Cooling medium distribution device, heat dissipation cabinet and server system

Abstract

Embodiments of the present application provide a cooling medium distribution device, a heat dissipation cabinet and a server system. The cooling medium distribution device comprises: a first pipeline and at least one condenser; the first pipeline has a plurality of first inlets and a plurality of first outlets; the plurality of first inlets are arranged at intervals along a first direction, and the first inlets are used for flowing gaseous first cooling medium into the first pipeline; the first direction is an axial extension direction of the first pipeline; the plurality of first outlets are arranged at intervals along the first direction; in the first direction, there are at least one first inlet between two adjacent first outlets; the at least one condenser has a plurality of second inlets arranged at intervals along the first direction; the first outlet and the second inlet correspondingly communicate, and the gaseous first cooling medium flowing into the first pipeline flows into the at least one condenser through the plurality of first outlets and the plurality of second inlets. In this way, the condensation efficiency of the cooling medium distribution device can be improved.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and in particular to a cooling medium distribution device, a heat dissipation cabinet, and a server system. Background Technology

[0002] Internet service providers, enterprise platforms, and research institutions all require massive computing power, and the operating platforms that support these needs—storage, computing, and networking—are called data centers. Furthermore, with the increasing demand for information and communication technologies (ICTs) in modern society, data centers have developed rapidly. This has led to a shift in the density of ICT equipment within data centers from low to high. High-density ICT equipment generates significant heat during operation, necessitating cooling systems in data centers to ensure the proper functioning of the ICT equipment.

[0003] In related technologies, multiple electronic devices in a server work in conjunction with a cooling medium distribution device. This device can simultaneously deliver liquid cooling medium to multiple electronic devices and condense the gaseous cooling medium generated by the devices into liquid cooling medium, thus enabling two-phase heat dissipation. However, the cooling medium distribution device suffers from low condensation efficiency.

[0004] Therefore, improving the condensation efficiency of the cooling medium distribution device has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides a cooling medium distribution device, a heat dissipation cabinet, and a server system. The cooling medium distribution device allows the gaseous first cooling medium to flow into the condenser through multiple outlets, thereby improving the condensation efficiency of the condenser.

[0006] In a first aspect, embodiments of this application provide a cooling medium distribution device, comprising: a first pipe and at least one condenser. The first pipe has a plurality of first inlets and a plurality of first outlets. The plurality of first inlets are spaced apart along a first direction, and the first inlets are used to supply a gaseous first cooling medium flowing into the first pipe, the first direction being the axial extension direction of the first pipe. The plurality of first outlets are spaced apart along the first direction. In the first direction, at least one first inlet is located between two adjacent first outlets. The at least one condenser has a plurality of second inlets spaced apart along the first direction. The first outlets are correspondingly connected to the second inlets, and the second inlets are used to supply the gaseous first cooling medium flowing into the first pipe to the at least one condenser via the plurality of first outlets and the plurality of second inlets.

[0007] In this embodiment, the first inlet can be connected to the first opening of the electronic device, and the second opening of the electronic device can be connected to the second opening of the condenser, thereby achieving two-phase heat dissipation of the electronic device. The gaseous first cooling medium inside the electronic device sequentially passes through the first opening and the first inlet before entering the first pipe. Subsequently, the gaseous first cooling medium in the first pipe flows upward in a first direction and enters the condenser from the first outlet it passes through. Under the action of the condenser, it is condensed into a liquid first cooling medium, which then re-enters the electronic device through the second opening. Because the gaseous first cooling medium can enter the condenser from the first outlet during its upward flow in the first direction, the upward flow distance of the first cooling medium flowing into the first pipe from each first inlet can be shortened, thereby reducing the flow resistance of the first cooling medium and avoiding insufficient heat dissipation due to insufficient flow of the first cooling medium inside the electronic device. Furthermore, because the gaseous first cooling medium in the first pipe can enter the condenser from multiple first outlets, the rate at which the gaseous first cooling medium enters the condenser from the first pipe can be increased, thereby improving the condensation efficiency of the condenser.

[0008] In one possible implementation, in the first direction, the top end of the at least one condenser is located above the top end of the first pipe, and the bottom end of the at least one condenser is located above the bottom end of the first pipe. This arrangement allows the first cooling medium to exchange heat using the bottom of the condenser, helping to increase the effective heat exchange area of ​​the condenser.

[0009] In one possible implementation, in the first direction, one of the plurality of second inlets is located near the bottom end of the at least one condenser. This arrangement allows the first cooling medium to exchange heat using the bottom of the condenser, thus helping to increase the effective heat exchange area of ​​the condenser.

[0010] In one possible implementation, in the first direction, at least one of the lowermost of the plurality of first outlets is provided below the first outlet. This arrangement allows the first cooling medium to exchange heat using the bottom of the condenser, which helps to increase the effective heat exchange area of ​​the condenser.

[0011] In one possible implementation, the spacing between two adjacent first outlets decreases from top to bottom along the first direction. This arrangement helps to increase the gas flow rate of the first cooling medium at the bottom of the condenser, thereby improving the utilization rate of the bottom of the condenser.

[0012] In one possible implementation, the opening size of the first opening gradually increases from top to bottom along the first direction. This arrangement helps to increase the gas flow rate of the first cooling medium at the bottom of the condenser, thereby improving the utilization rate of the bottom of the condenser.

[0013] In one possible implementation, in the first direction, the first opening is positioned at the same height as the second inlet that it communicates with. Alternatively, in the first direction, the first opening is located below the second inlet that it communicates with. This arrangement of the first opening and the second inlet utilizes the characteristic that the gaseous first cooling medium automatically rises, ensuring that the first cooling medium enters the condenser.

[0014] In one possible implementation, the condenser has a first flow channel for supplying a gaseous first cooling medium that exchanges heat with air outside the condenser. Alternatively, the condenser has a first flow channel and a second flow channel that are isolated from each other, the first flow channel for supplying the gaseous first cooling medium and the second flow channel for supplying a second cooling medium that exchanges heat with the gaseous first cooling medium. This arrangement allows the gaseous first cooling medium to be condensed into a liquid first cooling medium.

[0015] In one possible implementation, when there is only one condenser, the condenser is provided with multiple second inlets. This arrangement can reduce the cost of the cooling medium distribution device.

[0016] In one possible implementation, when there are multiple condensers, the multiple condensers are arranged side by side along the first direction, and each condenser is provided with at least one second inlet. This arrangement helps to expand the application range of the cooling medium distribution device.

[0017] In one possible implementation, the condenser includes a housing and a heat exchange core. The housing has a condensation chamber, and a second outlet communicating with the condensation chamber is provided on the housing for a liquid first cooling medium to flow out of the first flow channel. A second inlet is provided on the housing and communicates with the condensation chamber. The heat exchange core is disposed within the condensation chamber, and its outer wall and the inner wall of the condensation chamber together define the first flow channel. The inner wall of the heat exchange core defines a second flow channel that is isolated from the first flow channel. The second inlet and the second outlet are respectively connected to the first flow channel. This configuration allows the gaseous first cooling medium to be condensed into a liquid first cooling medium.

