Liquid spraying device, control method thereof, substrate processing device, and article manufacturing method

Abstract

The present application provides a liquid ejecting device, a control method thereof, a substrate processing device, and an article manufacturing method, and provides a technology that is advantageous in reducing liquid consumption when a surface provided with a liquid ejection port is cleaned. The liquid ejecting device includes: an ejection head having a surface provided with a liquid ejection port, a storage portion for storing liquid, and a flow path that communicates from the ejection port to the storage portion; a control portion that controls the pressure in the storage portion; and a cleaning portion that performs cleaning processing of the surface by moving a suction port along the surface while sucking liquid adhering to the surface from the suction port, wherein the control portion controls the pressure in the storage portion based on a first force acting on the liquid in the flow path due to the suction force of the suction port during the cleaning processing so as to maintain the position of a liquid surface formed in the flow path in the flow path.

Description

Technical Field

[0001] This invention relates to a liquid spraying device, its control method, a substrate processing device, and a method for manufacturing articles. Background Technology

[0002] In recent years, inkjet printers have been used to apply materials to substrates to form patterns when manufacturing various functional components. Patterning using inkjet printers has advantages such as high material utilization efficiency due to on-demand patterning, non-vacuum process and relatively small manufacturing equipment, and the ability to coat large areas at high speed.

[0003] In the aforementioned inkjet apparatus, during dot pattern formation and standby periods, defects such as poor inkjet output and incorrect color formation sometimes occur due to foreign matter or droplets adhering near the ink (liquid) ejection port, or air bubbles flowing in from the ejection port. To resolve these defects, Patent Document 1 discloses a technique in which a suction nozzle (suction port) moves along the ejection port surface while separated from it, thereby suctioning away the ink remaining on the ejection port surface and cleaning it.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2020-110802 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In the cleaning of the nozzle surface described in Patent Document 1, ink inside the nozzle may also be drawn into the suction nozzle along with ink remaining on the nozzle surface. In this case, the ink consumption during cleaning may increase.

[0009] Therefore, the object of the present invention is to provide a technique that helps reduce the amount of liquid consumed when cleaning a surface provided with a liquid spray nozzle.

[0010] Methods for solving problems

[0011] To achieve the above objectives, a liquid spraying device according to one aspect of the present invention is characterized in that the liquid spraying device comprises: a spray head having a surface having a spray outlet for spraying liquid, a storage portion for storing liquid, and a flow path communicating from the spray outlet to the storage portion; a control unit for controlling the pressure within the storage portion; and a cleaning unit for cleaning the surface by drawing liquid adhering to the surface from the suction port while moving the suction port along the surface, wherein the control unit controls the pressure within the storage portion during the cleaning process based on a first force acting on the liquid within the flow path due to the suction force of the suction port, so as to maintain the position of the liquid surface formed within the flow path within the flow path.

[0012] To achieve the above objectives, a spraying method according to one aspect of the present invention is a control method for a spraying device, characterized in that the spraying device comprises: a spray head having a surface having a spray outlet for spraying liquid, a storage section for storing liquid, and a flow path communicating from the spray outlet to the storage section; and a cleaning section that performs cleaning treatment on the surface by drawing liquid adhering to the surface from the suction port while moving the suction port along the surface, wherein the pressure in the storage section is controlled based on a first force acting on the liquid in the flow path due to the suction force of the suction port, so as to maintain the position of the liquid surface formed in the flow path within the flow path.

[0013] The effects of the invention

[0014] According to the present invention, for example, it is possible to provide a technique that helps reduce the amount of liquid consumed when cleaning a surface provided with a liquid spray nozzle.

[0015] Further objects and other aspects of the present invention will become clear from the preferred embodiments described below with reference to the accompanying drawings. Attached Figure Description

[0016] Figure 1 This is a diagram showing an example of the structure of an inkjet device (ejection process).

[0017] Figure 2 This is a diagram showing an example of the structure of an inkjet device (cleaning process).

[0018] Figure 3 This is a diagram showing an example of the structure of a nozzle.

[0019] Figure 4 This diagram shows a portion of the nozzle and a portion of the suction nozzle in a cleaning process.

[0020] Figure 5 This is a diagram showing the cleaning process being carried out on the nozzle's spray surface.

[0021] Figure 6 It is a flowchart showing the sequence of operations of the inkjet device.

