A radiator partition control method, system, device and storage medium

Abstract

The present application relates to the technical field of radiator control, and in particular to a partition control method, system, device and storage medium for radiator, the method comprising obtaining temperature information, the temperature information comprising temperature information and temperature thresholds corresponding to a main partition and multiple sub-partitions; obtaining temperature adjustment information corresponding to the main partition and multiple sub-partitions; determining one or more partitions that need to be turned on for heat dissipation as target partitions according to the temperature information; determining a heat dissipation scheme according to the temperature adjustment information; and controlling the target radiator to be turned on according to the heat dissipation scheme until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition. The present application can achieve the beneficial effect of reducing the power consumption of the radiator.

Description

Technical Field

[0001] The present application relates to the technical field of radiator control, and in particular to a radiator partition control method, system, device and storage medium. Background Art

[0002] When electronic equipment is running, it not only meets the needs of users in production and life, but also generates a lot of heat, which causes the temperature of the working environment of the electronic equipment to rise. If the temperature of the working environment of the electronic equipment is too high, it may cause some components of the electronic equipment to be damaged or fail, or even cause problems in the operation of the entire electronic equipment. Therefore, the heat dissipation system of the electronic equipment is particularly critical.

[0003] At present, electronic devices usually have a heat sink such as a cooling fan installed inside or outside to dissipate heat. For electronic devices, multiple heat sinks can be installed to dissipate heat in multiple areas according to actual heat dissipation needs. Although this method can achieve high heat dissipation efficiency, it is difficult to perform corresponding heat dissipation and temperature control according to actual needs. The problem of excessive power consumption is caused by opening multiple heat sinks at the same time. Therefore, how to reduce heat dissipation power consumption while ensuring heat dissipation efficiency is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The embodiments of the present application provide a radiator partition control method, system, device and storage medium, which can achieve the beneficial effect of reducing the power consumption of the radiator.

[0005] A first aspect of the present application provides a radiator partition control method, the method comprising:

[0006] Acquire temperature information, where the temperature information includes temperature information and temperature thresholds corresponding to the main partition and multiple sub-partitions;

[0007] Acquire temperature adjustment information corresponding to the main partition and the plurality of sub-partitions;

[0008] According to the temperature information, determining one or more partitions that need to start heat dissipation as target partitions;

[0009] Determining a heat dissipation solution according to the temperature adjustment information;

[0010] According to the heat dissipation solution, the target heat sink is controlled to be turned on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0011] By adopting the above technical solution, according to the heat dissipation solution determined by the temperature adjustment information, the target radiator is controlled to cool down multiple target partitions at the same time, thereby reducing the number of radiators that need to be turned on and reducing heat dissipation power consumption.

[0012] Optionally, the step of obtaining the temperature adjustment information corresponding to the main partition and the plurality of sub-partitions further includes:

[0013] Acquire main heat dissipation information of the main partition and the plurality of sub-partitions when a main radiator of the main partition is turned on;

[0014] Acquire combined heat dissipation information of the main partition and the multiple sub-partitions when the main radiator and the sub-radiators of the multiple sub-partitions are turned on in combination;

[0015] The temperature adjustment information is acquired according to the main heat dissipation information and the combined heat dissipation information.

[0016] By adopting the above technical solution, combined with the main heat dissipation information and the combined heat dissipation information when the main radiator is turned on and the main radiator is used in combination with multiple sub-radiators, the corresponding temperature adjustment information is determined according to the corresponding heat dissipation efficiency.

[0017] Optionally, the method further includes:

[0018] Detecting whether there is a radiator that cannot be turned on normally among the radiators corresponding to the main partition and the plurality of sub-partitions;

[0019] If yes, it is determined that the radiator that cannot be turned on normally is a failed radiator;

[0020] If the heat dissipation solution involves the failed radiator, an alternative heat dissipation solution that does not involve the failed radiator is determined according to the temperature adjustment information.

[0021] By adopting the above technical solution, if a partition fails, the corresponding failed radiator is determined, and when there is a cooling solution involving the failed radiator, an alternative cooling solution is determined through the temperature adjustment relationship, thereby ensuring normal cooling of the target device.

