Additive manufacturing quality inspection method and related device

Abstract

The embodiment of the present application discloses an additive manufacturing quality detection method and related devices, the method comprising: an industrial control computer acquires an electrical signal corresponding to an optical signal in the first period of time during the laser additive manufacturing process, and the industrial control computer constructs at least two trajectory amplitude graphs based on at least two electrical signals corresponding to at least two optical signals; the industrial control computer divides the at least two trajectory amplitude graphs to obtain multiple image block sets; the industrial control computer determines whether there is a defect in the area corresponding to the image block in each image block set in the target slice layer based on the electrical signal amplitude of the image block in each image block set. This is beneficial for detecting abnormal areas of the part slice layer during the additive processing process.

Description

Technical Field

[0001] The present application relates to the field of additive manufacturing technology, and in particular to an additive manufacturing quality detection method and related devices. Background Art

[0002] Additive manufacturing, also known as 3D printing manufacturing, is mainly to melt the metal raw materials by focusing laser heat energy, and then process the dust and other materials layer by layer into the required workpiece. Laser additive manufacturing is a metal additive manufacturing process. Compared with the processing methods such as parts assembly and metal cutting in traditional industries, laser additive manufacturing has higher efficiency and flexibility. It can be used for rapid prototyping, manufacturing functional graded materials, and repairing high value-added components. At present, this technology is increasingly used in aerospace, defense, automotive and biomedical industries. In the laser additive manufacturing process, under the influence of different laser processing parameters, environment and equipment, the surface accuracy of the workpiece forming quality is poor, among which the generation of defects and dimensional accuracy have always affected the further popularization and application of this technology. Therefore, the research on online monitoring technology of the additive manufacturing process is a necessary means and quality assurance for controlling the overall additive manufacturing process.

[0003] Existing online detection of laser additive processing generally has the following two detection methods: offline and online:

[0004] In offline detection, surface detection is mainly completed through microscopes, scanning electron microscopes and other surface detection equipment, and it is difficult to detect internal defects of components. Industrial metallographic cutting and other cutting methods are used for destructive measurement, which destroys the original morphology of components and has low efficiency. Industrial CT scanning and ultrasonic testing can obtain internal information of workpieces and perform defect detection, but they can only be arranged after the parts are manufactured. They are offline detection and cannot be realized online. Manufacturing and testing are difficult to be carried out in one, which affects production efficiency.

[0005] In the online detection method, such as the existing Chinese patent (CN115861187A) laser additive manufacturing through the laser deposition additive manufacturing online monitoring system schematic diagram of this application, the powder material or filamentary material is melted and deposited in combination with the digital model by means of photographing, scanning, infrared sensing, etc., and three types of data, namely, molten pool image data, molten pool temperature data and three-dimensional point cloud data, are used for matching. Specifically, high-speed cameras, infrared cameras and laser three-dimensional scanners are used to obtain online detection information, such as collecting molten pool image data through high-speed cameras; collecting molten pool temperature data using infrared cameras; and collecting three-dimensional point cloud data of the workpiece shape using laser three-dimensional scanners.

[0006] The offline detection method not only destroys the workpiece structure, but also easily causes the workpiece to deform due to destructive detection, affecting the final measurement results; inspection based on online detection methods is costly. Summary of the invention

[0007] The present application proposes an additive manufacturing quality detection method and related devices, which are conducive to detecting abnormal areas of a part slice layer during the additive manufacturing process.

[0008] This application is implemented using the following technical solutions.

[0009] In a first aspect, an embodiment of the present application provides an additive manufacturing quality detection method, comprising: an industrial control computer acquires an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, the first time period being a time period for processing a target slice layer of a target part during laser additive processing, the optical signal in the first time period comprising an output light signal of a laser in the first time period, and at least two optical signals among a laser reflection signal, a visible light signal and an infrared light signal generated by the target slice layer in the first time period; the industrial control computer constructs at least two trajectory amplitude graphs based on at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude graph in the at least two trajectory amplitude graphs is the same as the contour of the target slice layer, the trajectory amplitude graph comprises a plurality of trajectory amplitude lines, and the plurality of trajectory amplitude lines are respectively aligned with the contour of the target slice layer during processing. The industrial control computer divides at least two trajectory amplitude maps respectively to obtain a plurality of first image blocks; each of the plurality of first image blocks is divided respectively to obtain a plurality of image block sets; the plurality of image block sets correspond to the regions of the target slice layer; each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same region of the target slice layer; the industrial control computer determines whether there is a defect in the region corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set.

[0010] In the process of processing the target slice layer of the target part, at least two of the electrical signals corresponding to the light output signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal are obtained; at least two trajectory amplitude graphs are respectively constructed based on the electrical signals corresponding to the light output signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal, and the constructed trajectory amplitude graphs are divided into blocks, and the area with defects in the target slice layer, that is, the abnormal area, is determined based on the electrical signal amplitude of the image block obtained by the block division. In this way, while being able to detect the abnormal area of ​​the part slice layer during the additive processing process, compared with the prior art, the part will not be damaged and the cost is low. Since the area with defects in the target slice layer can be determined, it is convenient to reprocess the defective area in the subsequent process to eliminate the defective area.

[0011] In combination with the first aspect, in a possible implementation, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set, including:

[0012] The industrial control computer determines the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set.

[0013] By judging whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer through the electrical signal amplitudes of at least two image blocks respectively belonging to at least two trajectory amplitude maps, the accuracy of the judgment result can be improved.

[0014] In combination with the first aspect, in a possible implementation, when the electrical signal amplitude of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the image block in the target slice layer; when the electrical signal amplitude of each second image block does not exceed the threshold range of the electrical signal corresponding to the second image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the second image block in the target slice layer.

[0015] In combination with the first aspect, in a possible implementation, the industrial control computer determines the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set, including:

[0016] The industrial control computer determines the ratio of each second image block, and the ratio of each second image block is the ratio of the electrical signal amplitude of the second image block to the electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0017] In combination with the first aspect, in a possible implementation, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, including:

[0018] When the detection results corresponding to all the second image blocks in the target image block set are that there is a defect in the area corresponding to the second image block in the target slice layer, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of multiple image block sets.

[0019] Only when the detection results corresponding to all the second image blocks in the target image block set show that there is a defect in the area corresponding to the image block in the target slice layer, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer, which can improve the accuracy of judging whether there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0020] In combination with the first aspect, in a possible implementation, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, including:

[0021] When the detection result in the target image block set is that there are multiple image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include a second image block with a priority higher than the preset priority, when the number of the multiple second image blocks is greater than the preset number, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0022] By means of the above method, it is possible to improve the accuracy of judging whether there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0023] In combination with the first aspect, in one possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein, the second image block A belongs to a trajectory amplitude map constructed based on an electrical signal corresponding to an output signal of the laser; the second image block B belongs to a trajectory amplitude map constructed based on an electrical signal corresponding to an infrared light signal; the second image block C belongs to a trajectory amplitude map constructed based on an electrical signal corresponding to a visible light signal; and the second image block D belongs to a trajectory amplitude map constructed based on an electrical signal corresponding to a laser reflection signal.

[0024] In combination with the first aspect, in a possible implementation, the method of this embodiment further includes: the industrial control computer obtains one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, wherein the target group is a group in which the number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position, and the industrial control computer obtains the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. One or more of the ratio of the area of ​​the normal area to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0025] In combination with the first aspect, in a possible implementation manner, the method of this embodiment further includes:

[0026] The industrial control computer obtains the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer. When the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, the industrial control computer transmits the position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

[0027] or,

[0028] The industrial control computer obtains the position information of all abnormal areas from the first layer to the target slice layer, and groups the position information of all abnormal areas, so that the position information in the same group indicates the same position; the industrial control computer transmits the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; the target group is a group in which the number of position information is greater than a preset number;

[0029] or,

[0030] The industrial control computer obtains the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. If the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, the industrial control computer transmits the position information of all abnormal areas in the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0031] In combination with the first aspect, in a possible implementation manner, the electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

[0032] In combination with the first aspect, in a possible implementation, the industrial computer constructs at least two trajectory amplitude graphs based on at least two electrical signals corresponding to at least two optical signals, including:

[0033] The industrial computer obtains the first and last coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of at least two trajectory amplitude maps; the industrial computer calculates the number of first additive processing points of each trajectory line based on the first and last coordinates, laser printing speed and sampling rate of each trajectory line; the industrial computer obtains the number of second additive processing points of each trajectory line based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the absolute value of the difference between the number of second additive processing points of the target trajectory line and the number of first additive processing points of the target trajectory line is less than the preset ratio, the target trajectory line is retained; if it exceeds, the target trajectory line is deleted.

