An optical module

Abstract

This application provides an optical module, including a circuit board and an optical transceiver assembly. The circuit board has a cutout area. The optical transceiver assembly includes an upper cover, a transceiver socket, and optical components mounted on the circuit board. The transceiver socket includes a socket body and a second support protrusion, which together with the upper cover form a storage cavity. The second support protrusion has a first storage slot and a first support protrusion, which engage with the cutout area. The optical components, located within the storage cavity, include a laser chip, a lithium niobate chip, and other devices. The laser chip and other devices are located at the first end of the second support protrusion, and the lithium niobate chip is located at the second end of the second support protrusion. The laser chip is located within the first storage slot. The lithium niobate chip is located on the first support protrusion. In this application, the laser chip provides high-power light, and the optical loss of the lithium niobate chip is less than that of the silicon photonics chip, so that the modulated optical signal modulated by the lithium niobate chip meets the optical power requirements of 50GPON transmitted light.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] The international standard for 50G GPON, ITU-T G.9804.3, was released in September 2021. To maintain the current PON link budget of 29dB / 32dB, the 50G PON standard imposes higher requirements on the optical power transmitted by the OLT optical module. The current conventional 53GBaud EML cannot meet the optical power requirements of 50G PON.

[0003] To meet the optical power requirements of the 50G PON standard for OLT optical modules, many major international manufacturers have been developing EML+SOA chip solutions for 50G PON. However, these manufacturers are currently facing significant technical challenges, and no EML+SOA optical devices for 50G PON OLTs have yet been released. Therefore, no single optical module can currently meet the optical power requirements of 50G PON. Summary of the Invention

[0004] This application provides an optical module that meets the optical power requirements of 50G PON transmitted light.

[0005] An optical module, comprising:

[0006] The circuit board has a cut-out area.

[0007] Optical transceiver assembly, including transceiver socket and optical components;

[0008] A receiving / distributing connector, including a connector body and a first support protrusion formed by the connector body;

[0009] The first support protrusion is provided with a first storage slot, a second support protrusion and a snap-fit ​​device for snapping in the fiber optic ferrule, which snaps into the cut-out area.

[0010] The first storage slot is located between the second support protrusion and the snap-fit ​​component;

[0011] Optical components include a laser chip, a first lens, a lithium niobate chip, a second lens, a second filter, a third lens, a fourth lens, and a receiving prism;

[0012] The laser chip, the first lens, the second lens, the second filter, the receiving conversion prism, the third lens, and the fourth lens are all located at the first end of the first support protrusion, and the lithium niobate chip is located at the second end of the first support protrusion.

[0013] The laser chip is located in the first storage slot;

[0014] The lithium niobate chip, located on the second support protrusion, includes a substrate and a lithium niobate thin film, with an optical loss of less than 10dB.

[0015] A lithium niobate thin film, deposited on a substrate, with a thickness of less than 100 μm.

[0016] Beneficial Effects: This application provides an optical module, including a circuit board and an optical transceiver assembly. The circuit board has a cutout area. The optical transceiver assembly includes a transceiver socket and optical components. The transceiver socket engages with the lower surface of the circuit board. The transceiver socket includes a socket body and a first support protrusion formed by the socket body. The first support protrusion engages with the cutout area, and the area of ​​the socket body other than the first support protrusion is connected to the lower surface of the circuit board. The first support protrusion has a first storage slot, a second support protrusion, and a snap-fit ​​device for engaging an optical fiber ferrule. The first storage slot is located between the second support protrusion and the snap-fit ​​device. The optical components include a laser chip, a first lens, a lithium niobate chip, a second lens, a second filter, a third lens, a fourth lens, and a receiving deflection prism. The laser chip, the first lens, the second lens, the second filter, the receiving deflection prism, the third lens, and the fourth lens are all located at the first end of the first support protrusion, and the lithium niobate chip is located at the second end of the first support protrusion. The laser chip is located in the first storage slot. The lithium niobate chip is located on the second support protrusion. The laser chip is a high-power DFB laser chip. The high-power DFB laser chip is used to emit high-power light. A first lens, located between the laser chip and the lithium niobate chip, is used to couple the high-power light to the lithium niobate chip. The lithium niobate chip, corresponding to the cut-out area, includes a substrate and a lithium niobate thin film, with an optical loss of less than 10dB, and is used to modulate the high-power light to obtain a modulated optical signal. The lithium niobate thin film is deposited on the substrate and has a thickness of less than 100μm. Due to the smaller size and higher integration precision of the lithium niobate chip, it has advantages such as lower power consumption and lower optical loss compared to silicon photonics chips. Specifically, the optical loss of the silicon photonics chip is less than 11.2dB, and the optical loss of the lithium niobate chip is less than 10dB. Because the optical loss of the silicon photonics chip is less than 11.2dB, in order for the optical module including the DFB laser chip + silicon photonics chip combination to meet the optical power requirements of 50G PON, the optical power emitted by the DFB laser chip must be >158mW. Because the optical loss of lithium niobate chips is less than 10dB, to ensure that the optical module combining a DFB laser chip and a lithium niobate chip meets the optical power requirements for 50G PON, the optical power emitted by the DFB laser chip must be greater than 80mW. Conventional DFB laser chips emit optical power less than 50mW, and high-power DFB laser chips emit optical power less than 120mW. Currently, it is difficult for DFB laser chips to achieve an optical power exceeding 120mW across the entire temperature range. Therefore, to meet the optical power requirements for 50G PON, the optical module must use a combination of a DFB laser chip and a lithium niobate chip. A second lens, located between the lithium niobate chip and the second filter, is used to collimate the modulated optical signal to obtain a collimated optical signal. A second filter, located between the laser chip and the fourth lens, is used to transmit the collimated optical signal to the fiber optic ferrule.The third lens, located between the fiber optic ferrule and the second filter, couples the first optical signal transmitted through the second filter to the fiber optic ferrule and collimates the second optical signal incident through the fiber optic ferrule before it is incident on the second filter. The fourth lens, located between the second filter and the receiving deflection prism, couples the second optical signal reflected from the second filter to the receiving deflection prism. The receiving deflection prism, located above the optical receiver chip, modulates the second optical signal so that it is reflected back to the optical receiver chip. In this application, the laser chip provides high-power light, and the optical loss of the lithium niobate chip is less than that of the silicon photonics chip, ensuring that the modulated optical signal modulated by the lithium niobate chip meets the optical power requirements of 50G PON transmission. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a diagram showing the connection relationships of an optical communication system.