[0022] Optionally, after the step of determining that the radiator that cannot be turned on normally is a failed radiator, the method further includes:

[0023] Based on the temperature information, determine whether the remaining radiators that can be turned on normally can maintain the heat dissipation requirements;

[0024] If the remaining radiators that can be turned on normally cannot maintain the heat dissipation demand, a shutdown signal is output to the target heat dissipation device.

[0025] By adopting the above technical solution, if there are too many failed radiators or the heat dissipation demand can no longer be maintained, a shutdown signal is sent to the target device, thereby preventing the target device from being damaged due to excessive temperature caused by heat dissipation difficulties.

[0026] Optionally, the method further includes:

[0027] The temperature thresholds include heat dissipation temperature thresholds and temperature warning thresholds corresponding to the main partition and the plurality of sub-partitions;

[0028] If the temperature information of the target partition reaches the heat dissipation temperature threshold corresponding to the target partition, determining the heat dissipation solution according to the temperature adjustment information;

[0029] If the temperature information of the target partition reaches the temperature warning threshold corresponding to the target partition, determining a heat dissipation combination solution according to the temperature adjustment information;

[0030] According to the heat dissipation combination solution, the plurality of target heat sinks are controlled to be turned on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0031] By adopting the above technical scheme, the temperature threshold of each partition is divided into a heat dissipation temperature threshold and a temperature warning threshold. When the temperature information of a partition reaches the temperature warning threshold, a heat dissipation combination scheme is determined to control multiple target radiators to turn on, which work together to avoid the target device being damaged due to excessive temperature.

[0032] Optionally, the method further includes:

[0033] Acquire the temperature change rate of the main partition and the plurality of sub-partitions, wherein the temperature change rate includes a heating rate and a cooling rate;

[0034] According to the heating rate, determining whether a preset warning rate has been reached;

[0035] Determine, among the main partition and the plurality of sub-partitions, a partition corresponding to which the heating rate reaches the warning rate as the target partition;

[0036] The heat dissipation scheme is determined according to the temperature adjustment information, and the target radiator is controlled to be turned on according to the heat dissipation scheme until the cooling rate of the target partition reaches a preset safety rate.

[0037] By adopting the above technical solution, before the target partition reaches the preset temperature threshold, the target partition that is about to reach the temperature threshold or the warning threshold is predicted according to the temperature rise rate, and the relevant radiator is turned on in advance, thereby preventing the subsequent temperature from being too high and difficult to cool down.

[0038] Optionally, the method further includes:

[0039] Obtaining protection priorities corresponding to the primary partition and the plurality of sub-partitions;

[0040] The power allocation ratio of each partition is determined according to the protection priority, and the higher the protection priority, the greater the power allocation ratio.

[0041] By adopting the above technical solution, the radiator power of different partitions is allocated accordingly according to different protection priorities, thereby ensuring that the heat dissipation of important partitions can be maintained.

[0042] A second aspect of the present application provides a radiator partition control system, comprising:

[0043] A temperature information acquisition module, used to acquire temperature information, wherein the temperature information includes temperature information and temperature thresholds corresponding to the main partition and multiple sub-partitions;

[0044] A temperature control information acquisition module, used to acquire temperature control information corresponding to the main partition and the plurality of sub-partitions;

[0045] A target partition confirmation module, used to determine one or more partitions that need to start heat dissipation as target partitions according to the temperature information;

[0046] A heat dissipation scheme confirmation module, used to determine a heat dissipation scheme according to the temperature adjustment information;

[0047] The heat dissipation control module is used to control the target heat sink to turn on according to the heat dissipation solution until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0048] A third aspect of the present application provides a device including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and execute the above-mentioned radiator partition control method.

[0049] A fourth aspect of the present application provides a storage medium storing a computer program that can be loaded by a processor and execute the above-mentioned radiator partition control method.

[0050] In summary, the present application includes at least one of the following beneficial effects:

[0051] 1. According to the cooling scheme determined by the temperature control information, the temperature control information includes the temperature impact of the target radiator on other partitions when it is turned on. According to the cooling scheme, the target radiator is controlled to cool down multiple target partitions at the same time, thereby reducing the number of radiators that need to be turned on and reducing cooling power consumption.

