Display panel, display device

Abstract

Provided is a display panel, comprising a substrate (200), a display area (AA) and a peripheral area surrounding the display area (AA); a first conductive layer located on one side of the substrate (200) and comprising a plurality of data lines (DL) located in the display area (AA); and a second conductive layer located on the side of the first conductive layer away from the substrate (200) and comprising at least one first heating line group, the first heating line group comprising at least one first heating line (HL1), the first heating line (HL1) extending from the display area (AA) to the peripheral area, and the first heating line (HL1) being in the same extension direction as the data lines (DL). The display panel has a higher display effect under low-temperature conditions and is suitable for narrow-frame display products.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] LCD monitors are often used in extreme environments, such as low temperatures, which requires them to function normally under these conditions. However, due to the inherent properties of liquid crystals, their viscosity coefficient is higher at low temperatures, resulting in a significantly longer response time compared to normal temperatures. This causes a visual ghosting effect, especially when the temperature drops to near the crystallization temperature of the liquid crystal, which greatly affects the display quality of the LCD monitor. Summary of the Invention

[0003] The embodiments of this application adopt the following technical solutions:

[0004] In a first aspect, embodiments of this application provide a display panel, comprising:

[0005] The substrate includes a display area and a peripheral area surrounding the display area;

[0006] The first conductive layer is located on one side of the substrate and includes multiple data lines located in the display area;

[0007] The second conductive layer is located on the side of the first conductive layer away from the substrate, and includes at least one first heating line group. The first heating line group includes at least one first heating line, which extends from the display area to the peripheral area and extends in the same direction as the data line.

[0008] In some embodiments of this application, the orthographic projection of the first heating line on the substrate at least partially overlaps with the orthographic projection of the data line on the substrate.

[0009] In some embodiments of this application, the display panel includes a black matrix layer located on the side of the second conductive layer away from the substrate.

[0010] The orthographic projection of the portion of the first heating line located in the display area on the substrate is within the orthographic projection of the black matrix layer on the substrate, and the orthographic projection of the data line on the substrate is within the orthographic projection of the black matrix layer on the substrate.

[0011] In some embodiments of this application, the orthographic projection of the portion of the first heating line located in the display area on the substrate is within the orthographic projection of the data line on the substrate.

[0012] In some embodiments of this application, the peripheral area further includes a first peripheral sub-area and a second peripheral sub-area, the first peripheral sub-area and the second peripheral sub-area being located on opposite sides of the display area;

[0013] The second conductive layer further includes at least one second heating wire group located in the first peripheral sub-region, the second heating wire group including at least one second heating wire;

[0014] Each of the first heating wires in the same first heating wire group intersects with and is connected to each of the second heating wires in a second heating wire group.

[0015] In some embodiments of this application, the second conductive layer further includes at least two third heating wire groups located in the second peripheral sub-region, wherein the third heating wire group includes at least one third heating wire;

[0016] The number of the third heating wire group is twice the number of the second heating wire group;

[0017] A portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in one third heating wire group, and another portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in another third heating wire group.

[0018] In some embodiments of this application, the display panel further includes at least two heat-bonding terminals located in the second peripheral sub-area, one of the third heating wire groups being electrically connected to one of the heat-bonding terminals, and the other third heating wire group being electrically connected to the other heat-bonding terminal;

[0019] The first heating wire group, the second heating wire group, the two third heating wire groups, and the two heating bonding terminals are configured to form a first closed loop.

[0020] In some embodiments of this application, the display panel further includes at least one antistatic unit located in the peripheral area, and a first closed loop is electrically connected to at least one of the antistatic units.

[0021] In some embodiments of this application, the display panel further includes multiple first fan-out traces and multiple second fan-out traces located in the second peripheral sub-area. The first fan-out traces are electrically connected to the data line, and the second fan-out traces are electrically connected to the third heating wire group and the heating bonding terminal, respectively.

[0022] The orthographic projection of the first fan-out trace on the substrate and the orthographic projection of the second fan-out trace on the substrate at least partially overlap.

[0023] In some embodiments of this application, the display panel is electrically connected to a flexible circuit board and at least one driver chip, respectively;

[0024] The display panel further includes a plurality of display bonding terminals located in the second peripheral sub-region. Along a plane parallel to the substrate, the minimum distance from each display bonding terminal to the display area is greater than the minimum distance from the driver chip to the display area. The data line is electrically connected to the driver chip through the first fan-out trace, and the driver chip is electrically connected to the flexible circuit board through the display bonding terminals.

[0025] The heating bonding terminals are arranged in the same row, and the display bonding terminals are arranged in the same row. The minimum distance between the heating bonding terminals and the edge of the display panel is equal to the minimum distance between the display bonding terminals and the edge of the display panel.

[0026] In some embodiments of this application, the structure of each of the display bonding terminals and each of the heating bonding terminals is the same, and they are all electrically connected to the same flexible circuit board.

[0027] In some embodiments of this application, each of the heat-bonding terminals includes a first portion and a second portion, and all of the display bonding terminals are located in the area between the first portion and the second portion.

[0028] In some embodiments of this application, each of the display bonding terminals includes a first portion and a second portion.

[0029] All of the heat-bonded terminals are located in the area between the first part and the second part;

[0030] or,

[0031] A portion of the heat-bonding terminals are located in the area between the first portion and the second portion, another portion of the heat-bonding terminals are located in the area of ​​the first portion away from the second portion, and yet another portion of the heat-bonding terminals are located in the area of ​​the second portion away from the first portion.

[0032] In some embodiments of this application, the display panel further includes a test unit located in the second peripheral sub-region, wherein the orthographic projection of the test unit on the substrate does not overlap with the orthographic projections of the first fan-out trace and the second fan-out trace on the substrate;

[0033] The heated bonding terminals located in the region between the first portion and the second portion include a first group and a second group, and the test unit is located in the region between the first group and the second group.

