A kind of array structure resin bond polishing pad and preparation method thereof

Abstract

The present invention belongs to the technical field of polishing pads, and specifically relates to an array structure resin bond polishing pad and a preparation method thereof; the present invention adopts the following preparation method: a, mixing of abrasive layer slurry; b, mold preparation; c, pre-curing and molding of bonding layer; d, curing and molding of abrasive layer; e, demolding and bonding; to obtain an array structure resin bond polishing pad, which has a four-layer structure including an abrasive layer and bonding layer molded by a double-layer mold, a base layer formed by a substrate, and a bonding layer formed by a double-sided adhesive, wherein the abrasive layer and the bonding layer are corresponding array structures. The present invention adopts a double-layer mold and direct casting molding to prepare the polishing pad, improves the production tools, optimizes the production process, and improves the production efficiency; the present invention adopts a modified resin with both the strength of epoxy resin and the hardness of phenolic resin, thereby increasing the service life of the grinding wheel; the present invention adopts a pre-curing and re-curing treatment method, so that the bonding layer and the abrasive layer are stably combined.

Description

Technical Field

[0001] The invention belongs to the technical field of polishing pads, and in particular relates to an array structure resin bond polishing pad and a preparation method thereof. Background Art

[0002] The structural design of grinding tools is an important means to improve the grinding performance of grinding tools. At present, through structural design on the geometric surface of the grinding tool, active grinding area and passive grinding area are formed on its surface; during the grinding process, the active grinding area performs intermittent grinding process, thereby reducing the total contact time between the grinding tool and the workpiece, the average grinding force and the temperature of the grinding zone; the passive grinding area refers to the non-grinding area, which has enough space for the entry of grinding fluid and the processing and discharge of grinding chips, thereby reducing grinding heat and improving the quality of the processed surface.

[0003] With the development of the 3C industry, more and more hard and brittle materials such as sapphire, SiC chips, and microcrystalline glass are used. However, these materials are hard and brittle, which results in the inability of traditional abrasive processing methods to meet the needs of workpiece surface accuracy. Currently, many companies use grinding pad products for grinding. Their grinding pads mostly use resin binders, and the surface structure is arranged in an array structure, which can effectively grind hard and brittle materials such as sapphire.

[0004] There are three main existing technical methods for realizing the design of the array structure of the abrasive surface: 1. Prepare a separate abrasive structure unit in advance, and then transfer and arrange it to the substrate surface individually or as a whole; 2. Prepare a mold with a product structure in advance, place the molding material in it, and then cover the substrate on the mold surface, and remove the mold after solidification; 3. Directly form the entire surface of the substrate, and realize the array structure of the surface through mechanical molding or laser cutting after solidification. However, whether it is the pre-preparation method or the post-processing method, there is a problem of long production cycle, and it is impossible to expand production, resulting in insufficient supply. Summary of the invention

[0005] The purpose of the present invention is to simplify the preparation process of the polishing pad and shorten the production cycle of the polishing pad under the premise of meeting the processing requirements of hard and brittle material workpieces such as sapphire, SiC wafers, and microcrystalline glass; a preparation method of an array structure resin bond polishing pad is provided, in which a double-layer mold is designed and the polishing pad is prepared by direct casting.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A method for preparing an array structure resin bond polishing pad comprises the following steps:

[0008] a. Slurry mixing:

[0009] According to the composition of the abrasive layer: 20-35 parts of epoxy modified phenolic resin binder, 50-60 parts of abrasive, 2-5 parts of lubricating material, 10-30 parts of filler, weigh the abrasive, lubricating material and filler according to the mass ratio, use a three-dimensional mixer to mix for 1-4 hours until the mixed powder is uniform and set aside;

[0010] According to the composition of the epoxy-modified phenolic resin binder, each component is weighed according to the mass ratio, and a mechanical stirrer is used for stirring at a stirring rate of 400-600 r / min and a stirring time of 10-30 min, and the epoxy-modified phenolic resin binder is obtained by blending and modification;

[0011] Subsequently, the mixed powder is added to the rubber in batches and stirred with a stirrer until it is uniform. The stirring rate is 400-800 r / min and the stirring time is 20-60 min to obtain the abrasive layer forming slurry.

