Implantable flexible optoelectrode device and brain-computer interface apparatus thereof

Abstract

An implantable flexible light electrode device and a brain-computer interface device thereof. The implantable flexible light electrode device (1, 1') comprises a main body (10, 10') and a first connecting part (11, 11') connected with the main body (10, 10'); the first connecting part (11, 11') comprises a first flexible support layer (101, 101'); a light emitting assembly (102, 102') is located on the first flexible support layer (101, 101') and is configured to provide a light beam (L) to a light irradiation area (M), the light emitting assembly (102, 102') comprises a light emitting unit (110, 110'), the light emitting unit (110, 110') has a light emitting area (N) and is configured to emit the light beam (L) from the light emitting area (N); wherein the orthographic projection of the light irradiation area (M) on the first flexible support layer (101, 101') is located in the orthographic projection of the light emitting area (N) on the first flexible support layer (101, 101'). The implantable flexible light electrode device (1, 1') can avoid optical diffusion and improve light modulation accuracy.

Description

Technical Field

[0001] This disclosure relates to the field of medical devices, and in particular to an implantable flexible photoelectrode device and its brain-computer interface device. Background Technology

[0002] Optogenetics has garnered increasing attention as a means of neuromodulation. Electrical or pharmacological stimulation utilizes electricity or drugs to stimulate target neurons. Therefore, brain-computer interface devices based on optogenetics have wide applications in fields such as medicine and entertainment. Summary of the Invention

[0003] This disclosure provides an implantable flexible photoelectrode device and its brain-computer interface device.

[0004] According to a first aspect of this disclosure, an implantable flexible photoelectrode device is provided. It includes: a main body and a first connecting portion; the first connecting portion is connected to the main body and includes: a first flexible support layer; a light-emitting component located on the first flexible support layer and configured to provide a light beam to an illuminated area, the light-emitting component including a light-emitting unit having a light-emitting region and configured to emit the light beam from the light-emitting region; wherein the orthographic projection of the illuminated area onto the first flexible support layer lies within the orthographic projection of the light-emitting region onto the first flexible support layer.

[0005] In at least some embodiments, the first connection portion further includes: a first light-shielding layer located on the side of the light-emitting unit away from the first flexible support layer, wherein the first light-shielding layer is configured to cover a portion of the light-emitting area so that the light beam is partially blocked by the first light-shielding layer.

[0006] In at least some embodiments, the first light-shielding layer includes a first light-transmitting portion configured to allow the light beam to be transmitted through it and emitted in a direction away from the light-emitting area.

[0007] In at least some embodiments, the first light-transmitting portion includes a first through-hole located in the first light-shielding layer, and the orthographic projection of the first through-hole on the first flexible support layer is located within the orthographic projection of the light-emitting area on the first flexible support layer.

[0008] In at least some embodiments, there are multiple first through holes, and the orthographic projections of some of the multiple first through holes on the first flexible support layer are located within the orthographic projection of the light-emitting area on the first flexible support layer, while the orthographic projections of another portion of the multiple first through holes on the first flexible support layer are located outside the orthographic projection of the light-emitting area on the first flexible support layer.

[0009] In at least some embodiments, the planar shape of the first through hole includes at least one of a square, a circle, an ellipse, a rectangle, and a parallelogram.

[0010] In at least some embodiments, the size of the first through hole is 0.1% to 99% of the size of the light-emitting area.

[0011] In at least some embodiments, the area of ​​the first through-hole is 1~225 µm. 2 The area of ​​the light-emitting region N is 400~900 µm. 2 .

[0012] In at least some embodiments, there are multiple light-emitting units, and the multiple light-emitting units have multiple light-emitting regions; there are multiple first light-transmitting parts, and the multiple first light-transmitting parts are arranged in a one-to-one correspondence with the multiple light-emitting regions.

[0013] In at least some embodiments, the plurality of light-emitting regions are arranged without gaps so that the plurality of light-emitting regions are connected to each other.

[0014] In at least some embodiments, the implantable flexible photoelectrode device further includes: a second connection portion connected to the body, the second connection portion being different from and spaced apart from the first connection portion; an electrode assembly configured to record and transmit signals generated under the excitation of the light beam; the electrode assembly being located on at least one of the first connection portion and the second connection portion.

[0015] In at least some embodiments, the electrode assembly is located on the first connection portion and includes: a first electrode, the first electrode and the light-emitting unit being located on the same side of the first flexible support layer, and the first electrode and the light-emitting unit being spaced apart from each other in a direction parallel to the plane of the first flexible support layer.

[0016] In at least some embodiments, the first light-shielding layer further includes a second light-transmitting portion, the second light-transmitting portion being positioned to correspond to the first electrode so that at least a portion of the first electrode is exposed.

[0017] In at least some embodiments, the surface of the first electrode near the illumination area is not coplanar with the light-emitting surface of the light-emitting unit.

[0018] In at least some embodiments, the electrode assembly further includes: a second electrode located on the side of the first electrode away from the illumination area, and the second electrode being insulated from the first electrode; and the second electrode being spaced apart from the light-emitting unit in a direction parallel to the plane of the first flexible support layer.

[0019] In at least some embodiments, the first connection portion further includes: a second light-shielding layer located on the side of the first flexible support layer away from the light-emitting component; the second light-shielding layer includes a third light-transmitting portion, the third light-transmitting portion being configured to correspond to the second electrode so that at least a portion of the second electrode is exposed.

[0020] In at least some embodiments, the electrode assembly is located on the second connection portion and includes: a first electrode located on the side of the first connection portion away from the light-illuminated area.

[0021] In at least some embodiments, the electrode assembly further includes a second electrode; the second connection portion includes a second flexible support layer, the second flexible support layer including a first side close to the illumination area and a second side away from the illumination area; the first electrode is located on the first side, the second electrode is located on the second side, and the second electrode is insulated from the first electrode.

[0022] In at least some embodiments, the first electrode and the second electrode overlap each other in the thickness direction perpendicular to the second flexible support layer.

[0023] In at least some embodiments, there are multiple light-emitting units, multiple first electrodes, multiple second electrodes, and the multiple first electrodes and multiple second electrodes are configured to correspond one-to-one and constitute multiple electrode groups; each light-emitting unit is configured to correspond one-to-one with one of the multiple electrode groups.

[0024] In at least some embodiments, the implantable flexible photoelectrode device further includes a fixation component located on the body and configured to fix the body in place.

[0025] In at least some embodiments, the fixing component includes: an adhesive; a storage container configured to store the adhesive; the body having a circumferential direction perpendicular to its extension direction, the storage container being disposed along the circumferential direction of the body.

[0026] In at least some embodiments, the body includes a first end away from the light-emitting component and a second end near the light-emitting component along its extension direction, and the storage container is located on the first end of the body.

[0027] In at least some embodiments, the storage container is configured to automatically release the adhesive when the implantable flexible photoelectrode device is secured in place.

[0028] In at least some embodiments, the implantable flexible photoelectrode device is configured to be implanted below the skull, and the illuminated area is the cerebral cortex region within the brain.

[0029] According to a second aspect of this disclosure, a brain-computer interface device is provided, comprising the implantable flexible photoelectrode device as described in any one of claims 1-21.

[0030] In at least some embodiments, the brain-computer interface device further includes: a housing; and a control device located in the housing and connected to the implantable flexible photoelectrode device, the control device being configured to transmit signals with the implantable flexible photoelectrode device; wherein the main body of the implantable flexible photoelectrode device is configured to move together with the housing and the control device.

[0031] In at least some embodiments, the implantable flexible photoelectrode device further includes an electrode assembly, and the control device includes: a central control module; a driving module, one end of which is connected to the central control module and the other end of which is connected to the light-emitting component of the implantable flexible photoelectrode device, configured to provide a driving signal to the light-emitting component; and a detection module, one end of which is connected to the central control module and the other end of which is connected to the electrode assembly of the implantable flexible photoelectrode device, configured to receive signals from the electrode assembly.

[0032] In at least some embodiments, the brain-computer interface device further includes a power module connected to the central control module, the drive module and the detection module, configured to provide power, wherein the power module is located within the housing.

[0033] In at least some embodiments, the central control module includes: a control circuit configured to generate a drive signal; and a communication circuit connected to the control circuit, wherein a first terminal of the communication circuit is connected to the drive module and a second terminal is connected to the detection module, and the communication circuit is configured to transmit the drive signal to the drive module and transmit the signal provided by the detection module from the electrode assembly to the control circuit.

[0034] In at least some embodiments, the housing has a longitudinal axis, the housing includes a first dimension along the longitudinal axis and a second dimension perpendicular to the longitudinal axis, the first dimension being smaller than the second dimension.

[0035] In at least some embodiments, the housing has a circumferential direction perpendicular to the longitudinal axis, and there are multiple implantable flexible photoelectrode devices distributed along the circumferential direction.

[0036] In at least some embodiments, the housing includes a first side and a second side disposed opposite to each other on the longitudinal axis, and the body of the implantable flexible photoelectrode device is connected to at least one of the first side and the second side.

[0037] In at least some embodiments, the brain-computer interface device further includes a fixing component located on the same side of the housing as the main body and configured to fix the brain-computer interface device in place.

[0038] In at least some embodiments, the fixing component includes an adhesive.

[0039] In at least some embodiments, the brain-computer interface device is partially or wholly implantable.