[0034] By using the above method, the abnormal trajectory lines in the trajectory amplitude map are removed, and subsequently judging whether there is a defect in the target slice layer based on the processed trajectory amplitude map, the accuracy of the judgment result can be improved.

[0035] Further, if the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line and the ratio of the number of the first additive processing points of the target trajectory line exceeds a preset ratio, the industrial control computer deletes the target trajectory, including:

[0036] If the ratio of the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line to the number of the first additive processing points of the target trajectory line exceeds a preset ratio, and the ratio of the absolute value of the difference between the number of the second additive processing points of the next trajectory adjacent to the target trajectory in the processing order and the number of the first additive processing points of the next trajectory to the number of the first additive processing points of the next trajectory does not exceed the preset ratio, the industrial control computer deletes the target trajectory.

[0037] The above method can improve the accuracy of determining the abnormal trajectory line.

[0038] In combination with the first aspect, in a possible implementation method, the method of this embodiment also includes: the industrial control computer displays at least two trajectory amplitude maps and displays the result of whether there is a defect in the target slice layer; when the industrial control computer determines that there is a defect in the target slice layer, the abnormal area of ​​the target slice layer is displayed on at least two trajectory amplitude maps.

[0039] By displaying the above trajectory amplitude graph and the result of whether there is a defect, the processing personnel can know whether the target slice layer has a defect. And when there is a defect, the processing personnel can know which specific area of ​​the target slice layer has the defect, so as to facilitate subsequent reprocessing.

[0040] In a second aspect, an embodiment of the present application provides an industrial computer, comprising an acquisition unit, a construction unit, a display unit, a division unit, a determination unit, and a sending unit. The acquisition unit, the construction unit, the display unit, the division unit, the determination unit, and the sending unit are used to implement the method provided in any one of the first aspects.

[0041] In a third aspect, an embodiment of the present application provides an industrial control computer, comprising: a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial control computer executes a method as provided in any one of the first aspects.

[0042] In a fourth aspect, an embodiment of the present application provides a laser processing control system, comprising a laser welding system, a sensor module, a signal processing module and an industrial control computer, wherein the industrial control computer is used to execute a method as provided in any one of the first aspects.

[0043] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program enables a computer to execute a method as provided in any one of the first aspects.

[0044] In a sixth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer is operable to cause the computer to execute the method described in the first aspect or the second aspect.

[0045] It can be understood that the industrial control computer described in the second and third aspects, the laser processing control system described in the fourth aspect, the computer storage medium described in the fifth aspect, or the computer program product described in the sixth aspect are all used to implement the method provided in any one of the first aspects. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 A schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application.

[0048] Figure 2 A schematic flow chart of an additive manufacturing quality inspection method provided in an embodiment of the present application.

[0049] Figure 3 A schematic diagram of the relationship between a processing trajectory and an electrical signal provided in an embodiment of the present application.

[0050] Figure 4 A schematic diagram of a target slice layer and trajectory amplitude diagram provided in an embodiment of the present application.

[0051] Figure 5a A schematic diagram of the correspondence between an image block and an area in a target slice layer provided in an embodiment of the present application.

[0052] Figure 5b A schematic diagram of another correspondence between an image block and an area in a reference slice layer provided in an embodiment of the present application.

[0053] Figure 5c A schematic diagram of a detection result provided in an embodiment of the present application.

[0054] Figure 6 A structural schematic diagram of an industrial control computer is provided for an embodiment of the present application.

[0055] Figure 7A structural schematic diagram of another industrial control computer is provided for the embodiment of the present application. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the embodiments of the present application, the accompanying drawings and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should be understood that the term "and / or" used in this article is only a kind of association relationship describing the associated objects, indicating that there can be three relationships, for example, A and / or B, which can be represented by: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are an "or" relationship. It should be understood that although the terms "first", "second" and similar words may be used in the embodiments of the present application, they do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not represent quantity restrictions, but represent the existence of at least one. The "multiple" involved in the embodiments of the present application refers to greater than or equal to two.

[0058] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application. Figure 1 As shown, the system includes a laser 1, a field lens 2, a scanning galvanometer 3, a beam splitter 4, a sensor module 5, a signal processor 6, and an industrial control computer 7, wherein the sensor module 5 is coaxially installed in the scanning galvanometer system of the laser additive manufacturing equipment, the sensor module 5 is connected to the signal processor 6 through a signal line, the signal processor 6 is connected to the industrial control computer 7 through a signal line, and the signal processor 6 is connected to the control system 8 of the laser additive manufacturing equipment through a signal line.

[0059] In this embodiment, the laser light generated by the laser 1 is first transmitted to the sensor module of the laser light output signal of the sensor module 5 through the beam splitter 4. At the same time, the laser light generated by the laser 1 is also incident into the molding cavity 9 by the scanning galvanometer 3 and the field lens 2. The light radiation generated in the laser additive manufacturing process is transmitted to the sensor module 5 through the field lens 2, the scanning galvanometer 3 and the beam splitter 4. The sensor module 5 can realize photoelectric conversion and can convert the light radiation signals of various wavelengths into electrical signals, including visible light (400-700nm), laser reflection (1060-1070nm), laser light (1060-1070nm) ) and infrared light (>1200nm); the electrical signal is transmitted to the signal processor 6 via the signal line, and the signal processor 6 performs relevant processing on the electrical signal, including signal amplification and filtering. After the signal processing, it is transmitted to the industrial control computer 7 via the signal line, and the industrial control computer 7 extracts and processes the corresponding characteristic values ​​of the signal, and compares it with the preset upper and lower thresholds and upper and lower ratio thresholds, so as to judge the processing quality of each slice layer in the additive manufacturing process. The industrial control computer 7 transmits the corresponding processing information to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so as to adjust and optimize the process parameters of additive manufacturing.

[0060] Optionally, the sensor module 5 includes at least one of a laser light output signal sensor, a laser reflection signal sensor, a visible light signal sensor and an infrared light signal sensor.

[0061] The laser wavelength generated by the laser 1 is 1070-1070nm, and the sensor module 5 can realize photoelectric conversion, specifically through a silicon photoelectric sensor; the sensor module 5 can perform photoelectric conversion on light of multiple wavelengths, including visible light (400-700nm), laser reflection (1070-1070nm), and infrared light (>1200nm); the signal processor 6 processes the electrical signal, including signal amplification and filtering, so that the signal amplitude becomes larger and the signal noise is reduced; the industrial control computer 7 can further filter the signal, and then determine whether there is an abnormal area in the slice layer of the part based on the collected electrical signal. If there is an abnormal area, obtain the position information of the abnormal area; the position information or other information of the abnormal area is transmitted to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so that the control system controls the laser 1 or the laser processing head or other components that control laser welding in the laser welding system to reprocess the abnormal area.

[0062] In laser processing applications, the infrared radiation signal corresponds to the infrared radiation signal with a wavelength in the range of 1250nm to 1700nm. The visible light radiation signal corresponds to the visible light radiation signal in the range of 400nm to 700nm. The laser processing reflection signal corresponds to the processing laser reflection signal during actual laser processing, such as the processing laser wavelengths of 915nm, 1064nm, 1070nm, etc. The wavelength of the processing laser is related to the actual wavelength of the laser used. In some use environments, the suitable range of the infrared radiation signal can be extended outside the range of 1250nm to 1700nm. In some use environments, the visible light radiation signal can be extended outside the range of 400nm to 700nm.

[0063] The solution of this application is described in detail below.

[0064] See also Figure 2 , Figure 2 A schematic diagram of a process flow of an additive manufacturing quality inspection method provided in an embodiment of the present application. Figure 2 As shown, the method includes:

[0065] S201. An industrial control computer obtains an electrical signal corresponding to an optical signal in a first period of time during a laser additive manufacturing process.

[0066] Among them, the first time period is the time period for processing the target slice layer of the target part during the laser additive processing process, and the optical signal of the first time period includes the light output signal of the laser in the first time period, and at least two optical signals of the laser reflection signal, visible light signal and infrared light signal generated by the target slice layer in the first time period.

