A production process for an electrostatic dust removal device

Abstract

The present invention relates to a production process of an electrostatic dust removal device, belonging to the technical field of air purification. S100: Alternately place dust collection plates and spacers in sequence to form a mold core; S300: Install a fixed spacer along the fixed positions reserved on the dust collection plates and remove the spacers; S500: Install a conductor at the end of the mold core and perform insulation treatment on the end of the mold core with insulating glue. The present invention can solve the technical problems in the prior art, such as low production efficiency and increased input costs caused by complicated production processes.

Description

Technical Field

[0001] The present invention belongs to the technical field of air purification, and specifically relates to a production process of an electrostatic dust removal device. Background Art

[0002] Currently, the mainstream air purification technologies are divided into filtration technology and electrostatic technology. The filtration technology filters or adsorbs pollutants in the air through fibers and filter materials based on fibers, thereby purifying the air. Its technology is mature and the operation is relatively stable. However, the labor cost, material cost, operation cost, and maintenance cost are very high, and there is a certain safety risk if the maintenance is improper. Since the filter material continuously intercepts pollutants in the air, the gaps between the fibers are continuously blocked, and the wind resistance continuously increases. Therefore, it is necessary to frequently clean and replace the filter material. At the same time, bacteria and viruses in the air remaining on the filter material will cause problems such as bacterial reproduction, filter material mildew, and odor. The electrostatic technology ionizes the particulate matter in the gas through an ionization module, and the charged particulate matter is adsorbed by the electric field formed by the dust collection module to complete the purification. Various high-voltage electrostatic dust removal devices developed based on the technical principle of the electrostatic technology can complete the purification of a relatively wide flow rate and relatively comprehensive particulate pollution, can be used relatively stably in different environments such as temperature and humidity, and can be preferably applied to air filtration treatment in the fields of household, commercial, industrial, tunnel, subway, etc., and have technical characteristics such as long service life, high purification efficiency, low operation cost, and low maintenance cost.

[0003] Currently, the production process of most electrostatic dust removal devices is cumbersome, resulting in low production efficiency and increased input costs. Therefore, it is necessary to develop a rapid production process for electrostatic dust removal devices. Summary of the Invention

[0004] In view of the various deficiencies of the prior art, a production process of an electrostatic dust removal device is proposed to solve the technical problems of low production efficiency and increased input costs caused by the cumbersome production process in the prior art.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A production process of an electrostatic dust removal device includes the following steps:

[0007] S100. Alternately place dust collection plates and spacers in sequence to form a mold core;

[0008] S300. Install a fixed spacer along the fixed positions reserved on the dust collection plate, and remove the spacer;

[0009] S500. Install a conductor at the end of the mold core, and perform insulation treatment on the end of the mold core with an insulating adhesive.

[0010] The technical solution is further configured such that, in step S100, the placement order of the dust collecting plates and the spacers is adjustable, the dust collecting plates include grounded dust collecting plates and high-pressure dust collecting plates that are alternately stacked, the grounded dust collecting plates and the high-pressure dust collecting plates are staggered 180°, and the structures of the two are the same.

[0011] The technical solution is further configured such that the interior of the dust collecting plate is an insulating layer, semiconductor layers are provided on both sides of the insulating layer, and a conductive layer is provided between the insulating layer and the semiconductor layer.

[0012] The technical solution is further configured as follows: the manufacturing method of the dust collecting plate is:

[0013] Conductive layers are printed symmetrically on both sides of the insulating layer, an adhesive layer is applied after the conductive layer is dried, a semiconductor layer is pasted or bonded on the adhesive layer, and after flipping, the semiconductor layer is pasted or bonded on the other side of the conductive layer in the same way, and a dust collecting plate that meets the design size requirements is cut or punched out on the equipment.

[0014] The technical solution is further configured such that the thickness of the semiconductor layer of the dust collecting plate of the dust collecting layer is smaller than the thickness of the semiconductor layer of the dust collecting plate of the non-dust collecting layer.

[0015] The technical solution is further configured such that the interior of the dust collecting plate is a conductive layer, and semiconductor layers are provided on both sides of the conductive layer.

[0016] The technical solution is further configured such that, in step S100, a rod-shaped component is used to sequentially penetrate the process holes on the dust collecting plate and the spacer to form a mold core.

[0017] The technical solution is further configured such that, in step S100, insulating plates are provided on both sides of the mold core, and a rod-shaped component is sequentially inserted into the process holes on the insulating plate, the dust collecting plate and the spacer, and is fastened on the outside of the insulating plate to form a mold core.

[0018] The technical solution is further configured such that, in step S300, insulating glue is poured along a fixed position reserved on the dust collecting plate, and the fixed position is set at an edge of the dust collecting plate.

[0019] The technical solution is further configured that, in step S300, a rigid insulating member is installed along a fixed position reserved on the dust collecting plate, and a dust collecting plate seam for accommodating the dust collecting plate is provided on the rigid insulating member.

[0020] The technical solution is further configured such that, in step S300, the rod-shaped component is removed and the spacer is extracted from the end of the mold core.