[0019] Figure 2 This is a structural diagram of an optical network terminal;

[0020] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0021] Figure 4 This is an exploded structural diagram of an optical module according to some embodiments;

[0022] Figure 5 This is a structural diagram of an optical module with the upper housing removed according to some embodiments;

[0023] Figure 6 This is a structural diagram of an optical fiber adapter, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments;

[0024] Figure 7 An exploded view of a fiber optic adapter, fiber optic ferrule, optical transceiver assembly, and circuit board according to some embodiments;

[0025] Figure 8 This is a first structural diagram of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0026] Figure 9 This is a second structural diagram of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0027] Figure 10This is a third structural diagram of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0028] Figure 11 This is a first cross-sectional view of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0029] Figure 12 This is a second cross-sectional view of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0030] Figure 13 An exploded view of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments;

[0031] Figure 14 This is a first structural diagram of an optical component according to some embodiments;

[0032] Figure 15 This is a second structural diagram of an optical component according to some embodiments;

[0033] Figure 16 This is a first structural diagram of the upper cover according to some embodiments;

[0034] Figure 17 This is a second structural diagram of the upper cover according to some embodiments;

[0035] Figure 18 This is a structural diagram of a circuit board according to some embodiments;

[0036] Figure 19 This is a first structural diagram of a transceiver socket according to some embodiments;

[0037] Figure 20 This is a second structural diagram of a transceiver socket according to some embodiments;

[0038] Figure 21 This is a first cross-sectional view of the transceiver socket and circuit board according to some embodiments;

[0039] Figure 22 This is a second cross-sectional view of the transceiver socket and circuit board according to some embodiments;

[0040] Figure 23 This is a third cross-sectional view of the transceiver socket and circuit board according to some embodiments;

[0041] Figure 24 This is an optical path diagram of an optical module according to some embodiments. Detailed Implementation

[0042] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-light-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0043] In the field of optical communication technology, optical modules realize the mutual conversion function between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0044] Figure 1 This is a diagram showing the connection relationships within an optical communication system. (Example:) Figure 1 As shown, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0045] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, unlimited distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0046] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0047] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by optical fiber 101 and network cable 103; while the connection between optical fiber 101 and network cable 103 is completed by optical module 200 and optical network terminal 100.

[0048] The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101. The electrical port is configured to connect to the optical network terminal 100, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. The optical module 200 performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101. Since the optical module 200 is a tool for mutual conversion between optical and electrical signals and does not have the function of data processing, the information does not change during the above photoelectric conversion process.

[0049] The optical network terminal 100 includes a generally cuboid housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to an optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200; the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and vice versa, thus the optical network terminal 100 acts as a host computer for the optical module 200, monitoring its operation. Besides the optical network terminal 100, the host computer for the optical module 200 may also include an optical line terminal (OLT), etc.

[0050] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing equipment 2000 through optical fiber 101, optical module 200, optical network terminal 100 and network cable 103.

[0051] Figure 2 This is a structural diagram of an optical network terminal. To clearly show the connection relationship between the optical module 200 and the optical network terminal 100... Figure 2Only the structure of the optical network terminal 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the optical network terminal 100 also includes a circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0052] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to an electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0053] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded structural diagram of an optical module according to some embodiments. For example... Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed inside the shell, and an optical transceiver assembly 400.

[0054] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0055] In some embodiments of this disclosure, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0056] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0057] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold fingers 301 of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 205 is an optical port, configured to connect to external optical fiber 101 so that external optical fiber 101 can connect to the optical transceiver assembly 400 inside optical module 200.

[0058] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and the optical transceiver assembly 400 into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these components. Furthermore, the assembly of the circuit board 300 and the optical transceiver assembly 400 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0059] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0060] In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, the unlocking component being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0061] For example, the unlocking component is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a locking component that matches the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the locking component of the unlocking component fixes the optical module 200 in the host computer cage; when the unlocking component is pulled, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the host computer cage.

[0062] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0063] Circuit board 300 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. When the optical transceiver assembly is located on the circuit board, the rigid circuit board can also provide stable support. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0064] The circuit board 300 also includes gold fingers 301 formed on its end surface, the gold fingers 301 consisting of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers 301. The gold fingers 301 may be provided only on one side of the surface of the circuit board 300 (e.g., Figure 4 The gold fingers 301 (shown on the upper surface) can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers 301 are configured to establish an electrical connection with the host computer to enable power supply, grounding, I2C signal transmission, and data signal transmission.

[0065] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver components.

[0066] Optical transceiver unit 400 is used to transmit and receive optical signals.

[0067] Figure 5 This is a structural diagram of an optical module with the upper housing removed, according to some embodiments. Figure 6 This is a structural diagram of an optical fiber ferrule assembly, an optical transceiver assembly, and a circuit board according to some embodiments. Figure 7 This is an exploded view of a fiber optic ferrule assembly, an optical transceiver assembly, and a circuit board according to some embodiments. Figure 5-7It is understood that in some embodiments, in addition to the upper housing 201, lower housing 202, circuit board 300 and optical transceiver assembly 400, the optical module also includes an optical fiber ferrule assembly 500.

[0068] The fiber optic ferrule assembly 500 includes a fiber optic adapter 501, an internal fiber optic cable 502, and a fiber optic ferrule 503. The first end of the fiber optic adapter 501 is connected to an external fiber optic cable, and the second end of the fiber optic adapter 501 is connected to the first end of the internal fiber optic cable. The fiber optic ferrule 503 has a receiving cavity inside, and the second end of the internal fiber optic cable 502 is inserted into the receiving cavity of the fiber optic ferrule 503 via the first end of the fiber optic ferrule 503. The second end of the fiber optic ferrule 503 is then inserted into the optical transceiver assembly 400.

[0069] Fiber optic adapter 501 is an LC adapter, and fiber optic ferrule 503 is an LC fiber optic ferrule. The LC adapter is used to transmit optical signals from the external fiber to the internal fiber optic 502, and also to transmit optical signals emitted by the optical module to the external fiber via the internal fiber optic 502.

[0070] Figure 8 This is a first structural diagram of the internal optical fiber, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments. Figure 9 This is a second structural diagram of the internal optical fiber, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments. Figure 10 This is a third structural diagram of the internal optical fiber, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments. Figure 11 This is a first cross-sectional view of the internal optical fiber, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments. Figure 12 This is a second cross-sectional view of the internal optical fiber, optical fiber ferrule, optical transceiver assembly, and circuit board according to some embodiments. Figure 13 This is an exploded view of an optical fiber ferrule, an optical transceiver assembly, and a circuit board according to some embodiments. Figure 5-13 As can be seen, in some embodiments, the optical transceiver assembly 400 includes an upper cover 4011, a transceiver socket 4012, and optical components. The circuit board 300 has a cutout area 3033, which corresponds to both the upper cover 4011 and the transceiver socket 4012. The upper cover 4011 covers the circuit board 300, and the transceiver socket 4012 engages with the cutout area 3033, such that the upper cover 4011 and the transceiver socket 4012 form a transceiver cavity with an insertion hole, and the optical components are located within this transceiver cavity. An optical fiber ferrule 503 is inserted into the optical transceiver assembly 400 through this insertion hole.