[0067] During the laser additive manufacturing process, the keyhole metal vapor generated radiates visible light, the molten pool radiates infrared light, the laser reflected light not absorbed by the powder and the laser light output signal are collected by the sensor module 5, and photoelectrically converted into electrical signals, including: obtaining the corresponding voltage value V0 through the laser light output signal sensor, obtaining the corresponding voltage value V1 through the visible light signal sensor, obtaining the corresponding voltage value V2 through the laser reflection signal sensor, and obtaining the corresponding voltage value V3 through the infrared light signal sensor, respectively adjusting the gain of the voltage values ​​V0, V1, V2, and V3 to obtain the adjusted output adjusted electrical signal. In the process of machining the target slicing layer of the target part, at least two electrical signals corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal, and the electrical signal corresponding to the infrared light signal can be obtained in the above manner.

[0068] S202: The industrial control computer constructs at least two trajectory amplitude graphs based on the at least two electrical signals corresponding to the at least two optical signals.

[0069] Among them, the contour of each trajectory amplitude map in at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map includes multiple trajectory amplitude lines, and the multiple trajectory amplitude lines correspond to the processing trajectories when processing the target slice layer. The amplitude represented by the trajectory amplitude line is the amplitude of the corresponding electrical signal during the processing of the target slice layer.

[0070] In the laser additive manufacturing process, the model of the target part is preprocessed, that is, the three-dimensional model of the target part is sliced ​​and layered in the Z-axis direction according to the preset slice layer thickness, so as to obtain the contour data of each layer section in the XY direction. Figure 3 Part (a) is the contour information of a slice layer of the target part model, where line segments ①-⑧ are the laser tracks during the laser processing of the slice layer, and the arrows are the positions where the laser ends in each laser track; Figure 3 Part (b) is a graph of the electrical signals corresponding to the laser tracks of the slice layer obtained after the laser light output signal and the generated light radiation signal (including laser reflection signal, visible light signal and infrared light signal) in the laser additive manufacturing process are collected by the sensor module 5 and photoelectrically converted into electrical signals, and then the signal processor 6 performs corresponding signal processing.

[0071] like Figure 3 As shown in part (b), the electric signal amplitude interval L1-L2 corresponds to laser trajectory ①, the electric signal amplitude interval L3-L4 corresponds to laser trajectory ②, the electric signal amplitude interval L5-L6 corresponds to laser trajectory ③, the electric signal amplitude interval L7-L8 corresponds to laser trajectory ④, the electric signal amplitude interval L9-L10 corresponds to laser trajectory ⑤, the electric signal amplitude interval L11-L12 corresponds to laser trajectory ⑥, the electric signal amplitude interval L13-L14 corresponds to laser trajectory ⑦, and the electric signal amplitude interval L15-L16 corresponds to laser trajectory ⑧.

[0072] For example, the shape of the target slice layer is a circle, and the processing trajectory is as follows: Figure 4 As shown in the left figure, the corresponding trajectory amplitude is Figure 4 As shown in the right figure. Figure 4 The trajectory amplitude diagram shown in the right figure includes multiple trajectory amplitude lines, and the trajectory amplitude lines correspond to the processing trajectory of the processing target slice layer. Each trajectory amplitude line includes multiple pixel points, and the pixel value of the pixel point is used to characterize the amplitude of the target electrical signal at the corresponding moment in the process of processing the target slice layer. Among them, the target electrical signal is the electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal, or the electrical signal corresponding to the infrared light signal.

[0073] Optionally, the industrial computer displays the trajectory amplitude map corresponding to the target slice layer. The inspection personnel can know the amplitude of the target electrical signal at the corresponding moment through the pixel value of the pixel point in the trajectory amplitude map.

[0074] In a possible implementation, the industrial computer constructs at least two trajectory amplitude graphs based on at least two electrical signals corresponding to at least two optical signals, including:

[0075] The industrial computer obtains the first and last coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of at least two trajectory amplitude maps; the industrial computer calculates the number of first additive processing points of each trajectory line based on the first and last coordinates, laser printing speed and sampling rate of each trajectory line; the industrial computer obtains the number of second additive processing points of each trajectory line based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the difference between the number of first additive processing points of the target trajectory line and the number of second additive processing points of the target trajectory line does not exceed the difference threshold, the target trajectory line is retained; if it exceeds, the target trajectory line is deleted.

[0076] Specifically, in the process of constructing a corresponding trajectory amplitude diagram based on the electrical signal corresponding to the optical signal, the industrial control computer first obtains the head and tail coordinates, laser printing speed and sampling frequency of each trajectory line in the trajectory amplitude diagram, wherein the length of each trajectory line can be obtained based on the head and tail coordinates of each trajectory line; based on the length of each trajectory line, the laser printing speed and the sampling frequency, the number of the first additive processing points of each trajectory line is calculated.

[0077] The length of each trajectory line, laser printing speed, sampling frequency and the first additive processing point satisfy the following formula:

[0078]

[0079] Among them, points is the number of the first additive processing points of the trajectory line, distance is the length of the trajectory line, speed is the laser printing speed, frequency is the sampling frequency, that is, the sampling frequency of the photoelectric sensor, such as 20kHz. Round is the rounding function.

[0080] The number of the first additive processing points of the trajectory line is calculated based on the above formula and can be called the theoretical number; since the light signal is collected by the photoelectric sensor, the industrial control computer determines the number of the second additive processing points of the trajectory line based on the electrical signal corresponding to the light signal, and the number of the second additive processing points can be called the actual number of additive processing points. For the target trajectory line, by comparing the number of the first additive processing points and the number of the second additive processing points, it is determined whether the target trajectory line is an abnormal trajectory line.

[0081] The specific judgment method is: determine the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line, and then determine the ratio of the absolute value of the difference to the number of the first additive processing points of the target trajectory line. If the ratio does not exceed the preset ratio, the industrial control computer retains the target trajectory line; if it exceeds, the industrial control computer deletes the target trajectory line.

[0082] It should be pointed out that an abnormal track line refers to a track line that is printed when the laser does not emit light.

[0083] Furthermore, the industrial control computer determines whether the next track adjacent to the target track in the processing sequence is an abnormal track line according to the above method. If it is determined that the next track adjacent to the target track in the processing sequence is not an abnormal track line, the industrial control computer determines that the laser is not emitting light when processing the target track line. At this time, the target track line is determined to be an abnormal track line, and the industrial control computer deletes the target track line. This method can avoid the target track line from being accidentally deleted, which is conducive to improving the accuracy of determining the abnormal track line.

[0084] According to the above method, each trajectory line is processed, and the retained trajectory lines can form a trajectory amplitude map.

[0085] The above processing is performed on each of the at least two electrical signals, and the industrial control computer can obtain at least two trajectory amplitude graphs.

[0086] S203, the industrial control computer divides the at least two trajectory amplitude images respectively to obtain a plurality of first image blocks; the industrial control computer divides each of the plurality of first image blocks respectively to obtain a plurality of image block sets.

[0087] Among them, multiple first image blocks correspond to the first area of ​​the target slice layer, and multiple image block sets correspond to the second area of ​​the target slice layer; each image block set in the multiple image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude images, and at least two second image blocks correspond to the same second area of ​​the target slice layer.

[0088] Specifically, the industrial control computer divides each of the at least two trajectory amplitude maps in a preset manner, and for each trajectory amplitude map, the industrial control computer obtains a corresponding plurality of first image blocks; the first image blocks correspond to the first region in the target slice layer; the plurality of first image blocks are then divided into blocks to obtain a plurality of second image blocks; the second image blocks correspond to the second region in the target slice layer. The industrial control computer forms an image block set with the second image blocks corresponding to the same second region in the target slice layer and belonging to at least two trajectory amplitude maps, and finally the industrial control computer obtains a plurality of image block sets. In other words, the second image blocks belonging to the same image block set correspond to the same second region of the target slice layer, and belong to at least two trajectory amplitude maps respectively.

[0089] like Figure 5a As shown, Figure 5a Figure a in the figure shows the result of dividing the target slice layer into regions according to the preset method; Figure 5a Figures b and c in the figure illustrate the results of dividing the trajectory amplitude map corresponding to the two electrical signals according to a preset method. It can be seen that the image blocks in the trajectory amplitude map corresponding to the two electrical signals correspond to the areas in the target slice layer. For example, Figure 5a The first image block 1 in the b image and the first image block 2 in the c image correspond to the first target area in the target slice layer. Figure 5a The second image block 1 in the b figure and the second image block 2 in the c figure correspond to the second target area in the target slice layer.