[0012] b. Mold preparation:

[0013] The substrate surface, the first mold and the second mold are cleaned, and a layer of release agent is evenly applied on the surface and cavity of the first mold and the second mold; the first mold and the second mold have corresponding cavities, and the cavity is a through-hole structure arranged in an array.

[0014] c. Adhesive layer forming:

[0015] Fix the substrate on a plane, position the first mold on the substrate, and use heavy objects to press and fix the periphery to prevent the mold from being dislocated and moved; pour the adhesive on the mold, apply it evenly, and place it in an oven for pre-curing treatment at a pre-curing temperature of 60~80℃ and a pre-curing time of 0.5-2h.

[0016] d. Abrasive layer forming:

[0017] The second mold is positioned on the first mold, fixed with a heavy object, the abrasive layer forming slurry obtained in step a is poured on it, and it is slowly and evenly scraped, and the whole is placed in an oven for curing treatment. The curing process parameters are 60~70℃, curing for 5h; 80~90℃, curing for 4h; 90~100℃, curing for 4h.

[0018] e. Demolding and bonding:

[0019] After curing, the second mold and the first mold are removed layer by layer to obtain a semi-finished product; a layer of double-sided tape is evenly adhered to the back of the substrate of the semi-finished product, and the array structure resin bond polishing pad is cut according to the required shape.

[0020] Preferably, the abrasive is a composition of diamond, silicon carbide and corundum, with a particle size range of 400#~2000#.

[0021] Preferably, the lubricating material is graphite or hexagonal boron nitride.

[0022] Preferably, the filler is a composition comprising cerium oxide, chromium oxide, iron oxide and copper powder.

[0023] Preferably, the components of the epoxy-modified phenolic resin binder are: 15-35 parts of epoxy resin, 45-65 parts of phenolic resin, 5-20 parts of curing agent, and 3-5 parts of diluent; wherein the epoxy resin is a glycidyl epoxy resin liquid, the phenolic resin has a viscosity between 200 and 500 mpa·s and a hardness between 75 and 90 HD, the curing agent is an epoxy resin curing agent, and the diluent is cyclohexane or dibutyl phthalate.

[0024] Furthermore, the through hole structure on the first mold and the second mold is one of a square column, a cylinder, a triangular column, a pentagonal prism, and a hexagonal prism; the through hole size of the first mold is greater than or equal to the through hole size of the second mold.

[0025] Furthermore, the thickness of the second mold is higher than that of the first mold. The thickness of the first mold is 0.05~3mm, and the thickness of the second mold is 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm.

[0026] Preferably, the mold material is silicone or rubber.

[0027] Preferably, the substrate is made of one of PC, PET and ABS.

[0028] According to the above preparation method, an array structure resin bond polishing pad is obtained, which has a four-layer structure from top to bottom: an abrasive layer formed by the second mold, a bonding layer formed by the first mold, a base layer formed by a substrate, and an adhesive layer formed by a double-sided tape, wherein the abrasive layer and the bonding layer are corresponding array structures. The beneficial effects of the present invention are:

[0029] 1. The present invention adopts a double-layer mold and direct casting to prepare the grinding pad, improves the production tools, optimizes the production process, and improves the production efficiency; the bonding layer in the present invention is prepared by mold scraping, and the bonding layer forms a dot array structure, which avoids the problem of the overall flexibility of the grinding pad being reduced due to the poor flexibility of the adhesive used when the substrate is coated in the prior art; the mold in the present invention is made of flexible material, and the release agent applied between the molds can make the molds and the molds and the substrate fit tightly, and there will be no overflow during scraping.

[0030] 2. The grinding pad of the present invention is optimized through formula design, adopts new resin, new ratio and new filler, thereby improving the grinding performance of the grinding pad and improving the surface quality of the workpiece after grinding. The present invention adopts epoxy resin to modify the phenolic resin, so that the resin has both the strength of epoxy resin and the hardness of phenolic resin, thereby improving the service life of the grinding wheel.

[0031] 3. The present invention prepares a grinding pad having a four-layer structure of an abrasive layer, a bonding layer, a base layer and an adhesive layer, wherein the abrasive layer and the bonding layer are arranged in an array structure corresponding to each other, thereby saving materials for the bonding layer while ensuring the bonding effect. The array structure allows the grinding pad to have sufficient space for the entry of grinding fluid and the processing and discharge of grinding chips, thereby reducing grinding heat and improving the quality of the processed surface.