[0021] This technical solution is further configured such that in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue. Specifically:

[0022] When the process holes are provided at both ends of the dust collection plate, the rod-shaped component is inserted into the process holes again. A conductor is installed at the power connection port at the end of the dust collection plate. The two ends of the mold core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, the rod-shaped component is removed.

[0023] This technical solution is further configured such that in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue. Specifically:

[0024] When the process hole is provided at one end of the dust collection plate, the rod-shaped component serves as the conductor. The rod-shaped component is inserted into the process hole again. The two ends of the mold core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, the process hole is directly sealed.

[0025] This technical solution is further configured such that in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue. Specifically:

[0026] When the process hole is provided at one end of the dust collection plate, the rod-shaped component guides the conductor into the process hole. The two ends of the mold core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, the process hole is directly sealed.

[0027] This technical solution is further configured such that an isolation paper or an insulating thin layer is laid in the glue injection container. The beneficial effects of the present invention are:

[0028] The conductor realizes the electrical connection between the power supply and the dust collection plate. The fixed isolation member can improve the stability of the mold core. The present invention improves and simplifies the production process, helps to improve production efficiency, and reduces the input cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a flowchart of the production process of the electrostatic dust removal device in an embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the mold core in an embodiment of the present invention;

[0031] Figure 3 is an exploded view of the mold core in an embodiment of the present invention;

[0032] Figure 4 is a schematic diagram of the electrostatic dust removal device in an embodiment of the present invention;

[0033] Figure 5 It is a side view of the dust collection plate in an embodiment of the present invention;

[0034] Figure 6 It is a top view of the dust collection plate in an embodiment of the present invention;

[0035] Figure 7 It is a top view of another embodiment of the dust collection plate in an embodiment of the present invention;

[0036] Figure 8 It is a schematic diagram of the dust collection plate seam of the dust collection plate in an embodiment of the present invention;

[0037] Figure 9 It is a top view of another embodiment of the dust collection plate in an embodiment of the present invention;

[0038] Figure 10 It is a top view of another embodiment of the dust collection plate in an embodiment of the present invention;

[0039] Figure 11 It is a top view of another embodiment of the dust collection plate in an embodiment of the present invention;

[0040] Figure 12 It is a top view of another embodiment of the dust collection plate in an embodiment of the present invention.

[0041] In the drawings: 100, insulating plate; 200, dust collection plate; 300, fixed isolation member; 400, insulating adhesive layer; 500, conductor; 600, wire; 700, frame; 800, process hole;

[0042] 201, insulating layer; 202, semiconductor layer; 203, conductive layer; 204, fixed position; 205, avoidance port; 206, power connection port; 207, insulating gap; 208, groove; 209, first electrical safety area; 210, second electrical safety area; 301, dust collection plate seam. Detailed implementation manners

[0043] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by those of ordinary skill in the art without creative efforts shall all fall within the scope of protection of this application. In addition, the directional terms mentioned in the following embodiments, such as "upper", "lower", "left", "right", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for illustration rather than limitation of the present invention.

[0044] According to an embodiment of the present invention, a production process of an electrostatic dust removal device is provided. Please refer to Figure 1 , including the following steps:

[0045] S100. Alternately place the dust collecting plates and spacers in sequence to form a mold core;

[0046] S300. Install a fixed spacer along the fixed positions reserved on the dust collecting plates and remove the spacers;

[0047] S500. Install a conductor at the end of the mold core and insulate the end of the mold core with insulating glue.

[0048] It should be noted that the conductor realizes the electrical connection between the power supply and the dust collecting plates, and the fixed spacer can improve the stability of the mold core. The present invention improves and simplifies the production process, helps to improve production efficiency, and reduces input costs.

[0049] In the production process of the electrostatic dust removal device of this embodiment, please refer to Figures 1 to 3 , in step S100, the placement order of the dust collecting plate 200 and the spacer can be adjusted.

[0050] Specifically, the dust collecting plate 200 includes a grounded dust collecting plate and a high-voltage dust collecting plate that are alternately stacked, the grounded dust collecting plate and the high-voltage dust collecting plate are arranged staggeredly by 180°, and their structures are the same. The high-voltage dust collecting plate is electrically connected to the high-voltage end of the power supply of the electrostatic dust removal device, and the grounded dust collecting plate is electrically connected to the low-voltage end of the power supply of the electrostatic dust removal device.

[0051] Preferably, the power supply of the electrostatic dust removal device can be built-in or external.

[0052] Please refer to Figure 3 and Figure 5 , the middle part of the dust collecting plate 200 is an insulating layer 201, semiconductor layers 202 are provided on both sides of the insulating layer 201, a conductive layer 203 is provided between the insulating layer 201 and the semiconductor layer 202. At the same time, adhesive layers are provided between the semiconductor layer 202 and the conductive layer 203, and between the semiconductor layer 202 and the insulating layer 201.

