A method for making a via in a glass and a glass containing a via

Abstract

This invention relates to a method for preparing through-holes in glass and glass containing through-holes. The method includes irradiating a first surface of the glass with a laser to induce a modified region within the glass. During the induction, the distance between the focal point of the laser and the second surface of the glass is controlled according to the following formula: h = d / 2 + (1 + (X - 120) / 120 × 1% + (1.7 - Y) / 1.7 × 5%)K / 2, where h is the distance between the focal point of the laser and the second surface of the glass in mm, d is the glass thinning amount in mm, K is the focal depth of the laser in mm, X is the energy of the laser in μJ, and Y is the pulse width of the laser in ps. The glass after induction is chemically etched to form through-holes in the glass, wherein the aperture of the through-hole on the first surface is different from the aperture on the second surface.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of three-dimensional integrated packaging adapter plates, and particularly relates to a method for preparing a through hole on glass and glass containing a through hole. BACKGROUND

[0002] An adapter plate is a carrier for high-density interconnection and integrated passive components in a three-dimensional integrated microsystem and is a core material for realizing three-dimensional integration. Glass material has no free-moving charges and excellent dielectric properties, and is the most suitable adapter plate material. Through-hole glass has application advantages such as low cost, simple process flow, and strong mechanical stability, and has wide application prospects in the fields of radio frequency devices, micro-electro-mechanical system (MEMS) packaging, and optoelectronic system integration.

[0003] However, the through hole of the current through-hole glass is usually a cylindrical through hole, as shown in patents CN113045209A and CN116161870A. Patent CN114560634A provides a method for preparing a special-shaped through hole using a protective film, but the protective film layer is not resistant to high temperature, so that the glass corrosion cannot be carried out under high temperature conditions, affecting the corrosion speed, and the method for preparing the through hole is relatively complex. SUMMARY

[0004] The purpose of the present application is to provide a method for preparing a through hole on glass, which can prepare a special-shaped through hole without setting a protective film on the glass.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0006] The present application provides a method for preparing a through hole on glass, comprising the following steps:

[0007] (1) using a laser to irradiate from a first surface of the glass to generate an induction in the glass to form a modified region; when the induction is performed, the distance between the focal point of the laser and the second surface of the glass is controlled according to the following formula: h = d / 2 + (1 + (X-120) / 120 x 1% + (1.7-Y) / 1.7 x 5%)K / 2, wherein h is the distance between the focal point of the laser and the second surface of the glass, in mm, d is the glass thinning amount, in mm, K is the focal depth of the laser, in mm, X is the energy of the laser, in μJ, Y is the pulse width of the laser, in ps, and the first surface and the second surface are two opposite surfaces of the glass;

[0008] (2) chemically etching the glass after the induction is completed to form a through hole on the glass, the through hole penetrating the first surface and the second surface, and the aperture of the through hole on the first surface is different from the aperture on the second surface.

[0009] Wherein, the first surface and the second surface are two opposing surfaces in the glass thickness direction. In this application, the first surface is the upper surface and the second surface is the lower surface.

[0010] In some embodiments, the aperture of the through-hole on the first surface is larger than the aperture on the second surface. Furthermore, the through-hole is frustum-shaped, and frustum-shaped through-hole glass has superior strength.

[0011] According to some embodiments, the pulse width of the laser is 290 fs to 10 ps, ​​more specifically 290 fs to 5 ps, for example 0.3 ps, 0.4 ps, 0.5 ps, 0.6 ps, 0.7 ps, 0.8 ps, 0.9 ps, 1 ps, 1.1 ps, 1.2 ps, 1.3 ps, 1.4 ps, 1.5 ps, 1.6 ps, 1.7 ps, 1.8 ps, 1.9 ps, 2.0 ps, ​​2.1 ps, 2.2 ps, 2.3 ps, 2.4 ps. ps, 2.5ps, 2.6ps, 2.7ps, 2.8ps, 2.9ps, 3.0ps, 3.1ps, 3.2ps, 3.3ps, 3.4ps, 3.5ps, 3.6ps, 3.7ps, 3.8ps, 3.9ps, 4.0ps, 4.1ps, 4.2ps, 4.3ps, 4.4ps, 4.5ps, 4.6ps, 4.7ps, 4.8ps, 4.9ps, or 5.0ps, preferably 500fs to 2ps.