[0071] like Figure 5-13As can be seen, in some embodiments, the fiber optic ferrule 503 is located within the cut-out area 3033, and the fiber optic ferrule 503 is snapped onto the transceiver socket 4012. Because the first end of the fiber optic ferrule 503 is wrapped with a sleeve base, the height of the first end of the fiber optic ferrule 503 is greater than the height of the second end of the fiber optic ferrule 503. Since the height of the first end of the fiber optic ferrule 503 is greater than the height of the second end of the fiber optic ferrule 503, if the first end of the fiber optic ferrule 503 is engaged at the insertion hole formed by the transceiver socket 4012 and the upper cover, the second end of the fiber optic ferrule 503 may not be able to engage at the insertion hole formed by the transceiver socket 4012 and the upper cover. To avoid this situation, in some embodiments, the first end of the fiber optic ferrule 503 is no longer engaged at the insertion hole formed by the transceiver socket 4012 and the upper cover, but is directly engaged in the cut-out area 3033, the length of which is greater than the length of the upper cover 4011 and the transceiver socket 4012.

[0072] To protect most of the optical components located within the cutout area 3033 and a small portion of the optical components located on the circuit board 300, in some embodiments, the width of the upper cover 4011 is greater than the width of the cutout area 3033. The upper cover 4011 is used to protect the optical components from impacts or contamination that could affect the optical path.

[0073] To avoid a situation where the area of ​​the cutout region 3033 other than the area where the fiber optic ferrule 503 is placed cannot be sealed and connected to the transceiver socket 4012, in some embodiments, the width of the transceiver socket 4012 is greater than the width of the cutout region 3033.

[0074] Figure 14 This is a first structural diagram of an optical component according to some embodiments. Figure 15 This is a second structural diagram of an optical component according to some embodiments. Figure 13-15 As can be seen, in some embodiments, the optical components include a laser chip 4021, a first lens 4022, an isolator 4023, a lithium niobate chip 4024, a second lens 4025, a second filter 4026, a third lens 4027, a fourth lens 4029, a receiving prism 40210, a light receiving chip 4028, and a transimpedance amplifier chip 40214. The laser chip 4021, first lens 4022, isolator 4023, lithium niobate chip 4024, second lens 4025, second filter 4026, third lens 4027, and receiving prism 40210 are all located on the transceiver socket 4012, while the light receiving chip 4028 and transimpedance amplifier chip 40214 are located on the circuit board 300. Specifically,

[0075] The laser chip 4021 is used to emit high-power light. Specifically, since the laser chip 4021 is a high-power DFB laser chip, it can provide high-power light. The wavelength of the high-power light emitted by the laser chip 4021 is λ1, and the emitted high-power light is divergent.

[0076] Since the high-power light emitted by the laser chip 4021 is divergent, a first lens 4022 is provided between the laser chip 4021 and the lithium niobate chip 4024 in order to couple the divergent light emitted by the laser chip 4021 to the lithium niobate chip 4024.

[0077] The first lens 4022, located between the laser chip 4021 and the lithium niobate chip 4024, is used to couple the high-power light emitted by the laser chip 4021 to the lithium niobate chip 4024. Specifically, the first lens 4022 is a focusing lens, which couples the diverging light to the lithium niobate chip 4024.

[0078] The first lens 4022 can be a focusing lens, a collimating lens, and a focusing lens. When the first lens 4022 is both a collimating lens and a focusing lens, it includes a first sub-lens 40221 and a second sub-lens 40222, where the first sub-lens 40221 is a collimating lens and the second sub-lens 40222 is a focusing lens. For example... Figure 13-15 As shown. The first sub-lens 40221 first collimates the diverging light to obtain collimated light. The second sub-lens 40222 then focuses and couples the collimated light into the lithium niobate chip 4024.

[0079] Since light coupled to the lithium niobate chip 4024 via the first lens 4022 may return along the original path, thereby damaging the laser chip 4021, an isolator 4023 is provided between the laser chip 4021 and the lithium niobate chip 4024 to prevent light coupled to the lithium niobate chip 4024 via the first lens 4022 from returning along the original path.

[0080] Isolator 4023 is used to prevent light coupled to the lithium niobate chip 4024 via the first lens 4022 from returning along the original path.

[0081] When the first lens 4022 is a focusing lens, the isolator 4023 is located between the first lens 4022 and the lithium niobate chip 4024; when the first lens 4022 is a collimating lens and a focusing lens, the isolator 4023 is located between the first sub-lens 40221 and the second sub-lens 40222.

[0082] The international standard for 50G GPON, ITU-T G.9804.3, was released in September 2021. To maintain the current PON link budget of 29dB / 32dB, the 50G PON standard requires the optical power transmitted by the OLT optical module to be ≥8.5dBm. The current conventional 53GBaud EML cannot meet the optical power requirements of 50G PON. To meet the 50G PON standard's requirements for the optical power transmitted by the OLT optical module, many major international manufacturers have developed EML+SOA chip solutions for 50G PON. However, these manufacturers are currently encountering insurmountable technical difficulties, and no EML+SOA optical device for 50G PON OLTs has yet been released. Therefore, no single optical module can meet the optical power requirements of 50G PON.

[0083] To address this issue, some embodiments propose that the optical module includes a combination of a DFB laser chip and a lithium niobate chip.

[0084] The 4024 lithium niobate chip comprises a substrate and a lithium niobate thin film. The substrate is a glass substrate, and the lithium niobate thin film is deposited on the substrate. The thickness of the lithium niobate thin film is less than 100 μm. Due to its smaller size and higher integration precision, the lithium niobate chip offers advantages over silicon photonics chips, such as lower power consumption and lower optical loss. Specifically, the optical loss of a silicon photonics chip is less than 11.2 dB, while the optical loss of a lithium niobate chip is less than 10 dB.

[0085] The thickness of the lithium niobate film is less than 100 μm. To further reduce the size of the lithium niobate chip, in some embodiments, the thickness of the lithium niobate film is less than 20 μm. To further reduce the size of the lithium niobate chip, the thickness of the lithium niobate film is less than 100 μm.

[0086] Because the optical loss of silicon photonics chips is less than 11.2 dB, the optical power emitted by the DFB laser chip must be greater than 158 mW to meet the optical power requirements of 50G PON in an optical module comprising a DFB laser chip and a silicon photonics chip. Similarly, because the optical loss of lithium niobate chips is less than 10 dB, the optical power emitted by the DFB laser chip must be greater than 80 mW to meet the optical power requirements of 50G PON in an optical module comprising a DFB laser chip and a lithium niobate chip.

[0087] Conventional DFB laser chips emit light with a power of less than 50mW, while high-power DFB laser chips emit light with a power of less than 120mW. Currently, it is difficult for DFB laser chips to achieve an optical power exceeding 120mW across the entire temperature range. Therefore, to ensure the optical module meets the power requirements of 50G PON, it must employ a combination of a DFB laser chip and a lithium niobate chip.

