A circuit board manufacturing method and manufacturing system that facilitates source tracing

Abstract

This invention belongs to the field of circuit board manufacturing technology, and specifically refers to a circuit board manufacturing method and system that facilitates traceability. The method includes the following steps: (1) providing a plurality of circuit sub-boards, each circuit sub-board including a central circuit area and an external non-circuit area, each circuit sub-board having a corresponding first graphic code on its circuit area, the first graphic code containing production history information of the corresponding circuit sub-board; (2) pressing the circuit sub-boards in step (1) into a circuit board product; (3) reading the first graphic code of the circuit sub-boards in the circuit board product in step (2) and generating a second graphic code representing these circuit sub-boards; and fabricating the second graphic code on the outer surface of the circuit board product, the second graphic code being located in the non-circuit area. This invention helps control production costs, production cycle and production efficiency, thereby greatly improving the competitiveness of the product.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board manufacturing, and in particular to a circuit board manufacturing method and a manufacturing system thereof which are helpful for source tracing. Background Art

[0002] Printed circuit boards are an integral part of modern electronic devices, providing support and connectivity for electronic devices by connecting electronic components together in a reliable and cost-effective way. With the advancement of technology, all electronic devices contain printed circuit boards, making them widely used in the electronics field. Almost all electronic devices, from simple household appliances to highly complex computers and communication equipment, rely on printed circuit boards. Printed circuit boards are an integral part of modern electronic devices, playing a key role in connecting and supporting electronic components, and have a significant impact on the performance, reliability and economy of electronic devices. Its development history reflects the continuous advancement of electronic technology and provides a solid foundation for innovation and development in various fields.

[0003] A Chinese patent application with application number CN201310192682.6 discloses a double-sided circuit board and a method for making the same, a multi-layer circuit board and a method for making the same. The method for making the double-sided circuit board includes: drilling holes in a first double-sided metal foil plate to form a first blind hole; forming a first plating layer on the first blind hole; forming a first circuit pattern on a first surface of the first double-sided metal foil plate and on a second surface opposite to the first surface; pre-pressing a first insulating substrate on at least the first surface; drilling holes in the first insulating substrate to form a first hole; plugging the first blind hole with a conductive filler; plugging the first hole with the conductive filler. This method can shorten the production cycle of double-sided circuit boards and multi-layer circuit boards, and the production process is simple.

[0004] In the manufacturing process of printed circuit boards, there is no effective way to record and track the production history data of each batch of circuit boards, such as the source of raw materials, storage, delivery, production plant and subsequent disposal. Therefore, when defects in circuit board products are detected, it is not easy to trace the flow of the same batch of products, and it is difficult to track quality, which leads to waste of production materials and inability to further accurately optimize production, resulting in increased production costs.

[0005] It can be seen that the above technology still has inconveniences and defects, which is a problem that needs to be solved urgently in this industry. Summary of the invention

[0006] In order to solve the deficiencies in the prior art, the present invention provides a circuit board manufacturing method and a manufacturing system thereof that facilitates source tracing, so as to solve the difficulties mentioned in the above prior art.

[0007] In order to achieve the above object, the present invention adopts the following technical solution:

[0008] A method for manufacturing a circuit board that facilitates source tracing includes the following steps:

[0009] (1) providing a plurality of circuit sub-boards, each of which includes a circuit area in the middle and a non-circuit area outside, each circuit sub-board having a corresponding first graphic code on the circuit area, the first graphic code including production history data of the corresponding circuit sub-board;

[0010] (2) pressing the circuit sub-boards described in step (1) as a whole into a circuit board product;

[0011] (3) reading the first graphic codes of the circuit sub-boards in the circuit board product described in step (2) and generating second graphic codes representing these circuit sub-boards; and making the second graphic codes on the outer surface of the circuit board product, wherein the second graphic codes are located in the non-circuit area.