[0018] In one possible implementation, the cooling medium distribution device further includes a supply device for conveying a second cooling medium that exchanges heat with the first cooling medium into the second flow channel. By exchanging heat between the first cooling medium and the first cooling medium, the condensation efficiency of the first cooling medium can be improved.

[0019] In one possible implementation, the cooling medium distribution device further includes a storage tank and a delivery pump. The condenser also has a second opening for the outflow of liquid first cooling medium, the second opening being connected to the input end of the storage tank. The output end of the storage tank is connected to the input end of the delivery pump, the output end of which is used for the outflow of liquid first cooling medium. This configuration allows the first cooling medium to be delivered to various electronic devices.

[0020] In one possible implementation, the cooling medium distribution device further includes a liquid extraction assembly and a control device. The liquid extraction assembly includes a liquid extraction pump, a reversing valve, a first liquid level sensor, and a second liquid level sensor. A drain port is provided at the bottom of the first pipe, and the drain port is connected to the first input end of the reversing valve. The second input end of the reversing valve is connected to a replenishment container, and the output end of the reversing valve is connected to the input end of the liquid extraction pump. The output end of the liquid extraction pump is connected to the interior of the storage tank. The first liquid level sensor is disposed within the first pipe and is used to monitor the liquid level of the first cooling medium in the first pipe. The second liquid level sensor is disposed within the storage tank and is used to monitor the liquid level of the first cooling medium in the storage tank. The control device is electrically connected to the first liquid level sensor, the second liquid level sensor, the reversing valve, and the liquid extraction pump, respectively. This configuration ensures that the total amount of the first cooling medium in the cooling medium distribution device is within a preset range and prevents the accumulation of liquid first cooling medium in the first pipe, which would lead to a decrease in the total amount of the first cooling medium.

[0021] In one possible implementation, the control device is also electrically connected to the delivery pump, which can improve the application range of the control device.

[0022] Secondly, embodiments of this application provide a heat dissipation cabinet, including a cabinet body and a cooling medium distribution device as described in any of the first aspects. The cooling medium distribution device is mounted on the cabinet body.

[0023] Thirdly, embodiments of this application provide a server system including electronic equipment and a cooling medium distribution device as described in any of the first aspects. Alternatively, it includes electronic equipment and a heat dissipation cabinet as described in the second aspect, the heat dissipation cabinet including the cooling medium distribution device. A plurality of first inlets of a first pipe of the cooling medium distribution device are connected to a plurality of first openings of the electronic equipment.

[0024] Fourthly, embodiments of this application provide a data center, including a computer room and at least one of the aforementioned server systems disposed within the computer room.

[0025] Fifthly, embodiments of this application provide a control method for a cooling medium distribution device, comprising:

[0026] Obtain a first liquid level and a second liquid level; wherein, the first liquid level is the liquid level of the first cooling medium in the first pipe, and the second liquid level is the liquid level of the first cooling medium in the storage tank;

[0027] The operating mode of the pumping assembly is determined based on the first liquid level and the second liquid level.

[0028] In one possible implementation, determining the operating mode of the pumping assembly based on the first liquid level height and the second liquid level height includes:

[0029] If the first liquid level is greater than the pumping threshold and the second liquid level is greater than the replenishment threshold, then the pumping mode is executed.

[0030] If the first liquid level is less than or equal to the pumping threshold and the second liquid level is less than or equal to the replenishment threshold, then the replenishment mode is executed.

[0031] If the first liquid level is greater than the pumping threshold and the second liquid level is less than the replenishment threshold, then either the pumping mode or the replenishment mode is executed.

[0032] The liquid extraction mode is to extract the liquid first cooling medium in the first pipe into the liquid storage tank.

[0033] The replenishment mode involves pumping the liquid first cooling medium from the replenishment container into the storage tank.

[0034] These and other aspects, embodiments, and advantages of the exemplary embodiments will become apparent from the accompanying drawings and the examples described below. However, it should be understood that the specification and drawings are illustrative and not intended to limit the scope of this application; details are provided in the appended claims. Other aspects and advantages of this application will be set forth in the following description, and in part will be apparent from the description or may be learned by practice of the application. Furthermore, various aspects and advantages of this application may be realized and obtained by means and combinations particularly pointed out in the appended claims. Attached Figure Description

[0035] Figure 1 This is a three-dimensional structural diagram of the data center provided in the embodiments of this application;

[0036] Figure 2 This is a schematic diagram of the internal structure of a data center provided in an embodiment of this application;

[0037] Figure 3 This is a three-dimensional structural diagram of a server system provided in an embodiment of this application;

[0038] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0039] Figure 5 This is a partial schematic diagram of the interaction between a cooling medium distribution device and electronic equipment in related technologies;

[0040] Figure 6 This is a schematic diagram of the structure of the first server system provided in the embodiments of this application;

[0041] Figure 7 This is a schematic diagram of the structure of the second server system provided in the embodiments of this application;

[0042] Figure 8 This is a schematic diagram of the structure of the third server system provided in the embodiments of this application;

[0043] Figure 9 This is a schematic diagram of the structure of a first pipeline provided in an embodiment of this application;

[0044] Figure 10 This is a cross-sectional view of a condenser provided in an embodiment of this application;

[0045] Figure 11 This is a schematic diagram of the structure of the fourth server system provided in the embodiments of this application;

[0046] Figure 12 This is a schematic diagram of a supply device and a condenser working together, as provided in an embodiment of this application.

[0047] Figure 13This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application;

[0048] Figure 14 This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application;

[0049] Figure 15 This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application;

[0050] Figure 16 This is a schematic diagram of the structure of the fifth server system provided in the embodiments of this application;

[0051] Figure 17 This is a flowchart of a control method for a cooling medium distribution device provided in an embodiment of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 100. Server system;

[0054] 110. Electronic devices;

[0055] 111. Shell;

[0056] 112. Components to be cooled;

[0057] 113. Sealed cavity; 114. First opening; 115. Second opening; 116. First cooling medium; 117. Nozzle;

[0058] 120. Cabinet body; 121. Cabinet door; 122. Cabinet frame;

[0059] 130. Cooling medium distribution device;

[0060] 131. Condenser; 1311. Condensation zone; 1312. Second inlet; 1313. Second outlet; 1314. First flow channel; 1315. Second flow channel; 1316. Outer shell; 1317. Heat exchanger core; 1318. Condensation chamber; 1319. Second cooling medium;

[0061] 132. First pipe; 1321. First inlet; 1322. First outlet; 1323. Drain outlet;

[0062] 133. Second pipeline;

[0063] 134. Liquid storage tank;