[0088] The lithium niobate chip 4024 is used for modulating high-power light. Specifically, the lithium niobate chip 4024 has an input interface and an output interface on one side. The chip contains an input optical waveguide, an MZM modulator, and an output optical waveguide. The input optical waveguide connects the input interface to the input terminal of the MZM modulator, and the output optical waveguide connects the output terminal of the MZM modulator to the output optical interface. High-power light enters the input optical waveguide of the lithium niobate chip 4024 through the input interface. Most of the high-power light received by the input optical waveguide enters the input terminal of the MZM modulator. The MZM modulator modulates the high-power light to obtain a modulated optical signal. The modulated optical signal is output from the output terminal of the MZM modulator to the output optical waveguide. Most of the modulated optical signal received by the output optical waveguide is output through the output interface. The modulated optical signal is a divergent optical signal.

[0089] The input and output interfaces of the lithium niobate chip 4024 can also be located on different sides of the lithium niobate chip 4024. However, if the input and output interfaces of the lithium niobate chip 4024 are located on different sides of the lithium niobate chip 4024, it may increase the length of the lithium niobate chip 4024, thereby increasing the length of the optical module encapsulated within it. Therefore, in order to reduce the length of the lithium niobate chip 4024, in some embodiments, the input and output interfaces can be located on one side of the lithium niobate chip 4024.

[0090] The surface of the lithium niobate chip 4024 is provided with a first power monitor and a second power monitor. The first power monitor is located near the input optical waveguide of the lithium niobate chip 4024, and the second power monitor is located near the output optical waveguide of the lithium niobate chip 4024. The first power monitor is used to monitor a small portion of the light received by the input optical waveguide to monitor the optical power, and the second power monitor is used to monitor a small portion of the optical signal received by the output optical waveguide to monitor whether the MZM modulator is at the optimal modulation point.

[0091] Lithium niobate chips can modulate high-power light (the light power emitted by laser chips is >80mW). The light loss of lithium niobate thin film modulators (light loss is less than 10dB) is less than that of silicon photonic chips (light loss is less than 11.2dB). Therefore, the modulated light signal can meet the light power requirements of 50G PON.

[0092] The second lens 4025, located between the lithium niobate chip 4024 and the second filter 4026, is used to collimate the optical signal output from the lithium niobate chip 4024. Specifically, since the optical signal output from the lithium niobate chip 4024 is a divergent optical signal, the second lens 4025 is a collimating lens, which collimates the divergent optical signal output from the lithium niobate chip 4024 to obtain a collimated optical signal.

[0093] The second filter 4026 is used to transmit optical signals of a specific wavelength and reflect the second optical signal to the third lens 4027. Specifically, the second filter 4026 is used to transmit optical signals with a wavelength of λ1 and reflect the second optical signal to the third lens 4027. The optical signal entering the fiber optic ferrule 503 from the transceiver housing is the first optical signal, and the optical signal input to the fiber optic ferrule 503 from the fiber optic adapter 501 is the second optical signal.

[0094] The second filter 4026 can include either two 45° prisms, with their beveled edges bonded together, and one of the beveled edges coated with a filter film; or it can include a glass plate, with the end of the glass plate facing the optical fiber coated with a filter film. The design of the second filter 4026 including two 45° prisms facilitates manufacturing processes. The second filter 4026 includes a glass plate, which requires a filter holder to be fixed to the transceiver socket.

[0095] The second filter 4026 includes a glass plate, such as Figure 13-15 As shown.

[0096] The fourth lens 4029 is located between the fiber optic ferrule assembly 500 and the second filter 4026. The fourth lens 4029 is used to couple the optical signal transmitted through the second filter 4026 to the fiber optic ferrule 503 in the fiber optic ferrule assembly 500, and also to collimate the second optical signal incident on the fiber optic ferrule 503 in the fiber optic ferrule assembly 500 into the second filter 4026.

[0097] The third lens 4027, located between the second filter 4026 and the receiving deflection prism 40210, is used to couple the second optical signal reflected from the second filter 4026 to the receiving deflection prism 40210. Specifically, the third lens 4027 is a focusing lens, which couples the second optical signal reflected from the second filter 4026 to the receiving deflection prism 40210.

[0098] A receiving deflection prism 40210 is used to change the direction of the second optical signal so that the optical receiving chip 4028 can receive the second optical signal. Specifically, since the photosensitive surface of the optical receiving chip 4028 is perpendicular to the third lens 4027, the optical receiving chip 4028 cannot receive the second optical signal without the receiving deflection prism 40210. The receiving deflection prism 40210 is located above the optical receiving chip 4028. The receiving deflection prism 40210 is used to change the direction of the second optical signal coupled to the fourth lens 4029 so that the optical receiving chip 4028 can receive the second optical signal.

[0099] In order to enable the optical receiver chip 4028 to receive as many second optical signals as possible, in some embodiments, the receiving deflection prism 40210 is disposed at the focal point of the optical receiver chip 4028.

[0100] The angle of the receiving deflection prism 40210 is 41° to 43°. Specifically, the angle of the receiving deflection prism 40210 cannot be set to 45° to avoid the second optical signal being incident perpendicularly on the light receiving chip and to reduce the reflection of the second optical signal. Therefore, the angle of the receiving deflection prism 40210 is generally set to 41° to 43°.

[0101] For example, the angle of the receiving prism 40210 is 42°, and the principal optical axis incident on the optical receiver chip 4028 is not perpendicular to the upper surface of the optical receiver chip 4028, but forms an angle of 84°. Thus, a small portion of the second optical signal incident on the optical receiver chip 4028, after being reflected by the optical receiver chip, cannot be reflected back to the fiber optic adapter 501 along the original optical path.

[0102] The receiving prism 40210 can be connected to the fourth lens 4029 or not. The receiving prism 40210 and the fourth lens 4029 are connected by refractive index matching adhesive.

[0103] When the receiving deflection prism 40210 is not connected to the fourth lens 4029, the second optical signal passes sequentially through the incident surface of the fourth lens 4029, the exit surface of the fourth lens 4029, the incident surface of the receiving deflection prism 40210, the reflecting surface of the receiving deflection prism 40210, and the exit surface of the receiving deflection prism 40210 to the optical receiving chip.

[0104] Light is reflected at the interface between two interfaces with different refractive indices. When the receiving prism 40210 and the fourth lens 4029 are not connected, the second light signal is easily reflected at the exit surface of the fourth lens 4029, and also easily reflected at the incident surface of the receiving prism 40210. However, when the receiving prism 40210 and the fourth lens 4029 are connected by a refractive index matching adhesive, the adhesive makes it less likely for the exit surface of the fourth lens 4029 to reflect, and also less likely for the incident surface of the receiving prism 40210 to reflect, thus reducing the light loss of the second light signal.