[0012] Preferably, the method for manufacturing the circuit sub-board comprises the following steps:

[0013] S1. Provide a circuit board substrate;

[0014] S2, forming the first graphic code on the circuit board substrate;

[0015] S3, covering the first graphic code and the circuit board substrate with a metal layer; and making the metal layer into a circuit pattern that covers the first graphic code.

[0016] More preferably, in S2, the first graphic code is produced on the circuit board substrate by a laser marking device.

[0017] Preferably, the lamination method in step (2) is to press the circuit sub-boards together along a pressing direction, and to allow the first graphic codes of the circuit sub-boards to overlap or stagger with each other in the pressing direction.

[0018] Preferably, the reading method in step (3) is to use an X-ray code reading device to sequentially irradiate the pressing direction of these circuit sub-boards and read the first graphic codes corresponding to the circuit sub-boards.

[0019] Preferably, the second graphic code is produced on the outer surface of the circuit board product by a laser marking device.

[0020] Preferably, the first graphic code and the second graphic code are one-dimensional codes or two-dimensional codes.

[0021] Preferably, the first graphic code and the second graphic code are arranged as blind holes or through holes.

[0022] The present invention also claims protection for a manufacturing system using the above-mentioned circuit board manufacturing method that facilitates source tracing, comprising:

[0023] A pressing device, used for pressing a plurality of circuit sub-boards as a whole into a circuit board product, wherein a first graphic code is provided on the circuit area of ​​each circuit sub-board;

[0024] An X-ray code reading device, used for reading the first graphic code of the circuit board;

[0025] A barcode generating unit, the barcode generating unit being electrically connected to the X-ray code reading device and used for generating a second graphic code;

[0026] A laser marking device is electrically connected to the barcode generating unit and is used for laser engraving the second graphic code onto the outer surface of the circuit board product.

[0027] Preferably, it also includes:

[0028] A database device storing production history data of the circuit boards corresponding to the first graphic codes;

[0029] An optical code reading device, used for reading the second graphic code of the circuit board product;

[0030] The terminal device is electrically connected to the pressing device, the database device, the X-ray code reading device, the laser marking device, the bar code generating unit and the optical code reading device. The terminal device is used to electrically control the operation of these components, to record the second graphic code into the database device, and to obtain the serial number of the circuit board product, the stacking order of the circuit board and the production history information of the circuit board through the second graphic code read by the optical code reading device.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] (1) The circuit board product manufactured by the circuit board manufacturing method of the present invention can effectively record and track the production history data of raw material sources, warehousing, delivery, production plant, quality inspection and subsequent disposal, so that when quality problems occur, the problematic circuit board can be quickly found through the second graphic code, and accurate optimization can be performed based on the production history data of the graphic circuit board, thereby effectively controlling the production cost, production cycle and production efficiency, and greatly improving the competitiveness of the product.

[0033] (2) The circuit board manufacturing method of the present invention that facilitates source tracing can quickly manufacture, store and read the first graphic code and the second graphic code, and the operation process is simple, thereby effectively improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1A schematic diagram of a circuit board manufacturing system that facilitates source tracing according to the present invention;

[0035] Figure 2 A schematic flow chart of a circuit board manufacturing method that facilitates source tracing according to the present invention;

[0036] Figure 3 A schematic diagram of a circuit board manufacturing method that facilitates source tracing according to the present invention Figure 1 ;

[0037] Figure 4 A schematic diagram of a circuit board manufacturing method that facilitates source tracing according to the present invention Figure 2 ;

[0038] Figure 5 A schematic diagram of a circuit board manufacturing method that facilitates source tracing according to the present invention Figure 3 ;

[0039] Figure 6 A schematic diagram of a circuit board manufacturing method that facilitates source tracing according to the present invention Figure 4 ;

[0040] Figure 7 A schematic diagram of a circuit board manufacturing method that facilitates source tracing according to the present invention Figure 5 ;

[0041] Figure 8 The figure is a schematic diagram of the operation of reading the second graphic code by the optical code reading device of the present invention.

