Storage and transportation device dedicated to semiconductor plates

Abstract

The application discloses a storage and transportation device special for semiconductor plates, which comprises a transportation part of an upper opening box body, a storage part arranged on the transportation part, and a placing unit arranged on the storage part. The application realizes single storage and collective storage functions of semiconductor plates, and the semiconductor plates are high in storage flexibility and convenient to take out in a specific direction. The long arm of the L-shaped sleeve rod is arranged in a transverse and upward inclined mode along the vertical plate, so that observation of the content on the semiconductor plate is more convenient, and then the semiconductor plate is conveniently taken out in a specific direction. The elastic pad and the buffer pad are arranged, damage of the semiconductor plate in the transportation and storage process is avoided, the semiconductor plate is well protected, and the application has stronger practicability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor substrate storage and transportation, and in particular to a storage and transportation device specifically designed for semiconductor substrates. Background Technology

[0002] Semiconductor boards are commonly used components in semiconductor processing, primarily serving as substrates for semiconductor materials (such as IC carriers). Molded semiconductor circuit boards or semiconductor chip boards, and other plate-shaped semiconductor materials, typically require transport equipment, currently mostly using simple transport boxes with slotted structures. Due to the exceptional precision of semi-finished or finished semiconductor products, the lack of shock absorption during transport makes them prone to shaking, leading to collisions and damage between semiconductor devices, thus affecting the precision of the semiconductor chips. Furthermore, this type of storage and transport is inconvenient for centralized integration and rapid loading and unloading of semiconductor products. Summary of the Invention

[0003] The purpose of this invention is to provide a storage and transportation device specifically for semiconductor substrates, so as to effectively protect semiconductor substrates during storage and transportation.

[0004] To achieve the above objectives, the present invention can adopt the following technical solutions:

[0005] The storage and transportation device for semiconductor substrates described in this invention includes a transportation section, a storage section disposed on the transportation section, and a placement unit disposed on the storage section;

[0006] The transport section is an open-top box;

[0007] The storage unit includes:

[0008] A horizontal support plate, wherein a vertical plate is fixedly connected to the horizontal support plate along its transverse direction;

[0009] The placement unit includes:

[0010] An L-shaped sleeve rod is fixed to the upright plate, with the short arm of the L-shaped sleeve rod fixed to the upright plate and the long arm of the L-shaped sleeve rod inclined upward along the upright plate; a receiving chamber is connected to the long arm of the L-shaped sleeve rod by a sliding sleeve, the receiving chamber being a slot structure with openings at the top and one side; a support plate is provided on the upright plate below the L-shaped sleeve rod, the support plate being parallel to the long arm of the L-shaped sleeve rod.

[0011] Alternatively, the upright plate is set vertically upward along the transverse centerline of the horizontal support plate; the placement unit is in two sets, respectively set on the two sides of the upright plate to increase the number of placement units.

[0012] Alternatively, the placement units can be in multiple groups, arranged on the vertical plate in multiple layers, further increasing the number of placement units.

[0013] Alternatively, the flat support plate located below the placement unit is provided with an open storage slot for storing any excess storage chambers for later use.

[0014] Optionally, elastic pads are provided on the outer surfaces of the vertical walls on opposite sides of the receiving chamber to prevent friction or squeezing damage caused by the shaking of the semiconductor board.

[0015] Optionally, buffer pads are provided on the inner surfaces of the front and rear side walls of the top-opening box to reduce the bumps and vibrations of the semiconductor board during transportation.

[0016] Optionally, the bottom wall of the upper-opening box is provided with wheels.

[0017] Optionally, the upper part of the upright plate is provided with a pinch hole to facilitate the insertion and removal of the storage unit.

[0018] This invention, through the L-shaped sleeve and the sliding sleeve connecting the receiving chamber, realizes the functions of individual and collective storage of semiconductor boards. The storage of semiconductor boards is highly flexible and easy to directionally retrieve. The long arm of the L-shaped sleeve is set horizontally and upward along the upright plate, making it easier to observe the contents on the semiconductor boards, and thus facilitating the directional retrieval of the semiconductor boards. The elastic pads and buffer pads provided prevent damage to the semiconductor boards during transportation and storage, providing good cushioning protection for the semiconductor boards and enhancing their practicality. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention.

[0020] Figure 2 yes Figure 1 A top-view structural diagram.

[0021] Figure 3 This is a schematic diagram of the placement part described in this invention.

[0022] Figure 4 yes Figure 3 A top-view structural diagram.

[0023] Figure 5 This is a schematic diagram of the structure of the accommodating chamber described in this invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, horizontal, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0028] Furthermore, the meaning of "and / or" throughout the text is to include three parallel solutions. Taking "A and / or B as an example" as an example, it includes solution A, solution B, or a solution that satisfies both A and B. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0029] As shown in Figures 1-5, the storage and transportation device for semiconductor substrates according to the present invention includes a transportation section, a storage section disposed on the transportation section, and a placement unit disposed on the storage section.

[0030] The transport section is an open-top box 1; advantageously or exemplaryly, wheels 2 are provided on the bottom wall of the open-top box 1, making the transport of semiconductor boards more convenient.

[0031] Advantageously or exemplary, buffer pads 1.1 are provided on the inner surfaces of the front and rear side walls of the top-opening box 1, which can reduce the bumps and vibrations of the semiconductor board during transportation and avoid damage to the semiconductor board during transportation.

[0032] like Figure 3 , 4 As shown, the storage section includes:

[0033] A horizontal support plate 3 is provided, and a vertical plate 4 is fixedly connected to the horizontal support plate 3 along its transverse direction.