[0022] Figure 7 This is a schematic diagram illustrating an example of material coating for a functional component. Detailed Implementation

[0023] The embodiments will now be described in detail with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the technical solutions described in the claims. Although multiple features are described in the embodiments, not all of these features are essential to the present invention, and the multiple features can be combined arbitrarily. In addition, in the drawings, the same or identical structures are labeled with the same reference numerals, and repeated descriptions are omitted.

[0024] Reference Figures 1-2 The structure and operating principle of an inkjet device 1 (substrate processing device) according to one embodiment of the present invention will be described. Figures 1-2 This is a diagram showing an example of the structure of an inkjet apparatus 1, which is a substrate processing apparatus for processing display panels and semiconductor substrates. Figure 1 This shows the ink ejection process taking place on substrate 2. Figure 2 This shows the cleaning process being performed on the spray surface 20 of the spray head 5. As shown in the instruction manual and accompanying drawings... Figures 1-2 As shown, the orientation is illustrated in the XYZ coordinate system, where the plane parallel to the surface of the mounting substrate 2 is designated as the XY plane. Additionally, the pressure used in the following description can be gauge pressure.

[0025] The inkjet apparatus 1 of this embodiment is an apparatus for forming patterns or films by applying a material of functional elements onto a substrate. The inkjet apparatus 1 includes a substrate stage 3 that holds and moves a substrate 2, such as a display panel. The substrate 2 can be appropriately selected from glass substrates or plastic substrates, depending on the product to be manufactured. The substrate 2 is typically a plate-shaped component, but it is not limited to a specific shape as long as it functions as a substrate. For example, the substrate 2 can be a deformable film or a circular substrate. The substrate 2 on the substrate stage 3 has a pixel region 201 and an evaluation region 202. The pixel region 201 is used to supply (apply) ink to arrange and form a large number of display pixels, and the evaluation region 202 is used to experimentally eject ink to evaluate the state of the ink. Furthermore, in this specification, "ink" refers to a liquid used to form patterns or films on the substrate 2. In this specification, the composition of the ink is not particularly limited, but for example, a liquid containing solute and solvent used to form organic films can be used.

[0026] The inkjet apparatus 1 includes: a printhead 5 capable of ejecting ink droplets 4 onto a substrate 2; an ink supply system 6 supplying ink from an ink cartridge 7 to the printhead 5; and a pressure control unit 12 (control unit) for controlling the internal pressure of the printhead 5. The ink cartridge 7 is a container for storing ink and can be installed inside or outside the inkjet apparatus 1. Furthermore, the inkjet apparatus 1 includes: a main control unit 11 for controlling patterning on the substrate 2; and a cleaning unit 8 for cleaning the printhead 5 to restore its ejection characteristics. It can also be understood that the printhead 5, the pressure control unit 12, and the cleaning unit 8 constitute an inkjet device for ejecting ink (liquid).

[0027] Here, when the substrate 2 is mounted on the substrate stage 3, placement errors may occur. Furthermore, since the substrate 2 undergoes various manufacturing processes, shape deformation may occur along the XY direction. Therefore, the inkjet apparatus 1 can include an alignment oscilloscope 9 for measuring the position and deformation of the substrate 2. To perform alignment measurements on the entire surface of the substrate 2, the alignment oscilloscope 9 and the substrate stage 3 are driven in the XY direction. Additionally, the substrate 2 mounted on the substrate stage 3 has thickness variations. Therefore, when ink is ejected from the printhead 5 while scanning the substrate stage 3 in the Y direction, the thickness variations of the substrate 2 may cause deviations in the landing position (attachment position) of ink droplets on the substrate 2. Therefore, the inkjet apparatus 1 can also include a height sensor 10 for measuring the position (height) of the substrate 2 in the Z direction. To measure the height of the entire surface of the substrate 2, the height sensor 10 and the substrate stage 3 are driven relative to each other in the XY direction. That is, the height sensor 10 and / or the substrate stage 3 are driven in the XY direction. Additionally, the oscilloscope 9 for adjustment and the height sensor 10 are only used in... Figure 1 As shown in, Figure 2 The illustration is omitted in the text.