[0042] The reference numerals are as follows:

[0043] 100: Laminating device; 200: Database device; 300: X-ray code reading device; 400: Laser marking device; 500: Barcode generating unit; 600: Optical code reading device; 700: Terminal device; 800: Circuit board product; 810: Circuit area; 820: Non-circuit area; 830: Circuit sub-board; 831: Circuit board substrate; 832: Metal layer; 833: Circuit pattern; 840: First graphic code; 850: Second graphic code. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the embodiments. Of course, the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0045] Although the steps in the present invention are arranged with numbers, they are not used to limit the order of the steps. Unless the order of the steps is clearly stated or the execution of a certain step requires other steps as a basis, the relative order of the steps can be adjusted. It is understood that the term "and / or" used in this article involves and covers any and all possible combinations of one or more of the associated listed items.

[0046] Example 1

[0047] like Figures 1 to 8 As shown, a method for manufacturing a circuit board that facilitates source tracing includes the following steps:

[0048] (1) providing a plurality of circuit sub-boards 830, wherein the circuit sub-boards 830 include a circuit region 810 in the middle and a non-circuit region 820 in the outer portion, and each circuit sub-board 830 has a corresponding first graphic code 840 on the circuit region 810, wherein the first graphic code 840 includes production history data of the corresponding circuit sub-board 830;

[0049] (2) Pressing the circuit board 830 in step (1) as a whole into a circuit board product 800;

[0050] (3) reading the first graphic code 840 of the circuit sub-board 830 in the circuit board product 800 described in step (2) and generating a second graphic code 850 representing these circuit sub-boards 830; and making the second graphic code 850 on the outer surface of the circuit board product 800, wherein the second graphic code 850 is located in the non-circuit area 820.

[0051] It is worth mentioning that the first graphic code is a unique code used to distinguish different circuit boards 830. The production history data includes, for example, the material number of the circuit board 830, the batch number of the circuit board 830, the serial number, warehousing, delivery, production plant and subsequent disposal.

[0052] The method for manufacturing the circuit sub-board 830 comprises the following steps:

[0053] S1, providing a circuit board substrate 831;

[0054] S2, forming the first graphic code 840 on the circuit board substrate 831;

[0055] S3, covering the first graphic code 840 and the circuit board substrate 831 with a metal layer 832; and making the metal layer 832 into a circuit pattern 833 that shields the first graphic code 840.

[0056] In S2 , the first graphic code 840 is produced on the circuit board substrate 831 by the laser marking device 400 .

[0057] The pressing method in step (2) is to press the circuit sub-boards 830 together along a pressing direction, and to allow the first graphic codes 840 of the circuit sub-boards 830 to overlap or stagger in the pressing direction.

[0058] The reading method in step (3) is to use the X-ray code reading device 300 to sequentially irradiate the circuit sub-boards 830 in the pressing direction and read the first graphic code 840 corresponding to the circuit sub-boards 830.

[0059] It is worth noting that the X-ray code reading device 300 is used to see through the circuit board product and sequentially read the first graphic codes 840 of these circuit boards 830. For example, the X-ray code reading device 300 is not limited to a fixed code reading device or a movable code reading device.

[0060] The second graphic code 850 is produced on the outer surface of the circuit board product 800 by the laser marking device 400 .

[0061] The second graphic code 850 is a unique code, which is not only used to distinguish different circuit board products 800, but also to correspond the first graphic codes 840 in the database device 200 to the second graphic codes 850.

[0062] In detail, laser marking is a marking method that uses a high energy density laser to locally irradiate the outer surface of the circuit board product 800, causing the surface material to vaporize or undergo a reaction that changes color.

[0063] The first graphic code 840 and the second graphic code 850 are one-dimensional codes or two-dimensional codes.

[0064] The first graphic code 840 and the second graphic code 850 are arranged as blind holes or through holes.