[0012] According to some embodiments, the energy of the laser is 60–200 μJ, more preferably 60–180 μJ, such as 60 μJ, 65 μJ, 70 μJ, 75 μJ, 80 μJ, 85 μJ, 90 μJ, 95 μJ, 100 μJ, 105 μJ, 110 μJ, 115 μJ, 120 μJ, 125 μJ, 130 μJ, 135 μJ, 140 μJ, 145 μJ, 150 μJ, 155 μJ, 160 μJ, 165 μJ, 170 μJ, 175 μJ or 180 μJ, more preferably 100–120 μJ.

[0013] This invention modifies the effective range of the laser by adjusting the position of the laser focus, laser energy, pulse width, etc., thereby achieving the modification of a specific area. As a result, no additional protective layer is needed, and a frustum-shaped through hole can be formed between the upper and lower surfaces of the glass.

[0014] According to some embodiments, the average power of the laser is ≤30W, and more specifically 15-20W.

[0015] According to certain embodiments, the glass thinning amount is controlled to be 5–800 μm. Those skilled in the art can estimate the time required to etch a through-hole based on the corrosion rates of the etching solution and the glass, and can calculate the glass thinning amount based on the estimated corrosion time. The methods for estimating the corrosion time and glass thinning amount are well known to those skilled in the art and will not be elaborated here.

[0016] According to some embodiments, the distance between the focal point of the laser and the second surface of the glass is 0.6 to 1.2 mm, preferably 0.7 to 0.9 mm.

[0017] According to some embodiments, the chemical etching time is controlled to be 30–600 min, for example 30 min, 40 min, 50 min, 60 min, 70 min, 80 min, 90 min, 100 min, 110 min, 120 min, 130 min, 140 min, 150 min, 160 min, 170 min, 180 min, 190 min, 200 min, 210 min, 220 min, 230 min, 240 min, 250 min, 260 min, 270 min, 280 min, 290 min, 3 00min, 310min, 320min, 330min, 340min, 350min, 360min, 370min, 380min, 390min, 400min, 410min, 420min, 430min, 440min, 450min, 460min, 470min, 480min, 490min, 500min, 510min, 520min, 530min, 540min, 550min, 560min, 570min, 580min, 590min or 600min.

[0018] According to some embodiments, the temperature of the chemical etching is controlled to be between 20 and 150°C, for example, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, or 150°C.

[0019] According to some embodiments, the chemical etching is performed using an acidic or alkaline agent. The alkaline agent is a potassium hydroxide solution with a concentration of 5–40 wt%, preferably with a concentration of 20–35 wt%. The acidic agent is a hydrogen fluoride solution with a concentration of 5–20 wt%, preferably with a concentration of 5–15 wt%.

[0020] According to some embodiments, the thickness of the glass is 0.03 to 5 mm.

[0021] According to some embodiments, the glass is made of quartz glass, soda-lime glass, aluminosilicate glass, or borosilicate glass.

[0022] According to some embodiments, the diameter of the through hole on the second surface is 0.01 to 3 mm.

[0023] According to some embodiments, the taper of the through hole is 0.01 to 45°.

[0024] According to some embodiments, the aperture difference of the through hole between the first surface and the second surface is ≥10μm.

[0025] According to some embodiments, the specific method of step (1) is as follows: the glass is placed on the stage of the laser device, the glass is vacuum adsorbed, and then the corresponding modification pattern trajectory is introduced into the laser device. The laser is used to modify a specific area of ​​the glass, wherein the adsorption intensity of the vacuum adsorption is controlled to be 60-120 MPa.