[0028] The main control unit 11 controls the various parts of the inkjet device 1 and is collectively patterned on the substrate 2. The main control unit 11 can be configured as a computer having a processor such as a CPU (Central Processing Unit) and a storage unit such as memory. For example, the main control unit 11 can be configured as a PLD (Programmable Logic Device) such as a Field Programmable Gate Array (FPGA), or an ASIC (Application Specific Integrated Circuit), or a general-purpose computer with embedded programs, or a combination of all or some of them.

[0029] Next, the structure of the ejector head 5 (ejection section) will be described. Figures 1-2 The diagram shows a structural example of an inkjet apparatus 1 equipped with one printhead 5, but multiple printheads 5 may also be arranged in the X and Y directions respectively. In the inkjet apparatus 1, by individually controlling the ejection of ink droplets from each of the multiple printheads 5, ink with a desired distribution can be supplied (coated) to the pixel region 201 on the substrate 2. Figure 3 This represents a structural example of one ejector head 5. Figure 3 yes Figures 1-2 An enlarged view of the printhead 5. The printhead 5 includes: at least one printout 5a (printout hole) for ejecting ink; a storage section 5b for storing ink supplied from the ink cartridge 7 via the ink supply system 6; and a flow path 5c communicating from the printout 5a to the storage section 5b. In this embodiment, a plurality of printouts 5a are provided on the surface 20 facing the substrate 2. Hereinafter, the surface 20 facing the substrate 2 will sometimes be referred to as the "ejection surface 20".

[0030] A single ink ejection nozzle 19 (ejection element) is formed by a single ejection outlet 5a and a flow path 5c connected thereto. That is, the ejector head 5 of this embodiment has multiple ejection nozzles 19. Each ejection nozzle 19 has a piezoelectric element (ejection energy generating element, piezoelectric actuator) in the flow path 5c. By causing the piezoelectric element to operate according to a drive signal supplied from the main control unit 11, ink droplets 4 can be ejected from the ejection outlet 5a. In this embodiment, multiple nozzles 19 (ejection outlet 5a, flow path 5c) are provided for a single storage unit 5b.

[0031] Furthermore, the pressure control unit 12 controls the position and shape of the ink surface formed inside the flow path 5c. The pressure control unit 12 can be, for example, a pump that transports ink between the ink cartridge 7 and the storage section 5b of the print head 5. The pressure control unit 12 controls the pressure of the ink inside the storage section 5b of the print head 5 to maintain the position of the ink surface in each nozzle 19 within the flow path 5c, and the shape of this surface becomes a curved shape. For example, under normal conditions, the pressure control unit 12 controls the pressure inside the storage section 5b of the print head 5 to a pressure lower than the external pressure (atmospheric pressure) (negative pressure) to maintain a balance between the external pressure (atmospheric pressure) and gravity relative to the nozzle 5a. As an example, under normal conditions, the pressure control unit 12 can control the pressure in the storage section 5b to a pressure 0.3 to 0.5 kPa lower than atmospheric pressure (negative pressure) so that the ink surface forms a curved shape at the lower end of the flow path 5c. Through this negative pressure control, the ink in the flow path 5c forms a curved surface at the lower end (lowest end) of the flow path 5c, near the nozzle 5a, making it suitable for ejection. As a result, ink leakage from the nozzle 5a at undesirable times can be suppressed. Furthermore, the "normal state" refers to the state before the cleaning process described later has been performed; for example, it could be the state where ink is being ejected onto the substrate 2.

[0032] On the other hand, during ink ejection or standby, foreign objects or droplets may adhere to the vicinity of the nozzle 5a, or air bubbles may flow into the interior of the printhead 5 from the nozzle 5a, resulting in poor ejection or incorrect color. In this case, the pressure control unit 12 controls the pressure inside the storage compartment 5b of the printhead 5 to be higher than the external pressure (atmospheric pressure). For example, the pressure control unit 12 can control the pressure inside the storage compartment 5b to be 5 to 50 kPa higher than atmospheric pressure (positive pressure). Through such positive pressure control, foreign objects or air bubbles can be discharged from the nozzle 5a along with the ink to the outside of the printhead 5 (pressurized discharge process).

