A cleaving apparatus and a cleaving method

By integrating a platform, angle adjustment mechanism, CCD camera, and cleaving pin, the problem of contamination and poor stability during wafer cleaving was solved, achieving high-precision and stable cleaving results and avoiding the effects of debris contamination and scriber wear.

CN117799075BActive Publication Date: 2026-06-26WUHAN BRIGHT DIODE LASER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WUHAN BRIGHT DIODE LASER TECH CO LTD
Filing Date
2023-12-26
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing wafer cleaving equipment suffers from problems such as wafer front-side contamination and poor scriber stability during wafer cleaving. In particular, the complex alignment process required for split-type equipment and the scribing process for integrated equipment lead to debris contamination and scriber wear, which affect the cleaving effect.

Method used

The cleaving equipment includes a platform, an angle adjustment mechanism, a scribing tool, a CCD camera, and a cleaving pin. The platform moves to fix the wafer, the CCD camera captures a scratch pattern to adjust the scribing tool angle, and the cleaving pin moves along the cleaving line to achieve natural cleaving. The negative pressure generator and cleaving blue film are combined to improve the fixation effect and flatness.

Benefits of technology

It achieves high-precision and stable cleaving results, avoids contamination of the wafer surface by dirt and debris, and ensures the optimal contact angle of the scribing tool and the stability of the cleaving process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN117799075B_ABST
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Abstract

The application provides a cleaving device and a cleaving method, and relates to the technical field of semiconductors. The first platform and the second platform are arranged, and when the first platform and the second platform move to contact each other, the first platform and the second platform can be used for fixing a product to be cleaved. A cutter can be used to draw a test line on the upper surface of the product to be cleaved. A CCD camera can be used to shoot the test line and display a scratch diagram of the test line. An angle adjusting mechanism can adjust the pitch angle and the rotation angle of the cutter according to the scratch diagram, so that the cutter tip contacts the upper surface of the product to be cleaved at an optimal line drawing angle. The optimal line drawing angle can also be referred to as the angle at which the cutter tip is perpendicular to the product to be cleaved. Therefore, a cleaving line with high precision, good flatness and good stability can be drawn on the product to be cleaved. Even if the cutter is worn, the pitch angle and the rotation angle of the cutter can be adjusted, so that the cutter tip contacts the product to be cleaved at the optimal line drawing angle, and the stability of the cleaving effect is good.
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