[0105] The receiving conversion prism 40210 is connected to the fourth lens 4029, which can not only reduce the optical loss of the second optical signal, but also reduce the space occupied by the optical module.

[0106] The optical receiver chip 4028, located vertically below the receiving deflection prism 40210, is used to convert the received second optical signal into a current signal. Specifically, the optical receiver chip 4028 has a photosensitive surface that receives the second optical signal, and the optical receiver chip 4028 converts the second optical signal into a current signal.

[0107] Due to the relatively large size of the lithium niobate chip, in order to package it into a conventionally sized optical module, the lithium niobate chip 4024 is located at the second end of the transceiver socket. The laser chip 4021, the first sub-lens 40221, the isolator 4023, the second sub-lens 40222, the second lens 4025, the second filter 4026, the third lens 4027, the receiving prism 40210, and the optical receiver chip 4028 are all located at the first end of the transceiver socket 4012. The first end of the transceiver socket 4012 is the first end of the transceiver housing 4012, and the second end of the transceiver socket 4012 is the second end of the transceiver housing 4012.

[0108] The 40214 transimpedance amplifier chip is used to convert current signals into voltage signals.

[0109] Figure 16 This is a first structural diagram of the upper cover according to some embodiments. Figure 17 This is a second structural diagram of the upper cover according to some embodiments. For example... Figure 5-17 It is understood that in some embodiments, the upper cover 4011 includes an upper cover bottom plate 40111 and an upper cover side plate 40112. The upper cover side plate 40112 is connected to the upper cover bottom plate 40111, and the upper cover side plate 40112 and the upper cover bottom plate form an inverted, coverless hollow column.

[0110] The upper cover side plate 40112 is provided with a locking groove 40114 and two positioning posts 40113. Specifically, the upper cover side plate 40112 includes a first sub-upper cover side plate, a second sub-upper cover side plate, a third sub-upper cover side plate, and a fourth sub-upper cover side plate. The first sub-upper cover side plate is located at the first end of the upper cover 4011, and the fourth sub-upper cover is located at the second end of the upper cover 4011. The second and third sub-upper cover side plates are located between the first and second ends of the upper cover 4011. The first sub-upper cover side plate is provided with a locking groove 40114, and the second and third sub-upper cover side plates are each provided with a positioning post 40113. The two positioning posts 40113 are asymmetrical.

[0111] Figure 18 This is a structural diagram of a circuit board according to some embodiments. For example... Figure 5-18 It is understood that in some embodiments, the circuit board 300 includes a first sub-circuit board 3031, a second sub-circuit board 3032, and a hollowed-out area 3033. The second sub-circuit board 3032 is obtained by removing several layers from a first part of the first sub-circuit board 3031, and the hollowed-out area 3033 is obtained by hollowing out a second part of the first sub-circuit board 3031 that is connected to the first part of the first part of the first sub-circuit board 3031.

[0112] Since the second sub-circuit board 3032 is obtained by removing several layers from the first sub-circuit board 3031, the second sub-circuit board 3032 is more recessed than the first sub-circuit board 3031. That is, the height of the second sub-circuit board 3032 is less than the height of the first sub-circuit board 3031.

[0113] A light receiver chip 4028 is disposed on the second sub-circuit board 3032. Specifically, since the optical path of the second optical signal needs to be deflected by a receiving deflection prism, the upper surface of the light receiver chip 4028 must be much lower than the upper surface of the lithium niobate chip 4024. However, the upper surface of the first sub-circuit board 3031 is at approximately the same height as the upper surface of the lithium niobate chip 4024. Therefore, the light receiver chip 4028 cannot be placed directly on the first sub-circuit board 3031, but needs to be placed on the second sub-circuit board 3032, which is lower in height than the upper surface of the first sub-circuit board 3031.

[0114] In order to shorten the wire bonding length between the transimpedance amplifier chip 40214 and the optical receiver chip 4028 and thus improve the high-frequency performance of the signal line, in some embodiments, the second sub-circuit board 3032 is provided not only with the optical receiver chip 4028, but also with the transimpedance amplifier chip 40214 and some resistors and capacitors.

[0115] The second sub-circuit board 3032 also has a first notch 30321. The first notch 30321 is located near the optical receiver chip 4028.

[0116] The cutout area 3033 includes a first sub-cutout area 30331, a second sub-cutout area 30332, a third sub-cutout area 30333, and a fourth sub-cutout area 30334. The first sub-cutout area 30331 and the third sub-cutout area 30333 are connected. The second sub-cutout area 30332 is located at the second end of the circuit board 300 and communicates with the third sub-cutout area 30333. The third sub-cutout area 30333 is located between the first sub-cutout area 30331 and the fourth sub-cutout area 30334, and communicates with the first sub-cutout area 30331, the second sub-cutout area 30332, and the fourth sub-cutout area 30334, respectively. The fourth sub-cutout area 30334 is located at the first end of the circuit board 300. One side of the third sub-cutout area 30333 communicates with the first sub-cutout area 30331, and the second sub-circuit board 3032 is located on the other side of the third sub-cutout area 30333.

[0117] The excavated area 3033 is cross-shaped.

[0118] The first sub-circuit board 3031 has a first engaging protrusion 30312 at the connection between the first sub-cutout area 30331 and the fourth sub-cutout area 30334, a second engaging protrusion at the connection between the fourth sub-cutout area 30334 and the first notch 30321, a first engaging recess 30313 at the connection between the third sub-cutout area 30333 and the second sub-cutout area 30332, and a third engaging protrusion at the connection between the first notch 30321 and the second sub-circuit board 3032.

[0119] Since the first sub-circuit board 3031 is provided with a wire bonding pin, which is wire bonded to the laser chip 4021 and the thermistor in the first cutout area 30331, the first engagement protrusion 30312 is formed at the connection between the first sub-cutout area 30331 and the fourth sub-cutout area 30334 on the first sub-circuit board 3031.

[0120] Optical components are installed within the cut-out area 3033. Specifically, the first sub-cut-out area 30331 houses a laser chip 4021, a first sub-lens 40221, and an isolator 4023; the second sub-cut-out area 30332 houses a lithium niobate chip 4024; the third sub-cut-out area 30333 houses a second sub-lens 40222, a second lens 4025, a second filter 4026, and a third lens 4027; and the fourth sub-cut-out area 30334 houses a fourth lens 4029.

[0121] In addition to the cutout area 3033, the first sub-circuit board 3031 also has a through hole 30311. The through hole 30311 is correspondingly provided with the positioning post 40113. The positioning post 40113 of the upper cover side plate 40112 is engaged in the through hole 30311, and the upper cover side plate 40112 and the first sub-circuit board 3031 are bonded together with adhesive.