[0034] In some embodiments of this application, the display panel further includes a plurality of dummy heating terminals located in the second peripheral sub-area, wherein each dummy heating terminal is arranged in the same row and is located on the side of the test unit away from the display area;

[0035] The minimum distance between each of the Dummy heating terminals and the edge of the display panel is equal to the minimum distance between each of the heating bonding terminals and the edge of the display panel, and each of the Dummy heating terminals is electrically connected to the flexible circuit board.

[0036] In some embodiments of this application, the display panel further includes at least one fourth heating line located in the peripheral area, the fourth heating line being arranged around all the first heating lines, the second heating lines and the third heating lines;

[0037] The portion of the fourth heating line located in the first peripheral sub-region is located on the side of the second heating line away from the display area, and the portion of the fourth heating line located in the second peripheral sub-region is located on the side of the second fan-out trace away from the display area; the orthographic projection of the fourth heating line on the substrate at least partially overlaps with the orthographic projection of the first fan-out trace on the substrate;

[0038] One end of the fourth heating wire is connected to one of the heating bonding terminals, and the other end of the fourth heating wire is connected to another heating bonding terminal. The fourth heating wire and the two heating bonding terminals are configured to form a second closed loop.

[0039] In some embodiments of this application, the display panel includes a fourth heating line located in the peripheral area. Except for the portion of the fourth heating line disposed in the second peripheral sub-area, the line width of the other portions of the fourth heating line is greater than the line width of the first heating line, the line width of the other portions of the fourth heating line is greater than the line width of the second heating line, and the line width of the other portions of the fourth heating line is greater than the line width of the third heating line.

[0040] Alternatively, the display panel may also include multiple fourth heating lines located in the peripheral area, with the multiple fourth heating lines connected in parallel.

[0041] Secondly, embodiments of this application provide a display device, including a flexible circuit board, at least one driver chip, and the display panel described in the first aspect above, wherein the display panel is electrically connected to the flexible circuit board and the driver chip respectively.

[0042] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1A and Figure 1B Schematic diagrams of the structure of display devices in two related technologies provided for embodiments of this application;

[0045] Figure 2 and Figure 3 Schematic diagrams of the display panel structure in two related technologies provided for embodiments of this application;

[0046] Figure 4 , Figure 5 and Figure 9 Schematic diagrams of the structures of three display panels provided for embodiments of this application;

[0047] Figure 6 , Figure 7 and Figure 8 Schematic diagrams of three display surface devices provided for embodiments of this application;

[0048] Figure 10 A schematic diagram of the structure of the first heating wire and data wire provided for embodiments of this application;

[0049] Figure 11 A schematic diagram of the arrangement of heating wires in a display panel provided for an embodiment of this application;

[0050] Figure 12 and Figure 13 A schematic diagram showing the arrangement of two types of first heating wires and second heating wires provided for embodiments of this application;

[0051] Figure 14 A schematic diagram showing the arrangement of heating wires in the display area and the first peripheral sub-area of ​​a display panel provided for an embodiment of this application;

[0052] Figure 15 A schematic diagram showing the arrangement of heating wires in the display area and the second peripheral sub-area of ​​a display panel provided in an embodiment of this application;

[0053] Figure 16 A schematic diagram of the structure of the second peripheral sub-region of the display panel provided in an embodiment of this application;

[0054] Figure 17 for Figure 16 Enlarged view of the area where the heating bonding terminal is located. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] For clarity, the thickness of regions and layers may be exaggerated in the figures. The same reference numerals in the figures denote the same or similar structures, and therefore their detailed descriptions are omitted. Furthermore, the figures are merely illustrative of this application and are not necessarily drawn to scale.

[0057] Furthermore, unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0058] Liquid crystal displays (LCDs) are used in extreme environments, such as low temperatures, requiring them to function properly even under these conditions. However, due to the inherent properties of liquid crystals, their viscosity is higher at low temperatures, resulting in a significantly longer response time compared to room temperature. This causes a visual ghosting effect, especially when the temperature drops to near the crystallization temperature of the liquid crystal, drastically impacting the display quality. Developing in-cell heating technology for low-temperature applications is crucial to expanding the application range of LCDs and addressing this problem.

[0059] In related technologies, heating wires are incorporated within the liquid crystal display (LCD). An external FPC (Flexible Printed Circuit) is used to control the heating signal, which is then input to the heating wires. The heating wires generate heat to heat the panel in low-temperature environments. For example... Figure 1A and Figure 1B As shown, 101 represents the substrate of the display panel, 102 represents the edge of the display area, 103 represents the heating wire, 104 represents the COF (Chip On Film) for heating, 105 represents the FPC for heating, 106 represents the display driver chip (IC), 107 represents the bonding terminal of the display FPC, and 108 represents the display FPC. Figure 1A , Figure 2 and Figure 3 As shown, in related technologies, the heating wires are arranged parallel to the grid lines (GL) and extend from the display area to the peripheral area. Correspondingly, the bonding terminals of the heating FPC are also located on the left or right side of the display panel. However, typically, the bonding terminals 107 of the display FPC are located on the lower side of the display panel. In order to achieve normal display and meet the heating requirements within the liquid crystal cell, two dedicated FPCs, one for display and one for heating, need to be bonded simultaneously for power supply, which increases production costs and process complexity. Moreover, the bonding of the heating wires requires additional provisions for a larger bezel.

[0060] Based on this, embodiments of this application provide a display panel, such as... Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, it includes:

[0061] The substrate 200 includes a display area AA and a peripheral area surrounding the display area AA;

[0062] The first conductive layer is located on one side of the substrate 200 and includes multiple data lines DL located in the display area AA;

[0063] The second conductive layer is located on the side of the first conductive layer away from the substrate 200, and includes at least one first heating line group. The first heating line group includes at least one first heating line HL1, which extends from the display area AA to the peripheral area, and the first heating line HL1 extends in the same direction as the data line DL.

[0064] The aforementioned display panel is an LCD (Liquid Crystal Display) display panel, which includes an array substrate, a color filter substrate, and a liquid crystal layer located between the array substrate and the color filter substrate.