[0064] 135. Transfer pump;

[0065] 136. Supply device;

[0066] 137. Liquid pumping assembly; 1371. First liquid level sensor; 1372. Reversing valve; 1373. Liquid pump; 1374. Second liquid level sensor;

[0067] 138. Gas outlet pipe; 139. Liquid inlet pipe;

[0068] 140. Connecting pipes;

[0069] 150. Liquid replenishment container;

[0070] 200. Computer room;

[0071] 300. Equipment cabinet;

[0072] 1000, Data Center;

[0073] 110A, Upper part; 110B, Middle part; 110C, Lower part;

[0074] 132A, Second Upper Part; 132B, Second Middle Part; 132C, Second Lower Part;

[0075] 131A, Upper Third Section; 131B, Middle Third Section; 131C, Lower Third Section;

[0076] X, second direction; Y, third direction; Z, first direction. Detailed Implementation

[0077] A data center is a globally collaborative network of specific devices used to transmit, accelerate, display, compute, and store data information over the Internet infrastructure. This application provides a data center embodiment; see [link to related documentation]. Figure 1 As shown, a data center may include a server room of 200, see [link / reference]. Figure 2 As shown, the computer room 200 is equipped with at least one equipment cabinet 300. The number of equipment cabinets 300 may include, but is not limited to, the three shown in the figure, for example, 50 to 100 equipment cabinets 300. The computer room 200 is equipped with a cooling system. In this embodiment, the specific structure and working principle of the cooling system in the computer room 200 are not described in detail.

[0078] The equipment cabinet 300 can be a communication cabinet, a power supply cabinet, or a rack server, such as a rack server or a cabinet server, which includes at least one electronic device 110 (e.g., Figure 3(As shown), or, the equipment cabinet 300 can be a cooling cabinet for cooling servers. Each server can have one cooling cabinet, or multiple servers can share one cooling cabinet. It should be noted that the cooling cabinet can include a frame and a cooling device. The frame houses the cooling device, which is used to cool the servers. The frame can be the server cabinet 120; therefore, the cooling device can be integrated into the server.

[0079] In this embodiment, a heat dissipation device integrated into a server is used as an example for explanation. The device defined by the heat dissipation device and the server can be referred to as server system 100. The server system 100 provided in this embodiment can be set up in the computer room 200 of a data center. Of course, the server system 100 provided in this embodiment can also be set up separately.

[0080] Figure 3 This is a three-dimensional structural diagram of a server system 100 provided in an embodiment of this application. (Reference) Figure 3 The server system 100 provided in this application embodiment includes at least: a cooling medium distribution device 130, a cabinet 120, and at least one electronic device 110. The cooling medium distribution device 130 has at least one input terminal and at least one output terminal. (Reference) Figure 4 Each electronic device 110 has a first opening 114 and a second opening 115. The first opening 114 of each electronic device 110 is connected to an input terminal of the cooling medium distribution device 130, and the second opening 115 of each electronic device 110 is connected to an output terminal of the cooling medium distribution device 130. The cabinet 120 is used to house the electronic devices 110, and the cooling medium distribution device 130 can also be mounted on the cabinet 120.

[0081] refer to Figure 3 The cabinet 120 may include a cabinet body 122 and cabinet doors 121. The number of cabinet doors 121 can be one, or two. The two cabinet doors 121 can be arranged opposite each other; for example, one cabinet door 121 can be located at the front of the cabinet body 120 (e.g.,...). Figure 3 As shown), another cabinet door 121 can be located at the rear of the cabinet body 120. It should be noted that in some examples, the cabinet body 120 may not have a cabinet door 121. For example, the front and back of the cabinet body 120 may be open structures, or the front, back, left and right sides of the cabinet body 120 may all be open structures.

[0082] In this embodiment, the shape and structure of the cabinet 120 are not specifically limited. Furthermore, the shape of the cabinet 120 can be determined based on the shape of the electronic device 110. For example… Figure 3As shown, when the electronic device 110 has a plate-like structure, the cabinet 120 can have a cuboid shape (see reference). Figure 3 This reduces the size of a single server system 100, allowing multiple server systems 100 to be installed within the server room 200. Additionally, it is understood that the inner wall of the cabinet 120 defines a cavity for accommodating electronic devices 110, and the cabinet 120 is provided with a support structure (not shown in the figure) for carrying the electronic devices 110. For example, along the height direction of the cabinet 120 (e.g....). Figure 3 In the Z-direction, the side walls of the cabinet 120 are provided with multiple support plates at intervals, or the side walls of the cabinet 120 are provided with multiple support rings at intervals. It should be noted that the cooling medium distribution device 130 can be installed inside or outside the receiving cavity, and no specific limitation is made here.

[0083] Continue to refer to Figure 3 The cavity contains at least one electronic device 110, for example... Figure 3 The cabinet contains multiple electronic devices 110, which are placed horizontally at intervals within the cabinet 120 and stacked along the height of the cabinet 120. Furthermore, the electronic devices 110 can be computing devices, storage devices, switching devices, or communication devices that employ two-phase heat dissipation; no specific limitations are specified here.

[0084] Figure 4 This is a schematic diagram of the structure of an electronic device 110 provided in an embodiment of this application. (Reference) Figure 4 The electronic device 110 includes at least a housing 111 and a heat-dissipating device 112. The housing 111 has a sealed cavity 113 that accommodates a first cooling medium 116 and the heat-dissipating device 112. The side wall of the housing 111 has a first opening 114 and a second opening 115 communicating with the sealed cavity 113. The first opening 114 and the second opening 115 are respectively connected to the input and output terminals of a cooling medium distribution device 130. The heat-dissipating device 112 is located within the sealed cavity 113 and immersed in the liquid first cooling medium 116. Thus, when the electronic device 110 is working, the liquid first cooling medium 116 absorbs the heat generated by the heat-dissipating device 112 and changes from a gaseous state to a liquid state. The gaseous first cooling medium 116 can enter the cooling medium distribution device 130 through the first opening 114 and be condensed into a liquid first cooling medium 116 by the condenser 131. Subsequently, the cooling medium distribution device 130 delivers the liquid first cooling medium 116 into the sealed cavity 113 through the second opening 115. In this way, the phase change characteristics of the first cooling medium 116 can be used to perform two-phase heat dissipation on the heat-dissipating device 112, thereby performing two-phase heat dissipation on the electronic device 110 and ensuring that the temperature of the electronic device 110 is within a predetermined range.

[0085] It should be noted that an electronic device 110 may be connected to a cooling medium distribution device 130, or multiple electronic devices 110 may be connected to a cooling medium distribution device 130, without any specific limitation.

[0086] For the device to be cooled 112 to be immersed in the first cooling medium 116, it can be understood that: along the height direction of the electronic device 110 (e.g., Figure 4 In the Z direction, a portion of the device to be cooled 112 is immersed in the first cooling medium 116, while another portion of the device to be cooled 112 is located above the liquid surface of the first cooling medium 116, or all of the device to be cooled 112 is immersed in the first cooling medium 116.