[0040] In at least some embodiments, the flexible photoelectrode device is configured to be implanted below the skull, and the housing is configured to be implanted at and / or below the skull. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0042] Figure 1 A schematic diagram of the structure of a brain-computer interface device; Figure 2 for Figure 1 A schematic diagram of an implantable photoelectrode device; Figure 3 For along Figure 1 Cross-sectional view of line II; Figure 4 This is a schematic diagram of the brain-computer interface device provided in the embodiments of this disclosure; Figure 5 This is a connection block diagram of the various components in the brain-computer interface device provided in the embodiments of this disclosure; Figure 6 for Figure 4 A partially enlarged schematic diagram of the first connecting part; Figure 7 For along Figure 6 A schematic diagram of the cross-section of line AA; Figure 8 This is a schematic diagram of the structure of the light-emitting unit provided in an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the structure of a light-emitting unit provided in another embodiment of the present disclosure; Figure 10 A partial planar schematic diagram of the light-emitting area and the first through hole provided in an embodiment of this disclosure; Figure 11 A partial planar schematic diagram of the light-emitting area and the first through hole provided in another embodiment of this disclosure; Figure 12 A cross-sectional schematic diagram of the first electrode and the light-emitting unit provided in an embodiment of this disclosure; Figure 13 This is a schematic diagram of the structure of the first electrode and the second electrode provided in an embodiment of the present disclosure; Figure 14 for Figure 4 A cross-sectional schematic diagram of the fixing component 13; Figure 15 This is a schematic diagram of the structure of a brain-computer interface device provided in another embodiment of the present disclosure; Figure 16 for Figure 15 A partially enlarged schematic diagram of the first connecting part; Figure 17 For along Figure 16 A schematic diagram of the cross-section of the BB line; Figure 18 for Figure 15 A partially enlarged schematic diagram of the second connecting part; Figure 19 For along Figure 18 A schematic diagram of the cross-section of the CC line; Figure 20 A partial cross-sectional schematic diagram of the first connecting portion and the second connecting portion provided in an embodiment of this disclosure; Figure 21 for Figure 4 Front view of the middle shell; Figure 22 For along Figure 21 A cross-sectional view of the DD line; Figure 23 A schematic diagram of the structure of a brain-computer interface device provided in another embodiment of this disclosure; Figure 24 A schematic diagram of the structure of a brain-computer interface device provided in yet another embodiment of this disclosure; Figure 25 A schematic diagram of the structure of a brain-computer interface device provided in another embodiment of this disclosure. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0044] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this patent application specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” indicate that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0045] Typically, brain-computer interface devices based on optogenetics include photoelectrode devices, which may include a light-emitting component (also called a light-emitting component) for emitting illumination light and an electrode component for recording electrical signals. Due to the absorption and scattering of light by living organisms, light generated outside the animal brain cannot reach deep into the brain, let alone accurately target a specific area. Therefore, an implantable photoelectrode device that can guide light to neurons is proposed.

[0046] Figure 1 This is a schematic diagram of a brain-computer interface device. Figure 2 for Figure 1 A planar schematic diagram of an implantable photoelectrode device. Figure 3 For along Figure 1 A cross-sectional view of line II.

[0047] like Figures 1 to 3 As shown, the implantable photoelectrode device 90 includes a flexible layer 91 and a light-emitting component and an electrode assembly located on the flexible layer 91. The light-emitting component includes multiple light-emitting units 92, and the electrode assembly includes multiple electrodes 93. The light beam emitted by each light-emitting unit 92 illuminates brain neurons to form an illuminated area 95. After light stimulation, the brain neurons generate bioelectrical signals, which are recorded by the electrodes 93 and transmitted to a backend computer.

[0048] like Figure 3As shown, when it is desired to illuminate a specific neuron 94, the light beam emitted by the light-emitting unit 92 has a large divergence angle, resulting in a large illumination area 95 (the shaded area in the figure). This not only illuminates the target neuron 94 but also nearby neurons 96, causing light path diffusion and making precise control of the light path impossible. Furthermore, since the signals recorded by the electrode assembly are mostly in the microvolt range, they are easily affected by external environmental interference. Because the light beam also illuminates areas other than the target neuron, the signal-to-noise ratio of the photoelectrode device is reduced.

[0049] Therefore, this disclosure provides an implantable flexible photoelectrode device and its brain-computer interface device to avoid optical diffusion and improve optical modulation accuracy.

[0050] This disclosure provides an implantable flexible photoelectrode device, comprising: a main body and a first connecting portion connected to the main body. The first connecting portion includes a first flexible support layer, a light-emitting component, and a first light-shielding layer. The light-emitting component is located on the first flexible support layer and configured to provide a light beam to an illuminated area. The light-emitting component includes a light-emitting unit having a light-emitting area and configured to emit a light beam from the light-emitting area. The orthographic projection of the illuminated area on the first flexible support layer lies within the orthographic projection of the light-emitting area on the first flexible support layer.

[0051] In the aforementioned implantable flexible photoelectrode device, the area of ​​the illuminated region is reduced by setting the orthogonal projection of the illuminating region onto the first flexible support layer to lie within the orthogonal projection of the emitting region onto the first flexible support layer. Compared to Figure 3 In cases where the illumination area is large, this embodiment of the present disclosure solves the problem of light path dispersion by reducing the area of ​​the illumination area, making it easier for the light beam to be concentrated on a specific neuron cell, thereby improving the light modulation accuracy.

[0052] In this embodiment of the disclosure, "light-emitting area" refers to the area where the light-emitting surface is located when the light beam is emitted from the light-emitting unit. "Illuminated area" refers to the area illuminated by the light beam emitted from the light-emitting unit.

[0053] In this embodiment of the disclosure, "implantable flexible photoelectrode device" refers to a flexible photoelectrode device that can be placed inside the human body. For example, in some embodiments, the implantable flexible photoelectrode device can be implanted below the skull, and the illuminated area is the cerebral cortex region of the brain.

[0054] In this embodiment of the present disclosure, a first light-shielding layer can be provided on the light-emitting unit so that the light beam emitted by the light-emitting unit is partially blocked by the first light-shielding layer, thereby reducing the area of ​​the illuminated region.

[0055] The present disclosure will now be described through several specific embodiments. To keep the following description of the embodiments of the present disclosure clear and concise, detailed descriptions of known functions and components may be omitted. When any component of an embodiment of the present disclosure appears in more than one drawing, the component may be represented by the same reference numerals in each drawing.

[0056] Figure 4 This is a schematic diagram of the brain-computer interface device provided in an embodiment of this disclosure. Figure 5 This is a block diagram showing the connection of various components in the brain-computer interface device provided in the embodiments of this disclosure. Figure 6 for Figure 4 A partially enlarged schematic diagram of the first connecting part. Figure 7 For along Figure 6 A schematic diagram of the cross-section of line AA.

[0057] like Figure 4 As shown, the brain-computer interface device 100 provided in this embodiment includes: a plurality of implantable flexible photoelectrode devices 1, a housing 2, and a control device (not shown) located in the housing 2.

[0058] For example, the implantable flexible photoelectrode device 1 includes a main body 10 and a first connecting portion 11 connected to the main body 10. The main body 10 includes a first end 10A and a second end 10B disposed opposite to each other along its extension direction. The first end 10A is connected to the housing 2, and the second end 10B is connected to the first connecting portion 11.

[0059] like Figure 6 and Figure 7 As shown, for example, the first connecting part 11 includes a first flexible support layer 101, a light-emitting component 102, and a first light-shielding layer 104.

[0060] For example, the light-emitting component 102 is located on the first flexible support layer 101 and is configured to illuminate the light-emitting region M (reference). Figure 1 (As shown) provides a beam L.

[0061] In some embodiments, such as Figure 7 As shown, the first flexible support layer 101 includes a first side 101A and a second side 101B disposed opposite each other in a direction perpendicular to the thickness of the first flexible support layer 101 (e.g., the Z direction shown in the figure). The light-emitting component 102 may be located on at least one of the first side 101A and the second side 101B. Figure 4 As shown, for example, when the target object P is located on the first side 101A of the first flexible support layer 101 (i.e. Figure 4When the light-emitting component 102 is arranged on the first side 101A (below the first connecting portion 11), the light-emitting component 102 can be arranged so that the light beam L emitted by the light-emitting component 102 illuminates the target object P in the illumination area M. When there are multiple target objects P, and these multiple target objects are distributed on the first side 101A and the second side 102A of the first flexible support layer 101, the light-emitting component 102 can be arranged on the first side 101A and the second side 101B of the first flexible support layer 101 respectively, thereby realizing the illumination of multiple target objects P. Therefore, by arranging the light-emitting component 102 on at least one of the first side 101A and the second side 101B, the flexibility of the implantable flexible photoelectrode device 1 in different application scenarios can be improved, and different illumination requirements can be met. The embodiments of this disclosure are described with the light-emitting component 102 located only on the first side 101A as an example.

[0062] like Figure 6 and 7 As shown, for example, the light-emitting component 102 includes a light-emitting unit 110, which has a light-emitting region N and is configured to emit a light beam L from the light-emitting region N. The orthographic projection of the illumination region M onto the first flexible support layer 101 is set to lie within the orthographic projection of the light-emitting region N onto the first flexible support layer 101. Thus, by providing a first light-shielding layer 104 on the light-emitting unit 110, the light beam L emitted by the light-emitting unit 110 is partially blocked by the first light-shielding layer 104, thereby reducing the area of ​​the illumination region M. Compared to... Figure 3 In cases where the illumination area is large, the problem of light path dispersion is solved by reducing the area of ​​the illumination area M, making it easier for the light beam to be concentrated on a specific neuron cell, thereby improving the light modulation accuracy.

[0063] This disclosure does not specifically limit the type of light-emitting unit 110. In some embodiments, the light-emitting unit 110 may be a light-emitting diode device, such as a micro-LED device or a quantum dot light-emitting diode (QLED) device. Compared to QLED, Micro-LED has higher reliability and longer lifespan, and is therefore preferred.

[0064] Figure 8 This is a schematic diagram of the structure of the light-emitting unit provided in an embodiment of this disclosure. Figure 8 As shown, for example, the light-emitting unit 110 is a Micro-LED chip, which includes a first semiconductor layer 1101 and a second semiconductor layer 1102 stacked together.

[0065] For example, the first semiconductor layer 1101 and the second semiconductor layer 1102 are semiconductor layers doped with different types of impurities. For example, one of the first semiconductor layer 1101 and the second semiconductor layer 1102 is a P-type semiconductor layer, such as P-type GaN; the other is an N-type semiconductor layer, such as N-type GaN. When a voltage is applied between the P-type semiconductor layer and the N-type semiconductor layer, electrons and holes recombine, emitting monochromatic light.

[0066] like Figure 8 As shown, for example, a Micro-LED chip may also include a semiconductor active layer 1103 disposed between a first semiconductor layer 1101 and a second semiconductor layer 1102. The semiconductor active layer 1103 is, for example, a quantum well layer.