[0033] Incidentally, when performing the aforementioned pressurization and discharge process, if... Figure 2As shown, residual ink 16 discharged from each nozzle 5a sometimes adheres to the ejection surface 20. Even after ink has been ejected from each nozzle 5a onto the substrate 2, residual ink 16 may still adhere to the ejection surface 20. Therefore, the inkjet apparatus 1 (inkjet device) of this embodiment includes a cleaning unit 8 (recovery unit) for cleaning the printhead 5 (ejection surface 20). The cleaning process can be performed under the control of the main control unit 11 with the cleaning unit 8 positioned below the printhead 5. At this time, the substrate stage 3 can be positioned in a position retracted from below the printhead 5. Furthermore, while the inkjet apparatus 1 of this embodiment is configured to drive the cleaning unit 8 below the printhead 5, it could also have a structure where the printhead 5 is driven above the cleaning unit 8.

[0034] like Figure 2 As shown, the cleaning unit 8 may include: a suction nozzle 13 having a suction port 13a (suction hole); an XY drive mechanism 15 for driving the suction nozzle 13 in the XY direction (horizontal direction); and a Z drive mechanism 21 for driving the suction nozzle 13 in the Z direction (vertical direction). The suction nozzle 13 is configured such that the suction port 13a partially faces the ejection surface 20 of the ejection head 5. In this embodiment, the suction port 13a is provided on the upper surface 23 of the suction nozzle 13, which will sometimes be referred to as the "suction surface 23" below.

[0035] Additionally, the cleaning unit 8 may include: a flow control unit 14 for controlling the suction flow rate Q from the suction port 13a; a drive control unit 24 for controlling the drive of the suction nozzle 13; and a measurement unit 22 for measuring the distance L between the suction nozzle 13 (suction port 13a) and the ejection surface 20 of the nozzle head 5. The suction flow rate Q from the suction port 13a can also be understood as the suction force generated by the suction nozzle 13 (suction port 13a), and in the following text, it may sometimes be referred to as "suction flow rate Q". The drive control unit 24 may include the functions of a speed control unit for controlling the drive speed V of the suction nozzle 13 driven by the XY drive mechanism 15, and a height control unit for controlling the height of the suction nozzle 13 formed by the Z drive mechanism 21. The drive control unit 24 may also be part of the main control unit 11. For example, the measuring unit 22 detects the height position of the ejection surface 20 of the ejection head 5, and based on the detection result, measures the distance L between the suction nozzle 13 and the ejection surface 20 according to known information indicating the positional relationship between the measuring unit 22 and the suction port 13a (suction surface 23).

[0036] In the cleaning process, the cleaning unit 8, configured as described above, generates suction at the suction nozzle 13 (suction port 13a) while moving the suction nozzle 13 along the ejection surface 20 in a state where the suction nozzle 13 is separated from the ejection surface 20 of the ejector head 5. The suction flow rate Q, drive speed V, and interval L in the cleaning process are controlled to preset target values. For example, the target value of the suction flow rate Q can be set to 8 L / min or more, the target value of the drive speed V can be set to 20 mm / s or less, and the target value of the interval L can be set to 0.5 mm or less. Through such a cleaning process, residual ink 16 adhering to the ejection surface 20 of the ejector head 5 can be drawn in from the suction port 13a of the suction nozzle 13. That is, the residual ink 16 adhering to the ejection surface 20 of the ejector head 5 can be reduced (removed), and ejection abnormalities of the ejector head 5 can be reduced.

[0037] Here, during the cleaning process described above, ink in the ejector head 5 (each ejector nozzle 19) may sometimes be drawn into the suction nozzle 13 (suction port 13a) along with residual ink 16 at the ejection surface 20 of the ejector head 5. In this case, since ink consumption during the cleaning process may increase, it is desirable to avoid ink being drawn into the ejector head 5 by the suction nozzle 13. Therefore, in this embodiment, the pressure control unit 12 controls the pressure in the storage unit 5b during the cleaning process based on the force of the suction of the suction nozzle 13 acting on the ink in the flow path 5c, so as to maintain the position of the liquid surface of the ink formed in the flow path 5c within the flow path 5c. As a result, during the cleaning process, ink can be prevented from being drawn into the ejector nozzle 19 by the suction nozzle 13, reducing ink consumption. Next, a control example for reducing ink consumption during the cleaning process will be described.

[0038] First, refer to Figure 4 The definitions of the forces P1, P2, and P3 acting on the ink (liquid surface) in each flow path 5c of the nozzle 5 during the cleaning process are explained. Figure 4 A portion of the spray head 5 and a portion of the suction nozzle 13 are shown in the cleaning process. Figure 4 In the diagram, arrows are used to schematically represent the forces P1 and P2 acting on the ink (liquid surface) within the flow path 5c. The direction of the arrows indicates the direction in which forces P1 and P2 act.