[0053] It should be noted that by adding the insulating layer 201, the strength and stability of the dust collecting plate 200 are improved. The electrostatic dust removal device made of the dust collecting plate 200 with this structure can not only improve stability and ensure the normal use of the device, but also effectively reduce the distance between the dust collecting plates 200, increase the dust collection surface, capture more pollutants, and improve the purification efficiency.

[0054] During production, the conductive layer 203 is printed symmetrically on both sides of the flat insulating layer 201, such as conductive ink. After the conductive layer 203 is dried, an adhesive layer is applied, and the semiconductor layer is pasted or adhered on the adhesive layer. Similarly, the semiconductor layer is pasted or adhered on the other side in the same way, and then the required dust collecting plates are cut or punched out on the equipment.

[0055] Specifically, the conductive layer 203 is provided in a strip shape, and it can be provided as 1 strip or multiple strips.

[0056] Specifically, the conductive layer 203 is made of a conductive material and an additive. The conductive material includes graphite, graphene, or conductive ink, and the additive includes silicone, which can increase the heat resistance, water repellency, and corona resistance of the material.

[0057] The semiconductor layer 202 is made of a polymer material and a heat-conducting material. The polymer material is made of polyvinyl chloride, polyethylene, polypropylene, ABS plastic, or polytetrafluoroethylene, and the heat-conducting material includes one or a combination of alumina, silica, metal powder, silicon nitride, aluminum nitride, zinc oxide, calcium oxide, graphite, and graphene. To obtain wide applicability and take into account production processing and material costs, polyethylene, abbreviated as PE, is preferably used. It has excellent low-temperature resistance, can still maintain good mechanical properties at -60°C, is odorless, odorless, non-toxic, has a dull surface, is a milky white waxy granule, has a melting point of 100-130°C, is insoluble in water, can still maintain flexibility at low temperatures, has high electrical insulation, and has a relatively high thermal conductivity.

[0058] The insulating layer 201 is made of one or more of polypropylene, ABS plastic, polyamide, polyoxymethylene, polytetrafluoroethylene, or polycarbonate. The insulating layer 201 is selected as a rigid material, and its insulation and support properties are used to maintain the stiffness of the dust collection plate 200. Polycarbonate, also known as PC plastic, is preferably used. It is colorless and transparent, heat-resistant, impact-resistant, has good mechanical properties, is flame-retardant BI grade, has a melting point of 220-230°C, and has flame retardancy and oxidation resistance.

[0059] Specifically, the thickness of the insulating layer 201 is 0.1-1.0 mm, preferably 0.3 mm. If the thickness of the insulating layer 201 is too thin, such as less than 0.1 mm, the support strength is insufficient and the dust collection plate is prone to deformation; if the thickness of the insulating layer 201 is too thick, such as greater than 1 mm, under the condition that the sizes of other layers are the same, the thickness of the dust collection plate is relatively thick, and the effective ventilation area per unit area of the corresponding purification and dust removal device becomes smaller, and the purification efficiency and dust capacity will decrease; within the range of 0.1-1 mm, the support and the control of the dust collection plate thickness can be balanced. The thickness of the semiconductor layer 202 is 0.05-0.5 mm, preferably 0.15 mm. If the thickness of the semiconductor layer 202 is too thin, such as less than 0.05 mm, it is not easy to process during production, and it is prone to breakage during actual operation, affecting stability; if the thickness of the semiconductor layer 202 is too thick, such as greater than 0.5 mm, under the condition that the sizes of other layers are the same, the thickness of the dust collection plate is relatively thick, and the effective ventilation area per unit area of the corresponding purification and dust removal device becomes smaller, and the purification efficiency and dust capacity will decrease; within the range of 0.05-0.5 mm, the conductivity and the control of the dust collection plate thickness can be balanced. The thickness of the conductive layer 203 is 0.005-0.03 mm, preferably 0.01 mm.

[0060] Please refer to Figure 6 , the length of the conductive layer 203 is less than the length of the semiconductor layer 202, and the conductive layer 203 extends to the power connection end of the dust collecting plate, and the power connection end is the end of the dust collecting plate where the power connection port 206 is provided. That is to say, one end of the conductive layer 203 is flush with the end of the semiconductor layer 202 to achieve stable power connection, and the other end of the conductive layer 203 is not flush with the end of the semiconductor layer 202.

[0061] Please refer to Figure 10 , the area of the end of the conductive layer 203 located at the power connection end is smaller than the area of the other end of the conductive layer 203. The reduction of the area of the end of the conductive layer 203 located at the power connection end can prevent the end of the conductive layer 203 from being too close to the electrical safety distance of the frame of the electrostatic dust removal device, affecting the stable operation in the later stage. Specifically, the end of the conductive layer 203 located at the power connection end is inclined away from the power connection end from the entrance of the power connection port 206. There is a first electrical safety area 208 between the power connection end and the conductive layer 203. Two first electrical safety areas 208 are symmetrically provided, and the first electrical safety area 208 is triangular. The symmetrical structure design can maintain the uniformity of the electrical safety distance.