[0087] It should be noted that "device to be cooled 112" is a general term for all heat-generating devices, which can be circuit boards, resistors, central processing units, graphics processing units, heat sinks, capacitors, power supplies, memory, etc. Furthermore, the number of each type of heat-generating device can be one or more, without specific limitations.

[0088] Continue to refer to Figure 4 The electronic device 110 may further include at least one nozzle 117 disposed within a sealed cavity 113. The nozzle 117 communicates with a second opening 115 and is positioned above the surface of the liquid first cooling medium 116. The nozzle 117 is used to spray the liquid first cooling medium 116 onto the device 112 to be cooled. Because the nozzle 117 is positioned above the surface of the liquid first cooling medium 116, the amount of first cooling medium 116 used can be reduced, thereby reducing the cooling cost of the electronic device 110. Furthermore, the nozzle 117 can enhance the single-point heat dissipation capacity of the device 112 to meet the high-heat-generating scenarios of the electronic device 110.

[0089] Figure 5 This is a partial schematic diagram of the interaction between a cooling medium distribution device and electronic equipment in related technologies.

[0090] In order to condense the gaseous first cooling medium 116 into a liquid first cooling medium 116, in related technologies, references Figure 5 The cooling medium distribution device 130 may include an exhaust pipe 138, a liquid inlet pipe 139, and a condenser 131. The exhaust pipe 138 has one output end and multiple input ends. The output end of the exhaust pipe 138 is connected to the input end of the condenser 131, and the multiple output ends of the exhaust pipe 138 are respectively connected to the first openings 114 of multiple electronic devices 110. The liquid inlet pipe 139 has multiple input ends and multiple output ends. The input end of the liquid inlet pipe 139 is connected to the output end of the condenser 131, and the multiple output ends of the liquid inlet pipe 139 are respectively connected to the second openings 115 of multiple electronic devices 110. Since the multiple electronic devices 110 are along a first direction (e.g., ... Figure 5 The first direction (Z-direction, the axial extension direction of the first pipe 132, such as the height direction) is used to arrange the electronic devices 130. The condenser 131 is positioned close to the uppermost electronic device 110 among the multiple electronic devices 110. The distance between each electronic device 110 and the condenser 131 in the first direction is different. The first direction can be the height direction of the electronic device 110 (e.g., the height direction). Figure 5 (in the Z direction) or the height direction of the condenser 131 (e.g.) Figure 5 (Z-direction). Therefore, it can be seen that the gaseous first cooling medium 116 flowing out of different electronic devices 110 travels different distances upwards in the first direction within the outlet pipe 138. The distance between the electronic device 110 and the condenser 131 in the first direction is positively correlated with the flow resistance of the first cooling medium 116 within the electronic device 110. Therefore, under the same flow rate, the greater the distance between the electronic device 110 and the condenser 131, the greater the flow resistance of the first cooling medium 116 within the electronic device 110. This leads to insufficient flow of the first cooling medium 116 within the electronic device 110, thus reducing the heat dissipation performance of the electronic device 110. Furthermore, since the gaseous first cooling medium 116 is hot air, it floats upwards in the first direction, causing it to accumulate in the upper part of the condenser 131 for heat exchange. The lower part of the condenser 131 cannot be used for heat exchange, reducing the effective heat exchange area of ​​the condenser 131 and consequently lowering the condensation efficiency of the first cooling medium 116.

[0091] In view of this, embodiments of this application provide a server system 100, which includes a cooling medium distribution device 130 and a plurality of electronic devices 110. (Reference) Figure 6The cooling medium distribution device 130 includes a first conduit 132 and a condenser 131. Along a first direction, the top end of the condenser 131 is located above the top end of the first conduit 132, and the bottom end of the condenser 131 is located above the bottom end of the first conduit 132. The first conduit 132 has a plurality of first inlets 1321 and a plurality of first outlets 1322. The plurality of first inlets 1321 are spaced apart along the first direction. Each first inlet 1321 communicates with a first opening 114 of an electronic device 110. Along the first direction, one or more first inlets 1321 (including first inlets 1321 at the same height as the first outlets 1322) are provided between two adjacent first outlets 1322. In one example, the first inlet 1321 and the first outlet 1322 are located on opposite sides of the first pipe 132. For instance, multiple first inlets 1321 are located on the left side of the first pipe 132 and spaced apart along a first direction, while multiple first outlets 1322 are located on the right side of the first pipe 132 and spaced apart along a first direction. The number of first inlets 1321 exceeds the number of first outlets 1322. The condenser 131 has multiple second inlets 1312 spaced apart along a first direction. Each second inlet 1312 corresponds to one first outlet 1322; in other words, each second inlet 1312 is connected to a first outlet 1322. The gaseous first cooling medium 116 within the electronic device 110 enters the first pipe 132 after passing through the first opening 114 and the first inlet 1321. Subsequently, the gaseous first cooling medium 116 flows upward along the first direction and enters the condenser 131 from the first outlet 1322 it passes through. Since the multiple first outlets 1322 correspond to different parts of the condenser 131 in the first direction, the gaseous first cooling medium 116 in the first pipe 132 can flow into the condenser 131 at different heights in the first direction from the multiple first outlets 1322. This allows the gaseous first cooling medium 116 to be located at the lower part of the condenser 131, increasing the effective heat exchange area of ​​the condenser 131 and improving its condensation effect. Furthermore, since the gaseous first cooling medium 116 in the first pipe 132 can enter the condenser 131 through the first first outlet 1322 during its upward flow in the first direction, the upward flow distance of the first cooling medium 116 flowing from each first inlet 1321 can be shortened. This reduces the flow resistance of the first cooling medium 116 and avoids insufficient heat dissipation due to insufficient flow of the first cooling medium 116 in the electronic device 110. In addition, the first cooling medium 116 in the first pipe 132 enters the condenser 131 through multiple first outlets 1322, which can increase the rate at which the first cooling medium 116 enters the condenser 131, thereby improving the condensing efficiency of the condenser 131.

[0092] The server system 100 provided in this application embodiment will be described in detail below through specific implementation methods.

[0093] Figure 6 This is a schematic diagram of the structure of the first server system provided in the embodiments of this application.