[0039] Force P1 (first force) is defined as the force exerted by the suction nozzle 13 (suction port 13a) on the ink (liquid surface) within the flow path 5 to draw it out from the nozzle 5a (hereinafter sometimes referred to as suction force). The suction force (force P1) can be calculated based on the suction flow rate Q (attraction force) controlled by the flow control unit 14, the drive speed V controlled by the drive control unit 24, and the interval L measured by the measurement unit 22. For example, information (calculation formulas, etc.) representing the relationship between the suction force (force P1) and the suction flow rate Q, drive speed V, and interval L can be generated in advance through experiments, simulations, etc., and stored in the pressure control unit 12. The pressure control unit 12 can calculate the suction force (force P1) based on this information, according to the suction flow rate Q (attraction force), drive speed V, and interval L.

[0040] Force P2 (the second force) is defined as the force that pulls the ink (liquid surface) in the flow path 5c toward the storage section 5b (storage section side) (hereinafter sometimes referred to as the pulling force). In other words, force P2 is defined as the force acting on the ink (liquid surface) in the flow path 5c toward the storage section 5b (+Z direction). In this embodiment, the pressure control unit 12 controls the pressure in the storage section 5b to increase the pulling force (force P2) compared to the normal state in order to ensure balance with the suction force P1 in the opposing state (second state) where the suction nozzle 13 and the nozzle outlet 5a are facing each other. The pulling force (force P2) can be determined based on the suction force (force P1) using a pre-set calculation formula. In addition, the normal state refers to the non-opposing state (first state) where the suction nozzle 13 (suction outlet 13a) is not facing the nozzle outlet 5a, and may also include, for example, the state before cleaning treatment, as described above.

[0041] Force P3 is defined as the limit (threshold) of the pull force (force P2) that causes bubbles to flow into the storage section 5b through the nozzle 5a and flow path 5c. For example, if the pull force (force P2) is excessively increased by the pressure control unit 12 in the opposite direction, the ink level will exceed the upper end (topmost end) of the flow path 5c, and bubbles may flow into the storage section 5b through the nozzle 5a and flow path 5c. Force P3 is defined as the threshold of the pull force (force P2) that causes such bubble inflow, and can be preset through experiments, simulations, etc.

[0042] The pressure control sequence of the pressure control unit 12 during cleaning will now be explained using the aforementioned forces P1, P2, and P3. Figure 5 This diagram illustrates the cleaning process performed on the ejection surface 20 using the suction nozzle 13. Here, in this embodiment, the aforementioned pressurized discharge process can be performed prior to the cleaning process. The pressurized discharge process can also be understood as part of the cleaning process.

[0043] First, the pressure control sequence in the pressurized discharge process will be explained. During the pressurized discharge process, the pressure control unit 12 controls the pressure within the storage section 5b of the ejector head 5 to a pressure higher than the external pressure (atmospheric pressure) (positive pressure), and ejects ink from each ejector nozzle 19. When the pressurized discharge process is complete, the pressure control unit 12 controls the pressure within the storage section 5b to a pressure lower than the external pressure, in order to maintain equilibrium relative to the sum of the external pressure (atmospheric pressure) and gravity, and to form a meniscus in each ejector nozzle 19 (flow path 5c). At this time, the pressure control unit 12 controls the pressure within the storage section 5b so that the ink pull-in force (force P2) in each ejector nozzle 19 is below a threshold (force P3), i.e., |P2| < |P3|. Through this control, continuous leakage of ink from each ejector nozzle 19 (each ejector outlet 5a) and the flow of air bubbles into the storage section 5b via the ejector outlet 5a and flow path 5c can be prevented.

[0044] Next, the pressure control sequence in the cleaning process will be explained. The cleaning process involves moving the suction nozzle 13 (suction port 13a) relative to the ejection surface 20 while using the suction nozzle 13 to suction out residual ink 16 adhering to the ejection surface 20. Figure 5 In the cleaning process shown, an example is shown in which the suction nozzle 13 is moved relative to the ejection surface 20 in the +Y direction.

