Crystal orthogonal angle deviation adjustment method

Abstract

The application provides a crystal orthogonal angle deviation adjustment method, comprising the following steps: fixing a peak searching detection tool; fixing a crystal; rotating the crystal and performing peak searching measurement to obtain a position corresponding to a specific direction; marking a parallel line segment on the crystal and marking an arrow at one end of the parallel line segment; adjusting the position of the crystal, so that the crystal column is upward and the arrow points to the direction of the radiation of a directional instrument; measuring the deviation angle of the upper surface of the crystal, which is the Y-axis angle; preparing a bonding table suitable for the Y-axis angle; fixing the crystal on the bonding table according to the direction of the arrow; processing through a flat grinding equipment; and repeatedly performing the above steps until the adjustment of the orthogonal angle deviation of the crystal is completed. The crystal orthogonal angle deviation adjustment method provided by the application can ensure the accuracy of orthogonal angle detection, simplify the operation steps, reduce the number of operations on the surface of the crystal, reduce the dependence on the precision of the equipment, and improve the efficiency of orthogonal angle deviation adjustment.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of crystal processing, and particularly relates to a crystal orthogonal angle deviation adjustment method. BACKGROUND

[0002] Single crystal materials are solid materials composed of crystalline substances, which contain atoms, ions, molecules or groups with periodic regular arrangement and translational symmetry, and are widely used in cutting-edge science and technology.

[0003] Silicon carbide crystal is a single crystal of hexagonal system, and its orthogonal angle deviation needs to be measured and adjusted in the processing process. Specifically, the indices of the hexagonal system are as shown in the formula (1); in the processing process of a specific crystal, the normal line of the (0001) plane needs to be deviated to the direction of <0001>; when the normal line of the (0001) plane is not deviated to the direction of <0001>, an angle will be formed between the normal line and the direction of <0001> (that is, the normal line and the direction of <0001> form an angle on the surface of the crystal ingot), and this angle is the orthogonal angle deviation. Figure 1

[0004] The existing orthogonal angle deviation adjustment method is relatively traditional, which first detects and calculates the orthogonal angle, and then changes a plurality of variables by cutting the crystal to finally achieve the technical purpose of adjusting the orthogonal angle deviation. The detection method of the orthogonal angle includes: defining the direction of <0001> as the X axis, and the direction of <0001> as the Y axis, that is, the Y axis is parallel to the crystal plane; at this time, as long as the deviation angle of the X axis and the Y axis is measured, the orthogonal angle can be calculated according to the formula. Figure 1

[0005] For example, when the X axis angle is 4° and the Y axis angle is 0.14°, the orthogonal angle is 2°; when the X axis angle is 4° and the Y axis angle is 0.35°, the orthogonal angle is 5°; that is, the variables in the calculation of the orthogonal angle are the X axis angle and the Y axis angle.

[0006] The inventor finds that the existing orthogonal angle deviation adjustment method is too complex, and usually needs multiple rounds of calculation and repeated cutting, which not only reduces the adjustment efficiency of the orthogonal angle deviation, but also causes the hidden danger of uneven surface of the main body due to improper cutting operation, resulting in the unexpected condition of the decline of the quality of the crystal. SUMMARY

[0007] ​​​​​​​​​The embodiment of the present application provides a crystal orthogonal angle deviation adjustment method, aiming at ensuring the accuracy of orthogonal angle detection, simplifying the operation steps, reducing the number of crystal surface operations, reducing the dependence on equipment precision, and improving the orthogonal angle deviation adjustment efficiency.

[0008] To achieve the above object, the technical scheme adopted by the present application is:

[0009] The present application provides a crystal orthogonal angle deviation adjustment method, which is suitable for a crystal with a certain crystal direction deviating towards a specific direction, defines the crystal direction as <0001>, and the specific direction as The crystal orthogonal angle deviation adjustment method comprises the following steps:

[0010] (1) Fix the peak searching detection tool to the workbench of the orientation instrument;

[0011] (2) Place the crystal on the peak searching detection tool, so that the upper surface of the crystal faces upwards, and limit the movement of the crystal by fixing the column surface of the crystal;

[0012] (3) Rotate the crystal along the circumference of the column surface, and simultaneously perform peak searching measurement by the orientation instrument, to obtain the position corresponding to the direction of the column surface;