[0122] Figure 19 This is a first structural diagram of a transceiver socket according to some embodiments. Figure 20 This is a second structural diagram of a transceiver socket according to some embodiments. Figure 21 This is a first cross-sectional view of the transceiver socket and circuit board according to some embodiments. Figure 22 This is a second cross-sectional view of the transceiver socket and circuit board according to some embodiments. Figure 23 This is a third cross-sectional view of the transceiver socket and circuit board according to some embodiments. For example... Figure 5-23 It is understood that in some embodiments, the transceiver socket 4012 includes a socket body 40121, on which a storage groove 40122, a first support protrusion 40123, a second support protrusion 40124, a support plate 40125, and a snap-fit ​​member 40126 are provided.

[0123] The transceiver socket 4012 is generally made of a metal material with a coefficient of thermal expansion similar to that of glass and silicon, and with good thermal conductivity. As a metal transceiver socket, 4012 is used not only to bond optical components and stabilize the optical path, but also to conduct the heat dissipated by the optical components to the lower housing of the optical module in a timely manner, thereby reducing the operating temperature of the optical components.

[0124] The area of ​​the tube base body 40121, excluding the storage slot 40122, the first support protrusion 40123, the second support protrusion 40124, the support plate 40125, and the snap-fit ​​component 40126, is bonded to the lower surface of the circuit board 300 with adhesive. The storage slot 40122, the first support protrusion 40123, the second support protrusion 40124, the support plate 40125, and the snap-fit ​​component 40126 engage with the cutout area 3033 of the circuit board 300.

[0125] The storage slot 40122, the first support protrusion 40123, the second support protrusion 40124, the support plate 40125, and the snap-fit ​​component 40126 are engaged in the cutout area 3033 of the circuit board 300. The height of the upper surface of the first support protrusion 40123 is lower than the height of the upper surface of the circuit board 300, so that the height difference between the upper surface of the lithium niobate chip 4024 placed on the second support protrusion 40124 and the upper surface of the circuit board 300 is as small as possible. This reduces the bonding distance between the first bonding pin on the lithium niobate chip 4024 and the second bonding pin on the circuit board 300, thereby improving the high-frequency transmission performance of the optical module.

[0126] The length and width of the area corresponding to the storage slot 40122 in the tube base body 40121 are both greater than the length and width of the storage slot 40122. The length and width of the area corresponding to the first support protrusion 40123 in the tube base body 40121 are both greater than the length and width of the first support protrusion 40123. The length and width of the area corresponding to the second support protrusion 40124 in the tube base body 40121 are both greater than the length and width of the second support protrusion 40124. The length and width of the area corresponding to the support plate 40125 in the tube base body 40121 are both greater than the length and width of the support plate 40125. The length and width of the area corresponding to the snap-fit ​​member 40126 in the tube base body 40121 are both greater than the length and width of the snap-fit ​​member 40126.

[0127] The storage slot 40122 is formed by the inward and downward recess of the tube base body 40121. The first support protrusion 40123 is formed by the inward and upward protrusion of the tube base body 40121. The second support protrusion 40124, the support plate 40125, and the snap-fit ​​member 40126 are all formed by the inward and upward protrusion of the first support protrusion 40123. The snap-fit ​​member 40126 is located at the first end of the first support protrusion 40123, the second support protrusion 40124 is located at the second end of the first support protrusion 40123, the support plate 40125 and the storage slot 40122 are both located between the snap-fit ​​member 40126 and the second support protrusion 40124, the storage slot 40122 is located on one side of the first support protrusion 40123, and the storage slot 40122 is connected to the first support protrusion 40123.

[0128] A storage slot 40122 is correspondingly arranged to the first sub-cutout area 30331, and a thermoelectric cooler (TEC) is disposed within the storage slot 40122. A second support protrusion 40124 is correspondingly arranged to the second sub-cutout area 30332, and a lithium niobate chip 4024 is disposed on the second support protrusion 40124. A first support protrusion 40123 is correspondingly arranged to the third and fourth sub-cutout areas 30333 and 30334, and a second lens 4025, a second support protrusion 40124, a support plate 40125, a third lens 4027, a fourth lens 4029, and a snap-fit ​​component 40126 are disposed on the first support protrusion 40123. A second filter 4026 is bonded to the side of the support plate 40125. The snap-fit ​​component 40126 is provided with a snap-fit ​​cavity 40261, and the fiber optic ferrule 503 is snapped into the snap-fit ​​cavity 40261. The snap-fit ​​cavity 40261 and the snap-fit ​​groove 40114 on the upper cover 4011 form an insertion hole, and the fiber optic ferrule 503 is snapped into the insertion hole.

[0129] A semiconductor cooler (TEC) is installed inside the storage slot 40122. The TEC is used to control the temperature of the laser chip 4021 so that the laser chip 4021 emits light of a specific wavelength.

[0130] If the TEC is placed directly on the socket body 40121, to ensure that the optical waveguide of the laser chip 4021 above the TEC is on the same horizontal plane as the optical waveguide of the lithium niobate chip 4024, the position height of the second support protrusion 40124 needs to be increased, which in turn requires increasing the position height of the latching cavity 40261 and the optical receiver chip 4028. When the position height of the optical receiver chip 4028 is increased, the position height of the second sub-circuit board 3032 below the optical receiver chip 4028 also needs to be increased. Therefore, it is not recommended to place the TEC directly on the socket body 40121. When the position height of the latching cavity 40261 is increased, the position height of the fiber optic adapter 501 also needs to be adjusted. Since the position height of the fiber optic adapter 501 is fixed, the position of the latching cavity 40261 is also fixed; therefore, the TEC cannot be placed directly on the socket body 40121. In order to make the optical waveguide of the laser chip 4021 above the TEC and the optical waveguide of the lithium niobate chip 4024 on the same horizontal plane, and without increasing the position height of the second support protrusion 40124, in some embodiments, the TEC is placed in the storage slot 40122, and the storage slot 40122 is more recessed relative to the tube base body 40121.

[0131] Because the thickness tolerance of the TEC is poorly controlled, there is a significant height difference between the optical waveguide of the laser chip 4021 and the optical waveguide of the lithium niobate chip 4024. Consequently, the first lens 4022 can only couple a small portion of the light of a specific wavelength emitted by the laser chip 4021 into the lithium niobate chip 4024, resulting in low coupling efficiency. To avoid this problem, in some embodiments, a first ceramic substrate is bonded to the TEC.

[0132] A second ceramic substrate is disposed on the first ceramic substrate, and a laser chip 4021 and a thermistor are disposed on the second ceramic substrate.

[0133] The presence of the first ceramic substrate can reduce the height difference between the optical waveguide of the laser chip 4021 and the optical waveguide of the lithium niobate chip 4024, so that the optical waveguides of the laser chip 4021 and the optical waveguides of the lithium niobate chip 4024 are located on the same horizontal plane as much as possible, thereby improving the coupling efficiency.

[0134] In addition to the second ceramic substrate, the first lens 4022, and the second filter 4026, the first ceramic substrate also includes a switching circuit. The switching circuit connects the TEC, the laser chip 4021, and the thermistor to the third circuit board 303.