[0062] Please refer to Figure 11 , a notch is provided at the end of the conductive layer 203 located at the power connection end, and the notch forms a second electrical safety area 210. Two second electrical safety areas 210 are symmetrically provided, and the second electrical safety area 210 is square. The symmetrical structure design can maintain the uniformity of the electrical safety distance. Specifically, the conductive layer 203 extends to the area between the notch and the power connection port 206.

[0063] Specifically, the thickness of the semiconductor layer of the dust collecting layer dust collecting plate is the same as that of the semiconductor layer of the non-dust collecting layer dust collecting plate, which is beneficial to processing and production.

[0064] It should be noted that the dust collecting layer and non-dust collecting layer of the dust collecting plate are related to the high voltage supplied by the electrostatic dust removal device and the high voltage supplied by the front-end ionization device. Specifically, the electrical voltage is designed at the beginning, the high-voltage power supply is matched, and the dust collecting plate is matched accordingly during production. For example, if the ionization device is a DC positive high voltage, the particulate matter will carry a positive charge after passing through the ionization device. The dust collecting plates of the electrostatic dust removal device are staggered and superimposed. The power supplied to a part of the dust collecting plates is DC positive high voltage, and the other part of the dust collecting plates is connected to the grounding electrode. For this electrostatic dust removal device, the dust collecting plates supplied with DC positive high voltage are non-dust collecting layer dust collecting plates, and the grounded dust collecting plates are dust collecting layer dust collecting plates.

[0065] Specifically, the thickness of the semiconductor layer of the dust collecting layer dust collecting plate is less than the thickness of the semiconductor layer of the non-dust collecting layer dust collecting plate.

[0066] It should be noted that, on the premise of meeting electrical safety, the thickness of the semiconductor layer of the dust collection plate in the dust collection layer is less than that of the semiconductor layer of the dust collection plate in the non-dust collection layer. In the initial stage of operation, the accumulation of particulate matter on the dust collection surface is limited and has no impact on the purification efficiency. As the operation time increases, the accumulation of particulate matter increases and the thickness of the dust layer increases. The thinned semiconductor layer can quickly conduct away the charge of the particulate matter, avoiding the formation of back corona phenomenon and ensuring the purification efficiency.

[0067] In order to verify whether the difference in the thickness of the semiconductor layer on the dust collection surface and the non-dust collection surface affects the purification efficiency of the electrostatic dust removal device, the inventor conducted the following experiment. Electrostatic dust removal devices with a length of 500 mm, a width of 300 mm, and a thickness of 50.8 mm were compared. When the ionization device and ionization voltage at the front end were the same, in the same environment, the change in the PM2.5 purification efficiency during the long-term operation of the electrostatic dust removal device was compared at two wind speeds. The experimental data are shown in Table 1.

[0068] Table 1:

[0069]

[0070]

[0071]

[0072] It can be intuitively obtained from Table 1 that when the thickness of the semiconductor layer on the dust collection surface is less than that of the semiconductor layer on the non-dust collection surface, the semiconductor layer on the dust collection surface is thinner, which is more conducive to the rapid transfer of the charge of the captured particulate matter. Back corona is not easily formed, which is more conducive to ensuring the purification efficiency of the electrostatic dust removal device and increasing the dust holding capacity.

[0073] In the production process of the electrostatic dust removal device in this embodiment, the inside of the dust collection plate is a conductive layer, and semiconductor layers are provided on both sides of the conductive layer. Preferably, the conductive layer can be a metal material, such as aluminum foil, copper foil and other materials.

[0074] In the production process of the electrostatic dust removal device in this embodiment, please refer to Figure 1 , in step S100, a rod-shaped component is sequentially inserted into the process holes on the dust collection plate and the spacer to form a mold core.

[0075] In the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 3 , in step S100, a rod-shaped component is sequentially inserted into the process holes 800 on the insulating plate 100, the dust collection plate 200 and the spacer, and fastened on the outside of the insulating plate 100 to form a mold core, ensuring that the size of the mold core meets the design size.

[0076] During production, to increase stability, an insulating board 100 is first strung into the edge. The insulating board 100 is made of an insulating material and has a structure similar to that of the dust collecting plate 200. Its thickness is set according to strength requirements, and multiple pieces or a thicker insulating board 100 are used. After the insulating board 100 is strung in, the dust collecting plate 200, spacer, and dust collecting plate 200 are successively strung in, alternating in turn, and another insulating board 100 is strung into the last edge. It is also possible to string in the spacer, dust collecting plate 200, and spacer successively after the insulating board 100 is strung in, alternating in turn, and another insulating board 100 is strung into the last edge.

[0077] It should be noted that the insulating board 100 can be an insulating rigid board with high stability. The insulating board 100 can be an insulating flexible board for easy assembly.

[0078] For the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 3 In step S300, insulating glue is poured along the fixing position 204 reserved on the dust collecting plate 200, that is, the insulating glue serves as the fixing and isolating member 300, and the fixing position 204 is provided at the edge of the dust collecting plate 200.

