A vapor chamber with a pressure self-compensating wick
CN117615552BActive Publication Date: 2026-08-28SHAANXI QIAOSHANGQIAO EQUIP MFG CO LTD
Patent Information
- Application Number
- CN202311602498.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-28
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2043-11-28
AI Technical Summary
Technical Problem
当热管或均热板竖直放置且电子器件处于高位时,因重量影响,热管或均热板内部的吸液芯无法将工质输送到热源区域,或输送的工质量无法满足散热要求
Benefits of technology
[0014]由于采用了上述技术方案,本发明相对现有技术来说,取得的技术进步是:
✦ Generated by Eureka AI based on patent content.
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Figure CN117615552B_ABST
Abstract
The application discloses a heat spreading plate with a pressure self-compensation liquid absorbing core, and belongs to the technical field of electronic device heat dissipation, which comprises a heat spreading plate cavity, a pressure self-compensation liquid absorbing core, a composite capillary structure, a cover plate and a working medium. The pressure self-compensation liquid absorbing core can quickly transport the working medium to the heat source area, preventing the temperature of the heat source area from being too high. Since the liquid absorbing core has a pressure self-compensation function, when the working medium in a certain section of the liquid absorbing core is consumed, the internal pressure is reduced, and the working medium in other places of the liquid absorbing core can be compensated in time, realizing the continuous transportation of the working medium in the liquid absorbing core. The application has four different functional sections, namely, a collection section, a transportation section, a transition section and an evaporation section. Each section has its own function, and the transition section can not only supplement the working medium consumption of the evaporation section in time, but also draw the working medium from the transportation section, ensuring that each section can work continuously. In the process of use, the working medium can be quickly transported to the heat dissipation area, and the transportation speed is more than 3 times of the conventional capillary transportation speed.
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Citation Information
Patent Citations
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