[0032] 4. The bonding layer of the present invention is formed by pre-curing, which makes its surface fluidity worse, not fully cured or fully cured, and then the abrasive layer is formed by curing treatment, which avoids the mutual flow between the abrasive layer and the bonding layer during the curing process, so that the bonding layer and the abrasive layer are distinct and firmly connected, ensuring that the array structure will not separate from the base layer during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is an overall schematic diagram of the cylindrical array structure resin bond polishing pad in Example 1;

[0034] Figure 2 This is a schematic diagram of the arrangement of the cavities of the molds corresponding to each other in Example 1;

[0035] Figure 3 Schematic diagram of a first mold used for forming the bonding layer in Example 1;

[0036] Figure 4 is a schematic diagram of a second mold used for forming the abrasive layer in Example 1;

[0037] Figure 5 This is an overall schematic diagram of the resin-bonded polishing pad with a square column array structure in Example 2;

[0038] Figure 6 A schematic diagram of the arrangement of the cavities of the molds corresponding to each other in the second embodiment;

[0039] Figure 7 This is an overall schematic diagram of the hexagonal prism array structure resin bond polishing pad in Example 3;

[0040] In the figure, 1-abrasive layer, 2-bonding layer, 3-base layer, 4-adhesive layer, 5-first mold cavity, 6-second mold cavity, 7-second mold, 8-first mold. DETAILED DESCRIPTION

[0041] The technical solution of the present invention is further described below in conjunction with the embodiments of the present invention and the accompanying drawings.

[0042] The present invention provides a method for preparing an array structure resin bond polishing pad, comprising the following steps:

[0043] a. Slurry mixing:

[0044] According to the composition of the abrasive layer: 20-35 parts of epoxy modified phenolic resin binder, 50-60 parts of abrasive, 2-5 parts of lubricating material, 10-30 parts of filler, weigh the abrasive, lubricating material, and filler according to the mass ratio, and use a three-dimensional mixer to mix for 1-4 hours until the mixed powder is uniform and ready for use. The abrasive is a combination of diamond, silicon carbide, and corundum, the lubricating material is graphite or hexagonal boron nitride, and the filler is a combination of cerium oxide, chromium oxide, iron oxide, and copper powder.

[0045] Form according to the component of epoxy-modified phenolic resin binder again: 15~35 parts of epoxy resins, 45~65 parts of phenolic resins, 5~20 parts of curing agents, 3~5 parts of diluents, weigh each component by mass ratio, adopt mechanical stirrer to stir, stirring speed (S.S.) 400~600r / min, mixing time 10~30min, blending and modification obtains the sizing material of epoxy-modified phenolic resin binder.Wherein epoxy resin is glycidyl epoxy resin liquid, phenolic resin is phenolic resin liquid with viscosity between 200~500mpa·s, hardness at 75~90HD, curing agent is epoxy resin curing agent, and diluent is cyclohexane or dibutyl phthalate.

[0046] Subsequently, the mixed powder is added to the rubber in batches and stirred with a stirrer until it is uniform. The stirring rate is 400-800 r / min and the stirring time is 20-60 min to obtain the abrasive layer forming slurry.

[0047] b. Mold preparation:

[0048] Clean the surface of the substrate, the first mold and the second mold, and evenly apply a layer of release agent on the surface and cavity of the first mold and the second mold.

[0049] The material of the substrate is one of PC, PET, and ABS; the material of the mold is silicone or rubber.

[0050] The first mold and the second mold have corresponding cavities, and the cavity is a through-hole structure arranged in an array. The through-hole structure is one of a square column, a cylinder, a triangular column, a pentagonal prism, and a hexagonal prism. The through-hole size of the first mold is greater than or equal to the through-hole size of the second mold.

[0051] The thickness of the second mold is higher than that of the first mold. The thickness of the first mold is 0.05~3mm, and the thickness of the second mold is 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm.