[0079] Specifically, please refer to Figure 6 The fixing position 204 is a semi-circular opening, and the cured insulating glue is flush with or protrudes from the edge of the dust collecting plate 200. In some other embodiments, the fixing position 204 can also be a groove-shaped opening, and the cured insulating glue is flush with or protrudes from the edge of the dust collecting plate 200. Among them, the design of the semi-circular opening forms an equal-distance safety distance from the avoidance port 205, and an approximately circular colloid is formed after gluing and fixing. At the same time, the diameter of the semi-circular opening is adapted to the amount of glue. When the cured insulating glue is flush with the edge of the dust collecting plate 200, the surface flatness and aesthetics can be maintained.

[0080] Among them, after pouring insulating glue into the shallow arc opening for fixation, an approximately circular colloid is formed. The circular colloid forms an equidistant safety distance from the avoidance port 205. At the same time, the size of the shallow arc opening is adapted to the amount of glue, and the colloid is flush with the edge of the dust collection plate or slightly lower than the edge of the dust collection plate, that is, part of the colloid is inside the shallow arc opening and part of it is combined with the dust collection plate to form an approximately circular colloid, maintaining the surface flatness and aesthetics. Or the fixing position 204 is a semi-circular opening and the avoidance port 205 is a deep arc opening. After pouring insulating glue into the semi-circular opening for fixation, an approximately circular colloid is formed. The circular colloid forms an equidistant safety distance from the avoidance port 205. At the same time, the size of the semi-circular opening is adapted to the amount of glue, and after applying glue, the colloid is flush with the edge of the dust collection plate or slightly lower than the edge of the dust collection plate, that is, part of the colloid is inside the semi-circular opening and part of it is combined with the dust collection plate to form an approximately circular colloid, maintaining the surface flatness and aesthetics. The design of the equidistant safety distance utilizes the natural settlement of the insulating glue and the combination of the insulating glue and the dust collection plate to form an approximately circular colloid, mainly including the aforementioned two forms; the design of the equidistant safety distance can improve the proportion of the conductive layer of the dust collection plate as much as possible, thereby improving the purification efficiency and dust capacity of the electrostatic dust removal device and extending the maintenance cycle; the design of the equidistant safety distance, in the later stage of the operation of the electrostatic dust removal device, a layer of dust will adhere to the surface of the colloid and the surface of the dust collection plate. When the dust encounters environments such as high humidity, it will have a certain conductivity, indirectly reducing the safety distance of the electrostatic dust removal device. At this time, the dust collection plate and the colloid connecting different potential voltages will generate leakage current due to the reduction of the electrical safety distance, thereby reducing the purification efficiency of the electrostatic dust removal device and reducing the maintenance cycle.

[0081] During production, after the in-series process is completed, the mold core is formed and corrected by a right-angle tooling. At this time, glue is applied and fixed along the fixing position 204. The glue application can be carried out by an automated process or by manual glue application. The insulating glue has high bonding strength and can withstand high and low temperature impacts, such as PUR glue on the market; hot-melt glue can also be used for fixation. The electrostatic dust removal device fixed with hot-melt glue has limited application fields and cannot be used in environments with large temperature differences throughout the year or large temperature differences between morning and evening. The hot-melt glue is easy to soften at high temperatures and crack at low temperatures. After the glue is applied and cured on one side of the mold core, it is flipped and corrected with a right-angle tooling to prevent deviation. After the right-angle tooling correction, glue is applied and fixed to the other side of the mold core along the fixing position 204. Generally, using gravity, glue is applied and fixed above the mold core.

[0082] In addition, please refer to Figure 7 , a groove 208 facing the avoidance port 205 is provided inside the fixing position 204. The groove 208 increases the contact area between the fixing position 204 and the colloid, enabling vertical glue application. The vertical glue application can be carried out on two surfaces simultaneously, with a faster production speed; the design of the groove 208 allows more glue to soak into the groove 208 during vertical glue application, and a combination of the colloid and the dust collection plate can be formed in the groove 208, with a larger contact area and better firmness.

[0083] For the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 3 and Figure 8 , in step S300, install a rigid insulating member along the fixing position 204 reserved on the dust collecting plate 200, that is, the rigid insulating member serves as the fixing and isolating member 300, and a dust collecting plate slot 301 for accommodating the dust collecting plate 200 is opened on the rigid insulating member.

[0084] It should be noted that at the contact between the rigid insulator and the dust collecting plate 200, the width of the rigid insulator increases along the length direction of the dust collecting plate 200. At the same time, the dust collecting plate slot 301 is opened on the rigid insulator to better clamp the dust collecting plate 200, increase the fixed contact area with the dust collecting plate 200, and ensure the stability of the distance between the dust collecting plates 200.

[0085] In addition, a rigid insulator can be installed on one side of the model, and insulating glue can be poured on the other side of the model. In some other embodiments, after the rigid insulator clamps the dust collecting plate 200, insulating glue can also be poured for fixation to increase stability.