[0090] S204: The industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set.

[0091] In a possible implementation, the electrical signal amplitude of the image block is the average electrical signal amplitude of the image block, or is obtained by weighting the electrical signal amplitudes of all points in the image block. The following is an example in which the electrical signal amplitude corresponding to the image block is the average electrical signal amplitude corresponding to the image block.

[0092] In a possible implementation, the industrial computer determines the detection result corresponding to the second image block based on the average electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; when the average electrical signal amplitude of each second image block in each image block set exceeds the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to the second image block is that there is a defect in the area corresponding to the second image block in the target slice layer; when the average electrical signal amplitude of each second image block in each image block set does not exceed the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to the second image block is that there is no defect in the area corresponding to the second image block in the target slice layer. According to the above method, the industrial computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set.

[0093] For example, suppose Figure 5a Figure b in the figure is the trajectory amplitude diagram obtained based on the electrical signal corresponding to the optical signal. The target image set includes Figure 5a The second image block 1 in Figure b and the second image block 2 in Figure c. For the second image block 1, the industrial computer obtains the average electrical signal amplitude of the second image block 1 and the threshold range of the light output signal corresponding to the first image block 1. The industrial computer determines whether the average electrical signal amplitude of the second image block 1 exceeds the threshold range of the light output signal corresponding to the second image block 1; if it exceeds, the industrial computer determines that the detection result corresponding to the second image block 1 is that there is a defect in the second target area in the target slice layer; if it does not exceed, the industrial computer determines that the detection result corresponding to the second image block 1 is that there is no defect in the second target area in the target slice layer.

[0094] In the same way, the industrial computer can obtain the detection result corresponding to the second image block 2. The industrial computer determines whether there is a defect in the second target area of ​​the target slice layer based on the detection result corresponding to the second image block 1 and the detection result corresponding to the second image block 2.

[0095] In another possible implementation, the industrial control computer determines the ratio of each second image block in each image block set, and the ratio of each second image block is the ratio of the average electrical signal amplitude of the second image block to the average electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0096] For example, suppose Figure 5a Figure b in the figure is the trajectory amplitude diagram obtained based on the electrical signal corresponding to the optical signal. The target image set includes Figure 5a The second image block 1 in Figure b and the second image block 2 in Figure c. For the second image block 1, the industrial computer obtains the ratio of the average electrical signal amplitude of the second image block 1 to the average electrical signal amplitude of the first image block 1, and obtains the ratio range of the light output signal corresponding to the second image block 1. The industrial computer determines whether the ratio of the average electrical signal amplitude of the second image block 1 to the average electrical signal amplitude of the second image block 1 exceeds the ratio range of the light output signal corresponding to the second image block 1; if it exceeds, the industrial computer determines that the detection result corresponding to the second image block 1 is that there is a defect in the second target area in the target slice layer; if it does not exceed, the industrial computer determines that the detection result corresponding to the second image block 1 is that there is no defect in the second target area in the target slice layer.

[0097] In the same way, the industrial computer can obtain the detection result corresponding to the second image block 2. The industrial computer determines whether there is a defect in the second target area of ​​the target slice layer based on the detection result corresponding to the second image block 1 and the detection result corresponding to the second image block 2.

[0098] Due to the large printing area or errors in the installation of the printer, when printing the slice layer, the amplitude intensity corresponding to some areas in the trajectory amplitude map will always be higher than the amplitude intensity corresponding to other areas. If the global average electrical signal amplitude is compared with the threshold, the result of judging whether the slice layer has defects is inaccurate. In this embodiment, the trajectory amplitude map is divided into blocks and then judged in blocks, which is conducive to improving the accuracy of the result of judging whether the slice layer has defects and can determine the location of the defects in the slice layer.

[0099] In a possible implementation, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, including:

[0100] When the detection results corresponding to all image blocks in the target image block set are that the area corresponding to the image block in the target slice layer has defects, the industrial control computer determines that the area corresponding to the image block in the target image block set in the target slice layer has defects; wherein the target image block set is one of multiple image block sets.

[0101] For example, it is assumed that the target image block set includes a second image block 1 and a second image block 2, such as Figure 5aAs shown, if the detection result corresponding to the second image block 1 is that there is a defect in the second target area in the target slice layer, and the detection result corresponding to the second image block 2 is that there is a defect in the second target area in the target slice layer, the industrial control computer determines that there is a defect in the second target area in the target slice layer; if the detection result corresponding to the second image block 1 is that there is no defect in the second target area in the target slice layer, or the detection result corresponding to the second image block 2 is that there is no defect in the second target area in the target slice layer, the industrial control computer determines that there is no defect in the second target area in the target slice layer.

[0102] When the detection results corresponding to all second image blocks in the image block set indicate that there is a defect in the corresponding area of ​​the image block set in the target slice layer, it is determined that there is a defect in the corresponding area of ​​the image block set in the target slice layer, thereby improving the accuracy of the detection result.

[0103] In a possible implementation, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, including:

[0104] When the corresponding detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include an image block with a priority higher than the preset priority, then when the number of the multiple second image blocks is greater than the preset number, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0105] In a possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein, the second image block A belongs to a trajectory amplitude diagram constructed based on the electrical signal corresponding to the light output signal of the laser; the second image block B belongs to a trajectory amplitude diagram constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to a trajectory amplitude diagram constructed based on the electrical signal corresponding to the visible light signal; the second image block D belongs to a trajectory amplitude diagram constructed based on the electrical signal corresponding to the laser reflection signal. For example, the priority of the first image block is the first priority, the priority of the second image block is the second priority, the priority of the third image block is the third priority, and the priority of the fourth image block is the fourth priority.

[0106] For example, assuming that the preset priority is the second priority, the preset number is 2, and the target image block set includes: Figure 5aThe second image block 1 and the second image block 2 shown in Figure 5a The second image block 3 and the second image block 4 are not shown in the figure, wherein the second image block 1 and the second image block 2 belong to the trajectory amplitude diagram obtained based on the electric signal corresponding to the light-emitting signal and the trajectory amplitude diagram obtained based on the electric signal corresponding to the laser reflection signal, respectively, and the second image block 3 and the second image block 4 belong to the trajectory amplitude diagram obtained based on the electric signal corresponding to the visible light signal and the trajectory amplitude diagram obtained based on the electric signal corresponding to the infrared light signal, respectively. In other words, the priority of the second image block 1 is the first priority, the priority of the second image block 2 is the fourth priority, and the priority of the second image block 3 and the priority of the second image block 4 are the second priority and the third priority, respectively.

[0107] It should be understood that the second image block 3 and the second image block 4 correspond to the second target region in the target slice layer.

[0108] If the detection result of the second image block 1 is that there is a defect in the second target area in the target slice layer, since the priority of the second image block 1 is higher than the second priority (i.e., the preset priority), the industrial control computer directly determines that there is a defect in the second target area in the target slice layer, and there is no need to determine the detection results of the second image block 2, the second image block 3, and the second image block 4; if the detection result of the second image block 1 is that there is no defect in the second target area in the target slice layer, the industrial control computer continues to determine the detection results of the second image block 2, the second image block 3, and the second image block 4; if the detection results of the second image block 2, the second image block 3, and the second image block 4 are all the second target area in the target slice layer, If there is a defect in the target area, that is, the number of second image blocks corresponding to the second target area with defects in the target slice layer whose corresponding detection results in the target image block set are greater than the preset number, the industrial control computer determines that there is a defect in the second target area in the target slice layer; if the detection results of some of the second image blocks in the second image block 2, the second image block 3 and the second image block 4 are all that there is a defect in the second target area in the target slice layer, that is, the number of second image blocks corresponding to the second target area with defects in the target slice layer whose corresponding detection results in the target image block set are not greater than the preset number, the industrial control computer determines that there is no defect in the second target area in the target slice layer.