[0026] According to some embodiments, the glass processed in step (1) is washed and dried, and then placed in an acidic or alkaline agent for corrosion to form a blind hole structure. The corrosion continues until a specific area of ​​the second surface of the glass is corroded away, exposing the through hole structure. The glass is then cooled, washed, and dried to obtain glass with through holes.

[0027] According to some specific and preferred embodiments, the method includes the following steps performed sequentially:

[0028] 1) Perform ultrasonic cleaning on the glass and then dry it;

[0029] 2) The glass dried in step 1) is subjected to laser-induced modification;

[0030] 3) Perform ultrasonic cleaning and dry the glass after the modification in step 2);

[0031] 4) Place the dried glass from step 3) into a chemical agent for etching to form a porous structure;

[0032] 5) After the glass in step 4) has been etched, it is cooled, washed and dried to obtain glass with through holes.

[0033] The determination of the completion of laser-induced modification is made in accordance with conventional techniques in the field, such as the generation of modification lines extending from the first surface to the second surface in the glass modification region.

[0034] A second aspect of the present invention provides a glass with a through hole, the through hole penetrating two opposing surfaces in the thickness direction of the glass, and the aperture difference of the through hole on the two opposing surfaces is ≥10μm.

[0035] According to some implementations, the two opposing surfaces are the first surface and the second surface described above.

[0036] According to some embodiments, the diameter of the through hole on the surface with a smaller aperture is 0.01 to 3 mm; that is, the diameter of the through hole on the second surface is 0.01 to 3 mm.

[0037] According to some embodiments, the taper of the through hole is 0.01 to 45°.

[0038] According to some embodiments, the glass is made of quartz glass, soda-lime glass, aluminosilicate glass, or borosilicate glass.

[0039] According to some embodiments, the thickness of the glass with through holes is 0.02 to 4.5 mm, wherein the thickness of the glass with through holes is the thickness of the glass product with through holes prepared, and is the thickness of the glass raw material after laser induction and chemical etching.

[0040] According to some embodiments, the glass with through holes is prepared by the above method, which will not be described in detail here.

[0041] A third aspect of the present invention provides a three-dimensional integrated packaging adapter board, the three-dimensional integrated packaging adapter board comprising glass with through holes, the through holes penetrating two opposing surfaces in the thickness direction of the glass, and the aperture difference of the through holes on the two opposing surfaces being ≥10μm.

[0042] The glass with through holes used in the 3D integrated packaging adapter board is the same as the glass with through holes described in the second aspect above, and will not be repeated here.

[0043] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0044] This invention adjusts the position of the laser focus to induce a modified region in a specific area of ​​the glass. Without the need for a protective film, chemical etching is used to corrode this modified region, creating heterogeneous through-holes with different apertures on the first and second surfaces. The absence of a protective film reduces the number of process steps and avoids the temperature limitations imposed by the protective film on chemical etching, allowing the etching to proceed at higher temperatures. Detailed Implementation

[0045] All features disclosed in this invention, or all steps in the disclosed methods or processes, may be combined in any way except for mutually exclusive features or steps.

[0046] The technical solution of the present invention will be further described below with reference to specific embodiments. However, the present invention should not be limited to these embodiments. Unless specifically stated otherwise, all features can be replaced by other equivalent or similar features. Unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features. The proportions mentioned below are all mass ratios, and "%" means mass percentage. Unless otherwise specified in the following embodiments, all raw materials are commercially available or prepared by conventional methods in the art. The room temperature in the following embodiments is 25℃±5℃, and the focal depth K of the laser used in the following embodiments is 1.2mm.

[0047] Example 1

[0048] The preparation steps of a 0.1 mm thick low borosilicate glass, designated D263T, with a frustum structure and through-hole are as follows:

[0049] (1) Glass drying: Select D263T glass with a thickness of 0.1mm and a size of φ150 and use NaOH solution for ultrasonic cleaning for 15min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15min.