[0086] Specifically, the dust collecting plate slot 301 is set as a closing structure (that is, the size of the opening part of the dust collecting plate slot 301 is smaller than its internal size), and a prestress is preset after clamping the 200 dust collecting plates to increase the fixing strength. In addition, the dust collecting plate slot 301 is set as an anti-slip structure (that is, the inner wall of the dust collecting plate slot 301 is not a smooth surface, and anti-slip protrusions or anti-slip teeth are provided on its inner wall). After the dust collecting plate 200 is clamped in, it is not easy to loosen. At the same time, the anti-slip structure can reduce the usage amount of insulating glue as much as possible. It should be noted that the dust collecting plate slot 301 does not need to be entirely set as an anti-slip structure and can be set at intervals, that is, part of the dust collecting plate slots 301 are anti-slip structures.

[0087] For the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 3 , in step S300, remove the rod-shaped component and extract the spacer from the end of the mold core.

[0088] It should be noted that the rod-shaped component can be a metal component or a non-metal component and needs to have good rigidity. The rod-shaped component and the process hole 800 need to have a very good matching property. The diameter of the rod-shaped component is smaller than the diameter of the process hole 800, and the gap is 0.5 ± 0.1 mm to ensure the structural shape of the mold core.

[0089] Meanwhile, the width of the spacer is smaller than that of the dust collecting plate 200, and the length of the spacer is longer than that of the dust collecting plate 200, which facilitates disassembly. The spacers are exactly the same in size and can be set to different thicknesses to meet the design requirements of the dust collecting plate gap. Generally, when the insulating glue is used as the fixed spacer 300, the dust collecting plate gap is 0.5 - 3 mm. When the rigid insulating part is used as the fixed spacer 300, or when the rigid insulating part is combined with the insulating glue, the dust collecting plate gap can be larger.

[0090] For the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 6 , in step S500, a conductor 500 is installed at the end of the die core, and the end of the die core is insulated with insulating glue to form an insulating glue layer 400. Specifically:

[0091] When the process holes 800 are provided at both ends of the dust collecting plate 200, an insulating gap 207 is provided between the process holes 800 and the conductive layer 203 to form a safety distance, and the production process is cumbersome. To maintain the stability of the die core, after removing the spacer, the rod-shaped component is inserted into the die core again along the process hole 800. At this time, a stable structure body is formed by the rod-shaped component and the fixed spacer 300, and the model will not displace or loosen. A conductor 500 is installed in the power connection port 206 at the end of the dust collecting plate 200, and the two ends of the die core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue is cured, the rod-shaped component is removed.

[0092] It should be noted that after assembly, the insulating glue layer 400 directly seals the process holes 800 and the power connection port 206. However, after the rod-shaped component is removed, part of the process holes 800 are in an exposed state. During the operation of the electrostatic dust removal device, the exposed part of the process holes 800 is likely to form a purification blind area.

[0093] Specifically, the power connection port 206 adopts a closed-end structure, and the conductor 500 is inserted into the power connection port 206 to realize power connection. The closed-end structure of the power connection port 206 forms an inward acting force on the conductor 500, making the conductor 500 fit better with the conductive layer 203.

[0094] Preferably, please refer to Figure 6, the power connection port 206 with a closed-end structure includes an open end and a closed end. There is a protruding end between the open end and the closed end. The conductor 500 enters the power connection port 206 from the open end. For the power connection port 206 with a closed-end structure, the upper base of the isosceles trapezoid serves as the open end, the lower base of the isosceles trapezoid serves as the closed end, and the waist of the isosceles trapezoid serves as the protruding end. An inward acting force is formed on the conductor 500 by the protruding end to realize the clamping connection between the power connection port 206 and the conductor 500. The included angle between the protruding end and the horizontal direction is 10 - 25°. When this included angle is less than 10°, it is relatively easy to clamp the power connection port 206 and the conductor 500, but the firmness after clamping is poor. When this included angle is greater than 25°, it is relatively difficult to clamp the power connection port 206 and the conductor 500, but the firmness after clamping is good. When this included angle is 15°, it is relatively easy to clamp the power connection port 206 and the conductor 500, and the firmness after clamping is good. In addition, an arc matching the conductor 500 can be provided at the protruding end, so that after the conductor 500 is snapped into the power connection port 206, a part of the conductor 500 falls into the arc, and the clamping is tighter.

[0095] In some other embodiments, the cross-section of the power connection port 206 with a closed-end structure is arc-shaped, and the contact area between the arc shape and the conductor 500 is increased, and the power connection stability is better. Preferably, the arc shape is a major arc. The diameter of the conductor 500 matches the arc shape, and the gap is 0.2 - 1 mm. When the gap < 0.2 mm, the gap between the conductor 500 and the arc shape is too small, it is not easy to clamp, and the production and processing process requirements are too high. When the gap > 1 mm, the gap between the conductor 500 and the arc shape is too large, and it will become loose after clamping, and the power connection stability is not good.