[0067] like Figure 8 As shown, for example, a Micro-LED chip may also include a first metal pad 1104 and a second metal pad 1105. The first metal pad 1104 is connected to the first semiconductor layer 1101 to provide a first electrical signal, such as a first voltage, to the first semiconductor layer 1101. The second metal pad 1105 is connected to the second semiconductor layer 1102 to provide a second electrical signal, such as a second voltage, to the second semiconductor layer 1102, and the first voltage and the second voltage are different, thereby facilitating the formation of an electric field between the first semiconductor layer 1101 and the second semiconductor layer 1102.

[0068] Figure 9 This is a schematic diagram of the structure of a light-emitting unit provided in another embodiment of the present disclosure. Figure 9 and Figure 8 The difference is that, Figure 9 The second semiconductor layer 1102 has a larger area than the first semiconductor layer 1101, meaning that the orthogonal projection of the first semiconductor layer 1101 onto the second semiconductor layer 1102 lies within the region where the second semiconductor layer 1102 is located. This structure facilitates the placement of the first metal pad 1104 and the second metal pad 1105 (e.g., on the same side of the Micro-LED chip) more easily. Figure 9 (The upper side of the Micro-LED chip shown).

[0069] In some embodiments, the light-emitting component 102 further includes a first power line and a second power line, wherein a first metal pad 1104 is connected to the first power line and a second metal pad 1105 is connected to the second power line. When the first metal pad 1104 and the second metal pad 1105 are located on the same side of the Micro-LED chip, the first power line and the second power line can also be arranged on the same side of the Micro-LED chip, which simplifies the routing design of the first and second power lines and reduces manufacturing difficulty.

[0070] In some embodiments, the first power line and the second power line may be arranged in the first connection portion 11, for example, on the first side 101A of the first flexible support layer 101. For example, the first power line and the second power line may extend from the first metal pad 1104 and the second metal pad 1105, respectively, into the control device in the housing 2.

[0071] In this embodiment of the disclosure, the light-emitting region N is the overlapping region of the first semiconductor layer 1101 and the second semiconductor layer 1102. For example, Figure 8 and Figure 9 In the above, the light-emitting regions N are all the overlapping regions of the first semiconductor layer 1101 and the second semiconductor layer 1102.

[0072] In some embodiments, at least a portion of the first connecting portion 11 is provided with a light-emitting component 102. For example, such as Figure 4 As shown, the first connecting portion 11 includes, along its extending direction, a first region 11A close to the main body 10, a second region 11B away from the main body 10, and a third region 11C located between the first region 11A and the second region 11B. The light-emitting component 102 may be located in at least one of the first region 11A, the second region 11B, and the third region 11C. Thus, the position of the light-emitting component 102 can be flexibly set according to actual needs. This embodiment of the disclosure is illustrated using the example of the light-emitting component 102 located in the first region 11A, the second region 11B, and the third region 11C.

[0073] like Figure 7 As shown, for example, the first light-shielding layer 104 is located on the side of the light-emitting unit 110 away from the first flexible support layer 101, and the first light-shielding layer 104 is configured to cover part of the light-emitting area N so that the light beam L is partially blocked by the first light-shielding layer 104.

[0074] In this embodiment, by providing a first light-shielding layer 104 on the light-emitting unit 110, the light beam L emitted by the light-emitting unit 110 is partially blocked by the first light-shielding layer 104, thereby reducing the divergence angle of the light beam L and almost achieving a collimation effect. Therefore, the light beam L is more easily focused on specific neuronal cells, thus solving the problem of light path diffusion and improving the light modulation accuracy.

[0075] Furthermore, Figure 3 In this process, due to the large divergence angle of the light-emitting unit 92, the light beams between adjacent light-emitting units 92 may overlap. Target objects within the overlapping area will be irradiated by the superimposed light, leading to a decrease in the signal-to-noise ratio of the implanted flexible photoelectric electrode device. For example, the current minimum excitation power of Micro-LED is 4.8 μW, the transmission depth is 35 μm, and the influence range is 40... At 40μm, the light fields between two light-emitting units will overlap, increasing the light intensity at locations where the light intensity was originally less than the sensing intensity threshold. This causes brain cells that should not normally react to the light to do so, affecting the expected results.

[0076] In this embodiment, since the light-emitting region N is blocked by the first light-shielding layer 104, the light-emitting area is reduced, which can avoid or eliminate the overlap between the adjacent light-emitting units, thereby improving the signal-to-noise ratio of the implantable flexible photoelectrode device.

[0077] For example, the first light-shielding layer 104 includes a first light-transmitting portion configured to allow a light beam L to be transmitted through it and emitted in a direction away from the light-emitting region N. In some embodiments, the first light-transmitting portion can be a through-hole or a light-transmitting part made of a light-transmitting material. When a through-hole is used, material costs can be reduced and the manufacturing process can be simplified, so it is preferred. This disclosure describes embodiments with a through-hole as the first light-transmitting portion as an example.

[0078] In this embodiment, the thickness of the first light-shielding layer 104 can vary according to the luminous power of the light-emitting unit; a higher luminous power requires a thicker layer, ensuring that the light beam can exit through the first light-transmitting part. In some embodiments, the thickness of the first light-shielding layer 104 is 5~10μm.

[0079] In this embodiment, the first light-shielding layer 104 includes a light-blocking material, which is insulating and preferably a non-biotoxic insulating material, such as at least one of polyvinylidene fluoride, alkyl sulfonate, vinyltriamine, and ethylene glycol. It is understood that other suitable materials for light shielding, such as black matrix (BM) resin materials, may also be used in this embodiment.

[0080] In some embodiments, the first light-shielding layer 104 may be a single-layer or multi-layer structure.

[0081] For example, when the first light-shielding layer 104 is a single-layer structure, the amount of material used in the first light-shielding layer 104 can be reduced, thus lowering the difficulty of the manufacturing process. In this case, the first light-shielding layer 104 can be made of the aforementioned light-blocking material.

[0082] For example, when the first light-shielding layer 104 has a multi-layer structure, it can perform multiple different functions. For instance, the first light-shielding layer 104 may include multiple insulating layers, including a first insulating layer and a second insulating layer stacked together. The first insulating layer is close to the light-emitting component and is configured as an encapsulation layer for the light-emitting component, while the second insulating layer is located on the side of the first insulating layer away from the light-emitting component and is configured to block light. Thus, when the first light-shielding layer 104 has a multi-layer structure, it not only provides light blocking but also seals the light-emitting component and prevents moisture from entering. In some embodiments, the first insulating layer is made of an organic material, and the second insulating layer is made of the aforementioned light-blocking material.

[0083] like Figure 6 and 7 As shown. For example, the first light-transmitting portion includes a first through-hole 121 located in the first light-shielding layer 104. The orthographic projection of the first through-hole 121 on the first flexible support layer 101 lies within the orthographic projection of the light-emitting region N on the first flexible support layer 101. That is, the area of ​​the first through-hole 121 is smaller than the area of ​​the light-emitting region N, which is more conducive to generating approximately collimated illumination light.

[0084] For example, the planar shape of the first through hole 121 includes at least one of a square, a circle, an ellipse, a rectangle, and a parallelogram. It is understood that the planar shape of the first through hole 121 can also be other shapes, and this disclosure does not limit this.

[0085] For example, the size of the first through hole 121 is 0.1% to 99% of the size of the light-emitting region N. Further, for example, the size of the first through hole 121 is 0.1% to 56% of the size of the light-emitting region N, further, 5% to 50%, and even further, 15% to 35%. If the above dimensions are too large or too small, it may increase the manufacturing difficulty.

[0086] In some embodiments, the area of ​​the light-emitting region N is 400~900 µm. 2 The area of ​​the first through hole 121 is 1~225µm. 2 The luminescent region can be manufactured to a relatively large size to ensure luminescence quality. Furthermore, to further ensure luminescence quality and efficiency, the area of ​​the luminescent region N is 500–800 µm. 2 The area of ​​the first through hole 121 is 20~200µm. 2 Further, 20~50µm 2 This prevents a large amount of light from being blocked by the first light-shielding layer and converted into heat, thus affecting the target object's response to electrical stimulation. For example, when the area of ​​the light-emitting region N of each Micro-LED is 22µm... When the diameter is 22µm, the area of ​​the first through hole 121 is preferably 5µm. 5μm.

[0087] like Figure 6 As shown, there are multiple light-emitting units 110, each with multiple light-emitting regions N. There are also multiple first through holes 121, each corresponding to one of the multiple light-emitting regions N. This arrangement makes the multiple first through holes 121 more regularly arranged, reducing manufacturing difficulty and making it suitable for irradiating multiple regularly arranged target objects.

[0088] Figure 10 This is a partial planar schematic diagram of the light-emitting area and the first through-hole provided in an embodiment of this disclosure. For example, Figure 10 for Figure 6 Another variation of the central light-emitting region and the first through-hole (taking only two light-emitting regions as an example). For example... Figure 10 As shown, the first through-hole can be designed freely as needed. Each Micro-LED's light-emitting area can correspond to a different number of first through-holes.

[0089] In practical applications, there may be situations where different numbers of target objects are set in different lighting areas. If we adopt... Figure 6 The one-to-one regular distribution of the first through-holes in the original design cannot meet the requirements of the aforementioned application scenarios. In this embodiment, by setting the light-emitting area of ​​each Micro-LED as a corresponding number of first through-holes, different numbers of target objects can be illuminated in different lighting areas, thereby improving the light irradiation efficiency and making the application scenarios of implantable flexible photoelectrode devices more extensive.

[0090] Each luminescent region N can correspond to two or more first through holes. In this way, when the same luminous region is illuminated, multiple light beams L can be generated, which will respectively illuminate multiple target objects in the same luminous region, thereby improving the light illumination efficiency.