[0109] In a possible implementation, the industrial computer constructs multiple trajectory amplitude maps corresponding to the target electrical signals based on the target electrical signals corresponding to the multiple reference slice layers, and the multiple trajectory amplitude maps correspond to the multiple reference slice layers; wherein the multiple reference slice layers are slice layers determined to be defect-free according to the scheme of the present application. The contour of the reference slice layer is the same or similar to the contour of the target slice layer, and the multiple reference slice layers are slice layers for laser processing of parts with the same material as the target part. For each of the multiple trajectory amplitude maps, the same preset method is used to divide the multiple first image blocks; the reference slice layer can be divided into multiple first regions in the same way, and the multiple first image blocks of the same slice layer correspond to the multiple first regions respectively. Based on the first image blocks obtained by dividing the multiple trajectory amplitude maps, multiple image block sets are obtained, each of which includes multiple first image blocks, and the multiple first image blocks belong to the above-mentioned multiple trajectory amplitude maps respectively, and the multiple first image blocks correspond to the regions with the same position in the multiple reference slice layers. The first image blocks in the same image block set are divided in the same division manner to obtain multiple second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the multiple second image blocks are respectively used as the maximum value and the minimum value of the threshold range of the corresponding electrical signal of the image block set.

[0110] It should be understood that the first image block in the above-mentioned image block set corresponds to the same first area in the reference slice layer. When determining whether there is a defect in the target slice layer, the trajectory amplitude map corresponding to the target slice layer is divided in the same way, and the first image block obtained by the division corresponds to the same area in the target slice layer; therefore, the threshold range of the corresponding electrical signal of the above-mentioned image block set can be regarded as the threshold range of the electrical signal corresponding to the first image block.

[0111] like Figure 5b As shown, Figure 5b Figures A, B, and C illustrate a reference slice layer respectively, and the contours of the three slice layers are the same. The position of the first region A1 in the reference slice layer shown in Figure A, the position of the first region B1 in the reference slice layer shown in Figure B, and the position of the first region C1 in the reference slice layer shown in Figure C are the same. Figure 5b The trajectory amplitude diagrams shown in Figures D, E and F are trajectory amplitude diagrams corresponding to the target electrical signals of the reference slice layers shown in Figures A, B and C. The first image block D1 corresponds to the first area A1, the first image block E1 corresponds to the first area B1, and the first image block F1 corresponds to the first area C1.

[0112] Similarly, the position of the first region A2 in the reference slice layer shown in FIG. A, the position of the first region B2 in the reference slice layer shown in FIG. B, and the position of the first region C2 in the reference slice layer shown in FIG. C are the same. The first image block D2 corresponds to the first region A2, the first image block E2 corresponds to the first region B2, and the first image block F2 corresponds to the first region C2.

[0113] For the first image block D1, the first image block E1 and the first image block F1, block division is performed in the same manner to obtain 12 second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the target electrical signals corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the threshold range corresponding to the target electrical signals of the first image block D1, the first image block E1 and the first image block F1.

[0114] Similarly, for the first image block D2, the first image block E2 and the first image block F2, block division is performed in the same manner to obtain 12 second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the target electrical signals corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the threshold range corresponding to the target electrical signals of the first image block D2, the first image block E2 and the first image block F2.

[0115] According to the above method, the threshold range of the target electrical signal corresponding to each first image block can be obtained.

[0116] In a possible implementation, the industrial computer constructs multiple trajectory amplitude maps corresponding to the target electrical signals based on the target electrical signals corresponding to the multiple reference slice layers, and the multiple trajectory amplitude maps correspond to the multiple reference slice layers; wherein the multiple reference slice layers are slice layers determined to be defect-free according to the scheme of the present application. The contour of the reference slice layer is the same or similar to the contour of the target slice layer, and the multiple reference slice layers are slice layers for laser processing of parts with the same material as the target part. For each of the multiple trajectory amplitude maps, the same preset method is used to divide the multiple first image blocks; the reference slice layer can be divided into multiple first regions in the same division method, and the multiple first image blocks of the same slice layer correspond to the multiple first regions respectively. Based on the first image blocks obtained by dividing the multiple trajectory amplitude maps, multiple image block sets are obtained, each of which includes multiple first image blocks, and the multiple first image blocks belong to the above-mentioned multiple trajectory amplitude maps respectively, and the multiple first image blocks correspond to the regions with the same position in the multiple reference slice layers. The first image blocks in the same image block set are divided in the same division method to obtain multiple second image blocks.

[0117] Optionally, the multiple second image blocks are preprocessed based on their average electrical signal amplitudes. For example, after the average electrical signal amplitudes of the multiple second image blocks are sorted in ascending order, the k second image blocks with the highest average electrical signal amplitudes and the k second image blocks with the lowest average electrical signal amplitudes among the multiple second image blocks are eliminated.

[0118] The industrial computer obtains the ratio of the average electrical signal amplitude of each second image block to the average electrical signal amplitude to which the second image block belongs; among the ratios corresponding to the second image blocks obtained in the above manner, the maximum ratio and the minimum ratio are determined as the upper limit and the lower limit of the ratio range of the corresponding image block set.

[0119] It should be understood that the first image block in the above-mentioned image block set corresponds to the same first area in the reference slice layer, and when determining whether the target slice layer has defects, the trajectory amplitude map corresponding to the target slice layer is divided in the same way, and the first image block obtained by the division corresponds to the same area in the target slice layer; therefore, the ratio range of the corresponding electrical signals of the above-mentioned image block set can be regarded as the ratio range of the electrical signals corresponding to the first image block.

[0120] like Figure 5b As shown, Figure 5b Figures A, B, and C illustrate a reference slice layer respectively, and the contours of the three slice layers are the same. The position of the first region A1 in the reference slice layer shown in Figure A, the position of the first region B1 in the reference slice layer shown in Figure B, and the position of the first region C1 in the reference slice layer shown in Figure C are the same. Figure 5b The trajectory amplitude diagrams shown in Figures D, E and F are trajectory amplitude diagrams corresponding to the target electrical signals of the reference slice layers shown in Figures A, B and C. The first image block D1 corresponds to the first area A1, the first image block E1 corresponds to the first area B1, and the first image block F1 corresponds to the first area C1.

[0121] Similarly, the position of the first region A2 in the reference slice layer shown in FIG. A, the position of the first region B2 in the reference slice layer shown in FIG. B, and the position of the first region C2 in the reference slice layer shown in FIG. C are the same. The first image block D2 corresponds to the first region A2, the first image block E2 corresponds to the first region B2, and the first image block F2 corresponds to the first region C2.

[0122] For the first image block D1, the first image block E1 and the first image block F1, block division is performed in the same manner to obtain 12 second image blocks; the ratio of the average electrical signal amplitude of each of the 12 second image blocks to the average electrical signal amplitude of the first image block to which the second image block belongs is determined respectively, and the maximum value and the minimum value of the ratios corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the ratio range corresponding to the target electrical signals of the first image block D1, the first image block E1 and the first image block F1.

[0123] Similarly, for the first image block D2, the first image block E2 and the first image block F2, block division is performed in the same manner to obtain 12 second image blocks; the ratio of the average electrical signal amplitude of each of the 12 second image blocks to the average electrical signal amplitude of the first image block to which the second image block belongs is determined respectively, and the maximum value and the minimum value of the ratios corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the ratio range corresponding to the target electrical signals of the first image block D2, the first image block E2 and the first image block F2.

[0124] According to the above method, the threshold range of the target electrical signal corresponding to each first image block can be obtained.

[0125] The target electrical signal is an electrical signal corresponding to the outgoing light signal, an electrical signal corresponding to the laser reflection signal, an electrical signal corresponding to the visible light signal, or an electrical signal corresponding to the infrared light signal. That is to say, the threshold range corresponding to the outgoing light signal, the threshold range corresponding to the laser reflection signal, the threshold range corresponding to the visible light signal, and the threshold range corresponding to the infrared light signal can all be obtained according to the above method.

[0126] It should be understood that the preset manner used to divide the trajectory amplitude map when determining the threshold range is the same as the preset manner used to divide the trajectory amplitude map when determining whether there is a defect in the target slice layer.

[0127] In one possible implementation, when the industrial control computer determines that there is an area in the target slice layer, it obtains the position information of the abnormal area in the target slice layer, and transmits the position information of the abnormal area to the laser processing system, so that the laser processing system reprocesses the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer, thereby eliminating the defects in the target slice layer. It should be understood that the laser processing system here specifically refers to the control system of the additive manufacturing equipment.

[0128] It should be understood that since the image blocks of the target slice layer are obtained by dividing the trajectory amplitude map of the target slice layer in a preset manner, the image blocks correspond to the areas in the target slice layer. Therefore, after determining the abnormal area of ​​the target slice layer, the industrial control computer determines the position information of the abnormal area in the target slice layer based on the preset method.