[0094] refer to Figure 6 This application provides a server system 100, which includes at least a cooling medium distribution device 130 and multiple electronic devices 110. The cooling medium distribution device 130 may include a first pipe 132, a second pipe 133, a storage tank 134, a delivery pump 135, and a condenser 131. The first openings 114 of the multiple electronic devices 110 are all connected to the input end of the condenser 131 through the first pipe 132, and the second openings 115 of the multiple electronic devices 110 are all connected to the output end of the delivery pump 135 through the second pipe 133. The output end of the condenser 131 is connected to the input end of the storage tank 134, and the output end of the storage tank 134 is connected to the input end of the delivery pump 135. When the electronic device 110 is working, the gaseous first cooling medium 116 generated enters the condenser 131 through the first pipe 132. The condenser 131 can condense the gaseous first cooling medium 116 into a liquid first cooling medium 116. Then, the liquid first cooling medium 116 in the condenser 131 enters the storage tank 134. The delivery pump 135 can deliver the liquid first cooling medium 116 in the storage tank 134 to each electronic device 110, so that each electronic device 110 can achieve two-phase heat dissipation and realize the circulation of the first cooling medium 116.

[0095] Continue to refer to Figure 6 The first pipe 132 and the condenser 131 are in the second direction (e.g.) Figure 6 The first inlet 132 is spaced apart along the X-direction, with the first direction perpendicular to the second direction. In the first direction, the top end of the first pipe 132 is below the top end of the condenser 131, and the bottom end of the first pipe 132 is below the bottom end of the condenser 131. Thus, in the second direction, a portion of the first pipe 132 is positioned opposite a portion of the condenser 131. This arrangement ensures that a portion of the first inlet 1321 is always located below the bottom end of the condenser 131, allowing the gaseous first cooling medium 116 to enter from the bottom of the condenser 131, thus utilizing the lower part of the condenser 131 for heat exchange.

[0096] Continue to refer to Figure 6The first pipe 132 has multiple first inlets 1321 and multiple first outlets 1322. The multiple first inlets 1321 are spaced apart along a first direction, and the multiple first outlets 1322 are also spaced apart along the first direction. Furthermore, the number of first inlets 1321 exceeds the number of first outlets 1322. Along the first direction, multiple first inlets 1321 are located below each first outlet 1322. Each first inlet 1321 communicates with a first opening 114 of an electronic device 110. The condenser 131 has multiple condensation regions 1311 arranged side-by-side and interconnected along the first direction, and multiple second inlets 1312. Each condensation region 1311 corresponds to and communicates with a second inlet 1312. Each second inlet 1312 is located at the bottom of the condensation region 1311 corresponding to it. The multiple second inlets 1312 correspond one-to-one with and communicate with the multiple first inlets 1321.

[0097] It should be noted that, along the first direction, the first outlet 1322 and the second inlet 1312 can be set at the same height, or, along the first direction, the first outlet 1322 is located below the second inlet 1312. This arrangement can fully utilize the characteristic that the gaseous first cooling medium 116 is hot air, ensuring that the first cooling medium 116 can enter the condenser 131.

[0098] It should also be noted that the first inlet 1321 and the first outlet 1322 are located on opposite sides of the first pipe 132, for example, referring to... Figure 6 Multiple first inlets 121 are located on the left side of the first conduit 132, and multiple first outlets 1322 are located on the right side of the first conduit 132. Of course, the first inlets 1321 and the first outlets 1322 can also be located on the same side of the first conduit 132. For example, in some examples, the first inlets 1321 and the first outlets 1322 are both located on the left side of the first conduit 132.

[0099] Continue to refer to Figure 6 To connect the first outlet 1322 and the second inlet 1312, the cooling medium distribution device 130 may further include a plurality of connecting pipes 140. Each connecting pipe 140 has its two ends connected to the corresponding first outlet 1322 and second inlet 1312, respectively. Furthermore, the connecting pipes 140 may have a straight axis or their axis may intersect with a first direction and be inclined upwards, thereby increasing the rate at which the first cooling medium 116 enters the condenser 131.

[0100] Continue to refer to Figure 6In the first direction, all electronic devices 110 are divided from top to bottom into a first upper part 110A, a first middle part 110B, and a first lower part 110C. In the first direction, the interior of the first pipe 132 is divided from top to bottom into a second upper part 132A, a second middle part 132B, and a second lower part 132C. In the first direction, the interior of the condenser 131 is divided from top to bottom into a third upper part 131A, a third middle part 131B, and a third lower part 131C. A second inlet 1312 is provided at the bottom of each of the third upper part 131A, third middle part 131B, and third lower part 131C. The gaseous first cooling medium 116 in the first upper part 110A enters the second upper part 132A through the first opening 114, flows upward in the first direction, and enters the third upper part 131A through the first outlet 1322 of the second upper part 132A. Similarly, the gaseous first cooling medium 116 in the first middle section 110B enters the third middle section 131B after passing through the second middle section 132B, and the gaseous first cooling medium 116 in the first lower section 110C enters the third lower section 131C after passing through the second lower section 132C. Therefore, the gaseous first cooling medium 116 in each electronic device 110 can enter the condenser 131. In addition, since the gaseous first cooling medium 116 in the first upper section 110A, the first middle section 110B, and the first lower section 110C enters the condenser 131 at different heights in the first direction through the first outlets 1322 spaced apart along the first direction, the upward flow distance of the gaseous first cooling medium 116 in the first pipe 132 can be reduced, thereby reducing the flow resistance of the gaseous first cooling medium 116 and ensuring the heat dissipation performance of each electronic device 110.

[0101] Continue to refer to Figure 6 The top and bottom of the condenser 131 are located above the top and bottom of the first pipe 132, respectively. The second inlet 1312 is located at the bottom of the condensation area 1311. Multiple condensation areas 1311 are arranged side by side along the first direction. This arrangement can make full use of the characteristic that the gaseous first cooling medium 116 rises as hot air. A portion of the gaseous first cooling medium 116 is always located at the bottom of the condenser 131. Thus, the gaseous first cooling medium 116 can be located in the lower part of the condenser 131, and the lower part of the condenser 131 can participate in the heat exchange process of the first cooling medium 116. This can increase the effective heat exchange area of ​​the condenser 131 and help improve the condensation efficiency of the first cooling medium 116.

[0102] The above describes three examples of first exit 1322. Of course, the number of first exits 1322 can also be 2, 4, 5, etc., and no specific restriction is made here. For example, Figure 7 This is a schematic diagram of the structure of the second server system provided in the embodiments of this application. Figure 7 and Figure 6 The difference is that, Figure 7 The first pipe 132 has two first outlets 1322, one connected to the second inlet 1312 at the bottom of the condenser 131, and the other connected to the second inlet 1312 in the middle of the condenser 131. Alternatively, Figure 8 This is a schematic diagram of the structure of the third server system provided in the embodiments of this application. Figure 8 and Figure 6 The difference is that, Figure 8 The first pipe 132 is provided with four first outlets 1322, and the four first outlets 1322 are respectively connected to the four second inlets 1312 on the condenser 131.

[0103] Figure 9 This is a schematic diagram of the structure of a first pipeline provided in an embodiment of this application.