[0052] c. Adhesive layer forming:

[0053] Fix the substrate on a plane, position the first mold on the substrate, and use heavy objects to press and fix the periphery to prevent the mold from moving out of position; pour the adhesive on the mold, apply it evenly, and place it in an oven for pre-curing treatment at a temperature of 60-80°C for a pre-curing time of 0.5-2h;

[0054] d. Abrasive layer forming:

[0055] The second mold is positioned on the first mold, fixed with a heavy object, the abrasive layer forming slurry obtained in step a is poured on it, and it is slowly and evenly scraped, and the whole is placed in an oven for curing treatment. The curing process parameters are 60~70℃, curing for 5h; 80~90℃, curing for 4h; 90~100℃, curing for 4h.

[0056] e. Demolding and bonding:

[0057] After curing, the second mold and the first mold are removed layer by layer to obtain a semi-finished product; a layer of double-sided tape is evenly adhered to the back of the substrate of the semi-finished product, and the array structure resin bond polishing pad is cut according to the required shape.

[0058] According to the preparation method of the present invention, an array structure resin bond polishing pad can be obtained, which has a four-layer structure from top to bottom: an abrasive layer formed by a second mold, a bonding layer formed by a first mold, a base layer formed by a substrate, and an adhesive layer formed by a double-sided tape, wherein the abrasive layer and the bonding layer are corresponding array structures.

[0059] Embodiment 1

[0060] This embodiment provides a method for preparing an array structure resin bond polishing pad, comprising the following steps:

[0061] a. Slurry mixing:

[0062] a1) Mix the powders: weigh 80 g of 400# diamond, 92 g of 600# green silicon carbide, 20 g of 2000# white corundum, 8 g of graphite powder, 32 g of cerium oxide, 12 g of iron oxide, 16 g of chromium oxide, and 3 g of copper powder, put them into a three-dimensional mixer, mix for 2 h, and take them out for later use.

[0063] a2) Mixing a rubber material: weigh 96 g of phenolic resin liquid, 24 g of epoxy resin liquid, 12 g of low molecular weight polyamide curing agent, and 6 g of cyclohexane; stir them evenly with a mechanical stirrer at a stirring rate of 400 r / min for 15 min; and blend and modify to obtain a rubber material of an epoxy-modified phenolic resin binder.

[0064] a3) to obtain a slurry, then add the mixed powder obtained in a1) into the rubber obtained in a2) three times, stirring while adding, the stirring rate is 400r / min, the stirring time is 20min, the mixed powder of abrasive, lubricating material and filler is evenly mixed with the epoxy modified phenolic resin binder to obtain an abrasive layer forming slurry.

[0065] b. Mold preparation:

[0066] like Figure 2 As shown, the first mold 8 and the second mold 7 have corresponding cavities, and the cavities are through-hole structures arranged in an array. Figure 3 , 4 As shown, the first mold cavity 5 and the second mold cavity 6 are both cylindrical through-hole structures, and the through-hole sizes are the same.

[0067] Since the thickness of the second mold is higher than that of the first mold, the thickness range of the first mold is 0.05~3mm, and the thickness of the second mold is selected to be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm. In this embodiment, the thickness of the second mold 7 is 3mm, and the thickness of the first mold 8 is 0.5mm.

[0068] Use alcohol to wipe the surface of the substrate, and use silicone oil as a release agent to evenly apply it on the surface and cavity of the first mold 8 and the second mold 7.

[0069] c. Adhesive layer forming:

[0070] Fix the substrate on a plane, position the first mold 8 on the base, and use heavy objects to press and fix the periphery to prevent the mold from being dislocated and moving; pour room temperature curing epoxy resin as an adhesive on the cavity of the first mold 8, apply it evenly, and then place it in an oven for pre-curing treatment. The pre-curing temperature is preferably maintained at 60°C and the pre-curing time is 1 hour.

[0071] d. Abrasive layer forming:

[0072] The second mold 7 is positioned and placed on the first mold 8, and fixed by heavy objects. The abrasive layer forming slurry obtained in step a is poured on it, and it is slowly and evenly scraped. The whole is placed in an oven for curing treatment. The curing process parameters are 60~70℃, curing for 5h; 80~90℃, curing for 4h; 90~100℃, curing for 4h.

[0073] e. Demolding and bonding:

[0074] After curing, the second mold 7 and the first mold 8 are removed layer by layer to obtain a semi-finished product; a layer of double-sided adhesive is evenly bonded to the back of the substrate of the semi-finished product, and the array structure resin bond polishing pad is cut according to the required shape, such as Figure 1 As shown, it has a four-layer structure from top to bottom: an abrasive layer 1 formed by the second mold, a bonding layer 2 formed by the first mold, a base layer 3 formed by a substrate, and an adhesive layer 4 formed by a double-sided tape, wherein the abrasive layer and the bonding layer are corresponding array structures.