[0129] In a feasible implementation, when it is determined that there is an abnormal area in the target slice layer, the industrial control computer obtains the average electrical signal amplitude of the light output signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area of ​​the target slice layer. The industrial control computer compares the average electrical signal amplitude of the light output signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area with the corresponding preset thresholds respectively; based on the comparison result, the industrial control computer sends an instruction message to the additive manufacturing equipment control system to instruct the additive manufacturing equipment control system to adjust the light output power of the laser. If the comparison result is that the number of electrical signals higher than the corresponding preset threshold is greater than the number of electrical signals lower than the corresponding preset threshold, it means that the reason why the target slice layer has an abnormal area may be that the laser output power is too high, and the indication information is used to instruct the additive manufacturing equipment control system to reduce the laser output power; if the comparison result is that the number of electrical signals higher than the corresponding preset threshold is not greater than the number of electrical signals lower than the corresponding preset threshold, it means that the reason why the target slice layer has an abnormal area may be that the laser output power is too low, and the indication information is used to instruct the additive manufacturing equipment control system to increase the laser output power.

[0130] After completing the above adjustment, the industrial computer transmits the position information of the abnormal area to the control system of the additive manufacturing equipment, so that the control system of the additive manufacturing equipment controls the reprocessing of the abnormal area according to the position information and indication information of the abnormal area, so as to achieve the purpose of eliminating the defects in the target slice layer. And processing the subsequent slice layer based on the adjusted light output power can avoid the occurrence of defects in the subsequent slice layer.

[0131] In combination with the first aspect, in a possible implementation manner, the method of this embodiment further includes:

[0132] Method 1: The industrial control computer obtains the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer. When the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, that is, the area of ​​the abnormal region of the target slice layer is larger, the industrial control computer determines that the abnormal region of the target slice layer needs to be reprocessed, and the industrial control computer transmits the position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system reprocesses the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer;

[0133] or,

[0134] Method 2: The industrial computer obtains the position information of all abnormal areas from the first layer to the target slice layer, groups the position information of all abnormal areas, and the position information in the same group indicates the same position; based on the grouping result, the target group is determined, and the target group is a group where the number of position information is greater than the preset number, that is, the position corresponding to the target group is the position where the number of abnormal areas appears more frequently, which may be caused by incorrect setting of the processing parameters of the laser processing system. Therefore, the industrial computer transmits the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; thereby overcoming the occurrence of abnormal situations in the same area of ​​subsequent slice layers;

[0135] or,

[0136] Method three, the industrial control computer obtains the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. When the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, that is, the area of ​​the abnormal area of ​​the target slice layer is small, but the accumulated area of ​​the abnormal area from the first layer to the target slice layer is large, the industrial control computer needs to suppress the increase of the area of ​​the abnormal area. At this time, the industrial control computer The position information of all abnormal areas in the target slice layer is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal areas of the target slice layer based on the position information of the abnormal areas of the target slice layer; optionally, the industrial control computer also transmits the position information of the abnormal areas of the slice layer of a preset value adjacent to the target slice layer to the laser processing system, so that when the laser processing system re-processes the abnormal areas of the target slice layer based on the position information of the abnormal areas of the target slice layer, it re-processes the abnormal areas of the slice layer of a preset value adjacent to the target slice layer, thereby further suppressing the increase in the area of ​​the abnormal area.

[0137] It should be pointed out here that method 1 and method 2 can be executed separately or simultaneously, and there is no limitation here.

[0138] In a possible implementation, the industrial control computer obtains one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, where the target group is a group in which the number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position, and the industrial control computer compares the position information of the abnormal area of ​​the target slice layer, the area of ​​the abnormal area of ​​the target slice layer to the target One or more of the ratio of the areas of the slice layers, the ratio of the total areas of all abnormal areas from the first layer to the target slice layer to the total areas of all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total areas of all abnormal areas from the first layer to the target slice layer to the total areas of all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0139] It should be pointed out here that, the specific process of the laser processing system re-processing the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the specific process of the laser processing system adjusting the parameters of the laser processing system based on the position information corresponding to the target group can be found in the relevant description of the above-mentioned industrial control computer execution operation, which will not be described here.

[0140] Optionally, before transmitting one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system, the industrial control computer sends a reprocessing request or a processing parameter adjustment request to the terminal device of the processing personnel. If a response message indicating that the processing personnel agrees to reprocess or adjust the processing parameters is received, the industrial control computer transmits one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system.

[0141] It should be understood that the laser processing system here specifically refers to the control system of the additive manufacturing equipment.

[0142] This method allows processing personnel to determine whether the abnormal area needs to be reprocessed or the processing parameters need to be adjusted, or allows processing personnel to further determine whether the abnormal area is a true abnormal area, and then determine whether the abnormal area needs to be reprocessed, thereby improving processing flexibility.

[0143] By acquiring and displaying the above information, the processing personnel can know the information of the abnormal area of ​​each slice layer from the first layer to the current layer during the processing, as well as the overall information of the abnormal area from the first layer to the current layer.

[0144] In a possible implementation, the method of this embodiment further includes: the industrial computer displays at least two trajectory amplitude graphs and displays the result of whether the target slice layer has defects; when the industrial computer determines that the target slice layer has defects, it displays or marks the abnormal area of ​​the target slice layer on the at least two trajectory amplitude graphs, so that the inspection personnel know the location information of the abnormal area in the target slice layer. Figure 5c As shown, the abnormal area of ​​the target slice layer is marked by circumscribing a box.

[0145] It can be seen that in the scheme of the present application, in the process of processing the target slice layer of the target part, at least two of the electrical signals corresponding to the light output signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal and the electrical signals corresponding to the infrared light signal are obtained; at least two trajectory amplitude graphs are constructed based on the electrical signals corresponding to the light output signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal and the electrical signals corresponding to the infrared light signal, respectively, and the regions with defects in the target slice layer, that is, the abnormal regions, are determined based on the average electrical signal amplitudes of the image blocks obtained by the block division by dividing the constructed trajectory amplitude graphs. In this way, while being able to detect the abnormal regions of the slice layer of the part during the additive processing, compared with the prior art, the parts will not be damaged and the cost is low. By judging whether there is a defect in the region corresponding to the image block in each image block set in the target slice layer by the average electrical signal amplitudes of at least two image blocks respectively belonging to at least two trajectory amplitude graphs, the accuracy of the judgment result can be improved. By displaying at least two trajectory amplitude graphs and the results of whether there is a defect, it is convenient for processing personnel to know whether there is a defect in the target slice layer. And when there are defects, it is easy for the processing personnel to know which specific area of ​​the target slice layer has defects, so as to facilitate subsequent reprocessing.

[0146] See also Figure 6 , the present application embodiment provides a structural diagram of an industrial control computer. Figure 6 As shown, the industrial computer 600 includes:

[0147] An acquisition unit 601 is used to acquire an electrical signal corresponding to an optical signal in a first time period during the laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals of a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period;

[0148] A construction unit 602 is used to construct at least two trajectory amplitude maps based on at least two electrical signals corresponding to at least two optical signals; the contour of each trajectory amplitude map in the at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to the processing trajectory when processing the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the corresponding electrical signal in the process of processing the target slice layer;

[0149] A display unit 603, used to display at least two trajectory amplitude graphs;

[0150] The dividing unit 604 is used to divide the at least two trajectory amplitude maps respectively to obtain a plurality of first image blocks; divide each of the plurality of first image blocks respectively to obtain a plurality of image block sets; the plurality of image block sets correspond to regions of the target slice layer; each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to the at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same region of the target slice layer;

[0151] A determination unit 605 is configured to determine whether there is a defect in a region corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set;

[0152] The display unit 603 is further configured to display an abnormal region of the target slice layer on the at least two trajectory amplitude images when it is determined that the target slice layer has a defect.

[0153] In a possible implementation, in terms of determining whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set, the determining unit 605 is specifically configured to:

[0154] The detection result corresponding to each second image block is determined based on the electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; and whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer is determined based on the detection result corresponding to the second image block in each image block set.

[0155] In one possible implementation, when the electrical signal amplitude of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the image block in the target slice layer; when the electrical signal amplitude of each second image block does not exceed the threshold range of the electrical signal corresponding to the second image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the second image block in the target slice layer.