[0135] A laser chip 4021 and a thermistor are disposed on the second ceramic substrate.

[0136] The thermistor, located near the laser chip 4021, is used to monitor the temperature changes of the laser chip 4021.

[0137] In addition to the laser chip 4021 and the thermistor, the second ceramic substrate also contains a circuit. This circuit is used to connect the laser chip 4021 and the thermistor to the adapter circuit.

[0138] like Figure 5-23 As can be seen, in some embodiments, a lithium niobate chip 4024 is disposed on the second support protrusion 40124, and the length and width dimensions of the second support protrusion 40124 are both greater than or equal to the length and width dimensions of the lithium niobate chip 4024. In order to minimize the bonding distance between the second bonding pin of the lithium niobate chip 4024 and the second bonding pin of the circuit board 300, in some embodiments, the width dimension of the second sub-cutout area 30332 is equal to the width dimension of the lithium niobate chip 4024, and the length dimension of the second sub-cutout area 30332 is equal to the length dimension of the lithium niobate chip 4024.

[0139] like Figure 5-23 It is known that in some embodiments, the height of the first support protrusion 40123 is less than or equal to the height of the second support protrusion 40124. Specifically, the thickness of the lithium niobate chip 4024 is approximately 500 μm, and the height of the second lens 4025 is 1 mm, meaning the height difference between the center of the second lens 4025 and its lower surface is 500 μm. During the assembly of the optical module, the position of the second lens 4025 needs to be moved up, down, left, and right to collimate the modulated optical signal modulated by the lithium niobate chip 4024 as much as possible. Therefore, the height of the first support protrusion 40123 where the second lens 4025 is located is lower than the height of the second support protrusion 40124 where the lithium niobate chip 4024 is located.

[0140] However, if the thickness of the lithium niobate chip 4024 is about 550μm, since the height difference between the center of the second lens 4025 and the lower surface of the second lens 4025 is 500μm, the height of the first support protrusion 40123 where the second lens 4025 is located is equal to the height of the second support protrusion 40124 where the lithium niobate chip 4024 is located.

[0141] like Figure 5-23 It is understood that in some embodiments, the first support protrusion 40123 is also provided with a second notch 401231, a third notch 401232, a fourth engaging protrusion 401233, a fifth engaging protrusion 401234, and a sixth engaging protrusion 401235.

[0142] The first side of the first support protrusion 40123 is recessed inward to form a second notch 401231 and a third notch 401232. The second notch 401231 is located between the snap-fit ​​part 40126 and the third notch 401232. The third notch 401232 is correspondingly provided with the storage slot 40122. The second notch 401231 and the third notch 401232 are connected. The third notch 401232 is more recessed than the second notch 401231.

[0143] The second notch 401231 is set to correspond to the first engaging protrusion 30312, and the first engaging protrusion 30312 engages with the second notch 401231.

[0144] The second side of the first support protrusion 40123 protrudes outward to form a fourth engaging protrusion 401233, a fifth engaging protrusion 401234, and a sixth engaging protrusion 401235. The degree of concavity of the fourth engaging protrusion 401233, the sixth engaging protrusion 401235, and the fifth engaging protrusion 401234 increases sequentially. The fourth engaging protrusion 401233 is located at the first end of the first support protrusion 40123, the fifth engaging protrusion 401234 is located between the fourth engaging protrusion 401233 and the sixth engaging protrusion 401235, and the sixth engaging protrusion 401235 is located at the second end of the first support protrusion 40123. The connection between the fourth engaging protrusion 401233 and the fifth engaging protrusion 401234 is the second engaging recess, and the connection between the fifth engaging protrusion 401234 and the sixth engaging protrusion 401235 is the third engaging recess.

[0145] The fifth engaging protrusion 401234 is used to house the receiving tilting prism. The fifth engaging protrusion 401234 corresponds to the first notch 30321 and engages with it. The second engaging recess corresponds to the second engaging protrusion, and engages with it. The third engaging recess corresponds to the third engaging protrusion, and engages with it. The first engaging recess 30313 corresponds to the sixth engaging protrusion 401235, and engages with it.

[0146] like Figure 4-23 As can be seen, in some embodiments, the filter holder is a support plate 40125, and a second filter 4026 is bonded to the side of the support plate 40125 facing the fiber optic adapter 501. The second filter 4026 is used to transmit and couple the optical signal collimated by the second lens 4025 into the fourth lens 4029, and also to reflect the second optical signal collimated by the fourth lens 4029 into the third lens 4027.

[0147] Figure 24 This is an optical path diagram of an optical module according to some embodiments. For example... Figure 5-24 As can be seen, in some embodiments, the laser chip 4021 emits light of a specific wavelength. The first sub-lens 40221 collimates the light of the specific wavelength emitted by the laser chip to obtain collimated light. The second sub-lens 40222 couples the collimated light to the lithium niobate chip 4024. The light of the specific wavelength is modulated by the lithium niobate chip 4024 to obtain a modulated optical signal. The modulated optical signal is collimated by the second lens 4025 to obtain a collimated optical signal. The collimated optical signal passes through the second filter 4026 and is then coupled to the fiber optic ferrule 503 of the fiber optic ferrule assembly 500 via the third lens 4027. Here, the light with wavelength λ1 is the light of the specific wavelength.

[0148] like Figure 4-24 As can be seen, in some embodiments, the fiber optic ferrule 503 of the fiber optic ferrule assembly 500 emits a second optical signal. The second optical signal is collimated by the third lens 4027 to obtain a collimated optical signal. The collimated optical signal is reflected by the second filter 4026 to the fourth lens 4029. The fourth lens 4029 couples the second optical signal reflected by the second filter 4026 to the receiving deflection prism 40210. The second optical signal is changed in direction by the receiving deflection prism 40210 and then incident into the optical receiving chip 4028.