[0013] (4) Mark a parallel line segment parallel to the <0001> surface on the crystal, and mark an arrow at one end of the parallel line segment;

[0014] (5) Adjust the position of the crystal, so that the column surface of the crystal faces upwards, and limit the movement of the crystal by fixing the upper surface of the crystal; simultaneously, make the arrow point to the direction of the radiation of the orientation instrument;

[0015] (6) Measure the off-angle of the upper surface of the crystal, define it as the Y-axis angle, and distinguish the positive and negative signs;

[0016] (7) Prepare a bonding table matched with the Y-axis angle;

[0017] (8) Fix the upper surface of the crystal downwards on the bonding table, and match the arrow direction with the bonding table according to the positive and negative of the Y-axis angle;

[0018] When the Y-axis angle is positive, the arrow points to the upper end of the bonding table; when the Y-axis angle is negative, the arrow points to the bottom end of the bonding table;

[0019] (9) Process the lower surface of the crystal by a flat grinding device, so that the Y-axis angle of the processed surface reaches the expected value;

[0020] ​​(10) repeating the step (2) to the step (6) :

[0021] repeating the step (7) to the step (9) when the Y-axis angle of the processing surface does not meet the orthogonal angle requirement;

[0022] ending the adjustment when the Y-axis angle of the processing surface meets the orthogonal angle requirement.

[0023] In one possible implementation, in the step (2), the crystal is fixed by a chuck fixedly installed on the orientation instrument.

[0024] In the embodiments of the present application, the adjustment of the orthogonal angle deviation is completed by measuring the Y-axis angle, thereby reducing the adjustment steps and improving the adjustment efficiency.

[0025] Compared with the prior art, the crystal orthogonal angle deviation adjustment method provided by the embodiments of the present application does not need to detect and adjust the orthogonal angle, thereby ensuring the accuracy of the orthogonal angle detection, simplifying the operation steps, reducing the number of operations on the crystal surface, reducing the dependence on the equipment precision, and improving the orthogonal angle deviation adjustment efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is an index diagram of hexagonal system;

[0027] Figure 2 is a step diagram of the crystal orthogonal angle deviation adjustment method proposed in the present application; DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0029] It should be noted that, in the description of the embodiments, the crystal plane family is represented by {xxxx}, the crystal plane is represented by (xxxx), the crystal direction is perpendicular to the crystal plane, and the crystal direction is represented by [xxxx] or <xxxx>Indicates.

[0030] Please see Figure 1 and Figure 2 The crystal orthogonal angle deviation adjustment method provided by the present application will be described. The crystal orthogonal angle deviation adjustment method proposed by the present application is suitable for a crystal with a certain crystal direction deviating towards a specific crystal direction. Taking a crystal with a <0001> crystal direction deviating towards a <1120> direction as an example, the method comprises the following steps:

[0031] (1) Fix the peak searching detection tool on the workbench of the orientation instrument; wherein, the working principle of the peak searching detection tool is to find the diffraction peak of the crystal face to perform peak searching detection.

[0032] (2) Place the crystal on the peak searching detection tool so that the upper surface of the crystal faces upwards, and limit the movement of the crystal by fixing the column surface of the crystal.

[0033] (3) Rotate the crystal along the circumference of the column surface, and perform peak searching measurement by the peak searching detection tool to obtain the position corresponding to the <1120> direction.

[0034] (4) Mark a parallel line segment parallel to the (1120) face on the crystal, and mark an arrow at one end of the parallel line segment, which can be understood as defining it as the Y axis.

[0035] (5) Adjust the position of the crystal so that the column surface of the crystal faces upwards, and limit the movement of the crystal by fixing the upper surface of the crystal; at the same time, make the arrow point to the direction of the radiation of the orientation instrument.

[0036] (6) Measure the deviation angle of the upper surface of the crystal, define it as the Y axis angle, and distinguish the positive and negative signs.

[0037] (7) Prepare an adhesive table matched with the Y axis angle; here, the adhesive table matched with the Y axis angle means that the included angle between the adhesive surface angle of the adhesive table and the horizontal plane is close to or equal to the Y axis angle.

