciprocating lead screw 12. The guide bracket 13 uses the permanent magnet 16 to magnetically attract and move the cleaning brush 15 synchronously. Both the guide bracket 13 and the cleaning brush 15 are in contact with the outer wall of the soft polishing strip 8 to perform a leveling operation. At the same time, under the action of the lateral reciprocating movement of the cleaning brush 15, it can also perform a brushing operation on the surface of the soft polishing strip 8, so that dust and other impurities on the surface of the soft polishing strip 8 can be quickly cleaned.

[0044] Example 3

[0045] Based on Embodiments 1 and 2, the present invention also discloses a polishing slurry adding component for a high-precision polishing machine for semiconductor cavities. This polishing slurry adding component is used in combination with the first part of the tightening mechanism, and its specific method is as follows:

[0046] The polishing slurry adding component includes slurry filling chambers 19 on the left and right sides inside the grinding mounting base 5, and an injection chamber 20 is fixed above the slurry filling chambers 19. The injection chamber 20 is connected to the external polishing slurry pressurization component through a pipe, and a U-shaped tube 24 is fixed between the slurry filling chambers 19 and the cleaning chamber 10. The top of the U-shaped tube 24 and the bottom of the injection chamber 20 are both located above the horizontal level of the drain pipe 17. A vertical rod 21 is slidably installed through the bottom of the injection chamber 20 inside the slurry filling chamber 19. A float plate 22 is fixed to the lower end of the vertical rod 21, and a liquid seal plug 23 is fixed to the middle section of the vertical rod 21 inside the injection chamber 20. The top of the liquid seal plug 23 is fixed to the inner wall of the liquid injection cavity 20 with an elastic element. The liquid injection cavity 20 directly below the liquid seal plug 23 is provided with an injection hole. The liquid seal plug 23 realizes the sealing control of the injection hole. The first part is set inside the grinding mounting base 5 directly above the liquid filling cavity 19. The first part of the tightening mechanism includes an adjusting frame 25 hinged to the inner wall of the grinding mounting base 5. An elastic element is provided at the hinge of the adjusting frame 25 and the grinding mounting base 5. The end of the adjusting frame 25 is rotatably mounted with a tightening roller 26. The tightening roller 26 realizes the tightness adjustment of the soft grinding strip 8. The outer wall of the tightening roller 26 is in contact with the bottom of the soft grinding strip 8.

[0047] like Figure 4 and Figure 7-8 As shown, when the soft polishing strip 8 moves, it is cleaned in the cleaning chamber 10 and will be partially contaminated with solution. The soft polishing strip 8 is supported by the adjusting frame 25 and the tightening roller 26. Due to the squeezing force, the soft polishing strip 8 is pressed by the tightening roller 26, causing the solution contaminated on the soft polishing strip 8 to be introduced into the liquid filling chamber 19 for temporary storage under the squeezing force and gravity. The solution in the liquid filling chamber 19 gradually increases, and as the water level rises, the water level pushes the vertical rod 21 and the liquid seal plug 23 upwards through the float 22, causing the liquid seal plug 23 to no longer seal the liquid injection. The injection hole on the cavity 20 allows the polishing slurry, which is connected to the outside world, to be introduced into the liquid filling cavity 19. As the water level in the liquid filling cavity 19 increases, it rises above the top of the U-shaped tube 24. There is a height difference between the water levels in the liquid filling cavity 19 and the cleaning cavity 10. Under the siphon effect, all the solution in the liquid filling cavity 19 is introduced into the cleaning cavity 10. During the introduction process, the polishing slurry and the cleaning slurry are completely mixed, reducing the waste of polishing slurry. At the same time, it allows the soft polishing strip 8 to carry the polishing slurry synchronously to perform the polishing operation of the semiconductor cavity when it moves, thereby improving the efficiency of the polishing operation.