[0091] like Figure 10 As shown, for example, some of the multiple first through holes (such as...) Figure 10 As shown in Figure 121A), the orthographic projection of the light-emitting region N on the first flexible support layer 101 is located within the orthographic projection of the light-emitting region N on the first flexible support layer 101, and another portion of the plurality of first through holes (such as...) Figure 10 As shown in Figure 121B), the orthographic projection of the light-emitting region N onto the first flexible support layer 101 is located outside the orthographic projection of the light-emitting region N onto the first flexible support layer 101. When multiple first through-holes are arranged in the manner described above, multiple light beams L emitted from the multiple first through-holes can have different light intensities. For example, the light intensity of the light beam L in the first through-hole located within the orthographic projection of the light-emitting region N is greater than the light intensity of the light beam L in the first through-hole located outside the orthographic projection of the light-emitting region N. In this way, the different light intensity requirements of different target objects can be met.

[0092] Figure 11 This is a partial planar schematic diagram of the light-emitting area and the first through-hole provided in another embodiment of this disclosure. For example, Figure 11 for Figure 6 Another variation of the central light-emitting area and the first through hole (taking four light-emitting areas as an example only).

[0093] like Figure 11 As shown, for example, multiple light-emitting regions N include a first light-emitting region N1 and a second light-emitting region N2, which are arranged without gaps to connect with each other. By connecting the first light-emitting regions N1 and N2, a common light-emitting region CN can be formed. When multiple first through holes 121 are provided, it is not necessary for each first through hole 121 to be located within its corresponding light-emitting region, that is, the first through holes 121 are allowed to have a certain positional deviation. In this way, not only can the manufacturing process be simplified, but the flexibility of the layout of the first through holes 121 can also be improved.

[0094] like Figure 6 and Figure 7 As shown, for example, the implantable flexible photoelectrode device 1 also includes an electrode assembly 103 configured to record and transmit signals generated under the excitation of the light beam, such signals being generated, for example, in the illuminated area M or in a non-illuminated area. For example, the electrode assembly 103 functions to record changes in the electrical signals of a target object (e.g., a neuron) under light irradiation or light modulation, and to transmit the electrical signals to a control device.

[0095] In some embodiments, the electrode assembly 103 may be located on the same connection portion as the light-emitting assembly 102 (e.g., Figure 6 Both can be located on the first connecting portion 11, or they can be located on different connecting portions. When they are located on different connecting portions, the amount of light beam radiating to the electrode assembly 103 used to illuminate the area can be reduced, thereby reducing the interference of the light beam on the electrode recording and improving the signal-to-noise ratio of the device. When they are located on the same connecting portion, the number of connecting portions can be reduced, thereby reducing the number of implantation ports on the brain surface (i.e., openings on the brain surface used to guide implanted flexible photoelectrode devices). Therefore, those skilled in the art can set the specific positions of the electrode assembly 103 and the light-emitting component 102 according to actual needs.

[0096] like Figure 6 and Figure 7As shown, the electrode assembly 103 is located on the first connecting portion 11 and includes a first electrode 111. Both the first electrode 111 and the light-emitting unit 110 are located on the first side 101A of the first flexible support layer 101, and the first electrode 111 and the light-emitting unit 110 are spaced apart from each other in a direction parallel to the plane of the first flexible support layer 101. That is, a gap is left between the light-emitting region N and the first electrode 111, meaning that the orthographic projection of the light-emitting region N onto the plane of the first flexible support layer 101 does not overlap with the orthographic projection of the first electrode 111 onto the plane of the first flexible support layer 101. This further reduces the interference of the light beam L on the first electrode 111 and improves the signal-to-noise ratio of the device.

[0097] like Figure 7 As shown, for example, the first light-shielding layer 104 further includes a second light-transmitting portion, which is positioned to correspond to the first electrode 111 so that at least a portion of the first electrode 111 is exposed. The second light-transmitting portion is configured to transmit ambient light. In some embodiments, the second light-transmitting portion can be a through-hole or a light-transmitting portion made of a light-transmitting material. When a through-hole is used, material costs can be reduced and the manufacturing process can be simplified, so it is preferred. This disclosure describes embodiments where the second light-transmitting portion is a through-hole as an example.

[0098] like Figure 6 and Figure 7 As shown, for example, the second light-transmitting portion is a second through-hole 122 located in the first light-shielding layer 104, which partially exposes the first electrode 111. Compared to the case where the first light-shielding layer 104 covers the first electrode 111, by exposing part of the first electrode 111, the accuracy and precision of the first electrode 111 in recording changes in electrical signals can be improved. Furthermore, when the second through-hole 122 is configured to fully expose the first electrode 111, the detection accuracy and precision of the first electrode 111 can be further improved.

[0099] Figure 12 A schematic cross-sectional view of the first electrode and the light-emitting unit provided in an embodiment of this disclosure. For example, Figure 12 yes Figure 6 Another variation of the first connecting part.

[0100] like Figure 12 As shown, for example, the surface 111S of the first electrode 111 near the illumination area is not coplanar with the light-emitting surface 110S of the light-emitting unit 110. This further reduces interference from the light beam emitted by the light-emitting unit 110 on the first electrode 111, improving the accuracy of the first electrode 111 in recording changes in electrical signals. Furthermore, the distance d1 from the surface 111S of the first electrode 111 to the illumination area M is greater than the distance d2 from the light-emitting surface 110S of the light-emitting unit 110 to the illumination area M; that is, the surface 111S is farther from the illumination area than the light-emitting surface 110S. Figure 12 It can be seen that since the light beam L emitted from the light-emitting surface 110S is directed toward the illumination area M, when the surface 111S is farther away from the illumination area than the light-emitting surface 110S, the photoelectric effect generated by the light beam L hitting the first electrode 111 (because the first electrode 111 is on the back side of the light-emitting unit 110) can be avoided, thereby affecting the accuracy of the detection signal of the first electrode 111.

[0101] return Figure 7 For example, electrode assembly 103 further includes a second electrode 112, located on the side of the first electrode 111 away from the light-illuminated area M, and the second electrode 112 is insulated from the first electrode 111. In some embodiments, when signals from brain nerve cells are acquired, the signals vary depending on the implantation depth. By configuring a double-layer electrode structure of the first electrode 111 and the second electrode 112, the signals acquired by the first electrode 111 and the second electrode 112 can be compared and analyzed, thereby improving detection accuracy.

[0102] In this embodiment of the present disclosure, the first electrode 111 and the second electrode 112 are insulated from each other by a first flexible support layer 101. For example, the first flexible support layer 101 is made of a flexible insulating material, such as parylene C, polyethylene terephthalate (PETE), or polydimethylsiloxane (PDMS). The first electrode 111 and the second electrode 112 may be made of a conductive material, for example, at least one of a non-metallic material or a metallic material. Non-metallic materials are, for example, poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). Metallic materials are, for example, at least one of gold, silver, and copper.

[0103] like Figure 7 As shown, the second electrode 112 and the light-emitting unit 110 are spaced apart from each other in a direction parallel to the plane of the first flexible support layer 101. That is, a gap is left between the light-emitting region N and the second electrode 112, meaning that the orthographic projection of the light-emitting region N onto the plane of the first flexible support layer 101 does not overlap with the orthographic projection of the second electrode 112 onto the plane of the first flexible support layer 101. This further reduces the interference of the light beam L on the second electrode 112 and improves the signal-to-noise ratio of the device.

[0104] like Figure 7As shown, for example, the first connecting portion 11 also includes a second light-shielding layer 105, located on the side of the first flexible support layer 101 away from the light-emitting component 102, that is, on the second side 101B of the first flexible support layer 101. By providing the second light-shielding layer 105 on the second side 101B, the light beam L emitted by the light-emitting unit 110 can be prevented from escaping from the second side 101B of the first flexible support layer 101, thereby preventing light leakage.

[0105] like Figure 7 As shown, for example, the second light-shielding layer 105 includes a third light-transmitting portion, which is positioned to correspond to the second electrode 112 so that at least a portion of the second electrode 112 is exposed. The third light-transmitting portion is configured to transmit ambient light. In some embodiments, the third light-transmitting portion can be a through-hole or a light-transmitting portion made of a light-transmitting material. When a through-hole is used, material costs can be reduced and the manufacturing process can be simplified, so it is preferred. This disclosure describes embodiments with a through-hole as the third light-transmitting portion as an example.

[0106] like Figure 7 As shown, the second light-transmitting portion is a third through-hole 123 located in the second light-shielding layer 105, which partially exposes the second electrode 112. Compared to the case where the second light-shielding layer 105 covers the second electrode 112, by exposing part of the second electrode 112, the accuracy and precision of the second electrode 112 in recording changes in electrical signals can be improved. Furthermore, when the third through-hole 123 is configured to fully expose the second electrode 112, the detection accuracy and precision of the second electrode 112 can be further improved.

[0107] like Figure 12 As shown, the first electrode 111 and the second electrode 112 are both located inside the first flexible support layer 101, and the first electrode 111 and the second electrode 112 are insulated from each other through the first flexible support layer 101. Figure 12 In the second light-shielding layer 105, the third through hole 123 fully exposes the second electrode 112, which can improve the detection accuracy of the second electrode 112.

[0108] In this embodiment, the number of first electrodes 111 and second electrodes 112 can be the same or different. When the number of both is the same, the design difficulty can be reduced and the manufacturing process can be simplified, which is therefore preferred.

[0109] Figure 13 This is a schematic diagram of the structure of the first and second electrodes provided in an embodiment of this disclosure. For example, Figure 13 for Figure 7 A schematic diagram of the structure of the first electrode 111 and the second electrode 112. (See diagram below.) Figure 13As shown, the number of first electrodes 111 and the number of second electrodes 112 are the same, and they are arranged in a one-to-one correspondence to form multiple electrode groups 113.

[0110] Combination Figure 6 , Figure 7 and Figure 13 Each light-emitting unit 110 is configured in a one-to-one correspondence with an electrode group 113, so that after the light beam emitted by the light-emitting unit 110 illuminates the target object in the illuminated area, the electrical signal generated by the target object can be simultaneously recorded by a pair of first electrodes 111 and second electrodes 112 in the electrode group 113.

[0111] like Figure 13 As shown, for example, in the direction perpendicular to the thickness of the first flexible support layer, the first electrode 111 and the second electrode 112 overlap, which facilitates the detection of the same target object by both electrodes. Furthermore, when the first electrode 111 and the second electrode 112 completely overlap, the two electrodes can detect the same target object at the same position, thereby improving the accuracy of detection.