[0065] It should be noted that the substrate 200 mentioned above refers to the substrate of the array substrate.

[0066] For example, substrate 200 can be a rigid substrate, such as glass.

[0067] The material of the first conductive layer is a conductive material. For example, the conductive material can be a metallic material. The metallic material can include at least one or more combinations of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti).

[0068] In some embodiments, the first conductive layer described above may be referred to as a source-drain metal layer (SD layer), which may be used to form data lines DL and the source and drain of transistors.

[0069] The material of the second conductive layer is a conductive material. For example, the conductive material can be a metallic material; the metallic material can include at least one or more combinations of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti).

[0070] There is no limitation on whether the materials of the first conductive layer and the second conductive layer are the same.

[0071] In some embodiments, the material of the second conductive layer can be selected from materials with good thermal effects, that is, the material of the second conductive layer can be selected from materials that are easy to generate heat under the action of electrical signals.

[0072] The specific location of the first heating wire HL1 mentioned above is not specified here.

[0073] For example, the first heating line HL1 may be located in the region above the sub-pixel between two adjacent data lines DL, and overlaps with the orthographic projection of the sub-pixel on the substrate 200.

[0074] For example, such as Figure 4 As shown, the first heating line HL1 is located between adjacent pixel units; or, as... Figure 5 and Figure 9 As shown, the first heating line HL1 is located between two adjacent sub-pixels.

[0075] At this point, the orthographic projection of the first heating line HL1 onto the substrate 200 does not overlap with the orthographic projections of each sub-pixel onto the substrate 200. Therefore, the first heating line HL1 has a minimal impact on the aperture ratio of the display panel, ensuring high transmittance, improved display performance, and reduced power consumption.

[0076] The number of the first heating wire groups and the number of first heating wires HL1 included in each first heating wire group are not limited here. They can be determined according to the temperature of the environment in which the display panel is used.

[0077] For example, such as Figure 4 As shown, a first heating line HL1 can be set between every two adjacent pixel units, wherein, Figure 4 One pixel unit shown in the diagram comprises three sub-pixels.

[0078] For example, such as Figure 5 Or such as Figure 9 As shown, a first heating line HL1 can be set between every two adjacent sub-pixels.

[0079] The shape of the orthographic projection of the first heating line HL1 onto the substrate 200 is not limited here. For example, when the first heating line HL1 is located between adjacent pixel units, or when the first heating line HL1 is located between two adjacent sub-pixels, such as... Figure 10 As shown, the shape of the orthographic projection of the first heating line HL1 on the substrate 200 can be similar to the shape of the orthographic projection of the data line DL on the substrate 200.

[0080] In the embodiments of this application, by setting the first heating line HL1 along the extension direction of the data line DL, in subsequent processes, during the bonding of the heating FPC, the heating FPC and the display FPC (the FPC electrically connected to the data line) can be placed on the same side of the display panel, so that the bonding area of ​​the heating FPC and the bonding area of ​​the display FPC are shared. This can improve the abnormal display of the liquid crystal display panel in low temperature environment, while greatly saving the design space of the peripheral area of ​​the display panel, thus facilitating the manufacturing of narrow bezel display products.

[0081] In some embodiments of this application, such as Figure 4 and Figure 9 As shown, the orthographic projection of the first heating line HL1 on the substrate 200 at least partially overlaps with the orthographic projection of the data line DL on the substrate 200.

[0082] The orthographic projection of the first heating line HL1 on the substrate 200 at least partially overlaps with the orthographic projection of the data line DL on the substrate 200, including but not limited to the following situations:

[0083] First, the orthographic projection of the first heating line HL1 on the substrate 200 partially overlaps with the orthographic projection of the data line DL on the substrate 200;

[0084] Second, the orthographic projection of the first heating line HL1 on the substrate 200 completely overlaps with the orthographic projection of the data line DL on the substrate 200.

[0085] In the embodiments of this application, by setting the orthographic projection of the first heating line HL1 on the substrate 200 to at least partially overlap with the orthographic projection of the data line DL on the substrate 200, it is possible to improve the abnormal display of the liquid crystal display panel in a low-temperature environment, while ensuring to a large extent that the aperture ratio of the display panel is not reduced as much as possible after setting the first heating line HL1, and to avoid the negative impact of setting the first heating line HL1 on the transmittance of the display panel as much as possible, thereby ensuring the transmittance of the display panel and improving the display effect.

[0086] In some embodiments of this application, the display panel includes a black matrix layer BM located on the side of the second conductive layer away from the substrate 200, the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is within the orthographic projection of the black matrix layer on the substrate 200, and the orthographic projection of the data line DL on the substrate 200 is within the orthographic projection of the black matrix layer BM on the substrate 200.

[0087] It should be noted that in a liquid crystal display panel, the black matrix layer BM is typically disposed on the color filter substrate. After the array substrate and the color filter substrate are aligned, the black matrix layer BM is located on the side of the second conductive layer away from the substrate 200 of the array substrate. The black matrix layer BM has a light-shielding or light-absorbing function.

[0088] The above-mentioned first heating line HL1 located in the display area AA and its orthogonal projection on the substrate 200 is located within the orthogonal projection of the black matrix layer on the substrate 200, including: the outer contour of the orthogonal projection of the first heating line HL1 located in the display area AA and its orthogonal projection on the substrate 200 is located within the outer contour of the orthogonal projection of the black matrix layer BM on the substrate 200; or, the outer contour of the orthogonal projection of the first heating line HL1 located in the display area AA and its orthogonal projection on the substrate 200 overlaps with the outer contour of the orthogonal projection of the black matrix layer BM on the substrate 200.

[0089] Similarly, the orthographic projection of the data line DL on the substrate 200 being located within the orthographic projection of the black matrix layer BM on the substrate 200 includes: the outer contour of the orthographic projection of the data line DL on the substrate 200 being located within the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200; or, the outer contour of the orthographic projection of the data line DL on the substrate 200 overlapping with the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200.