[0050] (2) Place the cleaned glass in an oven to dry at 50°C for 20 minutes;

[0051] (3) Place the glass on the laser equipment platform;

[0052] (4) Vacuum fixation of the glass is performed with a vacuum strength of 80MPa;

[0053] (5) Import the cutting graphic file into the laser device. The specific shape is a φ0.01mm circle, and the laser focus height is set to be 0.62mm above the lower surface of the glass.

[0054] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 1.1 ps, an energy of 180 μJ, and a laser power of 20 W.

[0055] (7) Ultrasonic cleaning of the modified glass DIW for 15 min;

[0056] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0057] (9) Heat a 30wt% KOH solution to 110℃;

[0058] (10) The modified glass was placed in KOH solution and etched for 65 minutes. The glass on the lower surface was completely etched away, exposing the through-hole structure. At this time, the difference in hole size between the upper and lower surfaces of the frustum through-hole glass was 10 μm, the hole diameter on the lower surface was 0.01 mm, and the glass thinning amount was 10 μm.

[0059] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0060] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0061] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0062] Example 2

[0063] The preparation steps of a 0.5mm thick soda-lime glass, grade B270, frustum-shaped through-hole glass are as follows:

[0064] (1) Glass drying: Select B270 glass with a thickness of 0.5mm and a size of φ230 and use NaOH solution for ultrasonic cleaning for 15min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15min.

[0065] (2) Place the cleaned glass into an oven to dry at 50°C for 20 minutes;

[0066] (3) Place the glass on the laser equipment platform;

[0067] (4) Vacuum fixation of the glass is performed with a vacuum strength of 80MPa;

[0068] (5) Import the cutting graphic file into the laser device. The specific shape is a φ0.02mm circle, and the laser focus height is set to be 0.75mm above the lower surface of the glass.

[0069] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 1.7 ps, an energy of 140 μJ, and a laser power of 20 W.

[0070] (7) The modified glass is ultrasonically cleaned by DIW for 15 minutes;

[0071] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0072] (9) Heat a 10 wt% HF solution to 25 °C;

[0073] (10) The modified glass was placed in HF solution and etched for 125 min. The glass on the lower surface was completely etched away, exposing the through-hole structure. The difference in size between the upper and lower surfaces of the frustum through-hole glass was 100 μm, the hole diameter on the lower surface was 0.02 mm, and the glass thinning amount was 300 μm.

[0074] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0075] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0076] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0077] Example 3

[0078] The preparation steps of a 1.0 mm thick borosilicate glass, designated BF33, with a frustum-shaped through-hole are as follows:

[0079] (1) Glass drying: Select BF33 glass with a thickness of 1.0 mm and a size of φ150 and use NaOH solution for ultrasonic cleaning for 15 min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15 min.

[0080] (2) Place the cleaned glass in an oven to dry at 50°C for 20 minutes;

[0081] (3) Place the glass on the laser equipment platform;

[0082] (4) Vacuum fixation of the glass with a vacuum strength of 70MPa;

[0083] (5) Import the cutting graphic file into the laser device. The specific shape is a φ1mm circle, and the laser focus height is set to be 0.8mm higher than the lower surface of the glass.

[0084] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 0.7 ps, an energy of 80 μJ, and a laser power of 20 W.

[0085] (7) Ultrasonic cleaning of the modified glass DIW for 15 min;

[0086] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0087] (9) Heat a 30wt% KOH solution to 130℃;

[0088] (10) The modified glass was placed in KOH solution and etched for 385 min. The glass on the lower surface was completely etched away, exposing the through-hole structure. The difference in size between the upper and lower surfaces of the frustum through-hole glass was 40 μm, the hole diameter on the lower surface was 1 mm, and the glass thinning amount was 380 μm.

[0089] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0090] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0091] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0092] Example 4

[0093] The preparation steps of a 4.0 mm thick soda-lime glass, grade B270, frustum-shaped through-hole glass are as follows:

[0094] (1) Glass drying: Select a B270 glass with a thickness of 4mm and a size of φ230 and use NaOH solution for ultrasonic cleaning for 15min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15min.