[0112] In this embodiment, the arrangement of the plurality of first electrodes 111 and the plurality of second electrodes 112 can be the same or different. When their arrangement is the same, the design difficulty is reduced and the manufacturing process is simplified, which is therefore preferred. For example, as... Figure 13 As shown, multiple first electrodes 111 and multiple second electrodes 112 are arranged in an array.

[0113] In this embodiment, the electrode assembly 103 further includes a first electrode lead and a second electrode lead (not shown). The first electrode 111 is connected to the control device inside the housing 2 via the first electrode lead, and the second electrode 112 is connected to the control device inside the housing 2 via the second electrode lead. By providing the first electrode lead and the second electrode lead, the electrical signals recorded by the first electrode 111 and the second electrode 112 can be transmitted to the control device respectively.

[0114] For example, both the first electrode lead and the second electrode lead are located in the first connection portion. The first electrode lead and the second electrode lead are, for example, made of a conductive material.

[0115] return Figure 4 The implantable flexible photoelectrode device 1 also includes a fixation component 13, which is located on the main body 10 and configured to fix the main body 10 in place. When the implantable flexible photoelectrode device 1 is implanted into the brain through an implantation port on the brain surface, the fixation component 13 can be used to fix the main body 10 near the implantation port on the brain surface in order to keep the relative position of the main body unchanged.

[0116] The present disclosure does not limit the specific implementation of the fixing component 13, as long as it can fix the main body 10 in place. Figure 14 for Figure 4 A cross-sectional schematic diagram of the fixing component 13. (See attached diagram.) Figure 14 As shown, the fixing component 13 includes an adhesive 131 and a storage container 132 for storing the adhesive 131. The body 10 has a direction perpendicular to its extending direction (e.g., Figure 14 The storage container 132 is arranged in the circumferential direction (outward from the paper surface) of the main body 10. In this way, the adhesive 131 inside the storage container 132 can also be arranged in the circumferential direction of the main body 10 and fix the main body to the implantation port on the brain surface.

[0117] Combination Figure 4 and Figure 14 The storage container 132 may be located on the first end 10A of the main body 10. By placing the storage container 132 on the first end 10A of the main body 10, the storage container 132 can be located on the side of the main body 10 away from the light-emitting component 102, so as to avoid the storage container 132 affecting the light beam emitted by the light-emitting component 102.

[0118] Without an adhesive to fix the position of the main body 10, the position of the light-emitting component 102 may shift, causing the illumination area to shift and thus affecting the light stimulation signal. In this embodiment, by fixing the light-emitting component 102 at a position away from the light-emitting component 102 and fixing the first end 10A of the main body 10 with the adhesive 131, the influence of the light-emitting component 102 shifting on the light stimulation signal can be prevented.

[0119] Figure 4 The storage container 132 shown is only illustrative. In other embodiments, the storage container 132 may also be located in the first region 11A on the first connection portion 11, which can also be far away from the light-emitting component 102 to avoid affecting the normal operation of the light-emitting component 102.

[0120] In some embodiments, the storage container 132 is configured to automatically release the adhesive 131 when the implantable flexible photoelectrode device 100 is secured in place. For example, when the implantable flexible photoelectrode device 100 is implanted below the skull, the storage container 132 can automatically release the adhesive 131. Compared to manual operation, this reduces operation time and increases implantation speed.

[0121] In this embodiment of the disclosure, the storage container 132 is, for example, a sealed bag made of a polymer material, such as polyvinyl chloride (PVC) or polycarbonate (PC), which can be manually torn open, similar to the tear-off opening of food packaging. Depending on actual needs, the sealed bag can be provided on one or more implantable flexible photoelectrode devices 1.

[0122] In this embodiment, the adhesive 131 is, for example, a biogel. The biogel is a medical adhesive gel possessing functions such as hemostasis, adhesion, breathability, and antibacterial properties. Biogels include readily biodegradable biogels and non-biodegradable biogels. For example, readily biodegradable biogels include sodium alginate gel or geltin-methacryloyl (GELMA) gel. Non-biodegradable biogels include polyvinyl alcohol (PVA) hydrogels, polyacrylamide (PAAM)-alginic acid hydrogels, or polyacrylic acid (PAA) hydrogels.

[0123] return Figure 4 and Figure 5 The brain-computer interface device 100 includes a control device 30, which is located within a housing 2 and connected to an implantable flexible photoelectric electrode device 1. The control device 30 is configured to transmit signals with the implantable flexible photoelectric electrode device 1. Because the control device 30 is located within the housing 2 and connected to the implantable flexible photoelectric electrode device 1, when the control device 30 and the housing 2 move together, the main body of the implantable flexible photoelectric electrode device 1 also moves accordingly. Therefore, the brain-computer interface device of this embodiment has high integration, is easy to carry, and can perform real-time monitoring of the target object anytime and anywhere.

[0124] like Figure 5 As shown, for example, the control device 30 includes a central control module 31, a drive module 32, a detection module 33, and a power supply module 34.

[0125] For example, one end of the central control module 31 is connected to the drive module 32 and configured to send a drive signal to the drive module 32, while the other end is connected to the detection module 33 and configured to receive a detection feedback signal from the detection module 33. In some embodiments, the central control module 31 is, for example, an integrated circuit.

[0126] For example, one end of the driving module 32 is connected to the central control module 31, and the other end is connected to the light-emitting component 102 of the implanted flexible photoelectrode device 1. The driving module 32 is configured to receive a driving signal from the central control module 31 and transmit the driving signal to the light-emitting component 102. The driving signal is, for example, a voltage, used to drive the light-emitting component 102 to emit light.

[0127] For example, one end of the detection module 33 is connected to the central control module 31, and the other end is connected to the electrode assembly 103 of the implantable flexible photoelectrode device 1. The detection module 33 is configured to receive signals (e.g., detection feedback signals) from the electrode assembly 103 and transmit the signals to the central control module 31.

[0128] Furthermore, for example, the central control module 31 includes a control circuit 311 and a communication circuit 312 connected to the control circuit 311. One end of the communication circuit 312 is connected to the drive module 32, and the other end is connected to the detection module 33. On the one hand, the control circuit 311 generates a drive signal and transmits it to the drive module 32 through the communication circuit 312; on the other hand, the communication circuit 312 transmits the detection feedback signal provided by the detection module 33 to the control circuit 311.

[0129] In some embodiments, when the brain-computer interface device includes multiple implantable flexible photoelectrode devices, the multiple central control modules 31 in the multiple photoelectrode devices can communicate with each other through their respective communication circuits 312, which is beneficial for comparing optical signals or electrical signals between different flexible photoelectrode devices and enhancing the control capability.

[0130] For example, the power module 34 is connected to the central control module 31, the drive module 32, and the detection module 33 to provide power. The power module 34 is located inside the housing 2, which further improves the integration of the brain-computer interface device 100 compared to placing the power module 34 outside the housing 2.

[0131] In some embodiments, the power module 34 is, for example, a lithium battery or other rechargeable battery. Since the minimum operating power of a single Micro-LED is 4.8μW, its supply voltage is between 3-6V, and its operating current is in the microamp level, only a small-capacity lithium battery is required.

[0132] In the preceding embodiments, both the light-emitting component 102 and the electrode component 103 are located on the first connecting portion 11. Therefore, the driving module 32 and the detection module 33 are both connected to the central control module 31, and all three can reside on the same chip. However, when the light-emitting component 102 and the electrode component 103 are located on different connecting portions, the driving module 32 and the detection module 33 can be separately configured. That is, the driving module 32 and the first central control module connected to it are located on one chip, while the detection module 33 and the second central control module connected to it are located on another chip. When configured on different chips, signal crosstalk between the driving module 32 and the detection module 33 can be reduced. When configured on the same chip, the integration of the brain-computer interface device can be improved.

[0133] In the preceding embodiments, both the light-emitting component 102 and the electrode component 103 are located on the first connecting portion 11. This improves the integration of the implantable flexible photoelectrode device and facilitates its miniaturization. However, the light-emitting component 102 and the electrode component 103 can also be disposed separately. For example, in case one, they are disposed on two connecting portions of the same implantable flexible photoelectrode device, or in case two, they are disposed on connecting portions of different implantable flexible photoelectrode devices. For simplicity, case one will be used as an example in the following description.

[0134] Figure 15 This is a schematic diagram of the structure of a brain-computer interface device provided in another embodiment of this disclosure. Figure 16 for Figure 15 A partially enlarged schematic diagram of the first connecting part. Figure 17 For along Figure 16 A schematic diagram of the cross-section of the BB line.

[0135] like Figure 15 As shown, another embodiment of the brain-computer interface device 100' provided in this disclosure includes: an implantable flexible photoelectrode device 1', a housing 2', and a control device (not shown) located within the housing 2'. Figure 4 The brain-computer interface devices are 100 different. Figure 15 The brain-computer interface device 100' includes two connectors.

[0136] For example, the implantable flexible photoelectrode device 1' includes a main body 10' and a first connecting portion 11' and a second connecting portion 12 connected to the main body 10'. The main body 10' includes a first end 10'A and a second end 10'B disposed opposite to each other along its extension direction. The first end 10'A is connected to the housing 2, and the second end 10'B is connected to the first connecting portion 11' and the second connecting portion 12.

[0137] like Figure 17As shown, for example, the first connecting portion 11' includes a first flexible support layer 101', a light-emitting component 102', and a first light-shielding layer 104'. For example, the light-emitting component 102' is located on the first flexible support layer 101 and is configured to illuminate the light-emitting area M (see reference). Figure 1 (As shown) provides a beam L.

[0138] In some embodiments, such as Figures 15 to 17 As shown, the first flexible support layer 101' includes a first side 101'A and a second side 101'B disposed opposite each other in a thickness direction perpendicular to the first flexible support layer 101' (e.g., the Z direction shown in the figure), and the light-emitting component 102' may be located on at least one of the first side 101'A and the second side 101'B.