[0038] (8) Fix the surface of the Y axis angle measured in step (6) downwards on the adhesive table, and match the Y axis angle with the adhesive table according to the positive and negative signs of the Y axis angle and the direction of the arrow, specifically: when the Y axis angle is positive, the arrow points to the upper end of the adhesive table; when the Y axis angle is negative, the arrow points to the bottom end of the adhesive table.

[0039] (9) Process the other surface of the Y axis angle measured in step (6) by a flat grinding device to make the Y axis angle of the processed surface reach the expected value.

[0040] (10) Repeat steps (2) to (6):

[0041] When the Y-axis angle of the processing surface does not meet the requirement of the orthogonal angle, steps (7) to (9) are repeated.

[0042] When the Y-axis angle of the processing surface meets the requirement of the orthogonal angle, the processing surface is fixed on the 0° bonding table with the downward direction, the other surface of the processing surface is processed by the flat grinding equipment, and the adjustment is completed.

[0043] In the embodiment, the adjustment of the orthogonal angle deviation is completed by measuring the Y-axis angle, the adjustment steps are reduced, and the adjustment efficiency is improved.

[0044] Compared with the prior art, the crystal orthogonal angle deviation adjustment method provided in the embodiment does not need to detect and adjust the orthogonal angle, thereby ensuring the accuracy of the orthogonal angle detection, simplifying the operation steps, reducing the number of operations on the crystal surface, reducing the dependence on the equipment precision, and improving the orthogonal angle deviation adjustment efficiency.

[0045] In the foregoing step (2), the crystal is fixed by the suction cup fixedly installed on the goniometer.

[0046] It should be noted that in the foregoing adjustment method, there are four conditions that are mutually restricted: one is that the Y-axis arrow points to the direction in which the goniometer emits the ray / the direction in which the goniometer receives the ray; the second is that the Y-axis angle is positive / negative; the third is that the bonding table A end is high and the B end is low / the bonding table A end is low and the B end is high; and the fourth is that the arrow points to the A end / the arrow points to the B end when the crystal is fixed on the bonding table. When two conditions are changed at the same time among the four conditions, the adjustment result is not affected.

[0047] The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.< / xxxx>

Claims

1. A method for adjusting the orthogonality angle deviation of crystals, applicable to crystals where a certain crystal orientation is biased towards a specific direction, wherein the crystal orientation is defined as... <0001> The specific direction is <11 0>; characterized in that, The crystal orthogonal angle deviation adjustment method comprises the following steps: (1) Fix the peak detection tool to the workbench of the goniometer; (2) Place the crystal on the peak detection tool so that the upper surface of the crystal faces upward, and limit the movement of the crystal by fixing the column surface of the crystal; (3) rotating the crystal along the circumference of the girdle while peak searching measurement is performed by the orienter to obtain the position corresponding to the <11 0> direction; (4) Mark parallel to (11) on the upper surface of the crystal. 0) Parallel line segments of the surface, the (11) 0) The surface is perpendicular to the <11 A plane in the direction of 0, and an arrow is marked at one end of the parallel line segment; (5) Adjust the position of the crystal so that the column surface of the crystal faces upward, and limit the movement of the crystal by fixing the upper surface of the crystal; at the same time, the arrow points to the direction of the goniometer radiation; (6) Measure the deviation angle of the upper surface of the crystal, define it as the Y-axis angle, and distinguish the positive and negative signs; (7) Prepare an adhesive table suitable for the Y-axis angle; (8) Fix the upper surface of the crystal downward on the adhesive table, and match the arrow direction with the adhesive table according to the positive and negative of the Y-axis angle; When the Y-axis angle is positive, the arrow points to the upper end of the adhesive table; when the Y-axis angle is negative, the arrow points to the bottom end of the adhesive table; (9) Process the lower surface of the crystal by a flat grinding device to make the Y-axis angle of the processed surface reach the expected value; (10) Repeat the steps (2) to (6): When the Y-axis angle of the processed surface does not meet the orthogonal angle requirement, repeat the steps (7) to (9); When the Y-axis angle of the processed surface meets the orthogonal angle requirement, end the adjustment.

2. The method of claim 1, wherein the step of adjusting the crystal orthogonal angle deviation is performed by adjusting the crystal orthogonal angle deviation to a value of 0.1° or less. Comprise: In the step (2), the crystal is fixed by fixing the suction cup installed on the goniometer.

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