[0104] To increase the flow rate of the gaseous first cooling medium 116 flowing into the bottom of the condenser 131, further reference can be made. Figure 8 Along the first direction from top to bottom, multiple first inlets 1321 are evenly arranged, and the spacing between two adjacent first outlets 1322 gradually decreases, thereby increasing the density of the first outlets 1322 located at the bottom. Alternatively, refer to... Figure 9 The spacing between two adjacent first outlets 1322 is equal in the first direction. In the first direction, the opening of the upper first outlet 1322 is smaller than the opening of the lower first outlet 1322. That is, the opening size of the first outlet 1322 gradually increases from top to bottom along the first direction. This allows more gaseous first cooling medium 116 to enter the bottom of the condenser 131, which helps to increase the effective heat exchange area of ​​the condenser 131.

[0105] It should be noted that the distance between two adjacent first outlets 1322 gradually decreases, and that the opening of the upper first outlet 1322 can be smaller than the opening of the lower first outlet 1322 at the same time.

[0106] In order to condense the gaseous first cooling medium 116 into a liquid first cooling medium 116, in some possible embodiments, the condenser 131 can exchange heat between the gaseous first cooling medium 116 and the air. In this case, the condenser 131 has a first flow channel 1314 for the first cooling medium 116 to flow through, and a plurality of second inlets 1312 are connected to the first flow channel 1314 and together serve as the input end of the first flow channel 1314.

[0107] Figure 10 This is a cross-sectional view of a condenser provided in an embodiment of this application. (Reference) Figure 10In some possible embodiments, the condenser 131 further includes a first flow channel 1314 and a second flow channel 1315. A plurality of second inlets 1312 communicate with the first flow channel 1314 and collectively serve as the input end of the first flow channel 1314. The output end of the first flow channel 1314 can communicate with the input end of the liquid storage tank 134. The second flow channel 1315 is used to communicate with a supply device 136 for supplying the second cooling medium 1319. The outer walls of the first flow channel 1314 and the second flow channel 1315 are in contact, but the first flow channel 1314 and the second flow channel 1315 are not connected. This allows the first cooling medium 116 to exchange heat with the second cooling medium 1319, causing the gaseous first cooling medium 116 to condense into a liquid first cooling medium 116, while also preventing the first cooling medium 116 from contacting the second cooling medium 1319.

[0108] The shape of either the first flow channel 1314 or the second flow channel 1315 can be wavy, spiral, or continuous S-shaped, etc., without specific restrictions.

[0109] In the embodiments of this application, the first cooling medium 116 can be a low-boiling-point, non-conductive liquid, for example, the first cooling medium 116 is a fluorinated liquid. In addition, the atmospheric pressure boiling point of the first cooling medium 116 can be 30° to 60°. Of course, the specific type of the first cooling medium 116 is not specifically limited here.

[0110] In this embodiment, the second cooling medium 1319 can be a refrigerant, water, or other cooling medium. Alternatively, the second cooling medium 1319 can also be a low-boiling-point, non-conductive liquid, such as a fluorinated liquid or cooling water. The specific type of the second cooling medium 1319 is not limited here.

[0111] It should be noted that the specific type of the first cooling medium 116 and the specific type of the second cooling medium 1319 may be the same or different, and no specific restrictions are imposed here.

[0112] Continue to refer to Figure 10To define the mutually spaced first flow channel 1314 and second flow channel 1315, in some possible implementations, the condenser 131 may include a housing 1316 and a heat exchange core 1317. The housing 1316 has a condensation chamber 1318, and its outer wall has a second outlet 1313 and a plurality of second inlets 1312. The plurality of second inlets 1312 communicate with the condensation chamber 1318 and serve as the input end of the first flow channel 1314. The second outlet 1313 communicates with the condensation chamber 1318 and serves as the output end of the first flow channel 1314 for communication with the input end of the liquid storage tank 134. The heat exchange core 1317 is located within the condensation chamber 1318, and its inner wall defines a second flow channel 1315 that is not in communication with the condensation chamber 1318. The outer wall of the heat exchange core 1317 and the inner wall of the condensation chamber 1318 together define the first flow channel 1314 that contains the first cooling medium 116. With this configuration, the first cooling medium 116 can exchange heat with the second cooling medium 1319 without contacting each other.

[0113] The outer shell 1316 can be cylindrical, cuboid, or other shapes, and is not specifically limited thereto. For example, in this embodiment, the outer shell 1316 is cuboid in shape.

[0114] Since there are multiple second inlets 1312, all the second inlets 1312 can be arranged on the side wall of the outer shell 1316 and spaced apart along the first direction. Alternatively, some of the second inlets 1312 can be arranged on the side wall of the outer shell 1316, and a second inlet 1312 can also be provided on the top wall of the outer shell 1316. Alternatively, some of the second inlets 1312 can be arranged on the side wall of the outer shell 1316, and a second inlet 1312 can also be provided on the top wall and bottom wall of the outer shell 1316 respectively.

[0115] In order to ensure that the liquid first cooling medium 116 formed in the condensation chamber 1318 can enter the storage tank 134, the second outlet 1313 can be provided on the bottom wall of the outer casing 1316. In addition, the second outlet 1313 can be provided in the area of ​​the bottom wall of the outer casing 1316 at the lowest height in the direction of gravity.

[0116] Since the function of the heat exchange core 1317 is to separate the second cooling medium 1319 from the gaseous first cooling medium 116 while allowing heat exchange, the structure of the heat exchange core 1317 is not specifically limited here. For example, in some examples, the heat exchange core 1317 is a heat exchange tube with a spiral or corrugated shape. In some examples, the heat exchange core 1317 can also be a heat exchanger, such as a tube-fin heat exchanger or a plate-fin heat exchanger. When the heat exchange core 1317 is a tube-fin heat exchanger or a plate-fin heat exchanger, it helps to increase the contact area between the second cooling medium 1319 and the gaseous first cooling medium 116, thereby improving the heat exchange efficiency between the gaseous first cooling medium 116 and the second cooling medium 1319.

[0117] Continue to refer to Figure 6 All electronic devices 110 are connected to the same condenser 131 via a first conduit 132. This arrangement helps reduce the cost of the cooling medium distribution device 130. However, multiple condensers 131 can also be used to connect all electronic devices 110. For example, Figure 11 This is a schematic diagram of the structure of a second server system provided in an embodiment of this application. For example, refer to... Figure 11 , Figure 10 and Figure 6 The difference is Figure 11 The number of condensers 131 is three, and the three condensers 131 are arranged side by side along the first direction. Additionally, Figure 11 Each condenser 131 may have multiple second inlets 1312 spaced apart along a first direction. It is understood that the specific number of condensers 131 may include, but is not limited to, three; for example, the number of condensers 131 may also be two, four, five, etc. Therefore, when there are multiple condensers 131, the multiple condensers 131 are arranged side-by-side along the first direction, with the top of the uppermost condenser 131 located above the top of the first pipe 132, and the bottom of the lowermost condenser 131 located above the bottom of the first pipe 132.