[0090] In practical applications, to avoid the first heating line HL1 and data line DL reflecting light in the display panel, the reflectivity of the display panel is increased, and the orthogonal projection of the two on the substrate 200 is set to be within the orthogonal projection of the black matrix layer BM on the substrate 200.

[0091] It should be noted that the higher the reflectivity of the display panel, the more likely specular reflection will occur on the display surface, casting shadows of environmental objects and thus reducing the display effect.

[0092] In addition, considering that in addition to light reflection, there is also light refraction and scattering between the film layers of the display panel, the outer contour of the orthographic projection of the data line DL on the substrate 200 is set to be within the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200, and the outer contour of the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is set to be within the outer contour of the orthographic projection of the black matrix layer BM on the substrate 200. In this way, the reflection effect of the data line DL and the first heating line HL1 on the display light can be better reduced, the reflectivity of the display panel can be reduced, and the display effect can be improved.

[0093] In some embodiments of this application, the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 is within the orthographic projection of the data line DL on the substrate 200.

[0094] In an exemplary embodiment, the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 being within the orthographic projection of the data line DL on the substrate 200 includes: the outer contour of the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 being within the outer contour of the orthographic projection of the data line DL on the substrate 200; or, the outer contour of the orthographic projection of the portion of the first heating line HL1 located in the display area AA on the substrate 200 overlapping with the outer contour of the orthographic projection of the data line DL on the substrate 200.

[0095] In practical applications, by setting the orthographic projection of the portion of the first heating line HL1 located in the display area AA onto the substrate 200 to be within the orthographic projection of the data line DL onto the substrate 200, the influence of the portion of the first heating line HL1 located in the display area AA on the aperture ratio of the display area AA can be almost avoided, thereby ensuring that the display area AA of the display panel has a high transmittance and improving the display effect of the display panel.

[0096] In some embodiments of this application, such as Figure 11 As shown, the peripheral area also includes a first peripheral sub-area B1 and a second peripheral sub-area B2, which are located on opposite sides of the display area AA.

[0097] The second conductive layer also includes at least one second heating wire group located in the first peripheral sub-region B1, the second heating wire group including at least one second heating wire HL2;

[0098] Each first heating wire HL1 in the same first heating wire group intersects and connects with each second heating wire HL2 in a second heating wire group.

[0099] The angle formed by the intersection of the first heating wire HL1 and the second heating wire HL2 is not limited here. For example, as shown... Figure 11 and Figure 12 As shown, the first heating wire HL1 and the second heating wire HL2 intersect and are perpendicular.

[0100] In an exemplary embodiment, the second peripheral sub-area B2 includes a bonding area and a fan-out area, wherein the fan-out area is located between the bonding area and the display area, and the fan-out area is provided with fan-out traces of various signal lines.

[0101] In an exemplary embodiment, the number of the second heating wire groups is the same as the number of the first heating wire groups.

[0102] For example, Figure 12 and Figure 13 The image shows two groups of first heating wires (HL1 Group) and two groups of second heating wires (HL2 Group).

[0103] Among them, Figure 12 In this configuration, a first heating wire group HL1 Group comprises 16 first heating wires HL1, and a second heating wire group HL2 Group comprises 4 second heating wires HL2, combined with... Figure 12 and Figure 14 As shown, the closer the second heating line HL2 is to the display area AA, the better it is to increase the temperature in the display panel, thereby improving the display abnormality caused by the deterioration of the viscosity of the liquid crystal at low temperature.

[0104] exist Figure 13 In this system, a first heating wire group HL1 Group includes 32 first heating wires HL1, and a second heating wire group HL2 Group includes 3 second heating wires HL2.

[0105] The number of first heating wires HL1 included in the same first heating wire group can be adjusted according to the actual design. Usually, the number of first heating wires HL1 included in the same first heating wire group is determined by the size of the design space of the second peripheral sub-region B2.

[0106] For example, the more first heating wires HL1 included in the same group of first heating wires, the more fan-out wiring can be saved when the first heating wires HL1 included in the same group of first heating wires are arranged in parallel, and the heating bonding terminal is electrically connected through the fan-out wiring in the second peripheral sub-area B2, thereby saving the design space of the second peripheral sub-area B2.

[0107] In practical applications, such as Figure 14 As shown, since multiple anti-static units (ESDs) are installed on the side of the first peripheral sub-area B1 closest to the display area AA, the portion of the first heating wire HL1 located in the first peripheral sub-area B1 passes between two adjacent ESDs. The second heating wire HL2 also needs to avoid the area where the ESDs are installed. Therefore, when the number of second heating wires HL2 included in the second heating wire group is greater than or equal to 2, a portion of the second heating wires HL2 in the second heating wire group are placed on the side of the area where the ESDs are located away from the display area AA, and the other portion of the second heating wires HL2 in the second heating wire group are placed on the side of the area where the ESDs are located close to the display area AA.

[0108] In an exemplary embodiment, such as Figure 14 As shown, the orthographic projection of the second heating line HL2, which is located on the side of the ESD protection unit away from the display area AA, on the substrate 200 at least partially overlaps with the orthographic projection of the Com signal line on the substrate 200.

[0109] For example, the Com signal line includes at least a segment located in the gate layer and a segment located in the source / drain metal layers. The segment of the Com signal line located in the gate layer is a block structure or, as shown, a segment in the source / drain metal layers. Figure 14 The grid-like structure shown.

[0110] The orthographic projection of the second heating line HL2, which is located on the side of the ESD protection unit away from the display area AA, overlaps with the orthographic projection of a portion of the Com signal line located on the gate layer on the substrate 200.

[0111] It should be noted that in this application, the descriptions involving "one part and another part" are not limited to only two parts, but may also include a third part and a fourth part, which can be determined according to the actual situation, and this is explained here.