[0052] 2. If a partition fails, determine the corresponding failed radiator. If there is a cooling solution involving the failed radiator, determine an alternative cooling solution through the temperature adjustment relationship to ensure normal cooling of the target device.

[0053] 3. The temperature threshold of each partition is divided into a heat dissipation temperature threshold and a temperature warning threshold. When the temperature information of a partition reaches the temperature warning threshold, a heat dissipation combination scheme is determined to control multiple target radiators to turn on, so as to work together to prevent the target device from being damaged due to excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a flow chart of a radiator partition control method provided in an embodiment of the present application;

[0055] Figure 2 It is a virtual structural diagram of the partition control system of the radiator provided in this application. DETAILED DESCRIPTION

[0056] The following examples will help those skilled in the art to further understand the effects of the present application, but are not intended to limit the present application in any form. It should be noted that, for those of ordinary skill in the art, several modifications and improvements may be made without departing from the concept of the present application. These all fall within the scope of protection of the present application.

[0057] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0058] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0059] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0060] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0061] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0062] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0063] In order to make the purpose, technical solutions and advantages of the present application clearer, the partition control method of the radiator of the present application is explained below from the perspective of the partition control device of the radiator. The partition control device of the radiator can be an electronic device, such as a mobile phone terminal, a computer terminal and other devices.

[0064] The present application is further described in detail below in conjunction with the accompanying drawings.

[0065] Reference Figure 1 , Figure 1 : is a flow chart of a radiator partition control method provided in an embodiment of the present application, which specifically includes the following steps:

[0066] In step S1, temperature information is acquired, where the temperature information includes temperature information and temperature thresholds corresponding to a main partition and a plurality of sub-partitions.

[0067] Specifically, the temperature information is the device temperature of the target device (hereinafter referred to as the target device) that needs to be cooled. The target device is divided into multiple cooling zones according to the actual use requirements of the target device through the cooling device. The zone can be divided according to the thermal conductivity of the device of the target device, the importance of the device, etc. According to the actual use requirements, one or more radiators can be set for each zone, and the radiator can dissipate heat through air cooling, water cooling and / or heat pipes.

[0068] For example, suppose that devices that are easy to conduct heat are usually more likely to heat up during operation, and after heating up, they will affect the temperature of other devices through heat transfer. This part can be partitioned; and for devices that are less affected by temperature, you can consider classification and partitioning, so as to sort, classify and partition according to the degree of temperature influence. You can also divide according to the importance of the device. For important equipment, you can also classify and partition accordingly. Devices with higher importance can be divided into main partitions or partitions with higher heat dissipation power to maintain efficient and continuous heat dissipation. Classified in different partitions, you can set radiators of different types and powers according to actual usage needs. The following is a specific explanation:

[0069] Obtaining protection priorities corresponding to the primary partition and the plurality of sub-partitions;

[0070] The power allocation ratio of each partition is determined according to the protection priority, and the higher the protection priority, the greater the power allocation ratio.

[0071] Specifically, the heat dissipation protection priority is divided according to the importance or thermal conductivity of each partition of the target device. For the partition with larger thermal energy conversion in actual work, the corresponding priority can be increased, and more heat dissipation power can be allocated to the target device corresponding to the partition.

[0072] In step S2, temperature adjustment information corresponding to the main partition and the plurality of sub-partitions is obtained.

[0073] Specifically, the temperature adjustment relationship can be obtained by obtaining temperature-related parameters through sensors, circuit structure level signal outputs, etc. The temperature adjustment relationship involves relevant temperature parameters corresponding to the main partition and multiple sub-partitions. When the radiator of a certain partition is turned on, in addition to identifying and obtaining the relevant temperature parameter changes of the corresponding partition, the temperature impact on other partitions will also be obtained. The determination of the temperature adjustment relationship is specifically described below:

[0074] When a main radiator of the main partition is turned on, main heat dissipation information of the main partition and the plurality of sub-partitions is obtained.

[0075] Specifically, when the main radiator of the main partition is turned on, the temperature change curve of the main partition is detected and recorded by a temperature sensing method such as a sensor, and the heat dissipation effect of the main partition radiator on other sub-partitions is detected and recorded at the same time, and the temperature change curves of other sub-partitions are recorded accordingly. The temperature change curve can be used to determine the temperature effect of the main radiator on the main partition and the sub-partitions involved when working at various temperatures, and the above-mentioned main heat dissipation information is formed according to the temperature effect.