[0139] like Figure 15 As shown, for example, when the target object P is located on the first side 101'A of the first flexible support layer 101' (i.e. Figure 15 When the light source is located on the lower side of the first connecting portion 11', a light-emitting component 102' can be arranged on the first side 101'A, so that the light beam L emitted by the light-emitting component 102' illuminates the target object P in the illumination area M. When there are multiple target objects P, and these multiple target objects are distributed on the first side 101'A and the second side 102'A of the first flexible support layer 101', the light-emitting component 102' can be respectively arranged on the first side 101'A and the second side 101'B of the first flexible support layer 101', thereby realizing the illumination of multiple target objects P. Therefore, by arranging the light-emitting component 102' on at least one side of the first side 101'A and the second side 101'B, the flexibility of the implantable flexible photoelectrode device 1 in different application scenarios can be improved, and different illumination requirements can be met. The embodiments disclosed herein are described with the light-emitting component 102' located only on the first side 101'A as an example.

[0140] like Figure 16 and 17 As shown, for example, the light-emitting component 102' includes light-emitting units 110', each light-emitting unit 110' having a light-emitting region N and configured to emit a light beam L from the light-emitting region N. This disclosure does not specifically limit the type of light-emitting unit 110'. In some embodiments, the light-emitting unit 110' may be a light-emitting diode device, such as a micro-LED device or a quantum dot light-emitting diode (QLED) device. Compared to QLED, Micro-LED has higher reliability and longer lifespan, and is therefore preferred. Here, the specific structure and arrangement of the light-emitting unit 110' can be found in the relevant descriptions in the preceding embodiments, and will not be repeated here.

[0141] In some embodiments, at least a portion of the first connecting portion 11' is provided with a light-emitting component 102'. For example, the first connecting portion 11' includes, along its extending direction, a first region close to the main body 10', a second region away from the main body 10', and a third region located between the first region and the second region. Here, the arrangement of the first region, the second region, and the third region of the first connecting portion 11' can be referred to Figure 4 The first connecting portion 11' is shown in the layout of its first region 11A, second region 11B, and third region 11C. The light-emitting component 102' can be located in at least one of the first region 11A, second region 11B, and third region 11C. This allows for flexible placement of the light-emitting component 102' according to actual needs. This embodiment is described using the example of the light-emitting component 102' being located in the first region 11A, second region 11B, and third region 11C.

[0142] like Figure 17 As shown, for example, the first light-shielding layer 104' is located on the side of the light-emitting unit 110' away from the first flexible support layer 101', and the first light-shielding layer 104' is configured to cover part of the light-emitting area N so that the light beam L is partially blocked by the first light-shielding layer 104'.

[0143] In this embodiment, by providing a first light-shielding layer 104' on the light-emitting unit 110', the light beam L emitted from the light-emitting unit 110' is partially blocked by the first light-shielding layer 104', thereby reducing the divergence angle of the light beam L and almost achieving a collimation effect. Therefore, the light beam L is more easily focused on specific neuronal cells, thus solving the problem of light path diffusion and improving the light modulation accuracy.

[0144] For example, the first light-shielding layer 104' includes a first light-transmitting portion configured to allow a light beam L to be transmitted through it and emitted in a direction away from the light-emitting region N. In some embodiments, the first light-transmitting portion can be a through-hole or a light-transmitting portion made of a light-transmitting material. When using a through-hole, material costs can be reduced and the manufacturing process can be simplified, and therefore it is preferred.

[0145] like Figure 16 and 17 As shown. For example, the first light-transmitting portion includes a first through-hole 121' located in the first light-shielding layer 104', and the orthographic projection of the first through-hole 121' onto the first flexible support layer 101' lies within the orthographic projection of the light-emitting region N onto the first flexible support layer 101'. That is, the area of ​​the first through-hole 121' is smaller than the area of ​​the light-emitting region N, which is more conducive to generating approximately collimated illumination light.

[0146] In some embodiments, the light-emitting unit may further include a first metal pad and a second metal pad, and the light-emitting component 102' may further include a first power line and a second power line, wherein the first power line is connected to the first metal pad, and the second power line is connected to the second metal pad. The specific structure and arrangement of the first power line, the second power line, the first metal pad, and the second metal pad can be referred to the relevant descriptions in the preceding embodiments, and will not be repeated here.

[0147] In this embodiment, the specific structure and arrangement of the first flexible support layer 101', the first light-shielding layer 104', the light-emitting component 102', the light-emitting unit 110', the light-emitting area N, and the first through hole 121' can be referred to the relevant descriptions in the previous embodiments, and will not be repeated here.

[0148] like Figure 16 As shown, there are multiple light-emitting units 110', each with multiple light-emitting areas N, and multiple first through holes 121', each corresponding to one of the multiple light-emitting areas N. This makes the arrangement of the multiple first through holes 121' more regular, which helps to reduce manufacturing difficulty and is suitable for use in situations where multiple target objects are arranged in a regular manner.

[0149] like Figure 17 As shown, for example, the first connecting portion 11 also includes a second light-shielding layer 105', located on the side of the first flexible support layer 101' away from the light-emitting component 102, that is, on the second side 101'B of the first flexible support layer 101'. By providing the second light-shielding layer 105' on the second side 101'B, the light beam L emitted by the light-emitting unit 110' can be prevented from escaping from the second side 101'B of the first flexible support layer 101', thereby preventing light leakage.

[0150] In some embodiments, when the light-emitting component further includes a light-emitting unit disposed on the second side 101'B of the first flexible support layer 101', the second light-shielding layer 105' includes a light-transmitting portion configured to allow the light beam L to pass through. This light-transmitting portion is, for example, a through-hole and can be designed with reference to the first through-hole 121'.

[0151] Figure 18 for Figure 15 A partially enlarged schematic diagram of the second connecting part. Figure 19 For along Figure 18 A schematic diagram of the cross-section of the CC line.

[0152] In this embodiment of the disclosure, the second connecting portion 12 is different from the first connecting portion 11', for example, they are provided with different components. Figures 15 to 19 As shown, when the light-emitting component 102' is located on the first connecting portion 11', the electrode component 103' may be located on at least one of the first connecting portion 11 and the second connecting portion 12.

[0153] like Figures 15 to 19 As shown, the light-emitting component 102' is located on the first connecting portion 11', and the electrode component 103' is located on the second connecting portion 12. By placing the light-emitting component 102' and the electrode component 103' on different connecting portions, the amount of light beam L emitted by the light-emitting component 102' radiating onto the electrode component 103' can be reduced, thereby reducing the interference of the light beam on the electrode recording and improving the signal-to-noise ratio of the device.

[0154] like Figure 15 As shown, the second connecting portion 12 is spaced apart from the first connecting portion 11'. For example, the second connecting portion 12 is located on the side of the first connecting portion 11' away from the illumination area M, which can further reduce the radiation of the light beam L emitted by the light-emitting component 102' onto the electrode component 103' and improve the signal-to-noise ratio of the device.

[0155] Figure 20 A partial cross-sectional schematic diagram of the first connecting portion and the second connecting portion provided in an embodiment of this disclosure. For example, Figure 20 for Figure 16 A partial cross-sectional schematic diagram of the first connecting part 11' and the second connecting part 12.

[0156] like Figure 20 As shown, the first connecting portion 11' is closer to the illumination area M than the second connecting portion 12, meaning the second connecting portion 12 is located on the side of the first connecting portion 11' that is furthest from the illumination area M. This prevents the light beam L emitted by the light-emitting unit 110' on the first connecting portion 11' from hitting the electrode assembly 103' of the second connecting portion 12.

[0157] like Figure 19 and Figure 20 As shown, for example, the second connecting portion 12 includes a second flexible support layer 201. The second flexible support layer 201 includes a first side 201A and a second side 201B disposed opposite each other in a direction perpendicular to the thickness of the second flexible support layer 201 (e.g., the Z direction shown in the figure). For example, the first side 201A is closer to the light-illuminated area M, and the second side 201B is farther away from the light-illuminated area.

[0158] For example, electrode assembly 103' includes a first electrode 111'. The first electrode 111' is located on a first side 201A of the second flexible support layer 201. By placing the first electrode 111' on the first side 201A of the second flexible support layer 201, and positioning the first electrode 111' on the side of the first connection portion 11' away from the illumination area M, the light beam L can be prevented from hitting the first electrode 111'.

[0159] like Figure 19 and Figure 20As shown, for example, electrode assembly 103' further includes a second electrode 112', which is located on the second side 201B of the second flexible support layer 201 and is insulated from the first electrode 111. In some embodiments, when signals from brain nerve cells are acquired, the signals vary depending on the implantation depth. By configuring a double-layer electrode structure with the first electrode 111' and the second electrode 112', the signals acquired by the first electrode 111' and the second electrode 112' can be compared and analyzed, thereby improving detection accuracy.

[0160] In this embodiment of the disclosure, the first electrode 111' and the second electrode 112' are insulated from each other by a second flexible support layer 201'. For example, the second flexible support layer 201' is made of a flexible insulating material, such as parylene C, polyethylene terephthalate (PETE), or polydimethylsiloxane (PDMS). The first electrode 111' and the second electrode 112' may be made of a conductive material, such as at least one of a non-metallic material or a metallic material. For example, a non-metallic material is poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). A metallic material is, for example, at least one of gold, silver, and copper.

[0161] In this embodiment, the number of first electrodes 111 and second electrodes 112 can be the same or different. When the number of both is the same, the design difficulty can be reduced and the manufacturing process can be simplified, which is therefore preferred.

[0162] In the direction perpendicular to the thickness of the second flexible support layer 201', the first electrode 111' and the second electrode 112' overlap each other, which is beneficial for both to detect the same target object. Furthermore, when the first electrode 111' and the second electrode 112' completely overlap (e.g., as...), Figure 20 When (as shown), the two electrodes can detect the same target object at the same position, thereby improving the accuracy of detection.

[0163] like Figure 16As shown, there are multiple light-emitting units 110', each with multiple light-emitting regions N. There are also multiple first through holes 121', each corresponding to one of the multiple light-emitting regions N. This arrangement makes the multiple first through holes 121 more regularly arranged, reducing manufacturing difficulty and making it suitable for irradiating multiple regularly arranged target objects.