[0095] (2) Place the cleaned glass in an oven to dry at 50°C for 20 minutes;

[0096] (3) Place the glass on the laser equipment platform;

[0097] (4) Vacuum fixation of the glass is performed with a vacuum strength of 100MPa;

[0098] (5) Import the cutting graphic file into the laser device. The specific shape is a φ0.5mm circle, and the laser focus height is set to be 1.0mm higher than the lower surface of the glass.

[0099] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 0.4 ps, an energy of 180 μJ, and a laser power of 20 W.

[0100] (7) Ultrasonic cleaning of the modified glass DIW for 15 min;

[0101] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0102] (9) Heat a 30wt% KOH solution to 135℃;

[0103] (10) The modified glass was placed in KOH solution and etched for 500 min. The glass on the lower surface was completely etched away, exposing the through-hole structure. The difference in hole size between the upper and lower surfaces of the frustum through-hole glass was 40 μm, the hole diameter on the lower surface was 0.5 mm, and the glass thinning amount was 780 μm.

[0104] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0105] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0106] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0107] Example 5

[0108] The preparation steps of a frustum-shaped through-hole glass with a thickness of 0.03 mm and a grade of AS87 are as follows:

[0109] (1) Glass drying: Select AS87 glass with a thickness of 0.03mm and a size of φ100 and use NaOH solution for ultrasonic cleaning for 15min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15min.

[0110] (2) Place the cleaned glass in an oven to dry at 50°C for 20 minutes;

[0111] (3) Place the glass on the laser equipment platform;

[0112] (4) Vacuum fixation of the glass is performed with a vacuum strength of 110MPa;

[0113] (5) Import the cut graphic file into the laser device. The specific shape is a φ0.01mm circle, and the laser focus height is set to be 0.605mm above the lower surface of the glass.

[0114] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 0.9 ps, an energy of 120 μJ, and a laser power of 20 W.

[0115] (7) Ultrasonic cleaning of the modified glass DIW for 15 min;

[0116] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0117] (9) Heat a 30wt% KOH solution to 120℃;

[0118] (10) The modified glass was placed in KOH solution and etched for 40 min. The glass on the lower surface was completely etched away, exposing the through-hole structure. The difference in hole size between the upper and lower surfaces of the frustum through-hole glass was 10 μm, the hole diameter on the lower surface was 0.01 mm, and the glass thinning amount was 8 μm.

[0119] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0120] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0121] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0122] Example 6

[0123] The preparation steps of a 0.1 mm thick quartz glass, grade JGS2, frustum-shaped through-hole glass are as follows:

[0124] (1) Glass drying: Select a quartz glass with a thickness of 0.1 mm and a size of φ100 and use NaOH solution for ultrasonic cleaning for 15 min. The ratio of NaOH to water is 1:400. Then use DIW for ultrasonic cleaning for 15 min.

[0125] (2) Place the cleaned glass in an oven to dry at 50°C for 20 minutes;

[0126] (3) Place the glass on the laser equipment on the table;

[0127] (4) Vacuum fixation of the glass is performed with a vacuum strength of 90MPa;

[0128] (5) Import the cutting graphic file into the laser device. The specific shape is a φ0.01mm circle, and the laser focus height is set to be 0.62mm above the lower surface of the glass.

[0129] (6) The glass fixed area was induced by an ultrashort pulse laser with a pulse width of 0.4 ps, an energy of 120 μJ, and a laser power of 20 W.

[0130] (7) The modified glass was ultrasonically cleaned for 15 minutes using DIW.

[0131] (8) Place the cleaned glass into an oven to dry at 60°C for 20 minutes;

[0132] (9) Heat a 30wt% KOH solution to 110℃;

[0133] (10) The modified glass was placed in KOH solution and etched for 115 min. The glass on the lower surface was completely etched away, exposing the through-hole structure. The difference in hole size between the upper and lower surfaces of the frustum through-hole glass was 20 μm, the hole diameter on the lower surface was 0.01 mm, and the glass thinning amount was 35 μm.