[0045] Figure 5 (a) shows the state where the ejector nozzle 19 (ejector outlet 5a) is not located in the ejector surface 20 and faces the suction nozzle 13 (suction outlet 13a), i.e., the normal state (first state) where the ejector nozzle 19 and the suction nozzle 13 do not face each other. At this time, the pressure control unit 12 controls the pressure in the storage section 5b of the ejector head 5 to be lower than the external pressure in order to maintain the balance with respect to the sum of the external pressure (atmospheric pressure) and gravity, and the ink liquid surface forms a meniscus near each ejector outlet 5a. At this time, the pressure control unit 12 controls the pressure in the storage section 5b to be negative so that the ink pull force (force P2) at the ejector nozzle 19 is below the threshold (force P3), i.e., |P2| < |P3|. With such control, it is possible to prevent ink from leaking from each ejector nozzle 19 (each ejector outlet 5a) and prevent air bubbles from flowing into the storage section 5b through the ejector outlet 5a and the flow path 5c.

[0046] Figure 5 (b) shows the state in which the ejector nozzle 19 (ejector outlet 5a) is located in the region of the ejector surface 20 facing the suction nozzle 13 (suction outlet 13a), i.e., the opposing state (second state) in which the ejector nozzle 19 and the suction nozzle 13 face each other. In this case, from the viewpoint of reducing ink consumption, it is necessary to... Figure 5In state (a) (first state), the pulling force (force P2) is increased to prevent ink from being sucked out of the ejection nozzle 19 by the suction force (force P1) of the suction nozzle 13. Therefore, the pressure control unit 12 controls the pressure in the storage unit 5b to be negative compared to the normal state based on the suction force (force P1) of the suction nozzle 13, so as to maintain the liquid level of ink in the ejection nozzle 19 (flow path 5c) within the ejection nozzle 19 (flow path 5c). At this time, the pressure control unit 12 controls the pressure in the storage unit 5b so that the pulling force (force P2) of ink in the ejection nozzle 19 is greater than or equal to the suction force (force P1) of the suction nozzle 13, that is, |P1|≤|P2|. With such control, it is possible to prevent ink in the ejection nozzle 19 from being sucked out by the suction nozzle 13 in the opposing state (first state), while cleaning of the ejection surface 20 is possible. That is, the amount of ink consumed during the cleaning process can be reduced.

[0047] Furthermore, the pressure control unit 12 controls the pressure within the storage unit 5b so that the ink pull force (force P2) in the nozzle 19 during the opposing states is below a threshold (force P3), i.e., |P2| < |P3|. This control prevents air bubbles from flowing into the storage unit 5b via the nozzle 5a and the flow path 5c. In other words, the pressure control unit 12 can control the pressure within the storage unit 5b so that |P1| ≤ |P2| < |P3| is satisfied during the opposing states.

[0048] Here, the pressure control unit 12 controls the pressure within the storage unit 5b so that the pull force (force P2) varies according to the relative position of each ejection nozzle 19 (ejection outlet 5a) and the suction nozzle 13 in the XY direction of the ejection head 5. For example, when the pressure control unit 12 determines that the relative position indicates a change from a normal state to an opposing state, it reduces the pressure within the storage unit 5b so that the pull force (force P2) increases at that moment. Similarly, when the pressure control unit 12 determines that the relative position indicates a change from an opposing state to a normal state, it increases the pressure within the storage unit 5b so that the pull force (force P2) decreases (restores) at that moment. Through such control, the ink level within the ejection nozzle 19 can be maintained within the flow path 5c in both the normal state and the opposing state.

[0049] Furthermore, when the gap L between the suction nozzle 13 and the ejection surface 20 changes during the cleaning process, the suction force (force P1) acting on the ink surface in the ejection nozzle 19 due to the suction force of the suction nozzle 13 may also change accordingly. Therefore, the cleaning unit 8 (drive control unit 24) controls the movement of the suction nozzle 13 (suction port 13a) based on the measurement results of the measuring unit 22, so as to maintain the gap L at a predetermined value (target value) during the cleaning process.

[0050] As described above, in this embodiment, the pressure control unit 12 controls the pressure in the storage unit 5b based on the suction force (force P1) during the cleaning process, so as to maintain the liquid level of the ink formed in the ejection nozzle 19 (flow path 5c) of the ejection head 5 within the flow path 5c. As a result, it is possible to prevent the ink in the ejection nozzle 19 from being sucked into the suction nozzle 13 during the cleaning process, thereby reducing ink consumption.