[0075] Embodiment 2

[0076] This embodiment provides a method for preparing an array structure resin bond polishing pad, comprising the following steps:

[0077] a. Slurry mixing:

[0078] According to the components of the abrasive layer: 20-35 parts of epoxy modified phenolic resin binder, 50-60 parts of abrasive, 2-5 parts of lubricating material, and 10-30 parts of filler, the preparation is carried out in a mass ratio.

[0079] a1) Mix the powders: weigh 80 g of 600# diamond, 92 g of 600# green silicon carbide, 20 g of 2000# white corundum, 8 g of hexagonal boron nitride, 32 g of cerium oxide, 12 g of iron oxide, 16 g of chromium oxide, and 3 g of copper powder, put them into a three-dimensional mixer, mix for 2 h, and take them out for use.

[0080] a2) Mixing a rubber material: weigh 72 g of phenolic resin liquid, 48 g of epoxy resin liquid, 24 g of low molecular weight polyamide curing agent, and 6 g of dibutyl phthalate, stir them evenly with a mechanical stirrer at a stirring rate of 600 r / min for 30 min, and blend and modify to obtain a rubber material of an epoxy-modified phenolic resin binder.

[0081] a3) to obtain a slurry, then add the mixed powder obtained in a1) into the rubber obtained in a2) three times, stirring while adding, the stirring rate is 500r / min, the stirring time is 30min, the mixed powder of abrasive, lubricating material and filler is evenly mixed with the epoxy modified phenolic resin binder to obtain an abrasive layer forming slurry.

[0082] b. Mold preparation:

[0083] In this embodiment, the thickness of the second mold 7 is preferably 4 mm, and the thickness of the first mold 8 is 1 mm. The first mold 8 and the second mold 7 have corresponding cavities, and the cavities are through-hole structures arranged in an array. The first mold cavity 5 and the second mold cavity 6 are square columnar through-hole structures, such as Figure 6As shown, the through hole size of the first mold cavity 5 is slightly larger than the through hole size of the second mold cavity 6 .

[0084] Use alcohol to wipe the surface of the substrate, and use silicone oil as a release agent to evenly apply it on the surface and cavity of the first mold 8 and the second mold 7.

[0085] c. Adhesive layer forming:

[0086] Fix the substrate on a plane, position the first mold 8 on the base, and use heavy objects to press and fix the periphery to prevent the mold from being dislocated and moved; pour room temperature curing epoxy resin as an adhesive on the cavity of the first mold 8, apply it evenly, and then place it in an oven for pre-curing treatment. The pre-curing temperature is preferably maintained at 80°C and the pre-curing time is 0.5h.

[0087] d. Abrasive layer forming:

[0088] The second mold 7 is positioned and placed on the first mold 8, and fixed by heavy objects. The abrasive layer forming slurry obtained in step a is poured on it, and it is slowly and evenly scraped. The whole is placed in an oven for curing treatment. The curing process parameters are 60~70℃, curing for 5h; 80~90℃, curing for 4h; 90~100℃, curing for 4h.

[0089] e. Demolding and bonding:

[0090] After curing, the second mold 7 and the first mold 8 are removed layer by layer to obtain a semi-finished product; a layer of double-sided adhesive is evenly bonded to the back of the substrate of the semi-finished product, and the semi-finished product is cut according to the required shape to obtain a square columnar array structure resin bond polishing pad, such as Figure 5 As shown, it has a four-layer structure from top to bottom: an abrasive layer formed by the second mold, a bonding layer formed by the first mold, a base layer formed by a substrate, and an adhesive layer formed by a double-sided tape, wherein the abrasive layer and the bonding layer are corresponding array structures.

[0091] Embodiment 3

[0092] The difference from the first embodiment is that the first mold cavity 5 and the second mold cavity 6 are hexagonal prism through-hole structures, and the array structure resin bond polishing pad finally formed is as follows: Figure 7 shown.