[0164] In some embodiments, the number of the first electrode and the second electrode may be the same or different. For example... Figure 18 and Figure 19 As shown, there are multiple first electrodes 111' and multiple second electrodes 112'. The number of multiple first electrodes 111' and multiple second electrodes 112' is the same, and they are arranged in a one-to-one correspondence to form multiple electrode groups 113'.

[0165] Combination Figure 16 and Figure 18 Each light-emitting unit 110' is set up in a one-to-one correspondence with an electrode group 113'. In this way, after the light beam emitted by the light-emitting unit 110' illuminates the target object in the illuminated area, the electrical signal generated by the target object can be recorded simultaneously by a pair of first electrodes 111' and second electrodes 112' in the electrode group 113'. This facilitates the subsequent comparison and analysis of the recorded signals.

[0166] In this embodiment, the arrangement of the plurality of first electrodes 111' and the plurality of second electrodes 112' can be the same or different. When their arrangement is the same, the design difficulty is reduced and the manufacturing process is simplified, which is therefore preferred. For example, as... Figure 18 As shown, multiple first electrodes 111' and multiple second electrodes 112' are arranged in an array.

[0167] In this embodiment of the present disclosure, the electrode assembly 103' further includes a first electrode lead and a second electrode lead (not shown). The first electrode 111' is connected to a control device inside the housing 2' via the first electrode lead, and the second electrode 112' is connected to the control device inside the housing 2' via the second electrode lead. By providing the first electrode lead' and the second electrode lead', the electrical signals recorded by the first electrode 111' and the second electrode 112' can be transmitted to the control device respectively.

[0168] For example, both the first electrode lead and the second electrode lead are located in the second connection portion 12. The first electrode lead and the second electrode lead are made of, for example, a conductive material.

[0169] like Figure 15As shown, the brain-computer interface device 100' includes a control device located within the housing 2' and connected to the implantable flexible photoelectric electrode device 1'. Because the control device is located within the housing 2' and connected to the implantable flexible photoelectric electrode device 1', when the control device 30 and the housing 2' move together, the main body of the implantable flexible photoelectric electrode device 1' also moves accordingly. Therefore, the brain-computer interface device of this embodiment has high integration, is easy to carry, and can perform real-time monitoring of the target object anytime, anywhere. For details regarding the specific structure and arrangement of the control device in the brain-computer interface device 100', please refer to the previous... Figure 4 The relevant descriptions in the document will not be repeated here.

[0170] because Figure 4 The shell 2 and Figure 15 The shell 2' is basically the same as the shell in the previous one. The following explanation will take shell 2 as an example.

[0171] Figure 21 for Figure 4 Front view of the inner shell. Figure 22 For along Figure 21 A cross-sectional view of the DD line. (See diagram below.) Figure 21 and Figure 22 As shown, the shell 2 has a longitudinal axis O1O2.

[0172] For example, the housing 2 has a first dimension V1 along the longitudinal axis OO and a second dimension V2 perpendicular to the longitudinal axis O1O2, and the second dimension V2 is larger than the first dimension V1. By setting the second dimension V2 to be larger than the first dimension V1, the height of the housing 2 can be minimized while ensuring that the housing 2 has a large accommodating space (for accommodating the control device). In this way, when the brain-computer interface device 100 is fully implanted in the brain, the overall implantation depth of the brain-computer interface device 100 can be reduced.

[0173] In some embodiments, the flexible photoelectrode device 100 is configured to be implanted below the skull, and the housing 2 is configured to be implanted at and / or below the skull. For example, when the housing 2 is implanted at the skull, an opening can be formed at the skull, and the housing 2 can be placed in the opening. This facilitates the fixation of the housing 2 and prevents it from shaking. Moreover, it ensures the quality of signal communication and charging efficiency between the brain-computer interface device and external devices (external devices).

[0174] In this embodiment of the disclosure, the number of implantable flexible photoelectrode devices 1 connected to the housing 2 can be one (e.g., ...). Figure 15 As shown), it can also be multiple (such as...). Figure 4(As shown). The shell 2 has a circumferential direction Q perpendicular to the longitudinal axis OO. When there are multiple implantable flexible photoelectrode devices 1, the multiple implantable flexible photoelectrode devices 1 are distributed along the circumferential direction Q, which is beneficial for detecting light and electrical signals of target objects in different areas of the brain.

[0175] In some embodiments, the lengths of the multiple implantable flexible photoelectrode devices 1 may be the same or different. Those skilled in the art can choose according to actual needs.

[0176] like Figure 21 As shown, for example, the housing 2 includes a first side 2A and a second side 2B disposed opposite to each other on the longitudinal axis OO. The main body 10 of the implantable flexible photoelectrode device 1 is connected to at least one of the first side 2A and the second side 2B. That is, the implantable flexible photoelectrode device 1 can be disposed on one side of the housing 2 or on both sides. With the above arrangement, the illumination range and signal detection range of different regions in the brain can be increased by the implantable flexible photoelectrode device 1, thereby further improving the flexibility of the implantable flexible photoelectrode device 1 in different application scenarios. Figure 4 Multiple implantable flexible photoelectrode devices 1 are disposed on the first side 2A.

[0177] like Figure 21 As shown, for example, the brain-computer interface device 100 also includes a fixing component 4, which is located on the first side 2A of the housing 2 and configured to fix the brain-computer interface device 100 in place. For example, when the housing 2 is not implanted into the brain, the fixing component 4 is located between the housing 2 and the brain surface, which serves to fix the device and reduce the feeling of a foreign body.

[0178] For example, the fixing component 4 includes an adhesive. The adhesive may be, for example, a biogel, a medical adhesive gel possessing functions such as hemostasis, adhesion, breathability, and antibacterial properties. Specific materials of the biogel can be found in the detailed descriptions in the preceding embodiments, and will not be repeated here.

[0179] In this embodiment of the disclosure, part or all of the brain-computer interface device 100 (or brain-computer interface device 100') is implantable. That is, part or all of the brain-computer interface device 100 can be implanted into the brain. For example, when the brain-computer interface device 100 (or brain-computer interface device 100') is partially implanted into the brain, the implantable flexible photoelectrode device 1 is implanted into the brain, and the shell 2 remains outside the brain. When the brain-computer interface device 100 (or brain-computer interface device 100') is fully implanted into the brain, the implantable flexible photoelectrode device 1 is implanted below the skull, and the shell 2 can be implanted at and / or below the skull.

[0180] The brain-computer interface device provided in this disclosure may include one or more implantable flexible photoelectrode devices.

[0181] Figure 15 The brain-computer interface device 100' includes only one implantable flexible photoelectrode device 100', and the first connecting portion 11' and the second connecting portion 12 are both connected to the same main body 10'. As another variation, the brain-computer interface device 100' may also include at least two implantable flexible photoelectrode devices, each of which includes a main body and a connecting portion, wherein the connecting portion of one of the implantable flexible photoelectrode devices is... Figure 15 The first connecting part 11' shown (i.e., only the light-emitting component is provided), and the connecting part of the other implantable flexible photoelectrode device is... Figure 15 The second connection portion 12 shown is provided only with electrode components. In this case, an implantable flexible photoelectrode device with a light-emitting component can be used to provide light signals at one site (i.e., the illuminated area), and another implantable flexible photoelectrode device with an electrode component can be used to collect signals at the same or different sites (i.e., illuminated or unilluminated areas). The collected signals can be applied to scientific research and teaching, to conduct further brain function research, and can also be used as a medical device for treating epileptic abnormal brain discharges.

[0182] For example, before the electrode assembly operates, brain tissue is transfected with inhibitory photosensitive proteins; then, the abnormal discharge areas in the brain are identified and brain wave signals at the onset of symptoms are acquired to construct a database; finally, brain signals are detected through the electrode assembly and matched with the database; when abnormal brain discharge is detected, the photoelectric component can be triggered to provide targeted light to suppress brain discharge. Using this method, the driver program of the implantable flexible photoelectric electrode device can be trained to accurately stimulate pathogens when the brain discharges, minimizing interference with normal cells.

[0183] In the case of a brain-computer interface device including at least two implantable flexible photoelectrode devices, each implantable flexible photoelectrode device can be configured to have only an electrode assembly. This allows for the detection of electrical signals from different parts of the brain. When a subject performs a certain brain activity, such as visual activity, auditory activity, or psychological activity, the brain signals can be accurately detected for subsequent brain signal library construction, simulation, and analysis.

[0184] In brain-computer interface devices comprising at least two implantable flexible photoelectrode devices, each device can be configured to have only a light-emitting component, thereby enabling the restoration or inhibition of brain activity. The restoration of brain activity can include: pain sensation restoration, visual sensation restoration, tactile sensation restoration, and brain function restoration, while the inhibition of brain activity can target specific diseases, such as the suppression of abnormal brain discharge behaviors in epilepsy.

[0185] When a brain-computer interface device includes at least two implantable flexible photoelectrode devices, the arrangement of the electrode assembly and the light-emitting assembly is not limited to the configurations described in the above embodiments. Those skilled in the art can design flexibly according to different needs.

[0186] In some embodiments, each of the plurality of implantable flexible photoelectrode devices employs Figure 4 The illustrated structure of the implantable flexible photoelectrode device 1. In other embodiments, each of the plurality of implantable flexible photoelectrode devices employs... Figure 15 The illustrated structure of the implantable flexible photoelectrode device 1' is shown. In some embodiments, a portion of the plurality of implantable flexible photoelectrode devices employs... Figure 4 The structure of the implantable flexible photoelectrode device 1 shown is another part of which adopts... Figure 15 The implantable flexible photoelectrode device 1' shown is illustrated.

[0187] Figure 23 This is a schematic diagram of the structure of a brain-computer interface device provided in another embodiment of this disclosure. Figure 4 The difference is, Figure 23 The brain-computer interface device consists of only one implantable flexible photoelectrode device 1.

[0188] Figure 24 This is a schematic diagram of the structure of a brain-computer interface device provided in yet another embodiment of this disclosure. Figure 23 The difference is, Figure 24 The shell 2'' is flatter than shell 2. For example, compared to Figure 21 The first dimension V1 of the shell 2 is smaller, and the first dimension of the shell 2'' is smaller, thus achieving a thinner and lighter shell.