[0048] Example 4

[0049] Based on Embodiment 3, the present invention also discloses a tightening mechanism for a high-precision polishing machine for semiconductor cavities, which solves the problem of incomplete polishing caused by irregular surfaces such as curved surfaces and depressions on the outer surface of semiconductor cavities. The specific method is as follows:

[0050] The tightening mechanism consists of two parts. The first part is located inside the grinding mounting base 5 directly above the liquid filling chamber 19. This first part of the tightening mechanism includes an adjusting frame 25 hinged to the inner wall of the grinding mounting base 5. An elastic element is provided at the hinge point between the adjusting frame 25 and the grinding mounting base 5, and an adjusting roller 26 is rotatably mounted at the end of the adjusting frame 25. The adjusting roller 26 adjusts the tightness of the soft grinding strip 8, and the outer wall of the adjusting roller 26 is in contact with the bottom of the soft grinding strip 8. The second part of the tightening mechanism is located inside the grinding mounting base 5. At the bottom center of the mounting base 5, the second part of the tightening mechanism includes a spacer cavity 27 at the bottom center of the mounting base 5. Lifting frames 28 are evenly spaced in the spacer cavity 27. A rotating rod 29 is rotatably mounted on the bottom of the lifting frame 28. The lifting frame 28 and the spacer cavity 27 form a through-type telescopic structure. An elastic element is provided at the through-connection. A magnet is provided on the top of the lifting frame 28. At the same time, electromagnets 30 are distributed one by one on the inner wall of the top of the spacer cavity 27 directly above the lifting frame 28.

[0051] Adopting such Figure 7 and Figure 9 The technical solution shown, when polishing irregular surfaces such as curved surfaces and depressions on the outer surface of a semiconductor cavity, selectively uses different electromagnets 30. Utilizing the repulsive force of like poles, this causes the lifting frame 28 and the spacer cavity 27 at different positions to rise and fall relative to each other. This causes the lifting frame 28 and rotating rod 29 at the alignment position to bulge outwards, compressing and deforming the soft polishing strip 8 below it. This makes the soft polishing strip 8 fit more closely to the semiconductor cavity, facilitating polishing operations and improving polishing accuracy. The first-part tightening mechanism releases pressure on the soft polishing strip 8 when it is compressed and deformed, preventing it from breaking under pressure.

[0052] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision polishing machine for semiconductor cavities, comprising: A positioning base (1) is movably mounted on a sliding base (2), and a robotic arm (3) is provided above the sliding base (2), and a connecting arm (4) is connected to the end of the robotic arm (3). Its characteristic is that it further includes: Grinding mounting base (5) is rotatably mounted on the end of the connecting arm (4). A track-type polishing component is provided on the outside of the grinding mounting base (5). A cleaning component and a polishing liquid addition component of the track-type polishing component are respectively provided in the middle and on the side of the interior of the grinding mounting base (5). The surface cleaning and polishing treatment of the track-type polishing component are carried out by quantitative addition of polishing liquid. The tightening mechanism is set on the grinding mounting base (5) and is used to adjust the tightness and distribution of the track-type polishing assembly to improve the polishing accuracy. The polishing fluid addition component includes the liquid addition chambers (19) on the left and right sides inside the grinding mounting base (5), and the liquid injection chamber (20) is fixed above the liquid addition chamber (19). The liquid injection chamber (20) is connected to the external polishing fluid pressurization assembly through a pipe, and a U-shaped tube (24) is fixed between the liquid addition chamber (19) and the cleaning chamber (10). The top of the U-shaped tube (24) and the bottom of the liquid injection chamber (20) are both located at The drain pipe (17) is located above the horizontal level of the positioning; the injection chamber (20) is located inside the injection chamber (19) and a vertical rod (21) is slidably installed through it. The lower end of the vertical rod (21) is fixed with a float plate (22), and a liquid seal plug (23) is fixed in the middle section of the vertical rod (21) inside the injection chamber (20). The top of the liquid seal plug (23) is fixed with an elastic element to the inner wall of the injection chamber (20). An injection hole is opened on the injection chamber (20) directly below the liquid seal plug (23). The liquid seal plug (23) realizes the sealing control of the injection hole.