[0076] When the main radiator and the sub-radiators of the multiple sub-partitions are turned on in combination, combined heat dissipation information of the main partition and the multiple sub-partitions is obtained.

[0077] Specifically, since the main partition is usually used to dissipate heat for the key heat dissipation parts of the target device, and the main partition should be able to affect most sub-partitions when it is turned on for heat dissipation, in theory, there is no situation where only the sub-partitions turn on heat dissipation while the main partition does not turn on heat dissipation, except for the failure of the main partition to dissipate heat. When the main radiator of the main partition is turned on, the sub-radiators of one or more sub-partitions are also turned on at the same time, and the radiators of multiple partitions form a combined heat dissipation. In this case, the temperature change curves of the main partition and each sub-partition are detected and recorded through temperature sensing methods such as sensors. The temperature change curves can be used to determine the temperature impact of the main radiator on the main partition and each sub-partition when it works at various temperatures, and the above-mentioned combined heat dissipation information is formed based on the temperature impact.

[0078] The temperature adjustment information is acquired according to the main heat dissipation information and the combined heat dissipation information.

[0079] Specifically, after obtaining the above-mentioned main heat dissipation information and combined heat dissipation information, a variety of temperature control relationships are formed through the arrangement and combination of the main partition and multiple sub-partition heat dissipation parts, which together constitute the temperature control information. The temperature control information can be stored in the memory of the target device, and the corresponding heat dissipation device can be controlled to operate and work through the target device, or it can be stored in the memory of the heat dissipation device that can run the method provided in this application. In addition, each time the heat dissipation device is operated, there may be certain subtle differences in the temperature control relationship due to various reasons such as temperature and humidity, internal resistance changes, and losses. In order to maintain efficient heat dissipation, the temperature control information can be updated. The update can be a regular test, and the temperature control information will be updated after the test; it can also be a real-time temperature control information acquisition after each startup, and the temperature control information is updated in real time according to the acquisition results.

[0080] In step S3, one or more partitions that need to start heat dissipation are determined as target partitions according to the temperature information.

[0081] Specifically, the temperature information can be the temperature value of each partition, and combined with the above-mentioned temperature threshold, if the current temperature value exceeds the preset temperature threshold of the corresponding partition, the corresponding partition can be determined as the target partition to be cooled. In addition, after the target partition is divided, early warning can be given through the temperature increase, and relevant cooling can be started in advance to prevent the device from reaching the preset temperature threshold. The following is a specific description of the temperature increase warning:

[0082] Acquire the temperature change rate of the main partition and the plurality of sub-partitions, wherein the temperature change rate includes a heating rate and a cooling rate;

[0083] According to the heating rate, determining whether a preset warning rate has been reached;

[0084] Determine, among the main partition and the plurality of sub-partitions, a partition corresponding to which the heating rate reaches the warning rate as the target partition;

[0085] The heat dissipation scheme is determined according to the temperature adjustment information, and the target radiator is controlled to be turned on according to the heat dissipation scheme until the cooling rate of the target partition reaches a preset safety rate.

[0086] Specifically, the temperature value can be obtained through temperature information acquisition methods such as temperature sensors, and the temperature change can also be detected. The temperature change includes heating and cooling. For partitions that heat up too quickly, that is, the heating efficiency exceeds the preset warning rate, even if the preset heat dissipation start-up temperature threshold is not reached, the temperature adjustment relationship can be called to set the corresponding partition that heats up too quickly as the target partition, determine the corresponding heat dissipation plan and start heat dissipation.

[0087] More specifically, after the heat dissipation is turned on, the temperature information of the target partition is continuously detected until the temperature of the target partition of the target device decreases steadily, and the heat dissipation device is turned off according to the decreasing speed, that is, the cooling rate reaches the preset safety rate. Under normal circumstances, since the target device works continuously, the temperature will be maintained in a range after the heat dissipation is turned on. If the preset safety rate is not reached, the radiator will continue to be turned on until the target device finishes working. After the work is finished, the temperature will drop sharply to reach the safety rate, and the radiator will be turned off accordingly.