[0093] Experimental example

[0094] The above examples 1, 2, 3, the company's original patented polishing pad product and the commercially available resin bond polishing pad were used to perform grinding tests on the microcrystalline glass material, and the comparison results are shown in the following table:

[0095]

[0096] According to the comparison of the results, the array structure resin bond polishing pad prepared by the present invention can effectively grind microcrystalline glass. The flatness of the workpiece after grinding can reach 0.01mm, the surface roughness Sz of the workpiece after grinding can reach 6800nm, the surface quality after grinding is good, and the grinding process is stable.

Claims

1. A method for preparing an array structure resin bond polishing pad, characterized in that: The steps include: a. Slurry mixing: According to the composition of the abrasive layer: 20-35 parts of epoxy modified phenolic resin binder, 50-60 parts of abrasive, 2-5 parts of lubricating material, 10-30 parts of filler, weigh the abrasive, lubricating material and filler according to the mass ratio, use a three-dimensional mixer to mix for 1-4 hours until the mixed powder is uniform and set aside; According to the composition of the epoxy-modified phenolic resin binder, each component is weighed according to the mass ratio, and a mechanical stirrer is used for stirring at a stirring rate of 400-600 r / min and a stirring time of 10-30 min, and the epoxy-modified phenolic resin binder is obtained by blending and modification; Then, the mixed powder is added to the rubber in batches, and stirred with a stirrer until uniform, with a stirring rate of 400-800 r / min and a stirring time of 20-60 min to obtain an abrasive layer forming slurry; b. Mold preparation: Clean the substrate surface, the first mold, and the second mold, and evenly apply a layer of release agent on the surface and cavity of the first mold and the second mold; the first mold and the second mold have corresponding cavities, and the cavity is a through-hole structure arranged in an array; c. Adhesive layer forming: Fix the substrate on a plane, position the first mold on the substrate, and use heavy objects to press and fix the periphery to prevent the mold from moving out of position; pour the adhesive on the mold, apply it evenly, and place it in an oven for pre-curing treatment at a temperature of 60-80°C for a pre-curing time of 0.5-2h; d. Abrasive layer forming: The second mold is positioned and placed on the first mold, and a heavy object is used to press and fix it. The abrasive layer forming slurry obtained in step a is poured on it, and the slurry is slowly and evenly applied. The whole is placed in an oven for curing. The curing process parameters are 60-70°C, curing for 5 hours; 80-90°C, curing for 4 hours; 90-100°C, curing for 4 hours; e. Demolding and bonding: After curing, the second mold and the first mold are removed layer by layer to obtain a semi-finished product; a layer of double-sided tape is evenly adhered to the back of the substrate of the semi-finished product, and the array structure resin bond polishing pad is cut according to the required shape.

2. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The abrasive is a composite of diamond, silicon carbide and corundum, and the particle size range is 400#~2000#.

3. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The lubricating material is graphite or hexagonal boron nitride.

4. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The filler is a composition comprising cerium oxide, chromium oxide, iron oxide and copper powder.

5. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The epoxy-modified phenolic resin binder comprises the following components: 15-35 parts of epoxy resin, 45-65 parts of phenolic resin, 5-20 parts of curing agent and 3-5 parts of diluent; wherein the epoxy resin is a glycidyl epoxy resin liquid, the phenolic resin has a viscosity between 200 and 500 mpa·s and a hardness between 75 and 90 HD, the curing agent is an epoxy resin curing agent, and the diluent is cyclohexane or dibutyl phthalate.

6. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The through hole structure on the first mold and the second mold is one of a square column, a cylinder, a triangular prism, a pentagonal prism, and a hexagonal prism; the through hole size of the first mold is greater than or equal to the through hole size of the second mold.

7. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The thickness of the second mold is higher than that of the first mold. The thickness of the first mold is 0.05~3mm, and the thickness of the second mold is 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm.

8. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The mold material is silicone or rubber.

9. The method for preparing an array structure resin bond polishing pad according to claim 1, characterized in that: The material of the substrate is one of PC, PET and ABS.

10. The preparation method according to claim 1 obtains an array structure resin bond polishing pad, characterized in that: The four-layer structure comprises from top to bottom: an abrasive layer formed by the second mold, a bonding layer formed by the first mold, a base layer formed by a substrate, and an adhesive layer formed by a double-sided tape, wherein the abrasive layer and the bonding layer are corresponding array structures.

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