[0149] This application provides an optical module, including a circuit board and an optical transceiver assembly. The circuit board has a cutout area. The optical transceiver assembly includes a transceiver socket and optical components. The transceiver socket engages with the lower surface of the circuit board. The transceiver socket includes a socket body and a first support protrusion formed by the socket body. The first support protrusion engages with the cutout area, and the area of ​​the socket body other than the first support protrusion is connected to the lower surface of the circuit board. The first support protrusion has a first storage slot, a second support protrusion, and a latching member for engaging an optical fiber ferrule. The first storage slot is located between the second support protrusion and the latching member. The optical components include a laser chip, a first lens, a lithium niobate chip, a second lens, a second filter, a third lens, a fourth lens, and a receiving deflection prism. The laser chip, the first lens, the second lens, the second filter, the receiving deflection prism, the third lens, and the fourth lens are all located at the first end of the first support protrusion, and the lithium niobate chip is located at the second end of the first support protrusion. The laser chip is located in the first storage slot. The lithium niobate chip is located on the second support protrusion. The laser chip is a high-power DFB laser chip. The high-power DFB laser chip is used to emit high-power light. A first lens, located between the laser chip and the lithium niobate chip, is used to couple the high-power light to the lithium niobate chip. The lithium niobate chip, corresponding to the cut-out area, includes a substrate and a lithium niobate thin film, with an optical loss of less than 10dB, and is used to modulate the high-power light to obtain a modulated optical signal. The lithium niobate thin film is deposited on the substrate and has a thickness of less than 100μm. Due to the smaller size and higher integration precision of the lithium niobate chip, it has advantages such as lower power consumption and lower optical loss compared to silicon photonics chips. Specifically, the optical loss of the silicon photonics chip is less than 11.2dB, and the optical loss of the lithium niobate chip is less than 10dB. Because the optical loss of the silicon photonics chip is less than 11.2dB, in order for the optical module including the DFB laser chip + silicon photonics chip combination to meet the optical power requirements of 50G PON, the optical power emitted by the DFB laser chip must be >158mW. Because the optical loss of lithium niobate chips is less than 10dB, to ensure that the optical module combining a DFB laser chip and a lithium niobate chip meets the optical power requirements for 50G PON, the optical power emitted by the DFB laser chip must be greater than 80mW. Conventional DFB laser chips emit optical power less than 50mW, and high-power DFB laser chips emit optical power less than 120mW. Currently, it is difficult for DFB laser chips to achieve an optical power exceeding 120mW across the entire temperature range. Therefore, to meet the optical power requirements for 50G PON, the optical module must use a combination of a DFB laser chip and a lithium niobate chip. A second lens, located between the lithium niobate chip and the second filter, is used to collimate the modulated optical signal to obtain a collimated optical signal. A second filter, located between the laser chip and the fourth lens, is used to transmit the collimated optical signal to the fiber optic ferrule.The third lens, located between the fiber optic ferrule and the second filter, couples the first optical signal transmitted through the second filter to the fiber optic ferrule and collimates the second optical signal incident through the fiber optic ferrule before it is incident on the second filter. The fourth lens, located between the second filter and the receiving deflection prism, couples the second optical signal reflected from the second filter to the receiving deflection prism. The receiving deflection prism, located above the optical receiver chip, modulates the second optical signal so that it is reflected back to the optical receiver chip. In this application, the laser chip provides high-power light, and the optical loss of the lithium niobate chip is less than that of the silicon photonics chip, ensuring that the modulated optical signal modulated by the lithium niobate chip meets the optical power requirements of 50G PON transmission.

[0150] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical module characterized by comprising: include: The circuit board has a cut-out area. Optical transceiver assembly, including transceiver socket and optical components; A receiving / distributing connector, including a connector body and a first support protrusion formed by the connector body; The first support protrusion is provided with a first storage slot, a second support protrusion and a snap-fit ​​device for snapping in the fiber optic ferrule, which snaps into the cut-out area. The first storage slot is located between the second support protrusion and the snap-fit ​​component; Optical components include a laser chip, a first lens, a lithium niobate chip, a second lens, a second filter, a third lens, a fourth lens, and a receiving prism; The laser chip, the first lens, the second lens, the second filter, the receiving conversion prism, the third lens, and the fourth lens are all located at the first end of the first support protrusion, and the lithium niobate chip is located at the second end of the first support protrusion. The laser chip is located in the first storage slot; The lithium niobate chip, located on the second support protrusion, includes a substrate and a lithium niobate thin film, with an optical loss of less than 10dB. A lithium niobate thin film, deposited on a substrate, with a thickness of less than 100 μm.

2. The optical module according to claim 1, characterized by The excavated area includes a first sub-excavated area, a second sub-excavated area, a third sub-excavated area, and a fourth sub-excavated area; The first sub-excavated area is connected to the third sub-excavated area and is set correspondingly to the first storage slot; The second sub-cutout area is located at the second end of the circuit board, communicates with the third sub-cutout area, and is correspondingly set to the second support protrusion; The third sub-excavation area is located between the first sub-excavation area and the fourth sub-excavation area, and is connected to the first sub-excavation area, the second sub-excavation area and the fourth sub-excavation area respectively; The fourth sub-cutout area is located at the first end of the circuit board and is correspondingly set with the snap-fit ​​component.

3. The optical module according to claim 1, characterized by The first support protrusion is provided with a second notch, a third notch, a fourth engaging protrusion, a fifth engaging protrusion, and a sixth engaging protrusion; The third notch, like the second notch, is located on the first side of the first support protrusion, corresponding to the first storage slot, and communicating with the second notch, and is more recessed than the second notch; The fourth engaging protrusion is located at the first end of the first supporting protrusion, and is located on the second side of the first supporting protrusion along with the fifth engaging protrusion and the sixth engaging protrusion. The fifth engaging protrusion is located between the fourth engaging protrusion and the sixth engaging protrusion, and the receiving turning prism is disposed on it; The sixth engaging protrusion is located at the second end of the first supporting protrusion; The degree of indentation of the fourth, sixth, and fifth engaging protrusions increases sequentially.

4. The optical module according to claim 2, characterized by The excavated area is cross-shaped.

5. The optical module according to claim 2, characterized by The circuit board includes a first sub-circuit board and a second sub-circuit board; The first sub-circuit board is provided with the cut-out area and through holes; The through hole is obtained by hollowing out the first sub-circuit board; The second sub-circuit board, connected to the first sub-circuit board, is more recessed than the first sub-circuit board and is used to house the light receiving chip; The optical receiver chip is used to receive the second optical signal.

6. The optical module according to claim 5, characterized by The optical transceiver assembly also includes an upper cover, which includes a bottom plate and a side plate. The upper cover body side plate is connected with the upper cover body bottom plate, and is provided with a clamping groove and a positioning column; The clamping groove is located at the first end of the upper cover body side plate, is correspondingly arranged with the clamping piece, and is matched with the clamping piece to insert the fiber ferrule; The positioning column is correspondingly arranged with the through hole and is clamped in the through hole.

7. The optical module of claim 1, wherein, The second filter comprises two 45° triangular prisms, and the oblique sides of the two 45° triangular prisms are bonded, and one of the oblique sides is coated with a filter film; or only one glass sheet is included, and one end of the glass sheet towards the optical fiber is coated with a filter film.

8. The optical module of claim 1, wherein, The first lens is a focusing lens; or a collimating lens and a focusing lens.

9. The optical module of claim 1, wherein, The receiving turning prism can be connected with the third lens or not connected with the third lens, wherein the angle of the receiving turning prism is 41°-43°.

10. The optical module of claim 2, wherein, Further comprising a fiber ferrule assembly; The fiber ferrule assembly comprises a fiber adapter, an internal optical fiber and the fiber ferrule; The internal optical fiber is connected with the fiber adapter at the first end and connected with the fiber ferrule at the second end; The fiber ferrule is located in the fourth sub hollowed region and clamped on the clamping piece at the second end.

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