2. The high-precision polishing machine for semiconductor cavities according to claim 1, characterized in that: The tracked polishing assembly includes a guide roller (6) and a steering wheel (7), wherein the guide roller (6) and the steering wheel (7) are rotatably mounted on the top and bottom corners of the polishing mounting base (5), respectively, and a soft polishing strip (8) is movably mounted on the outer side of the guide roller (6) and the steering wheel (7), and a motor assembly (9) is fixed in the middle of the back of the polishing mounting base (5), wherein the motor assembly (9) drives the guide roller (6) to rotate through the chain assembly.

3. A high-precision polishing machine for semiconductor cavities according to claim 2, characterized in that: The guide roller (6) and the steering wheel (7) are symmetrically arranged in two positions about the vertical center axis of the grinding mounting base (5), and the guide roller (6) and the steering wheel (7) are distributed parallel to each other, and the soft grinding strip (8) below the steering wheel (7) is horizontally arranged.

4. The high-precision polishing machine for semiconductor cavities according to claim 1, characterized in that: The cleaning component includes a cleaning chamber (10) in the middle of the grinding mounting base (5), and two symmetrically distributed positioning rollers (11) are provided inside the cleaning chamber (10). The positioning rollers (11) realize the rotation positioning of the soft grinding strip (8). A reciprocating screw (12) is provided directly above the middle position of the two positioning rollers (11). The reciprocating screw (12) is fixed to the end of the motor shaft of the motor assembly (9). A guide bracket (13) is sleeved on the outer wall of the reciprocating screw (12). At the same time, a fixing seat (14) is fixed on the inner wall of the grinding mounting base (5) directly below the middle position of the two positioning rollers (11). A cleaning brush (15) is sleeved on the outer side of the fixing seat (14). A permanent magnet (16) is embedded in the middle of the top of the cleaning brush (15) and the middle of the bottom of the guide bracket (13).

5. A high-precision polishing machine for semiconductor cavities according to claim 4, characterized in that: The guide bracket (13) is hollowed out as a whole, and the guide bracket (13) is threadedly connected to the reciprocating screw (12). The guide bracket (13), the fixed seat (14), and the cleaning brush (15) are all vertically coaxially distributed. The middle part of the cleaning brush (15) and the fixed seat (14) form a through sliding installation structure. The top surface of the middle part of the cleaning brush (15) is in contact with the bottom surface of the guide bracket (13) and the outer wall of the soft grinding strip (8) between the positioning roller (11).

6. A high-precision polishing machine for semiconductor cavities according to claim 5, characterized in that: The cleaning chamber (10) is fixedly connected to the upper and lower parts of the chamber, respectively, with the drain pipe (17) and the inlet pipe (18) located above the soft grinding strip (8) between the positioning rollers (11), and the drain pipe (17) and the inlet pipe (18) are connected to the external cleaning fluid circulation assembly.

7. A high-precision polishing machine for semiconductor cavities according to claim 1, characterized in that: The tightening mechanism is provided in two parts. The first part is located inside the grinding mounting base (5) directly above the liquid filling chamber (19). The first part of the tightening mechanism includes an adjusting frame (25) hinged to the inner wall of the grinding mounting base (5). An elastic element is provided at the hinge of the adjusting frame (25) and the grinding mounting base (5). An adjusting roller (26) is rotatably installed at the end of the adjusting frame (25). The adjusting roller (26) realizes the tightness adjustment of the soft grinding strip (8). The outer wall of the adjusting roller (26) is in contact with the bottom of the soft grinding strip (8).

8. A high-precision polishing machine for semiconductor cavities according to claim 7, characterized in that: The second part of the tightening mechanism is located at the bottom center of the grinding mounting base (5). The tightening mechanism of the second part includes a spacer cavity (27) at the bottom center of the grinding mounting base (5). Lifting frames (28) are arranged at equal intervals in the spacer cavity (27). A rotating rod (29) is rotatably installed at the bottom of the lifting frame (28). The lifting frame (28) and the spacer cavity (27) form a through-type relative telescopic structure. An elastic element is provided at the through-connection. A magnet is provided at the top of the lifting frame (28). At the same time, an electromagnet (30) is distributed one by one on the inner wall of the top of the spacer cavity (27) directly above the lifting frame (28).

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