[0065] The circuit board manufacturing method of the present invention that facilitates source tracing can quickly manufacture, store and read the first graphic code 840 and the second graphic code 850, and the operation process is simple, thereby effectively improving production efficiency.

[0066] A manufacturing system according to the above-mentioned circuit board manufacturing method that facilitates source tracing comprises:

[0067] The pressing device 100 is used to press a plurality of circuit sub-boards 830 as a whole into a circuit board product 800, and a first graphic code 840 is provided on the circuit area 810 of each circuit sub-board 830;

[0068] The plurality of circuit sub-boards 830 are pressed together along a pressing direction to form a circuit board product 800, and the circuit board product 800 is subjected to a sideline grinding process. At this time, the first graphic codes 840 of the circuit sub-boards 830 overlap each other in the pressing direction. However, the present invention is not limited to this, and other embodiments may be modified so that the first graphic codes 840 of the circuit sub-boards 830 are staggered in the pressing direction.

[0069] An X-ray code reading device 300 is used to read a first graphic code 840 of a circuit board 830;

[0070] A barcode generating unit 500, the barcode generating unit 500 is electrically connected to the X-ray code reading device 300, and is used to generate a second graphic code 850;

[0071] The first graphic codes 840 of the circuit boards 830 are sequentially irradiated and read by the X-ray code reading device 300 in the pressing direction. Thus, when the terminal device 700 activates the X-ray code reading device 300 and obtains the first graphic codes 840 sequentially read by the X-ray code reading device 300, the terminal device 700 records the first graphic codes 840 in the database device 200, instructs the barcode generation unit 500 to generate the second graphic code 850, records the second graphic code 850 in the database device 200, and corresponds the first graphic codes 840 to the second graphic codes 850.

[0072] The laser marking device 400 is electrically connected to the barcode generating unit 500 and is used to laser engrave the second graphic code 850 on the outer surface of the circuit board product 800 .

[0073] Also includes:

[0074] The database device 200 stores production history data of the circuit boards 830 corresponding to the first graphic codes 840 respectively;

[0075] The optical code reading device 600 is used to read the second graphic code 850 of the circuit board product 800;

[0076] The optical code reading device 600 is electrically connected to the terminal device 700 to read the second graphic code 850 on the outer surface of the circuit board product 800, so that the terminal device 700 can obtain the serial number of the circuit board product 800, the stacking order of the circuit board 830 on the circuit board product 800, and the production history information of each circuit board 830 of the circuit board product 800 through the second graphic code 850 read by the optical code reading device 600.

[0077] For example, the optical barcode reading device 600 is not limited to being a fixed barcode reading device or a movable barcode reading device.

[0078] The terminal device 700 is electrically connected to the pressing device 100, the database device 200, the X-ray code reading device 300, the laser marking device 400, the barcode generating unit 500 and the optical code reading device 600. The terminal device 700 is used to electrically control the operation of these components, to record the second graphic code 850 in the database device 200, and to obtain the serial number of the circuit board product 800, the stacking sequence of the circuit board 830 and the production history data of the circuit board 830 through the second graphic code 850 read by the optical code reading device 600, and record them in the database device 200. The terminal device 700 is, for example, a computer, a server, a workstation or a single chip device.

[0079] When any inspector aligns the optical code reading device 600 in the pressing direction and reads the second graphic code 850 of the circuit board product 800, the terminal device 700 not only obtains the relevant trajectory information corresponding to the second graphic code 850 from the database device 200, but can also check the stacking sequence and production history data of all circuit boards 830 corresponding to this second graphic code 850.

[0080] In this way, through the above architecture, the circuit board product 800 produced by the circuit board production method of the present invention can effectively record and track the production history data such as the source of raw materials, warehousing, delivery, production plant, quality inspection and subsequent disposal. Therefore, when quality problems occur, the second graphic code 850 can be used to quickly find the problematic circuit board 830, and the production history data of the graphic circuit board 830 can be accurately optimized, thereby effectively controlling the production cost, production cycle and production efficiency, and greatly improving the competitiveness of the product.