[0051] <Operating sequence of inkjet unit>

[0052] Below, refer to Figure 6 The operating sequence of the inkjet unit 1 is explained. In step S11, the main control unit 11 controls a substrate transport device (not shown) to transport the substrate 2 into the inkjet unit 1. In step S12, the main control unit 11 performs a recovery determination on each of the ejector nozzles 19 of the printhead 5. The recovery determination can be based on the results of checking the landing position of the droplets in each ejector nozzle 19, checking the residual signal waveform, etc. Checking the landing position refers to checking the landing position of the droplets ejected from each ejector nozzle 19 onto the substrate 2 (e.g., evaluation area 202). If there is an ejector nozzle 19 where the landing position of the droplets is different from the reference position, it can be determined that the ejector nozzle 19 has produced an ejection abnormality. In addition, checking the residual signal waveform refers to checking the waveform of the electrical signal corresponding to the deformation of each ejector nozzle 19 caused by the pressure wave generated after the ejector nozzle 19 is activated by providing a specific pulse signal to each ejector nozzle 19. If a nozzle 19 has a residual signal waveform that differs from the reference waveform, it can be determined that the nozzle 19 has experienced a discharge abnormality. If a nozzle 19 is determined to have a discharge abnormality in this recovery determination, the main control unit 11 performs nozzle recovery processing in step S13. As part of the nozzle recovery processing, the aforementioned pressurized discharge processing and cleaning processing can be performed.

[0053] In step S14, the main control unit 11 controls the substrate stage 3 and the alignment oscilloscope 9 to perform alignment measurements on the substrate 2. In step S15, the main control unit 11 controls the substrate stage 3 and the height sensor 10 to perform height measurements on the substrate 2. Alternatively, the order of the alignment measurement in step S14 and the height measurement in step S15 can be reversed. Information regarding the position, deformation, and height of the substrate 2 obtained through the alignment and height measurements is stored, for example, in a memory within the main control unit 11. Based on pixel data containing information such as pixel configuration and pixel size formed on the substrate, the main control unit 11 determines ejection control information. The ejection control information contains information indicating the target coating distribution of ink in the pixel region 201 and the evaluation region 202 on the substrate 2.

[0054] In step S16, the main control unit 11 performs a recovery determination on each nozzle 19 of the nozzle head 5. If there is a nozzle 19 that is determined to have a spraying abnormality in the recovery determination, in step S17, the main control unit 11 performs nozzle recovery processing on that nozzle 19. Steps S16 to S17 are the same procedures as steps S12 to S13 described above.

[0055] In step S18, the main control unit 11 synchronously drives the printhead 5 and the substrate stage 3, and controls the ejection of ink droplets (ejection processing) by the printhead 5 based on the target coating distribution. In order to form a large number of functional elements on the substrate 2 using the inkjet device 1, the coating area and the printhead 5 are scanned relative to each other to coat the material of the functional elements, and ink is applied to the coating area. Figure 7 A schematic diagram illustrating the coating of the material used to depict this functional element is shown. Figure 7 In the diagram, substrate surface 101 is the surface of substrate 2 on which the functional element 102 is formed. Arrows 103, 104, 105, and 106 indicate the scanning direction. Because... Figure 7 This is a schematic diagram, so only 7×5 functional elements 102 are shown, but in reality, a great many functional elements can be formed.

[0056] In step S19, the main control unit 11 determines whether the spraying of the target coating distribution is complete based on the spraying control information. If the spraying is not complete, the process returns to step S16; if the spraying is complete, the process proceeds to step S20. In step S20, the main control unit 11 controls a substrate transport device (not shown) to remove the substrate 2 from the inkjet device 1.

[0057] Here, although the substrate stage 3 is driven in this embodiment, it is not limited to this. The substrate stage 3 may also be fixed and the ejector head 5, the adjustment oscilloscope 9, etc., may be driven in the XY plane. Alternatively, the substrate stage 3, the ejector head 5, the adjustment oscilloscope 9, etc., may be driven relative to each other.