[0034] Advantageously or exemplary, the horizontal support plate 3 of the upright plate 4 is arranged vertically upward along the transverse center line 5; furthermore, the upper part of the upright plate 4 is provided with a pinch hole 6 to facilitate the insertion and removal of the storage part.

[0035] like Figure 1 , 2 As shown in Figure 5, the placement unit includes:

[0036] An L-shaped sleeve rod is fixed to the vertical plate 4. The end of the short arm 7.1 of the L-shaped sleeve rod is fixed to the vertical plate 4, and the long arm 7.2 of the L-shaped sleeve rod is set horizontally upward along the vertical plate 4. The length of the long arm 7.2 of the L-shaped sleeve rod is adapted to the length of the vertical plate 4.

[0037] A receiving chamber 9 is connected to the long arm 7.2 of the L-shaped sleeve through a sliding sleeve 8. There are several sliding sleeves 8 and receiving chambers 9. The receiving chamber 9 is a slot structure with openings on the top and one side. A support plate 10 is provided on the upright plate 4 located below the L-shaped sleeve. The support plate is parallel to the long arm 7.2 of the L-shaped sleeve.

[0038] The width of the sliding sleeve 8 is greater than the width of the receiving chamber 9. This design allows for a certain distance between two adjacent receiving chambers 9, facilitating the placement and removal of semiconductor boards.

[0039] Beneficially or exemplaryly, such as Figure 2 As shown, there are two sets of placement units, which are respectively set on the two sides of the upright plate 4 to increase the number of placement units.

[0040] Beneficially or exemplaryly, such as Figure 1 As shown, the placement units are in multiple groups, arranged on the vertical plate 4 in multiple layers, further increasing the number of placement units.

[0041] Beneficially or exemplaryly, such as Figure 1 As shown, a storage slot 11 with an upper opening is provided on the flat support plate 3 located below the placement unit for storing excess storage compartments for later use.

[0042] Beneficially or exemplaryly, such as Figure 5As shown, elastic pads 12 are respectively provided on the outer surfaces of the vertical walls on both sides of the receiving chamber 9 to prevent damage to the semiconductor board caused by friction or squeezing during transportation.

[0043] Beneficially or exemplaryly, such as Figure 1 As shown, two or more storage compartments can be stacked on top of each other inside the top-opening box 1.

[0044] The working principle of this invention is briefly described as follows:

[0045] In use, the receiving chamber 9 is installed by fitting the sliding sleeve 8 onto the long arm 7.2 of the L-shaped sleeve rod. When storing a single semiconductor board, the semiconductor board is placed in the slot of the receiving chamber 9. When storing several semiconductor boards of the same type together, the semiconductor boards are placed between two adjacent receiving chambers 9. At this time, the semiconductor boards are placed on the support plate 10, and the receiving chambers 9 slide down along the long arm 7.2 of the L-shaped sleeve rod under the action of gravity, so that the two adjacent receiving chambers 9 are brought closer together to achieve a neat arrangement. Then, the elastic pad 12 clamps several semiconductor boards. After the semiconductor boards are installed in the placement unit, the placement unit is grasped through the pinch hole 6 and placed in the inner cavity of the upper open box 1. The open box 1 can be easily moved by the traveling wheels 2.

Claims

1. A device specifically designed for storing and transporting semiconductor substrates, characterized in that: It includes a transport section, a storage section provided on the transport section, and a placement unit provided on the storage section; The transport section is an open-top box; The storage section includes: a horizontal support plate, on which a vertical plate is fixedly connected laterally; The placement unit includes: an L-shaped sleeve rod fixed to the upright plate, the short arm of the L-shaped sleeve rod being fixed to the upright plate, and the long arm of the L-shaped sleeve rod being inclined upwards laterally along the upright plate; a receiving chamber is connected to the long arm of the L-shaped sleeve rod by a sliding sleeve, the receiving chamber being a slot structure with openings at the top and one side; a support plate is provided on the upright plate below the L-shaped sleeve rod, the support plate being parallel to the long arm of the L-shaped sleeve rod; The upright plate is vertically upward along the transverse centerline of the horizontal support plate; there are two sets of placement units, which are respectively set on the two side plates of the upright plate; the two sets of placement units constitute a group. Elastic pads are provided on the outer surfaces of the upright walls on opposite sides of the accommodating chamber; pinch holes are provided on the upper part of the upright plate; In use, the receiving chamber is installed by fitting the sliding sleeve onto the long arm of the L-shaped sleeve rod. When a single semiconductor board needs to be stored, the semiconductor board is placed in the slot of the receiving chamber. When several semiconductor boards of the same type need to be stored together, the semiconductor board is placed between two adjacent receiving chambers. At this time, the semiconductor board is placed on the pallet, and the receiving chamber slides down along the long arm of the L-shaped sleeve rod under the action of gravity, so that the two adjacent receiving chambers are brought closer together to achieve a neat arrangement. Then, the semiconductor boards are clamped by the elastic pad. After the semiconductor board is loaded into the placement unit, the placement unit is grasped through the pinch hole and placed into the inner cavity of the upper opening box. The upper opening box can be easily moved by the traveling wheels.

2. The storage and transportation device specifically for semiconductor substrates according to claim 1, characterized in that: The placement unit consists of multiple sets, arranged in multiple layers on the vertical plate, both above and below.

3. The storage and transportation device specifically for semiconductor substrates according to claim 1, characterized in that: An open storage slot is provided on the horizontal support plate located below the placement unit.

4. The storage and transportation device specifically for semiconductor substrates according to claim 1, characterized in that: The inner surfaces of the front and rear side walls of the top-opening box are respectively provided with buffer pads.

5. The storage and transportation device specifically for semiconductor substrates according to claim 1, characterized in that: The bottom wall of the upper-opening box is equipped with wheels.

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