[0088] For example, suppose the heat dissipation device divides the target device into four partitions, A, B, C and D, with A being the main partition and B, C and D being sub-partitions. Suppose at a certain moment, the temperature threshold of partition A is 80 degrees Celsius and a large amount of heat energy is generated due to overload work. The heat energy causes the temperature of partition A to rise rapidly. Suppose the normal heating rate is 3-5 degrees Celsius per second, and the obtained heating rate of partition A has reached 10 degrees Celsius per second. In this case, even if the current temperature of zone A does not reach the threshold of 80 degrees Celsius, it will be locked as the target partition by the heat dissipation device, and according to the temperature adjustment relationship, the heat dissipation device of zone A will be directly called to cool and dissipate the heat of zone A.

[0089] In step S4, a heat dissipation solution is determined according to the temperature adjustment information.

[0090] Specifically, after the target partition is confirmed, it does not mean that the heat dissipation device corresponding to the target partition is directly turned on, but an optimal heat dissipation solution is determined based on the temperature control information obtained. The characteristics of this heat dissipation solution are that it consumes the least energy and can cover and reduce the temperature of each target partition.

[0091] For example, assuming that a cooling fan is used, a total of partitions A, B, and C are identified as target partitions. According to the temperature control information, it can be determined that only the heat dissipation device of partition A or partition B needs to be turned on to cool down the devices of the above three target partitions at the same time. And compared with turning on the heat dissipation of partition B, turning on the heat dissipation and cooling of partition A is more efficient, so that the energy consumed by turning on the heat dissipation and cooling of partition A is less. Therefore, turning on the heat dissipation of partition A is used as the heat dissipation solution this time. However, in actual use, the heat dissipation components of each partition may be damaged and fail. The present application can also identify the failed heat dissipation partitions and maintain the temperature through alternative solutions. The failure handling is described in detail below:

[0092] Detecting whether there is a radiator that cannot be turned on normally among the radiators corresponding to the main partition and the plurality of sub-partitions;

[0093] If yes, it is determined that the radiator that cannot be turned on normally is a failed radiator;

[0094] Specifically, the high and low level or square wave signals can be obtained through the airflow, rotation speed and other parameters of the heat dissipation device to determine whether the corresponding heat dissipation device has failed. For example, when the heat dissipation device is working normally, it outputs a square wave signal, and when it fails, it outputs a continuous high or low level signal. The heat dissipation device can determine that the corresponding heat dissipation device has failed based on this signal.

[0095] If the heat dissipation solution involves the failed radiator, an alternative heat dissipation solution that does not involve the failed radiator is determined according to the temperature adjustment information.

[0096] Specifically, if there is a failed radiator in the heat dissipation solution determined according to the temperature control information, in this case, in order to maintain the heat dissipation of the target device, a heat dissipation solution that does not require the use of the failed radiator will be re-determined according to the temperature control information. For example, assuming that there are three target partitions A, B, and C, the original heat dissipation solution uses the radiator of partition A to cool the three target partitions at the same time. This solution has the highest heat dissipation efficiency and the lowest energy consumption. However, due to the failure signal of the radiator of partition A, the heat dissipation device will use partition B as the heat dissipation solution, which can also cool the above three target partitions but consumes more energy than the original heat dissipation solution. In addition, according to actual usage needs, when a failed radiator appears, the target user who uses the heat dissipation device can be informed through audio, display and other prompt methods, so that the target user can repair or replace the failed radiator in time.

[0097] More specifically, when there is a failed radiator in the heat dissipation device and an alternative heat dissipation solution cannot be re-determined based on the temperature adjustment information, in order to avoid overheating damage caused by continuing to use the target device, corresponding processing will be performed, as described below:

[0098] Based on the temperature information, determine whether the remaining radiators that can be turned on normally can maintain the heat dissipation requirements;

[0099] If the remaining radiators that can be turned on normally cannot maintain the heat dissipation demand, a shutdown signal is output to the target heat dissipation device.