[0189] Figure 25 This is a schematic diagram of the structure of a brain-computer interface device provided in another embodiment of this disclosure. Figure 24 The difference is, Figure 23 The brain-computer interface device includes multiple implantable flexible photoelectrode devices.

[0190] In this embodiment of the disclosure, Figures 23 to 25 The implantable flexible photoelectrode device 1 in the middle can also be replaced with Figure 15 The implantable flexible photoelectrode device 1' can be connected to different types of implantable flexible photoelectrode devices at the same time using the same control device.

[0191] This disclosure also provides a method for manufacturing a brain-computer interface device, referring to... Figure 4The manufacturing method includes forming an implantable flexible photoelectrode device 1, wherein the implantable flexible photoelectrode device 1 includes a main body 10 and a first connecting portion 11 connected to the main body 10. The first connecting portion 11 includes a first flexible support layer 101, a light-emitting component 102, and a first light-shielding layer 104. The light-emitting component 102 is located on the first flexible support layer 101 and configured to provide a light beam L to an illumination area M. The light-emitting component 102 includes a light-emitting unit 110, which has a light-emitting area N and is configured to emit a light beam L from the light-emitting area N. The first light-shielding layer 104 is located on the side of the light-emitting unit 110 away from the first flexible support layer 101, and the first light-shielding layer 104 is configured to cover a portion of the light-emitting area N so that the light beam L is partially blocked by the first light-shielding layer 104.

[0192] In the above manufacturing method, by forming a first light-shielding layer on the light-emitting unit, the light beam emitted by the light-emitting unit is partially blocked by the first light-shielding layer, thereby reducing the area of ​​the illuminated region. Compared to Figure 3 In cases where the illumination area is large, this embodiment of the present disclosure solves the problem of light path dispersion by reducing the area of ​​the illumination area, making it easier for the light beam to be concentrated on a specific neuron cell, thereby improving the light modulation accuracy.

[0193] See Figure 4 and Figure 5 Furthermore, the above manufacturing method also includes: forming a housing 2 and a control device 30 located in the housing 2, wherein the control device 30 is connected to the implantable flexible photoelectrode device 1, and the control device 30 is configured to transmit signals with the implantable flexible photoelectrode device 1; the main body 10 of the implantable flexible photoelectrode device 1 is configured to move together with the housing 2 and the control device 30.

[0194] In the above manufacturing method, the specific structure and arrangement of the implantable flexible photoelectrode device 1, the housing 2 and the control device 30 can be referred to the description in the previous embodiments, and will not be repeated here.

[0195] The following points should be noted in this article: (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0196] (2) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0197] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure, which is determined by the appended claims.

Claims

1. An implantable flexible photoelectrode device, comprising: main body; A first connecting portion, the first connecting portion being connected to the main body and comprising: First flexible support layer; A light-emitting component, located on the first flexible support layer and configured to provide a light beam to an illumination area, the light-emitting component includes a light-emitting unit having a light-emitting area and configured to emit the light beam from the light-emitting area; Wherein, the orthographic projection of the illuminated area onto the first flexible support layer lies within the orthographic projection of the luminescent area onto the first flexible support layer. The implantable flexible photoelectrode device further includes: The second connecting part is connected to the main body and includes a second flexible support layer, the second flexible support layer including a first side close to the light-illuminated area and a second side away from the light-illuminated area; An electrode assembly is located on the second connection portion and includes a first electrode and a second electrode. The first electrode is located on the first side, the second electrode is located on the second side, and the second electrode is insulated from the first electrode.

2. The implantable flexible photoelectrode device according to claim 1, wherein, The first connecting part further includes: A first light-shielding layer is located on the side of the light-emitting unit away from the first flexible support layer. The first light-shielding layer is configured to cover part of the light-emitting area so that the light beam is partially blocked by the first light-shielding layer.

3. The implantable flexible photoelectrode device according to claim 2, in, The first light-shielding layer includes a first light-transmitting portion, which is configured to allow the light beam to be transmitted through it and emitted in a direction away from the light-emitting area.

4. The implantable flexible photoelectrode device according to claim 3, in, The first light-transmitting portion includes a first through-hole located in the first light-shielding layer, and the orthographic projection of the first through-hole on the first flexible support layer is located within the orthographic projection of the light-emitting area on the first flexible support layer.

5. The implantable flexible photoelectrode device according to claim 4, in, There are multiple first through holes. The orthographic projection of some of the first through holes on the first flexible support layer is located within the orthographic projection of the light-emitting area on the first flexible support layer, while the orthographic projection of another portion of the first through holes on the first flexible support layer is located outside the orthographic projection of the light-emitting area on the first flexible support layer.

6. The implantable flexible photoelectrode device according to claim 4, in, The planar shape of the first through hole includes at least one of square, circle, ellipse, rectangle and parallelogram.

7. The implantable flexible photoelectrode device according to claim 4, in, The size of the first through hole is 0.1% to 99% of the size of the light-emitting area.

8. The implantable flexible photoelectrode device according to claim 7, in, The area of ​​the first through hole is 1~225 µm. 2 The area of ​​the light-emitting region N is 400~900 µm. 2 .

9. The implantable flexible photoelectrode device according to claim 3, in, There are multiple light-emitting units, and each of the multiple light-emitting units has multiple light-emitting areas; there are multiple first light-transmitting parts, and each of the multiple first light-transmitting parts is arranged in a one-to-one correspondence with the multiple light-emitting areas.

10. The implantable flexible photoelectrode device according to claim 9, in, The plurality of light-emitting regions are arranged without gaps so that the plurality of light-emitting regions are connected to each other.

11. The implantable flexible photoelectrode device according to claim 1, wherein: The second connecting portion is different from the first connecting portion and is spaced apart from the first connecting portion; The electrode assembly is configured to record and transmit signals generated under the excitation of the light beam.

12. The implantable flexible photoelectrode device according to claim 1, in, The first electrode is located on the side of the first connection portion away from the illuminated area.

13. The implantable flexible photoelectrode device according to claim 1, wherein, The first electrode and the second electrode overlap each other in the thickness direction perpendicular to the second flexible support layer.

14. The implantable flexible photoelectrode device according to claim 1, in, The light-emitting unit is multiple, the first electrode is multiple, the second electrode is multiple, and the multiple first electrodes and multiple second electrodes are configured to correspond one-to-one and form multiple electrode groups; Each of the light-emitting units is configured in a one-to-one correspondence with one of the multiple electrode groups.

15. The implantable flexible photoelectrode device according to claim 1, further comprising: A fixing component, which is located on the body and configured to fix the body in place.

16. The implantable flexible photoelectrode device according to claim 15, in, The fixing component includes: Adhesives; A storage container configured to store the adhesive; The main body has a circumferential direction perpendicular to its extension direction, and the storage container is disposed along the circumferential direction of the main body.

17. The implantable flexible photoelectrode device according to claim 16, wherein, The body includes a first end away from the light-emitting component and a second end close to the light-emitting component along its extension direction, and the storage container is located on the first end of the body.

18. The implantable flexible photoelectrode device according to claim 16, wherein, The storage container is configured to automatically release the adhesive when the implantable flexible photoelectrode device is fixed in place.

19. The implantable flexible photoelectrode device according to any one of claims 1 to 18, wherein, The implantable flexible photoelectrode device is constructed to be implanted below the skull, and the illuminated area is the cerebral cortex region within the brain.

20. A brain-computer interface device, comprising the implantable flexible photoelectrode device as described in any one of claims 1-18.

21. The brain-computer interface device according to claim 20, further comprising: case; and A control device is located in the housing and connected to the implantable flexible photoelectrode device, the control device being configured to transmit signals with the implantable flexible photoelectrode device; The main body of the implantable flexible photoelectrode device moves together with the housing and the control device.

22. The brain-computer interface device according to claim 21, in, The implantable flexible photoelectrode device also includes an electrode assembly. The control device includes: Central control module; A driving module, one end of which is connected to the central control module and the other end of which is connected to the light-emitting component of the implanted flexible photoelectrode device, is configured to provide a driving signal to the light-emitting component; The detection module is connected at one end to the central control module and at the other end to the electrode assembly of the implantable flexible photoelectrode device, and is configured to receive signals from the electrode assembly.

23. The brain-computer interface device according to claim 22, further comprising: A power module, connected to the central control module, the drive module and the detection module, is configured to provide power, wherein the power module is located in the housing.

24. The brain-computer interface device according to claim 22, wherein, The central control module includes: The control circuit is configured to generate drive signals; and A communication circuit connected to the control circuit, wherein a first end of the communication circuit is connected to the drive module and a second end is connected to the detection module, the communication circuit being configured to transmit the drive signal to the drive module and the signal provided by the detection module from the electrode assembly to the control circuit.

25. The brain-computer interface device according to claim 21, in, The housing has a longitudinal axis, and the housing includes a first dimension along the longitudinal axis and a second dimension perpendicular to the longitudinal axis, wherein the first dimension is smaller than the second dimension.

26. The brain-computer interface device according to claim 25, in, The housing has a circumferential direction perpendicular to the longitudinal axis, and there are multiple implantable flexible photoelectrode devices distributed along the circumferential direction.

27. The brain-computer interface device according to claim 25, in, The housing includes a first side and a second side disposed opposite to each other on the longitudinal axis, and the main body of the implantable flexible photoelectrode device is connected to at least one of the first side and the second side.

28. The brain-computer interface device according to claim 27, in, The brain-computer interface device further includes a fixing component, which is located on the same side of the housing as the main body and is configured to fix the brain-computer interface device in place.

29. The brain-computer interface device according to claim 28, wherein, The fixing component includes an adhesive.

30. The brain-computer interface device according to claim 20, wherein, The brain-computer interface device is partially or wholly implantable.

31. The brain-computer interface device according to claim 30, wherein, The implantable flexible photoelectrode device is constructed to be implanted below the skull, and the shell of the brain-computer interface device is constructed to be implanted at and / or below the skull.

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