[0156] In a possible implementation, in determining the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set, the determining unit 605 is specifically configured to:

[0157] The industrial control computer determines the ratio of each second image block, and the ratio of each second image block is the ratio of the electrical signal amplitude of the second image block to the electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0158] In a possible implementation, in terms of determining whether there is a defect in an area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, the determining unit 605 is specifically configured to:

[0159] When the detection results corresponding to all second image blocks in the target image block set are that there is a defect in the area corresponding to the second image block in the target slice layer, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of multiple image block sets.

[0160] In a possible implementation, in terms of determining whether there is a defect in an area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set, the determining unit 605 is specifically configured to:

[0161] When the detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include a second image block with a priority higher than the preset priority, when the number of the multiple second image blocks is greater than the preset number, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer,

[0162] In one possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein, the second image block A belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser output signal; the second image block B belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; and the second image block D belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal.

[0163] In a possible implementation, the acquisition unit 601 is further used to acquire one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, where the target group is a group whose number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position,

[0164] The industrial control computer also includes: a sending unit 606, which is used to transmit one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0165] In a possible implementation, the acquisition unit 601 is further used to acquire the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer, and the sending unit 606 is further used to, when the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, the industrial control computer transmits the position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer;

[0166] or,

[0167] The acquisition unit 601 is further used to acquire the position information of all abnormal areas from the first layer to the target slice layer, and group the position information of all abnormal areas, so that the position information in the same group indicates the same position; the sending unit 606 is further used to transmit the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; the target group is a group whose number of position information is greater than a preset number;

[0168] or,

[0169] The acquisition unit 601 is also used to obtain the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. The sending unit 606 is also used to transmit the position information of all abnormal areas in the target slice layer to the laser processing system if the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0170] In a possible implementation, the electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

[0171] In a possible implementation, the construction unit 602 is specifically configured to:

[0172] The first and last coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map are obtained; the target trajectory amplitude map is one of at least two trajectory amplitude maps; the number of first additive processing points of each trajectory line is calculated based on the first and last coordinates, laser printing speed and sampling rate of each trajectory line; the number of second additive processing points of each trajectory line is obtained based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the absolute value of the difference between the number of second additive processing points of the target trajectory line and the number of first additive processing points of the target trajectory line is less than the preset ratio, the target trajectory line is retained; if it exceeds, the target trajectory line is deleted.

[0173] Further, in the aspect of deleting the target trajectory if the ratio of the absolute value of the difference between the number of the second additive processing points of the target trajectory and the number of the first additive processing points of the target trajectory exceeds a preset ratio, the construction unit 602 is specifically configured to:

[0174] If the ratio of the absolute value of the difference between the number of second additive processing points of the target trajectory line and the number of first additive processing points of the target trajectory line to the number of first additive processing points of the target trajectory line exceeds a preset ratio, and the ratio of the absolute value of the difference between the number of second additive processing points of a next trajectory adjacent to the target trajectory in the processing order and the number of first additive processing points of the next trajectory to the number of first additive processing points of the next trajectory does not exceed the preset ratio, the target trajectory is deleted.

[0175] In a possible implementation, the display unit 603 is also used to display the result of whether the target slice layer has defects; when the industrial control computer determines that the target slice layer has defects, it displays the abnormal area of ​​the target slice layer on at least two trajectory amplitude graphs.

[0176] It should be noted that the above-mentioned units (acquisition unit 601, construction unit 602, display unit 603, division unit 604, determination unit 605 and sending unit 606) are used to execute the relevant steps of the above-mentioned method. For example, acquisition unit 601 is used to execute the relevant content of S201, construction unit 602 is used to execute the relevant content of S202, division unit 604 is used to execute the relevant content of S203, display unit 603, determination unit 605 and sending unit 606 are used to execute the relevant content of S204. Each unit or module in the industrial computer 600 can be combined into one or several other units or modules separately or in full, or one (some) of the units or modules can be further divided into multiple units or modules with smaller functions, which can achieve the same operation without affecting the realization of the technical effects of the embodiments of the present invention. The above-mentioned units or modules are divided based on logical functions. In practical applications, the functions of one unit (or module) can also be realized by multiple units (or modules), or the functions of multiple units (or modules) can be realized by one unit (or module).

[0177] Based on the description of the above method embodiment and device embodiment, please refer to Figure 7 , an embodiment of the present invention also provides a structural schematic diagram of another industrial control computer 700. Figure 7 The industrial computer 700 shown (the industrial computer 700 may be a computer device) includes a memory 701, a processor 702, a communication interface 703 and a bus 704. The memory 701, the processor 702 and the communication interface 703 are connected to each other through the bus 704.

[0178] The memory 701 may be a read-only memory (ROM), a static storage device, a dynamic storage device or a random access memory (RAM).

[0179] The memory 701 can store programs. When the program stored in the memory 701 is executed by the processor 702, the processor 702 and the communication interface 703 are used to execute each step of the additive manufacturing quality detection method of the embodiment of the present application.

[0180] The processor 702 can adopt a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), a graphics processing unit (GPU) or one or more integrated circuits to execute relevant programs to implement the functions required to be performed by the units in the industrial control computer 600 of the embodiment of the present application, or to execute the additive manufacturing quality detection method of the method embodiment of the present application.

[0181] The processor 702 may also be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the additive manufacturing quality detection method of the present application may be completed by an integrated logic circuit of hardware or software instructions in the processor 702. The above-mentioned processor 702 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present application may be directly embodied as being executed by a hardware decoding processor, or may be executed by a combination of hardware and software modules in a decoding processor. The software module may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 701, and the processor 702 reads the information in the memory 701, and combines its hardware to complete the functions required to be performed by the units included in the industrial control computer 700 of the embodiment of the present application, or executes the additive manufacturing quality detection method of the method embodiment of the present application.

[0182] The communication interface 703 uses a transceiver such as, but not limited to, a transceiver to implement communication between the industrial computer 700 and other devices or a communication network. For example, data can be obtained through the communication interface 703 .

[0183] The bus 704 may include a path for transmitting information between various components of the industrial computer 700 (eg, the memory 701 , the processor 702 , and the communication interface 703 ).

[0184] It should be noted that although Figure 7The industrial computer 700 shown only shows a memory, a processor, and a communication interface. However, in the specific implementation process, those skilled in the art should understand that the industrial computer 700 also includes other devices necessary for normal operation. At the same time, according to specific needs, those skilled in the art should understand that the industrial computer 700 may also include hardware devices for implementing other additional functions. In addition, those skilled in the art should understand that the industrial computer 700 may also include only the devices necessary for implementing the embodiments of the present application, and does not necessarily include Figure 7 All devices shown in .

[0185] An embodiment of the present application also provides a chip, which includes a processor and a data interface. The processor reads instructions stored in a memory through the data interface to implement the additive manufacturing quality detection method.

[0186] Optionally, as an implementation method, the chip may further include a memory, in which instructions are stored, and the processor is used to execute the instructions stored in the memory. When the instructions are executed, the processor is used to execute the additive manufacturing quality inspection method.

[0187] An embodiment of the present application also provides a computer-readable storage medium, which stores instructions. When the computer-readable storage medium is executed on a computer or a processor, the computer or the processor executes one or more steps in any of the above methods.

[0188] The embodiment of the present application further provides a computer program product including instructions. When the computer program product is executed on a computer or a processor, the computer or the processor executes one or more steps in any of the above methods.

[0189] Those skilled in the art will appreciate that the functions described in conjunction with the various illustrative logic blocks, modules, and algorithm steps disclosed herein can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions described in the various illustrative logic blocks, modules, and steps can be stored or transmitted as one or more instructions or codes on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media may include computer-readable storage media, which corresponds to tangible media, such as data storage media, or includes any media (e.g., based on a communication protocol) that facilitates the transfer of a computer program from one place to another. In this manner, computer-readable media may generally correspond to (1) non-temporary tangible computer-readable storage media, or (2) communication media, such as signals or carrier waves. Data storage media may be any available media that can be accessed by one or more computers or one or more processors to retrieve instructions, codes, and / or data structures for implementing the techniques described in this application. A computer program product may include computer-readable media.