[0100] Specifically, according to the temperature-related parameters such as the heating rate and current temperature of the target partition, combined with the temperature adjustment information and the available radiators of the heat dissipation device, it is determined that the heat dissipation demand cannot be maintained, that is, the target device will continue to rise above the temperature threshold, and even if all radiators are turned on, the temperature cannot be lowered, and a shutdown signal is sent to the target device. This shutdown signal can be a delayed shutdown signal, which informs the target user through audio, display and other prompt information that the device will be shut down after a preset time. It can also receive instructions from the target user to delay the shutdown time and shut down immediately. Adjustments are made according to actual needs. After shutdown, the target device can be restarted by replacing or repairing the heat dissipation device to prevent the target device from continuing to work in the case of insufficient heat dissipation and causing damage due to excessive temperature, thereby protecting the components of the target device.

[0101] Furthermore, the temperature threshold in the temperature information can be divided more specifically, and different heat dissipation solutions can be combined according to different situations. For situations where the temperature is too high and the device is likely to be burned, multiple heat dissipation partitions can be used to work simultaneously for combined heat dissipation. The following is a specific description of combined heat dissipation:

[0102] The temperature thresholds include heat dissipation temperature thresholds and temperature warning thresholds corresponding to the main partition and the plurality of sub-partitions.

[0103] If the temperature information of the target partition reaches the heat dissipation temperature threshold corresponding to the target partition, determining the heat dissipation solution according to the temperature adjustment information;

[0104] If the temperature information of the target partition reaches the temperature warning threshold corresponding to the target partition, determining a heat dissipation combination solution according to the temperature adjustment information;

[0105] According to the heat dissipation combination solution, the plurality of target heat sinks are controlled to be turned on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0106] Specifically, the heat dissipation temperature threshold means that when the temperature of the heat dissipation partition reaches this temperature threshold, it may affect the device, reduce the response speed of the device, and increase the workload of the device. One or more heat dissipation partitions need to be turned on for heat dissipation. For example, partitions A, B, and C can be cooled by turning on partition A, and partitions C, D, and E can be cooled by turning on partition D, etc.; and the temperature warning threshold means that when the temperature of the heat dissipation partition reaches the temperature warning threshold, the high temperature is likely to have caused damage to the target device, and the temperature needs to be lowered as soon as possible. At this time, the cooling speed should be prioritized, and all radiators of the target partitions with too high temperatures should be turned on. At the same time, the partition radiators outside the target partition that can lower the temperature of the target partition according to the temperature adjustment information can be turned on to lower the temperature of the target device as soon as possible, ensure the safe use of the target device, and extend the service life of the target device.

[0107] In step S5, according to the heat dissipation solution, the target heat sink is controlled to be turned on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0108] Specifically, relevant cooling and heat dissipation operations are performed according to the heat dissipation scheme determined in the above steps, and the temperature information of the target partition is continuously detected until the temperature of the target partition after cooling is lower than the preset temperature threshold.

[0109] On the other hand, the present application discloses a radiator partition control system, see Figure 2 , Figure 2 It is a virtual structural diagram of the partition control system of the radiator provided in this application, and the partition control system of the radiator includes:

[0110] The temperature information acquisition module 100 is used to acquire temperature information, wherein the temperature information includes temperature information and temperature thresholds corresponding to the main partition and multiple sub-partitions;

[0111] The temperature adjustment information acquisition module 200 is used to obtain the temperature adjustment information corresponding to the main partition and the plurality of sub-partitions;

[0112] A target partition confirmation module 300 is used to determine one or more partitions that need to start heat dissipation as target partitions according to the temperature information;

[0113] A heat dissipation scheme confirmation module 400 is used to determine a heat dissipation scheme according to the temperature adjustment information;

[0114] The heat dissipation control module 500 is used to control the target heat sink to turn on according to the heat dissipation solution until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

[0115] The specific definition of the partition control system of the radiator can be found in the definition of the partition control method of the radiator above, which will not be repeated here. Each module in the partition control system of the radiator can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0116] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0117] A radiator partition control method provided in an embodiment of the present application can be applied to terminal devices such as electronic devices, computers, wearable devices, vehicle-mounted devices, tablet computers, laptop computers, netbooks, personal digital assistants (PDA), augmented reality (AR) / virtual reality (VR) devices, mobile phones, etc. The embodiment of the present application does not impose any restrictions on the specific type of terminal devices.

[0118] The embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in each embodiment of the above method can be implemented.