[0112] In some embodiments of this application, combined with Figure 11 and Figure 15 As shown, the second conductive layer also includes at least two third heating wire groups located in the second peripheral sub-region B2, each third heating wire group including at least one third heating wire HL3; the number of third heating wire groups is twice the number of second heating wire groups.

[0113] A portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in a third heating wire group, and another portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in another third heating wire group.

[0114] In an exemplary embodiment, the third heating wire group includes multiple third heating wires HL3, which reduces the load on the third heating wire group, increases its conductivity, and facilitates the transmission of electrical signals.

[0115] In an exemplary embodiment, such as Figure 15 As shown, a first heating wire group and two third heating wire groups are illustrated. The first heating wire group includes 16 first heating wires HL1, and each third heating wire group includes 3 third heating wires HL3. Half of the first heating wires HL1 in the first heating wire group intersects and connects with one of the third heating wire groups, and the other half of the first heating wires HL1 in the first heating wire group intersects and connects with the other third heating wire group.

[0116] In an exemplary embodiment, multiple anti-static units (ESD units) are also provided on the side of the second peripheral sub-area B2 closest to the display area AA, such as... Figure 15 As shown, each of the third heating lines HL3 is located on the side of the ESD protection unit away from the display area AA.

[0117] In an exemplary embodiment, a portion of the same third heating wire group may be located on the side of the anti-static unit ESD area away from the display area AA, while another portion may be located on the side of the anti-static unit ESD area closer to the display area AA.

[0118] In some embodiments of this application, such as Figure 16 and Figure 17 As shown, the display panel also includes at least two heat-bonding terminals 201 located in the second peripheral sub-region B2, a third heating wire group electrically connected to one of the heat-bonding terminals 201, and another third heating wire group electrically connected to the other heat-bonding terminal 201; wherein the first heating wire group, the second heating wire group, the two third heating wire groups, and the two heat-bonding terminals are configured to form a first closed loop. Figure 17 yes Figure 16 Enlarged view of the area where the middle-bonded terminal is located.

[0119] In an exemplary embodiment, since the heating wires inside the display panel are all connected in parallel, under the same applied voltage V, the resistance of the parallel heating wires is lower. According to the power formula, W = V 2 / R, the smaller the internal resistance R of the display panel, the greater the power W generated on the panel. The greater the power is beneficial to the temperature rise of the display panel in low-temperature environments, and its temperature rise rate is also faster.

[0120] In practical applications, positive and negative voltages are applied to the two heating bonding terminals of a first closed loop respectively, causing the heating wire in the first closed loop to heat up.

[0121] In some embodiments of this application, the display panel further includes at least one anti-static unit (ESD) located in the peripheral area, and a first closed loop is electrically connected to the at least one ESD unit.

[0122] In an exemplary embodiment, the display panel includes multiple anti-static units (ESD) located in the peripheral area, wherein the specific location of the ESD units in the peripheral area is not limited.

[0123] For example, such as Figure 14 As shown, a portion of the anti-static unit (ESD) can be located in the first peripheral sub-region B1.

[0124] For example, such as Figure 15 As shown, a portion of the anti-static unit (ESD) can be located in the first peripheral sub-region B2.

[0125] In some embodiments of this application, combined with Figure 15 , Figure 16 and Figure 17 As shown, the display panel also includes multiple first fan-out routing lines FL1 and multiple second fan-out routing lines FL2 located in the second peripheral sub-area B2. The first fan-out routing lines FL1 are electrically connected to the data line DL, and the second fan-out routing lines FL2 are electrically connected to each of the third heating lines HL3 in the third heating line group and the heating bonding terminal 201, respectively.

[0126] like Figure 15 As shown, the orthographic projection of the first outgoing trace FL1 on the substrate 200 at least partially overlaps with the orthographic projection of the second outgoing trace FL2 on the substrate 200.

[0127] In an exemplary embodiment, such as Figure 16 As shown, the second peripheral sub-region B2 includes a bonding area B2-B and a fan-out area B2-F. The first fan-out trace FL1 and the second fan-out trace FL2 are both located in the fan-out area B2-F, and each heating bonding terminal 201 is located in the bonding area B2-B.

[0128] In an exemplary embodiment, the first fan-out trace FL1 may be located in the first conductive layer, for example, the first fan-out trace FL1 may be located in the source / drain metal layer, and the second fan-out trace FL2 may be located in the second conductive layer.

[0129] In an exemplary embodiment, the second outgoing cable FL2 also has a heating function.

[0130] It is understood that in the embodiments of this application, "located in a certain layer" refers to the meaning of that layer. For example, the first outgoing trace FL1 can be located in the source / drain metal layer, which means that the source / drain metal layer includes the first outgoing trace FL1. The meanings of other related descriptions are similar to those here.

[0131] In an exemplary embodiment, the display panel may further include a third conductive layer, wherein the third conductive layer is located between the first conductive layer and the substrate 200, and the third conductive layer is typically used to form gate lines GL and the gates of transistors.

[0132] In some embodiments, the first fan-out trace FL1 may be located in the third conductive layer.

[0133] In other embodiments, a portion of the first fan-out trace FL1 is located in the first conductive layer, and a portion of the first fan-out trace FL1 is located in the third conductive layer.

[0134] In some embodiments of this application, such as Figure 6 , Figure 7 and Figure 8 As shown, the display panel is electrically connected to the flexible circuit board (FPC) and at least one driver chip IC.

[0135] The display panel also includes a plurality of display bonding terminals 202 located in the second peripheral sub-region B2. Along the plane parallel to the substrate 200, the minimum distance from each display bonding terminal 202 to the display area AA is greater than the minimum distance from the driver chip IC to the display area AA. The data line DL is electrically connected to the driver chip IC through the first fan-out trace FL1, and the driver chip IC is electrically connected to the flexible circuit board FPC through the display bonding terminals 202.