[0081] The above is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and changes without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A method for manufacturing a circuit board that facilitates source tracing, characterized in that: The steps include: (1) providing a plurality of circuit sub-boards (830), wherein the circuit sub-boards (830) include a circuit area (810) in the middle and a non-circuit area (820) outside, and each circuit sub-board (830) has a corresponding first graphic code (840) on the circuit area (810), and the first graphic code (840) includes production history data of the corresponding circuit sub-board (830); (2) Pressing the circuit sub-board (830) in step (1) as a whole into a circuit board product (800); (3) reading the first graphic codes (840) of the circuit sub-boards (830) in the circuit board product (800) described in step (2), and generating second graphic codes (850) representing the circuit sub-boards (830); and manufacturing the second graphic code (850) on the outer surface of the circuit board product (800), wherein the second graphic code (850) is located in the non-circuit area (820); The pressing method of the pressing in step (2) is to press the circuit sub-boards (830) together along a pressing direction, and to allow the first graphic codes (840) of the circuit sub-boards (830) to overlap or stagger in the pressing direction; The reading method in step (3) is to sequentially irradiate the circuit sub-boards (830) in the pressing direction of the circuit sub-boards (830) with an X-ray code reading device (300) and read the first graphic code (840) corresponding to the circuit sub-boards (830); The method for manufacturing the circuit sub-board (830) comprises the following steps: S1, providing a circuit board substrate (831); S2, forming the first graphic code (840) on the circuit board substrate (831); S3, covering the first graphic code (840) and the circuit board substrate (831) with a metal layer (832); The metal layer (832) is made into a circuit pattern (833) that shields the first graphic code (840).

2. The circuit board manufacturing method that facilitates source tracing according to claim 1, characterized in that: In S2, the first graphic code (840) is produced on the circuit board substrate (831) by using a laser marking device (400).

3. The circuit board manufacturing method that facilitates source tracing according to claim 1 is characterized in that: The second graphic code (850) is produced on the outer surface of the circuit board product (800) by using a laser marking device (400).

4. The circuit board manufacturing method that facilitates source tracing according to claim 1 is characterized in that: The first graphic code (840) and the second graphic code (850) are one-dimensional codes or two-dimensional codes.

5. The circuit board manufacturing method that facilitates source tracing according to claim 1, characterized in that: The first graphic code (840) and the second graphic code (850) are arranged as blind holes or through holes.

6. A system for manufacturing a circuit board manufacturing method that facilitates source tracing according to any one of claims 1 to 5, characterized in that: include: A pressing device (100) is used to press a plurality of circuit sub-boards (830) as a whole into a circuit board product (800), wherein a first graphic code (840) is provided on the circuit area (810) of each circuit sub-board (830); An X-ray code reading device (300) for reading a first graphic code (840) on a circuit board (830); A barcode generating unit (500), the barcode generating unit (500) being electrically connected to the X-ray code reading device (300) and used for generating a second graphic code (850); A laser marking device (400) is electrically connected to a barcode generation unit (500) and is used to laser engrave a second graphic code (850) onto the outer surface of the circuit board product (800).

7. The production system according to claim 6, characterized in that: Also includes: A database device (200) stores production history data of the circuit boards (830) corresponding to the first graphic codes (840); An optical code reading device (600) for reading a second graphic code (850) of the circuit board product (800); The terminal device (700) is electrically connected to the pressing device (100), the database device (200), the X-ray code reading device (300), the laser marking device (400), the bar code generating unit (500) and the optical code reading device (600). The terminal device (700) is used to electrically control the operation of these components, to record the second graphic code (850) into the database device (200), and to obtain the serial number of the circuit board product (800), the stacking sequence of the circuit board (830) and the production history data of the circuit board (830) through the second graphic code (850) read by the optical code reading device (600).

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