[0096] In the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 5 and Figure 9 , in step S500, the conductor 500 is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue to form an insulating glue layer 400. Specifically:

[0097] When a process hole 800 is provided at one end of the dust collecting plate 200, the distance between the process hole 800 and the end of the dust collecting plate 200 is 2 - 5 mm. The process hole 800 also serves as a power connection port. At this time, there is no need to set an insulating gap between the process hole 800 and the conductive layer 203, reducing the processing difficulty. The rod-shaped component serves as the conductor 500. After removing the spacer, the rod-shaped component is inserted into the mold core again through the process hole 800. At this time, a stable structure body is formed by the rod-shaped component and the fixed spacer 300, and the model will not have phenomena such as displacement and loosening. The two ends of the mold core are sequentially placed into a glue injection container filled with insulating glue. The insulating glue directly seals the process hole 800 after curing, and there is no need to remove the rod-shaped component again, simplifying the production process.

[0098] It should be noted that there is a rod-shaped component serving as the conductor 500 in the process hole 800. After assembly, the insulating glue layer 400 directly seals the process hole 800 and the power connection port 206, that is, the process hole 800 and the power connection port 206 are covered, solving the problem of purification blind spots.

[0099] Specifically, the distance between the edge of the conductive layer 203 and the fixing position 204 and the avoidance port 205 is equal. According to the shapes of the fixing position 204 and the avoidance port 205, the shape of the edge of the conductive layer 203 is designed to maximize the proportion of the conductive layer 203 while not affecting electrical safety, which helps to increase the area for the electrostatic precipitator to capture particulate matter, increase the acting time on particulate matter, improve the purification efficiency of particulate matter, and correspondingly increase the dust capacity of the electrostatic precipitator. Please refer to Figure 12 , both the fixed reserved port 204 and the avoidance port 205 are semi-circular openings. Therefore, the edge of the conductive layer 203 is similar to a wavy shape. Please refer to Figure 9 , the avoidance port 205 is a groove-shaped opening. Therefore, the edge of the conductive layer 203 is similar to a rectangular tooth shape.

[0100] In order to verify whether the conductive layer 203 with different shapes has an impact on the purification efficiency of the electrostatic precipitator, the inventor conducted the following experiment. Electrostatic precipitators with a length of 500 mm, a width of 400 mm, and a thickness of 50.8 mm were compared. Under the same conditions of the ionization device and ionization voltage at the front end and in the same environment, the PM2.5 purification efficiency of the electrostatic precipitator was compared at two wind speeds. The experimental data are shown in Table 2.

[0101] Table 2:

[0102]

[0103]

[0104] It can be concluded from Table 2 that: the conductive layer 203 with a waveform (please refer to Figure 12 ) has the largest proportion, and its PM2.5 purification efficiency is the highest at both wind speeds; the conductive layer 203 with a square shape (please refer to Figure 9 ) has a proportion second only to the waveform, and its PM2.5 purification efficiency is also relatively high; at a high wind speed of 4 m / s, the ordinary (please refer to Figure 6 ) conductive layer 203 has the smallest proportion, and the gap between its efficiency and that of the waveform and square shapes is the largest and most obvious. Therefore, increasing the proportion of the conductive layer 203 is beneficial to ensuring the PM2.5 purification efficiency of the electrostatic precipitator, and the increase in efficiency will correspondingly increase the dust capacity of the electrostatic precipitator.

[0105] In the production process of the electrostatic precipitator in this embodiment, please refer to Figures 1 to 5 and Figure 9, in step S500, a conductor 500 is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue to form an insulating glue layer 400. Specifically:

[0106] When a process hole 800 is provided at one end of the dust collecting plate 200, the distance between the process hole 800 and the end of the dust collecting plate 200 is 2 - 5 mm. The process hole 800 also serves as an electrical connection port. At this time, there is no need to set an insulating gap between the process hole 800 and the conductive layer 203, which reduces the processing difficulty. After removing the spacer, the rod-shaped component is inserted into the mold core again along the process hole 800. At the same time, the rod-shaped component guides the conductor 500 into the process hole 800. The two ends of the mold core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, it directly seals the process hole 800.

[0107] It should be noted that there is a conductor 500 inside the process hole 800. After assembly, the insulating glue layer 400 directly seals the process hole 800 and the electrical connection port 206, that is, the process hole 800 and the electrical connection port 206 are covered, solving the problem of the purification blind area.

[0108] Specifically, an isolation paper or an insulating thin layer is laid in the glue injection container.

[0109] During production, the end of the mold core with the conductor 500 is placed into the glue injection container. The conductor 500 is tightened and cannot be loose. Then, insulating glue such as epoxy resin glue or silicone glue is slowly poured in. It is also possible to first pour in the insulating glue and then slowly place the end of the mold core according to the amount of insulating glue used for each mold core. After the insulating glue at the end of the mold core cures, the other end of the mold core is cured in the same way.

[0110] It should be noted that before curing, the height of the insulating glue should be 3 - 5 mm higher than the conductor. After curing, the height of the insulating glue layer 400 should be 2 - 4 mm higher than the conductor. Different insulating glues have different shrinkage rates. Considering the insulation requirements, the appropriate height is controlled. At the same time, the grounding dust collecting plate and the high-voltage dust collecting plate are arranged in a staggered manner, resulting in a gap between their ends. The insulating glue layer 400 does not cover or only partially covers the gap.