[0118] It is understood that since the condenser 131 has a first flow channel 1314 for the first cooling medium 116 to flow, the output ends of multiple first flow channels 1314 can be connected to the input end of the liquid storage tank 134 respectively, or multiple first flow channels 1314 can be connected to the input end of the liquid storage tank 134 in series, without specific restrictions.

[0119] It should be noted that when there are multiple condensers 131, the specific structure of each condenser 131 can be described in the above content. Figure 7 The condenser 131 shown.

[0120] Figure 12 This is a schematic diagram of a supply device and a condenser working together, according to an embodiment of this application. Figure 13 This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application. Figure 14 This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application. Figure 15 This is another structural schematic diagram of the supply device and condenser provided in the embodiments of this application.

[0121] In order to supply the second cooling medium 1319 to the condenser 131, refer to Figure 12 The cooling medium distribution device 130 further includes a supply device 136. The output end of the supply device 136 is connected to the input end of the second flow channel 1315, and the input end of the supply device 136 is connected to the output end of the second flow channel 1315. The function of the supply device 136 is to lower the temperature of the second cooling medium 1319, which absorbs heat from the first cooling medium 116, to form a low-temperature second cooling medium 1319, and to supply the low-temperature second cooling medium 1319 into the second flow channel 1315, thereby circulating the second cooling medium 1319.

[0122] When there are multiple condensers 131, and each condenser 131 has a first flow channel 1314 and a second flow channel 1315, refer to Figure 13 Multiple condensers 131 can correspond one-to-one with multiple supply devices 136, or, refer to Figure 14 or Figure 15 Multiple condensers 131 can share the same supply unit 136.

[0123] When multiple condensers 131 can share the same supply device 136, all the second flow channels 1315 can be connected to the supply device 136 in parallel (e.g., Figure 14 Alternatively, all the second flow channels 1315 can be connected in series with the supply device 136 (e.g., Figure 15 ).

[0124] Since the gaseous first cooling medium 116 discharged from the first opening 114 of the electronic device 110 carries some liquid first cooling medium 116, what is discharged from the first opening 114 is a gas-liquid mixture of gaseous and liquid first cooling medium 116. However, when the gas-liquid mixture passes through the first pipe 132, not all of the liquid first cooling medium 116 in the gas-liquid mixture enters the condenser 131, but accumulates at the bottom of the first pipe 132. This results in the first cooling medium 116 circulating more times and its total amount decreasing.

[0125] Figure 16This is a schematic diagram of the structure of the third server system provided in the embodiments of this application.

[0126] To prevent the first cooling medium 116 from accumulating at the bottom of the first pipe 132, refer to Figure 16 The cooling medium distribution device 130 may further include a liquid extraction assembly 137 and a control device (not shown in the figure). The liquid extraction assembly 137 may include a first liquid level sensor 1371, a second liquid level sensor 1374, a liquid extraction pump 1373, and a reversing valve 1372. The first liquid level sensor 1371, the second liquid level sensor 1374, the liquid extraction pump 1373, and the reversing valve 1372 are all electrically connected to the control device. The first liquid level sensor 1371 is disposed in the first pipe 132 and is used to monitor the liquid level of the first cooling medium 116 in the first pipe 132. The second liquid level sensor 1374 is disposed in the storage tank 134 and is used to monitor the liquid level of the first cooling medium 116 in the storage tank 134. A drain port is provided at the bottom of the first pipe 132. The first input terminal of the reversing valve 1372 is connected to the drain port, the second input terminal of the reversing valve 1372 is connected to the replenishment container 150, and the output terminal of the reversing valve 1372 is connected to the input terminal of the pump 1373. The output terminal of the pump 1373 is connected to the interior of the storage tank 134.

[0127] It is understandable that the function of the reversing valve 1372 is to connect the output end of the reversing valve 1372 with one of the first input end and the second input end of the reversing valve 1372, so that the reversing valve 1372 is used to connect the drain port with the input end of the pump 1373, or the reversing valve 1372 is used to connect the replenishment container 150 with the input end of the pump 1373.

[0128] When the first liquid level sensor 1371 detects that the liquid level of the first cooling medium 116 exceeds the pumping threshold, it controls the reversing valve 1372 to connect the drain port with the output of the reversing valve 1372, while the second input of the reversing valve 1372 is not connected to its output. Subsequently, the pumping pump 1373 pumps the liquid first cooling medium 116 from the first pipe 132 into the storage tank 134. The pumping pump 1373 can stop after a preset time, or it can stop when the liquid level of the first cooling medium 116 in the first pipe 132 falls below the first stop threshold.

[0129] It should be noted that the liquid extraction threshold can be determined according to the actual situation and is not specifically limited here. For example, the liquid extraction threshold can be 100 mm. Similarly, the first stop threshold and the preset time are not specifically limited. For example, the preset time can be 30 seconds. In addition, the device for controlling the operation or stop of the liquid extraction pump 1373 can be a control device.

[0130] To ensure proper heat dissipation of the electronic device 110, the liquid level of the first cooling medium 116 in the storage tank 134 must also be within a reasonable range. Therefore, a second liquid level sensor 1374 is installed in the storage tank 134. The working principle of replenishing the storage tank 134 via the second liquid level sensor 1374 is as follows: When the second liquid level sensor 1374 detects that the liquid level of the first cooling medium 116 is lower than the replenishment threshold, it controls the reversing valve 1372 to operate, causing the first input terminal of the reversing valve 1372 to be disconnected from its output terminal, and the second input terminal to be connected to its output terminal. Subsequently, the pump 1373 can draw liquid first cooling medium 116 from the replenishment container 150 and replenish it into the storage tank 134 until the liquid level of the first cooling medium 116 in the storage tank 134 is higher than the second stop threshold, at which point the replenishment stops. The replenishment threshold and the second stop threshold can be determined according to the usage requirements of the electronic device 110, and no specific restrictions are imposed here.

[0131] It should be noted that when the liquid level of the first cooling medium 116 in the first pipe 132 is greater than the liquid extraction threshold and the liquid level of the first cooling medium 116 in the storage tank 134 is lower than the liquid replenishment threshold, the liquid extraction pump 1373 can extract liquid first cooling medium 116 from either the first pipe 132 or the liquid replenishment container 150, without any restriction.

[0132] The control device can control the reversing valve 1372 and the pump 1373 based on the liquid level information obtained from the first liquid level sensor 1371 and the second liquid level sensor 1374 to perform a pumping operation (extracting the first cooling medium 116 from the first pipe 132) or a replenishment operation (extracting the first cooling medium 116 from the replenishment container 150). Alternatively, the control device can be electrically connected to the delivery pump 135 to allow the first cooling medium 116 to enter the various electronic devices 110.