[0136] Along the plane parallel to the substrate 200, the minimum distance from each display bonding terminal 202 to the display area AA is greater than the minimum distance from the driver chip IC to the display area AA. That is, at least some of the display bonding terminals 202 are located on the side of the driver chip IC away from the display area AA, and each display bonding terminal 202 is used to electrically connect the driver chip IC to the flexible circuit board FPC. That is, the display bonding terminal 202 involved in the embodiments of this application refers to the display bonding terminal used to bond the flexible circuit board FPC.

[0137] In practical applications, the display panel also includes display bonding terminals for bonding the driver chip IC to the first fan-out trace FL1. Typically, the orthographic projection of these display bonding terminals on the substrate 200 overlaps with the orthographic projection of the driver chip IC on the substrate 200.

[0138] In an exemplary embodiment, combined with Figure 6 , Figure 7 , Figure 8 , Figure 16 and Figure 17As shown, each heating bonding terminal 201 is arranged in the same row, and each display bonding terminal 202 is arranged in the same row. The minimum distance between the heating bonding terminal 201 and the edge of the display panel is equal to the minimum distance between each display bonding terminal 202 and the edge of the display panel.

[0139] In an exemplary embodiment, the spacing between two adjacent heating bonding terminals 201 is the same, and the spacing between two display bonding terminals 202 is the same.

[0140] In some embodiments, each display bonding terminal 202 is electrically connected to a flexible circuit board (FPC), and each heating bonding terminal 201 is electrically connected to another flexible circuit board (FPC). The two flexible circuit boards (FPCs) with different functions are located on the same side of the display panel.

[0141] In some embodiments of this application, each display bonding terminal 202 and each heating bonding terminal 201 have the same structure and are all electrically connected to the same flexible circuit board FPC, that is, each display bonding terminal 202 and each heating bonding terminal 201 share a flexible circuit board FPC.

[0142] In the embodiments of this application, by setting the minimum distance between each heating bonding terminal 201 and the edge of the display panel to be equal to the minimum distance between each display bonding terminal 202 and the edge of the display panel, and by setting the structure of each display bonding terminal 202 and each heating bonding terminal 201 to be the same and sharing a flexible circuit board (FPC), it is possible to achieve integrated bonding of the heating bonding terminal 201 and the display bonding terminal 202, saving a flexible circuit board (FPC), reducing the difficulty of the bonding process, saving space in the periphery of the display panel for bonding, reducing the manufacturing cost of the display panel, improving the internal heating efficiency of the display panel, and also facilitating the manufacture of display products with narrow bezels.

[0143] It should be noted that, compared to related technologies where the heating wire is set parallel to the gate line GL, the embodiment of this application sets the first heating wire HL1 parallel to the data line DL. In practical applications, this can increase the density of the first heating wire HL1 to a certain extent, thereby improving the heating efficiency of the heating wire on the display panel, increasing the heating speed, and improving the fast response rate of the liquid crystal in low-temperature environments.

[0144] In some embodiments of this application, such as Figure 7 As shown, each heating bonding terminal 201 includes a first part and a second part, and all display bonding terminals 202 are located in the area between the first part and the second part.

[0145] In an exemplary embodiment, such as Figure 7As shown, the display panel includes a driver chip IC located in the central area of ​​the second peripheral sub-region B2. The display bonding terminal 202 is located on the side of the driver chip IC furthest from the display area AA. Figure 7 The data line DL and the first sector outgoing line FL1 are not shown in the diagram. In actual applications, each first sector outgoing line FL1 and each second sector outgoing line FL1 intersect and are insulated from each other.

[0146] The plurality of heating bonding terminals 201 include a first portion located to the left of all display bonding terminals 202 and a second portion located to the right of all display bonding terminals 202.

[0147] In some embodiments, the heating bonding terminals 201 and the display bonding terminals 202 have the same structure and size and are arranged in the same row, thus enabling the following: Figure 7 The heating bonding terminal 201 and the display bonding terminal 202 shown share the same flexible circuit board (FPC).

[0148] In an exemplary embodiment, such as Figure 6 or Figure 8 As shown, the display panel includes two driver chip ICs. Each display bonding terminal 202 comprises two parts: a first part and a second part. One driver chip IC is electrically connected to the first part of the display bonding terminal 202, and the other driver chip IC is electrically connected to the second part of the display bonding terminal 202. Wherein... Figure 6 and Figure 8 In the middle, the first part of the display binding terminal 202 can be the display binding terminal on the left, and the second part of the display binding terminal 202 can be the display binding terminal on the right.

[0149] In some embodiments, such as Figure 8 As shown, all heating bonding terminals 201 are located in the area between the first part showing bonding terminals 202 and the second part showing bonding terminals 202;

[0150] In other embodiments, such as Figure 6 As shown, a portion of the heating bonding terminals 201 are located in the area between the first part of the display bonding terminal 202 and the second part of the display bonding terminal 202, another portion of the heating bonding terminals 201 are located in the area of ​​the first part of the display bonding terminal 202 away from the second part of the display bonding terminal 202, and yet another portion of the heating bonding terminals 201 are located in the area of ​​the second part of the display bonding terminal 202 away from the first part of the display bonding terminal 202.

[0151] In some embodiments of this application, such as Figure 16As shown, the display panel also includes a test unit CT (Cell Test) located in the second peripheral sub-region B2. The orthographic projection of the test unit CT on the substrate 200 does not overlap with the orthographic projections of the first outgoing line FL1 and the second outgoing line FL2 on the substrate 200.

[0152] The heating bonding terminal 201 located in the area between the first part display bonding terminal 202 and the second part display bonding terminal 202 includes a first group 201-G1 and a second group 201-G2, and the test unit CT is located in the area between the first group of heating bonding terminals 201-G1 and the second group of heating bonding terminals 201-G2.

[0153] In some embodiments of this application, such as Figure 16 and Figure 17 As shown, the display panel also includes multiple Dummy heating terminals 203 located in the second peripheral sub-area B2. Each Dummy heating terminal 203 is arranged in the same row and is located on the side of the test unit CT away from the display area AA.