[0119] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in each embodiment of the above method when executing the computer program product.

[0120] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device that can carry the computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0121] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0122] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0123] In the embodiments provided in the present application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0124] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0125] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A radiator partition control method, characterized in that: The method comprises: Acquire temperature information, wherein the temperature information includes temperature information and temperature thresholds corresponding to a main partition and a plurality of sub-partitions; wherein the partitions are divided according to the thermal conductivity of a device of a target device or the importance of the device, and each partition is provided with one or more heat sinks; Acquire main heat dissipation information of the main partition and the plurality of sub-partitions when the main heat sink of the main partition is turned on; the main heat dissipation information is used to indicate the temperature influence of the main heat sink on the main partition and the sub-partitions involved when working at various temperatures; Acquire combined heat dissipation information of the main partition and the one or more sub-partitions when the main heat sink of the main partition is turned on and the sub-heat sinks of one or more sub-partitions are turned on at the same time; the combined heat dissipation information is used to indicate the temperature impact of the main heat sink on the main partition and each sub-partition when the main heat sink works at various temperatures; According to the main heat dissipation information and the combined heat dissipation information, temperature adjustment information is obtained; the temperature adjustment information is composed of a plurality of temperature adjustment relationships formed by arranging and combining the main heat dissipation information and the combined heat dissipation information obtained through the radiator of the main partition and the radiators of the plurality of sub-partitions; According to the temperature information, determining multiple partitions that need to start heat dissipation as target partitions; According to the temperature adjustment information, determining a heat sink combination that consumes the least energy and can cover and reduce the temperature of each target partition as a heat dissipation solution; Controlling a target radiator in the radiator combination of the heat dissipation solution to turn on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition; The method further comprises: Detecting whether there is a radiator that cannot be turned on normally among the radiators corresponding to the main partition and the plurality of sub-partitions; If yes, it is determined that the radiator that cannot be turned on normally is a failed radiator; If the heat dissipation scheme involves the failed heat sink, determining an alternative heat dissipation scheme that does not involve the failed heat sink according to the temperature adjustment information; After the step of determining that the radiator that cannot be turned on normally is a failed radiator, the method further includes: Based on the temperature information, determine whether the remaining radiators that can be turned on normally can maintain the heat dissipation requirements; If the remaining radiators that can be turned on normally cannot maintain the heat dissipation demand, a shutdown signal is output to the target heat dissipation device.

2. The radiator partition control method according to claim 1, characterized in that: The method further comprises: The temperature thresholds include heat dissipation temperature thresholds and temperature warning thresholds corresponding to the main partition and the plurality of sub-partitions; If the temperature information of the target partition reaches the heat dissipation temperature threshold corresponding to the target partition, determining the heat dissipation solution according to the temperature adjustment information; If the temperature information of the target partition reaches the temperature warning threshold corresponding to the target partition, determining a heat dissipation combination solution according to the temperature adjustment information; According to the heat dissipation combination solution, the plurality of target heat sinks are controlled to be turned on until the temperature information of the target partition is lower than the temperature threshold of the corresponding partition.

3. The radiator partition control method according to claim 1, characterized in that: The method further comprises: Acquire the temperature change rate of the main partition and the plurality of sub-partitions, wherein the temperature change rate includes a heating rate and a cooling rate; According to the heating rate, determining whether a preset warning rate has been reached; Determine, among the main partition and the plurality of sub-partitions, a partition corresponding to which the heating rate reaches the warning rate as the target partition; The heat dissipation scheme is determined according to the temperature adjustment information, and the target radiator is controlled to be turned on according to the heat dissipation scheme until the cooling rate of the target partition reaches a preset safety rate.

4. The radiator partition control method according to claim 1, characterized in that: The method further comprises: Obtaining protection priorities corresponding to the primary partition and the plurality of sub-partitions; The power allocation ratio of each partition is determined according to the protection priority, and the higher the protection priority, the greater the power allocation ratio.

5. A terminal device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executes the zoning control method for the radiator as claimed in any one of claims 1 to 4.

6. A storage medium, characterized in that: A computer program is stored which can be loaded by a processor and execute the partition control method of the radiator as claimed in any one of claims 1 to 4.

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