[0133] The first liquid level sensor 1371 can detect the liquid level of the first cooling medium 116 in the first pipe 132 in real time and send it to the control device. In addition, the first liquid level sensor 1371 can be a float-type liquid level transmitter, a magnetic liquid level transmitter, an ultrasonic liquid level transmitter, etc., and no specific limitation is made here.

[0134] The second liquid level sensor 1374 can detect the liquid level of the first cooling medium 116 in the storage tank 134 in real time and send it to the control device. In addition, the second liquid level sensor 1374 can be a float-type liquid level transmitter, a magnetic liquid level transmitter, an ultrasonic liquid level transmitter, etc., and no specific limitation is made here.

[0135] In this embodiment of the application, the utilization rate of the pump 1373 can be improved by setting the reversing valve 1372. The pump 1373 can pump out the liquid first cooling medium 116 in the first pipeline 132, and can also extract the liquid first cooling medium 116 from the replenishment container 150. This helps to reduce the cost of the cooling medium distribution device 130, so that there is no need to set up a separate replenishment pump for extracting the first cooling medium 116 from the replenishment container 150.

[0136] It should be noted that, in addition to being automatically controlled by the control device, the reversing valve 1372 and the liquid pump 1373 can also be manually controlled. In this case, the control device will send the liquid level information in the first pipeline 132 and the liquid storage tank 134 to the operator, so that the liquid pumping operation or liquid replenishment operation can be performed.

[0137] Figure 17 This is a flowchart of a control method for a cooling medium distribution device provided in an embodiment of this application, with reference to... Figure 17 The control method includes the following steps:

[0138] S101, Obtain the first liquid level height and the second liquid level height.

[0139] Specifically, the first liquid level height is obtained based on the first liquid level sensor 1371, which sends the collected first liquid level height to the control device. The second liquid level height is obtained based on the second liquid level sensor 1374, which sends the collected second liquid level height to the control device.

[0140] S102. Determine the working mode of the pumping component 137 based on the first liquid level height and the second liquid level height.

[0141] When the first liquid level is greater than the pumping threshold and the second liquid level is greater than the replenishment threshold, the pumping mode is executed. Specifically, the reversing valve 1372 connects the drain port of the first pipe 132 to the input end of the pumping pump 1373. Then, the pumping pump 1373 pumps the liquid first cooling medium 116 from the first pipe 132 until the first liquid level is lower than the first stop threshold or the working time of the pumping pump 1373 is greater than a preset time, at which point it stops working.

[0142] When the first liquid level is less than or equal to the pumping threshold and the second liquid level is less than or equal to the replenishment threshold, the replenishment mode is executed. Specifically, the reversing valve 1372 connects the replenishment container 150 to the input of the pumping pump 1373, and then the pumping pump 1373 draws the liquid first cooling medium 116 from the replenishment container 150 until the second liquid level is greater than the second stop threshold and then stops working.

[0143] When the first liquid level is greater than the pumping threshold and the second liquid level is less than the replenishment threshold, either the pumping mode or the replenishment mode is executed. Specifically, if the liquid first cooling medium 116 in the first pipe 132 has reached the pumping standard and the liquid first cooling medium 116 in the storage tank 134 has also reached the replenishment requirement, then the pumping mode can be executed instead of the replenishment mode. After the pumping mode is completed, if the first liquid level is less than the pumping threshold and the second liquid level is less than or equal to the replenishment threshold, or even greater than the replenishment threshold, the decision to execute the replenishment mode is made based on the specific relationship between the second liquid level and the replenishment threshold.

[0144] Of course, you can also choose to execute the replenishment mode instead of the extraction mode. When the replenishment mode is completed, the first liquid level height is greater than the extraction threshold, and the second liquid level height is greater than the replenishment threshold.

[0145] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0146] The devices or elements referred to in this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0147] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0148] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling medium distribution device, characterized in that, include: A first conduit and at least one condenser; The first pipeline has multiple first inlets and multiple first outlets; The plurality of first inlets are spaced apart along a first direction, and the first inlets are used to supply gaseous first cooling medium to flow into the first pipe, wherein the first direction is the axial extension direction of the first pipe. The plurality of first outlets are spaced apart along the first direction; in the first direction, there is at least one first inlet between two adjacent first outlets; The at least one condenser has a plurality of second inlets spaced apart along the first direction; the first outlet is correspondingly connected to the second inlets, so that the gaseous first cooling medium flowing into the first pipe flows into the at least one condenser through the plurality of first outlets and the plurality of second inlets; In the first direction, the top end of the at least one condenser is located above the top end of the first pipe, and the bottom end of the at least one condenser is located above the bottom end of the first pipe; The at least one condenser has a plurality of condensation zones arranged side by side and communicating with each other along the first direction. Each condensation zone corresponds to a second inlet and is connected to the second inlet. Each second inlet is located at the bottom of the condensation zone corresponding to the second inlet.

2. The cooling medium distribution device according to claim 1, characterized in that, In the first direction, at least one of the first inlets is provided below the lowest of the plurality of first outlets.

3. The cooling medium distribution device according to claim 1, characterized in that, Along the first direction from top to bottom, the distance between two adjacent first outlets decreases.

4. The cooling medium distribution device according to claim 1, characterized in that, Along the first direction from top to bottom, the opening size of the first outlet increases.

5. The cooling medium distribution device according to any one of claims 1-4, characterized in that, When the number of condensers is one, the condenser is provided with multiple second inlets; or, When there are multiple condensers, the multiple condensers are arranged side by side along the first direction, and each condenser is provided with at least one second inlet.

6. The cooling medium distribution device according to any one of claims 1-4, characterized in that, The cooling medium distribution device also includes: a liquid storage tank, a liquid pumping assembly, and a control device; The liquid extraction assembly includes a liquid extraction pump, a reversing valve, a first liquid level sensor, and a second liquid level sensor. The bottom of the first pipe is provided with a drain port, which is connected to the first input end of the reversing valve; The second input terminal of the reversing valve is used to communicate with the replenishment container, the output terminal of the reversing valve is used to communicate with the input terminal of the pump, and the output terminal of the pump is used to communicate with the interior of the storage tank. The first liquid level sensor is installed inside the first pipe and is used to monitor the liquid level of the first cooling medium inside the first pipe; The second liquid level sensor is installed inside the storage tank and is used to monitor the liquid level of the first cooling medium inside the storage tank; The control device is electrically connected to the first liquid level sensor, the second liquid level sensor, the reversing valve, and the pump, respectively.

7. A heat dissipation cabinet, characterized in that, It includes a cabinet and a cooling medium distribution device as described in any one of claims 1-6; the cooling medium distribution device is mounted on the cabinet.

8. A server system, characterized in that, Includes electronic equipment and a cooling medium distribution device as described in any one of claims 1-6; or includes electronic equipment and a heat dissipation cabinet as described in claim 7; The first inlets of the first pipe of the cooling medium distribution device are connected to the first openings of the multiple electronic devices.

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