[0154] The minimum distance between each dummy heating terminal 203 and the edge of the display panel is equal to the minimum distance between each heating bonding terminal 201 and the edge of the display panel, and each dummy heating terminal 203 is electrically connected to the flexible circuit board (FPC).

[0155] In an exemplary embodiment, such as Figure 17 As shown, the dimensions of each Dummy heating terminal 203 along the direction from the display area AA to the second peripheral area B2 are smaller than the dimensions of the other heating terminals 201 along the direction from the display area AA to the second peripheral area B2.

[0156] exist Figure 17 The system also includes bonding mark patterns 204 located on both sides of the area where each heat bonding terminal 201 is located, which are used for alignment when the heat bonding terminal 201 is bonded to the flexible circuit board FPC.

[0157] In the embodiments of this application, a row of dummy heating terminals 203 is arranged on the side of the test unit CT away from the display area AA, and the minimum distance between each dummy heating terminal 203 and the edge of the display panel is equal to the minimum distance between each heating bonding terminal 201 and the edge of the display panel. In this way, without affecting the normal use of the test unit CT, the blank area between the first group of heating bonding terminals 201-G1 and the second group of heating bonding terminals 201-G2 is connected. When bonding the flexible circuit board FPC, since each heating bonding terminal 201 is bonded to the same flexible circuit board FPC, the dummy heating terminals 203 between the first group of heating bonding terminals 201-G1 and the second group of heating bonding terminals 201-G2 are beneficial to the electrical connection stability between each heating terminal and the flexible circuit board FPC.

[0158] In some embodiments of this application, such as Figure 11 As shown, the display panel also includes at least one fourth heating line HL4 located in the peripheral area, the fourth heating line HL4 being arranged around all the first heating lines HL1, the second heating line HL2 and the third heating line HL3;

[0159] Combination Figure 11 and Figure 14 As shown, the portion of the fourth heating line HL4 located in the first peripheral sub-area B1 is situated on the side of the second heating line HL2 furthest from the display area AA. Figure 11 and Figure 15 As shown, the portion of the fourth heating line HL4 located in the second peripheral sub-region B2 is on the side of the second fan-out trace FL2 away from the display area AA; the orthographic projection of the fourth heating line HL4 on the substrate 200 at least partially overlaps with the orthographic projection of the first fan-out trace FL1 on the substrate 200.

[0160] In this configuration, one end of the fourth heating wire HL4 is connected to a heating bonding terminal 201, and the other end of the fourth heating wire HL4 is connected to another heating bonding terminal 201. The fourth heating wire HL4 and the two heating bonding terminals 201 are configured to form a second closed loop. Positive and negative voltages are applied to the second closed loop through the two heating bonding terminals 201, causing the heating wires in the second closed loop to heat up.

[0161] In some embodiments of this application, the display panel includes a fourth heating line HL4 located in the peripheral area. Except for the portion of the fourth heating line HL4 located in the second peripheral sub-area B2, the line width of the other portions of the fourth heating line HL4 is greater than the line width of the first heating line HL1, the line width of the other portions of the fourth heating line HL4 is greater than the line width of the second heating line HL2, and the line width of the other portions of the fourth heating line HL4 is greater than the line width of the third heating line HL3.

[0162] Alternatively, the display panel may also include multiple fourth heating lines HL4 located in the peripheral area, with the multiple fourth heating lines HL4 connected in parallel.

[0163] The linewidth mentioned above refers to the dimension of the heating wire along its direction of extension.

[0164] In an exemplary embodiment, the second closed loop may be electrically connected to at least one antistatic unit (ESD).

[0165] In the embodiments of this application, by adjusting the wiring method of the heating wire, the display bonding terminal 202 and the heating bonding terminal 201 are set on the same side of the display panel, and the structure of each bonding terminal electrically connected to the flexible circuit board FPC is the same, and the minimum distance between these bonding terminals and the edge of the display panel is the same. In this way, the display bonding terminal 202 and the heating bonding terminal 201 can use the same flexible circuit board FPC, realizing the integrated bonding technology of FPC, simplifying the bonding process, saving the cost of FPC, and eliminating the need to reserve additional space for bonding the heating bonding terminals, thus achieving the requirement of narrow bezel and realizing the purpose of high-power heating of the panel.

[0166] It should be noted that the above-mentioned display panel may also include other structures. Only the structures related to the inventive point are introduced here. Other structures of the above-mentioned liquid crystal display panel can be obtained from relevant technologies or common knowledge, and will not be described in detail here.

[0167] Embodiments of this application provide a display device, including a flexible circuit board, at least one driver chip, and a display panel as described above, wherein the display panel is electrically connected to the flexible circuit board and the driver chip, respectively.

[0168] The structure of the display panel can be referred to in the previous description, and will not be repeated here.

[0169] In an exemplary embodiment, in Figure 7 The display device shown includes a driver chip IC; Figure 6 and Figure 8 The display device shown includes two driver chip ICs.

[0170] exist Figures 6-8 In this configuration, each display bonding terminal 202 and heating bonding terminal 201 shares a single flexible circuit board (FPC).

[0171] The aforementioned display device is a liquid crystal display device, which may be a TN (Twisted Nematic) type, a VA (Vertical Alignment) type, an IPS (In-Plane Switching) type, or an ADS (Advanced Super Dimension Switching) type liquid crystal display device.

[0172] The display device can be an LCD monitor or other display device, as well as any product or component with display functionality, such as a television, digital camera, mobile phone, or tablet computer. The display device provided in the embodiments of this application exhibits high display performance at low temperatures and is suitable for display products with narrow bezels.