[0190] As an example and not limitation, such computer-readable storage media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage, flash memory, or any other medium that can be used to store the desired program code in the form of instructions or data structures and can be accessed by a computer. Also, any connection is properly referred to as a computer-readable medium. For example, if instructions are transmitted from a website, server or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio and microwave are included in the definition of media. However, it should be understood that the computer-readable storage media and data storage media do not include connections, carrier waves, signals or other temporary media, but are actually directed to non-temporary tangible storage media. As used herein, disks and optical disks include compact disks (CDs), laser optical disks, optical optical disks, digital versatile disks (DVDs), and Blu-ray disks, where disks typically reproduce data magnetically, while optical disks reproduce data optically using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0191] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Thus, the term "processor" as used herein may refer to any of the aforementioned structures or any other structures suitable for implementing the techniques described herein. Additionally, in some aspects, the functions described by the various illustrative logic blocks, modules, and steps described herein may be provided within dedicated hardware and / or software modules configured for encoding and decoding, or incorporated in a combined codec. Moreover, the techniques may be fully implemented in one or more circuits or logic elements.

[0192] The techniques of the present application may be implemented in a variety of devices or apparatuses, including a wireless handset, an integrated circuit (IC), or a set of ICs (e.g., a chipset). Various components, modules, or units are described in this application to emphasize functional aspects of devices for performing the disclosed techniques, but do not necessarily need to be implemented by different hardware units. In fact, as described above, the various units may be combined in an encoded hardware unit in conjunction with appropriate software and / or firmware, or provided by interoperating hardware units (including one or more processors as described above).

[0193] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the specific descriptions of the corresponding steps in the aforementioned method embodiments, and will not be repeated here.

[0194] It should be understood that in the description of the present application, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship, for example, A / B can represent A or B; wherein A and B can be singular or plural. Also, in the description of the present application, unless otherwise specified, "multiple" refers to two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, wherein a, b, c can be single or multiple. In addition, in order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same items or similar items with substantially the same functions and effects. Those skilled in the art can understand that the words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not limit them to be necessarily different. Meanwhile, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0195] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the division of the unit is only a logical function division, and there may be other division methods in actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. The mutual coupling, direct coupling, or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0196] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0197] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (digital subscriber line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media integrations. The available medium may be a read-only memory (ROM), or a random access memory (RAM), or a magnetic medium, such as a floppy disk, a hard disk, a tape, a disk, or an optical medium, such as a digital versatile disc (DVD), or a semiconductor medium, such as a solid state disk (SSD), etc.

[0198] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

[0199] The device embodiments described above are merely illustrative, wherein the units and modules described as separate components may or may not be physically separated. In addition, some or all of the units and modules may be selected according to actual needs to achieve the purpose of the present embodiment. Those of ordinary skill in the art may understand and implement the present invention without creative effort.

[0200] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for detecting quality of additive manufacturing, characterized in that: The method comprises: Acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals of a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; At least two trajectory amplitude maps are constructed based on the at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude map in the at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to the processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the corresponding electrical signals in the process of processing the target slice layer; Dividing the at least two trajectory amplitude images respectively to obtain a plurality of first image blocks; The plurality of first image blocks are respectively divided into blocks to obtain a plurality of image block sets; the plurality of image block sets correspond to regions of the target slice layer; each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same region of the target slice layer; Based on the electrical signal amplitude of the second image block in each image block set and the electrical signal corresponding to the first image block to which the second image block belongs, it is determined whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer.

2. The method according to claim 1, characterized in that: The determining whether there is a defect in a region corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set and the electrical signal corresponding to the first image block to which the second image block belongs includes: Determine the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set and the electrical signal corresponding to the first image block to which the second image block belongs; Based on the detection result corresponding to the second image block in each image block set, it is determined whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer.

3. The method according to claim 2, characterized in that When the amplitude of the electrical signal of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; When the electrical signal amplitude of each image block does not exceed the threshold range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

4. The method according to claim 2, characterized in that: The determining the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set and the electrical signal corresponding to the first image block to which the second image block belongs comprises: Determine a ratio of each second image block, wherein the ratio of each second image block is a ratio of an electrical signal amplitude of the second image block to an electrical signal amplitude of the first image block to which the second image block belongs; When the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that a defect exists in the area corresponding to each second image block in the target slice layer; When the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

5. The method according to any one of claims 2 to 4, characterized in that: The determining whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set includes: When the detection results corresponding to all the second image blocks in the target image block set indicate that the area corresponding to the second image block in the target slice layer has a defect, it is determined that the area corresponding to the second image block in the target image block set in the target slice layer has a defect; The target image block set is one of the multiple image block sets.

6. The method according to claim 3 or 4, characterized in that: The determining whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set includes: When the detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; If the plurality of second image blocks do not include an image block with a priority higher than a preset priority, when the number of the plurality of second image blocks is greater than a preset number, it is determined that a region corresponding to a second image block in the target image block set in the target slice layer has a defect.

7. The method according to claim 6, characterized in that The priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; Among them, the second image block A belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the optical signal of the laser; the second image block B belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; the second image block D belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal.

8. The method according to any one of claims 1 to 4, characterized in that: The method further comprises: Obtain one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, wherein the target group is a group whose number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position; One or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group are transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

9. The method according to any one of claims 1 to 4, characterized in that: The method further comprises: acquiring a ratio of an area of ​​the abnormal region of the target slice layer to an area of ​​the target slice layer, and when the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, transmitting position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer; or, Acquire the position information of all abnormal areas from the first layer to the target slice layer, group the position information of all abnormal areas, and the position information in the same group indicates the same position; transmit the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group; the target group is a group with a number of position information greater than a preset number; or, Obtain the ratio of the total area of ​​all abnormal regions from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. If the ratio of the total area of ​​all abnormal regions from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than a second preset ratio, and the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, transmit the position information of all abnormal regions in the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

10. The method according to claim 9, characterized in that The electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

11. The method according to any one of claims 1 to 4, characterized in that: The step of constructing at least two trajectory amplitude graphs based on the at least two electrical signals corresponding to the at least two optical signals comprises: Obtaining the first and last coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of the at least two trajectory amplitude maps; Calculating the number of first additive processing points of each trajectory line based on the first and last coordinates of each trajectory line, the laser printing speed and the sampling rate; Acquire the number of second additive processing points of each trajectory line based on a target electrical signal; the target electrical signal is an electrical signal corresponding to the target trajectory amplitude map; For a target trajectory line in the target trajectory amplitude map, if the ratio of the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line to the number of the first additive processing points does not exceed a preset ratio, the target trajectory line is retained in the target trajectory amplitude map; if it exceeds, the target trajectory line is deleted.

12. The method according to claim 11, characterized in that If the target track is exceeded, the target track is deleted, including: If it exceeds, and the ratio of the absolute value of the difference between the number of second additive processing points of a next trajectory adjacent to the target trajectory in the processing order and the number of first additive processing points of the next trajectory to the number of first additive processing points of the next trajectory line does not exceed the preset ratio, the target trajectory is deleted.

13. The method according to claim 11, characterized in that The method further comprises: The at least two trajectory amplitude maps are displayed, and the result of whether the target slice layer has defects is displayed; when it is determined that the target slice layer has defects, an abnormal area of ​​the target slice layer is displayed on the at least two trajectory amplitude maps.

14. An industrial computer, characterized in that: include: an acquisition unit, configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals of a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; A construction unit, configured to respectively construct at least two trajectory amplitude maps based on at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude map of the at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map comprises a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the corresponding electrical signals during the processing of the target slice layer; A display unit, used for displaying the at least two trajectory amplitude graphs; a dividing unit, configured to divide the at least two trajectory amplitude maps respectively to obtain a plurality of first image blocks; and to divide the plurality of first image blocks respectively to obtain a plurality of image block sets; and the plurality of image block sets correspond to regions of the target slice layer; Each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude images, and the at least two second image blocks correspond to the same area of ​​the target slice layer; a determining unit, configured to determine whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on an amplitude of an electrical signal of the second image block in each image block set and an electrical signal corresponding to a first image block to which the second image block belongs; The display unit is further configured to display an abnormal region of the target slice layer on the at least two trajectory amplitude images when it is determined that the target slice layer has a defect.

15. An industrial computer, characterized in that: It includes a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial computer executes the method as described in any one of claims 1-13.

16. A laser processing control system, comprising: A laser welding system, a sensor module, a signal processing module and an industrial computer, wherein the industrial computer is used to execute the method as described in any one of claims 1-13.

17. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 13.

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