[0111] In the production process of the electrostatic dust removal device in this embodiment, please refer to Figures 1 to 4 , the insulated mold core is placed into the frame 700. At the same time, the conductor 500 is electrically connected to the frame 700 through a wire 600. In addition, a high-voltage power supply is provided inside or outside the frame 700. That is to say, the high-voltage power supply can be built-in or external.

[0112] The present invention has been described in detail above. The above is only the preferred embodiment of the present invention and cannot limit the scope of the present invention. That is, all equivalent changes and modifications made in accordance with the scope of this application should still fall within the scope covered by the present invention.

Claims

1. A production process of an electrostatic dust removal device, characterized in that, It includes the following steps: S100: Alternately place the dust collecting plates and spacers in sequence, and use rod-shaped components to penetrate the process holes on the dust collecting plates and the spacers in sequence to form a mold core; S300: Install a fixed spacer along the reserved fixing positions on the dust collecting plates, remove the rod-shaped components, extract the spacers from the end of the mold core, and remove the spacers; S500: When process holes are provided at both ends of the dust collecting plate, there is an insulating gap between the process holes and the conductive layer. After removing the spacers, insert the rod-shaped components into the mold core again along the process holes, install a conductor in the power connection port at the end of the dust collecting plate, and perform insulation treatment on the end of the mold core with insulating glue. After the insulating glue cures, remove the rod-shaped components; When a process hole is provided at one end of the dust collecting plate, the process hole serves as a power connection port, and there is no need to set an insulating gap between the process hole and the conductive layer. The rod-shaped component serves as a conductor. After removing the spacer, insert the rod-shaped component into the mold core again along the process hole, and perform insulation treatment on the end of the mold core with insulating glue. After the insulating glue cures, directly seal the process hole without removing the rod-shaped component again.

2. The production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S100, the placement order of the dust collecting plate and the spacer can be adjusted. The dust collecting plate includes a grounded dust collecting plate and a high-voltage dust collecting plate that are alternately stacked, and the grounded dust collecting plate and the high-voltage dust collecting plate are staggered by 180°, and their structures are the same.

3. The production process of an electrostatic dust removal device according to claim 1, characterized in that, The interior of the dust collecting plate is an insulating layer, semiconductor layers are provided on both sides of the insulating layer, and a conductive layer is provided between the insulating layer and the semiconductor layer.

4. The production process of an electrostatic dust removal device according to claim 3, characterized in that, The manufacturing method of the dust collecting plate is as follows: Print conductive layers symmetrically on both sides of the insulating layer. After the conductive layers are dried, apply an adhesive layer. Post or bond semiconductor layers on the adhesive layer. After turning it over, post or bond semiconductor layers on the other conductive layer in the same way. Cut or punch out the dust collecting plate that meets the design size requirements on the equipment.

5. A production process of an electrostatic dust removal device according to claim 3, characterized in that, The thickness of the semiconductor layer of the dust collecting plate of the dust collection layer is less than that of the dust collecting plate of the non-dust collection layer.

6. The production process of an electrostatic precipitator device according to claim 1, characterized in that The interior of the dust collecting plate is a conductive layer, and semiconductor layers are provided on both sides of the conductive layer.

7. A production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S100, insulating plates are provided on both sides of the mold core. Use rod-shaped components to penetrate the process holes on the insulating plates, the dust collecting plates, and the spacers in sequence, and tighten them on the outside of the insulating plates to form a mold core.

8. The production process of an electrostatic dust removal device according to claim 1, characterized in that In step S300, pour insulating glue along the reserved fixing positions on the dust collecting plates, and the fixing positions are arranged at the edges of the dust collecting plates.

9. The production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S300, install rigid insulating parts along the reserved fixing positions on the dust collecting plates, and dust collecting plate slots for accommodating the dust collecting plates are provided on the rigid insulating parts.

10. A production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S500, install a conductor at the end of the mold core, and perform insulation treatment on the end of the mold core with insulating glue. Specifically: When process holes are provided at both ends of the dust collecting plate, insert the rod-shaped components into the process holes again, install a conductor in the power connection port at the end of the dust collecting plate, and place the two ends of the mold core into a glue injection container in sequence. The glue injection container is filled with insulating glue. After the insulating glue cures, remove the rod-shaped components.

11. A production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S500, a conductor is installed at the end of the core, and the end of the core is insulated with insulating glue. Specifically: When the process hole is provided at one end of the dust collecting plate, the rod-shaped member serves as a conductor. The rod-shaped member is inserted into the process hole again, and the two ends of the core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, the process hole is directly sealed.

12. The production process of an electrostatic dust removal device according to claim 1, characterized in that, In step S500, a conductor is installed at the end of the core, and the end of the core is insulated with insulating glue. Specifically: When the process hole is provided at one end of the dust collecting plate, the rod-shaped member guides the conductor to penetrate into the process hole. The two ends of the core are sequentially placed into a glue injection container filled with insulating glue. After the insulating glue cures, the process hole is directly sealed.

13. A production process of an electrostatic dust removal device according to any one of claims 10 to 12, characterized in that, A release paper or an insulating thin layer is laid in the glue injection container.

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