[0173] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display panel, wherein, include: The substrate includes a display area and a peripheral area surrounding the display area; The first conductive layer is located on one side of the substrate and includes multiple data lines located in the display area; The second conductive layer is located on the side of the first conductive layer away from the substrate, and includes at least one first heating wire group. The first heating wire group includes at least one first heating wire, which extends from the display area to the peripheral area and extends in the same direction as the data line. The peripheral area further includes a first peripheral sub-area and a second peripheral sub-area, which are located on opposite sides of the display area; The second conductive layer further includes at least one second heating wire group located in the first peripheral sub-region, the second heating wire group including at least one second heating wire; Each of the first heating wires in the same first heating wire group intersects with and is connected to each of the second heating wires in a second heating wire group; The second conductive layer further includes at least two third heating wire groups located in the second peripheral sub-region, wherein the third heating wire group includes at least one third heating wire; The number of the third heating wire group is twice the number of the second heating wire group; A portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in one third heating wire group, and another portion of the first heating wires in the same first heating wire group intersects and connects with each of the third heating wires in another third heating wire group; The display panel further includes at least two heat-bonding terminals located in the second peripheral sub-area, one of the third heating wire groups being electrically connected to one of the heat-bonding terminals, and the other third heating wire group being electrically connected to the other heat-bonding terminal; The first heating wire group, the second heating wire group, the two third heating wire groups, and the two heating bonding terminals are configured to form a first closed loop; The display panel also includes at least one anti-static unit located in the peripheral area, and a first closed loop is electrically connected to at least one of the anti-static units.

2. The display panel according to claim 1, wherein, The orthographic projection of the first heating line on the substrate at least partially overlaps with the orthographic projection of the data line on the substrate.

3. The display panel according to claim 2, wherein, The display panel includes a black matrix layer located on the side of the second conductive layer away from the substrate. The orthographic projection of the portion of the first heating line located in the display area on the substrate is within the orthographic projection of the black matrix layer on the substrate, and the orthographic projection of the data line on the substrate is within the orthographic projection of the black matrix layer on the substrate.

4. The display panel according to claim 3, wherein, The orthographic projection of the portion of the first heating line located in the display area onto the substrate is within the orthographic projection of the data line onto the substrate.

5. The display panel according to claim 1, wherein, The display panel also includes multiple first fan-out traces and multiple second fan-out traces located in the second peripheral sub-area. The first fan-out traces are electrically connected to the data line, and the second fan-out traces are electrically connected to the third heating wire group and the heating bonding terminal, respectively. The orthographic projection of the first fan-out trace on the substrate and the orthographic projection of the second fan-out trace on the substrate at least partially overlap.

6. The display panel according to claim 5, wherein, The display panel is electrically connected to the flexible circuit board and at least one driver chip, respectively. The display panel further includes a plurality of display bonding terminals located in the second peripheral sub-region. Along a plane parallel to the substrate, the minimum distance from each display bonding terminal to the display area is greater than the minimum distance from the driver chip to the display area. The data line is electrically connected to the driver chip through the first fan-out trace, and the driver chip is electrically connected to the flexible circuit board through the display bonding terminals. The heating bonding terminals are arranged in the same row, and the display bonding terminals are arranged in the same row. The minimum distance between the heating bonding terminals and the edge of the display panel is equal to the minimum distance between the display bonding terminals and the edge of the display panel.

7. The display panel according to claim 6, wherein, The display bonding terminals and the heating bonding terminals have the same structure and are all electrically connected to the same flexible circuit board.

8. The display panel according to claim 7, wherein, Each of the heat-bonding terminals includes a first portion and a second portion, and all of the display bonding terminals are located in the area between the first portion and the second portion.

9. The display panel according to claim 7, wherein, Each of the aforementioned display bonding terminals includes a first part and a second part. All of the heat-bonded terminals are located in the area between the first part and the second part; or, A portion of the heat-bonding terminals are located in the area between the first portion and the second portion, another portion of the heat-bonding terminals are located in the area of ​​the first portion away from the second portion, and yet another portion of the heat-bonding terminals are located in the area of ​​the second portion away from the first portion.

10. The display panel according to claim 9, wherein, The display panel further includes a test unit located in the second peripheral sub-region, wherein the orthographic projection of the test unit on the substrate does not overlap with the orthographic projections of the first fan-out trace and the second fan-out trace on the substrate; The heated bonding terminals located in the region between the first portion and the second portion include a first group and a second group, and the test unit is located in the region between the first group and the second group.

11. The display panel according to claim 10, wherein, The display panel also includes a plurality of dummy heating terminals located in the second peripheral sub-area, all of which are arranged in the same row and are located on the side of the test unit away from the display area; The minimum distance between each of the Dummy heating terminals and the edge of the display panel is equal to the minimum distance between each of the heating bonding terminals and the edge of the display panel, and each of the Dummy heating terminals is electrically connected to the flexible circuit board.

12. The display panel according to any one of claims 5-11, wherein, The display panel further includes at least one fourth heating line located in the peripheral area, the fourth heating line being arranged around all the first heating lines, the second heating lines and the third heating lines; The portion of the fourth heating line located in the first peripheral sub-region is located on the side of the second heating line away from the display area, and the portion of the fourth heating line located in the second peripheral sub-region is located on the side of the second fan-out trace away from the display area; the orthographic projection of the fourth heating line on the substrate at least partially overlaps with the orthographic projection of the first fan-out trace on the substrate; One end of the fourth heating wire is connected to one of the heating bonding terminals, and the other end of the fourth heating wire is connected to another heating bonding terminal. The fourth heating wire and the two heating bonding terminals are configured to form a second closed loop.

13. The display panel according to claim 12, wherein, The display panel includes a fourth heating line located in the peripheral area. Except for the portion of the fourth heating line located in the second peripheral sub-area, the line width of the other portions of the fourth heating line is greater than the line width of the first heating line, the line width of the other portions of the fourth heating line is greater than the line width of the second heating line, and the line width of the other portions of the fourth heating line is greater than the line width of the third heating line. Alternatively, the display panel may also include multiple fourth heating lines located in the peripheral area, with the multiple fourth heating lines connected in parallel.

14. A display device, wherein, It includes a flexible circuit board, at least one driver chip, and a display panel as described in any one of claims 1-13, wherein the display panel is electrically connected to the flexible circuit board and the driver chip, respectively.

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