[0058] <Implementation Method of Item Manufacturing>

[0059] The article manufacturing method in the embodiments of the present invention is suitable for manufacturing articles such as panels for displays like organic EL, microdevices such as semiconductor devices, and components with fine structures. The article manufacturing method of this embodiment includes: a step of forming an ejected liquid film by spraying liquid onto a substrate using the aforementioned inkjet apparatus; a step of drying the substrate with the ejected liquid film and processing it to form a dried film; and a step of manufacturing an article from the processed substrate. Furthermore, this article manufacturing method includes other well-known steps (firing, cooling, cleaning, oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, encapsulation, etc.). Compared to conventional methods, the article manufacturing method of this embodiment is advantageous in at least one aspect of article performance, quality, productivity, and production cost.

[0060] This invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the concept and scope of this invention. Therefore, claims are appended to illustrate the scope of this invention.

[0061] Explanation of reference numerals in the attached figures

[0062] 1: Inkjet unit (substrate processing unit), 2: Substrate, 3: Substrate stage, 5: Printhead, 5a: Printout, 5b: Storage unit, 5c: Flow path, 9: Adjustment oscilloscope, 10: Height sensor, 11: Main control unit, 13: Suction nozzle (suction port), 19: Ejection nozzle, 20: Ejection surface.

Claims

1. A liquid spraying device, characterized in that, The liquid spraying device includes: The nozzle has a surface provided with a nozzle for spraying liquid, a storage part for storing liquid, and a flow path communicating from the nozzle to the storage part. The control unit controls the pressure within the storage unit; as well as The cleaning unit cleans the surface by moving the suction port along the surface and drawing in the liquid adhering to the surface through the suction port. The control unit during the cleaning process In the first state where the suction port is not facing the nozzle, the pressure in the storage section is controlled to a negative pressure based on a first force acting on the liquid in the flow path due to the attraction of the suction port, so as to maintain the position of the liquid surface formed in the flow path within the flow path. In the second state where the suction port and the spray outlet face each other, the pressure in the storage section is controlled to a greater negative pressure so that the second force that pulls the liquid in the flow path toward the storage section is increased compared to the first state.

2. The spraying device according to claim 1, characterized in that, When the first force is set to P1 and the second force is set to P2, the control unit controls the pressure in the storage unit so that |P1|≤|P2| is satisfied during the cleaning process.

3. The spraying device according to claim 1, characterized in that, The control unit controls the pressure within the storage compartment to prevent air bubbles from flowing into the storage compartment via the nozzle and the flow path during the cleaning process.

4. The spraying device according to claim 2, characterized in that, When the limit value of the second force that generates bubbles flowing into the storage section through the nozzle and the flow path is set to P3, the control unit controls the pressure in the storage section so that |P2| < |P3| is satisfied during the cleaning process.

5. The liquid spraying device according to claim 1, characterized in that, The cleaning unit controls the cleaning process by moving the suction port along the surface while the suction port is separated from the surface.

6. The liquid spraying device according to claim 5, characterized in that, The cleaning unit has a measuring unit that measures the distance between the suction port and the surface, and controls the movement of the suction port based on the measurement results of the measuring unit so as to maintain the distance at a predetermined value during the cleaning process.

7. The spraying device according to claim 1, characterized in that, The surface of the nozzle is provided with a plurality of nozzles for spraying out liquid from the storage compartment.

8. A control method for a liquid spraying device, characterized in that, The liquid spraying device includes: The nozzle has a surface provided with a nozzle for spraying liquid, a storage part for storing liquid, and a flow path communicating from the nozzle to the storage part. as well as The cleaning unit cleans the surface by moving the suction port along the surface and drawing in the liquid adhering to the surface through the suction port. In the cleaning process, In the first state where the suction port is not facing the nozzle, the pressure in the storage section is controlled to a negative pressure based on a first force acting on the liquid in the flow path due to the attraction of the suction port, so as to maintain the position of the liquid surface formed in the flow path within the flow path. In the second state where the suction port and the spray outlet face each other, the pressure in the storage section is controlled to a greater negative pressure so that the second force that pulls the liquid in the flow path toward the storage section is increased compared to the first state.

9. A substrate processing apparatus for processing substrates, characterized in that, have: A stage for holding and moving the substrate; and The liquid spraying device according to any one of claims 1 to 7 sprays liquid onto the substrate held by the stage.

10. A method for manufacturing an article, characterized in that, include: The process of spraying liquid onto a substrate using the substrate processing apparatus according to claim 9; A process for processing the substrate from which the liquid has been sprayed; as well as The process of manufacturing articles from the processed substrate.

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