[0134] (11) Allow the glass to cool naturally in the air for 5 minutes;

[0135] (12) Place the cooled glass in a DIW and clean it for 15 minutes;

[0136] (13) Place the cleaned glass into an oven to dry at 60°C for 20 minutes to obtain a frustum-shaped glass with a through hole.

[0137] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method of making a via in glass, the method comprising: The method comprises the following steps: (1) irradiating a first surface of a glass with a laser to induce a modification region in the glass; the pulse width of the laser is 290 fs-10 ps, the energy of the laser is 60-200 μJ, the distance between the focal point of the laser and the second surface of the glass is 0.6-1.2 mm, the height of the focal point of the laser is set to be higher than the lower surface of the glass, and the distance between the focal point of the laser and the second surface of the glass is controlled according to the following formula during the induction: h=d / 2+(1+(X-120) / 120×1%+(1.7-Y) / 1.7×5%)K / 2, wherein h is the distance between the focal point of the laser and the second surface of the glass, d is the thickness reduction of the glass, K is the focal depth of the laser, X is the energy of the laser, and Y is the pulse width of the laser; the first surface and the second surface are two opposite surfaces of the glass; (2) performing chemical etching on the glass after the induction to form a through hole penetrating through the first surface and the second surface, and the aperture of the through hole on the first surface is different from the aperture of the through hole on the second surface.

2. The method of making a via in glass according to claim 1, wherein: The average power of the laser is ≤30 W.

3. The method of making a via in glass according to claim 1, wherein: The thickness reduction of the glass is controlled to be 5-800 μm.

4. The method of making a via in glass according to claim 1 or 3, wherein: The etching time is controlled to be 30-600 min.

5. The method of making a via in glass according to claim 1 or 3, wherein: The etching temperature is controlled to be 20-150 °C.

6. The method of making a via in glass according to claim 1 or 3, wherein: The chemical etching is performed by using an acidic agent or an alkaline agent.

7. The method of making a via in glass of claim 1, wherein: The thickness of the glass is 0.03-5 mm, and / or the material of the glass is quartz glass, soda-lime glass, alumino-silicate glass or borosilicate glass.

8. The method of making a via in glass of claim 1, wherein: The aperture of the through hole on the second surface is 0.01-3 mm.

9. The method of making a via in glass of claim 1, wherein: The aperture difference of the through hole between the first surface and the second surface is ≥10 μm.

10. The method of making a via in glass of claim 1, wherein: The glass after the treatment in step (1) is washed and dried, and then etched in an acidic agent or an alkaline agent, until the specific area of the second surface of the glass is etched away and a through hole structure is formed, and then the glass is cooled, washed and dried to obtain a glass with a through hole.

11. A glass with a via hole produced by the method of any one of claims 1 to 10, characterized by: The through hole penetrates through two opposite surfaces in the thickness direction of the glass, and the aperture difference of the through hole between the two opposite surfaces is ≥10 μm.

12. The glass with a through hole according to claim 11, wherein: The aperture of the through hole on the surface with a smaller aperture is 0.01-3 mm; and / or the taper of the through hole is 0.01-45°.

13. The glass with a through hole according to claim 11, wherein: The material of the glass is quartz glass, soda-lime glass, alumino-silicate glass or borosilicate glass; and / or the thickness of the glass with a through hole is 0.02-4.5 mm.

14. A three-dimensional integrated package interposer, comprising: The three-dimensional integrated package adapter plate comprises the glass with a through hole prepared by the method in any one of claims 1-10, the through hole penetrates through two opposite surfaces in the thickness direction of the glass, and the aperture difference of the through hole between the two opposite surfaces is ≥10 μm.

15. The 3D integrated package interposer of claim 14, wherein: The aperture of the through hole on the surface with a smaller aperture is 0.01-3 mm; and / or the taper of the through hole is 0.01-45°.

16. The 3D integrated package interposer of claim 14, wherein: The material of the glass is quartz glass, soda-lime glass, alumino-silicate glass or borosilicate glass; and / or the thickness of the glass with the through hole is 0.02-4.5mm.